JP2012015431A - Dicing die bond film - Google Patents

Abstract

A dicing die-bonding film having a dicing film and a die-bonding film. (1) Regardless of the size and thickness of a semiconductor wafer or a semiconductor chip, good holding power for the semiconductor wafer during dicing, and a semiconductor from a substrate Provided is a dicing die-bonding film that has good chip releasability, (2) little influence on the environment and human body, and (3) easy handling.
A dicing die-bonding film 11 includes a dicing film having a pressure-sensitive adhesive layer 2 on a substrate 1 and a die-bonding film 3 ', and the pressure-sensitive adhesive layer is formed by curing a polymer (P) by ultraviolet irradiation. The polymer (P) contains a polymer (A) composed of components including an acrylate ester and a carboxyl group-containing monomer as main monomers, and an oxazoline group containing an oxazoline group and a radical-reactive carbon-carbon double bond. The die-bonding film obtained by reacting with the compound (B) contains an epoxy resin.
[Selection] Figure 2

Description

  The present invention relates to a dicing die bond film. Specifically, it is a film used for dicing a workpiece (semiconductor wafer, etc.), and an adhesive for fixing the chip-like workpiece (semiconductor chip, etc.) and the electrode member is already applied before dicing. It is related with the dicing die-bonding film which can be set as the state attached to.

The semiconductor wafer (work) on which the circuit pattern is formed is diced into a semiconductor chip (chip-shaped work) after adjusting the thickness by backside polishing as necessary (dicing step). In the dicing process, generally, the semiconductor wafer is washed with an appropriate liquid pressure (usually about 2 kg / cm ² ) in order to remove the cut layer. Next, the diced semiconductor chip is fixed to an adherend such as a lead frame with an adhesive (mounting process). Subsequently, bonding is performed on the semiconductor chip fixed to the adherend (bonding step).

  In the mounting step, the adhesive is applied to the surface of the lead frame or semiconductor chip. However, when applying the adhesive, there is a problem that a special device is required and a problem that a long time is required for the work. In addition, there is a problem that it is difficult to make the adhesive layer uniform because of the nature of the work of application.

  In order to solve the above problems, a dicing die bond film has been proposed that can adhere and hold a semiconductor wafer in a dicing process and can provide an adhesive layer for fixing an adherend in a mounting process (for example, Patent Document 1).

  The dicing die-bonding film described in Patent Document 1 is provided with an adhesive layer that can be peeled off on a supporting substrate. That is, after the semiconductor wafer is diced while being held by the adhesive layer, the support base is stretched, the semiconductor chip is peeled off together with the adhesive layer, and this is recovered individually, and the recovered semiconductor chip with the adhesive layer is bonded. It adheres to adherends, such as a lead frame, through an agent layer.

  The adhesive layer of the dicing die-bonding film as described above has a good holding power for the semiconductor wafer and a support base for the semiconductor chip after dicing integrated with the adhesive layer so that dicing is not impossible and dimensional errors do not occur. Good peelability that can be peeled from the material is desired.

  However, there is a problem that it is difficult to express both of the above characteristics, that is, good holding power and good peelability in a well-balanced manner. In particular, when a large holding force is required for the adhesive layer, such as a method of dicing a semiconductor wafer with a rotating round blade or the like, it is possible to obtain a dicing die bond film that can express both of the above characteristics in a balanced manner. Have difficulty.

  In order to solve the above problems, various improved methods have been proposed for dicing and die-bonding films (see, for example, Patent Document 2).

  In the dicing die-bonding film described in Patent Document 2, a pressure-sensitive adhesive layer capable of ultraviolet curing is interposed between the support substrate and the adhesive layer. The adhesive force between the pressure-sensitive adhesive layer and the adhesive layer is reduced by curing the pressure-sensitive adhesive layer with ultraviolet rays after dicing. Due to the decrease in the adhesive force, the pressure-sensitive adhesive layer and the adhesive layer are easily peeled off, and the semiconductor chip can be easily picked up.

  However, even with the improved method, it is difficult to obtain a dicing die-bonding film that can express a good holding power during dicing and a good peelability thereafter. For example, when obtaining a large semiconductor chip of 10 mm × 10 mm or more, since the area is large, it is not easy to pick up the semiconductor chip using a general die bonder.

  In order to solve the above problems, various improved methods have been proposed for dicing die-bonding films (see, for example, Patent Document 3).

  In the dicing die-bonding film described in Patent Document 3, a pressure-sensitive adhesive obtained by reacting a hydroxyl group in a polymer with a compound having an isocyanate group that reacts with the hydroxyl group and a radical-reactive carbon-carbon double bond is used. By using such an adhesive, a semiconductor chip is easily picked up.

  However, in order to promote the reaction between the isocyanate group-containing compound and the hydroxyl group-containing polymer, a tin-based catalyst may be added, which has a problem of having a great influence on the environment. Moreover, the compound which has an isocyanate group and a radical reactive carbon-carbon double bond has the problem of reacting with water and deactivating. Furthermore, the compound having an isocyanate group and a radical-reactive carbon-carbon double bond has a problem that it has a large influence on the environment and the human body because it is volatile, and sufficient care is required for handling.

JP-A-60-57642 JP-A-2-24864 JP 2009-170786 A

  An object of the present invention is a dicing die-bonding film having a dicing film having a pressure-sensitive adhesive layer on a base material and a die-bonding film provided on the pressure-sensitive adhesive layer, and (1) a semiconductor wafer or a semiconductor chip Regardless of size and thickness, good holding power to the semiconductor wafer at the time of dicing and good releasability that can peel the semiconductor chip after dicing from the base material integrally with the die bond film can be expressed in a balanced manner, (2) To provide a dicing die-bonding film that has little influence on the environment and the human body and (3) is easy to handle.

The dicing die-bonding film of the present invention is
A dicing film having a pressure-sensitive adhesive layer on a substrate, and a dicing film having a die-bonding film provided on the pressure-sensitive adhesive layer,
The pressure-sensitive adhesive layer contains a cured product of polymer (P) by ultraviolet irradiation,
The polymer (P) includes a polymer (A) composed of a monomer component including an acrylic acid ester as a main monomer and a carboxyl group-containing monomer, and an oxazoline group having a oxazoline group and a radical-reactive carbon-carbon double bond. Obtained by reacting with compound (B),
The die bond film includes an epoxy resin.

  In a preferred embodiment, the carboxyl group-containing monomer is at least one selected from (meth) acrylic acid and carboxyalkyl (meth) acrylate.

  In a preferred embodiment, the oxazoline group-containing compound (B) is 2-vinyl-2-oxazoline, 4-methyl-2-vinyl-2-oxazoline, 5-methyl-2-vinyl-2-oxazoline, 2- Vinyl-4,4-dimethyl-2-oxazoline, 2-isopropenyl-2-oxazoline, 4-methyl-2-isopropenyl-2-oxazoline, 5-methyl-2-isopropenyl-2-oxazoline, and 2- It is at least one selected from isopropenyl-4,4-dimethyl-2-oxazoline.

In a preferred embodiment, the acrylic ester is an acrylic ester represented by CH ₂ ═CHCOOR (wherein R is an alkyl group having 6 to 10 carbon atoms).

  In preferable embodiment, the glass transition temperature of the said polymer (P) is -70 degreeC--10 degreeC.

  According to the present invention, there is provided a dicing die-bonding film having a dicing film having a pressure-sensitive adhesive layer on a base material and a die-bonding film provided on the pressure-sensitive adhesive layer, wherein (1) a semiconductor wafer or a semiconductor chip Regardless of size and thickness, good holding power to the semiconductor wafer at the time of dicing and good releasability that can peel the semiconductor chip after dicing from the base material integrally with the die bond film can be expressed in a balanced manner, (2) A dicing die-bonding film that has a small influence on the environment and the human body and (3) is easy to handle can be provided.

It is a schematic sectional drawing of the dicing die-bonding film by preferable embodiment of this invention. It is a schematic sectional drawing of the dicing die-bonding film by another preferable embodiment of this invention. It is a schematic process drawing which shows the manufacturing method of the semiconductor device using the dicing die-bonding film by preferable embodiment of this invention.

When the present invention is described with reference to the drawings, the description of the portions unnecessary for the description may be omitted in the drawings. Further, when the present invention is described with reference to the drawings, some or all of the drawings may be enlarged or reduced for easy description.
≪A. Dicing die bond film >>
The dicing die-bonding film of the present invention is a dicing die-bonding film having a dicing film having a pressure-sensitive adhesive layer on a base material and a die-bonding film provided on the pressure-sensitive adhesive layer.

  FIG. 1 is a schematic cross-sectional view of an example of a preferred embodiment of the dicing die-bonding film of the present invention. In FIG. 1, a dicing die-bonding film 10 includes a dicing film having a pressure-sensitive adhesive layer 2 on a substrate 1 and a die-bonding film 3 provided on the pressure-sensitive adhesive layer 2. The pressure-sensitive adhesive layer 2 entirely contains a cured product of the polymer (P) by ultraviolet irradiation.

  FIG. 2 is a schematic cross-sectional view of an example of another preferred embodiment of the dicing die-bonding film of the present invention. In FIG. 2, a dicing die bond film 11 includes a dicing film having a pressure-sensitive adhesive layer 2 on a substrate 1 and a die bond film 3 ′ provided on the pressure-sensitive adhesive layer 2. The die bond film 3 ′ in FIG. 2 is formed only on the adhesive layer 2 where the semiconductor wafer 4 is attached. The pressure-sensitive adhesive layer 2 includes a portion 2a made of a cured product of the polymer (P) by ultraviolet irradiation and a portion 2b made of a polymer (P) not cured without being irradiated with ultraviolet light. Thus, in the dicing die-bonding film of the present invention, the pressure-sensitive adhesive layer 2 does not need to contain the entire cured product of the polymer (P) by ultraviolet irradiation, and the polymer (P) is cured by ultraviolet irradiation. A thing may be included partially.

  The dicing die-bonding film of the present invention can have antistatic ability. By providing the dicing die-bonding film with antistatic ability, it is possible to prevent the circuit from being destroyed due to the generation of static electricity at the time of bonding and peeling, and the charging of the workpiece (semiconductor wafer, etc.). .

  As a method of imparting antistatic ability to the dicing die bond film, a method of adding an antistatic agent or a conductive substance to a base material, an adhesive layer, or a die bond film, a conductive layer made of a charge transfer complex, a metal film, or the like. The method of attaching on a base material etc. are mentioned. As these methods, a method in which impurity ions that may change the quality of the semiconductor wafer are less likely to be generated is preferable.

  As a conductive substance (conductive filler) blended for the purpose of imparting conductivity and improving thermal conductivity, spherical, needle-like, and flaky shapes such as silver, aluminum, gold, copper, nickel, and conductive alloys Examples thereof include metal powders, metal oxides such as alumina, amorphous carbon black, and graphite.

  The die bond film is preferably non-conductive from the viewpoint of preventing electrical leakage.

  The die bond film is preferably protected by a separator. A separator has a function as a protective material which protects a die-bonding film until it uses for practical use. Further, the separator can be used as a support base material when transferring the die bond film to the pressure-sensitive adhesive layer. The separator is peeled off when the workpiece is stuck on the die bond film of the dicing die bond film. Examples of the separator include polyethylene terephthalate (PET), polyethylene, polypropylene, a plastic film whose surface is coated with a release agent such as a fluorine-type release agent and a long-chain alkyl acrylate-type release agent, and paper.

<< A-1. Base material >>
The base material is a strength matrix of the dicing die bond film.

  It is preferable that the substrate has ultraviolet transparency. This is because the polymer (P) contained in the pressure-sensitive adhesive layer of the dicing die-bonding film of the present invention needs to be cured in advance by ultraviolet irradiation.

  Arbitrary appropriate thickness can be employ | adopted for the thickness of a base material. Preferably, it is 5 micrometers-200 micrometers.

  Any appropriate material can be adopted as the material for the base material as long as the effects of the present invention can be exhibited. Examples of the base material include low density polyethylene, linear low density polyethylene, medium density polyethylene, high density polyethylene, ultra low density polyethylene, ultra high molecular weight polyethylene, random copolymer polypropylene, block copolymer polypropylene, and homopolypropylene. Len, polybutene, polymethylpentene, ethylene-vinyl acetate copolymer, ethylene- (meth) acrylic acid copolymer, ethylene- (meth) acrylic acid ester (random, alternating) copolymer, ethylene-butene copolymer Polyolefin resins such as ethylene-hexene copolymer and ionomer resin; Styrene resins such as polystyrene, ABS resin, AS resin, AAS resin, ACS resin, AES resin, MS resin, SMA resin, MBS resin; polyvinyl chloride Chlorine such as polyvinylidene chloride Fats; Urethane resins such as polyurethane; Polyester resins such as polyethylene terephthalate and polyethylene naphthalate; Polyamide, fully aromatic polyamide (aramid), polycarbonate, polyimide, polyetheretherketone, polyetherimide, polyphenylsulfide, etc. Examples include rearing plastic; glass; glass cloth; fluororesin; cellulose resin; silicone resin; metal (foil); Examples of the material for the base material include cross-linked materials such as the above-mentioned resins.

  The base material may be formed of only one kind of material or may be formed of two or more kinds of materials. The substrate may be a single layer or two or more types.

  As the substrate, an unstretched substrate may be used, or a substrate subjected to a stretching process such as uniaxial stretching or biaxial stretching may be used.

  When a base material that has been subjected to a stretching process is used, the adhesive area between the pressure-sensitive adhesive layer and the die-bonding film can be reduced by thermally shrinking the base material after dicing, and the semiconductor chip can be easily recovered. it can.

  The surface of the base material may be subjected to any appropriate surface treatment in order to improve adhesion and retention with an adjacent layer. Examples of such surface treatment include chemical or physical treatment such as chromic acid treatment, ozone exposure, flame exposure, high-voltage impact exposure, ionizing radiation treatment, etc .; coating treatment with a primer (for example, an adhesive substance described later); Etc.

  In order to impart an antistatic ability to the base material, a deposited layer of a conductive substance made of a metal, an alloy, an oxide thereof, or the like can be provided on the base material. The thickness of such a vapor deposition layer is preferably 30 to 500 mm.

<< A-2. Adhesive layer >>
An adhesive layer contains the hardened | cured material of the polymer (P) by ultraviolet irradiation.

  By curing the polymer (P) by ultraviolet irradiation, the degree of crosslinking can be increased and the adhesive strength of the polymer (P) can be reduced. For example, the pressure-sensitive adhesive layer 2 shown in FIG. 2 includes a portion 2a made of a cured product obtained by curing a polymer (P) by irradiating a semiconductor wafer attachment portion with ultraviolet rays, and a polymer (P ), And a difference is provided in the adhesive force between the portion 2a and the portion 2b.

  In FIG. 2, the die bond film 3 ′ is composed of all of the portion 2 a whose adhesive strength is reduced by curing the polymer (P) when irradiated with ultraviolet rays and the portion of the polymer (P) that is not cured without being irradiated with ultraviolet rays. Affixed to a part of 2b. In FIG. 2, the interface between the portion 2a of the pressure-sensitive adhesive layer 2 and the die bond film 3 'has a property of easily peeling off at the time of pickup because the adhesive strength of the portion 2a is reduced. On the other hand, in FIG. 2, the interface between the portion 2b and the die bond film 3 ′ is secured to the die bond film 3 ′ by adhering to the die bond film 3 ′ because the portion 2b has sufficient adhesive strength.

  As described above, the dicing die-bonding film of the present invention can support the die-bonding film with a good balance in terms of both adhesiveness and peelability by appropriately designing the pressure-sensitive adhesive layer.

  In the pressure-sensitive adhesive layer 2 shown in FIG. 2, the dicing ring can be fixed to the portion 2b made of the polymer (P) that has not been irradiated with ultraviolet rays and has not been cured. For example, a dicing ring made of a metal such as stainless steel or a resin can be used.

  The polymer (P) is a polymer (A) composed of a monomer component including an acrylate ester as a main monomer and a carboxyl group-containing monomer, and an oxazoline group-containing compound having an oxazoline group and a radical-reactive carbon-carbon double bond Obtained by reacting with (B).

  The glass transition temperature of the polymer (P) is preferably −70 ° C. or higher, more preferably −65 ° C. or higher, further preferably −60 ° C. or higher, particularly preferably −55 ° C. or higher, as the lower limit. The upper limit is preferably −10 ° C. or lower, more preferably −20 ° C. or lower, still more preferably −30 ° C. or lower, and particularly preferably −40 ° C. or lower.

  When the glass transition temperature of the polymer (P) exceeds −10 ° C., the adhesiveness between the pressure-sensitive adhesive layer and the die bond film is lowered, and so-called “chip jump” may occur during dicing.

  The polymer (P) preferably has a low content of a low molecular weight substance from the viewpoint of preventing contamination of a clean adherend. For this reason, the weight average molecular weight of the polymer (P) is preferably 350,000 or more, more preferably 450,000 or more as the lower limit, and preferably 1 million or less, more preferably 80,000 as the upper limit. 10,000 or less.

  Examples of the acrylic acid ester include an acrylic acid alkyl ester (for example, acrylic acid methyl ester, acrylic acid ethyl ester, acrylic acid propyl ester, acrylic acid isopropyl ester, acrylic acid butyl ester, acrylic acid isobutyl ester, and acrylic acid sec-butyl. Ester, t-butyl acrylate, pentyl acrylate, isopentyl acrylate, hexyl acrylate, heptyl acrylate, octyl acrylate, 2-ethylhexyl acrylate, isooctyl acrylate, acrylic acid Nonyl ester, acrylic acid decyl ester, acrylic acid isodecyl ester, acrylic acid undecyl ester, acrylic acid dodecyl ester, acrylic The carbon number of the alkyl group, such as tridecyl ester, acrylic acid tetradecyl ester, acrylic acid hexadecyl ester, acrylic acid octadecyl ester, acrylic acid eicosyl ester, etc. is preferably 1-30, more preferably 4-18, Straight chain or branched alkyl alkyl ester) and acrylic acid cycloalkyl ester (for example, acrylic acid cyclopentyl ester, acrylic acid cyclohexyl ester, etc.).

  Only one type of acrylic ester may be used, or two or more types may be used in combination.

The acrylate ester is preferably CH ₂ ═CHCOOR (R is an alkyl group or a cycloalkyl group. The carbon number of R is preferably 6 or more, more preferably 8 or more, as a lower limit value. As an upper limit, Preferably it is 10 or less, More preferably, it is 9. The carbon number of R is, for example, Preferably it is 6-10.

  When the carbon number of R is less than 6, the peeling force between the pressure-sensitive adhesive layer and the die bond film becomes too large, and the pick-up property may be lowered.

  When the carbon number of R exceeds 10, the adhesiveness between the pressure-sensitive adhesive layer and the die bond film is lowered, and so-called “chip jump” may occur during dicing.

  Particularly preferred acrylic esters in the present invention include 2-ethylhexyl acrylate and isooctyl acrylate.

  Arbitrary appropriate content rates can be employ | adopted for the content rate of the acrylic ester in the monomer component which comprises a polymer (A) in the range which does not impair the effect of this invention. The content ratio of the acrylate ester in the monomer component constituting the polymer (A) is preferably 40% by weight or more, more preferably 50% by weight or more, and further preferably 60% by weight or more as a lower limit. The upper limit is preferably 97% by weight or less, more preferably 95% by weight or less, still more preferably 93% by weight or less, and particularly preferably 91% by weight. % Or less.

  When the content ratio of the acrylate ester in the monomer component constituting the polymer (A) is less than 40% by weight, the peeling force between the pressure-sensitive adhesive layer and the die-bonding film becomes too large, and the pickup property may be lowered. is there.

  When the content ratio of the acrylic acid ester in the monomer component constituting the polymer (A) exceeds 97% by weight, the curability of the polymer (P) due to ultraviolet irradiation is lowered, and the pickup property may be lowered.

  Examples of the carboxyl group-containing monomer include (meth) acrylic acid, carboxyethyl (meth) acrylate, carboxypentyl (meth) acrylate, itaconic acid, maleic acid, fumaric acid, and crotonic acid. The carboxyl group-containing monomer is particularly preferably at least one selected from (meth) acrylic acid and carboxyalkyl (meth) acrylate.

  Only one type of carboxyl group-containing monomer may be used, or two or more types may be used in combination.

  Arbitrary appropriate content rates can be employ | adopted for the content rate of the carboxyl group-containing monomer in the monomer component which comprises a polymer (A) in the range which does not impair the effect of this invention. The content ratio of the carboxyl group-containing monomer in the monomer component constituting the polymer (A) is preferably 3% by weight or more, more preferably 5% by weight or more, and further preferably 7% by weight or more, as a lower limit. The upper limit is preferably 20% by weight or less, more preferably 18% by weight or less, still more preferably 16% by weight or less, and particularly preferably 15% by weight or more. % By weight or less.

  When the content ratio of the carboxyl group-containing monomer in the monomer component constituting the polymer (A) is less than 3% by weight, the curability of the polymer (P) due to ultraviolet irradiation is lowered, and the pickup property may be lowered.

  When the content ratio of the carboxyl group-containing monomer in the monomer component constituting the polymer (A) exceeds 20% by weight, the amount of residual carboxyl groups in the pressure-sensitive adhesive layer increases, and the interaction with the die bond film increases. As a result, the peelability may be reduced, and the pick-up property may be reduced.

  The monomer component constituting the polymer (A) may contain other monomers copolymerizable with the acrylate ester as necessary for the purpose of modifying cohesive strength, heat resistance and the like.

  Examples of other monomers include 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate, 6-hydroxyhexyl (meth) acrylate, (meth ) Hydroxyl group-containing monomers such as 8-hydroxyoctyl acrylate, 10-hydroxydecyl (meth) acrylate, 12-hydroxylauryl (meth) acrylate, (4-hydroxymethylcyclohexyl) methyl (meth) acrylate; maleic anhydride Acid anhydride monomers such as itaconic anhydride; styrene sulfonic acid, allyl sulfonic acid, 2- (meth) acrylamide-2-methylpropane sulfonic acid, (meth) acrylamide propane sulfonic acid, sulfopropyl (meth) acrylate, (meth ) Acrylio Sulfonic acid group-containing monomers shea naphthalene sulfonic acid; 2-hydroxyethyl acryloyl phosphate, etc. of a phosphate group-containing monomers; acrylamide; acrylonitrile; and the like.

  Other monomers may be used alone or in combination of two or more.

  Arbitrary appropriate content rates can be employ | adopted for the content rate of the other monomer in the monomer component which comprises a polymer (A) in the range which does not impair the effect of this invention. The content of other monomers in the monomer component constituting the polymer (A) is preferably 0% by weight or more as the lower limit, preferably 40% by weight or less, more preferably 35% as the upper limit. % Or less, and more preferably 30% by weight or less.

  When the content ratio of the other monomer in the monomer component constituting the polymer (A) exceeds 40% by weight, the peeling force between the pressure-sensitive adhesive layer and the die bond film becomes too large, and the pickup property may be reduced. The curability of the polymer (P) due to ultraviolet irradiation is lowered, and the pick-up property may be lowered.

  The polymer (A) is preferably obtained by polymerizing a monomer component containing an acrylate ester as a main monomer and a carboxyl group-containing monomer.

  Any appropriate method can be adopted as a polymerization method. Examples of the polymerization method include solution polymerization, emulsion polymerization, bulk polymerization, suspension polymerization and the like.

  Examples of the oxazoline group-containing compound (B) having an oxazoline group and a radical-reactive carbon-carbon double bond include 2-vinyl-2-oxazoline, 4-methyl-2-vinyl-2-oxazoline, 5-methyl- 2-vinyl-2-oxazoline, 2-vinyl-4,4-dimethyl-2-oxazoline, 2-isopropenyl-2-oxazoline, 4-methyl-2-isopropenyl-2-oxazoline, 5-methyl-2- Examples include isopropenyl-2-oxazoline and 2-isopropenyl-4,4-dimethyl-2-oxazoline.

  Only 1 type may be used for an oxazoline group containing compound (B), and it may use 2 or more types together.

  The amount of the oxazoline group-containing compound (B) to be used is preferably 80 mol% or more, more preferably 85 mol%, as a lower limit with respect to the carboxyl group-containing monomer in the monomer component constituting the polymer (A). More preferably, it is 90 mol% or more, and the upper limit is preferably 150 mol% or less, more preferably 100 mol% or less, and further preferably 98 mol% or less.

  When the amount of the oxazoline group-containing compound (B) used is less than 80 mol% with respect to the carboxyl group-containing monomer in the monomer component constituting the polymer (A), the amount of residual carboxyl groups in the pressure-sensitive adhesive layer is large. Therefore, the peelability is lowered due to the high interaction with the die bond film, and the pickup property may be lowered.

  When the amount of the oxazoline group-containing compound (B) used exceeds 150 mol% with respect to the carboxyl group-containing monomer in the monomer component constituting the polymer (A), the residual oxazoline group-containing compound (B ) And the amount of the low molecular weight substance derived therefrom, the peel force between the pressure-sensitive adhesive layer and the die-bonding film becomes too large, and the pick-up property may decrease, and the residual oxazoline group-containing compound ( The volatilization of B) may increase the impact on the environment and human body.

  Any appropriate reaction method can be adopted as a method of obtaining the polymer (P) by reacting the polymer (A) with the oxazoline group-containing compound (B). For example, the oxazoline group-containing compound (B) is added to the polymer (A) to any appropriate reaction conditions (for example, a reaction temperature in the range of 20 to 70 ° C., a reaction time of 10 to 100 hours in air). And a method of performing an addition reaction.

  The cured product of the polymer (P) can be obtained by causing the polymer (P) to undergo a crosslinking reaction by ultraviolet irradiation.

  In order to cause the polymer (P) to undergo a crosslinking reaction by ultraviolet irradiation, any appropriate crosslinking agent and any appropriate photopolymerization initiator are preferably used for the polymer (P).

  Examples of the crosslinking agent include polyisocyanate compounds, epoxy compounds, aziridine compounds, melamine-based crosslinking agents, and the like.

  Only 1 type may be used for a crosslinking agent and it may use 2 or more types together.

  Any appropriate amount of the cross-linking agent can be adopted depending on the type of the polymer (P). The amount of the crosslinking agent used is, for example, preferably 0.01% by weight or more, more preferably 0.1% by weight or more, preferably 0.1% by weight or more, preferably as the upper limit, relative to the polymer (P). It is 20 weight% or less, More preferably, it is 10 weight% or less.

  Examples of the photopolymerization initiator include 4- (2-hydroxyethoxy) phenyl (2-hydroxy-2-propyl) ketone, α-hydroxy-α, α′-dimethylacetophenone, 2-methyl-2-hydroxypropio Α-ketol compounds such as phenone and 1-hydroxycyclohexyl phenyl ketone; methoxyacetophenone, 2,2-dimethoxy-2-phenylacetophenone, 2,2-diethoxyacetophenone, 2-methyl-1- [4- (methylthio) Acetophenone compounds such as -phenyl] -2-morpholinopropane-1; benzoin ether compounds such as benzoin ethyl ether, benzoin isopropyl ether and anisoin methyl ether; ketal compounds such as benzyldimethyl ketal; 2-naphthalenesulfonyl chloride Aromatic sulfonyl chloride compounds such as 1; -phenone-1,1-propanedione-2- (o-ethoxycarbonyl) oxime; photoactive oxime compounds such as benzophenone, benzoylbenzoic acid, 3,3′-dimethyl Benzophenone compounds such as -4-methoxybenzophenone; thioxanthone, 2-chlorothioxanthone, 2-methylthioxanthone, 2,4-dimethylthioxanthone, isopropylthioxanthone, 2,4-dichlorothioxanthone, 2 Thioxanthone compounds such as 1,4-diethylthioxanthone and 2,4-diisopropylthioxanthone; camphorquinone; halogenated ketone; acyl phosphinoxide; acyl phosphonate;

  Only 1 type may be used for a photoinitiator and it may use 2 or more types together.

  Arbitrary appropriate quantity can be employ | adopted for the usage-amount of a photoinitiator by the kind etc. of polymer (P). The use amount of the photopolymerization initiator is, for example, as a lower limit for the polymer (P), preferably 0.01% by weight or more, more preferably 0.05% by weight or more, Preferably it is 20 weight% or less, More preferably, it is 10 weight% or less.

  The pressure-sensitive adhesive layer may contain other components in addition to the polymer (P) cured product as long as the effects of the present invention are not impaired.

  Examples of other components include an uncured polymer (P); a compound that reacts with a carboxyl group; an ultraviolet curable monomer; an ultraviolet curable oligomer; an additive such as a tackifier and an antiaging agent; .

  A compound that reacts with a carboxyl group can be used, for example, to adjust the amount of residual carboxyl group present in the pressure-sensitive adhesive layer. Any appropriate amount of the compound that reacts with the carboxyl group may be used as long as the effects of the present invention are not impaired.

  Examples of the compound that reacts with a carboxyl group include an amino group-containing compound, an epoxy group-containing compound, an isocyanate group-containing compound, and a carbodiimide group-containing compound.

  Only 1 type may be used for the compound which reacts with a carboxyl group, and 2 or more types may be used together.

  The ultraviolet curable monomer or the ultraviolet curable oligomer can be used, for example, to adjust the adhesive strength before ultraviolet irradiation or the adhesive strength after ultraviolet irradiation.

  Examples of the ultraviolet curable monomer include urethane (meth) acrylate, trimethylolpropane tri (meth) acrylate, tetramethylolmethane tetra (meth) acrylate, pentaerythritol tri (meth) acrylate, pentaerythritol tetra (meth) acrylate, Examples thereof include dipentaerystol monohydroxypenta (meth) acrylate, dipentaerythritol hexa (meth) acrylate, 1,4-butanediol di (meth) acrylate and the like.

  Only one type of ultraviolet curable monomer may be used, or two or more types may be used in combination.

  Examples of the ultraviolet curable oligomer include urethane oligomers, polyether oligomers, polyester oligomers, polycarbonate oligomers, polybutadiene oligomers, and the like.

  Only 1 type may be used for an ultraviolet curable oligomer and it may use 2 or more types together.

  The molecular weight of the ultraviolet curable oligomer is preferably 100 to 30000.

  Any appropriate amount of the ultraviolet curable monomer and the ultraviolet curable oligomer may be used as long as the effects of the present invention are not impaired. The total amount of the ultraviolet curable monomer and the ultraviolet curable oligomer used is, for example, preferably 5% by weight or more, more preferably 40% by weight or more as a lower limit value with respect to the polymer (P). The upper limit is preferably 500% by weight or less, and more preferably 150% by weight or less.

  The acid value of the pressure-sensitive adhesive layer is preferably 10 or less. When the acid value of the pressure-sensitive adhesive layer exceeds 10, the amount of residual carboxyl groups in the pressure-sensitive adhesive layer increases, and the releasability decreases due to an increase in interaction with the die bond film, resulting in a decrease in pickup performance. There is a fear.

  The acid value of the pressure-sensitive adhesive layer can be adjusted by adjusting the amount of various compounds such as the oxazoline group-containing compound (B) that can be used in forming the pressure-sensitive adhesive layer.

  The acid value can be evaluated according to JIS K 0070-1992 (potentiometric titration method).

  Arbitrary appropriate methods can be employ | adopted as a method of forming an adhesive layer. Examples of the method for forming the pressure-sensitive adhesive layer include a method for directly forming the pressure-sensitive adhesive layer on the substrate and a method for transferring the pressure-sensitive adhesive layer provided on the separator onto the substrate.

  In the pressure-sensitive adhesive layer, curing of the polymer (P) by ultraviolet irradiation may be performed before the die bond film is bonded, or may be performed after the die bond film is bonded.

  In the pressure-sensitive adhesive layer, the polymer (P) can be cured by ultraviolet irradiation, as shown in FIG. 2, only a part of the polymer (P) can be cured by ultraviolet irradiation (the cured portion is the portion 2a, the uncured portion). Part 2b).

  Any appropriate method can be adopted as a method of partially curing the polymer (P) by ultraviolet irradiation. As a method of partially curing the polymer (P) by ultraviolet irradiation, for example, a method of partially irradiating ultraviolet rays or a method of providing a material that shields ultraviolet rays on at least one side of a substrate by printing or vapor deposition is used. Can be mentioned.

The cumulative amount of irradiated ultraviolet light for curing the polymer (P) is preferably 50 to 500 mJ / cm ² . By setting the cumulative amount of irradiation of ultraviolet rays for curing the polymer (P) within the above range, it is possible to maintain adhesiveness that can suppress the occurrence of so-called “chip jump” during dicing, and at the time of pickup. Can exhibit good pickup properties.

  When the polymer (P) is irradiated with ultraviolet rays and curing inhibition occurs due to oxygen, it is preferable to block oxygen from the surface of the pressure-sensitive adhesive layer. Examples of the method for blocking oxygen include a method in which the surface of the pressure-sensitive adhesive layer is covered with a separator, and a method in which ultraviolet irradiation is performed in an atmosphere of an inert gas such as nitrogen gas.

  Arbitrary appropriate thickness can be employ | adopted for the thickness of an adhesive layer. The thickness of the pressure-sensitive adhesive layer is, for example, preferably 1 μm or more as a lower limit, more preferably 2 μm or more, still more preferably 5 μm or more, and the upper limit is preferably 50 μm or less, more preferably. It is 30 μm or less, more preferably 25 μm or less. When the thickness of the pressure-sensitive adhesive layer is in the above range, chipping of the chip cut surface can be prevented and the die bond film can be supported in a well-balanced manner in terms of both adhesiveness and peelability.

<< A-3. Die bond film >>
The dicing die-bonding film of the present invention has a dicing film having a pressure-sensitive adhesive layer on a substrate and a die-bonding film provided on the pressure-sensitive adhesive layer.

  For example, the die bond film may be composed of only a single adhesive layer, or two or more layers by appropriately combining thermoplastic resins having different glass transition temperatures or thermosetting resins having different thermosetting temperatures. A multilayer structure may be used.

  Since cutting water is used in the dicing process of the semiconductor wafer, the die bond film may absorb moisture, resulting in a moisture content higher than normal. When a die bond film having such a high water content is bonded to a substrate or the like, water vapor may accumulate at the bonding interface in the after-curing stage, and floating may occur. Therefore, as a die-bonding adhesive, water vapor diffuses through the film at the stage of after-curing by adopting a structure in which a core material with high moisture permeability is sandwiched between the die-adhesives. It can be avoided.

  From the above viewpoint, the die bond film may have a multilayer structure in which an adhesive layer is formed on one side or both sides of the core material.

  Examples of the core material include a film (for example, a polyimide film, a polyester film, a polyethylene terephthalate film, a polyethylene naphthalate film, a polycarbonate film), a resin substrate reinforced with glass fiber or plastic non-woven fiber, a silicon substrate, A glass substrate etc. are mentioned.

  The die bond film includes an epoxy resin in the adhesive layer. Epoxy resins have the advantage of containing less ionic impurities that corrode semiconductor elements.

  The content ratio of the epoxy resin in the adhesive layer of the die bond film is a lower limit value, preferably 50% by weight or more, more preferably 70% by weight or more, further preferably 90% by weight or more, and particularly preferably 95% by weight or more. Yes, the upper limit is 100% by weight or less.

  Any appropriate epoxy resin can be adopted as the epoxy resin as long as it is generally used as an adhesive composition. Examples of the epoxy resin include bisphenol A type, bisphenol F type, bisphenol S type, brominated bisphenol A type, hydrogenated bisphenol A type, bisphenol AF type, biphenyl type, naphthalene type, fluorene type, phenol novolac type, and orthocresol. Bifunctional epoxy resins and polyfunctional epoxy resins such as novolak type, trishydroxyphenylmethane type, and tetraphenylolethane type; hydantoin type epoxy resin; trisglycidyl isocyanurate type epoxy resin; glycidylamine type epoxy resin;

  Only one type of epoxy resin may be used, or two or more types may be used in combination.

  Particularly preferable examples of the epoxy resin include novolak type epoxy resins, biphenyl type epoxy resins, trishydroxyphenylmethane type resins, and tetraphenylolethane type epoxy resins. These epoxy resins are rich in reactivity with a phenol resin as a curing agent, and are excellent in heat resistance and the like.

  In the adhesive layer of the die bond film, other thermosetting resins and thermoplastic resins may be included as necessary. These resins may be used alone or in combination of two or more.

  Examples of the thermosetting resin include phenol resin, amino resin, unsaturated polyester resin, polyurethane resin, silicone resin, thermosetting polyimide resin, and the like.

  As a curing agent for the epoxy resin, a phenol resin is preferable.

  The phenol resin can act as a curing agent for the epoxy resin. For example, a novolak type phenol resin such as a phenol novolak resin, a phenol aralkyl resin, a cresol novolak resin, a tert-butylphenol novolak resin, or a nonylphenol novolak resin; Resin; polyoxystyrene such as polyparaoxystyrene; and the like.

  As the phenol resin, a phenol novolac resin and a phenol aralkyl resin are particularly preferable. This is because the connection reliability of the semiconductor device can be improved.

  The blending ratio of the epoxy resin and the phenol resin is such that the hydroxyl group in the phenol resin per equivalent of epoxy group in the epoxy resin component is preferably at least 0.5 equivalent, more preferably at least 0.8 equivalent, as the lower limit. The upper limit is preferably 2.0 equivalents or less, more preferably 1.2 equivalents or less. If the blending ratio of the epoxy resin and the phenol resin is out of the above range, a sufficient curing reaction does not proceed, and the properties of the cured epoxy resin may be easily deteriorated.

  Examples of the thermoplastic resin include natural rubber, butyl rubber, isoprene rubber, chloroprene rubber, ethylene-vinyl acetate copolymer, ethylene-acrylic acid copolymer, ethylene-acrylic acid ester copolymer, polybutadiene resin, polycarbonate resin, Examples thereof include thermoplastic polyimide resins, polyamide resins such as 6-nylon and 6,6-nylon, phenoxy resins, acrylic resins, saturated polyester resins such as PET and PBT, polyamideimide resins, and fluorine resins.

  As the thermoplastic resin, an acrylic resin is particularly preferable in that it has few ionic impurities and high heat resistance, and can ensure the reliability of the semiconductor element.

  Any appropriate acrylic resin can be adopted as the acrylic resin. The acrylic resin has a linear or branched alkyl group having, for example, a lower limit value, preferably 4 or more, and an upper limit value, preferably 30 or less, more preferably 18 or less. The polymer obtained by superposing | polymerizing the monomer component containing 1 type, or 2 or more types of the ester of acrylic acid or methacrylic acid is mentioned.

  Examples of the alkyl group include a methyl group, ethyl group, propyl group, isopropyl group, n-butyl group, t-butyl group, isobutyl group, amyl group, isoamyl group, hexyl group, heptyl group, cyclohexyl group, 2- Examples include ethylhexyl group, octyl group, isooctyl group, nonyl group, isononyl group, decyl group, isodecyl group, undecyl group, lauryl group, tridecyl group, tetradecyl group, stearyl group, octadecyl group, dodecyl group and the like.

  Any appropriate other monomer may be contained in the monomer component forming the acrylic resin.

  Examples of other monomers include acrylic acid, methacrylic acid, carboxyethyl acrylate, carboxypentyl acrylate, itaconic acid, maleic acid, fumaric acid, crotonic acid, and other carboxyl group-containing monomers; maleic anhydride, itaconic anhydride, and other acids. Anhydride monomer; 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate, 6-hydroxyhexyl (meth) acrylate, (meth) acrylic acid 8 Hydroxyl group-containing monomers such as -hydroxyoctyl, 10-hydroxydecyl (meth) acrylate, 12-hydroxylauryl (meth) acrylate, (4-hydroxymethylcyclohexyl) -methyl acrylate; styrene sulfonic acid, allyl sulfonic acid, -Sulphonic acid group-containing monomers such as (meth) acrylamide-2-methylpropane sulfonic acid, (meth) acrylamide propane sulfonic acid, sulfopropyl (meth) acrylate, (meth) acryloyloxynaphthalene sulfonic acid; 2-hydroxyethylacryloyl phosphate And the like, and the like.

  Since the adhesive layer of the die bond film is previously crosslinked to some extent, a polyfunctional compound capable of reacting with a functional group at the molecular chain terminal of the polymer contained in the adhesive layer is used as a crosslinking agent in the production. It may be added. By adding such a polyfunctional compound, it is possible to improve adhesive properties at high temperatures and improve heat resistance. Only 1 type may be used for a polyfunctional compound and it may use 2 or more types together.

  Any appropriate other additive can be appropriately blended in the adhesive layer of the die bond film as necessary. Other additives may be used alone or in combination of two or more.

  Examples of other additives include flame retardants, silane coupling agents, and ion trapping agents.

  Examples of the flame retardant include antimony trioxide, antimony pentoxide, brominated epoxy resin, and the like.

  Examples of the silane coupling agent include β- (3,4-epoxycyclohexyl) ethyltrimethoxysilane, γ-glycidoxypropyltrimethoxysilane, γ-glycidoxypropylmethyldiethoxysilane, and the like.

  Examples of the ion trapping agent include hydrotalcites and bismuth hydroxide.

  Any appropriate thickness can be adopted as the thickness of the die bond film. The lower limit of the thickness of the die bond film is preferably 5 μm or more, and the upper limit is preferably 100 μm or less, more preferably 50 μm or less.

≪B. Manufacturing method of dicing die bond film >>
The manufacturing method of the dicing die-bonding film of this invention is demonstrated taking the dicing die-bonding film 11 (FIG. 2, FIG. 3 (a)) as an example.

  The substrate 1 can be formed by any appropriate film forming method. Examples of such a film forming method include a calendar film forming method, a casting method in an organic solvent, an inflation extrusion method in a closed system, a T-die extrusion method, a co-extrusion method, and a dry lamination method.

  Next, a composition containing a pressure-sensitive adhesive is applied on the substrate 1 and dried (heat-crosslinked as necessary) to form a pressure-sensitive adhesive layer. Examples of the method for applying the composition containing the pressure-sensitive adhesive include roll coating, screen coating, and gravure coating. The application may be performed directly on the substrate 1 or may be transferred to the substrate 1 after being applied to a release paper or the like whose surface has been subjected to a release treatment. Thereafter, the pressure-sensitive adhesive is cured by irradiating only a region slightly smaller than the portion to which the die-bonding film is bonded, to form a pressure-sensitive adhesive layer 2 including a cured portion 2a and an uncured portion 2b.

  Next, a forming material for forming the die bond film 3 is applied on the release paper so as to have a predetermined thickness, and further dried under predetermined conditions to form a coating layer. The die-bonding film 3 is formed by cutting this coating layer and transferring it onto the pressure-sensitive adhesive layer 2a.

  Alternatively, the die-bonding film 3 can also be formed by directly applying a forming material for forming the die-bonding film 3 on the pressure-sensitive adhesive layer 2a and then drying it under predetermined conditions.

  As described above, the dicing die-bonding film 11 according to the present invention can be obtained. In addition, in this example, although the ultraviolet irradiation to an adhesive is implemented before bonding a die-bonding film, you may implement after bonding a die-bonding film.

≪C. Manufacturing method of semiconductor device >>
The dicing die-bonding film of the present invention can be used as follows by appropriately peeling a separator arbitrarily provided on the die-bonding film. Hereinafter, a method for manufacturing a semiconductor device will be described with reference to FIG. 3, taking as an example the case where the dicing die-bonding film 11 is used.

  First, as shown to Fig.3 (a), the semiconductor wafer 4 is crimped | bonded on the die-bonding film 3 'in the dicing die-bonding film 11, this is adhere | attached and hold | maintained (mounting process). This step is performed while pressing with a pressing means such as a pressure roll.

  Next, as shown in FIG. 3B, the semiconductor wafer 4 is diced (dicing step). By dicing, the semiconductor wafer 4 is cut into a predetermined size and separated into individual pieces to manufacture the semiconductor chip 5. For example, dicing is performed from the circuit surface side of the semiconductor wafer 4 according to a conventional method. In this step, for example, a cutting method called full cut for cutting up to the dicing die-bonding film 11 can be adopted. Any appropriate apparatus can be used as the dicing apparatus used in this step. Since the semiconductor wafer is bonded and fixed by the dicing die bond film 11, chip chipping and chip jump can be suppressed, and damage to the semiconductor wafer 4 can also be suppressed.

  Next, as shown in FIG. 3C, the semiconductor chip 5 is picked up in order to peel off the semiconductor chip adhered and fixed to the dicing die bond film 11 (pickup process). Any appropriate method can be adopted as the pickup method. Examples of the pick-up method include a method in which each semiconductor chip 5 is pushed up by a needle from the dicing die-bonding film 11 side, and the pushed-up semiconductor chip 5 is picked up by a pickup device.

  Next, as shown in FIG. 3D, the picked-up semiconductor chip 5 is bonded and fixed to the adherend 6 through the die-bonding film 3a (die-bonding step). The adherend 6 is placed on the heat block 9. Examples of the adherend 6 include a lead frame, a TAB film, a substrate, and a separately manufactured semiconductor chip. The adherend 6 may be, for example, a deformable adherend that can be easily deformed, or a non-deformable adherend (such as a semiconductor wafer) that is difficult to deform. . Any appropriate substrate can be adopted as the substrate. Examples of the lead frame include a metal lead frame such as a Cu lead frame and a 42 Alloy lead frame, an organic substrate made of glass epoxy, BT (bismaleimide-triazine), polyimide, and the like. The adherend 6 may be a circuit board that can be used by mounting a semiconductor element and electrically connecting the semiconductor element. In the case where the die bond film 3a is a thermosetting type, the semiconductor chip 5 is bonded and fixed to the adherend 6 by heat curing to improve the heat resistance strength. In addition, what the semiconductor chip 5 adhere | attached and fixed to the board | substrate etc. via the semiconductor wafer bonding part 3a can be used for a reflow process.

  Subsequently, as shown in FIG. 3 (e), a wire for electrically connecting the tip of the terminal portion (inner lead) of the adherend 6 and an electrode pad (not shown) on the semiconductor chip 5 with a bonding wire 7. Bonding is performed (bonding process). Thereafter, the semiconductor chip is sealed with a sealing resin 8, and the sealing resin 8 is after-cured.

  Thus, the semiconductor device is manufactured.

  EXAMPLES Hereinafter, although an Example demonstrates this invention concretely, this invention is not limited to these Examples at all. In addition, the test and evaluation method in an Example etc. are as follows. Moreover, a part means a weight part.

<Measurement of glass transition temperature>
Using a dynamic viscoelasticity measuring device “ARES” manufactured by Rheometric Co., Ltd., using a jig with a sample thickness of about 1.5 mm and a φ7.9 mm parallel plate, a frequency of 1 Hz, and a heating rate of 5 ° C./min. The temperature at the peak point of the obtained loss modulus was taken as the glass transition temperature.

<Evaluation of pickup property>
Using the dicing die-bonding film in each example and comparative example, picking up was performed after dicing the semiconductor wafer in the following manner, and the pick-up property of each dicing die-bonding film was evaluated.
A semiconductor wafer (diameter 8 inches, thickness 0.6 mm) was subjected to a back surface polishing process (grinding apparatus: “DFG-8560” manufactured by Disco Corporation), and a mirror wafer having a thickness of 0.075 mm was used as a workpiece.
After separating the separator from the dicing die-bonding film, the mirror wafer is roll-bonded onto the die-bonding film at 40 ° C. and bonded together (bonding device: “MA-3000II” manufactured by Nitto Seiki, bonding speed: 10 mm / min. , Pasting pressure: 0.15 MPa, stage temperature during pasting: 40 ° C.), and further dicing was performed. Dicing was fully cut so as to obtain a 10 mm square chip size.
Dicing conditions were as follows.
Dicing machine: “DFD-6361” manufactured by DISCO
Dicing ring: 2-8-1 (manufactured by Disco)
Dicing speed: 80mm / sec
Dicing blade (Z1): “2050HEDD” manufactured by DISCO
Dicing blade (Z2): “2050HEBB” manufactured by Disco Corporation
Dicing blade rotation speed (Z1): 40000 rpm
Dicing blade rotation speed (Z2): 40000 rpm
Blade height (Z1): 0.170 mm (depending on the thickness of the semiconductor wafer (0.170 mm when the wafer thickness is 75 μm))
Blade height (Z2): 0.085mm
Cut method: A mode / step cut Wafer chip size: 10.0 mm square Next, each dicing die-bonding film was stretched, and an expanding process was performed in which each chip had a predetermined interval.
Further, the semiconductor chip was picked up from the base material side of each dicing die-bonding film by a needle push-up method, and the pickup property was evaluated.
Specifically, when 400 semiconductor chips are picked up continuously and the success rate when both are performed under the conditions A and B shown in Table 1 is 100%, ◎ A case where the success rate was 100% and the success rate when it was performed under condition B was not 100%, and a case where the success rate was not 100% for both conditions A and B was indicated as x.

<Measurement of acid value>
The acid value was evaluated according to JIS K 0070-1992 (potentiometric titration method).
Specifically, 100 ml of acetone was added to about 3 g of the pressure-sensitive adhesive in the dried pressure-sensitive adhesive layer, and dissolved by stirring. To this, 25 ml of water was added and stirred. This solution was titrated with 0.05 mol / l sodium hydroxide solution. The number of mg of potassium hydroxide required to neutralize 1 g of the sample was taken as the acid value.

[Example 1]
<Production of dicing film>
In a reaction vessel equipped with a cooling pipe, a nitrogen introduction pipe, a thermometer, and a stirring device, 90 parts of 2-ethylhexyl acrylate (hereinafter referred to as “2EHA”), 10 parts of acrylic acid (hereinafter referred to as “AA”), 0.2 parts of benzoyl peroxide and 150 parts of ethyl acetate were added and polymerized in a nitrogen stream at 61 ° C. for 6 hours to obtain an acrylic polymer A.
To this acrylic polymer A, 12.8 parts of 2-vinyl-2-oxazoline (hereinafter referred to as “VO”) (95 mol% with respect to AA) was added, and an addition reaction treatment was performed at 50 ° C. for 48 hours in an air stream. As a result, an acrylic polymer A ′ was obtained. The glass transition temperature of the acrylic polymer A ′ was −49 ° C.
Next, with respect to 100 parts of acrylic polymer A ′, 4 parts of a polyisocyanate compound (trade name “Coronate L”, manufactured by Nippon Polyurethane Co., Ltd.) and a photopolymerization initiator (trade name “Irgacure 651”, Ciba Special) 5 parts) (manufactured by T Chemicals) was added to prepare an adhesive solution.
The pressure-sensitive adhesive solution was applied on the surface of the PET release liner that had been subjected to the silicone treatment, and heat-crosslinked at 120 ° C. for 2 minutes to form a pressure-sensitive adhesive layer having a thickness of 10 μm.
Next, a polyolefin film having a thickness of 100 μm was bonded to the surface of the pressure-sensitive adhesive layer.
After storing at 50 ° C. for 24 hours, a portion to which the die bond film was bonded was irradiated with ultraviolet rays to produce a dicing film. Ultraviolet irradiation (ultraviolet (UV) irradiation apparatus: “UM-810” manufactured by Nitto Seiki Co., Ltd., ultraviolet irradiation integrated light quantity: 300 mJ / cm ² ) was performed from the polyolefin film side.
<Production of die bond film>
Epoxy resin 1 (“Epicoat 1004” manufactured by JER Co., Ltd.) with respect to 100 parts of an acrylic ester polymer (“Paraklon W-197CM” manufactured by Negami Kogyo Co., Ltd.) mainly composed of ethyl acrylate-methyl methacrylate. 59 parts, epoxy resin 2 (“Epicoat 827” manufactured by JER Corporation) 53 parts, phenol resin (“Millex XLC-4L” manufactured by Mitsui Chemicals, Inc.) 121 parts, spherical silica (manufactured by Admatechs Corporation “SO” −25R ”) 222 parts were added and dissolved in methyl ethyl ketone to obtain an adhesive composition solution having a concentration of 23.6% by weight.
The obtained adhesive composition solution was applied as a release liner (separator) onto a release film made of a polyethylene terephthalate film having a thickness of 38 μm after silicone release treatment, and then dried at 130 ° C. for 2 minutes. . Thus, a die bond film having a thickness of 25 μm was produced.
<Production of dicing die bond film>
The die bond film was transferred to the pressure-sensitive adhesive layer side of the dicing film to produce a dicing die bond film (1).
Various evaluation was performed about the obtained dicing die-bonding film (1). The results are shown in Table 2.
In addition, the meaning of the abbreviation described in Table 2 is as follows.
2EHA: 2-ethylhexyl acrylate i-OA: isooctyl acrylate BA: n-butyl acrylate AA: acrylic acid VO: 2-vinyl-2-oxazoline

[Examples 2 to 5]
Dicing die-bonding films (2) to (5) were produced in the same manner as in Example 1 except that the composition and content shown in Table 2 were changed.
Various evaluation was performed about the obtained dicing die-bonding films (2) to (5). The results are shown in Table 2.

[Comparative Examples 1-2]
Dicing die-bonding films (C1) to (C2) were produced in the same manner as in Example 1 except that the composition and content shown in Table 2 were changed.
Various evaluation was performed about the obtained dicing die-bonding films (C1) to (C2). The results are shown in Table 2.

  As shown in Table 2, it can be seen that the dicing die-bonding film of the present invention has good pickup properties. That is, the dicing die-bonding film of the present invention has a good balance between a good holding force for the semiconductor wafer during dicing and a good peelability that allows the semiconductor chip after dicing to be peeled off from the substrate integrally with the die-bonding film. It can be seen that it is well expressed. Moreover, since the dicing die-bonding film of this invention does not use the tin-type catalyst used with the conventional adhesive, it turns out that it does not have a bad influence on an environment. Furthermore, in the dicing die-bonding film of the present invention, it can be seen that volatile substances remaining in the pressure-sensitive adhesive layer can be suppressed, so that it does not adversely affect the environment and the human body and is easy to handle.

  The dicing die-bonding film of the present invention can be suitably used, for example, for dicing a workpiece (semiconductor wafer or the like) when manufacturing a semiconductor device.

DESCRIPTION OF SYMBOLS 1 Base material 2 Adhesive layer 2a Cured part 2b of an adhesive layer Uncured part 3 of an adhesive layer 3 Die bond film 3 'Die bond film 3a Die bond film 4 Semiconductor wafer 5 Semiconductor chip 5
6 Substrate 7 Bonding wire 8 Sealing resin 9 Heat block 10 Dicing die bond film 11 Dicing die bond film

Claims (5)

A dicing film having a pressure-sensitive adhesive layer on a substrate, and a dicing film having a die-bonding film provided on the pressure-sensitive adhesive layer,
The pressure-sensitive adhesive layer contains a cured product of polymer (P) by ultraviolet irradiation,
The polymer (P) includes a polymer (A) composed of a monomer component including an acrylic acid ester as a main monomer and a carboxyl group-containing monomer, and an oxazoline group having a oxazoline group and a radical-reactive carbon-carbon double bond. Obtained by reacting with compound (B),
The die bond film includes an epoxy resin,
Dicing die bond film.   The dicing die-bonding film according to claim 1, wherein the carboxyl group-containing monomer is at least one selected from (meth) acrylic acid and carboxyalkyl (meth) acrylate.   The oxazoline group-containing compound (B) is 2-vinyl-2-oxazoline, 4-methyl-2-vinyl-2-oxazoline, 5-methyl-2-vinyl-2-oxazoline, 2-vinyl-4,4- Dimethyl-2-oxazoline, 2-isopropenyl-2-oxazoline, 4-methyl-2-isopropenyl-2-oxazoline, 5-methyl-2-isopropenyl-2-oxazoline, and 2-isopropenyl-4,4 The dicing die-bonding film according to claim 1 or 2, which is at least one selected from -dimethyl-2-oxazoline. The dicing product according to any one of claims 1 to 3, wherein the acrylic ester is an acrylic ester represented by CH ₂ = CHCOOR (wherein R is an alkyl group having 6 to 10 carbon atoms). Die bond film. The dicing die-bonding film according to any one of claims 1 to 4, wherein the polymer (P) has a glass transition temperature of -70 ° C to -10 ° C.

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