JP2012203301A - Proximity exposure device, alignment method of proximity exposure device, and method for manufacturing display panel substrate - Google Patents

Abstract

An image of an alignment mark is acquired without covering a part of a mask pattern with an image acquisition device, the mask and the substrate are aligned, and the image acquisition device is not required to be retracted during exposure. Reduce tact time.
A plurality of image acquisition units 51 each having a mirror 51c and an image acquisition device 51a are provided, and the mirror 51c of each image acquisition unit 51 is arranged above an alignment mark 2a provided on the mask 2, and the mask 2 and Images of the alignment marks 2a and 1a provided on the substrate 1 are projected on the surface of the mirror 51c of each image acquisition unit 51, and the images of the alignment marks 2a and 1a projected on the surface of the mirror 51c of each image acquisition unit 51 are displayed on each image. Obtained by the image obtaining device 51 a of the obtaining unit 51. The exposure light applied to the position of the alignment mark 2 a of the mask 2 is blocked by the back surface of the mirror 51 c of each image acquisition unit 51.
[Selection] Figure 9

Description

  The present invention relates to a proximity exposure apparatus that exposes a substrate using a proximity method in manufacturing a display panel substrate such as a liquid crystal display device, an alignment method for the proximity exposure apparatus, and a display panel substrate using the same. In particular, a proximity exposure apparatus that acquires an image of an alignment mark of a mask and a substrate by an image acquisition apparatus such as a CCD camera and aligns the mask and the substrate, and an alignment method for the proximity exposure apparatus And a method of manufacturing a display panel substrate using them.

  Manufacturing of TFT (Thin Film Transistor) substrates, color filter substrates, plasma display panel substrates, organic EL (Electroluminescence) display panel substrates, and the like of liquid crystal display devices used as display panels is performed using photolithography using an exposure apparatus. This is performed by forming a pattern on the substrate by a technique. As an exposure apparatus, a projection method in which a mask pattern is projected onto a substrate using a lens or a mirror, and a minute gap (proximity gap) is provided between the mask and the substrate to transfer the mask pattern to the substrate. There is a proximity method. The proximity method is inferior in pattern resolution performance to the projection method, but the configuration of the irradiation optical system is simple, the processing capability is high, and it is suitable for mass production.

  For example, in manufacturing a color filter substrate of a liquid crystal display device, a new pattern is exposed on a base pattern formed on a substrate, such as when a colored pattern is exposed on a black matrix formed on the substrate. In this case, it is necessary to accurately align the mask and the substrate so that the newly exposed pattern does not deviate from the base pattern. Conventionally, in the proximity method mainly used for exposure of a large substrate, a plurality of alignment marks are provided on a mask and a substrate ground pattern, respectively, and an alignment mark of the mask and substrate ground pattern is obtained by an image acquisition device such as a CCD camera. An image is acquired, a positional shift between the two is detected by image processing, and the mask and the substrate are aligned. As such a proximity exposure apparatus, there is one described in Patent Document 1.

JP 2007-256581 A

  The alignment mark is arranged close to the pattern to be exposed in order to accurately align the mask and the substrate and suppress the pattern displacement. Conventionally, an image acquisition device such as a CCD camera that acquires an image of an alignment mark is disposed above the alignment mark of the mask, and the dimensions are much larger than the distance between the pattern on the mask and the alignment mark. As it is, a part of the mask pattern is covered and hidden by the image acquisition device when viewed from the sky irradiated with the exposure light. Therefore, conventionally, when the exposure is performed after the image of the alignment mark is acquired by the image acquisition device, the image acquisition device is moved outside the exposure range where the exposure light is irradiated using a moving mechanism such as a ball screw and a motor. Was evacuated. For this reason, there has been a problem that it takes a long time to move the image acquisition apparatus and the tact time becomes long.

  Further, the mask alignment mark is provided within an exposure range irradiated with exposure light, and the mask alignment mark is exposed to the substrate as it is. For this reason, conventionally, there has been a need to provide a small shutter that blocks the exposure light irradiated to the position of the alignment mark on the mask, and to move the shutter above the alignment mark on the mask in accordance with the retreat of the image acquisition device. It was.

  An object of the present invention is to acquire an alignment mark image without covering a part of the mask pattern with the image acquisition device, align the mask and the substrate, and does not require the image acquisition device to be retracted during exposure. Thus, the tact time is shortened. Another object of the present invention is to eliminate the need to move a shutter that blocks exposure light irradiated to the position of the alignment mark on the mask. Another object of the present invention is to manufacture a display panel substrate with high throughput.

  The proximity exposure apparatus of the present invention includes a mask holder that holds a mask, a chuck that supports the substrate, and a stage that relatively moves the mask holder and the chuck, and a minute gap between the mask and the substrate. In a proximity exposure apparatus that transfers a mask pattern to a substrate, a plurality of image acquisition units that acquire images of a plurality of alignment marks provided on the mask and the substrate and output image signals, and each image A plurality of image acquisition unit moving means for moving the acquisition unit, an image processing apparatus for processing the image signal output from each image acquisition unit to detect the position of the alignment mark, and the mask alignment mark detected by the image processing apparatus Based on the position of the alignment mark on the substrate and the position of the substrate, the mask holder and chuck are moved by the stage. And a control means for aligning the mask and the substrate, each image acquisition unit is disposed above the mask alignment mark, and the mask alignment mark and the image of the substrate alignment mark Is provided on the front surface, and a mirror that blocks exposure light irradiated to the position of the alignment mark on the mask on the back surface, and an image acquisition device that acquires an image of the alignment mark reflected on the surface of the mirror.

  In addition, the proximity exposure apparatus alignment method of the present invention includes a mask holder that holds a mask, a chuck that supports the substrate, and a stage that relatively moves the mask holder and the chuck. An alignment method for a proximity exposure apparatus that transfers a mask pattern to a substrate by providing a small gap between the plurality of image acquisition units having a mirror and an image acquisition apparatus, and the mirror of each image acquisition unit Alignment mark that is placed above the alignment mark provided on the mask and the image of the alignment mark provided on the mask and substrate is projected on the mirror surface of each image acquisition unit, and is reflected on the mirror surface of each image acquisition unit Are acquired by the image acquisition device of each image acquisition unit, and the image of each image acquisition unit The image signal output by the acquisition device is processed to detect the position of the alignment mark, and the mask holder and chuck are moved relatively by the stage based on the detected position of the alignment mark on the mask and the position of the alignment mark on the substrate. Then, the mask and the substrate are aligned, and the exposure light irradiated to the position of the alignment mark of the mask is blocked by the back surface of the mirror of each image acquisition unit.

  The size of the mirror of each image acquisition unit is small enough not to cover the mask pattern, and a part of the mask pattern is not covered and hidden by the image acquisition device as in the prior art. Accordingly, it is not necessary to save the image acquisition apparatus during exposure, and the tact time is shortened. Furthermore, since the exposure light irradiated to the position of the alignment mark of the mask is blocked by the back surface of the mirror of each image acquisition unit at the time of exposure, the exposure light irradiated to the position of the alignment mark of the mask is conventionally used. There is no need to move the shutter to be interrupted above the alignment mark of the mask in accordance with the retreat of the image acquisition device.

  Furthermore, the proximity exposure apparatus of the present invention moves the image acquisition device of each image acquisition unit independently of the mirror of each image acquisition unit, and focuses the image acquisition device of each image acquisition unit on the alignment mark of the mask. Alternatively, it includes a plurality of focus adjusting means for matching with the alignment marks on the substrate. The alignment method of the proximity exposure apparatus of the present invention moves the image acquisition device of each image acquisition unit independently of the mirror of each image acquisition unit, and masks the focus of the image acquisition device of each image acquisition unit. To the alignment mark of the substrate or the alignment mark of the substrate.

  Since the image acquisition device of each image acquisition unit is moved independently of the mirror of each image acquisition unit and the image acquisition device of each image acquisition unit is focused on the alignment mark of the mask or the alignment mark of the substrate, Even if the gap with the substrate is large, an image acquisition device with high resolution and shallow depth of focus is used to acquire images of the mask alignment mark and the substrate alignment mark at high resolution, and the position of the mask alignment mark and the substrate The position of the alignment mark can be detected with high accuracy, and the alignment between the mask and the substrate can be performed with high accuracy.

  The method for producing a display panel substrate according to the present invention exposes a substrate using any one of the above-described proximity exposure apparatuses, or alternatively uses the alignment method of any one of the above-described proximity exposure apparatuses to mask and the substrate. And the substrate is exposed. Since it is not necessary to retract the image acquisition apparatus during exposure and the tact time is shortened, the display panel substrate is manufactured with high throughput.

  According to the proximity exposure apparatus and the alignment method of the proximity exposure apparatus of the present invention, the mirror of each image acquisition unit is arranged above the alignment mark provided on the mask, and the alignment mark provided on the mask and the substrate is aligned. A portion of the mask pattern is obtained by projecting an image on the mirror surface of each image acquisition unit and acquiring an image of the alignment mark projected on the mirror surface of each image acquisition unit with the image acquisition device of each image acquisition unit. The image of the alignment mark is acquired without being covered with the image acquisition device, the mask and the substrate are aligned, and it is not necessary to save the image acquisition device during exposure, and the tact time can be shortened. Furthermore, it is not necessary to move the shutter that blocks the exposure light irradiated to the position of the alignment mark on the mask by blocking the exposure light irradiated to the position of the alignment mark on the mask at the back of the mirror of each image acquisition unit. Can be.

  Furthermore, according to the proximity exposure apparatus and the proximity exposure apparatus alignment method of the present invention, the image acquisition device of each image acquisition unit is moved independently of the mirror of each image acquisition unit, and the image of each image acquisition unit is moved. By aligning the focus of the acquisition device with the alignment mark of the mask or the alignment mark of the substrate, even if the gap between the mask and the substrate is large, an image acquisition device with high resolution and shallow depth of focus is used. The image of the alignment mark on the substrate can be obtained with high resolution, the position of the alignment mark on the mask and the position of the alignment mark on the substrate can be accurately detected, and the alignment between the mask and the substrate can be accurately performed.

  According to the method for manufacturing a display panel substrate of the present invention, it is possible to reduce the tact time by eliminating the need to retract the image acquisition device at the time of exposure, so that the display panel substrate can be manufactured with high throughput. .

It is a figure which shows schematic structure of the proximity exposure apparatus by one embodiment of this invention. 1 is a top view of a proximity exposure apparatus according to an embodiment of the present invention. FIG. It is a side view which shows the state which moved the chuck | zipper to the exposure position. It is a figure which shows the alignment mark of a mask. It is a figure which shows the alignment mark of a board | substrate. 6A is a top view of the camera unit moving mechanism and the focus adjusting mechanism, and FIG. 6B is a side view of the same. It is a figure explaining the alignment method of the proximity exposure apparatus by one embodiment of this invention. It is a figure explaining the alignment method of the proximity exposure apparatus by one embodiment of this invention. It is a figure explaining the alignment method of the proximity exposure apparatus by one embodiment of this invention. It is a flowchart which shows an example of the manufacturing process of the TFT substrate of a liquid crystal display device. It is a flowchart which shows an example of the manufacturing process of the color filter board | substrate of a liquid crystal display device.

  FIG. 1 is a diagram showing a schematic configuration of a proximity exposure apparatus according to an embodiment of the present invention. FIG. 2 is a top view of the proximity exposure apparatus according to the embodiment of the present invention. The proximity exposure apparatus includes a base 3, an X guide 4, an X stage 5, a Y guide 6, a Y stage 7, a θ stage 8, a chuck support base 9, a chuck 10, a mask holder 20, an image processing apparatus 50, a camera unit 51, The camera unit moving mechanism, the focus adjusting mechanism, the stage drive circuit 60, and the main controller 70 are included. In FIG. 1, the camera unit moving mechanism and the focus adjusting mechanism are omitted. In FIG. 2, the image processing device 50, the camera unit moving mechanism, the focus adjusting mechanism, the stage driving circuit 60, and the main control device 70 are omitted. In addition to these, the proximity exposure apparatus carries a substrate 1 into the chuck 10 and also carries a substrate transport robot that unloads the substrate 1 from the chuck 10, an irradiation optical system that irradiates exposure light, and a temperature at which temperature management in the apparatus is performed. A control unit is provided.

  Note that the XY directions in the embodiments described below are examples, and the X direction and the Y direction may be interchanged.

  1 and 2, the chuck 10 is in a load / unload position where the substrate 1 is loaded and unloaded. At the load / unload position, the substrate 1 is carried into the chuck 10 and the substrate 1 is carried out of the chuck 10 by a substrate transfer robot (not shown). The loading of the substrate 1 onto the chuck 10 and the unloading of the substrate 1 from the chuck 10 are performed using a plurality of push-up pins provided on the chuck 10. The push-up pin is housed inside the chuck 10 and is lifted from the inside of the chuck 10 to receive the substrate 1 from the substrate transfer robot and unload the substrate 1 from the chuck 10 when loading the substrate 1 onto the chuck 10. In doing so, the substrate 1 is delivered to the substrate transfer robot. The chuck 10 supports the back surface of the substrate 1 by vacuum suction. A base pattern is formed on the surface of the substrate 1, and a photoresist is applied on the base pattern.

  FIG. 3 is a side view showing a state where the chuck is moved to the exposure position. In FIG. 3, the image processing device 50, the camera unit moving mechanism, the focus adjusting mechanism, the stage driving circuit 60, and the main control device 70 are omitted. A mask holder 20 for holding the mask 2 is installed above the exposure position. In FIG. 2, the mask holder 20 is provided with an opening 20a through which exposure light passes, and the mask holder 20 vacuum-sucks the peripheral portion of the mask 2 by a suction groove (not shown) provided around the opening 20a. And hold. An irradiation optical system (not shown) is disposed above the mask 2 held by the mask holder 20. At the time of exposure, exposure light from the irradiation optical system passes through the mask 2 and is irradiated onto the substrate 1, whereby the pattern of the mask 2 is transferred to the surface of the substrate 1 and a pattern is formed on the substrate 1.

  1 and 3, the chuck 10 is mounted on the θ stage 8 via the chuck support 9, and a Y stage 7 and an X stage 5 are provided below the θ stage 8. The X stage 5 is mounted on an X guide 4 provided on the base 3 and moves along the X guide 4 in the X direction (the horizontal direction in FIGS. 1 and 3). The Y stage 7 is mounted on a Y guide 6 provided on the X stage 5 and moves in the Y direction (the depth direction in FIGS. 1 and 3) along the Y guide 6. The θ stage 8 is mounted on the Y stage 7 and rotates in the θ direction. The chuck support 9 is mounted on the θ stage 8 and supports the back surface of the chuck 10 at a plurality of locations. The X stage 5, Y stage 7, and θ stage 8 are provided with drive mechanisms (not shown) such as ball screws and motors, linear motors, etc., and each drive mechanism is driven by a stage drive circuit 60 of FIG. The

  The chuck 10 is moved between the load / unload position and the exposure position by the movement of the X stage 5 in the X direction and the movement of the Y stage 7 in the Y direction. At the load / unload position, the substrate 1 mounted on the chuck 10 is pre-aligned by moving the X stage 5 in the X direction, moving the Y stage 7 in the Y direction, and rotating the θ stage 8 in the θ direction. Is done. At the exposure position, the X stage 5 is moved in the X direction and the Y stage 7 is moved in the Y direction, whereby the substrate 1 mounted on the chuck 10 is stepped in the XY direction. Further, the gap between the mask 2 and the substrate 1 is adjusted by moving and tilting the mask holder 20 in the Z direction (vertical direction in FIG. 3) by a Z-tilt mechanism (not shown). Then, the mask 2 and the substrate 1 are aligned by the movement of the X stage 5 in the X direction, the movement of the Y stage 7 in the Y direction, and the rotation of the θ stage 8 in the θ direction. In FIG. 1, the main controller 70 controls the stage drive circuit 60 to rotate the θ stage 8 in the θ direction, move the X stage 5 in the X direction, and move the Y stage 7 in the Y direction. Do.

  In the present embodiment, the gap between the mask 2 and the substrate 1 is adjusted by moving and tilting the mask holder 20 in the Z direction. However, the chuck support base 9 is provided with a Z-tilt mechanism, The gap between the mask 2 and the substrate 1 may be adjusted by moving and tilting the chuck 10 in the Z direction. In this embodiment, the mask 10 and the substrate 1 are aligned by moving the chuck 10 in the XY direction by the X stage 5 and the Y stage 7, but the mask holder 20 is moved in the XY direction. The mask 2 may be aligned with the substrate 1 by moving the mask holder 20 in the XY directions.

  FIG. 4 is a diagram showing alignment marks on the mask. On the surface (lower surface) of the mask 2 facing the substrate 1, alignment marks 2a are provided at four locations. FIG. 5 is a diagram showing alignment marks on the substrate. FIG. 5 shows an example in which exposure is performed by dividing one surface of the substrate 1 into four exposure regions divided by broken lines. A base pattern is formed in each exposure region on the surface of the substrate 1. In the base pattern, alignment marks 1a are provided at positions corresponding to the positions of the alignment marks 2a of the mask 2, respectively. The positions of the alignment marks 1a and 2a vary depending on the size of the exposure area of the substrate 1.

  In FIG. 2, four camera units 51 are installed above the mask 2. Each camera unit 51 is moved to a predetermined position above the mask holder 20 by a camera unit moving mechanism (not shown) according to the positions of the alignment marks 1a and 2a. Since the position of the alignment mark 1a on the substrate 1 varies depending on the exposure conditions when the base pattern is formed, the position of each camera unit 51 is determined based on the position of the alignment mark 2a on the mask 2.

  6A is a top view of the camera unit moving mechanism and the focus adjusting mechanism, and FIG. 6B is a side view of the same. The camera unit 51 includes a CCD camera 51a, a lens 51b, and a mirror 51c. The camera unit moving mechanism includes an X guide 54, an X stage 55, a Y guide 56, a Y stage 57, motors 81 and 86, shaft couplings 82 and 87, bearings 83 and 88, ball screws 84a and 89a, and nuts 84b and 89b. It is configured to include. The focus adjustment mechanism includes an X guide 58, a focus adjustment table 59, a motor 91, a shaft coupling 92, a bearing 93, a ball screw 94a, and a nut 94b.

  A top frame 53 on which a camera unit moving mechanism is installed is provided above the exposure position, and an opening 53 a is formed in the top frame 53. An X guide 54 is provided on the top surface of the top frame 53, and an X stage 55 is mounted on the X guide 54. Further, a motor 81 is installed on the upper surface of the top frame 53, and the motor 81 is driven by the main controller 70 of FIG. A rotation shaft of the motor 81 is connected to a ball screw 84 a by a shaft coupling 82, and the ball screw 84 a is rotatably supported by a bearing 83. A nut 84 b that is moved by a ball screw 84 a is attached to the lower surface of the X stage 55, and the X stage 55 is moved in the X direction along the X guide 54 by the rotation of the motor 81.

  A Y guide 56 is provided on the upper surface of the X stage 55, and a Y stage 57 is mounted on the Y guide 56. A motor 86 is installed on the upper surface of the X stage 55, and the motor 86 is driven by the main controller 70 of FIG. A rotation shaft of the motor 86 is connected to a ball screw 89 a by a shaft coupling 87, and the ball screw 89 a is rotatably supported by a bearing 88. A nut 89 b that is moved by a ball screw 89 a is attached to the lower surface of the Y stage 57, and the Y stage 57 is moved in the Y direction along the Y guide 56 by the rotation of the motor 86.

  The camera unit 51 is moved in the XY direction by the movement of the X stage 55 in the X direction and the movement of the Y stage 57 in the Y direction. 1 controls the motors 81 and 86 in accordance with the position of the alignment mark 2a on the mask 2 to move each camera unit 51 to a predetermined position.

  An X guide 58 is provided on the upper surface of the Y stage 57, and a focus adjustment table 59 is mounted on the X guide 58. Further, a motor 91 is installed on the upper surface of the Y stage 57, and the motor 91 is driven by the main controller 70 of FIG. The rotation shaft of the motor 91 is connected to a ball screw 94 a by a shaft coupling 92, and the ball screw 94 a is rotatably supported by a bearing 93. A nut 94 b that is moved by a ball screw 94 a is attached to the lower surface of the focus adjustment table 59. The focus adjustment table 59 is moved in the X direction along the X guide 58 by the rotation of the motor 91. .

  A mirror support 95 is attached to the upper surface of the Y stage 57. The mirror support 95 supports the mirror 51 c of the camera unit 51 above the opening 53 a of the top frame 53. A CCD camera 51 a and a lens 51 b of the camera unit 51 are mounted on the upper surface of the focus adjustment table 59. The focus of the CCD camera 51a of the camera unit 51 is adjusted by the movement of the focus adjustment table 59 in the X direction.

  Hereinafter, an alignment method for a proximity exposure apparatus according to an embodiment of the present invention will be described. 7 to 9 are views for explaining an alignment method of the proximity exposure apparatus according to the embodiment of the present invention. 7 to 9, the portion below the Y stage 57 of the camera unit moving mechanism is omitted. In FIG. 6, each camera unit moving mechanism moves each camera unit 51 in the X and Y directions under the control of the main controller 70, and as shown in FIGS. 7 to 9, the mirror 51 c of each camera unit 51 is The mask 2 is arranged above the alignment mark 2a. 7 and 8, the mirror 51c disposed above the alignment mark 2a of the mask 2 projects images of the alignment mark 2a of the mask 2 and the alignment mark 1a of the substrate 1 on the surface.

  In FIG. 7, when acquiring the image of the alignment mark 2 a of the mask 2, the focus adjustment mechanism moves the focus adjustment table 59 in the X direction under the control of the main controller 70, and the CCD camera 51 a of the camera unit 51. Is aligned with the alignment mark 2 a of the mask 2. The CCD camera 51a acquires an image of the alignment mark 2a of the mask 2 reflected on the mirror 51c in a state where the alignment mark 2a of the mask 2 is in focus, and outputs an image signal to the image processing device 50 of FIG.

  In FIG. 8, when acquiring the image of the alignment mark 1 a on the substrate 1, the focus adjustment mechanism moves the focus adjustment table 59 in the direction of the arrow under the control of the main controller 70, and the CCD camera 51 a of the camera unit 51. Is focused on the alignment mark 1 a of the substrate 1. The CCD camera 51a acquires an image of the alignment mark 1a of the substrate 1 reflected on the mirror 51c in a state where the alignment mark 1a of the substrate 1 is in focus, and outputs an image signal to the image processing device 50 of FIG.

  In FIG. 1, an image processing apparatus 50 processes an image signal output from the CCD camera 51a of each camera unit 51, compares a pre-registered image with an image acquired by the CCD camera 51a of each camera unit 51, and The position of the alignment mark 2a on the mask 2 and the position of the alignment mark 1a on the substrate 1 are detected. The main controller 70 controls the stage drive circuit 60 based on the position of the alignment mark 2 a of the mask 2 and the position of the alignment mark 1 a of the substrate 1 detected by the image processing apparatus 50, and chucks by the X stage 5 and the Y stage 7. 10 is moved to align the mask 2 with the substrate 1.

  The CCD camera 51a of each camera unit 51 is moved independently of the mirror 51c of each camera unit 51, and the focus of the CCD camera 51a of each camera unit 51 is set to the alignment mark 2a of the mask 2 or the alignment mark 1a of the substrate 1. Therefore, even if the gap between the mask 2 and the substrate 1 is large, images of the alignment mark 2a on the mask 2 and the alignment mark 1a on the substrate 1 are acquired with high resolution using a CCD camera with high resolution and shallow depth of focus. The position of the alignment mark 2a on the mask 2 and the position of the alignment mark 1a on the substrate 1 can be detected with high accuracy, and the alignment between the mask 2 and the substrate 1 can be performed with high accuracy.

  In FIG. 9, at the time of exposure, exposure light is irradiated to the mask 2 from an irradiation optical system (not shown) above the mask 2. In FIG. 9, the exposure light irradiated from the irradiation optical system is shown in gray. At this time, the mirror 51c disposed above the alignment mark 2a of the mask 2 blocks exposure light irradiated to the position of the alignment mark 2a of the mask 2 on the back surface.

  As shown in FIGS. 7 to 9, the size of the mirror 51c of each camera unit 51 is small enough not to cover the pattern 2b of the mask 2, and a part of the pattern 2b of the mask 2 is a CCD camera as in the prior art. It is not covered and hidden by an image acquisition device such as. Accordingly, it is not necessary to save the image acquisition apparatus during exposure, and the tact time is shortened. Furthermore, since the exposure light irradiated to the position of the alignment mark 2a of the mask 2 is blocked by the back surface of the mirror 51c of each camera unit 51 during exposure, the position of the alignment mark 2a of the mask 2 is irradiated as in the conventional case. It is not necessary to move the shutter that blocks the exposure light to be moved above the alignment mark of the mask in accordance with the retreat of the image acquisition device.

  7 and 8, the image of the alignment mark 1a of the substrate 1 is acquired after the image of the alignment mark 2a of the mask 2 is acquired. However, after the image of the alignment mark 1a of the substrate 1 is acquired, An image of the alignment mark 2a of the mask 2 may be acquired.

  According to the embodiment described above, the mirror 51c of each camera unit 51 is disposed above the alignment mark 2a provided on the mask 2, and the images of the alignment marks 2a and 1a provided on the mask 2 and the substrate 1 are displayed. Is displayed on the surface of the mirror 51c of each camera unit 51, and the images of the alignment marks 2a and 1a reflected on the surface of the mirror 51c of each camera unit 51 are acquired by the CCD camera 51a of each camera unit 51, thereby Without covering a part of the pattern 2b with the CCD camera 51a, images of the alignment marks 2a and 1a are acquired, the mask 2 and the substrate 1 are aligned, and the CCD camera 51a is not required to be retracted during exposure. , Tact time can be shortened. Further, the exposure light irradiated to the position of the alignment mark 2a of the mask 2 is blocked by blocking the exposure light irradiated to the position of the alignment mark 2a of the mask 2 on the back surface of the mirror 51c of each camera unit 51. It is also possible to eliminate the need to move the shutter.

  Further, the CCD camera 51a of each camera unit 51 is moved independently of the mirror 51c of each camera unit 51 so that the CCD camera 51a of each camera unit 51 is focused on the alignment mark 2a of the mask 2 or the alignment mark of the substrate 1. By adjusting to 1a, even if the gap between the mask 2 and the substrate 1 is large, a high-resolution image of the alignment mark 2a on the mask 2 and the alignment mark 1a on the substrate 1 is obtained using a CCD camera with high resolution and shallow focal depth. The position of the alignment mark 2a on the mask 2 and the position of the alignment mark 1a on the substrate 1 can be detected with high accuracy, and the alignment between the mask 2 and the substrate 1 can be performed with high accuracy.

  By exposing the substrate using the proximity exposure apparatus of the present invention, or by aligning the mask and the substrate using the alignment method of the proximity exposure apparatus of the present invention, Since it is not necessary to retract the image acquisition apparatus during exposure and the tact time can be shortened, a display panel substrate can be manufactured with high throughput.

  For example, FIG. 10 is a flowchart showing an example of the manufacturing process of the TFT substrate of the liquid crystal display device. In the thin film formation step (step 101), a thin film such as a conductor film or an insulator film, which becomes a transparent electrode for driving liquid crystal, is formed on the substrate by sputtering, plasma chemical vapor deposition (CVD), or the like. In the resist coating process (step 102), a photosensitive resin material (photoresist) is applied by a roll coating method or the like to form a photoresist film on the thin film formed in the thin film forming process (step 101). In the exposure step (step 103), the mask pattern is transferred to the photoresist film using a proximity exposure apparatus, a projection exposure apparatus, or the like. In the development step (step 104), a developer is supplied onto the photoresist film by a shower development method or the like to remove unnecessary portions of the photoresist film. In the etching process (step 105), a portion of the thin film formed in the thin film formation process (step 101) that is not masked by the photoresist film is removed by wet etching. In the stripping step (step 106), the photoresist film that has finished the role of the mask in the etching step (step 105) is stripped with a stripping solution. Before or after each of these steps, a substrate cleaning / drying step is performed as necessary. These steps are repeated several times to form a TFT array on the substrate.

  FIG. 11 is a flowchart showing an example of the manufacturing process of the color filter substrate of the liquid crystal display device. In the black matrix forming step (step 201), a black matrix is formed on the substrate by processing such as resist coating, exposure, development, etching, and peeling. In the colored pattern forming step (step 202), a colored pattern is formed on the substrate by a dyeing method, a pigment dispersion method, a printing method, an electrodeposition method, or the like. This process is repeated for the R, G, and B coloring patterns. In the protective film forming step (step 203), a protective film is formed on the colored pattern, and in the transparent electrode film forming step (step 204), a transparent electrode film is formed on the protective film. Before, during or after each of these steps, a substrate cleaning / drying step is performed as necessary.

  In the TFT substrate manufacturing process shown in FIG. 10, in the exposure process (step 103), in the color filter substrate manufacturing process shown in FIG. 11, in the exposure process of the colored pattern forming process (step 202), the proxy of the present invention. The alignment method of the proximity exposure apparatus or proximity exposure apparatus of the present invention can be applied.

DESCRIPTION OF SYMBOLS 1 Substrate 1a, 2a Alignment mark 2 Mask 2b Pattern 3 Base 4 X guide 5 X stage 6 Y guide 7 Y stage 8 θ stage 9 Chuck support 10 Chuck 20 Mask holder 20a Aperture 50 Image processing device 51 Camera unit 51a CCD camera 51b Lens 51c Mirror 53 Top frame 54, 58 X guide 55 X stage 56 Y guide 57 Y stage 59 Focus adjustment table 60 Stage drive circuit 70 Main controller 81, 86, 91 Motor 82, 87, 92 Shaft coupling 83, 88, 93 Bearing 84a, 89a, 94a Ball screw 84b, 89b, 94b Nut 95 Mirror support base

Claims (6)

A mask pattern comprising a mask holder for holding a mask, a chuck for supporting a substrate, and a stage for moving the mask holder and the chuck relative to each other, and providing a minute gap between the mask and the substrate. In proximity exposure equipment that transfers
A plurality of image acquisition units for acquiring images of a plurality of alignment marks provided on the mask and the substrate and outputting image signals;
A plurality of image acquisition unit moving means for moving each image acquisition unit;
An image processing device that processes the image signal output by each image acquisition unit and detects the position of the alignment mark;
Based on the position of the alignment mark on the mask detected by the image processing apparatus and the position of the alignment mark on the substrate, the mask holder and the chuck are relatively moved by the stage to align the mask and the substrate. Control means,
Each image acquisition unit is arranged above the mask alignment mark, and displays an image of the mask alignment mark and the substrate alignment mark on the front surface, and a mirror that blocks the exposure light irradiated to the position of the mask alignment mark on the back surface. And a proximity exposure apparatus comprising: an image acquisition apparatus that acquires an image of an alignment mark reflected on the surface of the mirror.   Multiple focus adjustments in which the image acquisition device of each image acquisition unit is moved independently of the mirror of each image acquisition unit, and the focus of the image acquisition device of each image acquisition unit is aligned with the alignment mark of the mask or the alignment mark of the substrate The proximity exposure apparatus according to claim 1, further comprising: means. A mask holder for holding a mask, a chuck for supporting the substrate, and a stage for relatively moving the mask holder and the chuck are provided, and a fine gap is provided between the mask and the substrate to form the mask pattern on the substrate. An alignment method for a proximity exposure apparatus that transfers to
A plurality of image acquisition units having a mirror and an image acquisition device;
The mirror of each image acquisition unit is arranged above the alignment mark provided on the mask, and the image of the alignment mark provided on the mask and the substrate is projected on the surface of the mirror of each image acquisition unit.
An image of the alignment mark reflected on the mirror surface of each image acquisition unit is acquired by the image acquisition device of each image acquisition unit,
Process the image signal output by the image acquisition device of each image acquisition unit, detect the position of the alignment mark,
Based on the detected position of the alignment mark of the mask and the position of the alignment mark of the substrate, the mask holder and the chuck are relatively moved by the stage to align the mask and the substrate,
An alignment method for a proximity exposure apparatus, wherein exposure light applied to a position of an alignment mark on a mask is blocked by a back surface of a mirror of each image acquisition unit.   The image acquisition device of each image acquisition unit is moved independently of the mirror of each image acquisition unit, and the focus of the image acquisition device of each image acquisition unit is adjusted to the alignment mark of the mask or the alignment mark of the substrate, An alignment method for a proximity exposure apparatus according to claim 3.   A method for manufacturing a display panel substrate, comprising: exposing a substrate using the proximity exposure apparatus according to claim 1.   5. A method for manufacturing a display panel substrate, wherein the alignment of the proximity exposure apparatus according to claim 3 or 4 is used to align the mask and the substrate to expose the substrate.

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