JP2012064682A - Electronic component - Google Patents

Abstract

An object of the present invention is to provide an electronic component that is reduced in size and height so that the thickness dimension of a mounting portion of a terminal does not vary due to solder.
A terminal 15 is disposed on a side surface from which a lead wire 14 protrudes, a connection portion 18 to which the lead wire 14 is connected, a side surface adjacent to the side surface on which the connection portion 18 is disposed, and is connected to the connection portion 18. And a mounting portion 20 disposed on the lower surface of the electronic component main body 13 and connected to the connecting portion 18 via the connecting portion 19. The connecting portion 18 protrudes outward and has a groove 21 on the inner side. The protruding ridge portion 22 is provided in the vertical direction, the root side of the lead wire 14 is stored in the groove 21 of the ridge portion 22, and the end portion of the lead wire 14 is viewed from the ridge portion 22 and the connecting portion 19. This is soldered to the connecting portion 18 on the opposite side.
[Selection] Figure 1

Description

  The present invention relates to an electronic component used in various electronic devices.

  In recent years, as electronic devices such as notebook computers are becoming smaller and thinner, electronic components mounted on these electronic devices are also required to be small and low-profile. As shown in FIGS. 4 and 5, the electronic component body 1, the circuit element lead wire 2 drawn out from the electronic component body 1, and the lead wire 2, as shown in FIGS. In the electronic component comprising the terminals 3 soldered to each other, the terminal 3 is connected to the connecting portion 4 connecting the lead wire 2 and the mounting portion 5 connecting to the mounting substrate (not shown) via the connecting portion 6. Thus, an electronic component that has been reduced in size and reduced in height by arranging the connecting portion 4 and the connecting portion 6 on adjacent side surfaces of the electronic component main body 1 has been proposed.

  As prior art document information related to the invention of this application, for example, Patent Document 1 is known.

JP 2003-282333 A

  In the above conventional configuration, if the electronic component is further reduced in size and height, when the lead wire 2 is solder-connected to the connection portion 4, the melted solder easily goes around the connection portion 6 and the mounting portion 5, and the mounting portion 5 There is a possibility that the height of the electronic component is increased due to the thickness of the solder that has wrapped around, or that the solder fillet when soldered to the mounting board by the solder that has wrapped around the connecting portion 6 becomes large and proper solder connection cannot be made. This hindered further downsizing and height reduction of electronic components.

  In order to solve the above-mentioned problems, the present invention includes an electronic component body composed of a circuit element and an exterior portion of the circuit element, a lead wire for the circuit element protruding from the side surface of the electronic component body, and a terminal obtained by processing a metal plate. Provided, the terminal is disposed on the side surface from which the lead wire protrudes and connected to the lead wire, the connection portion disposed on the side surface adjacent to the side surface on which the connection portion is disposed and connected to the connection portion, and the electronic component main body And a mounting portion that is connected to the connecting portion via the connecting portion. The protruding portion that protrudes outward and has a groove on the inner side is provided in the vertical direction on the connecting portion. The base side of the lead wire is housed in the groove, and the end portion of the lead wire is soldered to the connection portion on the side opposite to the connecting portion when viewed from the protruding portion.

  With the above configuration, when the lead wire is soldered to the connecting part, the protruding strip formed on the connecting part can serve as a wall to prevent molten solder from wrapping around the connecting part or mounting part. The thickness dimension of the part is not varied by the solder, and an electronic component that is reduced in size and height can be provided.

The upper surface side perspective view of the electronic component in one embodiment of this invention The lower surface side perspective view of the electronic component in one embodiment of this invention Part A enlarged view of FIG. Plan view of conventional electronic components Side view of conventional electronic components

  Hereinafter, an example in which a coil is used as a circuit element for an electronic component according to an embodiment of the present invention will be described with reference to the drawings.

  FIG. 1 is a top perspective view of an electronic component according to an embodiment of the present invention, and FIG. 2 is a bottom perspective view of the electronic component.

  1 and 2, an electronic component according to an embodiment of the present invention includes an electronic component body 13 including a circuit element 11 and an exterior portion 12 of the circuit element 11, and a circuit protruding from a side surface of the electronic component body 13. It consists of a lead wire 14 of the element 11 and a terminal 15 connected to the lead wire 14 by soldering.

  This electronic component main body 13 is obtained by covering the periphery of a circuit element 11 formed by winding an insulating film conductor having a diameter of 0.2 mm to form a coil 16 with an exterior portion 12. The circuit element 11 is embedded in a mixture of powder and binder and compacted. The shape of the electronic component main body 13 is a prismatic shape having the same shape on the upper surface and the lower surface, a substantially square shape having a side length of 5.0 mm on the upper surface or the lower surface, and a height of 1.2 mm. Yes. Then, at least two corners are chamfered when viewed from the upper surface or the lower surface, and a tapered portion 17 is formed on the side surface of the electronic component main body 13.

  The lead wire 14 is an end of the coil 16 that is the circuit element 11 that protrudes from the tapered portion 17 of the electronic component body 13, and the end of the coil 16 is formed when the exterior portion 12 is compacted. It is compacted by protruding outside a mold (not shown). In this way, by projecting the lead wire 14 from the tapered portion 17, when the electronic component is viewed from the upper surface, the lead-out portion is disposed on the tapered portion 17, and the area of the electronic component is not excessively widened. Electronic components can be miniaturized. In the present embodiment, the tapered portions 17 are formed at a pair of opposite corner portions. However, the tapered portions 17 may be formed at adjacent corner portions, or the tapered portions 17 may be formed at all corner portions. .

  The terminal 15 is obtained by processing a phosphor bronze plate having a thickness of 0.1 mm and soldering the surface thereof and fixing it to the electronic component main body 13 with an adhesive. And a mounting unit 20. First, the connecting portion 18 is a portion to which the lead wire 14 is connected by soldering. The connecting portion 18 is disposed on the taper portion 17 of the electronic component main body 13 from which the lead wire 14 protrudes, and the lead wire 14 is disposed on the surface of the connecting portion 18 and soldered. Connected. Further, the connecting portion 19 is formed on the side surface adjacent to the tapered portion 17 on which the connecting portion 18 is arranged and is connected to the connecting portion 18. The mounting portion 20 is a portion that is solder-connected to a mounting substrate (not shown), and is formed on the lower surface of the electronic component main body 13 and connected to the connecting portion 18 via the connecting portion 19.

  Further, the connecting portion 18 is provided with a straight ridge 22 that protrudes outward and has a groove 21 on the inside in a vertical direction from the upper end to the lower end of the connecting portion 18 at a position corresponding to the lead wire 14. Provided. The ridge portion 22 is formed so that the lead wire 14 can be accommodated by making the width dimension and depth dimension of the groove 21 formed inside larger than the diameter dimension of the lead wire 14.

  In addition, a slit 23 is formed at the upper end of the ridge portion 22 and the side opposite to the connecting portion 19 is opened. The width dimension of the opening portion of the slit 23 and the dimension of the opening depth from the upper end of the connection portion 18 are formed. Is made larger than the diameter of the lead wire 14 so that the lead wire 14 can be inserted.

  Next, a state in which the terminal 15 is attached to the electronic component main body 13 and connected to the lead wire 14 will be described.

  As shown in FIG. 3, the lead wire 14 is once bent upward so that the base side of the lead wire 14 is fitted into the groove 21 of the protruding strip portion 22 and stored, and the end side of the lead wire 14 is inserted into the slit 23. Is inserted into the connecting portion 18 on the side opposite to the connecting portion 19 when viewed from the protruding portion 22 and connected by solder 24 (part indicated by a broken line).

  By doing so, the protruding ridge 22 is located between the portion where the lead wire 14 is solder-connected to the connecting portion 18 and the connecting portion 19, and the protruding ridge 22 becomes a wall and is soldered. It is possible to prevent the molten solder 24 at the time of connection from flowing into the connecting portion 19 and the mounting portion 20.

  In particular, since the groove 21 is formed on the inner side of the ridge 22, the melted solder 24 wraps around the inner side of the groove 21 and becomes a solder pool even when the amount of solder increases at the time of solder connection. It is possible to further prevent the connection portion 19 and the mounting portion 20 from going around. In this case, it is desirable that the width dimension and the depth dimension of the groove 21 be about 0.1 to 0.2 mm larger than the diameter dimension of the lead wire 14. In this way, not only the lead wire 14 can be easily stored in the groove 21 but also the melted solder 24 can be easily wrapped around the gap between the inner wall of the groove 21 and the lead wire 14 due to a capillary phenomenon.

  Furthermore, providing the slits 23 in the ridges 22 as in the present embodiment makes it easier for the molten solder 24 to wrap around the grooves 21 in the ridges 22 than when the slits 23 are not formed. be able to.

  Further, in the configuration of the conventional electronic component, when the electronic component is further reduced in size and height, the lead wire 2 and the connection portion 4 are arranged in order to prevent the molten solder from flowing into the connecting portion 6 and the mounting portion 5. Therefore, it is necessary to reduce the solder connection area to reduce the amount of solder, which may reduce the connection reliability. However, in the present invention, since the lead wire 14 once bent upward is folded downward and soldered to the connection portion 18, the solder connection area can be increased to the full width dimension of the connection portion 18. it can. In particular, by providing the slit 23, the upper and lower width dimensions of the connecting portion 18 can be formed larger, so that it is possible to increase the solder connection area and improve the connection reliability.

  As a result, the solder 24 does not wrap around the connecting portion 19 or the mounting portion 20, the thickness of the solder of the mounting portion 20 varies, and the height of the electronic component increases, or the electronic component is mounted on the mounting board. In this case, it is possible to prevent the solder fillet from becoming large, and it is possible to obtain a small and low-profile electronic component with improved connection reliability between the lead wire 14 and the connection portion 18.

  In the present embodiment, the slit 23 is provided on the upper end side of the ridge portion 22, but it may be provided on the lower end side, and the lead wire 14 is once bent downward so that the base side of the lead wire 14 is the ridge. The lead wire 14 is housed in the groove 21, and the end side of the lead wire 14 is turned upward by inserting the slit 23, and is disposed on the connecting portion 18 on the side opposite to the connecting portion 19 when viewed from the protruding portion 22. Even when soldered, the same effects can be obtained.

  In this embodiment, the coil is used as the circuit element. However, even when a resistor, a capacitor, or the like is used as the circuit element, the same effect can be obtained.

  The electronic component according to the present invention is industrially useful because it can obtain a small and low-profile electronic component that does not increase the height dimension of the electronic component due to variations in the solder thickness of the mounting portion. is there.

DESCRIPTION OF SYMBOLS 11 Circuit element 12 Exterior part 13 Electronic component main body 14 Lead wire 15 Terminal 16 Coil 17 Tapered part 18 Connection part 19 Connection part 20 Mounting part 21 Groove 22 Projection part 23 Slit 24 Solder

Claims (2)

An electronic component main body comprising a circuit element and an exterior portion of the circuit element, a lead wire for the circuit element protruding from a side surface of the electronic component main body, and a terminal obtained by processing a metal plate, wherein the terminal is the drawer A connecting portion that is disposed on a side surface from which the wire is projected and connected to the lead wire; a connecting portion that is disposed on a side surface adjacent to the side surface on which the connecting portion is disposed and is connected to the connecting portion; and a lower surface of the electronic component main body And a mounting portion connected to the connecting portion via the connecting portion, and the connecting portion is provided with a protruding portion that protrudes outward and has a groove on the inner side in the vertical direction. An electronic component in which a base side of the lead wire is housed in a groove of a part, and an end portion of the lead wire is solder-connected to the connection portion on the side opposite to the connecting portion when viewed from the protruding line portion. The electronic component according to claim 1, wherein a slit having a width wider than a diameter dimension of the lead wire is formed on a side opposite to the connecting portion side of the protruding portion.

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