JP2012004024A - Led lighting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an LED lighting device 1000 that efficiently conducts heat generated by an LED 211 to a heat radiating member on a substrate 214 on which the LED 211 is mounted, and improves light output characteristics emitted from the LED 211.
An LED lighting device 1000 includes an LED mounting substrate 210 on which an LED 211 is mounted on a substrate 214, and a reflective cover 250 that covers the LED mounting substrate 210 and has a window portion 251 on which the LED 211 is disposed. The mounting substrate 210 is slightly larger than the opening area of the window 211 and the periphery of the LED 211, and the first printing unit 214b printed in white and the mounting surface other than the first printing unit 214b are printed in black. Since the second printing unit 214c is provided, the heat of the LED 211 emitted when the LED 211 is lit can be radiated with a simple structure, and the light emitted from the LED 211 can be efficiently obtained.
[Selection] Figure 5

Description

  The present invention relates to an LED illumination device including a light emitting diode (LED), for example.

  There is a technique for radiating heat generated from an LED and improving insulation and light extraction efficiency (see, for example, Patent Document 1).

  In addition, there is a technique in which black printing is performed on the substrate to prevent discoloration due to the heat-generating electronic components, and when heat is generated from the heat-generating components, heat is dissipated from the black printing. (See Patent Document 2).

JP 2008-71895 A Japanese Patent Laid-Open No. 2-153588

  However, in the LED mounting board, heat energy is generated as much as light is not generated in the power loss of the LED, and the LED element is overheated and the board on which the LED is mounted is overheated due to this thermal energy. There was a problem such as that the LED has a short life

  The present invention provides an LED lighting device that efficiently conducts heat generated by lighting an LED to a heat radiating member on a substrate on which the LED is mounted, and improves light output characteristics emitted by the LED.

  An LED lighting device according to the present invention includes: an LED mounting substrate on which an LED is mounted on a substrate; and a reflective cover that covers the LED mounting substrate and has a window portion on which the LED is disposed. The substrate is printed in a color around the LED and slightly larger than the opening area of the window, and having a high reflectance in the wavelength of the visible light region, and mounting other than the first printing unit And a second printing portion on which the surface is printed in a color having a low reflectance at wavelengths in the infrared region.

  ADVANTAGE OF THE INVENTION According to this invention, while radiating the heat | fever of LED emitted when LED is lighted with a simple structure, the light emitted from LED can be obtained efficiently.

1 is a perspective view of an LED LED lighting device showing Embodiment 1. FIG. It is a disassembled perspective view of the LEDLED illuminating device of FIG. 2 is an exploded perspective view of the LED module according to Embodiment 1. FIG. It is AA sectional drawing of the state in which the LED module of FIG. 3 was assembled. It is a front view of the LED mounting board of FIG. FIG. 6 is a reflectance characteristic diagram showing a relationship between a wavelength of light and a reflectance in a color of a printing unit according to the first embodiment. FIG. 3 is a circuit diagram showing electrical wiring between the lighting device and the LED module in the first embodiment.

Embodiment 1 FIG.
FIG. 1 is a perspective view of the LED lighting device of Embodiment 1, and FIG. 2 is an exploded perspective view of the LED lighting device of FIG.

  The LED lighting apparatus 1000 includes an instrument main body 100, an LED module 200 attached to the instrument main body 100, and a long design cover 300 that covers the LED module 200.

  The instrument body 100 includes a long base body 110, a lighting device 120 attached to the base body 110, a power terminal block 130 attached to the base body 110 and electrically connected to the lighting device 120, a base A design cover attaching part 140 provided at both ends in the longitudinal direction of the main body 110 to which the design cover 300 is attached, and a main body cover part 150 covering the base main body 110 are provided.

  The base body 110 includes a power supply insertion hole 111 into which a power supply line is inserted from the outside, and a fixing hole (not shown) fixed to the ceiling or the like.

  The design cover attaching part 140 has a design cover fixing hole 141 for fixing the design cover 300 with the side surface shape formed in a “π” shape.

  The main body cover 150 includes two design cover attachment portion insertion holes 151 into which the design cover attachment portion 140 is inserted, and eight LED module fixing holes 152 for fixing the LED module 200.

  The LED module 200 includes two LED mounting boards 210, a connection connector 230a that electrically connects the LED mounting boards 210, a termination connector 230b that indicates a terminal portion of the LED mounting board 210, a connection connector 230a, and a termination connector 230b. An insulating cover 240 that enhances the covering insulating performance, a reflective cover 250 that is mounted on the light emitting surface side of the LED mounting substrate 210, a screw 260 that screws the reflective cover 250 to the main body cover base portion 140, and a reflective cover portion 250 A translucent cover 270 to be attached.

  The LED mounting substrate 210 includes twelve LEDs 211 that are mounted and arranged at equal intervals, a protection element 212 that electrically protects the LEDs 211, a connector 213 that is electrically connected to the lighting device 120, and the like. And a substrate 214 on which the protection element 212 and the connector 213 are mounted.

  The protection elements 212 are electrically connected to the LEDs 211 in parallel. The protection element 212 is an electronic component that suppresses a surge voltage applied to the LED 211, and is, for example, a capacitor, a Zener diode, a varistor, or a resistor.

  The substrate 214 has a copper pattern 214a connected to the LED 211 on a mounting surface on which the LED 211 is mounted, and a first printing unit 214b (hereinafter, also referred to as a white second printing unit 214c14b) printed in white on the copper pattern 214a. )), And a second printing unit 214c14c (printing black on the upper surface of the white second printing unit 214c14b, leaving a white portion around the LED 211 and having the same or slightly larger area than the area of the opening portion of the window portion 251). Hereinafter, it is also referred to as a second printing unit 214c).

  For convenience of explanation, the white second printing portion 214c14b that can be seen from the mounting surface on which the LED 211 on the substrate 214 is mounted is referred to as a reflection area 214d. Correspondingly, the second printing portion 214c (the LED 211 on the substrate 214 is mounted). The portion seen from the mounting surface) is also referred to as a heat dissipation area 214e.

  When the reflective cover 250 is attached so as to cover the LED mounting substrate 210, the reflective cover 250 includes a window 251 provided so as to be at the same position as the LED 211, a screw hole 252 into which the screw 260 is inserted, and the translucent cover 270. A translucent cover locking claw 253 to be stopped.

  The window portion 251 has a cylindrical shape with a predetermined angle so as to collect or diffuse the light of the LED 211 as the LED illumination device 1000. Therefore, the LED 211 is arranged at substantially the center of the window 251 so that light emitted from the LED 211 can be emitted to the outside of the LED lighting device 1000.

  The translucent cover 270 is formed of a highly light-blocking resin or the like so as not to leak light emitted from the LEDs 211.

  Therefore, since the LED mounting substrate 210 is covered with the reflective cover 250 and the light emitting surface of the LED 211 is covered with the translucent cover 270, the user cannot directly see the LED mounting substrate 210 (LED 211). It has become.

  The design cover 300 is formed in a “U” shape on the side surface, a screw hole 320 into which the screw 310 is inserted at both ends in the longitudinal direction, and a light emitting portion insertion hole 330 into which the light emitting portion of the LED module 200 is inserted. With.

  Next, the process of assembling the LED lighting device in the present embodiment will be described.

  3 is an exploded perspective view of the LED module, FIG. 4 is an AA cross-sectional view showing a cross section of the LED module of FIG. 3 assembled, and FIG. 5 is an LED of FIG. It is a front view of a mounting substrate.

  First, the base main body 110 is attached to a ceiling or the like, the design cover attachment portion 140 of the base main body 110 is inserted into the design cover attachment portion insertion portion 151, and the main body cover portion 150 is attached. The LED module 200 is attached to the main body cover 150 in advance.

  Next, the LED module 200 is inserted into the light emitting portion insertion hole 330, the design cover 300 is attached, the screw 310 is inserted into the screw hole 320, and the design cover 300 is fixed.

  In this manner, the design cover 300 and the main body cover 150 are fixed to the base main body 110 by screwing the screws 310.

  Next, a process of attaching the LED module 200 to the main body cover 150 will be described.

  First, the connector 230a and the terminal connector 230b are inserted into the connectors 213 of the two LED mounting boards 210, and the two LED mounting boards 210 connected by the connecting connector 230a are placed on the main body cover 150. Although not shown, an insulating sheet may be provided between the LED mounting substrate 210 and the main body cover 150 in order to increase the insulation.

  Next, an insulating cover 240 is attached so as to cover each connector 213, and a reflective cover 250 is attached to each LED mounting substrate 210. At this time, each of the LEDs 211 mounted on the LED mounting substrate 210 is disposed at a substantially central portion of the opening portion of the window portion 251. In this state, the screw 260 is inserted into the screw hole 252, the screw 260 is screwed into the main body cover portion 150, and the reflective cover 250 and the LED mounting substrate 210 are fixed to the main body cover portion 150.

  Next, the translucent cover 270 is attached so that the window part 252 of the reflective cover 250 may be covered. The translucent cover 270 is engaged with the translucent cover engaging claw 253 and fixed to the light emitting surface of the reflective cover 250 (window 252).

  Next, the details of the LED mounting substrate in the present embodiment will be described.

  FIG. 6 is a reflectance characteristic diagram showing the relationship between the wavelength of light and the reflectance in the printing color of the substrate of the first embodiment, and FIG. 6A is a white reflectance characteristic of a general solder resist. In FIG. 6B, the second printing unit 214c printed in black has a black reflectance characteristic of a general symbol resist.

  FIG. 6A shows that the reflectance characteristic of the first printing portion 214b (white) indicates that the wavelength of light having a reflectance exceeding 70% is 434 nm or more in the visible light region of 400 nm to 750 nm. .

  In the range of 400 nm to 434 nm, the reflectivity decreases, but the reflectivity is around 73% in the vicinity of 555 nm, which is the peak of the relative visibility characteristic (in a bright place), and there is little practical impact. Therefore, the light output characteristics of the LED lighting device 1000 are improved by the reflection by the white paint.

  In this way, in the visible light region (practical region), white has a reflectance of 70% or more, and thus the light emitted from the LED 211 can be efficiently reflected.

  On the other hand, it can be seen from FIG. 6B that the reflectance characteristics of the second printed portion 214c (black) are all less than 6% in the visible light range of 400 nm to 750 nm.

  For this reason, it is almost impossible to improve the light output characteristics by the reflection of the second printing portion 214c, but it can be seen that the reflectance is about 6% even for light having a wavelength of 700 μm or more in the infrared region. . On the other hand, in the case of white, the reflectance in light having a wavelength of 700 μm or more in the infrared region is about 73%.

  Therefore, since the infrared rays are easily absorbed when the reflectance in the infrared region is increased, the first printing unit 214b can easily retain heat, and the second printing unit 214c can easily dissipate heat.

  Therefore, since black has a reflectance of about 6% in the infrared region, it is possible to efficiently dissipate heat generated by the LED 211 emitting light.

  As described above, when the LED mounting substrate 210 is covered with the reflective cover, the white area of the first printing unit 214b is attached so as to block the window part, so that the light emitted from the LED 211 is efficiently reflected by the white area and the window part. Can do. For example, in the cylindrical shape of the window portion 251 of the reflective cover 250, the LED module 200 obtains light by diffusing light emitted from the LED 211 and repeating reflection in the cylinder. There is light returning to the substrate 214 of the LED module 200 due to reflection in the cylinder. From this, the light reflected on the first printing unit 214b can be obtained by making the first printing unit 214b white, which is a color having a high reflectance.

  In addition, since the second printed portion 214c is applied to the portion of the substrate 214 that is hidden by the reflective cover 250, the heat generated when the LED 211 emits light is transmitted to the outside (a member that contacts the outside air or the second printed portion 214c). It becomes easy to conduct heat, and the heat conducted from the LED 211 to the substrate 214 can be efficiently radiated.

  The heat generated by the LED 211 is transmitted to the substrate 214 to be mounted. By providing a heat dissipation mechanism on the substrate 214, heat generation of the LED 211 can be suppressed, and when the second printing unit 214c is blackened, a heat dissipation effect by heat radiation utilizing light absorption is enhanced.

  In this way, black that has a high heat dissipation effect and white that has a high light reflection are printed separately on the substrate 214, and the window portion 251 of the reflective cover 250 is placed near the color boundary between the black print portion 214c and the white print portion 214b. When the opening portion is in contact, the LED module 200 having good light output characteristics, high heat dissipation, and high designability can be obtained.

  Since the heat dissipation can be improved by the second printing unit 214c, the size of the LED mounting substrate 210 can be reduced.

  The first printing portion 214b also serves as a solder resist that covers the copper pattern 214a and prevents insulation or solder from adhering thereto. The second printing unit 214c also functions as a symbol resist that displays the type of electronic component that is printed and mounted on the first printing unit 214b. By doing in this way, it is possible to perform printing (first printing unit) that increases the reflectance and printing (second printing unit) that increases heat dissipation without increasing the number of steps when manufacturing the substrate 214. It becomes.

  FIG. 7 is a circuit diagram showing electrical connection between the lighting device and the LED module in the first embodiment.

  The LED 211 has an anode and a cathode connected in series. The LED 211 is connected to the lighting device 120 via the connector 213 and is lit by being supplied with a predetermined current or power.

  A protection element 212 is mounted in parallel with the LED 211. In the LED module 200, the LEDs 211 are linearly arranged, and the window portion 251 of the reflective cover 250 is also linearly arranged.

  Further, the second printing portion 214c of the substrate 214 includes a mounting portion on which twelve protection elements 212 are mounted, and the protection elements 212 are arranged substantially linearly.

  Since this protective element 212 is disposed inside the reflective cover 250, it is possible to improve the design of the LED lighting device 1000 and to prevent the LED 211 from being damaged by the influence of a surge voltage or the like.

  In addition, since the protection element 212 is mounted on the substrate 214 in parallel and substantially linearly along the LED 211, the size (width direction) of the LED mounting substrate 210 (substrate 214) can be reduced, and the LED mounting substrate 210 can be reduced. Since the protective element 212 is hidden behind the reflective cover 250 after the reflective cover 250 is attached, the design is improved.

  In the LED module 200 of this embodiment, the case where there are two LED mounting substrates 210 has been described. However, the number of LED mounting substrates 210 may be one, or three or more.

  In this embodiment, the case where the LED module 200 includes the translucent cover 270 has been described. However, depending on the usage of the LED lighting device 1000, a transparent cover may be used, or the translucent cover 270 may be used. May not be provided. Even in such a case, since the white print portion 214b of the substrate 214 is disposed in the window portion 251, the design as the LED lighting device 1000 is not impaired, and the black print portion 214c of the substrate 214 is not damaged. Thus, the heat emitted from the LED 211 can be efficiently radiated and the light emitted from the LED 211 can be efficiently reflected by the white printing unit 214b.

  In the substrate of this embodiment, the first printing unit 214b is white and the second printing unit 214c is black. However, the first printing unit 214b is a paint having a high reflectance of light having a wavelength in the visible light region ( For example, it may not be white if the reflectance is 70% or more, and the second printing unit 214c has a low reflectance of light having a wavelength in the infrared region (for example, the reflectance is 10% or less). ) As long as it is not black.

  The LED mounting substrate 210 of this embodiment has been described for the case where the number of the LEDs 211 is twelve, but the number of the LEDs 211 may be other than twelve, and the window portion of the reflective cover 250 is determined according to the number of the LEDs 211. 251 may be provided.

  In this embodiment, the case where the protection element is mounted in the area of the second printing unit 214c has been described, but the second printing unit may be used when the heat dissipation of the LED mounting substrate can be sufficiently maintained without the second printing unit. A protective element may be mounted on a substrate that does not have this.

  Further, in this embodiment, the case where the protection element is connected to each LED 211 in parallel has been described. However, the protection element may be connected in parallel to the two LEDs 211 connected in series, or connected in series. A protective element may be connected in parallel to the three LEDs 211. That is, a protection element may be provided so that a voltage exceeding the rated voltage of the LED 211 is not applied.

  DESCRIPTION OF SYMBOLS 100 Instrument main body, 110 Base main body, 111 Power supply insertion hole, 120 Lighting device, 130 Power supply terminal block, 140 Design cover attachment part, 141 Design cover fixing hole, 150 Main body cover part, 151 Design cover attachment part insertion hole, 152 LED module Fixing hole, 200 LED module, 210 LED mounting board, 211 LED, 212 protection element, 213 connector, 214 board, 214a copper pattern, 214b first printing part (white printing part), 214c second printing part (black printing part) , 214d Reflection area, 214e Heat dissipation area, 230a Connection connector, 230b Termination connector, 240 Insulation cover, 250 Reflection cover, 251 Window, 252 Screw hole, 253 Translucent cover locking claw, 260 Screw, 270 Translucent cover , 300 design cover , 310 screw, 320 screw holes, 330 light-emitting portion insertion hole, 1000 LED lighting device.

Claims (8)

An LED mounting substrate on which the LED is mounted on the substrate;
A LED cover that covers the LED mounting substrate and includes a reflective cover having a window portion on which the LED is disposed,
The LED mounting substrate is
A first printing portion that is printed in a color around the LED and slightly larger than the opening area of the window portion and having a high reflectance at a wavelength in the visible light region;
A second printing unit printed on the mounting surface other than the first printing unit in a color having a low reflectance at a wavelength in the infrared region;
LED lighting device characterized by having. The LED illumination device according to claim 1, wherein the window portion of the reflection cover is a reflection portion that reflects light emitted from the LED.
LED lighting device.   The LED lighting device according to claim 1, wherein the first printing unit has a solder resist function, and the second printing unit has a symbol resist function.   The LED illumination device according to claim 1, wherein the second printing unit is black.   The LED lighting device according to claim 1, wherein the first printing unit is white. A protective element that is electrically connected in parallel to the LED and protects the LED,
The LED lighting device according to claim 1, wherein the LED element is mounted in an area of the second printing unit. A plurality of the LED elements, and a plurality of protection elements corresponding to the number of the LED elements,
The plurality of LEDs are arranged substantially linearly,
The LED lighting device according to claim 6, wherein the plurality of protection elements are arranged substantially parallel to the plurality of LEDs.   The LED lighting device according to claim 7, wherein the plurality of protection elements are arranged substantially linearly.

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