JP2012169330A - Electronic device - Google Patents

Abstract

In a conventional electronic device, when wiring boards are stacked and arranged, a cooling path for a semiconductor package arranged between the wiring boards cannot be secured without increasing the size.
A semiconductor package 1 serving as a heat source, a first wiring board 2 on which the semiconductor package 1 is mounted, and a surface of the first wiring board 2 on which the semiconductor package 1 is mounted are disposed at a predetermined interval. A second wiring board 3 having one or a plurality of through holes 3d, a transmission hole that is interposed between the through holes 3d of the second wiring board 3 and the semiconductor package 1 and transmits heat from the semiconductor package 1 to the through holes 3d. The heat member 4 is bonded so that heat from the through hole 3d is transmitted to the surface of the second wiring board 3 on the side opposite to the heat transfer member 4 side, and heat is released to release the transmitted heat to the outside. Means 5.
[Selection] Figure 1

Description

  The present invention relates to an electronic device having a structure for cooling a semiconductor package mounted on a wiring board, and more particularly to an electronic device in which a plurality of wiring boards are stacked.

  Conventionally, in an electronic device in which a semiconductor package is mounted on a wiring board, as a technique for cooling the semiconductor package, heat generated in the semiconductor package is transmitted through a through-hole and a heat radiation solid layer in the wiring board on which the semiconductor package is mounted. Some semiconductor packages are cooled by transmitting them to the heat radiating fins.

  For example, in Patent Document 1, heat is transferred to a connection area, a through-hole, and a heat-dissipating solid layer through bonding means provided directly under the LSI chip package, and heat-dissipating means connected to the heat-dissipating solid layer ( What dissipates heat by means of heat dissipating fins, chassis, etc. is disclosed.

  As for LSI chip packages, with higher integration and higher performance, the amount of heat increases and the number of pins increases, and due to the demand for miniaturization of LSI chip packages, full-grid ball grid arrays (BGA) Increasing adoption of packages. When such a full-grid BGA package LSI chip package is mounted on a substrate, it is not possible to provide a heat dissipation connection area directly under the LSI chip package. Heat is transferred to the heat-dissipating chassis, chassis feet, connection area, through hole, and heat-dissipating solid layer through the bonding means provided on the top of the chip package. What dissipates heat is disclosed.

JP 2002-184915 A JP 2005-228809 A

  However, in the case where the LSI chip package in Patent Document 1 has a high performance and a large number of pins, a space for drawing many signals from the pins of the LSI chip package and performing equal length wiring / GND shielding for high-speed parallel signals, etc. Therefore, it is extremely difficult to secure a connection area for connecting the feet of the heat dissipation chassis and a space for providing a through hole for transferring heat on the substrate in the area around the LSI chip package. . If a heat dissipation connection area or through hole is provided on the board, the signal wiring bypasses the heat dissipation connection area or through hole, resulting in an increase in the board area or the wiring layer layer on the board. The number will increase.

  If a CPU cooler (fin (heat sink), fan) as in Patent Document 2 is provided on the upper surface of the LSI chip package for cooling instead of providing a heat dissipation connection area or through hole, a large space and height direction Therefore, there is a problem that the apparatus becomes large.

  By the way, in recent years, electronic devices have been reduced in size, and in order to reduce the area of a wiring board on which a semiconductor package is mounted, a configuration in which a plurality of wiring boards are stacked is increasing. In an electronic device having a configuration in which such wiring boards are stacked, when a semiconductor package is disposed between the wiring boards, how to secure a cooling path for the semiconductor package without increasing the size becomes a problem.

  In a conventional electronic device, when wiring boards are stacked and arranged, it is necessary to increase the size of the device in order to secure a cooling path for semiconductor packages arranged between the wiring boards.

  In one aspect of the present invention, in an electronic device, a semiconductor package serving as a heat source, a first wiring board on which the semiconductor package is mounted, and a predetermined interval from a surface of the first wiring board on which the semiconductor package is mounted. And a second wiring board having one or a plurality of through-holes, and being interposed between the through-holes of the second wiring board and the semiconductor package and transferring heat from the semiconductor package to the through-holes. The heat transfer member that transmits heat to the heat transfer member is bonded to the surface of the second wiring board opposite to the heat transfer member side so that heat from the through hole is transferred, and the transferred heat is transferred to the outside. And a heat dissipating means for discharging.

  According to the present invention, in a configuration in which a plurality of wiring boards are stacked, a heat transfer member is provided in accordance with a gap between the semiconductor package and the second wiring board, and heat is transferred from the heat transfer member to the heat radiating means in the second wiring board. By providing the through hole, it is not necessary to secure a space for transferring heat on the first wiring board on which the semiconductor package is mounted, the interval between the wiring boards can be narrowed, and the device can be miniaturized. Can do. In addition, since the heat dissipating means is provided on the second wiring board that is open at the top, it can sufficiently dissipate heat even with a cooling fan or heat sink that does not have a large airflow, and can reduce power consumption, cost, and noise. .

It is the side view which showed typically the structure of the electronic device which concerns on Example 1 of this invention. It is the fragmentary sectional view which showed typically the structure of the through-hole (3d) vicinity of the wiring board (3) of the electronic device which concerns on Example 1 of this invention. It is the side view which showed typically the structure of the electronic device which concerns on Example 2 of this invention. It is the fragmentary sectional view which showed typically the structure of the through-hole (3d) vicinity of the wiring board (3) of the electronic device which concerns on Example 3 of this invention. It is the side view which showed typically the structure of the electronic device which concerns on Example 4 of this invention. It is the side view which showed typically the structure of the electronic device which concerns on Example 5 of this invention.

  In an electronic device according to an embodiment of the present invention, a semiconductor package (1 in FIG. 1) serving as a heat source, a first wiring board (2 in FIG. 1) on which the semiconductor package is mounted, and the first wiring board A second wiring board (3 in FIG. 1) which is arranged at a predetermined interval from the surface on which the semiconductor package is mounted and has one or a plurality of through holes (3d in FIG. 1), and the second wiring board A heat transfer member (4 in FIG. 1) that is interposed between the through hole and the semiconductor package and transfers heat from the semiconductor package to the through hole, and opposite to the heat transfer member side in the second wiring board It is bonded so that heat from the through hole is transmitted on the side surface, and a heat radiating means (5 in FIG. 1) for releasing the transmitted heat to the outside.

  In the electronic device of the present invention, it is preferable that the heat dissipating means is a cooling fan or a heat sink.

  In the electronic device according to the present invention, the second wiring board is connected to the heat radiating means and connected to the through hole, and is connected to the heat transfer member and the through hole. It is preferable to have the 2nd conductor solid pattern connected with.

  In the electronic device of the present invention, it is preferable that the through hole is connected to a GND pattern or a power supply pattern formed on the second wiring board.

  In the electronic device according to the aspect of the invention, it is preferable that the through hole is formed in a tubular shape, and a heat transfer material is filled inside the through hole.

  In the electronic device according to the present invention, it is preferable that the electronic device includes a thermally conductive adhesive that adheres the heat dissipating means to the through hole and transmits heat from the through hole to the heat dissipating means.

  In the electronic device of the present invention, the first wiring board includes one or a plurality of other semiconductor packages mounted in a region different from the semiconductor package, and the heat transfer member includes the second wiring board. It is preferable that the semiconductor device is interposed between the through hole and the other semiconductor package, and heat of the other semiconductor package is transmitted to the second wiring board.

  In the electronic device according to the aspect of the invention, it is preferable that the semiconductor package is mounted on the first wiring board via a plurality of bumps.

  In the electronic device according to the aspect of the invention, it is preferable that the heat transfer member is made of a heat conductive rubber capable of elastic deformation and heat transfer.

  In the electronic device of the present invention, another heat transfer member and another wiring board are alternately arranged between the second wiring board and the heat transfer member, and the second wiring is formed from the heat transfer member. It is preferable that the other heat transfer member is disposed so that heat is transferred to the through hole of the substrate, and another through hole is provided in the other wiring substrate.

  The electronic device of the present invention includes a connector that detachably electrically connects the first wiring board and the second wiring board between the first wiring board and the second wiring board. Is preferred.

  In the electronic device according to the present invention, it is preferable that the electronic device includes a support column interposed between the first wiring board and the second wiring board at a position that does not conflict with the semiconductor package.

  In addition, when drawing reference numerals are given in the present application, they are for the purpose of assisting understanding only, and are not intended to be limited to the illustrated modes.

  An electronic apparatus according to a first embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a side view schematically showing the structure of an electronic device according to Embodiment 1 of the present invention. FIG. 2 is a partial cross-sectional view schematically showing a structure near the through hole (3d) of the wiring board (3) of the electronic device according to the first embodiment of the present invention.

  Referring to FIG. 1, an electronic device 100 is an electronic device having a configuration in which a plurality of wiring substrates 2 and 3 are stacked, and has a structure for cooling a semiconductor package 1 mounted on the wiring substrate 2 between the wiring substrates 2 and 3 ( Route). The electronic device 100 includes, as main components, a semiconductor package 1, a wiring board 2, a wiring board 3, a heat transfer member 4, a cooling fan 5, a connector 6, a column 7, and a heat conductive adhesive. 8 and.

  The semiconductor package 1 is a full grid ball grid array package in which semiconductor chips (for example, LSI chips) are packaged. The semiconductor package 1 serves as a heat source. The semiconductor package 1 is mounted on the surface of the wiring board 2 on the wiring board 3 side. The semiconductor package 1 is provided with a plurality of bumps 1a on the surface of the wiring board 2 and is electrically connected to the electrodes of the wiring board 2 through the bumps 1a. The semiconductor package 1 is connected (joined or contacted) to a heat transfer member 4 serving as a cooling path (heat dissipating path) on the surface (at least part, preferably all) of the wiring board 3 side.

  The wiring board 2 is a wiring board (for example, an electronic circuit board or a printed wiring board) in which a wiring pattern (signal wiring, power wiring, for example, copper) is formed on the surface or inside of an insulator (for example, insulating resin). . The wiring board 2 has a plurality of electronic components 2a mounted on both sides. In addition, the semiconductor package 1 is mounted on the wiring board 2 at a position where it does not touch the electronic component 2a on the surface on the wiring board 3 side. The wiring board 2 is a main board on which the semiconductor package 1 is mounted. The wiring board 2 is arranged at a predetermined interval with respect to the wiring board 3. The wiring board 2 has a connector portion 6a attached to a position corresponding to the connector portion 6b of the wiring board 3 on the surface on the wiring board 3 side. The wiring board 2 is electrically connected to the wiring board 3 by connecting the connector part 6a to the connector part 6b. The wiring board 2 supports the wiring board 3 via the support columns 7 at positions that do not conflict with the electronic component 2 a, the connector portion 6 a, and the semiconductor package 1 on the surface on the wiring board 3 side.

  The wiring board 3 is a wiring board (for example, an electronic circuit board or a printed wiring board) in which a wiring pattern 3e (signal wiring, power wiring, for example, copper) is formed on the surface or inside of an insulator 3f (for example, insulating resin). (See FIG. 2). A plurality of electronic components 3a are mounted on both sides of the wiring board 3 (see FIG. 1). The wiring board 3 is a sub board on which the semiconductor package 1 is not mounted. The wiring board 3 is arranged at a predetermined interval with respect to the wiring board 2. The wiring board 3 has a connector portion 6b attached to a position corresponding to the connector portion 6a of the wiring board 2 on the surface on the wiring board 2 side. The wiring board 3 is electrically connected to the wiring board 2 by connecting the connector part 6b to the connector part 6a. The wiring board 3 supports the wiring board 2 via the support column 7 at a position that does not conflict with the electronic component 2 a, the connector portion 6 a, and the semiconductor package 1 on the surface on the wiring board 2 side.

  The wiring board 3 includes a conductor solid pattern 3b, a conductor solid pattern 3c, and a through hole 3d as a structure that transmits heat from the semiconductor package 1 toward the cooling fan 5. The solid conductor pattern 3b is a solid pattern made of a conductor (for example, copper) for providing the cooling fan 5 via the heat conductive adhesive 8 on the surface of the wiring board 3 on the cooling fan 5 side, and is a through hole. 3d is connected. The conductor solid pattern 3c is a solid pattern made of a conductor (for example, copper) for connecting (contacting or joining) to the heat transfer member 4 on the surface of the wiring board 3 on the wiring board 2 side. It is connected. The through hole 3d is a tubular conductor (for example, copper) that penetrates the insulator 3f of the wiring board 3 in the region where the cooling fan 5 is mounted, and is connected to the conductor solid patterns 3b and 3c. The through hole 3d is not connected to the wiring pattern 3e.

  The heat transfer member 4 is a member that transfers heat generated in the semiconductor package 1 toward the wiring board 3 (through hole 3d). The heat transfer member 4 is interposed between the semiconductor package 1 and the wiring board 3 (conductor solid pattern 3c), and is connected to the semiconductor package 1 and the wiring board 3 (conductor solid pattern 3c). For the heat transfer member 4, for example, a heat conductive rubber capable of elastic deformation and heat transfer can be used. By using a heat conductive rubber for the heat transfer member 4, the heat transfer member 4 is brought into close contact with the upper surface of the semiconductor package 1 and the conductor solid pattern 3c, so that heat can be transferred efficiently.

  The cooling fan 5 is an air-cooling type cooling device that cools the wiring board 3 to which the heat generated in the semiconductor package 1 is transmitted by the airflow generated by the rotation of the fan. The cooling fan 5 is disposed on the opposite side of the wiring board 3 from the wiring board 2 side, and is bonded onto the conductor solid pattern 3 b of the wiring board 3 by a heat conductive adhesive 8.

  The connector 6 is a member for electrically connecting the wiring board 2 and the wiring board 3. The connector 6 includes a connector part 6 a attached to the wiring board 2 and a connector part 6 b attached to the wiring board 3. The connector 6 electrically connects the wiring board 2 and the wiring board 3 by connecting the connector part 6a and the connector part 6b.

  The column 7 is a columnar member that maintains a gap between the wiring board 2 and the wiring board 3.

  The heat conductive adhesive 8 is a heat conductive adhesive that bonds the cooling fan 5 onto the conductor solid pattern 3 b of the wiring board 3.

  Next, transfer of heat generated in the semiconductor package of the electronic device according to the first embodiment of the present invention will be described.

  Of the heat generated in the semiconductor package 1 by energization in the electronic device 100, part of the heat is transmitted from the bump 1 a of the semiconductor package 1 through the wiring substrate 2 (wiring pattern; not shown) on which the semiconductor package 1 is mounted. However, most of the heat is transferred from the upper surface of the semiconductor package 1 (the surface on the side of the wiring board 3) to the heat transfer member 4, the conductive solid pattern 3c, the through hole 3d, the conductive solid pattern 3b, and the heat conductive adhesive. 8 and the heat dissipation path in order of the cooling fan 5.

  According to the first embodiment, most of the heat generated in the semiconductor package 1 is dissipated by the heat dissipation path from the upper surface of the semiconductor package 1 (surface on the wiring board 3 side). It is not necessary to secure a space for transferring heat to the mounted wiring board 2, and an optimal wiring pattern for fully exhibiting the performance of the semiconductor package 1 can be drawn. Since the number of wiring layers can be reduced, the substrate cost can be reduced.

  In addition, according to the first embodiment, the heat transfer member 4 is provided in the gap between the semiconductor package 1 and the wiring substrate 3, and the conductor solid pattern 3 c, the through hole 3 d, and the conductor solid pattern 3 b are provided on the wiring substrate 3. Since the cooling fan 5 is provided on the three conductor solid patterns 3b, the wiring boards 2, 3 as in the case of the prior art in which a heat sink or fan is directly attached to the upper surface of the semiconductor package (for example, see Patent Document 2). It is not necessary to widen the space between them, and since the cooling fan 5 as a heat radiating means is located at an open position above the wiring board 3 instead of between the wiring boards 2 and 3, it is possible to sufficiently radiate heat with a small air volume. The electronic device can be reduced in size. Accordingly, power consumption, cost, and noise can be reduced.

  In addition, when a heat sink or a fan is directly attached to the upper surface of the semiconductor package and a plurality of wiring boards are stacked as in Patent Document 2, the interval between the wiring boards cannot be reduced, and the wiring Air that has become hot between the boards is released by the fan to the outside of the wiring boards, but there are many electronic components mounted on the wiring boards between the wiring boards, and the air flow is poor, A large number of large fans are required, resulting in increased power consumption, increased cost, and increased noise. Further, when the CPU cooler of Patent Document 2 is applied as it is on the conductor solid pattern 3b of the wiring board of the first embodiment, there is a problem that the size of the CPU cooler is large and the device is not downsized.

  On the other hand, in the case of Example 1, when the heat of the semiconductor package 1 serving as a heating element is transmitted through the stacked wiring board 3, the heat is radiated through the conductor solid pattern 3c, the through hole 3d, and the conductor solid pattern 3b. The heat dissipating means provided on the conductor solid pattern 3b on the upper surface of the wiring board 3 can be only a fan, and heat can be sufficiently dissipated by a small and inexpensive heat dissipating means. As a result, it is possible to reduce the size of the apparatus, reduce power consumption, reduce costs, and reduce noise.

  In the first embodiment, none of the wiring patterns 3e on the wiring board 3 is connected to the through holes 3d. However, the GND pattern or the power supply pattern of the wiring patterns 3e may be connected to the through holes 3d. As a result, the heat transferred to the through hole 3d can be radiated from the GND pattern / power supply pattern, the GND pin / power supply pin of the low heat generation component, the low heat generation component, and the air heat dissipation path, so that the heat dissipation effect can be improved. .

  An electronic apparatus according to Embodiment 2 of the present invention will be described with reference to the drawings. FIG. 3 is a side view schematically showing the structure of the electronic device according to the second embodiment of the present invention.

  The second embodiment uses a heat sink 9 instead of the cooling fan (5 in FIG. 1) of the first embodiment. Other configurations are the same as those of the first embodiment.

  The heat sink 9 is a heat dissipating means made of metal (for example, aluminum), and the base is bonded to the wiring board 3 (part corresponding to the solid conductor pattern 3b in FIG. 2) via the heat conductive adhesive 8. A plurality of fins extend upward from the base.

  Most of the heat generated in the semiconductor package 1 is from the upper surface (surface on the wiring board 3 side) of the semiconductor package 1 to the heat transfer member 4, the wiring board 3 (conductor solid pattern 3 c, through hole 3 d in FIG. 2, The heat is dissipated by the heat radiation path in the order of the conductive solid pattern 3b), the heat conductive adhesive 8, and the heat sink 9.

  According to the second embodiment, the same effects as those of the first embodiment can be obtained, and the heat sink 9 is used as a heat radiating means instead of the cooling fan (5 in FIG. 1), thereby reducing power consumption, cost, noise, and reliability. Can be improved.

  An electronic apparatus according to Embodiment 3 of the present invention will be described with reference to the drawings. FIG. 4 is a partial cross-sectional view schematically showing a structure in the vicinity of the through hole (3d) of the wiring board (3) of the electronic device according to the third embodiment of the present invention.

  The third embodiment is a modification of the first embodiment, in which a heat transfer material 3g (for example, solder, conductive paste) is filled inside the through hole 3d. Other configurations are the same as those of the first embodiment. Further, a heat sink (9 in FIG. 3) may be applied instead of the cooling fan 5.

  According to the third embodiment, the heat transfer path in the wiring board 3 becomes thick and the thermal resistance can be lowered, so that the number of through holes 3d can be reduced. As a result, a region where the wiring pattern can be formed in the region between the conductive solid pattern 3b and the conductive solid pattern 3c in the wiring substrate 3 is widened, the number of wiring layers of the wiring substrate 3 can be reduced, and the cost can be reduced. Can do.

  Embodiment 4 An electronic apparatus according to Embodiment 4 of the present invention will be described with reference to the drawings. FIG. 5 is a side view schematically showing the structure of an electronic device according to Embodiment 4 of the present invention.

  The fourth embodiment is a modification of the first embodiment, in which a plurality of semiconductor packages 1 and 10 that are heating elements are mounted on the wiring board 2, and the heat transfer member 4 is connected to both the semiconductor packages 1 and 10 (contacts). ). Other configurations are the same as those of the first embodiment. The configuration of the semiconductor package 10 may be the same as or different from that of the semiconductor package 1. Further, a heat sink (9 in FIG. 3) may be applied instead of the cooling fan 5. Furthermore, a heat transfer material (corresponding to 3g in FIG. 4) may be filled inside the through hole 3d.

  According to the fourth embodiment, the same effects as those of the first embodiment can be obtained, and it is not necessary to provide the cooling fan 5 for each of the plurality of semiconductor packages 1 and 10, and the cooling fan 5 can be integrated into one. , Noise can be reduced.

  An electronic apparatus according to Embodiment 5 of the present invention will be described with reference to the drawings. FIG. 6 is a side view schematically showing the structure of the electronic device according to the fifth embodiment of the present invention.

  The fifth embodiment is a modification of the first embodiment and has a configuration in which the wiring boards 2, 11, and 3 are stacked in three stages (four or more stages are also possible). That is, the wiring board 11 and the heat transfer member 4 ′ are provided between the wiring board 3 and the heat transfer member 4 in the first embodiment. In connection with this, the support | pillar 7 is also provided between the wiring boards 11 and 3, and between the wiring boards 2 and 11 and between the wiring boards 11 and 3 is also electrically connected via the connector 6. Other configurations are the same as those of the first embodiment.

  The wiring board 11 is a wiring board (for example, an electronic circuit board or a printed wiring board) in which a wiring pattern (signal wiring, power wiring, for example, copper) is formed on the surface or inside of an insulator (for example, insulating resin). . The wiring board 11 has a plurality of electronic components 11a mounted on both sides. The wiring board 11 is a sub-board on which the semiconductor package 1 is not mounted. The wiring board 11 is arranged at a predetermined interval with respect to the wiring board 2. The wiring board 11 has a connector portion 6b attached to a position corresponding to the connector portion 6a of the wiring board 2 on the surface on the wiring board 2 side. The wiring board 11 has a connector portion 6a attached to a position corresponding to the connector portion 6b of the wiring board 3 on the surface on the wiring board 3 side. The wiring board 11 is electrically connected to the wiring board 2 by connecting the connector part 6 b to the connector part 6 a of the wiring board 2, and the connector part 6 a is connected to the connector part 6 b of the wiring board 3. Thus, the wiring board 3 is electrically connected. The wiring board 11 supports the wiring board 2 via the support column 7 at a position that does not conflict with the electronic component 2 a, the connector portion 6 a, and the semiconductor package 1 on the surface on the wiring board 2 side. The wiring board 11 supports the wiring board 3 via the support column 7 at a position where it does not contact the electronic component 3a, the connector portion 6b, and the heat transfer member 4 ′ on the surface on the wiring board 3 side.

  Similar to the wiring substrate 3, the wiring substrate 11 has a conductive solid pattern (similar to 3 b and 3 c in FIG. 2) and through-holes as a structure that transfers heat from the semiconductor package 1 toward the wiring substrate 3. 11d. The conductor solid pattern (portion corresponding to 3b in FIG. 2) is formed from a conductor (for example, copper) for connecting (contacting or joining) to the heat transfer member 4 ′ on the surface of the wiring board 11 on the wiring board 3 side. And is connected to the through hole 11d. The solid conductor pattern (portion corresponding to 3c in FIG. 2) is made of a conductor (for example, copper) for connecting (contacting or joining) to the heat transfer member 4 on the surface of the wiring substrate 11 on the wiring substrate 2 side. It is a solid pattern and is connected to the through hole 11d. The through hole 11d is a tubular conductor (for example, copper) that penetrates the insulator of the wiring board 11 in the region where the heat transfer members 4 and 4 'are disposed, and corresponds to a solid conductor pattern (3b and 3c in FIG. 2). Connected).

  The heat transfer member 4 ′ is a member that transmits heat transferred from the semiconductor package 1 through the heat transfer member 4 and the wiring board 11 (through hole 11 d) toward the wiring board 3 (through hole 3 d). The heat transfer member 4 ′ is interposed between the wiring board 11 and the wiring board 3, and is connected to the wiring board 11 and the wiring board 3. For the heat transfer member 4 ′, for example, a heat conductive rubber capable of elastic deformation and heat transfer can be used. By using heat conductive rubber for the heat transfer member 4 ′, heat can be transferred efficiently by being in close contact with the wiring board 11 and the wiring board 3.

  According to the fifth embodiment, the same effects as the first embodiment can be obtained, and a configuration in which three or more wiring boards are stacked can be dealt with.

  It should be noted that the embodiments and examples may be changed and adjusted within the scope of the entire disclosure (including claims and drawings) of the present invention and based on the basic technical concept. Various combinations or selections of various disclosed elements are possible within the scope of the claims of the present invention. That is, the present invention naturally includes various variations and modifications that could be made by those skilled in the art according to the entire disclosure including the claims and the drawings, and the technical idea.

1, 10 Semiconductor package 1a, 10a Bump 2 Wiring board (first wiring board)
2a Electronic components 3 Wiring board (second wiring board)
3a Electronic component 3b, 3c Solid conductor pattern 3d Through hole 3e Wiring pattern 3f Insulator 3g Heat transfer material 4 Heat transfer member 4 'Heat transfer member (other heat transfer member)
5 Cooling fan (heat dissipation means)
6 Connector 6a, 6b Connector 7 Strut 8 Thermal conductive adhesive 9 Heat sink (Heat dissipation means)
11 Wiring boards (other wiring boards)
11a Electronic component 11d Through hole (other through holes)
100 electronic devices

Claims (10)

A semiconductor package as a heat source;
A first wiring board for mounting the semiconductor package;
A second wiring board disposed at a predetermined interval from a surface of the first wiring board on which the semiconductor package is mounted and having one or a plurality of through holes;
A heat transfer member that is interposed between the through hole of the second wiring board and the semiconductor package and transmits heat from the semiconductor package to the through hole;
The second wiring board is bonded so that heat from the through hole is transmitted on the surface opposite to the heat transfer member side of the second wiring board, and heat radiating means for releasing the transmitted heat to the outside,
An electronic device comprising:   The electronic device according to claim 1, wherein the heat radiating means is a cooling fan or a heat sink.   The second wiring board is bonded to the heat dissipation means and connected to the through hole, and the second conductor solid pattern is connected to the heat transfer member and connected to the through hole. The electronic device according to claim 1, further comprising:   4. The electronic device according to claim 1, wherein the through hole is connected to a GND pattern or a power supply pattern formed in the second wiring board. 5.   The electronic device according to claim 1, wherein the through hole is formed in a tubular shape, and a heat transfer material is filled inside the through hole.   6. The electronic device according to claim 1, further comprising a heat conductive adhesive that adheres the heat dissipation unit to the through hole and transmits heat from the through hole to the heat dissipation unit. . In the first wiring board, comprising one or more other semiconductor packages mounted in a region different from the semiconductor package,
The heat transfer member is interposed between the through hole of the second wiring board and the other semiconductor package, and also transfers heat of the other semiconductor package to the second wiring board. The electronic device according to any one of claims 1 to 6.   The electronic device according to claim 1, wherein the semiconductor package is mounted on the first wiring substrate via a plurality of bumps.   The electronic device according to claim 1, wherein the heat transfer member is made of a heat conductive rubber that is elastically deformable and capable of transferring heat. Between the second wiring board and the heat transfer member, other heat transfer members and other wiring boards are alternately arranged,
The other heat transfer member is disposed so that heat is transferred from the heat transfer member to the through hole of the second wiring board, and another through hole is provided in the other wiring board. An electronic device according to any one of claims 1 to 9.

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