JP2012005988A - Pattern forming method and pattern forming apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a pattern forming method and a pattern forming apparatus capable of uniformly forming a pattern, such as a finger wiring pattern for a solar battery, including a start end.SOLUTION: Viscosity change (viscosity characteristics) of paste corresponding to increase in shearing stress applied to the paste is measured (Step S10). In accordance with the measured viscosity characteristics, conditions of moving speed of a substrate when discharge of the paste from a nozzle is started are adjusted (Step S20). The substrate is moved in the adjusted speed conditions and the paste is linearly discharged from the nozzle to perform application and formation of the linear finger wiring pattern on the substrate (Step S30).

Description

  The present invention relates to a technique for forming a pattern such as a wiring pattern on a substrate for a solar cell element, for example.

  In general, as shown in FIG. 13 (a), on the surface of the substrate 9 for solar cell elements, there are provided a bus wiring 93 for taking out an output, and intersecting the bus wiring 93 in a direction orthogonal to each other and parallel to each other. A plurality of finger wirings 91 are formed (see, for example, Patent Document 1). The substrate 9 is, for example, a silicon substrate, an n-type diffusion layer is formed on the surface thereof, and bus wiring 93 and finger wiring 91 are formed on the surface of the n-type diffusion layer. Further, an antireflection film is formed on the surface of the n-type diffusion layer excluding the bus wiring 93 and the finger wiring 91. Note that, as shown in FIG. 13B, bus wiring 97 for the back surface is formed on the back surface of the substrate 9. A current collecting electrode 95 is formed on almost the entire back surface of the substrate 9 excluding the bus wiring 97.

  As a method of forming each wiring such as the bus wiring 93 and the finger wiring 91 described above, a method of forming a wiring by printing a conductive paste on a substrate using a screen printing method is known. The finger wiring formed by the screen printing method has, for example, a line width of 120 μm, a height of 20 μm, and a flat convex shape in cross section.

  In recent years, in order to improve the photoelectric conversion efficiency by the solar cell element, it has been studied to reduce the line width of the finger wiring 91 and increase the light receiving area on the surface of the substrate 9. However, when the line width of the finger wiring 91 is reduced, the cross-sectional area of the finger wiring 91 is reduced. As a result, the electrical resistance of the finger wiring 91 increases, and the problem that the current collection capability of the finger wiring 91 decreases occurs.

  A method of suppressing an increase in electrical resistance by increasing the thickness of the finger wiring 91 in order to prevent a decrease in current collecting capability can be considered. In other words, although the line width of the finger wiring 91 is reduced, the height of the finger wiring 91 is increased to form a high aspect ratio wiring, thereby increasing the cross-sectional area of the finger wiring 91 and suppressing an increase in electrical resistance. Can be considered. However, it is difficult to thicken the wiring by the screen printing method, and there is a problem that the finger wiring 91 having a high aspect ratio cannot be easily formed.

  Therefore, instead of the screen printing method, for example, a method of coating and forming a wiring pattern using a coating method described in Patent Document 2 is conceivable. According to this pattern forming method, a conductive paste is supplied linearly from a plurality of ejection openings onto a substrate, and the paste supplied on the substrate is irradiated with light to cure the paste, thereby forming a thick film ( High aspect ratio) linear patterns can be formed.

Japanese Patent Laying-Open No. 2005-353851 (for example, FIGS. 1 and 2) Japanese Patent Laid-Open No. 2002-184303 (for example, FIG. 3)

  However, when the finger wiring 91 that is a linear pattern is formed on the substrate 9 by using the above-described pattern forming method, the following problem occurs. That is, as shown in FIG. 14A, the pattern dimension of the finger wiring 91 needs to be uniform over the extending direction, and it is necessary to form the pattern dimension uniformly also at the tip of the finger wiring 91. is there. However, according to the above-described pattern forming method, there arises a problem that the pattern dimension is not uniform at the tip of the finger wiring 91 as shown in FIGS.

  FIG. 14B shows a state in which a thin line portion 91 n having a small line width dimension is formed at the tip end portion of the finger wiring 91. In FIG. 14 (c), a thin wire portion 91n and an island portion 91i spaced from the thin wire portion 91n are formed at the tip of the finger wiring 91, and a broken portion 91b is generated between the thin wire portions 91n and 91i. Indicates the state. As shown in FIGS. 14B and 14C, if the pattern dimension at the tip of the finger wiring 91 is non-uniform, there arises a problem that the current collecting ability by the finger wiring 91 is lowered.

  In view of the above points, an object of the present invention is to provide a pattern forming method and a pattern forming apparatus capable of uniformly forming a pattern such as a finger wiring pattern for a solar cell including its starting end. There is.

  The invention according to claim 1 (pattern forming method) is based on a viscosity characteristic measuring step for measuring a viscosity characteristic according to a shear stress of a material for forming a pattern, and a viscosity characteristic measured by the viscosity characteristic measuring step. A speed adjusting step for adjusting the speed condition of the substrate when starting the discharge of the material from the nozzle toward the substrate that moves relative to the nozzle; and a speed adjusting step for starting the discharging of the material from the nozzle And an application step of forming a linear pattern on the substrate by discharging the material from the nozzle toward the substrate under a speed condition adjusted by It is characterized by that.

  The invention according to claim 2 is the pattern forming method according to claim 1, wherein the speed adjustment step is a step of adjusting the relative acceleration of the substrate with respect to the nozzle based on the viscosity characteristic measured by the viscosity characteristic measurement step. It is characterized by that.

  According to a third aspect of the present invention, in the pattern forming method according to the first aspect, the relative speed of the substrate is increased to a predetermined speed when the speed condition starts the discharge of the material from the discharge port of the nozzle. The speed condition has a period that is a constant speed lower than a predetermined speed in the middle of the process, and the speed adjustment step is a step of adjusting the value of the constant speed based on the viscosity characteristic measured by the viscosity characteristic measurement step. It is characterized by that.

  According to a fourth aspect of the present invention, in the pattern forming method according to the first aspect, the relative speed of the substrate is increased to a predetermined speed when the speed condition starts the discharge of the material from the discharge port of the nozzle. The speed condition has a period that is a constant speed lower than a predetermined speed, and the speed adjustment process adjusts the length of the constant speed period based on the viscosity characteristic measured by the viscosity characteristic measurement process. It is a process to perform.

  The invention according to claim 5 (pattern forming method) starts the linear pattern formed on the substrate by discharging the material for forming the pattern from the nozzle toward the substrate that moves relative to the nozzle. An observation process for observing the shape of the edge, and a substrate at the time of starting discharging the material from the nozzle to the substrate that moves relative to the nozzle based on the shape of the start end of the linear pattern observed in the observation process When starting the ejection of the material from the nozzle, the substrate is moved relative to the nozzle at the speed adjusting step for adjusting the speed condition, and from the nozzle toward the substrate. And a coating step of discharging the material to form a linear pattern of the material on the substrate.

  The invention according to claim 6 is the pattern forming method according to claim 5, wherein the speed adjustment step adjusts the relative acceleration of the substrate with respect to the nozzle based on the shape of the starting end of the linear pattern observed in the observation step. It is a process to perform.

  According to a seventh aspect of the present invention, in the pattern forming method according to the fifth aspect, when the speed condition starts to discharge the material from the nozzle, the relative movement speed of the substrate is increased to a predetermined speed. , A speed condition having a period of a constant speed lower than a predetermined speed, and based on the shape of the start end of the linear pattern observed by the speed adjustment process in the observation process, the value of the constant speed as the speed condition It is the process of adjusting, It is characterized by the above-mentioned.

  According to an eighth aspect of the present invention, in the pattern forming method according to the fifth aspect, when the speed condition starts discharging the material from the nozzle, the relative movement speed of the substrate is accelerated to a predetermined speed. , A speed condition having a period of a constant speed lower than a predetermined speed, and the length of the period of the constant speed is determined based on the shape of the start end of the linear pattern observed by the observation process in the speed adjustment process. It is the process of adjusting, It is characterized by the above-mentioned.

  The invention according to claim 9 is the pattern forming method according to any one of claims 1 to 8, wherein the substrate is a substrate for a solar cell element, and the material is a conductive paste having conductivity. And the linear pattern is a pattern for finger wiring.

  The invention according to claim 10 (pattern forming apparatus) starts a discharge of the material from the nozzle, a nozzle that discharges the material for forming the pattern linearly, a moving means that moves the substrate relative to the nozzle, and And a control means for causing the substrate to move relative to the nozzle based on the speed condition by the moving means, and to discharge the material linearly from the nozzle toward the substrate, wherein the speed condition is the material. The speed condition is preliminarily adjusted based on the viscosity characteristic corresponding to the shear stress.

  According to an eleventh aspect of the present invention (pattern forming apparatus), a nozzle that linearly discharges a material for forming a pattern, a moving unit that moves the substrate relative to the nozzle, and discharge of the material from the nozzle are started. And a control means for causing the substrate to move relative to the nozzle based on the speed condition by the moving means, and to discharge the material linearly from the nozzle toward the substrate, wherein the speed condition is the material. The speed condition is adjusted in advance by observing the shape of the starting end of the linear pattern applied and formed on the substrate.

  According to the invention of any one of claims 1 to 11, for example, a pattern such as a finger wiring pattern for a solar cell can be uniformly formed including its start end.

It is a side view which shows the pattern formation apparatus 1 which is embodiment of this invention. It is side sectional drawing (a) and bottom view (b), (c) of a nozzle. It is a block diagram which shows the electric constitution of embodiment. It is a flowchart which shows the flow of operation | movement of 1st Embodiment. It is a flowchart which shows the flow of an application | coating process. It is a figure which shows the application | coating state of a finger wiring pattern. It is a figure which shows the application | coating state of a bus wiring pattern. It is a figure which shows the viscosity characteristic according to the shear stress of the paste. It is a figure which shows the speed condition of the board | substrate at the time of an application | coating start. It is a figure which shows the speed condition of the board | substrate at the time of an application | coating start. It is a flowchart which shows the flow of operation | movement of 2nd Embodiment. It is a figure which shows the state of the starting end of a finger wiring pattern. It is a figure which shows the surface (a) and back surface (b) of the board | substrate for solar cell elements. It is a figure which shows the state of the starting end of finger wiring.

  Embodiments of the present invention will be described below with reference to the accompanying drawings. FIG. 1 is a side view schematically showing a pattern forming apparatus 1 according to an embodiment of the present invention. In the pattern forming apparatus 1, for example, a bus wiring pattern 71 for a bus wiring 91 and a finger wiring pattern 73 for a finger wiring 93 are applied and formed on a substrate 9 for a solar cell shown in FIG.

  The substrate 9 is a silicon substrate which is a p-type semiconductor made of, for example, single crystal silicon or polycrystalline silicon. An n-type diffusion layer is formed on the surface side of the substrate 9 on which the bus wiring 93 and the finger wiring 91 are formed, and an antireflection film is formed on the n-type diffusion layer.

  As shown in FIG. 1, the pattern forming apparatus 1 includes a substrate mounting unit 20, a driving unit 30, a first forming unit 40, and a second forming unit 50. The substrate platform 20 has a structure in which a stage 21, a lift unit 22, a turntable 23, and a nut unit 25 are stacked from above. The stage 21 holds the substrate 9 horizontally on its upper surface. The turntable 23 rotates the stage 21 by 90 degrees in the horizontal plane. The nut portion 25 is fixed to the lower surface of the turntable 23.

  Further, an elevating unit 22 is provided between the turntable 23 and the stage 21. The elevating unit 22 elevates the stage 21 with respect to the turntable 23 and positions the height (Z-direction position) of the substrate 9 placed on the stage 21. As the elevating part 22, for example, an actuator such as a solenoid or a piezoelectric element, a gear, or a wedge meshing can be used.

  The drive unit 30 includes a motor 35 that is fixed to the upper surface of the (+ X) side end of the base 31. The motor 35 is a servo motor and incorporates an encoder. A ball screw 33 is fixed to the rotating shaft of the motor 35. The (−X) side end of the ball screw 33 is fixed to the upper surface of the (−X) side end of the base 31 so as to be rotatable around the X axis. The ball screw 33 is screwed into the nut portion 25. A pair of guide rails 37 arranged in parallel in the Y direction is extended on the upper surface of the base 31 along the X direction. The guide rail 37 slidably supports the nut portion 25 and defines the moving direction of the substrate platform 20. The substrate placement unit 20 and the drive unit 30 correspond to the moving unit of the present invention.

  The first forming portion 40 is a forming portion for forming a wiring pattern for finger wiring (finger wiring pattern 71) on the main surface of the substrate 9. The finger wiring pattern 71 corresponds to the linear pattern of the present invention. The first forming unit 40 includes a plurality of first nozzles 47 that discharge, for example, conductive high-viscosity paste 7 that is a material for forming a pattern. The plurality of first nozzles 47 are provided in a row along the Y direction below the first head 41 extending in the Y direction. The 1st head 41 is attached to the lower surface of the beam part of the flame | frame 81 provided in the base 31 so that the board | substrate mounting part 20 might be straddled along a Y direction.

  One end of a pipe 42 is connected to the first head 41 through a flow path. The other end of the pipe 42 is connected to an air supply source (not shown). In the middle of the pipe 42, a valve 45 for opening and closing the flow path of the pipe 42 and a regulator 46 for adjusting the pressure of air supplied to the first head 41 are interposed. Further, a paste supply mechanism (not shown) for supplying the paste 7 into the first head 41 is provided.

  The paste 7 which is a high-viscosity material for forming a pattern has conductivity and photocurability, and includes, for example, conductive particles, an organic vehicle (a mixture of solvent, resin, thickener, etc.) and a photopolymerization initiator. Including. The conductive particles are, for example, silver powder, and the organic vehicle contains ethyl cellulose as a resin material and an organic solvent.

  As shown in FIG. 2A, a manifold (internal space) 87 is formed inside the first head 41. In addition, the first head 41 is provided with a piston 83 that partitions the manifold 87 into an upper space and a lower space (a liquid reservoir) and is slidable in the Z direction. A pipe 42 is connected to the upper space of the manifold 87 above the piston 83. The space below the manifold 87 below the piston 83 is filled with the paste 7. The space below the manifold 87 has a tapered shape in which the cross-sectional area (volume per unit length) decreases as it goes toward the flow path of the first nozzle 47.

  As shown in FIGS. 2A and 2B, a plurality (for example, 16) of first nozzles 47 are provided vertically downward (in the −Z direction) and in a row in the Y direction below the first head 41. It is done. A circular discharge port 85 is provided at the lower end of the first nozzle 47, and the discharge port 85 communicates with the space below the manifold 87 through a flow path formed in the first nozzle 47. The volume (volume) in the flow path of the first nozzle 47 is smaller than the volume (volume) in the lower space of the manifold 87. The width dimension (diameter dimension) of the discharge port 85 in the Y direction is substantially equal to the width dimension of the finger wiring pattern 71 to be formed, for example, 50 μm, and the interval between the plurality of discharge ports 85 is that of the plurality of finger wiring patterns 71. It is almost equal to the interval.

  Returning to FIG. 1, the first forming unit 40 includes a plurality of (for example, 16) first light irradiation units 61. The plurality of first light irradiation parts 61 are fixed to the frame 81 so as to be arranged in parallel with the first nozzles 47 at predetermined intervals at positions on the (+ X) side of the plurality of first nozzles 47. That is, the first nozzle 47 and the first light irradiation unit 61 of the first head 41 are integrally fixed to the frame 81. One end of an optical fiber 62 is optically connected to the first irradiation unit 47. The other end of the optical fiber 62 is optically connected to the first light source unit 63. The first light source unit 63 includes a light source that emits ultraviolet light, and a shutter mechanism that is disposed between the light source and the optical fiber 63.

  The second forming unit 50 is disposed on the (+ X) side from the first forming unit 40. The second forming unit 50 is a forming unit for forming a bus wiring pattern (bus wiring pattern 73) on the main surface of the substrate 9. The second forming unit 50 includes a plurality of second nozzles 57 that discharge the paste 7 that is a material for forming a pattern. The plurality of second nozzles 57 are provided in a row along the Y direction below the second head 51 extending in the Y direction. The 2nd head 51 is attached to the lower surface of the beam part of the flame | frame 82 provided in the base 31 so that the board | substrate mounting part 20 might be straddled along a Y direction.

  One end of a pipe 52 is connected to the second head 51 through a flow path. The other end of the pipe 52 is connected to a supply source of air (air) (not shown). In the middle of the pipe 52, a valve 55 for opening and closing the flow path of the pipe 52 and a regulator 56 for adjusting the pressure of air supplied to the second head 51 are interposed. Further, a paste supply mechanism (not shown) for supplying the paste 7 is provided in the second head 51.

  As shown in FIG. 2A, the second head 51 has a manifold 88 formed therein and a piston 84, similarly to the first head 41. A pipe 52 is connected to the space above the manifold 87 above the piston 84. The space below the manifold 88 below the piston 84 is filled with the paste 7.

  As shown in FIGS. 2A and 2C, a plurality of (for example, two) second nozzles 57 are provided vertically downward (in the −Z direction) and in a row in the Y direction below the second head 51. It is done. A rectangular discharge port 86 is provided at the lower end of the second nozzle 57, and the discharge port 86 and the space below the manifold 88 communicate with each other through a flow path formed in the second nozzle 57. The width dimension of the discharge port 86 in the Y direction is substantially equal to the width dimension of the bus wiring pattern 73 to be formed, for example, 2 mm, and the interval between the plurality of discharge ports 86 is approximately equal to the interval between the plurality of bus wiring patterns 73. .

  Returning to FIG. 1, the second forming unit 50 further includes a plurality of (for example, two) second light irradiation units 64. The second light irradiation unit 64 is fixed to the frame 82 so as to be arranged in parallel with the second nozzle 57 at a predetermined interval at a position on the (+ X) side of the second nozzle 57. That is, the second nozzle 57 and the second light irradiation unit 64 of the second head 51 are integrally fixed to the frame 82. One end of an optical fiber 65 is optically connected to the second light irradiation unit 64. The other end of the optical fiber 65 is optically connected to the second light source unit 66. The second light source unit 66 includes a light source that emits ultraviolet light and a shutter mechanism that is disposed between the light source and the optical fiber 65.

  FIG. 3 is a block diagram showing an electrical configuration of the pattern forming apparatus 1. The control unit 60 is a computer including a CPU, a RAM, a ROM, and the like. The ROM stores a program for controlling the operation of the pattern forming apparatus 1, a speed parameter that is a speed condition for controlling the moving speed of the stage 21 (that is, the moving speed of the substrate 9), and the like. The speed condition is a speed condition adjusted in advance by a speed adjustment step (step S20 in FIG. 4 or step S21 in FIG. 11) described later.

  The control unit 60 is electrically connected to the turntable 23 and controls the turning operation of the turntable 23. The controller 60 is electrically connected to the elevating unit 22 and controls the elevating operation of the elevating unit 22. The control unit 60 is electrically connected to the valves 45 and 55, and controls the opening / closing operation of each valve. The control unit 60 is electrically connected to the first light source unit 63 and the second light source unit 66, respectively, and controls turning on / off of the light source in each light source unit and opening / closing operation of the shutter mechanism.

  The control unit 60 is electrically connected to the motor 35, controls the driving / stopping of the motor 35, the rotation speed and the rotation direction, and acquires feedback information from the motor 35. The rotation speed of the motor 35 is controlled by the control unit 60 in accordance with the speed parameter. Further, the control unit 60 calculates and detects the movement distance from the origin position in the X direction of the substrate platform 20 based on feedback information from the motor 35. In other words, the control unit 60 calculates and detects the position of the substrate 9 placed on the stage 21 in the X direction. The control unit 60 corresponds to the control means of the present invention.

<First Embodiment>
Next, a first embodiment of the pattern forming operation will be described with reference to the flowchart shown in FIG. As shown in FIG. 4, the viscosity characteristic measurement step (step S10), the speed adjustment step (step S20), and the coating step (step S30) are sequentially executed. First, the coating process (step S30) will be described. In step S30, the finger wiring pattern 71 and the bus wiring pattern 73 are applied and formed on the main surface of the substrate 9 by the pattern forming apparatus 1 (application process). The details of this coating process (step S30) are as follows.

  That is, in step S31 shown in FIG. 5, the substrate 9 is placed at a predetermined position on the stage 21 arranged at the end (−X) side (origin position) in FIG. . When the substrate 9 is placed on the stage 21, the control unit 60 starts driving the motor 35 to rotate the ball screw 33. When the ball screw 33 is rotationally driven, the nut portion 25 is driven in the (+ X) direction, and the substrate platform 20 including the stage 21 starts moving in the (+ X) direction. When the control unit 60 detects that the front end portion (+ X direction end portion) of the substrate 9 has reached the lower side of the first nozzle 47 of the first forming unit 40 based on feedback information from the motor 35, The driving is stopped and the movement of the stage 21 is stopped. At this stop position, the first nozzle 47 and the application start position of the finger wiring pattern 71 at the tip of the substrate 9 are opposed to each other (substrate loading step).

  Next, the formation process of the finger wiring pattern 71 is performed in step S32. Specifically, the control unit 60 drives the motor 35 to start moving the stage 21 in the (+ X) direction and opens the valve 45. At this time, the control unit 60 controls the rotational speed of the motor 35 so that the stage 21 increases the speed based on the speed condition (speed parameter) adjusted in advance in step S20 described later, and shifts to a constant speed.

  When the valve 45 is opened by the control unit 60, pressurized air is supplied to the space above the manifold 87 in the first head 41 via the pipe 42. The piston 83 is pushed down by the pressure of the air supplied to the upper space, and as a result, the paste 7 filled in the lower space of the manifold 87 is discharged from the plurality of discharge ports 85, respectively.

  The paste 7 discharged from the discharge port 85 is supplied to the application start position of the substrate 9 that has started moving. Thereafter, the supply of the paste 7 from the discharge port 85 is continued, and the moving speed of the substrate 9 is increased to a predetermined speed, and then the predetermined speed is maintained. When the controller 60 detects that the application end position at the (−X) side end of the substrate 9 has reached the lower side of the first nozzle 47 based on feedback information from the motor 35, the controller 60 detects the valve 45. Is closed and the discharge of the paste 7 from the discharge port 85 is stopped.

  By the above-described operation, as shown in FIG. 6A, the paste 7 discharged from the 16 discharge ports 85 of the first nozzle 47 is supplied linearly to the main surface of the substrate 9 moving in the X direction. . Further, the paste 7 supplied to the main surface of the substrate 9 is irradiated with light (ultraviolet rays) from the light irradiation unit 61 and the paste 7 is cured. As a result, as shown in FIG. 6B, 16 finger wiring patterns 71 are formed along the X direction and parallel to each other (finger wiring forming step).

  As described above, since the paste 7 is cured while the shape of the paste 7 immediately after being discharged from the discharge port 85 of the first nozzle 47 is substantially maintained, the cross-sectional dimension of the finger wiring pattern 71 is, for example, 50 μm wide and high Can be 50 μm. When the conventional screen printing method is used, the finger wiring has a cross-sectional dimension of, for example, a width of 120 μm and a height of 20 μm. Using the pattern forming method of the present embodiment, a thick film wiring pattern can be formed. it can. That is, according to the pattern forming method of this embodiment, the ratio of the height to the width of the cross-sectional dimension can be increased, and the aspect ratio can be increased.

  Also, the starting end portion (+ X side end portion) of the finger wiring pattern 71 can be formed to have substantially the same cross-sectional dimensions as the cross-sectional dimensions other than the starting end portion. As a result, the longitudinal direction of the finger wiring pattern 71 ( The finger wiring pattern 71 can be formed with a substantially uniform cross-sectional dimension over the X direction.

  Next, in step S33, the control unit 60 rotates the turntable 23 to rotate the stage 21 holding the substrate 9 by 90 degrees. When the stage 21 is rotated 90 degrees, the longitudinal direction of the finger wiring pattern 71 formed on the substrate 9 becomes parallel to the Y direction (stage 90-degree rotation process). The moving direction of the substrate 9 placed on the stage 21 by rotating the stage 21 by 90 degrees in this way is the moving direction (first direction) in the step of forming the finger wiring pattern 71 in step S32 described above. It will be changed relatively in the 2nd direction which intersects by orthogonal relation.

  After executing step S33, the controller 60 drives the motor 35 to move the stage 21 in the (+ X) direction, and the (+ X) side end of the substrate 9 is below the second nozzle 57 of the second forming unit 50. Is reached, the drive of the motor 35 is stopped and the movement of the stage 21 is stopped.

  Next, in step S34, a process of forming the bus wiring pattern 73 is performed. The formation process of the bus wiring pattern 73 is performed in substantially the same manner as the formation process of the finger wiring pattern 71 in step 32 described above. That is, the control unit 60 drives the motor 35 to start moving the stage 21 in the (+ X) direction, and opens the valve 55 to start discharging the paste 7 from the second nozzle 57. Thereafter, when the control unit 60 detects that the application end position at the (−X) side end of the substrate 9 has reached the lower side of the second nozzle 57 based on the feedback information from the motor 35, the control unit 60 The valve 55 is closed and the discharge of the paste 7 from the discharge port 86 is stopped. As a result, as shown in FIGS. 7A and 7B, the paste 7 discharged from the two discharge ports 86 of the second nozzle 57 is the main surface of the substrate 9 moving in the X direction and the finger wiring pattern 71. After being supplied to each of the lines in a straight line, the resin is cured to form two bus wiring patterns 73 along the X direction and parallel to each other (bus wiring forming step). The bus wiring pattern 73 intersects the finger wiring pattern 71 in an orthogonal relationship, and the bus wiring pattern 73 has, for example, a width of 2 mm and a height of 50 μm.

  Next, when the control unit 60 detects that the stage 21 has reached the end on the (+ X) side shown in FIG. 1 in step S35, the control unit 60 stops driving the motor 35 and stops the movement of the stage 21. Then, a transport robot or an operator (not shown) receives and unloads the substrate 9 from the stopped stage 21 (substrate unloading step).

  As described above, the finger wiring pattern 71 and the bus wiring pattern 73 formed on the antireflection film on the surface of the substrate 9 are formed under the antireflection film by a fire-through method in a subsequent baking process. It will be electrically connected to the n-type diffusion layer.

  Returning to FIG. 4, the viscosity characteristic measurement step (step S10) and the speed adjustment step (step S20), which are preparation steps prior to the coating step (step S30), will be described. First, in step S10, the viscosity characteristic according to the shearing force applied to the paste 7 which is a high viscosity material is measured.

  Here, when the piston 83 of the first head 41 is pushed down and pressure is applied to the paste 7, the paste 7 flows from the inside of the manifold 87 toward the discharge port 85 of the first nozzle 47. At this time, since the paste 7 having a high viscosity is pushed down by the piston 83 immediately after the discharge of the paste 7 is started, the pushing speed of the piston 83 becomes slow. As a result, immediately after the start of discharge, the discharge amount per unit time of the paste 7 discharged from the discharge port 85 is reduced.

  The paste 7 flowing from the inside of the manifold 87 toward the discharge port 85 of the first nozzle 47 is subjected to a shearing force due to friction between the inner wall of the manifold 87 and the inner wall of the flow path of the first nozzle 47, and the paste 7 is sheared. Stress is generated. Since the paste 7 has thixotropic properties, the viscosity decreases when shear stress is generated in the paste 7. As the viscosity of the paste 7 decreases, the pushing speed of the piston 83 increases, and as a result, the discharge amount of the paste 7 discharged from the discharge port 85 per unit time increases.

  Since the piston 83 is elastically pushed down by the air pressure as described above, the pushing speed of the piston 83 depends on the viscosity of the paste 7 and becomes slow immediately after the start of discharge when the viscosity of the paste 7 is high. As the viscosity of the paste 7 decreases as the pressure is reduced, the speed increases. As a result, the discharge amount of the paste 7 from the discharge port 85 is small immediately after the start of discharge, and then gradually increases.

  Therefore, prior to the coating step (step S30), the viscosity change (viscosity characteristics) of the paste 7 is measured while increasing the shearing force applied to the paste 7 with a rheometer (rotary viscometer). As a result, for example, the viscosity characteristic NC2 of the paste 7 shown by a solid line in FIG. 8 is obtained (viscosity characteristic measurement step). A viscosity characteristic NC1 indicated by a broken line in FIG. 8 indicates a viscosity characteristic of a paste different from the previously obtained paste 7, and is hereinafter referred to as a reference paste viscosity characteristic NC1. Further, the viscosity characteristic NC3 indicated by a two-dot chain line in FIG. 8 shows a viscosity characteristic of a paste different from the paste 7, and is hereinafter referred to as a viscosity characteristic NC3 of the second paste.

  As shown in FIG. 8, the viscosity characteristic NC2 of the paste 7 is that the paste 7 has thixotropy, so that the shear force applied to the paste 7, that is, the shear stress generated in the paste 7 increases, for example, 10000 Pa · The viscosity tends to decrease from s (Pascal second) to 100 Pa · s. Moreover, the rate of viscosity reduction in the viscosity characteristic NC2 of the paste 7 is larger than the rate of viscosity reduction in the viscosity characteristic NC1 of the reference paste. In addition, the ratio of the viscosity reduction accompanying the increase in the shearing force in the viscosity characteristic NC3 of the second paste is smaller than the ratio of the viscosity reduction in the viscosity characteristic NC1 of the reference paste. Thus, although the viscosity characteristics of each paste are different, when a shear force SO or more is applied to each paste, for example, a substantially constant viscosity NS (eg, 100 Pa · s) within a range of 10 Pa · s to 1000 Pa · s. Such a paste is selected.

  Next, in step S20, the speed at which the movement of the substrate 9 in the first forming unit 40 is started in the above-described coating process (step S30) is adjusted in advance. In other words, the speed parameter to be stored in the ROM of the control unit 60 is adjusted (speed adjustment process). FIG. 9 is a graph (speed parameter) showing a change in the speed V of the substrate 9 with respect to the elapsed time t when the movement of the substrate 9 in the first forming unit 40 is started in the above-described coating process (step S30). It is. The speed parameter indicated by the broken line in FIG. 9 indicates the speed parameter Vp1 that has been experimentally obtained in advance. In the finger wiring forming step (step S32) of the coating step that has been experimentally performed, the reference paste is used as the first nozzle. This is the speed parameter when the starting end of the finger wiring pattern 71 can be uniformly formed as shown in FIG.

  Here, according to the viscosity characteristic NC2 of the paste 7 shown by a solid line in FIG. 8, the viscosity of the paste 7 decreases as the shearing force applied to the paste 7, that is, the shear stress generated in the paste 7 increases. However, the viscosity of the paste 7 is larger than the viscosity of the reference paste (refer to the viscosity characteristic NC1) until the viscosity of the paste 7 decreases to the viscosity NS.

  As described above, since the viscosity characteristic NC2 of the paste 7 is different from the viscosity characteristic NC1 of the reference paste, when the paste 7 is pushed down more than the pushing speed when the reference paste is pushed down by the piston 83 with the same air pressure. The depressing speed of is slow. As a result, the discharge amount of the paste 7 discharged from the discharge port 85 per unit time is smaller than the discharge amount of the reference paste. As a result, if the paste 7 is supplied to the substrate 9 while the substrate 9 is moved with the reference paste speed parameter Vp1 (FIG. 9A), the supply amount of the paste 7 is not sufficient, and thus the finger wiring pattern 71 starts. The ends are not uniform, and for example, as shown in FIGS. 12B and 12C, a thin line portion 71n, an island portion 71i, and a broken portion 71b are generated at the start end of the finger wiring pattern 71.

  FIG. 12A is a plan view and a side view showing a state in which the finger wiring pattern 71 has a uniform line width and height dimension including its starting end (tip). FIG. 12B is a plan view and a side view showing a state in which a thin line portion 71 n having a small line width and height is formed at the start end of the finger wiring pattern 71. In FIG. 12C, after the island portion 71i is formed by the paste 7 at the start end (application start position) of the finger wiring pattern 71, the thin wire portion 71n is formed through the broken portion 71b where the supply of the paste 7 is interrupted. It is the top view and side view which show a state.

  Therefore, when the finger wiring pattern 71 is applied and formed with the paste 7, the acceleration when starting the movement of the substrate 9 from the application start position of the first forming unit 40 is determined from the acceleration a1 indicated by a broken line in FIG. The speed parameter Vp2 is reduced to the acceleration a2 indicated by the solid line. The speed parameter Vp2 is a speed parameter that shifts to a constant speed Vc after increasing the speed by the acceleration a2. By changing to such a speed parameter Vp2, even if the discharge amount of the paste 7 from the first nozzle 47 is smaller than that of the reference paste, the acceleration of the substrate 9 is accordingly reduced. A sufficient amount of paste 7 can be supplied to the application start end of the finger wiring pattern 71. As a result, as shown in FIG. 12A, a finger wiring pattern 71 having a uniform line width and height dimension including its starting end (tip) can be formed. Here, “uniform” indicates a state in which the line width and the height dimension of the finger wiring pattern 71 are uniform to such an extent that the current collecting ability by the finger wiring does not decrease, and there may be a dimensional error of about several μm, for example. .

  9B, when the finger wiring pattern 71 is applied and formed with the paste 7, the substrate 9 is moved when the movement of the substrate 9 is started from the application start position of the first forming unit 40. You may employ | adopt the speed parameter Vp2 which moves the board | substrate 9 for a predetermined period by the fixed speed Vs smaller than the fixed speed Vc before accelerating and shifting to the fixed speed Vc. By changing to such a speed parameter Vp2, even if the discharge amount of the paste 7 from the first nozzle 47 is smaller than that in the case of the reference paste, the movement of the substrate 9 is accordingly reduced at the low speed Vs. Since a period for moving the substrate 9 is provided, a sufficient amount of paste 7 can be supplied to the application start end of the finger wiring pattern 71. As a result, as shown in FIG. 12A, a finger wiring pattern 71 having a uniform line width and height dimension including its starting end (tip) can be formed.

  Next, a case where the finger wiring pattern 71 is applied and formed with a second paste different from the paste 7 will be described. According to the viscosity characteristic NC3 of the second paste indicated by a two-dot chain line in FIG. 8, the viscosity of the second paste increases as the shearing force applied to the second paste, that is, the shearing stress generated in the second paste increases. Although the viscosity tends to decrease, the viscosity of the second paste is smaller than the viscosity of the reference paste (see viscosity characteristic NC1) until the viscosity of the second paste decreases to the viscosity NS.

  As described above, since the viscosity characteristic NC3 of the second paste is different from the viscosity characteristic NC1 of the reference paste, the second paste is pushed down more than the pressing speed when the reference paste is pushed down by the piston 83 with the same air pressure. The push-down speed will increase. As a result, the discharge amount of the second paste discharged from the discharge port 85 is larger than the discharge amount of the reference paste, and while moving the substrate 9 with the reference paste speed parameter Vp1 (FIG. 9A), When the second paste is supplied to the substrate 9, the supply amount of the second paste increases, and the starting end of the finger wiring pattern 71 becomes thick and does not become uniform.

  Therefore, when the finger wiring pattern 71 is applied and formed with the second paste, the acceleration a1 indicated by the broken line in FIG. 9A is the acceleration when the movement of the substrate 9 is started from the application start position of the first forming unit 40. To a speed parameter Vp3 that is increased to an acceleration a3 indicated by a two-point difference line. This speed parameter Vp3 is a speed parameter for shifting to a constant speed Vc after increasing the speed by the acceleration a3. By changing to such a speed parameter Vp3, even if the discharge amount of the second paste from the first nozzle 47 is increased as compared with the reference paste, the acceleration of the substrate 9 is correspondingly reduced. An appropriate amount of paste 7 can be supplied to the application start end of the finger wiring pattern 71. As a result, as shown in FIG. 12A, a finger wiring pattern 71 having a uniform line width and height dimension including its starting end (tip) can be formed.

<Modification of First Embodiment>
The speed parameter Vp1 of the substrate 9 when the finger wiring pattern 71 is applied and formed with the reference paste is lower than the speed Vc in the middle of increasing the speed of the substrate 9 to the constant speed Vc as shown by the broken line in FIG. When the speed parameter is a speed parameter for moving the substrate 9 for a predetermined period at a constant speed Vs1, the speed parameter may be changed as follows according to the viscosity characteristics of the paste.

  That is, as shown by a solid line in FIG. 10A, when the finger wiring pattern 71 is applied and formed with the paste 7, the speed of the substrate 9 is increased to a constant speed Vc and is lower than the speed Vc. Then, the speed is changed to a speed parameter Vp2 for moving the substrate 9 for a predetermined period at a constant speed Vs2 which is lower than the speed Vs1. By changing to such a speed parameter Vp2, even if the discharge amount of the paste 7 from the first nozzle 47 is smaller than that of the reference paste, the movement of the substrate 9 is accordingly started at the speed Vs1. Since a period in which the substrate 9 is moved at a low speed Vs2 is provided, a sufficient amount of paste 7 can be supplied to the application start end of the finger wiring pattern 71. As a result, as shown in FIG. 12A, a finger wiring pattern 71 having a uniform line width and height dimension including its starting end (tip) can be formed.

  Further, when the finger wiring pattern 71 is applied and formed with the second paste, the speed parameter Vp3 is changed. By changing to such a speed parameter Vp3, even if the discharge amount of the paste 7 from the first nozzle 47 is increased as compared with the reference paste, the movement of the substrate 9 is accordingly started from the speed Vs1. Since a period for moving the substrate 9 at the high speed Vs3 is provided, an appropriate amount of the second paste can be supplied to the application start end of the finger wiring pattern 71. As a result, as shown in FIG. 12A, a finger wiring pattern 71 having a uniform line width and height dimension including its starting end (tip) can be formed.

  The length of the low speed period in the reference paste speed parameter Vp1 may be changed according to the viscosity measurement of the paste. Specifically, the speed parameter Vp1 of the substrate 9 when the finger wiring pattern 71 is applied and formed with the reference paste is increased while the speed of the substrate 9 is increased to a constant speed Vc as shown by the broken line in FIG. In the case of the speed parameter for moving the substrate 9 at a constant speed Vs that is low during the period t1, the length of the low speed period may be changed according to the viscosity characteristics of the paste. For example, when the finger wiring pattern 71 is applied and formed with the paste 7, a speed parameter Vp2 indicated by a solid line may be adopted in which the period of the low speed Vs is changed so as to be increased from t1 to t2. By extending the low speed period in this manner, a sufficient amount of paste 7 can be supplied to the application start end of the finger wiring pattern 71. As a result, as shown in FIG. 12A, a finger wiring pattern 71 having a uniform line width and height dimension including its starting end (tip) can be formed.

  Further, when the finger wiring pattern 71 is applied and formed with the second paste, a speed parameter Vp3 indicated by a two-dot chain line in which the period of the low speed Vs is shortened from t1 to t3 may be employed. Thus, by shortening the low speed period, an appropriate amount of paste 7 can be supplied to the application start end of the finger wiring pattern 71. As a result, as shown in FIG. 12A, a finger wiring pattern 71 having a uniform line width and height dimension including its starting end (tip) can be formed.

Second Embodiment
Next, a second embodiment of the pattern forming operation will be described with reference to the flowchart shown in FIG. As shown in FIG. 11, in the second embodiment, the paste stirring step (step S5), the start end observation step (step S11), the speed adjustment step (step S20), and the coating step (step S30) are sequentially executed. The details of the coating process (step S30) are the same as the coating process (step S30) in the first embodiment described above.

  As a preparatory process prior to the coating process (step S30), the paste 7 is stirred in step S5, thereby degassing the paste 7 and reducing the amount of gas mixed in the paste 7 (paste stirring process). ).

  Next, in step S11, after the finger wiring pattern 71 is applied and formed with the paste 7, the shape of the start end is observed (start end observation step). Specifically, the paste 7 is filled into the manifold 87 of the first head 41, and the above-described finger wiring formation step (step S32 in FIG. 5) is experimentally executed by the pattern forming apparatus 1 to form on the substrate 9. Finger wiring pattern 71 is applied and formed. The speed parameter of the substrate 9 in step S32 is, for example, a reference paste speed parameter Vp1 indicated by a broken line in FIG.

  In the start end observation step of step S11, for example, an image obtained by imaging the start end of the finger wiring pattern 71 by an imaging means such as a camera is observed. For example, a finger wiring pattern 71 having a shape as shown in FIGS. 12B and 12C can be observed. Note that the starting end of the finger wiring pattern 71 may be directly observed visually.

  In the observation process of the start end, for example, as shown in FIG. 12B, a shape in which the thin line portion 71n is formed at the start end of the finger wiring pattern 71 is observed, or as shown in FIG. The shape in which the thin wire portion 71n, the island portion 71i, and the disconnection portion 71b are formed is observed. This observation result indicates that the discharge amount of the paste 7 discharged from the discharge port 85 was not sufficient and insufficient at the start of discharge. The reason why the discharge amount of the paste 7 is insufficient is that the amount of gas mixed in the paste 7 is larger than the amount of gas mixed in the reference paste. The amount of gas mixed in the paste is reduced by the above-described paste stirring step (step S5), but the amount of gas (degree of gas mixing) differs depending on the type of paste. Here, when the piston 83 is pushed down, the paste filled in the manifold 87 is pressurized and compressed, and when the pressure exceeds a predetermined pressure, the paste is discharged from the discharge port 85. Since the gas mixed in the paste has higher compressibility than the paste, the time until the pressure becomes higher than the predetermined pressure becomes longer as the amount of the gas mixed in the paste is larger. As a result, the larger the amount of gas mixed in the paste, the smaller the discharge amount per unit time at the start of discharge.

  Next, in step S21 shown in FIG. 11, the speed at which the movement of the substrate 9 in the first forming unit 40 is started in the above-described coating process (step S30) is adjusted in advance. In other words, the speed condition (speed parameter) to be stored in the ROM of the control unit 60 is adjusted (speed adjustment process).

  Specifically, when the shape of the start end as shown in FIGS. 12B and 12C is observed in the start end observation step (step S11), the first nozzle 47 at the application start end is observed. It is determined that a sufficient amount of paste 7 has not been discharged. For example, when the finger wiring pattern 71 is applied and formed with the paste 7, the acceleration when the movement of the substrate 9 is started from the application start position of the first forming unit 40 is indicated by a broken line in FIG. The speed parameter Vp2 is changed from a1 to the acceleration a2 indicated by the solid line. The speed parameter Vp2 is a speed parameter that shifts to a constant speed Vc after increasing the speed by the acceleration a2. By changing to the speed parameter Vp2 in which the acceleration is reduced in this way, a sufficient amount of paste 7 can be supplied to the application start end of the finger wiring pattern 71. As a result, as shown in FIG. 12A, a finger wiring pattern 71 having a uniform line width and height dimension including its starting end (tip) can be formed.

  Further, as shown by a solid line in FIG. 9B, when the finger wiring pattern 71 is applied and formed with the paste 7, the movement of the substrate 9 is started when the movement of the substrate 9 is started from the application start position of the first forming unit 40. A speed parameter Vp2 for moving the substrate 9 for a predetermined period at a speed Vs smaller than the constant speed Vc before the speed is increased to shift to the constant speed Vc may be adopted. Thus, by changing to the speed parameter Vp2 provided with the period during which the substrate 9 is moved at the low speed Vs, a sufficient amount of paste 7 can be supplied to the application start end of the finger wiring pattern 71. As a result, as shown in FIG. 12A, a finger wiring pattern 71 having a uniform line width and height dimension including its starting end (tip) can be formed.

  Next, the case where the finger wiring pattern 71 is applied and formed with a third paste different from the paste 7 will be described. The gas mixing amount (mixing amount) after the third paste stirring step (step S5 in FIG. 11) is smaller than the mixing amount of the reference paste. As described above, the time until the paste becomes equal to or higher than the predetermined pressure required for discharge at the start of discharge depends on the amount of gas mixed in the paste, and the time increases as the amount of gas increases. Therefore, the discharge amount of the third paste discharged from the discharge port 85 at the start of discharge is larger than the discharge amount of the reference paste. As a result, the finger wiring pattern 71 having a thick coating start end is observed in the start end observation step (step S11).

  Therefore, when the finger wiring pattern 71 is applied and formed with the third paste, the acceleration a1 indicated by the broken line in FIG. 9A indicates the acceleration when the movement of the substrate 9 is started from the application start position of the first forming unit 40. To a speed parameter Vp3 that is increased to an acceleration a3 indicated by a two-point difference line. This speed parameter Vp3 is a speed parameter for shifting to a constant speed Vc after increasing the speed by the acceleration a3. By changing to the speed parameter Vp3 with increased acceleration in this way, an appropriate amount of the third paste can be supplied to the application start end of the finger wiring pattern 71. As a result, as shown in FIG. 12A, a finger wiring pattern 71 having a uniform line width and height dimension including its starting end (tip) can be formed.

<Modification of Second Embodiment>
The speed parameter Vp1 of the substrate 9 when the finger wiring pattern 71 is applied and formed with the reference paste is lower than the speed Vc in the middle of increasing the speed of the substrate 9 to the constant speed Vc as shown by the broken line in FIG. When the speed parameter is the speed parameter for moving the substrate 9 for a predetermined period at the speed Vs1, the speed parameter may be changed as follows according to the observation result in the start end observation step (step S11).

  Specifically, in the above-described start end observation step (step S11 in FIG. 11), the finger wiring pattern 71 is formed by applying the paste 7 experimentally using the reference paste speed parameter Vp1 indicated by the broken line in FIG. When the starting end state shown in FIGS. 12B and 12C is observed, the speed parameter may be changed as follows. That is, when the start end state shown in FIGS. 12B and 12C is observed, it is determined that a sufficient amount of paste 7 is not supplied to the substrate 9 as described above. Then, as shown by the solid line in FIG. 10A, when the finger wiring pattern 71 is applied and formed with the paste 7, the speed of the substrate 9 is increased to a constant speed Vc and is lower than the speed Vc. Then, the speed is changed to the speed parameter Vp2 for moving the substrate 9 for a predetermined period at the speed Vs2 which is lower than the speed Vs1. Thus, by changing to the speed parameter Vp2 provided with the period during which the substrate 9 is moved at the speed Vs2 which is lower than the speed Vs1, a sufficient amount of the paste 7 can be supplied to the application start end of the finger wiring pattern 71. it can. As a result, as shown in FIG. 12A, a finger wiring pattern 71 having a uniform line width and height dimension including its starting end (tip) can be formed.

  Further, when the finger wiring pattern 71 is applied and formed by the third paste, the speed parameter Vp3 is changed to a speed parameter Vp3 provided with a period for moving the substrate 9 at a speed Vs3 higher than the speed Vs1. By changing to such a speed parameter Vp3, an appropriate amount of the third paste can be supplied to the application start end of the finger wiring pattern 71. As a result, as shown in FIG. 12A, a finger wiring pattern 71 having a uniform line width and height dimension including its starting end (tip) can be formed.

  The length of the low speed period in the reference paste speed parameter Vp1 may be changed according to the observation result in the start end observation step (step S11). Specifically, the speed parameter Vp1 of the substrate 9 when the finger wiring pattern 71 is applied and formed with the reference paste is increased while the speed of the substrate 9 is increased to a constant speed Vc as shown by the broken line in FIG. When the speed parameter is such that the substrate 9 is moved at the constant low speed Vs for the period t1, the length of the low speed period may be changed according to the observation result in the start end observation step (step S11). For example, when the finger wiring pattern 71 is applied and formed with the paste 7, a speed parameter Vp2 indicated by a solid line may be adopted in which the period of the low speed Vs is changed so as to be increased from t1 to t2. By extending the low speed period in this manner, a sufficient amount of paste 7 can be supplied to the application start end of the finger wiring pattern 71. As a result, as shown in FIG. 12A, a finger wiring pattern 71 having a uniform line width and height dimension including its starting end (tip) can be formed.

  Further, when the finger wiring pattern 71 is applied and formed with the third paste, a speed parameter Vp3 indicated by a two-dot chain line in which the period of the low speed Vs is shortened from t1 to t3 may be employed. Thus, by shortening the low speed period, an appropriate amount of the third paste can be supplied to the application start end of the finger wiring pattern 71. As a result, as shown in FIG. 12A, a finger wiring pattern 71 having a uniform line width and height dimension including its starting end (tip) can be formed.

The above-described embodiment may be modified as follows.
In the speed adjustment process (step S20 or step S21) of the above-described embodiment or modification, when the speed parameter Vp1 is changed and adjusted based on the viscosity characteristic or the observation result, the change of FIG. If a speed parameter that can apply and form a uniform finger wiring pattern 71 as shown in FIG. 4 is not obtained, an appropriate speed parameter may be obtained by changing the speed parameter a plurality of times. In addition, a relationship between a plurality of viscosity characteristics and an appropriate speed parameter corresponding to the shape (observation result) of the coating start end is obtained in advance, and the viscosity of the paste measured in the viscosity characteristics measurement step (step S10 in FIG. 4). The speed adjustment step (step S20) may be executed so as to select the speed parameter corresponding to the observation result of the characteristics and the start end observation step (step S11 in FIG. 11).

  In the above-described embodiments and modifications, a paste having no photocurability may be used. Such a paste is a paste that is solidified only by the volatilization of the solvent without using a curing treatment such as photocuring, and includes, for example, conductive particles and an organic vehicle (a mixture of a solvent, a resin, a thickener, and the like). The conductive particles are, for example, silver powder, and the organic vehicle contains ethyl cellulose as a resin material and an organic solvent. In this case, the light irradiation part and light source part for photocuring a paste become unnecessary. In addition, the structure hardened by heating the paste which does not have photocurability may be sufficient.

  Instead of a configuration in which the piston 38 is elastically pushed down by air pressure, a rod may be connected to the piston 38, and the rod 38 may be pushed down by a push-down mechanism having a motor, a ball screw, and the like.

  In the above embodiment, the substrate 9 moves relative to the first forming unit 40 and the second forming unit 50. However, the first forming unit 40 and the second forming unit 50 are arranged with respect to the fixedly arranged substrate 9. It may be moved in the X direction. Alternatively, the first forming unit 40 may be moved in a predetermined direction (for example, the X direction) with respect to the fixedly arranged substrate 9 and the second forming unit 50 may be moved in a direction orthogonal to the predetermined direction (for example, the Y direction). good.

  The pattern formed by the present invention is not limited to the finger wiring pattern and the bus wiring pattern, and may be a partition pattern formed on a substrate when manufacturing a plasma display panel (PDP), for example. Alternatively, an adhesive pattern formed on the substrate may be used. Moreover, the pattern containing the active material material formed on a collector when manufacturing a battery may be sufficient.

DESCRIPTION OF SYMBOLS 1 Pattern formation apparatus 7 Paste 9 Substrate 20 Substrate mounting part 30 Drive part 40 1st formation part 41 1st head 47 1st nozzle 50 2nd formation part 51 2nd head 57 2nd nozzle 60 Control part 61 1st light irradiation Part 64 Second light irradiation part 71 Bus wiring pattern 73 Finger wiring pattern

Claims (11)

A viscosity characteristic measuring step for measuring a viscosity characteristic according to a shear stress of a material for forming a pattern;
Based on the viscosity characteristic measured by the viscosity characteristic measurement step, a speed adjustment step of adjusting the speed condition of the substrate when starting the discharge of the material from the nozzle toward the substrate that moves relative to the nozzle;
When starting the discharge of the material from the nozzle, the substrate is moved relative to the nozzle under the speed condition adjusted by the speed adjustment process, and the material is discharged from the nozzle toward the substrate to be on the substrate. An application step of forming a linear pattern of the material;
A pattern forming method comprising: In the pattern formation method described in Claim 1,
A pattern forming method, wherein the speed adjustment step is a step of adjusting the relative acceleration of the substrate with respect to the nozzle based on the viscosity characteristic measured by the viscosity characteristic measurement step. In the pattern formation method described in Claim 1,
The speed condition is a speed condition having a period of a constant speed lower than a predetermined speed in the middle of increasing the relative movement speed of the substrate to a predetermined speed when starting the discharge of the material from the discharge port of the nozzle. ,
The pattern forming method, wherein the speed adjusting step is a step of adjusting the value of the constant speed based on the viscosity characteristic measured by the viscosity characteristic measuring step. In the pattern formation method described in Claim 1,
The speed condition is a speed condition having a period of a constant speed lower than a predetermined speed in the middle of increasing the relative movement speed of the substrate to a predetermined speed when starting the discharge of the material from the discharge port of the nozzle. ,
The pattern forming method, wherein the speed adjusting step is a step of adjusting a length of the period of the constant speed based on the viscosity characteristic measured by the viscosity characteristic measuring step. An observation step of observing the shape of the starting end of the linear pattern formed on the substrate by discharging the material for forming the pattern from the nozzle toward the substrate moving relative to the nozzle;
Based on the shape of the starting end of the linear pattern observed in the observation step, a speed adjustment step of adjusting the speed condition of the substrate when starting the discharge of the material from the nozzle to the substrate that moves relative to the nozzle;
When starting the discharge of the material from the nozzle, the substrate is moved relative to the nozzle under the speed condition adjusted by the speed adjustment process, and the material is discharged from the nozzle toward the substrate to be on the substrate. An application step of forming a linear pattern of the material;
A pattern forming method comprising: In the pattern formation method described in Claim 5,
A pattern forming method, wherein the speed adjustment step is a step of adjusting the relative acceleration of the substrate with respect to the nozzle based on the shape of the starting end of the linear pattern observed in the observation step. In the pattern formation method described in Claim 5,
The speed condition is a speed condition having a period of a constant speed lower than the predetermined speed in the middle of increasing the relative movement speed of the substrate to the predetermined speed when starting the discharge of the material from the nozzle,
A pattern forming method, wherein the speed adjustment step is a step of adjusting the value of the constant speed based on a shape of a starting end of the linear pattern observed in the observation step. In the pattern formation method described in Claim 5,
The speed condition is a speed condition having a period of a constant speed lower than the predetermined speed in the middle of increasing the relative movement speed of the substrate to the predetermined speed when starting the discharge of the material from the nozzle,
A pattern forming method, wherein the speed adjustment step is a step of adjusting the length of the period of the constant speed based on the shape of the start end of the linear pattern observed in the observation step. In the pattern formation method in any one of Claims 1-8,
The substrate is a substrate for solar cell elements,
The material is a conductive paste having conductivity,
A pattern forming method, wherein the linear pattern is a pattern for finger wiring. A nozzle that linearly discharges a material for forming a pattern;
Moving means for moving the substrate relative to the nozzle;
When starting the discharge of the material from the nozzle, the moving means moves the substrate relative to the nozzle based on the speed condition, and a control means for discharging the material from the nozzle in a linear shape toward the substrate. Prepared,
The pattern forming apparatus, wherein the speed condition is a speed condition adjusted in advance based on a viscosity characteristic corresponding to a shear stress of the material. A nozzle that linearly discharges a material for forming a pattern;
Moving means for moving the substrate relative to the nozzle;
When starting the discharge of the material from the nozzle, the moving means moves the substrate relative to the nozzle based on the speed condition, and a control means for discharging the material from the nozzle in a linear shape toward the substrate. Prepared,
The pattern forming apparatus, wherein the speed condition is a speed condition adjusted in advance by observing a shape of a starting end of a linear pattern applied and formed on the substrate by the material.

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