JP2012009580A - Manufacturing method of mounting structure - Google Patents

Abstract

An object of the present invention is to provide a method for manufacturing a mounting structure having a small area, in which a component interval between an SMD component and a semiconductor chip is narrowed for miniaturization of a module, and both components can be efficiently mounted together.
A step of forming an electrode bonding material 105 for connecting to an electrode portion 114 of an SMD component 113 on a first electrode portion 103 of a circuit board 101, and an insulating resin in a region where an IC chip 107 is mounted 110, a step of mounting the IC chip 107 in the region to which the insulating resin 110 is supplied, a step of selectively spreading the insulating resin 110 to the outer periphery, and an SMD component 113 on the electrode bonding material 105 And a step of heating the electrode bonding material 105 and the insulating resin 110 together.
[Selection] Figure 1

Description

  The present invention relates to an electronic circuit printed circuit board (hereinafter, the electronic circuit printed circuit board is simply referred to as a circuit board, which means an object to be mounted such as an interposer or other component on which an electronic component is mounted). The present invention relates to a manufacturing method for manufacturing a mounting structure in which an electronic component is mounted.

  Currently, electronic circuit boards are used in all products, their performance is improved, and the frequencies used on circuit boards are increasing. As a method for mounting an electronic device using a high frequency, flip chip mounting with low impedance is suitable.

  As the number of portable devices increases, flip chip mounting is required in which an IC chip is mounted on a circuit board in a bare state (bare IC) instead of a package. In addition to flip chips, CSP (Chip Size Package), BGA (Ball Grid Array), and the like have been used.

  In recent years, there has been a demand for a structure and a manufacturing method for mounting a flip chip mounting component and an SMD component (surface mounting component) in a mixed manner on one circuit board in order to reduce the size of the module.

  Conventionally, as a manufacturing method of a structure in which a flip chip mounting component such as a semiconductor component (IC chip) and an SMD component are mixedly mounted on one circuit board, the electrode surface by the solder flux used for mounting the SMD component In order to prevent contamination, a method is first used in which semiconductor components are flip-chip mounted, solder is supplied by special printing using an emboss mask, etc., SMD components are mounted, and heated by a reflow furnace or the like. Yes.

  3A to 3E illustrate a conventional method for manufacturing a structure in which a flip chip mounting component such as an IC chip and an SMD component are mixedly mounted on a circuit substrate of an electronic device. It is a cross-sectional schematic diagram for this.

  3A is a step of flip-chip mounting a semiconductor such as an IC chip on a circuit board, FIG. 3B is a step of sealing the flip-chip mounted semiconductor with an insulating resin, and FIG. A step of applying an electrode bonding material using an emboss mask to mount the SMD component, FIG. 3D shows a step of mounting the SMD component on the applied electrode bonding material, FIG. 3E shows a reflow furnace, etc. The structure figure after heating an electrode bonding material using is shown, respectively.

  3A to 3E, reference numeral 301 denotes a circuit board, 302 denotes an electrode part of the circuit board 301, 303 denotes a first electrode part of the circuit board 301, 304 denotes a second electrode part of the circuit board 301, 305 Is an electrode bonding material, 307 is a second electronic component (IC chip), 308 is an electrode part of the second electronic component 307, 309 is a protruding electrode (bump), 312 is a mounting tool, 313 is a first electronic component ( SMD parts) 314 is an electrode portion of the first electronic component 313, 315 is an insulating resin, 316 is an insulating resin application tool, and 317 is an embossing mask for applying an electrode bonding material.

  First, as shown in FIG. 3A, for example, bumps 309 are formed on the electrode portions 308 of the second electronic component 307 such as an IC chip, and the second electrode of the circuit board 301 is used using the mounting tool 312. The bumps 309 of the second electronic component 307 are aligned and mounted so as to correspond to the part 304.

  Then, as shown in FIG. 3B, the insulating resin 315 is supplied between the second electronic component 307 and the circuit board 301 by using an insulating resin coating tool 316 such as a needle, and is cured by heating. .

  Next, as shown in FIG. 3C, on the first electrode portion 303 of the circuit board 301 other than the second electrode portion 304 corresponding to the bump 309 using the electrode bonding material application emboss mask 317. The electrode bonding material 305 is supplied.

  Then, as shown in FIG. 3D, the electrode portion 314 of the first electronic component 313 is aligned with the electrode bonding material 305 formed on the first electrode portion 303 of the circuit board 301. And implement.

  Finally, the electrode bonding material 305 is heated using a reflow furnace or the like, and the first electrode portion 303 of the circuit board 301 and the electrode portion 314 of the first electronic component 313 are electrically bonded, so that FIG. The structure shown in (e) is produced.

  4A to 4C show conventional structures in which the IC chip and the SMD component are mixedly mounted when the electrode portion of the circuit board has a narrow structure so that the distance between the IC chip and the SMD component is narrow. It is a cross-sectional schematic diagram for demonstrating this manufacturing method.

  4A to 4C, 401 is a circuit board, 402 is an electrode part of the circuit board 401, 403 is a first electrode part of the circuit board 401, 404 is a second electrode part of the circuit board 401, 407 Is a second electronic component (IC chip), 408 is an electrode part of the second electronic component 407, 409 is a protruding electrode (bump), 412 is a mounting tool, 415 is an insulating resin, 416 is an insulating resin coating tool is there.

  First, as illustrated in FIG. 4A, bumps 409 are formed on the electrode portions 408 of the second electronic component 407, and the bumps 409 are formed so as to face the second electrode portions 404 of the circuit board 401. Align and mount.

  Then, as shown in FIG. 4B, the insulating resin 415 is supplied between the second electronic component 407 and the circuit board 401 by using an insulating resin coating tool 416 such as a needle.

  Next, when the insulating resin 415 is cured by heating, the state shown in FIG. In this state, the insulating resin 415 rides on the first electrode portion 403 other than the second electrode portion 404 corresponding to the bump 409, and the SMD component cannot be mounted.

  If an insulating resin having a low viscosity (for example, 100 Pa · s or less) is used as the insulating resin 415, the insulating resin coating tool 416 sags and spreads on the first electrode portion 403. There are many cases in which a ride that adheres occurs.

  In addition, when the first electrode portion 403 is raised to reduce the rise of the insulating resin 415, when the component interval is narrow, the first electrode portion 403 is mounted when the second electronic component 407 is mounted. Since the mounting tool 412 collides, the first electrode portion 403 cannot be easily raised.

  For the purpose of shortening the tact time at the time of the mixed mounting and improving the reliability, after mounting the SMD component first, the sealing resin is applied, and finally the IC chip is mounted, and the resin is cured by batch reflow or the like. A method has also been proposed (see, for example, Patent Document 1).

  In addition, the IC chip is mounted by applying heat and pressure with the thermosetting adhesive applied, and after the thermosetting adhesive is semi-cured, the electrode bonding material for the SMD component is applied and the SMD component is mounted. Finally, a method of curing the resin at once by reflow has been proposed (see, for example, Patent Document 2).

  The pre-applied thermosetting adhesive used in these methods generally has a high viscosity (for example, 100 Pa · s or more).

JP 2004-356549 A JP 2002-299809 A

  However, in the method of mounting the SMD component after mounting the IC chip, the insulating resin for sealing the IC chip spreads over the mounting electrodes of the SMD component on the circuit board so as not to contaminate the electrode surface. Although it is necessary to increase the distance between the IC chip and the SMD component, the distance between the components is required to be 0.5 mm or more because of the design of the emboss mask, and the distance between the components cannot be reduced.

  On the other hand, even when the SMD component is mounted first, the IC chip is often lower in component height than the SMD component, and therefore mounting the IC chip adjacent to the SMD component having a higher component height is not possible. In the IC chip mounting tool, the holding surface of the IC chip is larger than the IC chip, and it is difficult to descend vertically, so a sufficient distance is required so that it does not hit the SMD component. The distance cannot be reduced.

  In the present invention, in consideration of the problems of the prior art, even when a low-viscosity insulating resin is used, an electrode on which a semiconductor electronic component is mounted on a circuit board and an electronic component including a passive component are mounted. An object of the present invention is to provide a method of manufacturing a mounting structure in which electrodes are formed at a narrow interval, the distance between components of both electronic components is made narrower than before, and the module can be miniaturized.

  In order to solve the above-mentioned problem, the invention according to claim 1 is a mounting structure in which a first electronic component made of passive components and a second electronic component made of semiconductor are mixedly mounted on the same circuit board surface. A method of manufacturing, comprising: forming an electrode bonding material on at least the first electrode with respect to a circuit board provided with at least a first electrode and a second electrode; and the second electronic component comprising: Supplying an insulating resin onto the circuit board to be mounted; and mounting the electrode of the second electronic component on the second electrode in the region on the circuit board to which the insulating resin is supplied. And a step of selectively flowing and spreading the insulating resin around the first electrode, a step of mounting the first electronic component on the first electrode on which an electrode bonding material is formed, The process of heating the insulating resin and the electrode bonding material together Characterized in that it has a.

  By this method, an electrode bonding material for bonding a first electronic component such as an SMD component is formed on an electrode of a circuit board, and an insulating resin is supplied to a region where the second electronic component such as an IC chip is mounted. The second electronic component is mounted on the insulating resin to obtain electrical bonding, and the first electronic component is electrode bonded by selectively spreading the insulating resin outside the region where the electrode bonding material exists. Since the insulating resin and the electrode bonding material are collectively heat-cured by mounting on the material, the distance between the first electronic component and the second component can be mounted in a narrow manner. Area modules can be manufactured.

  According to a second aspect of the present invention, in the method for manufacturing a mounting structure according to the first aspect, the periphery of at least one of the first electrode and the second electrode on the circuit board is made lower than the electrode surface. It is characterized by.

  By this method, the circuit board is lowered and the recesses are provided, so that when the insulating resin is poured and spread, the resin can be poured and spread more selectively, so that interference with the electrode bonding material can be reduced.

  The invention described in claim 3 is characterized in that, in the method for manufacturing a mounting structure according to claim 1 or 2, a resin having a viscosity of 1 to 70 Pa · s is used as the insulating resin.

  By this method, when the insulating resin is spread and spread, the viscosity of the insulating resin is low, so that it is difficult to get wet onto the first electrode to which the electrode bonding material is applied, thereby reducing interference with the electrode bonding material. Can do.

  According to a fourth aspect of the present invention, in the method for manufacturing a mounting structure according to any one of the first to third aspects, the electrode of the second electronic component is formed in the region of the circuit board where the insulating resin is supplied. In the step of mounting on the second electrode, the bump formed on the electrode of the second electronic component is mounted on the second electrode while applying an ultrasonic wave.

  By this method, the mounting of the second electronic component is securely connected by metal bonding with ultrasonic waves, and further the flow of the insulating resin is promoted by the vibration of ultrasonic waves, and the resin is flowed and spread well. Interference with the bonding material can be reduced.

  According to the present invention, the electrode bonding material for bonding the first electronic component such as the SMD component is formed on the electrode of the circuit board, and the insulating resin is applied to the region where the second electronic component such as the IC chip is mounted. Supply and mount the second electronic component on top of the insulating resin to obtain electrical bonding, and selectively spread and spread the first electronic component outside the region where the electrode bonding material exists. By mounting on the electrode bonding material and heat-curing the insulating resin and the electrode bonding material in a lump, the space between the first electronic component and the second component can be mounted in a mixed manner. It is possible to provide a mounting structure manufacturing method capable of manufacturing a small-area module.

  Furthermore, when the insulating resin is spread and spread, the interference with the electrode bonding material can be reduced, and the mounting structure that can be mounted in a narrow space between the first electronic component and the second electronic component. A manufacturing method can be provided.

(A)-(e) is a cross-sectional schematic diagram for demonstrating the manufacturing method of the mounting structure of Embodiment 1 of this invention. (A-1), (a-2), (b-1), (b-2) are plan views seen from the IC chip side of the circuit board used for manufacturing the mounting structure of the second embodiment of the present invention. , (C) is a schematic cross-sectional view of the mounting structure of the second embodiment. (A)-(e) is a cross-sectional schematic diagram for demonstrating the manufacturing method of the conventional mounting structure. (A)-(c) is a cross-sectional schematic diagram for demonstrating the manufacturing method of the other conventional mounting structure.

  Embodiments according to the present invention will be described below in detail with reference to the drawings.

(Embodiment 1)
As Embodiment 1 of the present invention, mounting is performed by mounting a first electronic component (for example, an SMD component such as a resistor, a capacitor, or a coil) and a second electronic component (for example, an IC chip) on a circuit board. A method for manufacturing the structure will be described.

  FIGS. 1A to 1E are schematic cross-sectional views for explaining a method for manufacturing a mounting structure according to the first embodiment, wherein 101 is a circuit board, 102 is an electrode portion of the circuit board 101, and 103 is a circuit. The first electrode part of the substrate 101, 104 is the second electrode part of the circuit board 101, 105 is the electrode bonding material, 106 is the mask for applying the electrode bonding material, 107 is the IC chip as the second electronic component, and 108 is The electrode portion of the IC chip 107, 109 is a protruding electrode (bump), 110 is an insulating resin, 111 is an insulating resin coating tool, 112 is a mounting tool, 113 is an SMD component as a first electronic component, and 114 is an SMD component 113 is an electrode portion.

  As shown in FIG. 1A, an electrode bonding material 105 is supplied to the first electrode 103 on the circuit board 101 by a screen printing method using an electrode bonding material application mask 106. Specifically, an electrode bonding material application mask 106 having openings provided in a predetermined pattern is arranged on the circuit board 101 and moved while pressing a squeegee against the electrode bonding material application mask 106. Printing is applied so that the electrode bonding material 105 has a uniform thickness. The electrode bonding material application mask 106 is preferably a metal mask (or metal), and the squeegee is preferably metal. After printing, the electrode bonding material application mask 106 is removed from the circuit board.

  Instead of the screen printing method, the electrode bonding material may be supplied to a predetermined region of the circuit wiring board by other methods such as ink jet, dispenser, impregnation, spin coating and the like.

  As the circuit board 101, ceramic multilayer board, FPC (flexible printed circuit board), glass cloth laminated epoxy board (glass epoxy board), glass cloth laminated polyimide resin board, or aramid non-woven cloth epoxy board (for example, “ALIVH” manufactured by Panasonic Corporation) (Resin multilayer substrate sold as (registered trademark)) or the like is used.

  As the first electrode part 103 and the second electrode part 104 on the circuit board 101, for example, Ni is plated on Cu and the surface is flash-plated with Au. Further, the electrode part 102 other than the IC chip 107 and the SMD component 113 mounted thereon may be the same as or different from the electrode parts 103 and 104.

  In the conventional circuit board, the distance between the first electrode and the second electrode is designed to be 0.5 mm or more. In the present embodiment, a circuit board designed with 0.3 mm is used. In the conventional circuit board, the reason why it is designed to be 0.5 mm or more is the design limit value of the embossing mask for printing, or when the component interval between the SMD component and the IC chip becomes narrow, the electrodes are short-circuited. This is because there is a possibility.

  In this embodiment, an emboss mask is not required, and the spread insulating resin 110 insulates the electrodes, so that the distance between the electrodes can be 0.5 mm or less.

  As the electrode bonding material 105, a metal bonding material such as cream solder, conductive paste, or nano paste is used.

  The solder composition of the cream solder is, for example, a tin alloy single or a mixture of those alloys, specifically Sn-Bi, Sn-In, Sn-Bi-In, Sn-Ag, Sn-Cu. Type, Sn-Ag-Cu type, Sn-Ag-Bi type, Sn-Cu-Bi type, Sn-Ag-Cu-Bi type, Sn-Ag-In type, Sn-Cu-In type, Sn-Ag- An alloy composition selected from the group consisting of Cu—In and Sn—Ag—Cu—Bi—In can be used. In particular, it is preferable to use an alloy composition selected from the group consisting of Sn—Ag and Sn—Ag—Cu.

  As a conductive paste, a single metal (for example, Au, Ag, Cu or an alloy, a mixture of a plurality of metals, or the solder composition described above) may be blended as conductive particles in an insulating resin. Things are used.

  In the nano paste, metal particles of nano-micron size (for example, a mixture of Au, Ag, Cu, etc. mixed with a dispersing agent) are vaporized by heating to metal-bond metal electrodes to each other.

  Next, as shown in FIG. 1B, the insulating resin 110 is applied to the region where the IC chip 107 is mounted on the circuit board 101 and / or by the insulating resin application tool 111 by, for example, a dispenser or an inkjet method. It supplies on the 2nd electrode part 104. FIG.

  As the insulating resin 110, various resins such as an insulating thermosetting resin (for example, epoxy resin, urethane resin, acrylic resin, polyimide resin, polyamide resin, bismaleimide, phenol resin, polyester resin, silicone resin, oxetane resin, etc.) Can be included). These insulating thermosetting resins may be used alone or in combination of two or more.

  Among the insulating thermosetting resins, an epoxy resin is particularly preferable. As the epoxy resin, an epoxy resin selected from the group of bisphenol type epoxy resin, polyfunctional epoxy resin, flexible epoxy resin, brominated epoxy resin, glycidyl ester type epoxy resin and polymer type epoxy resin can also be used. Among them, for example, bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, biphenyl type epoxy resin, naphthalene type epoxy resin, phenol novolak type epoxy resin, cresol novolak type epoxy resin and the like are preferably used. . Moreover, the epoxy resin which modified | denatured these is also used. These may be used alone or in combination of two or more.

  In some cases, an insulating thermoplastic resin (for example, poniphenylene sulfide (PPS), polycarbonate, modified polyphenylene oxide (PPO), etc.) can also be used. Moreover, what mixed the insulating thermoplastic resin in the insulating thermosetting resin etc. can be used. When only a thermoplastic resin is used, it is first softened by heating and then cured by stopping the heating and allowing it to cool naturally.

  On the other hand, when using a mixture of an insulating thermosetting resin and a thermoplastic resin, the thermosetting resin functions more dominantly, so heat it in the same way as with the thermosetting resin alone. To cure.

  In this embodiment, a case where an insulating thermosetting resin is used as a representative example will be described.

  The curing agent used in combination with the insulating thermosetting resin as described above is a compound selected from the group of thiol compounds, modified amine compounds, polyfunctional phenol compounds, imidazole compounds, and acid anhydride compounds. Can be used. These may be used alone or in combination of two or more.

  In the present embodiment, circuit wiring or an electrode portion 108 is formed on the surface of an IC chip 107 as an example of the second electronic component. In this example, an Al pad electrode is formed as the electrode portion 108. The electrode material may be Au, Cu, or the like, or may be an electrode that is plated with Ni and then plated with metal as a base.

  A wire bonding apparatus or the like is used for the electrode portion 108 on the IC chip 107 to form a metal wire (for example, a gold wire or a wire of tin, aluminum, copper, or an alloy in which a trace element is contained in these metals). Heat and ultrasonic waves are applied to bond to the electrode portion 108, and the bump (projection electrode) 109 is formed so that the end is torn and the tip is narrowed while pressing to increase the area of the bonded portion.

  Next, as shown in FIG. 1B, in the electronic component mounting apparatus, the IC chip 107 in which the bump 109 is formed on the electrode portion 108 is sucked and held by the heated mounting tool 112 at the tip of the component holding member. However, the IC chip 107 is aligned with the circuit board 101 prepared in the previous step so as to be positioned on the second electrode portion 104 of the circuit board 101 corresponding to the bump 109 of the IC chip 107. To do. Thereafter, the IC chip 107 is pressed and mounted on the circuit board 101. A known position recognition operation is used for this alignment.

  The load at the time of the press mounting may be such a load that the head of the bump 109 comes into contact with the electrode portion 104 of the circuit board 101 and is deformed to obtain conduction. Further, the temperature of the mounting tool 112 is lower than the temperature at which the insulating resin 110 is completely cured, and is preferably set to a temperature at which the viscosity of the insulating resin 110 is the lowest.

  After mounting the IC chip 107, as shown in FIG. 1C, the insulating resin 110 wets and spreads to the periphery of the first electrode portion 103 on which the electrode bonding material 105 on the circuit board 101 is applied. At this time, the wetting and spreading may contact the electrode bonding material 105 at the maximum, but the electrode bonding material 105 is not covered.

  In the present embodiment, the viscosity of the insulating resin 110 is lower than the viscosity of the electrode bonding material 105, and the IC resin 107 is not set at a high temperature at which the insulating resin 110 starts to be cured when the IC chip 107 is mounted. The electrode bonding material 105 is not completely covered.

  Next, as shown in FIG. 1D, an electrode bonding material on the circuit board 101 corresponding to the electrode portion 114 of the SMD component 113 which is the first electronic component (passive component) using a chip mounting machine or the like. The SMD component 113 is mounted on the circuit board 101 after being aligned so as to be positioned on the first electrode portion 103 to which 105 is applied. A known position recognition operation is used for this alignment.

  Next, using a heating furnace such as an oven or a reflow furnace, the temperature is higher than the temperature at which the insulating resin 110 is completely cured, and the electrode bonding material 105 is the electrode part 114 of the SMD component 113 and the electrode part 103 of the circuit board 101. Are heated to a temperature at which they are electrically conducted to produce a structure as shown in FIG.

(Embodiment 2)
Mounting produced by bonding a first electronic component (for example, an SMD component such as a resistor, a capacitor, or a coil) and a second electronic component (for example, an IC chip) according to Embodiment 2 of the present invention to a circuit board A method for manufacturing the structure will be described. In the following description, members corresponding to those described with reference to FIG.

  In the second embodiment, the same manufacturing method and apparatus as those in the first embodiment described with reference to FIG. 1 are used, but only the circuit board to be used is different from that in the first embodiment.

  2A-1 and 2B-1 are plan views of a circuit board used in the second embodiment, and FIGS. 2A-2 and 2B-2 are FIGS. FIG. 2C is a plan view of the circuit board after mounting the SMD component in (b-1), and FIG. 2C is a schematic cross-sectional view of the mounting structure of the second embodiment.

  The circuit board 101 of the second embodiment is different from the circuit board used in the first embodiment in that the peripheral portion of the first electrode portion 103, the peripheral portion of the second electrode 104, and the IC chip 107 are mounted. This is that the region on the substrate 101 is made lower than the electrode portion to provide the recess 215.

  In the configuration shown in FIG. 2 (b-1), the first electrode portion 103 is arranged on two sides with the direction rotated by 90 °, unlike the configuration shown in FIG. 2 (a-1). However, this is one configuration example, and the 1-4 sides may be arranged in this way.

  Due to the difference in height, the spread of the insulating resin 110 after the IC chip 107 is mounted can be controlled, and the insulating resin can be flowed to a necessary portion (FIG. 2C).

  The depth of the concave portion 215 is more effective as it is deeper, but is preferably 30 to 150 μm so as not to change the original properties of the circuit board 101.

(Embodiment 3)
In the third embodiment of the present invention, the same manufacturing method and apparatus as those in the first embodiment shown in FIG. 1 are used, and cream solder is used as the electrode bonding material 105 to be used.

(Embodiment 4)
In the fourth embodiment of the present invention, the same manufacturing method and apparatus as those in the first embodiment shown in FIG. 1 are used, and a conductive adhesive is used as the electrode bonding material 105 to be used.

  Many common conductive adhesives have a curing temperature close to that of an insulating resin, for example, 150 to 200 ° C., and can lower the temperature at the time of batch curing at the end of the process.

(Embodiment 5)
In the fifth embodiment of the present invention, the same manufacturing method and apparatus as those in the first embodiment shown in FIG. 1 are used, and the viscosity of the insulating resin 110 to be used is as low as about 1 to 70 Pa · s. An insulating resin having a viscosity is used.

  Generally used insulating resin for pre-coating for semiconductors has a high viscosity for maintaining the shape after coating, for example, 100 Pa · s or more, but the viscosity is 70 Pa · s or less as in the fifth embodiment. By doing so, the fluidity of the insulating resin 110 after mounting the IC chip 107 is improved.

(Embodiment 6)
In the sixth embodiment of the present invention, the same manufacturing method and apparatus as those in the first embodiment shown in FIG. 1 are used, and heating / heating when mounting the IC chip 107 in the electronic component mounting apparatus is performed. During pressure treatment, mounting is performed while applying ultrasonic waves.

  By applying the ultrasonic wave, the electrical connection between the bump 109 and the electrode of the circuit board 101 is improved as compared with the case where only the heating / pressurizing process is performed. Specifically, metal-to-metal bonding can be obtained.

  Next, the effect of the embodiment of the present invention will be specifically described based on examples and comparative examples.

(Example)
In this embodiment, an IC chip 107 which is the second electronic component (semiconductor) is an IC chip having a thickness of 36 μm and an Al pad electrode (size: 70 × 70 μm) on each side of a Si substrate having a thickness of 300 μm and 6 mm ^2. used. Among the electrodes of this IC chip 107, each side pad is spaced apart and using an Au wire with a diameter of 25 μm, the diameter of the electrode joint is 50 μm and the height is 65 μm (the diameter decreases toward the tip, Bump 109 is created. In this way, 18 bumps were formed on each side of the IC chip 107.

  In addition, as the SMD component 113 which is the first electronic component (passive component), a 0603 size 0Ω resistor (for example, manufactured by Panasonic Electronic Device Co., Ltd.) was used.

As a circuit board 101 for Comparative Examples and Examples 1 to 3 to be described later, an ALIVH substrate having a thickness of 400 μm is used, and a portion corresponding to each electrode of the IC chip 107 is 60 μm ^{2 in} size and made of Cu. An underlayer provided with a second electrode portion 104 made of Ni and flash Au plating was used. The center of the electrode of the circuit board 101 and the center of the electrode of the IC chip 107 are designed to coincide.

  In order to mount the SMD component 113, two rectangular first electrode portions 103 of 0.5 × 0.3 mm were provided 0.3 mm apart from the second electrode portion 104 at a distance of 0.3 mm. The material of the first electrode portion 103 was the same as that of the second electrode portion 104.

  The circuit board 101 of Example 2 was the same as that described above. However, as shown in FIG. 2 (a-1), the peripheral part of the first electrode part 103, the peripheral part of the second electrode 104, and A region on the circuit board 101 on which the IC chip 107 is mounted is lower by 50 μm than the electrode part, and a recess 215 is provided in the circuit board 101.

  As a comparative example, a commercially available underfill (viscosity 8 Pa · s) (manufactured by NAMICS CORPORATION) was used.

As the insulating resin 110 in Examples 1 to 3, 5, an epoxy resin mixed with 60% by weight of an acid anhydride-based curing agent and silica (SiO ₂ ) having a particle diameter of 1 to 10 μm was used. The viscosity of this material at 25 ° C. was 140 Pa · s when measured using an E-type viscometer.

As the insulating resin 110 of Example 4, an epoxy resin mixed with 40% by weight of an acid anhydride curing agent and silica (SiO ₂ ) having a particle diameter of 1 to 10 μm was used. The viscosity of this material at 25 ° C. was 70 Pa · s when measured using an E-type viscometer.

  In each of the comparative examples and Examples 1 to 5, a sample (mounting structure) was prepared using a mounting machine, a thermocompression bonding machine, and a curing furnace (reflow furnace and oven). Thereafter, the resistance value for one side (36 bump connection portion + wiring) of the IC chip, the connection resistance value of 0603 parts, and the shear strength were measured. The results are shown in Table 1.

  The preparation method of the sample in each of the comparative example and Examples 1 to 5 is as follows.

(Comparative example)
The IC chip 107 having the above-described configuration is mounted on a circuit board by applying a load of 50 N with a tool at 210 ° C. using a mounting machine as in the conventional example of FIG. Cured for 30 minutes.

  Next, SnAgCu cream solder is printed on the electrode of the circuit board by a screen printer using an embossed mask having a thickness of 0.12 mm, and 0603 chip resistor component which is SMD component 113 is mounted using a chip component mounter. Then, a sample was prepared by heating in a reflow furnace with a peak at 230 ° C.

(Example 1)
As shown in FIG. 1, SnAgCu cream solder is supplied by a screen printer using a metal mask having a thickness of 0.12 mm only on electrodes on which 0603 components which are SMD components 113 on the circuit board 101 are mounted.

Next, 3 mg of the insulating resin 115 is supplied to the area of 6 mm ² where the IC chip 107 is mounted with a dispenser kept at 50 ° C. On top of that, the IC chip 107 was mounted with a load of 70 ° C. and 50 N using a mounting machine.

  Finally, a 0603 chip resistor component was mounted using a chip component mounter, and heated in a reflow furnace with a peak at 230 ° C. to prepare a sample.

(Example 2)
A sample was prepared in the same manner as in Example 1, and a sample was prepared using a circuit board provided with a recess 215 as the circuit board 101.

(Example 3)
A sample was prepared in the same manner as in Example 1, and an Ag filler conductive adhesive (manufactured by NAMICS Co., Ltd.) was used instead of SnAgCu cream solder, and heated in a 150 ° C. oven for 30 minutes instead of heating in a reflow oven. A sample was prepared.

Example 4
A sample was prepared in the same manner as in Example 1, and a sample was prepared using an insulating resin having a low viscosity (70 Pa · s) as the insulating resin 115.

(Example 5)
A sample was prepared in the same manner as in Example 1, and when the IC chip 107 was mounted on the circuit board 101, an ultrasonic wave was applied in addition to a load of 70 ° C. and 50 N to prepare a sample.

  From the results shown in Table 1, the effect of improving the resistance value of one side of the IC chip, the connection resistance value of 0603 parts, and the shear strength of 0603 parts is seen in comparison with the comparative example of the conventional manufacturing method. It was. This is because, in the comparative example, a 0.3 mm circuit board having a distance between the limit component electrodes of 0.5 mm or less of the conventional method was used, so that the insulating resin spread over the electrodes and hindered the conduction of 0603 components. From this, it can be seen that in the embodiment according to the present invention, it is possible to produce a structure having a distance between component electrodes which is smaller than that of the conventional method.

  As described above, in this embodiment, the distance between the component electrodes of 0.5 mm can be reduced to 0.3 mm.

  Further, according to the verification results of Examples 1 to 5, it is found that the IC chip 107 ultrasonically bonded, the circuit board 101 provided with the recess 215, and the insulating resin 110 having a lower viscosity are more effective. The In addition, since the insulating resin 110 wetted and spread in Examples 1 to 5 reinforces the 0603 component which is the SMD component 113, it can be seen that the shear strength is improved as compared with the comparative example.

  Since the mounting structure manufacturing method according to the present invention can manufacture a mounting structure in which the interval between a semiconductor component and an SMD component is narrow, an IC chip (bare IC), a CSP (Chip Size Package), and an MCM (Multi Chip Module) , BGA (Ball Grid Array) and surface acoustic wave (SAW) device and other SMD components (surface mounted components) such as resistors, capacitors, and coils are mounted on a circuit board in a small distance between components. Useful as.

DESCRIPTION OF SYMBOLS 101 Circuit board 102 Circuit board electrode part 103 Circuit board first electrode part 104 Circuit board second electrode part 105 Electrode bonding material 106 Electrode bonding material application mask 107 Second electronic component (IC chip)
108 Electrode part of second electronic component 109 Projection electrode (bump)
110 Insulating Resin 111 Insulating Resin Application Tool 112 Mounting Tool 113 First Electronic Component (SMD Component)
114 Electrode portion 215 of first electronic component Recessed portion of circuit board

Claims (4)

A method for manufacturing a mounting structure in which a first electronic component made of a passive component and a second electronic component made of a semiconductor are mixedly mounted on the same circuit board surface,
Forming an electrode bonding material on at least the first electrode with respect to a circuit board provided with at least a first electrode and a second electrode;
Supplying an insulating resin on the circuit board on which the second electronic component is mounted;
The electrode of the second electronic component is mounted on the second electrode in the region where the insulating resin is supplied on the circuit board, and the insulating resin is selectively disposed around the first electrode. The process of spreading
Mounting the first electronic component on the first electrode on which an electrode bonding material is formed;
And a step of heating the insulating resin and the electrode bonding material together.   The method for manufacturing a mounting structure according to claim 1, wherein a periphery of at least one of the first electrode and the second electrode on the circuit board is lower than the electrode surface.   The method for manufacturing a mounting structure according to claim 1, wherein a resin having a viscosity of 1 to 70 Pa · s is used as the insulating resin.   In the step of mounting the electrode of the second electronic component on the second electrode in the region of the circuit board to which the insulating resin is supplied, bumps formed on the electrode of the second electronic component are The mounting structure manufacturing method according to claim 1, wherein the mounting structure is mounted on the second electrode while applying an ultrasonic wave.

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