JP2012087328A - Film deposition device and film deposition method - Google Patents

Abstract

A film forming apparatus and a film forming method capable of evaporating while supplying a predetermined amount of film forming material are provided.
[Solution]
The inside of the vacuum chamber 11 is evacuated, and the vaporization container 21 connected to the discharge container 16 is heated to a temperature equal to or higher than the evaporation temperature of the film forming material and equal to or higher than the evaporation temperature of the solvent of the liquid material containing the film forming material. A predetermined amount of the liquid material is ejected into the gas 21, the film forming material is attached to the vaporizing member 22 disposed in the vaporizing vessel 21, and then the vapor of the solvent is discharged from the vaporizing vessel 21. The film forming material adhering to the vaporizing member 22 is evaporated by heating to a temperature equal to or higher than the evaporation temperature of the material, the vapor of the film forming material is caused to flow into the discharge container 16, and the vapor of the film forming material is released from the hole 17 of the discharge container 16. To reach the substrate 15 disposed in the vacuum chamber 11.
[Selection] Figure 1

Description

  The present invention relates to a film forming apparatus and a film forming method.

Conventionally, when an organic film such as an organic EL element is formed, a substrate is placed in a vacuum chamber, and an organic film forming material is deposited on the substrate by vacuum vapor deposition.
In recent years, as the size of a substrate increases, the amount of film forming material necessary for film formation per substrate increases. For example, to form an organic film having a thickness of 400 mm on a G8 size substrate, about 500 mg of film forming material is required. This corresponds to 1 kg of film forming material when converted into film forming work for one week.

  In the conventional film forming apparatus, the powdery film forming material placed in the crucible is heated to generate steam, so that it is necessary to heat a large amount of material for a long time, and deterioration of the material has been a problem. In addition, a method of supplying and evaporating the powder little by little has been developed, but it has been difficult to accurately measure and control the flow rate of the powder.

  Furthermore, since the heat capacity increases as the amount of film forming material put into the crucible increases, even if a crucible containing 1 kg of film forming material is made, the heating becomes uneven or necessary due to the increase or decrease of the material. Since the amount of heat changes, it is difficult to control the amount of evaporation.

International Publication No. 2009/101953

  The present invention was created to solve the above-described disadvantages of the prior art, and an object of the present invention is to provide a film forming apparatus and a film forming method capable of evaporating while supplying a predetermined amount of film forming material.

In order to solve the above-described problems, the present invention is arranged in a vacuum chamber, a substrate holding unit that is arranged in the vacuum vessel and holds a substrate on a holding surface, and a position facing the holding surface of the substrate holding unit. A hollow discharge vessel provided with a plurality of holes, a material gas supply device for supplying vapor of the film forming material into the discharge vessel, and a vacuum exhaust device for evacuating the vacuum chamber. The material gas supply device includes a hollow vaporization container connected to the discharge container, a liquid material container in which a liquid material containing the film forming material is stored, and a hollow of the vaporization container A film forming apparatus having a nozzle exposed at a portion, connected to the liquid material container, and configured to eject a predetermined amount of the liquid material from the nozzle;
The present invention is a film forming apparatus, wherein the nozzle ejects the liquid material in a pulse shape.
The present invention is a film forming apparatus, wherein a vaporizing member disposed in a hollow portion of the vaporizing container and spaced from the nozzle, and a vaporizing member heating apparatus that heats the vaporizing member to an evaporation temperature of the film forming material or more. A film forming apparatus.
The present invention is a film forming apparatus, comprising: a vaporization container heating apparatus that heats the vaporization container to a temperature equal to or higher than an evaporation temperature of the film forming material and equal to or higher than an evaporation temperature of a solvent of the liquid material. .
The present invention is a film forming apparatus having an exhaust trap connected to the vaporization container and having a temperature not higher than the condensation temperature of the film forming material and not lower than the condensation temperature of the solvent.
The present invention is a film forming method in which the inside of a vacuum chamber is evacuated, vapor of a film forming material is discharged from a hole of a discharge container disposed in the vacuum chamber, and reaches a substrate disposed in the vacuum chamber. The vaporization container connected to the discharge container has a temperature equal to or higher than the evaporation temperature of the film formation material and contains the film formation material before releasing the vapor of the film formation material from the hole of the discharge container. A vaporization container heating step for heating to a temperature equal to or higher than the evaporation temperature of the solvent of the liquid material, and a liquid for ejecting a predetermined amount of the liquid material into the vaporization container and attaching the film forming material to a vaporization member disposed in the vaporization container A material jetting step, a solvent vapor discharging step for discharging the vapor of the solvent from the vaporization vessel, and the film forming material attached to the vaporizing member by heating the vaporizing member to a temperature equal to or higher than the evaporation temperature of the film forming material. To evaporate the film-forming material. A film forming material evaporation step of the flow into the discharge vessel, a film formation method with.
The present invention is a film forming method in which the inside of a vacuum chamber is evacuated, vapor of a film forming material is discharged from a hole of a discharge container disposed in the vacuum chamber, and reaches a substrate disposed in the vacuum chamber. A liquid material containing a solvent and a solute as the film forming material is ejected in a pulsed manner into a vaporized container in a reduced pressure state connected to the discharge container, and the film forming material and the vapor of the solvent are generated. A film forming method in which the vapor is introduced from the vaporization container into the discharge container, the vapor is discharged from the discharge container, and a film is formed on a substrate disposed opposite to the discharge container.

According to the present invention, since the liquid is evaporated while being supplied, the supply amount can be easily controlled, and the supplied material can be supplied while being accurately controlled.
Since the evaporation material is supplied little by little and evaporated, the deterioration of the material can be suppressed.

In one form of the invention, the liquid material solvent does not adhere to the substrate, so the thin film on the substrate does not degrade. In addition, since the film forming material that has not been used for film formation can be collected, the cost of the film forming material can be saved.
In another embodiment of the present invention, since the solvent vapor can be used as the carrier gas, the film can be uniformly formed.

Internal configuration diagram of film forming apparatus of the present invention (A), (b): Inside enlarged view of nozzle

FIG. 1 shows an internal configuration diagram of a film forming apparatus 10 of the present invention.
The film forming apparatus 10 includes a vacuum chamber 11, a substrate holding unit 14, a discharge container 16, a material gas supply device 20, and a vacuum exhaust device 12.
The vacuum evacuation device 12 is connected to the vacuum chamber 11 and is configured so that the inside of the vacuum chamber 11 can be evacuated.
The substrate holding part 14 has a holding surface for holding the substrate and is disposed in the vacuum chamber 11. Reference numeral 15 denotes a substrate held on the holding surface.

The discharge container 16 is a hollow casing and is disposed at a position facing the holding surface of the substrate holding unit 14 in the vacuum chamber 11.
A plurality of holes 17 are provided in the surface facing the holding surface of the discharge container 16, and the internal space of the discharge container 16 communicates with the internal space of the vacuum chamber 11 through the holes 17.
The material gas supply device 20 includes a vaporization container 21, a liquid material container 25, and a fixed amount discharge device 26.

The vaporization container 21 is a hollow casing and is disposed in the vacuum chamber 11.
A restriction valve 36 is disposed between the vaporization container 21 and the discharge container 16, and the internal space of the vaporization container 21 is configured to be able to communicate with the internal space of the discharge container 16 through the restriction valve 36.

The liquid material container 25 is a hollow housing and is arranged outside the vacuum chamber 11 so that a liquid material containing a film forming material is stored in the internal space.
Here, the liquid material container 25 is formed in such a size that a liquid material containing a film forming material in an amount capable of forming a plurality of substrates can be stored.

The fixed amount discharge device 26 has a nozzle 24 and is connected to the liquid material container 25 via an open / close valve. The tip of the nozzle 24 is exposed to the internal space of the vaporization container 21.
2A and 2B are enlarged views of the inside of the nozzle 24. FIG.

Here, inside the nozzle 24, a sealing member 24b that performs a piston motion that repeats the sealing opening of the nozzle 24 at a constant period is disposed.
Referring to FIG. 2A, when the sealing member 24 b is in the right movement process, the nozzle opening 24 a at the tip of the nozzle 24 is opened, and the liquid material supplied from the liquid material container 25 is separated from the inner wall surface of the nozzle 24. It is ejected from the nozzle opening 24a through the groove 24c between the sealing member 24b. On the other hand, as shown in FIG. 2B, when the sealing member 24b is in the left moving process, the nozzle opening 24a is sealed, and the ejection of the liquid material is stopped.

  The sealing member 24b repeats the piston movement at a constant cycle, the nozzle opening 24a is opened for a fixed time, and a fixed amount of liquid material is ejected into the vaporization vessel 21 in a pulsed manner. By adjusting the period of the piston movement, the amount of liquid material to be ejected can be adjusted.

As the fixed amount discharge device 26, for example, the one described in Japanese Patent No. 3501412 can be used. As described above, the nozzle 24 is described as an example of a “pulse injector” that opens and closes at regular intervals. The opening / closing cycle of the pulse injector is, for example, 2 μsec to 10 μsec. The “pulse injector” is suitable for controlling the amount of liquid introduced into the vacuum. However, the nozzle 24 is not limited to this, and any other system can be used as long as it can introduce a controlled amount of liquid into the vacuum. A method may be used.
The material gas supply device 20 includes a vaporizing member 22, a vaporizing member heating device, and a vaporizing container heating device 33.

The vaporizing member 22 is disposed at a position where the film forming material in the liquid material ejected from the tip of the nozzle 24 in the internal space of the vaporization container 21 is attached, separated from the tip of the nozzle 24.
The vaporizing member heating device includes a main electric heater (not shown) and a main DC power source 31 here. The main electric heater is embedded in the vaporizing member 22, and the main DC power supply 31 is electrically connected to the main electric heater. When the first DC voltage is applied from the main DC power source 31 to the main electric heater, the main electric heater generates heat, and the vaporizing member 22 has a temperature not higher than the evaporation temperature of the film forming material and not lower than the evaporation temperature of the solvent. When the second DC voltage is applied to the main electric heater, the vaporizing member 22 is heated to a temperature higher than the evaporation temperature of the film forming material.

  Here, the vaporization container heating device 33 includes a linear sub-electric heater 33a and a sub-DC power source 33b. The sub electric heater 33a is wound around the outer peripheral side surface of the vaporization vessel 21, and the sub DC power source 33b is electrically connected to the sub electric heater 33a.

  When a DC voltage is applied from the auxiliary DC power source 33b to the auxiliary electric heater 33a, the auxiliary electric heater 33a generates heat, and the wall surface of the vaporization vessel 21 is heated to a temperature higher than the evaporation temperature of the film forming material and higher than the evaporation temperature of the solvent. It is configured to be.

The material gas supply device 20 has an exhaust trap 27.
The exhaust trap 27 is formed in a cylindrical shape here, and one end thereof is connected to the restriction valve 36, and the internal space of the exhaust trap 27 is configured to be able to communicate with the internal space of the vaporization container 21 through the restriction valve 36. . The other end of the exhaust trap 27 is exposed in the vacuum chamber 11. Alternatively, the exhaust trap 27 may be separately exhausted.

  A refrigerant pipe 34a is wound around the outer peripheral side surface of the exhaust trap 27, and a refrigerant circulation device 34b is connected to the refrigerant pipe 34a. When a temperature-controlled cooling medium such as liquid nitrogen is circulated from the refrigerant circulation device 34b into the refrigerant pipe 34a, the exhaust trap 27 is below the condensation temperature of the film forming material and above the condensation temperature of the solvent of the liquid material. Cooled to temperature.

The cooling medium circulated in the refrigerant pipe 34a is not limited to liquid nitrogen as long as the exhaust trap 27 can be cooled to a temperature not higher than the condensation temperature of the film forming material and higher than the condensation temperature of the solvent of the liquid material. A fluid may be used.
The restriction valve 36 is a three-way valve, and the connection destination of the vaporization container 21 is switched to the discharge container 16 or the exhaust trap 27.

A film forming method using the film forming apparatus 10 will be described.
(Preparation process)
The inside of the vacuum chamber 11 is evacuated by the evacuation device 12. When the inside of the vacuum chamber 11 is evacuated, the internal space of the discharge container 16 is also evacuated through the hole 17.

  When the discharge container 16 and the vaporization container 21 are communicated with each other by the regulating valve 36, the internal space of the vaporization container 21 is also evacuated through the discharge container 16. That is, the internal space of the vaporization vessel 21 is brought to a reduced pressure state that is reduced from the atmospheric pressure.

Thereafter, evacuation by the evacuation device 12 is continued, and the vacuum atmosphere in the vacuum chamber 11 is maintained.
While maintaining the vacuum atmosphere in the vacuum chamber 11, the substrate 15 is carried into the vacuum chamber 11 and held on the holding surface of the substrate holding unit 14.

A liquid material containing a film forming material is stored in the liquid material container 25. Here, a liquid material containing a film forming material in an amount capable of forming a plurality of substrates is stored.
As the solvent of the liquid material, a solvent that does not deteriorate the film forming material and has an evaporation temperature lower than the evaporation temperature of the film forming material is used.
The liquid material may be one in which a film forming material (solute) is dissolved in a solvent, or one in which a film forming material (solute) is dispersed or suspended in a solvent.

  When forming an organic thin film, both the host material and the dopant material may be dispersed in a solvent. When the film-forming material is an organic material, it is preferable to use a liquid that does not contain moisture in an organic solvent such as toluene.

As the vaporization container heating step, the wall surface of the vaporization container 21 is heated to a temperature equal to or higher than the evaporation temperature of the film forming material and equal to or higher than the evaporation temperature of the solvent by the vaporization container heating device 33.
Further, the vaporizing member 22 is heated to a temperature not higher than the evaporation temperature of the film forming material and not lower than the evaporation temperature of the solvent by the vaporizing member heating device.

The restriction valve 36 has a main heat generator (not shown). The main heat generator is caused to generate heat, and the flow path of the regulating valve 36 is heated above the condensation temperature of the film forming material.
A cooling medium is circulated through the refrigerant pipe 34a to cool the exhaust trap 27 to a temperature not higher than the condensation temperature of the film forming material and not lower than the condensation temperature of the solvent.

The regulation valve 36 closes the communication between the discharge container 16 and the vaporization container 21 and allows the vaporization container 21 and the exhaust trap 27 to communicate with each other.
Of the film-forming material concentration in the liquid material, the amount of the liquid material ejected from the nozzle 24 of the quantitative discharge device 26 at a time, and the film-forming material in the liquid material ejected from the nozzle 24, the vaporizing member 22 The ratio of the film forming material adhering to the film is obtained in advance.

(Liquid material ejection process)
As a liquid material ejection step, a predetermined amount of liquid material is jetted into the vaporization vessel 21 from the nozzle 24 of the fixed amount discharge device 26. The liquid material is released into the reduced pressure, and the solvent is evaporated (vaporized) because the vaporization vessel 21 is heated. The vaporization vessel 21 is heated so that the temperature is lowered by the heat of vaporization due to evaporation of the solvent and the solvent does not precipitate or solidify. At this time, the film forming material (solute) does not evaporate and flies toward the vaporizing member 22.

  Of the liquid material ejected from the nozzle 24 into the vaporization container 21, a predetermined amount of the film forming material reaches the vaporization member 22 and adheres thereto. The vaporizing member 22 is set to a temperature equal to or lower than the evaporation temperature of the film forming material, and the deposited film forming material does not evaporate. Further, since the vaporizing member 22 is equal to or higher than the evaporation temperature of the solvent, the solvent is not condensed or solidified by the vaporizing member 22.

  As the solvent vapor discharging step, the solvent is discharged simultaneously with the liquid material jetting step. The solvent in the ejected liquid material evaporates in the vaporization container 21 before reaching the vaporization member 22, and the vapor of the solvent flows to the regulation valve 36.

  A part of the vaporized solvent reaches the vaporization member 22, but the vaporization member 22 is heated to a temperature equal to or higher than the evaporation temperature of the solvent, and the reached solvent does not condense or solidify and flows to the regulation valve 36.

  A part of the film forming material and a part of the solvent reach the inner wall surface of the vaporization vessel 21, but the wall surface is heated to a temperature equal to or higher than the evaporation temperature of the film forming material and equal to or higher than the evaporation temperature of the solvent. Both of the reached film forming material and the solvent are evaporated without remaining on the inner wall surface of the vaporization vessel 21 and flow to the regulating valve 36.

  The flow path of the regulating valve 36 is heated to a temperature equal to or higher than the condensation temperature of the film forming material, and neither the vapor of the film forming material nor the vapor of the solvent flows to the exhaust trap 27 without being condensed inside the regulating valve 36.

The exhaust trap 27 is cooled to a temperature below the condensation temperature of the film forming material and above the condensation temperature of the solvent, and the vapor of the film forming material that has flowed in is condensed and stored in the exhaust trap 27 for reuse. To be recovered for.
On the other hand, the vapor of the solvent that has flowed in passes through the exhaust trap 27 without being condensed, is discharged into the vacuum chamber 11, and is evacuated by the vacuum exhaust device 12.

  A monitor (not shown) for analyzing the pressure, the flow rate of steam, or the component may be arranged between the regulation valve 36 and the vaporization vessel 21. When the vapor flow is no longer detected by the monitor, it may be determined that the solvent vapor is evacuated from the vaporization vessel 21. When a certain time has elapsed since the ejection of the liquid material, it may be determined that the solvent vapor has been evacuated from the vaporization vessel 21.

After the vapor of the solvent is evacuated from the inside of the vaporization container 21, the communication between the vaporization container 21 and the exhaust valve 27 is closed by the regulating valve 36, and the vaporization container 21 and the discharge container 16 are communicated.
In this way, the solvent vapor is supplied to the discharge container 16 and the solvent is prevented from adhering to the substrate 15.

(Film forming material evaporation process)
As the film forming material evaporation step, when the vaporizing member 22 is heated to a temperature equal to or higher than the evaporation temperature of the film forming material by the vaporizing member heating device, the film forming material attached to the vaporizing member 22 is evaporated. The vapor of the film forming material flows into the discharge container 16 through the regulation valve 36.

The wall surface of the vaporization container 21 is heated to a temperature equal to or higher than the evaporation temperature of the film forming material, so that the film forming material does not precipitate on the inner wall surface of the vaporization container 21.
The flow path of the regulating valve 36 is heated to a temperature equal to or higher than the condensation temperature of the film forming material, so that the vapor of the film forming material is not condensed inside the regulating valve 36.
Accordingly, a predetermined amount of vapor of the film forming material adhering to the vaporizing member 22 is all supplied to the discharge container 16.

The discharge container 16 has a sub-heater (not shown). The sub-heater is caused to generate heat, and the wall surface of the discharge container 16 is heated above the condensation temperature of the film forming material.
The vapor of the film forming material that has flowed into the discharge container 16 is discharged from the hole 17 into the vacuum chamber 11, reaches the substrate 15 held on the holding surface of the substrate holding unit 14, and is deposited.

Of the film forming material in the liquid material, only a predetermined amount of the film forming material adhering to the vaporizing member 22 is evaporated. Therefore, even if the amount is so precise that it is difficult to measure with the powder, a predetermined amount of the film forming material is formed. A film material can be deposited on the substrate 15.
It is preferable that the concentration of the film forming material in the liquid material is smaller because the amount of the film forming material attached to the vaporizing member 22 can be easily adjusted.

  Here, the vapor is measured by a monitor (not shown) disposed between the regulating valve 36 and the vaporization vessel 21, and when the measured vapor amount of the film formation material becomes zero, the film formation of the substrate 15 is performed. May be determined as the end point of

  The method for determining the end point of film formation on the substrate 15 is not limited to the above method, and the substrate 15 is arranged when a film thickness monitor is disposed in the vacuum chamber 11 and the measurement result of the film pressure monitor reaches a predetermined film pressure. The film formation rate may be determined by the film thickness monitor, and the time when a predetermined time has elapsed from the start of film formation may be determined as the film formation end time of the substrate 15. Good.

After the film formation of the substrate 15 is completed, the communication between the vaporization container 21 and the discharge container 16 is closed by the restriction valve 36, and the vaporization container 21 and the exhaust trap 27 are communicated.
When the heating of the vaporizing member 22 by the vaporizing member heating device is stopped, and the heating of the vaporizing vessel 21 by the vaporizing vessel heating device 33 is stopped, both the temperature of the vaporizing member 22 and the temperature of the vaporizing vessel 21 are evaporated due to heat radiation. Decrease below temperature.

  While maintaining the vacuum atmosphere in the vacuum chamber 11, the substrate 15 formed into a film is carried out to the outside of the vacuum chamber 11, and then another undeposited substrate 15 is carried into the vacuum chamber 11 to repeat the film formation in the same manner.

While exchanging the substrate, the liquid material ejection step and the solvent vapor discharge step are performed.After the substrate exchange is completed, the film formation material evaporation step can be performed, and the tact time can be shortened, and Since the deposition material is deposited at a necessary time, waste of the deposition material can be suppressed.
Since the liquid material container 25 stores an amount of film forming material capable of forming a plurality of substrates, it is possible to continuously form a plurality of substrates without replenishing the film forming materials.

(Another embodiment)
In the above embodiment, an example of removing the solvent is shown. However, if the solvent vapor does not affect the composition of the film on which the film is formed, the solvent vapor is vaporized simultaneously with the film forming material vapor. It may be introduced into the container 21. In this case, the solvent vapor can also function as a carrier gas.

  For example, the vaporizing member 22 is not provided, and the vaporizing vessel 21 is heated to a temperature at which the solvent and the film forming material (solute) are evaporated when the liquid material is ejected into the vaporizing vessel 21. Furthermore, the vaporization container 21 and the discharge container 16 are communicated. If the liquid material is ejected into the vaporization container 21 in this state, vapor obtained by evaporating the solvent and the film forming material (solute) can be introduced into the discharge container 16 and discharged onto the substrate 15 to form a film. It is preferable that the solvent has an evaporation temperature lower than that of the film forming material (solute), does not precipitate or solidify on the substrate 15, and is exhausted as vapor.

  Alternatively, the vaporization member 22 may be installed and the vaporization member 22 may be heated to a temperature at which the film formation material (solute) evaporates to evaporate the film formation material (solute). In this case, the liquid material ejection step and the film forming material evaporation step are performed simultaneously, and the solvent vapor discharge step is not performed.

  If it is a system which ejects a liquid, it will become possible to make flow control precise. Further, it is preferable that a predetermined amount can be ejected into the vacuum accurately by ejecting in a pulse shape, and the amount of ejection can be controlled by the number or length of pulses.

DESCRIPTION OF SYMBOLS 10 ... Film-forming apparatus 11 ... Vacuum chamber 12 ... Vacuum exhaust apparatus 14 ... Substrate holding part 15 ... Substrate 16 ... Release container 17 ... Hole 20 ... Material gas supply apparatus 21 ... Vaporization container 22 ... ... Vaporizing member 24 ... Nozzle 25 ... Liquid material container 26 ... Quantitative discharge device 27 ... Exhaust trap 33 ... Vaporization container heating device

Claims (7)

A vacuum chamber;
A substrate holding part disposed in the vacuum chamber and holding a substrate on a holding surface;
A hollow discharge container disposed at a position facing the holding surface of the substrate holding unit and provided with a plurality of holes;
A material gas supply device for supplying vapor of a film forming material into the discharge container;
An evacuation device for evacuating the vacuum chamber;
A film forming apparatus comprising:
The material gas supply device includes:
A hollow vaporization container connected to the discharge container;
A liquid material container in which a liquid material containing the film forming material is stored;
A metering discharge device having a nozzle exposed in a hollow portion of the vaporization container, connected to the liquid material container, and configured to eject a predetermined amount of the liquid material from the nozzle;
A film forming apparatus.   The film forming apparatus according to claim 1, wherein the nozzle ejects the liquid material in a pulse shape. A vaporization member disposed in a hollow portion of the vaporization container and spaced from the nozzle;
A vaporizing member heating device for heating the vaporizing member to a temperature equal to or higher than an evaporation temperature of the film forming material;
The film-forming apparatus of any one of Claim 1 or Claim 2 which has these. A vaporization container heating device for heating the vaporization container to a temperature equal to or higher than an evaporation temperature of the film forming material and to a temperature equal to or higher than an evaporation temperature of the solvent of the liquid material;
The film-forming apparatus of any one of Claim 1 thru | or 3 which has these. An exhaust trap that is connected to the vaporization vessel and is equal to or lower than the condensation temperature of the film forming material and equal to or higher than the condensation temperature of the solvent;
The film-forming apparatus of any one of Claim 1 thru | or 4 which has these. A film forming method for evacuating the inside of the vacuum chamber, releasing vapor of a film forming material from a hole of a discharge container disposed in the vacuum chamber, and reaching a substrate disposed in the vacuum chamber,
Before releasing the vapor of the film forming material from the hole of the discharge container,
A vaporization container heating step of heating the vaporization container connected to the discharge container to a temperature equal to or higher than an evaporation temperature of the film-forming material and to a temperature equal to or higher than an evaporation temperature of a solvent of the liquid material containing the film-forming material;
A liquid material ejecting step of ejecting a predetermined amount of the liquid material into the vaporization container and attaching the film forming material to a vaporization member disposed in the vaporization container;
A solvent vapor discharge step of discharging the vapor of the solvent from the vaporization vessel;
A film forming material evaporation step of heating the vaporizing member to a temperature equal to or higher than an evaporation temperature of the film forming material, evaporating the film forming material attached to the vaporizing member, and allowing the vapor of the film forming material to flow into the discharge container; ,
A film forming method comprising: A film forming method for evacuating the inside of the vacuum chamber, releasing vapor of a film forming material from a hole of a discharge container disposed in the vacuum chamber, and reaching a substrate disposed in the vacuum chamber,
In a reduced-pressure vaporization container connected to the discharge container, a liquid material containing a solvent and a solute that is the film-forming material is ejected in a pulse shape, and the film-forming material and the solvent vapor are generated.
Introducing the vapor from the vaporization vessel into the discharge vessel;
A film forming method for discharging the vapor from the discharge container and forming a film on a substrate disposed opposite to the discharge container.

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