JP2012191019A - Method of manufacturing adhesive sheet for optical semiconductor device, and adhesive sheet for optical semiconductor device - Google Patents

Abstract

The production of an adhesive sheet for an optical semiconductor device enables high throughput, and an adhesive for an optical semiconductor device having an appropriate, uniform shape, area, and film thickness is formed on a base sheet. A method for producing an adhesive sheet for optical semiconductor devices is provided.
An optical semiconductor element 13 cut out from a wafer 12 and sorted is picked up from a base sheet 2, and the optical semiconductor element 13 is mounted on an element mounting portion 15 in an optical semiconductor device 14, and then the optical semiconductor element is mounted. A method of manufacturing an optical semiconductor device adhesive sheet 3 in which an optical semiconductor device adhesive used to cure and bond an element 13 to the element mounting portion 15 is disposed, and at least on the substrate sheet 2 An adhesive molding step for releasably molding the film-shaped adhesive for an optical semiconductor device 1; and an adhesive splitting step for dividing the molded adhesive for an optical semiconductor device 1 into an arbitrary shape.
[Selection] Figure 5

Description

  The present invention relates to a method for producing an adhesive sheet for a semiconductor device, and particularly relates to a method for producing an adhesive sheet for an optical semiconductor device.

  In the production of an optical semiconductor device, a liquid, paste-like curable adhesive (also referred to as a die bond agent) for bonding an optical semiconductor element to an element mounting portion, and a curable adhesive for sealing the optical semiconductor element from above. Agents have been used. In manufacturing an optical semiconductor device having a blue LED (light emission diode) element or an LED element that emits white light by performing wavelength conversion by light emission from an LED element having an emission wavelength equal to or less than a blue wavelength, an optical semiconductor element is used. Liquid and paste-like silicone adhesives have been used as curable adhesives for sealing from above.

  In addition, liquid and pasty silicone materials are also used as the die bond agent, and the silicone die bond agent generally has low internal stress, excellent adhesiveness, and excellent light transmittance (Patent Document 1, Patent Document 2). Specifically, in Patent Document 1, a light emitting semiconductor device is produced by potting an epoxy / silicone hybrid resin composition and curing at 180 ° C. for 1 hour. In Patent Document 2, an epoxy / silicone hybrid resin composition is prepared. The object is bonded and sealed by injecting it into a cup, cavity, package recess or the like in which a light emitting element is arranged at the bottom by a dispenser or other method and curing it by heating or the like.

  As a method of applying such a liquid, paste-like silicone die bond agent, a method of applying by stamping is generally used. Hereinafter, a method for manufacturing an optical semiconductor device by stamping a die bond agent will be described with reference to FIG. First, an optical semiconductor element 13 ′ such as an LED element is cut out in large quantities from one wafer 12 ′ by a dicer 11 ′ (Step 1 ′) and collected, but the optical semiconductor element 13 ′ has a large variation in emission wavelength. Each of the emission wavelengths is measured, and an operation called sorting is performed (step 2 ′). Next, the optical semiconductor elements 13 ′ sorted into the respective layers are bonded together on one adhesive tape 21 for each layer (Step 3 ′). Thereafter, an operation of picking up the optical semiconductor elements 13 ′ one by one from the adhesive tape 21 to which the optical semiconductor elements 13 ′ having the selected emission wavelength layer are affixed is performed (step 4-1 ′) and arranged separately. A liquid, paste-like die-bonding agent 22 is applied to the element mounting portion 15 ′ in the optical semiconductor device 14 ′ thus prepared by stamping (step 4-2 ′), and the picked-up optical semiconductor element 13 ′ is applied to the element mounting portion 15 ′. The die bonding agent 22 is cured by heating or the like, and the optical semiconductor element 13 ′ and the element mounting portion 15 ′ in the optical semiconductor device 14 ′ are cured and bonded (step 5 ′).

  However, the above method for manufacturing an optical semiconductor device has a problem that it takes time because it is necessary to stamp a die bond agent on each of the element mounting portions of the optical semiconductor device. This problem has been a problem that cannot be avoided as long as a liquid or paste die bond agent is applied and used.

Japanese Patent No. 4479883 Japanese Patent Laid-Open No. 2004-266134

  Therefore, from the viewpoint of high efficiency productivity and production cost reduction, there has been a demand for an optical semiconductor device adhesive that replaces the liquid and paste die bond agent and a method of manufacturing an optical semiconductor device using the same. As an application form of such an adhesive for optical semiconductor devices, an adhesive sheet for optical semiconductor devices in which this is disposed on a base sheet can be considered. As a result, an optical semiconductor device can be efficiently manufactured. In particular, an optical semiconductor device (also referred to as a die, a die, or a chip) such as a light emission diode (hereinafter referred to as an LED) or a laser diode (hereinafter referred to as an LD) is used as an element of the optical semiconductor device. It is considered that the work up to fixing to the mounting portion can be performed efficiently, and the productivity of manufacturing the optical semiconductor device can be improved. However, on the other hand, it has an appropriate uniform shape, area, and film thickness according to the high throughput of the production of the adhesive sheet for an optical semiconductor device itself, or the adhesion area of the optical semiconductor element to be cured and bonded to the element mounting portion. If it is difficult to form the adhesive for optical semiconductor devices on the base sheet, it will also be difficult to improve the productivity of manufacturing the optical semiconductor device.

  The present invention has been made in order to solve the above-described problem, and can produce a high-throughput production of an adhesive sheet for an optical semiconductor device that can increase the productivity of the production of an optical semiconductor device, and For an optical semiconductor device capable of forming an adhesive for an optical semiconductor device having an appropriate, uniform shape, area, and film thickness on the base sheet in accordance with the bonding area of the optical semiconductor element to be cured and bonded to the element mounting portion. It aims at providing the manufacturing method of an adhesive agent sheet.

In order to solve the above problems, in the present invention, an optical semiconductor element cut out and sorted from a wafer is picked up from a base sheet, and the optical semiconductor element is mounted on an element mounting portion in an optical semiconductor device, and then the optical semiconductor element is mounted. A method for producing an adhesive sheet for an optical semiconductor device in which an adhesive for an optical semiconductor device used for curing and bonding a semiconductor element to the element mounting portion is disposed,
At least an adhesive molding step for releasably molding the film-shaped adhesive for an optical semiconductor device on the base sheet, and an adhesive division for dividing the molded optical semiconductor device adhesive into an arbitrary shape The manufacturing method of the adhesive sheet for optical semiconductor devices characterized by having a process is provided.

  In this way, production of an optical semiconductor device is produced by dividing the adhesive for an optical semiconductor device uniformly formed on a base sheet into an arbitrary shape according to the bonding area of the optical semiconductor element to be cured and bonded. The production of the adhesive sheet for optical semiconductor devices capable of enhancing the properties can be made high-throughput, and suitable and uniform shape and area according to the adhesion area of the optical semiconductor element to be cured and adhered to the element mounting portion The adhesive for optical semiconductor devices having a film thickness can be formed on the substrate sheet.

  Moreover, it is preferable to divide | segment the shape | molded adhesive agent for optical semiconductor devices to arbitrary shapes by irradiation of a laser beam in the said adhesive agent division | segmentation process.

In this way, the adhesive for optical semiconductor devices can be easily divided by irradiation with laser light, and the side surfaces of the adhesive divided on the part irradiated with the laser light are separated, The divided adhesives for optical semiconductor devices can be easily peeled off from the base sheet. In this way, by dividing the adhesive for optical semiconductor devices by laser light irradiation, it becomes possible to further increase the throughput of the production of the adhesive sheet for optical semiconductor devices, and the optical semiconductor that is cured and bonded to the element mounting portion. An optical semiconductor device adhesive sheet manufacturing method capable of forming an optical semiconductor device adhesive having a more appropriate and more uniform shape, area, and film thickness on the base sheet in accordance with the bonding area of the element. . Any laser beam may be used as long as it can divide the adhesive for an optical semiconductor device, and a carbon dioxide laser, a YAG laser, a YVO ₄ laser, or the like is applicable.

  Furthermore, in the adhesive dividing step, it is also preferable to divide the formed adhesive for optical semiconductor devices into an arbitrary shape by a cutter blade.

  In this way, the adhesive for optical semiconductor devices can be easily divided by the cutter blade, and the side surfaces of the adhesive divided by the portion cut by the cutter blade are separated from each other, The divided adhesives for optical semiconductor devices can be easily peeled off from the base sheet. Thus, by dividing the adhesive for optical semiconductor devices by the cutter blade, it becomes possible to further increase the throughput of the production of the adhesive sheet for optical semiconductor devices, and the optical semiconductor element to be cured and bonded to the element mounting portion. It becomes the manufacturing method of the adhesive sheet for optical semiconductor devices which can form the adhesive agent for optical semiconductor devices which has a more suitable and more uniform shape, area, and film thickness according to the adhesion area on a base material sheet. Any cutter blade may be used as long as it can divide the adhesive for optical semiconductor devices, and a BIK blade (Thomson blade), a pinnacle blade, or the like can be applied.

  Moreover, in this invention, the adhesive sheet for optical semiconductor devices which has the adhesive for optical semiconductor devices manufactured by the manufacturing method of the said adhesive sheet for optical semiconductor devices divided | segmented into the said arbitrary shapes is provided.

  In such an adhesive sheet for optical semiconductor devices, since the adhesive for optical semiconductor devices divided into a plurality of arbitrary shapes is arranged on the base sheet, it is for one optical semiconductor device. A plurality of optical semiconductor elements can be attached on the adhesive sheet. In addition, the optical semiconductor element and the optical semiconductor device adhesive are both peeled off and picked up at the time of pickup, and can be directly mounted on the element mounting portion and cured and bonded via the optical semiconductor device adhesive. It becomes. Therefore, stamping of the die bond agent to the element mounting portion is not required, and the optical semiconductor device can be efficiently manufactured. In particular, for an optical semiconductor device that can efficiently perform the work until it is fixed to the element mounting portion of the optical semiconductor device. It becomes an adhesive sheet.

  As described above, according to the present invention, the production of an adhesive sheet for an optical semiconductor device that can increase the productivity of the production of an optical semiconductor device can be made high-throughput, and the element mounting portion is cured. Manufacture of an adhesive sheet for an optical semiconductor device capable of forming an adhesive for an optical semiconductor device having an appropriate and uniform shape, area and film thickness on the base sheet in accordance with the adhesive area of the optical semiconductor element to be bonded A method can be provided.

It is a top view which shows the base material sheet before the adhesive agent division | segmentation process concerning this invention, and the adhesive agent for optical semiconductor devices. It is a side view which shows the base material sheet and the adhesive agent for optical semiconductor devices before the adhesive agent division | segmentation process concerning this invention. It is a top view of the adhesive agent sheet for optical semiconductor devices manufactured by this invention. It is a side view of the adhesive agent sheet for optical semiconductor devices manufactured by this invention. (A) It is the figure which arranged and showed the manufacturing flow of the optical semiconductor device using the adhesive agent sheet for optical semiconductor devices manufactured by this invention, and the manufacturing flow of the (B) conventional optical semiconductor device.

Hereinafter, although the manufacturing method of the adhesive agent sheet for optical semiconductor devices of this invention is demonstrated in detail, this invention is not limited to these.
As described above, it is possible to increase the manufacturing throughput of the optical semiconductor device adhesive sheet itself that can increase the productivity of the optical semiconductor device manufacturing, and to match the bonding area of the optical semiconductor element that is cured and bonded to the element mounting portion. Therefore, there is a need for a method for producing an adhesive sheet for optical semiconductor devices, which can form an adhesive for optical semiconductor devices having an appropriate and uniform shape, area and film thickness on a base sheet.

  First, as a result of studying a highly efficient manufacturing method of an optical semiconductor device having an optical semiconductor element such as an LED device, the present inventors have obtained an optical semiconductor device divided into an arbitrary shape on a base sheet. If the adhesive sheet for an optical semiconductor device having the adhesive for use in a peelable state is used, the operation until the optical semiconductor element is fixed to the element mounting portion of the optical semiconductor device can be efficiently performed. It has been found that the time for stamping on the mounting portion can be reduced.

  Furthermore, the present inventors have increased the throughput of the production of the adhesive sheet for an optical semiconductor device itself, and an appropriate and uniform shape, area in accordance with the adhesion area of the optical semiconductor element to be cured and adhered to the element mounting portion, If an adhesive for an optical semiconductor device having a film thickness can be formed on a base sheet, the inventors have conceived that the production of the optical semiconductor device can be made more efficient, and earnestly studied in order to achieve this problem. As a result, the present invention was completed by finding that the adhesive for an optical semiconductor device uniformly formed on the base sheet was divided into arbitrary shapes according to the adhesive area of the optical semiconductor element to be cured and bonded. .

That is, in the present invention, an optical semiconductor element cut out from a wafer and sorted is picked up from a base sheet, and the optical semiconductor element is mounted on an element mounting portion in an optical semiconductor device, and then the optical semiconductor element is inserted into the element. A method for producing an adhesive sheet for an optical semiconductor device in which an adhesive for an optical semiconductor device used for curing and bonding to an attachment portion is disposed,
At least an adhesive molding step for releasably molding the film-shaped adhesive for an optical semiconductor device on the base sheet, and an adhesive division for dividing the molded optical semiconductor device adhesive into an arbitrary shape The manufacturing method of the adhesive sheet for optical semiconductor devices characterized by having a process is provided. The present invention will be described in detail below.

[Optical semiconductor device]
The optical semiconductor element in the present invention is an optical semiconductor element cut out from a wafer and sorted, and is not particularly limited as long as it is generally handled as an optical semiconductor element, and examples thereof include LEDs and LDs. . Such optical semiconductor elements generally have large variations in light quantity, emission wavelength, etc., as a particular problem. For this reason, a sorting operation is performed in which the layers are classified for each emission wavelength and the like before being fixed to the optical semiconductor device. Since the sorting is performed by measuring the emission wavelength of each optical semiconductor element, the optical semiconductor element after sorting usually needs to be attached to an adhesive sheet or the like for each layer. In that respect, the optical semiconductor device according to the present invention is an optical semiconductor device in which the adhesive for an optical semiconductor device according to the present invention is attached to the surface to be bonded to the element mounting portion after being cut out from the wafer and sorted. After being mounted on the inner element mounting portion, it is cured and bonded to the element mounting portion by the optical semiconductor device adhesive according to the present invention. Accordingly, in the step of pasting the sorted optical semiconductor element to the adhesive for optical semiconductor devices on the base sheet, the sorted optical semiconductor element is stuck to each layer, and the adhesive for optical semiconductor devices It is possible to simultaneously press and paste the.

[Base material sheet]
The substrate sheet in the present invention is particularly suitable if the adhesive for optical semiconductor devices according to the present invention is disposed thereon and the adhesive for optical semiconductor devices according to the present invention can be peeled from the adhesive. There are no restrictions. As such a base sheet, for example, a PET separator in which a release agent is coated on a PET film can be used. The optical semiconductor element cut out from the wafer and sorted is affixed to the divided adhesive for an optical semiconductor device arranged on the base sheet, picked up from the base sheet, and within the optical semiconductor device. It is mounted on the element mounting part. At this time, since the base material sheet is one from which the adhesive for optical semiconductor devices in the present invention can be peeled off, the adhesive for optical semiconductor devices is integrated with the picked-up optical semiconductor element from above the base material sheet. Peel off and pick up.

[Element mounting part in optical semiconductor device]
The element mounting portion in the optical semiconductor device according to the present invention is a portion on which the optical semiconductor element is mounted.

[Adhesive for optical semiconductor devices]
An adhesive for an optical semiconductor device according to the present invention is an adhesive for an optical semiconductor device used for curing and bonding the optical semiconductor element to an element mounting portion in the optical semiconductor device, and is formed into a film shape. It is arrange | positioned on the said base material sheet, and can peel from the said base material sheet. Therefore, first, the optical semiconductor element cut out from the wafer and sorted is attached to an adhesive for an optical semiconductor device that is disposed on the base sheet and formed into a film (attaching step). Furthermore, the adhesive for optical semiconductor devices is peeled off from the substrate sheet and picked up together with the optical semiconductor element picked up (pickup process). Thereafter, in the step of mounting the optical semiconductor element on the element mounting portion and curing and bonding, the optical semiconductor element is mounted on the element mounting portion and cured and bonded via the adhesive for an optical semiconductor device according to the present invention ( Die bonding process). Thereby, according to the adhesive sheet for optical semiconductor devices having the adhesive for optical semiconductor devices, the optical semiconductor element can be cured and bonded without stamping the die bonding agent to the element mounting portion, and the element mounting portion of the optical semiconductor device It is possible to efficiently perform the work up to fixing to the optical semiconductor device, and to increase the productivity of manufacturing the optical semiconductor device.

-Film-like adhesive for optical semiconductor devices The adhesive for optical semiconductor devices according to the present invention is formed into a film shape. Therefore, it is easy to form on a base material sheet and to peel easily. In addition, since the optical semiconductor element can be attached with a film of an adhesive for an optical semiconductor device having a uniform shape, area and thickness, the quality of the optical semiconductor device after curing and bonding is kept constant. It is. According to the adhesive molding process and the adhesive dividing process of the present invention, the optical semiconductor device adhesion having an appropriate uniform shape, area, and film thickness according to the adhesion area of the optical semiconductor element to be cured and adhered to the element mounting portion. The agent can be formed on the base sheet.

  Moreover, the adhesive for optical semiconductor devices concerning this invention is shape | molded by the film form, and the thickness has the preferable range of 1 micrometer or more and 150 micrometers or less, and it is especially preferable that they are 3 micrometers or more and 100 micrometers or less. If the thickness is 1 μm or more, it is preferable because sufficient adhesive strength can be obtained after curing. If the thickness is 150 μm or less, the optical semiconductor device to which the optical semiconductor element is cured and bonded can be prevented from becoming too thick. preferable.

-The adhesive for optical semiconductor devices arrange | positioned on the said base material sheet The adhesive agent for optical semiconductor devices concerning this invention is arrange | positioned on the said base material sheet. Therefore, after being cut out from the wafer, the optical semiconductor elements sorted according to the light amount, emission wavelength, etc. can be individually attached to the adhesive for optical semiconductor devices arranged on the base sheet for each layer. .

-Adhesive for optical semiconductor devices that can be peeled off from the base sheet The adhesive for optical semiconductor devices according to the present invention can be peeled off from the base sheet. Therefore, the adhesive for optical semiconductor devices is peeled off from the substrate sheet and picked up together with the picked optical semiconductor element. Thereafter, in the die bonding step, the optical semiconductor element is mounted on the element mounting portion via the optical semiconductor device adhesive in the present invention and cured and bonded. As described above, according to the adhesive sheet for an optical semiconductor device manufactured according to the present invention, the optical semiconductor element can be cured and bonded without stamping a die bond agent to the element mounting portion, and fixed to the element mounting portion of the optical semiconductor device. The operations up to this can be performed efficiently, and the productivity of manufacturing the optical semiconductor device can be increased.

  Although it does not specifically limit as a shaping | molding method of the adhesive agent for optical semiconductor devices, It can carry out by coating and heat-drying a curable silicone composition.

[Adhesive sheet for optical semiconductor devices]
The adhesive sheet for optical semiconductor devices manufactured by this invention arranges the adhesive agent for optical semiconductor devices divided | segmented into the said some arbitrary shape on the said base material sheet. FIG. 3 illustrates a top view of the adhesive sheet for optical semiconductor devices according to the present invention, and FIG. 4 illustrates a side view. As described above, the adhesive sheet 3 for optical semiconductor devices according to the present invention is obtained by arranging the adhesive 1 for optical semiconductor devices divided into a plurality of film-like shapes on the base sheet 2. is there.

  The optical semiconductor elements cut out from the wafer and sorted are individually attached to the adhesive for optical semiconductor devices divided into a plurality of arbitrary shapes of the adhesive sheet for optical semiconductor devices (attaching step). Therefore, a plurality of optical semiconductor elements are bonded on one adhesive sheet for an optical semiconductor device. Further, at the time of picking up the optical semiconductor element, the adhesive for the optical semiconductor device is peeled off from the base sheet together with the optical semiconductor element and picked up (pickup process). Thereafter, in the step of mounting the optical semiconductor element on the element mounting part and curing and bonding, the optical semiconductor element is mounted on the element mounting part and cured and bonded via the adhesive for optical semiconductor devices in the present invention (die bonding). Process). Thereby, according to the adhesive sheet for optical semiconductor devices manufactured according to the present invention, the optical semiconductor element can be cured and bonded without stamping the die bonding agent on the element mounting portion, and fixed to the element mounting portion of the optical semiconductor device. The operations up to this can be performed efficiently, and the productivity of manufacturing the optical semiconductor device can be increased.

  In this case, when the optical semiconductor element is sorted (by layer) after being cut out from the wafer according to the amount of light, emission wavelength, or the like, the optical semiconductor element having a specific layer is the same adhesive for an optical semiconductor device. It can also be set as the usage form which affixes on a sheet | seat, and affixes the optical semiconductor element which has a layer different from a specific layer on the adhesive agent sheet for different optical semiconductor devices. As a result, an adhesive sheet for an optical semiconductor device in which an optical semiconductor element for each layer is attached can be obtained. Thus, the optical semiconductor device adhesive sheet to which the specific layer of the optical semiconductor element is bonded can be placed on the die bonder as it is, and the optical semiconductor elements having the specific layer can be collectively bonded to the element mounting portion. Such usage is preferable from the viewpoint of productivity.

[Method for producing adhesive sheet for optical semiconductor device]
According to the present invention, an optical semiconductor element cut out from a wafer and sorted is picked up from a base sheet, and the optical semiconductor element is mounted on an element mounting portion in an optical semiconductor device. A method of manufacturing an optical semiconductor device adhesive sheet in which an optical semiconductor device adhesive used for curing and bonding is disposed,
At least an adhesive molding step for releasably molding the film-shaped adhesive for an optical semiconductor device on the base sheet, and an adhesive division for dividing the molded optical semiconductor device adhesive into an arbitrary shape The manufacturing method of the adhesive sheet for optical semiconductor devices characterized by having a process is provided.

(Adhesive molding process)
The adhesive forming step according to the present invention is a step of forming a film-like adhesive for an optical semiconductor device on a substrate sheet so as to be peelable. Although not particularly limited, the optical semiconductor device adhesive molded in this step can be in a semi-cured state. By making the adhesive for optical semiconductor devices into a semi-cured state, it is easy to divide into any shape in the subsequent adhesive splitting process, more suitable and more uniform according to the adhesive area of the optical semiconductor element to be cured and bonded to the element mounting part It is preferable because an adhesive for optical semiconductor devices having an appropriate shape, area, and film thickness can be easily formed on a substrate sheet.

  FIG. 1 illustrates a top view of the base material sheet and the adhesive for an optical semiconductor device before the adhesive dividing step, and FIG. 2 illustrates a side view. As described above, the optical semiconductor device adhesive sheet 3 ′ before the adhesive dividing step is obtained by forming the film-shaped optical semiconductor device adhesive 1 ′ on the base sheet 2 ′. In the adhesive forming step, an adhesive for an optical semiconductor device having an area corresponding to a plurality of optical semiconductor elements can be formed.

(Adhesive splitting process)
The adhesive dividing step according to the present invention is a step of dividing the formed optical semiconductor device adhesive into an arbitrary shape. In the adhesive dividing step, it is preferable to divide the formed adhesive for optical semiconductor devices into an arbitrary shape by laser light irradiation.

In this way, the adhesive for optical semiconductor devices can be easily divided by irradiation with laser light, and the side surfaces of the adhesive divided on the part irradiated with the laser light are separated, The divided adhesives for optical semiconductor devices can be easily peeled off from the base sheet. In this way, by dividing the adhesive for optical semiconductor devices by laser light irradiation, it becomes possible to further increase the throughput of the production of the adhesive sheet for optical semiconductor devices, and the optical semiconductor that is cured and bonded to the element mounting portion. Manufacture of an adhesive sheet for an optical semiconductor device capable of forming a divided adhesive for an optical semiconductor device having a more appropriate and more uniform shape, area, and film thickness on the base sheet in accordance with the bonding area of the element Become a method. Any laser beam may be used as long as it can divide the adhesive for an optical semiconductor device, and a carbon dioxide laser, a YAG laser, a YVO ₄ laser, or the like is applicable.

  Furthermore, it is also preferable to divide the molded adhesive for optical semiconductor devices into an arbitrary shape by a cutter blade.

  In this way, the adhesive for optical semiconductor devices can be easily divided by the cutter blade, and the side surfaces of the adhesive divided by the portion cut by the cutter blade are separated from each other, The divided adhesives for optical semiconductor devices can be easily peeled off from the base sheet. Thus, by dividing the adhesive for optical semiconductor devices by the cutter blade, it becomes possible to further increase the throughput of the production of the adhesive sheet for optical semiconductor devices, and the optical semiconductor element to be cured and bonded to the element mounting portion. A method for producing an adhesive sheet for an optical semiconductor device, which can form a divided adhesive for an optical semiconductor device having a more suitable and more uniform shape, area, and film thickness according to the adhesive area on a base sheet, and Become. Any cutter blade may be used as long as it can divide the adhesive for optical semiconductor devices, and a BIK blade (Thomson blade), a pinnacle blade, or the like can be applied.

  FIG. 3 illustrates a top view of an adhesive sheet for an optical semiconductor device manufactured according to the present invention, and FIG. 4 illustrates a side view. As described above, the adhesive sheet 3 for an optical semiconductor device manufactured according to the present invention has an adhesive 1 for an optical semiconductor device 1 divided into a plurality of film-like arbitrary shapes arranged on the base sheet 2. It will be a thing. In particular, when divided by laser light irradiation and a cutter blade, the width of the adhesive for an optical semiconductor device can be narrowed, so that the sheet surface can be used more efficiently. Further, as the optical semiconductor element becomes smaller and the viscosity of the optical semiconductor device adhesive increases, another method, for example, screen printing or the like, has a uniform shape, area, and film thickness on the base sheet. However, according to the method of the present invention in which an adhesive for an optical semiconductor device is molded and then divided by laser light irradiation and a cutter blade, etc., a uniform shape, area, and film thickness can be accurately obtained. The adhesive for optical semiconductor devices which has can be formed on a base material sheet.

[Method for Manufacturing Optical Semiconductor Device]
Hereinafter, a method of manufacturing an optical semiconductor device by using an adhesive sheet for an optical semiconductor device manufactured according to the present invention to cure and bond an optical semiconductor element cut out from a wafer and sorted to an element mounting portion in the optical semiconductor device. It illustrates about.

  As a comparison, first, a conventional method for manufacturing an optical semiconductor device using a liquid, paste-like die bond agent will be described with reference to FIG. FIG. 5B shows a flowchart of a conventional method for manufacturing an optical semiconductor device. First, an optical semiconductor element 13 'such as an LED element is cut out from the wafer 12' by the dicer 11 '(step 1'). Since the cut out optical semiconductor element 13 ′ has a large variation in light quantity, emission wavelength, etc., the emission wavelength is measured, sorted (by layer) (step 2 ′), and the optical semiconductor element 13 ′ sorted in each layer is An affixing process (process 3 ′) to be affixed on the adhesive sheet 21 for each layer is performed. Subsequently, a pick-up step (step 4-1 ′) for picking up the attached optical semiconductor element 13 ′ from the adhesive sheet 21 of the selected light emission wavelength layer is performed, and at the same time, an optical semiconductor device 14 ′ arranged separately. The die bonding agent 22 is applied to the inner element mounting portion 15 ′ by stamping (step 4-2 ′), and the picked-up optical semiconductor element 13 ′ is mounted on the element mounting portion 15 ′ via the die bonding agent 22. A die-bonding step (step 5 ′) is performed in which is cured and bonded. However, as described above, the optical semiconductor device manufacturing method has a problem that it takes time to stamp the die bond agent (step 4-2 ′). This problem uses a liquid, paste-like die bond agent. It was a problem that could not be avoided. Therefore, there has been a demand for an optical semiconductor device adhesive that replaces a liquid, paste-like die bond agent and a method of manufacturing an optical semiconductor device using the same.

  If the adhesive sheet for optical semiconductor devices manufactured by this invention is used, the said problem can be avoided and productivity of manufacture of an optical semiconductor device can be improved. One embodiment of a method for manufacturing an optical semiconductor device using the adhesive sheet for an optical semiconductor device manufactured according to the present invention will be described with reference to FIG. FIG. 5A shows a flowchart of a method for manufacturing an optical semiconductor device using the adhesive sheet for optical semiconductor devices. First, an optical semiconductor element 13 such as an LED element is cut out from the wafer 12 by the dicer 11 (step 1). Since the cut out optical semiconductor element 13 has a large variation in light quantity, emission wavelength, and the like, the emission wavelength is measured and sorted (step 2). In this case, when sorting (by layer), an optical semiconductor element having a specific layer is attached to the same adhesive sheet for an optical semiconductor device, and an optical semiconductor element having a layer different from the specific layer is different from the optical semiconductor device. It can also be affixed to an adhesive sheet. In that case, in the subsequent process, the adhesive sheet for optical semiconductor device to which the optical semiconductor element of the specific layer is bonded is directly installed on the die bonder, and the optical semiconductor elements having the specific layer are collectively bonded to the element mounting portion. This is preferable.

(Attaching process)
The optical semiconductor element 13 sorted into each layer is attached to the optical semiconductor device adhesive 1 divided into an arbitrary film-like shape disposed on the base sheet 2 for each layer (step 3). ) Is done. By this affixing process, it is possible to simultaneously affix the sorted optical semiconductor element and affix the adhesive for the optical semiconductor device to the optical semiconductor element.

  Prior to this attaching step, the film-like adhesive for an optical semiconductor device can be in a semi-cured state. Although the method to make a semi-hardened state is not specifically limited, Performing using a hot-air circulation type oven is illustrated. Although it does not specifically limit as temperature dried using a hot-air circulation type oven, 40 to 150 degreeC is preferable and 40 to 140 degreeC is more preferable. If the temperature is 40 ° C. or higher, it is possible to suppress an increase in the time required for curing, and if the temperature is less than 150 ° C., it is preferable because the curing speed is too high to completely cure. Moreover, as time to dry using a hot-air circulation type oven, 10 second or more and less than 2 hours are preferable, and 10 second or more and 1 hour and a half or less are more preferable. If the time is 10 seconds or more, the optical semiconductor element can be satisfactorily attached (crimped), and the optical semiconductor element and the film-like adhesive for an optical semiconductor device can be easily picked up together. Moreover, since it can suppress that it hardens | cures completely if time is less than 2 hours, it is preferable.

(Pickup process)
Subsequently, in the adhesive sheet 3 for an optical semiconductor device having the selected emission wavelength layer, the pasted optical semiconductor element 13 is peeled from the base sheet 2 together with the adhesive 1 for an optical semiconductor device. Then, a pickup process (step 4) for picking up is performed, whereby the optical semiconductor element 13 to which the film-like adhesive 1 for optical semiconductor devices is bonded is picked up.

(Die bond process)
The optical semiconductor element 13 thus picked up is mounted so that the film-like adhesive 1 for an optical semiconductor device adheres to the element mounting portion 15 of the optical semiconductor device 14, and the film-like adhesive 1 for an optical semiconductor device is attached. A die bonding step (step 5) is performed in which the optical semiconductor element 13 is cured and bonded to the optical semiconductor device 14 by curing. Thereby, the work up to fixing the optical semiconductor element to the element mounting portion of the optical semiconductor device can be efficiently performed without stamping the die bond agent, and the light that can increase the productivity of manufacturing the optical semiconductor device. A method for manufacturing a semiconductor device is provided.

  EXAMPLES Hereinafter, although the Example and comparative example of the manufacturing method of the adhesive agent sheet for optical semiconductor devices of this invention are shown and this invention is demonstrated in detail, this invention is not limited to these.

[Method for producing adhesive sheet for optical semiconductor device]
Example 1
KER-3000-M4 (manufactured by Shin-Etsu Chemical Co., Ltd.), which is a curable silicone composition, as an adhesive molding composition for optical semiconductor devices, PET separator as a base sheet, FL2-01, 38 μm (Takaline Corporation) And a coating machine by blade coating (also referred to as knife coating) using PET separator, FL1-01, 38 μm (manufactured by Takaline Corporation) as a cover sheet. Laser irradiation was performed using a CO ₂ laser marker, ML-Z9550T (manufactured by Keyence Corporation).

[Adhesive molding process]
Using these, a solution-form composition for forming an adhesive for an optical semiconductor device is uniformly coated on a base sheet, and the PET separator is continuously bonded together with an optical semiconductor device in a hot air circulation oven at 110 ° C. By drying the agent for 120 seconds, a 30-μm thick semi-cured film-like adhesive for an optical semiconductor device was formed on the substrate sheet so as to be peelable. A cover sheet was affixed to the surface of this film-like adhesive for optical semiconductor devices.

[Adhesive splitting process]
The cover sheet is peeled off, laser light is irradiated at a laser power of 70% and a scanning speed of 900 mm / s, and a semi-cured film-like adhesive for an optical semiconductor device formed on a base sheet is formed into an arbitrary shape. It divided | segmented and the adhesive sheet for optical semiconductor devices manufactured by the manufacturing method of the adhesive sheet for optical semiconductor devices of this invention was obtained. In Example 1, the adhesive for optical semiconductor devices was divided into a 1 mm × 1 mm square shape. The semi-cured film-like adhesive for an optical semiconductor device was removed from the irradiated portion of the laser beam.

  The adhesive sheet for optical semiconductor devices manufactured as described in Example 1 is obtained by arranging a plurality of divided adhesives for optical semiconductor devices. Moreover, the adhesive agent for optical semiconductor devices divided | segmented on the base material sheet is shape | molded in the film form, is arrange | positioned on the said base material sheet, and can peel from the said base material sheet.

(Example 2)
Moreover, as Example 2, it carried out similarly to Example 1 except having dried for 90 second in a 120 degreeC hot-air circulation oven at the time of the coating of the said adhesive agent formation process, and the adhesive sheet for optical semiconductor devices of this invention The adhesive sheet for optical semiconductor devices manufactured by this manufacturing method was obtained.

(Example 3)
Further, as Example 3, the adhesive sheet for optical semiconductor devices of the present invention was carried out in the same manner as in Example 1 except that it was dried in a hot air circulation oven at 100 ° C. for 240 seconds at the time of coating in the adhesive molding step. The adhesive sheet for optical semiconductor devices manufactured by this manufacturing method was obtained.

Example 4
Moreover, as Example 4, it carries out similarly to Example 1 until the time of the coating of the said adhesive agent formation process, and peels a cover sheet | seat in an adhesive division | segmentation process, uses a big blade for a cutting machine and a cutter blade, The semi-cured film-like adhesive for optical semiconductor devices formed on the material sheet was divided into arbitrary shapes. Specifically, using a big blade that can form a 1 mm × 1 mm square shape by cutting four times, the cutting machine feed amount is 1 mm, and the feed speed is 2 m / min. The adhesive sheet for optical semiconductor devices manufactured by the manufacturing method of the adhesive sheet for optical semiconductor devices was obtained. In the portion of the adhesive for optical semiconductor device cut by the cutter blade, the adjacent adhesive for optical semiconductor device was separated.

(Comparative Example 1)
Further, as Comparative Example 1, an adhesive sheet for an optical semiconductor device was produced by screen printing without performing the adhesive molding step and the adhesive dividing step. KER-3000-M4 (manufactured by Shin-Etsu Chemical Co., Ltd.) which is a curable silicone composition as an adhesive molding composition for optical semiconductor devices, PET separator, PET # 38x-41-3035, 38 μm (stock) (Takaline Corporation), 10 screens with 10 1mm x 1mm square openings arranged as a screen plate, 100 screens with a total of 100 openings regularly arranged at intervals of 0.5mm, screen printing machine A screen printer manufactured by Mino Group was used.

  Using these, 100 adhesives for an optical semiconductor device were arranged on a base sheet by screen printing at a squeegee angle of 70 °, a squeegee speed of 300 mm / sec, and a clearance amount of 1 mm. Thereafter, the adhesive for an optical semiconductor device printed together with the PET separator in a hot air circulation oven at 120 ° C. is dried for 120 seconds, whereby a semi-cured adhesive for an optical semiconductor device is disposed on the PET separator. Thus obtained optical semiconductor device adhesive sheet was obtained. This adhesive for optical semiconductor devices has a square shape of 1 mm × 1 mm.

  As described above, in Examples 1 to 4, the adhesive for the optical semiconductor device is molded and dried in a semi-cured state in the adhesive molding step, and then the adhesive is divided. In Comparative Example 1, light is obtained by screen printing. After placing the adhesive for semiconductor device, it is dried to a semi-cured state. That is, in Examples 1 to 4, a semi-cured adhesive having a certain shape can be divided in accordance with the adhesion area of the optical semiconductor element, so that the adhesive for an optical semiconductor device having an appropriate uniform shape, area, and film thickness can be obtained. The adhesive can be formed on the base sheet, whereas in Comparative Example 1, the adhesive is in an uncured state with an unstable shape, and then cured, so the shape, area, and film thickness of the adhesive Tends to be uneven. Actually, when the adhesive sheet for optical semiconductor devices produced in Examples 1 to 4 and Comparative Example 1 was visually confirmed, the adhesive for optical semiconductor devices produced in Examples 1 to 4 rather than Comparative Example 1 was used. The adhesive sheet had a more uniform shape, area and film thickness.

  Further, in Comparative Example 1, when the viscosity of the adhesive is high, the squeegee speed may be inevitably lowered, and the throughput is lowered. In particular, when the adhesive has a high viscosity and the optical semiconductor element is small, the throughput is significantly reduced, making it difficult to meet the demand for downsizing. Further, when the distance between the openings of the screen plate is too narrow, the throughput may be lowered due to the cause that the adhesives for optical semiconductor devices adjoin each other. On the other hand, according to Examples 1 to 4 of the present invention, as in Comparative Example 1, the influence of the decrease in throughput derived from the viscosity of the adhesive, the small size of the optical semiconductor element, the interval between the openings of the screen plate, and the like. Therefore, it is possible to increase the throughput of the production of the adhesive sheet for optical semiconductor devices. Next, the adhesive strength of the adhesive sheet for optical semiconductor devices manufactured according to the present invention and the manufacturing efficiency compared with the case of using a conventional die bond agent were evaluated.

[Evaluation of adhesive strength and production efficiency]
Using the adhesive sheet for optical semiconductor devices obtained in Example 1, the adhesive strength of the optical semiconductor element was evaluated. A blue LED element having an adhesive area of 1 mm × 1 mm was pressure-bonded to the film-shaped adhesive for an optical semiconductor device, and then lifted while holding the element with tweezers. The adhesive for the optical semiconductor device was removed from the PET separator. It was easy to peel off. At this time, the film-like adhesive for an optical semiconductor device was picked up together with the optical semiconductor element while being adhered cleanly to one surface of the element (surface to be bonded to the element mounting portion). Thereafter, this film-like optical semiconductor element with an adhesive for optical semiconductor devices was pressure-bonded so as to adhere to a silver-plated copper plate (corresponding to the element mounting portion) via the adhesive for film-like optical semiconductor devices. Thereafter, it was heated and cured in a hot air circulating oven at 150 ° C. for 2 hours to be cured and adhered. The shear bond strength after curing and bonding was 4.0 MPa. The shear bond strength was measured using a strength tester (manufactured by Daisy). The production efficiency was 1/5 when the time required when using a paste-like die bonding agent described later was designated as production efficiency 1.

[Production Comparative Example of Optical Semiconductor Device Using Paste Die Bonding Agent]
For comparison with the adhesive sheet for optical semiconductor devices prepared in Example 1, the manufacturing efficiency of the conventional method for manufacturing an optical semiconductor device using a paste-like die bond agent is the same as that of Example 1. -Assessed by Assembly Technology Co., Ltd. 100 blue LED elements of 1 mm × 1 mm were pressure-bonded and fixed on an adhesive film ELP V-8S (manufactured by Nitto Denko Corporation) and placed on a die bonder to perform die bonding. Stamping of the die bond agent took time, and the manufacturing time (manufacturing efficiency 1) was five times longer than the time for using the adhesive sheet for optical semiconductor devices. The shear bond strength after curing and bonding was 4.0 MPa.

  Similarly, the adhesive strength and production efficiency of the adhesive sheet optical semiconductor elements for optical semiconductor devices obtained in Examples 2 to 4 were evaluated. The results of Examples 1 to 4 are summarized in Table 1.

  Thus, in the comparative example of manufacturing an optical semiconductor device according to the conventional method that does not use the adhesive sheet for an optical semiconductor device manufactured by the manufacturing method of the present invention, stamping of the die bond agent is necessary, and the optical semiconductor device according to the present invention The manufacturing time (manufacturing efficiency 1) was five times longer than the manufacturing time of the optical semiconductor device using the adhesive. On the other hand, when an optical semiconductor device is manufactured using the adhesive sheet for an optical semiconductor device manufactured according to Examples 1 to 4 of the present invention, stamping of a die bond agent can be omitted, and a paste-like die bond It has become clear that an optical semiconductor device can be manufactured in a manufacturing time of 1/5 (manufacturing efficiency 1/5) as compared with the case where an agent is used. Thereby, the adhesive sheet for an optical semiconductor device according to the present invention can efficiently perform the work until the optical semiconductor element is fixed to the element mounting portion of the optical semiconductor device, and the productivity of manufacturing the optical semiconductor device can be increased. It became clear that it could be increased.

  As described above, according to the present invention, the production of an adhesive sheet for an optical semiconductor device that can increase the productivity of the production of an optical semiconductor device can be made high-throughput, and the element mounting portion is cured. Manufacture of an adhesive sheet for an optical semiconductor device capable of forming an adhesive for an optical semiconductor device having an appropriate and uniform shape, area and film thickness on the base sheet in accordance with the adhesive area of the optical semiconductor element to be bonded A method can be provided.

  The present invention is not limited to the above embodiment. The above-described embodiment is an exemplification, and the present invention has any configuration that has substantially the same configuration as the technical idea described in the claims of the present invention and that exhibits the same effects. Are included in the technical scope.

DESCRIPTION OF SYMBOLS 1 ... Adhesive for optical semiconductor devices, 1 '... Adhesive for optical semiconductor devices before an adhesive division | segmentation process, 2, 2' ... Base material sheet, 3 ... Adhesive sheet for optical semiconductor devices, 3 '... Adhesive division | segmentation Pre-process adhesive sheet for optical semiconductor device, 11, 11 '... Dicer, 12, 12' ... Wafer, 13, 13 '... Optical semiconductor element, 14, 14' ... Optical semiconductor device, 15, 15 '..., element Mounting part, 21 ... Adhesive sheet, 22 ... Die bond agent

Claims (4)

The optical semiconductor element cut out from the wafer and sorted is picked up from the base sheet, the optical semiconductor element is mounted on the element mounting portion in the optical semiconductor device, and then the optical semiconductor element is cured and bonded to the element mounting portion. A method of manufacturing an optical semiconductor device adhesive sheet in which an optical semiconductor device adhesive to be used is disposed,
At least an adhesive molding step for releasably molding the film-shaped adhesive for an optical semiconductor device on the base sheet, and an adhesive division for dividing the molded optical semiconductor device adhesive into an arbitrary shape The manufacturing method of the adhesive agent sheet for optical semiconductor devices characterized by having a process.   2. The production of an adhesive sheet for optical semiconductor devices according to claim 1, wherein, in the adhesive dividing step, the molded adhesive for optical semiconductor devices is divided into arbitrary shapes by irradiation with laser light. Method.   2. The method for producing an adhesive sheet for an optical semiconductor device according to claim 1, wherein in the adhesive dividing step, the molded adhesive for an optical semiconductor device is divided into an arbitrary shape by a cutter blade. It is manufactured with the manufacturing method of the adhesive sheet for optical semiconductor devices of any one of Claim 1 thru | or 3, and has the adhesive agent for optical semiconductor devices divided | segmented into the said arbitrary shapes. An adhesive sheet for optical semiconductor devices.

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