JP2012152701A - Hydrogen separation membrane, method of manufacturing the same, and hydrogen separation method - Google Patents
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Abstract
【課題】炭化水素の水蒸気改質用メンブレンリアクターにも利用可能な、高温においても脆性を示さず耐久性があると共に優れた水素透過性能を有する水素分離膜を提供する。また、その水素分離膜の製造方法を提供すると共に、水素分離方法を提供する。
【解決手段】パラジウムと銅と銀とを主体とする合金薄膜からなる水素分離膜であって、500℃以上での加熱処理後における前記合金薄膜の結晶構造が実質的に体心立方構造であることを特徴とする水素分離膜。
【選択図】なしThe present invention provides a hydrogen separation membrane that can be used in a membrane reactor for steam reforming of hydrocarbons, exhibits no brittleness even at high temperatures, has durability, and has excellent hydrogen permeation performance. Moreover, while providing the manufacturing method of the hydrogen separation membrane, the hydrogen separation method is provided.
A hydrogen separation membrane comprising an alloy thin film mainly composed of palladium, copper, and silver, and the crystal structure of the alloy thin film after heat treatment at 500 ° C. or higher is substantially a body-centered cubic structure. A hydrogen separation membrane characterized by that.
[Selection figure] None
Description
本発明は、水素分離膜、その製造方法及び水素分離方法に関するものである。 The present invention relates to a hydrogen separation membrane, a production method thereof, and a hydrogen separation method.
パラジウム又はパラジウム合金の薄膜は、水素の選択的透過性を有するものであり、この特性を利用して水素分離膜として用いられている。パラジウム合金薄膜として代表的なものとしてはパラジウム・銀合金薄膜及びパラジウム・銅合金薄膜が挙げられる。 A thin film of palladium or palladium alloy has a selective hydrogen permeability, and is used as a hydrogen separation membrane by utilizing this characteristic. Typical examples of the palladium alloy thin film include a palladium / silver alloy thin film and a palladium / copper alloy thin film.
パラジウム薄膜やパラジウム・銀合金薄膜はその結晶構造が面心立方構造を有しており、その特徴として水素を吸収すると膨張することが知られている。そのため水素分圧や温度の変動により膜が膨張収縮して膜が損傷・破壊される、所謂、水素脆化という現象が生じる。パラジウム又はパラジウム合金は水素分離膜として用いる場合には、一般に膜厚が薄いほど水素の透過速度が向上し、しかも高価なパラジウム等の貴金属使用量が減少する。しかし、面心立方構造を有するパラジウム系膜の過度の薄膜化は水素脆化によって膜が破壊されるため、膜寿命の低下をもたらす。 Palladium thin films and palladium / silver alloy thin films have a face-centered cubic structure, and are known to expand when they absorb hydrogen. For this reason, a so-called hydrogen embrittlement phenomenon occurs in which the film expands and contracts due to fluctuations in the hydrogen partial pressure and temperature, causing damage and destruction of the film. When palladium or a palladium alloy is used as a hydrogen separation membrane, generally, the thinner the film thickness, the higher the permeation rate of hydrogen, and the less the amount of noble metal used such as expensive palladium. However, excessive reduction in the thickness of the palladium-based film having a face-centered cubic structure causes the film to be destroyed due to hydrogen embrittlement, resulting in a decrease in film life.
一方、銅を40〜50重量%程度含有するパラジウム・銅合金はその結晶構造が300℃において体心立方構造であることが知られている(非特許文献1及び2)。このような体心立方構造を有するパラジウム・銅合金では水素の吸収が上記の面心立方構造の合金に比べて著しく少ないことが知られており(非特許文献3)、そのため水素脆化の危険が小さいことが予想され、実際に高い耐久性を示すことがわかっている。しかしながら、パラジウム・銅の2元系合金の状態図によればパラジウム・銅合金で最も高い水素透過性能を有する銅が40重量%含まれる合金では340〜550℃で面心立方構造と体心立方構造の混合された結晶構造となり、550℃以上で完全に面心立方構造に結晶転位が生じる(非特許文献1及び2)。実際に銅が40重量%含まれる合金を水素分離膜とした場合には、400℃と450℃における水素透過性能はほぼ同じで、450℃を超えると水素透過性能が著しく劣化する(非特許文献4)。これは450℃で既に面心立方構造の結晶相の出現があり、450℃を超えると面心立方構造が顕著になるために生じたと考えられる。よって面心立方構造に起因する水素脆化及び結晶転位に伴う脆化は450℃においても危惧され、そのため、銅が40重量%含まれる合金の水素分離膜としての利用は実用的には結晶相が主として体心立方構造である400℃以下で行うことが好ましいと言える。銅含有量が45〜48重量%のパラジウム・銅合金ではこの体心立方構造から面心立方構造への転位温度は600℃程度となり、体心立方構造と面心立方構造との共存領域はほとんど存在しないことが知られている(非特許文献1及び2)。よって、このような組成を有するパラジウム系水素分離膜は600℃近傍で体心立方構造を失わないので、600℃以下の温度領域では水素脆化及び結晶転位に伴う脆化の危険性が少ないことが予想される。しかし、銅含有量が40重量%より増加すると膜の結晶相が体心立方構造であっても水素透過速度の著しい低下が生じることが知られている。実際、47重量%のパラジウム・銅合金膜は600℃付近まで体心立方構造を保つが、その水素透過性能は40重量%のパラジウム・銅合金膜に比べて10〜20%程度しかないことが報告されている(非特許文献5)。 On the other hand, it is known that a palladium / copper alloy containing about 40 to 50% by weight of copper has a body-centered cubic structure at 300 ° C. (Non-patent Documents 1 and 2). It is known that the palladium-copper alloy having such a body-centered cubic structure absorbs hydrogen significantly less than the above-mentioned face-centered cubic structure alloy (Non-Patent Document 3), and therefore the danger of hydrogen embrittlement. Is expected to be small and is actually known to be highly durable. However, according to the phase diagram of the palladium-copper binary alloy, the face-centered cubic structure and the body-centered cubic structure are obtained at 340 to 550 ° C. in an alloy containing 40% by weight of copper having the highest hydrogen permeation performance among palladium / copper alloys. A crystal structure having a mixed structure is formed, and crystal dislocations are completely generated in a face-centered cubic structure at 550 ° C. or higher (Non-patent Documents 1 and 2). When an alloy containing 40% by weight of copper is actually used as a hydrogen separation membrane, the hydrogen permeation performance at 400 ° C. and 450 ° C. is almost the same, and when it exceeds 450 ° C., the hydrogen permeation performance deteriorates significantly (non-patent document). 4). This is considered to be caused by the appearance of a crystal phase having a face-centered cubic structure at 450 ° C., and when the temperature exceeds 450 ° C., the face-centered cubic structure becomes prominent. Therefore, hydrogen embrittlement due to the face-centered cubic structure and embrittlement due to crystal dislocation are feared even at 450 ° C. Therefore, use of an alloy containing 40% by weight of copper as a hydrogen separation membrane is practically a crystalline phase. Can be said to be preferably performed at 400 ° C. or lower, which is mainly a body-centered cubic structure. In the case of palladium-copper alloys with a copper content of 45 to 48% by weight, the transition temperature from this body-centered cubic structure to the face-centered cubic structure is about 600 ° C., and there is almost no coexistence region between the body-centered cubic structure and the face-centered cubic structure It is known that it does not exist (Non-patent Documents 1 and 2). Therefore, since the palladium-based hydrogen separation membrane having such a composition does not lose the body-centered cubic structure near 600 ° C., there is little risk of hydrogen embrittlement and embrittlement accompanying crystal dislocation in the temperature range of 600 ° C. or lower. Is expected. However, it is known that when the copper content is increased from 40% by weight, the hydrogen permeation rate is significantly reduced even if the crystalline phase of the film has a body-centered cubic structure. In fact, the 47% by weight palladium / copper alloy film maintains a body-centered cubic structure up to around 600 ° C., but its hydrogen permeation performance is only 10-20% compared to the 40% by weight palladium / copper alloy film. It has been reported (Non-Patent Document 5).
水素分離膜の利用法として水素製造反応と水素分離を同一の反応器で行うメンブレンリアクター技術がある。炭化水素からの水素製造では通常水蒸気改質反応が行われるが、水素分離なしに反応を行う場合は化学平衡の制約から逃れるため、実用上、800℃以上の反応温度が選択される。それに対して、メンブレンリアクターを用いて水素分離を行いながら反応を行うとルシャトリエの法則によって化学平衡が生成物側に有利となるため、反応の低温化が図れる。しかし、反応を低温化すると触媒活性が低下するので大量の触媒を使用せざるを得ず、そのような事態を避けるには反応温度を少なくとも500℃以上、好ましくは550℃以上にする必要がある。ここで、従来から知られているパラジウム・銅合金からなる水素分離膜を炭化水素の水蒸気改質用メンブレンリアクターに採用することを考えると、脆化なく水素分離膜を利用するには例えば45重量%以上の高い銅含有率を有する水素透過性能の低い膜の使用を余儀なくされ、その結果としてメンブレンリアクターの効率を大きく低下させて実用性を失ってしまう。 As a method of using a hydrogen separation membrane, there is a membrane reactor technology in which hydrogen production reaction and hydrogen separation are performed in the same reactor. In the production of hydrogen from hydrocarbons, a steam reforming reaction is usually carried out. However, when the reaction is carried out without hydrogen separation, a reaction temperature of 800 ° C. or higher is selected in practice because it escapes from the constraints of chemical equilibrium. On the other hand, when the reaction is carried out while performing hydrogen separation using a membrane reactor, the chemical equilibrium is advantageous to the product side according to Le Chatelier's law, so that the temperature of the reaction can be lowered. However, since the catalyst activity decreases when the reaction temperature is lowered, a large amount of catalyst must be used. To avoid such a situation, the reaction temperature must be at least 500 ° C., preferably 550 ° C. or more. . Here, considering that a hydrogen separation membrane made of a conventionally known palladium / copper alloy is used in a membrane reactor for hydrocarbon steam reforming, for example, 45 wt. A membrane having a high copper content of at least% and having a low hydrogen permeation performance is inevitably used, and as a result, the efficiency of the membrane reactor is greatly reduced and the utility is lost.
尚、水素分離膜として多くの特許文献にパラジウム、銅、銀の組み合わせの合金を使用できるとの記載がある(例えば特許文献1)。しかし、本発明者の知る限りにおいて、その結晶構造について言及は無く、また、パラジウム、銀、銅の組み合わせの合金に特定した先行例も無い。 In addition, as a hydrogen separation membrane, there are descriptions in many patent documents that an alloy of a combination of palladium, copper, and silver can be used (for example, Patent Document 1). However, as far as the present inventor is aware, there is no mention of the crystal structure, and there is no precedent specific to an alloy of a combination of palladium, silver and copper.
本発明は、上記した従来技術の現状に鑑みてなされたものであり、その主な目的は、炭化水素の水蒸気改質用メンブレンリアクターにも利用可能な、高温においても脆性を示さず耐久性があると共に優れた水素透過性能を有する水素分離膜を提供することである。また、その水素分離膜の製造方法を提供すると共に、水素分離方法を提供することを目的とする。 The present invention has been made in view of the current state of the prior art described above, and its main purpose is that it can be used for a membrane reactor for hydrocarbon steam reforming and does not exhibit brittleness even at high temperatures and has durability. Another object is to provide a hydrogen separation membrane having excellent hydrogen permeation performance. Moreover, while providing the manufacturing method of the hydrogen separation membrane, it aims at providing the hydrogen separation method.
本発明者は、上記した目的を達成すべく鋭意研究を重ねてきた。その結果、パラジウム・銅合金に少量の銀を添加すると銅含有量が少ない場合でも体心立方構造から面心立方構造への転移温度が高温領域に移動し550〜600℃における加熱後も、その体心立方構造が失われないパラジウム・銅・銀合金薄膜を形成でき、この薄膜が500〜600℃での水素分離にも耐えられることを見出し、ここに本発明を完成するに至った。 The present inventor has intensively studied to achieve the above-described object. As a result, when a small amount of silver is added to the palladium / copper alloy, the transition temperature from the body-centered cubic structure to the face-centered cubic structure moves to a high temperature region even when the copper content is small, and even after heating at 550 to 600 ° C. It has been found that a palladium / copper / silver alloy thin film that does not lose the body-centered cubic structure can be formed, and that this thin film can withstand hydrogen separation at 500 to 600 ° C., and the present invention has been completed.
即ち、本発明の前記目的は、パラジウムと銅と銀とを主体とする合金薄膜からなる水素分離膜であって、500℃以上での加熱処理後における前記合金薄膜の結晶構造が実質的に体心立方構造であることを特徴とする水素分離膜により達成される。 That is, the object of the present invention is a hydrogen separation membrane comprising an alloy thin film mainly composed of palladium, copper, and silver, and the crystal structure of the alloy thin film after heat treatment at 500 ° C. or higher is substantially body. This is achieved by a hydrogen separation membrane characterized by a centered cubic structure.
また、この水素分離膜において、前記合金薄膜における銅の含有量が37重量%〜40重量%であり、少なくとも500℃での加熱処理後の前記合金薄膜の結晶構造が実質的に体心立方構造であることが好ましい。 Further, in this hydrogen separation membrane, the copper content in the alloy thin film is 37 wt% to 40 wt%, and the crystal structure of the alloy thin film after heat treatment at least at 500 ° C. is substantially a body-centered cubic structure. It is preferable that
また、前記合金薄膜における銅の含有量が40重量%〜42重量%であり、少なくとも550℃での加熱処理後の前記合金薄膜の結晶構造が実質的に体心立方構造であることが好ましい。 Moreover, it is preferable that the content of copper in the alloy thin film is 40 wt% to 42 wt%, and the crystal structure of the alloy thin film after the heat treatment at least at 550 ° C. is substantially a body-centered cubic structure.
また、前記合金薄膜における銅の含有量が42重量%〜44重量%であり、少なくとも600℃での加熱処理後の前記合金薄膜の結晶構造が実質的に体心立方構造であることが好ましい。 Moreover, it is preferable that content of copper in the alloy thin film is 42 wt% to 44 wt%, and the crystal structure of the alloy thin film after the heat treatment at least at 600 ° C. is substantially a body-centered cubic structure.
また、本発明の前記目的は、パラジウムと銅と銀とを主体とする合金薄膜からなる水素分離膜を製造する方法であって、パラジウム含有薄膜、銀含有薄膜及び銅含有薄膜の積層体を生成するステップと、前記積層体を350℃〜600℃で加熱処理して、結晶構造が実質的に体心立方構造となるパラジウムと銅と銀との合金薄膜を生成するステップとを備える水素分離膜により達成される。 Another object of the present invention is a method for producing a hydrogen separation membrane comprising an alloy thin film mainly composed of palladium, copper, and silver, and produces a laminate comprising a palladium-containing thin film, a silver-containing thin film, and a copper-containing thin film. And a step of heat-treating the laminate at 350 ° C. to 600 ° C. to produce an alloy thin film of palladium, copper and silver having a crystal structure substantially having a body-centered cubic structure. Is achieved.
また、本発明の前記目的は、上述の水素分離膜を介して、一方側に水素含有混合気体を位置させ、他方側の水素分圧を水素含有混合気体側の水素分圧以下とすることを特徴とする水素含有混合気体からの水素の分離方法により達成される。 Further, the object of the present invention is to position the hydrogen-containing mixed gas on one side through the hydrogen separation membrane described above, and set the hydrogen partial pressure on the other side to be equal to or lower than the hydrogen partial pressure on the hydrogen-containing mixed gas side. This is achieved by a method for separating hydrogen from a hydrogen-containing gas mixture.
本発明によれば、炭化水素の水蒸気改質用メンブレンリアクターにも利用可能な、高温においても脆性を示さず耐久性があると共に優れた水素透過性能を有する水素分離膜、その製造方法及び水素分離方法を提供することができる。 According to the present invention, a hydrogen separation membrane that can be used for a membrane reactor for steam reforming of hydrocarbons, exhibits no brittleness even at high temperatures, has durability, and has excellent hydrogen permeation performance, its production method, and hydrogen separation A method can be provided.
以下、本発明の水素分離膜について具体的に説明する。
水素分離膜及びその製造方法
本発明の水素分離膜は、パラジウムと銅と銀とを主体とする合金であって、銅を好ましくは37〜44重量%、更に好ましくは38〜44重量%含有し、銀を好ましくは0.5重量%〜7重量%、更に好ましくは1重量%〜5重量%含有し、500℃以上での加熱においてもその主な結晶構造が体心立方構造であることを特徴とするパラジウム・銅・銀合金薄膜からなるものである。本発明の水素分離膜は銅の含有量によって、結晶構造の安定性が異なり、37重量%〜40重量%の銅を含有する水素分離膜は少なくとも500℃で体心立方構造を実質的に保持し、40重量%〜42重量%の銅を含有する水素分離膜は少なくとも550℃で体心立方構造を実質的に保持し、42重量%〜44重量%の銅を含有する水素分離膜は少なくとも600℃で体心立方構造を実質的に保持する。ここで、結晶構造の特定はX線回折パターンの測定によれば良く、本発明の体心立方構造を実質的に保持している水素分離膜を加熱後、室温でX線回折パターンを測定すると合金の体心立方構造に起因する明瞭なピークが検出され、面心立方構造に起因するピークの存在は明瞭に検出できない。
Hereinafter, the hydrogen separation membrane of the present invention will be specifically described.
Hydrogen separation membrane and method for producing the same The hydrogen separation membrane of the present invention is an alloy mainly composed of palladium, copper and silver, and preferably contains 37 to 44% by weight, more preferably 38 to 44% by weight of copper. Further, it preferably contains 0.5 to 7% by weight, more preferably 1 to 5% by weight of silver, and the main crystal structure is a body-centered cubic structure even when heated at 500 ° C. or higher. It consists of a characteristic palladium / copper / silver alloy thin film. The hydrogen separation membrane of the present invention has different crystal structure stability depending on the copper content, and the hydrogen separation membrane containing 37 wt% to 40 wt% copper substantially maintains a body-centered cubic structure at least at 500 ° C. The hydrogen separation membrane containing 40 wt% to 42 wt% copper substantially retains the body-centered cubic structure at least at 550 ° C., and the hydrogen separation membrane containing 42 wt% to 44 wt% copper is at least The body-centered cubic structure is substantially retained at 600 ° C. Here, the crystal structure can be specified by measuring the X-ray diffraction pattern. When the hydrogen separation membrane substantially holding the body-centered cubic structure of the present invention is heated, the X-ray diffraction pattern is measured at room temperature. A clear peak due to the body-centered cubic structure of the alloy is detected, and the presence of a peak due to the face-centered cubic structure cannot be clearly detected.
この薄膜の好ましい膜厚は0.5〜30μmであり、更に好ましくは1〜20μmである。膜厚が小さすぎると欠陥が増加し水素の選択分離性能が悪化するし、膜厚が大きすぎると水素の透過性能が悪化する。 The preferable film thickness of this thin film is 0.5-30 micrometers, More preferably, it is 1-20 micrometers. If the film thickness is too small, defects increase and the hydrogen selective separation performance deteriorates. If the film thickness is too large, the hydrogen permeation performance deteriorates.
本発明の水素分離膜は多孔性セラミックスや多孔性焼結金属のようなガス拡散が可能な支持体上に形成して差し支えない。多孔性セラミックスとしてはアルミナ多孔体、ジルコニア多孔体、セリア多孔体、ジルコニア−セリア多孔体、シリカ多孔体、チタニア多孔体、イットリア安定化ジルコニア多孔体、ムライト多孔体等が例示できる。多孔性焼結金属の材質については特に限定はなく、例えば、ステンレス、ハステロイ合金、インコネル合金、ニッケル、ニッケル合金、チタン、チタン合金等を用いることができる。多孔性焼結金属からのパラジウム・銅・合金膜への金属拡散を防止するために、多孔性焼結金属の表面酸化処理や、銀、金等の拡散阻止層の形成処理を行っても良い。また、多孔性焼結金属上にアルミナ多孔体、ジルコニア多孔体、セリア多孔体、ジルコニア−セリア多孔体、シリカ多孔体、チタニア多孔体、イットリア安定化ジルコニア多孔体、ムライト多孔体等の多孔性セラミックスを修飾した支持体を使用しても良い。なお、支持体の形状について特に限定はなく、例えば、板状、中空の管状、有底筒状等の形状を採用することができる。 The hydrogen separation membrane of the present invention may be formed on a support capable of gas diffusion such as porous ceramics and porous sintered metal. Examples of porous ceramics include alumina porous bodies, zirconia porous bodies, ceria porous bodies, zirconia-ceria porous bodies, silica porous bodies, titania porous bodies, yttria-stabilized zirconia porous bodies, mullite porous bodies, and the like. The material of the porous sintered metal is not particularly limited, and for example, stainless steel, hastelloy alloy, inconel alloy, nickel, nickel alloy, titanium, titanium alloy and the like can be used. In order to prevent metal diffusion from the porous sintered metal to the palladium / copper / alloy film, the surface of the porous sintered metal may be oxidized or a diffusion blocking layer such as silver or gold may be formed. . Also, porous ceramics such as alumina porous body, zirconia porous body, ceria porous body, zirconia-ceria porous body, silica porous body, titania porous body, yttria stabilized zirconia porous body, mullite porous body on porous sintered metal A support modified with may be used. In addition, there is no limitation in particular about the shape of a support body, For example, shapes, such as plate shape, a hollow tubular shape, and a bottomed cylindrical shape, are employable.
本発明の水素分離膜は銅を好ましくは37重量%〜44重量%、更に好ましくは38重量%〜43重量%含有し、銀を好ましくは0.5重量%〜7重量%、更に好ましくは1重量%〜5重量%含有したパラジウム・銅・銀合金を圧延によって薄膜化することにより製造できる。 The hydrogen separation membrane of the present invention preferably contains 37% to 44% by weight of copper, more preferably 38% to 43% by weight, and preferably 0.5% to 7% by weight of silver, more preferably 1%. It can be produced by rolling a palladium-copper-silver alloy containing 5% by weight to 5% by weight by rolling.
しかし、圧延による薄膜化手法の場合、薄膜化するのに限界があるので、何らかの多孔性支持体上にパラジウム・銅・銀合金薄膜を成膜するのがより好ましい。成膜手法としては、例えばマグネトロンスパッタリングのようなスパッタリングによる方法や化学蒸着、めっき、といった方法を用いて差し支えないが、中でも、めっきによる方法が最も簡便で安価にパラジウム・銅・銀合金薄膜を成膜することができる。 However, in the case of a thinning method by rolling, there is a limit to thinning, so it is more preferable to form a palladium / copper / silver alloy thin film on some porous support. As a film formation method, for example, a sputtering method such as magnetron sputtering, a chemical vapor deposition method, or a plating method may be used, but among them, the plating method is the simplest and cheapest to form a palladium / copper / silver alloy thin film. Can be membrane.
めっき法による場合、支持体表面が多孔性セラミックスのような導電性のない物質である場合、無電解めっき法によってパラジウム・銅・銀合金薄膜を構成する金属をめっきすれば良い。無電解めっきによって複数の金属元素をめっきする合金めっきを行うことは可能であるが、組成制御が難しく、段階的にめっきを行うのが好ましい。また、支持体表面が導電性のある物質の場合、無電解めっき、電気めっきの何れの方法を用いても差し支えない。第1段階のめっきとしてはパラジウムをめっきするのが組成制御の観点から好ましい。銅あるいは銀を第1段階でめっきした場合でも後段でのパラジウム・銅・銀合金薄膜を構成する金属のめっきと、引き続く加熱による合金化処理によって目的を達することができるが、銅及び銀はパラジウムに比べて電気的に卑なので銅や銀を先にめっきすると後段のパラジウムを含有した金属のめっきの時に置換めっきが生じてしまい組成制御が難しくなる。 In the case of the plating method, when the support surface is a non-conductive substance such as porous ceramics, the metal constituting the palladium / copper / silver alloy thin film may be plated by an electroless plating method. Although it is possible to perform alloy plating for plating a plurality of metal elements by electroless plating, it is difficult to control the composition, and it is preferable to perform the plating step by step. Further, when the support surface is a conductive material, any method of electroless plating or electroplating may be used. From the viewpoint of composition control, it is preferable to plate palladium as the first stage plating. Even if copper or silver is plated in the first stage, the purpose can be achieved by plating the metal constituting the palladium / copper / silver alloy thin film in the latter stage and the subsequent alloying treatment by heating, but copper and silver are palladium. Compared to the above, since it is electrically base, if plating with copper or silver first, substitution plating occurs at the time of plating with a metal containing palladium in the latter stage, making composition control difficult.
第1段階のめっきにより支持体表面は導電性となるので、第2段階以降は無電解めっき、電気めっきの何れの方法を行うことも可能である。また、場合によっては置換めっきを行うこともできる。第2段階以降、パラジウム・銅・銀合金薄膜を構成する金属を順次第1段階で成膜した層の上にめっきし、その後、加熱による合金化を行えば良い。銅は合金組成中で電気的に最も卑であるので、最終段階で銅を含む金属のめっきを行うのが組成制御の観点からは好ましい。 Since the surface of the support becomes conductive by the first stage plating, any method of electroless plating and electroplating can be performed after the second stage. In some cases, displacement plating can also be performed. After the second stage, the metal constituting the palladium / copper / silver alloy thin film may be sequentially plated on the layer formed in the first stage, and then alloyed by heating. Since copper is the most basic in the alloy composition, it is preferable from the viewpoint of composition control to perform plating of a metal containing copper in the final stage.
ここで、めっきされた金属層の組成中に銅が好ましくは37重量%〜44重量%、更に好ましくは38重量%〜44重量%あり、銀が好ましくは0.5重量%〜7重量%、更に好ましくは1重量%〜5重量%あるようにした後、加熱処理により金属層の合金化を行う。一般に加熱処理によるパラジウム中への銅の拡散は容易であるが、銀の拡散は生じにくく、通常600℃を超える温度での加熱が必要となる。しかし、600℃を超える温度ではパラジウム・銅・銀合金の結晶相が面心立方構造となる可能性がある。これを回避するためには一旦、第1段階でパラジウム及び銀を積層して600℃を超える温度で加熱して銀をパラジウム中に拡散させてパラジウム・銀合金膜としてから、第2段階でその上に銅を積層し、その後、600℃以下で熱処理を行い、銅をパラジウム・銀合金中に拡散させてパラジウム・銀・銅合金とすることも可能である。しかし、第1段階での600℃を超える温度での熱処理は金属膜を劣化させる危険性が高く、新たな欠陥が発生して水素選択性の悪化につながる。 Here, in the composition of the plated metal layer, copper is preferably 37 wt% to 44 wt%, more preferably 38 wt% to 44 wt%, and silver is preferably 0.5 wt% to 7 wt%, More preferably, after 1 wt% to 5 wt%, the metal layer is alloyed by heat treatment. In general, copper is easily diffused into palladium by heat treatment, but silver is hardly diffused, and heating at a temperature usually exceeding 600 ° C. is required. However, when the temperature exceeds 600 ° C., the crystal phase of the palladium / copper / silver alloy may have a face-centered cubic structure. To avoid this, once palladium and silver are laminated in the first stage and heated at a temperature exceeding 600 ° C., the silver is diffused into the palladium to form a palladium / silver alloy film, and then in the second stage. It is also possible to stack copper on top and then heat-treat at 600 ° C. or lower to diffuse copper into the palladium / silver alloy to form a palladium / silver / copper alloy. However, the heat treatment at a temperature exceeding 600 ° C. in the first stage has a high risk of deteriorating the metal film, and new defects are generated, leading to deterioration of hydrogen selectivity.
このような600℃を超える温度での加熱処理を避けるには、第1段階で無電解めっきによりパラジウム層を形成し、次に第2段階で無電解めっきに比べて容易な電気めっきによるパラジウム・銀の合金めっきを行い、そして、第3段階で銅をめっきする。ここで、無電解めっき及び電気めっきには公知のめっき浴およびめっき方法を用いればよい。 In order to avoid such a heat treatment at a temperature exceeding 600 ° C., a palladium layer is formed by electroless plating in the first stage, and then palladium / electroplating, which is easier than electroless plating in the second stage, is performed. Silver alloy plating is performed, and copper is plated in the third stage. Here, a known plating bath and plating method may be used for electroless plating and electroplating.
このようにして成膜した水素分離膜前駆体を好ましくは350〜600℃で、より好ましくは450〜550℃で加熱すると、加熱前に既に銀がパラジウム中に拡散した状態にあるので、合金化が容易に進行して体心立方構造を有するパラジウム・銅・銀合金薄膜が形成できる。この加熱処理は非酸化性雰囲気中で行えばよく、通常、還元ガス雰囲気下、あるいは不活性ガス雰囲気下で加熱することによって行うことができる。還元ガスとしては、例えば水素、メタノール等の還元性を有する気体を用いることができる。不活性ガスとしてはヘリウム、窒素、アルゴン、水蒸気、等が例示できる。あるいは、真空下で行ってもよい。この処理時間は、通常、5〜100時間程度とすればよい。処理中に水素分離膜表面に付着した有機物を取り除くため、酸素あるいは酸素を含んだ気体と接触させても差し支えない。 When the hydrogen separation membrane precursor thus formed is heated preferably at 350 to 600 ° C., more preferably at 450 to 550 ° C., since silver is already diffused in palladium before heating, alloying is performed. Can easily proceed to form a palladium-copper-silver alloy thin film having a body-centered cubic structure. This heat treatment may be performed in a non-oxidizing atmosphere, and can usually be performed by heating in a reducing gas atmosphere or an inert gas atmosphere. As the reducing gas, for example, a reducing gas such as hydrogen or methanol can be used. Examples of the inert gas include helium, nitrogen, argon, water vapor, and the like. Alternatively, it may be performed under vacuum. This processing time may normally be about 5 to 100 hours. In order to remove organic substances adhering to the surface of the hydrogen separation membrane during the treatment, it may be brought into contact with oxygen or a gas containing oxygen.
水素分離方法
本発明の水素分離膜は、常法に従って、水素を含有する混合気体から水素のみを分離するために使用できる。例えば、該水素分離膜によって隔離された一方の側に水素含有混合気体を位置させて該水素分離膜の一方の面を水素含有気体と接触させ、他方の面側の水素分圧を水素含有混合気体側の水素分圧以下とすればよい。これにより水素分離膜中を水素が選択的に透過し、水素含有混合気体側にある水素のみを反対側に移動させて分離することができる。この場合の水素分離膜の温度は、パラジウム・銅・銀合金の体心立方構造が保持される範囲内であれば良く、通常、50〜650℃程度、好ましくは300〜600℃程度とすれば良い。温度が低すぎると水素透過速度が低下し、温度が高すぎると膜の体心立方構造から面心立方構造への構造変化が生じて劣化が進行するので好ましくない。
Hydrogen Separation Method The hydrogen separation membrane of the present invention can be used for separating only hydrogen from a mixed gas containing hydrogen according to a conventional method. For example, a hydrogen-containing mixed gas is positioned on one side separated by the hydrogen separation membrane, one surface of the hydrogen separation membrane is brought into contact with the hydrogen-containing gas, and the hydrogen partial pressure on the other surface side is mixed with the hydrogen-containing mixture. What is necessary is just to be below the hydrogen partial pressure on the gas side. Thus, hydrogen selectively permeates through the hydrogen separation membrane, and only hydrogen on the hydrogen-containing mixed gas side can be moved to the opposite side for separation. The temperature of the hydrogen separation membrane in this case may be within a range in which the body-centered cubic structure of the palladium / copper / silver alloy is maintained, and is usually about 50 to 650 ° C., preferably about 300 to 600 ° C. good. If the temperature is too low, the hydrogen permeation rate is lowered, and if the temperature is too high, the structure changes from a body-centered cubic structure to a face-centered cubic structure, which causes deterioration.
本発明によれば、比較的簡単な方法によって、高温での耐久性に優れた水素分離膜が得られる。得られる水素分離膜は、特に炭化水素の水蒸気改質等の比較的高温を必要とする反応を対象とするメンブレンリアクター用として有効に利用できる。 According to the present invention, a hydrogen separation membrane excellent in durability at high temperatures can be obtained by a relatively simple method. The obtained hydrogen separation membrane can be effectively used particularly for a membrane reactor intended for a reaction requiring a relatively high temperature such as steam reforming of hydrocarbon.
以下、実施例を挙げて本発明を更に詳細に説明する。
[実施例1]
有底筒状のステンレス製多孔性焼結金属(直径1cm、長さ5cm)の外表面にイットリア安定化ジルコニア粒子をコーティングして製作した層厚30μm、平均細孔径0.1μmの多孔性セラミックス支持体上に市販の無電解パラジウムめっき試薬を用いて、厚さ2.0μmのパラジウム層(パラジウム含有薄膜)を無電解めっきによって形成した。そして、引き続き、このパラジウム層をパラジウム及び銀のアンミン錯体からなる電気めっき液に浸漬し、パラジウム層上にパラジウム・銀合金(銀含有薄膜)の電気めっきを行い、パラジウム層上にパラジウム・銀合金の層を形成した。次に、このパラジウム層上に形成されたパラジウム・銀合金層を銅のエチレンジアミン錯体からなる電気めっき液に浸漬し、パラジウム・銀合金層上に銅の層(銅含有薄膜)を形成した。
Hereinafter, the present invention will be described in more detail with reference to examples.
[Example 1]
A porous ceramic support with a layer thickness of 30μm and an average pore diameter of 0.1μm manufactured by coating yttria-stabilized zirconia particles on the outer surface of a bottomed cylindrical stainless steel porous sintered metal (diameter 1cm, length 5cm) A palladium layer (palladium-containing thin film) having a thickness of 2.0 μm was formed on the body by electroless plating using a commercially available electroless palladium plating reagent. Subsequently, this palladium layer is immersed in an electroplating solution comprising palladium and silver ammine complexes, and a palladium / silver alloy (silver-containing thin film) is electroplated on the palladium layer, and the palladium / silver alloy is deposited on the palladium layer. Layers were formed. Next, the palladium / silver alloy layer formed on the palladium layer was immersed in an electroplating solution made of a copper ethylenediamine complex to form a copper layer (copper-containing thin film) on the palladium / silver alloy layer.
パラジウム層、パラジウム・銀合金層及び銅の層からなる積層体を洗浄・乾燥後にアルゴン気流下で400℃まで昇温し、引き続き、水素雰囲気下で500℃まで昇温し、500℃で40時間、加熱処理して多孔性セラミックスを支持体とする膜厚6μmのパラジウム・銅・銀合金薄膜を得た。 A laminate comprising a palladium layer, a palladium / silver alloy layer, and a copper layer is washed and dried, and then heated to 400 ° C. under an argon stream, then heated to 500 ° C. in a hydrogen atmosphere, and then heated to 500 ° C. for 40 hours. Then, a heat treatment was performed to obtain a 6 μm-thick palladium / copper / silver alloy thin film using porous ceramic as a support.
パラジウムを主成分とする合金からなる水素分離膜の水素透過速度(k)は一般にシーベルト則に従う。即ち、
k=J/(p10.5−p20.5)
となる。ここでJは水素透過流速(mmol/s/m2)、p1は入口側水素分圧(Pa)、p2は出口側水素分圧(Pa)である。
The hydrogen permeation rate (k) of a hydrogen separation membrane made of an alloy containing palladium as a main component generally follows the Sievert law. That is,
k = J / (p1 0.5 -p2 0.5 )
It becomes. Here, J is the hydrogen permeation flow rate (mmol / s / m 2 ), p1 is the inlet-side hydrogen partial pressure (Pa), and p2 is the outlet-side hydrogen partial pressure (Pa).
また、水素以外の気体では、一般にガス透過速度(k’)は、
k’=J’/(p3−p4)
と、なる。ここでJ’はガス透過流速(mmol/s/m2)、p3は入口側ガス分圧(Pa)、p4は出口側ガス分圧(Pa)である。
For gases other than hydrogen, the gas permeation rate (k ′) is generally
k ′ = J ′ / (p3-p4)
And become. Here, J ′ is a gas permeation flow rate (mmol / s / m 2 ), p3 is an inlet side gas partial pressure (Pa), and p4 is an outlet side gas partial pressure (Pa).
そこで、上記方法で得られた水素分離膜の性能を評価するため、水素差圧0〜2気圧、アルゴン差圧0〜4気圧の範囲でガス透過試験を行った結果、550℃において1.0mmol/s/m2/Pa0.5の水素透過速度を得ると共に18nmol/s/m2/Paのアルゴンの透過速度を得た。 Therefore, in order to evaluate the performance of the hydrogen separation membrane obtained by the above method, a gas permeation test was conducted in the range of a hydrogen differential pressure of 0 to 2 atm and an argon differential pressure of 0 to 4 atm. A hydrogen permeation rate of 0.5 / s / m 2 / Pa 0.5 and an argon permeation rate of 18 nmol / s / m 2 / Pa were obtained.
550℃におけるガス透過試験後、このパラジウム・銅・銀合金薄膜を室温まで冷却して測定したX線回折パターン(図1)は、体心立方構造の結晶構造に特有のものであり、面心立方構造に由来するピークは検出されなかった。また、ICP発光分光分析法によって得られた、このパラジウム・銅・銀合金薄膜の平均組成はパラジウム60重量%、銅38重量%、銀1.7重量%であった。なお、X線回析パターンは、マックサイエンス社製のX線回折装置(型番:MP6XCE、Cu線源)を用いて測定し、パラジウム・銅・銀合金薄膜の平均組成は、リガク/SPECTRO社製のICP発光分析装置(型番:CIROS−120EOP)を用いて測定した。 After the gas permeation test at 550 ° C., the X-ray diffraction pattern (FIG. 1) measured by cooling the palladium / copper / silver alloy thin film to room temperature is unique to the crystal structure of the body-centered cubic structure. No peak derived from the cubic structure was detected. The average composition of the palladium / copper / silver alloy thin film obtained by ICP emission spectroscopic analysis was 60 wt% palladium, 38 wt% copper, and 1.7 wt% silver. The X-ray diffraction pattern was measured using an X-ray diffractometer (model number: MP6XCE, Cu source) manufactured by Mac Science, and the average composition of the palladium / copper / silver alloy thin film was manufactured by Rigaku / SPECTRO. And an ICP emission analyzer (model number: CIROS-120EOP).
[実施例2]
実施例1と同様の方法で多孔性セラミックス支持体上に市販の無電解パラジウムめっき試薬を用いて、厚さ1.8μmのパラジウム層を無電解めっきによって形成した。そして、引き続き、実施例1と同様の方法で、パラジウム層上にパラジウム・銀合金の層を形成し、そして、その層上に銅の層を形成した。
[Example 2]
Using a commercially available electroless palladium plating reagent on the porous ceramic support in the same manner as in Example 1, a 1.8 μm thick palladium layer was formed by electroless plating. Subsequently, in the same manner as in Example 1, a palladium / silver alloy layer was formed on the palladium layer, and a copper layer was formed on the layer.
これを洗浄・乾燥後にアルゴン気流下で400℃まで昇温し、引き続き、水素雰囲気下で500℃まで昇温し、500℃で40時間、加熱処理して多孔性セラミックスを支持体とする膜厚6μmのパラジウム・銅・銀合金薄膜を得た。 After cleaning and drying, the temperature was raised to 400 ° C. under an argon stream, followed by raising the temperature to 500 ° C. under a hydrogen atmosphere, and heat treatment at 500 ° C. for 40 hours to form a porous ceramic support. A 6 μm palladium / copper / silver alloy thin film was obtained.
上記方法で得られた水素分離膜の性能を評価するため実施例1と同様の方法でガス透過試験を行った結果、600℃において0.6mmol/s/m2/Pa0.5の水素透過速度を得ると共に1nmol/s/m2/Paのアルゴンの透過速度を得た。 As a result of conducting a gas permeation test in the same manner as in Example 1 in order to evaluate the performance of the hydrogen separation membrane obtained by the above method, a hydrogen permeation of 0.6 mmol / s / m 2 / Pa 0.5 at 600 ° C. Along with the rate, an argon permeation rate of 1 nmol / s / m 2 / Pa was obtained.
600℃におけるガス透過試験後、このパラジウム・銅・銀合金薄膜を室温まで冷却して測定したX線回折パターン(図2)は、体心立方構造の結晶構造に特有のものであり、面心立方構造に由来するピークは検出されなかった。また、ICP発光分光分析法によって得られた、このパラジウム・銅・銀合金薄膜の平均組成はパラジウム57重量%、銅41重量%、銀1.7重量%であった。 After the gas permeation test at 600 ° C., the X-ray diffraction pattern (FIG. 2) measured by cooling the palladium / copper / silver alloy thin film to room temperature is unique to the crystal structure of the body-centered cubic structure. No peak derived from the cubic structure was detected. The average composition of the palladium / copper / silver alloy thin film obtained by ICP emission spectroscopy was 57 wt% palladium, 41 wt% copper, and 1.7 wt% silver.
[実施例3]
実施例1と同様の方法で多孔性セラミックス支持体上に市販の無電解パラジウムめっき試薬を用いて、厚さ1.3μmのパラジウム層を無電解めっきによって形成した。そして、引き続き、実施例1と同様の方法で、パラジウム層上にパラジウム・銀合金の層を形成し、そして、その層上に銅の層を形成した。
[Example 3]
Using a commercially available electroless palladium plating reagent, a palladium layer having a thickness of 1.3 μm was formed by electroless plating on the porous ceramic support in the same manner as in Example 1. Subsequently, in the same manner as in Example 1, a palladium / silver alloy layer was formed on the palladium layer, and a copper layer was formed on the layer.
これを洗浄・乾燥後にアルゴン気流下で400℃まで昇温し、引き続き、水素雰囲気下で500℃まで昇温し、500℃で20時間、加熱処理して多孔性セラミックスを支持体とする膜厚4μmのパラジウム・銅・銀合金薄膜を得た。 After cleaning and drying, the temperature was raised to 400 ° C. under an argon stream, followed by raising the temperature to 500 ° C. under a hydrogen atmosphere, and heat treatment at 500 ° C. for 20 hours to form a porous ceramic as a support. A 4 μm palladium / copper / silver alloy thin film was obtained.
上記方法で得られた水素分離膜の性能を評価するため実施例1と同様の方法でガス透過試験を行った結果、600℃において0.6mmol/s/m2/Pa0.5の水素透過速度を得ると共に0.5nmol/s/m2/Paのアルゴンの透過速度を得た。 As a result of conducting a gas permeation test in the same manner as in Example 1 in order to evaluate the performance of the hydrogen separation membrane obtained by the above method, a hydrogen permeation of 0.6 mmol / s / m 2 / Pa 0.5 at 600 ° C. Along with the rate, an argon permeation rate of 0.5 nmol / s / m 2 / Pa was obtained.
600℃におけるガス透過試験後、このパラジウム・銅・銀合金薄膜を室温まで冷却して測定したX線回折パターン(図3)は、体心立方構造の結晶構造に特有のものであり、面心立方構造に由来するピークは検出されなかった。また、ICP発光分光分析法によって得られた、このパラジウム・銅・銀合金薄膜の平均組成はパラジウム56重量%、銅43重量%、銀1.2重量%であった。 After the gas permeation test at 600 ° C., the X-ray diffraction pattern (FIG. 3) measured by cooling the palladium / copper / silver alloy thin film to room temperature is unique to the crystal structure of the body-centered cubic structure. No peak derived from the cubic structure was detected. The average composition of the palladium / copper / silver alloy thin film obtained by ICP emission spectroscopy was 56 wt% palladium, 43 wt% copper, and 1.2 wt% silver.
[実施例4]
実施例1と同様の方法で多孔性セラミックス支持体上に市販の無電解パラジウムめっき試薬を用いて、厚さ0.5μmのパラジウム層を無電解めっきによって形成した。そして、引き続き、実施例1と同様の方法で、パラジウム層上にパラジウム・銀合金の層を形成し、そして、その層上に銅の層を形成した。
[Example 4]
Using a commercially available electroless palladium plating reagent on the porous ceramic support in the same manner as in Example 1, a palladium layer having a thickness of 0.5 μm was formed by electroless plating. Subsequently, in the same manner as in Example 1, a palladium / silver alloy layer was formed on the palladium layer, and a copper layer was formed on the layer.
これを洗浄・乾燥後にアルゴン気流下で400℃まで昇温し、引き続き、水素雰囲気下で500℃まで昇温し、500℃で40時間、加熱処理して多孔性セラミックスを支持体とする膜厚6μmのパラジウム・銅・銀合金薄膜を得た。 After cleaning and drying, the temperature was raised to 400 ° C. under an argon stream, followed by raising the temperature to 500 ° C. under a hydrogen atmosphere, and heat treatment at 500 ° C. for 40 hours to form a porous ceramic support. A 6 μm palladium / copper / silver alloy thin film was obtained.
上記方法で得られた水素分離膜の性能を評価するため実施例1と同様の方法でガス透過試験を行った結果、600℃において0.6mmol/s/m2/Pa0.5の水素透過速度を得ると共に1nmol/s/m2/Paのアルゴンの透過速度を得た。 As a result of conducting a gas permeation test in the same manner as in Example 1 in order to evaluate the performance of the hydrogen separation membrane obtained by the above method, a hydrogen permeation of 0.6 mmol / s / m 2 / Pa 0.5 at 600 ° C. Along with the rate, an argon permeation rate of 1 nmol / s / m 2 / Pa was obtained.
600℃におけるガス透過試験後、このパラジウム・銅・銀合金薄膜を室温まで冷却して測定したX線回折パターン(図4)は、体心立方構造の結晶構造に特有のものであり、面心立方構造に由来するピークは検出されなかった。また、ICP発光分光分析法によって得られた、このパラジウム・銅・銀合金薄膜の平均組成はパラジウム51重量%、銅44重量%、銀4.6重量%であった。 After the gas permeation test at 600 ° C., the X-ray diffraction pattern (FIG. 4) measured by cooling the palladium / copper / silver alloy thin film to room temperature is unique to the crystal structure of the body-centered cubic structure. No peak derived from the cubic structure was detected. The average composition of the palladium / copper / silver alloy thin film obtained by ICP emission spectroscopy was 51% by weight of palladium, 44% by weight of copper, and 4.6% by weight of silver.
Claims (6)
パラジウム含有薄膜、銀含有薄膜及び銅含有薄膜の積層体を生成するステップと、
前記積層体を350℃〜600℃で加熱処理して、結晶構造が実質的に体心立方構造となるパラジウムと銅と銀との合金薄膜を生成するステップとを備える水素分離膜の製造方法。 A method for producing a hydrogen separation membrane comprising an alloy thin film mainly composed of palladium, copper and silver,
Generating a laminate of a palladium-containing thin film, a silver-containing thin film and a copper-containing thin film;
A method for producing a hydrogen separation membrane, comprising: heat-treating the laminate at 350 ° C. to 600 ° C. to produce an alloy thin film of palladium, copper, and silver having a crystal structure substantially having a body-centered cubic structure.
Through the hydrogen separation membrane according to any one of claims 1 to 4, the hydrogen-containing mixed gas is positioned on one side, and the hydrogen partial pressure on the other side is set to be equal to or lower than the hydrogen partial pressure on the hydrogen-containing mixed gas side. A method for separating hydrogen from a hydrogen-containing gas mixture.
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