JP2012030941A - Device and method for carrying workpiece - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a workpiece carrying device and workpiece carrying method which can prevent an inclination of a workpiece when holding of the thin plate-like workpiece is switched from a noncontacting state to a contacting state or from the contacting state to the noncontacting state.SOLUTION: The workpiece carrying device 10 has: a noncontacting type carrying mechanism 15 which lowers and approaches the thin plate-like workpiece 11, attracts a workpiece 11, and holds it in a noncontacting state to move; a contacting type carrying mechanism 21 equipped with a suction table 16 which sucks and holds the workpiece 11 received from the noncontacting type carrying mechanism 15 by suction-holding to move; and a control means 27 for controlling timing which starts the suction-holding of the suction table 16, and stops the attraction of the noncontacting type carrying mechanism 15 when the workpiece 11 is delivered from the noncontacting type carrying mechanism 15 to the contacting type carrying mechanism 21. The control means 27 lowers the noncontacting type carrying mechanism 15, then starts the suction-holding, and stops the suction of the noncontacting type carrying mechanism 15 at a point in time that a distance of a lower face of the workpiece 11 and the upper face of the suction table 16 reaches a delivery distance.

Description

In the present invention, a fragile thin plate-like workpiece (article) such as a silicon wafer is held and conveyed in a non-contact state, and then switched to a contact state and further conveyed, or held and conveyed in a contact state and then non-contact. The present invention relates to a workpiece transfer apparatus and a workpiece transfer method for further transferring after switching to state holding.

For example, in the solar cell manufacturing process, when the current collecting electrodes provided on the front and back surfaces of a silicon wafer are formed by screen printing, the silicon wafer is sequentially supplied to a screen printer to print the electrodes and the electrodes are printed. The obtained silicon wafers are sequentially taken out from the screen printer.
At this time, when supplying the silicon wafer to the screen printing machine and taking out the silicon wafer from the screen printing machine using the contact-type transfer device, the silicon wafer holder provided in the contact-type transfer device is applied. There is a problem that cracks are likely to occur at the contact portion of the silicon wafer in contact therewith. Furthermore, when a silicon wafer is taken out from a screen printer using a contact-type transfer device, the electrode is damaged if the holding part comes into contact with the electrode before the printed electrode is dried. The silicon wafer can be taken out from the screen printer only after waiting. For this reason, the printing processing speed of the silicon wafer is limited by the time required for drying the electrodes, and there is also a problem that the printing processing of the silicon wafer cannot be performed efficiently.
Therefore, an air flow is ejected from a nozzle provided in the upper part of the recessed part opened downward, swung along the wall surface of the recessed part, and guided to the lower part of the recessed part, while approaching the upper surface of the horizontally disposed silicon wafer, The air pressure is passed through the gap between the annular flat surface provided around and the top surface of the silicon wafer at high speed to reduce the static pressure of the recess (negative pressure), and the silicon wafer is sucked and is in a non-contact state Has been proposed (see, for example, Patent Document 1).

JP 2002-64130 A

However, when the silicon wafer held by the non-contact conveyance device described in Patent Document 1 is transferred to the work stage of the screen printing machine, the silicon wafer is easily inclined when the suction holding by the non-contact conveyance device is stopped. There is a problem that the edge of the wafer collides with the work stage of the screen printer. In addition, when a silicon wafer held on the work stage of a screen printing machine is transferred to a non-contact transfer device, the silicon wafer is easily lifted by tilting when the suction by the non-contact transfer device is started. Has a problem of colliding with the suction surface of the non-contact conveyance device.

The present invention has been made in view of such circumstances, and after a brittle thin plate-like workpiece is held and conveyed in a non-contact state, it is switched to a contact state and further conveyed or held and conveyed in a contact state. It is an object of the present invention to provide a workpiece transfer device and a workpiece transfer method capable of preventing the workpiece from being tilted at the time of switching to hold in a non-contact state and further transferring.

The work conveying apparatus according to the first invention that meets the above-mentioned object descends and approaches a horizontally disposed thin plate-like work, generates a swirling flow on the upper side of the work, and generates a negative pressure inside the swirling flow. A non-contact type transport mechanism that sucks and holds the work in a non-contact state and transports, and a contact table that moves by sucking and holding the work received from the non-contact type transport mechanism by vacuum suction Control means for controlling the start of vacuum suction of the suction table and the stop of suction of the non-contact type transport mechanism when delivering the workpiece from the non-contact type transport mechanism to the suction table A workpiece transfer device having
The control means starts the vacuum suction of the suction table under the condition that the suction force of the suction table becomes smaller than the suction force of the non-contact transport mechanism after lowering the non-contact transport mechanism. The swirling flow is stopped when the distance between the lower surface of the workpiece held by the contact-type transport mechanism and the upper surface of the suction table reaches a set delivery distance.

In the workpiece transfer apparatus according to the first invention, when the workpiece is sucked and held by the non-contact transfer mechanism in a non-contact state, a distance formed between the upper surface of the workpiece and the non-contact transfer mechanism is set. As d, the delivery distance is preferably greater than 0 and less than or equal to d.

A workpiece transfer device according to a second invention that meets the above-described object is a contact-type transfer mechanism that includes a suction table that moves by sucking and holding a thin plate-like workpiece by vacuum suction, and the workpiece that is suction-held by the suction table. A non-contact type transport mechanism that approaches and descends toward the upper side, generates a swirling flow on the upper side of the work, creates a negative pressure inside the swirling flow, and sucks and holds the work in a non-contact state; Control means for controlling the timing of starting suction of the non-contact type transport mechanism and stopping vacuum suction of the contact type transport mechanism when the workpiece is transferred from the contact type transport mechanism to the non-contact type transport mechanism; A workpiece transfer device comprising:
The control means sucks the work on the suction table in advance with a suction force larger than the suction force of the non-contact transport mechanism, and generates a swirl flow while lowering the non-contact transport mechanism toward the work. When the distance between the upper surface of the workpiece and the non-contact type transport mechanism reaches a set delivery distance, the vacuum suction of the suction table is stopped.

In the workpiece transfer apparatus according to the second invention, when the workpiece is sucked and held by the non-contact transfer mechanism in a non-contact state, a distance formed between the upper surface of the workpiece and the non-contact transfer mechanism is set. As d, it is preferable to set the delivery distance between 0.8d and 1.2d.

In the workpiece transfer device according to the first and second inventions, the non-contact transfer mechanism includes a holding unit that sucks and holds the workpiece in a non-contact state, a moving unit fixed to an upper portion of the holding unit, Cover means attached to the holding means and covering the upper side and the periphery of the holding means and opening downward;
The workpiece is rectangular,
The cover means is disposed on the upper side of the holding means, and is provided so as to be vertically movable with respect to the holding means by a plurality of guide members, and is attached to each guide member and a rectangular upper shielding plate in plan view. A spring for urging the upper shielding plate downward, and a side wall material that is provided around the upper shielding plate and into which the workpiece can be fitted, and is held by the holding means with a gap. It is preferable to prevent the workpiece from rotating.

In the workpiece transfer device according to the first and second inventions, the holding means is 1) a housing having a gap inside the cover means and having a circular opening at the center of the lower portion; A mounting member provided at the center of the housing, provided with a connecting portion for the moving means, and having an air port for injecting compressed air into the opening; and 3) an annular air chamber formed around the inner wall of the housing. A notch to be opened, an annular groove formed at an inner side in the radial direction from the annular air chamber, an air passage for guiding compressed air from the air port to the annular air chamber, and the annular air chamber A suction mechanism that is fixedly disposed in the opening, and includes a plurality of nozzles that blow out the compressed air to the annular groove and generate a negative pressure inside the annular groove and a positive pressure outside the annular groove; It is preferable to have.

In the workpiece transfer device according to the first and second inventions, it is preferable that the nozzle is formed obliquely including a right angle with respect to a radial line of the annular groove.
Moreover, it is preferable that the exit of the said air path inclines to the inclination side of the said nozzle, and forms the swirl flow in the said annular air chamber.

According to the third aspect of the invention, the workpiece conveying method according to the third aspect of the invention moves downward toward the thin plate-like workpiece arranged horizontally, generates a swirling flow on the upper side of the workpiece, and generates a negative pressure inside the swirling flow. A non-contact type transport mechanism that sucks and holds the work in a non-contact state and transports, and a contact table that moves by sucking and holding the work received from the non-contact type transport mechanism by vacuum suction A workpiece transfer method using a workpiece transfer device having a transfer mechanism and delivering the workpiece from the non-contact transfer mechanism to the suction table,
Lowering the non-contact type transport mechanism holding and sucking the workpiece in a non-contact state toward the suction table of the contact type transport mechanism;
Starting the vacuum suction of the suction table under conditions where the suction force of the suction table is smaller than the suction force of the non-contact transfer mechanism after the non-contact transfer mechanism starts to descend;
When the distance between the lower surface of the workpiece held by the non-contact conveyance mechanism and the upper surface of the suction table reaches a set delivery distance, the swirl flow generated in the non-contact conveyance mechanism is stopped. And the step of sucking and holding the workpiece that has been sucked and held by the non-contact type transport mechanism to the suction table.

The work transfer method according to the fourth invention in accordance with the above object includes a contact-type transfer mechanism including a suction table that moves by sucking and holding a thin plate-like work by vacuum suction, and the work sucked and held by the suction table. A non-contact type transport mechanism that lowers and approaches the workpiece, generates a swirling flow on the upper side of the work, creates a negative pressure inside the swirling flow, and sucks and holds the work in a non-contact state. A workpiece transfer method for transferring the workpiece from the suction table to the non-contact transfer mechanism using the workpiece transfer device provided,
A step of sucking the work in advance on the suction table with a suction force larger than the suction force of the non-contact type transport mechanism;
Generating a swirl flow while lowering the non-contact type transport mechanism toward the work held by suction on the suction table;
When the distance between the upper surface of the workpiece sucked and held by the suction table and the non-contact type transport mechanism reaches a set delivery distance, the vacuum suction of the suction table is stopped and the suction table is stopped. And sucking and holding the work held by suction on the non-contact type transport mechanism.

In the workpiece conveyance device according to the first invention and the workpiece conveyance method according to the third invention, the distance between the lower surface of the workpiece held by the non-contact type conveyance mechanism and the upper surface of the suction table has reached the delivery distance. At that time, the suction force that is smaller than the suction force of the non-contact type transport mechanism is uniformly applied to the lower surface of the work by the suction table. Therefore, when the suction of the non-contact type transport mechanism is stopped, the work is not tilted. It can be sucked by moving to the suction table side. Thereby, when changing holding | maintenance of a workpiece | work from a non-contact-type conveyance mechanism to a contact-type conveyance mechanism, it can prevent that the edge of a workpiece | work contacts a suction table and is damaged.

In the workpiece transfer apparatus according to the first invention, when the workpiece is sucked and held in a non-contact state by the non-contact transfer mechanism, the distance formed between the upper surface of the workpiece and the non-contact transfer mechanism is d, When the delivery distance is greater than 0 and less than or equal to d, the suction force acting on the workpiece is maintained while maintaining the distance between the workpiece and the non-contact conveyance mechanism when the non-contact conveyance mechanism is brought close to the suction table. Can be maintained, and the distance that the work moves before it is attracted to the suction table can be shortened to reduce the impact when the work comes into contact with the suction table.

In the workpiece transfer apparatus according to the second invention and the workpiece transfer method according to the fourth invention, the distance between the lower surface of the workpiece held by the non-contact transfer mechanism and the upper surface of the suction table has reached the delivery distance. At that time, a suction force smaller than the suction force of the suction table is uniformly applied to the upper surface of the workpiece by the non-contact type transport mechanism, so when the vacuum suction of the suction table is stopped, the workpiece is not contacted without tilting. It can be sucked and held by the type transport mechanism. Thereby, when changing holding | maintenance of a workpiece | work from a contact-type conveyance mechanism to a non-contact-type conveyance mechanism, it can prevent that the edge of a workpiece | work contacts and contacts a non-contact-type conveyance mechanism.

In the workpiece conveyance device according to the second invention, when the workpiece is sucked and held in the non-contact type conveyance mechanism in a non-contact state, a distance formed between the upper surface of the workpiece and the non-contact type conveyance mechanism is defined as d. When the delivery distance is 0.8d or more and 1.2d or less, the suction force by the non-contact type transport mechanism can be surely applied to the lower surface side of the silicon wafer while the silicon wafer is sucked and held by the contact type transport mechanism. it can.

In the work conveying apparatus according to the first and second inventions, the cover means of the non-contact type conveying mechanism is disposed on the upper side of the holding means, and is provided so as to be vertically movable with respect to the holding means by a plurality of guide members, Since it has a rectangular upper shielding plate in plan view and a spring that is attached to each guide member and biases the upper shielding plate downward, the cover means is provided close to the suction table and provided around the upper shielding plate. When the side wall member thus brought into contact with the upper surface of the suction table, only the holding means can be brought closer to the upper surface of the suction table while the upper shielding plate is moved upward relative to the holding means. Accordingly, the work can be sucked and held by the holding means in a non-contact state in a state where the rectangular work is fitted inside the side wall member. As a result, even if the workpiece is sucked and held by the holding means, each side of the rectangular workpiece contacts the opposite side wall material and rotation is prevented, so that the workpiece direction is always aligned. It can be sucked and held.

In the workpiece transfer apparatus according to the first and second inventions, the holding means is 1) a housing having a gap inside the cover means and having a circular opening in the lower center, and 2) the housing A mounting member having a connecting portion for moving means and having an air port for injecting compressed air into the opening, and 3) a notch forming an annular air chamber around the inner wall of the housing, An annular groove formed on the inner side in the radial direction from the annular air chamber, an air passage for guiding the compressed air from the air port to the annular air chamber, and the compressed air in the annular air chamber is ejected to the annular groove A plurality of nozzles for generating negative pressure inside the annular groove and generating positive pressure outside the annular groove, and having a suction mechanism fixedly arranged in the opening, by replacing the suction mechanism, A swirl flow can be formed

In the workpiece transfer apparatus according to the first and second inventions, when the nozzle is formed obliquely including a right angle to the radial line of the annular groove, a swirl flow of compressed air is efficiently formed in the annular groove. can do.

It is explanatory drawing of the workpiece conveyance apparatus which concerns on one embodiment of this invention. It is explanatory drawing of the control means of the work conveyance apparatus. It is explanatory drawing of the use condition of the 1st non-contact-type conveyance mechanism of the workpiece conveyance apparatus. It is a partially cutaway sectional side view of a 1st non-contact-type conveyance mechanism. It is a top view of the 1st non-contact-type conveyance mechanism. It is a bottom view of the first non-contact type transport mechanism. (A), (B) is the top view and side view of a suction mechanism, respectively. It is explanatory drawing of the guide means of a 1st non-contact-type conveyance mechanism. It is explanatory drawing of the use condition of the 2nd non-contact-type conveyance mechanism of the workpiece conveyance apparatus which concerns on one embodiment of this invention.

Next, embodiments of the present invention will be described with reference to the accompanying drawings for understanding of the present invention.
As shown in FIG. 1, a workpiece transfer device 10 according to an embodiment of the present invention is used for collecting current on one surface of a silicon wafer 11 for solar cells (an example of a workpiece) in a solar cell manufacturing process, for example. This is an apparatus for taking out the silicon wafer 11 on which the electrode has been printed from the screen printer 12 while supplying the silicon wafer 11 to the screen printer 12 on which the electrodes are printed. Here, the silicon wafer 11 has a thin plate shape, for example, a square shape in which one side has a length of 120 to 160 mm and a corner portion is notched, and a thickness is 0.15 to 0.25 mm. Then, the work transfer device 10 descends toward the silicon wafer 11 that is transferred through the payout transfer path 13 and is horizontally disposed at the first payout place 14, and swirls on the outer upper surface of the silicon wafer 11. A first non-contact type transport mechanism 15 that moves from the first payout place 14 by sucking and holding the silicon wafer 11 in a non-contact state with a negative pressure at the center of the silicon wafer 11. ing.

In addition, the workpiece transfer device 10 includes a plurality of suction tables 16 on a disc-shaped turntable 17 at regular intervals along the circumferential direction, and the turntable 17 is intermittently rotated at a predetermined angle so that the suction table 16 is moved. The silicon wafer 11 moved to the receiving place 18 and transferred by the first non-contact type transfer mechanism 15 is received and sucked and held by the suction table 16 and moved to the printing place 19 of the screen printing machine 12 for suction. After the electrodes are printed on the held silicon wafer 11, the contact-type transport mechanism 21 moves to the take-out place 20 and the silicon wafer 11 sucked and held by the suction table 17 moved to the take-out place 20 moves down and approaches. Then, a swirling flow is generated on the upper side of the silicon wafer 11 and the inside of the swirling flow is set to a negative pressure, and the silicon wafer 11 is sucked and held in a non-contact state and taken out. 0 moved to the second payout location 22, and a second non-contact conveyance mechanism 23 for placing the second payout locations 22. The silicon wafer 11 moved to the second payout location 22 is sent out to the next process via the transfer path 24.

In the contact type transport mechanism 21, the suction table 17 that has transferred the silicon wafer 11 to the second non-contact type transport mechanism 23 at the take-out place 20 returns to the receiving place 18. When one suction table 16 exists at the receiving place 18, another suction table 16 also exists at the printing place 19 and the take-out place 20. Therefore, the time interval for intermittently rotating the turntable 17 is set such that the first non-contact type transport mechanism 15 sucks and holds the silicon wafer 11 at the first dispensing place 14 and moves to the receiving place 18 and the suction table 16 holds the suction. The time required for printing, the time required for printing the electrode on the silicon wafer 11 at the printing place 19, and the second non-contact type transport mechanism 23 sucks and holds the silicon wafer 11 at the take-out place 20, and the second payout place. It is set so that the longest time is secured in the time required for moving to 22 and mounting.

Further, as shown in FIG. 2, the workpiece transfer device 10 lowers the first non-contact transfer mechanism 15 toward the suction table 16 at the receiving place 18, and then the suction table 16 at the receiving place 18. Vacuum suction of the suction table 16 is started so that the suction force becomes smaller than the suction force when the first non-contact type transport mechanism 15 sucks and holds the silicon wafer 11, and the first non-contact type transport mechanism 15 sucks the suction force. A first control unit having a first function of stopping the swirling flow when the distance between the lower surface of the held silicon wafer 11 and the upper surface of the suction table 16 reaches a set first delivery distance. 25, for example, when the suction table 16 is detected to move from the receiving place 18 to the printing place 19, the suction force when the suction table 16 holds the silicon wafer 11 by suction is set to a second value. When the suction table 16 is moved to the take-out place 20 and is increased to a value larger than the suction force of the non-contact transport mechanism 23, the second non-contact is directed toward the silicon wafer 11 sucked and held by the suction table 16. When a swirl flow is generated while lowering the transport mechanism 23 and the distance between the upper surface of the silicon wafer 11 and the second non-contact transport mechanism 23 reaches a set second delivery distance, the take-out place And a second control unit 26 having a second function of stopping the vacuum suction of the suction table 16 at 20.

Here, the first delivery distance between the lower surface of the silicon wafer 11 sucked and held by the first non-contact type transport mechanism 15 and the upper surface of the suction table 16 at the receiving place 18 is the first non-contact type. When the distance of the gap formed between the upper surface of the silicon wafer 11 and the first non-contact type transport mechanism 15 when the silicon wafer 11 is sucked and held by the transport mechanism 15 in a non-contact state, respectively, is d. , Set to a distance greater than 0 and less than or equal to d. Further, the second delivery distance between the upper surface of the silicon wafer 11 sucked and held on the suction table 16 in the take-out place 20 and the second non-contact type transport mechanism 23 is the second non-contact type transport mechanism 23. When the distance of the gap formed between the upper surface of the silicon wafer 11 and the second non-contact type transport mechanism 23 is d. A distance of 8d to 1.2d is set. The first and second control units 25 and 26 can be configured by installing a program that expresses the first and second functions in a computer.

As shown in FIG. 3, the first non-contact type transport mechanism 15 generates a swirling flow on the upper side of the silicon wafer 11 and sets the inner side of the swirling flow to a negative pressure to suck and hold the silicon wafer 11 in a non-contact state. The holding means 28, a moving means 29 fixed to the upper part of the holding means 28, and a cover means 30 attached to the holding means 28 and covering the upper side and the periphery of the holding means 28 and opening downward. The moving means 29 reciprocates between the first dispensing place 14 of the silicon wafer 11 and the receiving place 18 where the suction table 16 waits to receive the silicon wafer 11.

The suction table 16 holds and fixes (fixes) the lower surface of the silicon wafer 11. The suction table 16 has a plate-like air-permeable member 31 that vacuum-sucks the lower surface side of the silicon wafer 11 and adsorbs the silicon wafer 11 to the upper surface, and a gas-permeable member 31 fitted in the central portion. The side member 32 that covers the peripheral side surface of the member 31 and prevents the air from flowing, and the breathable member 31 that is fitted and inserted into the lower part of the side member 32 are placed on the lower surface side of the breathable member 31. A pedestal member (not shown) for suction and a suction means (not shown) (for example, a vacuum pump) connected to the pedestal member via a vacuum hose are provided. Here, the breathable member 31 is slightly smaller than the sectional area of the silicon wafer 11 so that the breathable member 31 is covered with the silicon wafer 11 when the silicon wafer 11 is adsorbed. It is formed by porous metal manufactured by sintering or porous ceramics manufactured by sintering ceramic powder such as alumina.

Further, the suction table 16 has a pedestal member placed so that the upper surface of the air-permeable member 31 is horizontal, and the holding means 28 for holding the silicon wafer 11 has moved above the standby position of the suction table 16 and stopped. At this time, the suction table 16 is moved back and forth and left and right with respect to the stop position of the holding means 28, and rotated around the central axis to position the suction table 16 with respect to the holding means 28. (Not shown). Thus, when the holding means 28 is lowered and the silicon wafer 11 is transferred from the holding means 28 to the suction table 16, the position of the silicon wafer 11 on the suction table 16 (the position in the horizontal plane and the rotation angle in the horizontal plane). Position) can always be made constant, and the pattern of electrodes formed on the silicon wafer 11 by the screen printer 12 can be made constant.

As shown in FIG. 4, the holding means 28 is disposed with a gap inside the cover means 30. The housing 33 is provided with a circular opening at the center of the lower part, and is provided at the center of the housing 33. And a mounting member 36 having an air port 35 for injecting compressed air into the opening of the housing 33. Further, the holding means 28 includes a notch that forms an annular air chamber 37 around the inner wall of the housing 33, and an annular groove 38 that is open at the lower side and is formed at a radially inner position from the annular air chamber 37. The air passage 39 for guiding the compressed air from the air port 35 to the annular air chamber 37 and the compressed air in the annular air chamber 37 are ejected to the annular groove 38, and a negative pressure is generated outside the annular groove 38 inside the annular groove 38. The suction mechanism 41 includes a plurality of nozzles 40 that generate positive pressure and is fixedly disposed in the opening of the housing 33.
Here, the nozzle 40 is formed obliquely including a right angle with respect to the radial line of the annular groove 38. Thus, compressed air can be blown into the annular groove 38 from the direction along or substantially along the inner peripheral surface of the annular groove 38, and a swirling flow of compressed air is efficiently formed in the annular groove 38. can do

The housing 33 includes an upper member 42 in which an attachment member 36 is erected at the center of the upper surface, and a side wall member 43 provided downward on an outer peripheral portion of the upper member 42, and the attachment member 36 has an air port 35. And an air inflow passage 44 communicating with the opening. Further, a reinforcing member 45 that houses the mounting member 36 is fixed to the upper surface of the upper member 42 on the outside of the mounting member 36 by using bolts 46 that are examples of fastening members.
At the lower surface of the suction mechanism 41, inside the annular groove 38, suction is generated when compressed air is ejected from the annular air chamber 37 to the annular groove 38 (the silicon wafer 11 is sucked and held in a non-contact state). A surface 47 is formed, and the upper surface of the annular groove 38 is in contact with the lower end of the side wall member 43 via an O-ring 48, and the lower surface protrudes below the suction surface 47 by, for example, 0.2 to 0.3 mm. A flange portion 49 is provided.

As shown in FIGS. 4 and 6, the annular groove 38 includes a bottom surface 50 formed parallel to the suction surface 47, and first and second slopes formed on the radially inner side and the radially outer side of the bottom surface 50, respectively. Surfaces 51 and 52 are provided, and the width of the annular groove 38 is larger on the opening side than on the bottom surface 50 side.
As shown in FIGS. 4, 7 </ b> A, and 7 </ b> B, the suction mechanism 41 is formed at the center of the suction mechanism 41 when the suction mechanism 41 is fixedly disposed in the opening of the housing 33. A square recess 53 is formed in the upper side so as to communicate with the air inflow path 44 when viewed from above. A groove 54 having a rectangular cross section extends from each corner of the recess 53 to the upper side of the suction mechanism 41 and extends toward the outer periphery of the suction mechanism 41 along an extension line of one side of the corner. .

Further, in the upper surface of the suction mechanism 41, a plurality (two in the present embodiment) of screw holes 59 are respectively provided in the regions 55, 56, 57, and 58 where the concave portion 53 and the groove 54 are not formed. An O-ring groove 61 for accommodating the O-ring 60 is formed outside the opening of each screw hole 59. On the other hand, the upper member 42 has a through-hole 63 in which the opening on the upper surface side of the upper member 42 is expanded so as to communicate with each screw hole 59 when the suction mechanism 41 is fixedly disposed in the opening of the housing 33. (See FIG. 8). As a result, the O-ring 60 is set in the O-ring groove 61, the suction mechanism 41 is inserted into the opening of the housing 33, the bolt 64, which is an example of a fastening member, is inserted into the through-hole 63 and screwed into the screw hole 59. Thus, the housing 33 and the suction mechanism 41 can be fixed and integrated.

With the above configuration, the air inflow portion 65 into which the compressed air injected into the air port 35 flows is formed by being surrounded by the recess 53 formed in the suction mechanism 41 and the lower surface of the upper member 42 of the housing 33. Can do. The radius of the annular groove 38 is concentric with the annular groove 38 surrounded by the inner wall of the housing 33 (the lower surface of the upper member 42 and the inner peripheral surface of the side wall member 43) and the notch formed around the suction mechanism 41. An annular air chamber 37 can be formed on the outer side in the direction. Further, a plurality (four in this embodiment) of air passages 39 are formed which are surrounded by the groove 54 and the lower surface of the upper member 42 and allow the compressed air gas flowing into the air inflow portion 65 to flow into the annular air chamber 37. be able to.

Here, as shown in FIGS. 6, 7 </ b> A and 7 </ b> B, the outlet of each air passage 39 is inclined toward the inclined side of the nozzle 40, so that the inclination of the nozzle 40 is within the annular air chamber 37. The compressed air can be ejected from the direction along the direction, and a swirling flow of the compressed air can be easily formed in the annular air chamber 37. Then, a part of the compressed air forming the swirling flow in the annular air chamber 37 is ejected into the annular groove 38 through the nozzle 40 from an oblique direction including a right angle to the radial line of the annular groove 38. Therefore, a swirling flow of compressed air can be easily formed in the annular groove 38.
For this reason, when compressed air is supplied to the holding means 28 to form a swirling flow of compressed air in the annular groove 38 and the holding means 28 is brought close to the upper surface of the silicon wafer 11, the upper side of the silicon wafer 11 and the annular groove are formed. The swirl flow generated between the outer circumferential surfaces of the annular grooves 38 flows out from the gap formed between the outer peripheral portion of the second inclined surface 52 of the annular groove 38 and the outer peripheral portion of the silicon wafer 11 while rotating outward in the radial direction. Can be made.

As shown in FIGS. 3 to 5, the moving means 29 is connected to a connecting portion 34 provided on an upper portion of a mounting member 36 erected on the upper member 42 of the housing 33 via a bolt 66 which is an example of a fastening member. The arm member 67 to which the front side is fixed, the rotation shaft 68 to which the base side of the arm member 67 is fixed, and the holding means 28 attached to the front side of the arm member 67 by driving the rotation shaft 68 are made of silicon. A function of reciprocating between a receiving position of the wafer 11 above the first discharging place 14 and a discharging position above the receiving position 18 of the suction table 16 disposed opposite to the first discharging place 14, and silicon A drive mechanism 69 having a function of raising and lowering the holding means 28 between the first dispensing place 14 and the receiving position of the wafer 11 or between the receiving place 18 and the dispensing position of the suction table 16 is provided. There.

As shown in FIGS. 5 and 8, the cover means 30 is disposed on the upper side of the holding means 28, and can be moved up and down with respect to the holding means 28 by a plurality of (four in the present embodiment) guide members 70. A rectangular upper shielding plate 71 in plan view, a spring 72 attached to each guide member 70 to urge the upper shielding plate 71 downward, and a silicon wafer provided around the upper shielding plate 71 on the inside. 11 has a side wall material 73 into which it can be fitted. Here, when the silicon wafer 11 is fitted inside the side wall member 73 provided around the upper shielding plate 71, the gap between the side wall member 73 and the end surface of the silicon wafer 11 is, for example, 0.05 to 0.15 mm. The side wall member 73 is fixed around the upper shielding plate 71 using a bolt 74 which is an example of a fastening member. In addition, an insertion hole having a dimension through which the reinforcing member 45 can be passed is provided in the central portion of the upper shielding plate 71, and through holes 75 are respectively formed at the four corner sides.

As shown in FIGS. 7 and 8, each region 55, 56, 57, 58 in which the screw hole 59 of the suction mechanism 41 is formed is provided with an O-ring groove 77 that accommodates an O-ring 76 around it. A circular hole 78 is formed. The upper member 42 is formed with through holes 79 that communicate with the respective circular holes 78, and whose lower side (the side that communicates with the circular holes 78) has the same diameter as the circular holes 78 and whose upper diameter is reduced. Further, a cylindrical body 80 is inserted into each space formed below the circular hole 78 and the through hole 79, and a guide member 70 having a spring 72 externally mounted therein is inserted into the cylindrical body 80. The upper side of the guide member 70 passes through the through hole 79 and the reduced diameter portion 81 on the front side protrudes from the upper surface of the upper member 42. Each reduced diameter portion 81 is accommodated in a through hole 79 a formed in the upper shielding plate 71, and a bolt 82, which is an example of a fastening member inserted from the upper surface side of the upper shielding plate 71, is an upper portion of the reduced diameter portion 81. Screwed into.

With this configuration, the upper shield plate 71 can be attached to the upper surface of the upper member 42 by screwing the bolt 82 into the reduced diameter portion 81 of the guide member 70 via the upper shield plate 71. it can. Then, when the lower end of the side wall member 73 attached to the upper shielding plate 71 comes into contact with the upper surface of the first dispensing place 14 or the suction table 16 of the silicon wafer 11 and the side wall member 73 is pressed upward, the side wall member 73 The upper shielding plate 71 to which 73 is attached moves upward, and the guide member 70 connected via the bolt 82 moves upward in the cylindrical body 80. Thereby, the upper shielding plate 71 can be moved upward with respect to the upper member 42. When the guide member 70 moves upward in the cylindrical body 80, the spring 72 sheathed on the guide member 70 is in a compressed state. For this reason, when the state in which the lower end of the side wall member 73 is in contact with the upper surface of the first payout place 14 or the suction table 16 is released, the compressed state of the spring 72 is released and the spring 72 is extended. By moving downward in the cylindrical body 80, the upper shielding plate 71 is biased downward. As a result, the upper shielding plate 71 can move downward and come into contact with the upper surface of the upper member 42.

The second non-contact type transport mechanism 23 shown in FIG. 9 generates a swirling flow on the upper side of the silicon wafer 11 and creates a negative pressure on the inner side of the swirling flow so that the silicon wafer 11 is sucked and held in a non-contact state. And a moving means 84 fixed to the upper part of the holding means 83 and a cover means 85 attached to the holding means 83 and covering the upper side and the periphery of the holding means 83 and opening downward. The moving means 84 reciprocates between the take-out place 20 of the silicon wafer 11 and the second pay-out place 22. Here, the holding unit 83, the moving unit 84, and the cover unit 85 can have the same configuration as the holding unit 28, the moving unit 29, and the cover unit 30 of the first non-contact transport mechanism 15, respectively. For this reason, the same code | symbol is attached | subjected to the same structural member and detailed description is abbreviate | omitted.

Subsequently, as shown in FIG. 1, the work conveying apparatus 10 according to one embodiment of the present invention prints current collecting electrodes on one surface of the silicon wafer 11 for solar cells in the solar cell manufacturing process. A method for transporting the silicon wafer 11 in the case of using the silicon wafer 11 on which the electrode has been printed as an apparatus for taking out the silicon wafer 11 from the screen printing machine 12 while supplying the silicon wafer 11 to the screen printing machine 12 will be described.

As shown in FIG. 3, the work transfer method for supplying the silicon wafer 11 to the screen printing machine 12 using the first non-contact transfer mechanism 15 and the contact transfer mechanism 21 is the first non-contact transfer mechanism. 15 is brought close to the silicon wafer 11 horizontally disposed at the first payout place 14, a swirling flow is generated on the upper side of the silicon wafer 11, the inside of the swirling flow is set to a negative pressure, and the silicon wafer 11 is sucked in a non-contact state. The first non-contact type transport mechanism 15 holding and sucking the silicon wafer 11 is waited at the receiving place 18. After the first non-contact type transport mechanism 15 starts to descend and the suction force of the suction table 16 is equal to the suction force of the first non-contact type transport mechanism 15. The step of starting the vacuum suction of the suction table 16 under a smaller condition, and the delivery in which the distance between the lower surface of the silicon wafer 11 held by the first non-contact transfer mechanism 15 and the upper surface of the suction table 16 is set When the distance is reached, the swirl flow generated by the first non-contact type transport mechanism 15 is stopped, and the silicon wafer 11 sucked and held by the first non-contact type transport mechanism 15 is sucked by the suction table 16. Holding. Details will be described below.

By operating the moving means 29, the holding means 28 is moved to the receiving position above the first dispensing place 14 of the silicon wafer 11. Next, an air supply hose (not shown) is inserted into the air port 35 of the holding means 28 while lowering the holding means 28 from the receiving position to the first payout place 14 of the silicon wafer 11 toward the silicon wafer 11 that is sucked and fixed. Compressed air is supplied through

The supplied compressed air flows into the air inflow portion 65 via the air inflow passage 44 formed in the attachment member 36 of the holding means 28, and the annular air chamber via the plurality of air passages 39 communicating with the air inflow portion 65. 37. Here, since the outlet of each air passage 39 is inclined toward the inclined side of the nozzle 40, a swirling flow is formed in the annular air chamber 37 by the compressed air flowing in through the air passage 39. A part of the air forming the swirling flow in the annular air chamber 37 flows into the annular groove 38 via the nozzle 40 from an oblique direction including a right angle with respect to the radial line of the annular groove 38. A swirling flow is easily formed in the annular groove 38.

When compressed air is supplied to the holding means 28 to form a swirling flow of compressed air in the annular groove 38 and the holding means 28 is brought close to the upper surface of the silicon wafer 11, a side wall material 73 covering the periphery of the holding means 28 is formed. Since it is urged downward with respect to the holding means 28 via the upper shielding plate 71, the height position of the lower end of the side wall material 73 coincides with the height position of the lower surface of the silicon wafer 11 (side wall material). At the time when the lower end of 73 comes into contact with the upper surface of the first payout place 14 of the silicon wafer 11, the suction surface 47 can be brought closer to the upper surface of the silicon wafer 11 while the side wall member 73 is moved upward. The silicon wafer 11 can be fitted inside the side wall member 73 provided around the upper shielding plate 71.

When the silicon wafer 11 is fitted inside the side wall member 73, a swirling flow is generated between the upper side of the silicon wafer 11 and the annular groove 38 by the compressed air ejected into the annular groove 38. The gas flows out from the gap formed between the outer peripheral part of the inclined surface 52 and the outer peripheral part of the silicon wafer 11 while turning outward in the radial direction. For this reason, the gap between the suction surface 47 and the upper surface of the silicon wafer 11 is caused by the flow of compressed air flowing out from the gap between the second inclined surface 52 and the silicon wafer 11 while turning outward in the radial direction. Is sucked, and the pressure in the gap between the suction surface 47 and the upper surface of the silicon wafer 11 decreases (becomes negative pressure). The compressed air flowing out from the gap between the second inclined surface 52 and the silicon wafer 11 is discharged to the outside through the through holes 75 formed on the four corners of the upper shielding plate 71.

As a result, a suction force is generated between the suction surface 47 and the silicon wafer 11. When the suction force with respect to the silicon wafer 11 sucked and fixed to the first payout place 14 is released, the silicon wafer 11 is The silicon wafer 11 is sucked and held by the holding surface 28 in a non-contact state by being sucked by the suction surface 47. Here, since a swirling flow is generated between the upper side of the silicon wafer 11 and the annular groove 38, when the silicon wafer 11 is sucked and held on the suction surface 47 in a non-contact state, the silicon wafer 11 has a horizontal plane. A force to rotate is applied. However, since the silicon wafer 11 is fitted inside the side wall member 73, when the silicon wafer 11 tries to rotate, the end of the silicon wafer 11 comes into contact with the side wall member 73 and the rotation of the silicon wafer 11 is prevented. .

When the silicon wafer 11 is sucked and held by the holding means 28, the moving means 29 is operated to raise the holding means 28 to the receiving position above the first payout location 14 of the silicon wafer 11. When the holding means 28 is raised and the lower end of the side wall member 73 of the cover means 30 is detached from the upper surface of the first payout place 14, the compressed state of the spring 72 sheathed on the guide member 70 is released. As a result, the spring 72 extends and the guide member 70 moves downward in the cylindrical body 80 (the upper shielding plate 71 is urged downward), and the upper shielding plate 71 moves downward to the upper surface of the upper member 42. Abut. As a result, the upper side and the periphery of the holding means 28 are covered with the cover means 30, and the suction holding by the holding means 28 of the silicon wafer 11 is stabilized.

When the holding means 28 rises to the receiving position, the moving means 29 is further operated to move the holding means 28 to the payout position above the receiving place 18 where the suction table 16 stands by. Next, the position adjustment mechanism of the suction table 16 is operated to align the suction table 16 with the stop position of the holding means 28. Then, suction of air from the lower surface side of the air-permeable member 31 of the suction table 16 is started while the holding means 28 is lowered from the payout position toward the suction table 16. The distance between the lower surface of the silicon wafer 11 sucked and held by the holding means 28 and the upper surface of the suction table 16 gradually decreases, and the height position of the lower end of the side wall member 73 is the height position of the upper surface of the suction table 16. When the side wall material 73 is moved upward, the distance between the lower surface of the silicon wafer 11 and the upper surface of the suction table 16 is further reduced, for example, the lower surface of the silicon wafer 11 and the suction table 16 The distance between the upper surface and the upper surface can be set to the same distance as the gap formed when the silicon wafer 11 is held on the suction surface 20 in a non-contact state.

When the distance between the lower surface of the silicon wafer 11 and the upper surface of the suction table 16 reaches the same distance as the gap when the silicon wafer 11 is sucked and held on the suction surface 20 in a non-contact state, the silicon wafer 11 Since the suction force of the suction table 16 that sucks water is smaller than the suction force by the holding means 28 of the first non-contact type transport mechanism 15, the silicon wafer 11 is sucked and held by the holding means 28. Here, when the supply of air to the air port 35 of the holding unit 28 is stopped, the suction holding of the silicon wafer 11 by the holding unit 28 is released, and the silicon wafer 11 is adsorbed to the adsorption table 16. Here, when the silicon wafer 11 is transferred from the holding means 28 to the suction table 16, the rotation of the silicon wafer 11 is prevented by the side wall material 73, so that the angular position of the silicon wafer 11 on the suction table 16 is determined. The suction table 16 can be sucked and held constantly.

As shown in FIG. 9, the work transfer method for taking out the silicon wafer 11 from the screen printer 12 using the contact transfer mechanism 21 and the second non-contact transfer mechanism 23 is the second non-contact transfer mechanism 23. The step of adjusting the suction force of the suction table 16 so that the silicon wafer 11 is sucked and held on the suction table 16 with a suction force larger than the suction force of the silicon wafer 11 by the step, and the second non-contact transport mechanism 23 is taken out. A step of generating a swirling flow while descending toward the silicon wafer 11 sucked and held by the suction table 16 at the position 20, and a second non-contact type with the upper surface of the silicon wafer 11 sucked and held by the suction table 16 When the distance to the transport mechanism 23 reaches the set delivery distance, the vacuum suction of the suction table is stopped and the suction table 16 holds the suction. The silicon wafer 11, which is and a step of sucking and holding the second non-contact conveyance mechanism 23. Details will be described below.

By operating the moving means 84, the holding means 83 of the second non-contact type transport mechanism 23 is moved above the take-out place 20 for the silicon wafer 11. Next, while lowering the holding means 83 toward the silicon wafer 11 sucked and held by the suction table 16 in the take-out place 20, the compressed air is supplied to the air port 35 of the holding means 83 via an air supply hose (not shown). Supply.

The supplied compressed air flows into the air inflow portion 6 via the air inflow passage 44 formed in the mounting member 36 of the holding means 83, and the annular air passes through the plurality of air passages 39 communicating with the air inflow portion 65. The air flows into the chamber 37, and a swirling flow of compressed air is formed in the annular air chamber 37. A part of the air forming the swirling flow in the annular air chamber 37 flows into the annular groove 38 through the nozzle 40 from an oblique direction including a right angle to the radial line of the annular groove 38. A swirling flow is formed in the annular groove 38.

When the holding means 83 is brought close to the upper surface of the silicon wafer 11 while forming a swirling flow of compressed air in the annular groove 38 of the holding means 83, the height position of the lower end of the side wall member 73 covering the periphery of the holding means 83 is set. When the height of the lower surface of the silicon wafer 11 coincides (the lower end of the side wall member 73 comes into contact with the upper surface of the suction table 16 holding the silicon wafer 11), the side wall member 73 is moved upward. However, the suction surface 47 can be brought close to the upper surface of the silicon wafer 11, and the silicon wafer 11 can be fitted inside the side wall member 73 provided around the upper shielding plate 71.

When the silicon wafer 11 is fitted inside the side wall member 73 and the distance between the upper surface of the silicon wafer 11 and the holding means 83 of the second non-contact type transport mechanism 23 reaches the delivery distance, the silicon wafer 11 is ejected into the annular groove 38. The compressed air generates a swirling flow between the outer upper surface of the silicon wafer 11 and the annular groove 38, and the swirling flow is between the outer peripheral portion of the second inclined surface 52 of the annular groove 38 and the outer peripheral portion of the silicon wafer 11. It flows out from the gap formed in the above while turning outward in the radial direction. For this reason, the gap between the suction surface 47 and the upper surface of the silicon wafer 11 is caused by the flow of compressed air flowing out from the gap between the second inclined surface 52 and the silicon wafer 11 while turning outward in the radial direction. Is sucked, and the pressure in the gap between the suction surface 47 and the upper surface of the silicon wafer 11 decreases (becomes negative pressure).

As a result, a suction force is generated between the suction surface 47 of the holding means 83 and the silicon wafer 11. However, since the suction force of the silicon wafer 11 by the second non-contact type transport mechanism 23 is smaller than the suction force of the silicon wafer 11 by the suction table 16, the silicon wafer 11 is held by suction on the suction table 16. Therefore, when the suction force to the silicon wafer 11 sucked and fixed to the suction table 16 is released, the silicon wafer 11 is sucked to the suction surface 47 of the holding means 83, and the silicon wafer 11 is sucked and held to the holding means 83 in a non-contact state. Will be. Here, since a swirling flow is generated between the upper side of the silicon wafer 11 and the annular groove 38, when the silicon wafer 11 is sucked and held on the suction surface 47 in a non-contact state, the silicon wafer 11 has a horizontal plane. Although the force to rotate acts, since the silicon wafer 11 is fitted inside the side wall member 73, when the silicon wafer 11 tries to rotate, the end portion of the silicon wafer 11 comes into contact with the side wall member 73, and silicon The rotation of the wafer 11 is prevented.

When the silicon wafer 11 is sucked and held by the holding means 83, the moving means 84 is operated to raise the holding means 83 to the receiving position above the take-out location 20. When the holding means 83 is raised and the lower end of the side wall member 73 of the cover means 85 is detached from the upper surface of the suction table 16, the compressed state of the spring 72 sheathed on the guide member 70 is released, and the spring 72 extends to extend the guide member. 70 moves downward in the cylindrical body 80 (the upper shielding plate 71 is urged downward), and the upper shielding plate 71 moves downward and contacts the upper surface of the upper member 42. As a result, the upper side and the periphery of the holding unit 83 are covered with the cover unit 85, and the suction holding by the holding unit 83 of the silicon wafer 11 is stabilized.

When the holding means 83 rises to a set height position above the take-out place 20, the moving means 84 is further operated to move the holding means 83 to the second payout position above the second payout place 22 of the silicon wafer 11. Move to position. Next, the moving means 84 is operated to lower the holding means 83 toward the second payout place 22, approach the transfer stand (not shown) waiting at the second payout place 22, and hold it. The suction holding of the silicon wafer 11 by the means 83 is released, and the silicon wafer 11 is delivered to the transfer table.

As described above, the present invention has been described with reference to the embodiment. However, the present invention is not limited to the configuration described in the above-described embodiment, and the matters described in the scope of claims. Other embodiments and modifications conceivable within the scope are also included.

DESCRIPTION OF SYMBOLS 10: Work conveying apparatus, 11: Silicon wafer, 12: Screen printing machine, 13: Discharge conveyance path, 14: 1st discharge place, 15: 1st non-contact-type conveyance mechanism, 16: Suction table, 17: Rotation 18: receiving place, 19: printing place, 20: take-out place, 21: contact-type transport mechanism, 22: second pay-out place, 23: second non-contact type transport mechanism, 24: transport path, 25: First control unit 26: Second control unit 27: Control unit 28: Holding unit 29: Moving unit 30: Cover unit 31: Breathable member 32: Side member 33: Housing 34 : Connection part, 35: air port, 36: mounting member, 37: annular air chamber, 38: annular groove, 39: air channel, 40: nozzle, 41: suction mechanism, 42: upper member, 43: side wall member, 44 : Air inflow path, 45: Reinforcement part , 46: bolt, 47: suction surface, 48: O-ring, 49: flange portion, 50: bottom surface, 51: first inclined surface, 52: second inclined surface, 53: recessed portion, 54: groove, 55, 56, 57, 58: Region, 59: Screw hole, 60: O-ring, 61: O-ring groove, 63: Through hole, 64: Bolt, 65: Air inflow part, 66: Bolt, 67: Arm member, 68: Rotating shaft, 69: Drive mechanism, 70: Guide member, 71: Upper shielding plate, 72: Spring, 73: Side wall material, 74: Bolt, 75: Through hole, 76: O-ring, 77: O-ring groove, 78 : Circular hole, 79, 79a: through hole, 80: cylindrical body, 81: reduced diameter portion, 82: bolt, 83: holding means, 84: moving means, 85: cover means

Claims (10)

Moves downward toward a thin plate-like workpiece placed horizontally, generates a swirling flow on the upper side of the workpiece, creates a negative pressure inside the swirling flow, and sucks and holds the workpiece in a non-contact state for conveyance. A contact-type transport mechanism, a contact-type transport mechanism having a suction table that moves the workpiece received from the non-contact-type transport mechanism by vacuum suction, and the suction table from the non-contact type transport mechanism And a control means for controlling the timing of the vacuum suction start of the suction table and the suction stop of the non-contact transport mechanism when delivering the work to the work table,
The control means starts the vacuum suction of the suction table under the condition that the suction force of the suction table becomes smaller than the suction force of the non-contact transport mechanism after lowering the non-contact transport mechanism. A work transfer device that stops a swirling flow when a distance between a lower surface of the work held by a contact-type transfer mechanism and an upper surface of the suction table reaches a set delivery distance. 2. The workpiece transfer apparatus according to claim 1, wherein a distance formed between the upper surface of the workpiece and the non-contact transfer mechanism when the workpiece is sucked and held by the non-contact transfer mechanism is d. As described above, the workpiece transfer apparatus is characterized in that the delivery distance is greater than 0 and less than or equal to d. A contact-type transport mechanism having a suction table that moves by sucking and holding a thin plate-like workpiece by vacuum suction, and descends toward the workpiece held by the suction table and swivels above the workpiece. A non-contact type transport mechanism that generates a flow to create a negative pressure inside the swirling flow, sucks and holds the work in a non-contact state, and transports the work from the contact-type transport mechanism to the non-contact type transport mechanism. A workpiece transfer device provided with control means for controlling the timing of the start of suction of the non-contact transfer mechanism and the stop of vacuum suction of the contact transfer mechanism when delivering,
The control means sucks the work on the suction table in advance with a suction force larger than the suction force of the non-contact transport mechanism, and generates a swirl flow while lowering the non-contact transport mechanism toward the work. The work transfer device stops vacuum suction of the suction table when the distance between the upper surface of the work and the non-contact transfer mechanism reaches a set delivery distance. 4. The workpiece transfer apparatus according to claim 3, wherein a distance formed between the upper surface of the workpiece and the non-contact transfer mechanism when the workpiece is sucked and held by the non-contact transfer mechanism is d. As described above, the workpiece transfer device is characterized in that the delivery distance is 0.8d or more and 1.2d or less. 5. The workpiece transfer apparatus according to claim 1, wherein the non-contact transfer mechanism includes a holding unit that sucks and holds the workpiece in a non-contact state, and a movement fixed to an upper portion of the holding unit. Means, and cover means attached to the holding means and covering the upper side and the periphery of the holding means and opening downward,
The workpiece is rectangular,
The cover means is disposed on the upper side of the holding means, and is provided so as to be vertically movable with respect to the holding means by a plurality of guide members, and is attached to each guide member and a rectangular upper shielding plate in plan view. A spring for urging the upper shielding plate downward, and a side wall material that is provided around the upper shielding plate and into which the workpiece can be fitted, and is held by the holding means with a gap. Further, a workpiece transfer device that prevents the workpiece from rotating. 6. The workpiece transfer apparatus according to claim 5, wherein the holding means is 1) a housing having a gap inside the cover means and having a circular opening at the center of the lower portion, and 2) the housing. A mounting member provided in the center and provided with a connecting portion of the moving means and having an air port for injecting compressed air into the opening; and 3) a notch forming an annular air chamber around the inner wall of the housing. An annular groove formed on the lower side and formed radially inward from the annular air chamber, an air passage for guiding compressed air from the air port to the annular air chamber, and compressed air in the annular air chamber A suction mechanism that is fixedly disposed in the opening, and includes a plurality of nozzles that are ejected to the annular groove and generate a negative pressure inside the annular groove and a positive pressure outside the annular groove. Characteristic workpiece transfer device 7. The workpiece transfer apparatus according to claim 6, wherein the nozzle is formed obliquely including a right angle with respect to a radial line of the annular groove. 8. The workpiece transfer device according to claim 6, wherein an outlet of the air passage is inclined toward the inclined side of the nozzle to form a swirling flow in the annular air chamber. Moves downward toward a thin plate-like workpiece placed horizontally, generates a swirling flow on the upper side of the workpiece, creates a negative pressure inside the swirling flow, and sucks and holds the workpiece in a non-contact state for conveyance. Using a workpiece transfer device having a non-contact transfer mechanism, and a contact transfer mechanism having a suction table that moves by sucking and holding the workpiece received from the non-contact transfer mechanism, A workpiece transfer method for transferring the workpiece from the non-contact transfer mechanism to the suction table,
Lowering the non-contact type transport mechanism holding and sucking the workpiece in a non-contact state toward the suction table of the contact type transport mechanism;
Starting the vacuum suction of the suction table under conditions where the suction force of the suction table is smaller than the suction force of the non-contact transfer mechanism after the non-contact transfer mechanism starts to descend;
When the distance between the lower surface of the workpiece held by the non-contact conveyance mechanism and the upper surface of the suction table reaches a set delivery distance, the swirl flow generated in the non-contact conveyance mechanism is stopped. And a step of causing the suction table to suck and hold the workpiece that has been sucked and held by the non-contact transfer mechanism. A contact-type transport mechanism having a suction table that moves by sucking and holding a thin plate-like workpiece by vacuum suction, and descends toward the workpiece held by the suction table and swivels above the workpiece. Using a work transfer device that includes a non-contact type transfer mechanism that generates a flow to create a negative pressure inside the swirl flow and sucks and holds and transfers the work in a non-contact state. A workpiece transfer method when delivering the workpiece to a non-contact transfer mechanism,
A step of sucking the work in advance on the suction table with a suction force larger than the suction force of the non-contact type transport mechanism;
Generating a swirl flow while lowering the non-contact type transport mechanism toward the work held by suction on the suction table;
When the distance between the upper surface of the workpiece sucked and held by the suction table and the non-contact type transport mechanism reaches a set delivery distance, the vacuum suction of the suction table is stopped and the suction table is stopped. And a step of sucking and holding the work sucked and held by the non-contact type carrying mechanism.

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