JP2012094794A - Cleaning method, exposure apparatus, and device manufacturing method - Google Patents

Abstract

It is desired to devise a technique that can satisfactorily clean a liquid immersion member 6 that contacts an exposure liquid LQ1.
[Solution]
The exposure apparatus EX includes a liquid immersion member 6 that comes into contact with the exposure liquid LQ1. In a state where the immersion space LS is formed between the liquid immersion member 6 and the vibration member C, the vibration member C is vibrated and the sound wave is propagated to the liquid immersion member 6, thereby cleaning the liquid immersion member 6. Depending on the location of the liquid immersion member 6 to be cleaned, at least one of the positional relationship between the liquid immersion member 6 and the vibration part C or the wavelength of the sound wave is changed.
[Selection] Figure 5

Description

The present invention relates to a cleaning method, an exposure apparatus, and a device manufacturing method.

  In a manufacturing process of a micro device such as a semiconductor device, an exposure apparatus that exposes a substrate with exposure light is used. When a member or component of the exposure apparatus is contaminated, for example, an exposure failure such as a defect formed in a pattern formed on the substrate may occur, and as a result, a defective device may occur. Therefore, for example, a technique for cleaning a predetermined member in an exposure apparatus has been devised as disclosed in the following patent document.

US Patent Application Publication No. 2008/0018867

  In order to suppress the occurrence of exposure failure, it is effective to clean the predetermined member. Therefore, it is desired to devise a technique that can satisfactorily clean a predetermined member in the exposure apparatus.

  An object of an aspect of the present invention is to provide a cleaning method capable of suppressing the occurrence of exposure failure. Another object of the present invention is to provide an exposure apparatus that can suppress the occurrence of exposure failure. Another object of the present invention is to provide a device manufacturing method that can suppress the occurrence of defective devices.

  According to a first aspect of the present invention, there is provided a method for cleaning a liquid contact member in contact with a first liquid of an exposure apparatus that exposes a substrate through the first liquid, wherein the liquid contact member is changed to the second liquid. By making contact and oscillating the vibration part, the sound wave generated in the second liquid is propagated in the second liquid, and reaches the first point on the surface of the liquid contact member from a predetermined direction. By cleaning the point and vibrating the vibration part, the sound wave generated in the second liquid is propagated in the second liquid, and the second point different from the first point on the surface of the wetted member is in a predetermined direction. At least the relationship between the wavelength of the sound wave and the positional relationship between the wetted member and the vibrating portion in a predetermined direction by cleaning the second point, cleaning the first point, and cleaning the second point. A method of cleaning is provided that includes changing one.

  According to the second aspect of the present invention, in the cleaning method according to the first aspect, manufacturing a device including cleaning the liquid contact member, exposing the substrate, and developing the exposed substrate. A method is provided.

  According to a third aspect of the present invention, there is provided an exposure apparatus that exposes a substrate through a first liquid, comprising: a liquid contact member that contacts the first liquid; and a vibration part, and the liquid contact member; By vibrating the vibration portion in a state where it is in contact with the second liquid, the sound wave generated in the second liquid is propagated to the liquid contact member and reaches the surface of the liquid contact member from a predetermined direction. When cleaning the liquid member, the surface of the liquid contact member is reached by cleaning the first point on the surface of the liquid contact member by reaching the sound wave from the predetermined direction and by reaching the sound wave from the predetermined direction. An exposure apparatus is provided that changes at least one of the wavelength of the sound wave and the positional relationship between the liquid contact member and the vibrating portion in a predetermined direction when the second point different from the first point is cleaned.

  According to a fourth aspect of the present invention, there is provided a device manufacturing method comprising: cleaning the liquid contact member with the exposure apparatus according to the third aspect; exposing the substrate; and developing the exposed substrate. Is provided.

  According to the aspect of the present invention, it is possible to suppress the occurrence of exposure failure.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings, but the present invention is not limited thereto. In the following description, an XYZ orthogonal coordinate system is set, and the positional relationship of each part will be described with reference to this XYZ orthogonal coordinate system. A predetermined direction in the horizontal plane is defined as an X-axis direction, a direction orthogonal to the X-axis direction in the horizontal plane is defined as a Y-axis direction, and a direction orthogonal to each of the X-axis direction and the Y-axis direction (that is, a vertical direction) is defined as a Z-axis direction. Further, the rotation (inclination) directions around the X axis, Y axis, and Z axis are the θX, θY, and θZ directions, respectively.

<First Embodiment>
FIG. 1 is a schematic block diagram that shows an example of an exposure apparatus EX in the present embodiment. The exposure apparatus EX of the present embodiment is an immersion exposure apparatus that exposes a substrate P with exposure light EL through an exposure liquid LQ1. In the present embodiment, the immersion space LS is formed so that at least a part of the optical path of the exposure light EL is filled with the exposure liquid LQ1. The immersion space is a portion (space, region) filled with liquid. The substrate P is exposed with the exposure light EL through the exposure liquid LQ1 in the immersion space LS. In the present embodiment, water (pure water) is used as the exposure liquid LQ1. The exposure apparatus EX of the present embodiment uses a local immersion method in which the immersion space LS is formed in a part of the substrate P and the substrate P is exposed.

  In FIG. 1, an exposure apparatus EX measures a mask stage 1 that can move while holding a mask M, a substrate stage 2 that can move while holding a substrate P, and exposure light EL without holding the substrate P. A measuring stage I holding a measuring member (measuring instrument) to be moved, an illumination system IL for illuminating the mask M with the exposure light EL, and an image of the pattern of the mask M illuminated with the exposure light EL on the substrate P The projection optical system PL to project, the liquid immersion member 6 capable of forming the liquid immersion space LS so that at least a part of the optical path of the exposure light EL is filled with the exposure liquid LQ1, and the control of the overall operation of the exposure apparatus EX. And a control device shown in the figure.

  An exposure apparatus including a substrate stage 2 that can move while holding a substrate, and a measurement stage I that can move while holding a measurement member (measuring instrument) that measures exposure light without holding the substrate. Examples are disclosed in, for example, US Pat. No. 6,897,963, European Patent Application Publication No. 1713113, and the like, the contents of which are incorporated herein by reference.

  Here, in the present embodiment, as the exposure apparatus EX, scanning exposure is performed in which the pattern formed on the mask M is exposed on the substrate P while the mask M and the substrate P are synchronously moved in different directions (reverse directions) in the scanning direction. A case where an apparatus (so-called scanning stepper) is used will be described as an example. Note that the exposure apparatus EX may be a scanning exposure apparatus that performs exposure by synchronously moving the scanning directions of the mask M and the substrate P in the same direction. In the following description, the direction that coincides with the optical axis AX of the projection optical system PL is the Z-axis direction, the synchronous movement direction (scanning direction) between the mask M and the substrate P in the plane perpendicular to the Z-axis direction is the Y-axis direction, A direction (non-scanning direction) perpendicular to the Z-axis direction and the Y-axis direction is taken as an X-axis direction. Further, the rotation (inclination) directions around the X axis, Y axis, and Z axis are the θX, θY, and θZ directions, respectively. Here, the “substrate” includes a semiconductor wafer coated with a resist, and the “mask” includes a reticle on which a device pattern to be reduced and projected on the substrate is formed.

The illumination system IL irradiates the predetermined illumination area IR with the exposure light EL. The illumination area IR includes a position where the exposure light EL emitted from the illumination system IL can be irradiated. The illumination system IL illuminates at least a part of the mask M arranged in the illumination region IR with the exposure light EL having a uniform illuminance distribution. As the exposure light EL emitted from the illumination system IL, for example, far ultraviolet light (DUV light) such as bright lines (g line, h line, i line) and KrF excimer laser light (wavelength 248 nm) emitted from a mercury lamp, ArF Excimer laser light (wavelength 193 nm), vacuum ultraviolet light (VUV light) such as F ₂ laser light (wavelength 157 nm), or the like is used. In the present embodiment, ArF excimer laser light, which is ultraviolet light (vacuum ultraviolet light), is used as the exposure light EL. An example of an optical system for routing the exposure light EL emitted from the laser light source to the illumination region IR is disclosed in, for example, US Patent Application Publication No. 2009/0316132.

  The mask M includes a reticle on which a device pattern projected onto the substrate P is formed. The mask M includes a transmission type mask having a transparent plate such as a glass plate and a pattern formed on the transparent plate using a light shielding material such as chromium. A reflective mask can also be used as the mask M.

  The mask stage 1 can move on a guide surface of a base member (not shown) including the illumination region IR while holding the mask M. The mask stage 1 is movable in six directions on the guide surface, such as an X axis, a Y axis, a Z axis, a θX, a θY, and a θZ direction, by an operation of a drive system including, for example, a linear motor.

  The projection optical system PL irradiates the predetermined projection region PR with the exposure light EL. The projection region PR includes a position where the exposure light EL emitted from the projection optical system PL can be irradiated. The projection optical system PL projects an image of the pattern of the mask M at a predetermined projection magnification onto at least a part of the substrate P arranged in the projection region PR. The projection optical system PL of the present embodiment is a reduction system whose projection magnification is, for example, 1/4, 1/5, or 1/8. Note that the projection optical system PL may be either an equal magnification system or an enlargement system. In the present embodiment, the optical axis of the projection optical system PL is parallel to the Z axis. The projection optical system PL may be any of a refractive system that does not include a reflective optical element, a reflective system that does not include a refractive optical element, and a catadioptric system that includes a reflective optical element and a refractive optical element. Further, the projection optical system PL may form either an inverted image or an erect image. The projection optical system PL includes a terminal optical element 10 having an exit surface 11 that emits exposure light EL toward the image plane of the projection optical system PL. The last optical element 10 is an optical element closest to the image plane of the projection optical system PL among the plurality of optical elements of the projection optical system PL.

  The substrate P is a substrate for manufacturing a device. The substrate P includes, for example, a base material such as a semiconductor wafer and a photosensitive film formed on the base material. The photosensitive film is a film of a photosensitive material (photoresist). Further, the substrate P may include another film in addition to the photosensitive film. For example, the substrate P may include an antireflection film or a protective film (topcoat film) that protects the photosensitive film.

  The liquid immersion member 6 is disposed in the vicinity of the terminal optical element 10 closest to the image plane of the projection optical system PL among the plurality of optical elements of the projection optical system PL. In the present embodiment, at least a part of the liquid immersion member 6 is disposed around the terminal optical element 10. The liquid immersion space LS formed by the liquid immersion member 6 and at least a part of the liquid immersion member 6 are in contact with each other.

  The liquid of the exposure liquid LQ1 fills the optical path of the exposure light EL between the exit surface 11 of the last optical element 10 and the object disposed facing the position where the exposure light EL can be irradiated (projection region PR). The immersion member 6 can form a liquid immersion space LS. In the present embodiment, the object that can be arranged in the projection region PR is an object that can move with respect to the projection region PR on the image plane side of the projection optical system PL (the exit surface 11 side of the terminal optical element 10), and the substrate stage. 2, the substrate P held on the substrate stage 2 and the measurement stage I are included.

  As shown in FIG. 2, the liquid immersion member 6 includes a supply unit 7 that supplies the exposure liquid LQ1, a collection unit 8 that collects the exposure liquid LQ1, and an opening 6K through which the exposure light EL emitted from the emission surface 11 passes. And a flat member F. FIG. 2 is a diagram illustrating an example of the liquid immersion member 6 in the present embodiment. As the liquid immersion member 6, for example, a liquid immersion member (nozzle member) as disclosed in US Patent Application Publication No. 2007/0132976 and European Patent Application Publication No. 1768170 can be used.

  The exposure liquid LQ1 is supplied by the supply unit 7, and the supplied exposure liquid LQ1 is recovered by the recovery unit 8, thereby forming the immersion space LS. The immersion space LS formed is in contact with at least a part of the recovery unit 8 and at least a part of the flat member F. In the present embodiment, as shown in FIG. 2, the supply unit 7 is disposed between the terminal optical element 10 and the collection unit 8. That is, the supply unit 7 is disposed closer to the terminal optical element 10 than the collection unit 8. In addition, the collection unit 8 surrounds the flat member F. That is, the exposure liquid LQ1 can be collected so as to surround the optical path of the exposure light EL that passes through the opening 6K. FIG. 2 shows a state where the space between the exit surface 11 of the last optical element 10 and the substrate P is filled with the exposure liquid LQ1. In the present embodiment, the surface of the liquid immersion member 6 includes at least a part of the collection unit 8 and at least a part of the flat member F.

  The supply unit 7 has a supply port 7a. The supply unit 7 is connected to the liquid supply device, and can operate to supply the exposure liquid LQ1 from the supply port 7a. The exposure liquid LQ1 supplied from the supply port 7a passes through the opening 6K. When the immersion member 6 and the object are arranged to face each other, the exposure liquid LQ1 that has passed through the opening 6K6K causes the optical path of the exposure light EL between the exit surface 11 of the last optical element 10 and the object to be the exposure liquid. Filled with LQ1.

  In the present embodiment, the liquid supply apparatus can supply a liquid (non-exposure liquid LQ2) different from the exposure liquid LQ1. The non-exposure liquid LQ2 is an aqueous solution containing a substance, for example. The aqueous solution containing the substance is, for example, an aqueous tetramethylammonium hydroxide (TMAH) solution, an aqueous choline solution, an aqueous solution containing ozone, or an aqueous solution containing hydrogen peroxide. Further, the non-exposure liquid LQ2 is not limited to an aqueous solution, and may be a liquid containing an alcohol such as methyl alcohol or isopropyl alcohol.

  FIG. 3 shows an example of the collection unit 8 in the present embodiment. In the present embodiment, the collection unit 8 has a collection port 8a that can face an object arranged in at least a part of the projection region PR. A plate-like porous member 19 including a plurality of holes (openings or pores) is disposed in the recovery port 8a. Note that a mesh filter, which is a porous member in which a large number of small holes are formed in a mesh shape, may be disposed in the collection unit 8. A porous member 19 is included in the lower surface 8 b of the collection unit 8.

  The recovery unit 8 is connected to the liquid recovery apparatus, and can recover the liquid from the recovery port 8a by operating the liquid recovery apparatus. The exposure liquid LQ1 supplied from the supply port 7a passes through the opening 6K, and is recovered at the recovery port 8a via a space between the flat member F and the object disposed.

  In the present embodiment, at least a part of the interface (meniscus, edge) of the immersion space LS formed when the substrate P is irradiated with the exposure light EL (during exposure) is connected to the lower surface 8b of the recovery unit 8. It is formed between the surface of the substrate P. Further, the interface of the immersion space LS formed at the time of exposure is formed in the porous member 19 in the lower surface 8 b of the recovery unit 8.

  FIG. 4 shows an example of the porous member 19 in the present embodiment. In the present embodiment, the lower surface 8a includes an uneven portion O. The uneven portion O is disposed on the porous member 19. Therefore, the shape of the porous member 19 in the present embodiment includes irregularities. The concavo-convex portion O includes a concave portion B and a convex portion D. Therefore, the uneven | corrugated | grooved part O differs in the Z-axis direction position of the recessed part B and the convex part D in XY plane. In the present embodiment, the convex portion D and the concave portion B are separated from the gap G along the Z-axis direction. The distance of the gap G is larger than 1/4 of the wavelength of the sound wave described later.

  The position information of the collection port 8a in the present embodiment is stored in the control device. For example, it is the distance of the porous member 19 from the optical axis of the projection optical system PL. In addition, as positional information of the porous member 19, information related to the distance between the concave portion B of the concave and convex portion O and the gap G of the convex portion D disposed on the porous member 19 is also stored. Therefore, the positional relationship between the predetermined location and the porous member 19 can be calculated based on the distance between the predetermined location of the object facing the porous member 19 and the optical axis of the projection optical system PL. In addition, information on the uneven portion O in the shape of the porous member 19 facing the predetermined location (for example, in the Z-axis direction) (such as the presence or absence of the gap G between the concave portion B and the convex portion D) is known.

  The substrate stage 2 supports the substrate P, and includes a Z stage 21 that holds the substrate P through a substrate holding portion PH that detachably holds, and an XY stage 22 that supports the Z stage 21. Yes. The substrate stage 2 including the Z stage 21 and the XY stage 22 is supported by the stage base B. The substrate stage 2 is driven by a drive system such as a linear motor, and can move on the surface Ba of the base member B including the projection region PR. By driving the Z stage 21, the position (focus position) in the Z-axis direction of the substrate P held by the Z stage 21 and the position in the θX and θY directions are controlled. Further, by driving the XY stage 22, the position of the substrate P in the XY direction (position in a direction substantially parallel to the image plane of the projection optical system PL) is controlled. That is, the Z stage 21 controls the focus position and the tilt angle of the substrate P to adjust the surface of the substrate P to the image plane of the projection optical system PL by the autofocus method and the auto leveling method, and the XY stage 22 Positioning of P in the X-axis direction and the Y-axis direction is performed. Needless to say, the Z stage 21 and the XY stage 22 may be provided integrally. A surface H of the Z stage 21 is disposed around the substrate holding part PH. The surface H of the Z stage 21 is arranged around the surface of the substrate P held by the substrate holding part PH. The surface H is substantially flat and is disposed in substantially the same plane (XY plane) as the surface of the substrate P held by the substrate holding portion PH. That is, the surface H of the Z stage is substantially flush with the surface of the substrate P held by the substrate holding part PH.

  The measurement stage I holds a vibration member C capable of generating vibration and a measurement member (measuring instrument) (not shown), and includes a Z stage I1 that holds the vibration member C, and a Z stage I1. And an XY stage I2 supporting the above. The measurement stage I including the Z stage I1 and the XY stage I2 is supported by the stage base B. The measurement stage I is driven by a drive system such as a linear motor, and can move on the surface Ba of the base member B including the projection region PR. By driving the Z stage I1, the position of the vibrating member C held by the Z stage I1 in the Z-axis direction and the positions in the θX and θY directions are controlled. Further, by driving the XY stage I2, the position of the vibrating member C in the XY direction (position in a direction substantially parallel to the image plane of the projection optical system PL) is controlled. Therefore, by driving the Z stage I1, the positional relationship between the vibrating member C and the object facing the vibrating member C can be changed in the position in the Z-axis direction and in the θX and θY directions. Further, by driving the XY stage I2, it is possible to change the positional relationship between the vibrating member C and the object facing the vibrating member C in the XY direction. The object facing the vibration member C is, for example, the porous member 19 of the recovery unit 8 of the liquid immersion member 6. Therefore, for example, information on the shape of the porous member 19 facing the vibrating member C along the Z-axis direction can be obtained from the positional relationship between the vibrating member C and the porous member 19. Furthermore, since the position of the vibrating member C in the Z-axis direction is controlled, the distance between the vibrating member C and the porous member 19 along the Z-axis direction can be calculated.

  Needless to say, the Z stage I1 and the XY stage I2 may be provided integrally. The Z stage I1 may hold the vibration member C so as to be removable. Around the vibration member C, the surface S of the Z stage I1 is disposed. The surface S of the Z stage I1 is disposed around the surface Ca of the vibration member C. The surface Ca is substantially flat and is disposed in substantially the same plane (in the XY plane) as the surface Ca of the vibration member C. That is, the surface H of the Z stage 21 and the surface Ca of the vibration member C are substantially flush.

  In the present embodiment, the vibrating member C can generate vibrations having a frequency of 950 KHz. The vibration member C generates vibration by operating the piezoelectric ceramic element. The vibrating member C is not limited to 950 KHz, and a vibrator of about 1 KHz to 2 MHz can be mounted. The vibrating member C is not limited to a piezoelectric ceramic element, for example, and may be a piezoelectric polymer film or a ZnO thin film vibrator.

  The vibration generated by the vibration member C can be propagated as a sound wave in the liquid. The wavelength of the sound wave propagating to the liquid can be expressed by the following formula 1.

Wavelength of sound wave = Speed of sound wave in liquid / Frequency of vibrating member C --- Formula 1
Therefore, in this embodiment, the frequency of the vibration member C is 950 KHz and the wavelength of the sound wave is determined based on the speed of the sound wave in the liquid in which the sound wave is transmitted.

  FIG. 5 shows the state of sound waves propagating to the liquid. The vibration applied to the liquid by the vibration member C generates an amplitude. In the liquid, abdominal portions R having a large amplitude are generated at predetermined intervals along the direction of the propagating sound wave, and node portions F are generated between the abdominal portions R. One wavelength in this embodiment includes two antinodes and two nodes as shown in FIG. That is, the half wavelength includes one antinode portion R and two node portions F. In the present embodiment, the quarter wavelength includes one antinode portion R and one nodal portion F. Therefore, the antinode portion R is always included within the quarter wavelength. When the vibration is propagated to the object as a sound wave, the vibration that reaches the object when it reaches the abdomen R and the vibration that reaches the object when it reaches the node part F are different. In the present embodiment, the vibration when the vibration reaches the abdominal part R is larger than the vibration when the vibration reaches the node part F.

  In the present embodiment, due to the vibration of the vibration member C, as shown in FIG. 4, the sound wave generated in the liquid propagates while traveling straight. Therefore, in the cleaning of the object by the vibration member C, the sound wave generated by the vibration member C goes straight, and only the portion of the object where the sound wave has reached is cleaned by the vibration member C. Therefore, in the case where the cross-sectional area of the sound wave generated by the vibration member C on the XY plane is to be cleaned, it is necessary to relatively move the vibration member C and the target object on the XY plane. There is. In the XY plane, the cross-sectional area of the sound wave generated by the vibrating member C is the same as the area of the vibrating member C. In the XY plane, the cross-sectional area of the sound wave generated by the vibrating member C may be different from the area of the vibrating member C.

  The surface Ca of the vibrating member C is liquid repellent with respect to the exposure liquid LQ1. In the present embodiment, the contact angle is desirably 90 ° or more. The surface Ca of the vibration member C may not be liquid repellent, and may be lyophilic, for example.

  The measuring member (measuring instrument) includes a reference member on which a reference mark such as an alignment sensor mark is formed, and various photoelectric sensors. The measuring instrument is an aerial image of a pattern projected by the projection optical system PL disclosed in, for example, an uneven illuminance sensor disclosed in US Pat. No. 4,465,368, for example, US 2002/0041377. An aerial image measuring instrument that measures the light intensity of a projected image, for example, an illuminance monitor disclosed in US Patent Application Publication No. 2002/0061469, and a wavefront aberration measuring instrument disclosed in European Patent No. 1,079,223. is there. The measuring instrument includes a reference member on which a reference mark such as an alignment sensor mark is formed, and various photoelectric sensors. The measuring instrument is an aerial image of a pattern projected by the projection optical system PL disclosed in, for example, an uneven illuminance sensor disclosed in US Pat. No. 4,465,368, for example, US 2002/0041377. An aerial image measuring instrument that measures the light intensity of a projected image, for example, an illuminance monitor disclosed in US Patent Application Publication No. 2002/0061469, and a wavefront aberration measuring instrument disclosed in European Patent No. 1,079,223. is there.

  Next, an example of the operation of the above-described exposure apparatus EX will be described.

  First, the substrate P before exposure is loaded onto the substrate stage 2 using a predetermined transport device.

  After the substrate P before exposure is held on the substrate stage 2, the immersion space LS formed between the last optical element 10 and the measurement stage I is moved to the substrate stage 2. The substrate stage 2 is moved below the projection optical system PL so that the last optical element 10 and the substrate P face each other, and the immersion space LS is measured in a state where the substrate stage 2 and the measurement stage I are close to or in contact with each other. Move from the surface S of the stage to the surface H of the substrate stage 2. By moving the substrate stage 2, the immersion space LS is moved from the surface H of the substrate stage 2 to the surface of the substrate P. Therefore, the emission surface 11 and the surface of the substrate P face each other, and the projection region PR is arranged on a part of the surface of the substrate P. The immersion space LS is disposed so as to cover a partial region of the surface of the substrate P facing the emission surface 11.

  In the state where the optical path of the exposure light EL between the last optical element 11 and the substrate P is filled with the exposure liquid LQ1, the exposure light EL is emitted from the illumination system IL. The exposure light EL emitted from the emission surface 11 illuminates the mask M. The exposure light EL that has passed through the mask M is irradiated onto the substrate P via the projection optical system PL and the liquid LQ in the immersion space LS. As a result, the pattern image of the mask M is projected onto the surface Pa of the substrate P, and the substrate P is exposed with the exposure light EL. As described above, at the time of exposure, the exposure liquid LQ1 in the immersion space LS and the liquid immersion member 6 (for example, the recovery port 8a) are in contact with each other.

  After the exposure of the substrate P is completed, the measurement stage I approaches or contacts the substrate stage 2. In a state where the immersion space LS is maintained below the projection optical system PL, the immersion space LS is moved from above the substrate P to the surface H of the substrate stage 2, and from the surface H of the substrate stage 2 to the surface S of the measurement stage I. The immersion space LS is moved. During this time, the exposure liquid LQ1 in the immersion space LS and the emission surface 11 are in contact with each other. The substrate P (exposed substrate P) exposed with the exposure light EL is unloaded from the substrate holder PH.

  While the substrate stage unloads the exposed substrate P at a predetermined position and loads the unexposed substrate P, the measuring instrument of the measurement stage I is immersed in the immersion space LS on the surface S of the measurement stage I. In a state where the above is maintained, the measurement is performed while the liquid is in the immersion space LS.

  By the way, during exposure of the substrate P, a substance (e.g., an organic substance such as a photosensitive material) generated (eluted) from the substrate P may be mixed into the exposure liquid LQ1 in the immersion space LS as a foreign substance (contaminant, particle). is there. If foreign matter is mixed in the exposure liquid LQ1 in the immersion space LS, there is a possibility that the foreign matter adheres to the recovery portion 8 of the immersion member 6. If a foreign matter is left on the surface (liquid contact surface) of a predetermined member in the exposure apparatus EX that contacts the exposure liquid LQ1, the foreign matter may adhere to the substrate P during exposure. is there. Further, if the recovery unit 8 of the liquid immersion member 6 is contaminated, for example, the liquid immersion space LS may not be formed satisfactorily. As a result, exposure failure may occur.

  In the present embodiment, cleaning that removes foreign matter adhering to the porous member 19 of the recovery unit 8 of the liquid immersion member 6 among the members in contact with the exposure liquid LQ1 will be described as an example. The place to be cleaned is not limited to the porous member 19 and may be, for example, the terminal optical element 10 or the flat member F.

  In the present embodiment, cleaning is performed to remove foreign matter adhering to the porous member 19 using the vibrating member C mounted on the measurement stage I. In the present embodiment, the exposure liquid LQ1 is used for cleaning the porous member 19.

  In this embodiment, the porous member 19 is cleaned after exposing a predetermined number of substrates or exposing for a predetermined period. Note that the cleaning of the porous member 19 may be started using an observation device (not shown) (for example, a camera), for example, by observing the lower surface 8a and determining that cleaning to remove foreign matter is necessary. In this case, a place different from the porous member 19 (for example, the surface H of the substrate stage 2) may be observed, and it may be determined whether or not cleaning is necessary to remove the foreign matter adhering to the porous member 19.

  As shown in FIG. 6, in the cleaning of the porous member 19, the immersion space LS with the exposure liquid LQ1 is formed with the liquid immersion member 6 and the measurement stage I facing each other. The exposure liquid LQ1 is supplied from the supply port 7a, and the supplied exposure liquid LQ1 is recovered from the recovery port 8a, thereby forming an immersion space LS by the exposure liquid LQ1. At the time of cleaning the porous member 19, the immersion space LS with the exposure liquid LQ1 and the porous member 19 come into contact with each other. Further, at the time of exposure of the substrate P, the interface of the exposure liquid LQ1 was in the porous member 19, but at the time of cleaning the porous member 19, the interface of the exposure liquid LQ1 was outside the porous member 19 (to the opening 6K). , Outside). The size of the immersion space LS of the exposure liquid LQ1 when exposing the substrate P and the size of the immersion space LS of the non-exposure liquid LQ2 when cleaning the porous member 19 may not be the same.

  While the immersion liquid LS is formed while supplying the exposure liquid LQ1 from the supply port 7a and collecting the recovery port 8a of the supplied exposure liquid LQ1, the vibrating member C The porous member 19 is opposed. In the present embodiment, the porous member 19 having a larger area than the cross-sectional area is washed with the cross-sectional area of the sound wave generated in the exposure liquid LQ1 by the vibration of the vibration member C on the XY plane. The vibration member C is moved by driving I. That is, in the XY plane, the area of the vibrating member C is smaller than the area of the porous member 19. By moving the vibrating member C, the portion where the sound wave reaches in the porous member 19 changes. In the present embodiment, after the concave portion B shown in FIG. 4 is cleaned, the vibrating member C is moved to clean the convex portion D. The convex portion D may be washed before the concave portion B.

  Incidentally, as described above, since the porous member 19 includes the concave portion B and the convex portion D, when the vibrating member C is moved along the XY plane, the concave portion and the vibrating member when the concave portion B is washed are used. The distance in the Z-axis direction from C is different from the distance in the Z-axis direction between the convex portion D and the vibrating member C when the convex portion D is cleaned. In the present embodiment, since the surface of the vibration member C is parallel to the XY plane, the sound wave generated by the vibration of the vibration member C propagates along the Z-axis direction. Therefore, the distance that the sound wave propagates through the exposure liquid LQ1 when cleaning the concave portion B is different from the distance that the sound wave propagates through the exposure liquid LQ1 when cleaning the convex portion D. Therefore, since the antinode portion R of the sound wave does not reach the concave portion B and the convex portion D, the vibration of the sound wave reaching the concave portion B and the convex portion D is smaller than that of the antinode portion R, and the cleaning efficiency is lowered. there's a possibility that.

  In the present embodiment, when the vibrating member C is moved along the XY plane, cleaning is performed on the antinode portion R of the sound wave in the concave portion B, and cleaning is performed on the node portion F of the sound wave in the convex portion D. To do.

  In cleaning the recess B, the position of the vibration member C in the Z-axis direction and the position of the recess B in the Z-axis direction are calculated, and the distance between the vibration member C and the recess B along the Z-axis direction is calculated. In the present embodiment, the wavelength of the sound wave is calculated from the liquid (exposure liquid LQ1) already used for cleaning and the frequency of the vibrating member C. Based on these, in the cleaning of the recess B, the position of the vibrating member C for the arrival of the anti-node portion R of the sound wave is determined.

  In the present embodiment, after cleaning the concave portion B, the vibrating member C is moved along the XY plane to a place where the convex portion D is cleaned. The distance between the vibrating member C and the convex portion D along the Z-axis direction through which the sound wave propagates is changed so that the convex portion D is cleaned at the antinode portion R of the acoustic wave. The distance between the vibrating member C and the convex portion D is calculated from the wavelength of the sound wave generated in the exposure liquid LQ1 by the vibration of the vibrating member C that has already been calculated so as to perform cleaning at the abdominal portion R. The vibrating member C is moved along the Z-axis direction at the place where the convex portion D is cleaned so that the calculated distance is obtained. As described above, since the sound wave propagating in the liquid repeats the abdominal part R and the node part F every quarter wavelength, the vibration member C is moved along the Z-axis direction at the place where the convex part D is cleaned. , And move within a range shorter than ¼ wavelength. The moving direction may be the + Z-axis direction in which the distance between the vibrating member C and the porous member 19 is shortened, or the −Z-axis direction in which the distance between the vibrating member C and the porous member 19 is increased. It is desirable to move the vibrating member C in the + Z-axis direction and the −Z-axis direction so that the moving distance of the vibrating member C is shortened. In the present embodiment, even when the porous member 19 includes the concavo-convex portion O, the sound wave antinodes R can reach all of the porous member 19 and the porous member 19 can be cleaned. After the cleaning of the porous member 19, the exposure of the substrate P held on the substrate stage 2 is started.

  In this embodiment, the concave and convex portion O of the porous member 19 is provided with one concave portion B and one convex portion D, but a plurality of concave portions and convex portions D may be provided. In the present embodiment, the concave portion B and the convex portion D are provided adjacent to each other. However, the concave portion B and the convex portion D may be separately provided on a predetermined surface.

  As described above, since the convex portion D and the concave portion B are separated by a quarter wavelength or more in the Z-axis direction, when the convex portion D is cleaned, the vibration member C is in a range of the quarter wavelength or more. You may move it with. For example, the distance between the concave portion B and the vibrating portion C where the abdominal portion R reaches is calculated by cleaning the concave portion B, but the shape of the uneven portion O of the porous member 19 is maintained while maintaining the calculated distance. Based on this, the vibration member C may be moved and cleaned.

  In this embodiment, after cleaning the concave portion B, the vibrating portion C is moved along the XY plane, and the vibrating portion C is moved in the Z-axis direction to clean the convex portion D. The moving direction of the part C is not limited to this. For example, after cleaning the recess B, the vibrating part C may be moved along a plane intersecting the XY plane.

  As described above, in the present embodiment, when the liquid immersion member 6 is cleaned, the positional relationship between the liquid immersion member 6 and the vibration part C is changed depending on the location of the liquid immersion member 6 to be cleaned. Therefore, the antinode portion R of the sound wave generated by the vibration of the vibration member C can reach the liquid immersion member 6. Therefore, the liquid immersion member 6 can be satisfactorily cleaned using the vibration part C. Therefore, exposure failure can be suppressed.

Second Embodiment
Next, a second embodiment will be described. In the following description, the same or equivalent components as those in the above-described embodiment are denoted by the same reference numerals, and the description thereof is simplified or omitted.

  In this embodiment, when cleaning the porous member 19, the temperature of the exposure liquid LQ1 between the porous member 19 and the vibrating member C is adjusted.

  As described above, the wavelength of the sound wave changes based on the speed of the sound wave in the liquid. Further, the speed of the sound wave in the liquid changes based on the temperature of the liquid. Therefore, in this embodiment, when cleaning the porous member 19, the temperature of the exposure liquid LQ1 between the porous member 19 and the vibrating member C is adjusted to change the wavelength of the sound wave in the exposure liquid LQ1. In the present embodiment, the control device stores in advance information on the wavelength of the sound wave in the exposure liquid LQ1 generated by the vibrating member C having a predetermined frequency at each temperature of the exposure mode LQ1.

  In the present embodiment, when the vibrating member C is moved along the XY plane, cleaning is performed on the antinode portion R of the sound wave in the concave portion B, and cleaning is performed on the node portion F of the sound wave in the convex portion D. To do.

  After the cleaning in the recess B, the distance between the recess B and the vibration member C along the Z-axis direction when the vibration member C is moved along the XY plane is calculated. From the stored wavelength of the sound wave in the exposure liquid LQ1 at each temperature of the exposure liquid LQ1 and the calculated distance between the recess B and the vibration member C along the Z-axis direction, The temperature of the exposure liquid LQ1 necessary for reaching R is calculated. The temperature of the exposure liquid LQ1 supplied from the supply unit 7 is adjusted using the liquid supply device so that the calculated temperature is obtained.

  In addition, not only one of the wavelength of the sound wave in the liquid and the positional relationship between the liquid immersion member 6 and the vibration member C may be changed. Further, a liquid having a predetermined temperature may be supplied to the vibrating member C so that the wavelength of the sound wave in the liquid does not change with the temperature change of the liquid during cleaning.

  As described above, in the present embodiment, when cleaning the liquid immersion member 6, the wavelength of the sound wave in the liquid is changed depending on the location of the liquid immersion member 6 to be cleaned. Therefore, the antinode portion R of the sound wave generated by the vibration of the vibration member C can reach the liquid immersion member 6. Therefore, the liquid immersion member 6 can be satisfactorily cleaned using the vibration member C. Therefore, exposure failure can be suppressed.

<Third Embodiment>
Next, a second embodiment will be described. In the following description, the same or equivalent components as those in the above-described embodiment are denoted by the same reference numerals, and the description thereof is simplified or omitted.

  In the present embodiment, when the porous member 19 is cleaned, the space between the porous member 19 and the vibrating member C is filled with the non-exposure liquid LQ2, and the porous member 19 is cleaned. In this embodiment, a tetramethylammonium hydroxide (TMAH) aqueous solution is used as the non-exposure liquid LQ2.

  In the cleaning of the porous member 19, the immersion space LS with the non-exposure liquid LQ2 is formed with the liquid immersion member 6 and the measurement stage I facing each other. The non-exposure liquid LQ2 is supplied from the supply port 7a, and the supplied non-exposure liquid LQ2 is recovered from the recovery port 8a, thereby forming an immersion space LS by the non-exposure liquid LQ2. At the time of cleaning the porous member 19, the immersion space LS with the non-exposure liquid LQ2 and the porous member 19 come into contact with each other. Further, at the time of exposure of the substrate P, the interface of the exposure liquid LQ1 was in the porous member 19, but at the time of cleaning the porous member 19, the interface of the non-exposure liquid LQ2 was outside the porous member 19 (with respect to the opening 6K). It is better to be on the outside. The size of the immersion space LS of the exposure liquid LQ1 when the substrate P is exposed may differ from the size of the immersion space LS of the non-exposure liquid LQ2 when the porous member 19 is cleaned.

  In the present embodiment, a case where the porous member 19 using the non-exposure liquid LQ2 different from the exposure liquid LQ1 is cleaned after the porous member 19 using the exposure liquid LQ1 in the first embodiment is cleaned will be described. . In the present embodiment, the control device stores in advance information on the wavelength of the sound wave in the liquid generated by the vibrating member C having a predetermined frequency for each type of liquid.

  Since the types of liquid are different between the exposure liquid LQ1 and the non-exposure liquid LQ2, the speed of sound waves in each liquid is different. Therefore, the wavelength of the sound wave differs between the exposure liquid LQ1 and the non-exposure liquid LQ2. Therefore, in the present embodiment, the distance between the concave portion B and the vibration member C along the Z-axis direction, the convex portion D, and the convex portion D so that the antinode portion R reaches the concave portion B from the wavelength of the sound wave of the non-exposure liquid LQ2. The distance from the vibration member C is calculated, and cleaning is performed based on the calculated distance. In the present embodiment, unlike the exposure liquid LQ1 and the non-exposure liquid LQ2, since the wavelength of the sound wave in the liquid is different, the calculated distance also differs depending on the type of liquid.

  In the above-described embodiment, the immersion space LS is formed by the non-exposure liquid LQ2 supplied from the supply port 7a. However, the immersion space LS is formed by the non-exposure liquid LQ2 supplied from a place different from the supply port 7a. It may be formed. For example, a supply port for supplying the non-exposure liquid LQ2 that is different from the supply port 7a of the liquid immersion member 6 may be provided outside the recovery port 8 of the liquid immersion member 6 to supply the non-exposure liquid LQ2. Further, for example, a supply port for supplying the non-exposure liquid LQ2 to the measurement stage I may be provided to supply the non-exposure liquid LQ2. Further, for example, the non-exposure liquid LQ2 may be supplied from the recovery port 8 of the liquid immersion member 6. In this case, a recovery port capable of recovering the supplied non-exposure liquid LQ2 may be provided outside the recovery unit 8 to recover the supplied non-exposure liquid LQ2.

  The non-exposure liquid LQ2 may not be cleaned after the exposure liquid LQ1 is cleaned. Further, the cleaning of the non-exposure liquid LQ2 may be performed a plurality of times by changing the type of liquid used. Further, the cleaning of the exposure liquid LQ1 and the cleaning of the non-exposure liquid LQ2 may be repeated a plurality of times.

  As described above, in this embodiment, when cleaning the liquid immersion member 6, the wavelength of the sound wave in the liquid is calculated based on the type of liquid between the liquid immersion member 6 and the vibration member C. . Based on the calculated wavelength of the sound wave, the positional relationship between the liquid immersion member 6 and the vibration member C was changed depending on the location of the liquid immersion member 6 to be cleaned. Therefore, the antinode portion R of the sound wave generated by the vibration of the vibration member C can reach the liquid immersion member 6. Therefore, the liquid immersion member 6 can be satisfactorily cleaned using the vibration member C. Therefore, exposure failure can be suppressed.

  In addition, when changing the positional relationship of the liquid immersion member 6 and the vibration member C, it is not restricted to the above-mentioned uneven | corrugated | grooved part O. FIG. For example, the positional relationship between the liquid immersion member 6 and the vibration member C is also changed when the porous member 19 includes an inclined portion that intersects the XY plane perpendicular to the Z-axis direction. FIG. 7 shows an example of the porous member 19 having an inclined portion. As shown in FIG. 7, the case where the first portion J of the inclined portion and the second portion K of the inclined portion are cleaned will be described as an example. Even in the case of the inclined portion, the distance between the vibration member C and the first point J in the Z-axis direction in the first point cleaning, and the vibration member C and the second point K in the Z-axis direction in the second point cleaning. And the distance is different. Therefore, similarly to the concavo-convex portion D, the positional relationship between the inclined portion and the vibration member C is changed so that the anti-node portion R of the sound wave reaches the cleaning target.

  In addition, although the distance which the sound wave in the liquid by the vibration of the vibration member C propagates is changed by moving the vibration member C along the Z-axis direction, it is not limited to this. For example, the liquid immersion member 6 to be cleaned may be driven and moved along the Z-axis direction. Further, for example, as shown in FIG. 8, by tilting the vibrating member C about the Y axis (θY), the distance that the sound wave in the liquid propagates to the liquid immersion member 6 can be changed. For example, as shown in FIG. 9, the direction in which the sound wave propagates in the liquid can be changed by arranging a reflecting member that reflects the sound wave in the liquid.

  In the above-described embodiment, the vibration member C is mounted on the measurement stage I, the vibration member C is vibrated, and the liquid immersion member 6 is cleaned. However, the method of generating vibration is not limited thereto. For example, in a state where the immersion space LS is formed between the measurement stage I and the liquid immersion member 6, the measurement stage I may be vibrated at a predetermined cycle to generate sound waves in the liquid immersion space LS.

  In the above-described embodiment, the place where the vibration member C is mounted is not limited to the measurement stage I. For example, the substrate stage 2 may be used. In this case, the vibrator C may be mounted on the substrate, and the substrate on which the vibrator C is mounted may be held by the substrate holding portion PH. Further, a stage different from the substrate stage 2 and the measurement stage I may be provided, and the vibrator C may be mounted on the different stage.

  In the above-described embodiment, the Z stage I1 of the measurement stage I is moved along the Z-axis direction and the vibration member C is moved along the Z-axis direction. However, the method for changing the position of the vibration member C is as follows. Not limited to. For example, the vibrating member C may be driven independently of the measurement stage I.

  In the above-described embodiment, one vibration member C is mounted, but a plurality of vibration members C may be mounted. For example, the positions in the Z-axis direction of the plurality of vibration members C may be different. Since the position of the vibration member C is different in the Z-axis direction, the distance between the vibration member C and the object to be cleaned in the Z-axis direction is also different for each of the plurality of vibration members C. Therefore, among the plurality of vibration members C, the vibration member C that can reach the sound wave of the abdominal part R in the object to be cleaned may be selected from the plurality of vibration members C and used for cleaning.

  In the above-described embodiment, the frequency of vibration generated from the vibration member C is one, but it may be selected from a plurality of frequencies. As described above, the wavelength of the generated sound wave can be changed based on the frequency. Therefore, among the plurality of frequencies, a frequency at which the sound wave of the abdominal portion R can reach the object to be cleaned may be selected from the plurality of frequencies and used for cleaning.

  In the above-described embodiment, the liquid immersion member 6 and the measurement stage mounted with the vibration member C are opposed to each other to clean the liquid immersion member 6. However, the object to be opposed is carried into the inside from the outside of the exposure apparatus EX. And may be washed. For example, a maintenance device as disclosed in US Patent Application Publication No. 2008/018867 may be faced and cleaned. The positional relationship between the vibrating member and the liquid immersion member mounted on the maintenance device may be changed.

  In each of the above-described embodiments, water is used as the exposure liquid LQ1, but a liquid other than water may be used. The exposure liquid LQ1 is transmissive to the exposure light EL, has a high refractive index with respect to the exposure light EL, and is a photosensitive material (photoresist) that forms the surface of the projection optical system PL or the substrate P. Those that are stable to the membrane are preferred. For example, as the exposure liquid LQ1, hydrofluoroether (HFE), perfluorinated polyether (PFPE), fomblin oil, or the like can be used. In addition, various fluids such as a supercritical fluid can be used as the exposure liquid LQ1.

  As the substrate P in each of the above embodiments, not only a semiconductor wafer for manufacturing a semiconductor device, but also a glass substrate for a display device, a ceramic wafer for a thin film magnetic head, or an original mask or reticle used in an exposure apparatus. (Synthetic quartz, silicon wafer) or the like is applied.

  The exposure apparatus EX is not limited to the exposure apparatus using a scanning stepper. A step / repeat method in which the pattern of the mask M is collectively exposed while the mask M and the substrate P are stationary and the substrate P is sequentially moved may be employed.

  Furthermore, in the step-and-repeat exposure, after the reduced image of the first pattern is transferred onto the substrate P using the projection optical system while the first pattern and the substrate P are substantially stationary, the second pattern With the projection optical system, the reduced image of the second pattern may be partially overlapped with the first pattern and collectively exposed on the substrate P (stitch type batch exposure apparatus). ). Further, the stitch type exposure apparatus can be applied to a step-and-stitch type exposure apparatus in which at least two patterns are partially transferred on the substrate P, and the substrate P is sequentially moved.

  Further, as disclosed in, for example, US Pat. No. 6,611,316, two mask patterns are synthesized on a substrate via a projection optical system, and one shot on the substrate is obtained by one scanning exposure. The present invention can also be applied to an exposure apparatus that performs double exposure of a region almost simultaneously. The present invention can also be applied to proximity type exposure apparatuses, mirror projection aligners, and the like.

  The present invention also relates to a twin stage type exposure apparatus having a plurality of substrate stages as disclosed in US Pat. No. 6,341,007, US Pat. No. 6,208,407, US Pat. No. 6,262,796, and the like. It can also be applied to.

  The type of the exposure apparatus EX is not limited to an exposure apparatus for manufacturing a semiconductor element that exposes a semiconductor element pattern on the substrate P, but an exposure apparatus for manufacturing a liquid crystal display element or a display, a thin film magnetic head, an image sensor (CCD). ), An exposure apparatus for manufacturing a micromachine, a MEMS, a DNA chip, a reticle, a mask, or the like.

  In each of the above-described embodiments, an ArF excimer laser may be used as a light source device that generates ArF excimer laser light as exposure light EL. For example, as disclosed in US Pat. No. 7,023,610. A harmonic generator that outputs pulsed light with a wavelength of 193 nm may be used, including a solid-state laser light source such as a DFB semiconductor laser or a fiber laser, an optical amplification unit having a fiber amplifier, a wavelength conversion unit, and the like. Furthermore, in the above-described embodiment, each illumination area and the projection area described above are rectangular, but other shapes such as an arc shape may be used.

  In each of the above-described embodiments, a light-transmitting mask in which a predetermined light-shielding pattern (or phase pattern / dimming pattern) is formed on a light-transmitting substrate is used. You can use a mask. Further, as disclosed in, for example, U.S. Pat. No. 6,778,257, a variable shaping mask (an electronic mask, an active mask, an active mask, or the like) that forms a transmission pattern, a reflection pattern, or a light emission pattern based on electronic data of a pattern to be exposed. Alternatively, an image generator may be used. The variable shaping mask includes, for example, a DMD (Digital Micro-mirror Device) which is a kind of non-light emitting image display element (spatial light modulator). Further, a pattern forming apparatus including a self-luminous image display element may be provided instead of the variable molding mask including the non-luminous image display element. As a self-luminous type image display element, for example, CRT (Cathode Ray Tube), inorganic EL display, organic EL display (OLED: Organic Light Emitting Diode), LED display, LD display, field emission display (FED: Field Emission Display) And a plasma display panel (PDP).

  In each of the above embodiments, the exposure apparatus provided with the projection optical system PL has been described as an example. However, the present invention can be applied to an exposure apparatus and an exposure method that do not use the projection optical system PL.

  Further, as disclosed in, for example, International Publication No. 2001/035168, an exposure apparatus (lithography system) that exposes a line and space pattern on the substrate P by forming interference fringes on the substrate P. The present invention can also be applied to.

  As described above, the exposure apparatus EX according to the embodiment of the present application maintains various mechanical subsystems including the respective constituent elements recited in the claims of the present application so as to maintain predetermined mechanical accuracy, electrical accuracy, and optical accuracy. Manufactured by assembling. In order to ensure these various accuracies, before and after assembly, various optical systems are adjusted to achieve optical accuracy, various mechanical systems are adjusted to achieve mechanical accuracy, and various electrical systems are Adjustments are made to achieve electrical accuracy. The assembly process from the various subsystems to the exposure apparatus includes mechanical connection, electrical circuit wiring connection, pneumatic circuit piping connection and the like between the various subsystems. Needless to say, there is an assembly process for each subsystem before the assembly process from the various subsystems to the exposure apparatus. When the assembly process of the various subsystems to the exposure apparatus is completed, comprehensive adjustment is performed to ensure various accuracies as the entire exposure apparatus. The exposure apparatus is preferably manufactured in a clean room where the temperature, cleanliness, etc. are controlled.

  As shown in FIG. 10, a microdevice such as a semiconductor device includes a step 201 for designing a function / performance of the microdevice, a step 202 for producing a mask (reticle) based on the design step, and a substrate as a substrate of the device. Substrate processing step 204 including substrate processing including exposing the substrate with exposure light using a mask pattern (exposure processing) and developing the exposed substrate according to the above-described embodiment. The device is manufactured through a device assembly step (including processing processes such as a dicing process, a bonding process, and a package process) 205, an inspection step 206, and the like.

  Note that the requirements of the above-described embodiments can be combined as appropriate. In addition, as long as permitted by law, the disclosure of all published publications and US patents related to the exposure apparatus and the like cited in the above-described embodiments and modifications are incorporated herein by reference.

6 --- Immersion member, C --- Vibration member, LQ1 --- Exposure liquid, LS --- Immersion space

It is a schematic block diagram which shows an example of the exposure apparatus EX in this embodiment. FIG. 6 is a diagram showing a state where an immersion space LS is formed on the substrate stage 2. It is a figure which shows an example of the collection | recovery part 8 in this embodiment. It is a figure which shows an example of the porous member 19 in this embodiment. It is a figure which shows an example of the mode of the sound wave which propagates to the liquid in this embodiment. FIG. 3 is a diagram showing a state where an immersion space LS is formed in the measurement stage I. It is a figure which shows an example of the porous member 19 in this embodiment. It is a figure which shows an example of the mode of the sound wave which propagates to the liquid in this embodiment. It is a figure which shows an example of the mode of the sound wave which propagates to the liquid in this embodiment. The flowchart which shows an example of the manufacturing process of a microdevice.

Claims (29)

A method for cleaning a liquid contact member in contact with the first liquid of an exposure apparatus that exposes a substrate through the first liquid,
Contacting the liquid contact member with a second liquid;
By vibrating the vibration part, the sound wave generated in the second liquid is propagated in the second liquid, and reaches the first point on the surface of the liquid contact member from a predetermined direction. Cleaning and
By vibrating the vibrating portion, sound waves generated in the second liquid are propagated in the second liquid, and the second point different from the first point on the surface of the liquid contact member is moved from the predetermined direction. Cleaning the second point by reaching,
Changing at least one of the wavelength of the sound wave and the positional relationship of the liquid contact member and the vibrating portion in the predetermined direction between the cleaning of the first point and the cleaning of the second point. Cleaning method.   The cleaning method according to claim 1, wherein at least one of the wavelength of the sound wave and the positional relationship between the liquid contact member and the vibrating portion is changed based on the shape of the surface of the liquid contact member.   The cleaning method according to claim 1, wherein positions of the first and second points are different in the predetermined direction.   The cleaning method according to claim 3, wherein the positions of the first and second points are separated by a quarter or more of the sound wave. The shape of the surface of the liquid contact member includes irregularities,
The cleaning method according to claim 3, wherein the first and second points are arranged on the unevenness. The exposure apparatus includes a projection optical system that emits the exposure light,
The shape of the surface of the liquid contact member includes an inclined portion with respect to a plane perpendicular to the optical axis of the projection optical system,
The cleaning method according to claim 3, wherein the first and second points are arranged on the inclined portion.   The difference between the distance that the sound wave propagates in the cleaning of the first point and the distance that the sound wave propagates in the cleaning of the second point is in a range shorter than ¼ of the wavelength of the sound wave. The cleaning method according to any one of claims 1 to 6, wherein a positional relationship between the liquid contact member and the vibrating portion is changed in a predetermined direction. The liquid contact member holds the first liquid with the substrate so that at least a part of the optical path of the exposure light is filled with the first liquid,
The cleaning method according to any one of claims 1 to 7, wherein the liquid contact member includes at least one of a supply port for supplying the first liquid and a recovery port for recovering the supplied first liquid.   The cleaning method according to claim 8, wherein a porous member is disposed in the recovery port.   The cleaning method according to claim 8 or 9, wherein at least one of the supply of the second liquid and the recovery of the second liquid is performed using at least one of the supply port and the recovery port.   The cleaning method according to any one of claims 1 to 10, wherein the second liquid is supplied in a state where an object is disposed to face the liquid contact member. The object includes a movable stage;
The cleaning method according to claim 11, wherein the vibration unit is mounted on the stage.   The cleaning method according to claim 12, wherein the stage is equipped with a measuring instrument that measures the exposure light without holding the substrate.   The cleaning method according to claim 1, wherein the first liquid and the second liquid are the same. Washing the liquid contact member with the cleaning method according to any one of claims 1 to 14,
Exposing the substrate;
Developing the exposed substrate. A device manufacturing method. An exposure apparatus that exposes a substrate through a first liquid,
A liquid contact member in contact with the first liquid;
A vibration part,
In the state where the liquid contact member and the second liquid are in contact with each other, by vibrating the vibration portion, a sound wave generated in the second liquid is propagated to the liquid contact member, and the surface of the liquid contact member When the liquid contact member is cleaned by reaching the liquid contact member in a predetermined direction, the first point on the surface of the liquid contact member is cleaned by reaching the sound wave from the predetermined direction. When the sound wave from the direction is reached to clean a second point different from the first point on the surface of the liquid contact member, the wavelength of the sound wave, the liquid contact member, and the vibration unit An exposure apparatus that changes at least one of the positional relationship in the predetermined direction.   The exposure apparatus according to claim 16, wherein at least one of the wavelength of the sound wave and the positional relationship between the liquid contact member and the vibration unit is changed based on a shape of a surface of the liquid contact member.   The exposure apparatus according to claim 16 or 17, wherein positions of the first and second points are different in the predetermined direction.   The exposure apparatus according to claim 18, wherein the positions of the first and second points are separated by a quarter or more of the sound wave. The shape of the surface of the liquid contact member includes irregularities,
The exposure apparatus according to claim 18, wherein the first and second points are arranged on the unevenness. And a projection optical system for emitting the exposure light,
The shape of the surface of the liquid contact member includes an inclined portion with respect to a plane perpendicular to the optical axis of the projection optical system,
21. The exposure apparatus according to any one of claims 18 to 20, wherein the first and second points are arranged on the inclined portion.   The difference between the distance that the sound wave propagates in the cleaning of the first point and the distance that the sound wave propagates in the cleaning of the second point is within a range shorter than ¼ of the wavelength of the sound wave. The exposure apparatus according to any one of claims 16 to 21, wherein a positional relationship between the liquid contact member and the vibrating portion is changed in the predetermined direction.   Further, the liquid contact member includes a supply port for supplying the first liquid and a recovery port for recovering the supplied first liquid so that at least a part of the optical path of the exposure light is filled with the first liquid. The exposure apparatus according to any one of claims 16 to 22, comprising:   The exposure apparatus according to claim 23, wherein a porous member is disposed in the recovery port.   The second liquid is supplied using at least one of the first and second supply ports and the recovery port, and the supplied second liquid is supplied using at least one of the second supply port and the recovery port. The exposure apparatus according to claim 23 or 24 to be collected. Furthermore, the vibration part is mounted, and a movable stage is provided.
The exposure apparatus according to any one of claims 16 to 25, wherein the second liquid is supplied in a state where the stage is disposed to face the liquid contact member.   27. The exposure apparatus according to claim 26, wherein the stage is equipped with a measuring instrument that measures the exposure light without holding the substrate.   The exposure apparatus according to any one of claims 16 to 27, wherein the first liquid and the second liquid are the same. In the exposure apparatus according to any one of claims 16 to 28, washing the liquid contact member;
Exposing the substrate;
Developing the exposed substrate. A device manufacturing method.

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