JP2012030273A - Method for manufacturing semiconductor device, and jig for soldering - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a soldering jig and a method for manufacturing a semiconductor device capable of suitably performing soldering by controlling the temperature of solder during soldering.
When soldering solder 70, a soldering jig 100 is used. The soldering jig 100 has a lower base material 110 and an upper base material 120. The lower substrate 110 includes a temperature control member 111 and a lid member 112. The temperature control member 111 is made of a material having a melting point lower than that of solder used for soldering. During soldering, heating is performed from the lower substrate 110 side and the upper substrate 120 side. When the temperature of the temperature control member 111 reaches the melting point due to the heating, the temperature control member 111 is melted. Since the temperature control member 111 is melted, the temperature of the lower electrode 30 is kept at the melting point of the temperature control member 111. Thereby, the solder 70 is melted and used for soldering, but the solder 50 already soldered is not melted.
[Selection] Figure 4

Description

  The present invention relates to a semiconductor device manufacturing method and a soldering jig. More specifically, the present invention relates to a soldering jig capable of suitably performing soldering and a method for manufacturing a semiconductor device.

  In a semiconductor device, a semiconductor element is generally soldered to a circuit board or the like. Some of such semiconductor devices have a plurality of solder layers. When manufacturing a semiconductor device having a plurality of solder layers, generally, the first layer is soldered and then the second layer is soldered. Then, the semiconductor device is manufactured by sequentially performing soldering. In that case, if solders having the same melting point are used when soldering a plurality of layers, the soldered solder layer is melted. For this reason, the re-melted solder protrudes from the solder layer, or the position accuracy of each soldered component becomes low.

  Low melting point solder may be used so that once soldered solder does not melt again. In that case, the first layer is first soldered using a high melting point solder. Next, the second layer is soldered using a low melting point solder. At that time, soldering is performed at a soldering temperature lower than the melting point of the high melting point solder. This is to prevent the solder layer of the first layer already soldered from melting again. This is because if the solder layer is melted again, the positional accuracy of each component already soldered may be deteriorated.

  For example, Patent Document 1 discloses a method of manufacturing a semiconductor device in which a semiconductor pellet is soldered to a substrate body using a high melting point solder, and a tape carrier package is soldered to the substrate body using a low melting point solder. Yes. As a result, when the tape carrier package is soldered, the high melting point solder is not likely to melt.

Japanese Patent Laid-Open No. 11-145379

  However, low melting point solder is inferior in soldering performance compared to high melting point solder. In other words, low melting point solder is easily plastically deformed. When subjected to repeated stress, fatigue failure is likely. Furthermore, the melting point of the low melting point solder is a temperature close to the operating temperature range (for example, 150 to 175 ° C. at the maximum value) of the electronic component. That is, when used as a semiconductor device, the low melting point solder may melt. In addition, it is environmentally undesirable to use lead or cadmium for manufacturing low melting point solder. However, the use of rare metals such as indium is disadvantageous in terms of cost.

  The present invention has been made to solve the above-described problems of the prior art. That is, an object of the present invention is to provide a soldering jig and a method for manufacturing a semiconductor device capable of suitably performing soldering by controlling the temperature of solder during soldering.

  The soldering jig according to one aspect of the present invention, which has been made for the purpose of solving this problem, includes a lower part for placing a soldering target part and an upper part placed on the soldering target part. It has. At least one of the lower part and the upper part is a temperature control member that melts at a predetermined temperature, and a member that has a melting point higher than the melting point of the temperature control member. And an intermediate member disposed between the two. Such a soldering jig controls the temperature of the solder during soldering and can perform soldering suitably.

  In the soldering jig described above, the temperature control member may be the same melting point temperature control member having the same melting point as that of the solder used for soldering. This is because the solder temperature does not rise too much during soldering. Therefore, there is no risk of solder bumping.

  In the soldering jig described above, the temperature control member may be a low melting point temperature control member having a melting point lower than the melting point of the solder used for soldering. This is because the solder temperature does not rise too much during soldering. And there is no possibility that the solder which has already been soldered will melt again. Therefore, the shape accuracy of the solder joint body soldered using this soldering jig is high.

  In the soldering jig described above, a first temperature control member disposed on one of the lower side and the upper side and a second temperature control disposed on the other of the lower side and the upper side The first temperature control member is a low melting point temperature control member having a melting point lower than the melting point of the solder used for soldering, and the second temperature control member is a soldering member used for soldering. A high melting point temperature control member having a melting point higher than the melting point is even better. This is because temperature control can be performed on both sides of heating.

  In the soldering jig described above, the temperature control member is made of a material whose volume after melting is smaller than the volume before melting, and the intermediate member is fixed to the lower or upper base material. It is good that it is a highly rigid member. This is because after the temperature control member is melted, the space in which the temperature control member is disposed is in a reduced pressure state. The reduced pressure layer thus formed has a high heat insulating effect. That is, it is possible to prevent the heating heat from the soldering jig from being transmitted to the solder, and to prevent the solder from overheating.

  In the soldering jig described above, the temperature control member is made of a material whose volume after melting is smaller than the volume before melting, and the intermediate member is fixed to the lower or upper base material. In addition, it may be made of a material that is elastically deformed by melting of the temperature control member. This is because the lid member is elastically deformed after the temperature control member is melted, and an air layer is formed between the soldering target component and the lid member. That is, a heat insulation effect occurs. For this reason, heating to the soldering target component is suppressed.

  In the soldering jig described above, the temperature control member is made of a material whose volume after melting is smaller than the volume before melting, and the intermediate member is fixed to the lower or upper base material. It should be possible to move away from the parts to be soldered. This is because the contact between the lid member and the part to be soldered is released after the temperature control member is melted. That is, the heat transfer path is blocked, and an air layer is formed between the soldering target part and the lid member, so that a heat insulating effect is generated. For this reason, heating to the soldering target component is suppressed.

  In the soldering jig described above, the temperature control member may be made of a material that vaporizes at a predetermined temperature instead of a material that melts at a predetermined temperature. This is because even if such a temperature control member is used, the temperature of the part to be soldered can be controlled. In other words, an air layer is formed in the middle of the heat transfer path leading to the part to be soldered, resulting in a heat insulation effect. For this reason, heating to the soldering target component is suppressed.

  In the soldering jig described above, the temperature control member becomes a reducing gas having reducibility in a vaporized state, and the component to be soldered is placed from the place where the temperature control member is disposed. It is preferable that a through-hole reaching the portion where it is formed is formed. This is because the oxide film can be removed from the surface of the part to be soldered to facilitate the soldering.

  A method for manufacturing a semiconductor device according to one embodiment of the present invention includes a first soldering step in which a semiconductor element is soldered to a first base material to form a first solder joint. In the first soldering step, a temperature control member that melts at a predetermined temperature and a member having a melting point higher than the melting point of the temperature control member, between the temperature control member and the first substrate. Using the first soldering jig having the intermediate member disposed on the first base material, the first base material is disposed such that the intermediate member is positioned between the temperature control member and the first base material; Heat in the state and solder. In such a method of manufacturing a semiconductor device, it is possible to perform soldering suitably by controlling the temperature of solder during soldering.

  According to another aspect of the present invention, there is provided a method for manufacturing a semiconductor device, comprising: a first soldering step in which a semiconductor element is soldered to a first base material to form a first solder joint; And a second soldering step of soldering the material to the first solder joint to form a double-sided cooling type semiconductor device. In the second soldering step, at least one of the first base material side and the second base material side is melted at a predetermined temperature, and is higher than the melting point of the temperature control member. A second soldering jig having a melting point material and having an intermediate member disposed between at least one of the first base material and the second base material and the temperature control member; The first base material or the second base material is disposed so that the intermediate member is positioned between at least one of the first base material and the second base material and the temperature control member, and heated in that state. And solder. This is because the semiconductor device manufacturing method can suitably solder a double-sided cooling type semiconductor device having a plurality of solder layers.

  In the semiconductor device manufacturing method described above, at least one of the first soldering step and the second soldering step has the same melting point temperature as the temperature control member, the same melting point as that of the solder used for soldering. A control member may be used. This is because the solder temperature does not rise too much during soldering. Therefore, there is no risk of solder bumping.

  In the semiconductor device manufacturing method described above, at least one of the first soldering step and the second soldering step is a temperature control member that has a low melting point that is lower than the melting point of the solder used for soldering. A control member may be used. This is because the solder temperature does not rise too much during soldering. And there is no possibility that the solder which has already been soldered will melt again. Therefore, the shape accuracy of the solder joint body soldered using this soldering jig is high.

  In the semiconductor device manufacturing method described above, the melting point of the solder used for soldering on one side of the first base material side and the second base material side as the second soldering jig A low melting point temperature control member having a lower melting point and a high melting point that is higher than the melting point of the solder used for soldering on the other side of the first substrate side and the second substrate side A thing provided with a temperature control member is good to use. This is because temperature control can be performed on both sides of heating. Therefore, the solder to be soldered in the second soldering step can be soldered at a suitable soldering temperature without melting the solder layer that has already been soldered again.

  In the semiconductor device manufacturing method described above, the temperature control member other than the high melting point temperature control member is made of a material whose volume after melting is smaller than the volume before melting, and the first base material is used as the intermediate member. A jig provided with a high-rigidity member fixed to at least one of the second base material and the second base material may be used. This is because after the temperature control member is melted, the space in which the temperature control member is disposed is in a reduced pressure state. The reduced pressure layer thus formed has a high heat insulating effect and can prevent solder overheating.

  In the semiconductor device manufacturing method described above, the temperature control member other than the high melting point temperature control member is made of a material whose volume after melting is smaller than the volume before melting, and the first base material is used as the intermediate member. And a jig that is fixed to at least one of the second base material and that is elastically deformed by melting of the temperature control member. This is because the lid member is elastically deformed after the temperature control member is melted, and an air layer is formed between the soldering target component and the lid member. That is, a heat insulation effect occurs. For this reason, heating to the soldering target component is suppressed.

  In the semiconductor device manufacturing method described above, a temperature control member other than the high melting point temperature control member is made of a material whose volume after melting is smaller than the volume before melting, and the intermediate member is used as a soldering target component. It is preferable to use a jig provided with a tool that can move in a direction away from it. This is because the contact between the lid member and the part to be soldered is released after the temperature control member is melted. That is, the heat transfer path is blocked, and an air layer is formed between the soldering target part and the lid member, so that a heat insulating effect is generated. For this reason, heating to the soldering target component is suppressed.

  In the semiconductor device manufacturing method described above, the temperature control member other than the high melting point temperature control member is made of a material that vaporizes at a predetermined temperature instead of a material that melts at a predetermined temperature. It is advisable to use a gas that has a reducing property. This is because even if such a temperature control member is used, the temperature of the member to be soldered can be controlled. This is because the oxide film can be removed from the surface of the part to be soldered to facilitate the soldering.

  ADVANTAGE OF THE INVENTION According to this invention, the jig | tool for soldering which can control solder temperature at the time of soldering, and can perform soldering suitably, and the manufacturing method of a semiconductor device are provided.

It is sectional drawing for demonstrating the double-sided cooling type power module manufactured in 1st Embodiment to 3rd Embodiment. It is sectional drawing for demonstrating the soldering jig which concerns on 1st Embodiment. It is sectional drawing (the 1) for demonstrating the manufacturing method of the power module which concerns on 1st Embodiment. It is sectional drawing (the 2) for demonstrating the manufacturing method of the power module which concerns on 1st Embodiment. It is sectional drawing (the 3) for demonstrating the manufacturing method of the power module which concerns on 1st Embodiment. It is a graph which shows the change of the temperature of the solder at the time of performing soldering in the manufacturing method of the power module concerning a 1st embodiment. It is sectional drawing for demonstrating the manufacturing method of the soldering jig | tool and power module which concern on 2nd Embodiment. It is sectional drawing (the 1) for demonstrating another soldering jig which concerns on 2nd Embodiment. It is sectional drawing (the 2) for demonstrating another soldering jig which concerns on 2nd Embodiment. It is sectional drawing for demonstrating the jig | tool for soldering which concerns on 3rd Embodiment. It is sectional drawing for demonstrating the single-sided cooling type power module manufactured in 4th Embodiment and 5th Embodiment. It is a top view for demonstrating the jig | tool for soldering which concerns on 4th Embodiment. It is sectional drawing for demonstrating the jig | tool for soldering which concerns on 4th Embodiment. It is sectional drawing (the 1) for demonstrating another soldering jig which concerns on 4th Embodiment. It is sectional drawing (the 2) for demonstrating another soldering jig which concerns on 4th Embodiment. It is sectional drawing for demonstrating the jig | tool for soldering which concerns on 5th Embodiment. It is sectional drawing (the 1) for demonstrating another jig | tool for soldering which concerns on 5th Embodiment. It is sectional drawing (the 2) for demonstrating another jig | tool for soldering which concerns on 5th Embodiment.

  DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments embodying the present invention will be described below in detail with reference to the accompanying drawings. The present embodiment embodies the present invention regarding a method for manufacturing a power module and a soldering jig used therefor.

(First embodiment)
1. Power Module A cross-sectional view of the power module 1 manufactured in the present embodiment is shown in FIG. The power module 1 is a double-sided cooling type semiconductor device. As shown in FIG. 1, the power module 1 includes a power element 10, a block electrode 20, an element lower electrode 30, an element upper electrode 40, and solders 50, 60, and 70.

  The power element 10 is a semiconductor element such as an IGBT or a diode. The block electrode 20 is an electrode soldered between the power element 10 and the element upper electrode 40. The element lower electrode 30 is an electrode located on the outermost side of the power module 1. The element upper electrode 40 is also the outermost electrode in the power module 1. Examples of the material of these electrodes include copper. The outer surfaces 31 and 41 of the element lower electrode 30 and the element upper electrode 40 are surfaces to be cooled. Each of these parts is a soldering target part to be soldered.

  The solder 50 is a solder layer that joins the power element 10 and the element lower electrode 30. The solder 60 is a solder layer that joins the power element 10 and the block electrode 20. The solder 70 is a solder layer that joins the block electrode 20 and the element upper electrode 40. The solders 50, 60, and 70 are all layers made of the same type of solder. For example, SnCu (melting point: around 227 ° C.). Therefore, of course, the melting points of these solders 50, 60 and 70 are the same.

  The thickness of the power element 10 is about 100 to 500 μm. The thickness of the block electrode 20 is about 0.5 to 5 mm. The thickness of the solders 50, 60, 70 is about 50 to 500 μm. The thickness of the element lower electrode 30 and the element upper electrode 40 is about 1 to 10 mm. In FIG. 1, the thickness of each part is drawn with emphasis to show the structure in an easy-to-understand manner. However, in practice, the thickness of each component sandwiched between the element lower electrode 30 and the element upper electrode 40 is very thin.

2. FIG. 2 is a cross-sectional view of the soldering jig 100 of this embodiment. The soldering jig 100 is a jig used when soldering the power element 10 or the like. As a heating method for the soldering, any of a heat transfer method using a heating plate or the like, a radiation method using infrared rays or the like, or a convection method in which heating is performed in a high-temperature atmosphere can be used. Of course, you may combine these suitably.

  As shown in FIG. 2, the soldering jig 100 includes a lower base 110, a temperature control member 111, a lid member 112, an upper base 120, and a height determining pin 130. . The lower substrate 110, the temperature control member 111, and the lid member 112 are lower portions on which the soldering target components are placed. The upper base material 120 is an upper part placed on the upper side of the soldering target component.

  The lower base material 110 is a first base material for supporting a component to be soldered. Further, it is also for supporting the temperature control member 111 and the lid member 112. A recess 115 is formed in the lower member 110. The thickness of the lower substrate 110 is 3 to 20 mm. Examples of the material of the lower base material 110 include a carbon material. In addition, it is preferable that the material is difficult to form an alloy together with the molten temperature control member 111. This is because the soldering jig 100 can be used repeatedly. Alternatively, a surface treatment may be performed on the lower substrate 110.

  The temperature control member 111 is disposed inside the recess 115 of the lower base material 110. The temperature control member 111 is located in a space between the lower base material 110 and the lid member 112. The material of the temperature control member 111 is a low melting point temperature control member having a melting point lower than the melting point of solder used for soldering. That is, the temperature control member 111 is in a solid state at room temperature (under atmospheric pressure) and in a liquid state at a soldering temperature (under atmospheric pressure). The volume in the solid state and the volume in the liquid state are almost the same. The temperature control member 111 may be present over most of the area occupied by the plate surface of the element lower electrode 30.

  The lid member 112 is for covering the temperature control member 111. Further, during soldering, the intermediate member is disposed between the temperature control member 111 and the element lower electrode 30 shown in FIG. The lid member 112 does not melt during soldering. That is, the melting point of the lid member 112 is higher than the soldering temperature. Therefore, the melting point of the lid member 112 is higher than the melting point of the temperature control member 111. The inner surface of the recess 115 of the lower substrate 110 and the outer surface of the lid member 112 located inside the recess 115 are joined. That is, the lid member 112 is fixed to the lower base material 110.

  The upper substrate 120 is a second substrate for pressing the element electrode 40 from above. As will be described later, the upper base member 120 serves as a weight for allowing the molten solder 70 to spread. An example of the material of the upper base 120 is a carbon material. The thickness of the upper substrate 120 is 3 to 20 mm. The height determining pin 130 is for aligning the height of the power module 1. Moreover, it is also for maintaining the parallelism of the surfaces 31 and 41 of the power module 1.

  As is clear from FIG. 2, the temperature control member 111 is a component of the soldering jig 100. However, it is not a component of the power module 1. That is, the temperature control member 111 does not remain in the power module 1 after manufacturing. Of course, the soldering jig 100 itself does not remain in the power module 1 after manufacturing.

3. Method for Manufacturing Power Module A method for manufacturing the power module 1 will be described. The method for manufacturing the power module 1 of this embodiment is characterized by using a soldering jig 100.

3-1. Element Lower Electrode Bonding Step First, each component such as the power element 10 is soldered to the element lower electrode 30 (element lower electrode bonding step). This element lower electrode bonding step is a first soldering step. In this step, it is not always necessary to use the soldering jig 100 described above.

  FIG. 3 is a cross-sectional view for explaining how each component is soldered to the lower electrode 30 of the element. As shown in FIG. 3, the solder 50 is placed on the lower electrode 30, and the power element 10 is placed on the solder 50. Then, the solder 60 is placed on the power element 10, and the block electrode 20 is placed on the solder 60. Further, the solder 70 is placed on the block electrode 20. At this stage, the solders 50, 60, 70 are not yet joined to the upper and lower members.

  Next, as shown in FIG. 3, the stacked members are heated to melt the solders 50, 60, and 70. For this heating, a heating method such as a heating plate may be used, or a heating method using a radiation method such as infrared rays may be used. Alternatively, a convection heating method such as exposure to a high temperature atmosphere may be used. Since the materials of the solders 50, 60, 70 are the same, the solders 50, 60, 70 begin to melt almost simultaneously.

  The melted solder 50 wets and spreads between the element lower electrode 30 and the power element 10. Similarly, the melted solder 60 wets and spreads between the power element 10 and the block electrode 20. Further, the solder 70 spreads wet on the block electrode 20. When the solder 50, 60, 70 is sufficiently melted, heating is stopped. And what laminated | stacked each member is cooled. This cooling may be performed by natural cooling. Other cooling methods may be used. By this cooling, the solder 50 and the solder 60 are solidified again. Thereby, the element lower electrode 30, the power element 10, and the block electrode 20 are soldered to form a solder joint. Note that the solder 70 of this solder joint has a convex shape from the bottom surface 71 to the top as shown in FIG.

3-2. On-Element Electrode Bonding Step Subsequently, the on-element electrode 40 is further soldered to the solder joint shown in FIG. 3 in which the respective parts are laminated and soldered (on-element electrode bonding step). In this step, a soldering jig 100 is used. Therefore, as shown in FIG. 4, the joined body of the element lower electrode 30, the power element 10, and the block electrode 20 shown in FIG. 3 is placed on the lid member 112.

  Here, as described above, the shape of the solder 70 is convex from the bottom surface 71 to the top. The lower end 131 of the height determining pin 130 is inserted into the pin hole 113 of the lower substrate 110. At this time, the height of the upper end 132 of the height determining pin 130 is slightly lower than the height of the top portion 72 of the solder 70 and slightly higher than the upper end of the block electrode 20, that is, the bottom surface 71.

  Next, the upper electrode 40 is placed on the top 72 of the solder 70. As shown in FIG. 4, since there are a plurality of solders 70, there is no problem in placing the element upper electrode 40. Then, the upper substrate 120 is placed on the element electrode 40. The upper substrate 120 serves as a weight. That is, when the solder 70 is melted, the molten solder 70 is sufficiently wet and spread.

  And these members are heated in the state of FIG. For this heating, a heat transfer type heating method using a heating plate or the like may be used, or a radiation type heating method using infrared rays or the like may be used. Further, a convection heating method such as exposure to a high temperature atmosphere in a heating furnace may be used.

  These heating operations are mainly performed via the lower base material 110 and the upper base material 120. When a heating plate is used, the two heating plates are brought into contact with the lower substrate 110 and the upper substrate 120, respectively. When infrared rays are used, the infrared rays are irradiated toward the lower base material 110 and the upper base material 120. When using a heating furnace, the high temperature atmosphere substantially heats the lower substrate 110 and the upper substrate 120. This is because each component for manufacturing the power module 1 is very thin as described above. Therefore, the high temperature atmosphere hardly heats each part from the side.

  When heating is continued in this manner, the temperature control member 111 is also heated together with the lower base material 110. Then, the temperature of the temperature control member 111 reaches the melting point. Therefore, the temperature control member 111 starts to melt. The subsequent heating is used for melting the temperature control member 111. That is, the temperature of the temperature control member 111 is kept at the melting point of the temperature control member 111 until the temperature control member 111 is completely melted after the temperature control member 111 starts to melt. Therefore, during that period, the temperature of the lid member 112 that is in contact with the lower substrate 110 is also equal to or lower than the melting point of the temperature control member 111. Of course, the temperature of the lower electrode 30 in contact with the lid member 112 is also the same.

  As described above, the melting point of the temperature control member 111 is lower than the melting point of the solder 50. The temperature of the element lower electrode 30 in contact with the solder 50 is lower than the melting point of the solder 50. For this reason, there is almost no possibility that the solder 50 will melt. The same applies to the solder 60.

  On the other hand, on the element upper electrode 40 side, the temperature of the element upper electrode 40 continues to rise while the temperature control member 111 is melted. For this reason, the temperature of the element upper electrode 40 exceeds the melting point of the solder 70. Then, the solder 70 in contact with the element upper electrode 40 starts to melt. Therefore, the solder 70 wets and spreads between the block electrode 20 and the element upper electrode 40. Since the solder 70 before melting has a shape with a convex portion on the upper side, air does not enter when melting and voids are unlikely to occur.

  When the solder 70 melts and spreads, as shown in FIG. 5, the upper electrode 40 descends accordingly. The element upper electrode 40 stops at the position where it comes into contact with the height determining pin 130. At this stage, the distance between the element upper electrode 40 and the element lower electrode 30 is determined. The parallelism between the element upper electrode 40 and the element lower electrode 30 is also determined. Due to the height determining pin 130, the distance and parallelism between the element upper electrode 40 and the element lower electrode 30 are good.

  After that, the power module 1 is manufactured by cooling the stacked members. The shape accuracy of the power module 1 is high. The soldering jig 100 can be used any number of times. This is because the temperature control member 111 becomes solid again after being cooled.

4). Comparison with Conventional Technology Here, a comparison between the semiconductor device manufacturing method of this embodiment and the conventional semiconductor device manufacturing method will be described with reference to FIG. FIG. 6 is a graph showing the time change of the temperature in the solder 50. The horizontal axis is time. The vertical axis represents the temperature of the solder 50.

  The solid line in FIG. 6 indicates the temperature of the solder 50 heated by the heating method of this embodiment. The broken line indicates the temperature of the solder 50 heated by the conventional heating method (double-sided heating). The two-dot chain line indicates the temperature of the solder 50 heated by the conventional heating method (heating only from the upper surface).

  In FIG. 6, heating is started at time t1. Accordingly, the temperature of the solder 50 is the same at a time before time t1. When heating is started at time t1, the temperature of the solder 50 rapidly rises in the case of this embodiment (solid line) and the double-sided heating (broken line) of the prior art. On the other hand, in the heating method only from the upper surface (two-dot chain line), the temperature rise of the solder 50 is slower than in the other two heating methods.

  Then, by continuing the heating, the temperature of the solder 50 reaches the melting point (T1) of the temperature control member 111. Here, in the heating method of this embodiment, the temperature of the solder 50 is constant at the temperature T1. Therefore, there is no possibility that the solder 50 reaches the melting point (T2) of the solder 50. That is, the solder 50 does not melt.

  In the conventional heating method by double-sided heating (broken line), the temperature exceeds the temperature T1 and reaches the melting point (T2) of the solder 50. Therefore, the solder 50 is melted. That is, the solder 50 once soldered is melted again. Furthermore, the temperature of the solder 50 increases. The same applies to the conventional heating method by single-sided heating (two-dot chain line). After that, the solder 50 is solidified again regardless of which heating method is used.

  As described above, in the conventional heating method by double-sided heating (broken line) and heating method by single-sided heating (two-dot chain line), the solder 50 that has already been soldered is melted again when the solder 70 is soldered. Therefore, in the power module 1 manufactured using the conventional heating method by double-sided heating (broken line) or the heating method by single-sided heating (two-dot chain line), the parallelism between the element lower electrode 30 and the element upper electrode 40 is low. In particular, when the solder 50 and the solder 60 are melted before the solder 70 is melted in the state of FIG. 4, the solder 50 and the solder 60 are crushed by the weight of the element upper electrode 40 and the upper substrate 120. As a result, the melted solder protrudes from under the power element 10 and the block electrode 20, resulting in solder joint failure. For this reason, the parallelism between the members is lost. On the other hand, in the power module manufacturing method using the soldering jig according to the present embodiment, the power module 1 in which the parallelism between the element lower electrode 30 and the element upper electrode 40 is high is manufactured.

5. In this embodiment, the temperature control member 111 is made of a material having a melting point lower than that of solder. However, the same melting point temperature control member having the same melting point as that of the solder may be used. For example, the same kind of solder as that used for soldering can be used. Even in that case, it is possible to prevent the already soldered solder from being overheated. That is, it is possible to prevent the generation of voids and the scattering of solder.

  Further, in the soldering jig 100, the part to be soldered is placed on the lid member 112. However, the lower substrate 110 may be turned upside down. In this case, the bottom where the recess 115 is formed in FIG. 2 is disposed between the temperature control member 111 and the component to be soldered. That is, in this case, the lower base material 110 itself is an intermediate member.

6). Summary As described above in detail, the soldering jig 100 according to the present embodiment has the temperature control member 111 having a melting point lower than the melting point of the solder inside the recess 115 of the lower substrate 110. is doing. Therefore, when the soldering is heated, the temperature of the solder that has already been soldered does not reach the melting point. That is, there is no possibility that the solder that has already been soldered will melt again. This realizes a soldering jig that does not cause the solder that has already been soldered to melt by heating during soldering.

  Further, in the method of manufacturing a semiconductor device according to this embodiment, it is possible to perform soldering of a plurality of layers without remelting the solder that has already been soldered. A power module having a high degree of parallelism between the element lower electrode 30 and the element upper electrode 40 can be manufactured. Further, a power module in which the power element 10 and the block electrode 20 are not inclined can be manufactured.

  Note that this embodiment is merely an example, and does not limit the present invention. Therefore, the present invention can naturally be improved and modified in various ways without departing from the gist thereof. For example, the present invention can be applied to the manufacture of semiconductor devices other than the power module. Of course, the present invention can also be applied to the manufacture of a single-side cooling type semiconductor device.

  Further, the soldering jig 100 of this embodiment can be applied not only to the manufacture of semiconductor devices. It does not depend on the product manufactured by soldering.

  Furthermore, the present invention is not limited to soldering but can be applied as long as heat treatment is performed. For example, it can be applied to resin molding by selecting a temperature control member having an appropriate melting point. In that case, the addition of Bi or In can lower the melting point. For example, SnBiIn (79 ° C.), SnIn (117 ° C.), SnBi (138 to 139 ° C.), SnBiAg (138 to 139 ° C.) can be used.

(Second Embodiment)
A second embodiment will be described. The power module manufacturing method according to the present embodiment is substantially the same as the power module manufacturing method of the first embodiment. The difference from the first embodiment is that a temperature control member 111 having a molten volume smaller than a solid volume is used.

1. Soldering jig 200 of this embodiment is substantially the same as the soldering jig 100 shown in FIG. 2, as shown in FIG. A different point is the material of the temperature control member 211 arranged between the lower base 110 and the lid member 112. The volume of the temperature control member 211 in the liquid is smaller than the volume in the solid state.

  The soldering jig 200 at the time of soldering will be described. As described above, the temperature control member 211 has a smaller volume in the liquid state than in the solid state. During heating in soldering, the temperature control member 211 is melted. That is, the temperature control member 211 is a low melting point temperature control member. Here, the temperature control member 211 is in a sealed state. On the other hand, the volume of the space formed between the lower base 110 and the lid member 112 does not change. Therefore, a space 212 in a decompressed state is realized in the space occupied by the temperature control member 211. In some cases, components of the temperature control member 211 are vaporized in the space 212. The lid member 112 is a high-rigidity member having a strength that does not deform even in such a reduced pressure state.

  Since the space 212 is in a reduced pressure state, the soldering jig 200 has a heat insulating effect during soldering. Therefore, the soldering jig 200 is more difficult to melt the solder 50 than the soldering jig 100 of the first embodiment.

  Thus, by using the soldering jig 200, the heating by the heating device can be strengthened. That is, the soldering time can be shortened. In that case, the temperature of the lower base material 110 and the upper base material 120 that are mainly heated from the heating device is higher. However, there is almost no possibility that the solder 50 melts due to the heat insulating effect of the temperature control member 211.

  That is, the heat transfer path for transferring heat from the lid member 112 to the element lower electrode 30 is connected until the temperature of the temperature control member 211 reaches the melting point of the temperature control member 211. However, when the temperature of the temperature control member 211 reaches the melting point and the temperature control member 211 starts to melt, the heat transfer path is gradually cut off. That is, the soldering jig 200 according to the present embodiment has a higher heat insulating effect than the soldering jig 100 of the first embodiment. Therefore, soldering can be performed with heating stronger than in the first embodiment. This is because the solder 50 does not have to be melted again. If heating is strong, the time required for temperature rise can be shortened. That is, the cycle time is short.

  Note that the temperature control members made of different materials are used in the first embodiment and the second embodiment. In practice, however, the volume usually changes when a solid phase transitions to a liquid. And for many substances, the volume in the solid state is larger than the volume in the liquid state. That is, for the convenience of explanation, only the first embodiment and the second embodiment are distinguished. The embodiment can be used properly depending on the melting point of the temperature control member to be employed and the volume ratio between the solid state and the liquid state.

2. Modification 2-1. Movable lid Here, the modification of this form is explained. In the soldering jig 200 of this embodiment, the lower base material 110 and the lid member 112 are fixed. Therefore, the space in which the temperature control member 211 is disposed is in a sealed state. However, the lid member may be movable. That is, the lower base material and the lid member are not fixed.

  In the soldering jig 300 shown in FIG. 8, the lower substrate 310 and the lid member 312 are movable with respect to each other. That is, the lower base material 310 and the lid member 312 are not fixed to each other. Therefore, when the temperature control member 211 is melted, the lid member 312 moves downward. That is, the lid member 312 moves so as to move away from the part to be soldered. Therefore, a gap is generated between the lid member 312 and the element lower electrode 30. Therefore, when the temperature of the temperature control member 211 reaches its melting point, the contact state between the element lower electrode 30 and the lid member 312 is released. That is, the heat conduction path from the lid member 312 to the element lower electrode 30 is almost blocked. Here, a contact portion between the lower substrate 310 and the element lower electrode 30 exists. However, the area is sufficiently small. Therefore, the amount of heat transferred from the contact point is sufficiently small.

2-2. Deformation lid Here, another modification of this form is explained. Instead of making the lid member 312 movable as described above, the lid member itself may be deformed. This is because the heat transfer path from the lid member to the element lower electrode 30 is almost blocked even in this case.

  In the soldering jig 400 shown in FIG. 9, a lid member 412 made of an elastically deformable material is used. The lower base material 410 and the lid member 412 are fixed to each other. An example of the material of the lid member 412 is aluminum. Also, other materials can be deformed if they are thin enough. If the temperature control member 211 is melted and a volume reduction occurs, the pressure in the space where the temperature control member 211 is disposed decreases. The lid member 412 is deformed by this decompression.

3. Summary As described above in detail, the soldering jig 200 according to the present embodiment has the temperature control member 211 having a melting point lower than the melting point of the solder inside the concave portion of the lower substrate 110. ing. The volume of the temperature control member 211 in the liquid state is smaller than the volume in the solid state. Therefore, the heat conduction from the lid member 112 to the element lower electrode 30 is almost eliminated by the start of melting of the temperature control member 211. Therefore, there is no possibility that the solder which has already been soldered will be melted again. This realizes a soldering jig that does not cause the solder that has already been soldered to melt by heating during soldering.

  Further, in the method of manufacturing a semiconductor device according to this embodiment, it is possible to perform soldering of a plurality of layers without remelting the solder that has already been soldered. A power module having a high degree of parallelism between the element lower electrode 30 and the element upper electrode 40 can be manufactured. Further, a power module in which the power element 10 and the block electrode 20 are not inclined can be manufactured.

  Note that this embodiment is merely an example, and does not limit the present invention. Therefore, the present invention can naturally be improved and modified in various ways without departing from the gist thereof. For example, the present invention can be applied to the manufacture of semiconductor devices other than the power module. The present invention can also be applied to the manufacture of a single-side cooling type semiconductor device.

  Also, the soldering jig 200 of this embodiment can be applied not only to the manufacture of semiconductor devices. It does not depend on the product manufactured by soldering.

  Furthermore, the present invention is not limited to soldering but can be applied as long as heat treatment is performed. For example, it can be applied to resin molding by selecting a temperature control member having an appropriate melting point. In that case, the addition of Bi or In can lower the melting point. For example, SnBiIn (79 ° C.), SnIn (117 ° C.), SnBi (138 to 139 ° C.), SnBiAg (138 to 139 ° C.) can be used.

(Third embodiment)
A third embodiment will be described. The semiconductor device manufacturing method according to this embodiment is substantially the same as the semiconductor device manufacturing method according to the first embodiment. This embodiment is different from the first embodiment in that the temperature control member is provided on both the lower base material and the upper base material.

1. Soldering jig 500 of this embodiment has a lower base 110 and an upper base 520 as shown in FIG. A temperature control member 111 is disposed in the recess of the lower substrate 110. The temperature control member 521 is also disposed in the concave portion of the upper base material 520. That is, the soldering jig 500 can be controlled by the temperature control member 111 when heated from the lower side, and is also heated by the temperature control member 521 when heated from the upper side. Temperature control can be performed.

  Here, the materials and melting points of the solder and temperature control members 111 and 521 are as shown in Table 1. The material of the solder is SnCu. The material of the temperature control member 111 is SnAgCu. The material of the temperature control member 521 is SnSb. The melting point of the temperature control member 111 is lower than the melting point of solder. That is, the temperature control member 111 is a low melting point temperature control member. The melting point of the temperature control member 521 is higher than the melting point of the solder. That is, the temperature control member 521 is a high melting point temperature control member.

[Table 1]
Material Melting point Solder About SnCu 227 ° C Temperature control member 111 SnAgCu 217-224 ° C
Temperature control member 521 SnSb 232-240 ° C

  Accordingly, the temperature control member 111 is melted in the same manner as in the first embodiment during soldering. The temperature control member 521 melts when the heating from the upper side, that is, the upper base material 520 side is strong. That is, when the temperature of the temperature control member 521 exceeds its melting point, the temperature control member 521 melts. Therefore, the temperature of the solder 70 is kept at a temperature equal to or lower than the melting point of the temperature control member 521.

  Thus, the temperature of the solder 70 at the time of soldering can be controlled. It is desirable that the maximum temperature of the solder during soldering is about 5 to 30 ° C. higher than the melting point of the solder. If it is within this temperature range, there is no risk of solder boiling. In other words, there is no risk of solder scattering or voids. Also, there is no risk that the solder will form a brittle alloy with the metal of the component. Therefore, a material having a melting point in the range of 5 to 30 ° C. higher than the melting point of the solder 70 may be used as the temperature control member 521.

  In this embodiment, not only the temperature control member 111 but also the temperature control member 521 is provided. Therefore, temperature control is performed not only for heating from below but also for heating from above. Therefore, even if heating is performed stronger than in the first embodiment, there is no possibility that the temperature of the solder 70 will rise too much. Therefore, generation of voids caused by overheating of the molten solder can be suppressed.

2. Power Module Manufacturing Method A power module manufacturing method using the soldering jig 500 of this embodiment is substantially the same as that of the first embodiment. In the power module manufacturing method of this embodiment, temperature control can be performed on both sides of heating by using the soldering jig 500. Therefore, suitable soldering can be performed even if heating is performed stronger than in the first embodiment. That is, the power module manufacturing method of the present embodiment can have a shorter cycle time than the power module manufacturing method of the first embodiment.

3. Modification In this embodiment, the temperature control member 111 having a melting point lower than the melting point of solder is disposed in the recess of the lower substrate 110, and the temperature control member 521 having a melting point higher than the melting point of solder is disposed in the recess of the upper substrate 520. It was decided to. However, a high melting point temperature control member having a melting point higher than the melting point of solder may be disposed on the lower substrate 110, and a low melting point temperature control member having a melting point lower than the melting point of solder may be disposed on the upper substrate 520.

  In this embodiment, the sealed temperature control member 111 is used as in the first embodiment. However, you may make it the structure which has the heat insulation effect as demonstrated in 2nd Embodiment. That is, the temperature control member 211 can be used. In that case, a fixed lid member 112 (FIG. 7), a movable lid member 312 (FIG. 8), and a deformable lid member 412 (FIG. 9) can be used.

4). Summary As described above in detail, the soldering jig 500 according to the present embodiment includes the temperature control member 111 on the lower base 110 and the temperature control member 521 on the upper base 520. Is. Therefore, the solder 70 can be soldered without melting the solder 50 that has already been soldered, and the solder 70 can be soldered under a suitable temperature condition. As a result, a soldering jig capable of performing suitable soldering is realized.

  Further, in the method of manufacturing a semiconductor device according to this embodiment, it is possible to perform soldering of a plurality of layers without remelting the solder that has already been soldered. A power module having a high degree of parallelism between the element lower electrode 30 and the element upper electrode 40 can be manufactured. Further, a power module in which the power element 10 and the block electrode 20 are not inclined can be manufactured.

  Note that this embodiment is merely an example, and does not limit the present invention. Therefore, the present invention can naturally be improved and modified in various ways without departing from the gist thereof. For example, the present invention can be applied to the manufacture of other semiconductor devices other than the power module. The present invention can also be applied to the manufacture of a single-side cooling type semiconductor device.

  The soldering jig 500 of this embodiment can be applied not only to the manufacture of semiconductor devices. It does not depend on the product manufactured by soldering.

  Furthermore, the present invention is not limited to soldering but can be applied as long as heat treatment is performed. For example, it can be applied to resin molding by selecting a temperature control member having an appropriate melting point. In that case, the addition of Bi or In can lower the melting point. For example, SnBiIn (79 ° C.), SnIn (117 ° C.), SnBi (138 to 139 ° C.), SnBiAg (138 to 139 ° C.) can be used.

(Fourth embodiment)
A fourth embodiment will be described. The power module 1 manufactured by the method for manufacturing a power module described from the first embodiment to the third embodiment is a double-sided cooling type semiconductor device. The power module manufactured by the semiconductor device manufacturing method of this embodiment is a single-sided cooling type semiconductor device.

1. Single-sided cooling power module FIG. 11 shows a power module 2 manufactured in this embodiment. The power module 2 is a single-sided cooling type semiconductor device. The power module 2 includes a power element 11, a substrate 80, and solder 90. The power element 11 is a semiconductor element such as an IGBT. The substrate 80 is an insulating substrate. Even a circuit board on which a circuit is formed can be applied. The power element 11 and the substrate 80 are joined by solder 90.

  The solder 90 is a joint for joining the power element 11 and the substrate 80. The power element 11 is soldered to the surface 81 of the substrate 80. A heat sink may be provided on the back surface 82. The joining may be performed by soldering or may be performed by brazing.

2. Soldering jig A soldering jig 600 of this embodiment is shown in FIG. FIG. 12 is a plan view of the soldering jig 600. As shown in FIG. 12, the soldering jig 600 includes a lower base material 610 and an upper base material 620.

  13 is a cross-sectional view showing the AA cross section of FIG. As shown in FIG. 13, the lower base 610 includes a temperature control member 611 and a lid member 612. The material of the temperature control member 611 is a material having a melting point lower than that of the solder 90. The lid member 612 is fixed to the lower base material 610.

3. Power Module Manufacturing Method The power module manufacturing method of the present embodiment is substantially the same as the power module manufacturing method of the first embodiment. The difference is the heat conduction path during soldering. Therefore, the heat conduction path during soldering will be described.

  At the time of soldering, the lower base material 610 and the upper base material 620 are mainly heated. The lid member 612 of the lower base 610 is in contact with the lower surface 82 of the substrate 80. The upper base material 620 is in contact with the upper surface 81 of the substrate 80. Therefore, the substrate 80 is heated from the upper surface 81 and the lower surface 82 thereof.

  Here, the lower surface 82 of the substrate 80 is at a temperature lower than the melting point of the solder 90. This is because the temperature is controlled by the presence of the temperature control member 611. On the other hand, the upper surface 81 of the substrate 80 can have a temperature exceeding the melting point of the solder 90. The heat on the upper surface 81 side of the substrate 80 hardly escapes to the lower surface 82 side of the substrate 80. This is because the temperature on the lower surface 82 side of the substrate 80 reaches a temperature close to the temperature on the upper surface 81 side of the substrate 80, although it does not reach the melting point of the solder 90.

  If the heating is continued, the temperature of the solder 90 eventually reaches the melting point. Therefore, the solder 90 is melted. At that time, the temperature on the lower surface 82 side of the substrate 80 is lower than the temperature of the solder 90. Therefore, the heat of the solder 90 is slightly transmitted to the temperature control member 611. Therefore, there is no possibility that the temperature of the solder 90 becomes too high. In other words, there is no risk of solder scattering or voids. As a result, the solder 90 can be suitably soldered without becoming too hot.

4). Modified example 4-1. Lid member In this embodiment, the sealed temperature control member 111 is used as in the first embodiment. However, you may make it the structure which has the heat insulation effect as demonstrated in 2nd Embodiment. That is, the temperature control member 211 can be used. In that case, a fixed lid member 112 (FIG. 7), a movable lid member 312 (FIG. 8), and a deformable lid member 412 (FIG. 9) can be used.

4-2. Temperature control member on top (Part 1)
In this embodiment, the temperature control member 611 is provided on the lower base 610. However, as shown in FIG. 14, a temperature control member may be provided above the power element 11. A soldering jig 700 shown in FIG. 14 includes a lower base 710, an upper base 720, and an element upper member 730. A temperature control member 731 and a lid member 732 are provided in the concave portion of the element upper member 730.

  At the time of soldering, the element upper member 730 is at a temperature lower than the melting point of the solder 90. This is because there is a temperature control member 731. At the time of soldering, the power element 11 can reach a temperature close to the melting point of the solder 90. This is because it is in contact with the solder 90. However, the presence of the element upper member 730 does not cause the temperature of the power element 11 to rise excessively. Moreover, there is almost no possibility that the temperature of the solder 90 will rise too much. This is because the heat of the solder 90 can escape to the element upper member 730 via the power element 11.

4-3. Temperature control member on top (Part 2)
Further, as shown in FIG. 15, a temperature control member 831 may be provided on the upper base material 820 itself. As shown in FIG. 15, the soldering jig 800 has a lower base material 810 and an upper base material 820. The upper base member 820 is provided with a temperature control member 831 and a lid member 832.

  A case where soldering is performed using the soldering jig 800 will be described. When the soldering jig 800 is used, the temperature of the upper surface 81 of the substrate 80 is held at a temperature lower than the melting point of the solder 90, contrary to this embodiment. In addition, the temperature of the lower surface 82 of the substrate 80 can be higher than the melting point of the solder 90.

  Thus, heat is applied to the solder 90 from both the upper surface 81 and the lower surface 82 of the substrate 80. The solder 90 reaches the melting point of the solder 90 by heating from the lower surface 82 of the substrate 80. As a result, the solder 90 is melted. Then, the solder 90 spreads out and resolidifies by cooling. In this way, soldering is performed.

4-4. Others As described in the third embodiment, temperature control members may be disposed on both the lower base material 610 and the upper base material 620. In that case, a temperature control member disposed on the upper base material 620 side may be higher than the melting point of the solder 90.

5. Summary As described above in detail, the soldering jig 600 according to the present embodiment can be used for manufacturing a single-side cooling type semiconductor device. The soldering jig 600 includes a temperature control member 611 in a concave portion of the lower base 610. Therefore, a soldering jig 600 capable of suitably performing soldering is realized.

  Further, in the method of manufacturing a semiconductor device according to this embodiment, it is possible to perform soldering of a plurality of layers without remelting the solder that has already been soldered. And a power module with high shape accuracy can be manufactured. Further, a power module that is not inclined such as the power element 11 can be manufactured.

  Note that this embodiment is merely an example, and does not limit the present invention. Therefore, the present invention can naturally be improved and modified in various ways without departing from the gist thereof. For example, the present invention can be applied to the manufacture of other semiconductor devices other than the power module.

  The soldering jig 600 of this embodiment can be applied not only to the manufacture of semiconductor devices. It does not depend on the product manufactured by soldering.

  Furthermore, the present invention is not limited to soldering but can be applied as long as heat treatment is performed. For example, it can be applied to resin molding by selecting a temperature control member having an appropriate melting point. In that case, the addition of Bi or In can lower the melting point. For example, SnBiIn (79 ° C.), SnIn (117 ° C.), SnBi (138 to 139 ° C.), SnBiAg (138 to 139 ° C.) can be used.

(Fifth embodiment)
A fifth embodiment will be described. The power module manufactured in this embodiment is the same as the power module 2 manufactured in the fourth embodiment. That is, it is a single-sided cooling type semiconductor device. The difference of this embodiment from the first embodiment to the fourth embodiment is the material of the temperature control member. The temperature control member of this embodiment is liquid at room temperature under atmospheric pressure and gas at soldering temperature under atmospheric pressure. Alternatively, it may be a solid at room temperature or a substance that is a gas at a temperature near the melting point of the solder.

1. Soldering jig A cross-sectional view of a soldering jig 900 of this embodiment is shown in FIG. The soldering jig 900 includes a lower base material 910, an upper base material 920, and a chamber 950. The lower base material 910 includes a temperature control member 911 and a lid member 912. Further, a through hole 913 is provided in the lower base material 910.

  The chamber 950 is a case for confining gas. The temperature control member 911 is a liquid having a boiling point close to the melting point of the solder 90. Here, it is assumed that the soldering temperature is 170 to 200 ° C. Then, salicylaldehyde (boiling point: 195 ° C.) or benzaldehyde (boiling point: 179 ° C.) can be used as the temperature control member 911. In addition, perillaldehyde (boiling point: 237 ° C.) or cinnamaldehyde (boiling point: 251 ° C.) may be used. These melting points are in the range of −30 to 30 ° C., which is the highest temperature of the soldering temperature. These are substances that exhibit reducing properties when they are gases. The through-hole 913 is a through-hole penetrating from a place where the temperature control member 911 is located to a place where a part to be soldered is located.

  As described in the first to fourth embodiments, the temperature control member 911 of this embodiment performs solder temperature control. The temperature control member 911 of this embodiment can further cause an oxidation-reduction reaction on the surface of each component. That is, the oxide film formed on the surface of each component can be removed by soldering.

2. Modification 2-1. Temperature control member on top (Part 1)
In this embodiment, the temperature control member 911 is provided on the lower base material 910. However, a temperature control member may be provided above the power element 11. A soldering jig 1000 shown in FIG. 17 has a lower base material 1010, an upper base material 1020, and an element upper member 1030. A temperature control member 1031 and a lid member 1032 are disposed in the recess of the element upper member 1030. A through hole 1033 is formed in the lid member 1032. The through hole 1033 is for allowing the vaporized reducing gas to flow into the chamber 1050. Even in this case, the temperature of the solder 90 can be controlled. Moreover, the oxide film on the surface of each part can be removed.

2-2. Temperature control member on top (Part 2)
Further, a soldering jig 1100 as shown in FIG. 18 may be used. The soldering jig 1100 has a lower base material 1010, an upper base material 1120, and a chamber 1050. A temperature control member 1121 and a lid member 1122 are disposed in the recess of the upper base material 1120. A through hole 1123 is formed in the lid member 1122. The through hole 1123 is for allowing the vaporized reducing gas to flow into the chamber 1050. Even in this case, the temperature of the solder 90 can be controlled. Moreover, the oxide film on the surface of each part can be removed.

2-3. Others As described in the third embodiment, temperature control members may be disposed on both the lower base material and the upper base material. In that case, it is preferable to use a temperature control member disposed on the upper substrate side that is higher than the melting point of the solder 90.

3. Summary As described above in detail, the soldering jig 900 according to the present embodiment uses the temperature control member 911 having a boiling point near the melting point of the solder. Therefore, there is almost no risk of solder overheating. The vaporized temperature control member is reducible. Therefore, the oxide film on each part can be removed. That is, it is not necessary to supply the reducing gas separately. Thus, a soldering jig 900 that can be suitably soldered is realized.

  Further, in the method of manufacturing a semiconductor device according to this embodiment, it is possible to perform soldering of a plurality of layers without remelting the solder that has already been soldered. And a power module with high shape accuracy can be manufactured. Further, a power module that is not inclined such as the power element 11 can be manufactured. In addition, the method for manufacturing a semiconductor device of this embodiment has a higher heat insulation effect than the method for manufacturing a semiconductor device described in the first to second embodiments. This is because the thermal conductivity of gas is lower than that of liquid.

  Note that this embodiment is merely an example, and does not limit the present invention. Therefore, the present invention can naturally be improved and modified in various ways without departing from the gist thereof. For example, the present invention can be applied to the manufacture of other semiconductor devices other than the power module.

  The soldering jig 900 of this embodiment can be applied not only to the manufacture of semiconductor devices. It does not depend on the product manufactured by soldering.

  Furthermore, the present invention is not limited to soldering but can be applied as long as heat treatment is performed. For example, it can be applied to resin molding by selecting a temperature control member having an appropriate melting point. In that case, the addition of Bi or In can lower the melting point. For example, SnBiIn (79 ° C.), SnIn (117 ° C.), SnBi (138 to 139 ° C.), SnBiAg (138 to 139 ° C.) can be used.

DESCRIPTION OF SYMBOLS 1, 2 ... Power module 10, 11 ... Power element 20 ... Block electrode 30 ... Element lower electrode 40 ... Element upper electrode 50, 60, 70, 90 ... Solder 80 ... Substrate 81 ... Upper surface 82 ... Lower surface 100, 200, 300, 400, 500, 600, 700, 800, 900, 1000, 1100 ... soldering jigs 110, 310, 410, 610, 710 ... lower base materials 111, 211, 521, 611, 731, 831 ... temperature control members 112, 312, 412, 522, 612, 732, 832... Lid member 120, 520, 620, 720, 820... Upper substrate 130 .. height determining pin 630.

Claims (18)

A lower side for mounting the parts to be soldered;
A soldering jig having an upper portion placed on an upper side of the soldering target component,
At least one of the lower part and the upper part is
A temperature control member that melts at a predetermined temperature;
A soldering jig comprising a member having a melting point higher than the melting point of the temperature control member, and an intermediate member disposed between the temperature control member and the part to be soldered . The soldering jig according to claim 1,
The temperature control member is:
A soldering jig characterized by being a same melting point temperature control member having the same melting point as that of solder used for soldering. The soldering jig according to claim 1,
The temperature control member is:
A soldering jig characterized by being a low melting point temperature control member having a melting point lower than that of solder used for soldering. The soldering jig according to claim 1,
A first temperature control member disposed on one of the lower portion and the upper portion;
A second temperature control member disposed on the other of the lower side and the upper side;
The first temperature control member is:
A low melting point temperature control member that has a melting point lower than the melting point of the solder used for soldering,
The second temperature control member is:
A soldering jig characterized by being a high melting point temperature control member having a melting point higher than that of solder used for soldering. A soldering jig according to any one of claims 1 to 4, wherein
The temperature control member is:
The material after melting is smaller than the volume before melting,
The intermediate member is
A soldering jig, which is a high-rigidity member fixed to the base of the lower side or the upper side. A soldering jig according to any one of claims 1 to 4, wherein
The temperature control member is:
The material after melting is smaller than the volume before melting,
The intermediate member is
A soldering jig characterized by being made of a material that is fixed to the base material of the lower part or the upper part and elastically deforms by melting of the temperature control member. A soldering jig according to any one of claims 1 to 4, wherein
The temperature control member is:
The material after melting is smaller than the volume before melting,
The intermediate member is
While not being fixed to the base of the lower part or the upper part,
A soldering jig characterized by being movable in a direction away from the soldering target component. A soldering jig according to any one of claims 1 to 7,
As the temperature control member,
A soldering jig comprising a material that vaporizes at a predetermined temperature instead of a material that melts at a predetermined temperature. The soldering jig according to claim 8,
The temperature control member is:
It becomes a reducing gas with reducing properties in a vaporized state,
A soldering jig, wherein a through-hole extending from a place where the temperature control member is disposed to a place where the soldering target component is placed is formed. A method for manufacturing a semiconductor device, comprising: a first soldering step of soldering a semiconductor element to a first base material to form a first solder joint,
In the first soldering step,
A temperature control member that melts at a predetermined temperature; a member having a melting point that is higher than the melting point of the temperature control member; and an intermediate member disposed between the temperature control member and the first base material; Using a first soldering jig having
Disposing the first base material such that an intermediate member is located between the temperature control member and the first base material;
A method of manufacturing a semiconductor device, wherein heating and soldering are performed in that state. A first soldering step of soldering a semiconductor element to a first base material to form a first solder joint;
A second soldering step of soldering a second base material to the first solder joint to form a double-sided cooling type semiconductor device,
In the second soldering step,
At least one of the first substrate side and the second substrate side is a temperature control member that melts at a predetermined temperature, and a member made of a material having a melting point higher than the melting point of the temperature control member. And using a second soldering jig having an intermediate member disposed between at least one of the first base material and the second base material and the temperature control member,
Disposing the first base material or the second base material so that an intermediate member is positioned between at least one of the first base material and the second base material and the temperature control member;
A method of manufacturing a semiconductor device, wherein heating and soldering are performed in that state. A method of manufacturing a semiconductor device according to claim 10 or claim 11,
In at least one of the first soldering step and the second soldering step,
As the temperature control member,
A method of manufacturing a semiconductor device, characterized by using a same melting point temperature control member having the same melting point as that of solder used for soldering. A method of manufacturing a semiconductor device according to claim 10 or claim 11,
In at least one of the first soldering step and the second soldering step,
As the temperature control member,
A method of manufacturing a semiconductor device, comprising using a low melting point temperature control member having a melting point lower than that of solder used for soldering. A method for manufacturing a semiconductor device according to claim 11, comprising:
The second soldering jig is:
On one side of the first substrate side and the second substrate side,
A low melting point temperature control member having a melting point lower than the melting point of solder used for soldering is provided.
On the other side of the first substrate side and the second substrate side,
A method of manufacturing a semiconductor device, comprising: a high melting point temperature control member having a melting point higher than that of solder used for soldering. A method for manufacturing a semiconductor device according to any one of claims 10 to 14,
As the temperature control member other than the high melting point temperature control member,
Use a material whose volume after melting is smaller than the volume before melting.
As the intermediate member,
A method for manufacturing a semiconductor device, comprising using a jig including a high-rigidity member fixed to at least one of the first base material and the second base material. A method for manufacturing a semiconductor device according to any one of claims 10 to 14,
As the temperature control member other than the high melting point temperature control member,
Use a material whose volume after melting is smaller than the volume before melting.
As the intermediate member,
A semiconductor device characterized by using a jig that is fixed to at least one of the first base material and the second base material and has a material that is elastically deformed by melting of the temperature control member. Manufacturing method. A method for manufacturing a semiconductor device according to any one of claims 10 to 14,
As the temperature control member other than the high melting point temperature control member,
Use a material whose volume after melting is smaller than the volume before melting.
As the intermediate member,
A method of manufacturing a semiconductor device, comprising using a jig that is movable in a direction away from the part to be soldered. A method of manufacturing a semiconductor device according to any one of claims 10 to 17,
As the temperature control member other than the high melting point temperature control member,
A method of manufacturing a semiconductor device, wherein a material that is vaporized at a predetermined temperature is used instead of a material that melts at a predetermined temperature, and that the vaporized gas has reducibility.

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