JP2012123671A - Ic tag label and method for manufacturing ic tag label - Google Patents

Abstract

An IC tag label having a simple configuration and capable of adjusting a resonance frequency of an antenna is provided.
An IC tag label includes an inlet layer and a metal layer provided on the inlet layer. Among these, the inlet layer 30 includes a base material 32, an antenna 34 provided on the base material 32 and including a loop portion 35, and an IC chip 36 mounted on the antenna 34. On the inlet layer 30, a resonance frequency adjustment region 37 is defined by a region surrounded by the loop portion 35 of the antenna 34 and the IC chip 36. The metal layer 16 is provided so as to partially overlap the resonance frequency adjustment region 37 of the antenna 34.
[Selection] Figure 3

Description

  The present invention relates to an IC tag label that can be attached to an adherend and a method for manufacturing the IC tag label.

  As a method for providing individual identification information, a method of attaching an IC tag to an individual is known. The IC tag includes an IC chip in which individual identification information is recorded. When the IC chip is read by an IC tag reader / writer without contact, the individual identification information corresponding to the IC tag is acquired. In addition, in order to affix an IC tag to an individual (adherent), an IC tag subjected to adhesive processing, that is, an IC tag label has been proposed.

  By the way, when the adherend to which the IC tag label is affixed contains a large amount of moisture, it is known that radio waves are absorbed by the moisture, thereby preventing communication between the IC tag label and the IC tag reader / writer. . In order to solve such problems, it has been proposed to provide a metal layer for shielding the influence from the outside on the IC tag label.

  For example, Patent Document 1 proposes an IC tag label in which a linear half-wavelength dipole antenna is formed on a base material, and an IC chip is mounted between left and right quarter-wavelength antennas. In the IC tag label described in Patent Document 1, a metal layer is provided on the surface of the substrate opposite to the surface on which the antenna is formed. Accordingly, even when moisture is present in the vicinity of the IC tag label, communication between the IC tag label and the IC tag reader / writer can be enabled.

  By the way, it is known that when a metal object is brought close to an IC tag label, the resonance frequency of the antenna of the IC tag label changes. If the resonance frequency of the antenna deviates from a predetermined range, the sensitivity of the antenna is deteriorated, which may make communication between the IC tag label and the IC tag reader / writer difficult. In order to solve such a problem, it is preferable that a mechanism for adjusting the resonance frequency of the antenna is provided in the IC tag label. However, the IC tag label described in Patent Document 1 is not provided with a mechanism for adjusting the resonance frequency of the antenna. For this reason, in the IC tag label described in Patent Document 1, it is considered that communication between the IC tag label and the IC tag reader / writer becomes impossible when a metal object is brought close to the IC tag label.

  Conventionally, various mechanisms have been proposed as a mechanism for adjusting the resonance frequency of the antenna. For example, Patent Document 2 proposes that when an IC tag label is attached to a metal surface, a magnetic material sheet having a thickness of about 1 mm is inserted between the metal surface and the IC tag label. Patent Document 3 proposes an IC tag label that uses a half-wavelength microstrip line resonator. In the IC tag described in Patent Document 3, the midpoint of the resonator is grounded by a grounding impedance element. In addition, the resonance frequency of the antenna can be adjusted by changing the width and length of the microstrip line of each 1/4 wavelength type antenna with respect to the ground at the midpoint of the 1/2 wavelength type microstrip line. Has been.

JP 2007-31955 A Utility Model Registration No. 3123411 JP 2000-332523 A

  In order to be able to affix the IC tag label to various adherends, it is desired to reduce the thickness of the IC tag label. On the other hand, in the IC tag label described in Patent Document 2 or 3, the above-described mechanism for adjusting the resonance frequency of the antenna has a large size and a relatively complicated mechanism. For this reason, it is difficult to reduce the thickness of the IC tag label described in Patent Document 2 or 3.

  An object of this invention is to provide the IC tag label which can solve such a subject effectively.

  The present invention provides an IC tag label including an IC chip, and an inlet layer having a base material, an antenna provided on the base material and including at least a loop portion, and an IC chip mounted on the loop portion of the antenna, A metal layer provided on the inlet layer, wherein a resonance frequency adjustment region is defined on the inlet layer by a region surrounded by the loop portion of the antenna and the IC chip, and the metal layer Is partially overlapped with the resonance frequency adjustment region of the antenna.

  In the IC tag label according to the present invention, an insulating layer may be interposed between the metal layer and the inlet layer.

  In the IC tag label according to the present invention, preferably, the thickness of the metal layer is in the range of 5 to 100 μm, and the thickness of the insulating layer is in the range of 100 to 500 μm.

  In the IC tag label according to the present invention, the antenna may consist only of the loop portion.

  In the IC tag label according to the present invention, the antenna may include a loop portion and a pair of quarter-wave antenna portions extending from the loop portion.

The present invention relates to a method of manufacturing an IC tag label including an IC chip, a base sheet, a plurality of antennas provided on the base sheet and including at least a loop portion, and an IC mounted on the loop portion of each antenna. A step of preparing an inlet sheet having a chip, a step of providing a metal sheet and a printing sheet on the inlet sheet, a step of printing predetermined information on the printing sheet, the inlet sheet, the printing sheet, and the metal Cutting out the sheet in a predetermined shape to obtain an IC tag label,
On the inlet sheet, a resonance frequency adjustment region is defined by a region surrounded by the loop portion and the IC chip of each antenna, and in the step of providing the metal sheet on the inlet sheet, the metal sheet An IC tag label manufacturing method characterized by being provided so as to partially overlap each resonance frequency adjustment region of an inlet sheet.

  The IC tag label of the present invention includes a base material, an inlet layer provided on the base material and including an antenna including at least a loop portion, and an IC chip mounted on the loop portion of the antenna, on the inlet layer. And a provided metal layer. Among these, on the inlet layer, a resonance frequency adjustment region is defined by a region surrounded by the loop portion of the antenna and the IC chip. The metal layer partially overlaps with the resonance frequency adjustment region of the antenna. For this reason, according to this invention, the IC tag label which can adjust the resonant frequency of an antenna can be provided with a simple layer structure. Thereby, according to this invention, the thickness of an IC tag label can be made smaller.

  According to the IC tag label manufacturing method of the present invention, the inlet sheet includes a base sheet, a plurality of antennas provided on the base sheet and including at least a loop portion, and an IC mounted on the loop portion of each antenna. And a chip. On the inlet sheet, a resonance frequency adjustment region is defined by a region surrounded by the loop portion of each antenna and the IC chip. The metal sheet is provided so as to partially overlap each resonance frequency adjustment region of the inlet sheet. Therefore, according to the present invention, an IC tag label sheet on which a plurality of IC tag labels capable of adjusting the resonance frequency of the antenna is formed can be provided with a simple layer configuration. Thereby, according to this invention, the thickness of an IC tag label sheet can be made smaller. For this reason, it is possible to continuously perform a printing process on the printed sheet of the IC tag label sheet, and thereby it is possible to more easily manufacture an IC tag label on which predetermined information is printed.

FIG. 1 is a perspective view showing each layer constituting an IC tag label in the first embodiment of the present invention. FIG. 2 is a longitudinal sectional view of the IC tag label of FIG. 1 as viewed from the II-II direction. FIG. 3 is a plan view showing a positional relationship between an inlet layer and a metal layer constituting the IC tag label in the first embodiment of the present invention. FIG. 4 is an enlarged view showing the periphery of the IC chip of the inlet layer shown in FIG. FIG. 5 is a diagram showing a method of manufacturing an IC tag label in the first embodiment of the present invention. 6 is a plan view showing a positional relationship between an inlet sheet and a metal sheet constituting the IC tag label sheet shown in FIG. FIG. 7 is a plan view showing an IC tag label in a modification of the first embodiment of the present invention. FIG. 8 is a longitudinal sectional view of the IC tag label shown in FIG. 7 as viewed from the VIII-VIII direction. FIG. 9 is a longitudinal sectional view showing an IC tag label according to the second embodiment of the present invention. FIG. 10 is a longitudinal sectional view showing an IC tag label in a modification of the second embodiment of the present invention. FIG. 11 is a longitudinal sectional view showing an IC tag label in another modification of the second embodiment of the present invention. FIG. 12 is a longitudinal sectional view showing an IC tag label in another modification of the second embodiment of the present invention.

  Hereinafter, a first embodiment of the present invention will be described with reference to FIGS. First, the entire IC tag label 10 in the present embodiment will be described with reference to FIGS.

IC Tag Label FIG. 1 is a perspective view showing main layers among the layers constituting the IC tag label 10. By stacking the layers shown in FIG. 1, the IC tag label 10 according to the present embodiment is formed. 2 is a longitudinal sectional view of the IC tag label 10 as seen from the II-II direction of FIG.

  As shown in FIGS. 1 and 2, the IC tag label 10 includes a printed layer 12, an inlet layer 30 provided on the printed layer 12, an insulating layer 14 provided on the inlet layer 30, and an insulating layer 14. And a metal layer 16 provided on the substrate. Among these, the inlet layer 30 was mounted on the base material 32 including the one side surface 32 a and the other side surface 32 b, the antenna 34 provided on the other side surface 32 b of the base material 32, and the antenna 34. IC chip 36. In the example shown in FIG. 2, the “other side” is the side where the adherend (not shown) to which the IC tag label 10 is attached is located, and the “one side” is the adherend to which the IC tag label 10 is attached. The IC tag reader / writer (not shown) that communicates with the IC tag label 10 when it is attached to the IC tag label 10 is located on the side.

  As shown in FIG. 2, an adhesive layer 18 for attaching the IC tag label 10 to the adherend may be provided on the other side of the IC tag label 10. In this case, as shown in FIG. 2, the adhesive layer 18 is protected by the release paper 20 until the IC tag label 10 is attached to the adherend.

In the present embodiment, the thickness of the IC tag label 10 is preferably 1 mm or less, more preferably 0.5 mm or less. Therefore, as will be described later, an IC tag label sheet on which a plurality of IC tag labels 10 are formed can be stored in a roll shape.
As will be described later, generally, the IC tag label 10 is printed with predetermined information for identifying the IC tag label 10. This printing is preferably performed continuously on an IC tag label sheet on which a plurality of IC tag labels 10 are formed. By the way, in a label printer that performs such continuous printing, the thickness of an object to be printed is generally limited. For example, in PX473 made by Phoenix, the thickness of the printing target is limited to 0.2 to 1.0 mm. Here, according to the present embodiment, as described above, the thickness of the IC tag label 10 is preferably 1 mm or less, and more preferably 0.5 mm or less. Therefore, according to the present embodiment, it is possible to continuously print on the IC tag label sheet using a general label printer. As a result, the time required for printing can be shortened compared to the case where printing is performed in a sheet-fed manner.
Hereinafter, each layer constituting the IC tag label 10 will be described in detail.

(Print layer)
The print layer 12 is a layer on which predetermined information for identifying the IC tag label 10 is printed. The material of the printing layer 12 is appropriately set according to the printing method, and for example, paper or synthetic paper is used. The specific content of the predetermined information for identifying the IC tag label 10 is not particularly limited. For example, character information for identifying the IC tag label 10 may be printed, or image information for identifying the IC tag label 10 may be printed. The thickness of the printing layer 12 is, for example, 50 μm.

(Inlet layer)
As described above, the inlet layer 30 includes the base material 32, the antenna 34 provided on the other surface 32 b of the base material 32, and the IC chip 36 mounted on the antenna 34. .

[Base material]
The base material 32 is made of an insulating material that can appropriately support the antenna 34 and the IC chip 36. For example, as the material of the base material 32, polyethylene terephthalate (PET), PET-G (terephthalic acid-cyclohexanedimethanol-ethylene glycol copolymer), polyvinyl chloride, vinyl chloride-vinyl acetate copolymer, polycarbonate, polyamide, Polyimide, cellulose diacetate, cellulose triacetate, polystyrene, ABS, polyacrylic ester, polypropylene, polyethylene, polyurene and the like can be used alone or in combination.

  The thickness of the base material 32 is set so that the thickness of the IC tag label 10 as a whole is equal to or less than a desired thickness, and the antenna 34 and the IC chip 36 are appropriately supported. ing.

[antenna]
Next, the antenna 34 will be described. The antenna 34 is designed to perform wireless communication with an IC tag reader / writer. Various bands such as a 13.56 MHz band, a microwave band (2.45 GHz), and a UHF band are conceivable as a band used for wireless communication. For example, a UHF band (860 to 960 MHz) is used.

  FIG. 3 is a plan view showing a case where the IC tag label 10 is viewed from one side (upper side in FIG. 2), and is a plan view showing only the inlet layer 30 and the metal layer 16 of the IC tag label 10 for convenience. As shown in FIG. 3, in the present embodiment, the antenna 34 includes only the loop portion 35. The material of the antenna 34 is appropriately selected so as to realize a desired band and sensitivity in communication with the IC tag reader / writer. For example, copper, aluminum, silver paste, or the like is used.

[IC chip]
Next, the IC chip 36 will be described. The IC chip 36 includes a memory for recording information on the adherend to which the IC tag label 10 is attached. Information recorded in the memory is read by the IC tag reader / writer via the antenna 34. Also, new information can be written into the memory of the IC chip 36 via the antenna 34 using an IC tag reader / writer.
Note that when information is written to the IC chip 36 before the IC tag label 10 is attached to the adherend, the IC tag reader / writer that writes information to the IC chip 36 is one side of the IC tag label 10 (FIG. 2). The IC tag label 10 may be arranged on the other side (the lower side in FIG. 2). As will be described later, the metal layer 16 is provided so as not to overlap the IC chip 36 when viewed from the normal direction of the IC tag label 10. For this reason, when writing information to the IC chip 36, even if the IC tag reader / writer is disposed on the other side of the IC tag label 10, communication between the IC chip 36 and the IC tag reader / writer is hindered by the metal layer 16. It will never be done.

  The IC chip 36 is mounted on a loop portion 35 of the antenna 34 as shown in FIG. For example, as shown in FIG. 4, both ends of the loop portion 35 are connected to terminal portions 36 a and 36 a of the IC chip 36, respectively. In this way, the loop portion 35 and the IC chip 36 form a loop-shaped region in the antenna 34.

  By the way, the resonance frequency of the antenna 34 is adjusted by partially making the loop region of the antenna 34 face the metal piece (metal layer), specifically, the resonance frequency of the antenna 34 is lowered to the low frequency side. It is known to be shifted. Hereinafter, the principle of adjusting the resonance frequency of the antenna 34 will be described.

ここで、ＩＣタグラベル１０の近傍に何らかの金属製の物体（被着体など）が近接すると、磁束を得ることができず、このため自己インダクタンスＬが小さくなる。この結果、アンテナ３４の共振周波数が高周波数側へシフトしてしまう。
一方、上述のようにアンテナ３４におけるループ状の領域を部分的に金属片（金属層）に対向させると、キャパシタＣを大きくすることができる。これによって、アンテナ３４の共振周波数を低周波数側へシフトさせることができる。
本実施の形態においては、このような現象を利用することにより、アンテナ３４の共振周波数を最適に調整することが意図されている。なお以下の記述において、ループ部３５およびＩＣチップ３６により囲まれるループ状の領域を、共振周波数調整領域３７（図３において点線で囲まれている領域）と称する。 The resonance frequency f of the antenna 34 is expressed by the following equation, where L is a self-inductance and C is a capacitor.

Here, if any metallic object (such as an adherend) is in the vicinity of the IC tag label 10, magnetic flux cannot be obtained, and the self-inductance L is reduced. As a result, the resonance frequency of the antenna 34 is shifted to the high frequency side.
On the other hand, the capacitor C can be enlarged by partially making the loop-shaped region of the antenna 34 face the metal piece (metal layer) as described above. Thereby, the resonance frequency of the antenna 34 can be shifted to the low frequency side.
In the present embodiment, it is intended to optimally adjust the resonance frequency of the antenna 34 by utilizing such a phenomenon. In the following description, a loop-shaped region surrounded by the loop portion 35 and the IC chip 36 is referred to as a resonance frequency adjustment region 37 (a region surrounded by a dotted line in FIG. 3).

  Note that the degree of increase of the capacitor C, that is, the degree of shift of the resonance frequency of the antenna 34 to the lower frequency side, is the degree of overlap between the metal piece (metal layer) and the loop-shaped region of the antenna 34, the metal It is determined according to the distance between the piece (metal layer) and the loop-shaped region of the antenna 34.

(Metal layer)
Next, the metal layer 16 will be described. As described above, the metal layer 16 is provided to adjust the resonance frequency of the antenna 34. For example, consider a case where some metallic object exists in the vicinity of the IC tag label 10 attached to the adherend. In this case, the resonance frequency of the antenna 34 shifts to the high frequency side as described above due to the influence of the metal object. If the resonance frequency of the antenna 34 deviates from a predetermined range, the sensitivity of the antenna 34 is deteriorated, which may make communication between the IC tag label 10 and the IC tag reader / writer difficult.

  Here, according to the present embodiment, as shown in FIG. 3, the metal layer 16 partially overlaps the resonance frequency adjustment region 37 of the antenna 34 when viewed from the normal direction of the IC tag label 10. Is provided. For this reason, the resonant frequency of the antenna 34 can be shifted to the low frequency side, and thereby the resonant frequency of the antenna 34 can be kept within a predetermined range. Accordingly, even when some metallic object is present in the vicinity of the IC tag label 10, the quality of communication between the IC tag label 10 and the IC tag reader / writer can be ensured.

  The degree of overlap between the metal layer 16 and the resonance frequency adjustment region 37 of the antenna 34 is not particularly limited, and is appropriately set according to the intended degree of adjustment of the resonance frequency of the antenna 34. For example, it is set according to the environment in which the IC tag label 10 is used, the characteristic of the antenna 34, and the like.

  When setting the position of the metal layer 16, it is noted that the metal layer 16 does not overlap the IC chip 36 when viewed from the normal direction of the IC tag label 10. This prevents the function of the IC chip 36 from being hindered due to the metal layer 16, for example, preventing reading / writing of the memory of the IC chip 36.

  The material of the metal layer 16 is not particularly limited as long as it has conductivity, but preferably a metal material excluding a ferromagnetic material such as iron is used. For example, copper or aluminum is used as the material of the metal layer 16. The thickness of the metal layer 16 is set so that the thickness of the IC tag label 10 as a whole is equal to or less than a desired thickness, and the metal layer 16 has an appropriate strength, but is within a range of, for example, 5 to 100 μm.

(Insulating layer)
Next, the insulating layer 14 will be described. The insulating layer 14 sets the distance and the dielectric constant between the resonance frequency adjustment region 37 of the antenna 34 and the metal layer 16, thereby adjusting the capacitor, whereby the metal layer 16 affects the resonance frequency of the antenna 34. It is for adjusting the influence. The material of the insulating layer 14 is not particularly limited as long as it is an insulating material, but a material having a high dielectric constant and flexibility is preferably used. For example, PET is used as the material of the insulating layer 14.

  The thickness of the insulating layer 14 is appropriately set according to the intended degree of adjustment of the resonance frequency of the antenna 34. For example, the thickness of the insulating layer 14 is in the range of 100 to 500 μm, and more preferably in the range of 100 to 300 μm.

(Adhesive layer)
Next, the adhesive layer 18 will be described. The adhesive layer 18 is appropriately composed of an adhesive or an adhesive so that the IC tag label 10 is adhered to the adherend. The type of adhesive or pressure-sensitive adhesive is not particularly limited, and various types of adhesives and pressure-sensitive adhesives such as a solvent type, a polymerization type, an ultraviolet curable type, an emulsion type, and a heat melting type can be used. Adhesive and adhesive resin compositions include natural rubber, nitrile rubber, epoxy resin, vinyl acetate emulsion, polyester, acrylic, acrylate copolymer, polyvinyl alcohol, phenolic resin, Various materials such as can be used. The thickness of the adhesive layer 18 is 20 μm, for example.

[Release paper]
The release paper 20 is not particularly limited. For example, a high-quality paper or a glassine paper coated with silicon is used. The thickness of the release paper 20 is, for example, 100 μm.

  Next, the operation of the present embodiment having such a configuration will be described. Here, a manufacturing method of the IC tag label 10 will be described with reference to FIGS. FIG. 5 is a diagram showing an apparatus for manufacturing an IC tag label sheet 11 in which a plurality of IC tag labels 10 are formed by laminating a plurality of sheets.

IC Tag Label Manufacturing Method First, as shown in FIG. 5, rolls each having a printed sheet 13, an inlet sheet 31, an insulating sheet 15, a metal sheet 17, and a release paper 20 are prepared. Here, the printed sheet 13, the inlet sheet 31, the insulating sheet 15, and the metal sheet 17 are cut out in a shape corresponding to the IC tag label 10, respectively, so that the printed layer 12, the inlet layer 30, the insulating layer 14, and the metal layer of the IC tag label 10 are obtained. 16 is a sheet. An adhesive layer 18 may be formed on the release paper 20 in advance.

  Next, as shown in FIG. 5, the printing sheet 13, the inlet sheet 31, the insulating sheet 15, the metal sheet 17, and the release paper 20 are laminated. For example, the printing sheet 13 is provided on one side of the inlet sheet 31, and the metal sheet 17 is provided on the other side of the inlet sheet 31 via the insulating sheet 15. A release paper 20 is provided on the other side of the metal sheet 17. Thereby, the IC tag label sheet 11 in which the printing sheet 13, the inlet sheet 31, the insulating sheet 15, the metal sheet 17, and the release paper 20 are laminated is obtained.

  FIG. 6 is a diagram showing only the inlet sheet 31, the metal sheet 17, and the release paper 20 in the IC tag label sheet 11. As shown in FIG. 6, the inlet sheet 31 is mounted on the base material sheet 33, the plurality of antennas 34 provided on the base material sheet 33, and the loop portions 35 of each antenna 34. And an antenna 34. As shown in FIG. 6, in the inlet sheet 31, the above-described resonance frequency adjustment region 37 is defined by a region surrounded by the loop portion 35 of each antenna 34 and the IC chip 36.

  The above-described process of providing the metal sheet 17 on the other side of the inlet sheet 31 via the insulating sheet 15 will be described in more detail. As shown in FIG. 6, the metal sheet 17 is provided so as to partially overlap each resonance frequency adjustment region 37 of the inlet sheet 31. In this case, the degree of overlap between each resonance frequency adjustment region 37 of the inlet sheet 31 and the metal sheet 17 is set according to the environment in which the IC tag label 10 is used, the specific characteristics of the antenna 34, and the like. This makes it possible to maintain the resonance frequency of the antenna 34 within a predetermined range even when some metallic object is present in the vicinity of the IC tag label 10. In the step of providing the metal sheet 17, it is noted that the metal sheet 17 does not overlap each IC chip 36 of the inlet sheet 31.

  Thereafter, as shown in FIG. 5, predetermined information for identifying the IC tag label 10 is printed on the printing sheet 13 of the IC tag label sheet 11 by the label printer 24. Next, the printed sheet 13, the inlet sheet 31, the insulating sheet 15, and the metal sheet 17 of the IC tag label sheet 11 are cut out in a predetermined shape corresponding to the IC tag label 10, for example, a substantially rectangular shape. Specifically, as shown in FIG. 6, a half-cut line 26 having an outline corresponding to the IC tag label 10 is formed on the IC tag label sheet 11. Such a half-cut line 26 is prepared by, for example, preparing a punching die having an outline corresponding to the IC tag label 10 and penetrating the punching die through the printing sheet 13, the inlet sheet 31, the insulating sheet 15 and the metal sheet 17. It is formed. Thereby, the IC tag label 10 cut out in a predetermined shape is obtained.

  The IC tag label sheet 11 on which the plurality of IC tag labels 10 are formed is wound up in a roll shape as shown in FIG.

  According to the present embodiment, the IC tag label 10 includes a base material 32, an antenna 34 provided on the base material 32 and including at least a loop portion 35, and an IC chip 36 mounted on the loop portion 35 of the antenna 34. And an inlet layer 30 having a metal layer 16 provided on the inlet layer 30. Among these, on the inlet layer 30, a resonance frequency adjustment region 37 is defined by a region surrounded by the loop portion 35 of the antenna 34 and the IC chip 36. The metal layer 16 partially overlaps the resonance frequency adjustment region 37 of the antenna 34. Therefore, according to the present embodiment, the IC tag label 10 that can adjust the resonance frequency of the antenna 34 can be provided with a simple layer configuration. Thereby, according to this Embodiment, the thickness of the IC tag label 10 can be made small.

  Preferably, the thickness of the IC tag label 10 is 1 mm or less as described above, and more preferably 0.5 mm or less. By reducing the thickness of the IC tag label 10 in this way, the flexibility of the IC tag label 10 can be increased, and this enables the IC tag label 10 to be attached to an adherend having various shapes. Become.

  Moreover, by reducing the thickness of the IC tag label 10, the thickness of the IC tag label sheet 11 on which the plurality of IC tag labels 10 are formed can be reduced. Thus, the printing process can be continuously performed on the printing sheet 13 of the IC tag label sheet 11, whereby the IC tag label 10 on which the predetermined information is printed can be more easily manufactured. Furthermore, it becomes possible to store the IC tag label sheet 11 on which the plurality of IC tag labels 10 are formed in a roll shape, thereby improving convenience in storage and transport.

  Further, according to the present embodiment, the insulating layer 14 is interposed between the metal layer 16 and the inlet layer 30 of the IC tag label 10. For this reason, the distance between the resonance frequency adjustment region 37 of the antenna 34 and the metal layer 16 can be arbitrarily adjusted. As a result, the influence of the metal layer 16 on the resonance frequency of the antenna 34 can be freely adjusted. That is, the resonant frequency of the antenna 34 can be adjusted by interposing the insulating layer 14 between the metal layer 16 and the inlet layer 30 of the IC tag label 10 and adjusting the thickness of the insulating layer 14.

In the present embodiment, an example in which the antenna 34 includes only the loop portion 35 has been described. However, the present invention is not limited to this, and various shapes of the antenna 34 can be used as long as the antenna 34 has a shape suitable for a desired communication band. For example, an example in which the antenna 34 is configured as a dipole antenna will be described with reference to FIGS. 7 and 8.

  FIG. 7 is a plan view showing the IC tag label 10 in the present modification, and FIG. 8 is a longitudinal sectional view of the IC tag label 10 shown in FIG. 7 viewed from the VIII-VIII direction. In FIG. 7, only the inlet layer 30 and the metal layer 16 of the IC tag label 10 are shown for convenience of explanation. In the modification shown in FIGS. 7 and 8, the same parts as those in the first embodiment shown in FIGS. 1 to 6 are denoted by the same reference numerals, and detailed description thereof is omitted.

  As shown in FIG. 7, the antenna 34 includes a loop portion 35 and a pair of quarter wavelength antenna portions 38 and 39 extending from the loop portion 35. That is, in this modification, the antenna 34 is a dipole antenna.

  Hereinafter, the metal layer 16 in this modification will be described. Also in this modification, the metal layer 16 partially overlaps the resonance frequency adjustment region 37 of the antenna 34, as in the case of the first embodiment shown in FIGS. Specifically, the metal layer 16 partially overlapping the resonance frequency adjustment region 37 on the left side of the IC chip 36, and the metal layer 16 partially overlapping the resonance frequency adjustment region 37 on the right side of the IC chip 36, , Are provided respectively. For this reason, also in this modification, the IC tag label 10 that can adjust the resonance frequency of the antenna 34 can be provided with a simple layer configuration, and thereby the thickness of the IC tag label 10 can be further reduced. it can.

  Furthermore, according to this modification, by using a dipole antenna as the antenna 34, the possible communication distance between the IC tag label 10 and the IC tag reader / writer can be further increased.

Second Embodiment Next, a second embodiment of the present invention will be described with reference to FIG. The second embodiment shown in FIG. 9 is different only in that an insulating layer is not interposed between the metal layer and the inlet layer of the IC tag label, and the other configurations are the same as those shown in FIGS. This is substantially the same as the first embodiment. In the second embodiment shown in FIG. 9, the same parts as those in the first embodiment shown in FIGS. 1 to 6 are denoted by the same reference numerals, and detailed description thereof is omitted.

  As shown in FIG. 9, the IC tag label 10 includes a printing layer 12, an inlet layer 30 provided on the printing layer 12, and a metal layer 16 provided on the inlet layer 30. Among these, the inlet layer 30 includes a base material 32, an antenna 34 including a loop portion 35 provided on the other surface 32 b of the base material 32, and an IC chip 36 mounted on the loop portion 35. is doing. The metal layer 16 is provided on one side of the base material 32 of the inlet layer 30.

  As shown in FIG. 9, in the present embodiment, no insulating layer is interposed between the metal layer 16 and the inlet layer 30. Even in this case, by providing the loop portion 35 on the other side of the base material 32 and providing the metal layer 16 on one side of the base material 32, a predetermined distance is provided between the loop portion 35 and the metal layer 16. It is secured. For this reason, the resonance frequency of the antenna 34 can be adjusted by the metal layer 16. Further, by not interposing the insulating layer between the metal layer 16 and the inlet layer 30, the thickness of the entire IC tag label 10 can be further reduced. Thereby, the flexibility of the IC tag label 10 is further increased, which makes it possible to attach the IC tag label 10 to an adherend that is curved with a small curvature radius, for example.

  In the present embodiment, the thickness of the base material 32 of the inlet layer 30 is appropriately adjusted in consideration of the influence of the metal layer 16 on the resonance frequency of the antenna 34. For example, the thickness of the base material 32 is in the range of 25 to 100 μm.

(Modification)
In the present embodiment, an example is shown in which the antenna 34 is provided on the other surface 32 b of the base material 32 and the metal layer 16 is provided on one side of the base material 32. However, the present invention is not limited to this. For example, as shown in FIG. 10, the antenna 34 may be provided on the surface 32 a on one side of the base material 32, and the metal layer 16 may be provided on the other side of the base material 32. Even in this case, a predetermined distance can be secured between the loop portion 35 and the metal layer 16, whereby the resonance frequency of the antenna 34 can be adjusted by the metal layer 16.

(Other variations)
Further, in the present embodiment shown in FIG. 9 and the modification shown in FIG. However, the present invention is not limited to this, and the antenna 34 may be configured as a dipole antenna as in the case of the modification of the first embodiment shown in FIGS. 7 and 8.

  For example, as shown in FIG. 11, the antenna 34 may include a loop portion 35 and a pair of quarter-wave antenna portions 38 and 39 provided on the other surface 32 b of the base material 32. In this case, the metal layer 16 is provided on one side of the base material 32.

  As shown in FIG. 12, the antenna 34 may be configured by a loop portion 35 and a pair of quarter-wave antenna portions 38 and 39 provided on one surface 32 a of the base material 32. In this case, the metal layer 16 is provided on the other side of the substrate 32.

DESCRIPTION OF SYMBOLS 10 IC tag label 11 IC tag label sheet 12 Print layer 13 Print sheet 14 Insulation layer 15 Insulation sheet 16 Metal layer 17 Metal sheet 18 Adhesive layer 20 Release paper 24 Label printer 26 Half cut line 30 Inlet layer 31 Inlet sheet 32 Base material 32a Base material One side surface 32b The other side surface of the base material 33 Base material sheet 34 Antenna 35 Loop part 36 IC chip 36a Terminal part 37 Resonance frequency adjustment region 38 1/4 wavelength antenna part 39 1/4 wavelength antenna part

Claims (6)

In an IC tag label including an IC chip,
An inlet layer having a base material, an antenna provided on the base material and including at least a loop portion, and an IC chip mounted on the loop portion of the antenna;
A metal layer provided on the inlet layer,
On the inlet layer, a resonance frequency adjustment region is defined by a region surrounded by the loop portion of the antenna and the IC chip,
The IC tag label, wherein the metal layer partially overlaps the resonance frequency adjustment region of the antenna.   The IC tag label according to claim 1, wherein an insulating layer is interposed between the metal layer and the inlet layer. The thickness of the metal layer is in the range of 5 to 100 μm,
The IC tag label according to claim 2, wherein the insulating layer has a thickness in a range of 100 to 500 μm.   The IC tag label according to any one of claims 1 to 3, wherein the antenna includes only the loop portion.   The IC tag label according to any one of claims 1 to 3, wherein the antenna includes a loop portion and a pair of quarter-wave antenna portions extending from the loop portion. In a method of manufacturing an IC tag label including an IC chip,
Preparing an inlet sheet having a base sheet, a plurality of antennas provided on the base sheet and including at least a loop part, and an IC chip mounted on the loop part of each antenna;
Providing a metal sheet and a printing sheet on the inlet sheet;
Printing predetermined information on the print sheet;
Cutting out the inlet sheet, the printed sheet, and the metal sheet in a predetermined shape to obtain an IC tag label, and
On the inlet sheet, a resonance frequency adjustment region is defined by a region surrounded by the loop portion and the IC chip of each antenna,
In the step of providing the metal sheet on the inlet sheet, the metal sheet is provided so as to partially overlap each resonance frequency adjustment region of the inlet sheet.

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