JP2012069698A - Electronic circuit module and method for manufacturing the same - Google Patents

Abstract

An object of the present invention is to provide a technique capable of avoiding inadvertent adhesion of chips and materials of a shield layer to a cut surface of a circuit board when the shield layer is cut into individual pieces.
An electronic circuit module manufacturing method includes an electronic component mounting step S100 for mounting an electronic component 12 on each circuit board 11 of a collective substrate 20, and a sealing resin layer 13 for sealing the electronic component 12. Stop resin layer forming step S200, first groove forming step S300 in which a part of the sealing resin layer 13 and the circuit board 11 is cut to form the first groove 16, and the first groove 16 is filled with a conductive resin. A shield layer forming step S400 for forming the shield layer 14; a second groove forming step S500 for cutting part of the circuit board 11 to form the second groove 17; and a cutting width of the first groove 16; In addition, an individualization step S600 for separating the circuit boards 11 into individual pieces by cutting the shield layer 14 with a cutting width narrower than the cutting width of the second groove 17 is provided.
[Selection] Figure 4

Description

  The present invention relates to a method for manufacturing an electronic circuit module in which an electronic component is mounted on a circuit board, and the electronic circuit module.

  Conventionally, in this type of electronic circuit module, an electronic component such as a semiconductor integrated circuit is mounted on a circuit board having a wiring pattern. At this time, for example, in order to prevent an electronic circuit module from malfunctioning due to the influence of an electromagnetic wave or the like from an adjacent circuit or the like, a shielding measure is taken to prevent the influence of an electromagnetic field or electrostatic induction.

Here, there is a method of shielding the electronic circuit module by attaching a metal cover so as to cover the electronic component.
However, in this method, it is necessary to secure a solder area for mounting a metal cover on the surface of the circuit board, and this hinders the downsizing of the electronic circuit module.
Therefore, there is a method in which an electronic component or the like is covered with a conductive resin without attaching a metal cover, and the conductive resin serves as a metal cover (see, for example, Patent Document 1).

Since the electronic circuit module of Patent Document 1 shields an electronic component using a conductive resin, it can exhibit a shielding property against the electronic component to be mounted without using a metal cover.
In addition, since this electronic circuit module has the end face of the circuit board and the end face of the shield layer made of conductive resin located on the same plane, the electronic circuit module as a whole can be reduced in size and cost. It is thought that it can plan.

JP 2008-288610 A

  In the prior art described above, when manufacturing an electronic circuit module, first, a groove is formed by half-cutting the sealing resin layer along the separation line from the upper surface side of the collective substrate. Next, a conductive resin is poured into the groove to form a shield layer. Finally, by cutting the collective substrate along the separation line with a cut width narrower than the cut width of the half cut, the individual electronic circuit modules are separated into individual pieces.

  However, in the above-described prior art, when the individual electronic circuit modules are finally separated into individual pieces, it is necessary to cut the shield layer along the separation line and cut the circuit boards. And this cutting is performed by a cutting machine such as a dicing machine having a dicing blade (a disk-shaped blade for cutting). When the shield layer is cut, the chips of the shield layer are formed on the side surface of the dicing blade. (Scraps generated by cutting) may adhere. In this case, if cutting is continued as it is, chips of the shield layer may adhere to the cross-sectional portion (cut surface) between the circuit boards.

  In addition, even if the shield layer chips are not attached to the side surface of the dicing blade, when the dicing blade itself pushes in the cutting direction of the shield layer, a part of the shield layer is pushed out, and the cut surface of the circuit board The shield layer material may adhere to the surface.

  Here, since the material of the shield layer is a conductive resin, if the shield layer is attached to the cut surface of the circuit board, the electronic circuit module is intended to be mounted on an external board (such as a motherboard). Doing so may cause a short circuit.

  Therefore, the present invention has an object to provide a technique capable of avoiding inadvertent adhesion of chips and materials of the shield layer to the cut surface of the circuit board when the shield layer is cut into pieces. It is a thing.

  In order to solve the above problems, the present invention firstly provides a method of manufacturing an electronic circuit module. Secondly, the present invention provides an electronic circuit module.

[Method of manufacturing electronic circuit module]
The electronic circuit module manufacturing method of the present invention is a method of manufacturing individual electronic circuit modules from a collective substrate, and includes the following steps.

(1) Electronic component mounting step In this step, an electronic component is mounted on each circuit board with respect to a collective board in which a plurality of circuit boards having wiring patterns are arranged across a line to be separated. Since a plurality of circuit boards are arranged on the collective board, electronic components are mounted on each circuit board.

(2) Sealing resin layer formation process In this process, the sealing resin layer which seals the electronic component mounted in the circuit board is formed. By sealing the electronic component with the sealing resin layer, the electronic component mounted on the circuit board can be insulated.

(3) First groove forming step In this step, the sealing resin layer is cut along the line to be separated from the upper surface side of the collective substrate, and a part of the circuit board is cut to thereby remove the sealing resin layer. A first groove reaching from the upper surface to the inside of the circuit board is formed. This 1st groove | channel is comprised by the part which cut off the sealing resin layer, and the part which cut off a part of circuit board, and the depth which reaches from the upper surface of a sealing resin layer to a part of circuit board in the thickness direction It is a groove | channel which has. In the thickness direction of the collective substrate, the first groove is formed by completely penetrating the sealing resin layer and leaving a part without completely penetrating the circuit board.

(4) Shield layer forming step In this step, the first groove is filled with a conductive resin, thereby forming a shield layer on the top surface and side surface of the sealing resin layer and part of the side surface of the circuit board. Since the first groove is composed of a portion obtained by cutting the sealing resin layer and a portion obtained by cutting a part of the circuit board, the upper surface and the side surface of the sealing resin layer and the side surface of the circuit board are thus formed. A shield layer is formed in part.

(5) Second groove forming step In this step, a second part reaching the inside of the circuit board from the lower surface of the circuit board by cutting a part of the circuit board along the line to be separated from the lower surface side of the collective board. Grooves are formed. This 2nd groove | channel is a groove | channel comprised by the part which cut a part of circuit board, and has the depth which reaches the inside of a circuit board from the lower surface of a circuit board in the thickness direction. The second groove is formed by cutting a part of the circuit board along the scheduled separation line in the thickness direction of the collective board.

(6) Individualization process In this process, the shield layer is cut along the planned separation line with a cutting width narrower than the cutting width of the first groove and narrower than the cutting width of the second groove. A plurality of circuit boards arranged on the board are separated and separated into individual electronic circuit modules.

The reason for cutting the shield layer with a cutting width narrower than the cutting width of the first groove forming step is to keep the thickness of the shield layer properly, and that the side shield layers are all cut when singulated. This is to prevent it.
The reason why the shield layer is cut with a cutting width narrower than the cutting width in the second groove forming step is to prevent chips and materials of the shield layer from adhering to the cut surface of the circuit board.

  As described above, according to the manufacturing method of the present invention, the shield layer is cut with a cutting width narrower than the cutting width of the second groove. Therefore, when individual electronic circuit modules are separated into individual pieces in the individualization step. The end face of the circuit board located in the second groove portion is located inside the end face of the shield layer. Therefore, even if the shielding layer is cut by a cutting machine or the like, chips of the shielding layer are generated or a part of the shielding layer is pushed into the second groove side, they are not removed from the second groove. No longer adheres to the side surface of the circuit board, that is, the side surface of the circuit board. Thereby, when cutting and separating the shield layer into pieces, it is possible to prevent the chips and materials of the shield layer from adhering to the cut surface of the circuit board.

  As a configuration of the manufacturing method of the present invention, in the second groove forming step, it is preferable to form a second groove having a width wider than the width of the first groove formed in the first groove forming step.

  According to the present invention, the second groove having a width wider than the width of the first groove is formed. Therefore, when the second groove is formed corresponding to the first groove, the location of the second groove is formed. (Accuracy matching) becomes easy. Even when it is desired to completely align the centers of the first groove and the second groove, a slight deviation occurs in the manufacturing process. In such a case, by making the second groove wider than the width of the first groove, even if the cutting positions of both the grooves are slightly deviated, the deviation can be allowed.

  On the contrary, if the second groove having a width smaller than the width of the first groove is formed, chips of the shield layer adhere to the side surface of the dicing blade when the second groove is formed. There is a possibility of adhering to the inner surface of the two grooves (the cut surface of the circuit board).

  On the other hand, in the present invention, since the second groove is wider than the width of the first groove, when the second groove is formed, the chips of the shield layer are separated from the end face of the dicing blade (the cutting object and the blade). Are attached only to the contact surface) and not to the side surface of the dicing blade. As a result, it is possible to prevent the shield layer chips from adhering to the cut surface of the circuit board.

  As a structure of the manufacturing method of this invention, it is preferable to form the 2nd groove | channel which reaches a 1st groove | channel from the lower surface of a circuit board in a 2nd groove | channel formation process.

According to the present invention, since the second groove is a groove reaching the first groove, the circuit board is substantially cut when the second groove is formed. Actually, the adjacent circuit boards are connected to each other by the shield layer, so that the circuit boards are not separated at this stage. For this reason, at the time of singulation, only the shield layer needs to be cut, and the manufacture is easy.
Further, when forming the second groove, a part of the shield layer formed inside the first groove can be cut together, so that the shield layer is cut on the cut surface of the circuit board at the time of separation. Inadvertent adhesion of powder and materials can be reliably avoided.

[Electronic circuit module]
An electronic circuit module of the present invention is formed on a circuit board having a wiring pattern, an electronic component mounted on the circuit board, a sealing resin layer for sealing the electronic component, and a lower surface side peripheral portion of the side surface of the circuit board. And a concave portion recessed toward the inside of the circuit board, an upper surface and a side surface of the sealing resin layer, and a shield layer formed on a portion of the side surface of the circuit board excluding the concave portion.

  In the present invention, a recessed portion that is recessed toward the inside of the circuit board is formed at the lower peripheral edge of the side surface of the circuit board. And the shield layer is formed in the part except the dent part among the side surfaces of a circuit board. Here, since the shield layer functions as the ground by being connected to the ground pattern (ground conductor), the wiring pattern other than the ground pattern and the shield layer should not be in contact with each other. For this reason, depending on the arrangement of the circuit board wiring pattern and the external substrate wiring pattern, it may be desirable that the shield layer is slightly retracted to the upper surface side from the lower surface of the circuit substrate.

  In the present invention, in such a case, by forming this recess, a slight recess can be realized, and various wiring patterns can be escaped by the recess. Moreover, weight reduction of an electronic circuit module can be achieved by forming a recessed part. Further, when forming the recess, the recess can be formed by cutting the circuit board together with the shield layer, which can contribute to the efficiency of the manufacturing method.

  As described above, according to the present invention, the side surface of the circuit board is shielded except for a very small gap (dent), thereby not only sufficiently shielding the side surface of the circuit board but also the complicated wiring pattern. There is an extraordinary effect of being able to deal with placement and the like.

  According to the present invention, when the shield layer is cut into individual pieces, it is possible to prevent the chips and materials of the shield layer from inadvertently adhering to the cut surface of the circuit board. When the is mounted on an external substrate, it is possible to prevent an unintended short circuit from occurring.

It is a figure which shows the electronic circuit module manufactured by the manufacturing method which concerns on one Embodiment of this invention. It is a schematic diagram explaining the manufacturing method of an electronic circuit module (1/2). It is a schematic diagram explaining the manufacturing method of an electronic circuit module (2/2). It is process drawing explaining the manufacturing method of an electronic circuit module. It is a schematic diagram explaining the manufacturing method of the electronic circuit module of a comparative example.

Hereinafter, an electronic circuit module manufacturing method and an electronic circuit module according to the present invention will be described.
FIG. 1 is a diagram showing an electronic circuit module manufactured by a manufacturing method according to an embodiment of the present invention. 1A is a perspective view of an electronic circuit module, FIG. 1B is a cross-sectional view taken along line BB of FIG. 1A, and FIG. FIG. 2 is an enlarged view of a portion C in FIG. In these drawings, the dimensions of each part are exaggerated in order to facilitate understanding of the internal structure of the electronic circuit module and the arrangement relationship of each part. The same applies to the drawings shown below.

  The electronic circuit module 10 is a high-frequency module (unit) having, for example, a radio communication function in a high-frequency band (wireless LAN, Bluetooth: registered trademark). It is built in a notebook computer or the like. Hereinafter, the configuration of each part of the electronic circuit module 10 will be described.

[Circuit board]
The electronic circuit module 10 includes a circuit board 11 that serves as a base for the electronic circuit module 10.
The circuit board 11 is a board provided with a wiring pattern 11a having a plurality of connection terminals and a ground pattern 11b. The circuit board 11 has a multilayer structure, and a wiring pattern and a ground pattern are also provided on the inner layer of the circuit board 11.

  As shown in FIG. 1C, the circuit board 11 has a recess 11 c formed on the lower peripheral edge of the side surface of the circuit board 11. The recessed portion 11 c is formed to be recessed (recessed) toward the inside of the circuit board 11. The recessed portion 11 c is a portion that is recessed from the lower surface side of the circuit board 11 toward the upper surface side and from the side surface side of the circuit board 11 toward the inside.

[Electronic parts]
An electronic component 12 is mounted on the circuit board 11.
The electronic component 12 is an electronic element mounted on the circuit board 11, for example, a component such as a semiconductor integrated circuit mounted on the circuit board 11.
Examples of the electronic component 12 to be mounted include a high-frequency chip or FET array packaged with an integrated circuit, a passive element such as a chip resistor, a chip coil, or a chip capacitor, but may be other components.

(Sealing resin layer)
The electronic circuit module 10 includes a sealing resin layer 13.
The sealing resin layer 13 is a resin layer that seals the electronic component 12 by covering the electronic component 12 from the upper surface, and is formed of a silicon-based or epoxy-based insulating resin.

[Shield layer]
A shield layer 14 is formed on the outer surface of the electronic circuit module 10.
The shield layer 14 is a layer that is formed on the upper surface and side surfaces of the sealing resin layer 13 and the side surface of the circuit board 11 excluding the recessed portion 11 c and prevents the influence of the electromagnetic field and electrostatic induction on the electronic component 12. is there.

  The shield layer 14 is a resin layer containing a metallic conductive material. By connecting the shield layer 14 to the ground pattern 11b of the circuit board 11, the shield layer 14 functions as a ground. . As a result, the shield layer 14 can exhibit a shielding effect (blocking noise from the outside, radiating unnecessary radio waves to the outside).

Next, a method for manufacturing an electronic circuit module according to an embodiment will be described with reference to FIGS.
2 and 3 are schematic diagrams for explaining a method for manufacturing an electronic circuit module, and FIG. 4 is a process diagram for explaining a method for manufacturing an electronic circuit module.

[Aggregate substrate]
First, the collective substrate 20 will be described. As shown in FIG. 2A, the collective substrate 20 is a substrate in which a plurality of circuit boards 11 having wiring patterns are arranged in a matrix (lattice) with the planned separation lines 15 in between.
The scheduled separation line 15 is a line that exists between the circuit boards 11 as a guide for individualization described later.
The manufacturing method of the electronic circuit module 10 proceeds by executing the following steps.

[Electronic component mounting step; see (B) in FIG. 2 and step S100 in FIG. 4]
In this step, the electronic component 12 is mounted on each circuit board 11 of the collective board 20. Since the plurality of circuit boards 11 are arranged on the collective board 20, the electronic component 12 is mounted on each circuit board 11. The electronic component 12 is electrically connected to a wiring pattern or the like formed on the circuit board 11 by wire bonding connection, flip chip connection, or the like.

[Sealing resin layer forming step; see (C) in FIG. 2 and step S200 in FIG. 4]
In this step, a sealing resin layer 13 for sealing the electronic component 12 mounted on the circuit board 11 is formed. The sealing resin layer 13 is molded using a resin for the sealing resin layer 13 while applying pressure with a molding machine.
Further, the sealing resin layer 13 is not formed only on the upper surface of the electronic component 12 but is formed on the entire upper surface of the collective substrate 20 (circuit substrate 11) including the electronic component 12. By sealing the electronic component 12 with the sealing resin layer 13, the electronic component 12 mounted on the circuit board 11 can be insulated.

[First groove forming step; see (D) in FIG. 2 and step S300 in FIG. 4]
In this step, the sealing resin layer 13 is cut along the scheduled separation line 15 from the upper surface side of the collective substrate 20 and a part of the circuit board 11 is cut (see arrow D in the figure), thereby sealing. A first groove 16 extending from the upper surface of the stop resin layer 13 to the inside of the circuit board 11 is formed.

  The first groove 16 includes a portion obtained by cutting the sealing resin layer 13 and a portion obtained by cutting a part of the circuit board 11, and a part of the circuit board 11 from the upper surface of the sealing resin layer 13 in the thickness direction. This is a groove having a depth that reaches (substantially the central portion). In the thickness direction of the collective substrate 20, the first groove 16 is formed by completely penetrating the sealing resin layer 13 and leaving a part thereof without completely penetrating the circuit board 11.

  At this time, since a part of the ground pattern 11b formed inside the circuit board 11 is disposed in a relatively upper layer portion of the circuit board 11, the ground pattern 11b is formed when the first groove 16 is formed. Are also cut at the same time.

Here, the cutting of the groove is performed by a cutting machine such as a dicing machine having a dicing blade. The cutting width can be adjusted by changing the blade width of the dicing blade used for cutting. The same applies to the cutting of the following grooves.
In the present embodiment, the blade width of the dicing blade is adjusted so that the width dimension of the first groove 16 is about 200 μm.

[Shield layer forming step; see (E) in FIG. 3 and step S400 in FIG. 4]
In this step, the first groove 16 is filled with a conductive resin, thereby forming the shield layer 14 on the upper surface and side surface of the sealing resin layer 13 and part of the side surface of the circuit board 11. The material for forming the shield layer 14 made of conductive resin may be any material having conductivity, and a resin material containing a metallic conductive material is poured into the first groove 16 and formed.
At this time, the shield layer 14 is connected to the ground pattern 11b of the circuit board 11, and the shield layer 14 functions as a ground.

[Second groove forming step; see (F) in FIG. 3 and step S500 in FIG. 4]
In this step, a part of the circuit board 11 is cut from the lower surface side of the collective substrate 20 along the scheduled separation line 15 (see arrow F in the figure), so that the inside of the circuit board 11 is formed from the lower surface of the circuit board 11. A second groove 17 is formed to reach the first groove 16 formed in (1).

The second groove 17 is constituted by a portion obtained by cutting a part of the circuit board 11 and has a depth reaching the first groove 16 formed in the circuit board 11 from the lower surface of the circuit board 11 in the thickness direction. It is a groove.
The second groove 17 is formed by cutting a part of the circuit board 11 along the planned separation line 15 in the thickness direction of the collective substrate 20. If it is difficult to cut the second groove 17 from the back surface side, the aggregate substrate 20 may be turned over and cut from the front surface side in order to facilitate the work.

  In this step, the second groove 17 having a width wider than the width of the first groove 16 formed in the first groove forming step is formed. The shield layer 14 is cut by a cutting machine (not shown) as in the first groove forming step described above, and the cutting width is adjusted by changing the blade width of a dicing blade used for cutting. If the width dimension of the first groove 16 is about 200 μm, the cutting width dimension in this step may be about 300 μm.

  Thereby, the lower surface side peripheral part of the side surface of the circuit board 11 is cut, and the recessed part 11c is formed in the side surface of the circuit board 11 (refer FIG. 1). The dimensions of the recess 11c can be arbitrarily changed depending on the wiring pattern of the circuit board 11 to be used and the wiring pattern of the external board.

  In this step, not only a part of the lower surface of the circuit board 11 but also a part of the shield layer 14 of the conductive resin that has entered the first groove 16 is cut.

[Individualization step; see (G) in FIG. 3 and step S600 in FIG. 4]
In this step, the line 15 to be separated is cut with a cutting width narrower than the cutting width of the first groove 16 formed in the first groove forming step and narrower than the cutting width of the second groove 17 formed in the second groove forming step. The shield layer 14 is cut along The shield layer 14 is cut from the lower surface side of the collective substrate 20 as in the second groove forming step (see arrow G in the figure). As a result, a plurality of circuit boards 11 arranged on the collective board 20 can be separated and separated into individual electronic circuit modules 10.

The shield layer 14 is cut by a cutting machine (not shown), and the cutting width is adjusted by changing the diameter of the drill to be used, as in the above-described groove forming steps. If the width dimension of the first groove 16 is about 200 μm, the cutting width dimension in this step may be about 100 μm.
Then, through these steps, the electronic circuit module 10 shown in FIG. 1 is completed.

[Comparative Example]
FIG. 5 is a schematic diagram illustrating a method for manufacturing the electronic circuit module of the comparative example.
The method of manufacturing the electronic circuit module of the comparative example proceeds in the same manner as in the above-described embodiment until the first groove 16 is formed and the shield layer 14 is formed, as shown in FIG. The state shown in FIG. 5A corresponds to the shield layer forming step (see (E) in FIG. 3 and step S400 in FIG. 4) of the above-described embodiment.

  And in the manufacturing method of the electronic circuit module of a comparative example, the 2nd groove | channel formation process (refer step S500 in FIG. 4) does not exist like embodiment mentioned above. That is, the second groove 17 is not formed as in the above-described embodiment, and the shield layer 14 is cut along the planned separation line 15 from the upper surface side of the shield layer 14 as shown in FIG. As a result, a plurality of circuit boards 11 arranged on the collective board 20 are separated (see arrow B in FIG. 5).

  For this reason, in the manufacturing method of the comparative example, when the chips of the shield layer 14 adhere to the side surface of the dicing blade at the time of individual pieces, the shield layer is formed on the cut surface of the circuit board 11 as shown in FIG. 14 chips may adhere (see arrow D in FIG. 5).

  In addition, even if chips of the shield layer 14 are not attached to the side surface of the dicing blade, when the dicing blade itself pushes the shield layer 14, a part of the shield layer 14 is pushed out, and the cut surface of the circuit board 11. The material of the shield layer 14 may adhere to the surface (see arrow D in FIG. 5).

  In this case, since the material of the shield layer 14 is a conductive resin, if the shield layer 14 is attached to the cut surface of the circuit board 11, the electronic circuit module is mounted on an external board (motherboard or the like). May cause an unintended short circuit (short circuit).

  Here, if silver is contained in the shield layer 14, since the silver is a material that is easily stretched, chips and the like of the shield layer 14 easily adhere to the cut surface of the circuit board 11. And once silver adheres to the cut surface of the circuit board 11, the silver adheres to the cut surface, so that it is difficult to clean and it cannot be scraped off later.

  On the other hand, according to the manufacturing method of the present embodiment, since the second groove 17 is formed and then separated into individual electronic circuit modules 10, the cut surface of the circuit board 11 is formed from the end surface of the shield layer 14. Also, it is possible to prevent the metal from adhering to the cut surface of the circuit board 11 at the time of singulation. Therefore, when the electronic circuit module 10 is mounted on an external substrate such as a mother board, there is no possibility that an unintended short circuit occurs, and as a result, a higher quality electronic circuit module 10 can be provided.

  In addition, since the second groove 17 wider than the width of the first groove 16 is formed, when forming the second groove 17 corresponding to the first groove 16, the location of the second groove 17 is formed. Positioning (accuracy matching) becomes easy. Even when it is desired to completely align the centers of the first groove 16 and the second groove 17, a slight deviation occurs in the manufacturing process. In such a case, by setting the second groove 17 wider than the width of the first groove 16, even if the cutting positions of both grooves are slightly shifted, the shift can be allowed (absorbed). .

  Further, since the second groove 17 is wider than the width of the first groove 16, when the second groove 17 is formed, the chips of the shield layer 14 are separated from the end face of the dicing blade (the shield layer 14 and the dicing blade are separated from each other). It adheres only to the contact surface) and does not adhere to the side surface of the dicing blade. As a result, it is possible to prevent the chips of the shield layer 14 from adhering to the cut surface of the circuit board 11.

  Furthermore, since the second groove 17 reaches the first groove 16, the circuit board 11 is substantially cut when the second groove 17 is formed. Actually, the adjacent circuit boards 11 are not separated because they are connected by the shield layer 14. For this reason, at the time of singulation, only the shield layer 14 needs to be cut, and manufacture is easy.

  In addition, when the second groove 17 is formed, a part of the shield layer 14 formed inside the first groove 16 can also be cut. By cutting this, it is possible to reliably prevent the chips and materials of the shield layer 14 from inadvertently adhering to the cut surface of the circuit board 11.

  On the other hand, in the electronic circuit module 10 of the present embodiment, a recessed portion 11 c that is recessed toward the inside of the circuit board 11 is formed on the lower surface side periphery of the side surface of the circuit board 11. And the shield layer 14 is formed in the part except the recessed part 11c among the side surfaces of the circuit board 11. FIG. Here, since the shield layer 14 functions as the ground by being connected to the ground pattern 11b, the shield layer 14 should not contact the wiring pattern other than the ground pattern 11b.

  For this reason, depending on the wiring pattern of the circuit board 11 and the wiring pattern of the external board, the shield layer 14 may be preferably retracted slightly to the upper surface side from the lower surface of the circuit board 11. In this embodiment, in such a case, by forming the recess 11c, a slight recess can be realized, and various wiring patterns can be escaped by the recess 11c.

  Moreover, weight reduction of the electronic circuit module 10 can be achieved by forming the recessed part 11c. Furthermore, when forming the recessed part 11c, the circuit board 11 can be cut with the shield layer 14, and the recessed part 11c can be formed, and it can contribute to efficiency improvement of a manufacturing method.

  Thus, according to the electronic circuit module 10 of the present embodiment, the side surface of the circuit board 11 is shielded except for a very small gap (recessed portion 11c), thereby sufficiently shielding the side surface of the circuit board 11. In addition, there is an extraordinary effect that it is possible to deal with complicated layout of wiring patterns.

  The present invention can be implemented with various modifications and substitutions without being limited to the above-described embodiment. Further, the configurations of the electronic circuit module 10 and the collective substrate 20 mentioned in the embodiment are all preferable examples, and it is needless to say that these can be appropriately modified and implemented.

  In the above-described embodiment, the example in which the second groove 17 reaching the first groove 16 is described. However, a second groove that does not reach the first groove 16 may be formed. Even in this case, since the second groove is formed as a groove wider than the cutting width at the time of singulation, the same effect as the above-described embodiment can be obtained.

  In the above-described embodiment, the example in which the shield layer 14 is cut from the back surface side of the circuit board 11 in the individualization step has been described. However, even if the shield layer 14 is cut from the front surface side of the circuit board 11 to be individualized. Good.

  The dimensions of each groove and each cutting width can be appropriately changed without being limited to the values shown in the above-described embodiment.

DESCRIPTION OF SYMBOLS 10 Electronic circuit module 11 Circuit board 11a Wiring pattern 11b Ground pattern 11c Recessed part 12 Electronic component 13 Sealing resin layer 14 Shield layer 15 Scheduled separation line 16 1st groove 17 2nd groove 20 Collective board

Claims (4)

An electronic component mounting step for mounting an electronic component on each circuit board, with respect to a collective board in which a plurality of circuit boards having wiring patterns are arranged across a planned separation line,
A sealing resin layer forming step of forming a sealing resin layer for sealing the electronic component mounted on the circuit board;
By cutting the sealing resin layer along the planned separation line from the upper surface side of the collective substrate, and by cutting a part of the circuit substrate, the inner surface of the circuit substrate is cut from the upper surface of the sealing resin layer. A first groove forming step of forming a first groove reaching
A shield layer forming step of forming a shield layer on a part of the upper surface and side surface of the sealing resin layer and the side surface of the circuit board by filling the first groove with a conductive resin;
A second groove that forms a second groove from the lower surface of the circuit board to the inside of the circuit board by cutting a part of the circuit board along the planned separation line from the lower surface side of the collective board. Forming process;
By cutting the shield layer along the planned separation line with a cutting width narrower than the cutting width of the first groove and narrower than the cutting width of the second groove, a plurality of the shield layers are arranged on the collective substrate. A method of manufacturing an electronic circuit module, comprising: a step of separating circuit boards and separating them into individual electronic circuit modules. In the manufacturing method of the electronic circuit module of Claim 1,
In the second groove forming step,
A method of manufacturing an electronic circuit module, comprising: forming a second groove having a width wider than a width of the first groove formed in the first groove forming step. In the manufacturing method of the electronic circuit module according to claim 1 or 2,
In the second groove forming step,
A method of manufacturing an electronic circuit module, comprising: forming a second groove reaching the first groove from a lower surface of the circuit board. A circuit board having a wiring pattern;
Electronic components mounted on the circuit board;
A sealing resin layer for sealing the electronic component;
A dent formed on the lower peripheral edge of the side surface of the circuit board and recessed toward the inside of the circuit board;
An electronic circuit module comprising: an upper surface and a side surface of the sealing resin layer; and a shield layer formed on a portion of the side surface of the circuit board excluding the recessed portion.

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