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JP2012209293A - Manufacturing method of component for photoelectric conversion module - Google Patents

Manufacturing method of component for photoelectric conversion module Download PDF

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JP2012209293A
JP2012209293A JP2011071463A JP2011071463A JP2012209293A JP 2012209293 A JP2012209293 A JP 2012209293A JP 2011071463 A JP2011071463 A JP 2011071463A JP 2011071463 A JP2011071463 A JP 2011071463A JP 2012209293 A JP2012209293 A JP 2012209293A
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photoelectric conversion
lens
substrate
conversion element
light emitting
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JP5919632B2 (en
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Takayuki Shimazu
貴之 島津
Hiromi Nakanishi
裕美 中西
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Sumitomo Electric Industries Ltd
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Abstract

PROBLEM TO BE SOLVED: To provide a manufacturing method in which a component for photoelectric conversion module can be obtained at low cost with high optical coupling efficiency.SOLUTION: The manufacturing method of a component 10 for photoelectric conversion module includes: a first process of preparing a substrate 20 having a top surface 21, a reverse surface 22, and a through hole 23, a photoelectric conversion element 40 having a light reception part or a light emission part 41, and a lens element 30 having a plurality of lens parts 32; a second process of attaching the lens element 30 to the substrate 20 from the side of the top surface 21 of the substrate 20 so that respective optical axes of the lens parts 32 face the through hole 23; and a third process of positioning the photoelectric conversion element 40 for the lens element 30 from the side of the reverse surface 22 of the substrate 20 so as to align the optical axes of the lens parts 32 with an optical axis of the light reception part or light emission part 41 of the photoelectric conversion element 40.

Description

本発明は、多チャンネルを備えた光電変換モジュール用部品の製造方法に関する。   The present invention relates to a method for manufacturing a photoelectric conversion module component having multiple channels.

多チャンネルを備えた光電変換モジュールとして、回路基板に、複数の光信号を送信・受信する半導体レーザ素子(光電変換素子)を設け、その光電変換素子と対向するようにレンズ素子を有するレンズアレイを設け、そのレンズアレイに、光ファイバが挿入されたフェルールを接続する実装構造が特許文献1等として知られている。   As a photoelectric conversion module having multiple channels, a semiconductor laser element (photoelectric conversion element) that transmits and receives a plurality of optical signals is provided on a circuit board, and a lens array having a lens element so as to face the photoelectric conversion element A mounting structure in which a ferrule with an optical fiber inserted is connected to the lens array is known as Patent Document 1 or the like.

特許文献1では、光素子を複数個並列に配置してなる光素子アレイを、嵌合孔を有する保持基板にフリップチップ実装し、この保持基板を回路基板に金属バンプ接続して設け、レンズアレイの突起壁を嵌合孔に嵌合させている。これにより保持基板上にレンズアレイを位置決めして固定すると共に、光素子とレンズアレイを光結合している。   In Patent Document 1, an optical element array in which a plurality of optical elements are arranged in parallel is flip-chip mounted on a holding substrate having a fitting hole, and the holding substrate is provided by connecting metal bumps to a circuit board. The protruding wall is fitted into the fitting hole. Thus, the lens array is positioned and fixed on the holding substrate, and the optical element and the lens array are optically coupled.

特開2010-122312号公報JP 2010-122312 A

光電変換モジュールに用いられる光電変換モジュール用部品において、高効率な光結合を実現するために、レンズアレイと複数の光電変換素子との位置合わせは正確に行う必要がある。さらに、光電変換モジュールは製造コストの低減のため、その部材コスト及び実装コストを低減することが要求される。   In a photoelectric conversion module component used in a photoelectric conversion module, it is necessary to accurately align the lens array and the plurality of photoelectric conversion elements in order to realize highly efficient optical coupling. Furthermore, in order to reduce the manufacturing cost of the photoelectric conversion module, it is required to reduce the member cost and the mounting cost.

特許文献1に記載の技術では、複数チャンネルの光経路を備える光電変換モジュール用部品においては、複数個のレンズ素子を備えるレンズアレイに複数個の光電変換素子を備える光電変換素子アレイを実装している。しかし、レンズアレイの突起壁を保持基板の嵌合孔に嵌合させて位置合わせする形態では、突起壁と嵌合孔の両方に高精度な加工を施す必要がある。しかし、セラミック基板或いはシリコン基板を高精度加工するには、一般にエッチングやリソグラフィといった加工プロセスを要し、製造コストが増大する。   In the technique described in Patent Document 1, in a photoelectric conversion module component having a plurality of channels of optical paths, a photoelectric conversion element array having a plurality of photoelectric conversion elements is mounted on a lens array having a plurality of lens elements. Yes. However, in the form in which the projection wall of the lens array is fitted and aligned with the fitting hole of the holding substrate, it is necessary to process both the projection wall and the fitting hole with high accuracy. However, in order to process a ceramic substrate or a silicon substrate with high accuracy, a processing process such as etching or lithography is generally required, which increases the manufacturing cost.

また、光電変換素子同士の距離が離れている光電変換モジュールを製造する場合には、複数個の光電変換素子を備える光電変換素子アレイを用いると、半導体ウエア単位面積当たりの光電変換素子数が減少し、製造効率が低下して部材コストが増大する。これに対し、単一の光電変換素子を複数個作成し、これらをそれぞれ基板に実装した方が、光電変換素子が形成される半導体ウエハを有効利用できるので部材コスト低減の観点で好ましい。   In addition, when manufacturing a photoelectric conversion module in which the distance between the photoelectric conversion elements is large, the number of photoelectric conversion elements per unit area of semiconductor wear decreases when a photoelectric conversion element array including a plurality of photoelectric conversion elements is used. However, the manufacturing efficiency is reduced and the member cost is increased. On the other hand, it is preferable to prepare a plurality of single photoelectric conversion elements and mount them on a substrate from the viewpoint of reducing the member cost because a semiconductor wafer on which the photoelectric conversion elements are formed can be used effectively.

一方、このような製造方法を適用しようとすれば、個々独立して形成された単一の光電変換素子を、基板の予め決められた位置に高精度に実装し、基板の各々の光電変換素子に対応する位置にレンズアレイを実装することになる。したがって、光電変換素子を基板に実装する工程とレンズアレイを基板に実装する工程の2つの工程に高い位置決め精度が要求され、実装コストが増大する。したがって、光電変換モジュール用部品の製造コストが高くなる。   On the other hand, if such a manufacturing method is applied, a single photoelectric conversion element formed independently is mounted with high accuracy at a predetermined position on the substrate, and each photoelectric conversion element on the substrate is mounted. The lens array is mounted at a position corresponding to the above. Therefore, high positioning accuracy is required for the two steps of mounting the photoelectric conversion element on the substrate and mounting the lens array on the substrate, and the mounting cost increases. Therefore, the manufacturing cost of the photoelectric conversion module component is increased.

そこで、本発明は光電変換モジュール用部品を、低コストかつ高い光結合効率で得られる製造方法を提供することを目的とする。   Then, an object of this invention is to provide the manufacturing method which can obtain the components for photoelectric conversion modules with low cost and high optical coupling efficiency.

上記目的を達成するために本発明によれば、以下が提供される。
(1) 表面と裏面とを有し前記表面から前記裏面まで貫通する貫通孔を備える基板と、受光部又は発光部を備える光電変換素子と、複数のレンズ部を備えるレンズ素子と、を用意する第1工程と、
前記レンズ部の各々の光軸が前記貫通孔を臨むように、前記レンズ素子を前記基板の表面側から前記基板に取り付ける第2工程と、
前記レンズ部の前記光軸と前記光電変換素子の前記受光部又は発光部の光軸を一致させるように、前記基板の前記裏面側から前記光電変換素子を前記レンズ素子に対して位置決めする第3工程と、
を含むことを特徴とする光電変換モジュール用部品の製造方法。
(2) 前記第1工程において、前記レンズ部毎に第1位置決め部が前記基板の前記裏面に形成された前記レンズ素子と、前記受光部又は発光部とを同じ側に第2位置決め部が形成された前記光電変換素子と、を用意し、
前記第3工程において、前記第1位置決め部に前記第2位置決め部を当接させて、それぞれの前記光電変換素子の前記受光部又は発光部を前記レンズ部に対して位置決めすることを特徴とする(1)に記載の光電変換モジュール用部品の製造方法。
(3) 前記第1工程において、前記レンズ部と同じ側又は前記基板の前記第2位置決め部に第1金属層が形成された前記レンズ素子と、前記受光部又は発光部と同じ側に第2金属層が形成された前記光電変換素子と、を用意し、
前記第3工程において、前記第1金属層及び前記第2金属層とを熱圧着させて前記光電変換素子を前記レンズ素子に固定することを特徴とする(1)または(2)に記載の光電変換モジュール用部品の製造方法。
(4) 前記第1金属層は、前記レンズ素子とともにインサート成形されることを特徴とする(3)に記載の光電変換モジュール用部品の製造方法。
(5) 前記レンズ素子は、複数の前記レンズ部が等間隔に配列されたレンズアレイであることを特徴とする(1)から(4)のいずれか一項に記載の光電変換モジュール用部品の製造方法。
(6) 前記光電変換素子は、列状に並んだ複数の前記受光部又は発光部を備え、
前記第3工程において、列の両端に位置する前記受光部又は発光部についてのみ光軸を一致させるように、前記基板の前記裏面側から、前記光電変換素子を前記レンズ素子に対して位置決めすることを特徴とする(1)から(5)のいずれか一項に記載の光電変換モジュール用部品の製造方法。
In order to achieve the above object, the present invention provides the following.
(1) A substrate having a front surface and a back surface and having a through-hole penetrating from the front surface to the back surface, a photoelectric conversion element having a light receiving portion or a light emitting portion, and a lens element having a plurality of lens portions are prepared. The first step;
A second step of attaching the lens element to the substrate from the surface side of the substrate such that each optical axis of the lens portion faces the through hole;
Positioning the photoelectric conversion element with respect to the lens element from the back side of the substrate so that the optical axis of the lens unit and the optical axis of the light receiving unit or the light emitting unit of the photoelectric conversion element coincide with each other. Process,
The manufacturing method of the components for photoelectric conversion modules characterized by including.
(2) In the first step, a second positioning portion is formed on the same side of the lens element formed on the back surface of the substrate and the light receiving portion or the light emitting portion for each lens portion. Prepared the photoelectric conversion element,
In the third step, the second positioning portion is brought into contact with the first positioning portion, and the light receiving portion or the light emitting portion of each of the photoelectric conversion elements is positioned with respect to the lens portion. The manufacturing method of the components for photoelectric conversion modules as described in (1).
(3) In the first step, the lens element on which the first metal layer is formed on the same side as the lens part or the second positioning part of the substrate, and the second side on the same side as the light receiving part or the light emitting part. Preparing the photoelectric conversion element on which a metal layer is formed,
In the third step, the photoelectric conversion element according to (1) or (2), wherein the photoelectric conversion element is fixed to the lens element by thermocompression bonding the first metal layer and the second metal layer. A method for manufacturing a conversion module component.
(4) The method for manufacturing a part for a photoelectric conversion module according to (3), wherein the first metal layer is insert-molded together with the lens element.
(5) The component of the photoelectric conversion module according to any one of (1) to (4), wherein the lens element is a lens array in which a plurality of the lens portions are arranged at equal intervals. Production method.
(6) The photoelectric conversion element includes a plurality of the light receiving units or light emitting units arranged in a row,
In the third step, the photoelectric conversion element is positioned with respect to the lens element from the back surface side of the substrate so that only the light receiving part or the light emitting part located at both ends of the row is aligned with the optical axis. (1) The manufacturing method of the component for photoelectric conversion modules as described in any one of (5) characterized by the above-mentioned.

(7) 複数のレンズ部と第1位置合わせ部を同じ側に備えたレンズ素子と、受光部又は発光部と第2位置合わせ部とを同じ側に備える光電変換素子と、を用意する第4工程と、
前記レンズ部の光軸と前記光電変換素子の前記受光部又は発光部の光軸が一致するように、前記第2位置合わせ部を前記第1位置合わせ部に当接させて前記光電変換素子を前記レンズ素子に位置合わせする第5工程と、
を含むことを特徴とする光電変換モジュール用部品の製造方法。
(8) 前記第4工程において、前記第1位置合わせ部及び第2位置合わせ部の表面に第1金属層及び第2金属層が形成された前記レンズ素子及び前記光電変換素子を用意し、
前記第5工程において、前記第1金属層及び前記第2金属層を熱圧着させて前記光電変換素子を前記レンズ素子に固定することを特徴とする(7)に記載の光電変換モジュール用部品の製造方法。
(9) 前記第4工程において、前記第1金属層と共に前記レンズ素子をインサート成形することを特徴とする(8)に記載の光電変換モジュール用部品の製造方法。
(10) 前記レンズ素子は、複数の前記レンズ部が等間隔に配列されたレンズアレイであることを特徴とする(7)から(9)のいずれか一項に記載の光電変換モジュール用部品の製造方法。
(7) preparing a lens element having a plurality of lens portions and a first alignment portion on the same side, and a photoelectric conversion element having a light receiving portion or a light emitting portion and a second alignment portion on the same side; Process,
The second alignment unit is brought into contact with the first alignment unit so that the optical axis of the lens unit coincides with the optical axis of the light receiving unit or the light emitting unit of the photoelectric conversion element. A fifth step of aligning with the lens element;
The manufacturing method of the components for photoelectric conversion modules characterized by including.
(8) In the fourth step, the lens element and the photoelectric conversion element in which the first metal layer and the second metal layer are formed on the surfaces of the first alignment part and the second alignment part are prepared,
In the fifth step, the photoelectric conversion module component according to (7), wherein the photoelectric conversion element is fixed to the lens element by thermocompression bonding the first metal layer and the second metal layer. Production method.
(9) The method for manufacturing a component for a photoelectric conversion module according to (8), wherein the lens element is insert-molded together with the first metal layer in the fourth step.
(10) The component for a photoelectric conversion module according to any one of (7) to (9), wherein the lens element is a lens array in which a plurality of the lens portions are arranged at equal intervals. Production method.

本発明に係る光電変換モジュール用部品の製造方法によれば、光電変換素子をレンズ素子に対して光軸を直接一致させるので、レンズ素子を基板に配置する際は高い位置決め精度を要求されない。したがって、高い光結合効率を有する光電変換モジュール用部品を低コストで提供することができる。   According to the method for manufacturing a component for a photoelectric conversion module according to the present invention, since the optical axis of the photoelectric conversion element is directly aligned with the lens element, high positioning accuracy is not required when the lens element is arranged on the substrate. Therefore, a photoelectric conversion module component having high optical coupling efficiency can be provided at a low cost.

本発明の第1実施形態に係る光電変換モジュール用部品を適用した光電変換モジュールの斜視図である。1 is a perspective view of a photoelectric conversion module to which a photoelectric conversion module component according to a first embodiment of the present invention is applied. 本発明の第1実施形態に係る光電変換モジュール用部品の側断面図である。It is a sectional side view of the component for photoelectric conversion modules which concerns on 1st Embodiment of this invention. 本発明の第1実施形態に係る光電変換モジュール用部品の製造工程を示す説明図である。It is explanatory drawing which shows the manufacturing process of the components for photoelectric conversion modules which concern on 1st Embodiment of this invention. 本発明の第2実施形態に係る光電変換モジュール用部品の側断面図である。It is a sectional side view of the component for photoelectric conversion modules which concerns on 2nd Embodiment of this invention. 本発明の第2実施形態に係る光電変換モジュール用部品の製造工程を示す説明図である。It is explanatory drawing which shows the manufacturing process of the components for photoelectric conversion modules which concern on 2nd Embodiment of this invention.

以下、本発明の実施形態に係る光電変換モジュール用部品の製造方法を、図面を参照して説明する。   Hereinafter, a method for manufacturing a part for a photoelectric conversion module according to an embodiment of the present invention will be described with reference to the drawings.

<第1実施形態>
図1は本発明の第1実施形態に係る光電変換モジュール用部品の製造方法を適用して製造した光電変換モジュール用部品10を含む光電変換モジュール1を示す斜視図である。光電変換モジュール1は、複数本(図示の例では4本)の光ファイバ2が並列に配列された光コネクタ3と、この光ファイバ2に光信号を送受信する光電変換モジュール用部品10とを備えている。光電変換モジュール用部品10は、基板20の表面に固定され光ファイバ2に光学的に接続されたレンズアレイ(レンズ素子)30と、電気信号に応じて光ファイバ2に光信号を送信する、あるいは光信号に応じて電気信号を発する光電変換素子40(図2参照)を備えている。
<First Embodiment>
FIG. 1 is a perspective view showing a photoelectric conversion module 1 including a photoelectric conversion module component 10 manufactured by applying the photoelectric conversion module component manufacturing method according to the first embodiment of the present invention. The photoelectric conversion module 1 includes an optical connector 3 in which a plurality of optical fibers 2 (four in the illustrated example) are arranged in parallel, and a photoelectric conversion module component 10 that transmits and receives optical signals to and from the optical fiber 2. ing. The photoelectric conversion module component 10 transmits a light signal to the optical fiber 2 according to an electric signal, and a lens array (lens element) 30 fixed to the surface of the substrate 20 and optically connected to the optical fiber 2, or The photoelectric conversion element 40 (refer FIG. 2) which emits an electrical signal according to an optical signal is provided.

光コネクタ3は、並列に配列された光ファイバの端面がレンズアレイ30のファイバ側レンズ素子31に対向するように、光電変換モジュール用部品10に対して取り付けられる。なお、図示していないが、光コネクタ3を光電変換モジュール用部品10に対して取り付けやすくするために、レンズアレイ30の光コネクタ3に対向する面にガイド孔を設け、ガイドピンを光コネクタ3に設けて、ガイドピンをガイド孔に挿入して光ファイバ2とレンズアレイ30とを容易に光接続できるように構成してもよい。   The optical connector 3 is attached to the photoelectric conversion module component 10 so that the end faces of the optical fibers arranged in parallel face the fiber-side lens element 31 of the lens array 30. Although not shown, in order to make it easy to attach the optical connector 3 to the photoelectric conversion module component 10, a guide hole is provided on the surface of the lens array 30 facing the optical connector 3, and guide pins are provided to the optical connector 3. The optical fiber 2 and the lens array 30 may be easily optically connected by inserting a guide pin into the guide hole.

図2は光電変換モジュール用部品10の側断面図である。図2に示すように、光電変換モジュール用部品10は、表面21からその反対側の裏面22まで貫通する貫通孔23を備えた基板20と、基板20の表面21上に取り付けられたレンズアレイ30と、受光面又は発光面41がレンズアレイ30に対向するように基板20に取り付けられた光電変換素子40とを備えている。   FIG. 2 is a side sectional view of the photoelectric conversion module component 10. As shown in FIG. 2, the photoelectric conversion module component 10 includes a substrate 20 having a through hole 23 that penetrates from the front surface 21 to the back surface 22 on the opposite side, and a lens array 30 attached on the front surface 21 of the substrate 20. And a photoelectric conversion element 40 attached to the substrate 20 so that the light receiving surface or the light emitting surface 41 faces the lens array 30.

レンズアレイ30は、光ファイバ2と光接続されるように配列された複数のファイバ側レンズ部31と、光電変換素子40と光結合される複数の素子側レンズ素子(以下、レンズ部と略称する)32と、ファイバ側レンズ部31とレンズ部32間を光路変換して相互に導光する反射部33とを備えている。また、レンズ部32の周囲には基板取付部34がレンズ部32の光軸方向に沿って突出するように形成されている。複数のファイバ側レンズ部31及びレンズ部32は、等間隔に配列されていることが好ましい。このようなレンズアレイ30は、例えば樹脂の射出成形により製造される。   The lens array 30 includes a plurality of fiber side lens portions 31 arranged so as to be optically connected to the optical fiber 2 and a plurality of element side lens elements (hereinafter abbreviated as lens portions) optically coupled to the photoelectric conversion element 40. ) 32, and a fiber side lens unit 31 and a reflection unit 33 that guides each other by changing the optical path between the lens unit 32. A substrate mounting portion 34 is formed around the lens portion 32 so as to protrude along the optical axis direction of the lens portion 32. The plurality of fiber side lens portions 31 and the lens portions 32 are preferably arranged at equal intervals. Such a lens array 30 is manufactured by, for example, resin injection molding.

レンズアレイ30は基板20に対して、レンズアレイ30のレンズ部32が基板20の貫通孔23から裏面22側に露出するように、基板取付部34が基板20の貫通孔23の開口周囲の表面21上に接着されて固定されている。   The surface of the lens array 30 around the opening of the through hole 23 of the substrate 20 so that the lens portion 32 of the lens array 30 is exposed to the back surface 22 side from the through hole 23 of the substrate 20 with respect to the substrate 20. 21 is adhered and fixed.

光電変換素子40は、電気信号に応じて光信号を発する発光素子(面発光レーザ(VCSEL))や、光信号に応じて電気信号を発する受光素子(フォトダイオード)といった半導体素子である。光電変換素子40は受発光面41がレンズアレイ30のレンズ部32と光軸が一致するように対向して基板20の裏面22側から取り付けられている。   The photoelectric conversion element 40 is a semiconductor element such as a light emitting element (surface emitting laser (VCSEL)) that emits an optical signal in response to an electric signal or a light receiving element (photodiode) that emits an electric signal in response to an optical signal. The photoelectric conversion element 40 is attached from the back surface 22 side of the substrate 20 so that the light emitting / receiving surface 41 faces the lens portion 32 of the lens array 30 so that the optical axis coincides.

なお、貫通孔23の内径について、表面21側の内壁24が裏面22側の内壁25よりも小径となるように貫通孔23の内壁に段部26(第1位置決め部)を設けてもよい。光電変換素子40の受発光面41に隣接する外周面の外形寸法を、内壁25の内径寸法よりも小さく、かつ、内壁24の内径寸法よりも大きく設定すると、光電変換素子40を内壁25の内部に挿入することができ、レンズ部32と受発光面41との距離を小さくすることができるので、光結合効率が良い。また、受発光面41の取付面24を基板20の段部26に当接させて光電変換素子40を基板20に対して固定することができる。   Note that a step portion 26 (first positioning portion) may be provided on the inner wall of the through hole 23 so that the inner wall 24 on the front surface 21 side has a smaller diameter than the inner wall 25 on the rear surface 22 side. When the outer dimension of the outer peripheral surface adjacent to the light emitting / receiving surface 41 of the photoelectric conversion element 40 is set smaller than the inner diameter dimension of the inner wall 25 and larger than the inner diameter dimension of the inner wall 24, the photoelectric conversion element 40 is placed inside the inner wall 25. Since the distance between the lens portion 32 and the light emitting / receiving surface 41 can be reduced, the optical coupling efficiency is good. Further, the photoelectric conversion element 40 can be fixed to the substrate 20 by bringing the mounting surface 24 of the light emitting / receiving surface 41 into contact with the step portion 26 of the substrate 20.

このように構成された光電変換モジュール1は、例えば光電変換素子40が発光素子である場合は、電気信号に応じて発光面41から発せられた光がレンズ部32で集光され、反射部33でファイバ側レンズ素子31に反射され、光コネクタ3の光ファイバ2に光信号が伝達される。   In the photoelectric conversion module 1 configured as described above, for example, when the photoelectric conversion element 40 is a light emitting element, the light emitted from the light emitting surface 41 according to the electric signal is condensed by the lens unit 32 and the reflection unit 33. The optical signal is transmitted to the optical fiber 2 of the optical connector 3 by being reflected by the fiber side lens element 31.

なお、上述の例ではファイバ側レンズ素子31とレンズ部32とからなるレンズ対を複数備えたレンズアレイ30を備えた光電変換モジュール用部品10を例に挙げて説明したが、単一のファイバ側レンズ素子31と単一のレンズ部32とからなる単一のレンズ対を備えたレンズ体30を備えた光電変換モジュール用部品10としてもよい。   In the above-described example, the photoelectric conversion module component 10 including the lens array 30 including a plurality of lens pairs each including the fiber-side lens element 31 and the lens portion 32 has been described as an example. It is good also as the component 10 for photoelectric conversion modules provided with the lens body 30 provided with the single lens pair which consists of the lens element 31 and the single lens part 32. FIG.

このような光電変換モジュール用部品10の製造方法を図3を参照して以下に説明する。   A method for manufacturing such a photoelectric conversion module component 10 will be described below with reference to FIG.

まず、表面と裏面とを有し、表面から裏面まで貫通する貫通孔を備える基板と、受発光面(受光部又は発光部)41を備える光電変換素子と、複数のレンズ部32を備えるレンズアレイ(レンズ素子)30とを用意する。図3(a)に示すように、基板20に光コネクタ3の光ファイバ2相互の間隔と同じ間隔を設けて列状に複数の貫通孔23を形成する。貫通孔23は、基板20がガラスエポキシ基板の場合はドリル等を用いて穿鑿加工で形成してもよいし、基板20を樹脂成形する場合は射出成形によって基板20の成型時に同時に貫通孔23を形成してもよい。また、基板20を半導体基板とする場合はエッチング等を用いて貫通孔23を形成することができる。このときに、上述のように、表面21側の内壁24が裏面22側の内壁25よりも小径となるように貫通孔23の内壁に段部26を設けてもよい。   First, a substrate having a front surface and a back surface and having a through-hole penetrating from the front surface to the back surface, a photoelectric conversion element having a light emitting / receiving surface (light receiving portion or light emitting portion) 41, and a lens array having a plurality of lens portions 32 (Lens element) 30 is prepared. As shown in FIG. 3A, a plurality of through holes 23 are formed in a row on the substrate 20 with the same interval as the interval between the optical fibers 2 of the optical connector 3. The through-hole 23 may be formed by drilling using a drill or the like when the substrate 20 is a glass epoxy substrate. When the substrate 20 is resin-molded, the through-hole 23 is simultaneously formed when the substrate 20 is molded by injection molding. It may be formed. When the substrate 20 is a semiconductor substrate, the through hole 23 can be formed by etching or the like. At this time, as described above, the step portion 26 may be provided on the inner wall of the through hole 23 so that the inner wall 24 on the front surface 21 side has a smaller diameter than the inner wall 25 on the rear surface 22 side.

なお、貫通孔23は、レンズアレイ30の複数のレンズ部32に合わせて複数個形成してもよいし、複数のレンズ部32が同一の貫通孔23から裏面22側に露出するようにレンズ部32の配列方向に沿って単一の貫通孔23を形成してもよい。   Note that a plurality of through holes 23 may be formed in accordance with the plurality of lens portions 32 of the lens array 30, or the lens portions so that the plurality of lens portions 32 are exposed from the same through hole 23 to the back surface 22 side. A single through-hole 23 may be formed along 32 arrangement directions.

次に、図3(b)に示すように、レンズアレイ30のレンズ部32の各々の光軸Axがそれぞれ貫通孔23を臨むようにレンズアレイ30を基板20の表面21に取り付ける。   Next, as shown in FIG. 3B, the lens array 30 is attached to the surface 21 of the substrate 20 so that each optical axis Ax of the lens portion 32 of the lens array 30 faces the through hole 23.

レンズアレイ30を基板20の所定位置に位置決めする際は、基板20とレンズアレイ30とに位置決め凹部及び位置決め凸部とを設けておき、これらを当接させて嵌合させる、あるいは、基板20の表面21上に参照用のマークを付しておき、これを参照しながらレンズアレイ30を配置することが例示できる。なお、このような位置決め工程においては、レンズ部32の光軸Axが貫通孔23内を通過するようにされていれば十分であり、後述する光電変換素子40の取付時の位置決め精度よりも低い位置決め精度でよく、部材コスト及び実装コスト低減の観点から適宜選択すれば良い。   When positioning the lens array 30 at a predetermined position on the substrate 20, positioning concave portions and positioning convex portions are provided on the substrate 20 and the lens array 30, and these are brought into contact with each other, or are fitted. It can be exemplified that a reference mark is attached on the surface 21 and the lens array 30 is arranged with reference to this mark. In such a positioning step, it is sufficient that the optical axis Ax of the lens portion 32 passes through the through hole 23, which is lower than the positioning accuracy when the photoelectric conversion element 40 described later is attached. The positioning accuracy may be sufficient, and may be appropriately selected from the viewpoint of reducing the member cost and the mounting cost.

レンズアレイ30の基板20に対する取り付けは、基板取付部34の基板20との当接面に接着剤を塗布したり、あるいはバンプの振動溶着等により固定することが例示できる。あるいは、基板取付部34の基板20に当接する面、および基板20の基板取付部34に当接する面に金属層(第1金属層,第2金属層)を設け、これら金属層間を熱圧着させてもよい。   The attachment of the lens array 30 to the substrate 20 can be exemplified by applying an adhesive to the contact surface of the substrate attachment portion 34 with the substrate 20 or fixing it by vibration welding of bumps. Alternatively, a metal layer (first metal layer, second metal layer) is provided on the surface of the substrate mounting portion 34 that contacts the substrate 20 and the surface of the substrate 20 that contacts the substrate mounting portion 34, and these metal layers are thermocompression bonded. May be.

次に、レンズ部32の光軸Axと光電変換素子40の光軸Ayを一致させるように、光電変換素子40をレンズ部32に対して位置決めし、基板20の裏面22側からレンズアレイ30を取り付けて、図2に示す光電変換モジュール用部品10を得る。なお、図1に示したように基板20の貫通孔23に段部26を設けた場合は、光電変換素子40の取付面41を段部26に取り付けることができる。   Next, the photoelectric conversion element 40 is positioned with respect to the lens part 32 so that the optical axis Ax of the lens part 32 and the optical axis Ay of the photoelectric conversion element 40 coincide with each other, and the lens array 30 is moved from the back surface 22 side of the substrate 20. It attaches and the photoelectric conversion module component 10 shown in FIG. 2 is obtained. As shown in FIG. 1, when the step portion 26 is provided in the through hole 23 of the substrate 20, the mounting surface 41 of the photoelectric conversion element 40 can be attached to the step portion 26.

また、レンズ部32の光軸Axと光電変換素子40の光軸Ayを一致させて光電変換素子40をレンズ部32に対して位置決めするためには、以下の方法を挙げることができる。   In order to position the photoelectric conversion element 40 with respect to the lens unit 32 by matching the optical axis Ax of the lens unit 32 and the optical axis Ay of the photoelectric conversion unit 40, the following method can be used.

例えば光電変換素子40が発光素子の場合は、発光素子40を発光させてレンズアレイ30のファイバ側レンズ素子31側から光の強度を観察し、最も光の強度が大きくなった位置で発光素子40を基板20に取り付ける。なお、光電変換素子40が受光素子の場合は逆に、ファイバ側レンズ素子31から光を入射させて、この光を受光した受光素子40からの電気信号が最大となる位置で発光素子40を基板20に取り付ければよい。   For example, when the photoelectric conversion element 40 is a light emitting element, the light emitting element 40 is caused to emit light, the intensity of light is observed from the fiber side lens element 31 side of the lens array 30, and the light emitting element 40 is located at the position where the light intensity is maximum. Is attached to the substrate 20. On the contrary, when the photoelectric conversion element 40 is a light receiving element, light is incident from the fiber side lens element 31, and the light emitting element 40 is placed at the position where the electric signal from the light receiving element 40 receiving the light becomes maximum. 20 may be attached.

また、上記方法の他に、レンズアレイ30のファイバ側レンズ素子31からカメラ等により光電変換素子40の受発光面41を含む画像を取得し、レンズの中央に受発光面41が位置した状態で光電変換素子40を基板20に取り付けることができる。この方法は、光電変換素子40が発光素子であるか受光素子であるかを問わずに同一の手法を用いて光電変換素子40を基板20に取り付けることができる。   In addition to the above method, an image including the light emitting / receiving surface 41 of the photoelectric conversion element 40 is acquired from the fiber side lens element 31 of the lens array 30 by a camera or the like, and the light receiving / emitting surface 41 is located at the center of the lens. The photoelectric conversion element 40 can be attached to the substrate 20. In this method, the photoelectric conversion element 40 can be attached to the substrate 20 using the same method regardless of whether the photoelectric conversion element 40 is a light emitting element or a light receiving element.

上記の工程は、予め基板20の裏面22に第1位置決め部として例えば段部26を設けておき、光電変換素子40に、第1位置決め部26と当接する第2位置決め部として、例えば光電変換素子40と段部26との当接面43を受発光面41と同じ側に設けておくことが好ましい。第1位置決め部26に前記第2位置決め部43を当接させて、それぞれの位置を粗く調整した後に、上述のように光電変換素子40の受発光面41をレンズ部32に対して位置決めすることができる。   In the above process, for example, a step portion 26 is provided as a first positioning portion on the back surface 22 of the substrate 20 in advance, and a photoelectric conversion element 40 is used as a second positioning portion that contacts the first positioning portion 26 on the photoelectric conversion element 40. The contact surface 43 between the step 40 and the step portion 26 is preferably provided on the same side as the light emitting / receiving surface 41. After the second positioning portion 43 is brought into contact with the first positioning portion 26 and the respective positions are adjusted roughly, the light receiving / emitting surface 41 of the photoelectric conversion element 40 is positioned with respect to the lens portion 32 as described above. Can do.

即ち、粗調整用の上記第1位置決め部26及び第2位置決め部43は、高精度な加工を必要としないため、部材コストの上昇を抑制しながら実装コストを低減させることが可能になり、製造工程を最適化する上で自由度を向上させ得る。このような第1位置決め部26に前記第2位置決め部43は、両者が当接してレンズアレイ30及び光電変換素子40の位置を粗調整できればよく、段部26及当接面43は傾斜面として形成してもよい。   That is, since the first positioning portion 26 and the second positioning portion 43 for coarse adjustment do not require high-precision processing, it is possible to reduce the mounting cost while suppressing an increase in member cost. The degree of freedom in optimizing the process can be improved. The second positioning portion 43 is only required to be able to roughly adjust the positions of the lens array 30 and the photoelectric conversion element 40 by contacting the first positioning portion 26 and the stepped portion 26 and the contact surface 43 are inclined surfaces. It may be formed.

また、光電変換素子40の基板20に対する取り付けは、両者の当接面に接着剤を塗布したり、あるいはバンプの振動溶着等により固定することが例示できる。あるいは、両者の当接面に金属層(第1金属層,第2金属層)を設け、これら金属層間を熱圧着させてもよい。   Further, the attachment of the photoelectric conversion element 40 to the substrate 20 can be exemplified by applying an adhesive to the contact surfaces of both, or fixing by bump welding or the like. Alternatively, a metal layer (first metal layer, second metal layer) may be provided on the contact surfaces of the two, and the metal layers may be thermocompression bonded.

なお、光電変換素子40が複数の受発光面41を備える場合には、上述のレンズ部32の光軸Axと光電変換素子40の光軸Ayを一致させる工程は、光電変換素子40の列状に配置された受発光面41の両端に位置する受発光面41についてのみ光軸を一致させるように、基板20の裏面22側から、光電変換素子40をレンズアレイ30に対して位置決めすれば、全ての受発光面41について一括して光軸を一致させることができる。レンズ部32及び光電変換素子40は高精度加工が施されており、両者の光軸を直接一致させる工程を採用しているからである。このようにすれば、全ての受発光面について個別に光軸調整する場合に比べ、実装コストをさらに低減させることができる。   In the case where the photoelectric conversion element 40 includes a plurality of light receiving and emitting surfaces 41, the step of matching the optical axis Ax of the lens unit 32 and the optical axis Ay of the photoelectric conversion element 40 described above is an array of the photoelectric conversion elements 40. If the photoelectric conversion element 40 is positioned with respect to the lens array 30 from the back surface 22 side of the substrate 20 so that the optical axes coincide only with respect to the light emitting / receiving surfaces 41 located at both ends of the light emitting / receiving surface 41 arranged at The optical axes of all the light emitting / receiving surfaces 41 can be matched at once. This is because the lens unit 32 and the photoelectric conversion element 40 are subjected to high-precision processing and employ a process of directly matching the optical axes of the two. In this way, the mounting cost can be further reduced as compared with the case where the optical axes are individually adjusted for all light receiving and emitting surfaces.

<第2実施形態>
図4は本発明の第2実施形態に係る光電変換モジュール用部品10aを示す側断面図である。第2実施形態に係る光電変換モジュール用部品10aは、基板20の貫通孔23aが円筒形状であること、レンズアレイ30と光電変換素子40に位置合わせ嵌合部35,45が設けられること、及び光電変換素子40がレンズアレイ30に直接取り付けられる点が第1実施形態と異なる他は、第1実施形態と同様である。なお、第1実施形態と同様の構成については、第1実施形態と同様の符号を用いてその詳細な説明を省略する。
Second Embodiment
FIG. 4 is a side sectional view showing a photoelectric conversion module component 10a according to the second embodiment of the present invention. In the photoelectric conversion module component 10a according to the second embodiment, the through hole 23a of the substrate 20 is cylindrical, the alignment fitting portions 35 and 45 are provided in the lens array 30 and the photoelectric conversion element 40, and The photoelectric conversion element 40 is the same as the first embodiment except that the photoelectric conversion element 40 is directly attached to the lens array 30 except for the first embodiment. In addition, about the structure similar to 1st Embodiment, the detailed description is abbreviate | omitted using the code | symbol similar to 1st Embodiment.

第2実施形態に係る光電変換モジュール用部品10aは、基板20に設けられた段差のない内壁を備えた円柱状の貫通孔23に、光電変換素子40を挿入し、光電変換素子40の位置合わせ嵌合部45をレンズアレイ30の位置合わせ嵌合部35に嵌合させている。   In the photoelectric conversion module component 10a according to the second embodiment, the photoelectric conversion element 40 is inserted into a cylindrical through-hole 23 provided with a stepless inner wall provided in the substrate 20, and the photoelectric conversion element 40 is aligned. The fitting portion 45 is fitted to the alignment fitting portion 35 of the lens array 30.

レンズアレイ30のうち、レンズ部32が形成される側に位置決め嵌合部(第1位置合わせ部)35が設けられている。本実施形態では、位置合わせ嵌合部35はレンズ部32毎に、基板取付部34の内周側に形成されたテーパ面として形成されている。また、光電変換素子40には、受発光面41を含む領域が凸となるように取付面42に凸状が形成されており、受発光面41の周囲に位置合わせ嵌合部45(第2位置合わせ部)としてのテーパ面が形成されている。なお、位置合わせ嵌合部35,45は、両者を嵌合させたときにレンズ部32の光軸Axと光電変換素子40の光軸Ayとが一致するように設けられている。   A positioning fitting portion (first alignment portion) 35 is provided on the lens array 30 on the side where the lens portion 32 is formed. In the present embodiment, the alignment fitting portion 35 is formed as a tapered surface formed on the inner peripheral side of the substrate attachment portion 34 for each lens portion 32. The photoelectric conversion element 40 has a convex shape on the mounting surface 42 so that a region including the light emitting / receiving surface 41 is convex, and an alignment fitting portion 45 (second second) around the light emitting / receiving surface 41. A tapered surface is formed as an alignment portion. The alignment fitting portions 35 and 45 are provided so that the optical axis Ax of the lens portion 32 and the optical axis Ay of the photoelectric conversion element 40 coincide with each other when they are fitted together.

図5は第2実施形態に係る光電変換モジュール用部品10aの製造方法を示す説明図である。
まず、図5(a)に示すように、単一の内径を有する貫通孔23を備えた基板20を用意する。例えばガラスエポキシ基板20にドリル等の穿鑿加工により容易に貫通孔23を形成することができる。
FIG. 5 is an explanatory view showing a method of manufacturing the photoelectric conversion module component 10a according to the second embodiment.
First, as shown in FIG. 5A, a substrate 20 having a through hole 23 having a single inner diameter is prepared. For example, the through hole 23 can be easily formed in the glass epoxy substrate 20 by drilling such as a drill.

次に、図4(b)に示すように、レンズアレイ30のレンズ部32の各々の光軸Axがそれぞれ貫通孔23を臨むようにレンズアレイ30を基板20の表面21に取り付ける。上述した第1実施形態の製造方法と同様に、本工程には高い位置決め精度は要求されない。   Next, as shown in FIG. 4B, the lens array 30 is attached to the surface 21 of the substrate 20 so that each optical axis Ax of the lens portion 32 of the lens array 30 faces the through hole 23. Similar to the manufacturing method of the first embodiment described above, this process does not require high positioning accuracy.

次に、光電変換素子40を基板20の貫通孔23内に挿入し、レンズ部32の光軸Axと光電変換素子40の光軸Ayとが一致するように、光電変換素子40の位置合わせ嵌合部45をレンズアレイ30の位置合わせ嵌合部35に当接させて嵌合させ、光電変換素子40をレンズアレイ30に位置合わせして固定する。   Next, the photoelectric conversion element 40 is inserted into the through hole 23 of the substrate 20, and the alignment fitting of the photoelectric conversion element 40 is performed so that the optical axis Ax of the lens portion 32 and the optical axis Ay of the photoelectric conversion element 40 coincide. The joining portion 45 is brought into contact with and fitted to the alignment fitting portion 35 of the lens array 30, and the photoelectric conversion element 40 is aligned and fixed to the lens array 30.

なお、レンズアレイ30に位置合わせ嵌合部35を設ける際には、精密金型等を用いて高い位置決め精度及び寸法精度で、レンズアレイ30の射出成形時にレンズ部32毎に、位置合わせ嵌合部35を同時に形成することができる。また、光電変換素子40に位置合わせ嵌合部45を設ける際には、光電変換素子40の受発光面41を形成する工程の中で、半導体薄膜形成技術として公知のマスキング、エッチング等により、高い位置決め精度及び寸法精度で、形成することができる。即ち、部材コストを上昇することなく、実装コストを低減することができる。   When the alignment fitting portion 35 is provided in the lens array 30, the alignment fitting is performed for each lens portion 32 at the time of injection molding of the lens array 30 with high positioning accuracy and dimensional accuracy using a precision mold or the like. The part 35 can be formed simultaneously. Further, when the alignment fitting portion 45 is provided in the photoelectric conversion element 40, it is high in the process of forming the light receiving / emitting surface 41 of the photoelectric conversion element 40 by a known masking, etching, etc. as a semiconductor thin film forming technique. It can be formed with positioning accuracy and dimensional accuracy. That is, the mounting cost can be reduced without increasing the member cost.

また、レンズアレイ30の位置合わせ嵌合部35及び光電変換素子40の位置合わせ嵌合部45の表面に金属層を形成しておき、これらの金属層同士に熱および応力を加えて熱圧着することが好ましい。嵌合部にバンプやはんだ、接着剤を介在させないことで、バンプの突起高さ、はんだや接着剤の塗布量に影響されず、光電変換素子40を精度良くレンズアレイ30に取り付けることができる。レンズアレイ30にこのような金属層を形成するには、金属層と共にレンズアレイ30をインサート成形により製造することが好ましい。   Further, a metal layer is formed on the surfaces of the alignment fitting portion 35 of the lens array 30 and the alignment fitting portion 45 of the photoelectric conversion element 40, and heat and pressure are applied to these metal layers by applying heat and stress. It is preferable. By not interposing a bump, solder, or adhesive in the fitting portion, the photoelectric conversion element 40 can be attached to the lens array 30 with high accuracy without being affected by the bump protrusion height and the application amount of the solder or adhesive. In order to form such a metal layer on the lens array 30, it is preferable to manufacture the lens array 30 together with the metal layer by insert molding.

第2実施形態に係る光電変換モジュール用部品10aでは、レンズアレイ30と光電変換素子40それぞれに直接、高い位置決め精度及び寸法精度で、位置合わせ嵌合部35,45が形成されている。したがって、これら高い位置決め精度及び寸法精度で形成された位置合わせ嵌合部35,45を用いて、光電変換素子40をレンズ部32に対して容易にかつ高精度に位置合わせすることができる。   In the photoelectric conversion module component 10a according to the second embodiment, the alignment fitting portions 35 and 45 are formed directly on the lens array 30 and the photoelectric conversion element 40 with high positioning accuracy and dimensional accuracy, respectively. Therefore, the photoelectric conversion element 40 can be easily and accurately aligned with the lens portion 32 by using the alignment fitting portions 35 and 45 formed with high positioning accuracy and dimensional accuracy.

したがって、上述した第1実施形態のように光信号の強度あるいは電気信号の強度を測定しながら、あるいはカメラで撮影しながら光電変換素子40をレンズアレイ30に対して位置合わせする必要がない。つまり、位置決め精度が要求されないレンズアレイ30を基板20に取り付ける工程に加えて、光電変換素子40をレンズアレイ30に取り付ける工程でも複雑な取付方法、あるいは取付装置が不要となり、製造コストを低減することができる。   Therefore, it is not necessary to align the photoelectric conversion element 40 with respect to the lens array 30 while measuring the intensity of the optical signal or the intensity of the electric signal as in the first embodiment described above or photographing with the camera. That is, in addition to the process of attaching the lens array 30 that does not require positioning accuracy to the substrate 20, the process of attaching the photoelectric conversion element 40 to the lens array 30 eliminates the need for a complicated attachment method or attachment device, thereby reducing the manufacturing cost. Can do.

更に、第2実施形態に係る光電変換モジュール用部品10aでは、光電変換素子40と、レンズアレイ30とにそれぞれ位置合わせ嵌合部45,35が設けられ、光電変換素子40がレンズアレイ30に直接取り付けられている。したがって、基板20を介してレンズアレイ30に光電変換素子40を取り付ける場合と比べて、第2実施形態に係る光電変換モジュール用部品10aは基板20を介さずにレンズアレイ30に光電変換素子40を取り付けているので、寸法誤差や位置決め誤差が蓄積せず、位置合わせ精度が向上する。   Further, in the photoelectric conversion module component 10 a according to the second embodiment, the alignment fitting portions 45 and 35 are provided in the photoelectric conversion element 40 and the lens array 30, respectively, and the photoelectric conversion element 40 is directly attached to the lens array 30. It is attached. Therefore, compared with the case where the photoelectric conversion element 40 is attached to the lens array 30 via the substrate 20, the photoelectric conversion module component 10 a according to the second embodiment attaches the photoelectric conversion element 40 to the lens array 30 without the substrate 20. Since it is attached, dimensional errors and positioning errors do not accumulate, and alignment accuracy is improved.

また、基板20の貫通孔23の内壁に段部26を設けなくてもよいので、貫通孔23の形成が容易になる。この場合でも、受発光面41をレンズ部32に近づけることができ、また、光電変換素子40の受発光面41とは反対側の面が基板20の裏面22から突出する突出長さを小さくすることができる。   Moreover, since the step part 26 does not need to be provided in the inner wall of the through-hole 23 of the board | substrate 20, formation of the through-hole 23 becomes easy. Even in this case, the light emitting / receiving surface 41 can be brought closer to the lens portion 32, and the length of the protrusion of the photoelectric conversion element 40 opposite to the light receiving / emitting surface 41 from the back surface 22 of the substrate 20 is reduced. be able to.

なお、図示の例では嵌合部35,45としてレンズアレイ30に凹部、光電変換素子40に凸部が設けられるように位置合わせ嵌合部35,45を形成した例を示したが、レンズアレイ30に凸部、光電変換素子40に凹部が設けられるように位置合わせ嵌合部35,45を形成しても良い。また、嵌合部35,45の形状は図示したテーパ形状に限らず、凹凸等の形状であっても良い。   In the illustrated example, as the fitting portions 35 and 45, the alignment fitting portions 35 and 45 are formed so that the lens array 30 has a concave portion and the photoelectric conversion element 40 has a convex portion. The alignment fitting portions 35 and 45 may be formed so that a convex portion is provided in 30 and a concave portion is provided in the photoelectric conversion element 40. Further, the shape of the fitting portions 35 and 45 is not limited to the illustrated tapered shape, and may be a shape such as an unevenness.

1:光電変換モジュール、2:光ファイバ、3:光コネクタ、10:光電変換モジュール用部品、20:基板、21:表面、22:裏面、23:貫通孔、24,25:内壁、26:段部(第1位置決め部)、30:レンズアレイ(レンズ体)、31:ファイバ側レンズ素子、32:素子側レンズ素子(レンズ部)、33:反射部、34:基板取付部、35:第1位置合わせ嵌合部、Ax:レンズ部の光軸、40:光電変換素子、41:受発光面、42:取付面、45:第2位置合わせ嵌合部(第2位置決め部)、Ay:光電変換素子の光軸 1: photoelectric conversion module, 2: optical fiber, 3: optical connector, 10: parts for photoelectric conversion module, 20: substrate, 21: front surface, 22: back surface, 23: through hole, 24, 25: inner wall, 26: step Part (first positioning part), 30: lens array (lens body), 31: fiber side lens element, 32: element side lens element (lens part), 33: reflection part, 34: substrate mounting part, 35: first Alignment fitting part, Ax: Optical axis of lens part, 40: Photoelectric conversion element, 41: Light emitting / receiving surface, 42: Mounting surface, 45: Second alignment fitting part (second positioning part), Ay: Photoelectric Optical axis of conversion element

Claims (10)

表面と裏面とを有し前記表面から前記裏面まで貫通する貫通孔を備える基板と、受光部又は発光部を備える光電変換素子と、複数のレンズ部を備えるレンズ素子と、を用意する第1工程と、
前記レンズ部の各々の光軸が前記貫通孔を臨むように、前記レンズ素子を前記基板の表面側から前記基板に取り付ける第2工程と、
前記レンズ部の前記光軸と前記光電変換素子の前記受光部又は発光部の光軸を一致させるように、前記基板の前記裏面側から前記光電変換素子を前記レンズ素子に対して位置決めする第3工程と、
を含むことを特徴とする光電変換モジュール用部品の製造方法。
A first step of preparing a substrate having a front surface and a back surface and having a through-hole penetrating from the front surface to the back surface, a photoelectric conversion element having a light receiving portion or a light emitting portion, and a lens element having a plurality of lens portions When,
A second step of attaching the lens element to the substrate from the surface side of the substrate such that each optical axis of the lens portion faces the through hole;
Positioning the photoelectric conversion element with respect to the lens element from the back side of the substrate so that the optical axis of the lens unit and the optical axis of the light receiving unit or the light emitting unit of the photoelectric conversion element coincide with each other. Process,
The manufacturing method of the components for photoelectric conversion modules characterized by including.
前記第1工程において、前記レンズ部毎に第1位置決め部が前記基板の前記裏面に形成された前記レンズ素子と、前記受光部又は発光部とを同じ側に第2位置決め部が形成された前記光電変換素子と、を用意し、
前記第3工程において、前記第1位置決め部に前記第2位置決め部を当接させて、それぞれの前記光電変換素子の前記受光部又は発光部を前記レンズ部に対して位置決めすることを特徴とする請求項1に記載の光電変換モジュール用部品の製造方法。
In the first step, the second positioning portion is formed on the same side as the lens element in which the first positioning portion is formed on the back surface of the substrate and the light receiving portion or the light emitting portion for each lens portion. And a photoelectric conversion element,
In the third step, the second positioning portion is brought into contact with the first positioning portion, and the light receiving portion or the light emitting portion of each of the photoelectric conversion elements is positioned with respect to the lens portion. The manufacturing method of the components for photoelectric conversion modules of Claim 1.
前記第1工程において、前記レンズ部と同じ側又は前記基板の前記第2位置決め部に第1金属層が形成された前記レンズ素子と、前記受光部又は発光部と同じ側に第2金属層が形成された前記光電変換素子と、を用意し、
前記第3工程において、前記第1金属層及び前記第2金属層とを熱圧着させて前記光電変換素子を前記レンズ素子に固定することを特徴とする請求項1または2に記載の光電変換モジュール用部品の製造方法。
In the first step, the lens element in which a first metal layer is formed on the same side as the lens unit or the second positioning unit of the substrate, and a second metal layer on the same side as the light receiving unit or the light emitting unit. Prepared the photoelectric conversion element,
3. The photoelectric conversion module according to claim 1, wherein in the third step, the photoelectric conversion element is fixed to the lens element by thermocompression bonding the first metal layer and the second metal layer. Method of manufacturing parts.
前記第1金属層は、前記レンズ素子とともにインサート成形されることを特徴とする請求項3に記載の光電変換モジュール用部品の製造方法。   The method for manufacturing a component for a photoelectric conversion module according to claim 3, wherein the first metal layer is insert-molded together with the lens element. 前記レンズ素子は、複数の前記レンズ部が等間隔に配列されたレンズアレイであることを特徴とする請求項1から4のいずれか一項に記載の光電変換モジュール用部品の製造方法。   5. The method of manufacturing a component for a photoelectric conversion module according to claim 1, wherein the lens element is a lens array in which a plurality of the lens portions are arranged at equal intervals. 前記光電変換素子は、列状に並んだ複数の前記受光部又は発光部を備え、
前記第3工程において、列の両端に位置する前記受光部又は発光部についてのみ光軸を一致させるように、前記基板の前記裏面側から、前記光電変換素子を前記レンズ素子に対して位置決めすることを特徴とする請求項1から5のいずれか一項に記載の光電変換モジュール用部品の製造方法。
The photoelectric conversion element includes a plurality of the light receiving units or light emitting units arranged in a row,
In the third step, the photoelectric conversion element is positioned with respect to the lens element from the back surface side of the substrate so that only the light receiving part or the light emitting part located at both ends of the row is aligned with the optical axis. The method for producing a component for a photoelectric conversion module according to claim 1, wherein:
複数のレンズ部と第1位置合わせ部を同じ側に備えたレンズ素子と、受光部又は発光部と第2位置合わせ部とを同じ側に備える光電変換素子と、を用意する第4工程と、
前記レンズ部の光軸と前記光電変換素子の前記受光部又は発光部の光軸が一致するように、前記第2位置合わせ部を前記第1位置合わせ部に当接させて前記光電変換素子を前記レンズ素子に位置合わせする第5工程と、
を含むことを特徴とする光電変換モジュール用部品の製造方法。
A fourth step of preparing a lens element having a plurality of lens portions and a first alignment portion on the same side, and a photoelectric conversion element having a light receiving portion or a light emitting portion and a second alignment portion on the same side;
The second alignment unit is brought into contact with the first alignment unit so that the optical axis of the lens unit coincides with the optical axis of the light receiving unit or the light emitting unit of the photoelectric conversion element. A fifth step of aligning with the lens element;
The manufacturing method of the components for photoelectric conversion modules characterized by including.
前記第4工程において、前記第1位置合わせ部及び第2位置合わせ部の表面に第1金属層及び第2金属層が形成された前記レンズ素子及び前記光電変換素子を用意し、
前記第5工程において、前記第1金属層及び前記第2金属層を熱圧着させて前記光電変換素子を前記レンズ素子に固定することを特徴とする請求項7に記載の光電変換モジュール用部品の製造方法。
In the fourth step, the lens element and the photoelectric conversion element in which the first metal layer and the second metal layer are formed on the surfaces of the first alignment unit and the second alignment unit are prepared,
The component for a photoelectric conversion module according to claim 7, wherein, in the fifth step, the first metal layer and the second metal layer are thermocompression bonded to fix the photoelectric conversion element to the lens element. Production method.
前記第4工程において、前記第1金属層と共に前記レンズ素子をインサート成形することを特徴とする請求項8に記載の光電変換モジュール用部品の製造方法。   The method for manufacturing a component for a photoelectric conversion module according to claim 8, wherein in the fourth step, the lens element is insert-molded together with the first metal layer. 前記レンズ素子は、複数の前記レンズ部が等間隔に配列されたレンズアレイであることを特徴とする請求項7から9のいずれか一項に記載の光電変換モジュール用部品の製造方法。   The method for manufacturing a component for a photoelectric conversion module according to claim 7, wherein the lens element is a lens array in which a plurality of the lens portions are arranged at equal intervals.
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