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JP2012174741A - 複連ノズル及び当該複連ノズルを備える基板処理装置 - Google Patents

複連ノズル及び当該複連ノズルを備える基板処理装置 Download PDF

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Publication number
JP2012174741A
JP2012174741A JP2011032677A JP2011032677A JP2012174741A JP 2012174741 A JP2012174741 A JP 2012174741A JP 2011032677 A JP2011032677 A JP 2011032677A JP 2011032677 A JP2011032677 A JP 2011032677A JP 2012174741 A JP2012174741 A JP 2012174741A
Authority
JP
Japan
Prior art keywords
gas
introduction hole
liquid
nozzle
nozzles
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2011032677A
Other languages
English (en)
Japanese (ja)
Inventor
Akira Matsushita
亮 松下
Masatoshi Hirokawa
昌利 廣川
Mitsuji Hayashida
充司 林田
Gayeta Wally
ガイエッタ，ワリー
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Aqua Science Corp
Original Assignee
Aqua Science Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Aqua Science Corp filed Critical Aqua Science Corp
Priority to JP2011032677A priority Critical patent/JP2012174741A/ja
Priority to TW101104640A priority patent/TWI579061B/zh
Priority to PCT/JP2012/053828 priority patent/WO2012111809A1/ja
Priority to CN201280008138.5A priority patent/CN103370771A/zh
Priority to KR1020137021031A priority patent/KR20140042782A/ko
Publication of JP2012174741A publication Critical patent/JP2012174741A/ja
Withdrawn legal-status Critical Current

Links

Classifications

    • H10P72/0414—

Landscapes

  • Nozzles (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Cleaning By Liquid Or Steam (AREA)
JP2011032677A 2011-02-17 2011-02-17 複連ノズル及び当該複連ノズルを備える基板処理装置 Withdrawn JP2012174741A (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2011032677A JP2012174741A (ja) 2011-02-17 2011-02-17 複連ノズル及び当該複連ノズルを備える基板処理装置
TW101104640A TWI579061B (zh) 2011-02-17 2012-02-14 連串噴嘴及具有該連串噴嘴的基板處理裝置
PCT/JP2012/053828 WO2012111809A1 (ja) 2011-02-17 2012-02-17 複連ノズル及び当該複連ノズルを備える基板処理装置
CN201280008138.5A CN103370771A (zh) 2011-02-17 2012-02-17 复合喷嘴及具备该复合喷嘴的基板处理装置
KR1020137021031A KR20140042782A (ko) 2011-02-17 2012-02-17 복련 노즐 및 당해 복련 노즐을 구비하는 기판 처리 장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011032677A JP2012174741A (ja) 2011-02-17 2011-02-17 複連ノズル及び当該複連ノズルを備える基板処理装置

Publications (1)

Publication Number Publication Date
JP2012174741A true JP2012174741A (ja) 2012-09-10

Family

ID=46672720

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011032677A Withdrawn JP2012174741A (ja) 2011-02-17 2011-02-17 複連ノズル及び当該複連ノズルを備える基板処理装置

Country Status (5)

Country Link
JP (1) JP2012174741A (zh)
KR (1) KR20140042782A (zh)
CN (1) CN103370771A (zh)
TW (1) TWI579061B (zh)
WO (1) WO2012111809A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9230823B1 (en) 2014-08-05 2016-01-05 Chipbond Technology Corporation Method of photoresist strip

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6013557B1 (ja) * 2015-06-02 2016-10-25 株式会社Ｎｓｃ スプレイエッチング装置
KR101835986B1 (ko) * 2016-07-25 2018-03-07 시오 컴퍼니 리미티드 유체 공급관
JP6811113B2 (ja) * 2017-02-14 2021-01-13 株式会社Ｓｃｒｅｅｎホールディングス 衝撃力測定装置、基板処理装置、衝撃力測定方法、および基板処理方法
GB2588545B (en) * 2018-05-01 2022-11-30 Universal Can Corp Nozzle, drying device, and method for producing can body

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07185434A (ja) * 1993-12-28 1995-07-25 Kao Corp 塗布装置
JP2005021894A (ja) * 1999-10-27 2005-01-27 Tokyo Electron Ltd 液処理装置
JP2003145064A (ja) * 2001-11-12 2003-05-20 Tokyo Electron Ltd ２流体ジェットノズル及び基板洗浄装置
JP2004237282A (ja) * 2003-01-16 2004-08-26 Kyoritsu Gokin Co Ltd 二流体ノズル
JP5022074B2 (ja) * 2006-05-02 2012-09-12 株式会社共立合金製作所 二流体ノズルとそれを用いた噴霧方法
WO2009013797A1 (ja) * 2007-07-20 2009-01-29 Aqua Science Corporation 対象物処理方法及び対象物処理システム
JP4447042B2 (ja) * 2007-12-06 2010-04-07 福岡県 微粒化装置および微粒化方法
TWI469832B (zh) * 2008-12-17 2015-01-21 Aqua Science Corp 對象物清洗方法及對象物清洗系統
WO2010125664A1 (ja) * 2009-04-30 2010-11-04 アクアサイエンス株式会社 剥離液及び対象物洗浄方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9230823B1 (en) 2014-08-05 2016-01-05 Chipbond Technology Corporation Method of photoresist strip
JP2016039358A (ja) * 2014-08-05 2016-03-22 ▲き▼邦科技股▲分▼有限公司 フォトレジスト剥離方法

Also Published As

Publication number Publication date
CN103370771A (zh) 2013-10-23
WO2012111809A1 (ja) 2012-08-23
TW201240743A (en) 2012-10-16
KR20140042782A (ko) 2014-04-07
TWI579061B (zh) 2017-04-21

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Effective date: 20140513