JP2012218211A - Liquid ejection head, liquid ejecting apparatus, and method of manufacturing liquid ejection head - Google Patents

Abstract

Provided is a liquid ejecting head or the like that can reliably connect a wiring board and an actuator device, thereby reducing cost and downsizing.
The liquid ejecting head includes an actuator device having a plurality of mounting portions provided on a flow path forming substrate and a plurality of flexible wiring substrates for supplying a driving signal to the actuator device. And a protective substrate 30 provided on the mounting portion 90 side and having a through hole 102 through which the plurality of wiring boards 200 can be inserted, and between the plurality of mounting portions 90 exposed in the through holes 102, the wiring A step 103 is provided to prevent the conductive material 210 that electrically connects and fixes the substrate 200 and the mounting portion 90 from flowing out.
[Selection] Figure 7

Description

  The present invention relates to a liquid ejecting head that ejects liquid from a nozzle opening, a liquid ejecting apparatus, and a method for manufacturing the liquid ejecting head.

  A liquid ejecting head that ejects liquid is provided with a piezoelectric element on one surface side of a flow path forming substrate provided with a pressure generating chamber communicating with a nozzle opening, and the pressure in the pressure generating chamber is changed by the displacement of the piezoelectric element. Inkjet recording heads that eject ink droplets from nozzle openings are known.

  As an ink jet recording head, a protective substrate is bonded to the piezoelectric element side of the flow path forming substrate, and each terminal of the drive circuit provided on the protective substrate is electrically connected to each piezoelectric element with a bonding wire by wire bonding. However, there has been proposed one in which a drive signal from a drive circuit is supplied to a piezoelectric element via a bonding wire (see, for example, Patent Documents 1 to 3).

  In addition, an ink jet recording head in which a COF substrate that supplies a drive signal to a plurality of piezoelectric elements is connected has been proposed (see, for example, Patent Document 4).

JP 2005-053079 A JP 2007-301736 A JP 2008-023799 A JP 2006-281477 A

  However, if each terminal of the drive circuit and each piezoelectric element are individually connected by wire bonding, wire bonding must be performed by the number of piezoelectric elements, which increases the manufacturing time and costs. There is a problem of end.

  In addition, the piezoelectric element requires a region where a terminal to which a bonding wire is connected is required, and there is a problem that the head becomes large.

  Further, as disclosed in Patent Document 2, a device that is electrically connected to a piezoelectric element using a COF substrate has been proposed. However, when a plurality of rows in which piezoelectric elements are arranged in parallel are provided, There is a problem in that a resin material such as an anisotropic conductive adhesive or a potting agent used for connection to the piezoelectric element may flow out between the rows of piezoelectric elements, resulting in poor conduction. Incidentally, if the space between the rows of piezoelectric elements is widened in order to suppress poor conduction due to the resin that has flowed out, the size will increase.

  Such a problem exists not only in an ink jet recording head but also in a liquid ejecting head that ejects liquid other than ink.

  In view of such circumstances, the present invention provides a liquid ejecting head, a liquid ejecting apparatus, and a method for manufacturing a liquid ejecting head that can reliably connect a wiring board and an actuator device to reduce costs and reduce size. The purpose is to provide.

The present invention employs the following means in order to solve the above problems.
The liquid ejecting head according to the present invention is capable of supplying an actuator device having a plurality of mounting portions provided on the flow path forming substrate and a driving signal electrically connected to the plurality of mounting portions. A plurality of flexible wiring boards, and a protection board provided on the mounting portion side of the flow path forming board and having a through-hole through which the plurality of wiring boards can be inserted, and exposed in the through-hole. A step is provided between the plurality of mounting portions to prevent the conductive material that electrically connects and fixes the wiring board and the mounting portion from flowing out.

  The step is a partition wall formed in the through hole of the protective substrate.

  The step is a partition wall formed on the flow path forming substrate.

  The wiring board and the mounting portion are connected and fixed in a state where the conductive material wraps around the surface opposite to the connection surface of the wiring board.

  The step is a groove formed on the flow path forming substrate.

  The liquid ejecting apparatus according to the invention includes any one of the liquid ejecting heads described above.

  A method of manufacturing a liquid jet head according to the present invention includes an actuator device having a plurality of mounting portions provided on a flow path forming substrate, and a drive signal electrically connected to the plurality of mounting portions. A liquid jet head comprising: a plurality of flexible wiring boards to be supplied; and a protective board provided on the mounting portion side of the flow path forming board and having a through hole through which the plurality of wiring boards can be inserted. In the manufacturing method, a step is formed between the plurality of mounting parts exposed in the through hole to prevent the conductive material that electrically connects and fixes the wiring board and the mounting parts from flowing out. And a step of electrically connecting and fixing the wiring board to the mounting portion by the conductive material.

1 is a perspective view showing a schematic configuration of an ink jet recording apparatus A according to an embodiment of the present invention. 1 is an exploded perspective view illustrating a configuration of a recording head 1 according to an embodiment of the present invention. 2A and 2B are a plan view and a cross-sectional view illustrating the configuration of the recording head 1 according to the embodiment of the invention. FIG. 4 is a diagram illustrating a manufacturing process of the recording head 1 according to the embodiment of the invention. It is a figure which shows the manufacturing process following FIG. It is a figure which shows the manufacturing process following FIG. It is a figure which shows the manufacturing process following FIG. FIG. 6 is a cross-sectional view showing a first modification of the recording head 1. FIG. 6 is a cross-sectional view showing a second modification of recording head 1.

  DESCRIPTION OF EXEMPLARY EMBODIMENTS Hereinafter, an ink jet recording apparatus according to an embodiment of the invention will be described with reference to the drawings. In each drawing used for the following description, the scale of each member is appropriately changed to make each member a recognizable size.

[Inkjet recording apparatus A]
FIG. 1 is a perspective view showing a schematic configuration of an ink jet recording apparatus A according to an embodiment of the present invention.
The ink jet recording apparatus (liquid ejecting apparatus) A includes a recording head 1 that ejects ink, a carriage 2 on which the recording head 1 is mounted, a platen 3 that supports a recording sheet S on which ink is landed, and the like.
The carriage 2 is configured to reciprocate while being guided by the carriage shaft 6 via a timing belt 5 driven by a carriage motor 4.
The platen 3 supports the recording paper S that is a recording medium from the back surface thereof, and defines the position of the recording paper S with respect to the recording head 1.

  The recording head 1 is mounted on the surface of the carriage 2 that faces the recording paper S. A plurality of ink cartridges 7 for supplying ink to the recording head 1 are detachably mounted on the carriage 2.

[Recording head 1]
FIG. 2 is an exploded perspective view showing the recording head 1 according to the embodiment of the invention.
3A and 3B are a plan view and a cross-sectional view showing the recording head 1 according to the embodiment of the invention.

  The flow path forming substrate 10 is made of a silicon single crystal substrate, and an elastic film 50 made of silicon dioxide is formed on one surface thereof.

The flow path forming substrate 10 includes a row in which pressure generation chambers 12 partitioned by a plurality of wall portions 11 are arranged in parallel in the width direction (short direction) by anisotropic etching from the other surface side. Two rows are provided in the longitudinal direction of the pressure generating chamber 12.
In addition, an ink supply path 14 and a communication path 13 constituting an individual flow path for each nozzle opening together with the pressure generation chamber 12 are provided on one end side in the longitudinal direction of the pressure generation chamber 12 of the flow path forming substrate 10 by the wall section 11. It is partitioned. The ink supply path 14 and the communication path 13 are arranged outside the two rows of the pressure generation chambers 12 in each row of the pressure generation chambers 12.

The ink supply path 14 generates a flow path resistance for the ink between the manifold 100 and the pressure generation chamber 12, communicates with one end side in the longitudinal direction of the pressure generation chamber 12, and is smaller than the pressure generation chamber 12. Has an area. For example, the ink supply path 14 is formed with a width smaller than the width of the pressure generation chamber 12 by narrowing the flow path of the pressure generation chamber 12 in the width direction.
Although the ink supply path 14 is formed by narrowing the width of the flow path from one side, the ink supply path may be formed by narrowing the width of the flow path from both sides. Further, the ink supply path may be formed by narrowing from the thickness direction instead of narrowing the width of the flow path.
Further, each reaching passage 13 communicates with the side of the ink supply path 14 opposite to the pressure generation chamber 12 and has a larger cross-sectional area than the width direction (short direction) of the ink supply path 14. The communication passage 13 was formed with the same cross-sectional area as the pressure generation chamber 12.

  In other words, the flow path forming substrate 10 is connected to the pressure generation chamber 12, the ink supply path 14 having a smaller cross-sectional area in the short direction of the pressure generation chamber 12, the ink supply path 14, and the ink supply. Two rows are provided in which the individual flow paths including the communication passage 13 having a cross-sectional area larger than the cross-sectional area in the short direction of the path 14 are partitioned by the plurality of wall portions 11.

  On the surface side of the flow path forming substrate 10 where the individual flow paths such as the pressure generation chambers 12 are opened, nozzle openings 21 communicating with the vicinity of the ends of the pressure generation chambers 12 opposite to the ink supply paths 14 are formed. In one example of the nozzle forming member, the nozzle plate 20 is fixed by an adhesive, a heat welding film, or the like. The nozzle plate 20 is made of, for example, glass ceramics, a silicon single crystal substrate, stainless steel, or the like.

On the other hand, the elastic film 50 is formed on the surface of the flow path forming substrate 10 opposite to the nozzle plate 20, as described above, and the insulator film 55 is formed on the elastic film 50. ing. Further, on the insulator film 55, for example, a first electrode 60, a piezoelectric layer 70, and a second electrode 80 are stacked and formed by a process described later to form the piezoelectric element 300. .
Here, the piezoelectric element 300 refers to a portion including the first electrode 60, the piezoelectric layer 70, and the second electrode 80. In general, one electrode of the piezoelectric element 300 is used as a common electrode, and the other electrode and the piezoelectric layer 70 are patterned for each pressure generating chamber 12. Although the first electrode 60 is a common electrode of the piezoelectric element 300 and the second electrode 80 is an individual electrode of the piezoelectric element 300, there is no problem even if it is reversed for the convenience of a drive circuit and wiring. That is, the piezoelectric element 300 is provided as an actuator device that causes a pressure change in the ink (liquid) in the pressure generation chamber 12.

  The second electrode 80 of each piezoelectric element 300 has a lead electrode 90 such as gold (Au) extending to the vicinity of the end of the flow path forming substrate 10 opposite to the ink supply path 14. Each is connected. A voltage is selectively applied to each piezoelectric element 300 via the lead electrode 90. That is, the end portion of the lead electrode 90 opposite to the piezoelectric element 300 is a mounting portion to which the wiring board is electrically connected.

  Further, on the flow path forming substrate 10 on which the piezoelectric element 300 is formed, the protective substrate 30 having the piezoelectric element holding portion 31 having a space that does not hinder the movement of the piezoelectric element 300 in a region facing the piezoelectric element 300. Are joined by an adhesive 35 or the like. Since the piezoelectric element 300 is disposed in the piezoelectric element holding portion 31, it is protected in a state where it is hardly affected by the external environment. In addition, the piezoelectric element holding part 31 may be sealed or may not be sealed. Further, the piezoelectric element holding portion 31 may be provided independently for each piezoelectric element 300 or may be provided continuously over a plurality of piezoelectric elements 300.

Further, a manifold 100 serving as a common ink chamber (liquid chamber) for a plurality of individual flow paths is provided in a region facing the piezoelectric element holding portion 31 on the protective substrate 30. The manifold 100 is formed by a recess provided on the surface of the protective substrate 30 opposite to the joint surface with the flow path forming substrate 10. That is, the protective substrate 30 opens to the opposite side of the flow path forming substrate 10, and the opening of the manifold 100 is sealed by the compliance substrate 40. In addition, the manifold 100 is provided continuously over the short direction (width direction) of a plurality of individual flow paths.
The manifold 100 is provided to the vicinity of both end portions of the protective substrate 30 in the longitudinal direction of the pressure generating chamber 12, and one end portion side of the manifold 100 is provided to a region facing the end portion of the individual flow path. Yes. Thus, by providing the manifold 100 above the piezoelectric element holding portion 31 (a region overlapping the piezoelectric element holding portion 31 when viewed in plan), it is necessary to widen the manifold 100 to the outside in the longitudinal direction of the pressure generating chamber 12. Therefore, the width in the longitudinal direction of the pressure generating chamber 12 of the ink jet recording head 1 can be reduced to reduce the size.

  In addition, the protective substrate 30 has one end communicating with the end portion of the communication path 13 that is an individual flow path, and the supply portion 101 that is a through hole penetrating in the thickness direction with the other end communicating with one end portion of the manifold 100. Is provided. One supply unit 101 is provided across the communication path 13 which is a plurality of individual flow paths. Then, the ink from the manifold 100 is supplied to the communication path 13, the ink supply path 14, and the pressure generation chamber 12, which are individual flow paths, via the supply unit 101. That is, the supply unit 101 also functions as a part of the manifold 100.

  Examples of the material of the protective substrate 30 include glass, ceramic material, metal, resin, and the like, but it is preferable that the protective substrate 30 is formed of a material substantially the same as the coefficient of thermal expansion of the flow path forming substrate 10. A silicon single crystal substrate which is the same material as the flow path forming substrate 10 is used.

Further, the protective substrate 30 is provided with a through hole 102 penetrating in the thickness direction in a region corresponding to the two rows of the pressure generating chambers 12. The wiring board 200 is inserted through the through hole 102 and electrically connects the wiring board 200 and the mounting portion of the actuator device.
Here, the actuator device is the piezoelectric element 300, and the lead electrode 90 connected to the piezoelectric element 300 is provided at a position where an end portion thereof is disposed in the through hole 102.

One through hole 102 is provided for each of the two rows of the piezoelectric elements 300. That is, in this embodiment, the wiring board 200 is connected to every two rows of the piezoelectric elements 300, and there are two rows of the piezoelectric elements 300, so that one through hole 102 is provided.
A partition wall 103 that partitions the mounting portion (the end portion of the lead electrode 90) is formed on the inner bottom portion of the through hole 102.

  The wiring substrate 200 is electrically connected to the end portion (mounting portion) of the lead electrode 90 exposed in the through hole 102. The wiring board 200 has flexibility in which a driving circuit 201 for driving the piezoelectric element 300 is mounted on a wiring (not shown). For example, a chip-on-film (COF), a tape carrier package (TCP), or the like. A flexible printed circuit board (FPC) can be used.

  The wiring substrate 200 and the lead electrode 90 which is the mounting portion of the actuator device can be electrically connected through, for example, solder or anisotropic conductive adhesive (ACP). The wiring substrate 200 and the lead electrode 90 are electrically connected via an anisotropic conductive adhesive 210. The anisotropic conductive adhesive 210 electrically connects the wiring substrate 200 and the lead electrode 90 and also functions as an adhesive that fixes the wiring substrate 200.

As described above, since the inner bottom portion of the through hole 102 is partitioned by the partition wall 103, when the wiring substrate 200 and the lead electrode 90 are connected through the anisotropic conductive adhesive 210 in the through hole 102. The anisotropic conductive adhesive 210 can be prevented from flowing out to the adjacent lead electrode 90 side.
Therefore, in order to suppress the outflow of the anisotropic conductive adhesive 210, it is not necessary to dispose the mounting portions adjacent to each other. Miniaturization can be achieved.
Further, in order to suppress the outflow of the anisotropic conductive adhesive 210, it is not necessary to reduce the amount of the anisotropic conductive adhesive 210 to be applied. It is possible to suppress the occurrence of problems such as general connection failure and mechanical bond strength reduction.
Furthermore, since the plurality of lead electrodes 90 can be connected to one wiring substrate 200 by using the anisotropic conductive adhesive 210, it is more work than sequentially connecting to each lead electrode 90 by wire bonding. Time can be shortened and cost can be reduced.
Of course, even when the wiring board 200 and the plurality of lead electrodes 90 are connected by a metal such as solder, the plurality of lead electrodes 90 can be connected to the wiring board 200 at the same time.

  Further, even if the anisotropic conductive adhesive 210 filled in one space partitioned by the partition wall 103 protrudes from the joint surface between the wiring substrate 200 and the lead electrode 90, the anisotropic conductive adhesive 210 is dammed up by the partition wall 103 and is thus connected to the wiring substrate. It wraps around to the upper surface side of 200 (surface side opposite to the bonding surface). As described above, the anisotropic conductive adhesive 210 wraps around the side surface of the partition wall 103 and the upper surface side of the wiring substrate 200 as well as the bonding surface between the wiring substrate 200 and the lead electrode 90 and hardens. Bonding of the electrode 90 becomes stronger.

A compliance substrate 40 including a sealing film 41 and a fixing plate 42 is bonded to the surface of the protective substrate 30 where the manifold 100 is opened, and the opening of the manifold 100 is sealed by the compliance substrate 40.
The sealing film 41 is made of a material having low rigidity and flexibility, for example, a polyphenylene sulfide (PPS) film having a thickness of about several μm.

The fixing plate 42 is made of a hard material such as a metal such as stainless steel (SUS) having a thickness of about several tens of μm. As shown in FIG. 3, the fixing plate 42 is provided over the periphery of the manifold 100 of the protective substrate 30, and a region facing the manifold 100 is an opening 43 that is completely removed in the thickness direction. ing.
Further, the fixed plate 42 is provided with a protruding portion 44 that protrudes toward the opening 43 side, and the protruding portion 44 is provided from a storage means (not shown) that penetrates in the thickness direction and stores ink. An introduction path 45 is provided for supplying the ink to the manifold.
The projecting portion 44 is provided on the side opposite to the supply portion 101 and so as to project a part of the pressure generating chambers 12 in the juxtaposed direction to a region facing the manifold 100. For this reason, the introduction path 45 is provided at the opposite end in the longitudinal direction of the pressure generating chamber 12 from the supply part 101 provided in the protective substrate 30.
As described above, by providing the introduction path 45 at the end of the protective substrate 30 opposite to the supply unit 101, the influence of the dynamic pressure of the ink introduced from the storage unit is affected by the pressure generation chamber 12 via the supply unit 101. Can be reduced.

And, by such an opening 43 of the fixing plate 42, one surface of the manifold 100 is a flexible part 46 that can be flexibly deformed and is sealed only by the flexible sealing film 41. In other words, the flexible portion 46 is provided in a region facing the supply portion 101 of the protective substrate 30 in a region facing the manifold 100 and around the introduction path 45 of the fixing plate 42 in a region facing the manifold 100. The flexible portion 46 is provided continuously across the region facing the supply portion 101 and the periphery of the introduction path 45.
Thus, by providing the flexible portion 46 continuously over the region facing the supply portion 101 and the periphery of the introduction path 45, the flexible portion 46 can be formed in a wide area, and the manifold 100. By increasing the internal compliance, it is possible to reliably reduce the occurrence of crosstalk due to the adverse effects of pressure fluctuations.

  Further, since the wiring board 200 on which the driving circuit 201 is mounted is connected to the lead electrode 90, it is not necessary to mount the driving circuit 201 on the protective substrate 30. Therefore, the manifold 100 can be widened above the piezoelectric element holding portion 31, and the compliance substrate 40 having the wide flexible portion 46 can be provided on the protective substrate 30.

  In such an ink jet recording head 1, the ink is taken into the manifold 100 from the ink cartridge 7, filled with ink from the manifold 100 to the nozzle opening 21 through the supply unit 101, and then from the drive circuit 201. In accordance with the recording signal, a voltage is applied between the first electrode 60 and the second electrode 80 corresponding to the pressure generating chambers 12 to bend and deform the piezoelectric elements 300 and the diaphragms. The pressure increases and ink is ejected (discharged) from the nozzle opening 21.

Hereinafter, a method for manufacturing such an ink jet recording head will be described with reference to FIGS.
First, as shown in FIG. 4A, an oxide film 51 constituting the elastic film 50 is formed on the surface of a wafer 110 for flow path forming substrate 110, which is a silicon wafer and in which a plurality of flow path forming substrates 10 are integrally formed. To do.

  Then, as shown in FIG. 4B, an insulator film 55 made of an oxide film made of a material different from that of the elastic film 50 is formed on the elastic film 50 (oxide film 51).

  Next, as shown in FIG. 4C, the first electrode 60, the piezoelectric layer 70, and the second electrode 80 are sequentially stacked and patterned into a predetermined shape to form the piezoelectric element 300.

  Next, as shown in FIG. 5A, after forming the lead electrode 90 made of, for example, gold (Au) over the entire surface of the flow path forming substrate wafer 110, for example, a mask pattern made of resist or the like. Patterning is performed for each piezoelectric element 300 via (not shown).

Next, as shown in FIG. 5B, the protective substrate wafer 130 is bonded onto the flow path forming substrate wafer 110 by the adhesive 35. Here, a piezoelectric element holding portion 31, a manifold 100, a supply portion 101, a through hole 102, a partition wall 103, and the like are formed in advance on the protective substrate wafer 130.
Since the protective substrate wafer 130 is relatively thick, the rigidity of the flow path forming substrate wafer 110 is remarkably improved by bonding the protective substrate wafer 130.

  Next, as shown in FIG. 6A, the flow path forming substrate wafer 110 is thinned to a predetermined thickness.

  Next, as shown in FIG. 6B, a mask film 52 is newly formed on the flow path forming substrate wafer 110 and patterned into a predetermined shape. Then, as shown in FIG. 6C, the pressure generating chamber 12 is obtained by performing anisotropic etching (wet etching) using an alkali solution such as KOH on the flow path forming substrate wafer 110 through the mask film 52. The communication path 13 and the ink supply path 14 are formed.

When forming the individual flow path on the flow path forming substrate wafer 110, the surface of the protective substrate wafer 130 opposite to the flow path forming substrate wafer 110 side is made of a material having alkali resistance, for example, It is preferable to seal with a sealing film made of PPS (polyphenylene sulfide), PPTA (polyparaphenylene terephthalamide) or the like.
In addition, the manifold 100 and the supply unit 101 are provided in advance on the protective substrate wafer 130, but the invention is not particularly limited thereto. For example, when the flow path forming substrate wafer 110 and the protective substrate wafer 130 are bonded together and then the flow path forming substrate wafer 110 is wet etched to form the pressure generation chamber 12 and the like, the manifold 100 and the The supply unit 101 may be formed. Thereby, the manufacturing process can be simplified and the cost can be reduced.

Next, as shown in FIG. 7A, after the compliance substrate 40 is bonded to the protective substrate wafer 130, the wiring substrate 200 (in the row of one lead electrode 90 of the piezoelectric element 300 exposed in the through hole 102 is provided. Wiring (not shown) is electrically connected. The wiring substrate 200 and the lead electrode 90 are joined via an anisotropic conductive adhesive 210.
Specifically, after the anisotropic conductive adhesive 210 is filled in one space partitioned by the partition wall 103 in the through hole 102, the wiring substrate 200 is heated while being pressed onto the lead electrode 90. Thus, the lead electrode 90 and the wiring board 200 are connected. In order to heat the wiring board 200 while pressing it onto the lead electrodes 90, a mounting tool that contacts the back surface of the wiring board 200 is used.

  When the wiring substrate 200 and the lead electrode 90 are connected, since the rows of the lead electrodes 90 adjacent to each other in the through hole 102 are partitioned by the partition wall 103, the anisotropic connection between the wiring substrate 200 and the lead electrode 90 is performed. The conductive conductive adhesive 210 can be prevented from flowing out to the row side of adjacent lead electrodes 90 that are not connected.

Next, as shown in FIG. 7B, the wiring substrate 200 is connected to the row of the lead electrodes 90 of the piezoelectric element 300 exposed in the other space partitioned by the partition wall 103 in the through hole 102. At this time, since the anisotropic conductive adhesive 210 disposed on the row side of one lead electrode 90 does not flow out to the row side of the other lead electrode 90, the row of the other lead electrode 90 and the wiring substrate 200. And can be connected well.
That is, in the step shown in FIG. 7A, when the anisotropic conductive adhesive 210 used for one lead electrode 90 column flows out to the other lead electrode 90 row, the other lead electrode 90. There is a possibility that the anisotropic conductive adhesive 210 that has flowed into the column side is cured and the lead electrode 90 and the wiring board 200 cannot be connected well.

In the process before or after connecting the wiring substrate 200, unnecessary portions of the outer peripheral edge portions of the flow path forming substrate wafer 110 and the protective substrate wafer 130 are removed by cutting, for example, by dicing. The nozzle plate 20 having the nozzle openings 21 is bonded to the surface of the flow path forming substrate wafer 110 opposite to the protective substrate wafer 130.
Then, the ink jet recording head 1 is manufactured by dividing the flow path forming substrate wafer 110 and the like into a single chip size flow path forming substrate 10 and the like as shown in FIG. Of course, the compliance board 40 may be fixed after the wiring board 200 is connected.

[Modification of recording head 1]
8 and 9 are cross-sectional views showing modifications of the recording head 1. In addition, the same code | symbol is attached | subjected to the same thing as each member in the recording head 1 which concerns on the said embodiment, and the description is abbreviate | omitted.

In the recording head 1 according to the above-described embodiment, the case where the partition wall 103 is provided on the inner bottom portion of the through hole 102 as a step that partitions the row of adjacent mounting portions inside the through hole 102 of the protective substrate 30 has been described. Not limited to.
As shown in FIG. 8, a partition wall 105 may be formed on the upper surface of the flow path forming substrate 10 as a step for partitioning adjacent rows of mounting portions in the through hole 102. That is, the partition wall 105 made of an insulating material is formed at an intermediate position between the adjacent piezoelectric elements 300 on the upper surface of the flow path forming substrate 10.
The partition wall 105 may be formed of a piezoelectric layer material at the same time as the piezoelectric layer 70 is formed. This is because the piezoelectric layer material has an insulating property.

  In addition, as shown in FIG. 9, a groove 107 may be formed on the upper surface of the flow path forming substrate 10 as a step that partitions adjacent rows of mounting parts in the through hole 102. That is, the groove 107 is formed at an intermediate position between the adjacent piezoelectric elements 300 on the upper surface of the flow path forming substrate 10. The groove part 107 is formed by a method of providing the groove part 107 in advance in the flow path forming substrate wafer 110.

  In addition, as a step which divides a row of adjacent mounting portions in the through hole 102, a plate-like member (not shown) made of an insulating material is prepared instead of being formed on the flow path forming substrate 10 or the protective substrate 30. May be. That is, when the wiring board 200 is electrically connected to the row of the lead electrodes 90 of the piezoelectric element 300 exposed in the through hole 102 (FIGS. 7A and 7B), the plate-like member is connected to the wiring board. The wiring board 200 and the lead electrode 90 are electrically connected and fixed by the anisotropic conductive adhesive 210 while being inserted into the 200 and partitioning adjacent mounting portions (lead electrodes 90). In this case, the plate-shaped member made of an insulating material may be removed after the connection between the wiring board 200 and the lead electrode 90 is completed.

  In the above-described embodiment, the wiring substrate 200 and the lead electrode 90 as the mounting portion are electrically connected (mounted) by the anisotropic conductive adhesive 210, but the present invention is not limited to this. For example, the wiring substrate 200 and the lead electrode 90 may be connected using a metal such as solder. In this case, after connecting the wiring substrate 200 and the lead electrode 90 using a metal fitting, the through hole 102 may be filled with a resin made of a potting agent.

  In the above-described embodiment, two wiring boards 200 are connected in one through hole 102. However, the present invention is not limited to this. Three or more wiring boards 200 may be connected to the mounting portion in one through hole 102.

In the first embodiment described above, the actuator device having the thin-film piezoelectric element 300 is described as the actuator device that causes a pressure change in the pressure generation chamber 12, but is not limited thereto. For example, an actuator device having a thick film type piezoelectric element formed by a method such as attaching a green sheet, or a longitudinal vibration type piezoelectric element in which piezoelectric materials and electrode forming materials are alternately stacked to expand and contract in the axial direction An actuator device having the following can be used.
In addition, as an actuator device, a heat generating element is arranged in the pressure generating chamber 12, and a liquid droplet is discharged from the nozzle opening by a bubble generated by heat generation of the heat generating element, or static electricity is generated between the diaphragm and the electrode. Thus, it is possible to use a so-called electrostatic actuator device that deforms the diaphragm by electrostatic force and discharges droplets from the nozzle openings. In any actuator device, the mounting portion may be provided on the flow path forming substrate.

  Furthermore, the present invention is intended for a wide range of liquid ejecting heads in general, for example, recording heads such as various ink jet recording heads used in image recording devices such as printers, and manufacture of color filters such as liquid crystal displays. The present invention can also be applied to a coloring material ejecting head, an organic EL display, an electrode material ejecting head used for forming an electrode such as an FED (field emission display), a bioorganic matter ejecting head used for biochip production, and the like.

  Further, although the ink jet recording apparatus A has been described as an example of the liquid ejecting apparatus, the liquid ejecting apparatus using the other liquid ejecting heads described above can also be used.

  DESCRIPTION OF SYMBOLS A ... Inkjet recording apparatus (liquid ejecting apparatus), 1 ... Inkjet recording head (liquid ejecting head), 10 ... Flow path forming substrate, 30 ... Protection substrate, 90 ... Lead electrode (mounting part), 102 ... Through-hole, DESCRIPTION OF SYMBOLS 103 ... Partition (step), 105 ... Partition (step), 107 ... Groove part (step), 200 ... Wiring board, 210 ... Anisotropic conductive adhesive (conductive material), 300 ... Piezoelectric element (actuator device)

Claims (7)

An actuator device having a plurality of mounting portions provided on the flow path forming substrate;
A plurality of flexible wiring boards that are electrically connected to the plurality of mounting portions and supply a drive signal to the actuator device;
A protective substrate provided on the mounting portion side of the flow path forming substrate and having a through-hole through which the plurality of wiring substrates can be inserted;
With
A liquid is provided, wherein a step is provided between the plurality of mounting portions exposed in the through hole to prevent the conductive material that electrically connects and fixes the wiring board and the mounting portion from flowing out. Jet head.   The liquid ejecting head according to claim 1, wherein the step is a partition wall formed in the through hole of the protective substrate.   The liquid ejecting head according to claim 1, wherein the step is a partition wall formed on the flow path forming substrate.   4. The liquid jet head according to claim 2, wherein the wiring board and the mounting portion are connected and fixed in a state where the conductive material wraps around a surface opposite to a connection surface of the wiring board. 5. .   The liquid ejecting head according to claim 1, wherein the step is a groove formed on the flow path forming substrate.   A liquid ejecting apparatus comprising the liquid ejecting head according to claim 1. An actuator device having a plurality of mounting portions provided on the flow path forming substrate;
A plurality of flexible wiring boards that are electrically connected to the plurality of mounting portions and supply a drive signal to the actuator device;
A protective substrate provided on the mounting portion side of the flow path forming substrate and having a through-hole through which the plurality of wiring substrates can be inserted;
A method of manufacturing a liquid jet head comprising:
Forming a step between the plurality of mounting portions exposed in the through hole to prevent the conductive material that electrically connects and fixes the wiring board and the mounting portion from flowing out;
Electrically connecting and fixing the wiring board to the mounting portion with the conductive material;
A method for manufacturing a liquid jet head, comprising:

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