JP2012006820A - Ceramic joined body and method for producing the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a ceramic joined body which is suitable as a member for a semiconductor producing device, can be obtained with a simple joining technique, and is joined at a high strength; and a method for producing the ceramic joined body.SOLUTION: In the ceramic joined body, a first joined body made of a ceramic sintered body containing metal silicon, and a second joined body made of a sintered ceramic body are joined through a joining layer, the joining layer having metal silicon as a major component. The method for producing the ceramic joined body includes: a process to prepare the first joined body having a joining surface and being made of the ceramic sintered body containing metal silicon, and the second joined body having a joining surface and being made of a ceramic sintered body; a process to dispose a thermoplastic resin thin film between the joining surface of the first joined body and the joining surface of the second joined body and superimpose the first joined body and the second joined body; and a process to perform heat treatment at a predetermined temperature under an inert atmosphere while maintaining pressing the superimposed joining surfaces to each other.

Description

  The present invention relates to a ceramic bonding method and a manufacturing method thereof, and more particularly to a ceramic bonded body suitable for a member for a semiconductor manufacturing apparatus and the manufacturing method thereof.

Ceramics have higher heat resistance, corrosion resistance, and wear resistance than metals and plastics, and can be used even under severe conditions such as high temperatures and corrosive environments. Among these, silicon carbide ceramics have excellent properties such as high rigidity, high thermal conductivity, and low thermal expansibility, and thus are used as high-temperature structural members and semiconductor manufacturing apparatus members.
In this way, ceramics are useful materials that can be used in harsh environments, but it is difficult to produce complex shapes or large-sized members by integral molding. It is required to produce a complicated shape or a large member by bonding.

Conventionally, a ceramic composite member in which a SiC ceramic sintered body is diffusion bonded via carbon is known. In addition, there is known a method for manufacturing a ceramic composite member in which bonding surfaces of ceramic members are brought into contact with each other through an organic substance and heated in a non-oxidizing atmosphere at a temperature higher than the decomposition temperature of the organic substance. (For example, see Patent Document 1)
In the case of the above-described bonding method using carbon diffusion, there is a problem that it is difficult to control the bonding layer thickness to a uniform and desired thickness as a whole.

In addition, conventionally, a plurality of component units made of silicon carbide-based reaction sintered bodies are connected to each other through a bonding layer composed of silicon carbide crystal grains and silicon phases continuously existing in a network form in the gaps between the silicon carbide crystal grains. Silicon carbide-based joining members obtained by joining are known. This silicon carbide-based joining member was heated to a temperature of 1400 ° C. or higher in an inert gas atmosphere by maintaining a pre-joined body in which molded bodies corresponding to a plurality of component units were bonded with an organic adhesive, and the heated state was maintained. It is produced by impregnating a molded body and a bonding layer with molten silicon. (For example, see Patent Document 2.)
However, in this case, it is necessary to add silicon from the outside in order to contain silicon melted in the joining process, the joining method is complicated, and silicon added from the outside is uniformly contained in the entire joining layer. There is a problem that it is difficult to make the entire bonding layer uniform.

JP 60-127270 A JP 2005-22905 A

  The present invention has been made in order to solve the above-described problem. A joining layer is formed only by a small amount of metallic silicon that penetrates from the joined body without adding metallic silicon from the outside. It is an object of the present invention to provide a ceramic joined body obtained by a joining technique and joined with high strength, and a method for producing the same.

In order to solve the above-described problem, an embodiment of the present invention includes a first bonded body made of a ceramic sintered body containing metal silicon and a second bonded body made of a ceramic sintered body. The bonding layer is a ceramic bonded body characterized in that metal silicon is the main component. According to the ceramic joined body of the present invention, it is possible to provide a ceramic joined body obtained by a simple joining technique and joined with high strength.
The “ceramic sintered body containing metal silicon” means a so-called composite state in which the metal silicon and the ceramic constituting the ceramic sintered body are a mixture. It is not a ceramic sintered body composed of a compound containing a metal silicon element.

  According to the preferable aspect of this invention, a 2nd to-be-joined body consists of a ceramic sintered compact containing metal silicon. Moreover, it is also preferable that the first bonded body and the second bonded body are the same ceramic sintered body.

  According to another embodiment of the present invention, there is provided a method for manufacturing a ceramic joined body, the step of preparing a first joined body made of a ceramic sintered body having a joint surface and containing metallic silicon, A thermoplastic resin between the step of preparing a second bonded body having a bonded surface and made of a ceramic sintered body, and the bonded surface of the first bonded body and the bonded surface of the second bonded body A step of disposing a thin film and superimposing the first and second objects to be joined; and a first and second object to be joined that are superposed via the thermoplastic resin thin film; And a step of heat-treating at a predetermined temperature in an inert atmosphere while maintaining a state where the bonding surfaces are pressed with each other. According to the method for manufacturing a ceramic joined body of the present invention, since the initial joining layer thickness can be controlled by the thickness of the thermoplastic resin thin film, it is uniform without causing thickness variation such as coating unevenness. And it becomes possible to control to desired joining layer thickness.

According to a preferred aspect of the present invention, the predetermined temperature is higher than the melting point of metal silicon in the state included in the first bonded body and in the state included in the first bonded body. The temperature is lower than the evaporation temperature of metallic silicon.
If it is such temperature, since the metal silicon contained in the first bonded body during the heat treatment becomes a liquid having an appropriate viscosity, the movement of the metal silicon to the carbonized thermoplastic resin thin film is promoted, and the bonding surface The entire bonding layer can be formed in a short time.

In general, the melting point and evaporation temperature of metallic silicon vary depending on the state of metallic silicon. That is, the melting point of metallic silicon in the state contained in the ceramic sintered body is generally lower than the melting point in the state of being a single crystal. In addition, it varies depending on the type of ceramic sintered body.
For this reason, according to the kind of ceramic sintered body to be joined and the impregnation state of metal silicon, an appropriate heat treatment temperature is measured in advance by experiment, and the heat treatment is performed at the temperature, whereby the joining layer is obtained. Can be formed in a short time.

  According to a preferred aspect of the present invention, the thermoplastic resin thin film is a thin film made of cellophane. Since cellophane becomes a dense carbon material by heat treatment, it is possible to form a bonding layer with only a small amount of metal silicon that penetrates from the object to be bonded without adding metal silicon from the outside.

  ADVANTAGE OF THE INVENTION According to this invention, it becomes possible to provide the ceramic joined body joined by high intensity | strength obtained by a simple joining method, and its manufacturing method.

It is an electron micrograph which shows the joining layer cross section of this invention.

The ceramic joined body of the present invention and the manufacturing method thereof will be described in detail below.
In the ceramic joined body of the present invention, a first joined body made of a ceramic sintered body containing metal silicon and a second joined body made of a ceramic sintered body are joined via a joining layer, and joined. The layer is a ceramic joined body characterized by containing metal silicon as a main component. In addition, the method for manufacturing a ceramic joined body of the present invention includes a step of preparing a first joined body having a joint surface and made of a ceramic sintered body containing metal silicon, and a ceramic sintered body having a joint surface. A second to-be-joined body comprising a body, and a thermoplastic resin thin film disposed between the joining surface of the first to-be-joined body and the joining surface of the second to-be-joined body. The state in which the bonding surfaces are pressed between the step of superimposing the bonded body and the second bonded body, and the first bonded body and the second bonded body stacked via the thermoplastic resin thin film. And a step of heat-treating at a predetermined temperature under an inert atmosphere while maintaining the above.

(Substrate to be joined)
Among the objects to be bonded constituting the ceramic bonded body, various ceramics that can contain metallic silicon can be used for the first bonded object. Among these, silicon carbide ceramics containing metal silicon, boron carbide ceramics containing metal silicon, ceramic composites containing metal silicon and containing silicon carbide and boron carbide, and the like can be given. In addition to the ceramics that can be used for the first bonded body, various ceramics that do not contain metallic silicon can be used for the second bonded body.
The two objects to be bonded to each other through the bonded body may be ceramics containing at least one of metal silicon, but when both of the two objects to be bonded are ceramics containing metal silicon, This is more preferable because the adhesion between the object to be bonded and the bonding layer is increased.

(Bonding layer)
The bonding layer is a layer that is interposed between the first bonded body and the second bonded body and bonds the both. In the heat treatment step, after the thermoplastic resin thin film interposed between the first bonded body and the second bonded body is carbonized, metal silicon penetrates from any of the bonded bodies into the carbon. By reacting, it becomes a layer of silicon carbide containing metallic silicon.

(Thermoplastic resin thin film)
As the thermoplastic resin thin film, various resins containing carbon can be used. In particular, those that shrink after heating and become dense continuous carbon are preferred, such as phenol resin, polyimide resin, polyacetal resin, polycarbonate resin, polysulfone resin, polyvinylidene fluoride resin, epoxy resin, polyester resin, polybutyl acrylate. Examples thereof include thermoplastic resin thin films such as resins, vinyl acetate resins, and polyvinyl chloride resins. Moreover, the thing which is easy to shape | mold into a thin film form from the point that it is easy to adjust the thickness of a joining layer is preferable, for example, a cellophane resin and a polyimide resin can be used suitably.
The thermoplastic resin thin film is preferably heat-shrinkable to 1 to 200 μm after heat treatment from the viewpoint of increasing the bonding strength, and more preferably 1 to 50 μm.

(Joint surface)
At the time of joining, the shape of the surfaces to be abutted is not limited, and methods such as plane abutment and fitting are possible. Since it is joining via a thermoplastic resin thin film, plane matching is simple and preferable.

(Roughness of joint surface)
Although there is no restriction | limiting regarding the surface roughness of a joint surface, The grade which cannot make a clearance gap by the thermal contraction of a thermoplastic resin thin film is preferable, Ra = 3 micrometer or less is preferable, More preferably, Ra = 0.5 micrometer or less is good.

(Carbonization process)
Disposing a thermoplastic resin thin film between the bonding surface of the first bonded body and the bonding surface of the second bonded body and superimposing the first bonded body and the second bonded body; Then, the first and second objects to be joined that are superposed via the thermoplastic resin thin film are heat-treated at a predetermined temperature in an inert atmosphere while maintaining the state where the joining surfaces are pressed with each other. It is preferable to have a step of carbonizing the thermoplastic resin thin film that becomes the bonding layer during bonding heating. The temperature of the heat treatment in the step of carbonizing the thermoplastic resin thin film can be appropriately selected in the range of 400 to 900 ° C. according to the thermoplastic resin thin film to be used. The holding time can be appropriately selected according to the type and size of the thermoplastic resin thin film.

(Joining process)
The temperature required for the bonding process is higher than the melting point of metallic silicon in the state included in the first bonded body and lower than the evaporation temperature of metallic silicon in the state included in the first bonded body. It can be selected appropriately within the temperature range. The to-be-joined body of this invention is a to-be-joined body which already contains metallic silicon in the joining process, and forms the joining layer which has metallic silicon as a main component by the movement of the metallic silicon of a to-be-joined body. In the present embodiment, it is known that the metal silicon contained in the first non-bonded body melts at a temperature of 1100 ° C. or higher, and the evaporation of the metal silicon cannot be ignored when the temperature exceeds 1700 ° C. For this reason, the temperature of the heat treatment is preferably 1200 to 1500 ° C., more preferably 1300 to 1400 ° C. at which the heat treatment can be performed at a temperature lower than the melting point (1412 ° C.) in the state of metal silicon alone.
In the joining treatment step, the pressure during the heat treatment can be appropriately selected within the range of 0.1 to 200 MPa. At least a pressure that does not cause the object to be peeled off due to shrinkage deformation of the thermoplastic resin thin film is required, and the entire molded body in which the objects to be joined are overlapped may be pressed, or the joint surface may be pressed. Heat treatment may be performed by clamping with a jig.
The bonding process may be performed under an appropriate inert atmosphere, and examples thereof include a vacuum, an argon atmosphere, and a nitrogen atmosphere. An argon atmosphere is preferred. Note that bonding is possible even with a mixed gas of argon and nitrogen.

Example 1
Ceramic fired bodies containing metal silicon, boron carbide, and silicon carbide were prepared as the first and second bonded bodies. Cellophane having a thickness of 35 μm was prepared as a thermoplastic resin thin film.
A ceramic fired body containing metallic silicon, boron carbide and silicon carbide was produced by the following method.
30 parts by weight of silicon carbide powder having an average particle diameter of 0.6 μm, 70 parts by weight of boron carbide powder having an average particle diameter of 25 μm, and 10 parts by weight of carbon black powder having an average particle diameter of 55 nm are obtained by silicon carbide powder, boron carbide powder, carbon Disperse in pure water with 0.1 to 1 part by weight of dispersant added to black powder, adjust pH to 8 to 9.5 with aqueous ammonia, etc. to produce low viscosity slurry of less than 500 CP did. After mixing this slurry with a pot mill or the like for several hours, add 1 to 2 parts by weight of binder to silicon carbide powder, boron carbide powder, or carbon powder, mix and defoam, and then place an acrylic pipe with an inner diameter of 80 mm on the gypsum plate. The placed slurry was cast to produce a molded body having a thickness of about 10 mm. The molded body is naturally dried, dried at 100 to 150 ° C., degreased by holding at a temperature of 600 ° C. for 2 hours under a reduced pressure of 1 × 10 −4 to 1 × 10 −3 torr, and held at a temperature of 1700 ° C. for 1 hour. Perform calcination. After calcination, the reaction sintered body was manufactured by heating to a temperature of 1500 ° C. and holding for 30 minutes, and impregnating molten silicon into the molded body.
The obtained ceramic fired body containing metal silicon, boron carbide and silicon carbide was cut into a 20 mm square and a thickness of 6 mm, and ground so that the joint surface was Ra = 0.2 μm, and two joined bodies were produced. .
Cellophane having a thickness of 35 μm was sandwiched between the joining surfaces of the two objects to be joined, and fixed with a carbon jig to form a shape of 20 × 40 × 6 mm.
The fixed sample was heat-treated at 1400 ° C. in an argon atmosphere of 1 atm in a carbon furnace. While the temperature was raised to 1400 ° C. (temperature raising rate was 300 ° C./1 hour), the temperature was maintained at 600 ° C. for 1 hour to carbonize the cellophane.
An electron micrograph of the ceramic composite including the bonding layer is shown in FIG. It was observed that the objects to be bonded 1 were bonded to each other via a bonding layer 2 containing metal silicon as a main component, and the objects to be bonded 1 were ceramic bonded bodies composed of a boron carbide portion 3 and a silicon carbide portion 4. The joined layer thickness of the obtained joined body was about 16 μm.
The heated sample was processed into a 3 × 4 × 40 mm test piece and subjected to three-point bending (JIS R1601). As a result, the joined body was broken at the joining surface, and a strength of 130 MPa was obtained.

(Example 2)
Ceramic fired bodies containing metal silicon, boron carbide, and silicon carbide were prepared as the first and second bonded bodies. Cellophane having a thickness of 35 μm was prepared as a thermoplastic resin thin film.
A fired ceramic body containing metal silicon, boron carbide and silicon carbide was produced by the same method as in Example 1, and a joining sample was prepared in the same shape.
Cellophane having a thickness of 35 μm was sandwiched between the joining surfaces of the two objects to be joined, and fixed with a carbon jig to form a shape of 20 × 40 × 6 mm.
The fixed sample was heat-treated at 1300 ° C. in an argon atmosphere of 1 atm in a carbon furnace. While the temperature was raised to 1300 ° C. (temperature raising rate was 300 ° C./1 hour), the temperature was maintained at 600 ° C. for 1 hour to carbonize the cellophane.

(Example 3)
Ceramic fired bodies containing metal silicon, boron carbide, and silicon carbide were prepared as the first and second bonded bodies. Cellophane having a thickness of 35 μm was prepared as a thermoplastic resin thin film.
A fired ceramic body containing metal silicon, boron carbide and silicon carbide was produced by the same method as in Example 1, and a joining sample was prepared in the same shape.
Cellophane having a thickness of 35 μm was sandwiched between the joining surfaces of the two objects to be joined, and fixed with a carbon jig to form a shape of 20 × 40 × 6 mm.
The fixed sample was heat-treated at 1500 ° C. in an argon atmosphere of 1 atm in a carbon furnace. While the temperature was raised to 1500 ° C. (temperature raising rate was 300 ° C./1 hour), the temperature was maintained at 600 ° C. for 1 hour to carbonize the cellophane.

Example 4
Ceramic fired bodies containing metal silicon, boron carbide, and silicon carbide were prepared as the first and second bonded bodies. Cellophane having a thickness of 35 μm was prepared as a thermoplastic resin thin film.
A fired ceramic body containing metal silicon, boron carbide and silicon carbide was produced by the same method as in Example 1, and a joining sample was prepared in the same shape.
Cellophane having a thickness of 35 μm was sandwiched between the joining surfaces of the two objects to be joined, and fixed with a carbon jig to form a shape of 20 × 40 × 6 mm.
The fixed sample was heat-treated at 1600 ° C. in an argon atmosphere of 1 atm in a carbon furnace. While the temperature was raised to 1600 ° C. (temperature raising rate was 300 ° C./1 hour), the temperature was maintained at 600 ° C. for 1 hour to carbonize the cellophane.

(Example 5)
Ceramic fired bodies containing metal silicon, boron carbide, and silicon carbide were prepared as the first and second bonded bodies. Cellophane having a thickness of 35 μm was prepared as a thermoplastic resin thin film.
A fired ceramic body containing metal silicon, boron carbide and silicon carbide was produced by the same method as in Example 1, and a joining sample was prepared in the same shape.
Cellophane having a thickness of 35 μm was sandwiched between the joining surfaces of the two objects to be joined, and fixed with a carbon jig to form a shape of 20 × 40 × 6 mm.
The fixed sample was heat-treated at 1400 ° C. in a nitrogen atmosphere of 1 atm in a carbon furnace. While the temperature was raised to 1400 ° C. (temperature raising rate was 300 ° C./1 hour), the temperature was maintained at 600 ° C. for 1 hour to carbonize the cellophane.

(Example 6)
Ceramic fired bodies containing metal silicon, boron carbide, and silicon carbide were prepared as the first and second bonded bodies. Cellophane having a thickness of 35 μm was prepared as a thermoplastic resin thin film.
A fired ceramic body containing metal silicon, boron carbide and silicon carbide was produced by the same method as in Example 1, and a joining sample was prepared in the same shape.
Cellophane having a thickness of 35 μm was sandwiched between the joining surfaces of the two objects to be joined, and fixed with a carbon jig to form a shape of 20 × 40 × 6 mm.
The fixed sample was heat-treated at 1300 ° C. in a vacuum in a carbon furnace. While the temperature was raised to 1300 ° C. (temperature raising rate was 300 ° C./1 hour), the temperature was maintained at 600 ° C. for 1 hour to carbonize the cellophane.

(Example 7)
Ceramic fired bodies containing metal silicon, boron carbide, and silicon carbide were prepared as the first and second bonded bodies. Cellophane having a thickness of 35 μm was prepared as a thermoplastic resin thin film.
A fired ceramic body containing metal silicon, boron carbide and silicon carbide was produced by the same method as in Example 1, and a joining sample was prepared in the same shape.
Cellophane having a thickness of 35 μm was sandwiched between the joining surfaces of the two objects to be joined, and fixed with a carbon jig to form a shape of 20 × 40 × 6 mm.
The fixed sample was heat-treated at 1400 ° C. in a vacuum in a carbon furnace. While the temperature was raised to 1400 ° C. (temperature raising rate was 300 ° C./1 hour), the temperature was maintained at 600 ° C. for 1 hour to carbonize the cellophane.

(Example 8)
Ceramic fired bodies containing metal silicon, boron carbide, and silicon carbide were prepared as the first and second bonded bodies. As a thermoplastic resin thin film, cellophane having a thickness of 20 μm was prepared.
A fired ceramic body containing metal silicon, boron carbide and silicon carbide was produced by the same method as in Example 1, and a joining sample was prepared in the same shape.
A cellophane having a thickness of 20 μm was sandwiched between the joining surfaces of the two objects to be joined, and fixed with a carbon jig to form a shape of 20 × 40 × 6 mm.
The fixed sample was heat-treated at 1300 ° C. in an argon atmosphere of 1 atm in a carbon furnace. While the temperature was raised to 1300 ° C. (temperature raising rate was 300 ° C./1 hour), the temperature was maintained at 600 ° C. for 1 hour to carbonize the cellophane.

Example 9
Ceramic fired bodies containing metal silicon, boron carbide, and silicon carbide were prepared as the first and second bonded bodies. As a thermoplastic resin thin film, cellophane having a thickness of 20 μm was prepared.
A fired ceramic body containing metal silicon, boron carbide and silicon carbide was produced by the same method as in Example 1, and a joining sample was prepared in the same shape.
A cellophane having a thickness of 20 μm was sandwiched between the joining surfaces of the two objects to be joined, and fixed with a carbon jig to form a shape of 20 × 40 × 6 mm.
The fixed sample was heat-treated at 1400 ° C. in an argon atmosphere of 1 atm in a carbon furnace. While the temperature was raised to 1400 ° C. (temperature raising rate was 300 ° C./1 hour), the temperature was maintained at 600 ° C. for 1 hour to carbonize the cellophane.

(Example 10)
Ceramic fired bodies containing metal silicon, boron carbide, and silicon carbide were prepared as the first and second bonded bodies. As a thermoplastic resin thin film, cellophane having a thickness of 20 μm was prepared.
A fired ceramic body containing metal silicon, boron carbide and silicon carbide was produced by the same method as in Example 1, and a joining sample was prepared in the same shape.
A cellophane having a thickness of 20 μm was sandwiched between the joining surfaces of the two objects to be joined, and fixed with a carbon jig to form a shape of 20 × 40 × 6 mm.
The fixed sample was heat-treated at 1500 ° C. in an argon atmosphere of 1 atm in a carbon furnace. While the temperature was raised to 1500 ° C. (temperature raising rate was 300 ° C./1 hour), the temperature was maintained at 600 ° C. for 1 hour to carbonize the cellophane.

(Example 11)
Ceramic fired bodies containing metal silicon, boron carbide, and silicon carbide were prepared as the first and second bonded bodies. As a thermoplastic resin thin film, cellophane having a thickness of 20 μm was prepared.
A fired ceramic body containing metal silicon, boron carbide and silicon carbide was produced by the same method as in Example 1, and a joining sample was prepared in the same shape.
A cellophane having a thickness of 20 μm was sandwiched between the joining surfaces of the two objects to be joined, and fixed with a carbon jig to form a shape of 20 × 40 × 6 mm.
The fixed sample was heat-treated at 1600 ° C. in an argon atmosphere of 1 atm in a carbon furnace. While the temperature was raised to 1600 ° C. (temperature raising rate was 300 ° C./1 hour), the temperature was maintained at 600 ° C. for 1 hour to carbonize the cellophane.

(Example 12)
Ceramic fired bodies containing metal silicon, boron carbide, and silicon carbide were prepared as the first and second bonded bodies. As a thermoplastic resin thin film, cellophane having a thickness of 20 μm was prepared.
A fired ceramic body containing metal silicon, boron carbide and silicon carbide was produced by the same method as in Example 1, and a joining sample was prepared in the same shape.
A cellophane having a thickness of 20 μm was sandwiched between the joining surfaces of the two objects to be joined, and fixed with a carbon jig to form a shape of 20 × 40 × 6 mm.
The fixed sample was heat-treated at 1500 ° C. in a nitrogen atmosphere of 1 atm in a carbon furnace. While the temperature was raised to 1500 ° C. (temperature raising rate was 300 ° C./1 hour), the temperature was maintained at 600 ° C. for 1 hour to carbonize the cellophane.

(Example 13)
Ceramic fired bodies containing metal silicon, boron carbide, and silicon carbide were prepared as the first and second bonded bodies. As a thermoplastic resin thin film, cellophane having a thickness of 20 μm was prepared.
A fired ceramic body containing metal silicon, boron carbide and silicon carbide was produced by the same method as in Example 1, and a joining sample was prepared in the same shape.
A cellophane having a thickness of 20 μm was sandwiched between the joining surfaces of the two objects to be joined, and fixed with a carbon jig to form a shape of 20 × 40 × 6 mm.
The fixed sample was heat-treated at 1300 ° C. in a vacuum in a carbon furnace. While the temperature was raised to 1300 ° C. (temperature raising rate was 300 ° C./1 hour), the temperature was maintained at 600 ° C. for 1 hour to carbonize the cellophane.

(Example 14)
Ceramic fired bodies containing metal silicon, boron carbide, and silicon carbide were prepared as the first and second bonded bodies. As a thermoplastic resin thin film, cellophane having a thickness of 20 μm was prepared.
A fired ceramic body containing metal silicon, boron carbide and silicon carbide was produced by the same method as in Example 1, and a joining sample was prepared in the same shape.
A cellophane having a thickness of 20 μm was sandwiched between the joining surfaces of the two objects to be joined, and fixed with a carbon jig to form a shape of 20 × 40 × 6 mm.
The fixed sample was heat-treated at 1400 ° C. in a vacuum in a carbon furnace. While the temperature was raised to 1400 ° C. (temperature raising rate was 300 ° C./1 hour), the temperature was maintained at 600 ° C. for 1 hour to carbonize the cellophane.

In the above examples, the bonded samples are each of the same method as described in Example 1, that is, the heated sample is processed into a 3 × 4 × 40 mm test piece, subjected to three-point bending (JISR1601) and fractured. Measurements were made.
The measurement results are shown in Table 1.

Claims (8)

A ceramic joined body,
A first bonded body made of a ceramic sintered body containing metal silicon and a second bonded body made of a ceramic sintered body are bonded via a bonding layer,
The bonded ceramic body according to claim 1, wherein the bonding layer contains metal silicon as a main component.   The ceramic joined body according to claim 1, wherein the second joined body is made of a ceramic sintered body containing metallic silicon.   The ceramic joined body according to claim 1 or 2, wherein the first joined body and the second joined body are the same ceramic sintered body.   The ceramic joined body according to any one of claims 1 to 3, wherein the first joined body and the second joined body are ceramic sintered bodies containing metal silicon and silicon carbide. .   The said 1st to-be-joined body and the said 2nd to-be-joined body are the ceramic sintered compact containing metal silicon, silicon carbide, and boron carbide, The any one of Claims 1-4 characterized by the above-mentioned. Ceramic bonded body. A method for producing a ceramic joined body, comprising:
Preparing a first bonded body having a bonding surface and made of a ceramic sintered body containing metallic silicon;
Preparing a second bonded body having a bonding surface and made of a ceramic sintered body;
Disposing a thermoplastic resin thin film between the bonding surface of the first bonded body and the bonding surface of the second bonded body and superimposing the first bonded body and the second bonded body; ,
The first bonded body and the second bonded body that are overlapped with each other through the thermoplastic resin thin film are heat-treated at a predetermined temperature in an inert atmosphere while maintaining a state where the bonded surfaces are pressed to each other. A process for producing a ceramic joined body comprising the steps of:   The predetermined temperature is higher than the melting point of metallic silicon in the state contained in the first joined body and lower than the evaporation temperature of metallic silicon in the state contained in the first joined body. The method for producing a ceramic joined body according to claim 6, wherein:   The method for producing a ceramic joined body according to claim 6, wherein the thermoplastic resin thin film is a thin film made of cellophane.

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