JP2012016735A - Laser beam machining device and laser beam machining method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a laser processing apparatus and a laser processing method capable of obtaining higher dimensional accuracy in three-dimensional processing.
A processing apparatus for forming a shape by irradiating a processing object with a laser beam L, irradiating the processing object with a laser beam and scanning the laser beam, and holding the processing object. And a position adjusting mechanism capable of adjusting the relative positional relationship between the workpiece and the laser beam, and a control unit 25 for controlling these mechanisms. The laser beam irradiation mechanism has a light intensity distribution in the beam cross section. Irradiates a laser beam having a Gaussian distribution, and the control unit reduces the angle of the laser beam with respect to the processing surface to the processing area of the processing object in both the pre-processing shape and the designed post-processing shape. It divides | segments into a some area | region, controls a laser beam irradiation mechanism and a position adjustment mechanism, scans and irradiates a laser beam for every divided area.
[Selection] Figure 1

Description

  The present invention relates to a laser processing apparatus and a laser processing method capable of three-dimensional processing with high dimensional accuracy.

  In recent years, a laser processing apparatus that performs processing by irradiating a laser beam (laser light) is also used for form formation (shape formation) of a member or the like that has been cut using a grindstone until now. For example, Patent Document 1 describes an end mill that includes a diamond tip having a cutting edge portion and an end mill body, and uses an end mill that uses single crystal diamond in which a rake face cut portion is cut by laser processing using an ultraviolet laser. Yes. In this end mill, the portion constituting the cutting edge is formed by polishing with a grindstone or loose abrasive grains.

  In such a laser processing apparatus, it is required to perform processing with high dimensional accuracy. For example, Patent Document 2 discloses that a processing table that holds a processing object can be moved along the irradiation direction of laser light. There has been proposed a laser processing apparatus including a three-degree-of-freedom stage for tilting a processing table in order to change an irradiation angle of a laser beam to an object to be processed. That is, in this laser processing apparatus, the edge surface of the laser beam is inscribed in the edge surface of the processing region by tilting the stage on which the processing target object is installed with the angle between the laser beam to be irradiated and the processing target object. It has changed as follows. Thereby, the condensing point of a laser beam is made to correspond to a processing target object, and the deterioration of the processing precision by irradiating a processing target object other than the condensing point of the laser beam used as a cone shape is suppressed.

Japanese Patent No. 4339573 JP 2000-334594 A

The following problems remain in the conventional technology.
When performing laser processing with the above-described conventional laser processing apparatus, even if the focal point of the laser beam coincides with the surface of the object to be processed, depending on the angle formed by the laser beam to be irradiated and the processing surface, Morphology may change and dimensional accuracy may deteriorate. That is, the laser beam usually has a Gaussian distribution of light intensity in the beam cross section, and the intensity is higher at the center of the laser beam L as shown in FIG. In addition, the processing is shallower toward the periphery, and a certain inclination is generated on the side surface of the processing portion 5a of the processing target 5 irradiated with the laser, and the processing shape is distorted. Therefore, even if the object to be processed is tilted so that the edge surface of the conical laser beam is inscribed in the edge surface of the processing region, the side surface of the processing portion is inclined due to the light intensity distribution of the beam cross section. Dimensional accuracy could not be obtained. In particular, when processing a processing target three-dimensionally, the conventional laser processing apparatus needs to change the tilt of the processing target finely and frequently according to the three-dimensional shape of the processing target. Tilt control is complicated and difficult to put into practical use. For example, when a ball end mill or the like is used as an object to be processed, it is difficult to form a three-dimensional shape of a cutting edge or the like that requires high dimensional accuracy and small surface roughness by laser processing.

  The present invention has been made in view of the above-described problems, and an object thereof is to provide a laser processing apparatus and a laser processing method capable of obtaining higher dimensional accuracy in three-dimensional processing.

  The present invention employs the following configuration in order to solve the above problems. That is, the laser processing apparatus of the present invention is a processing apparatus for irradiating a workpiece with a laser beam to form a shape, and irradiates the laser beam onto the workpiece and scans it. A position adjusting mechanism capable of holding the processing object and adjusting a relative positional relationship between the processing object and the laser beam, and a control unit for controlling these mechanisms, the laser light irradiation mechanism comprising: Irradiating a laser beam having a Gaussian distribution of the light intensity distribution of the beam cross section, and the control unit applies the processing region of the processing object to the processing surface in both the pre-processing shape and the designed post-processing shape. The laser beam is divided into a plurality of regions where the angle of the laser beam is less than 50 °, and the laser beam irradiation mechanism and the position adjustment mechanism are controlled to scan the laser beam for each of the divided regions. And irradiating.

  The laser processing method of the present invention is a processing method for irradiating a workpiece with a laser beam to form a shape, and irradiating the workpiece with the laser beam and scanning the laser beam, A position adjusting step for holding the object to be processed and adjusting a relative positional relationship between the object to be processed and the laser beam, and the laser beam whose light intensity distribution in the beam cross section is a Gaussian distribution. Irradiate and divide the processing region of the processing object into a plurality of regions where the angle of the laser beam with respect to the processing surface is less than 50 ° in both the pre-processing shape and the designed post-processing shape. The laser beam is scanned and irradiated for each region.

  In these laser processing apparatuses and laser processing methods, the processing region of the processing object is divided into a plurality of regions in which the angle of the laser beam with respect to the processing surface is less than 50 ° in both the pre-processing shape and the designed post-processing shape. Since the laser beam is scanned and irradiated for each of the divided areas, a shape can be formed with a small surface roughness and high dimensional accuracy over the entire processed surface in the divided area. That is, the angle of the laser beam with respect to the processed surface (the angle formed by the propagation direction of the laser beam and the normal direction of the surface irradiated with the laser beam) in both the pre-processed shape and the designed post-processed shape By setting the angle to less than 50 °, which takes into account the light intensity distribution, it is difficult to be affected by the light intensity distribution, which is a Gaussian distribution, and the shape can be formed with small surface roughness and high dimensional accuracy without any machining shape. It can be performed. In addition, the processing region is divided into a plurality of regions where the laser beam angle is less than 50 °, and the divided region is scanned and irradiated with the laser beam. A complicated stage control or the like that changes the tilt of the object is not required, and the entire processed surface in the divided area can be easily formed with high dimensional accuracy.

Further, in the laser processing apparatus of the present invention, the laser beam irradiation mechanism has an elliptical cross-sectional shape of the laser beam, and the scanning direction of the laser beam is set to the long axis direction or the short axis direction of the beam cross-sectional shape. It is characterized by matching.
If the scanning direction of the laser beam is not aligned with the major axis or minor axis direction of the light intensity distribution and is tilted with respect to the major axis or minor axis, the processing shape of the scanning end portion is inclined and deviation occurs. However, in the laser processing apparatus of the present invention, the scanning direction of the laser beam is made to coincide with the long axis direction or the short axis direction of the beam cross-sectional shape, so that the processing shape of the scanning end portion is not inclined and deviation occurs. Since it becomes difficult, more accurate shape formation becomes possible.

In the laser processing apparatus of the present invention, when the control unit scans the laser beam, the processing region is set as a plurality of processing layers stacked in the irradiation direction of the laser beam. The layer is irradiated with the laser beam, a predetermined portion is removed for each processing layer, and a three-dimensional processing surface is formed.
That is, in this laser processing apparatus, each processing layer is irradiated with a laser beam, a predetermined portion is removed for each processing layer, and a processing surface having a three-dimensional shape is formed. And the smoothness of the processing layer itself determine the surface accuracy (Rz, Ra, etc.) after processing, and the surface roughness can be set with high accuracy. Further, the laser-processed surface of each processing layer includes a large number of fine long grooves extending in parallel with each other and a large number of fine short grooves extending in the adjacent direction between the adjacent fine long grooves. The surface roughness on which the mesh-like fine irregularities are formed is small and the surface is processed with high surface accuracy.

The present invention has the following effects.
That is, according to the laser processing apparatus and the laser processing method according to the present invention, the angle of the laser beam with respect to the processing surface of the processing region of the processing object is less than 50 ° in both the pre-processing shape and the designed post-processing shape. Is divided into a plurality of regions, and a laser beam is scanned and irradiated for each of the divided regions, so that complicated control that changes the tilt of the workpiece during scanning is unnecessary, and the machining surface in the division region A shape can be formed with small surface roughness and high dimensional accuracy over the entire area.
Therefore, the laser processing apparatus and laser processing method of the present invention are suitable for three-dimensional shape processing of a cutting tool such as a small-diameter ball end mill having a diameter of 2 mm or less.

In the laser processing apparatus and laser processing method concerning this invention, it is a rough whole block diagram which shows a laser processing apparatus. In this embodiment, it is explanatory drawing which shows the relationship between the scanning direction of a laser beam, and the cross-sectional shape of a laser beam. In this embodiment, it is explanatory drawing which shows the inclination angle shift | offset | difference of the design processing surface with respect to the irradiation angle of a laser beam, and an actual processing surface. In this embodiment, it is a graph which shows the inclination angle shift with respect to the irradiation angle of a laser beam. In this embodiment, it is explanatory drawing which shows the irradiation angle of the laser beam with respect to the process surface before a process, and the process surface after a design process. In this embodiment, it is explanatory drawing which shows the process for every process layer. In this embodiment, it is a schematic diagram which shows the fine unevenness | corrugation of a processing surface. In the Example of the laser processing apparatus and laser processing method concerning this invention, it is the side view and top view of a tool front-end | tip part which show the end mill after a process which is a process target object. In a present Example, it is the whole side view which shows the end mill after a process which is a process target object. In a present Example, it is explanatory drawing of the method (a) which processes by 2 division which shows the relationship between a laser beam and a processing surface, and the method (b) which processes by 4 division of this embodiment. In a present Example, it is explanatory drawing which shows the process of dividing a process area | region into 4 in the circumferential direction. In an Example, it is an enlarged image which shows the processed surface in which the shape was formed. In a present Example, it is a graph which shows the design value of shape formation, and the measured value of an Example. It is a conceptual diagram which shows the cross-sectional shape of the part processed by the laser beam irradiation.

  Hereinafter, an embodiment of a laser processing apparatus and a laser processing method according to the present invention will be described with reference to FIGS. In each drawing used in the following description, there is a portion where the scale is appropriately changed as necessary in order to make each member recognizable or easily recognizable.

  As shown in FIG. 1, the laser processing apparatus 21 of the present embodiment is an apparatus that performs three-dimensional processing by irradiating a workpiece 5 with a laser beam (laser light) L, and oscillates the laser beam L in a pulsed manner. A laser beam irradiation mechanism 22 that irradiates and scans the workpiece 5 at a constant repetition frequency, a rotating mechanism 23 such as a motor that can rotate while holding the workpiece 5, and a rotating mechanism 23 is installed and moved. The movable mechanism 24 which can be provided, and the control part 25 which controls these are provided. The rotation mechanism 23 and the moving mechanism 24 constitute a position adjustment mechanism that can hold the workpiece 5 and adjust the relative positional relationship between the workpiece 5 and the laser beam L.

  The moving mechanism 24 includes an X-axis stage unit 24x that can move in the X direction parallel to the horizontal plane, and a moving direction in the Y direction that is provided on the X-axis stage unit 24x and is perpendicular to the X direction and parallel to the horizontal plane. A Y-axis stage unit 24y, and a Z-axis stage unit 24z provided on the Y-axis stage unit 24y and capable of holding the workpiece 5 while being fixed to the rotation mechanism 23 and movable in the direction perpendicular to the horizontal plane. , Is composed of.

  The laser light irradiation mechanism 22 includes a laser light source 26 that also has an optical system that oscillates a laser beam that becomes a laser beam L in response to a trigger signal of a Q switch and collects it in a spot shape, and a galvano scanner that scans the laser beam L to be irradiated. 27 and a CCD camera 28 that captures an image for confirming the machining position of the held workpiece 5.

The laser beam L emitted from the laser beam irradiation mechanism 22 is in a single mode, and the light intensity distribution of the beam cross section is a Gaussian distribution, and as shown in FIG. 2, the light intensity of the beam cross section at the focal point. The distribution is elliptical.
Further, the laser beam irradiation mechanism 22 makes the scanning direction of the laser beam L coincide with the major axis direction or minor axis direction of the light intensity distribution having an elliptical shape. This is because when the scanning direction of the laser beam L is a direction inclined with respect to the major axis or the minor axis without matching the major axis direction or the minor axis direction of the light intensity distribution, the processing shape of the scanning end portion is This is because a tilt occurs and a deviation occurs. In FIG. 2, the scanning direction of the laser beam L is aligned with the minor axis direction of the light intensity distribution.

As the laser light source 26, one that can irradiate laser light having a wavelength of 190 to 550 nm can be used. For example, in the present embodiment, one that can oscillate and emit laser light having a wavelength of 355 nm is used.
The galvano scanner 27 is disposed immediately above the moving mechanism 24. The CCD camera 28 is installed adjacent to the galvano scanner 27.

  The control unit 25 divides the processing region of the processing object 5 into a plurality of regions in which the angle of the laser beam L with respect to the processing surface is less than 50 ° in both the pre-processing shape and the designed post-processing shape, The laser beam irradiation mechanism 22 and the position adjustment mechanism (the rotation mechanism 23 and the movement mechanism 24) are controlled so as to scan and irradiate the laser beam L for each divided region.

  That is, as shown in FIG. 3, the inclination angle θ2 of the processed surface 29a to be formed and the inclination angle θ3 of the processed surface 29b actually formed by processing with the laser beam L are as described above. Therefore, when the laser beam L is irradiated with a large inclination, a deviation in the inclination angle occurs. As can be seen from the graph shown in FIG. 4, this phenomenon occurs remarkably when the irradiation angle of the laser beam L with respect to the processed surface 29a to be formed is 50 ° or more, and the tilt angle is greatly shifted.

  For this reason, in this embodiment, as shown in FIG. 5, the angle θ4 and the angle θ5 of the laser beam L with respect to both the processed surface 29c with the pre-processed shape and the processed surface 29d with the designed post-processed shape are set to 50 °. The laser beam L is set to a value less than that. Further, in order to set the angle θ4 and the angle θ5 of the laser beam L to be less than 50 °, the processing region is divided, and laser processing is performed for each of the divided regions where the angle θ4 and the angle θ5 of the laser beam L are less than 50 °. Do.

  Further, as shown in FIG. 6, the control unit 25 sets the processing region as a stack of a plurality of processing layers 30 in the irradiation direction of the laser beam L when scanning with the laser beam L. The layer 30 is irradiated with the laser beam L vertically, a predetermined portion is removed for each processing layer 30, and a laser beam irradiation mechanism 22, a rotation mechanism 23, and a movement mechanism 24 are formed so as to form a three-dimensional processed surface. To control.

  That is, in the present embodiment, when scanning with the laser beam L, a plurality of processing layers 30 are stacked and set on the scanning program, so that each processing layer 30 is irradiated with the laser beam L vertically, A predetermined portion is removed for each processing layer 30 to form a processing surface 29 having a three-dimensional shape. For this reason, in the scanning control of the laser beam L, first, the processing object 5 is set in a plurality of processing layers 30 in the irradiation direction of the laser beam L.

  Then, a part to be processed and removed from the shape before processing and the designed shape after processing is set for each processing layer 30, and a predetermined portion is removed by scanning the laser beam L for each processing layer 30. The processed surface 29 is formed. In this processing method, the resolution (thickness) of the processing layer 30 and the smoothness of the processing layer 30 itself determine the surface accuracy (Rz, Ra, etc.) after processing. For example, in this embodiment, the resolution of the processing layer 30 is set so that the surface roughness is at least Rz (maximum surface roughness): 2 μm or less and Ra (arithmetic average roughness): 1 μm or less.

  As shown in FIG. 7, the surface laser-processed by this laser processing apparatus 21 extends in the adjacent direction between a large number of fine long grooves M1 extending in parallel with each other and the adjacent fine long grooves M1. A surface having a small surface roughness on which a plurality of fine short grooves M2 and mesh-like fine irregularities are formed is a processed surface with high surface accuracy.

  The texture of the processed surface 29 is fine irregularities due to a large number of fine long grooves M1 and a large number of fine short grooves M2, so that according to the laser processing method of the present embodiment, the surface roughness Rz is 2 μm or less and the surface A roughness Ra of 1 μm or less can be realized. The pitch of the fine long grooves M1 is, for example, 0.7 to 15 μm, and the pitch of the fine short grooves M2 is, for example, 0.5 to 10 μm.

  As described above, in the laser processing apparatus 21 and the laser processing method of the present embodiment, the angle of the laser beam L with respect to the processing surface 29 is set in the processing region of the processing object 5 in both the pre-processing shape and the designed post-processing shape. Since the laser beam L is divided into a plurality of regions of less than 50 °, and the divided regions are scanned and irradiated, the shape is formed with small surface roughness and high dimensional accuracy over the entire processing surface 29 in the divided regions. be able to.

  That is, the Gaussian distribution is set by setting the angle of the laser beam L with respect to the processing surface 29 in both the pre-processing shape and the designed post-processing shape to be less than 50 °, which is an angle considering the light intensity distribution of the beam cross section. Therefore, it is difficult to be affected by the light intensity distribution, and the shape can be formed with a small surface roughness and high dimensional accuracy without sagging the processed shape. Further, since the processing region is divided into a plurality of regions where the angle of the laser beam L is less than 50 °, and the laser beam L is scanned and irradiated for each of the divided regions, the laser beam L is scanned within the divided region. No complicated stage control or the like that changes the inclination of the workpiece 5 is required, and the entire machining surface 29 in the divided area can be easily formed with high dimensional accuracy.

In addition, since the scanning direction of the laser beam L coincides with the long axis direction or the short axis direction of the beam cross-sectional shape, the processing shape of the scanning end portion does not tilt and it is difficult for deviation to occur, so that more accurate shape formation Is possible.
Furthermore, each processing layer 30 is irradiated with the laser beam L, and a predetermined portion is removed for each processing layer 30 to form a three-dimensional processing surface. Therefore, the resolution (thickness) of the processing layer 30 is determined. The smoothness of the processed layer 30 itself determines the surface accuracy (Rz, Ra, etc.) after processing, and the surface roughness can be set with high accuracy.

  Next, an embodiment in which an end mill is actually formed by laser processing as an object to be processed by the laser processing apparatus and laser processing method of the present invention will be described with reference to FIGS.

  As shown in FIGS. 8 and 9, the final machining shape of the end mill 10 that is a workpiece is a tool tip 12 that rotates about the axis 0, and a pair of cutting blades 13 sandwich the axis 0 at the tip. It is a two-blade ball end mill formed on the opposite side and having a pair of ball blade portions 13a as the cutting blade 13 whose rotation trajectory around the axis 0 is substantially hemispherical. This end mill 10 is formed of a hard material such as cemented carbide and has a cylindrical shank portion 14 having a small-diameter neck portion 14a on the tip side, and a substantially cylindrical tip portion 11 joined to the tip portion of the neck portion 14a by diffusion bonding. And is composed of.

The tip portion 11 includes a cemented carbide portion 15 joined to the neck portion 14a and a tool tip portion 12 serving as a blade portion of a cBN sintered body joined to the cemented carbide portion 15. That is, the tool tip portion 12 of the tip portion 11 is formed of a cBN sintered body.
The end mill 10 has an outer diameter of the cutting edge 13 of 2 mm or less, the entire tool tip 12 is formed by laser processing, and a chamfer 19 (see FIG. 1) on the rake face 16 side of the cutting edge 13. Are hatched by laser processing.

  The cutting blade 13 includes a pair of ball blade portions 13a provided on the tip side and formed in an arc shape, and a pair of outer peripheral blade portions 13b extending linearly along the axis 0 continuously from the ball blade portion 13a. And have. That is, the tool front end portion 12 is a front end portion where the cutting blade 13 including the ball blade portion 13a and the outer peripheral blade portion 13b is formed. The outer diameter of the ball blade portion 13a is set to R = 0.5 mm, for example.

  The tool tip portion 12 is formed with a flat rake face 16 extending along the axis 0 from the tip end toward the base end side on the wall surface facing the end mill rotation direction. A flank 17 is formed on the outer peripheral surface of the tool tip 12. That is, the ball blade portion 13a and the outer peripheral blade portion 13b are formed at the intersecting ridge line between the rake face 16 and the flank face 17 formed by laser processing.

As for the surface roughness set for the flank 17, Rz (maximum surface roughness) is 2 μm or less and surface roughness Ra (arithmetic average roughness) is 1 μm or less.
The chamfer 19 extends from the ball blade portion 13a to the outer peripheral blade portion 13b and is formed with a constant width. For example, the chamfer width is set constant in the range of 30 to 40 μm. The set surface roughness of the chamfer 19 is at least Rz: 2 μm or less and Ra: 1 μm or less.

In order to manufacture the end mill 10 using the laser processing apparatus 21 of the present embodiment, first, the shank portion 14 to which the substantially cylindrical tip portion 11 is joined is installed and held on the rotation mechanism 23.
In this state, the entire tool tip 12 is formed by irradiating the laser beam L (three-dimensional laser processing step). At this time, the laser beam L is irradiated with the angle of the laser beam L with respect to the processing surface set to less than 50 ° in both the pre-processing shape and the designed post-processing shape.

  That is, as shown in FIG. 10 (a), when the tool tip 12 is divided into two in the circumferential direction and laser machining is performed, the angle θ of the laser beam L with respect to the machining surface 29 is 50 ° at the circumferential edge. That's it. In this case, since the light intensity distribution in the beam cross section of the laser beam L has a Gaussian distribution, the intensity is higher at the center of the laser beam L and deeper at the center of the laser beam L as shown in FIG. At the same time, the processing is shallower at the periphery, and a certain inclination is generated on the side surface of the processing portion 5 irradiated with the laser, and the processing shape is bent.

  For this reason, in this embodiment, as shown in FIG. 5, the angle θ4 and the angle θ5 of the laser beam L with respect to both the processed surface 29c with the pre-processed shape and the processed surface 29d with the designed post-processed shape are set to 50 °. The laser beam L is set to a value less than that. Further, in order to set the angle θ4 and the angle θ5 of the laser beam L to be less than 50 °, as shown in FIG. 10B and FIG. 11, the tool tip 12 is divided into four in the circumferential direction (regions A to D). Laser processing.

  That is, by scanning the laser beam L only in one region (divided region) of the tool tip 12 divided into four in the circumferential direction, any processed surface (the processed surface 29c of the shape before processing) in this processed region is scanned. The angle θ of the laser beam L is less than 50 ° with respect to the processed surface 29d having a post-processing shape in design. Therefore, as shown in FIG. 11, a tool is used by using the rotation mechanism 23 so that the angle between the irradiation direction of the laser beam L and the processed surface to be irradiated is always in an appropriate angle range (θ <50 °). The distal end portion 12 is processed by being divided and rotated four times every 90 ° around the axis 0. In this embodiment, the laser beam L is scanned along the direction of the axis 0 of the chip portion 11.

  In the present embodiment, when scanning with the laser beam L, as shown in FIG. 6, a plurality of processing layers 30 are stacked and set in the scanning program, so that the laser beam is applied to each processing layer 30. L is irradiated vertically, a predetermined portion is removed for each processing layer 30, and a three-dimensional processing surface 29 (e.g., flank 17 and chamfer 19) is formed. That is, in the scanning control of the laser beam L, first, the chip portion 11 of the processing target is set in a plurality of processing layers 30 in the irradiation direction of the laser beam L.

  Then, a part to be processed and removed from the shape before processing and the designed shape after processing is set for each processing layer 30, and the laser beam L is scanned for each processing layer 30 to remove a predetermined portion. A predetermined processed surface 29 such as the surface 17 is formed.

FIG. 12 shows a photographic image (350 times magnified image) obtained by enlarging the actually laser processed surface (flank 17).
As can be seen from this image, the surface processed in this example has a large number of fine long grooves extending in parallel with each other and a large number of fine short grooves extending in the adjacent direction between the adjacent fine long grooves. In addition to the formation of mesh-like fine irregularities composed of grooves, the surface roughness Rz was 2 μm or less, and Ra was 1 μm or less.

  Next, in the laser processing apparatus of the present invention, a laser beam having a wavelength of 355 nm, a repetition frequency of 166 kHz, and an average output of 0.5 W is condensed by an Fθ lens, and processed at a scanning speed of 300 mm / s using a galvano scanner. The three-dimensional formation of the ceramic was actually performed, and the target shape design value and the actually measured shape measurement value were compared. A graph comparing the design value and the measured value is shown in FIG.

  In this graph, the shape is three-dimensional, but since the same shape continues in the front-rear direction in the direction perpendicular to the paper surface, a cross section of an arbitrary part is plotted and represented in two dimensions. The thick line in the graph indicates the actual shape after laser processing, and the thin line indicates the target design shape (design drawing). The ceramic to be processed is a flat plate, and unnecessary portions are processed and removed into layers for each processing layer described above by laser processing. The interval between the processing layers as the processing layers was set to 1 μm. The arrows in this graph schematically show the layer processing of each processing layer.

The target shape after processing and the shape and arrangement of the flat plate before processing were set so that the irradiation angle of the laser beam with respect to the processing surface was less than 50 °, respectively, and were processed by the laser processing method of the present invention. The cross section of the laser beam was an elliptical shape with a major axis of 20 μm and a minor axis of 15 μm at the focal point, and the scanning direction of the laser beam was a direction that coincided with the major axis direction.
As a result, as shown in the graph of FIG. 13, the target shape design value and the actual processed shape measurement value could be matched with high dimensional accuracy with a difference of 2 μm.

  The technical scope of the present invention is not limited to the above-described embodiments and examples, and various modifications can be made without departing from the spirit of the present invention.

  5 ... processing object, 10 ... end mill (processing object), 22 ... laser light irradiation mechanism, 23 ... rotation mechanism (position adjustment mechanism), 24 ... movement mechanism (position adjustment mechanism), 25 ... control unit, 29, 29a , 29b, 29c, 29d ... processing surface, 30 ... processing layer, L ... laser beam

Claims (4)

A processing apparatus for forming a shape by irradiating a processing object with a laser beam,
A laser beam irradiation mechanism for irradiating and scanning the laser beam to the workpiece;
A position adjustment mechanism capable of holding the workpiece and adjusting a relative positional relationship between the workpiece and the laser beam;
A control unit for controlling these mechanisms,
The laser light irradiation mechanism irradiates a laser beam whose light intensity distribution in the beam cross section is a Gaussian distribution,
The control unit divides the processing region of the processing object into a plurality of regions in which the angle of the laser beam with respect to the processing surface is less than 50 ° in both the pre-processing shape and the designed post-processing shape, A laser processing apparatus, wherein a laser beam irradiation mechanism and the position adjustment mechanism are controlled to scan and irradiate the laser beam for each of the divided regions. In the laser processing apparatus of Claim 1,
The laser beam irradiation mechanism has an elliptical beam cross-sectional shape, and a scanning direction of the laser beam coincides with a major axis direction or a minor axis direction of the beam sectional shape. Processing equipment. In the laser processing apparatus according to claim 1 or 2,
When the control unit scans the laser beam, the processing region is set as a stack of a plurality of processing layers in the irradiation direction of the laser beam, and the processing layer is irradiated with the laser beam. A laser processing apparatus, wherein a predetermined portion is removed for each processing layer to form a three-dimensional processing surface. A processing method for forming a shape by irradiating a processing object with a laser beam,
Irradiating the workpiece with the laser beam and scanning the laser beam; and
A position adjusting step of holding the processing object and adjusting a relative positional relationship between the processing object and the laser beam,
Irradiating the laser beam whose light intensity distribution in the beam cross section is a Gaussian distribution,
The processing region of the processing object is divided into a plurality of regions in which the angle of the laser beam with respect to the processing surface is less than 50 ° in both the pre-processing shape and the designed post-processing shape, and for each of the divided regions A laser processing method characterized by scanning and irradiating the laser beam.