JP2012245646A - Thermocompression bonding system and thermocompression bonding method - Google Patents

Abstract

The present invention provides a technique for bringing a synthetic resin plate and a synthetic resin film into close contact with each other in a good state without a gap.
A thermocompression bonding apparatus 10 includes an upper chess block 32, a lower chess block 52, and a bonding object 20 formed by superposing a synthetic resin plate P and synthetic resin films F1 and F2 on a metal sheet 53. , And is welded by heating and pressurizing. The lower chess block 52 is in contact with the object to be crimped 20 for heating and pressurizing, so that the metal sheet 53 formed of an elastic material having higher rigidity than the thermocompression bonding object 20 and the lower die set 50 side from the metal sheet 33 The elastic member 54 is formed of a material having a lower elastic modulus than the metal sheet 53, the pressing plate 55 is disposed on the lower die set 50 side of the elastic member 54, and the pressing plate 55 is connected to the lower die set 50. A plurality of elastic supports 56 that transmit the applied pressure.
[Selection] Figure 1

Description

  The present invention relates to a technique for thermocompression bonding a synthetic resin film to the surface of a synthetic resin plate.

  Conventionally, as a method for attaching a synthetic resin film to the surface of a synthetic resin plate, an adhesion method or a thermocompression bonding method is known. Adhesion method is a method of bonding a synthetic resin plate and a synthetic resin film using an adhesive or a solvent, and a thermocompression bonding method is sandwiched between molds in a state where the synthetic resin plate and the synthetic resin film are overlapped, Both are thermally welded by applying heat and pressure.

  The adhesion method has good adhesion between the synthetic resin plate and the synthetic resin film, but when the synthetic resin film is attached to the synthetic resin plate having grooves or recesses on the surface, the grooves or recesses are caused by an adhesive or solvent. It may be blocked or deformed. For this reason, in the technical field of attaching a synthetic resin film to a synthetic resin plate having grooves and recesses on the surface, a thermocompression bonding method is frequently used.

  On the other hand, in press work during the manufacturing process of a thin non-contact IC card, a technique for increasing the yield rate by preventing damage to electronic components due to application of excessive pressure has been proposed (see, for example, Patent Document 1). .)

JP 2000-348155 A

  In the thermocompression bonding method, when a synthetic resin film is thermocompression bonded to the surface of a synthetic resin plate having grooves, recesses or holes on the surface, it is overlapped with the synthetic resin film due to warpage or deformation of the synthetic resin plate. The pressure may not be evenly and sufficiently applied to the synthetic resin plate in a state, and the synthetic resin plate and the synthetic resin film may not be completely adhered. In particular, poor adhesion at the periphery of the synthetic resin plate and the synthetic resin film is a problem.

  Also, in the thermocompression bonding process, the heat receiving state and the pressure receiving state vary due to the deformation of the synthetic resin plate itself, part of the groove formed in the synthetic resin plate is deformed, and the original function of the groove is lost. May be.

  When the synthetic resin film is thermocompression bonded to the surface of the synthetic resin plate having grooves, recesses or holes on the surface, the deformation described above can be applied to some degree by adopting the technique described in Patent Document 1. However, in the case of the synthetic resin plate having the above-described groove, recess, or hole, the deformation amount of the synthetic resin plate formed by injection molding is promoted, making it difficult to cope with it.

  The problem to be solved by the present invention is to provide a technique for bringing a synthetic resin plate and a synthetic resin film into close contact with each other in a good state without a gap.

  The thermocompression bonding apparatus of the present invention is a thermocompression bonding apparatus in which a pressure-bonding object in which a synthetic resin plate and a synthetic resin film are overlapped is sandwiched between an upper mold and a lower mold and heated and pressurized to be welded. At least one of the upper mold and the lower mold is in contact with the object to be crimped and heated and pressurized, so that the first sheet material formed of an elastic material having higher rigidity than the thermocompression object, A second sheet material that is disposed on the mold side from the one sheet material and formed of a material having a lower elastic modulus than the first sheet material; a pressing member that is disposed on the mold side from the second sheet material; And a plurality of elastic supports that transmit the pressing force of the mold to the pressing member.

  With such a configuration, it becomes possible to transmit the pressing force of the mold to the first sheet material and the second sheet material through the pressing member during pressurization, and the first sheet material is warped of the synthetic resin plate. In addition, the pressing member also follows the same direction, and the second sheet material in between absorbs the difference in deformation amount. The elastic support receives pressure in the mold clamping direction according to the deformation amount of the pressing member. In this way, as a result of the uniform pressing force of the mold being applied to the object to be bonded, the synthetic resin plate and the synthetic resin film can be brought into close contact with each other in a good state.

  It is desirable that the first sheet material, the second sheet material, the pressing member, and the plurality of elastic supports are detachable from at least one of the upper mold and the lower mold.

  With such a configuration, when the size or shape of the object to be crimped is changed, it becomes possible to cope with the problem by exchanging the first sheet material, the second sheet material, and the like, so that versatility is improved. .

  Here, it is preferable that the pressing member is formed by a plurality of plate pieces that are partitioned by a boundary surface parallel to the pressing force direction and are respectively supported by the plurality of elastic supports.

  With such a configuration, it is possible to transmit the pressing force of the mold to the first sheet material and the second sheet material in a state where the plurality of plate pieces constituting the pressing member are independent from each other at the time of pressurization. That is, the first sheet material is deformed so as to follow the warp of the synthetic resin plate and the unevenness of the surface, and the plurality of plate pieces constituting the pressing member are independent in a direction parallel to the pressing force direction. In this state, the pressing force of the mold can be transmitted according to the part of the object to be crimped, so that the synthetic resin plate and the synthetic resin film can be brought into close contact with each other in a good state.

  In addition, it is desirable that at least one of the plurality of elastic supports can be individually attached to and detached from the upper mold or the lower mold.

  With such a configuration, the upper mold or the lower mold is in a state in which it is possible to perform the necessary pressurization at the required position in the object to be crimped. The followability is improved, which is effective for improving the adhesion between the synthetic resin plate and the synthetic resin film.

  Furthermore, it is desirable to provide a means for adjusting the length of the elastic support in the pressing force direction on the mold side of the elastic support.

  With such a configuration, it becomes possible to adjust (set) the pressing force applied to the pressing plate transmitted from the mold for each elastic support, so that the followability to the warp of the synthetic resin plate is further improved, It is effective for improving the adhesion between the synthetic resin plate and the synthetic resin film.

  On the other hand, a decompression means for evacuating a region surrounding the synthetic resin plate and the synthetic resin film disposed between the upper mold and the lower mold may be provided.

  With such a configuration, in the step of thermocompression bonding the object to be crimped (synthetic resin plate and synthetic resin film), it is possible to eliminate the gas remaining between the synthetic resin plate and the synthetic resin film. The adhesion between the synthetic resin plate and the synthetic resin film can be further improved.

  Next, in the thermocompression bonding method of the present invention, the above-described thermocompression bonding apparatus is used to sandwich the object to be bonded on which the synthetic resin plate and the synthetic resin film are overlapped between the upper mold and the lower mold. It is a thermocompression bonding method that heats and presses and welds, and after thermocompression, a molded body that is removed from between the upper mold and the lower mold is formed of a material having higher thermal conductivity than the molded body. A cooling process is provided in which the cooling member is held between the cooling members.

  With such a configuration, warping occurs due to uneven cooling of the high-temperature molded body (the object to be bonded after thermocompression bonding) after the thermocompression bonding process is finished and removed from the mold. Or can be prevented from being deformed.

  Further, it is desirable to provide a preheating step of heating the synthetic resin plate before being sandwiched between the upper mold and the lower mold to a temperature lower than the softening temperature of the synthetic resin plate.

  With such a configuration, warping and deformation of the synthetic resin plate due to rapid heating in the thermocompression bonding step can be prevented, and the thermocompression bonding time can be shortened.

  On the other hand, an area surrounding the synthetic resin plate and the synthetic resin film disposed between the upper mold and the lower mold is set to a vacuum atmosphere, and then the synthetic resin plate and the synthetic resin film are heated. It can also be crimped.

  With such a configuration, gas remaining between the synthetic resin plate and the synthetic resin film can be eliminated before the thermocompression bonding process is started, so that the adhesion between the synthetic resin plate and the synthetic resin film can be eliminated. The property can be further improved.

  When the synthetic resin plate and the synthetic resin film are overlapped with each other, it is desirable that the peripheral portion of the synthetic resin film is disposed inside the peripheral portion of the synthetic resin plate.

  With such a configuration, in the thermocompression bonding step, it is possible to prevent the poor adhesion of the synthetic resin film caused by the peripheral edge of the synthetic resin plate expanding in the surface direction and reducing its thickness. In particular, it is effective in improving the adhesion at the peripheral edge of the synthetic resin plate.

  According to the present invention, it is possible to provide a technique for bringing a synthetic resin plate and a synthetic resin film into close contact with each other in a favorable state.

It is a partially notched front view which shows the thermocompression bonding apparatus which is embodiment of this invention. FIG. 2 is a partially omitted cross-sectional view taken along line AA in FIG. 1. FIG. 3 is a partially omitted sectional view taken along line BB in FIG. 2. It is a disassembled perspective view which shows the structure of a lower chess block. It is a figure which shows the thermocompression bonding process using the thermocompression bonding apparatus shown in FIG. It is sectional drawing when the thermocompression bonding apparatus upper and lower sides shown in FIG. 1 are in a mold-clamping state. (A) is a partially omitted sectional view showing the state of the resin plate and the resin plate before pressing, and (b) is a partially omitted sectional view showing the state of the synthetic resin plate and the synthetic resin plate after pressing. is there. It is a schematic block diagram of the cooling device used after the thermocompression bonding process shown in FIG.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. As shown in FIGS. 1 to 4, in the thermocompression bonding apparatus 10 of the present embodiment, an upper chess block 32 is attached to the lower surface of an upper die set 30 as an upper mold via an upper mold base 31. A lower chess block 52 is attached to the upper surface of a lower die set 50 as a mold via a lower mold base 51. The thermocompression bonding apparatus 10 includes an upper chess block 32 and a lower chess block 52 on the object 20 to be bonded in which the synthetic resin plate P and the synthetic resin films F1 and F2 are overlapped with the ascending and descending operations of the lower platen 12. Is a device that is sandwiched between and heated and pressurized for welding. The upper die set 30 is attached to the lower surface of the upper platen 11, and the lower die set 50 is attached to the upper surface of the lower platen 12.

  As shown in FIGS. 2 and 3, the upper chess block 32 is in contact with the press-bonded object 20 to heat and pressurize it, so that the first sheet material ( A metal sheet 33), a second sheet material (elastic material 34) which is disposed on the upper die set 30 side of the metal sheet 33 and formed of a material having a lower elastic modulus than the metal sheet 33, and an upper die than the elastic material 34 An upper slide block 35 disposed in close contact with the upper mold base 31 near the set 30, and a pair of strip-shaped upper side covers 36 are attached along the left and right side edges of the lower surface of the metal sheet 33. It has been. An upper front plate 37 and an upper back plate 38 are attached to the front surface and the rear surface of the upper mold base 31, the upper slide block 35, the elastic member 34, and the metal sheet 33, respectively.

  Here, the upper mold base 31 and the upper back plate 38 are fixed portions fixed to the upper die set 30 by connection means (not shown). The upper chess block 32 composed of the upper front plate 37, the upper slide block 35, the elastic material 34, the metal sheet 33, and the upper side cover 36 is slidably engaged with the upper mold base 31 and the upper slide block 35. It can be easily detached by sliding it in the direction of the arrow X described in FIG. Then, the upper chess block 32 shown in FIG. 2 is set at the molding position, and the upper front plate 37 and the upper mold base 31 are fixed by a connecting means (not shown) so that the upper chess block 32 is moved to the molding position. Fixed.

  As shown in FIG. 1, a cylindrical vacuum frame 39 surrounding the upper die set 30, the upper mold base 31, and the upper chess block 32 is fixed to the lower surface of the upper platen 11 so as to hang down. A short cylindrical movable frame 39 a that can slide up and down with respect to the vacuum frame 39 is attached to the outer periphery of the lower end. An O-ring 39b is attached to the outer peripheral surface of the vacuum frame 39 that slides with the inner peripheral surface of the movable frame 39a, and an O-ring 39c is attached to the lower edge of the movable frame 39a. The drive mechanism (not shown) moves the movable frame 39a up and down. It is configured to be movable.

  Further, in the thermocompression bonding step to be described later, the air inside the vacuum frame 39 and the movable frame 39a (the region surrounding the crimping object 20 set on the metal sheet 53) is sucked to be evacuated. A plurality of vacuum ports 39d are opened. Therefore, when the lower platen 12 is raised, the vacuum frame 39 and the movable frame 39a are in a state of airtightly surrounding the upper die set 30, the upper mold base 31, and the upper chess block 32. 2, 3 and 6, for convenience of explanation, the vacuum frames 19 and 39 and the movable frame 39a shown in FIG. 1 are omitted.

  As shown in FIGS. 2 to 4, the lower chess block 52 is in contact with the object 20 to be heated and pressurizes, so that the first sheet material ( A metal sheet 53), a second sheet material (elastic material 54) which is disposed on the lower die set 50 side of the metal sheet 33 and formed of a material having a lower elastic modulus than the metal sheet 53, and a lower die than the elastic material 54. A pressing member (pressing plate 55) disposed on the set 50 side and a plurality of elastic supports 56 that transmit the pressing force from the lower die set 50 to the pressing plate 55 are provided. A plurality of positioning pins 53p are erected on a portion of the upper surface of the metal sheet 53 near the corner portion, and a pair of belt-like lower side covers 57 are attached along the left and right side edges of the metal sheet 53.

  The pressing plate 55 is formed of a plurality of plate pieces 55 a that are partitioned by boundary surfaces 55 b parallel to the pressing force direction from the upper die set 30, and each plate piece 55 a is supported by a plurality of elastic support members 56. Yes. A plurality of through holes 58a parallel to the pressing force direction are provided through the lower slide block 58 disposed on the lower side of the pressing plate 55, and a plurality of elastic supports 56 having a substantially cylindrical shape are respectively formed in the through holes 58a. It is slidably inserted inside.

  A concave portion 58b (see FIG. 4) is formed on the lower surface of the lower slide block 58 so as to be recessed toward the pressing plate 55. A support plate 59 is fitted in the concave portion 58b in close contact with the lower slide block 58 and is connected to the lower slide block 58 by a connecting means (not shown). It is fixed to the slide block 58. The support plate 59 is formed of a plurality of plate pieces 59c partitioned by a boundary surface 59b parallel to the pressing force direction, like the pressing plate 55, and penetrates the lower slide block 58 on the upper surface of each plate piece 59c. A plurality of adjustment posts 59a are projected in the same phase as the plurality of through holes 58a. Each of the plurality of adjustment posts 59a has a substantially quadrangular prism shape, but is not limited to this shape.

  As shown in FIGS. 2 and 3, when the lower slide block 58 and the support plate 59 are mounted on the lower mold base 51, the plurality of adjustment posts 59 a are respectively open ends of the through holes 58 a on the lower surface of the lower slide block 58. It will be in the state which entered into it. Thereby, the lower end portion of the elastic support member 56 inserted into the through hole 58a is pushed up by the protruding length of the adjustment post 59a, and the upper end portion of each elastic support member 56 extends from the upper surface 58c of the lower slide block 58. It contacts the lower surface 55c of the pressing plate 55 in a protruding state. As a result, a slight gap S is formed between the upper surface 58 c of the lower slide block 58 and the lower surface 55 c of the pressing plate 55.

  In addition, as shown in FIG. 2, a metal sheet material 53, an elastic material 54, a pressing plate 55, a lower slide block 58, a support plate 59, and a lower mold base 51 are respectively provided with a lower front plate 60 and a lower back on the front and back surfaces, respectively. A plate 61 is attached. Similar to the upper mold, the lower mold base 51 and the lower back plate 61 are fixed portions fixed to the lower die set 50 by connecting means (not shown). The components stacked from the lower side cover 57 to the support plate 59 and the lower front plate 60 are slidably engaged with the lower mold base 51 and the lower slide block 58, whereby the arrow X shown in FIG. It can be easily detached by sliding in the direction. Then, the lower chess block 52 shown in FIG. 2 is set at a molding position, and the lower front plate 60 and the lower mold base 51 are fixed by a connecting means (not shown) so that the lower chess block 52 is positioned at the molding time. Fixed to.

  Further, as shown in FIG. 1, a cylindrical vacuum frame 19 surrounding the lower die set 50, the lower mold base 51, and the lower chess block 52 is fixed to the upper surface of the lower platen 12 in an upright manner. The O-ring 39c at the lower edge 39e of the movable frame 39a of the vacuum frame 39 fixed to the lower surface of the upper platen 11 and the upper edge 19a of the vacuum frame 19 fixed to the upper surface of the lower platen 12 are arranged to face each other. The upper edge 19a of the vacuum frame 19 contacts (adheres) to and separates from the O-ring 39c of the lower edge 39e of the movable frame 39 as the lower platen 12 is raised and lowered as will be described later.

  Next, a thermocompression bonding method using the thermocompression bonding apparatus 10 will be described based on FIGS. 1, 2, and FIGS. 5 to 8. The thermocompression bonding apparatus 10 shown in FIGS. 1 and 2 has a function in which the lower chess block 52 approaches and separates from the upper chess block 32 as the lower platen 12 moves up and down, and the lower platen 12 moves up. The object 20 to be bonded (the synthetic resin plate P and the synthetic resin films F1 and F2 are overlapped on the metal sheet 53) between the metal sheet 53 of the lower chess block 52 and the metal sheet 33 of the upper chess block 32. Is formed by sandwiching, and heating and pressurizing to weld.

  As shown in FIG. 5, a synthetic resin plate P formed by an injection molding process using a predetermined injection molding device 70 is placed on a preheating device 71 and placed at a predetermined temperature (for example, higher than room temperature, synthetic resin glass). Preheating to a temperature lower than the transition temperature and softening temperature (preheating process). Thereafter, the synthetic resin films F1 and F2 formed in a separate process (not shown) and the synthetic resin plate P that has been preheated are opened in the open state (down position) as shown in FIGS. The press-bonding object 20 having a structure in which the upper and lower surfaces of the synthetic resin plate P are sandwiched between the resin films F1 and F2 is formed by alternately overlapping the metal sheets 53 of the chess block 52 (see FIG. 1).

  At this time, a plurality of positioning pins 53p projecting from the metal sheet 53 are inserted into a plurality of positioning holes (not shown) opened at predetermined positions of the crimping target object 20, thereby placing the crimping target object 20 in the correct position. Set to. At this stage, the upper chess block 32 and the lower chess block 52 are heated to a predetermined temperature (about the softening temperature of the synthetic resin plate P and the resin films F1 and F2).

  As described above, by providing a preheating process using the preheating device 71, the synthetic resin plate P is prevented from warping and deformation due to rapid heating in the thermocompression bonding process described later, and the thermocompression bonding time is shortened. be able to. Note that the preheating step by the preheating device 71 is omitted, and the room temperature synthetic resin plate P and the synthetic resin films F1 and F2 are overlapped on the metal sheet 53 to form the object 20 to be bonded, and the thermocompression work is started. It is also possible to do.

  When the lower chess block 52 rises with the raising operation of the lower platen 12 after the crimping object 20 is formed on the metal sheet 53, the upper edge 19 a of the vacuum frame 19 shown in FIG. The vacuum frames 19 and 39 are joined to each other by contacting (tightly contacting) the O-ring 39c of the lower edge portion 39e, the region surrounding the object 20 to be crimped is hermetically sealed, and the intake air from the vacuum port 39d of the movable frame 39a is sucked. The region surrounding the crimping object 20 is started and evacuated.

  After the upper edge portion 19 a of the vacuum frame 19 contacts the O-ring 39 c of the lower edge portion 39 e of the movable frame 39, the lower chess block 52 further rises, and the crimping object 20 on the metal sheet 53 of the lower chess block 52 is moved. The upper surface comes into contact with the lower surface of the metal sheet 33 of the upper chess block 32, and as shown in FIG. 6, the crimping object 20 is sandwiched between the metal sheets 33 and 53.

  Thereafter, the object 20 to be pressed is pressed through the metal sheets 33 and 53 from the upper chess block 32 and the lower chess block 52 that are heated to about the softening temperature of the synthetic resin plate P and the resin films F1 and F2. Heated. The suction from the vacuum port 39d of the movable frame 39a is automatically stopped when the area surrounding the crimping object 20 reaches a predetermined degree of vacuum, and is automatically restarted when the degree of vacuum deteriorates. Can be maintained at a predetermined degree of vacuum.

  When such pressurization and heating state are maintained for a predetermined time, the synthetic resin plate P and the resin films F1 and F2 constituting the press-bonding object 20 are heat-welded to each other to form a molded body 100 integrated ( Thermocompression process).

  In the thermocompression bonding process described above, the pressure generated by the upper die set 30 and the lower die set 50 is applied to the first sheet material (metal) via a pressing member (pressing plate 55) provided in the lower chess block 52. Sheet 53) and the second sheet material (elastic material 54). At this time, the first sheet material (metal sheet 53) is deformed into a relatively gentle state along the warp of the synthetic resin plate P and the unevenness of the surface, and the pressing member (the pressing plate 55) is also in the same direction. The second sheet material (elastic material 54) between them absorbs the difference in deformation amount. The plurality of elastic supports 56 in contact with the lower surface of the pressing member (pressing plate 55) transmits a constant pressing force in the mold clamping direction via the pressing member (pressing plate 55).

  As a result, the pressing force of the upper die set 30 and the lower die set 50 is uniformly applied to the object 20 to be bonded, so that the synthetic resin plate P and the synthetic resin films F1 and F2 are in close contact with each other in a good state. be able to. As the first sheet material, a metal sheet 53 such as aluminum or stainless steel is suitable, but a first sheet material formed of a synthetic resin material having a relatively high hardness can also be used. The second sheet material is preferably an elastic material 54 such as silicon or urethane, but is not limited thereto as long as it is formed of a material having a lower elastic modulus than the first sheet material.

  As shown in FIG. 4, the pressing member (pressing plate 55) is defined by a plurality of plate pieces 55 a that are partitioned by a boundary surface 55 b that is parallel to the pressurizing direction and that are respectively supported by a plurality of elastic supports 56. Therefore, during pressurization, the pressing force of the mold can be transmitted to the first sheet material (metal sheet material 53) and the second sheet material (elastic material 54) while the plurality of plate pieces 55a are independent from each other. it can. That is, the metal sheet material 53 is deformed so as to follow the warp of the synthetic resin plate P and the surface irregularities, and the plurality of plate pieces 55a constituting the pressing plate 55 are parallel to the pressurizing direction. Since the pressure applied to the mold can be transmitted according to the portion of the object to be crimped 20 in a state of being independently displaced, the synthetic resin plate P and the synthetic resin films F1 and F2 can be kept in good condition without any gaps. It can be adhered.

  Further, each elastic support 56 is detachably attached to the through hole 58a of the lower slide block 58 constituting the lower chess block 52 attached to the lower die set 50, so that the lower die is Since it becomes a state which can perform required pressurization in the position required in the crimping | compression-bonding target object 20, the followability to the curvature etc. of the synthetic resin plate P improves, and the synthetic resin plate P and the synthetic resin films F1, F2 It is effective for improving the adhesion.

  Furthermore, as shown in FIGS. 1, 3 and 4, as a means for adjusting the length of the elastic support 56 in the pressing force direction on the mold side (lower die set 50 side) of the elastic support 56, A support plate 59 having a plurality of adjustment posts 59c is disposed. With such a configuration, the pressing force transmitted from the lower die set 50 to the pressing plate 55 can be adjusted (set) for each elastic support 56 by changing the protruding length of each adjustment post 59c. Therefore, the followability to the warp of the synthetic resin plate P is further improved, which is effective for improving the adhesion between the synthetic resin plate P and the synthetic resin films F1 and F2.

  That is, the length of the elastic support 56 and the protruding length of the adjustment post 59a can be changed according to the degree of deformation and the state of deformation of the synthetic resin plate P. Further, the elastic support 56 is preferably made of an elastically deformable material such as a synthetic resin material or a metal material, and the elastic coefficient can be changed by changing the material of the elastic support 56 as necessary. . The elastic support 56 of the present embodiment has a cylindrical shape, but may be a columnar shape or other shapes.

  On the other hand, as shown in FIG. 1, a region surrounding the crimping object 20 sandwiched between an upper chess block 32 attached to the upper mold side and a lower chess block 52 attached to the lower mold side. As a decompression means for evacuating, vacuum frames 19 and 39, a movable frame 39a with a vacuum port 39d, and the like are provided.

  Accordingly, in the thermocompression bonding process of the object 20 to be bonded, the gas remaining between the synthetic resin plate P and the synthetic resin films F1 and F2 can be eliminated by sucking air through the vacuum port 39d. The adhesion between P and the synthetic resin films F1 and F2 can be further improved.

  Moreover, in this embodiment, when the crimping | compression-bonding target object 20 is formed by overlapping the synthetic resin plate P and the synthetic resin films F1 and F2 on the metal sheet 53, as shown in FIG. The peripheral portions F1e and F2e of the films F1 and F2 are arranged inside the peripheral portion Pe of the synthetic resin plate P.

  As a result, during the thermocompression bonding process of the crimping object 20, as shown in FIG. 7B, the synthetic resin plate P spreads in the surface direction at the peripheral portion of the crimping object 20, and the thickness thereof decreases. Since the adhesion failure can be prevented, the synthetic resin plate P and the synthetic resin films F1 and F2 can be adhered in a good state without a gap.

  In the above-described thermocompression bonding process, when the synthetic resin plate P and the synthetic resin films F1 and F2 are thermally welded to form the molded body 100, the atmosphere is introduced via the vacuum port 39d, and the vacuum frames 19 and 39 After the internal vacuum state is released, the lower platen 12 is lowered, the lower chess block 52 is separated from the upper chess block 32, and the molded body 100 can be removed. Although the molded body 100 after demolding may be allowed to cool in a room temperature atmosphere, as shown in FIG. 8, it is cooled by being sandwiched between an upper mold 72 and a lower mold 73 having a cooling function. Is desirable (cooling step).

  As shown in FIG. 8, the upper mold 72 and the lower mold 73 are made of a material having higher thermal conductivity than the molded body 100 (synthetic resin plates and synthetic resin films F1 and F2). Cooling pipes 75 and 76 for passing a cooling medium adjusted to a predetermined temperature in the controller 74 are provided.

  If such a cooling process is provided, after being removed from the mold through the thermocompression bonding process, the molded body 100 in a high-temperature state is prevented from being warped or deformed by being cooled unevenly. can do.

  In addition, although it does not limit about the material of the synthetic resin plate P and the synthetic resin films F1 and F2 which comprise the crimping | compression-bonding target object 20, For example, as a raw material of the synthetic resin plate P, general synthetic resin materials, such as polyethylene and polystyrene, or polycarbonate, Engineering plastics-based synthetic resins such as polyether amide can be used. As the synthetic resin films F1 and F2, the above-described materials or fluorine-based synthetic resin materials such as PTFE and PVDF can be used.

  Moreover, in this embodiment, although the molded object 100 (crimp object 20) is formed by thermocompression bonding the synthetic resin films F1 and F2 on the upper and lower surfaces of the synthetic resin plate P, it is not limited to this. Only one of the synthetic resin films F1 and F2 can be thermocompression bonded to one surface (upper surface or lower surface) of the resin plate P.

  In this embodiment, the pressing plate 55, the elastic support 56, the lower slide block 58 having the through hole 58a, and the support plate 59 with the adjustment post 59a are provided only on the lower chess block 52. A structure provided in both the chess block 32 and the lower chess block 52 or a structure provided only in the upper chess block 32 may be employed.

  The thermocompression bonding apparatus and the thermocompression bonding method according to the present invention can be widely used in the field of electrical / electronic equipment manufacturing industry or analytical equipment manufacturing industry.

DESCRIPTION OF SYMBOLS 10 Thermocompression bonding apparatus 11 Upper platen 12 Lower platen 19,39 Vacuum frame 19a Upper edge part 20 Crimp object 30 Upper die set 31 Upper mold base 32 Upper chess block 33,53 Metal sheet 34,54 Elastic material 35 Upper slide block 36, 57 Side cover 37 Upper front plate 38 Upper back plate 39a Movable frame 39b, 39c O-ring 39d Vacuum port 39e Lower edge part 50 Lower die set 51 Lower mold base 52 Lower chess block 53p Positioning pin 55 Press plate 55a, 59c Plate piece 55b, 59b Interface 56 Elastic support 58 Lower slide block 58a Through hole 58b Concave portion 59 Support plate 59a Adjustment post 60 Upper front plate 61 Lower back plate 70 Injection molding device 71 Preliminary 72 upper mold 73 lower mold 74 temperature controller 75 condenser 100 molded F1, F2 synthetic resin film P synthetic resin plate F1e, F2e, Pe periphery S clearance

Claims (10)

  In the thermocompression bonding apparatus that heats and pressurizes and welds an object to be crimped in which a synthetic resin plate and a synthetic resin film are overlapped between an upper mold and a lower mold, the upper mold or the lower mold At least one of the molds is in contact with the object to be crimped to heat and pressurize the first sheet material formed of an elastic material having higher rigidity than the object to be thermocompression bonded, and closer to the mold side than the first sheet material A second sheet material that is disposed and formed of a material having a lower elastic modulus than the first sheet material; a pressing member that is disposed closer to the mold than the second sheet material; and a pressing force of the mold on the pressing member And a plurality of elastic supports for transmitting the heat.   The thermocompression bonding according to claim 1, wherein the first sheet material, the second sheet material, the pressing member, and the plurality of elastic supports are detachable from at least one of the upper mold and the lower mold. apparatus.   The thermocompression bonding apparatus according to claim 1 or 2, wherein the pressing member is defined by a plurality of plate pieces that are partitioned by a boundary surface parallel to the pressing force direction and are respectively supported by the plurality of elastic supports.   The thermocompression bonding apparatus according to any one of claims 1 to 3, wherein at least one of the plurality of elastic supports is individually detachable from the upper mold or the lower mold.   The thermocompression bonding apparatus according to any one of claims 1 to 4, wherein a means for adjusting the length of the elastic support in the pressing force direction is provided on the mold side of the elastic support.   The thermocompression bonding according to any one of claims 1 to 5, further comprising pressure reducing means for evacuating a region surrounding the synthetic resin plate and the synthetic resin film disposed between the upper mold and the lower mold. apparatus.   Using the thermocompression bonding apparatus according to any one of claims 1 to 6, a pressure bonding object obtained by superimposing a synthetic resin plate and a synthetic resin film is sandwiched between an upper mold and a lower mold and heated. A thermocompression bonding method in which pressure is applied and welded, and after the thermocompression bonding, the object to be bonded removed from between the upper mold and the lower mold is made of a material having higher thermal conductivity than the object to be bonded. A thermocompression bonding method comprising a cooling step of sandwiching the formed cooling member.   The thermocompression bonding method according to claim 7, further comprising a preheating step of heating the synthetic resin plate before being sandwiched between the upper mold and the lower mold to a temperature lower than a softening temperature of the synthetic resin plate.   A region surrounding the synthetic resin plate and the synthetic resin film disposed between the upper mold and the lower mold is set to a vacuum atmosphere, and then the synthetic resin plate and the synthetic resin film are thermocompression bonded. The thermocompression bonding method according to claim 7 or 8.   The thermocompression bonding method according to any one of claims 7 to 9, wherein when the synthetic resin plate and the synthetic resin film are overlapped with each other, a peripheral portion of the synthetic resin film is disposed on an inner side than a peripheral portion of the synthetic resin plate. .

Images