JP2012107968A - Piezoelectric vibrator, vibration gyro sensor and manufacturing method of the same - Google Patents

Abstract

To obtain a piezoelectric vibrator which is a small piezoelectric vibrator and is strong against an impact such as dropping.
A piezoelectric vibrator includes a piezoelectric vibration element and a package for housing the piezoelectric vibration element. The piezoelectric vibration element 1 includes a plurality of vibrating arms 9a and 9b, a base portion 5 connecting them, a piezoelectric substrate 4a provided with weight portions 9a and 9b provided at the other ends of the vibrating arms 9a and 9b, and vibrations. And excitation electrodes formed on the front and back surfaces of the arm. The package includes an insulating substrate 11 having an element mounting pad 18 and mounting terminals 16, an airtightly sealed lid 35, and weights 9 a and 9 b and a base portion 5 of the piezoelectric vibration element 4 on the upper surface of the insulating substrate 11. A cushioning material 24 made of a metal or a polymer is formed at a portion facing the tip.
[Selection] Figure 1

Description

  The present invention relates to a piezoelectric vibrator, a vibration gyro sensor, and a manufacturing method thereof.

A tuning fork type crystal resonator as a kind of piezoelectric resonator is used for a reference frequency source for a watch, an angular velocity sensor for a piezoelectric gyro device, and the like, and electronic devices and the like equipped with these are becoming smaller. Along with this, there is a demand for further downsizing and lowering the height of the piezoelectric vibrator.
Patent Document 1 discloses a piezoelectric device (piezoelectric vibrator) using a container (package) with improved impact resistance, as shown in FIG. FIG. 9 is a cross-sectional view of the piezoelectric device. The piezoelectric vibrator 100 includes a piezoelectric vibration element 130, a container body (package main body) 110 that accommodates the piezoelectric vibration element 130, and a lid body 140.

The piezoelectric vibration element (tuning fork type piezoelectric vibration element) 130 includes a piezoelectric substrate and an excitation electrode formed on the piezoelectric substrate. The piezoelectric substrate includes a base portion 132, a pair of vibrating arms 133 projecting substantially in parallel from one end edge of the base portion 132, and weight portions 135 at the tips of the vibrating arms 133. Excitation electrodes 134 for exciting the vibrating arms 133 are formed on the front and back surfaces of the vibrating arms 133.
A first recess 111 is formed near one end of the inner bottom surface of the container body (package main body) 110, and a second recess 112 is formed at the other part of the inner bottom surface. A mounting pad 122 is formed on the bottom surface of the first recess 111, and the piezoelectric vibration element 130 is bonded and fixed on the mounting pad 122 in parallel with the bottom surface of the second recess 112 via a conductive adhesive 124. .

An impact absorbing portion 120 is provided on the bottom surface of the second recess 112. The position where the shock absorbing portion 120 is disposed is a position corresponding to the weight portion 135 of the piezoelectric vibration element 130 when the piezoelectric vibration element 130 is mounted on the mounting pad 122.
As the shock absorber 120, a metal such as tungsten (W), chromium (Cr), nickel (Ni), molybdenum (Mo), or gold (Au) is used. Tungsten (W) can be easily formed by screen printing, and molybdenum (Mo), chromium (Cr), nickel (Ni), and gold (Au) can be formed by vapor deposition or sputtering. is there. The metal may have a two-layer structure.

  By providing the shock absorbing portion 120 on the bottom surface of the container body (package main body) 110, the shock absorbing portion 120 reduces the impact force when the tip of the piezoelectric vibration element 130 vibrates and collides with the bottom surface of the container body due to dropping or the like. Thus, it is disclosed that damage can be prevented and peeling of the metal of the piezoelectric vibration element 130 can be prevented.

JP 2009-290777 A

However, in the piezoelectric vibrator disclosed in Patent Document 1, the shock absorbing portion 120 is formed at a predetermined position on the bottom surface of the second recess 112 of the container body (package main body) 110, and the mounting pad 122 of the container body 110 is formed. Since the piezoelectric vibration element 130 is mounted on the piezoelectric element, the positional relationship between each shock absorbing part 120 and each weight part 135 of the piezoelectric vibration element 130 is slightly shifted, and there is a possibility that the impact force due to dropping or the like cannot be sufficiently reduced. there were.
The present invention has been made in order to solve the above-described problems. The position of each shock absorbing material that absorbs shock is accurately associated with each weight portion of the piezoelectric vibration element and the tip portion of the support arm, so that the impact force can be reduced. The object is to provide a strong piezoelectric vibrator. Similarly, to provide a vibration gyro sensor that is strong against impact force by accurately forming a cushioning material at a position facing each tip of each vibration arm for detection and each vibration arm for driving of the vibration gyro element. It is in.

  SUMMARY An advantage of some aspects of the invention is to solve at least a part of the problems described above, and the invention can be implemented as the following forms or application examples.

  Application Example 1 A piezoelectric vibrator according to the present invention is a piezoelectric vibrator including a piezoelectric vibration element and a package that houses the piezoelectric vibration element, and the piezoelectric vibration element includes a plurality of vibration arms, A base portion connected to one end of each vibrating arm and provided with a plurality of electrode pads, a weight portion formed at the other end of each vibrating arm and wider than each vibrating arm, A piezoelectric substrate having a groove formed on at least one of the front and back surfaces along the vibration center of the vibrating arm, and at least one of the front and back surfaces of each vibrating arm including the inside of each groove. And an excitation electrode electrically connected to each of the plurality of electrode pads, and the package is electrically and mechanically connected to each of the electrode pads of the piezoelectric vibration element. Insulation with device mounting pads and mounting terminals A plate and a lid for hermetically sealing the upper surface of the insulating substrate including the piezoelectric vibration element mounted on the element mounting pad, and at least each weight portion of the piezoelectric vibration element on the insulating substrate surface; Each of the piezoelectric vibrators is characterized in that a buffer material is disposed at a portion facing the tip of the base.

  Piezoelectric vibrator (tuning-fork type piezoelectric vibration) in which a buffer material is disposed on the insulating substrate surface (bottom surface of the cavity of the package body) on each portion of the piezoelectric vibration element facing the weight portion and the front portion of the base portion (support arm). When the impact force in the direction orthogonal to the insulating substrate surface is applied to the piezoelectric vibrator due to dropping or the like, the weight part of each vibrating arm of the piezoelectric vibrator and the tip part of the supporting arm of the base part Impacts the cushioning material, but the impact force is reduced by the cushioning material, and the situation where the electrode formed on the weight part is peeled off or the support arm tip part is damaged is greatly reduced. There is an effect that a child is obtained.

  Application Example 2 The piezoelectric vibrator is a piezoelectric vibrator including a piezoelectric vibration element and a package that accommodates the piezoelectric vibration element. The piezoelectric vibration element includes a plurality of vibration arms and each vibration arm. A base portion provided with a plurality of electrode pads, a weight portion formed on the other end portion of each vibrating arm and wider than each vibrating arm, and each of the vibrating arms. A piezoelectric substrate provided with a groove formed on at least one surface of the front and back surfaces along the vibration center, and formed on at least one surface of the front and back surfaces of each vibrating arm including the inside of each groove, And an excitation electrode electrically connected to each of the plurality of electrode pads, and the package is electrically and mechanically connected to each of the electrode pads of the piezoelectric vibration element in a recessed portion on an upper surface. An element mounting pad to be connected; An insulating substrate having a mounting terminal outside the depressed portion, and a lid for hermetically sealing the upper surface of the insulating substrate including the piezoelectric vibration element mounted on the element mounting pad, and the concave portion of the insulating substrate A buffer material is disposed on the inner bottom surface of the piezoelectric vibration element at portions facing the respective weight parts and the front part of the base part, and the front part of the base part of the piezoelectric vibration element is provided on the inner wall of the recessed part. The piezoelectric vibrator is characterized in that a cushioning material is disposed at each of the parts facing each other.

  A cushioning material is disposed on each part of the insulating substrate surface (bottom surface of the cavity of the package body) facing each weight part of the piezoelectric vibration element and the front part of the base part (supporting arm), and both sides inside the insulating substrate. Piezoelectric vibrators (tuning fork-type piezoelectric vibrators) each having a buffer material disposed on a portion of the wall facing the tip of the base of the piezoelectric vibration element are configured. With this configuration, when an impact force in a direction perpendicular to the insulating substrate surface is applied to the piezoelectric vibrator due to dropping or the like, the weight part of each vibrating arm of the piezoelectric vibrator and the tip part of the supporting arm of the base part are Although it impacts the shock absorber on the bottom surface, the shock force is reduced by the shock absorber, and the possibility that the electrode formed on the weight part peels off or the support arm tip part is damaged is greatly reduced. There is an effect that it is reduced. In addition, if an impact force in a direction parallel to the insulating substrate surface is applied to the piezoelectric vibrator, the support arm tip at the base of the piezoelectric vibrator may collide with the shock absorbing material on the side wall surface. There is an effect that the possibility of breakage of the support arm tip portion is greatly reduced, and the defect of the piezoelectric vibrator is greatly reduced.

  Application Example 3 In the piezoelectric vibrator, the base portion includes a base body, a connecting portion provided at a middle portion of the other end edge of the base body opposite to the vibrating arm, and the connecting portion. A pair of left and right support arms that are connected and extend away from the base body, and the cushioning material is disposed on the insulating substrate surface facing the tip of each support arm. The piezoelectric vibrator according to 1 or 2.

  The base of the piezoelectric vibration element includes a base body, a connecting portion, and a pair of left and right support arms connected via the connecting portion, so that a conductive adhesive is applied to the element mounting pad of the insulating substrate. When the piezoelectric vibration element is bonded / fixed through the base, the influence of the distortion due to the bonding / fixing is alleviated by the base structure, and the CI (crystal impedance) value of the piezoelectric vibration element is decreased, that is, the Q value is increased. There is an effect that can be done. In addition, the impact force applied to the piezoelectric vibration element is reduced.

  Application Example 4 In the piezoelectric vibrator, the buffer material is a buffer in which the buffer material is any one of silver (Ag), molybdenum (Mo), tungsten (W), chromium (Cr), and nickel (Ni). The piezoelectric vibrator according to any one of Application Examples 1 to 3, wherein the piezoelectric vibrator is a material layer or a buffer material layer made of a plurality of substances.

  If any one of Ag, Mo, W, Cr, Ni or a plurality of metals is used for the buffer material layer, and the evaporation method, sputtering method, photolithography technique and etching method are used, the buffer material can be easily formed. There is an effect that a piezoelectric vibrator strong against impact force can be obtained.

  Application Example 5 In the piezoelectric vibrator, the buffer material is a buffer material using any one of an epoxy-based, polyimide-based, and bismaleimide-based polymer material. 3. The piezoelectric vibrator according to any one of 3 above.

  A polymer material of any one of an epoxy, polyimide, and bismaleimide polymer material is applied to a predetermined region of the package body (insulating substrate) surface with a predetermined thickness, and a piezoelectric vibration element is formed using a laser device. If unnecessary polymer material is removed using the weight part and the tip of the support arm as a mask, the buffer material of the polymer material corresponding to the weight part and the tip of the support arm can be easily formed on the insulating substrate surface. Thus, there is an effect that a piezoelectric vibrator that is strong against an impact caused by dropping or the like can be obtained.

  Application Example 6 A vibration gyro sensor according to the present invention is a vibration gyro sensor including a vibration gyro element and a package that accommodates the vibration gyro element. The vibration gyro element includes a base and the base A pair of detection vibrating arms protruding on the same straight line from two opposite edges of the same, and two other opposite edges of the base in the direction perpendicular to the detection vibrating arm. A pair of first connecting arms projecting in a straight line, a pair of driving vibration arms projecting from each first connecting arm in both directions orthogonal thereto, and four corners of the base A pair of protrusions are provided so that a pair extends in the same direction as the detection vibrating arm on both sides of one of the detection vibrating arms, and the other pair detects the other on both sides of the other detection vibrating arm. Two support arms extending in the same direction as the vibrating arm Excitation electrodes formed on at least one of the pair of detection vibrating arms and each of the pair of driving vibrating arms and electrically connected to a plurality of electrode pads provided on the base. And a shock absorbing material provided on a portion of the insulating substrate surface facing a tip of each of the vibration arms for detection and each of the vibration arms for driving of the pressure vibration gyro element. It is a sensor.

  A vibration gyro sensor is provided in which a cushioning material is provided on a portion of the insulating substrate surface facing each of the detection vibration arms and the driving vibration arms of the pressure vibration gyro element. With this configuration, when an impact force in a direction perpendicular to the insulating substrate surface is applied to the piezoelectric vibrator due to dropping or the like, the detection vibration arms of the vibration gyro sensor and the tip portions of the drive vibration arms are The impact force of the shock absorber is reduced by the shock absorber, and it is reduced that the electrodes of each detection vibration arm and each drive vibration arm are peeled off or damaged. There is an effect that it can be configured.

  Application Example 7 In the vibration gyro sensor, the buffer material is a buffer made of any one of silver (Ag), molybdenum (Mo), tungsten (W), chromium (Cr), and nickel (Ni). The vibration gyro sensor according to Application Example 6, wherein the vibration gyro sensor is a material layer or a buffer material layer made of a plurality of substances.

  The buffer material layer is made of any one or a plurality of metals of silver (Ag), tungsten (W), chromium (Cr), nickel (Ni), molybdenum (Mo), vapor deposition method, sputtering method, photolithography. If the technique and the etching method are used, the buffer material 24 can be easily formed, and there is an effect that a piezoelectric vibrator strong against an impact force can be obtained.

  Application Example 8 According to Application Example 6, in the vibration gyro sensor, the buffer material is a buffer material using any one of an epoxy-based material, a polyimide-based material, and a bismaleimide-based polymer material. It is a vibration gyro sensor.

  Apply a polymer material of any one of epoxy, polyimide, and bismaleimide to a predetermined area of the package body (insulating substrate) surface, and use a laser device to make a vibration gyro sensor. If the unnecessary polymer material is removed using the detection vibration arms and the drive vibration arm tips as a mask, the detection vibration arms and the drive vibration arm tips are accurately placed on the insulating substrate surface. Corresponding polymer buffer material is easily formed, and there is an effect that a vibration gyro sensor which is strong against an impact caused by dropping or the like can be obtained.

  [Application Example 9] The method for manufacturing a piezoelectric vibrator according to any one of Application Examples 1 to 4, wherein the piezoelectric vibrator faces each of the weights before the piezoelectric vibration element is mounted on the insulating substrate. A buffer material layer forming step for forming the metal buffer material layer over the entire surface of the insulating substrate; a photoresist film forming step for forming a photoresist film on the surface of the buffer material layer; and Mounting the piezoelectric vibration element on the substrate, exposing the exposed portion of the photoresist film using the weight portions and the supporting arm tip portions as a mask, and removing the exposed portion of the photoresist film. A method of manufacturing a piezoelectric vibrator, comprising: an etching step of removing a specific portion of the buffer material layer exposed by removal by etching; and a resist film removing step of removing the resist film.

  Either the silver (Ag), tungsten (W), chromium (Cr), nickel (Ni), or molybdenum (Mo) is used on the surface of the package body (insulating substrate) of the piezoelectric vibrator by vapor deposition or sputtering. If a buffer material layer is formed using one metal or a plurality of metals, and the buffer material layer is processed by a photolithography technique and an etching technique, each weight portion of the piezoelectric vibration element on the insulating substrate surface and the tip of the support arm The cushioning material can be formed accurately and easily at the part facing the part, and there is an effect that a piezoelectric vibrator that is strong against impact caused by dropping or the like can be obtained.

  [Application Example 10] A method of manufacturing a vibration gyro sensor according to Application Example 6 or 7, wherein each of the detection vibration arms and each of the drive vibration arms is mounted before the vibration gyro element is mounted on the insulating substrate. A buffer material layer forming step of forming a buffer material layer over substantially the entire width on the insulating substrate surface facing each of the front portions, a photoresist film forming step of forming a photoresist film on the surface of the buffer material layer, An exposure step of exposing and removing the exposed portion of the photoresist film using the detection vibrating arms and the tip portions of the driving vibrating arms as a mask after mounting the vibrating gyro element on the insulating substrate. And an etching step for removing a specific portion of the buffer material layer exposed by removing the photoresist in the exposure step by etching, and a resist film removing step for removing the resist film A method of manufacturing a vibration gyro sensor, which comprises a.

  Any one of silver (Ag), tungsten (W), chromium (Cr), nickel (Ni), and molybdenum (Mo) is formed on the surface of the package body (insulating substrate) of the vibration gyro sensor using a vapor deposition method or a sputtering method. If a buffer material layer of one metal or a plurality of metals is formed and the buffer material layer is processed by using a photolithography technique and an etching technique, each vibration arm for detection and the tip of each vibration arm for driving are formed on the insulating substrate surface. It is possible to form a shock absorbing material accurately and easily at the part facing the surface, and there is an effect that a vibration gyro sensor that is strong against an impact caused by dropping or the like can be obtained.

  [Application Example 11] A method for manufacturing a piezoelectric vibrator according to any one of Application Examples 1 to 3, or 5 using a shape recognition camera, a laser device, and an information processing apparatus, wherein the piezoelectric vibrator is formed on the insulating substrate. A buffer material layer forming step of applying a buffer material layer using any one of the polymer materials over substantially the entire width of the insulating substrate surface facing each weight portion before mounting the piezoelectric vibration element; Then, after mounting the piezoelectric vibration element on the insulating substrate, the weight parts and the support arms are recognized by the shape recognition camera, and the weight parts and the weight parts and the support arms are recognized based on output information of the shape recognition camera. And a transpiration step of evaporating and removing the buffer material layer with a laser device while slightly avoiding the support arm.

  A polymer material is applied to a predetermined region of the insulating substrate surface for the piezoelectric vibrator, and the polymer material is applied using the shape recognition camera, the laser device, and the information processing device with the vibrating arm and the support arm of the piezoelectric vibration element as a mask. If processed, a buffer material made of a polymer material that accurately corresponds to the vibrating arm and the supporting arm is easily formed on the surface of the insulating substrate, and there is an effect that a piezoelectric vibrator that is strong against impact caused by dropping or the like can be obtained.

  Application Example 12 A method for manufacturing a vibration gyro sensor according to Application Example 6 or 8 using a shape recognition camera, a laser device, and an information processing device, before the vibration gyro element is mounted on the insulating substrate. And a buffer layer in which a buffer material layer using any one of the polymer materials is applied over substantially the entire width of the insulating substrate surface facing each tip of each of the detection vibrating arms and each of the driving vibrating arms. After the material layer forming step and mounting the vibrating gyro element on the insulating substrate, the shape recognizing camera recognizes the tip portions of the detecting vibrating arms and the driving vibrating arms, And a transpiration step of evaporating and removing the buffer material layer with a laser device while slightly avoiding the detection vibration arms and the drive vibration arms based on output information of the recognition camera. A method for manufacturing a piezoelectric vibrator

  A polymer material of any one of epoxy, polyimide, and bismaleimide is applied to a predetermined area on the surface of the package body (insulating substrate) of the vibration gyro sensor, and a shape recognition camera, laser device, and information Using the processing device, each detection vibrating arm of the vibrating gyro element and the tip of each driving vibrating arm as a mask, if unnecessary polymer material is removed, each vibrating arm for detection on the insulating substrate surface, and A buffer material made of a polymer material corresponding to each driving vibration arm is easily formed, and there is an effect that a piezoelectric vibrator strong against an impact caused by dropping or the like can be obtained.

It is the schematic which showed the structure of the piezoelectric vibrator which concerns on this invention, (a) is a top view, (b) is sectional drawing. It is a figure which shows electrode arrangement | positioning of a piezoelectric vibrator (tuning fork type vibrator), (a) is a top view, (b) is sectional drawing. FIG. 3 is a cross-sectional view showing a configuration of a piezoelectric vibrator according to the present invention. It is a figure which shows the structure of the piezoelectric vibrator of a 2nd Example, (a) is sectional drawing of a transversal direction, (b) is sectional drawing of a longitudinal direction. It is a figure which shows the structure of the vibration gyro sensor which concerns on this invention, (a) is a top view, (b) is sectional drawing, (c) It is explanatory drawing of operation | movement. (A)-(e) is process drawing which shows the process of forming a metal shock absorbing material. The manufacturing flowchart which forms a metal shock absorbing material. The manufacturing flowchart which forms a polymeric buffer material. Sectional drawing which shows the structure of the conventional piezoelectric vibrator.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. FIG. 1 is a schematic view showing a configuration of a piezoelectric vibrator (tuning fork type crystal vibrator) 1 according to an embodiment of the present invention. FIG. 1 (a) is a plan view with a lid removed, FIG. ) Is a cross-sectional view along PP. The piezoelectric vibrator (tuning fork type crystal vibrator) 1 generally includes a piezoelectric vibration element 4 and a package that accommodates the piezoelectric vibration element 4.
The piezoelectric vibration element 4 roughly includes a piezoelectric substrate 4a, excitation electrodes for exciting the plurality of vibrating arms 7a and 7b of the piezoelectric substrate 4a, and pad electrodes (not shown) for connection to the insulating substrate 11. ing.
The piezoelectric substrate 4a is formed on each of a plurality of vibrating arms 7a and 7b, a base portion 5 connecting one end of each vibrating arm 7a and 7b, and the other end of each vibrating arm 7a and 7b. Weight portions 9a and 9b wider than the arms, and groove portions 8a and 8b formed on at least one of the front and back surfaces along the vibration centers C of the vibrating arms 7a and 7b are provided. The outer shape of the piezoelectric substrate 4a and the groove portions 8a and 8b are formed by etching using a photolithography technique.
Excitation electrodes for exciting the plurality of vibrating arms 7a and 7b are formed on the front and back surfaces and the side surfaces of the vibrating arms 7a and 7b including the groove portions 8a and 8b, respectively, by vapor deposition or sputtering. Yes. In addition, lead electrodes are formed to electrically connect the plurality of electrode pads and the excitation electrodes.

The package includes an element mounting pad 18 electrically and mechanically connected to each electrode pad (not shown) of the piezoelectric vibration element 4, an insulating substrate (package body) 11 having a plurality of mounting terminals 16, an element A lid 35 for hermetically sealing the upper surface of the insulating substrate (package body) 11 including the piezoelectric vibration element 4 mounted on the mounting pad.
On the inner bottom surface of the recessed portion (cavity) of the insulating substrate (package main body) 11, at least a portion facing each of the weight portions 9 a and 9 b and the base portion 5 (support arms 5 d and 5 e) of the piezoelectric vibration element 4. A cushioning material 24 made of metal or polymer is disposed.
The buffer material 24 is not separated into a band-like continuum, but is separated separately because the electrodes formed on the weight parts 9a and 9b come into contact with the metal buffer material when the weight parts 9a and 9b collide with the buffer material 24. This is to prevent dielectric breakdown from occurring between the excitation electrodes formed on the vibrating arms 7a and 7b.

The base part 5 is connected to the base part body 5a, the connecting part 5b provided at the middle part of the other end of the base part 5a opposite to the vibrating arms 7a and 7b, and the base part body 5a. A support piece 5c that is spaced apart and extends orthogonally to each of the vibrating arms 7a and 7b; a pair of left and right support arms 5d and 5e that are connected to both ends of the support piece 5c and that are spaced apart from and extend in parallel with the vibrating arms 7a and 7b; It has.
The base part 5 of the piezoelectric vibration element 1 includes a base body 5a, a connecting part 5b, and a pair of left and right support arms 5d and 5e connected via the connecting part 5b. When the piezoelectric vibration element is bonded / fixed to the element mounting pad 18 via the conductive adhesive 22, the influence of distortion due to adhesion / fixation is mitigated by the structure of the base 5, and the CI (crystal impedance) of the piezoelectric vibration element 1 is reduced. There is an effect that the value can be reduced, that is, the Q value can be increased. In addition, the impact force applied to the piezoelectric vibration element 1 is also reduced.

FIG. 2 is an enlarged view of a main part showing the electrode configuration of the piezoelectric vibration element 4. 2A is a plan view showing the excitation electrodes 30 and 31, the electrodes 32a and 32b on the weight portions 9a and 9b, and the lead electrodes 33a and 33b, and FIG. FIG.
FIG. 2B is a cross-sectional view showing the arrangement of the excitation electrodes 30 and 31 formed on the vibrating arms 7a and 7b, respectively.
The excitation electrodes 30 and 31 are formed on the front and back surfaces and side surfaces of the vibrating arms 7a and 7b including the groove portions 8a and 8b, and the side surfaces of the groove portions 8a and 8b.
A voltage is applied via a plurality of electrode pads provided on the base 5 so that the polarity of the front and back electrodes of the vibrating arm 7a is different from the polarity of the front and back electrodes of the vibrating arm 7b. Similarly, a voltage is applied so that the polarity of the side electrode of the vibrating arm 7a and the polarity of the side electrode of the vibrating arm 7b are different from each other.
That is, when + voltage is applied to the front and back surfaces of the vibrating arm 7a and − voltage is applied to both side surfaces, − voltage and + voltage are applied to the front and back surfaces of the vibrating arm 7b, and the arrows in FIG. An electric field as shown is generated, and a tuning fork vibration symmetric with respect to the center line D passing through the center of gravity of the piezoelectric vibration element 4 is excited.
By forming the grooves 8a and 8b, the electric field strength is increased, and tuning fork vibration can be excited more efficiently. That is, the CI (crystal impedance) of the piezoelectric vibration element can be reduced (Q value is increased).
However, the groove portions are not necessarily formed on the front and back surfaces of the vibrating arms 7a and 7b.

3 is a QQ cross-sectional view of FIG. The package includes a package main body (insulating substrate) 11 formed in a rectangular box shape, and a lid 35 having a window member 36 made of glass or the like. The lid 35 hermetically seals a cavity (concave portion) formed on the upper surface of the package body 11.
As shown in FIG. 3, the package body (insulating substrate) 11 is formed by sequentially laminating a first substrate 12 made of an insulating material, a second substrate 13, and an annular third substrate 14. Yes. Each of the substrates 12, 13, and 14 is made of an aluminum oxide ceramic green sheet as an insulating material, and is formed by sintering them after forming them into a box shape. A plurality of mounting terminals 16 for surface mounting are formed on the outer bottom surface of the first substrate 12.
The third substrate 14 is an annular body from which the central portion is removed, and a metal seal ring 15 such as Kovar is fired around the upper periphery of the third substrate 14.
The upper surface of the second substrate 13 and the third substrate 14 form a cavity (concave portion) that accommodates the piezoelectric vibration element 4. At a predetermined position on the upper surface of the second substrate 13, a plurality of element mounting pads 18 that are electrically connected to the mounting terminals 35 by the internal conductors 17 are disposed. Further, near the one end portion of the upper surface (bottom surface of the cavity) of the second substrate 13, when the piezoelectric vibration element 4 is mounted on the element mounting pad 18, it corresponds to the tip portions of the weight portions 9a and 9b and the supporting arms 5d and 5e. A cushioning material 24 is formed at a portion to be performed.

When manufacturing the piezoelectric vibrator 1, first, an appropriate amount of a conductive adhesive 22, for example, an epoxy adhesive, a polyimide adhesive, a bismaleimide adhesive, or the like is applied on the element mounting pad 18 of the package body 11. This is applied, and the supporting arms 5d and 5e of the piezoelectric vibration element 4 are placed thereon and a load is applied.
In order to electrically connect the element mounting pad 18 in the package body 11 and the electrode pad of the piezoelectric vibration element 4, the conductive adhesive 22 is placed in a high temperature furnace at a predetermined temperature for a predetermined time. After performing the annealing treatment, the frequency adjustment electrodes formed on the weight portions 9a and 9b are irradiated with laser light from above to evaporate a part of the metal film and perform frequency rough adjustment. The lid 35 having the glass window member 36 is seam welded to the seal ring 15 formed on the upper surface of the package body 11.

Heat treatment is performed before sealing the through hole 19 on the bottom surface of the package body 11. A metal ball filler 19 a is placed on the stepped portion in the through hole 19 with the package body 11 upside down. The filler 19a is preferably a gold-germanium alloy or the like. The filler 19a is irradiated with a laser beam and melted to seal the through hole 19 and make the inside of the package vacuum.
Next, laser light is irradiated into the package from the outside of the package through the window member 36, and the frequency adjusting metal film formed on the vibrating arm is evaporated to finely adjust the frequency, whereby the piezoelectric vibrator 1 is completed.
Piezoelectric vibrator in which a buffer material 24 is disposed on a portion of the bottom surface of the cavity of the insulating substrate (package body) 11 facing the respective weight portions 9a and 9b of the piezoelectric vibration element 4 and the tip portions of the support arms 5d and 5e. (Tuning Fork Type Piezoelectric Vibrator) 1 constitutes a weight portion of each vibrating arm of the piezoelectric vibrator 1 when an impact force perpendicular to the surface of the insulating substrate 11 is applied to the piezoelectric vibrator 1 due to dropping or the like. 9a, 9b and the tip of the support arms 5d, 5e of the base 5 collide with the buffer material 24, but the impact force is reduced by the buffer material 24, and the electrodes formed on the weights 9a, 9b peel off, It is greatly reduced that the tip portions of the support arms 5d and 5e are damaged, and a piezoelectric vibrator that is strong against impact force can be obtained.

FIG. 4 is a diagram showing a configuration of the piezoelectric vibrator 2 according to the second embodiment, and a plan view thereof is substantially the same as the plan view shown in FIG. 4A is a cross-sectional view in the width direction (corresponding to PP in FIG. 1A), and FIG. 4B corresponds to the length direction (QQ in FIG. 1A). FIG. The difference from the piezoelectric vibrator 1 shown in FIG. 1 is that cushioning materials 24a are provided along the longitudinal direction on both side walls in the cavity 38a of the package body 38.
That is, when the piezoelectric vibration element 4 is mounted on the element mounting pad 18 of the package body 38 via the conductive adhesive 22, the cavity corresponding to the weight portions 9a and 9b and the front portions of the support arms 5d and 5e. Metal or polymer cushioning material 24 is disposed on the inner bottom surface of 38a, and metal or polymer cushioning material 24a is provided on the side wall surface of cavity 38a corresponding to the tip of support arms 5d and 5e. Form.
It is desirable to form the cushioning material 24a at the stage of forming the package body 38.

The cushioning material 24 is disposed on the insulating substrate surface (bottom surface of the cavity of the package body 38) at the portions facing the weight portions 9a and 9b of the piezoelectric vibration element 4 and the tip portions of the support arms 5d and 5e. At the same time, piezoelectric vibrators (tuning fork type piezoelectric vibrators) each provided with a buffer material 24a at portions facing the front portions of the supporting arms 5d and 5e (base portion 5) of the piezoelectric vibration element 4 on both side walls inside the insulating substrate. Constitute. When impact force in a direction perpendicular to the surface of the insulating substrate 38 is applied to the piezoelectric vibrator 2 due to dropping or the like, the weight portions 9a and 9b of the vibrating arms of the piezoelectric vibrator 2 and the tip portions of the support arms 5d and 5e of the base portion are moved. Although it collides with the cushioning material 24 on the bottom surface, the impact force is reduced by the cushioning material 24, and the possibility that the electrodes formed on the weight portions 9a and 9b are peeled off or the support arms 5d and 5e are damaged is greatly reduced. There is an effect that the defect of the piezoelectric vibrator is greatly reduced.
Further, when an impact force in a direction parallel to the surface of the insulating substrate 38 is applied to the piezoelectric vibrator 2, the tip portions of the support arms 5d and 5e of the piezoelectric vibrator 2 may collide with the side wall surface. The impact force is reduced, the possibility that the supporting arm tip portion is damaged is greatly reduced, and the defect of the piezoelectric vibrator is greatly reduced.

FIG. 5 is a diagram illustrating the configuration of the vibration gyro sensor 3 according to the third embodiment, with the lid removed. FIG. 5A is a plan view of the vibration gyro sensor 3, and FIG. 5B is a cross-sectional view taken along the line PP.
The vibration gyro sensor 3 generally includes a vibration gyro element 40 and a package that accommodates the vibration gyro element 40. The package includes an insulating substrate (package main body) 39 and a lid (not shown) that hermetically seals the insulating substrate 39.
The vibrating gyro element 40 has a base 41 located in the center and a central portion of two opposing edges of the base 41 (upper and lower edges 40a and 40b), respectively, protruding in the same direction and in opposite directions. A pair of detection vibrating arms 45a and 45b. Further, the vibrating gyro element 40 is the same in the direction orthogonal to the detection vibrating arms 45a and 45b and in the opposite direction from the central part of the other two opposite edges (left and right edge edges 41c and 41d) of the base 41. A pair of first connecting arms 42a and 42b projecting in a straight line, and a pair of driving members projecting in both directions orthogonal to each other from appropriate positions at the front portions of the first connecting arms 42a and 42b Vibration arms 43a, 43b and 44a, 44b.

Further, the vibrating gyro element 40 includes two pairs of support arms 46a, 46b and 47a, 47b that project from the four corners of the base portion 41 (each terminal portion of the upper and lower end edges 40a, 40b) in an L shape. . The tip of each support arm 46a, 47a extends in the same direction as the detection vibrating arm 45a on both sides of the detection vibrating arm 45a. The front portions of the support arms 46b and 47b extend in the same direction as the detection vibration arm 45b on both sides of the detection vibration arm 45b.
The excitation electrodes are formed on at least one pair of detection vibrating arms 45a and 45b and a pair of driving vibrating arms 43a and 43b and 44a and 44b, respectively. A plurality of electrode pads (not shown) are formed on the support arms 46a and 46b and 47a and 47b, and the electrode pads and the excitation electrodes are electrically connected to each other.
The vibration gyro sensor 3 has a metal on the surface of the insulating substrate 39 facing the detection vibration arms 45a and 45b of the pressure vibration gyro element 40 and the front portions of the drive vibration arms 43a and 43b and 44a and 44b. Alternatively, a buffer material made of a polymer material is provided.

FIG. 5C is a schematic plan view for explaining the operation of the vibrating gyro element. In the state where the angular velocity is not applied, the vibration gyro sensor 3 causes the vibration arms for driving 43a, 43b, 44a, 44b to bend and vibrate in the direction indicated by the arrow E. At this time, since the driving vibrating arms 43a and 43b and the driving vibrating arms 44a and 44b perform a line-symmetric vibration with respect to a straight line in the Y-axis direction passing through the center of gravity G, the base 41, the connecting arms 42a and 42b, The detection vibrating arms 45a and 45b hardly vibrate.
When an angular velocity ω about the Z axis is applied to the vibration gyro sensor 3, Coriolis force acts on the drive vibration arms 43a, 43b, 44a, 44b and the first connection arms 42a, 42b to excite new vibrations. This vibration is a vibration in the circumferential direction with respect to the center of gravity G. At the same time, the detection vibration arms 45a and 45b are excited in accordance with this vibration. A detection electrode formed on the vibrating arms for detection 45a and 45b detects the distortion generated by this vibration, and the angular velocity is obtained.

  The cushioning material 24 is placed on the surface of the insulating substrate (package body) 39 facing the detection vibration arms 45a and 45b of the pressure vibration gyro element 40 and the front portions of the drive vibration arms 43a, 43b, 44a and 44b. Provided. With this configuration, when an impact force in a direction orthogonal to the surface of the insulating substrate 39 is applied to the vibration gyro sensor 3 due to dropping or the like, the detection vibrating arms 45a and 45b of the vibration gyro sensor 3 and the driving The front ends of the vibrating arms 43a, 43b, 44a, 44b are in contact with the shock absorbing material 24, but the shock force is reduced by the shock absorbing material 24, and the detecting vibrating arms 45a, 45b and the driving vibrating arms 43a, 43b, The problem that the electrodes 44a and 44b are peeled off or damaged is reduced, and there is an effect that the vibration gyro sensor 3 that is strong against impact can be configured.

Next, a manufacturing method for forming the buffer material 24 on the package body (insulating substrate) 11 of the piezoelectric vibrator 1 will be described. 6 and FIG. 7, the buffer material 24, which is a feature of the present invention, is a kind of metal such as silver (Ag), tungsten (W), chromium (Cr), nickel (Ni), molybdenum (Mo), or the like. It is process drawing which shows the manufacturing method formed in the cavity bottom face 11a of the insulated substrate (package main body) 11 using a some metal, and a flowchart figure.
Before mounting the piezoelectric vibration element 4, as shown in FIG. 6A, each of the weights extends over almost the entire width to a portion facing the weight portions 9 a and 9 b of the cavity bottom surface 11 a of the insulating substrate (package body) 11. A buffer material layer 24 having a predetermined thickness is formed by using a vapor deposition method or a sputtering method to approximately the length of the portions 9a and 9b in the vibrating arm direction (S10). Next, a photoresist film 26 is formed on the entire surface of the buffer material layer 24 (S11).

Next, as shown in FIG. 6B, an appropriate amount of conductive adhesive 22 is applied to the element mounting pads 18 of the insulating substrate (package body) 11 on which the buffer material layer 24 and the photoresist film 26 are formed. Then, the piezoelectric vibration element 4 is mounted at a predetermined position, and the mounting is completed by applying a light weight and then curing the adhesive (S12). Next, exposure is performed by applying light from above the piezoelectric vibration element 4 using the weights 9a and 9b of the piezoelectric vibration element 4 and the tips of the support arms 5d and 5e as a photomask (S13). As shown in FIG. 6C, the exposed photoresist film 26 is removed (S14).
Next, as shown in FIG. 6D, the specific portion of the buffer material layer 24 exposed by the removal of the photoresist 26 is removed by etching (S14). As shown in FIG. 6E, by removing the remaining photoresist 26, a predetermined position of the cavity of the insulating substrate (package body) 11, that is, the weight portions 9a, 9b of the piezoelectric vibration element 4, and The cushioning material 24 can be accurately formed at a portion corresponding to the tip of the support arms 5d and 5e.

The manufacturing method for forming the buffer material 24 on the package body (insulating substrate) 11 of the piezoelectric vibrator 1 has been described above. However, the manufacturing method for forming the buffer material 24 on the package body (insulating substrate) 39 of the vibration gyro sensor 3 may also be used. Since it can be configured using the same manufacturing method as in FIGS.
That is, in the method of manufacturing the vibration gyro sensor provided with the buffer material, before mounting the vibration gyro element on the insulating substrate, the surface of the insulating substrate facing each front end of each vibration arm for detection and each vibration arm for driving is provided. A buffer material layer forming step of forming a buffer material layer over substantially the entire width, a photoresist film forming step of forming a photoresist film on the surface of the buffer material layer, and mounting the vibration gyro element on an insulating substrate. , An exposure step of exposing and removing an exposed portion of the photoresist film using the detection vibrating arms and the tip portions of the driving vibrating arms as masks, and a buffer material layer exposed by removing the photoresist in the exposure step These include an etching process for removing the specific part by etching and a resist film removing process for removing the resist film.

  Here, it should be noted that since the surface of the electrode of the piezoelectric vibration element 4 is generally made of gold (Au), a metal other than gold (Au) is used as the buffer material 24. This is to select an etching solution that does not etch the electrodes of the piezoelectric vibration element 4 when the buffer material layer 24 is etched. Further, since the hardness of the crystal is 7, it is desirable to use a buffer material having a softer hardness than the hardness 7 as the buffer material 24.

  The surface of the package body (insulating substrate) 11 of the piezoelectric vibrator 1 is made of silver (Ag), tungsten (W), chromium (Cr), nickel (Ni), molybdenum (Mo) by using a vapor deposition method or a sputtering method. If any one metal or a plurality of metals is used to form the buffer material layer 24 and the buffer material layer 24 is processed by the photolithography technique and the etching technique, each weight of the piezoelectric vibration element 1 is formed on the surface of the insulating substrate 11. The buffer material 24 can be formed accurately and easily at the portions facing the portions 9a and 9b and the tip portions of the support arms 5d and 5e, and the piezoelectric vibrator 1 that is strong against impact caused by dropping or the like can be obtained. There is.

  Any one of silver (Ag), tungsten (W), chromium (Cr), nickel (Ni), and molybdenum (Mo) is formed on the surface of the package main body (insulating substrate) 39 of the vibration gyro sensor 3 by vapor deposition or sputtering. When the buffer material layer 24 of one metal or a plurality of metals is formed and the buffer material layer 24 is processed by using a photolithography technique and an etching technique, each of the detection vibrating arms 45a, 45b, In addition, it is possible to accurately and easily form a cushioning material at a portion facing the front portion of each driving vibration arm 43a, 43b, 44a, 44b, and to obtain a vibration gyro sensor 3 that is strong against an impact caused by dropping or the like. effective.

FIG. 8 is a manufacturing flowchart in the case where the piezoelectric vibrator 1 is configured by using a polymer material such as an epoxy-based, polyimide, or bismaleimide-based polymer material for the buffer material 24.
First, before mounting the piezoelectric vibration element 4 on the insulating substrate (package main body) 11, the cavity bottom surface 11a of the insulating substrate (package main body) 11 is substantially omitted from the surface of the insulating substrate 11 facing the weights 9a and 9b. A buffer material layer 24 having a predetermined thickness is applied over the entire width so as to be about the length of each of the weight portions 9a and 9b in the vibrating arm direction (S20).
Next, an appropriate amount of conductive adhesive 22 is applied to the element mounting pad 18 of the insulating substrate (package body) 11 on which the buffer material layer 24 is formed, and the piezoelectric vibration element 4 is mounted at a predetermined position, and lightly loaded. Call (S21). Next, using a device equipped with a shape recognition camera, a laser device, and an information processing device (personal computer PC), the weight portions 9a and 9b of the piezoelectric vibration element 4 and the tip portions of the support arms 5d and 5e are used. Is captured and this information is stored in the PC (S22).
Next, based on the information stored in the PC, the weight portions 9a, 9b and the tip portions of the support arms 5d, 5e are slightly avoided to evaporate the buffer material layer 24, and the weight portions 9a, 9a, The cushioning material 24 can be accurately formed at the portions corresponding to the front portions of 9b and the support arms 5d and 5e.

In FIG. 8, the manufacturing method of the piezoelectric vibrator 1 has been described using a polymer material such as an epoxy-based, polyimide, or bismaleimide-based polymer material for the buffer material 24, but the vibration gyro sensor 3 is manufactured similarly. The method can be configured.
A polymer material of any one of epoxy, polyimide, and bismaleimide is applied to a predetermined region on the surface of the package body (insulating substrate) 11 of the piezoelectric vibrator 1, and a shape recognition camera, laser device, and If an unnecessary polymer material is removed using the weight portions 9a and 9b and the tips of the support arms 5d and 5e of the piezoelectric vibration element as a mask using an information processing apparatus (PC), the weight portion 9a is formed on the surface of the insulating substrate 11. , 9b and the tip of the support arms 5d and 5e are easily formed, and there is an effect that the piezoelectric vibrator 1 that is strong against impact force due to dropping or the like can be obtained.
A predetermined material on the surface of the package main body (insulating substrate) 39 of the vibration gyro sensor 3 is coated with any one of an epoxy, polyimide, and bismaleimide polymer material to form a shape recognition camera and laser device. And an information processing apparatus (PC), an unnecessary polymer material is formed using the detection vibrating arms 45a and 45b of the vibrating gyro element and the tip portions of the driving vibrating arms 43a, 43b, 44a and 44b as masks. If removed, the buffer material 24 of the polymer material corresponding to each of the detection vibrating arms 45a, 45b and the driving vibrating arms 43a, 43b, 44a, 44b accurately is easily formed on the surface of the insulating substrate 39, and dropped. Thus, there is an effect that the vibration gyro sensor 3 strong against the impact force due to the above or the like can be obtained.

DESCRIPTION OF SYMBOLS 1, 2 ... Piezoelectric vibrator, 3 ... Vibration gyro sensor, 4 ... Piezoelectric vibration element, 4a ... Piezoelectric substrate 5, 41 ... Base part, 5a ... Base part main body, 5b ... Connection part, 5c ... Supporting piece, 5d, 5e ... Support arm, 7a, 7b ... vibrating arm, 8a, 8b ... groove, 9a, 9b ... weight, 11, 38, 39 ... insulating substrate (package body), 12 ... first substrate, 13 ... second substrate, DESCRIPTION OF SYMBOLS 14 ... 3rd board | substrate, 15 ... Seal ring, 16 ... Mounting terminal, 17 ... Conductor, 18 ... Element mounting pad, 19 ... Through-hole 19, 19a ... Filler, 22 ... Conductive adhesive agent, 24 ... Buffer material, 30, 31 ... excitation electrodes, 32a, 32b ... weight electrodes, 33a, 33b ... lead electrodes, 35 ... lid bodies 35, 36 ... window members, 40 ... vibrating gyros, 42a, 42b ... first connecting arms, 43a, 43b, 44a, 44b ... drive vibrating arms, 45a, 4 b ... detection vibration arms, 46a, 46b, 47a, 47b ... support arm, C ... oscillation center, D ... centroids

Claims (12)

A piezoelectric vibrator comprising a piezoelectric vibration element and a package for housing the piezoelectric vibration element,
The piezoelectric vibration element includes a plurality of vibrating arms, a base portion connected to one end of each vibrating arm and a plurality of electrode pads, and formed on the other end of each vibrating arm. Each of the vibrations including the piezoelectric substrate having a wider weight part and a groove part formed on at least one of the front surface and the back surface along the vibration center of each vibration arm, and each of the vibrations including the inside of each groove part. An excitation electrode formed on at least one of the front and back surfaces of the arm and electrically connected to the plurality of electrode pads,
The package includes an element mounting pad electrically and mechanically connected to each electrode pad of the piezoelectric vibration element, an insulating substrate having a mounting terminal, and the piezoelectric vibration element mounted on the element mounting pad. A lid that hermetically seals the upper surface of the insulating substrate including:
A piezoelectric vibrator characterized in that a buffer material is disposed at least on a portion of the insulating substrate surface facing each weight portion of the piezoelectric vibration element. A piezoelectric vibrator comprising a piezoelectric vibration element and a package for housing the piezoelectric vibration element,
The piezoelectric vibration element includes a plurality of vibrating arms, a base portion connected to one end of each vibrating arm and a plurality of electrode pads, and formed on the other end of each vibrating arm. Each of the vibrations including the piezoelectric substrate having a wider weight part and a groove part formed on at least one of the front surface and the back surface along the vibration center of each vibration arm, and each of the vibrations including the inside of each groove part. An excitation electrode formed on at least one of the front and back surfaces of the arm and electrically connected to the plurality of electrode pads,
The package has an element mounting pad electrically and mechanically connected to each electrode pad of the piezoelectric vibration element in a concave portion on an upper surface, and an insulating substrate having a mounting terminal outside the concave portion, A lid that hermetically seals the upper surface of the insulating substrate including the piezoelectric vibration element mounted on the element mounting pad;
On the inner bottom surface of the recessed portion of the insulating substrate, a cushioning material is disposed at a portion facing each weight portion and the front portion of the base portion of the piezoelectric vibration element, and on the inner wall of the recessed portion, the piezoelectric vibration element A piezoelectric vibrator characterized in that a cushioning material is disposed at each of the portions facing the front portion of the base portion.   The base portion is connected to the base main body, a connecting portion provided at the other end edge intermediate portion on the opposite side of the vibrating arm of the base main body, and is connected via the connecting portion and extends away from the base main body. 3. The piezoelectric vibrator according to claim 1, further comprising: a pair of left and right support arms, wherein the cushioning material is disposed on the insulating substrate surface facing the tip of each of the support arms.   The buffer material is a buffer material layer made of any one of silver (Ag), molybdenum (Mo), tungsten (W), chromium (Cr), and nickel (Ni), or a buffer material layer made of a plurality of materials. The piezoelectric vibrator according to claim 1, wherein the piezoelectric vibrator is provided.   4. The piezoelectric vibrator according to claim 1, wherein the buffer material is a buffer material using any one of an epoxy-based, polyimide-based, and bismaleimide-based polymer material. 5. . A vibration gyro sensor comprising a vibration gyro element and a package for accommodating the vibration gyro element,
The vibrating gyro element includes a base, and a pair of detection vibrating arms protruding on the same straight line from two opposing edges of the base,
A pair of first connecting arms projecting from the other two opposite edges of the base on the same straight line in a direction orthogonal to the vibrating arm for detection, and from each of the first connecting arms A pair of drive vibrating arms each projecting in both orthogonal directions;
Projecting from the four corners of the base, a pair extends in the same direction as the detection vibrating arm on both sides of one of the detection vibrating arms, and the other pair is on both sides of the other detection vibrating arm. Two pairs of support arms extending in the same direction as the other detection vibrating arm in FIG.
Excitation electrodes formed on at least the pair of detection vibrating arms and the pair of driving vibration arms, respectively, and electrically connected to a plurality of electrode pads provided on the base. , And
A vibration gyro sensor characterized in that a buffer material is provided on a portion of the insulating substrate surface opposite to the detection vibration arm and the tip of each drive vibration arm of the pressure vibration gyro element.   The buffer material is a buffer layer made of any one of silver (Ag), molybdenum (Mo), tungsten (W), chromium (Cr), and nickel (Ni), or a buffer layer made of a plurality of materials. The vibration gyro sensor according to claim 6, wherein:   The vibration gyro sensor according to claim 6, wherein the buffer material is a buffer material using any one of an epoxy-based, polyimide-based, and bismaleimide-based polymer material. A method for manufacturing a piezoelectric vibrator according to any one of claims 1 to 4,
Before mounting the piezoelectric vibration element on the insulating substrate, a buffer material layer forming step of forming the buffer material layer over substantially the entire width on the surface of the insulating substrate facing each weight portion;
A photoresist film forming step of forming a photoresist film on the surface of the buffer material layer;
An exposure step of exposing and removing the exposed portion of the photoresist film using the respective weight portions as a mask after mounting the piezoelectric vibration element on the insulating substrate;
An etching step of removing a specific portion of the buffer material layer exposed by the removal of the photoresist by the exposure step by etching;
A resist film removing step for removing the resist film;
A method for manufacturing a piezoelectric vibrator, comprising: A method for manufacturing a vibration gyro sensor according to claim 6 or 7,
Before mounting the vibrating gyro element on the insulating substrate, a buffer material layer is formed over substantially the entire width on the insulating substrate surface facing each of the detection vibrating arms and the tip portions of the driving vibrating arms. A buffer material layer forming step,
A photoresist film forming step of forming a photoresist film on the surface of the buffer material layer;
An exposure step of exposing and removing the exposed portion of the photoresist film using the detection vibrating arms and the tip portions of the driving vibrating arms as a mask after mounting the vibrating gyro element on the insulating substrate. When,
An etching step of removing a specific portion of the buffer material layer exposed by the removal of the photoresist by the exposure step by etching;
A resist film removing step for removing the resist film;
The manufacturing method of the vibration gyro sensor characterized by including. A method of manufacturing a piezoelectric vibrator according to any one of claims 1 to 3, or 5 using a shape recognition camera, a laser device, and an information processing device,
Before mounting the piezoelectric vibration element on the insulating substrate, a buffer material layer using any one of the polymer materials is applied over substantially the entire width on the surface of the insulating substrate facing the weights. A buffer material layer forming step;
After mounting the piezoelectric vibration element on the insulating substrate, the weight parts and the supporting arms are recognized by the shape recognition camera, and the weight parts and the weights are determined based on output information of the shape recognition camera. A transpiration process of evacuating and removing the buffer material layer with a laser device while slightly avoiding the support arm;
A method for manufacturing a piezoelectric vibrator, comprising: A method for manufacturing a vibration gyro sensor according to claim 6 or 8, wherein a shape recognition camera, a laser device, and an information processing device are used.
Before mounting the vibrating gyro element on the insulating substrate, the polymeric material is formed over substantially the entire width of the insulating substrate surface facing the tip portions of the detecting vibrating arms and the driving vibrating arms. A buffer material layer forming step of applying a buffer material layer using any one of them;
After mounting the vibration gyro element on the insulating substrate, the shape recognition camera recognizes the detection vibration arms and the tip portions of the drive vibration arms, and output information of the shape recognition camera. A transpiration step of evaporating and removing the buffer material layer with a laser device while slightly avoiding the detection vibration arms and the drive vibration arms based on
A method for manufacturing a piezoelectric vibrator, comprising:

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