JP2012028681A - Bonding body of electrode member and bonding method of electrode member - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a bonding body of an electrode member which ensures bonding of stabilized quality, and to provide a bonding method of an electrode member.SOLUTION: A bonding body 101 of an electrode member is a body which bonds the electrode member, i.e. a lead 10, to a semiconductor element 3 by means of solder. The lead 10 has a first protrusion 11a and a second protrusion 12a where the respective ends 11ac and 12ac face each other across a gap g10. The first protrusion 11a and the second protrusion 12a are arranged to face the semiconductor element 3, and bonded to the semiconductor element 3 by means of solder supplied from the gap g10.

Description

  The present invention relates to a joined body of electrode members and a joining method thereof.

  As a joined body of electrode members using a conventional solder, for example, in Patent Document 1, a C-surface heat radiation plate electrode and a conductor block are joined to one side surface and the opposite side surface of a semiconductor element via a solder layer. Describes a semiconductor device in which an E-plane heat dissipation plate electrode is bonded to a surface on the opposite side of the semiconductor element via a solder layer. In this semiconductor device, a solder injection hole penetrating the E surface heat sink electrode is formed. When the E-surface heat sink electrode and the conductor block are connected, the E-surface heat sink electrode is arranged in parallel with the C-surface heat sink electrode with the solder injection hole facing the conductor block and a predetermined distance from the conductor block. Is done. Further, solder is supplied from the solder injection hole between the E-surface heat radiation plate electrode and the conductor block, and then the supplied solder is cured to form a solder layer, and the E-surface heat radiation plate electrode and the conductor block form the solder layer. Connected through.

JP 2004-303869 A

  However, in the semiconductor device of Patent Document 1, the solder layer formed between the E-surface heat radiation plate electrode and the conductor block can be confirmed only from above the solder injection hole and from the side of the semiconductor device. For this reason, in the back surface of the E surface heat sink electrode on the conductor block side, even if a gap is generated between the E surface heat sink electrode and the solder layer around the solder injection hole, it cannot be confirmed. Therefore, even when the space between the E-surface heat radiation plate electrode and the conductor block is not sufficiently filled with solder, it cannot be confirmed, and the bonding area between the E-surface heat radiation plate electrode and the solder layer is insufficient due to insufficient filling. Therefore, there is a problem that the bonding strength of the E-plane heat sink electrode is insufficient in the completed semiconductor device. That is, the semiconductor device of Patent Document 1 has a problem that it is not possible to ensure stable quality bonding that can ensure the bonding strength of the E-plane heat dissipation plate electrode.

  The present invention has been made to solve such problems, and an object of the present invention is to provide a joined body of electrode members and a joining method of electrode members that enable stable quality joining.

  An electrode member assembly according to the present invention is an electrode member assembly in which an electrode member is bonded to a member to be bonded by solder, and the electrode member includes first protrusions facing each other across a gap, and The first protrusion and the second protrusion are arranged by facing the member to be bonded, and the first protrusion and the second protrusion and the member to be bonded are provided by the solder supplied from the gap. Be joined.

Moreover, the edge part of a 1st protrusion part and the edge part of a 2nd protrusion part may be depressed.
Moreover, the 1st protrusion part and the 2nd protrusion part may become thin as it approaches the front-end | tip.
The electrode member includes a connection portion, a first arm portion and a second arm portion extending from the connection portion, the first arm portion includes a first protrusion, and the second arm portion includes a second arm portion. You may have a protrusion part.

  The electrode member joining method according to the present invention is a method for joining an electrode member to a member to be joined by soldering, and includes a first projecting portion and a second projecting end portion facing each other across a gap. A step of disposing an electrode member having a projecting portion with the first projecting portion and the second projecting portion facing the member to be joined; and a first projecting portion between the first projecting portion, the second projecting portion, and the member to be joined. Dropping solder into the gap in order to supply solder for joining the part and the second projecting part and the member to be joined.

  According to this invention, the joined body of the electrode member and the joining method of the electrode member can enable stable quality joining.

It is a schematic plan view which shows the structure of the assembly of the electrode member which concerns on Embodiment 1 of this invention. It is a schematic cross section along the II-II line of FIG. It is a schematic plan view which shows the structure of the assembly of the electrode member which concerns on Embodiment 2 of this invention. It is a schematic plan view which shows the structure of the joined body of the electrode member which concerns on Embodiment 3 of this invention.

Embodiments of the present invention will be described below with reference to the accompanying drawings.
Embodiment 1 FIG.
The configuration of the electrode member assembly 101 according to the embodiment of the present invention will be described with reference to FIGS. In the present embodiment, a joined body in which an electrode member is soldered on a semiconductor element soldered on a substrate will be described.

FIG. 1 is a schematic plan view showing the configuration of the joined body 101 of electrode members, and FIG. 2 is a schematic cross-sectional view taken along the line II-II in FIG.
The bonded body 101 includes a substrate 4, a semiconductor element 3 as a bonding target member to be soldered to the substrate 4 via the second solder layer 2, and a gap t 1 between the semiconductor element 3 and the semiconductor element 3. And the lead 10 arranged in the same manner.
As shown in FIG. 1, the lead 10 includes a rectangular plate-like connection portion 13, and a first arm portion 11 and a second arm portion 12 each having a rectangular plate shape extending in parallel with each other.
The first arm portion 11 includes a rectangular plate-shaped main body portion 11b extending from one of the long side surfaces of the connecting portion 13 toward a direction (front direction A) substantially orthogonal to the long side direction of the connecting portion 13, It consists of a rectangular plate-like first protrusion 11a that protrudes in the direction (right direction D) from one of the long side surfaces of the main body 11b to the second arm 12, and is formed in a T shape in this embodiment. ing. The second arm portion 12 has a rectangular plate-like main body portion 12b extending in parallel with the main body portion 11b of the first arm portion 11, and a direction (left) from one of the long side surfaces of the main body portion 12b toward the first arm portion 11. In this embodiment, it is formed in a T-shape like the first arm portion 11.
Here, the 1st projection part 11a and the 2nd projection part 12a comprise the 1st protrusion part and the 2nd protrusion part, respectively.

The first projecting portion 11a and the second projecting portion 12a project so that the end portions 11ac and 12ac face each other, and a gap g10 having a rectangular groove shape is formed between the end portions 11ac and 12ac. ing.
The lead 10 configured as described above includes the end 11ac of the first protrusion 11a, the end 12ac of the second protrusion 12a, the ends 11ac of the first protrusion 11a, and the ends of the second protrusion 12a. The gap g10 between the portions 12ac is disposed so as to be located above the semiconductor element 3 and is bonded to the semiconductor element 3 via the first solder layer 1.

Here, a method for forming the first solder layer 1 will be described.
As shown in FIG. 2, the first solder layer 1 has a gap g10 between the end 11ac of the first protrusion 11a and the end 12ac of the second protrusion 12a of the lead 10 disposed above the semiconductor element 3. To the gap t1 by supplying non-solid solder such as paste. For example, the supply of solder is performed by dropping and supplying paste-like solder into the gap g10 by the syringe filling device 100 disposed above the gap g10.

  When the solder is dropped and supplied to the gap g10, the supplied solder falls on the upper surface 3a of the semiconductor element 3, and further, the solder is dropped and supplied one after another, so that the first protrusion 11a is formed in the gap t1. It accumulates upward toward the lower surface 11ab and the lower surface 12ab of the second protrusion 12a and flows laterally so as to spread on the upper surface 3a of the semiconductor element 3. Then, the solder wets the upper surface 3a of the semiconductor element 3 and the lower surface 11ab of the first protrusion 11a and the lower surface 12ab of the second protrusion 12a of the lead 10 while the main body 11b and the second arm of the first arm 11 are wetted. 12 widens toward the main body 12b and fills the gap t1. After the supply of the solder is completed, the solder is cooled and solidified to form the first solder layer 1. The first solder layer 1 includes the lower surface 11ab of the first protrusion 11a, the lower surface 12ab of the second protrusion 12a, and the semiconductor element. 3 is joined to the upper surface 3a. Thereby, the first protrusion 11 a and the second protrusion 12 a are joined to the semiconductor element 3 via the first solder layer 1.

The first solder layer 1 is formed as described above, and the joined body 101 of electrode members is formed.
The joined body 101 configured as described above has the following effects.
In the state where the solder is deposited to the vicinity of the lower surface 11ab of the first projecting portion 11a and the lower surface 12ab of the second projecting portion 12a, the solder between the gaps g10 becomes the end portion 11ac and the end portion 11ac of the first projecting portion 11a. It can flow outside the gap g10 along the end 12ac of the second protrusion 12a. For this reason, it is reduced that the solder stays in the gap g10 and accumulates unevenly, and the generation of voids between the lower surface 11ab of the first protrusion 11a and the lower surface 12ab of the second protrusion 12a and the solder is reduced. To do.

  Moreover, since the 1st projection part 11a and the 2nd projection part 12a are isolate | separated by the gap | interval g10, after formation of the 1st solder layer 1, the edge part 11ac of the 1st projection part 11a, the side part 11ad, and the side part 11ae ( From FIG. 1), it can be confirmed whether a gap is formed between the first solder layer 1 and the lower surface 11ab of the first protrusion 11a. Similarly, a gap is formed between the first solder layer 1 and the lower surface 12ab of the second protrusion 12a from the end 12ac, the side 12ad, and the side 12ae (see FIG. 1) in the second protrusion 12a. You can check if it is not. And when there is a gap, the gap is filled by injecting solder, and the first protrusion 11a and the second protrusion 12a are respectively connected to the end 11ac, the side 11ad and the side with respect to the first solder layer 1. The part 11ae and the end part 12ac, the side part 12ad, and the side part 12ae are joined without having a gap, and a required joining area can be secured.

Since the first projecting portion 11a and the second projecting portion 12a are arranged to face each other with the gap g10 therebetween, after the first solder layer 1 is formed, the first projecting portion 11a and the second projecting portion 12a are arranged around the first projecting portion 11a and the second projecting portion 12a. It becomes easy to confirm the presence or absence of a gap between the first and second protrusions 11a and 12a and the first solder layer 1, and when there is a gap, it is easy to fill the gap with solder. Therefore, it is possible to secure a bonding area between the first and second protrusions 11a and 12a and the first solder layer 1.
Therefore, the joined body 101 of electrode members enables stable quality joining.

  In addition, the lead 10 includes a connecting portion 13, a first arm portion 11 and a second arm portion 12 extending from the connecting portion 13, and the first arm portion 11 includes a first projecting portion 11 a and a second arm portion 11. The arm part 12 has the 2nd protrusion part 12a. By joining two first arm portions 11 and second arm portions 12 protruding from one connection portion 13 to one semiconductor element 3, the first arm portion 11 and the second arm portion 12 constitute a spring structure. The stress acting on the joint portion to the semiconductor element 3 can be reduced. Therefore, it becomes possible to improve the durability of the joined member 101 of the electrode member.

  Further, when soldering the lead 10 to the semiconductor element 3, in order to form the first solder layer 1 at a desired position between the lead 10 and the semiconductor element 3, the solder is simply dropped between the gaps g <b> 10. Therefore, it is easy to set the solder supply position. Furthermore, even if solder is supplied from above the position shifted from the center of the gap g10 toward the end 11ac of the first protrusion 11a or the end 12ac of the second protrusion 12a, the end of the first protrusion 11a Since it is bounced by the portion 11ac or the end 12ac of the second protrusion 12a and dropped onto the semiconductor element 3 immediately below the center of the gap g10, even if the solder is dropped from above the position shifted from the center of the gap g10. The first solder layer 1 can be formed at an appropriate position and within an appropriate range.

Embodiment 2. FIG.
In the electrode member assembly 102 according to the second embodiment of the present invention, the end portion 11ac of the first protrusion portion 11a and the end portion 12ac of the second protrusion portion 12a of the lead 10 of the first embodiment are recessed. It is a thing.
In the following embodiments, the same reference numerals as those in the previous drawings are the same or similar components, and thus detailed description thereof is omitted.

  Referring to FIG. 3, in the lead 20 of the electrode member assembly 102, the first protrusion portion 21 a of the first arm portion 21 extending from the connection portion 23 has an end portion 21 ac facing the main body portion 21 b of the first arm portion 21. Is recessed in a semi-cylindrical shape. Similarly, the second projecting portion 22 a of the second arm portion 22 extending from the connecting portion 23 has an end 22 ac that is recessed in a semi-cylindrical shape toward the main body portion 22 b of the second arm portion 22. Furthermore, the end 21ac of the first protrusion 21a and the end 22ac of the second protrusion 22a face each other, and a gap g20 having a substantially columnar shape is formed therebetween. The gap g20 is opened at an open end g20b on the connection portion 23 side and an open end g20a located on the opposite side of the open end g20b and the center of the gap g20.

At this time, when the lead 20 is soldered to the semiconductor element 3, the solder dropped and supplied to the gap g20 in the state where the solder is deposited to the vicinity of the lower surfaces of the first protrusion 11a and the second protrusion 12a is the center of the gap g20. Since it is possible to suppress the outflow from the open ends g20a and g20b having a narrower width than the vicinity to the outside of the gap g20, even if the solder is dropped at a position shifted from the center of the gap g20, the open end g20a or the open end g20b The entire gap g20 spreads out without flowing out.
The other configuration of the electrode member assembly 102 according to the second embodiment of the present invention is the same as that of the first embodiment, and a description thereof will be omitted.

Thus, in the electrode member assembly 102 according to the second embodiment, the same effect as the electrode member assembly 101 of the first embodiment can be obtained.
The first protrusion 21a has a recessed end 21ac, the second protrusion 22a has a recessed end 22ac, and the first protrusion 21a has an end 21ac and a second protrusion 22a. The end portions 22ac face each other to form a gap g20. As a result, the solder supplied to the gap g20 is prevented from flowing out from the open ends g20a and g20b at both ends of the gap g20, and the first solder layer 1 is formed by the first protrusion 21a and the second protrusion 22a. Since it is formed in a shape in which the outward expansion is suppressed, the amount of solder used is reduced, and the cost can be reduced.

Embodiment 3 FIG.
In the electrode member assembly 103 according to the third embodiment of the present invention, the end portion 11ac of the first protrusion portion 11a and the end portion 12ac of the second protrusion portion 12a of the lead 10 of the first embodiment approach the tip. Accordingly, the shape becomes thinner.

Referring to FIG. 4, in the lead 30 of the electrode member assembly 103, the first protrusion 31 a of the first arm portion 31 extending from the connection portion 33 has an end portion 31 ac that decreases in width toward the second arm portion 32. Become. That is, the end portion 31ac is formed by a flat flat portion 31ac1 and tapered portions 31ac2 and 31ac3 extending in a tapered shape from both sides of the flat portion 31ac1. Similarly, the width of the second protrusion 32 a of the second arm portion 32 extending from the connection portion 33 decreases toward the first arm portion 31 at the end portion 32 ac. That is, the end portion 32ac is formed by the flat portion 32ac1 and the tapered portions 32ac2 and 32ac3 on both sides of the flat portion 31ac1.
Further, the flat portion 31ac1 of the first protrusion 31a and the flat portion 32ac1 of the second protrusion 32a face each other, and form a rectangular groove-like gap g30 having both ends opened therebetween.

At this time, the end portion 31ac of the first protrusion portion 31a and the end portion 32ac of the second protrusion portion 32a are respectively tapered by the taper portions 31ac2 and 31ac3 and the taper portions 32ac2 and 32ac3 in a direction away from the gap g30. It has a shape. For this reason, when soldering the lead 30 to the semiconductor element 3, the solder supplied from above tends to flow into the lower side of the first protrusion 31 a and the second protrusion 32 a, and the first protrusion 31 a and the second protrusion 32 a. The space between the protrusion 32a and the semiconductor element 3 is efficiently filled. Further, the first solder layer 1 is formed from the first solder layer of the first embodiment in a shape in which the first protrusion 31a and the second protrusion 32a toward the connecting portion 33 and the opposite direction are prevented from spreading. Is done.
The other configuration of the electrode member assembly 103 according to the third embodiment of the present invention is the same as that of the first embodiment, and a description thereof will be omitted.

Thus, in the electrode member assembly 103 according to the third embodiment, the same effects as those of the electrode member assembly 101 according to the first embodiment can be obtained.
Further, the first protrusion 31a has an end 31ac that becomes thinner as it approaches the tip, and the second protrusion 32a has an end 32ac that becomes thinner as it approaches the tip. The end portion 31ac and the end portion 32ac of the second protrusion 32a face each other to form a gap g30. At this time, the end portion 31ac of the first projection portion 31a and the end portion 32ac of the second projection portion 32a have a shape that expands in a direction away from the gap g30, and are below the first projection portion 31a and the second projection portion 32a. Since the solder supplied to the gap g30 tends to flow into the side, the space between the first protrusion 31a and the second protrusion 32a and the semiconductor element 3 can be efficiently filled with solder. Therefore, the joined body 103 of the electrode member enables joining with stable quality.

In addition, embodiment is not limited to the above, For example, you may actualize as follows.
In the first to third embodiments, after the leads 10, 20, and 30 are soldered to the semiconductor element 3, the connecting portions 13, 23, and 33 are cut off and removed, whereby the leads 10, 20, and 30 are attached to the semiconductor element 3. It can be used as two soldered electrodes.
In the first to third embodiments, the case where the leads 10, 20, and 30 are soldered to the semiconductor element 3 is described, but the present invention is not limited to this. The electrode member assemblies 101 to 103 are also applicable when the leads 10, 20, 30 are directly soldered to the substrate 4 and when the leads 10, 20, 30 are soldered to the electrodes on the substrate 4. Can do.

  In the first to third embodiments, the first protrusions 11a, 21a, 31a and the second protrusions 12a, 22a, 32a of the leads 10, 20, 30 are respectively the main bodies of the first arm parts 11, 21, 31. Although it was formed in the main body portions 12b, 22b, 32b of the portions 11b, 21b, 31b and the second arm portions 12, 22, 32, it is not limited to this, and the end portions of the two protruding portions have gaps. Anything that opens and faces each other is acceptable. That is, the first arm parts 11, 21, 31 and the second arm parts 12, 22, 32 do not have the main body parts 11 b, 21 b, 31 b and the main body parts 12 b, 22 b, 32 b, respectively. The first protrusions 11a, 21a, 31a and the second protrusions 12a, 22a, 32a may protrude from 33. In this case, the first protrusions 11a, 21a, 31a and the second protrusions 12a, 22a, 32a may be linear, and may be refracted or curved.

Further, in the first to third embodiments, the first projecting portions 11a, 21a, 31a and the second projecting portions 12a, 22a, 32a are connected to the end portions 11ac, 21ac, 31ac and the end portions 12ac, 22ac, 32ac, respectively. The first protrusions 11a, 21a, 31a and the second protrusions 12a, 22a, 32a are arranged so as to be arranged in a straight line, but are not limited thereto. For example, the first projecting portion 11a and the second projecting portion 12a of the first embodiment are connected to the main body portion 11b of the first arm portion 11 and the main body portion 12b of the second arm portion 12 from the vertical direction, respectively. It may extend in the direction inclined in the direction of 13 or the opposite direction. That is, the 1st projection part 11a and the 2nd projection part 12a may be arrange | positioned so that a square shape may be formed. At this time, the gap between the end portion 11ac of the first projection portion 11a and the end portion 12ac of the second projection portion 12a, which is located at the bent portion of the U-shape, becomes wider in the direction toward the connection portion 13. Even if it has, it may have the shape where a width | variety becomes wide as it goes to the opposite direction to the connection part 13, or may have a shape with a fixed width | variety. Then, by supplying solder to the gap, the first protrusion 11 a and the second protrusion 12 a can be soldered to the semiconductor element 3. In addition, the arrangement | positioning which carried out the U shape in the above-mentioned 1st projection part 11a and the 2nd projection part 12a may be applied in Embodiment 2 and 3, and the above-mentioned form, ie, the 1st arm part 11, is applied. , 21, 31 and the second arm parts 12, 22, 32 do not have the main body parts 11b, 21b, 31b and the main body parts 12b, 22b, 32b, respectively, and the first projecting part 11a, You may apply to the form which 21a, 31a and 2nd projection part 12a, 22a, 32a protrude.
Also, the number of protrusions may not be two, but may be three or more. For example, the ends of the three protrusions may face each other with a gap between them, and solder may be supplied to the gap.

  DESCRIPTION OF SYMBOLS 1 1st solder layer, 3 semiconductor element (member to be joined) 10, 20, 30 lead (electrode member), 11, 21, 31 first arm part (first arm part of electrode member), 11a, 21a, 31a 1st protrusion part (1st protrusion part), 11ac end part (end part of 1st protrusion part), 12, 22, 32 2nd arm part (2nd arm part of an electrode member), 12a, 22a, 32a 2nd Projection part (second projection part), 12ac end part (end part of second projection part), 13, 23, 33 connection part (connection part of electrode member), 21ac end part (end part where the first projection part is depressed) ), 22ac end (end where the second protrusion is depressed), 31ac end (end which becomes narrower as it approaches the tip of the first protrusion), 32ac end (closer to the end of the second protrusion) Therefore, 101, 102, 103 Joining of electrode members , G10, g20, g30 gap.

Claims (5)

The electrode member is a joined body of electrode members to be joined to a member to be joined by solder,
The electrode member has a first projecting portion and a second projecting portion facing each other across a gap, and the first projecting portion and the second projecting portion are arranged to face the joining target member,
A joined body of electrode members in which the first projecting portion, the second projecting portion, and the member to be joined are joined by solder supplied from the gap.   The joined body of electrode members according to claim 1, wherein an end portion of the first projecting portion and an end portion of the second projecting portion are recessed.   The joined body of electrode members according to claim 1, wherein the first projecting portion and the second projecting portion become thinner as approaching the tip. The electrode member has a connection portion, a first arm portion and a second arm portion extending from the connection portion,
The said 1st arm part has said 1st protrusion part, and said 2nd arm part is a joined body of the electrode member as described in any one of Claims 1-3 which has said 2nd protrusion part. An electrode member joining method for joining an electrode member to a joining target member by solder,
Arranging an electrode member having a first protrusion and a second protrusion facing each other across a gap, with the first protrusion and the second protrusion facing the member to be joined;
In order to supply solder for joining the first projecting part, the second projecting part, and the joining target member between the first projecting part, the second projecting part, and the joining target member, A step of dripping the solder.

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