JP2012074565A - Ultrasonic junction tool, ultrasonic junction device and junction material pattern formation method - Google Patents

Abstract

An object of the present invention is to provide an ultrasonic bonding tool capable of forming a solder pattern into a desired shape or size.
In an ultrasonic bonding tool 150, protrusions 157 are formed at both ends of a tip portion 159, respectively. When the supply solder is supplied to the notch 156, the molten solder comes into contact with the protrusion side wall surface 157b and the junction thickness adjusting surface 157c. For this reason, the solder melted at the tip 159 is guarded against flow in the plate width direction Fw by both protrusions 157, and droplets are prevented from scattering in the plate width direction Fw due to ultrasonic vibration. The Therefore, the solder pattern formed by the tool does not cause an unnecessary solder pattern to be formed outside the protruding body 157, and thus is free from generating a leakage current.
[Selection] Figure 1

Description

  The present invention relates to an ultrasonic bonding apparatus for bonding a bonding material to a bonding processed surface of an object to be bonded. The present invention also relates to an ultrasonic bonding tool used in the ultrasonic bonding apparatus. The present invention also relates to a bonding material pattern forming method performed using such an ultrasonic bonding apparatus.

  Ceramic materials are widely used as circuit boards for electronic devices because they are suitable for both electrical insulation and heat transfer. However, while a substrate using a ceramic material (hereinafter referred to as a ceramic substrate) has such suitable physical properties, it is very difficult to attach solder to the surface.

  For this reason, an ultrasonic bonding apparatus may be used when attaching solder to the surface of a ceramic material. Hereinafter, an ultrasonic bonding apparatus introduced in Japanese Patent Laid-Open No. 2008-296265 (Patent Document 1) will be described with reference to FIG.

  As illustrated, the ultrasonic bonding apparatus 100 includes a table 110, a heating panel 120, an actuator 130, an ultrasonic wave generation unit 140, and a solder supply unit 160. Further, the ceramic material 10 is fixed to the upper surface of the heating panel 120. At this time, the bonding processed surface 11 of the ceramic material 10 is disposed in a state of facing the tip of the ultrasonic wave generation unit 140.

  The actuator 130 includes a slider 131 and a carrier 132. The carrier 132 is supplied with electric power via the cable 133 and supplies a part of the electric power to the ultrasonic generator 140. In addition, the ultrasonic wave generation unit 140 and the solder supply unit 160 are fixed to the structure part of the carrier 132, and the structure part incorporates a driving unit such as a motor (not shown). The carrier 132 moves its position while holding the ultrasonic generator 140 and the solder supply unit 160 according to the operation of the built-in motor. The actuator 130 is assumed to be a mechanism that can move in any of the illustrated X-axis direction, Z-axis direction, and Y-axis direction (axial directions orthogonal to the X-axis and Z-axis). The actuator 130 also has a mechanism for controlling the rotation of the tip of the ultrasonic generator 140 about the Z axis. Hereinafter, with respect to the Z axis, the direction in which the actuator 130 is disposed when observed from the ultrasonic generator is referred to as the actuator side Fu, and the direction in which the table 110, the ceramic substrate 10 and the like are disposed is observed from the ultrasonic generator. Sometimes referred to as side Fd.

  The ultrasonic generator 140 has a built-in device that generates ultrasonic waves (16 to 18 kHz or more) with supplied power, and a horn 141 is provided at the tip of the ultrasonic generator 140. An ultrasonic bonding tool 150 is fixed to the front end side Fd of the horn 141. The ultrasonic bonding tool 150 may be fixed to the horn 141 with a lock nut or the like, or may be formed integrally with the horn 150. In the ultrasonic generator 140, when ultrasonic vibration is generated inside, the vibration is transmitted to the ultrasonic bonding tool 150 through the horn 141.

  The solder supply unit 160 includes a solder drum 161 around which a linear or flat supply solder 162 is wound, and a preheating unit 163 that heats the solder to a temperature near the melting point of the supply solder. The preheating unit 163 has a guide hole for guiding the supplied solder, and when the supplied solder passes through the guide hole, the preheater 163 applies a heat amount to the supplied solder to perform preheating. Further, as shown in the figure, the solder supply unit 160 has the tip of the solder supply unit arranged and fixed near the tip of the ultrasonic bonding tool 150.

  In the ultrasonic bonding apparatus 100, after setting the ceramic substrate 10 on the heating board 120, the distance (clearance) between the tip of the ultrasonic bonding tool 150 and the ceramic substrate 10 is adjusted by the carrier 132. Thereafter, ultrasonic vibration is sent from the ultrasonic generator 140 to the ultrasonic bonding tool 150, and the supply solder 162 is supplied from the preheating unit 163 to the tip of the ultrasonic bonding tool. In this state, when the carrier 132 moves in the XY plane, the solder pattern is formed on the bonding surface 11 of the ceramic substrate 10 with the moving direction of the ultrasonic bonding tool as a pattern forming direction. Is formed.

  At this time, the solder melted by the energy of ultrasonic vibration or the thermal energy supplied from the preheating unit 163 is supplied to the tip of the ultrasonic bonding tool. Also, at the bonding interface between the melted solder and the ceramic substrate, impurities such as an air layer are removed from the bonding interface by ultrasonic vibration or cavitation generated at the tip of the tool. You will be prompted. For this reason, the solder that has passed through the ultrasonic bonding tool 150, that is, the solder pattern after solid-phase formation, has a strong adhesion to the surface of the ceramic material.

  For example, an ultrasonic bonding tool shown in FIG. 5A is introduced in Japanese Patent Laid-Open No. 9-001065 (Patent Document 2). The ultrasonic welding tool 250 has a plate-like tip at the tip, and the tip surface 151 is substantially flat.

  When the ultrasonic bonding tool 250 is attached to the ultrasonic bonding apparatus 100 and a solder pattern is formed, as shown in FIG. 5B, the solder pattern 170 on the ceramic substrate is formed by pattern formation in which the ultrasonic bonding tool moves. They are successively formed in the direction Fs. As shown in the figure, the solder pattern 170 is formed to have a substantially uniform thickness by the front end surface 151 or the edge Eg1 of the ultrasonic bonding tool, and the width of the solder pattern is also adjusted according to the plate width t1 of the ultrasonic bonding tool. .

JP 2008-296265 A JP-A-9-001065 Japanese Utility Model Publication No. 6-052145 JP 2007-11010 A

  In the solder pattern forming method described above, molten solder is formed between the tip surface 151 of the ultrasonic bonding tool and the bonding processed surface 11 of the ceramic substrate, and the solder pattern is slid onto the bonding processed surface 11 by sliding the ultrasonic bonding tool. Is molded. At this time, the molten solder near the tip of the ultrasonic welding tool is melted in the thickness direction Ft or the width direction Fw of the tool depending on the feed speed of the carrier 132, the frequency state of ultrasonic vibration, and the temperature state of the supplied solder. The shape of the liquid mass will change.

  For this reason, according to the technique of patent document 1, the problem that the width dimension of a solder pattern will become non-uniform | heterogenous arises because the liquid lump shape of the molten solder in a tool front-end | tip part changes. This problem is not only a defect in the appearance of the wiring board, but also causes an increase in wiring resistance when the width dimension of the solder pattern is reduced (assuming that the plate thickness dimension is constant), and the wiring pattern has a high mounting density. In such a case, it causes a leakage current.

  In addition, the actuator used in the ultrasonic welding apparatus described above shifts to a solder pattern forming operation after a predetermined clearance is set. For this reason, when the ceramic substrate is tilted and fixed, or depending on the surface shape (swells or the like) of the ceramic substrate, the clearance at the tool tip cannot be kept constant. In such a case, there arises a problem that the clearance is deviated from the optimum value, the solder bonding state is deteriorated, and the quality of the circuit board is deteriorated. In addition, depending on the state of the clearance, the influence of cavitation generated at the tip of the tool may be greatly affected, and fine droplets of molten solder may be scattered in the plate width direction Fw of the ultrasonic bonding tool. It may also cause a leak current between the pattern. In order to avoid such a problem, it may be possible to control the clearance at any time by providing a sensor for detecting the vertical direction (Z-axis direction) in the actuator. In this case, however, the apparatus configuration and the control process are complicated. Cause the problem of inviting. Furthermore, in a portable solder joint machine that manually molds a solder pattern, the overall operation is left to the operator's sense, and therefore the accuracy of the clearance at the tool tip can hardly be expected.

  Japanese Utility Model Laid-Open No. 6-052145 (Patent Document 3) introduces an ultrasonic welding tool 350 having a semicircular opening 152 formed at the tip, as shown in FIG. However, when the tool 350 is attached to the ultrasonic bonding apparatus 100 to form a solder pattern, a flat surface is hardly formed on the upper surface of the solder pattern, which causes a problem when an electrical element is mounted. In addition, the tool according to Patent Document 3 is an instrument for spot-welding metals to each other, and is different from the above-described ultrasonic bonding tool for forming a solder pattern.

  Japanese Patent Application Laid-Open No. 2007-11010 (Patent Document 4) introduces an ultrasonic bonding tool 450 in which a cross groove is formed as shown in FIG. 6B. The ultrasonic welding tool 450 is intended for spot welding, and by adopting such a shape, the lateral displacement of the metal that is processed in direct contact with the tool is prevented. However, when the tool 450 is attached to the ultrasonic bonding apparatus 100 to form a solder pattern, the molten solder leaks in a direction different from the pattern forming direction of the solder (a direction orthogonal to the pattern forming direction), and the leaked molten solder This causes a problem that an unnecessary solder region is formed on the ceramic substrate. In addition, there is a concern that this may cause leakage current and the like.

  In view of the above problems, an object of the present invention is to provide an ultrasonic bonding tool, an ultrasonic bonding apparatus, and a bonding material pattern forming method capable of forming a bonding material pattern made of solder or the like into a desired shape or size.

  In order to solve the above problems, the first invention adopts the following ultrasonic bonding tool configuration. That is, in the ultrasonic welding tool for applying ultrasonic vibration from the tip portion to the supply bonding material and bonding the supply bonding material to the bonding processed surface of the joined object, the tip portion has a substantially flat surface formed on the tip portion. A joining thickness adjusting surface to be formed and at least one projecting body formed on the joining thickness adjusting surface are provided.

  In the second invention, the following ultrasonic bonding tool is configured. That is, in the ultrasonic welding tool for applying ultrasonic vibration from the tip portion to the supply bonding material and bonding the supply bonding material to the bonding processed surface of the joined object, the tip portion has a substantially flat surface formed on the tip portion. It has a joining thickness adjusting surface to be formed and two projecting bodies formed on the joining thickness adjusting surface, and the two projecting bodies are arranged at a predetermined interval.

  In the second aspect of the present invention, preferably, the two projecting bodies are respectively disposed at end portions of the tip end portion in the plate width direction.

  In the third invention, the following ultrasonic bonding apparatus is configured. That is, the ultrasonic bonding tool according to any one of the above-described inventions, and a horn to which the ultrasonic bonding tool is fixed, the ultrasonic bonding tool supplies a supply bonding material to the tip portion. However, relative movement in the pattern forming direction is performed with respect to the bonded surface.

  Preferably, with respect to the ultrasonic bonding apparatus, the ultrasonic welding tool moves relatively in the pattern forming direction with respect to the bonding processing surface in a state where the protruding body is in contact with the bonding processing surface. .

  In the ultrasonic bonding apparatus, preferably, the supply bonding material is an electrically conductive material mainly composed of tin element (Sn).

  In the fourth invention, the following bonding material pattern forming method is used. That is, a bonding material pattern forming method using an apparatus including the ultrasonic bonding tool according to any one of claims 1 to 3 and a horn to which the ultrasonic bonding tool is fixed, The ultrasonic bonding tool moves relative to the bonding surface in the pattern forming direction while supplying the supply bonding material to the tip portion.

  Preferably, for the bonding material pattern forming method, the ultrasonic welding tool is relatively moved in the pattern forming direction with respect to the bonding processing surface in a state where the protruding body is in contact with the bonding processing surface. To do.

  With respect to the bonding material pattern forming method, the supply bonding material is preferably an electrically conductive material containing tin element (Sn) as a main component.

  According to the ultrasonic bonding tool according to the present invention, the solder melted at the tip is guarded against the flow in the plate width direction Fw by the protrusions, and the liquid in the plate width direction Fw caused by the ultrasonic vibrations. Drop splash is suppressed. Accordingly, the solder pattern formed by the tool does not cause an unnecessary solder pattern to be formed outside the protruding body, and thus is free from generating a leakage current. In particular, in the second invention in which the protrusions are provided at a predetermined distance, such an effect is produced on both side surfaces of the solder pattern.

  In addition, since the clearance at the tool tip is maintained at an appropriate value by the protrusion, the bonding state of the solder to the ceramic substrate becomes good, leading to the improvement of the quality as a circuit board. Further, by optimizing the clearance, the way in which ultrasonic vibration is transmitted in the molten solder, the state of cavitation in the molten solder, and the like are controlled, and the scattering of the solder in the plate width direction Fw is suppressed. Also, the protrusions guard against solder scattering in the plate width direction Fw.

  According to the ultrasonic bonding apparatus using the ultrasonic bonding tool according to the first invention, the clearance of the tool tip is easily set by the protrusion. At this time, at the tip of the tool, the thickness of the bonding material pattern is adjusted by the bonding thickness adjusting surface, and at least one side surface portion of the bonding material pattern is formed into a shape with little molding error by the protruding body side wall surface. For this reason, the circuit board manufactured by the method using the tool can easily mount an electrical element on the bonding material pattern, and at the same time, the side surface portion formed by the protruding body side wall surface, Of course, the appearance can be improved, and it is possible to increase the wiring density by bringing adjacent bonding patterns closer to each other.

  Further, according to the ultrasonic bonding apparatus using the ultrasonic bonding tool according to the second invention, the clearance at the tip of the tool is easily set by the two protrusions. At this time, at the tip of the tool, the thickness of the bonding material pattern is adjusted by the bonding thickness adjusting surface, and the error in the width dimension of the bonding material pattern is slight due to the two protrusion side wall surfaces. For this reason, the circuit board manufactured by the method using the tool can easily mount the electrical element on the bonding material pattern, and of course, the appearance can be improved. Adjacent bonding patterns can be brought closer to improve the wiring density, and the wiring resistance of the bonding material pattern can be kept within the design range.

The figure which shows the front-end | tip shape of the ultrasonic joining tool which concerns on embodiment. The figure which shows the relationship between the inclination of an ultrasonic joining tool, and a pattern formation direction. The figure which shows the example of a change of the ultrasonic joining tool which concerns on embodiment. The figure which shows the structure of a general ultrasonic bonding apparatus. The figure which shows the front-end | tip shape of the ultrasonic joining tool which concerns on a prior art example. The figure which shows the front-end | tip shape of the ultrasonic joining tool which concerns on a prior art example.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. Even in the present embodiment, an ultrasonic bonding apparatus is used as in the conventional example, but the configuration other than the ultrasonic bonding tool is the same as the ultrasonic bonding apparatus 100 according to the related art, so the configuration, etc. The description relating to is omitted.

  FIG. 1A shows an ultrasonic bonding tool according to the present embodiment. The ultrasonic welding tool 150 is made of steel or high hardness alloy steel such as stainless steel. Moreover, in order to implement | achieve abrasion resistance and erosion resistance in the front-end | tip part 159, it is preferable to add heat processing, such as hardening. Further, when a titanium alloy is used as the ultrasonic bonding tool 150, a hardening process such as a nitriding process is preferably performed.

  As shown in the drawing, the ultrasonic welding tool 150 has a plate-like body with a tip portion 159 having a plate thickness t2 and a plate width t1, and a substantially rectangular cutout portion 156 is formed at the center of the tip of the plate-like body. Has been. As for the front-end | tip part 159, the notch part 156 is formed, and the protruding body 157 is formed in both ends, respectively. As a result, a junction thickness adjusting surface 157c having a substantially flat surface and a protruding body side wall surface 157b formed integrally with the junction thickness adjusting surface 157c are formed at the distal end portion 159.

  In the ultrasonic bonding tool 150 according to the present embodiment, when the supply solder (supply bonding material) is supplied to the notch portion 156, the solder melted at the tip portion 159 is stripped by both protrusions 157. The flow in the direction Fw is guarded, and the scattering of droplets in the plate width direction Fw due to ultrasonic vibration is suppressed. Therefore, the solder pattern formed by the tool does not cause an unnecessary solder pattern to be formed outside the protruding body 157, and thus is free from generating a leakage current. In particular, in the case of the present embodiment, such an effect occurs on both side surfaces of the solder pattern.

  FIG. 1B shows a usage example of the ultrasonic bonding apparatus when the ultrasonic bonding tool described above is used. In the ultrasonic bonding apparatus 100, first, the bonding processed surface 11 of the ceramic substrate 10 (the bonded object in the claims) is fixed to the heating panel 120 so as to face the actuator side Fu. The ultrasonic bonding tool 150 is fixed to the tip of the horn 141 so that the bonding thickness adjusting surface 157c at the tip thereof faces in parallel to the bonding processed surface 11. The ultrasonic welding tool 150 according to the present embodiment is fixed so that the plate thickness direction Ft of the tool coincides with the pattern forming direction Fs.

  Thereafter, the actuator 130 moves the ultrasonic generator 140 in the Z-axis direction (vertical direction) to bring the protruding body of the ultrasonic bonding tool 100 into contact with the bonding processed surface of the ceramic substrate. At this time, a suitable clearance d1 is formed between the bonding thickness adjusting surface 157c at the tip of the tool and the ceramic substrate. Note that the protrusion of the ultrasonic bonding tool may not be brought into contact with the bonding surface 11 of the ceramic substrate as long as the clearance is managed by a sensor or the like. In this case, the tip of the projecting body is disposed at a position separated from the bonding processed surface of the ceramic substrate by several μm.

  When the initial setting in the Z-axis direction is completed, after the temperature control of the heating panel 120 and the preliminary superheating unit 163 is set to an appropriate state, the ultrasonic bonding apparatus 100 supplies the supplied solder from the solder supply unit 160 and Ultrasonic vibration is applied to the sonic bonding tool and the supplied solder is temporarily melted at the tip of the tool.

  After that, the ultrasonic bonding apparatus 100 maintains the state in which the bonding thickness adjusting surface 156 of the tool and the bonding processed surface 11 of the ceramic substrate are substantially parallel, and the clearance d1 is maintained constant. The sonic bonding tool 150 is slid in the pattern forming direction Fs. Then, the molten solder after passing through the ultrasonic bonding tool 150 is gradually cooled to form a solder pattern. In the ultrasonic welding apparatus 100 according to the present embodiment, a slight pressing force is applied from the tool tip to the joining processing surface, and the Z-axis direction of the tool tip is slightly changed according to the undulation of the joining processing surface. .

  As shown in the drawing, the solder pattern 170 formed by the apparatus 100 has a substantially flat plane for the bonding thickness adjustment surface of the tool, so that the surface S1 of the pattern has a substantially flat shape. In addition, since the clearance d1 is maintained at an appropriate value by the protrusions 157, the bonding state of the solder to the ceramic substrate becomes good. In addition, due to the suitable clearance, scattering of the molten solder is suppressed, and at the same time, the thickness of the solder pattern 170 is kept constant.

  Further, the protruding body 157 of the ultrasonic bonding tool suppresses leakage of molten solder in the plate width direction Fw due to the molten solder being guided into the notch 156 and sliding movement of the protruding body. Yes. In addition, when the solder pattern 170 is melted, the solder pattern 170 is affected by the movement inside the notch 156. Therefore, the shape of the side surface S2 of the pattern is a linear shape with less meandering due to the protrusion side wall surface 157a. It becomes. For this reason, the contour of the solder pattern 170 is linearly formed as compared with the case where the protruding body 157 is not provided. This makes it possible to form the pattern so that the width dimension of the solder pattern is constant by providing the protrusions 157 at both ends of the ultrasonic bonding tool as in the present embodiment.

  As described above, according to the ultrasonic bonding apparatus according to the present embodiment, the clearance d1 at the tool tip is easily set by the protrusion. At this time, at the tip of the tool, the thickness of the bonding material pattern is adjusted by the bonding thickness adjusting surface, and the width dimension of the bonding material pattern is formed with a slight error by the two protruding side wall surfaces. For this reason, the circuit board manufactured by the method using the tool can easily mount the electrical element on the solder pattern, and of course, the appearance can be improved. It is possible to improve the wiring density by bringing adjacent bonding patterns closer, and the wiring resistance of the bonding material pattern can be kept within the design range.

  Further, since the clearance d1 at the tool tip is maintained at an appropriate value by the protrusions 157, the bonding state of the solder to the ceramic substrate becomes good, which leads to the improvement of the quality as a circuit board. Further, by optimizing the clearance, the way in which ultrasonic vibration is transmitted in the molten solder, the state of cavitation in the molten solder, and the like are controlled, and the scattering of the solder in the plate width direction Fw is suppressed. Also, the protrusions guard against solder scattering in the plate width direction Fw.

  The ultrasonic bonding apparatus 100 described above can adjust the width dimension of the solder pattern 170 by appropriately setting the rotation direction of the ultrasonic bonding tool 150 with respect to the Z axis. For example, as shown in FIG. 2A, when the solder pattern 170 is formed by matching the plate thickness direction Ft and the pattern forming direction Fs of the ultrasonic bonding tool, the width dimension of the solder pattern 170 is the opening width of the tool. The size is close to t5. Further, as shown in FIG. 2B, when the thickness direction Ft is inclined with respect to the pattern forming direction Fs, the formed solder pattern 170 can be formed with a narrow width dimension T in accordance with the inclination.

  In such a pattern forming method, since the movement of the melted solder is restricted by the presence of the protruding body 157, the solder pattern is compared with a conventional tool in which the protruding body 157 is not provided. It becomes easy to adjust the width dimension T, and the finished state of the pattern is also good.

  As shown in FIG. 2A, the shape of the projecting body 157 may be such that the projecting body side wall surface 157b and the front surface S4 (and / or the back surface S5) thereof are at right angles. As shown, a curved surface R2 may be formed between the protruding body side wall surface 157b and the front surface S4 (and / or the back surface S5). The shape of the protrusions is such that the ultrasonic vibration is transmitted, the melting point temperature of the solder used, the solder supply amount, or the tool feed so that the width T of the solder pattern or the contour shape of the side surface S2 is suitably maintained. It is designed according to speed.

  The embodiment according to the present invention has been described above, but the present invention is not limited to the above embodiment, and various improvements can be made within the scope of the technical idea described in the claims. It is. For example, as shown in FIG. 3 (a), the corner portion formed by the bonding thickness adjusting surface 157c and the protruding body side wall surface 157b may form an R surface so that the angle of intersection with both surfaces is obtuse, A C surface (cut surface) may be formed (intersection angle blunting means R1). By this intersection angle blunting means R1, the solder pattern 170 is more likely to be rounded at a portion (corner portion) corresponding to the corner portion than when the corner portion is a right angle. For this reason, when a stress is applied to the completed solder pattern, the stress concentration at the corner is alleviated, and breakage of the solder pattern can be suppressed.

  Further, in the present invention, as shown in FIG. 3B, a protruding body may be formed only on one side of the tool. According to the ultrasonic bonding apparatus using such an ultrasonic bonding tool, the clearance at the tip of the tool is adjusted by the projecting body, and the same effect as described above is exhibited. Further, in this case, the bonding material pattern is formed such that one side surface portion has a small molding error. For this reason, the tool 150 as shown in FIG. 3B is particularly useful when a pattern having a relatively large area, such as a solid pattern, is formed. As a matter of course, it is possible to improve the wiring density by bringing adjacent bonding patterns closer to each other.

  In addition, in the above-described embodiment, the solder is used as an example of the supply bonding material. However, in the present invention, even if a material other than solder is used, the type thereof is not limited as long as it is a brazing material capable of conducting electrical conduction. Solder is an electrically conductive material mainly composed of tin element (Sn), but the tin element contains zinc (Zn), copper (Cu), nickel (Ni), aluminum (Al), etc. The melting point temperature and the like of which are appropriately adjusted are also included, and those that have been used in the past may be used.

  Furthermore, in the above-described ultrasonic welding apparatus, the tip of the ultrasonic bonding tool is slid by the operation of the actuator to perform relative movement with respect to the bonding surface of the ceramic substrate. The tip of the ultrasonic bonding tool and the bonding processing surface may be moved relative to each other by sliding.

  Furthermore, the ultrasonic welding apparatus described above includes a portable solder joint machine that performs manual solder joint as well as a machine tool equipped with an actuator. In a portable solder joint machine, it is possible to know sensuously whether or not the protruding body is in contact with the ceramic substrate, so that it becomes easy to maintain the clearance at the tool tip. It is possible to form a solder pattern having a suitable shape by sliding the in the solder forming direction.

10 Ceramic substrate (Substrate to be joined)
DESCRIPTION OF SYMBOLS 11 Joining surface 100 Ultrasonic joining apparatus 141 Horn 150 Ultrasonic joining tool 157 Projection body 157b Projection body side wall surface 157c Joining thickness adjustment surface 162 Solder (supply joining material)

Claims (9)

In the ultrasonic welding tool for applying ultrasonic vibration from the tip to the supply bonding material and bonding the supply bonding material to the bonding processed surface of the object to be bonded,
The ultrasonic bonding tool, wherein the tip portion includes a joining thickness adjusting surface formed on the leading end portion and forming a substantially flat surface, and at least one projecting body formed on the joining thickness adjusting surface. In the ultrasonic welding tool for applying ultrasonic vibration from the tip to the supply bonding material and bonding the supply bonding material to the bonding processed surface of the object to be bonded,
The tip portion has a junction thickness adjusting surface formed in a substantially flat surface formed at the tip portion, and two projecting bodies formed on the junction thickness adjusting surface,
The ultrasonic bonding tool, wherein the two protrusions are arranged at a predetermined interval.   The ultrasonic bonding tool according to claim 2, wherein the two projecting bodies are respectively disposed at end portions in the plate width direction of the tip portions. The ultrasonic bonding tool according to any one of claims 1 to 3, and a horn to which the ultrasonic bonding tool is fixed,
The ultrasonic bonding tool is configured to move relative to the bonding processing surface in a pattern forming direction while a supply bonding material is supplied to the tip portion.   The supersonic welding tool according to claim 4, wherein the ultrasonic welding tool moves relative to the bonding processing surface in a pattern forming direction in a state where the protruding body is in contact with the bonding processing surface. Sonic bonding device.   6. The ultrasonic bonding apparatus according to claim 4, wherein the supply bonding material is an electrically conductive material mainly composed of tin element (Sn). A bonding material pattern forming method using an apparatus including the ultrasonic bonding tool according to any one of claims 1 to 3 and a horn to which the ultrasonic bonding tool is fixed,
The ultrasonic bonding tool moves relative to the bonding processed surface in a pattern forming direction while supplying a supply bonding material to the tip portion.   8. The bonding according to claim 7, wherein the ultrasonic welding tool moves relative to the bonding surface in a pattern forming direction in a state where the protruding body is in contact with the bonding surface. Material pattern forming method.   The bonding material pattern forming method according to claim 7 or 8, wherein the supply bonding material is an electrically conductive material mainly composed of tin element (Sn).

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