JP2012059735A - Component mounting method and component mounting apparatus - Google Patents

Abstract

A component is sucked and held at an accurate position by a nozzle and mounted.
A plurality of nozzles arranged in a matrix in a head and having a suction hole 123 having a negative pressure on the inside are brought into contact with the component to suck and hold the component, thereby holding the component in a holding state. A component mounting method in which the component 200 is mounted on the substrate 300 and mounted, and the imaging means 106 images a two-dimensional region including the tip surface 124 of the nozzle 121 that does not hold the component 200, and the obtained image data 400 is used. A dark color region 212 corresponding to the opening 125 of the suction hole 123 arranged on the front end surface 124 is specified by image processing, and the position reference when the nozzle 121 sucks a component based on the specified dark color region 212 is used. A suction point B (121B) of the nozzle 121 is derived.
[Selection] Figure 6

Description

  The present invention relates to a component mounter that sucks and holds a component from a component supply unit by a head including a plurality of nozzles, conveys the held component to the upper side of the substrate, and mounts the component on the substrate, and the component The present invention relates to a component mounting method realized by a mounting machine, and more particularly, to a component mounting machine for mounting a micro component having electrodes at both ends, and a component mounting method realized by the component mounting machine.

  2. Description of the Related Art Conventionally, there is a component mounting machine in which a component supplied to a component supply unit is sucked and held by a nozzle, the component is transported to the upper part of the substrate, and the component is lowered and attached to the substrate.

  In recent years, electronic components have been downsized along with downsizing of electronic devices. For example, small electronic parts, for example, electronic parts whose side length is less than 1 mm, such as 1005, 0603, 0402, and the like, have appeared. Accordingly, the diameter of the tip of the nozzle for sucking the small electronic component is also reduced, and it is necessary to position the nozzle with high positional accuracy to suck the small electronic component.

  For example, the invention described in Patent Document 1 captures the inclination of the nozzle relative to the rotation axis by capturing an image of the nozzle holding the electronic component from the electronic component side in the direction of the rotation axis of the nozzle and analyzing the image. As a result, the occurrence of pick-up mistakes due to misalignment between the nozzle and the electronic component is suppressed.

  In the invention described in Patent Document 2, the inclination of the nozzle with respect to the rotation axis is grasped by directly imaging the tip of the nozzle and analyzing the image.

  Furthermore, in the invention described in Patent Document 3, a flange for recognizing the position of the nozzle is provided in the vicinity of the tip of the nozzle, and by imaging the flange, the positional relationship between the rotation axis of the nozzle and the tip of the nozzle is obtained. I know.

  With these technologies, the position of the tip of the nozzle can be accurately grasped, and it is said that it can be sucked and held and mounted with high positional accuracy of a small electronic component.

JP 2002-57496 A JP-A-6-232599 JP 2003-124696 A

  However, recent component mounters often include a head in which a plurality of nozzles are arranged in a matrix in order to ensure high productivity. When imaging the tip of a nozzle provided in such a head, it is possible to image the tip of the nozzle at a higher speed if illuminated with high illuminance, but halation occurs due to reflected light from other nozzles, and the nozzle It becomes difficult to accurately image the contour of the tip of the. On the other hand, if the illuminance is reduced to suppress halation, it takes time for imaging, and a lot of noise is generated in the image, so that it takes time to analyze the image.

  Furthermore, in order to attract and hold small electronic components, the nozzle may have a tapered portion at the tip that narrows toward the tip. Depending on the illumination intensity and irradiation angle for imaging, the nozzle may be affected by the taper surface. It may be difficult to accurately grasp the contour of the nozzle tip surface.

  In this manner, when the component mounting machine does not accurately grasp the position of the nozzle front end surface and the component is sucked and held or mounted, the nozzle is biased with respect to the electronic component as shown in FIG. A load is applied, and electronic components may be damaged or broken.

  The present invention has been made in view of the above-mentioned problems, and has a head in which a plurality of nozzles are arranged, and picks up and holds small electronic components with high accuracy by mounting and imaging the nozzle tip. An object of the present invention is to provide a component mounting machine and a component mounting method that can be used.

  In order to achieve the above object, a component mounting method according to the present invention is a component mounting method in which a plurality of nozzles are arranged in a matrix on a head and a tip end surface of a nozzle having a suction hole with a negative pressure inside is brought into contact with the component. An imaging step in which an imaging unit images a two-dimensional region including a tip end surface of the nozzle that does not hold the component. And a dark color region specifying step for specifying a dark color region corresponding to the opening of the suction hole arranged on the tip surface by image processing from the image data obtained by the imaging step, and a dark color region specifying step. And a suction point deriving step for deriving a suction point as a reference on the position when the nozzle sucks the component based on the dark color area.

  As a result, image processing can be performed based on the high contrast between the inside of the opening and the tip surface of the nozzle corresponding to the outer peripheral edge of the opening, so that the suction point of the nozzle can be specified with high accuracy. It becomes. Therefore, a small component can be adsorbed at an accurate position and can be mounted at an accurate position. Further, for example, in the case of a small component provided with electrodes at both ends, the end face of the nozzle can be brought into contact with the electrodes at both ends evenly, and the small component is sucked and held with an equal load and mounted on the substrate. Therefore, it is possible to avoid the loss of parts due to an unbalanced load during suction or mounting.

  Furthermore, when performing the said imaging step, you may include the illumination step which illuminates the front-end | tip of the said nozzle by 40% or more of the maximum brightness | luminance of the illumination means with which the said component mounting machine is equipped.

  According to this, since the front end surface of the nozzle that hits the outer peripheral edge of the opening can be imaged with high luminance, the imaging process can be performed at high speed. Therefore, it becomes possible to contribute to the improvement of the production efficiency of component mounting. On the other hand, when the tip of the nozzle is illuminated with high brightness, halation may occur, or image defects such as noise and disturbance may occur in image data obtained by imaging due to reflection from other nozzles. In the case of the present invention, since the image processing is performed on the dark color region, the image processing can be performed ignoring the defect of the image data due to the high-luminance illumination, and the suction point can be derived with high accuracy. .

  Further, based on the rotation center of the nozzle, the rotation phase of the nozzle during the imaging step, and the suction point, an eccentricity that calculates an eccentric value that is a deviation of the suction point from the rotation center in the rotation phase. A value calculating step and a correcting step of correcting the mounting position of the component with the eccentric value based on the rotational phase of the nozzle.

  Thus, even when a component having a predetermined angle is rotated from the suction state and mounted on the substrate, the component can be mounted at an accurate position by correction based on the eccentricity value.

  Furthermore, a dark color shape specifying step that specifies a dark color shape that is information related to the shape of the dark color region specified in the dark color region specifying step, and an opening shape acquisition step that acquires an opening shape that is information related to the shape of the opening. A suitability determining step of creating suitability information, which is information regarding whether or not the nozzle can be applied to mounting, by comparing the dark color shape with the opening shape, may be included.

  According to this, on the basis of the shape of the dark color region, it is possible to accurately create suitability information, which is information on whether or not the nozzle can be applied to mounting, such as clogging of the opening portion or chipping of the nozzle tip surface. It is possible to accurately determine whether or not automatic replacement or maintenance is to be performed.

  In order to achieve the above object, a component mounting machine according to the present invention includes a nozzle having suction holes that have negative pressure inside, and a head in which a plurality of the nozzles are arranged in a matrix. A component mounting machine that abuts the tip surface of a nozzle against a component to suck and hold the component, and mounts and mounts the held component on a substrate, the tip surface of the nozzle not holding the component An imaging unit that captures a two-dimensional area including the image, and a dark color region specifying unit that specifies, from the image data obtained by the imaging unit, a dark color region corresponding to the opening of the suction hole disposed on the tip surface by image processing And an adsorption point deriving unit for deriving an adsorption point serving as a reference on the position when the nozzle adsorbs the component based on the dark color region specified by the dark color region specifying unit.

  As a result, image processing can be performed based on the high contrast between the inside of the opening and the tip surface of the nozzle corresponding to the outer peripheral edge of the opening, so that the suction point of the nozzle can be specified with high accuracy. It becomes. Therefore, a small component can be adsorbed at an accurate position and can be mounted at an accurate position. Further, for example, in the case of a small component provided with electrodes at both ends, the end face of the nozzle can be brought into contact with the electrodes at both ends evenly, and the small component is sucked and held with an equal load and mounted on the substrate. Therefore, it is possible to avoid the loss of parts due to an unbalanced load during suction or mounting.

  Note that executing a program for causing a computer to execute each process included in the component mounting method also corresponds to the implementation of the present invention. Of course, implementing the recording medium in which the program is recorded also corresponds to the implementation of the present invention.

  According to the present invention, since the suction point of the nozzle can be derived at high speed and accurately, the bias of the impact load generated at the time of suction or mounting of the component is suppressed, and the loss or damage of the small component is avoided. It becomes possible.

FIG. 1 is a perspective view schematically showing a component mounting machine. FIG. 2 is a perspective view showing a head, imaging means, and the like. FIG. 3 is a diagram illustrating the head, the imaging unit, and the like from the front (Y-axis direction). FIG. 4 is a side view showing the nozzle virtually cut in the XZ plane. FIG. 5 is a bottom view showing the nozzle from below. FIG. 6 is a block diagram showing the functional unit of the component mounting machine together with the mechanism unit. FIG. 7 is a block diagram showing each functional unit in the image processing means. FIG. 8 is a diagram visually showing image data picked up by the image pickup means. FIG. 9 is a flowchart showing the flow of the component mounting method. FIG. 10 is a diagram showing a state immediately before the nozzle picks up the component with a part cut away from the side surface. FIG. 11 is a diagram showing a state immediately before adsorbing a component based on the positional information of the rotation center axis, with a part cut away from the side surface. FIG. 12 is a flowchart showing a flow of determining whether or not a nozzle is appropriate. FIG. 13 is a diagram visually showing image data. FIG. 14 is a flowchart showing a flow of correction by component rotation. FIG. 15 is a diagram visually showing the rotation center and the suction point in the image data. FIG. 16 is a diagram showing the nozzle in a state where the component is sucked from below, with the suction point and the rotation center virtually added. FIG. 17 is a diagram illustrating the nozzle in a state where the component is sucked from below, and is a diagram in which the suction point and the rotation center are virtually added, and illustrates a state where the nozzle is rotated by 90 degrees.

  Next, an embodiment of a component mounting machine according to the present invention will be described, and an embodiment of a component mounting method using the component mounting machine will be described.

FIG. 1 is a perspective view schematically showing a component mounting machine.
As shown in the figure, the component mounter 100 according to the present embodiment causes the tip surface of the nozzle 121 to abut against the component 200 to suck and hold the component, and mounts the held component 200 on the substrate 300. A device to be mounted, which includes a nozzle 121, a head 102, an imaging unit 106, and an illumination unit 107. Further, the component mounter 100 is the basis of the component mounter 100, the X beam 103 that guides the head 102 in the X-axis direction, the Y beam 104 that guides the X beam 103 in the Y-axis direction, and the component mounter 100. And a base 105.

  A number of tape feeders 110 are arranged in the component supply unit 101 side by side. The tape feeder 110 is detachably attached to the component mounter 100, respectively. A carrier tape 111 that is supplied while being wound around a reel 112 is attached to the tape feeder 110.

FIG. 2 is a perspective view showing a head, imaging means, and the like.
FIG. 3 is a diagram illustrating the head, the imaging unit, and the like from the front (Y-axis direction).

  The head 102 is an apparatus for freely moving in the XY plane, sucking and holding the component 200 from the component supply unit 101, transporting it, and mounting the component 200 on the substrate. And driving means 122 that reciprocates independently in the Z-axis direction. The head 102 also includes second drive means (not shown) that rotates the nozzle 121 in the θ direction (see FIG. 2).

FIG. 4 is a side view showing the nozzle virtually cut in the XZ plane.
FIG. 5 is a bottom view showing the nozzle from below.

  The nozzle 121 is a member having a suction hole 123 in which the inner pressure is negative. The nozzle 121 is a cylindrical member that holds the component 200 directly by holding the component by sucking and holding the tip surface 124 of the nozzle 121 to the component. . In the case of the present embodiment, the tip of the nozzle 121 has a tapered shape whose diameter is reduced toward the tip. This is because the small component 200 (for example, an electronic component called 1005, 0603, 0402) is sucked by the nozzle 121. The nozzle 121 is rotated in the θ direction by the second driving means (not shown) around the rotation center axis A shown in FIG. In FIG. 4, the rotation center axis A is described so as to pass through the center of the nozzle 121, but the nozzle 121 includes a suction hole 123 that is eccentric with respect to the rotation center axis A, or the nozzle 121. It is uncertain, for example, when it is inclined with respect to the rotation center axis A.

  The suction hole 123 is a hole connected to a vacuum device (not shown) included in the component mounting machine 100 via a vacuum path. When the component 200 is sucked and held, the inside of the suction hole 123 is negative. When the component 200 is mounted on the substrate 300 while maintaining the pressure (pressure lower than atmospheric pressure), the inside of the suction hole 123 is switched from negative pressure to positive pressure (pressure higher than atmospheric pressure). . In the case of the present embodiment, as shown in FIG. 5, the shape of the opening 125 of the suction hole 123 located on the tip surface 124 of the nozzle 121 in order to efficiently suck the small component 200 is circular, The shape is a combination of an ellipse whose width is narrower than the diameter.

  The imaging unit 106 is an apparatus that captures an image of a two-dimensional region including the tip surface 124 of the nozzle 121 in a state where the component 200 is not held. Specifically, it is a device for digitally obtaining an image using a semiconductor element array such as a CCD camera or a CMOS camera. In the case of the present embodiment, the imaging means 106 is attached to the upper surface of the base 105 with the imaging direction facing upward so that the tip surface of the nozzle 121 can be imaged from below the nozzle 121.

  The illumination unit 107 is a device that irradiates light at the tip of the nozzle 121 and sets the brightness near the tip surface 124 so that it can be imaged. In the case of the present embodiment, the illumination unit 107 includes an LED having an optical axis from the lower side of the front end surface 124 toward the front end surface 124, and the LEDs are arranged on the circumference of the outer peripheral edge of the imaging unit 106. A plurality are provided. Further, the illumination means 107 is variable in luminance, and can arbitrarily set the luminance in 256 steps from the state where the luminance is 0 to the maximum luminance of 255.

  In the case of the present embodiment, the component mounter 100 includes a set of imaging means 106 and illumination means 107 and images the tip surface 124 of the nozzle 121 one by one. Alternatively, a plurality of sets of illumination means 107 may be provided, and the tip surfaces 124 of the plurality of nozzles 121 may be imaged simultaneously.

  This is preferable because the operation of deriving each suction point in the plurality of nozzles 121 can be shortened.

FIG. 6 is a block diagram showing the functional unit of the component mounting machine together with the mechanism unit.
FIG. 7 is a block diagram showing each functional unit in the image processing means.

FIG. 8 is a diagram visually showing image data picked up by the image pickup means.
As shown in the figure, the component mounter 100 includes an image processing unit 131, a control unit 132, an illuminance adjusting unit 133, and a holding unit 134 as functional units. In the case of the present embodiment, the image processing unit 131, the control unit 132, and the illuminance adjustment unit 133 are processing units realized by an arithmetic device (computer) and a program, and holding unit 134 that holds data and the like. Is a storage device such as a hard disk. In addition, each may exist as an independent apparatus.

  The image processing unit 131 is a processing unit that performs various processing based on the image data 400 obtained by the imaging unit 106. In the case of the present embodiment, as shown in FIG. A derivation unit 142, an eccentricity value calculation unit 143, a correction instruction unit 144, a dark color shape identification unit 145, and a suitability determination unit 146 are provided.

  The dark color area specifying unit 141 is a processing part that specifies, from the image data 400 obtained by the imaging unit 106, the dark color area 212 corresponding to the opening 125 arranged on the front end surface 124 by image processing. For example, the dark color area specifying unit 141 specifies a dark color area 212 by setting a threshold value related to luminance and binarizing the image data 400.

  The suction point deriving unit 142 is based on the dark color region 212 specified by the dark color region specifying unit 141, and serves as a reference for the position when the nozzle 121 picks up the component 200. Derived from circle). For example, when there are electrodes 203 at both ends (X-axis direction) as in the gravity center of the dark color region 212 or the small component 200 shown in FIG. 10, the suction points 121B of the nozzle 121 in the both-end electrode direction (X-axis direction) The position may be the suction point 121B having the center of the length F1 in the longitudinal direction of the opening 125 of the nozzle 121 as the center with respect to the both-end electrode direction (X-axis direction) of the component 200.

  The eccentric value calculation unit 143 holds the rotation center point 121A of the nozzle 121 (the intersection of the rotation center axis A and the tip surface 124 in FIG. 4) and the rotation phase of the nozzle 121 when the image data 400 is obtained. 134 and the control means 132, the adsorption point 121B derived by the adsorption point deriving unit 142 is obtained, and an eccentricity value that is a deviation from the rotation center point 121A of the adsorption point 121B linked to the rotation phase is calculated. Is a processing unit. In the case of the present embodiment, the information obtained by associating the rotation center point 121A with the coordinates of the adsorption point 121B on the XY plane and the rotation phase is the eccentric value.

  When the component 200 sucked and held by the nozzle 121 is mounted by rotating the nozzle 121 by a predetermined angle, the correction instruction unit 144 calculates the eccentricity calculated by the eccentric value calculation unit 143 based on the rotation phase when the nozzle 121 is mounted. This is a processing unit that gives an instruction to the control means 132 to correct the mounting position of the component by value.

  The dark color shape specifying unit 145 is a processing unit that specifies a dark color shape that is information related to the shape of the dark color region 212 specified by the dark color region specifying unit 141. Here, the dark color shape may be, for example, one-dimensional information such as the length in the X-axis direction and the length in the Y-axis direction of the specified dark color region 212, or two-dimensional information such as the area of the dark color region 212. But you can. Further, the shape of the periphery of the dark color area 212 may be used.

  The suitability determination unit 146 compares the dark color shape with the opening shape that is information indicating the shape of the opening 125 that is specified in advance as a reference, thereby determining whether the nozzle 121 can be applied to mounting. It is a processing unit that creates suitability information. In the case of the present embodiment, the suitability determination unit 146 transmits the information to the control means 132 only when the information of rejection is created. In addition, when the information of “No” is created, for example, when the area of the dark color shape is too large with respect to the opening shape, it is considered that the tip of the nozzle 121 is missing, so the information of “No” is created. On the other hand, when the area of the dark color shape is too small, it is considered that the opening 125 is clogged.

  The control unit 132 determines the position of the mechanism unit included in the component mounting machine 100 such as the head 102, the nozzle 121, the X beam 103, and the Y beam 104 by controlling the driving unit 122, the second driving unit 126, and the like. It is a processing unit that can grasp the current position of each mechanism unit. Specifically, the position of the mechanism unit is grasped based on information obtained from the drive unit 122, the second drive unit 126, and the like or an encoder provided in the mechanism unit. Further, the control unit 132 can accurately move the nozzle 121 to a position C (see FIG. 11) where the component 200 is to be sucked based on the suction point acquired from the image processing unit 131.

  The illuminance adjusting unit 133 is a processing unit that can change the intensity of light emitted from the illumination unit 107 and determine the intensity of light suitable for image processing based on the image data 400 obtained at each intensity. However, in the case of the present embodiment, the illuminance adjusting unit 133 controls the illuminating unit 107 to emit light with a predetermined value, for example, a value selected from a range of 100 or more and 250 or less (220 or the like).

  The holding unit 134 is a device that stores various types of information. Examples of the information stored in the holding unit 134 include nozzle information 135 in which a nozzle type that is information indicating the type of the nozzle 121 and an opening shape that indicates the shape of the opening 125 of the nozzle 121 are associated with each other.

Next, a component mounting method using the component mounter 100 will be described.
FIG. 9 is a flowchart showing the flow of the component mounting method.

  First, the nozzle 121 to be measured is moved above the imaging means 106 (S101: moving step).

  Next, the illuminance adjusting unit 133 sets the luminance of the light of the illuminating unit 107 to 40% or more of the maximum luminance of the illuminating unit 107 (preferably 40% to 98% of the maximum luminance, more preferably 45% of the maximum luminance). The tip of the nozzle is illuminated at 93% or less. If illumination is performed at such a brightness level, good image data 400 can be acquired in about 3 msec. Thereby, the time required for the imaging process can be shortened, and the production efficiency of the component mounting machine 100 can be improved.

  In the case of the present embodiment, the maximum luminance is 255, and thus illumination may be performed with a value of approximately 100 or more. On the other hand, if the luminance is set to be larger than 250 (98% of the maximum luminance), the possibility that light will enter another camera included in the component mounter 100 is not preferable. Specifically, illumination is performed with the luminance fixed at 220 (88% of the maximum luminance) (S104: illumination step).

  Next, the illumination unit 107 illuminates the tip of the nozzle 121 with a predetermined brightness (for example, 220) in the illumination step (S104), and the imaging unit 106 images a two-dimensional region including the tip surface 124 of the nozzle 121 ( S107: Imaging step).

  In FIG. 8, the dark color region 212 is an image showing the opening 125, and the light color region 213 is an image showing the tip surface 124 other than the opening 125 and the tapered portion of the nozzle 121. In addition, since the image data 400 is represented by a diagram in the figure, the boundary is clear, but in the actual image data 400, the boundary is unclear. In particular, the light color region 213 includes a tapered portion and thus becomes a very blurred boundary.

  Next, from the image data 400 obtained in the imaging step S104, the dark color area specifying unit 141 specifies the dark color area 212 that is an area indicating the opening 125 by image processing (S110: dark color area specifying step).

  In specifying the dark color region 212, an image such as the edge of the tip of the nozzle 121 of the obtained image data 400 may be blurred due to halation or the like, but the suction hole 123 is narrow and long in the Z-axis direction (see FIG. 3), the image of the opening 125 is stably dark with little influence on the luminance of the illumination means 107. Therefore, even if a simple binarized image processing method is adopted for the dark color area 212 image processing, the dark color area 212 can be specified stably and accurately by extracting the dark color area 212.

  For example, since the non-opening portion 125 has a relatively high reflectance, the obtained image data 400 has a high luminance except for the dark color region 212. On the other hand, the opening 125 has a stable dark color. Therefore, by binarizing the image data 400 with a predetermined luminance as a threshold value, the dark color area 212 can be searched and specified easily and accurately.

  Next, based on the specified dark color region 212, the suction point deriving unit 142 derives a suction point 121B that serves as a positional reference when the nozzle 121 sucks and mounts the component 200 (S113: derivation step). Specifically, the suction point deriving unit 142 obtains the center of gravity (or center) of the dark color region 212 in the image data 400. On the other hand, position information (position information of the rotation center point 121A of the nozzle 121) on the XY plane of the tip surface 124 of the nozzle 121 of the rotation center axis A of the nozzle 121 at the time of imaging is acquired from the control unit 132. Then, from these two data, a suction point 121B serving as a reference for the position on the XY plane of the tip surface 124 of the nozzle 121 when the nozzle 121 sucks and mounts the component 200 is derived.

  In the case of the present embodiment, the above process is repeated so that the suction points 121B can be derived for the eight nozzles 121, respectively.

  FIG. 10 is a diagram showing a state immediately before the nozzle sucks a part, with a part cut away from the side surface (Y-axis direction).

  FIG. 11 is a diagram showing a state immediately before adsorbing a component based on position information of the rotation center axis, with a part cut away from the side surface (Y-axis direction).

  If the component mounting method is applied using the component mounting machine 100, the nozzle 121 is inclined or bent as shown in FIG. 10, so that the rotation center axis A and the center of gravity of the opening 125 of the suction hole 123 are Even when the suction point B (121B) is deviated and / or because the suction hole 123 is eccentric with respect to the nozzle 121 due to a malfunction during processing, the suction center B and the suction center B are attracted. Even when the point B is deviated, the component mounting machine 100 accurately grasps the position of the suction point B (121B), so the center position C and the suction point B (121B) of the component 200 are determined. It is possible to accurately match in the XY plane. Therefore, the nozzle 121 can apply a load evenly to the component 200, and it is possible to avoid the loss or breakage of the component 200.

  Specifically, when the diameter of the tip surface 124 of the nozzle 121 is 0.3 mm and the component 200 is a small component referred to as 1005, the nozzle 200 is used to dispose the component 200 without adopting the present invention. When sucked, a mistake (of the component 200) occurs when the suction point B (121B) is deviated from the rotation center point 121A of the rotation center axis A and / or the center of the tip surface 124 of the nozzle 121 (center of the nozzle outer shape). The probability of occurrence of deficiency and adsorption, standing adsorption, etc.) was 0.02%, but by adopting the present invention, it is not possible to confirm a mistake as a result of adsorbing 10,000 parts 200 It was.

Next, the step of determining whether or not the nozzle 121 can be applied for mounting will be described.
FIG. 12 is a flowchart showing a flow of determining whether or not a nozzle is appropriate.

  First, the dark color shape specifying unit 145 specifies a dark color shape, which is information regarding the shape of the dark color region 212 specified in the dark color region specifying step (S110) (S201: dark color shape specifying step).

  Here, for example, as shown in FIG. 13, the dark color shape is the longest length F1 (longitudinal length) in the X-axis direction of the dark color region 212 or the longest length F2 (short) in the Y-axis direction. The length in the hand direction), the area S of the dark area, and the like. A combination of these pieces of information also has a dark color shape.

  Next, the suitability determination unit 146 acquires an opening shape that is information related to the shape of the opening 125 from the nozzle information 135 held in the holding unit 134 (S204: opening shape acquisition step).

  Here, the opening shape is the actual shape of the opening 125 of the nozzle 121, and is the longest length F1 in the X-axis direction, which is the dark color shape, the longest length F2 in the Y-axis direction, the area S, and the like. It is data corresponding to. The opening shape may be a design value or an actual measurement value.

  Next, the suitability determination unit 146 determines whether the nozzle 121 can be applied to mounting by acquiring the dark color shape from the dark color shape specifying unit 145 and comparing it with the opening shape (S207: suitability determination step).

  For example, the suitability determination unit 146 determines suitability based on the longest length F1 of the dark color region 212 in the X-axis direction. That is, when F1 is longer than the corresponding opening shape (when it is longer than the error range generated by image analysis), it is determined that the tip of the nozzle 121 is missing or damaged. When F1 is shorter than a predetermined length (for example, 90% of the opening shape), it is determined that the nozzle 121 is clogged beyond the allowable range.

  In addition, the suitability determination unit 146 may make these determinations regarding F2 and S, and may comprehensively determine suitability.

  As described above, when the suitability determination unit 146 determines NO, the suitability information indicating NO is created (S210: information creation step).

  Note that in this embodiment, only the information of “no” is created as the suitability judgment information, but only the appropriate information may be created as the suitability judgment information, and any information of suitability is created according to the judgment. It doesn't matter.

  When the control unit 132 acquires the above suitability information, it is possible to replace the nozzle 121 or to notify that a problem has occurred in the nozzle 121. As a result, it is possible to avoid the occurrence of problems in the component mounting machine 100 and improve the yield of the mounting board manufacturing.

  Next, a description will be given of steps relating to correction when the component 200 held by suction is mounted after being rotated by a predetermined angle.

FIG. 14 is a flowchart showing a flow of correction by component rotation.
First, the eccentricity value calculation unit 143 sets the rotation center point A (121), which is the position on the XY plane of the rotation center axis A, and the reference position (for example, the nozzle 121) of the nozzle 121 when imaged in the imaging step (S107). A reference position or the like determined by a servo motor for rotation, and a position arbitrarily determined with respect to the head 102. Specifically, the longitudinal direction (X-axis direction) of the X beam 103 and the longitudinal direction of the suction hole 123 The rotation phase, which is information indicating the rotation angle from the position where the directions are parallel, etc.) is acquired from the control means 132. Further, the eccentric value calculation unit 143 acquires the adsorption point B (121B) from the adsorption point deriving unit 142 (S301: acquisition step). And the eccentric value calculation part 143 calculates the eccentric value which is a shift | offset | difference from the rotation center A of the adsorption | suction point B (121B) in the acquired rotational phase (S304: Eccentric value calculation step).

  Next, when the rotational phase of the nozzle 121 when mounting the component 200 is different from the rotational phase of the nozzle 121 when the component 200 is sucked and held, the control means 132 is calculated by the eccentricity value calculation unit 143. The component mounting position is corrected based on the eccentric value (S307: correction step).

  Specifically, for example, as shown in FIG. 15, the eccentric value calculation unit 143 calculates the correction value as polar coordinates with the rotation center point A (121A) of the nozzle 121 as the origin. Then, the component mounting machine 100 sucks and holds the component 200 with the nozzle 121 by the component supply unit 101 as shown in FIG. 16, and the component 200 sucked and held by the nozzle 121 as shown in FIG. In the case of mounting with rotation, the component 200 is mounted on the board 300 based on the position in consideration of the correction value indicated by polar coordinates.

  As described above, it is possible to mount the component 200 at an accurate position by calculating the eccentric value and performing correction corresponding to the rotation of the component 200.

  The eccentricity value is not limited to polar coordinates, and can be expressed by any method such as orthogonal coordinates.

  Further, when the suction point 121B of the nozzle 121 is derived, when the component 200 is sucked from the component supply unit 101 or when the component 200 is mounted (mounted) on the board 300, the suction and mounting heights, and / or Or you may carry out with the attitude | position of the adsorption | suction or mounting | wearing. As a result, even if the rotation center point 121A and the suction point 121B are different due to the displacement of the nozzle 121 or the like, it can be derived as the suction point 121B of the nozzle 121 in consideration of the eccentric value with respect to the rotation center point 121A. Therefore, it is possible to hold and mount a small electronic component with high positional accuracy.

The present invention is not limited to the above embodiment. For example, another embodiment realized by arbitrarily combining the components described in this specification may be used as an embodiment of the present invention. In addition, the present invention also includes modifications obtained by making various modifications conceivable by those skilled in the art without departing from the gist of the present invention, that is, the meanings indicated in the claims. included.

  The present invention can be applied to a mounting board production process in which an electronic component is mounted on a surface of a printed board or the like to manufacture a mounting board.

DESCRIPTION OF SYMBOLS 100 Component mounting machine 101 Component supply part 102 Head 103 X beam 104 Y beam 105 Base 106 Imaging means 107 Illumination means 110 Tape feeder 111 Carrier tape 112 Reel 121 Nozzle 121A Rotation center point 121B Adsorption point (virtual)
122 driving means 123 suction hole 124 tip surface 125 opening 126 second driving means 131 image processing means 132 control means 133 illuminance adjustment means 134 holding means 135 nozzle information 141 dark color area specifying part 142 suction point deriving part 143 eccentricity value calculating part 144 Correction instruction unit 145 Dark color shape specifying unit 146 Suitability determining unit 200 Parts 212 Dark color region 213 Light color region 300 Substrate 400 Image data

Claims (5)

A plurality of nozzles are arranged in a matrix on the head, the tip of the nozzle having suction holes with negative pressure on the inside is brought into contact with the component to suck and hold the component, and the held component is mounted on the board and mounted A component mounting method for
An imaging step in which an imaging means images a two-dimensional region including the tip surface of the nozzle not holding the component;
From the image data obtained by the imaging step, a dark color region specifying step for specifying a dark color region corresponding to the opening of the suction hole arranged on the tip surface by image processing;
A component mounting method comprising: a suction point deriving step for deriving a suction point that serves as a reference on the position when the nozzle sucks the component based on the dark color region specified in the dark color region specifying step. further,
The component mounting method according to claim 1, further comprising: an illuminating step of illuminating a tip of the nozzle with 40% or more of a maximum luminance of an illuminating unit included in the component mounting machine when performing the imaging step. further,
Based on the rotation center of the nozzle, the rotation phase of the nozzle during the imaging step, and the suction point, an eccentric value calculation that calculates an eccentric value that is a deviation of the suction point from the rotation center in the rotation phase. Steps,
The component mounting method according to claim 1, further comprising: a correction step of correcting the mounting position of the component with the eccentric value based on the rotation phase of the nozzle. further,
A dark color shape specifying step for specifying a dark color shape which is information relating to the shape of the dark color region specified in the dark color region specifying step;
An opening shape obtaining step for obtaining an opening shape which is information on the shape of the opening;
The component mounting according to claim 1, further comprising: determining whether or not the nozzle is applicable to mounting by determining whether the nozzle is applicable for mounting by comparing and determining the dark color shape and the opening shape. Method. A nozzle having a suction hole with a negative pressure inside, and a head in which a plurality of nozzles are arranged in a matrix, the tip surface of the nozzle is brought into contact with the component, and the component is sucked and held, and the holding state A component mounter for mounting and mounting the component on a board,
An imaging means for imaging a two-dimensional region including a tip surface of the nozzle not holding the component;
From the image data obtained by the imaging means, a dark color region specifying unit for specifying a dark color region corresponding to the opening of the suction hole arranged on the tip surface by image processing;
A component mounting machine comprising: a suction point deriving unit for deriving a suction point serving as a reference on the position when the nozzle sucks the component based on the dark color region specified by the dark color region specifying unit.

Images