JP2012156350A - Method of manufacturing circuit mounting board and printed circuit board - Google Patents

Abstract

A circuit mounting board manufacturing method and a printed board capable of reducing heat applied to an electric component when mounting the electric component on the board and preventing an increase in manufacturing cost are provided.
A method of manufacturing a circuit mounting board 201 includes soldering first lands 21 and 22 for soldering a target component 11 and non-target components 12 and 71 having higher heat resistance than the target component 11. Second lands 23, 24, 72, and 73, and the area of the first lands 21, 22 corresponds to the wiring patterns 74, 75 of the second lands 23, 24, 72, 73. Preparing a printed circuit board 101 that is larger than the area of the second lands 23 and 24 that are not covered; and soldering the target component 11 to the printed circuit board 101 using the first lands 21 and 22. .
[Selection] Figure 1

Description

  The present invention relates to a circuit mounting board manufacturing method and a printed circuit board, and more particularly to a circuit mounting board manufacturing method and a printed circuit board that take measures against heat applied to an electrical component during manufacturing.

  Countermeasures for heat dissipation of electrical equipment are an important issue. As an example of measures for heat dissipation of electrical equipment, for example, Japanese Patent Laid-Open No. 2001-168476 (Patent Document 1) discloses the following technique. That is, the heat generating component is mounted on the circuit board and transmitted to the heat radiating component to radiate heat.

JP 2001-168476 A

  By the way, there is a varistor as an electronic component for protecting electrical equipment from lightning surge. Generally, varistors have low heat resistance, and may become short-circuited when broken at high temperatures.

  For this reason, a circuit using a varistor needs to be provided with a thermal fuse, for example, so that the circuit does not short-circuit when the varistor is broken by heat.

  And when soldering and mounting this thermal fuse to a printed circuit board, for example, a heat clip is attached to the lead of the thermal fuse so that the thermal fuse is not transmitted to the thermal fuse body so that the thermal fuse does not break due to heat. It is necessary to do so.

  However, in such a method, it becomes necessary to use a heat clip that is not mounted on a finished product of the electrical device for each lead of the thermal fuse. That is, since the heat clip is attached and the heat clip is removed after the soldering process, the manufacturing cost increases.

  In addition, even if the heat-generating component is radiated as in the technique described in Patent Document 1, a component that is weak against heat and hardly generates heat cannot be protected by the soldering process.

  The present invention has been made to solve the above-described problems, and its object is to reduce the heat applied to an electrical component when mounting the electrical component on a substrate and to prevent an increase in manufacturing cost. It is an object of the present invention to provide a method for manufacturing a circuit mounting board and a printed board.

  In order to solve the above problems, a circuit mounting board manufacturing method according to an aspect of the present invention includes a first land for soldering a target component, and a non-target component having higher heat resistance than the target component. One or a plurality of second lands for soldering, and the area of the first lands is the area of the second lands that are not covered with the wiring pattern among the second lands. The method includes the steps of preparing a relatively large printed circuit board and soldering the target component to the printed circuit board using the first land.

  Thereby, since the area which a 1st land contacts with air can be increased, the temperature rise of a target component can be easily suppressed, without attaching / detaching a heat clip to a target component at the time of soldering of a target component. Can do. Therefore, when the electrical component is mounted on the substrate, heat applied to the electrical component can be reduced and an increase in manufacturing cost can be prevented.

  Preferably, in the step of preparing the printed circuit board, the first land is further formed to include a portion for placing a part or all of the heat dissipation member on the first land. In the step of preparing a substrate and soldering the target component, the target component is soldered after the heat radiating member is placed on the first land.

  As described above, the configuration in which the heat dissipating member is locally disposed on the first land allows the heat radiation amount to be insufficient even when the area of the first land is maximized, or the first due to design restrictions. If the land area of the land cannot be made sufficiently large and the heat radiation amount is insufficient, the shortage can be compensated. Here, since the area of the first land is larger than that of the second land for the non-target component, it is easy to place the heat dissipation member. In addition, higher heat dissipation can be achieved as compared with a method in which the first land and other portions are thermally coupled using a heat conducting member. In addition, a heat clip needs to be prepared for each lead of the target component, whereas a heat dissipation member need not be prepared for each lead of the target component. That is, normally, one electrical component has two or more leads, and a plurality of non-heat resistant components such as thermal fuses may be arranged adjacent to each other on one printed circuit board. For example, it is possible to place one heat radiating member on each land so as to straddle the lands for three leads. Thereby, compared with the method of attaching and detaching a heat clip to an object part, the number of used parts can be reduced and work time can be reduced significantly.

  Preferably, in the step of preparing the printed circuit board, a printed circuit board formed so that the first land further extends in a direction toward a portion having a larger heat capacity than the resist in the printed circuit board, In the step of soldering the target component, the first land and the portion having a large heat capacity are thermally coupled using a heat conducting member, and then the target component is soldered.

  As a result, even when the area of the first land is maximized, the heat dissipation amount is still insufficient, or the area of the first land cannot be sufficiently increased due to design restrictions, resulting in insufficient heat dissipation. In some cases, the shortage can be compensated. Further, for example, even when there is no space for placing the heat dissipation member, the shortage of the heat dissipation amount of the first land alone can be compensated. Further, similarly to the method for manufacturing a circuit-mounted board using a heat dissipation member, it is not necessary to prepare a heat conduction member for each lead of the target component, so that the heat clip is attached to and removed from the target component. The number of parts used can be reduced and the working time can be greatly reduced.

  Preferably, in the step of preparing the printed circuit board, the first land is further spaced apart from the other conductive parts by a distance equal to or greater than a minimum distance from the other conductive parts including the second lands. A printed circuit board provided is prepared.

  Thus, for example, by setting the gap between the first land and other adjacent lands and patterns so as to obtain the minimum creepage distance necessary for electrical insulation from other conductive parts, The area of the first land can be maximized.

  Preferably, the target component is a thermal fuse.

  In this way, a more remarkable effect can be obtained by taking measures against heat dissipation at the time of soldering, particularly for a temperature fuse having low heat resistance.

  According to another aspect of the present invention, there is provided a circuit mounting board manufacturing method having a first main surface for mounting a component and a second main surface, and soldering the target component on the first main surface. A first land for soldering and a second land for soldering the target component on the second main surface, wherein the area of the first land is larger than the area of the second land Preparing a board; and soldering the target component to the printed board using the first land and the second land.

  Thus, by increasing the area of the land of the target part on the first main surface as compared with the land of the target part on the second main surface, the area where the land on the first main surface is in contact with air can be increased. Therefore, the temperature rise of the target component can be easily suppressed without attaching or detaching the heat clip to the target component when soldering the target component. Therefore, when the electrical component is mounted on the substrate, heat applied to the electrical component can be reduced and an increase in manufacturing cost can be prevented.

  In order to solve the above problems, a printed circuit board according to an aspect of the present invention solders a first land for soldering a target component and a non-target component having higher heat resistance than the target component. One or a plurality of second lands are provided, and the area of the first lands is larger than the area of the second lands that are not covered with the wiring pattern among the second lands.

  Thereby, since the area which a 1st land contacts with air can be increased, the temperature rise of a target component can be easily suppressed, without attaching / detaching a heat clip to a target component at the time of soldering of a target component. Can do. Therefore, when the electrical component is mounted on the substrate, heat applied to the electrical component can be reduced and an increase in manufacturing cost can be prevented.

  A printed circuit board according to an aspect of the present invention has a first main surface for mounting a component and a second main surface, and a first for soldering the target component on the first main surface. A land and a second land for soldering the target component on the second main surface are provided, and the area of the first land is larger than the area of the second land.

  Thus, by increasing the area of the land of the target part on the first main surface as compared with the land of the target part on the second main surface, the area where the land on the first main surface is in contact with air can be increased. Therefore, the temperature rise of the target component can be easily suppressed without attaching or detaching the heat clip to the target component when soldering the target component. Therefore, when the electrical component is mounted on the substrate, heat applied to the electrical component can be reduced and an increase in manufacturing cost can be prevented.

  ADVANTAGE OF THE INVENTION According to this invention, when mounting an electrical component on a board | substrate, while being able to reduce the heat added to an electrical component, the increase in manufacturing cost can be prevented.

It is a figure which shows the structure of the circuit mounting board | substrate which concerns on the 1st Embodiment of this invention. It is a figure which shows the outline of the cross section along the II-II line | wire in FIG. 1 of the circuit mounting board | substrate 201. FIG. It is the flowchart which defined the procedure for manufacturing the circuit mounting board | substrate which concerns on the 1st Embodiment of this invention. It is a figure which shows the structure of the circuit mounting board | substrate which concerns on the 2nd Embodiment of this invention. It is the flowchart which defined the procedure for manufacturing the circuit mounting board | substrate which concerns on the 2nd Embodiment of this invention. It is a figure which shows the structure of the circuit mounting board | substrate which concerns on the 3rd Embodiment of this invention. It is a figure which shows the outline of the cross section along the VII-VII line in FIG. 6 of the circuit mounting board 203. FIG. It is the flowchart which defined the procedure for manufacturing the circuit mounting board | substrate which concerns on the 3rd Embodiment of this invention. It is a figure which shows the structure of the modification of the circuit mounting board | substrate which concerns on the 3rd Embodiment of this invention. It is a figure which shows the structure of the modification of the circuit mounting board | substrate which concerns on the 3rd Embodiment of this invention.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the drawings, the same or corresponding parts are denoted by the same reference numerals and description thereof will not be repeated.

<First Embodiment>
FIG. 1 is a diagram showing a configuration of a circuit mounting board according to the first embodiment of the present invention.

  Referring to FIG. 1, the circuit mounting board 201 includes a printed board 101, a target component 11, and non-target components 12 and 71. The printed circuit board 101 includes lands (first lands) 21 and 22, lands (second lands) 23 and 24, and wiring patterns 25, 26, and 72 to 75. The material of each land and each wiring pattern is, for example, copper.

  The printed circuit board 101 has a main surface S1 and a main surface S2. The main surface S1 is a so-called component surface on which various electrical components are mounted. The main surface S2 is a so-called solder surface. For example, during mass production, the entire main surface S2 is soldered all at once by being immersed in the molten solder in the solder bath.

  The target component 11 is, for example, a DIP (Dual Inline Package) component, and is a non-heat resistant component such as a thermal fuse. The thermal fuse 11 is blown at 140 ° C., for example. On the other hand, the temperature of the solder bath is 260 ° C., for example, and the temperature of the soldering iron is 350 ° C., for example. For this reason, if the thermal fuse 11 is soldered without taking measures against heat dissipation, the thermal fuse 11 often breaks.

  Further, the thermal fuse 11 is mounted in a state where the main body portion is spaced from the printed board 101 so as not to be affected by the heat from the printed board 101.

  The non-target components 12 and 71 are, for example, DIP components, and are electrical components having heat resistance higher than 260 ° C., which is the temperature of the solder bath, such as resistors and capacitors.

  Lands 21-24 and wiring patterns 25, 26, 72-75 are provided on main surface S1. The lands 21 and 22 are provided for soldering the thermal fuse 11. The lands 23 and 24 are provided for soldering the non-target component 12.

  The lands 21 and 22 are connected to electrical components other than the thermal fuse 11 via wiring patterns 25 and 26, respectively.

  The lands 23 and 24 are connected to electrical components other than the non-target component 12 through wiring patterns 74 and 75, respectively.

  The target component 71 is connected to other electrical components via the wiring patterns 72 and 73. The wiring patterns 72 and 73 are formed with a large width in order to increase the electric capacity, and the two lands for soldering the target component 71 are covered with the wiring patterns 72 and 73, respectively.

  Here, the areas of the lands 21 and 22 are larger than the lands that are not covered by the wiring pattern, that is, the lands 23 and 24.

  The lands 21 and 22 are formed such that their widths are at least larger than the widths of the lands 23 and 24 and the creeping distances with other conductive portions are not less than a predetermined value.

  That is, the lands 21 and 22 are provided apart from other conductive portions by a distance equal to or longer than the minimum distance K necessary for ensuring electrical insulation with other conductive portions including the lands 23 and 24, for example.

  Specifically, the land 21 is provided at a distance from the adjacent land 23 by a minimum distance K. Further, the land 22 is provided at a distance from the adjacent land 24 by a minimum distance K. Adjacent lands 21 and lands 22 are spaced apart from each other by a minimum distance K.

  The minimum distance K is, for example, several mm in order to ensure electrical insulation in a circuit to which a voltage of several tens to several hundreds of volts is applied. In a circuit to which a voltage of several volts is applied, the minimum distance K can be set to, for example, 0.4 mm to 0.5 mm from the viewpoint of manufacturing and quality.

  FIG. 2 is a diagram showing an outline of a cross section taken along line II-II in FIG.

  Referring to FIG. 2, printed circuit board 101 further includes lands (second lands) 27 and 29 and through holes 28 and 30.

  Lands 27 and 29 are provided for soldering thermal fuse 11 on main surface S2.

  The lead 81 of the thermal fuse 11 is soldered in a state of penetrating from the component surface, that is, the main surface S1 side of the printed board 101, to the solder surface, that is, the main surface S2 side, through the through hole 28. That is, the solder 81 is poured into the lands 21 on the component surface, the lands 27 on the solder surface, and the through holes 28, thereby fixing the leads 81 to the printed circuit board 101.

  Further, the lead 82 of the thermal fuse 11 is soldered in a state of penetrating from the component surface, that is, the main surface S1 side of the printed board 101 to the solder surface, that is, the main surface S2 side through the through hole 30. That is, the solder 82 is poured into the lands 22 on the component surface, the lands 29 on the solder surface, and the through holes 30, thereby fixing the leads 82 to the printed circuit board 101.

  Here, the area of the land 21 is larger than the area of the land 27. Further, the area of the land 22 is larger than the area of the land 29.

  FIG. 3 is a flowchart defining a procedure for manufacturing the circuit-mounted board according to the first embodiment of the present invention.

  Referring to FIG. 3, first, printed circuit board 101 is prepared (step S1). The printed circuit board 101 includes lands 21 and 22 for soldering the thermal fuse 11 on the main surface S1, lands 23 and 24 for soldering the non-target component 12 on the main surface S1, and wiring patterns 25 and 26. 72-75. The areas of the lands 21 and 22 are larger than the areas of the lands 23 and 24 which are lands that are not covered with the wiring pattern.

  The printed circuit board 101 includes lands 27 and 29 for soldering the thermal fuse 11 on the main surface S2, and the areas of the lands 21 and 22 are larger than the areas of the lands 27 and 29.

  Further, in the printed circuit board 101, the lands 21 and 22 are provided with a distance from the other conductive parts at least the minimum distance K from the other conductive parts including the lands 23 and 24.

  Next, each component, that is, the thermal fuse 11 and the non-target components 12 and 71 are soldered. More specifically, the thermal fuse 11 is soldered to the printed circuit board 101 using the lands 21 and 22 and the lands 27 and 29. Further, the non-target component 12 is soldered to the printed circuit board 101 using the lands 23 and 24. Further, the non-target component 71 is soldered to the printed circuit board 101 using the wiring patterns 72 and 73 (step S2).

  By the way, when soldering and mounting a thermal fuse on a printed circuit board, for example, a heat clip is attached to the lead of the thermal fuse so that the thermal fuse is not transmitted to the thermal fuse body, so that the thermal fuse does not break due to heat. It is necessary to. However, in such a method, it becomes necessary to use a heat clip that is not mounted on a finished product of the electrical device for each lead of the thermal fuse. That is, since the heat clip is attached and the heat clip is removed after the soldering process, the manufacturing cost increases.

  On the other hand, in the method for manufacturing the circuit mounting board according to the first embodiment of the present invention, the lands 21 and 22 for soldering the thermal fuse 11 and the non-heat resistant non-higher temperature than the thermal fuse 11 are used. The printed circuit board 101 is prepared which includes lands 23 and 24 for soldering the target component 12 and has an area of the lands 21 and 22 larger than that of the lands 23 and 24 which are lands which are not covered with the wiring pattern. . Then, the thermal fuse 11 is soldered to the printed circuit board 101 using the lands 21 and 22.

  Thus, in the circuit mounting board manufacturing method according to the first embodiment of the present invention, the printed board is used as a heat dissipation component.

  That is, the copper foil normally used for circuit formation is also used for heat dissipation measures. In addition, heat dissipation measures are not taken when electrical components are mounted on unfinished electrical equipment, rather than heat dissipation countermeasures on electrical equipment completed as products.

  Here, the width of the land and the wiring pattern is determined according to the amount of current flowing through them and, for example, according to the ratio of 1 mm / 1 A (ampere). Also, the land and the wiring pattern usually have a minimum width of 0.4 mm. Also, the land width of the printed circuit board is often unified according to the maximum current capacity.

  On the other hand, in the printed circuit board according to the first embodiment of the present invention, the areas of the lands 21 and 22 that are copper foils for soldering the leads of the target component 11 are reduced on the component surface of the printed circuit board 101. , Larger than the minimum area required to ensure current capacity.

  Accordingly, since the area where the lands 21 and 22 are in contact with air through the resist can be increased, the temperature of the temperature fuse 11 can be increased without attaching or removing the heat clip to the temperature fuse 11 when soldering the temperature fuse 11. The rise can be easily suppressed.

  Therefore, in the circuit mounting board manufacturing method according to the first embodiment of the present invention, when the electrical component is mounted on the board, heat applied to the electrical component is reduced and an increase in manufacturing cost is prevented. it can.

  In the method for manufacturing a circuit-mounted board according to the first embodiment of the present invention, the minimum distance between the lands 21 and 22 and other conductive parts including the lands 23 and 24 in the step of preparing the printed board 101. A printed circuit board 101 provided with a distance of K or more from other conductive parts is prepared.

  Thus, for example, by setting the gap between the lands 21 and 22 and other adjacent lands and patterns so as to obtain the minimum creepage distance necessary for electrical insulation from other conductive portions, The area of the lands 21 and 22 can be maximized.

  In the method for manufacturing a circuit-mounted board according to the first embodiment of the present invention, the target component is a thermal fuse.

  In this way, a more remarkable effect can be obtained by taking measures against heat dissipation at the time of soldering, particularly for a temperature fuse having low heat resistance.

  Further, in the method for manufacturing a circuit mounting board according to the first embodiment of the present invention, the circuit mounting board has a main surface S1 for mounting components and a main surface S2, and the thermal fuse 11 is soldered on the main surface S1. Lands 21 and 22, and lands 27 and 29 for soldering the thermal fuse 11 on the main surface S 2, and the printed circuit board 101 having an area of the lands 21 and 22 larger than that of the lands 27 and 29 is provided. prepare. Then, the thermal fuse 11 is soldered to the printed circuit board 101 using the lands 21 and 22 and the lands 27 and 29.

  In this way, by increasing the area of the land of the target part on the part surface compared to the land of the target part on the solder surface, it is possible to increase the area where the land on the part surface comes into contact with air via the resist, When soldering the thermal fuse 11, it is possible to easily suppress the temperature rise of the thermal fuse 11 without attaching or detaching the heat clip to the thermal fuse 11.

  Therefore, when the electrical component is mounted on the substrate, heat applied to the electrical component can be reduced and an increase in manufacturing cost can be prevented.

  In the circuit mounting board manufacturing method according to the first embodiment of the present invention, the target component is the thermal fuse. However, the present invention is not limited to this. The target component may be any component as long as it has a lower heat resistance than solder.

  Next, another embodiment of the present invention will be described with reference to the drawings. In the drawings, the same or corresponding parts are denoted by the same reference numerals and description thereof will not be repeated.

<Second Embodiment>
The present embodiment relates to a circuit mounting board manufacturing method that employs a further heat dissipation measure as compared with the circuit mounting board manufacturing method according to the first embodiment. Except for the contents described below, the method is the same as the method for manufacturing the circuit-mounted substrate according to the first embodiment.

  FIG. 4 is a diagram showing a configuration of a circuit mounting board according to the second embodiment of the present invention.

  With reference to FIG. 4, the circuit mounting board 202 includes a printed circuit board 102, a target component 11, and non-target components 12 and 71. The printed circuit board 102 includes lands (first lands) 51 and 52, lands (second lands) 23 and 24, and wiring patterns 25, 26, and 72 to 75. The material of each land and each wiring pattern is, for example, copper.

  The lands 51 and 52 are formed so as to have a larger area than the lands 23 and 24, and in addition, a part for placing a part or all of the heat radiating member such as the heat sinks 54 and 55 on the lands 51 and 52. It is formed to include.

  FIG. 5 is a flowchart defining a procedure for manufacturing a circuit-mounted board according to the second embodiment of the present invention.

  Referring to FIG. 5, first, printed circuit board 102 is prepared. The printed circuit board 102 is formed so that the lands 51 and 52 include a part for placing part or all of the heat radiating member, for example, the heat sinks 54 and 55 on the lands 51 and 52 (step S11).

  Next, part or all of the heat sinks 54 and 55 are placed on the lands 51 and 52, respectively (step S12). The heat sinks 54 and 55 need not be mounted on the product.

  Next, each component, that is, the thermal fuse 11 and the non-target components 12 and 71 are soldered. More specifically, the thermal fuse 11 is soldered to the printed circuit board 102 using the lands 51 and 52 and the lands 27 and 29. Further, the non-target component 12 is soldered to the printed circuit board 102 using the lands 23 and 24. Further, the non-target component 71 is soldered to the printed circuit board 102 using the wiring patterns 72 and 73 (step S13).

  In the circuit mounting board manufacturing method according to the second embodiment of the present invention, the lands 51 and 52 are provided with portions for placing part or all of the heat radiating members such as the heat sinks 54 and 55 on the lands 51 and 52. A printed circuit board 102 formed so as to be included is prepared. Then, after placing a part or all of the heat dissipation member on the lands 21 and 22, the thermal fuse 11 is soldered.

  As described above, when the heat sinks 54 and 55 are locally disposed on the lands 51 and 52, the heat radiation amount is still insufficient even when the areas of the lands 51 and 52 are maximized, or the land is limited due to design restrictions. When the areas of 51 and 52 cannot be sufficiently increased and the heat radiation amount is insufficient, the shortage can be compensated.

  Here, since the areas of the lands 51 and 52 are larger than the lands 23 and 24 for non-target parts, the heat sinks 54 and 55 can be easily placed. Further, as will be described later, it is possible to achieve higher heat dissipation as compared with a method in which the lands 51 and 52 are thermally coupled to other portions using a copper plate or a copper tape.

  In addition, a heat clip needs to be prepared for each lead of the thermal fuse 11, whereas a heat sink need not be prepared for each lead of the thermal fuse 11. That is, normally, one electrical component has two or more leads, and a plurality of non-heat resistant components such as thermal fuses may be arranged adjacent to each other on one printed circuit board. For example, it is possible to place one heat sink on each land so as to straddle the lands for three leads. Thereby, compared with the method of attaching and detaching a heat clip to the thermal fuse 11, the number of used parts can be reduced and work time can be reduced significantly.

  Since other configurations and operations are the same as those of the method for manufacturing the circuit-mounted substrate according to the first embodiment, detailed description thereof will not be repeated here.

  Next, another embodiment of the present invention will be described with reference to the drawings. In the drawings, the same or corresponding parts are denoted by the same reference numerals and description thereof will not be repeated.

<Third Embodiment>
The present embodiment relates to a circuit mounting board manufacturing method that employs a further heat dissipation measure as compared with the circuit mounting board manufacturing method according to the first embodiment. Except for the contents described below, the method is the same as the method for manufacturing the circuit-mounted substrate according to the first embodiment.

  FIG. 6 is a diagram showing a configuration of a circuit mounting board according to the third embodiment of the present invention.

  With reference to FIG. 6, the circuit mounting board 203 includes a printed circuit board 103, a target component 11, and non-target components 12 and 71. The printed circuit board 103 includes lands (first lands) 61 and 62, lands (second lands) 23 and 24, wiring patterns 25, 26 and 72 to 75, and a copper foil pattern 63. The material of each land and each wiring pattern is, for example, copper.

  The copper foil pattern 63 is a solid pattern for ground, for example, and has a significantly larger area and larger heat capacity than each land.

  The lands 61 and 62 are formed so as to have a larger area than the lands 23 and 24, and are formed so as to spread in a direction toward the copper foil pattern 63 in the printed circuit board 103 having a larger heat capacity than the resist. Has been.

  FIG. 7 is a diagram showing an outline of a cross section taken along line VII-VII in FIG.

  Referring to FIG. 7, it is difficult for heat to be transmitted between land 62 and copper foil pattern 63 via resist 66. Therefore, in the method of manufacturing the circuit mounting board 203, heat is transmitted via a heat conducting member such as a copper tape or a copper plate 65. Thereby, the thermal conductivity from the land 62 to the copper foil pattern 63 can be enhanced.

  FIG. 8 is a flowchart defining a procedure for manufacturing a circuit-mounted board according to the third embodiment of the present invention.

  Referring to FIG. 8, first, printed circuit board 103 is prepared (step S21). The printed circuit board 103 is formed such that the lands 61 and 62 spread in a direction toward a portion having a larger heat capacity than the resist 66 in the printed circuit board 103, for example, the copper foil pattern 63.

  Next, the lands 61 and 62 and the portion having a large heat capacity are thermally coupled using a heat conducting member (step S22).

  Specifically, the land 61 and the copper foil pattern 63 having a large heat capacity in the vicinity of the land 21 are thermally coupled using a copper tape or a copper plate 64. Further, the land 62 and the copper foil pattern 63 having a large heat capacity in the vicinity of the land 62 are thermally coupled using a copper tape or a copper plate 65.

  Next, each component, that is, the thermal fuse 11 and the non-target components 12 and 71 are soldered. More specifically, the thermal fuse 11 is soldered to the printed circuit board 103 using the lands 61 and 62 and the lands 27 and 29. Further, the non-target component 12 is soldered to the printed circuit board 103 using the lands 23 and 24. Further, the non-target component 71 is soldered to the printed circuit board 103 using the wiring patterns 72 and 73 (step S23).

  When electrical insulation between the lands 61 and 62 and the copper foil pattern 63 can be ensured by the resist 66 on the printed circuit board 103, the copper tape or the copper plates 64 and 65 may not be removed after the thermal fuse 11 is soldered. .

  In the method for manufacturing a circuit-mounted board according to the third embodiment of the present invention, the lands 61 and 62 are formed so as to spread in the direction toward the portion having a larger heat capacity than the resist 66 on the printed board 103, for example, the copper foil pattern 63 Prepared printed circuit board 103 is prepared. Then, after the lands 61 and 62 and the portion having a large heat capacity are thermally coupled to each other by using a heat conducting member such as a copper tape or copper plates 64 and 65, the temperature fuse 11 is soldered.

  As described above, the thermal fuse and the portion having a large heat capacity near the thermal fuse, for example, the solid ground pattern, are thermally coupled using the copper plate or the copper tape.

  As a result, even if the areas of the lands 61 and 62 are maximized, the amount of heat dissipation is still insufficient, or the area of the lands 61 and 62 cannot be sufficiently increased due to design restrictions, resulting in insufficient heat dissipation. In some cases, the shortage can be compensated. Further, for example, even when there is no space for placing the heat sink, the shortage of the heat radiation amount of the lands 61 and 62 can be compensated.

  Further, as in the method of manufacturing the circuit mounting board according to the second embodiment of the present invention using the heat sink, it is not necessary to prepare the copper plate or the copper tape for each lead of the thermal fuse 11, so that the heat clip Compared with the method of attaching / detaching to / from the thermal fuse 11, the number of parts used can be reduced and the working time can be greatly reduced.

  FIG. 9 is a diagram showing a configuration of a modified example of the circuit mounting board according to the third exemplary embodiment of the present invention.

  Referring to FIG. 9, the circuit mounting board 204 includes a printed board 104, a target component 11, and non-target components 12 and 71. The printed circuit board 103 includes lands (first lands) 31, 32, lands (second lands) 23, 24, wiring patterns 25, 26, 72-75, and screw hole lands 33-36. The material of each land and each wiring pattern is, for example, copper.

  In addition to the lands 31 and 32 being formed to have a larger area than the lands 23 and 24, the lands 31 and 32 spread in the direction toward the portions having a larger heat capacity than the resist, for example, screw hole lands 35 and 36, respectively. It is formed as follows.

  In the method of manufacturing the circuit mounting board 204, before soldering the target component 11 to the printed circuit board 104, the land 31 and the screw hole land 35 having a large heat capacity near the land 31 are used using a copper tape or a copper plate 37. And heat-bond. Further, the land 32 and the screw hole land 36 having a large heat capacity in the vicinity of the land 32 are thermally coupled using a copper tape or a copper plate 38.

  FIG. 10 is a diagram showing a configuration of a modification of the circuit mounting board according to the third embodiment of the present invention.

  Referring to FIG. 10, the circuit mounting board 205 includes a printed circuit board 105, a target component 11, and non-target components 12 and 71. The printed circuit board 105 includes lands (first lands) 41, 42, lands (second lands) 23, 24, wiring patterns 25, 26, 72 to 75, and discarded plates 43, 44. The material of each land and each wiring pattern is, for example, copper.

  The lands 41 and 42 are formed so as to have a larger area than the lands 23 and 24, and are formed so as to spread in the direction toward the portion of the printed circuit board 103 having a larger heat capacity than the resist, for example, the discard plate 44. ing.

  In the method of manufacturing the circuit mounting board 205, before soldering the target component 11 to the printed board 105, the land 41 and the discard plate 44 having a large heat capacity in the vicinity of the land 41 are used by using a copper tape or a copper plate 45. Thermally bond. Further, the land 42 and the discard plate 44 having a large heat capacity in the vicinity of the land 42 are thermally coupled using a copper tape or a copper plate 46.

  In addition, it is also possible to combine the manufacturing method of the circuit mounting board based on the 2nd Embodiment and 3rd Embodiment of this invention. That is, in addition to forming a large land area for soldering the target component, a heat dissipating member is placed on the land, and the land and the portion having a large heat capacity are thermally coupled by the heat conducting member. Then, the target part may be soldered. Thereby, the heat dissipation can be further increased.

  Since other configurations and operations are the same as those of the method for manufacturing the circuit-mounted substrate according to the first embodiment, detailed description thereof will not be repeated here.

  The above embodiment should be considered as illustrative in all points and not restrictive. The scope of the present invention is defined by the terms of the claims, rather than the description above, and is intended to include any modifications within the scope and meaning equivalent to the terms of the claims.

11 Thermal fuse (target parts)
12, 71 Non-target parts 21, 22, 31, 32, 41, 42, 51, 52, 61, 62 Land (first land)
23,24 land (second land)
25, 26, 72 to 75 Wiring pattern 27, 29 land (second land)
28, 30 Through hole 33-36 Screw hole land 37, 38, 45, 46, 64, 65 Copper tape or copper plate 43, 44 Discarding plate 54, 55 Heat sink 63 Copper foil pattern 66 Resist 72, 73, 74, 75 Wiring pattern 81, 82 Lead 101-105 Printed circuit board 201-205 Circuit mounting board

Claims (8)

A first land for soldering a target component; and one or a plurality of second lands for soldering a non-target component having higher heat resistance than the target component, the first land Preparing a printed circuit board having a larger area than the area of the second land that is not covered with the wiring pattern among the second lands,
And soldering the target component to the printed board using the first land. In the step of preparing the printed circuit board, the printed circuit board formed so that the first land further includes a part for placing a part or all of the heat dissipation member on the first land is prepared. And
2. The method for manufacturing a circuit-mounted board according to claim 1, wherein in the step of soldering the target component, the target component is soldered after the heat dissipation member is placed on the first land. In the step of preparing the printed circuit board, the first land is further prepared with a printed circuit board formed so as to spread in a direction toward a portion having a larger heat capacity than the resist in the printed circuit board,
The soldering of the target component includes soldering the target component after thermally coupling the first land and the portion having a large heat capacity using a heat conduction member. 3. A method for manufacturing a circuit-mounted board according to 2.   In the step of preparing the printed circuit board, the first land is further provided at a distance from the other conductive part at least a minimum distance from the other conductive part including each second land. The manufacturing method of the circuit mounting board | substrate of any one of Claims 1-3 which prepares a printed circuit board.   The method for manufacturing a circuit-mounted substrate according to claim 1, wherein the target component is a thermal fuse. A first land for mounting a component and a second main surface, a first land for soldering the target component on the first main surface, and the target component on the second main surface A second land for soldering, and preparing a printed circuit board having an area of the first land larger than an area of the second land;
And soldering the target component to the printed circuit board using the first land and the second land. A first land for soldering the target part;
One or a plurality of second lands for soldering non-target components having higher heat resistance than the target components;
The printed circuit board, wherein an area of the first land is larger than an area of the second land that is not covered with a wiring pattern among the second lands. A first land for mounting a component and a second main surface; a first land for soldering a target component on the first main surface;
A second land for soldering the target component on the second main surface,
The printed circuit board, wherein an area of the first land is larger than an area of the second land.

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