JP2012074274A - Method for manufacturing light-emitting device, light-emitting device, and electronic device provided with the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for manufacturing a light-emitting device improved in productivity, the light-emitting device, and an electronic device provided with the same.SOLUTION: The method for manufacturing a light-emitting device is characterized in that: a light-emitting element is formed on a substrate 100; a sealing resin film 134 and a looped adhesive film 144 surrounding the sealing resin film 134 are formed on a sealing substrate 105; and the substrate 100 and the sealing substrate 105 are bonded together under a first pressure, and then a pressure around both substrates is changed to a second pressure higher than the first pressure.

Description

  The present invention relates to a method for manufacturing a light emitting device, a light emitting device, and an electronic apparatus including the same.

  2. Description of the Related Art In recent years, as a next-generation display device following a liquid crystal display (LCD), a self-luminous element in which self-luminous elements such as organic electroluminescence elements (hereinafter abbreviated as “organic EL elements”) are two-dimensionally arranged. Research and development of a light-emitting device or a display device including a substrate has been performed.

  The organic EL element includes an anode electrode, a cathode electrode, and a light emitting functional layer formed between the pair of electrodes. The light emitting functional layer includes, for example, an organic EL layer, a hole injection layer, and an interlayer. The organic EL layer is made of a material capable of emitting fluorescence or phosphorescence, for example, a light emitting material containing a conjugated double bond polymer such as polyparaphenylene vinylene or polyfluorene. The organic EL element emits light by energy generated when holes and electrons recombine in the organic EL layer.

  Some light emitting materials and electrode materials used in organic EL elements are easily deteriorated by contact with moisture or oxygen. In order to prevent moisture and oxygen from entering, it is necessary to seal the region where the organic EL element is formed. Although there are several methods for sealing, Patent Document 1 discloses a method of providing a protective layer made of an electrically insulating inorganic compound having a thickness of 10 μm or less on the outer surface of a laminated structure of an organic EL element. ing. This protective layer is formed by vacuum deposition or sputtering.

  As another method, a method of covering a region where an organic EL element is formed with a resin is also known. Patent Document 2 discloses a method of laminating and sealing an organic EL element formed on a glass substrate with a sealing material in which a photocurable resin layer is formed on a light-transmitting film. Yes.

JP-A-5-089959 JP 2004-139777 A

  In the method disclosed in Patent Document 1, since a protective layer is formed on the surface of an organic EL element having irregularities by a vacuum deposition method or a sputtering method, a protective layer having a thickness sufficient to block moisture and oxygen is formed. There is a problem that it takes time to obtain.

  In the method disclosed in Patent Document 2, in order to sufficiently adhere the photocurable resin layer to the surface of the organic EL element having unevenness, and to expel bubbles contained in the bonding surface and the resin layer, After laminating the sealing material, it is necessary to go through a process of thermocompression bonding with a heating roller or the like.

  SUMMARY An advantage of some aspects of the invention is that it provides a method for manufacturing a light-emitting device with improved productivity, a light-emitting device, and an electronic apparatus including the same.

  A method of manufacturing a light emitting device according to a first aspect of the present invention includes a first substrate, a second electrode facing the first electrode, the first electrode, and the first electrode on a first substrate. A light emitting functional layer provided between the two electrodes, and a region on the second substrate corresponding to the region where the light emitting device is formed on the first substrate. Forming a resin film, forming a loop-shaped first adhesive film so as to surround the resin film and forming a space between the resin film and the first substrate under a first pressure; And the second substrate through the first adhesive film so that the light emitting element and the resin film face each other, and the periphery of the bonded first substrate and second substrate The pressure is changed to a second pressure higher than the first pressure.

  In the method for manufacturing the light emitting device, a plurality of the light emitting elements are formed on the first substrate, and the resin film is formed on a region on the second substrate corresponding to a region on which the plurality of light emitting elements are formed. A plurality of the first adhesive films may be formed so as to surround the plurality of resin films.

  Forming a second adhesive film surrounding the resin film in a region inside the first adhesive film on the second substrate, wherein the space includes the first adhesive film and the second adhesive film; It may be formed between.

  You may further provide the process of removing the edge part of the said 1st board | substrate bonded together, the edge part of the said 2nd board | substrate, and said 1st adhesive film.

  The light emitting device according to the second aspect of the present invention includes the light emitting device manufactured by the method according to the first aspect of the present invention.

  A light-emitting device according to a third aspect of the present invention is provided between a first electrode, a second electrode facing the first electrode, and the first electrode and the second electrode. A light emitting functional layer, a first substrate including a light emitting element, a resin layer formed at a position corresponding to the light emitting element, and a space surrounding the resin layer and between the resin layer. A loop-shaped adhesive portion formed so as to be provided, and a second substrate bonded to the first substrate through the resin layer and the adhesive portion. And

  An electronic apparatus according to a fourth aspect of the present invention includes the light emitting device according to the third aspect of the present invention.

  ADVANTAGE OF THE INVENTION According to this invention, the manufacturing method of the light-emitting device with improved productivity, a light-emitting device, and an electronic device provided with the same can be provided.

(A), (b) is the figure which showed the digital camera which has the light-emitting device based on this invention. It is the figure which showed the personal computer which has the light-emitting device which concerns on this invention. It is the figure which showed the mobile telephone which has a light-emitting device based on this invention. It is a figure showing a television having a light emitting device according to the present invention. It is the figure which notched and showed a part of light-emitting device obtained by the manufacturing method of the light-emitting device which concerns on 1st Embodiment of this invention. FIG. 6 is a cross-sectional view of the light emitting device shown in FIG. 5 taken along the line A-A ′. It is an equivalent circuit diagram of a pixel provided in the light emitting device according to the present invention. It is the partial plane schematic diagram which expanded and showed a part of light-emitting device which concerns on this invention. It is one enlarged plan view of the pixel with which the light-emitting device which concerns on this invention is equipped. FIG. 10 is a sectional view taken along line XX in FIG. 9. It is the XI-XI sectional view taken on the line of FIG. (A), (b) is a figure for demonstrating the formation process of the organic EL element substrate in the manufacturing method of the light-emitting device which concerns on 1st Embodiment of this invention. (C), (d) is a figure for demonstrating the formation process of the organic EL element substrate in the manufacturing method of the light-emitting device concerning 1st Embodiment of this invention. It is a top view of the laminate substrate used in the manufacturing method of the light-emitting device which concerns on 1st Embodiment of this invention. FIG. 15 is a cross-sectional view taken along line B-B ′ of the laminate substrate illustrated in FIG. 14. (A), (b) is a figure for demonstrating the process of bonding an organic EL element substrate and a laminated substrate under reduced pressure in the manufacturing method of the light-emitting device concerning 1st Embodiment of this invention. In the manufacturing method of the light-emitting device concerning a 1st embodiment of the present invention, it is a figure showing the state after putting the pasted organic EL element substrate and the laminate substrate under atmospheric pressure. It is a top view of the laminate substrate used in the manufacturing method of the light-emitting device concerning 2nd Embodiment of this invention. FIG. 19 is a sectional view taken along line C-C ′ of the laminate substrate shown in FIG. 18. It is sectional drawing of the light-emitting device obtained by the manufacturing method of the light-emitting device which concerns on 2nd Embodiment of this invention. It is a top view of the organic electroluminescent element substrate used for the modification of 2nd Embodiment of this invention. It is a top view of the laminate substrate used for the modification of 2nd Embodiment of this invention. (A)-(c) is a cross-sectional schematic diagram for demonstrating the manufacturing method of the light-emitting device which concerns on the modification of 2nd Embodiment of this invention.

  Hereinafter, a method for manufacturing a light emitting device, a light emitting device, and an electronic apparatus including the same according to an embodiment of the present invention will be described with reference to the drawings.

  The light emitting device according to the present invention is used for an organic EL display device, an organic EL light emitting device, an LCD, and the like. These light emitting devices are used for display units (displays) of electronic devices such as digital cameras, personal computers, mobile phones, and televisions. A specific example will be described with reference to FIGS. As shown in FIGS. 1A and 1B, the camera 1200 includes a lens unit 1201, an operation unit 1202, a display unit 1203, and a viewfinder 1204. The display unit 1203 includes the light emitting device according to the present invention. Similarly, the personal computer 1210 includes a display unit 1211 and an operation unit 1212 as shown in FIG. The display portion 1211 includes the light emitting device according to the present invention. Further, as shown in FIG. 3, the mobile phone 1220 includes a display unit 1221, an operation unit 1222, a reception unit 1223, and a transmission unit 1224. The display portion 1221 includes the light emitting device according to the present invention. Further, as illustrated in FIG. 4, the television 1230 includes a display unit 1231. The display portion 1231 includes the light emitting device according to the present invention.

(First embodiment)
A method for manufacturing a light emitting device according to a first embodiment of the present invention will be described with reference to the drawings, taking a manufacturing process of the light emitting device 800 as an example. The light emitting device 800 is a bottom emission type light emitting device that emits light to the substrate side. As shown in FIGS. 5 and 6, the light emitting device 800 includes a glass substrate 100, a sealing substrate 105, and a sealing resin layer 135. A plurality of pixels 120 are formed on the glass substrate 100. The pixels 120 are organic EL elements and are two-dimensionally arranged on the glass substrate 100. The pixels 120 are partitioned by a partition wall 130. A region where the pixel 120 is formed is sealed with a sealing resin layer 135.

  The structure of the light emitting device 800 will be described in more detail with reference to FIGS. FIG. 7 is an equivalent circuit diagram for explaining the configuration of the pixel 120. FIG. 8 is a partially enlarged plan view of the light emitting device 800, and FIG. 9 is an enlarged plan view showing one of the pixels 120 provided in the light emitting device 800.

  As shown in FIG. 7, each pixel 120 includes a capacitor Cs, an anode line La, a signal line Ld, a scanning line Ls, an organic EL element OEL, a selection transistor Tr11, and a drive transistor Tr12. When seen in a plan view, the anode line La, the signal line Ld, and the scanning line Ls are arranged so as to intersect vertically and horizontally between the openings of the pixel 120 as shown in FIG. FIG. 9 is a plan view showing the structure of the pixel 120 more specifically. 8 and 9, the counter electrode 46, the inorganic film 47, the sealing resin layer 135, and the sealing substrate 105 are omitted for easy understanding of the structure.

  The capacitor Cs is for holding the gate-source voltage of the drive transistor Tr12, and is connected between the gate-source of the drive transistor Tr12 as shown in FIGS.

  The selection transistor Tr11 is a transistor that functions as a switch for selecting the organic EL element OEL. As shown in FIGS. 9 and 11, the drain electrode is connected to the signal line Ld. The source electrode is connected to the gate electrode of the drive transistor Tr12. The gate electrode is connected to the scanning line Ls.

  As shown in FIG. 10, the pixel 120 includes an organic EL layer 45. The organic EL layer 45 emits light when supplied with current. In order to supply current to the organic EL layer 45, the pixel 120 includes a drive transistor Tr12, an anode electrode 42, and a counter electrode 46. The drive transistor Tr12 is a thin film transistor, for example. The anode electrode 42 is formed of a transparent electrode material such as ITO. In the case of the bottom emission type light-emitting device 800, the counter electrode 46 includes an electron injecting lower layer made of a material having a low work function such as Li, Mg, Ca, Ba, and an upper layer made of a light reflective conductive metal such as Al. And is composed of.

Some organic EL materials that form the organic EL layer 45 deteriorate when they come into contact with oxygen or moisture. In addition, a material constituting the counter electrode 46, in particular, a low work function material layer made of Ba or the like is easily oxidized when it comes into contact with oxygen, and the performance of the light emitting device 800 is deteriorated. In order to prevent this, the pixel 120 is sealed with a sealing resin layer 135 and an inorganic film 47 as shown in FIG. The sealing resin layer 135 is made of, for example, an epoxy UV curable resin. The inorganic film 47 is made of, for example, Al ₂ O ₃ or SiN.

  An embodiment of a method for manufacturing the light emitting device 800 will be described with reference to FIGS. Note that although a method for manufacturing the light-emitting device 800 will be described as an example for easy understanding, the present invention is not limited to this.

  First, as shown in FIG. 12A, a gate electrode Tr12g of a drive transistor Tr12 made of a Cr film, an Al film, a Cr / Al laminated film, an AlTi alloy film, an AlTiNb alloy film or the like is formed on a glass substrate 100, A gate insulating film 106 made of silicon nitride, silicon oxide or the like is covered. The gate insulating film 106 is formed by, for example, a CVD (Chemical Vapor Deposition) method. Although omitted in FIG. 12A, other metal wirings and electrodes such as signal lines and gate electrodes of switch transistors can be formed in this step.

  Next, as shown in FIG. 12B, the anode electrode 42, the source electrode, the drain electrode, and the like constituting the driving transistor Tr12 are formed on the gate insulating film 106 by a known process.

  When the light emitting device 800 is a bottom emission type, the anode electrode 42 is a transparent conductive film formed of ITO (Indium Tin Oxide), ZnO, or the like. The thickness is, for example, 50 to 300 nm. The source electrode and the drain electrode are made of, for example, a Cr film, an Al film, a Cr / Al laminated film, an AlTi alloy film, or an AlTiNb alloy film. The anode electrode 42 supplies the current supplied via the drive transistor Tr12 to the organic EL layer formed in the next step.

  Next, as shown in FIG. 13C, the partition wall 130 and the organic EL layer 45 are formed. The partition wall 130 is made of polyimide or the like, and plays a role of insulating each drive transistor Tr12 and each anode electrode 42 from each other. Further, as will be described later, it also serves as a partition when the organic EL layer 45 is formed.

  The organic EL layer 45 has a function of generating light by applying a voltage. The organic EL layer 45 is made of a known polymer light-emitting material capable of emitting fluorescence or phosphorescence, for example, a light-emitting material containing a conjugated double bond polymer such as polyparaphenylene vinylene or polyfluorene.

  The organic EL layer 45 is prepared by a nozzle coating method or an inkjet using a solution (dispersion) obtained by dissolving (dispersing) the above-described light emitting material in a suitable solvent such as an aqueous solvent or an organic solvent such as tetralin, tetramethylbenzene, mesitylene, and xylene. It is formed by applying by a method or the like and volatilizing the solvent. At this time, the organic EL layer 45 can be formed in a desired thickness at a desired position by applying a solution to each region partitioned by the partition wall 130.

  Before applying the solution, the surface of the anode electrode 42 may be made lyophilic by oxygen plasma treatment or UV ozone treatment. By making the anode electrode 42 lyophilic, the applied solution (dispersion) spreads uniformly on the surface of the anode electrode 42. As a result, the organic EL layer 45 having a uniform film thickness can be formed.

  Furthermore, the surface of the partition wall 130 may be subjected to a liquid repellent treatment in advance. Here, the liquid repellency indicates the property of repelling both aqueous solvents and organic solvents. By applying a liquid repellent treatment to the surface of the partition wall 130 in advance, the applied solution (dispersion) is prevented from spreading on the partition wall 130, and the organic EL layer 45 is formed at a desired thickness at a desired position. Becomes easy.

  In the present embodiment, the organic EL layer 45 is exemplified as a single layer for easy understanding of the invention. However, the organic EL layer 45 further includes a hole injection layer, an interlayer, or both. It may be. When the hole injection layer is formed, the hole injection layer is formed between the anode electrode 42 and the organic EL layer 45. The hole injection layer has a function of supplying holes to the organic EL layer 45. The hole injection layer is composed of an organic polymer material that can inject and transport holes, for example, polyethylenedioxythiophene (PEDOT) as a conductive polymer and polystyrene sulfonic acid (PSS) as a dopant. .

  Furthermore, when an interlayer is formed, the interlayer is formed between the hole injection layer and the organic EL layer 45. The interlayer has a function of suppressing the hole injection property of the hole injection layer to facilitate recombination of electrons and holes in the organic EL layer 45, and increases the light emission efficiency of the organic EL layer 45.

  Next, as illustrated in FIG. 13D, the counter electrode 46 is formed so as to cover the partition wall 130 and the organic EL layer 45. When the light emitting device 800 is a bottom emission type, the counter electrode 46 includes an electron injecting lower layer made of a material having a low work function such as Li, Mg, Ca, Ba, and an upper layer made of a light reflecting conductive metal such as Al. A laminated structure having On the other hand, when the light emitting device 800 is a top emission type, the counter electrode 46 is an extremely thin light-transmitting low work function with a thickness of about 10 nm made of a material having a low work function such as Li, Mg, Ca, Ba, for example. A transparent laminated structure having a layer and a light-reflective conductor layer such as ITO having a thickness of about 100 nm to 200 nm.

An inorganic film 47 is formed on the counter electrode 46. As shown in FIG. 13D, the inorganic film 47 is formed so as to cover the counter electrode 46. The inorganic film 47 is formed, for example, by depositing Al ₂ O ₃ , SiN or the like by a sputtering method or a plasma CVD method. In this way, the element formation region 400 in which the organic EL elements are two-dimensionally arranged is formed on the glass substrate 100.

  In the next step, the element formation region 400 is sealed. Here, the sealing is performed using the laminate substrate 110 shown in FIGS. The laminate substrate 110 includes a sealing resin film 134 and an adhesive film 144 formed in a loop shape so as to surround it. A space is formed between the sealing resin film 134 and the adhesive film 144 as shown in FIGS. The sealing resin film 134 and the adhesive film 144 are made of, for example, a UV curable epoxy resin. Both may be formed of the same resin, but the adhesive film 144 preferably has higher adhesiveness than the sealing resin film 134.

  The sealing process will be described with reference to FIGS. Bonding is performed under reduced pressure. First, as a preparation stage, the glass substrate 100 on which the organic EL element is formed and the laminate substrate 110 are placed, for example, in a pressure resistant container (not shown). The air in the pressure vessel is evacuated and decompressed. At this time, the pressure is not particularly limited. By placing both under reduced pressure, it is possible to remove and reduce a trace amount of moisture and air present on the surface or inside of the element or resin. As a result, the reliability and durability of the resulting light emitting device 800 are improved. At this time, in order to reduce moisture and air, heating may be performed as necessary, or the time for placing under reduced pressure may be increased.

  Next, as shown in FIG. 16A, the glass substrate 100 and the laminate substrate 110 are disposed so that the element formation region 400 faces the sealing resin film 134 and the adhesive film 144. The laminate substrate 110 is pressed against and adhered to the glass substrate 110 as shown in FIG. At this time, a space S is formed between the loop-shaped adhesive film 144 and the sealing resin film 134 as shown in FIG. The space S is blocked from outside air by a loop-shaped adhesive film 144. In this state, the pressure in the space S is substantially equal to the pressure in the pressure vessel.

  Next, the pressure around the bonded glass substrate 100 and laminate substrate 110 is increased. The simplest method is to open the pressure vessel and return the internal pressure to atmospheric pressure. Then, due to the pressure difference between the space S and the outside, the sealing resin film 134 and the adhesive film 144 are crushed as shown in FIG. 17, and the glass substrate 100 and the laminate substrate 110 are more closely attached.

  After the glass substrate 100 and the laminate substrate 110 are sufficiently adhered, the sealing resin film 134 and the adhesive film 144 made of a photocurable epoxy resin are cured by ultraviolet irradiation, and the sealing resin layer 135 and the adhesive portion 145 are respectively cured. To do. Thereafter, the region including the glass substrate 100, the laminate substrate 105, and the bonding portion 145 is cut and removed, whereby the light emitting device 800 shown in FIGS. 5 and 6 is obtained.

  In the present embodiment, two types of substrates constituting the light emitting device 800 are bonded together under reduced pressure, and are then brought into close contact using a pressure difference between the inside and outside. By placing the two types of substrates under reduced pressure, it is possible to remove traces of moisture and air present on the surface or inside of the element or resin. For this reason, the obtained light-emitting device 800 has durability higher than before. Further, since both are brought into close contact with each other using a pressure difference, a pressure bonding step using a large heating roller or the like, which is essential in the prior art, is unnecessary. Furthermore, compared with the case where pressure is applied in order from one end portion to the other end portion using a heating roller or the like, the pressure can be uniformly applied to the entire substrate. For this reason, the light-emitting device 800 which is hard to produce distortion and adhesion nonuniformity and has higher reliability is obtained.

  In the present embodiment, the pressure around the glass substrate 100 and the laminate substrate 110 bonded together is increased by opening the pressure vessel, but the internal pressure is increased by introducing air or an inert gas into the pressure vessel. The pressure may be increased. The pressure after the increase can be arbitrarily selected in consideration of various factors such as the thickness of the light emitting device after completion, the required adhesive strength, and the strength of each substrate.

(Second Embodiment)
Next, a method for manufacturing a light emitting device according to the second embodiment of the present invention will be described with reference to FIGS. A difference from the first embodiment is that a laminate substrate 115 shown in FIGS. 18 and 19 is used instead of the laminate substrate 110. Other configurations and manufacturing processes are the same as those in the first embodiment.

  As shown in FIGS. 18 and 19, the laminate substrate 115 has an adhesive film 139 around the sealing resin film 134. The adhesive film 139 is formed of a resin having higher adhesiveness than the sealing resin film 134. A loop-shaped adhesive film 144 is formed on the outer peripheral portion of the laminate substrate 115. When this is bonded to the glass substrate 100, a space S is formed between the two adhesive films 139 and 144.

  After passing through the bonding step, as in the first embodiment, the sealing resin film 134 and the adhesive films 139 and 144 made of a photocurable epoxy resin are cured by ultraviolet irradiation, and the sealing resin layer 135 and the adhesive part 140 are respectively cured. , 145. When the region including the glass substrate 100, the laminate substrate 115, and the bonding portion 145 is cut and removed, a light emitting device 810 shown in FIG. 20 is obtained.

  As shown in FIG. 20, the light emitting device 810 has an adhesive portion 140 around the sealing resin layer 135, unlike the light emitting device 800 obtained in the first embodiment. The adhesive portion 140 is a resin having higher adhesiveness than the sealing resin layer 135 and bonds the glass substrate 100 and the laminate substrate 115 more firmly. For this reason, the light-emitting device 810 has high mechanical strength and is more durable.

(Modification)
In the first embodiment and the second embodiment, an example in which one element formation region 400 is formed on one glass substrate 100 is shown to facilitate understanding of the invention. However, the scope of the present invention is not limited to this. I can't. For example, a plurality of element formation regions 400 can be formed on one glass substrate 100. As a modification of the second embodiment, a method of obtaining a plurality of light emitting devices 810 by forming a plurality of element formation regions 400 on one glass substrate 100 will be described with reference to FIGS.

  In this modification, as shown in FIG. 21, a plurality of element formation regions 400 are formed on the glass substrate 100, and these are bonded to the laminate substrate 116 shown in FIG. The laminate substrate 116 has a sealing resin film 134 at a position corresponding to the element formation region 400. An adhesive film 139 is formed around each sealing resin film 134. A loop-shaped adhesive film 139 is formed on the outer peripheral portion of the sealing substrate 105 so as to surround the plurality of sealing resin films 134 and the adhesive film 139.

  In the bonding step, first, the glass substrate 100 having a plurality of element formation regions 400 and the laminate substrate 116 are introduced into, for example, a pressure resistant container (not shown). After the inside of the pressure vessel is adjusted to a predetermined temperature and a predetermined pressure lower than the atmospheric pressure, the element forming regions 400 and the sealing resin films 134 are bonded together so as to face each other. FIG. 23A is a cross-sectional view taken along the line D-D 'shown in FIGS. In this state, the pressure in the space S is substantially equal to the pressure in the pressure vessel.

  Next, for example, the pressure in the vicinity of both substrates bonded together by opening the valve of the pressure vessel is increased. Then, as shown in FIG. 23B, the sealing resin film 134 and the adhesive films 139 and 144 are crushed by the pressure difference between the space S and the outside, and the glass substrate 100 and the laminate substrate 116 are more closely adhered.

  Similarly to the first embodiment and the second embodiment, the sealing resin film 134 and the adhesive films 139 and 144 are cured by ultraviolet irradiation to form the sealing resin layer 135 and the adhesive portions 140 and 145, respectively. The glass substrate 100 and the laminate substrate 116 are cut along a scribe break line indicated by a broken line in FIG. The scribe / break lines are arranged as shown in FIGS. 21 and 22 in plan view. For this reason, when the glass substrate 100 and the laminate substrate 116 are cut along the scribe / break line, the bonding portion 145 is also removed. In this way, a plurality of light emitting devices 810 are obtained as shown in FIG. In this modification, six element formation regions 400 are formed, and six light emitting devices 810 can be obtained in one step, so that productivity is particularly high. Further, since the pressure can be uniformly applied to the entire substrate by utilizing the atmospheric pressure difference, there is little variation in quality due to the part, and the light emitting device 810 with stable quality can be obtained.

  As mentioned above, although this invention was described in detail, showing embodiment, this invention is not limited to said embodiment. For example, the light emitting device and the manufacturing method thereof according to the present invention can be applied to an organic EL display device, a liquid crystal display panel, and the like in addition to a light emitting device having an organic EL element. In addition, various modifications are possible based on ordinary knowledge in the technical field, and these modifications are included in the technical scope of the present invention.

Cs ... capacitor, La ... anode line, Ld ... signal line, Ls ... scanning line, OEL ... organic EL element, S ... space, Tr11 ... select transistor, Tr12 ... drive transistor, Tr12g ... gate electrode, 42 ... anode electrode, 45 ... Organic EL layer, 46 ... Counter electrode, 47 ... Inorganic film, 100 ... Glass substrate, 105 ... Sealing substrate, 110, 115, 116 ... Laminate substrate, 106 ... Gate insulating film, 120 ... Pixel, 125 ... Interlayer insulation Membrane, 130 ... partition wall, 134 ... sealing resin film, 135 ... sealing resin layer, 139, 144 ... adhesive film, 140, 145 ... adhesive portion, 400 ... element formation region, 800, 810 ... light emitting device, 1200 ... digital Camera 1201 Lens unit 1202 Operation unit 1203 Display unit 1204 Viewfinder 1210 Personal computer , 1211 ... the display unit, 1212 ... the operating unit, 1220 ... mobile phone, 1221 ... the display unit, 1222 ... the operating unit, 1223 ... earpiece, 1224 ... the transmission section, 1230 ... TV, 1231 ... the display unit

Claims (7)

A first substrate, a first electrode, a second electrode facing the first electrode, and a light emitting functional layer provided between the first electrode and the second electrode; Forming a light emitting device having,
A resin film is formed on a second substrate in a region corresponding to the region where the light emitting element is formed on the first substrate, and a space is formed surrounding the resin film and between the resin film. To form a loop-shaped first adhesive film,
Under the first pressure, the first substrate and the second substrate are bonded through the first adhesive film so that the light emitting element and the resin film face each other.
A method for manufacturing a light-emitting device, wherein the pressure around the bonded first substrate and second substrate is changed to a second pressure higher than the first pressure. A plurality of the light emitting elements are formed on the first substrate;
A plurality of the resin films are formed in a region on the second substrate corresponding to a region where the plurality of light emitting elements are formed,
The first adhesive film is formed so as to surround the plurality of resin films.
The method of manufacturing a light emitting device according to claim 1. Forming a second adhesive film surrounding the resin film in a region inside the first adhesive film on the second substrate;
The space is formed between the first adhesive film and the second adhesive film.
The method for manufacturing a light-emitting device according to claim 1 or 2.   4. The method according to claim 1, further comprising a step of removing an end portion of the first substrate, an end portion of the second substrate, and the first adhesive film that are bonded to each other. A method for manufacturing the light emitting device according to claim 1.   A light-emitting device manufactured by the method according to claim 1. A light-emitting element including a first electrode, a second electrode facing the first electrode, and a light-emitting functional layer provided between the first electrode and the second electrode is provided. A first substrate;
A resin layer formed at a position corresponding to the light emitting element, and a loop-shaped adhesive portion formed so as to surround the resin layer and to provide a space between the resin layer, A second substrate bonded to the first substrate via a resin layer and the adhesive portion;
A light emitting device comprising:   An electronic apparatus comprising the light emitting device according to claim 6.

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