JP2012129319A - Reflective optical element, optical unit, exposure device and method of manufacturing device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a reflective optical element in which heat exchange can be carried out quickly, and to provide an optical unit, an exposure device and a method of manufacturing a device.SOLUTION: The optical unit comprises a reflective optical element 43 having a first surface 47 which reflects the exposure light, a second surface 49 different from the first surface 47 and a recess 68 formed in the second surface 49, and a projection member 69 which is in contact, at least, with a part of the bottom surface and the side surface of the recess 68, respectively, and exchanges heat between the reflective optical element 43.

Description

  The present invention relates to a reflective optical element that reflects incident light, an optical unit that includes the reflective optical element, an exposure apparatus that includes the optical unit, and a device manufacturing method that uses the exposure apparatus.

  In general, an exposure apparatus for manufacturing a microdevice such as a semiconductor integrated circuit includes an illumination optical system that illuminates exposure light on a mask such as a reticle on which a predetermined pattern is formed, and a pattern of the mask illuminated by the exposure light. A projection optical system that projects an image onto a substrate such as a wafer or a glass plate coated with a photosensitive material. In such an exposure apparatus, in order to achieve high integration of a semiconductor integrated circuit and miniaturization of a pattern image associated with the high integration, a further increase in resolution of an exposure technique is desired. As one of the exposure apparatuses that achieve the high resolution, an EUV exposure apparatus that uses EUV (Extreme Ultraviolet) light having a wavelength of about 5 to 20 nm as exposure light has attracted attention. The illumination optical system of such an EUV exposure apparatus includes an optical unit composed of a pair of fly-eye mirrors in order to make the intensity distribution of illumination light that illuminates the irradiated surface of the mask uniform (Patent Literature). 1).

US Patent Application Publication No. 2007/0273859

  By the way, in an EUV exposure apparatus, since a glass material showing high transmittance with respect to EUV light is limited, an illumination optical system and a projection optical system are, for example, reflective optical members in which a multilayer film of molybdenum and silicon is formed on a reflective surface. Consists of. However, when EUV light is irradiated onto the reflective optical member, a part of the EUV light is absorbed by the reflective optical member, so that the temperature of the reflective optical member changes. For this reason, the reflective optical member is deformed.

  The present invention has been made in view of such circumstances, and an object thereof is to provide a reflective optical element, an optical unit, an exposure apparatus, and a device manufacturing method capable of efficiently performing heat exchange. .

The present invention adopts the following configuration corresponding to FIGS. 1 to 14 shown in the embodiment.
The reflective optical element of the present invention is formed on a first surface (47) for reflecting light (EL), a second surface (49) different from the first surface (47), and the second surface (49). An optical member (48) having a recessed portion (68), a bottom surface of the recessed portion (68), and at least a part of a side surface of the recessed portion (68), and the optical member (48), And a heat exchanging member (69) for exchanging heat between the two.

  In order to explain the present invention in an easy-to-understand manner, the description has been made in association with the reference numerals of the drawings shown in the embodiments, but it goes without saying that the present invention is not limited to the embodiments.

1 is a schematic block diagram that shows an exposure apparatus according to a first embodiment. The schematic block diagram which shows the structure of an optical integrator optical system. (A) is a front view schematically showing an incident-side fly-eye mirror, and (b) is a front view schematically showing an emission-side fly-eye mirror. Sectional drawing of the 1st optical unit in 1st Embodiment. (A) (b) (c) is a schematic diagram which shows the manufacturing procedure which provides a protrusion member in the incident side fly-eye mirror of 1st Embodiment, (a) is the 2nd surface side of an incident side fly-eye mirror. The schematic diagram which shows the state in the middle of arrange | positioning a mold material and filling the metal with respect to the inside of the through-hole of a recessed part and a mold material, (b) is the recessed part of an entrance side fly eye mirror, and the inside of the through-hole of a mold material The schematic diagram which shows the state which filling was completed, (c) is a schematic diagram which shows the state which removed the type | mold material from the incident side fly eye mirror. The principal part expanded sectional view of the 1st optical unit in 2nd Embodiment. The principal part expanded sectional view of the 1st optical unit in 3rd Embodiment. (A) (b) (c) (d) (e) is a schematic diagram showing a manufacturing procedure for providing a projecting member on the incident side fly-eye mirror of the fourth embodiment, wherein (a) is relative to the base material. FIG. 4B is a schematic view showing a state where a metal film is deposited, FIG. 5B is a schematic view showing a state in which a concave portion is formed on the base material, and FIG. (D) is a schematic diagram showing a state in which the metal filling into the concave portion of the base material and the through hole of the base material is completed, and (e) is a schematic diagram showing a state in which the base material is removed from the base material. Figure. (A) (b) (c) (d) (e) is a schematic diagram showing a manufacturing procedure for providing a projecting member on the incident side fly-eye mirror of the fifth embodiment, and (a) is a contact of a base material. Schematic diagram showing a state in which the mold materials are arranged on the surface side and the second surface side, respectively, (b) is a schematic diagram showing a state in which the filling of the metal in the space between the base material and the mold material is completed, (c) Is a schematic diagram showing a state in which the mold material arranged on the contact surface side is removed from the base material, (d) is a schematic diagram showing a state where a reflecting surface is formed, and (e) is a diagram showing the mold material arranged on the second surface side. The schematic diagram which shows the state removed from the base material. (A) (b) (c) (d) is a schematic diagram which shows the manufacture procedure which provides a protrusion member in the incident side fly-eye mirror of 6th Embodiment, (a) is a contact surface side of a base material, and The schematic diagram which shows the state which has each arrange | positioned the mold material in the 2nd surface side, (b) is a schematic diagram which shows the state which filling with the metal to the space area between a base material and a mold material, (c) is a contact surface The schematic diagram which shows the state which removed the mold material arrange | positioned in the side from the base material, (d) is the schematic diagram which shows the state which removed the mold material arrange | positioned in the 2nd surface side from the base material. Sectional drawing which shows schematic structure of the 1st optical unit of 7th Embodiment. Sectional drawing which shows schematic structure of the 1st optical unit of 8th Embodiment. The flowchart of the manufacture example of a device. The detailed flowchart regarding the board | substrate process in the case of a semiconductor device.

  Below, 1st Embodiment which actualized this invention is described based on FIGS. In this embodiment, the direction parallel to the optical axis of the projection optical system is the Z-axis direction, and the scanning direction of the reticle R and wafer W during scanning exposure in a plane perpendicular to the Z-axis direction is the Y-axis direction. The non-scanning direction orthogonal to the scanning direction will be described as the X-axis direction. The rotation directions around the X, Y, and Z axes are also referred to as the θx direction, the θy direction, and the θz direction. It is assumed that the direction of gravity coincides with the −Z axis direction.

  As shown in FIG. 1, an exposure apparatus 11 according to this embodiment uses extreme ultraviolet light, ie, EUV (Extreme Ultraviolet) light, which is a soft X-ray region having a wavelength of about 100 nm or less, emitted from a light source device 12 as exposure light. It is an EUV exposure apparatus used as an EL. Such an exposure apparatus 11 includes a chamber 13 (a portion surrounded by a two-dot chain line in FIG. 1) whose inside is set to a vacuum atmosphere lower in pressure than the atmosphere. In this chamber 13, an illumination optical system 14 that illuminates a reflective reticle R on which a predetermined pattern is formed with exposure light EL supplied from the light source device 12 into the chamber 13, and pattern formation in which a pattern is formed A reticle holding device 15 that holds the reticle R is provided so that the surface Ra is positioned on the −Z direction side (the lower side in FIG. 1). Further, in the chamber 13, a projection optical system 16 that irradiates a wafer W coated with a photosensitive material such as a resist by exposure light EL through the reticle R, and an exposure surface (a wafer surface coated with the photosensitive material). ) A wafer holding device 17 for holding the wafer W is provided so that Wa is positioned on the + Z direction side (upper side in FIG. 1).

  The light source device 12 is a device that outputs EUV light having a wavelength of 5 to 20 nm as exposure light EL, and includes a laser excitation plasma light source (not shown). In this laser-excited plasma light source, a high-power laser is used to irradiate a high-density EUV light generating substance (target) into a plasma, and EUV light is emitted from the plasma as exposure light EL. Examples of the high-power laser include a CO2 laser, a YAG laser using semiconductor laser excitation, and an excimer laser. The emitted exposure light EL is condensed by a condensing optical system (not shown) and output into the chamber 13.

  The illumination optical system 14 includes a housing 18 (a portion surrounded by a solid line in FIG. 1) whose interior is set to a vacuum atmosphere, as in the interior of the chamber 13. In the casing 18, a plurality of reflection mirrors (not shown) that can reflect the exposure light EL incident from the light source device 12 into the casing 18 are provided. Then, the exposure light EL sequentially reflected by the respective reflection mirrors is incident on a reflection mirror 19 for folding installed in a lens barrel 25 described later, and the exposure light EL reflected by the reflection mirror 19 is reflected by the reticle holding device 15. To the reticle R held on the surface. The reflection mirror 19 for folding may be installed outside the lens barrel 25 or inside the housing 18 or may be installed so as to be supported between the housing 18 and the lens barrel 25. Further, the illumination optical system 14 is provided with an optical integrator optical system 40 (see FIG. 2) for achieving illuminance uniformity on the reticle R. The configuration of the optical integrator optical system 40 will be described later.

  The reticle holding device 15 is disposed on the object plane side of the projection optical system 16 and includes a first electrostatic chucking holding device 21 for electrostatically chucking the reticle R. The first electrostatic chucking and holding device 21 includes a base body 22 made of a dielectric material and having a suction surface 22a, and a plurality of electrode portions (not shown) disposed in the base body 22. When a voltage is applied to each electrode unit from a voltage application unit (not shown), the reticle R is electrostatically adsorbed on the adsorption surface 22 a by the Coulomb force generated from the base body 22.

  The reticle holding device 15 is movable in the Y-axis direction by driving the reticle moving device 23. That is, the reticle moving device 23 moves the reticle R held by the first electrostatic attraction holding device 21 with a predetermined stroke in the Y-axis direction. The reticle moving device 23 can finely move the reticle R in the X-axis direction (direction orthogonal to the paper surface in FIG. 1) and the θz direction. When the pattern formation surface Ra of the reticle R is illuminated with the exposure light EL, a substantially arcuate illumination region extending in the X-axis direction is formed on a part of the pattern formation surface Ra.

  The projection optical system 16 is an optical system that reduces an image of a pattern formed by illuminating the pattern forming surface Ra of the reticle R with exposure light EL to a predetermined reduction magnification (for example, 1/4 times). Similarly to the inside of the lens 13, a lens barrel 25 whose inside is set to a vacuum atmosphere is provided. A plurality of (for example, 2 to 10 and only one is shown in FIG. 1) reflective mirrors 26 are accommodated in the lens barrel 25. Each of these mirrors 26 is supported by the lens barrel 25 via a mirror holding device (not shown). Then, the exposure light EL guided from the reticle R side, which is the object plane side, is sequentially reflected by each mirror 26 and guided to the wafer W held by the wafer holding device 17. In each mirror included in the illumination optical system 14 and the projection optical system 16, a reflection layer that reflects the exposure light EL is formed on each mirror surface that reflects the exposure light EL.

  The wafer holding device 17 includes a second electrostatic adsorption holding device 27 for electrostatically adsorbing the wafer W. The second electrostatic chucking and holding device 27 includes a base body 28 made of a dielectric material and having a suction surface 28a, and a plurality of electrode portions (not shown) disposed in the base body 28. When a voltage is applied to each electrode unit from a voltage application unit (not shown), the wafer W is electrostatically adsorbed on the adsorption surface 28 a by the Coulomb force generated from the base 28. The wafer holding device 17 includes a wafer holder (not shown) that holds the second electrostatic chuck holding device 27 and a Z (not shown) that adjusts the position of the wafer holder in the Z-axis direction and the tilt angles around the X axis and the Y axis. A leveling mechanism is incorporated.

  The wafer holding device 17 can be moved in the Y-axis direction by driving the wafer moving device 29. That is, the wafer moving device 29 moves the wafer W held by the second electrostatic chucking holding device 27 with a predetermined stroke in the Y-axis direction. Further, the wafer moving device 29 can move the wafer W held by the second electrostatic chucking holding device 27 with a predetermined stroke in the X-axis direction and can finely move the wafer W in the Z-axis direction. .

  When the pattern of the reticle R is formed on one shot area of the wafer W, the reticle R is moved in the Y-axis direction (by driving the reticle moving device 23 with the illumination area formed on the reticle R by the illumination optical system 14 ( For example, it is moved every predetermined stroke from the + Y direction side to the -Y direction side. At the same time, the wafer moving device 29 is driven to move the wafer W along the Y-axis direction along the Y-axis direction at a speed ratio corresponding to the reduction magnification of the projection optical system 16 (for example, on the −Y direction side). To + Y direction side). When the pattern formation on one shot area is completed, the pattern formation on the other shot areas of the wafer W is continuously performed.

Next, the optical integrator optical system 40 will be described.
As shown in FIG. 2, the optical integrator optical system 40 includes a first optical unit 41 disposed on the exposure light EL incident side and a second optical unit 42 disposed on the emission side. The first optical unit 41 is provided with a reflective optical element 43 that reflects the incident exposure light EL toward the second optical unit 42, and a temperature adjusting device 44 that is attached in a detachable state. ing. Further, the second optical unit 42 includes a reflective optical element 45 that reflects the exposure light EL incident from the first optical unit 41 side, and a temperature adjusting device 46 that is attached in a state where the reflective optical element 45 is detachable. Is provided.

  The reflective optical element 43 of the first optical unit 41 is, as shown in FIGS. 2 and 3A, an incident-side fly-eye mirror having a first surface 47 (lower surface in FIG. 2) that reflects incident exposure light EL. 48 and a support member 50 that supports the incident-side fly-eye mirror 48 from the side of the second surface 49 (the upper surface in FIG. 2) located on the opposite side of the first surface 47. As shown in FIG. 3A, the incident-side fly-eye mirror 48 is composed of a plurality of optical elements 51 arranged two-dimensionally, and each optical element 51 has a substantially arc shape in plan view. One element surface 52 (also referred to as a reflective surface) is provided. That is, the first surface 47 of the incident-side fly's eye mirror 48 includes a plurality of first element surfaces 52. Further, the second surface 49 of the incident-side fly's eye mirror 48 is configured in a planar shape that is substantially orthogonal to the Z-axis direction. The incident-side fly-eye mirror 48 is arranged such that the first surface 47 is located at a position optically conjugate with the pattern forming surface Ra of the reticle R or in the vicinity of the conjugate position.

  The reflective optical element 45 of the second optical unit 42 is, as shown in FIGS. 2 and 3B, an exit-side fly-eye mirror having a first surface 55 (upper surface in FIG. 2) that reflects the incident exposure light EL. 56 and a support member 58 that supports the exit-side fly-eye mirror 56 from the second surface 57 (the lower surface in FIG. 2) located on the opposite side of the first surface 55. The exit-side fly-eye mirror 56 is composed of a plurality of optical elements 59 arranged two-dimensionally, and each optical element 59 has a second element surface 60 that is substantially rectangular in plan view. That is, the first surface 55 of the exit-side fly-eye mirror 56 is composed of a plurality of second element surfaces 60. Such an exit-side fly-eye mirror 56 is arranged so as to be located at a position optically conjugate with the illumination pupil plane or in the vicinity of the conjugate position.

  The light beam of the exposure light EL that has entered the incident-side fly-eye mirror 48 is wavefront-divided for each first element surface 52, and the many light beams that have undergone wave-front division are incident on the exit-side fly-eye mirror 56. A light beam emitted from the first element surface 52 of the incident-side fly-eye mirror 48 that individually corresponds to each second element surface 60 is incident on each second element surface 60 of the emission-side fly-eye mirror 56. As a result, a large number of light source images (also referred to as secondary light sources) are formed in the vicinity of the exit-side fly-eye mirror 56. A large number of light beams emitted from the exit-side fly-eye mirror 56 are superimposed on the pattern forming surface Ra of the reticle R, thereby ensuring high illuminance uniformity on the reticle R.

Next, the configuration of the first optical unit 41 will be described.
As shown in FIG. 4, the reflective optical element 43 of the first optical unit 41 is fixed to the casing 18 (or the side wall of the chamber 13) using a fixing mechanism 61, and is relative to the casing 18. The position is determined. On the other hand, the reflective optical element 43 is movable in the Z-axis direction with respect to the temperature adjustment device 44 when removed from the fixing mechanism 61.

  The incident-side fly-eye mirror 48 is fixed to the mirror block 62 having a reflection surface (first surface 47) of the incident exposure light EL, and the back surface 63 side opposite to the first surface 47 with respect to the mirror block 62. And a base material 64 to be formed.

  On the first surface 47 of the mirror block 62, a multilayer film in which a molybdenum layer and a silicon layer are repeatedly laminated is formed. This multilayer film exhibits a high reflectance with respect to EUV light having a wavelength of about 13.5 nm.

  On the other hand, the back surface 63 of the mirror block 62 is formed in a planar shape perpendicular to the Z-axis direction (vertical direction in FIG. 4). On the back surface 63 side of the mirror block 62, a plurality of (only four are shown in FIG. 4) hole portions 65 are opened. These holes 65 are formed so that the shape of the opening viewed from the + Z direction side is substantially circular. The mirror block 62 is made of a metal material having a high thermal conductivity such as copper or aluminum. However, the mirror block 62 may be made of, for example, molybdenum, silicon carbide, and a material having a low thermal expansion coefficient such as low thermal expansion glass represented by Zerodur (trade name), ULE (registered trademark), or the like.

  The base material 64 has a planar contact surface 66 that contacts the back surface 63 of the mirror block 62 and is orthogonal to the Z-axis direction. In the base material 64, the opposite side of the contact surface 66 is a second surface 49 of the incident side fly-eye mirror 48. Examples of the material constituting the base material 64 include molybdenum, silicon carbide, and a material having a low thermal expansion coefficient such as low thermal expansion glass represented by Zerodur (trade name), ULE (registered trademark), and the like. Further, the material constituting the base material 64 may be, for example, a negative expansion material having a property that the volume decreases as the temperature rises, or a metal material having high thermal conductivity such as copper or aluminum. May be.

  Further, a through hole 67 that penetrates in a direction orthogonal to the contact surface 66 of the base material 64 (that is, the Z-axis direction) is formed at a position corresponding to the hole 65 of the mirror block 62 in the base material 64. These through-holes 67 have substantially circular openings when viewed from the + Z direction side, and are arranged coaxially with the corresponding hole portions 65. That is, the inside of the through hole 67 communicates with the corresponding hole 65. In the incident-side fly-eye mirror 48, a recess 68 that opens to the second surface 49 side of the incident-side fly-eye mirror 48 is configured by the hole 65 of the mirror block 62 and the through-hole 67 of the base material 64. Yes. The mirror block 62 and the base material 64 are not necessarily required to be coaxially arranged with the hole 65 and the through-hole 67, as long as the hole 65 and the through-hole 67 are arranged to communicate with each other. Arbitrary arrangement configurations can be adopted.

  The incident-side fly's eye mirror 48 includes a plurality of protruding members 69 (only four are shown in FIG. 4) that extend in the Z-axis direction and have a substantially cylindrical shape. Each of these projecting members 69 has a distal end side portion 69 a located on the + Z direction side of the recessed portion 68 and a proximal end portion 69 b located in the recessed portion 68. An end portion on the + Z direction side of the distal end side portion 69 a of the protruding member 69 (that is, the distal end of the protruding member 69) is disposed on the + Z direction side with respect to the support member 50. Further, the base end side portion 69 b of the protruding member 69 is in close contact with the bottom surface and the side surface of the recess 68.

  The protruding member 69 is preferably made of a material (for example, copper, aluminum, indium, indium alloy, resin, etc.) having higher thermal conductivity than the material constituting the mirror block 62. This is because the heat generated in the mirror block 62 is quickly released to the outside through the protruding member 69. Further, from the viewpoint of manufacturing the incident side fly-eye mirror 48, the protruding member 69 is preferably made of a material having a melting point lower than that of the material constituting the mirror block 62 and the base material 64. More preferably, the protruding member 69 may be made of a material having a melting point slightly higher than room temperature. Here, the normal temperature indicates the temperature in the chamber 13 when the exposure apparatus 11 is in operation.

  The support member 50 has a facing surface 70 that faces the second surface 49 of the incident-side fly's eye mirror 48, and the facing surface 70 is formed so as to form a plane substantially parallel to the second surface 49. Yes. The incident side fly-eye mirror 48 is fixed to the support member 50 with bolts 71 so that the second surface 49 contacts the opposing surface 70.

  Further, the support member 50 has a plurality (only four are shown in FIG. 4) penetrating in the Z-axis direction orthogonal to the facing surface 70 from the back surface 72 side opposite to the facing surface 70 toward the facing surface 70 side. A through hole 73 is formed. Each of these through holes 73 is formed at a position corresponding to the concave portion 68 of the incident side fly-eye mirror 48. Therefore, the protruding member 69 protruding from the concave portion 68 of the incident side fly-eye mirror 48 is inserted into the through hole 73 of the support member 50 and protrudes from the back surface 72 of the support member 50 to the + Z direction side.

  Further, the shape of the opening of the through hole 73 viewed from the + Z direction side is substantially circular, and the diameter of the through hole 73 is larger than the diameter of the concave portion 68 of the incident side fly-eye mirror 48. Therefore, a slight clearance is interposed between the side surface of the through hole 73 of the support member 50 and the side surface of the distal end side portion 69 a of the protruding member 69.

  The temperature adjustment device 44 includes a temperature adjustment block 81 having a substantially rectangular parallelepiped shape. The temperature control block 81 is connected to a supply pipe 82 for supplying a refrigerant from a refrigerant supply apparatus (not shown) and a discharge pipe 83 for discharging the refrigerant to the refrigerant supply apparatus. In such a temperature control block 81, a circulation channel 84 (indicated by a broken line in FIG. 4) communicating with the supply pipeline 82 and the discharge pipeline 83 is formed. The circulation channel 84 is a channel for circulating the supplied refrigerant in the temperature control block 81.

  Further, in the temperature control block 81, a heat conductive layer formed of a soft heat transfer material (for example, a metal such as aluminum or indium or an alloy thereof) is provided on the facing surface facing the support member 50 in the Z-axis direction. 85 is formed. In a state where the incident side fly-eye mirror 48 is supported by the support member 50, the tip end portion of the projecting member 69 extending from the incident side fly-eye mirror 48 is pressed against the heat conduction layer 85. It is like that. As a result, the temperature adjustment device 44 including the temperature adjustment block 81 can adjust the temperature of the incident side fly-eye mirror 48 via the protruding member 69 and the heat conductive layer 85.

Next, an operation when the protruding member 69 of the incident side fly-eye mirror 48 is molded will be described.
As shown in FIG. 5A, when the protruding member 69 is molded with respect to the incident side fly-eye mirror 48, first, the mold material 89 is brought into contact with the base material 64 of the incident side fly-eye mirror 48. . A through hole 90 is formed in the mold material 89 at a position corresponding to the through hole 73 of the base material 64. Then, the through hole 90 of the mold material 89 is brought into contact with the second surface 49 of the base material 64 so that the through hole 90 of the mold material 89 and the through hole 73 of the base material 64 are aligned. A high-temperature molten material (for example, copper, aluminum, indium, indium alloy, resin, or the like) is poured from the upper opening.

  Then, the melted material is gradually filled in the concave portion 68 of the incident side fly-eye mirror 48 and the through hole 90 of the mold material 89. Then, as shown in FIG. 5B, when the filling of the material into the through hole 90 of the mold material 89 is completed, the filled material is gradually cooled and solidified by radiating heat into the atmosphere.

  The material is filled into the concave portion 68 of the incident side fly-eye mirror 48 in a liquid state with high fluidity. Therefore, this material is bonded to the inner surface of the concave portion 68 of the incident side fly-eye mirror 48 in a state of being in close contact with the gap. Therefore, in the incident-side fly-eye mirror 48, the protruding member 69 can efficiently exchange heat with the mirror block 62 on which the exposure light EL is incident.

  Then, as shown in FIG. 5C, when the solidification of the filled material is completed, the mold material 89 is removed from the base material 64. Then, the projecting member 69 joined to the mirror block 62 is configured to project in the + Z direction side from the back surface (second surface 49) of the base material 64. Then, the incident side fly-eye mirror 48 is fixed to the support member 50 by the bolt 71 while the protruding member 69 is inserted into the through hole 73 of the support member 50.

Therefore, in this embodiment, the following effects can be obtained.
(1) The projecting member 69 of the incident side fly-eye mirror 48 is in contact with the bottom and side surfaces of the recess 68 of the incident side fly-eye mirror 48 and is connected to the mirror block 62 so as to be able to transfer heat. Therefore, when the temperature adjusting device 44 cools the protruding member 69, the mirror block 62 that absorbs a part of the incident exposure light EL and generates heat can be suitably cooled.

  (2) The most heat-generating part in the incident side fly-eye mirror 48 on which the exposure light EL is incident is in the vicinity of the first surface 47 on which the exposure light EL is incident. In this regard, in the present embodiment, the proximal end portion 69 b of the protruding member 69 is disposed at a position close to the first surface 47 of the incident-side fly-eye mirror 48. Therefore, the temperature of the first surface 47 of the incident side fly-eye mirror 48 can be adjusted efficiently.

  (3) The incident side fly-eye mirror 48 includes a mirror block 62 having a reflecting surface that reflects the exposure light EL, and a base material 64 that supports the mirror block 62. In addition, a through hole 67 is formed in the base material 64 so as to penetrate in a direction orthogonal to the contact surface 66 with respect to the mirror block 62. The protruding member 69 extending from the mirror block 62 protrudes from the back surface (second surface 49) of the base material 64 through the through hole 67. Therefore, the incident-side fly-eye mirror 48 can realize a configuration in which the protruding member 69 for radiating heat from the mirror block 62 is protruded from the second surface 49.

  (4) Generally, the incident-side fly-eye mirror 48 is made of a material having a low coefficient of thermal expansion in order to suppress thermal expansion due to heat generated by the exposure light EL incident. Thus, the incident side fly-eye mirror 48 made of a material having a low coefficient of thermal expansion hardly releases heat generated by itself. That is, there is a tendency to accumulate heat in the incident side fly-eye mirror 48. In this regard, in the present embodiment, the incident-side fly-eye mirror 48 is composed of a plurality of members (that is, different in thermal conductivity) (that is, the mirror block 62 and the base material 64) having different materials. . That is, the thermal conductivity of the mirror block 62 is higher than the thermal conductivity of the base material 64. The heat generated in the mirror block 62 having the first surface 47 is released to the outside of the incident side fly-eye mirror 48 through the protruding member 69. Therefore, even if the mirror block 62 is made of a material having high thermal conductivity, deformation of the first surface 47 due to heat generation can be suppressed.

  (5) The base material 64 is made of a material having a lower coefficient of thermal expansion than the mirror block 62. Therefore, even if heat is propagated from the heated mirror block 62 to the base material 64 by absorbing a part of the incident exposure light EL, the base material 64 hardly undergoes thermal deformation. Accordingly, it is possible to suppress the mirror block 62 from being deformed so as to be distorted by the stress acting on the mirror block 62 from the base material 64.

  (6) The thermal conductivity of the protruding member 69 is higher than the thermal conductivity of the mirror block 62. Therefore, heat can be quickly propagated from the heated mirror block 62 to the protruding member 69 by absorbing the incident exposure light EL.

  (7) The protruding member 69 is made of a material having a melting point in the vicinity of room temperature. Therefore, the temperature change of the material when the material is solidified after flowing into the concave portion 68 of the incident side fly-eye mirror 48 in a melted state becomes small. As a result, thermal deformation accompanying the temperature change of the material is suppressed. Accordingly, it is possible to suppress the mirror block 62 from being deformed so as to be distorted by the stress acting on the mirror block 62 from the protruding member 69.

  (8) The support member 50 is formed with a through hole 73 penetrating from the opposing surface 70 side that supports the incident-side fly-eye mirror 48 to the back surface 72 side, and the protruding member 69 is in the through hole 73 of the support member 50. The through hole 73 of the support member 50 is inserted so as to protrude from the opening on the back surface 72 side. The protruding member 69 protrudes from the back surface 72 of the support member 50 in the + Z direction side. Therefore, the protruding member 69 can be brought into contact with the temperature adjustment block 81 located on the opposite side of the incident side fly-eye mirror 48 with the support member 50 interposed therebetween. Therefore, the temperature of the incident-side fly-eye mirror 48 can be adjusted efficiently using the protruding member 69.

  (9) In the through hole 73 of the support member 50, a clearance is interposed between the side surface of the through hole 73 and the side surface of the protruding member 69. Therefore, even if the protruding member 69 to which heat has propagated from the mirror block 62 heated by absorbing the incident exposure light EL is thermally expanded, stress due to the thermal expansion of the protruding member 69 is applied to the side surface of the through hole 73. Acting is avoided. Even if the stress due to the thermal expansion of the protruding member 69 acts on the side surface of the through-hole 73, the effect is very small compared to the case where no clearance is provided. Therefore, it is possible to suppress the first surface 47 of the mirror block 62 from being deformed so as to be distorted due to the propagation of stress from the protruding member 69 to the incident-side fly-eye mirror 48 via the support member 50.

  (10) When the heat conductive layer 85 having higher thermal conductivity than the protruding member 69 is interposed between the protruding member 69 and the temperature adjustment block 81, the heat transfer efficiency between the protruding member 69 and the temperature adjustment block 81 is improved. Can do well. Therefore, the heat propagated from the mirror block 62 to the protruding member 69 can be quickly radiated to the temperature adjustment block 81 via the heat conductive layer 85.

  (11) When the heat conductive layer 85 is made of a material having rigidity lower than that of the protruding member 69, the tip end portion 69 a of the protruding member 69 can be pressed against the heat conductive layer 85. In this case, the tip end portion 69a of the protruding member 69 comes into close contact with the heat conductive layer 85 without any gap. Therefore, heat can be efficiently transferred between the protruding member 69 and the temperature adjustment block 81, and the temperature adjustment of the incident-side fly-eye mirror 48 can be suitably performed.

(Second Embodiment)
Next, a second embodiment of the present invention will be described with reference to FIG. In the second embodiment, the configuration of the protruding member 69 joined to the mirror block 62 is different from that of the first embodiment. Therefore, in the following description, parts different from those of the first embodiment will be mainly described, and the same or corresponding member configurations as those of the first embodiment are denoted by the same reference numerals, and redundant description will be omitted. Shall.

  As shown in FIG. 6, the protruding member 69 of the present embodiment has a substantially cylindrical shape. A hollow space S <b> 1 is formed inside the projecting member 69 so as to extend over the entire region in the longitudinal direction of the projecting member 69. Even if heat propagates from the mirror block 62 to the projecting member 69 and the projecting member 69 is thermally expanded, the projecting member 69 is thermally expanded so that the space region S1 formed inside thereof is narrowed. That is, thermal expansion to the outside of the protruding member 69 is suppressed. Therefore, stress hardly propagates from the projecting member 69 to the side surface of the concave portion 68 of the incident side fly-eye mirror 48, and the mirror block 62 is prevented from being deformed to be distorted.

Therefore, in this embodiment, in addition to the effects (1) to (11) of the first embodiment, the following effects can be obtained.
(12) Even if the protruding member 69 is thermally expanded by the heat propagated from the mirror block 62, the thermal expansion is inward expansion of the protruding member 69. Therefore, the stress hardly propagates from the protruding member 69 to the incident-side fly-eye mirror 48 via the support member 50, and the mirror block 62 can be prevented from being deformed to be distorted.

(Third embodiment)
Next, a third embodiment of the present invention will be described with reference to FIG. In the third embodiment, the configuration of the protruding member 69 joined to the mirror block 62 is different from those in the above embodiments. Therefore, in the following description, parts different from those of the above embodiments will be mainly described, and the same or corresponding member configurations as those of the above embodiments will be denoted by the same reference numerals and redundant description will be omitted. To do.

  As shown in FIG. 7, the protruding member 69 has a substantially T-shaped cross section, and a small-diameter portion 91 having a substantially cylindrical shape having a smaller diameter than the shape of the concave portion 68 of the incident-side fly-eye mirror 48 in plan view, It has a substantially disc-shaped large-diameter portion 92 provided at the proximal end (lower end in FIG. 7) of the small-diameter portion 91. The diameter of the large diameter portion 92 is larger than the diameter of the small diameter portion 91. In the present embodiment, the large-diameter portion 92 of the projecting member 69 contacts the bottom surface and part of the side surface of the concave portion 68 of the incident side fly-eye mirror 48. More specifically, the large diameter portion 92 contacts the side surface of the hole 65 formed in the mirror block 62 among the side surfaces of the recess 68, but does not contact the side surface of the through hole 67 of the base material 64. . Further, the small diameter portion 91 of the protruding member 69 does not contact the side surface of the concave portion 68 of the incident side fly-eye mirror 48. That is, a slight clearance is interposed between the side surface of the small diameter portion 91 and the side surface of the recess 68.

  Here, it is assumed that the projecting member 69 is thermally expanded as heat propagates from the mirror block 62 to the projecting member 69 through the large-diameter portion 92 of the projecting member 69. In this case, the protruding member 69 thermally expands so as to narrow the clearance between the small diameter portion 91 of the protruding member 69 and the side surface of the concave portion 68 of the incident side fly-eye mirror 48. That is, when the side surface of the small-diameter portion 91 of the projecting member 69 that has thermally expanded does not contact the side surface of the recess 68, stress hardly propagates from the projecting member 69 to the side surface of the recess 68. As a result, the mirror block 62 is prevented from being deformed so as to be distorted.

  Further, even if the side surface of the small diameter portion 91 comes into contact with the side surface of the concave portion 68 due to the thermal expansion of the protruding member 69, the stress propagated from the thermally expanded protruding member 69 to the side surface of the concave portion 68 is small before the thermal expansion. This is smaller than the case where the side surface of 91 is in contact with the side surface of the recess 68. Therefore, the degree of deformation of the mirror block 62 due to the thermal expansion of the protruding member 69 can be reduced.

Therefore, in this embodiment, in addition to the effects (1) to (11) of the above embodiments, the following effects can be obtained.
(13) The protruding member 69 of the present embodiment does not contact the base material 64. That is, in the through hole 67 provided in the base material 64, a clearance is interposed between the side surface of the through hole 67 and the side surface of the protruding member 69. Therefore, even if the protruding member 69 is thermally expanded, the thermally expanded protruding member does not contact the side surface of the through hole 67. Further, even if the protruding member that has thermally expanded contacts the side surface of the through hole 67, the stress received by the side surface of the through hole 67 as a result of the contact is very small compared to the case where the clearance is not interposed. Therefore, the deformation of the base material 64 can be suppressed, and the deformation of the mirror block 62 fixed to the base material 64 can be suppressed.

(Fourth embodiment)
Next, a fourth embodiment of the present invention will be described with reference to FIG. The fourth embodiment is different from the first embodiment in the molding process of the protruding member 69 in the incident side fly-eye mirror 48. Therefore, in the following description, parts different from those of the first embodiment will be mainly described, and the same or corresponding member configurations as those of the first embodiment will be denoted by the same reference numerals and redundant description will be given. Shall be omitted.

  As shown in FIG. 8A, the base material 64 of the present embodiment is formed with a pseudo reflection surface 94 imitating the reflection surface (that is, the first surface 47) of the incident side fly-eye mirror 48. When the projecting member 69 is provided on the incident side fly-eye mirror 48, first, a metal film 95 such as aluminum or copper having high thermal conductivity is formed on the pseudo-reflecting surface 94 of the base material 64 by vapor deposition. The As a result, a plurality of first element surfaces 52 are formed on the opposite side of the pseudo reflection surface 94 in the metal film 95 formed on the pseudo reflection surface 94. Each of the first element surfaces 52 constitutes a reflection surface (first surface 47) of the incident-side fly-eye mirror 48. Note that a multilayer film in which a molybdenum layer and a silicon layer are repeatedly laminated is formed on the reflection surface of the incident side fly-eye mirror 48. This multilayer film exhibits a high reflectance with respect to EUV light having a wavelength of about 13.5 nm.

  When the projecting member 69 is molded with respect to the incident-side fly's eye mirror 48, first, as shown in FIG. 8 (b), the back surface and the back surface are separated from the back surface (second surface 49) side of the base material 64. A hole 96 is formed to extend in the orthogonal direction. The hole 96 has a depth enough to reach the metal film 95.

  Next, as shown in FIG. 8C, the mold material 97 is brought into contact with the base material 64. The mold member 97 has a plurality of through holes 98 extending in the vertical direction. The mold member 97 is arranged such that the inside of each through hole 98 and the inside of each hole 96 of the base material 64 communicate with each other. In this state, a high-temperature molten material (for example, copper, aluminum, indium, indium alloy, resin, etc.) is poured from the opening above the through hole 98 of the mold member 97. Note that the material used here is preferably the same as the material constituting the metal film 95.

  Then, the hole 96 of the base material 64 and the through hole 98 of the mold material 97 are gradually filled with the molten material. Then, as shown in FIG. 8 (d), the filled material is gradually cooled and solidified by radiating heat into the atmosphere.

  The filled material is filled into the hole 96 of the base material 64 in a liquid state with high fluidity. Here, as described above, the metal film 95 deposited on the base material 64 constitutes a part of the inner surface of the hole 96 of the base material 64. Therefore, the material poured into the hole 96 of the base material 64 is joined to the metal film 95 in a state of being in close contact with the gap. Here, when the material poured into the hole 96 is the same as the material constituting the metal film 95, the protruding member 69 made of the material poured into the hole 96 is integrated with the metal film 95. . Therefore, in the incident-side fly-eye mirror 48, the protruding member 69 can efficiently transmit the heat generated in the metal film 95 constituting the reflecting surface of the incident exposure light EL to the outside.

  Then, as shown in FIG. 8E, when the solidification of the filled material is completed, the mold member 97 is removed from the base material 64. Then, the projecting member 69 joined to the mirror block 62 is configured to project in the + Z direction side from the back surface (second surface 49) of the base material 64.

Therefore, in this embodiment, in addition to the effects (1), (3), and (8) to (11) of the above embodiments, the following effects can be obtained.
(14) The proximal end portion of the projecting member 69 is directly connected to the metal film 95 having the reflecting surface (first surface 47) of the incident-side fly-eye mirror 48. That is, the base end side portion of the protruding member 69 is disposed at a position close to the reflecting surface of the incident side fly-eye mirror 48. Therefore, the temperature in the vicinity of the first surface 47 of the incident side fly-eye mirror 48 can be adjusted efficiently.

(Fifth embodiment)
Next, a fifth embodiment of the present invention will be described with reference to FIG. The fifth embodiment is different from the first and fourth embodiments in the molding process of the protruding member 69 in the incident side fly-eye mirror 48. Therefore, in the following description, portions different from the first and fourth embodiments will be mainly described, and the same or corresponding member configurations as those of the first and fourth embodiments are the same. Reference numerals will be attached and redundant description will be omitted.

  When the projecting member 69 is molded with respect to the incident-side fly's eye mirror 48, first, as shown in FIG. 9A, the mold material 100 and the mold material 97 are respectively arranged on the upper and lower sides of the base material 64. . The mold member 100 disposed on the lower side of the base material 64 is formed to have a substantially square box shape with a bottom. The opening on the lower side of each through hole 67 formed in the base material 64 is covered with the mold material 100. As a result, a space region S <b> 2 is formed by the lower surface (contact surface 66) of the base material 64 and the inner surface of the mold material 100.

  In this state, high-temperature molten metal (for example, copper, aluminum, indium, indium alloy, etc.) is poured from the upper opening of the through hole 98 of the mold member 97. Then, the molten metal is gradually filled in the space region S <b> 2 between the base material 64 and the mold material 100. Then, as shown in FIG. 9B, when the filling of the metal into the space S2 between the base material 64 and the mold material 100, the through hole 67 of the base material 64 and the through hole 98 of the mold material 97 is completed, the metal material is filled. The metal is gradually cooled and solidified by radiating heat into the atmosphere. Note that a material other than a metal such as a resin is used as a material to be filled in the space region S2 between the base material 64 and the mold material 100, and heat is radiated from the filled material to the atmosphere and gradually cured. You may do it.

  Next, as shown in FIG. 9C, when the mold member 100 is removed from the base material 64, the lower metal portion of the solidified metal is formed into a substantially rectangular parallelepiped shape similar to the inner shape of the mold member 100. Then, as shown in FIG.9 (d), cutting operation is performed with respect to the lower end surface of the metal lower side site | part. Then, a plurality of first element surfaces 52 constituting the reflecting surface (first surface 47) of the incident side fly-eye mirror 48 are formed on the lower end surface of the lower portion of the solidified metal. Subsequently, a multilayer film in which a molybdenum layer and a silicon layer are repeatedly laminated is formed on the reflection surface of the incident side fly-eye mirror 48. This multilayer film shows a high reflectance with respect to EUV light having a wavelength of about 13.5 nm.

  Next, as shown in FIG. 9E, when the formation of the first element surface 52 for the filled metal is completed, the mold member 97 is removed from the base material 64. Then, the upper part of the solidified metal becomes a protruding member 69 that protrudes in the + Z direction side from the back surface (second surface 49) of the base material 64.

Therefore, in this embodiment, the effects (1), (3), (8) to (11), and (14) of the above embodiments can be obtained.
(Sixth embodiment)
Next, a sixth embodiment of the present invention will be described with reference to FIG. The sixth embodiment differs from the sixth embodiment in the molding process of the protruding member 69 in the incident side fly-eye mirror 48. Therefore, in the following description, parts different from those of the sixth embodiment will be mainly described, and the same or corresponding member configurations as those of the sixth embodiment will be denoted by the same reference numerals and redundant description will be given. Shall be omitted.

  As shown in FIG. 10A, the shape of the inner surface of the mold member 105 disposed on the lower side of the base material 64 is different from the shape of the inner surface of the mold member 100 (see FIG. 9) in the fifth embodiment. . That is, the inner bottom surface of the mold member 105 has a shape imitating the reflecting surface (that is, the first surface 47) of the incident side fly-eye mirror 48.

  In this state, a high-temperature molten material (for example, copper, aluminum, indium, indium alloy, resin, or the like) is poured from the opening above the through hole 98 of the mold member 97. Then, the melted material is gradually filled in the space region S3 between the base material 64 and the mold material 105. Then, as shown in FIG. 10B, when the filling of the material into the space S3 between the base material 64 and the mold material 105, the through hole 98 of the base material 64 and the through hole 98 of the mold material 97 is completed, the filling is completed. The metal is gradually cooled and solidified by radiating heat into the atmosphere.

  Then, as shown in FIG. 10C, when the mold member 105 is removed from the base material 64, the reflecting surface (first surface 47) of the incident-side fly-eye mirror 48 is formed on the lower end surface of the lower portion of the solidified material. A plurality of first element surfaces 52 are formed. Furthermore, a multilayer film in which a molybdenum layer and a silicon layer are repeatedly laminated is formed on the reflection surface of the incident side fly-eye mirror 48. This multilayer film exhibits a high reflectance with respect to EUV light having a wavelength of about 13.5 nm.

  Subsequently, as shown in FIG. 10D, when the formation of the first element surface 52 for the filled metal is completed, the mold member 97 is removed from the base material 64. Then, the upper part of the solidified material becomes a protruding member 69 that protrudes in the + Z direction side from the back surface (second surface 49) of the base material 64.

Therefore, in this embodiment, the effects (1), (3), (8) to (11), and (14) of the above embodiments can be obtained.
(Seventh embodiment)
Next, a seventh embodiment of the present invention will be described with reference to FIG. The seventh embodiment is different from the first embodiment in the configuration for cooling the incident side fly-eye mirror 48. Therefore, in the following description, parts different from those of the first embodiment will be mainly described, and the same or corresponding member configurations as those of the first embodiment will be denoted by the same reference numerals and redundant description will be given. Shall be omitted.

  As shown in FIG. 11, the support member 50 is formed with a plurality of recesses 112 that open to the facing surface 70 side. These concave portions 112 are formed in a concave shape having a substantially circular shape when viewed from the −Z direction side. Further, the diameter of the recess 112 is larger than the diameter of the protruding member 69. When the incident-side fly-eye mirror 48 is fixed to the support member 50 with the bolts 71, the protruding member 69 of the incident-side fly-eye mirror 48 is inserted into the recess 112 of the support member 50 from below. At this time, the tip (upper end in FIG. 11) of the protruding member 69 of the incident side fly-eye mirror 48 is in pressure contact with the bottom surface of the recess 112 (upper end surface of the recess 112 in FIG. 11).

  In addition, the support member 50 is formed with a plurality of accommodating portions 113 that open to the back surface 72 side. These accommodating portions 113 are formed in a concave shape having a substantially circular shape when viewed from the + Z direction side. Further, the diameter of the accommodating portion 113 is sufficiently larger than the diameter of the concave portion 112. A heat transfer medium having lower rigidity and higher heat transfer efficiency than that of the projecting member 69 is stored in the storage portion 113.

  In this embodiment, a liquid metal that is a kind of heat exchange liquid is used as the heat transfer medium. Examples of the liquid metal include an alloy of gallium and indium, an alloy of gallium, indium and tin, an alloy of gallium, indium and zinc, an alloy of gallium and tin, an alloy of gallium and zinc, and mercury. The liquid level of the heat exchange liquid is generated in the −Z direction side of the back surface 72 due to gravity in the housing portion 113 of the support member 50.

  Further, in the heat conductive layer 85 of the temperature control block 81, a heat transfer member 114 made of a material having high heat transfer efficiency (for example, a metal such as aluminum) is provided at each position corresponding to the housing portion 113 of the support member 50. The heat transfer member 114 protrudes in the −Z direction side. The heat transfer member 114 has a substantially cylindrical shape, and is configured such that its diameter is larger than the diameter of the protruding member 69. The tip (lower end in FIG. 11) of such a heat transfer member 114 is disposed in the corresponding accommodating portion 113. That is, the tip of the heat transfer member 114 is in contact with the heat transfer medium in the housing portion 113.

  When the temperature adjustment block 81 of the temperature adjustment device 44 is cooled by the refrigerant circulating in the circulation channel 84, the heat conduction layer 85 supported by the temperature adjustment block 81 is cooled. Then, heat is exchanged between the support member 50 of the reflective optical element 43 and the temperature adjustment device 44 via the heat transfer medium and the heat conductive layer 85 in the housing portion 113. Specifically, heat is radiated from the support member 50 of the reflective optical element 43 to the temperature adjusting device 44 side through the heat transfer medium and the heat conductive layer 85 in each housing portion 113. In addition, since the support member 50 is cooled by the temperature adjustment device 44, the protruding members 69 that are in contact with the support member 50 are also cooled. Therefore, in this embodiment, most of the heat generated in the mirror block 62 is released to the temperature control block 81 side through the protruding member 69, the support member 50, the heat transfer medium in the housing portion 113, and the heat transfer member 114. Is done.

  At this time, in the temperature control block 81, vibration is generated by the pulsation of the refrigerant circulating in the circulation channel 84 formed therein. This vibration is transmitted to each heat transfer member 114 fixed to the temperature control block 81, but is hardly transmitted to the support member 50 side. This is because the heat transfer medium interposed between the front end portion of each heat transfer member 114 and the side surface of the housing portion 113 functions as a damper that absorbs vibration transmitted from the temperature adjusting device 44 side.

  The incident-side fly-eye mirror 48 reflects most of the exposure light EL incident on the first surface 47 toward the emission-side fly-eye mirror 56 while absorbing the remaining exposure light EL. For this reason, in the incident-side fly-eye mirror 48, a heat amount corresponding to the amount of exposure light EL absorbed is generated in the mirror block 62. Then, heat is exchanged between the mirror block 62 having a high temperature and the support member 50 having a low temperature via the protruding member 69.

  As a result, since the temperature rise of the mirror block 62 is suppressed, the thermal deformation of the reflecting surface (first surface 47) of the mirror block 62 is suppressed. Further, since heat is also exchanged between the support member 50 and the temperature control device 44, thermal deformation of the facing surface 70 that supports the back surface (second surface 49) of the base material 64 in the support member 50 is suppressed. . As a result, in the incident-side fly-eye mirror 48, distortion stress hardly acts on the mirror block 62 from the base material 64, and deformation of the reflecting surface (first surface 47) of the mirror block 62 is suppressed. Is done.

  Further, when replacing the reflective optical element 43, the reflective optical element 43 is removed from the fixing mechanism 61. Then, the reflective optical element 43 is moved to the −Z direction side so that the liquid metal in the housing portion 113 does not leak. Here, the support member 50 of the reflective optical element 43 is not connected to a conduit for supplying a coolant. Therefore, the reflective optical element 43 is easily detached from the first optical unit 41 as compared with the case where the reflective optical element 43 to which the conduit for supplying the coolant to the support member 50 is connected.

Therefore, in this embodiment, in addition to the effects (1) to (11) of the first embodiment, the following effects can be obtained.
(15) When the incident-side fly-eye mirror 48 is replaced in the first optical unit 41, it is not necessary to remove the incident-side fly-eye mirror 48 from the support member 50. Therefore, the incident-side fly's eye mirror 48 can be easily replaced because there is no need to worry about damage to the protruding member 69.

(Eighth embodiment)
Next, an eighth embodiment of the present invention will be described with reference to FIG. The eighth embodiment is different from the seventh embodiment in that the first element surface 52 of the incident-side fly's eye mirror 48 is configured by a plurality of mirror blocks 62. Therefore, in the following description, parts different from those of the seventh embodiment will be mainly described, and the same or corresponding member configurations as those of the seventh embodiment will be denoted by the same reference numerals and redundant description will be given. Shall be omitted.

  As shown in FIG. 12, the base material 64 supports a plurality of mirror blocks 62 (only three are shown in FIG. 12). Each of these mirror blocks 62 has at least one first element surface 52. In FIG. 12, a large gap is interposed between adjacent mirror blocks 62 for convenience of understanding the description, but in reality, the gap between the mirror blocks 62 is very narrow.

Therefore, in this embodiment, in addition to the effects (1) to (11) and (15) of the above embodiments, the following effects can be obtained.
(16) The plurality of mirror blocks 62 constitute the first element surface 52 of the incident side fly-eye mirror 48. Therefore, as compared with the case where the first element surface 52 of the incident-side fly-eye mirror 48 is configured by a single mirror block 62, the number of projecting members 69 extending from each mirror block 62 is reduced. Therefore, it is possible to reliably avoid the protrusion member 69 from being damaged when the mirror blocks 62 are individually attached to the support member 50.

In addition, you may change each said embodiment into another embodiment as follows.
In the first to sixth embodiments, the heat conductive layer 85 may be provided at the tip of the protruding member 69 that contacts the temperature adjustment block 81.

In the first to sixth embodiments, the heat conductive layer 85 may be made of a highly rigid material, and the protruding member 69 may be press-fitted into the heat conductive layer 85.
-In 1st-6th embodiment, you may provide the low-rigidity and highly heat-conductive heat conductive layer 85 with respect to the mutual contact part in both the temperature control block 81 and the protrusion member 69. FIG.

In the first to sixth embodiments, it is not necessary to provide a clearance between the side surface of the protruding member 69 and the side surface of the through hole 73 of the support member 50.
In the seventh and eighth embodiments, it is not necessary to provide a gap between the side surface of the protruding member 69 and the side surface of the concave portion 112 of the support member 50.

  In the first to sixth embodiments, the protruding member 69 may be configured not to protrude in the + Z direction side from the opening on the back surface 72 side in the through hole 73 formed in the support member 50. That is, you may comprise so that the front end surface of the protrusion member 69 and the back surface 72 of the supporting member 50 may become flush. Even with such a configuration, the protruding member 69 and the temperature adjustment block 81 can be connected to each other on the back surface 72 side of the support member 50. Further, when a slight clearance is interposed between the front end surface of the projecting member 69 and the temperature control block 81 as in the case where the front end surface of the projecting member 69 is disposed below the back surface 72 of the support member 50. Even if it exists, by making the front-end | tip surface of the protrusion member 69 and the temperature control block 81 oppose, heat exchange can be performed between the protrusion member 69 and the temperature control block 81 using a thermal radiation.

  In the seventh and eighth embodiments, the protruding member 69 may be configured such that a slight clearance is interposed between the protruding member 69 and the bottom surface of the concave portion 112 of the support member 50. Even in such a configuration, heat exchange can be performed between the protruding member 69 and the bottom surface of the concave portion 112 of the support member 50 using heat radiation.

In the first to sixth embodiments, the reflective optical element 43 may have a configuration in which the support member 50 that supports the incident side fly-eye mirror 48 is omitted.
In each embodiment, the protruding member 69 may be made of a material having a melting point higher than the temperature in the chamber 13 when the exposure apparatus 11 is in operation.

  In the first embodiment, a notch portion may be formed on the side surface of the protruding member 69. In such a configuration, even if the protruding member 69 is thermally expanded by the heat propagated from the mirror block 62, the thermal expansion is expansion toward the inside of the notch. Therefore, the stress hardly propagates from the protruding member 69 to the incident-side fly-eye mirror 48 via the support member 50, and the mirror block 62 can be prevented from being deformed to be distorted.

  In each embodiment, the reflective optical element 43 may be configured as a protruding member 69 of a rod-shaped metal material inserted so as to be fitted into the concave portion 68 of the incident side fly-eye mirror 48.

  In the third embodiment, the large diameter portion 92 of the projecting member 69 is located at a position spaced upward from the bottom surface of the concave portion 68 of the incident side fly-eye mirror 48, and the side surface of the concave portion 68 of the incident side fly-eye mirror 48. It is good also as a structure which contacts with respect to.

  In the first to sixth embodiments, the heat conductive layer 85 may be omitted. That is, the protruding member 69 extending from the mirror block 62 may be brought into direct contact with the temperature adjustment block 81. Further, a slight clearance may be interposed between the protruding member 69 and the temperature control block 81. Even if it comprises in this way, the temperature of the protrusion member 69 can be adjusted using thermal radiation by arrange | positioning the temperature control block 81 close to the protrusion member 69. FIG.

In each embodiment, the protruding member 69 may be a heat pipe.
In each embodiment, the temperature adjustment device 44 may be configured to include an adjustment mechanism that adjusts the temperature of the temperature adjustment block 81 using thermal radiation. At this time, the temperature control block 81 may be formed of a material having a high heat ray absorption rate, and heat may be exchanged between the control mechanism and the temperature control block 81 using radiation. In addition, glass is mentioned as a substance with a high heat ray absorption rate, for example.

  -In each embodiment, the temperature control apparatus 44 is the structure provided with the Peltier device as an example of the heat exchange element for adjusting the temperature of the temperature control block 81, and the controller for controlling this Peltier device. May be.

  In each embodiment, the first optical unit 41 cools the incident-side fly-eye mirror 48 when the incident-side fly-eye mirror 48 generates heat, while the incident-side fly-eye mirror 48 is external to the reference temperature. If the temperature is always lower than the reference temperature due to the influence or internal influence, the incident-side fly-eye mirror 48 may be heated.

  In each embodiment, in the second optical unit 42, the temperature of the first surface 55 of the exit-side fly-eye mirror 56 is the same as the method of adjusting the temperature of the entrance-side fly-eye mirror 48 in the first optical unit 41. May be adjusted.

  In each embodiment, the incident-side fly-eye mirror 48 may have a configuration in which the base material 64 is omitted. In other words, the mirror block 62 may be directly fixed to the support member 50.

The optical unit of the present invention may be embodied in a unit including a mirror other than the fly-eye mirrors 48 and 56 and a temperature adjustment mechanism that adjusts the temperature of the other mirror.
In each embodiment, the exposure apparatus 11 manufactures a reticle or mask used in not only a microdevice such as a semiconductor element but also a light exposure apparatus, an EUV exposure apparatus, an X-ray exposure apparatus, and an electron beam exposure apparatus. Therefore, an exposure apparatus that transfers a circuit pattern from a mother reticle to a glass substrate or a silicon wafer may be used. The exposure apparatus 11 is used for manufacturing a display including a liquid crystal display element (LCD) and the like, and is used for manufacturing an exposure apparatus that transfers a device pattern onto a glass plate, a thin film magnetic head, and the like. It may be an exposure apparatus that transfers to a wafer or the like, and an exposure apparatus that is used to manufacture an image sensor such as a CCD.

  In each embodiment, the EUV light generating material used in the light source device 12 may be gaseous tin (Sn), or liquid or solid tin. Xenon (Xe) may be used as the EUV light generating substance.

In each embodiment, the light source device 12 may be a device having a discharge plasma light source.
In each embodiment, the light source device 12 includes, for example, g-line (436 nm), i-line (365 nm), KrF excimer laser (248 nm), F ₂ laser (157 nm), Kr ₂ laser (146 nm), Ar ₂ laser (126 nm) Or the like. The light source device 12 amplifies the infrared or visible single wavelength laser light oscillated from the DFB semiconductor laser or fiber laser, for example, with a fiber amplifier doped with erbium (or both erbium and ytterbium). Alternatively, a light source capable of supplying harmonics converted into ultraviolet light using a nonlinear optical crystal may be used.

In each embodiment, the exposure apparatus 11 may be embodied as a step-and-repeat apparatus.
Next, an embodiment of a microdevice manufacturing method using the device manufacturing method by the exposure apparatus 11 of the embodiment of the present invention in the lithography process will be described. FIG. 13 is a flowchart showing a manufacturing example of a micro device (a semiconductor chip such as an IC or LSI, a liquid crystal panel, a CCD, a thin film magnetic head, a micromachine, or the like).

  First, in step S101 (design step), function / performance design (for example, circuit design of a semiconductor device) of a micro device is performed, and pattern design for realizing the function is performed. Subsequently, in step S102 (mask manufacturing step), a mask (reticle R or the like) on which the designed circuit pattern is formed is manufactured. On the other hand, in step S103 (substrate manufacturing step), a substrate (a wafer W when a silicon material is used) is manufactured using a material such as silicon, glass, or ceramics.

  Next, in step S104 (substrate processing step), using the mask and substrate prepared in steps S101 to S104, an actual circuit or the like is formed on the substrate by lithography or the like, as will be described later. Next, in step S105 (device assembly step), device assembly is performed using the substrate processed in step S104. Step S105 includes processes such as a dicing process, a bonding process, and a packaging process (chip encapsulation) as necessary. Finally, in step S106 (inspection step), inspections such as an operation confirmation test and a durability test of the microdevice manufactured in step S105 are performed. After these steps, the microdevice is completed and shipped.

FIG. 14 is a diagram illustrating an example of a detailed process of step S104 in the case of a semiconductor device.
In step S111 (oxidation step), the surface of the substrate is oxidized. In step S112 (CVD step), an insulating film is formed on the substrate surface. In step S113 (electrode formation step), an electrode is formed on the substrate by vapor deposition. In step S114 (ion implantation step), ions are implanted into the substrate. Each of the above steps S111 to S114 constitutes a pretreatment process at each stage of the substrate processing, and is selected and executed according to a necessary process at each stage.

  When the above-mentioned pretreatment process is completed in each stage of the substrate process, the posttreatment process is executed as follows. In this post-processing process, first, in step S115 (resist formation step), a photosensitive material is applied to the substrate. In step S116 (exposure step), the circuit pattern of the mask is transferred to the substrate by the lithography system (exposure apparatus 11) described above. Next, in step S117 (development step), the substrate exposed in step S116 is developed to form a mask layer made of a circuit pattern on the surface of the substrate. Subsequently, in step S118 (etching step), the exposed member other than the portion where the resist remains is removed by etching. In step S119 (resist removal step), the photosensitive material that has become unnecessary after the etching is removed. That is, in step S118 and step S119, the surface of the substrate is processed through the mask layer. By repeatedly performing these pre-processing steps and post-processing steps, multiple circuit patterns are formed on the substrate.

Next, technical ideas other than the invention described in the claims ascertained from the above embodiments will be additionally described.
(1) Heat exchange for exchanging heat between the optical member having a first surface that reflects light, a second surface different from the first surface, and an optical member having a recess formed in the second surface. In a method for manufacturing a reflective optical element comprising a member,
Cast the melted material into the recess,
A method of manufacturing a reflective optical element, comprising: curing a material cast into the recess, and configuring the heat exchange member with the cured material.

(2) In the manufacturing method of the reflective optical element described in the technical idea (1),
A mold member having a through hole is arranged on the second surface side of the optical member so that the inside of the through hole and the inside of the recess communicate with each other.
In the through hole and the concave portion of the mold material, a material melted from the through hole side is cast,
After the material cast into the through hole and the recess is cured, the mold member is removed from the optical member,
The method of manufacturing a reflective optical element, wherein the heat exchange member is made of the cured material.

(3) In the manufacturing method of the reflective optical element described in the technical idea (1) or (2),
The optical member has at least a base portion having the second surface,
A reflective portion having the first surface is formed by subjecting a surface of the base portion, which is located on the opposite side of the second surface, to a film forming process using a material different from the material constituting the base portion. A method of manufacturing a reflective optical element.

(4) Heat exchange for exchanging heat between the optical member having a first surface for reflecting light, a second surface different from the first surface, and an optical member having a recess formed in the second surface. In a method for manufacturing a reflective optical element comprising a member,
The optical member is
A reflection part on which the first surface is formed;
The front reflective surface includes a support surface that supports a back surface located on the opposite side of the first surface, a second surface, and a through hole that penetrates the support surface from the second surface, and is different from the reflective portion. And a base portion made of a material,
A mold material for forming the reflective portion is disposed on the support surface side of the base portion,
Casting a material melted into the mold from the opening on the second surface side of the through hole,
After the material cast in the mold material and the through hole is cured, the mold material is removed from the base part,
Of the cured material, the reflective portion is constituted by a material located on the support surface side of the base portion, and the heat exchange member is constituted by a material located in the through hole. A method for manufacturing a reflective optical element.

(5) In the manufacturing method of the reflective optical element described in the technical idea (4),
A method of manufacturing a reflective optical element, wherein the first surface is formed on the reflecting portion by processing the reflecting portion after the mold material is removed from the base.

(6) In the manufacturing method of the reflective optical element described in the technical idea (4) or (5),
The mold material for forming the heat exchange member communicates with the inside of the through hole provided in the base part and the inside of the through hole provided in the base part on the second surface side of the base part. And place
In each mold material and in the concave portion, a material melted from the through hole side provided in the mold material for forming the heat exchange member is cast,
After the cast material has hardened, remove each mold from the base,
Among the materials after curing, the reflective portion is configured by a material located on the support surface side of the base portion, and the second surface side from the base portion and in the through hole of the base portion A method of manufacturing a reflective optical element, wherein the heat exchange member is made of a material projecting from the surface.

  DESCRIPTION OF SYMBOLS 11 ... Exposure apparatus, 41 ... 1st optical unit, 42 ... 2nd optical unit, 43 ... Reflection optical element, 44 ... Temperature adjustment apparatus as an example of temperature adjustment mechanism, 45 ... Reflection optical element, 46 ... Temperature adjustment mechanism Temperature control device as one example, 47... First surface, 48... Incident side fly eye mirror as an example of optical member, 49... Second surface, 50 .. Support member, 55. , Second surface, 58 ... support member, 62 ... mirror block as an example of a reflection part, 63 ... back surface, 64 ... base material as an example of a base part, 66 ... support surface Contact surface as an example, 68... Concave portion, 69. Projecting member as an example of heat exchange member, 70. Opposite surface as an example of opposing portion, 73. 91 ... an example of the first part The small diameter portion, 92 ... large-diameter portion as an example of a second portion, 95 ... metal film as an example of the reflection portion, 113 ... receiving portion, 114 ... heat transfer member as an example of a heat exchange element of Te.

Claims (25)

An optical member having a first surface for reflecting light, a second surface different from the first surface, and a recess formed in the second surface;
A reflective optical element comprising: a heat exchange member that contacts a bottom surface of the concave portion and at least a part of a side surface of the concave portion and exchanges heat with the optical member. The reflective optical element according to claim 1,
The reflective optical element, wherein the heat exchange member has a first part that contacts a side surface of the recess and a second part that does not contact a side surface of the recess. The reflective optical element according to claim 2,
The reflective optical element, wherein the first portion of the heat exchange member is located closer to the bottom surface of the recess than the second portion. The reflective optical element according to any one of claims 1 to 3,
The optical member is
A reflection part on which the first surface is formed;
The reflective portion includes a support surface that supports a back surface located on the opposite side of the first surface, a second surface, and a through hole that penetrates the support surface from the second surface, and is different from the reflective portion. A base portion made of a material,
The bottom surface of the concave portion is formed on the back surface side of the reflective portion,
The side surface of the concave portion includes a side surface of a through hole formed in the base portion. The reflective optical element according to claim 4,
The reflection optical element, wherein the reflection portion is formed on the support surface of the base portion by film formation. The reflective optical element according to claim 4,
The reflection optical element is characterized in that the reflection portion is formed by casting a metal on the support surface side of the base portion. In the reflective optical element according to any one of claims 4 to 6,
The reflection optical element, wherein the base portion is made of a material having a lower coefficient of thermal expansion than the material constituting the reflection portion. In the reflective optical element according to any one of claims 1 to 7,
The reflection optical element, wherein the heat exchange member is formed in a cylindrical shape. The reflective optical element according to claim 8,
A reflective optical element, wherein a notch is formed on an inner surface of the heat exchange member. In the reflective optical element according to any one of claims 1 to 9,
The reflection optical element, wherein the heat exchange member has higher thermal conductivity than the optical member. In the reflective optical element according to any one of claims 1 to 10,
The reflection optical element, wherein the heat exchange member is made of a material having a melting point near normal temperature. In the reflective optical element according to any one of claims 1 to 11,
A reflective optical element, further comprising a support member that supports the optical member. The reflective optical element according to claim 12,
The support member is formed with a facing portion that faces the second surface and an insertion portion that opens at a position facing the heat exchange member on the facing portion side.
A reflective optical element, wherein at least a part of a portion of the heat exchange member that protrudes from the second surface toward the support member is inserted into the insertion portion. The reflective optical element according to claim 13,
The insertion portion penetrates from the facing portion to the opposite side of the facing portion in the support member,
The reflection optical element, wherein the heat exchange member is formed so as to protrude from an opening of the insertion portion formed on the support member on the opposite side of the facing portion. The reflective optical element according to claim 14,
The said insertion part is comprised so that a clearance gap may intervene between the said heat exchange members, The reflective optical element characterized by the above-mentioned. The reflective optical element according to any one of claims 1 to 15,
An optical unit comprising: a temperature adjusting mechanism that adjusts the temperature of the reflective optical element through the heat exchange member. The optical unit according to claim 16, wherein
An optical unit, further comprising a heat conductive layer disposed between the heat exchange member and the temperature adjusting mechanism and having a higher thermal conductivity than the heat exchange member. The optical unit according to claim 17,
The optical unit, wherein the heat conductive layer is made of a material having rigidity lower than that of the heat exchange member. The reflective optical element according to any one of claims 12 to 15,
A temperature adjusting mechanism for adjusting the temperature of the reflective optical element;
An optical unit comprising: a heat exchanging element disposed between the support member of the reflective optical element and the temperature adjusting mechanism and performing heat exchange with the reflective optical element via the support member. . The optical unit according to claim 19,
Heat conduction between at least one of the heat exchange element and the support member and between the heat exchange element and the temperature adjustment mechanism is made of a material having lower rigidity and higher heat transfer than the heat exchange element. An optical unit in which a layer is formed. The optical unit according to claim 19 or 20,
The heat exchange element is supported on one side of the support member and the temperature adjustment mechanism,
An optical unit, wherein a heat transfer medium having higher thermal conductivity and lower rigidity than the heat exchange member is interposed on the other side of the support member and the temperature adjusting mechanism. The optical unit according to claim 21,
The other side of the support member and the temperature adjustment mechanism is disposed below the one side of the support member and the temperature adjustment mechanism in the direction of gravity, and a concave housing in which the opening is positioned above in the direction of gravity. Have
The optical unit, wherein the heat transfer medium including a part of the heat exchange element and a heat exchange liquid is housed in the housing portion. The optical unit according to any one of claims 16 to 22,
The optical unit, wherein the reflective optical element is a fly-eye mirror in which the first surface includes a plurality of reflective surfaces. In an exposure apparatus that illuminates a mask on which a predetermined pattern is formed and exposes the predetermined pattern on a substrate,
An exposure apparatus comprising the optical unit according to any one of claims 16 to 23. In a device manufacturing method including a lithography process,
25. A device manufacturing method, wherein the lithography process uses the exposure apparatus according to claim 24.

Images