JP2012186285A - Through-hole substrate, through wiring board, electronic component, manufacturing method of substrate, and inspection method of through hole - Google Patents

Abstract

Provided are a through-hole substrate, a through-wiring substrate, an electronic component, a substrate manufacturing method, and a through-hole inspection method that can confirm the state in the through-hole.
(1) A through-hole substrate in which a through-hole 4 is formed from one surface 1a to the other surface 1b of a substrate 1 and a conductive pattern 2 is disposed to cover an opening 5 of the through-hole 4 on the one surface 1a. A through-hole substrate, wherein the conductive pattern 2 is formed with a cutout 3 through which the through-hole 4 can be observed from the side 1a. (2) In the cutout 3, the edge of the opening 5 can be observed.
[Selection] Figure 2

Description

  The present invention relates to a through-hole substrate, a through-wiring substrate, an electronic component, a substrate manufacturing method, and a through-hole inspection method.

  As a conventional technique, there is disclosed a through wiring substrate including an electrode pad arranged on one surface of the substrate and a through wiring that penetrates from one surface of the substrate to the other surface and is electrically connected to the electrode pad ( Patent Document 1). The through wiring is formed by forming a through hole from the other surface of the substrate toward the electrode pad and filling the inside of the through hole with a conductive substance.

Japanese Patent Laid-Open No. 4-133472

  In recent years, with further miniaturization of semiconductor devices, the size of the through wiring in the substrate has also been miniaturized. Along with this, the diameter of the opening where the through hole opens on the surface of the substrate is also reduced. As a general method for manufacturing a semiconductor device, there is a method in which a surface wiring is provided on one surface of a substrate, a through hole is formed from the other surface of the substrate to one surface, and a conductive material is disposed in the through hole. Usually, an electrode pad formed of a surface wiring made of a metal thin film is formed at least one size larger than the opening of the through hole, so that the opening is completely covered by the electrode pad. For this reason, when the electrode pad is optically observed from one surface side of the substrate, there is a problem that it is not possible to confirm that the conductive material is arranged in the fine hole and that the electrode pad and the through wiring are connected. is there.

  The present invention has been made in view of the above circumstances, and it is an object to provide a through-hole substrate, a through-wiring substrate, an electronic component, a substrate manufacturing method, and a through-hole inspection method that can easily check the state in the through-hole. And

The through hole substrate according to claim 1 of the present invention is a through hole substrate in which a through hole is formed from one surface of the substrate to the other surface, and a conductive pattern covering the opening of the through hole on the one surface is disposed. The conductive pattern is formed with a cutout through which the through hole can be observed from the one surface side.
In this configuration, a through-hole is formed from one surface, which is the two main surfaces of the substrate, to the other surface, and a conductive pattern is provided to cover an opening where the through-hole opens on one surface. And since the cutout which can visually recognize the inside of a through-hole is formed in this conductive pattern, the state in a through-hole can be easily observed by optically observing a conductive pattern from the one surface side of a board | substrate.

The through hole substrate according to claim 2 of the present invention is characterized in that, in claim 1, the edge of the opening can be observed in the cutout.
According to this configuration, by observing the edge of the opening, it is possible to observe the state in the through hole through the cutout, and whether the edge of the opening that is liable to cause poor formation of the through hole is formed as designed. Can be inspected.

The through hole substrate according to claim 3 of the present invention is characterized in that, in claim 2, the cutout is formed so as to include at least both ends of a line segment connecting the diameters of the openings.
According to this configuration, by observing both ends of the diameter of the opening through the cutout, it is possible to observe the state in the through hole, and whether the edge of the opening that is likely to cause poor formation of the through hole is formed as designed. Whether the size and position of the opening are as designed.

According to a fourth aspect of the present invention, in the through hole substrate according to any one of the first to third aspects, the conductive pattern has two or more cutouts.
According to this configuration, since the inside of the through hole can be observed through two or more cutouts, the state in the through hole can be observed in more detail.

A through-wiring board according to claim 5 of the present invention uses the through-hole board according to any one of claims 1 to 4 to form a through-wiring inside the through-hole of the through-hole board. It is characterized by.
According to this configuration, the conductive substance disposed in the through hole can be observed through the cutout. Thereby, it is possible to inspect whether or not the through wiring is defective.

An electronic component according to a sixth aspect of the present invention is an electronic component cut out from the through wiring board according to the fifth aspect, and includes at least one through hole.
According to this configuration, since the cutout is formed in the conductive pattern, the state in the through hole can be observed through the cutout.

The method for manufacturing a substrate according to claim 7 of the present invention includes a step A1 of disposing a conductive pattern on one surface side of the substrate, a step A2 of disposing a translucent support layer on the conductive pattern, Forming a through hole from one surface to the other surface, and forming a cutout in the conductive pattern in the step A1, and forming an opening in which the through hole opens on the one surface in the step A3. In addition to being formed directly below the conductive pattern, a part of the opening is formed through the cutout so as to be observable from above the support layer.
According to this configuration, after step A3, the inside of the through hole formed in the substrate can be observed to inspect for the presence or absence of defects such as poor formation of the through hole. Thereby, the quality of a through-hole board | substrate can be grasped | ascertained easily.

The substrate manufacturing method according to an eighth aspect of the present invention is the method according to the seventh aspect, further comprising a step A4 of inspecting the inside of the through hole from one surface side of the substrate after the step A3. And
According to this configuration, after step A3, the inside of the through hole formed in the substrate can be observed to inspect for the presence or absence of defects such as poor formation of the through hole. Thereby, while being able to grasp | ascertain the quality of a through-hole board | substrate easily, a defective through-hole board | substrate can be sorted out easily.

  According to a ninth aspect of the present invention, in the method for manufacturing a substrate according to the ninth aspect, the inner wall of the through hole formed in the step A3 and the lower surface of the conductive pattern exposed in the through hole are formed with an insulating layer. After the coating, the method has a step A4 of inspecting the inside of the through hole from one surface side of the substrate.

A method for manufacturing a substrate according to a tenth aspect of the present invention is the method for manufacturing a substrate according to any one of the seventh to ninth aspects, wherein a step A5 of forming a through-wiring inside the through-hole is performed, It has process A6 which test | inspects the inside of the said through-hole.
According to this configuration, after step A5, the conductive substance disposed in the through hole formed in the substrate can be observed to inspect for the presence or absence of defects such as poor formation of the through wiring. As a result, the quality of the through wiring board can be easily grasped, and defective through wiring boards can be easily selected.

The through-hole inspection method according to claim 11 of the present invention is the through-hole substrate according to claims 1 to 4, the through-wiring substrate according to claim 5, or the electronic component according to claim 6. The inside of the through hole is examined through the cutout from one side.
Thereby, while being able to grasp | ascertain the quality of a through-hole board | substrate, a through-wiring board, and an electronic component easily, a defective product can be sorted out easily.

According to the through hole substrate of the present invention, since the cutout is arranged in the conductive pattern, the state in the through hole can be easily inspected through the cutout.
According to the through wiring board of the present invention, since the cutout is arranged in the conductive pattern, the state of the conductive substance arranged inside the through hole can be inspected through the cutout. Thereby, the state of the through wiring formed in the through hole can be easily inspected.
According to the electronic component of the present invention, the state of the through wiring formed in the through hole can be easily inspected.
According to the substrate manufacturing method of the present invention, since the state of the through hole or the state of the through wiring can be easily inspected, the quality of the through hole substrate and the through wiring substrate can be easily grasped.
According to the through-hole inspection method of the present invention, it is possible to easily inspect the state of the through-hole or the through-wiring constituting the through-hole substrate, the through-wiring substrate, and the electronic component. Thereby, the quality of the through hole substrate, the through wiring substrate, and the electronic component can be easily grasped.

It is a schematic diagram which shows the external shape of the through-hole board | substrate 10 concerning this invention. It is a schematic diagram of the upper surface (a) and the cross section (b) around the opening 5 of the through-hole substrate 10A according to the present invention. It is a schematic diagram of the upper surface (a) and the cross section (b) around the opening 5 of the through-hole substrate 10B according to the present invention. It is a schematic diagram of the upper surface (a) and the cross section (b) around the opening 5 of the through-hole substrate 10C according to the present invention. It is a schematic diagram of the upper surface (a) and the cross section (b) around the opening 5 of the through-hole substrate 10D according to the present invention. It is a schematic diagram of the upper surface (a) and the cross section (b) around the opening 5 of the through-hole substrate 10E according to the present invention. It is a schematic diagram of the upper surface (a) and the cross section (b) around the opening 5 of the through-hole substrate 10F according to the present invention. It is a schematic diagram of the upper surface (a) and the cross section (b) around the opening 5 of the through-hole substrate 10G according to the present invention. It is a schematic diagram of the upper surface (a) and the cross section (b) around the opening 5 of the through-hole substrate 10H according to the present invention. 2 is a schematic diagram of an upper surface (a) and a cross section (b) around an opening 105 of a through-hole substrate 100. FIG. It is a schematic diagram of the upper surface (a) and the cross section (b) around the opening 5 of the through wiring board 20A according to the present invention. It is a schematic diagram of the upper surface (a) and the cross section (b) around the opening 5 of the through wiring board 20B according to the present invention. It is a schematic diagram of the cross section of 30 A of electronic components concerning this invention. It is a schematic diagram of the upper surface (a) and the cross section (b) around the opening 5 of the electronic component 30A according to the present invention. It is typical sectional drawing which shows the manufacturing method of the board | substrate concerning this invention.

  The present invention will be described below based on preferred embodiments with reference to the drawings.

<< Through-hole substrate >>
The through-hole substrate according to the present invention is a wafer substrate before cutting out an electronic component 30 described later. The outline of the through-hole substrate 10 as an example is shown in FIG.
In the through hole substrate according to the present invention, a through hole is formed from one surface to the other surface, and a conductive pattern covering the opening of the through hole on the one surface is disposed. That is, a through hole is formed so as to connect one surface and the other surface of the substrate, and a conductive pattern is arranged on an opening where the through hole opens on the one surface. The conductive pattern has a cutout through which the through hole can be observed from the one surface side.

<First aspect of through-hole substrate>
As a first embodiment of the through hole substrate according to the present invention, an enlarged view of the through hole of the through hole substrate 10A is shown in FIG. FIG. 2A is a view of the opening 5 of the through hole 4 as viewed from the one surface 1 a side of the substrate 1. FIG. 2B is a cross-sectional view including the diameter of the opening 5.

The through hole 4 is formed from one surface 1 a to the other surface 1 b of the substrate 1. Moreover, the conductive pattern 2 which covers the opening part 5 of the through-hole 4 in the one surface 1a is arranged. The electrode pad made of the conductive pattern 2 is formed with a cutout 3 through which the through hole 4 can be optically observed from the side 1a.
A first insulating layer 7 is formed on one surface 1a of the substrate 1, and a conductive pattern 2 is disposed thereon. A second insulating layer 6 is formed on the inner wall of the through hole 4. The conductive pattern 2 may constitute an electrode pad and may constitute wiring (surface wiring) on the one surface 1a. The wiring may electrically connect a plurality of electrode pads formed on one surface 1a.

  Since the cutout 3 is formed in the electrode pad, the state in the through hole 4 can be observed through the cutout 3 when the electrode pad is optically observed from the one surface 1 a side of the substrate 1. As a result, it can be confirmed whether or not the through hole 4 is formed as designed, and when a defect such as a positional shift or etching residue of the formed through hole 4 is found, the use of the through hole substrate is stopped. It can be determined whether or not.

  In general, when the through-hole 4 is formed in the wafer substrate 1, a single lithography mask is used for a wide range including a plurality of electronic components 30 to be formed later. For this reason, if the through-holes 4 are formed on the wafer substrate 1 with the position of the lithography mask shifted, all the through-holes 4 are formed in a misaligned state. Therefore, when examining the presence or absence of positional deviation of the through-holes 4 formed in the substrate 1, only the at least two through-holes 4 should be inspected for the presence or absence of positional deviation. For this reason, in the through-hole board | substrate 10 of this invention, the conductive pattern 2 in which the cutout 3 was formed should just be distribute | arranged to the at least two of the through-holes 4 formed. Further, as the distance between the conductive patterns 2 in which the cutouts 3 are formed is larger, more accurate information such as the direction of misalignment and the width of misalignment can be obtained.

  On the other hand, when inspecting the etching residue instead of the positional deviation, it is necessary to inspect at least one through hole 4. Therefore, at least one conductive pattern 2 in which the cutout 3 is formed is provided in the through-hole substrate 10. It is even better if a plurality of conductive patterns 2 in which the cutouts 3 are formed are arranged. It is even better if the conductive pattern 2 in which the cutouts 3 are formed is provided for all the through holes 4. That is, the more conductive patterns 2 in which the cutouts 3 are formed, the more through-holes can be inspected, and information such as the frequency of occurrence of defects and the distribution in the substrate surface can be obtained more accurately. be able to.

The material of the substrate 1 (wafer substrate) constituting the through-hole substrate 10 is not particularly limited, and examples thereof include a semiconductor substrate such as silicon, a glass substrate such as quartz and Pyrex (registered trademark), a sapphire substrate, and a resin substrate.
When the substrate 1 is a semiconductor substrate, an insulating layer (oxide film) is usually disposed on the substrate surface. For example, an oxide film made of SiO ₂ may be disposed on the substrate surface of the silicon substrate 1. On the other hand, when the substrate 1 is an insulating substrate such as a glass substrate, an insulating layer is not necessary.

  In the through hole substrate 10 </ b> A of the first embodiment shown in FIG. 2, the first insulating layer 7 is not drawn in the opening 5 in the region of the rectangular cutout 3. This is because the first insulating layer 7 is removed when the through hole 4 and the opening 5 are formed. In the cutout 3 according to the present invention, the first insulating layer 7 covering the opening 5 may be present or absent. Usually, since the first insulating layer 7 is light transmissive, the inside of the through hole 4 can be observed through the cutout 3 from the one surface 1a side regardless of the presence or absence thereof.

As the material of the conductive pattern 2 disposed on the one surface 1a, a transparent conductive film can be applied, but the conductive pattern 2 made of a metal layer is preferable.
For the metal layer, a well-known metal used as an electrode pad or a wiring can be applied. Examples thereof include copper (Cu), aluminum (Al), and an alloy mainly composed of aluminum (Al). As the electrode pad and the wiring, a metal layer formed by sputtering or plating and patterned by, for example, etching or damascene can be used.

  The shape of the cutout 3 is not particularly limited as long as the inside of the through hole 4 can be observed, and examples thereof include a rectangle, an ellipse, a circle, a star, a crescent, an arc, and various polygons.

  The area of the cutout 3 is preferably 1 to 60%, more preferably 5 to 40%, and even more preferably 10 to 30% of the area of the opening 5. It is easier to observe the inside of the through hole 4 if it is above the lower limit value of the above range, and if it is below the upper limit value of the above range, both solder bumps and wire bonding are formed on the electrode pad. The electrical connection can be more reliably taken.

  The position where the cutout 3 is arranged is not particularly limited as long as it is on the position where the inside of the through-hole 4 can be observed, that is, on the opening 5. For example, the positions of the cutouts 3 in the second to eighth modes shown below are exemplified. it can.

In the through hole substrate 10B of the second mode shown in FIG. 3, the rectangular cutout 3 is formed immediately above the opening 5 so that the edge of the opening 5 can be observed.
According to this configuration, by observing the edge of the opening 5, it is possible to observe the state in the through hole 4 through the cutout 3, and whether or not the edge of the opening 5 that is likely to cause etching residue is formed as designed. Can be inspected.

In the through hole substrate 10 </ b> C of the third aspect shown in FIG. 4, the arcuate cutout 3 is formed immediately above the opening 5 so as to include at least both ends of a line segment connecting the diameter of the opening 5. A first insulating layer 7 is disposed in the cutout 3 of the conductive pattern 2.
According to this configuration, by observing both ends of the diameter of the opening 5 through the cutout 3 and the first insulating layer 7, the state in the through hole 4 can be observed, and the edge of the opening 5 where etching residue is likely to occur. It can be inspected whether or not is formed as designed, and further, it can be inspected that the size and position of the opening 5 are as designed.

  In the drawing of the present invention (for example, FIG. 4), the second insulating layer 6 is exaggerated and thickly shown to show the presence of the second insulating layer 6 formed on the inner wall of the through hole 4. Since the second insulating layer 6 actually formed is a thin layer (several microns) and is a translucent layer, when the inside of the through hole 4 is observed through the cutout 3 from one surface 1a of the substrate, The second insulating layer 6 does not hinder.

In the through hole substrate 10D of the fourth aspect shown in FIG. 5, the rectangular first cutout 3a (3) and the second cutout 3b (3) have at least both ends of a line segment connecting the diameters of the openings 5. It is formed immediately above the opening 5 so as to include it. A first insulating layer 7 is disposed in the cutouts 3 a and 3 b of the conductive pattern 2.
According to this configuration, by observing both ends of the diameter of the opening 5 through the first cutout 3 a and the second cutout 3 b and the first insulating layer 7, the state in the through hole 4 through each cutout 3. It is possible to inspect whether or not the edge of the opening 5 where etching residue is likely to occur is formed as designed, and further, it is possible to inspect that the size and position of the opening 5 are as designed.
Further, according to this configuration, since the two cutouts 3a and 3b can be used, observation in the through hole 4 is further facilitated.

In the through-hole substrate 10E of the fifth aspect shown in FIG. 6, the arc-shaped first cutout 3a (3), second cutout 3b (3), third cutout 3c (3), and fourth cutout 3d (3) is respectively formed immediately above the opening 5 so as to include at least both ends of a line segment connecting the diameter of the opening 5. A first insulating layer 7 is disposed in the cutouts 3 a, 3 b, 3 c, 3 d of the conductive pattern 2.
According to this configuration, by observing both ends of the diameter of the opening 5 through the first cutout 3 a to the fourth cutout 3 d and the first insulating layer 7, the state in the through hole 4 through each cutout 3. It is possible to inspect whether or not the edge of the opening 5 where etching residue is likely to occur is formed as designed, and further, it is possible to inspect that the size and position of the opening 5 are as designed.
In addition, according to this configuration, since the four cutouts 3a, 3b, 3c, and 3d can be used, observation in the through hole 4 is further facilitated.

In the through hole substrate 10F of the sixth aspect shown in FIG. 7, the rectangular first cutout 3a (3), second cutout 3b (3), third cutout 3c (3), and fourth cutout 3d (3) is respectively formed immediately above the opening 5 so as to include at least both ends of a line segment connecting the diameter of the opening 5. A first insulating layer 7 is disposed in the cutouts 3 a, 3 b, 3 c, 3 d of the conductive pattern 2.
According to this configuration, by observing both ends of the diameter of the opening 5 through the first cutout 3 a to the fourth cutout 3 d and the first insulating layer 7, the state in the through hole 4 through each cutout 3. It is possible to inspect whether or not the edge of the opening 5 where etching residue is likely to occur is formed as designed, and further, it is possible to inspect that the size and position of the opening 5 are as designed.
In addition, according to this configuration, since the four cutouts 3a, 3b, 3c, and 3d can be used, observation in the through hole 4 is further facilitated.

In the through hole substrate 10G of the seventh aspect shown in FIG. 8, the electrode pads made of the conductive pattern 2 are the first conductive pattern 2a (2), the second conductive pattern 2b (2), and the third conductive pattern. It consists of three layers 2c (2). Since the layers are electrically connected by vias, when wire bonding or solder bumps are provided on the uppermost conductive pattern 2c, they are also electrically connected to the lowermost conductive pattern 2a. A rectangular first cutout 3 a (3) and a second cutout 3 b (3) are formed at the same position on the electrode pad formed of the conductive patterns 2 a, 2 b, 2 c. These cutouts are respectively formed immediately above the opening 5 so as to include at least both ends of a line segment connecting the diameter of the opening 5. A first insulating layer 7 is disposed in the cutouts 3 a and 3 b of each conductive pattern 2.
According to this configuration, by observing both ends of the diameter of the opening 5 through the first cutout 3 a to the fourth cutout 3 d and the first insulating layer 7, the state in the through hole 4 through each cutout 3. It is possible to inspect whether or not the edge of the opening 5 where etching residue is likely to occur is formed as designed, and further, it is possible to inspect that the size and position of the opening 5 are as designed.
Further, according to this configuration, since the two cutouts 3a and 3b can be used, observation in the through hole 4 is further facilitated.

In the through hole substrate 10H of the eighth aspect shown in FIG. 9, the T-shaped first cutout 3a (3) and the second cutout 3b (3) are at least both ends of the line segment connecting the diameters of the openings 5 Is formed immediately above the opening 5. A first insulating layer 7 is disposed in the cutouts 3 a and 3 b of the conductive pattern 2.
According to this configuration, by observing both ends of the diameter of the opening 5 through the first cutout 3 a and the second cutout 3 b and the first insulating layer 7, the state in the through hole 4 through each cutout 3. It is possible to inspect whether or not the edge of the opening 5 where etching residue is likely to occur is formed as designed, and further, it is possible to inspect that the size and position of the opening 5 are as designed.
Further, according to this configuration, since the two cutouts 3a and 3b can be used, observation in the through hole 4 is further facilitated.

As exemplified in the through-hole substrate 10H, the shape of the cutout in the present invention may be a closed shape (a shape that is completely surrounded by a conductive pattern) or an open shape (the periphery is conductive). The shape may be partially surrounded by a pattern).
When the shape of the cutout according to the present invention is the open shape, the ratio of the periphery of the cutout surrounded by the conductive pattern (peripheral length in which the cutout is actually surrounded by the conductive pattern ÷ the cutout is a closed shape) Assuming that the surrounding length surrounded by the conductive pattern is 100%, 20 to 99% is preferable, 40 to 90% is preferable, and 60 to 80% is more preferable. Within this range, when the electrode pad is electrically connected to an external connection terminal such as a solder bump or wire bonding, the effective area of the electrode pad is small and there is a risk of adversely affecting the electrical connection. Almost no.

  In the through hole substrate 100 shown in FIG. 10, the electrode pad made of the conductive pattern 102 is not cut out. The area of the electrode pad made of the conductive pattern 102 is smaller than that of the opening 105. For this reason, in order to mount external connection terminals, such as wire bonding and a solder bump, on this electrode pad, a highly accurate operation | work is required and there exists a possibility that those electrical connections may not be performed appropriately.

Therefore, the area of the electrode pad formed of the conductive pattern 2 in the present invention is preferably 100 to 500%, more preferably 120 to 400%, and further preferably 150 to 300 of the area of the opening 5.
The external connection terminal can be more reliably mounted on the electrode pad as the lower limit of the above range is exceeded. If it is below the upper limit of the above range, it can be avoided that the electrode pad occupies an unnecessarily large area on one surface 1a of the substrate, and it is possible to more reliably prevent short-circuiting with other wiring.

  In addition, by disposing the electrode pad formed of the conductive pattern 2 having the area in the above range on the opening 5, the conductive pattern 2 is disposed not only immediately above the opening 5 but also in the vicinity of the opening 5. Become. Here, “in the vicinity of the opening” refers to the range of the distance corresponding to the diameter of the opening from the periphery of the opening.

  In the above description, in the through-hole substrate according to the present invention, the conductive pattern 2 has been described with the electrode pad formed immediately above the opening 5. However, what the conductive pattern 2 forms immediately above the opening 5 is not limited to the electrode pad, and may be a simple wiring, for example. Needless to say, the wiring has the aforementioned cutout 3 immediately above the opening 5.

  In the above description, the case where the conductive pattern 2 in which the cutout 3 is formed is disposed only on the one surface 1a of the through-hole substrate has been described. However, the conductive pattern 2 in which the cutout 3 is formed may be arranged on both the one surface 1a and the other surface 1b of the through-hole substrate. That is, the conductive pattern 2 in which the cutout 3 is formed may be disposed only in the opening 5 on one end side of the through hole 4, or both of the opening 5 on one end side and the opening on the other end side of the through hole 4. It may be.

<< Penetration wiring board >>
The through wiring substrate according to the present invention is such that the through wiring 8 is formed inside the through hole 4 of the through hole substrate 10 using the through hole substrate 10 according to the present invention described above. That is, it is a wafer substrate before cutting out an electronic component 30 to be described later. An example of the through wiring board 20A (20) is shown in FIG.

In the through wiring substrate 20A according to the present invention, a through hole 4 is formed from one surface 1a to the other surface 1b, and a conductive pattern 2 covering the opening 5 of the through hole 4 on the one surface 1a is disposed. A through wire 8 made of a conductive material is formed in the through hole 4. One end of the through wiring 8 is electrically connected to the conductive pattern 2 and the other end of the through wiring 8 is exposed to the other surface 1b. The conductive pattern 2 is formed with two cutouts 3a (3) and 3b (3) through which the through hole 4 can be observed from the side 1a.
According to this configuration, the conductive substance forming one end of the through wiring 8 disposed in the through hole 4 can be observed through the cutouts 3a and 3b. Thereby, it is possible to inspect whether or not the through wiring is defective. For example, it can be inspected that the electrode pad made of the conductive pattern 2 provided with the cutout 3 and the through wiring 8 are electrically connected.

In the through wiring substrate 20 </ b> A, the first insulating layer 7 is disposed in the cutout 3. Furthermore, the electrode pad made of the conductive pattern 2 is formed at the same height as the first insulating layer 7.
In the through wiring board according to the present invention, a part of one end of the through wiring 8 may be exposed to the entire surface 1a through the cutout 3 like a through wiring board 20B shown in FIG. In addition, the electrode pad formed of the conductive pattern 2 may be formed by being laminated on the first insulating layer 7. The same applies to the above-described through-hole substrate 10 according to the present invention.

  The conductive material constituting the through wiring 8 is not particularly limited. For example, when the through wiring 8 is formed by a plating method or the like, copper (Cu) is preferable.

<< Electronic parts >>
The electronic component according to the present invention is an electronic component 30 cut out from the above-described through wiring substrate 20 according to the present invention, and includes at least one through wiring 8 described above. In the through wiring substrate 20, a dicing line for cutting out the electronic component 30 is usually formed. The mesh line drawn on the one surface 1a of the substrate in FIG. 1 represents this dicing line, and each area defined by the mesh line corresponds to each electronic component 30 according to the present invention. Various semiconductor devices and the like may be mounted on the electronic component 30 according to the present invention before being cut out.
According to this configuration, since the cutout 3 is formed in the electrode pad made of the conductive pattern 2 (not shown), the electrode pad and the through wiring 8 are electrically connected through the cutout 3. Can be inspected.

  An electronic component 30A, which is an example of the electronic component 30 according to the present invention, is shown in FIG. FIG. 14 shows an enlarged top view (a) and a cross section (b) of the vicinity of the through wiring 8 arranged in the electronic component 30A.

  Two penetration wirings 8 are arranged on the substrate 1 of the electronic component 30A from the one surface 1a to the other surface 1b. Each through wiring 8 is formed in the through hole 4, and an electrode pad made of the conductive pattern 2 is arranged so as to cover the opening 5 immediately above the opening 5 of the through hole 4 on one surface 1 a. One end of the through wiring 8 is electrically connected to the electrode pad. An adhesive layer 31 made of resin is disposed on the electrode pad, and a translucent support layer 32 (transparent substrate 32) made of resin or glass covers the entire surface 1a. On the other hand, the other end 4b of the through hole 4 forms an opening in the other surface 1b, and the other end of the through wiring 8 exposed to the other surface 1b in the opening is electrically connected to the external connection terminal 34 via the surface wiring. Connected to. A sealing resin layer 33 for sealing the surface wiring is disposed on the other surface 1b. A light receiving portion 35 is mounted in the gap between the one surface 1 a and the transparent substrate 32, and the light receiving portion 35 is electrically connected to the conductive pattern 2 and the through wiring 8. That is, the electronic component 30A is a light receiving element.

In the electronic component 30 </ b> A, cutouts 3 a and 3 b are formed in the conductive pattern 2 immediately above the opening 5. Therefore, it is possible to optically observe the state of the through wiring 8 disposed in the through hole 4 from the one surface 1a side through the transparent substrate 32, the adhesive layer 31, the first insulating layer 7, and the cutouts 3a and 3b. it can.
The translucent support layer 32 (transparent substrate 32) and the adhesive layer 31 are made of a translucent (light transmissive) material. The material may be transparent (colorless) or non-transparent, and may transmit light of a specific wavelength. Even when the material is colored, it can be used if it is thin enough to transmit light. Each of the translucent support layer 32 and the adhesive layer 31 is preferably made of a transparent material (colorless material). If it is made of a transparent material, the through hole 4 can be observed from the one surface 1a side of the substrate 1 through the translucent support layer 32, the adhesive layer 31, the first insulating layer 7, and the cutouts 3a and 3b. It can be easier.
Therefore, not only the electronic component 30A but also the electronic component 30, the through wiring substrate 20, and the one surface 1a or the other surface 1b of the through hole substrate 10 according to the present invention, a transparent support member (such as the transparent substrate 32 and the adhesive layer 31). A translucent support layer) may be provided.

In the electronic component 30 </ b> A, the conductive pattern 2 in which the cutouts 3 a and 3 b are formed is arranged in each of the openings 5 of the two through wirings 8. The conductive pattern 2 on which 3b is formed is not necessarily arranged. The electronic component 30 according to the present invention only needs to include at least one through wiring 8 provided with the conductive pattern 2 in which the cutout 3 is formed in the opening 5 of the through hole 4.
When a plurality of cutouts 3 are formed in the conductive pattern 2, the shapes of the cutouts 3 may be the same or different. This is common to all of the electronic component 30, the through wiring substrate 20, and the through hole substrate 10 according to the present invention.

<< Substrate manufacturing method >>
The substrate manufacturing method according to the present invention includes a step A1 of disposing a conductive pattern on one surface side of the substrate, a step A2 of disposing a translucent support layer on the conductive pattern, and from one surface of the substrate to the other surface. A step A3 for forming a through hole, and in the step A3, an opening in which the through hole opens in the one surface is formed immediately below the conductive pattern, and a part of the opening is supported in the step A3. It is formed so that it can be observed from above the layer.
According to this configuration, after step A3, the inside of the through hole formed in the substrate can be observed to inspect for the presence or absence of defects such as poor formation of the through hole. Thereby, the quality of a through-hole board | substrate can be grasped | ascertained easily.

<First aspect of substrate manufacturing method>
As shown in FIG. 15, the first aspect of the method for manufacturing a substrate according to the present invention includes a step A <b> 1 in which the conductive pattern 2 is disposed on the one surface 1 a side of the substrate 1, and a translucent support layer 32 on the conductive pattern 2. And a step A3 for forming the through hole 4 from one surface 1a of the substrate 1 to the other surface 1b. In step A1, the cutout 3 is formed in the conductive pattern 2, and in step A3, An opening 5 in which the through-hole 4 is opened on one surface 1 a is formed immediately below the conductive pattern 2, and a part of the opening is formed so as to be observable from above the support layer 32 through the cutout 3.
According to this configuration, after step A3, the inside of the through-hole formed in the substrate can be observed through the cut-out to check for defects such as defective formation of the through-hole. Thereby, the quality of a through-hole board | substrate can be grasped | ascertained easily.

[Step A1 of First Embodiment]
First, a wafer substrate 1 made of silicon (Si) is prepared, and a first insulating layer 7 made of an oxide film (SiO ₂ film) is formed on the surface 1a. The method for forming the oxide film is not particularly limited, and a known method such as PECVD (Plasma Enhanced Chemical Vapor Deposition) method can be applied.

  Subsequently, a conductive pattern 2 forming an electrode pad or wiring having a desired shape is disposed on the first insulating layer 7 [FIG. 15A]. The region where the conductive pattern 2 is formed includes at least a region 5a which is directly above the opening 5 of the through hole 4 formed in the subsequent step A3. A cutout 3 is formed in the region 5a. The shape and arrangement of the cutout 3 are as described for the through-hole substrate 10 described above.

  Although the material which comprises the conductive pattern 2 is not restrict | limited in particular, A metal is preferable and especially the alloy etc. which have aluminum (Al), copper (Cu), aluminum (Al) as a main component are more preferable. Al and Cu are highly conductive and easy to process. That is, the conductive pattern 2 is preferably composed of a metal thin film.

  A method for forming the conductive pattern 2 is not particularly limited, and a known film forming method such as a sputtering method, a CVD method, or a plating method can be applied. Moreover, the method in particular of patterning the conductive pattern 2 to a desired shape is not restrict | limited, For example, a well-known lithography method is applicable. By this patterning, a cutout 3 having a desired shape can be formed in the conductive pattern 2.

[Step A2 of First Embodiment]
Next, an adhesive layer 31 (adhesive) is disposed on the conductive pattern 2 and / or the substrate 1.
The material of the adhesive layer 31 is not particularly limited as long as it can adhere the substrate 1 and the translucent support layer 32, but a translucent resin is suitable. If it is translucent, optically observing the inside of the through-hole 4 from the one surface 1a side through the cutout 3 formed in the conductive pattern 2 is not prevented.
When the non-light-transmitting adhesive layer 31 is used, it is necessary to avoid disposing the adhesive layer 31 on the cutout 3. In this case, for example, a method of removing the mask after arranging a mask immediately above the cutout 3 and applying a curable resin to be the adhesive layer 31 at a predetermined position on the one surface 1a can be exemplified.

Subsequently, the translucent support layer 32 (transparent substrate) is disposed by being adhered to the one surface 1a via the adhesive layer 31 (FIG. 15B).
The material of the translucent support layer 32 is not particularly limited as long as it transmits the light of the means for observing the inside of the through hole 4. As a suitable thing, glass and transparent resin are mentioned, for example.
The translucent support layer 32 is preferably disposed on the cutout 3 formed in the conductive pattern 2 via the adhesive layer 31. Thereby, since the support layer 32 can fix or support the cutout 3, the shape of the cutout 3 can be protected (held) when the through hole 4 is formed in the subsequent step A3. That is, it becomes easy to reliably form the through-hole 4 in the step A3 without damaging the cutout 3 or the conductive pattern 2.

[Step A3 of First Embodiment]
Next, a through hole 4 is formed from the other surface 1b of the substrate 1 to the first surface 1a [FIG. 15 (c)].
An opening 5 in which the through hole 4 opens on one surface 1 a is formed immediately below the conductive pattern 2 in which the cutout 3 is formed, and a part of the opening 5 is formed on the support layer 32 through the cutout 3. Form to be observable.
The substrate obtained after step 3A corresponds to the through-hole substrate 10 according to the present invention.

  The method for forming the through hole 4 is not particularly limited, and a known method may be applied according to the material of the substrate. For example, a wet etching method, an RIE (Reactive Ion Etching) method, a DRIE (Deep Reactive Ion Etching) method, a process using laser modification and wet etching, and the like can be applied, and photolithography can be used in combination as appropriate.

In FIG. 15C, the oxide film (first insulating layer 7) made of SiO ₂ is removed, and the lower surface 2 p of the conductive pattern 2 is exposed in the through hole 4. By exposing in this way, it is possible to electrically connect the conductive material disposed in the through hole 4 in the subsequent step A5 and the lower surface 2p of the conductive pattern 2.
When manufacturing the through-hole board | substrate 10 concerning this invention, the said oxide film in the lower surface 2p of the conductive pattern 2 may be removed, and does not need to be removed. When the through hole substrate 10 is not removed at the manufacturing stage, the oxide film may be removed when the through wiring 8 is formed.

[Step A4 of First Embodiment]
The substrate manufacturing method according to the present invention preferably includes a step A4 for inspecting the inside of the through-hole 4 from the one surface 1a side of the substrate 1 after the step A3.
Since the adhesive layer 31 and the support layer 32 are disposed on the one surface 1a, the state inside the through hole 4 or a part of the opening 5 and the periphery thereof are inspected through the cutout 3 from above the support layer 32.
By this inspection, it is possible to inspect for defects in the etching state, the positional accuracy of the through hole 4, the state of the through hole 4, and the like. Thereby, while being able to grasp | ascertain the quality of the through-hole board | substrate 10 easily, the through-hole board | substrate 10 with a malfunction can be sorted out easily.

  As a specific method for inspecting the inside of the through hole 4, for example, visible light is irradiated into the through hole 4 from the other surface 1b side, and the visible light passing through the cutout 3 from the one surface 1a side is used as a CCD camera. And a method of observing with a microscope or the like. As another method, for example, the visible light reflected from the periphery of the opening 5 through the cutout 3 is irradiated with visible light in the through-hole 4 or a part and the periphery of the opening 5 from the one surface 1a side. There is a method of observing from one side 1a with a microscope or the like equipped with a CCD camera.

[Step A5 of First Embodiment]
Subsequent to the step A3 or the step A4, the through wiring 8 is formed inside the through hole 4 [FIG. 15 (d)].
When the substrate 1 is a semiconductor substrate, it is necessary to cover the inner wall of the through hole 4 with the second insulating layer 6 (oxide film) before the through wiring 8 is formed. After forming the second insulating layer 6, the second insulating layer 6 is removed only in a region covering the lower surface 2 p of the conductive pattern 2. A known method can be applied to the formation and removal of the second insulating layer 6. For example, PECVD (plasma-enhanced chemical vapor deposition) can be applied to form the second insulating layer 6. An RIE (Reactive Ion Etching) method can be applied to the removal of the second insulating layer 6. A method for forming the through wiring 8 by disposing a conductive substance in the through hole 4 is not particularly limited, and for example, a known method can be applied. For example, techniques such as plating, sputter deposition, CVD, and molten metal filling can be applied.

  The step A4 for inspecting the inside of the through hole 4 may be performed after the second insulating layer 6 is formed. Generally, the material of the second insulating film 6 is a silicon oxide film or a silicon nitride film, and the thickness thereof is several microns. Therefore, the inside of the through hole 4 can be inspected through the second insulating film 6. After the second insulating layer 6 is formed, the process A4 can be performed with the lower surface 2p of the conductive pattern 2 covered with the second insulating layer 6. Therefore, since the lower surface 2p of the conductive pattern 2 is not exposed to the atmosphere for a long time, the problem that the lower surface 2p of the conductive pattern 2 is oxidized and deteriorated can be prevented.

[Step A6 of First Embodiment]
The substrate manufacturing method according to the present invention preferably includes a step A6 of inspecting the through hole 4 from the one surface 1a side of the substrate 1 after the step A5.
Since the adhesive layer 31 and the support layer 32 are disposed on the one surface 1a, the state in the through hole 4 is inspected through the cutout 3 from above the support layer 32 through these.
By this inspection, it is possible to inspect for defects in the etching state, the position accuracy of the through hole, the state of the through wiring 8, the electrical connection between the through wiring 8 and the conductive pattern 2, and the like. As a result, the quality of the through wiring board can be easily grasped, and defective through wiring boards can be easily selected.

As a specific method for inspecting the inside of the through hole 4, for example, the visible light reflected from the periphery of the opening 5 through the cutout 3 is irradiated with visible light from the one surface 1 a side, and a CCD camera is used. There is a method of observing from the side 1a with a mounted microscope or the like.
This inspection method of the through hole 4 is applicable as a method of examining the inside of the through hole 4 through the cutout 3 from the one surface 1a side in the through hole substrate 10, the through wiring substrate 20, or the electronic component 30 of the present invention. .

<Second aspect of substrate manufacturing method>
In the second aspect of the substrate manufacturing method according to the present invention, a process A1 in which a transparent conductive film is disposed as the conductive pattern 2 on the one surface 1a side of the substrate 1, and a translucent support layer 32 is disposed on the conductive pattern 2. At least a step A2 and a step A3 for forming the through hole 4 from one surface 1a to the other surface 1b of the substrate 1, and in step A3, the opening 5 in which the through hole 4 opens on the one surface 1a is formed on the conductive pattern 2. In addition to being formed immediately below, a part of the opening is formed so as to be observable from above the support layer 32.
Since a transparent conductive film is employed for the conductive pattern 2, a portion of the opening 5 or the inside of the through-hole 4 is formed from the surface 1a side using visible light that passes through the transparent conductive film without forming the cutout 3. Can be observed.
As the transparent conductive film, an ITO film (indium tin oxide film) or an FTO film (fluorine-doped tin oxide film) can be applied. The specific method of process A1-A3 is the same as that of a 1st aspect.

  The through-hole substrate, the through-wiring substrate, the electronic component, and the substrate manufacturing method according to the present invention can be widely used for manufacturing an electronic circuit or the like provided with a light receiving element.

DESCRIPTION OF SYMBOLS 1 ... Board | substrate, 1a ... One side of board | substrate, 1b ... Other side of board | substrate, 2, 2a, 2b, 2c ... Conductive pattern, 2p ... Lower surface of a conductive pattern, 3, 3a, 3b, 3c, 3d ... Cutout, 4 ... Through Holes, 4a ... one end of the through hole, 4b ... the other end of the through hole, 5 ... opening, 6 ... second insulating layer, 7 ... first insulating layer, 8 ... through wiring, 10, 10A to 10H ... through Hole substrate, 20, 20A, 20B ... Penetration wiring substrate, 30, 30A ... Electronic component, 31 ... Translucent adhesive layer, 32 ... Translucent support layer (transparent substrate), 33 ... Sealing resin, 34 ... External connection terminal, 35 ... light receiving part, 100 ... through hole substrate, 101 ... substrate, 101a ... one surface of substrate, 101b ... other surface of substrate, 102 ... conductive pattern, 104 ... through hole, 106 ... second insulating film, 107 A first insulating film.

Claims (11)

A through hole substrate in which a through hole is formed from one surface of the substrate to the other surface, and a conductive pattern covering the opening of the through hole on the one surface is disposed,
A through-hole substrate, wherein the conductive pattern is formed with a cutout through which the through-hole can be observed from the one surface side.   The through hole substrate according to claim 1, wherein an edge of the opening is observable in the cutout.   The through hole substrate according to claim 2, wherein the cutout is formed so as to include at least both ends of a line segment connecting the diameters of the openings.   The through hole substrate according to any one of claims 1 to 3, wherein the conductive pattern has two or more cutouts.   A through wiring substrate, wherein a through wiring is formed in the through hole of the through hole substrate using the through hole substrate according to claim 1. An electronic component cut out from the through wiring board according to claim 5,
An electronic component comprising at least one through hole. A step A1 of disposing a conductive pattern on one side of the substrate;
A step A2 of disposing a translucent support layer on the conductive pattern;
Forming a through hole from one surface to the other surface of the substrate; and
Having at least
In the step A1, a cut is formed in the conductive pattern,
In the step A3, an opening where the through-hole opens on the one surface is formed immediately below the conductive pattern, and a part of the opening is formed so as to be observable from above the support layer through the cutout. A method for manufacturing a substrate, comprising: After step A3,
8. The method of manufacturing a substrate according to claim 7, further comprising a step A4 of inspecting the inside of the through hole from one surface side of the substrate. After covering the inner wall of the through hole formed in step A3 and the lower surface of the conductive pattern exposed in the through hole with an insulating layer,
9. The method of manufacturing a substrate according to claim 8, further comprising a step A4 of inspecting the inside of the through hole from one surface side of the substrate. A step A5 of forming a through wiring inside the through hole;
Then, it has process A6 which test | inspects the inside of the said through-hole from the one surface side of the said board | substrate, The manufacturing method of the board | substrate as described in any one of Claims 7-9 characterized by the above-mentioned.   In the through-hole substrate according to claim 1, the through-wiring substrate according to claim 5, or the electronic component according to claim 6, the inside of the through-hole is examined by cutting out from the one surface side. A method for inspecting a through-hole.

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