JP2012099290A - Organic el display device - Google Patents

Abstract

Water is prevented from entering a region where organic EL elements are arranged.
A substrate GA on which a plurality of TFT elements are formed, a first inorganic insulating film IL1 formed on the upper side of the plurality of TFT elements, and a plurality of elements arranged on the upper side of the first inorganic insulating film IL1. The element array region formed by the organic EL elements, the first organic insulating film OL1 that covers each pixel in the element array region and covers the outside, and the first organic insulating film OL1 are covered from above, and the first A second inorganic insulating film IL2 that is in close contact with the first organic insulating film OL1 exposed from the first organic insulating film OL1, and a wiring ES3 embedded in the first inorganic insulating film IL1. In the organic EL display device, the wiring ES3 has an adhesion region passing portion that passes below the adhesion region SL to which the second inorganic insulating film IL2 is adhered, and the adhesion region passage portion is connected to the main wiring portion. , Projecting sideways from the main wiring section It has one protruding portion, the organic EL display device, characterized in that.
[Selection] Figure 3

Description

  The present invention relates to an organic EL display device.

  An organic EL display (Organic Electro-Luminescence display) includes a substrate having an element arrangement region in which a plurality of organic EL elements are arranged.

  Here, since the organic EL element has a property of being deteriorated by moisture, it is necessary to protect the element arrangement region from moisture. As one method for protecting from moisture, for example, it is conceivable to seal the element arrangement region by using a single layer or a plurality of layers of inorganic insulating film or organic insulating film (thin film sealing).

  Here, as an example of the organic EL display device that protects the element array region from moisture using an inorganic insulating film and an organic insulating film, the organic EL display device shown in FIGS. 5A and 5B can be considered. In this organic EL display device, as shown in FIG. 5A, the outer periphery of the element array region DP is covered with an organic insulating film OL1, and the organic insulating film OL1 is further covered with an inorganic insulating film IL2. As shown also in FIG. 5B, the inorganic insulating film IL2 and the inorganic insulating film IL1 formed as the protective insulating film on the substrate GA are in close contact with each other outside the element arrangement region DP, whereby the organic EL element Is protected from moisture.

  However, a wiring is embedded in the inorganic insulating film IL1. When this wiring passes below the portion where the two inorganic insulating films are in close contact, moisture may enter the element array region DP through the wiring.

  In view of the above problems, the present invention provides an organic EL display device in which two layers of an inorganic insulating film with an organic insulating film interposed therebetween are in close contact outside the element arrangement region DP. It is an object to suppress moisture from entering the element array region DP through the wiring embedded in the film.

  In view of the above problems, an organic EL display device according to the present invention includes a substrate on which a plurality of TFT elements are arranged, a first inorganic insulating film formed above the plurality of TFT elements, and the first An element arrangement region formed by a plurality of organic EL elements arranged on the upper side of the inorganic insulating film; a first organic insulating film which covers each pixel in the element arrangement region and covers the outside; and A second inorganic insulating film that covers the organic insulating film from above and is in close contact with a portion of the first inorganic insulating film exposed from the first organic insulating film; and the first inorganic insulating film An organic EL display device having a wiring embedded in an insulating film, wherein the wiring has a close contact region passing portion that passes under a close contact region to which the second inorganic insulating film is closely attached, The contact area passing part further includes a main wiring part and the main wiring part. It has at least one protrusion projecting laterally, and wherein the.

  In the organic EL display device according to the aspect of the invention, the wiring may be a power supply line that supplies power for driving the plurality of organic EL elements.

  Further, in one aspect of the organic EL display device according to the present invention, the main wiring portion may change direction at least at one place and pass under the adhesion region.

  In one aspect of the organic EL display device according to the present invention, the main wiring portion may have a portion laid in a U-shape.

  In one aspect of the organic EL display device according to the present invention, the main wiring portion may be laid in a crank shape.

  In one aspect of the organic EL display device according to the present invention, the adhesion region may be formed so as to surround the element arrangement region.

  In one aspect of the organic EL display device according to the present invention, the second organic insulating film formed on the upper side of the second inorganic insulating film and the second organic insulating film are covered from above, and the first A third inorganic insulating film that is in close contact with a portion of the second inorganic insulating film that is exposed from the second organic insulating film, and the first inorganic insulating film is formed from the first organic insulating film. The exposed portion is in close contact with the second inorganic insulating film, and at least a part of the region in which the third inorganic insulating film and the second inorganic insulating film are in close contact is formed between the first inorganic insulating film and the first inorganic insulating film. It may be characterized in that it overlaps with the contact region where the second inorganic insulating film is in close contact.

  According to the present invention, in an organic EL display device in which two inorganic insulating films having an organic insulating film interposed therebetween are in close contact outside the element array region DP, wiring embedded in the lower inorganic insulating film of the two Through this, the entry of moisture into the element array region DP is suppressed.

1 is a schematic top view of an organic EL display device according to an embodiment of the present invention. It is a figure for demonstrating the mode of the one part wiring laid on the board | substrate of the organic electroluminescent display apparatus concerning embodiment of this invention. It is a figure explaining the mode of the III-III cross section of FIG. It is a figure which shows the contact | attachment area | region passage part of the scanning circuit power supply line and anode power supply line in embodiment of this invention. It is a figure which shows the mode of the contact | adherence area | region passage part of the cathode power supply line in embodiment of this invention. It is a figure which shows the modification of the contact | adherence area | region passage part of the wiring in embodiment of this invention. It is a figure which shows an example of the organic electroluminescence display which protects an element arrangement | sequence area | region from a water | moisture content using an inorganic insulating film and an organic insulating film. It is a figure for demonstrating the mode of the VB-VB cross section of FIG. 5A.

  Hereinafter, an organic EL display device according to an embodiment of the present invention will be described with reference to the drawings.

  FIG. 1 is a diagram schematically showing an upper surface of an organic EL display device 1 according to an embodiment of the present invention. The organic EL display device 1 of the present embodiment has an element arrangement region DP in which a plurality of organic EL elements are arranged on a substrate GA, and the element arrangement region DP has an organic insulating film OL1 (hereinafter referred to as an organic insulating film OL1). In this specification, it is also referred to as a first organic insulating film), and the organic insulating film OL1 further covers the outer periphery of the element arrangement region DP. Further, the first inorganic insulating film IL1 and the second inorganic insulating film IL2 are surrounded by a region where they are in close contact with each other.

  First, in the element array region DP, a large number of scanning signal lines GL are laid at equal intervals, and a large number of video signal lines DL are perpendicular to the direction in which the scanning signal lines GL are laid. Are laid out at equal intervals. In each pixel region partitioned by the scanning signal line GL and the video signal line DL, a thin film transistor used for switching of a MIS (Metal-Insulator-Semiconductor) structure is disposed. A scanning signal line driving circuit (not shown) and a video signal line driving circuit (not shown) are connected to each scanning signal line GL and each video signal line DL. By outputting signals from these drive circuits, the light emission of the organic EL elements arranged in each pixel is controlled.

  Each organic EL element in the element arrangement region DP includes an anode electrode (anode), a cathode electrode (cathode), and an organic layer sandwiched between them. The organic layer sandwiched between the anode electrode and the cathode electrode includes layers such as a hole injection layer, a hole transport layer, an electron transport layer, and an electron injection layer in addition to the light emitting layer. The light emission of the organic EL element is controlled by the potential difference.

  Next, the first inorganic insulating film IL1, the organic insulating film OL1, and the second inorganic insulating film IL2 for protecting the element array region DP from moisture will be described in order.

  The first inorganic insulating film IL1 is formed of silicon nitride (SiN) on the substrate GA. The first inorganic insulating film IL1 of the present embodiment is formed on almost the entire substrate GA as a base of the element array region DP, and serves as a protective insulating film that protects the thin film transistor and the like.

  The organic insulating film OL1 is formed of resin and is disposed so as to cover the outside of the element arrangement region DP. As shown in FIG. 1, the organic insulating film OL1 in the present embodiment is formed to extend outside the element arrangement region DP, and a part of the first inorganic insulating film IL1 is exposed from the organic insulating film OL1. It has become. Specifically, the organic insulating film OL1 is disposed on the lower side in contact with the cathode electrode of each organic EL element, and separates each organic EL element to be subjected to display control.

  The second inorganic insulating film IL2 is formed of silicon nitride (SiN) above the organic insulating film OL1. As shown in FIG. 1, the second inorganic insulating film IL2 of the present embodiment is formed so as to further spread over the organic insulating film OL1 and cover the entire organic insulating film OL1. As shown in FIG. 1, a portion of the second inorganic insulating film IL2 that is formed so as to be wider than the organic insulating film OL1 is formed on the first inorganic insulating film IL1. The inorganic insulating film IL1 is in close contact with the portion exposed from the organic insulating film OL1.

  A region where the first inorganic insulating film IL1 and the second inorganic insulating film IL2 are in close contact with each other (hereinafter referred to as an adhesive region in the present embodiment) is an element arrangement region DP and an organic insulating film in plan view. It has a shape like a frame surrounding OL1. That is, the adhesion region of this embodiment is a frame-like region, and the element arrangement region DP and the organic insulation film OL1 existing inside the adhesion region are sealed from moisture by two inorganic insulating films having excellent water resistance. Stopped. In the present embodiment, an organic insulating film OL2 (also referred to as a second organic insulating film in this specification), which is different from the organic insulating film OL1, is formed on the second inorganic insulating film IL2. 3 is laminated, but the notation is omitted in FIG. 1, and will be described in FIG. 3 to be described later.

  Next, FIG. 2 is a diagram for explaining a part of wirings laid on the substrate GA of the organic EL display device 1 according to the present embodiment, and FIG. 3 is a cross-sectional view taken along the line III-III in FIG. It is a figure explaining.

  In the present embodiment, as shown in FIG. 2, the scanning circuit power supply line ES1, the cathode power supply line ES2, and the anode power supply line ES3 are protected by the adhesion region SL from the terminal portion TE for connecting to the flexible printed board. Laid in the area. These power supply lines are wirings formed of aluminum, and the scanning circuit power supply line ES1 is a wiring for supplying power to the scanning line driving circuits GDR disposed on both sides of the element arrangement region DP. The cathode power supply line ES2 and the anode power supply line ES3 are wirings for supplying power to the cathode electrode and the anode electrode of each organic EL element in the element array region DP.

  Further, as shown in FIG. 3, the scanning circuit power supply line ES1 is embedded in the first inorganic insulating film IL1, and the cathode power supply line ES2 and the anode power supply line ES3 are also embedded in the same manner. Covered with the inorganic insulating film IL1.

  However, a step due to the wiring occurs on the surface of the first inorganic insulating film IL1, and a minute crack is formed that reaches the wiring from the upper surface of the second inorganic insulating film IL2 through the adhesion region SL. There is a case. On the side surface of the wiring, the adhesiveness with the first inorganic insulating film IL1 may be deteriorated to form a gap. In the wiring including the above-described power supply line, the line width is relatively thicker than other wirings, so that distortion due to a difference in stress generated between the wiring material and the inorganic insulating film material is likely to occur, and adhesion is further increased. It is thought to get worse.

  Here, in particular, in the power supply line such as the scanning circuit power supply line ES1 of the present embodiment, a portion passing through the lower side of the contact region SL (hereinafter referred to as a contact region passing portion in the present embodiment) is a current. The main wiring part MP, which is a main path through which is passed, and at least one protruding part Pr protruding from the main wiring part MP to the side thereof are configured. FIG. 4A is a diagram illustrating a state of an adhesion region passing portion of the scanning circuit power supply line ES1 and the anode power supply line ES3 in the present embodiment, and FIG. 4B is a state of an adhesion region passing portion of the cathode power supply line ES2 in the present embodiment. FIG. In each drawing of FIG. 4, it is assumed that the terminal portion TE is arranged on the lower side in the drawing, and the element arrangement region DP is arranged on the upper side in the drawing. In the scanning circuit power supply line ES1 and the like, the main wiring part MP is laid in a straight line, the projecting parts Pr are formed in a convex shape from a plurality of positions on the side surface of the main wiring part MP, and the cathode power supply line ES2 The portions MP meander and lay in a crank shape, and a plurality of projecting portions Pr are similarly formed on the side surfaces of the main wiring portion MP.

  As described above, when the protruding portion Pr is formed on the side surface of the main wiring portion MP, the adhesion with the first inorganic insulating film IL1 is improved, and moisture from the upper side of the adhesion region SL to the wiring is transferred to the side surface of the wiring. Can be fastened. Further, in order to prevent moisture from entering the element array region DP, it is preferable that the main wiring portion MP meanders in a crank shape rather than a straight line, but the main wiring portion MP as shown in FIG. 4C. More preferably, the part MP has a portion laid in a U-shape or a portion laid in an S-shape. As described above, the main wiring portion MP changes its direction at least at one place and passes below the adhesion region SL, so that the route through which moisture enters is extended and moisture entry is suppressed.

  The main wiring portion MP is formed with a line width on the order of several tens of microns to several hundreds of microns, while the protrusion Pr is preferably formed on the order of several microns to several tens of microns. The line width of the protrusion Pr shown in FIGS. 4A to 4C is about one-tenth of the main wiring part MP, but the line width of the protrusion Pr is less than one-tenth of the main wiring part MP. It may be thicker or thinner. The protruding portion Pr protrudes substantially perpendicularly from the main wiring portion MP and has a length of several microns to several tens of microns. However, the protruding portion Pr may be longer than the line width of the main wiring portion MP. good.

  In the present embodiment, as shown in FIG. 3, a second organic insulating film OL2 formed of resin and a third inorganic insulating film IL3 formed of silicon nitride are further formed to form three layers. The element arrangement region DP is protected by the inorganic insulating film and the two-layer organic insulating film. The second organic insulating film OL2 is formed above the second inorganic insulating film IL2, and the third inorganic insulating film IL3 is a portion of the second inorganic insulating film IL2 exposed from the second organic insulating film OL2. Close contact with. As shown in FIG. 3, the region where the third inorganic insulating film IL3 and the second inorganic insulating film IL2 are in close contact with each other is the region where the second inorganic insulating film IL2 and the first inorganic insulating film IL1 are in close contact with each other. , At least some overlap. The second organic insulating film OL2 is formed thicker than the first organic insulating film OL1, and the outer peripheral portion of the second organic insulating film OL2 is formed with a smoothly inclined curved surface.

  As described above, the organic EL display device 1 of the present embodiment includes the third inorganic insulating film IL3 and the second inorganic insulating film IL1, in addition to the first inorganic insulating film IL1, the second inorganic insulating film IL2, and the organic insulating film OL1. The organic insulating film OL2 is included, which is desirable because it further protects the inside of the adhesion region SL. However, it is not always necessary to have the third inorganic insulating film IL3 and the second organic insulating film OL2, and the first inorganic insulating film IL1 and the second inorganic insulating film with the organic insulating film OL1 interposed therebetween. The inner side is protected by the adhesion region SL formed by the insulating film IL2.

  In the present embodiment, as shown in FIG. 3, the flat portion of the first inorganic insulating film IL1 and the second inorganic insulating film IL2 are in close contact to form an adhesive region SL. . However, at least one groove or bank surrounding the outer periphery of the element array region DP and the organic insulating film OL1 may be formed on the surface of the first inorganic insulating film IL1. By forming such a groove or the like in the adhesion region SL, the protrusion of the organic insulating film OL1 to the adhesion region SL is suppressed. Further, the groove may be formed along a part of the outer periphery of the element array region DP and the organic insulating film OL1.

  Note that the first inorganic insulating film IL1, the second inorganic insulating film IL2, and the third inorganic insulating film IL3 are preferably formed of silicon nitride as in the present embodiment, but inorganic materials of other materials are used. An insulating film may be used, and different inorganic insulating films may be used. Even in the case of being formed of different inorganic insulating films, the first inorganic insulating film IL1 and the second inorganic insulating film IL2 may be in close contact with each other.

  The organic EL display device 1 of the present embodiment may be a top emission type organic EL display device or a bottom emission type organic EL display device.

  In addition, although the some protrusion part Pr is formed in the side of the main wiring part MP in this embodiment at predetermined intervals, this space | interval may change with places. Further, although the protruding portion Pr is formed on both side surfaces of the main wiring portion MP, it may be formed on one of the two side surfaces of the main wiring portion MP. By forming at least one projecting portion Pr in the main wiring portion MP, it is possible to prevent moisture from entering through the close contact region passage portion.

  Even when an impact that may cause damage is applied to the adhesion region SL between the first inorganic insulating film IL1 and the second inorganic insulating film IL2, the peeling of the inorganic insulating film is locally caused by the presence of the protrusion Pr. It is restrained to the range.

  The present invention is not limited to the above-described embodiments, and various modifications can be made. For example, the configuration described in the embodiment can be replaced with a configuration that is substantially the same, a configuration that exhibits the same effects, or a configuration that can achieve the same purpose.

  DESCRIPTION OF SYMBOLS 1 Organic electroluminescent display device, GA board | substrate, DP element arrangement | positioning area | region, IL1 1st inorganic insulating film, OL1 1st organic insulating film, IL2 2nd inorganic insulating film, OL2 2nd organic insulating film, IL3 3rd Inorganic insulating film, DL video signal line, GL scanning signal line, TE terminal part, GDR scanning line drive circuit, SL adhesion region, ES1 scanning circuit power supply line, ES2 cathode power supply line ES2, ES3 anode power supply line, MP main wiring part, Pr protrusion.

Claims (7)

A substrate on which a plurality of TFT elements are arranged;
A first inorganic insulating film formed on the upper side of the plurality of TFT elements;
An element arrangement region formed by a plurality of organic EL elements arranged on the upper side of the first inorganic insulating film;
A first organic insulating film that separates and covers the pixels in the element array region;
A second inorganic insulating film that covers the first organic insulating film from above and is in close contact with a portion of the first inorganic insulating film exposed from the first organic insulating film;
An organic EL display device having a wiring embedded in the first inorganic insulating film,
The wiring has a close contact area passing portion that passes below the close contact area to which the second inorganic insulating film is closely attached,
The contact area passing portion further includes
A main wiring section;
And at least one projecting portion projecting laterally from the main wiring portion,
An organic EL display device characterized by that. An organic EL display device according to claim 1,
The wiring is a power supply line that supplies power for driving the plurality of organic EL elements.
An organic EL display device characterized by that. An organic EL display device according to claim 2,
The main wiring portion changes direction at least at one place and passes below the contact area,
An organic EL display device characterized by that. An organic EL display device according to claim 3,
The main wiring portion has a portion laid in a U-shape,
An organic EL display device characterized by that. An organic EL display device according to claim 3,
The main wiring portion is laid in a crank shape,
An organic EL display device characterized by that. An organic EL display device according to claim 1,
The adhesion region is formed so as to surround the element arrangement region.
An organic EL display device characterized by that. An organic EL display device according to claim 1,
A second organic insulating film formed on the upper side of the second inorganic insulating film;
A third inorganic insulating film that covers the second organic insulating film from above and is in close contact with a portion of the second inorganic insulating film exposed from the second organic insulating film;
The first inorganic insulating film is in close contact with the second inorganic insulating film at a portion exposed from the first organic insulating film;
At least a part of a region where the third inorganic insulating film and the second inorganic insulating film are in close contact with each other is such that the first inorganic insulating film and the second inorganic insulating film are in close contact with each other, Duplicate,
An organic EL display device characterized by that.

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