JP2012033744A - Method of manufacturing circuit board and surface pressure distribution sensor - Google Patents

Abstract

Provided is a circuit board manufacturing method capable of forming a circuit pattern with high definition even in a large area. Moreover, the surface pressure distribution sensor manufactured using the manufacturing method of this circuit board is provided.
A step of forming a circuit pattern on a substrate, a step of forming a plurality of broken-line notches in a longitudinal direction of the substrate on which the circuit pattern is formed, the circuit pattern and the notches, Forming a geometric pattern by extending a circuit pattern by extending at least a part of the substrate 5 on which is formed in a direction orthogonal to the notches 1, and in the step of forming a plurality of rows of the notches 1; The broken line-like cut 1 is a circuit board in which the broken line period is shifted between the odd-numbered row and the even-numbered row, and the total length of the broken line cut 1 is at least half of the total length of the broken line Manufacturing method.
[Selection] Figure 4

Description

The present invention relates to a circuit board manufacturing method capable of forming a circuit pattern with high definition even in a large area. Moreover, it is related with the surface pressure distribution sensor manufactured using the circuit board obtained by this manufacturing method.

In recent years, printable electronics that use printing technology in the manufacturing process of electronic devices has received much attention. In printable electronics, high-precision and high-speed printing technologies such as inkjet and screen printing can be used to simplify the process, shorten the manufacturing time, and dramatically reduce the cost. It is thought to bring.

When trying to print a circuit pattern of a large area on a resin substrate normally used for electronic devices, there is a problem that positioning (registration) at the edge of the substrate becomes difficult due to the large linear expansion coefficient and softness of the resin. It was. In particular, when forming an element such as a transistor, it is necessary to form a precise circuit pattern. Deformation of the substrate due to temperature changes and temperature distribution of the substrate, force applied to the substrate during printing, thermal history of the printing process and drying process, etc. Becomes a problem. Therefore, for example, as disclosed in Patent Document 1, it is proposed to use a resin film having a small linear expansion coefficient. However, even if the resin film disclosed in Patent Document 1 is used, it is difficult to form a large area circuit pattern with high definition.
In addition, when a circuit pattern is formed by a conventional method, for example, when an RFID (Radio Frequency IDentification) antenna and a transistor are manufactured by printing, a portion of the transistor that requires a precision circuit and high precision are required. The process of printing the part of the antenna not to be printed on separate resin substrates and attaching the both resin substrates later is necessary.

International Publication No. 05/110718 Pamphlet

An object of this invention is to provide the manufacturing method of the circuit board which can form a circuit pattern with high definition even if it is a large area. It is another object of the present invention to provide a surface pressure distribution sensor manufactured using a circuit board obtained by the manufacturing method.

The present invention includes a step 1 for forming a circuit pattern on a substrate, a step 2 for forming a plurality of broken line-like cuts in the longitudinal direction of the substrate on which the circuit pattern is formed, and the circuit pattern and the cut. Forming a geometric pattern by extending a circuit pattern by extending at least a part of the formed substrate in a direction orthogonal to the notches, and in the step 2, the dashed notches are odd columns and In the circuit board manufacturing method, the period of the broken line is deviated from the even-numbered columns, and the total length of the broken line cut portions is at least half the total length of the entire broken line.
The present invention is described in detail below.

The present inventors previously formed a predetermined circuit pattern on the substrate and a plurality of rows of broken-line notches with the odd and even columns shifted in period, and then expanded the substrate to increase the area. And it discovered that the circuit board which has a high-definition circuit pattern can be manufactured, and came to complete this invention.

The method for manufacturing a circuit board of the present invention includes a step 1 of forming a circuit pattern on the substrate.
The material of the wiring that forms the circuit pattern is not particularly limited, and examples thereof include silver, silver paste, copper, aluminum, iron, stainless steel, brass, a magnetic material, and a dielectric material.

FIG. 1 shows an example of a circuit pattern before stretching in the case where a lattice-shaped matrix circuit is formed after stretching (hereinafter also referred to as a circuit pattern before stretching in the case of a lattice shape). FIG. 1 also shows the dashed notch formed in step 2. In the pre-stretch circuit pattern in the case of the lattice shape, a plurality of wirings for exchanging electrical signals must cross each other so as to be along a broken line-shaped cut. For example, in the case of two types of signals, step-like wiring patterns formed by electrode wiring A and electrode wiring B are crossed as shown in FIG.
In addition, the substrate preferably has a wiring extraction portion, and the wiring extraction portion preferably has a linear pattern as shown in FIG. FIG. 2 also shows a broken line-like cut formed in step 2 as in FIG.

The method for forming the circuit pattern is preferably a method by printing, vapor deposition, plating, or etching. Among these, a printing method is more preferable because a high-definition circuit pattern can be easily formed at low cost. Alternatively, a method may be used in which a groove is formed in the substrate by a method such as imprinting or nanoimprinting, and a conductive material is embedded in the formed groove by an inkjet method, a screen printing method, or the like.
When used in a large full-color LED video device or the like, the circuit pattern may be formed by a method of attaching or embedding a wire on a flexible sheet.

FIG. 3 shows an example of a circuit pattern when an element is mounted in the circuit pattern before stretching in the case of the lattice shape. FIG. 3 also shows the dashed cut formed in step 2. As shown in FIG. 3, the electrode wiring A and the electrode wiring B formed in a staircase pattern are connected to elements arranged at lattice points.
In this specification, a portion that becomes a lattice point after expansion of the substrate between the notches in the longitudinal direction of the substrate is also simply referred to as a lattice point. Moreover, the part which becomes linear in the part which does not form notches other than the said lattice point is also called a strand.

The element includes at least one of a pressure sensor, a temperature sensor, an optical sensor, a strain sensor, an acceleration sensor, a magnetic sensor, a capacitor, a piezoelectric sensor, a capacitor, an inductor, a resistor, a light emitting element, a liquid crystal driving electrode, and an electronic paper driving electrode. An element having one function is preferable.

The method for forming the element is preferably a method by printing, vapor deposition, plating, etching, or imprint. For example, when a surface pressure distribution sensor or the like is manufactured using an element having a pressure sensor function (hereinafter, also referred to as a pressure sensor element) as an element, the pressure sensor element may be surface-mounted with a chip type object. It may be formed by printing or the like, or may be formed by laminating electrode wiring / pressure sensitive resistor / pressure sensitive resistor / (pressure sensitive resistor) / (insulating layer) / electrode wiring in this order.
When a full color LED is mounted on an LED electronic bulletin board or the like, four electrode wirings are connected to LED elements, and the four electrode wirings are further connected to adjacent LED elements. These four electrode wirings can be connected by three-dimensionally intersecting by multi-layer printing in the LED element mounting portion, or by using a substrate having a function of three-dimensionally intersecting electrode wiring as a substrate for mounting the LED elements. it can.

The method for manufacturing a circuit board according to the present invention includes a step 2 in which a plurality of broken lines are formed in the longitudinal direction of the substrate on which the circuit pattern is formed. FIG. 4 shows an example of a substrate on which a plurality of broken lines are formed. In the circuit board manufacturing method of the present invention, the board into which the cut is made can be expanded by pulling in the direction perpendicular to the cut.

The material which comprises the said sheet-like board | substrate is not specifically limited, For example, a polyethylene terephthalate (PET), a polyether nitrile (PEN), a polyimide (PI), the composite material of paper and resin, the composite of glass fiber and resin Examples thereof include a material, a high dielectric constant material, a low dielectric constant material, a thin glass material, a thin ceramic material, a material obtained by coating a metal with a resin, and a material obtained by bonding a metal and a resin. When used for a large-area surface pressure distribution sensor or the like, a material that can be handled in a roll shape is suitable.

The broken line-like cut shape may be a simple line as long as it is a repeated pattern, or may be cut into a substantially rectangular shape or a substantially rhombus shape. When mounting an element on a part or printing an element before the expansion of the substrate, it is preferable that the expanded lattice point has a substantially square shape or a substantially circular shape in order to secure a necessary area. .
In the step 2, the notches are formed by shifting the period of the broken line between the odd-numbered columns and the even-numbered columns. When the odd-numbered columns and the even-numbered columns are broken lines having the same pattern and the period is shifted by a half period, the shape of the lattice formed by the expanded substrate is symmetrical.
The lengths of the odd-numbered and even-numbered broken line cut portions may be different, but in each broken line, the total length of the broken line cut portions is at least half the total length of the entire broken line.
Further, the broken line notch part may be formed by combining a long notch and a short notch if there is regularity and the total length of the notch part is half or more of the total length of the entire broken line. Good.

In addition, by forming a cutting pattern different from the above-mentioned broken cuts on the substrate and partially folding it back by about 180 °, the circuit can be multilayered and the substrates can be connected vertically.

In the method for manufacturing a circuit board according to the present invention, the geometric pattern is formed by extending the circuit pattern by extending at least a part of the substrate on which the circuit pattern and the cut are formed in a direction orthogonal to the cut. Have

When the substrate is expanded in the direction orthogonal to the notch in the above step 3, the result is as shown in FIG. 5, and twisting may occur when a force is applied in the vertical direction.
The circuit board is preferably fixed or sheet-molded by bonding, lamination, or the like after expansion, and in the expansion direction by sheet molding simultaneously with the foamed resin material or the like, or by thickening the adhesive layer of the adhesive sheet It becomes possible to form a sheet without applying any other distortion.
In the method for manufacturing a circuit board according to the present invention, a crease may be made in the lattice point in a direction parallel to the notches before step 3. For example, as shown in FIG. 6, the folds of about 180 ° are inserted into the lattice points so as to be inverted with the odd-numbered folds and the even-numbered folds with the valley folds, or as shown in FIG. By folding one side into a valley fold and the other into a mountain fold about 90 ° and reversing the way of folding in odd and even rows, it becomes possible to expand the board without causing twist in the wiring portion. .

When expanding a substrate having a wiring extraction part, only the necessary part (the part forming the circuit) is expanded, and the wiring extraction part is not expanded, thereby reducing the width of the wiring extraction part. be able to.
In the method for manufacturing a circuit board according to the present invention, a part for forming a circuit and a part for taking out wiring can be formed simultaneously.

An example of a lattice-like circuit pattern obtained by extending the substrate is shown in FIG. In the case of FIG. 8, since the grid-like circuit pattern is formed obliquely, the wiring is taken out from both sides of the opposing side surfaces. Further, by adopting a structure in which the upper and lower ends of the wiring in FIG. 8 are folded back, the wiring can be taken out only on one side.

FIG. 9 shows an example of the peripheral portion of the element after the substrate is expanded to form a lattice-like circuit pattern. FIG. 9 shows the extended circuit pattern of FIG. In FIG. 9, there are two types of wiring, electrode wiring A and electrode wiring B, but three types can be obtained by performing multilayer printing (conductor printing / insulating layer printing / conductor printing) or printing on the back surface as necessary. It is also possible to perform the above wiring.

Further, the circuit board manufacturing method of the present invention is not limited to the above-described lattice-shaped matrix circuit as the geometric pattern, but also a loop-shaped circuit pattern as shown in FIG. ), A spiral-shaped circuit pattern, a cross-shaped circuit pattern, a Y-shaped circuit pattern, and a T-shaped circuit pattern as shown in FIGS. Character-shaped circuit patterns and the like can be formed in an array.
For example, the loop-shaped and spiral-shaped circuit patterns can be produced by not forming a part of the grid-shaped circuit pattern, and the substantially C-shaped circuit pattern is one of the loop-shaped circuit patterns. It can be produced by not forming the part. These circuit patterns can be connected by forming a matrix circuit pattern on the back surface of the substrate.

Further, a FSS (Frequency Selective Surface) antenna element is formed by forming a circuit pattern of a loop shape, a substantially C shape, a spiral shape, a cross shape, a Y shape, and / or a T shape, and connecting them with a capacitor. Can be manufactured. By arranging the conductor patterns (metal patterns) of the FSS antenna in an array using the circuit board manufacturing method of the present invention, the FSS antenna can be used for a radio wave shield such as a wireless LAN. In this case, the frequency to be shielded can be selected as appropriate by adjusting the combination of circuit patterns, adjusting the pattern size, and selecting a conductive material or a substrate material.

Further, for example, a spiral circuit pattern is produced on the surface of the substrate using the method for producing a circuit board of the present invention, and the spiral circuit pattern and the current collection pattern produced on the back surface of the substrate are through-holed. A planar antenna, a rectenna, etc. can also be manufactured by connecting using methods, such as. In this case, the size, shape, material, and thickness of the substrate material (dielectric material) of the circuit pattern are appropriately selected depending on the target frequency.

In addition, the method for manufacturing a circuit board according to the present invention can also be used for a method for manufacturing a metamaterial manufactured by arranging minute split ring resonators (SRRs) in an array. Specifically, for example, an SRR is formed using a lithograph or the like on a deformable thin ceramic substrate on which a conductive film is formed, and a broken line pattern is put on the substrate using a lithograph or the like. By expanding, the SRRs can be arranged in an array.

When the method for manufacturing a circuit board according to the present invention is used for manufacturing the FSS antenna element, the planar antenna, the rectenna, the metamaterial, etc., the circuit board is made of an elastic material and is held under tension. By changing the expansion rate as necessary, the corresponding frequency of the antenna and metamaterial can be changed.

In the method for manufacturing a circuit board according to the present invention, an element having at least one function of a pressure sensor, an optical sensor, a strain sensor, a capacitor, an inductor, and a piezoelectric sensor is disposed at a lattice point. It can be used to manufacture a distribution sensor.
The surface pressure distribution sensor manufactured using the circuit board manufacturing method of the present invention is also one aspect of the present invention.

ADVANTAGE OF THE INVENTION According to this invention, the manufacturing method of the circuit board which can form a circuit pattern with high definition even if it is a large area can be provided. Moreover, the surface pressure distribution sensor manufactured using the circuit board obtained by this manufacturing method can be provided.
According to the present invention, since a high-definition pattern may be formed on a narrow-width sheet before expansion, registration during printing is facilitated, and a large area and high-definition can be achieved even with a narrow-width printing device. A simple circuit pattern can be formed.
Specifically, for example, in the case of a large full-color LED video device of about several meters installed on an electric bulletin board or a building surface, a circuit is formed with a width of about 10 to 100 cm, and the width is expanded after the LED is mounted on a lattice point. By doing so, it can be easily manufactured. In addition, the conventional surface pressure distribution sensor or display has to be prepared separately for the panel body and the circuit of the wiring extraction part, and each circuit has to be connected with a conductive adhesive or the like. The board body and the circuit of the wiring extraction part are manufactured integrally by providing the panel part and the wiring extraction part on the board, expanding the panel part, and narrowing the wiring extraction part without expanding. And there is no quality problem at the connection.

It is a schematic diagram which shows an example of the circuit pattern before extending in the case of setting it as a lattice shape. It is a schematic diagram which shows an example of the taking-out part of wiring. It is a schematic diagram which shows an example of the circuit pattern in the case of mounting an element in the circuit pattern before extending in the case of setting it as a lattice shape. It is a schematic diagram which shows an example of the board | substrate in which multiple broken line-like notches were formed. It is a schematic diagram of the cross section (expansion direction) of the circuit pattern obtained by extending a board | substrate. It is a schematic diagram of a cross section (extension direction) of a circuit pattern in the case where a fold of about 180 ° is inserted into a lattice point by being inverted with a mountain fold in odd rows and a valley fold in even rows. It is a schematic diagram of a cross section (expansion direction) of a circuit pattern in the case where one side of the lattice point on the strand side is folded at 90 ° and the other is folded at 90 °, and the folding method is reversed between odd and even rows. It is a schematic diagram which shows an example of the grid | lattice-like circuit pattern obtained by extending a board | substrate. It is a schematic diagram which shows an example of the element peripheral part after extending a board | substrate and forming a grid | lattice-like circuit pattern. It is a schematic diagram which shows an example of the loop-shaped circuit pattern obtained by extending a board | substrate. It is a schematic diagram which shows the example of the substantially C-shaped circuit pattern obtained by extending a board | substrate. It is a schematic diagram which shows the example of the spiral circuit pattern obtained by extending a board | substrate. In Example 1, it is a schematic diagram which shows the notch | incision formed in the part used as the surface of the surface pressure distribution sensor of a PET board | substrate.

Hereinafter, the present invention will be described in more detail with reference to examples. However, the present invention is not limited to these examples.

Example 1
(Production of surface pressure distribution sensor)
20 silver electrode wirings and pressure sensor elements are printed on a sheet-like PET substrate having a length of 450 cm × 15 cm × 200 μm. The lattice point portion is a 9 mm diameter circular portion and a 6 mm diameter circular pressure sensor. (Resistor sensor) was printed. The pitch of the pressure sensor elements at the time of printing was 7 cm in the lateral direction and 1 cm in the width direction, and the printed area of the portion serving as the surface of the surface pressure distribution sensor was 141 cm long and 11 cm wide.
Silver electrode wiring was printed in a staircase pattern on the portion to be the surface of the surface pressure distribution sensor to be manufactured, and pressure sensor elements were arranged at the intersection of the wiring. In addition, a linear pattern was printed on the wiring extraction portion. After that, the substrate on which the silver electrode wiring and the pressure sensor element were printed was cut as shown in FIG. 13 at the portion to be the surface of the surface pressure distribution sensor, and at FIG. As shown in FIG. 13, in the portion that becomes the surface of the surface pressure distribution sensor, the lattice point portion is substantially circular, and the strand is thin. The end of the wiring extraction part was not cut because it was connected to the connector.
The circuit pattern is extended by extending the portion that becomes the surface of the surface pressure distribution sensor of the substrate on which the cuts and the silver electrode wirings are formed in a direction orthogonal to the cuts, and is formed into a lattice shape as shown in FIG. A circuit board having a portion to be a surface of a 100 cm × 100 cm surface pressure distribution sensor was produced.
The obtained circuit board was sandwiched between PET sheets to produce a surface pressure distribution sensor.
In the obtained surface pressure distribution sensor, it was possible to connect the connector / amplifier / multiplexer / AD conversion / CPU in that order from the wiring board extraction portion of the circuit board and process the signal from the surface pressure distribution sensor.

ADVANTAGE OF THE INVENTION According to this invention, the manufacturing method of the circuit board which can form a circuit pattern with high definition even if it is a large area can be provided. Moreover, according to this invention, the touch panel manufactured using the manufacturing method of this circuit board can be provided.

1 Notch 2 Electrode wiring A
3 Electrode wiring B
4 Element 5 Substrate 6 Grid point 7 Strand

Claims (10)

Step 1 of forming a circuit pattern on the substrate;
Step 2 of forming a plurality of lines of broken lines in the longitudinal direction of the substrate on which the circuit pattern is formed;
Forming a geometric pattern by extending the circuit pattern by extending at least a part of the substrate on which the circuit pattern and the cut are formed in a direction perpendicular to the cut; and
In the step 2, the broken line-shaped cuts are shifted in the broken line period between the odd-numbered columns and the even-numbered columns, and the total length of the broken-line cut portions is not less than half of the total length of the whole broken line. A method of manufacturing a circuit board, comprising: 2. The circuit board according to claim 1, wherein the geometric pattern comprises a lattice shape, a loop shape, a substantially C shape, a spiral shape, a cross shape, a Y shape, a T shape, or a combination thereof. Production method. 3. The method of manufacturing a circuit board according to claim 1, wherein the circuit pattern before being stretched is formed by intersecting a part of stepped wiring patterns. 4. The method of manufacturing a circuit board according to claim 1, wherein after the circuit pattern and the cut are formed, a crease is made in a direction parallel to the cut in a portion to be a lattice point of the expanded board. . 5. The method of manufacturing a circuit board according to claim 1, wherein the substrate has a wiring extraction portion, and the wiring extraction portion does not expand in a direction orthogonal to the notch. 6. The circuit board manufacturing method according to claim 1, wherein the circuit pattern is formed by printing, vapor deposition, plating, etching, or imprinting. 6. The method of manufacturing a circuit board according to claim 1, wherein the circuit pattern is formed using a wire. Pressure sensor, temperature sensor, light sensor, strain sensor, acceleration sensor, magnetic sensor, capacitor, inductor, resistance, piezoelectric sensor, light emitting element, liquid crystal drive electrode, electronic paper drive on the part that becomes the lattice point of the substrate after expansion 8. The method for manufacturing a circuit board according to claim 1, wherein an element having at least one function among the electrodes is disposed. 9. The method of manufacturing a circuit board according to claim 8, wherein the element is formed by printing, vapor deposition, plating, etching, or imprinting. A circuit board manufactured using the manufacturing method according to claim 8 or 9, wherein an element to be arranged is an element having at least one function of a pressure sensor, an optical sensor, a strain sensor, a capacitor, and a piezoelectric sensor. A surface pressure distribution sensor manufactured by using the surface pressure distribution sensor.

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