JP2012049278A - Method for manufacturing electrothermal separation type light-emitting diode bracket - Google Patents

Abstract

A light-emitting diode chip having different specifications can be disposed on a heat dissipation base.
The heat dissipation is maintained by forming at least two heat dissipating bases and at least two sets of conductive brackets by coupling the heat dissipating plate and the bracket plate. The other maintains thermoelectric separation by forming at least two heat dissipation bases and at least two sets of conductive brackets from a thick sheet.
[Selection] Figure 3

Description

The present invention relates to a method of manufacturing a light emitting diode bracket, and more particularly, at least two heat dissipating bases and at least two sets of conductive brackets are formed by coupling a heat dissipating plate and a bracket plate, or at least 2 by a thick sheet. The present invention relates to a method of manufacturing a thermoelectric separation type light emitting diode bracket in which light emitting diode chips having different specifications can be arranged on the heat dissipation base by forming two heat dissipation bases and at least two sets of conductive brackets.

The recent light emitting diode (LED) has advantages such as low power consumption, long life of the light emitting element, no idling time, and high response speed, and its volume is small. Strong vibration resistance and good mass productivity. Information lamps and display devices for information, communication and consumer electronics products such as screen backlights for mobile phones and personal digital assistants (PDAs) Widely used for outdoor displays, traffic signal lights, vehicle lamps, and the like.

FIG. 1 is a cross-sectional view of a first conventional light emitting diode bracket, and a normal light emitting diode chip 85 is formed by surface mount technology (SMD) or flip chip bonding technology. It is fixed to the bracket 83 in the colloid bottom seat 81 having a recess.
At least two brackets 83 are embedded in the colloid bottom seat 81 including the recess 82, and a part of each bracket 83 is exposed to the recess 82 of the colloid bottom seat 81, and the other part of them is the colloid bottom seat 81. By extending from both sides, an electrical connection portion 84 can be formed, and the electrical connection portion 84 is electrically connected to another electronic device (not shown).

Then, the light-emitting diode chip 85 is fixed to one bracket 83 exposed in the concave portion 82 of the colloid bottom seat 81 by surface mounting technology, and light is emitted through the electric conductor 86 by wire bonding technology or flip chip bonding technology. The diode chip 85 is electrically connected to the other bracket 83. Finally, the package colloid 87 is formed in the recess 82 of the colloid bottom base 81 so that the package colloid 87 covers the light emitting diode chip 85 and the bracket 83 in the recess 82.

However, the above-described conventional light emitting diode bracket has the following problems. The bracket 83 to which the light-emitting diode chip 85 is fixed has a heat dissipation function and also has a multiple function for electrically connecting the light-emitting diode chip 85. Therefore, the heat dissipation efficiency of the light-emitting diode chip 85 tends to be insufficient, and high output It cannot be applied to the light emitting diode chip 85.

For this reason, the thermoelectric separation type light emitting diode bracket shown in FIG. 2 has been proposed. FIG. 2 is a plan view of a second conventional light emitting diode bracket. In a colloid bottom base 81 including a recess 82, a heat dissipation base 88 and at least two brackets 83 are embedded. 83 is exposed in the recess 82 of the colloid bottom seat 81, and the other part of each bracket 83 extends from both sides of the colloid bottom seat 81, whereby the electrical connection portion 84 can be formed. The electrical connection portion 84 is electrically connected to another electronic device (not shown).

Then, the light emitting diode chip 85 is fixed to the heat radiation base 88 exposed in the concave portion 82 of the colloid bottom base 81 by surface mounting technology, and the light emitting diode is connected via the electric conductor 86 by wire bonding technology or flip chip bonding technology. The chip 85 is electrically connected to the bracket 83. Finally, by forming the package colloid 87 in the recess 82 of the colloid bottom base 81, the package colloid 87 covers the light emitting diode chip 85, the heat dissipation base 88 and the bracket 83 in the recess 82.

In the second conventional light emitting diode bracket described above, the heat dissipation base 88 and the bracket 83 are embedded in the colloid bottom base 81, whereby the heat dissipation and electrical connection of the light emitting diode chip 85 can be separated. That is, the heat dissipation base 88 embedded in the colloid bottom base 81 is for heat dissipation of the light emitting diode chip 85, and the bracket 83 embedded in the colloid bottom base 81 is for electrical connection of the light emitting diode chip 85. The heat dissipation efficiency of the light-emitting diode chip 85 is improved, and the problem caused by the first conventional light-emitting diode bracket can be solved.

However, the second conventional light-emitting diode bracket has only one heat-dissipating base 88 embedded in the colloid bottom base 81. However, when a plurality of light-emitting diode chips 85 are installed on the heat-dissipating base 88, the same specification (PNP type or NPN) is used. It is necessary to use a light-emitting diode chip 85 of type). That is, as long as the same light-emitting diode chip 85 with positive and negative specifications is used, a plurality of light-emitting diode chips 85 can be provided on the heat dissipation base 88, so that the use and electrical connection of the light-emitting diode chips 85 are limited.

As described above, in the conventional technology, when installing a plurality of light emitting diode chips on the heat dissipation base, it is necessary to use the light emitting diode chips having the same specifications, and there is a problem that the use of the light emitting diode chips is limited. It is necessary to devise technical means to eliminate such problems.

The present invention can solve the problem that the use of the light-emitting diode chip is restricted by using the light-emitting diode chip of the same specification when installing a plurality of light-emitting diode chips on the heat dissipation base of the prior art. An object of the present invention is to provide a method for manufacturing a thermoelectric isolation type light emitting diode bracket.

The manufacturing method of the thermoelectric isolation type light emitting diode bracket which concerns on 1st embodiment of this invention includes the following processes. That is, first, at least two heat dissipating bases are formed on the heat dissipating plate, and at least two sets of conductive brackets are formed on the bracket plate, and the heat dissipating plate and the bracket plate are coupled to each other to form at least two heat dissipating bases. At least two heat dissipating bases and at least two heat dissipating bases are not brought into contact with each other, and at least two heat dissipating bases and at least part of at least two pairs of conductive brackets are provided. Embedded in the colloid bottom seat, and at least two heat dissipating bases and a portion of at least two sets of conductive brackets are exposed in the recesses of the colloid bottom seat, and at least two sets of conductive brackets are exposed outside the colloid bottom seat. Extend to the direction.

In the manufacturing method of the thermoelectric separation type light emitting diode bracket as described above, in the step of forming at least two heat dissipation bases on the heat dissipation plate, at least two heat dissipation bases are formed by a stamping process, and at least two sets of the bracket plate are formed on the bracket plate. In the step of forming conductive brackets, at least two sets of conductive brackets are formed by a stamping process.

The method of manufacturing the thermoelectric isolation type light emitting diode bracket as described above includes at least two heat dissipating bases and at least two sets of conductive brackets embedded in a colloid bottom, and at least two heat dissipating bases and at least two sets of conductive brackets. Of the at least two heat dissipating bases so as to fix each of the light emitting diode chips in the step of exposing a part of the light emitting diode chip in the recess of the colloid bottom base and extending a part of the at least two sets of conductive brackets outward of the colloid bottom base. A portion is exposed in the recess, and an electrical connection between each of the light emitting diode chips and any set of conductive brackets partially exposed in the recess is formed, and the light emitting diode chip is covered. By further covering the package colloid in the recess of the colloid bottom, the SMD light emitting diode To form.

The manufacturing method of the thermoelectric isolation type light emitting diode bracket according to the second embodiment of the present invention includes the following steps. That is, first, two kinds of thick sheets having different thicknesses are manufactured, and at least two heat dissipating bases are formed in a thick part of the thick sheet, and at least two sets are formed in a thin part of the thick sheet. And at least two sets of conductive brackets are not brought into contact with at least two heat dissipating bases. Finally, at least two heat dissipating bases and at least two sets of the conductive brackets are colloidal. Embedded in the bottom seat, exposing at least two heat dissipating bases and a portion of at least two sets of conductive brackets in the recess of the colloid bottom seat, and extending at least a portion of the two sets of conductive brackets outward of the colloid bottom seat Let

In the manufacturing method of the thermoelectric separation type light emitting diode bracket described above, at least two heat dissipation bases are formed by a stamping process in the step of forming at least two heat dissipation bases in a thick portion of the thick sheet. In the step of forming at least two sets of conductive brackets at a small thickness and not contacting at least two sets of conductive brackets with at least two heat dissipating bases, at least two sets of conductive brackets are formed by a stamping process. Form.

The method of manufacturing the thermoelectric isolation type light emitting diode bracket as described above includes at least two heat dissipating bases and at least two sets of conductive brackets embedded in a colloid bottom, and at least two heat dissipating bases and at least two sets of conductive brackets. Of the at least two heat dissipating bases so as to fix each of the light emitting diode chips in the step of exposing a part of the light emitting diode chip in the recess of the colloid bottom base and extending a part of the at least two sets of conductive brackets outward of the colloid bottom base. A portion is exposed in the recess, and an electrical connection between each of the light emitting diode chips and any set of conductive brackets partially exposed in the recess is formed, and the light emitting diode chip is covered. By further covering the package colloid in the recess of the colloid bottom, the SMD light emitting diode To form.

Although the manufacturing method according to the present invention has been described above, the differences from the prior art are as follows. That is, one of the specific embodiments according to the present invention is a design that maintains thermoelectric separation by forming at least two heat dissipation bases and at least two sets of conductive brackets by coupling the heat dissipation plate and the bracket plate. The other specific embodiment is a design that maintains thermoelectric separation by forming at least two heat dissipating bases and at least two sets of conductive brackets with a thick sheet, and having different specifications. Light emitting diode chips can be used simultaneously. In other words, light emitting diodes can be selected and used by forming electrical connections with different conductive bracket sets while disposing light emitting diode chips with different specifications on the heat dissipation base, respectively. Limitations on the use of chips can be avoided.

In the present invention, the technical effect of simultaneously using light emitting diode chips having different specifications can be achieved by the above technical means.

FIG. 1 is a side sectional view showing an arrangement of light emitting diode chips of a first conventional light emitting diode bracket. FIG. 2 is a top view showing an arrangement of light emitting diode chips of a second conventional light emitting diode bracket. FIG. 3 is a flowchart showing a manufacturing method of the first embodiment of the thermoelectric separation type light emitting diode bracket according to the present invention. FIG. 4 is a perspective view showing the fabrication of the coupling between the heat dissipation plate and the bracket plate of the thermoelectric isolation type light emitting diode bracket according to the present invention. FIG. 5 is a top view showing a structure of a thermoelectric isolation type light emitting diode bracket according to the present invention. FIG. 6 is a flowchart showing a manufacturing method of the second embodiment of the thermoelectric isolation type light emitting diode bracket according to the present invention. FIG. 7A is a perspective view of a thick sheet in the structure of the thermoelectric isolation type light emitting diode bracket according to the present invention. FIG. 7B is a perspective view showing fabrication of a thick sheet heat dissipation base and a conductive bracket in the structure of the thermoelectric isolation type light emitting diode bracket according to the present invention. FIG. 8 is a top view of a thermoelectric isolation type light emitting diode bracket according to the present invention. FIG. 9A is a top view showing a first arrangement form in which light emitting diode chips are arranged in the structure of the thermoelectric separation type light emitting diode bracket according to the present invention. FIG. 9B is a top view showing a second arrangement form in which the light emitting diode chips are arranged in the structure of the thermoelectric separation type light emitting diode bracket according to the present invention. FIG. 10 is a top view showing a light emitting diode chip package in the structure of the thermoelectric isolation type light emitting diode bracket according to the present invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings and examples.

Based on FIG.3 and FIG.4, the manufacturing method of the thermoelectric isolation type light emitting diode bracket which concerns on 1st embodiment of this invention is demonstrated. FIG. 3 is a flowchart of a manufacturing method of a thermoelectric isolation type light emitting diode bracket according to the present invention, and FIG. 4 is an assembly view of a heat radiating plate and a bracket plate.

First, the heat radiating plate 10 including at least two heat radiating bases 11 is manufactured by a stamping method. That is, at least two heat dissipation bases 11 are formed on the heat dissipation plate 10 (step 110). Then, the bracket plate 20 including at least two sets of conductive brackets 21 is manufactured by a stamping method, that is, at least two sets of conductive brackets 21 are formed on the bracket plate 20 (step 120).

The number of sets of conductive brackets 21 formed on the bracket plate 20 depends on the number of heat dissipation bases 11 formed on the heat dissipation plate 10, that is, the number of sets of conductive brackets 21 is the heat dissipation base formed on the heat dissipation plate 10. Equal to the number of 11. Each set of conductive brackets 21 includes an anode conductive bracket 22 and a cathode conductive bracket 23.

As shown in FIG. 4, since three heat dissipation bases 11 are formed on the heat dissipation plate 10, three sets of conductive brackets 21 are formed on the bracket plate 20. The number of the formation brackets 21 is merely an example, and does not limit the application range of the present invention.

Further, the heat radiating plate 10 and the bracket plate 20 are positioned and coupled via the positioning portions (12, 24) provided on the heat radiating plate 10 and the bracket plate 20, respectively. That is, the heat radiating plate 10 and the bracket plate 20 are coupled to each other, and at least two heat radiating bases 11 are provided between at least two sets of conductive brackets 21 (step 130). It should be noted that there is no connection between the conductive brackets 21, thereby making it possible to form a form of thermoelectric separation by electrically separating the connection from the heat dissipation.

Although the heat sink 10 and the bracket plate 20 at this time are integrated, the above description and drawings are merely descriptions for the process system of the heat sink 10 and the bracket plate 20, and the application range of the present invention is not limited thereto. .
When the heat sink 10 having at least two heat dissipating bases 11 and the bracket plate 20 having at least two sets of conductive brackets 21 are respectively manufactured by the stamping method, a metal plate having good electrical conductivity and heat conductivity. Alternatively, for example, the heat sink 10 and the bracket plate 20 can be made of copper, iron, aluminum alloy, or other material having good electrical and thermal conductivity. That is, although the heat dissipation base 11 and the conductive bracket 21 have good electrical conductivity and heat conductivity, the material of the heat dissipation plate 10 and the bracket plate 20 will be described here as an example, but the scope of application of the present invention is as follows. Not limited.

This will be described with reference to FIGS. FIG. 5 is a plan view showing a thermoelectric isolation type light emitting diode bracket according to the present invention.
By the above process method, the heat sink 10 including at least two heat dissipating bases 11 separated from each other and the bracket plate 20 including at least two sets of conductive brackets 21 are manufactured, and the heat sink 10 and the bracket plate 20 are coupled to each other. Then, the colloidal bottom seat 30 is formed so as to embed a part of each heat radiation base 11 and each set of conductive bracket 21 in the colloidal bottom seat 30 by an insert molding method (step 140). In an actual manufacturing process, each heat dissipating base 11 and each pair of conductive brackets 21 are embedded therein by an upper die (not shown) and a lower die (not shown) to form a colloid. As long as the bottom seat 30 is injection-molded, a part of each heat radiation base 11 and each pair of conductive brackets 21 is simultaneously rolled It can be embedded in de bottom seat 30, the upper mold and the lower mold can be collectively release. And the process of insert injection of the colloid bottom seat 30 can be completed.
The material of the colloidal base 30 may be polyphthalamide (PPA) or a thermoplastic resin often used as the colloidal base 30 of another light emitting diode structure. It is illustrated and the application range of the present invention is not limited.

In the case of injection molding of the colloid bottom seat 30, the concave portions 31 are simultaneously formed in the colloid bottom seat 30, and a part of each heat radiation base 11 and each set of conductive brackets 21 are exposed to the concave portions 31 of the colloid bottom seat 30 (steps). 140) Further, a part of each set of the conductive brackets 21 is extended from the colloid bottom seat 30 (step 140).
A portion exposed to the concave portion 31 of the colloid bottom seat 30 of each set of the conductive brackets 21 and a portion extending from the colloid bottom seat 30 of each set of the conductive brackets 21 are for electrical connection. That is, the portion of the conductive bracket 21 exposed to the concave portion 31 of the colloid bottom seat 30 is a light emitting diode chip (not shown) that is disposed in the heat dissipation base 11 later in the concave portion 31 of the colloid bottom seat 30. The portion extending from the colloidal bottom seat 30 of each pair of conductive brackets 21 is electrically connected to other electronic devices (not shown) such as a mother board, a circuit board,. It is for forming an electrical connection to the outside of the colloid bottom seat 30 so as to be electrically connected to the etc., and is merely illustrative and does not limit the application range of the present invention.

In other words, the light-emitting diode chips (not shown) which are respectively disposed in the recesses 31 of the colloid bottom 30 and the respective heat-dissipating bases 11 are radiated from the light-emitting diode chips via the heat-dissipating bases 11 later. It is useful to provide electrical connection of the light-emitting diode chip through a portion exposed to the recess 31 of the colloidal bottom 30 of the conductive bracket 21, and also to provide the colloidal bottom 30 of the conductive bracket 21. The LED chip is electrically connected to other electronic devices through a portion extending from the LED chip.
The structure of the thermoelectric isolation type light emitting diode bracket manufactured through the above process is as shown in FIG.

Next, a manufacturing method of the thermoelectric separation type light emitting diode bracket according to the second embodiment of the present invention will be described with reference to FIGS. 6 and 7A. FIG. 6 is a flowchart illustrating a method of manufacturing a thermoelectric isolation type light emitting diode bracket according to the present invention, and FIG. 7A is a perspective view of a thick sheet of the thermoelectric isolation type light emitting diode bracket according to the present invention.
First, a thick sheet 40 having two different thicknesses is manufactured by an extrusion method (step 210), but the above method is merely illustrative and does not limit the application range of the present invention.

At the same time, description will be made with reference to FIGS. 6 and 7B. FIG. 7B is a perspective view illustrating the fabrication of a heat radiation base and a conductive bracket of a thick sheet of a thermoelectric isolation type light emitting diode bracket according to the present invention. At least two heat dissipating bases 41 are formed in a thick portion of the thick sheet 40 by a stamping method (Step 220). Then, at least two sets of conductive brackets 42 are formed in a portion where the thickness of the thick sheet 40 is small by a stamping method (step 230).

The number of conductive brackets 42 formed on the thick sheet 40 depends on the number of heat dissipating bases 41 formed on the thick sheet 40. In other words, the number of sets of conductive brackets 42 is the heat dissipating base formed on the thick sheet 40. In addition, each set of conductive brackets 42 includes an anode conductive bracket 43 and a cathode conductive bracket 44.

7A and 7B, since three heat dissipating bases 41 are formed on the thick sheet 40, three sets of conductive brackets 42 are formed on the thick sheet 40. The number of conductive brackets 42 is merely illustrative and does not limit the scope of application of the present invention.

Note that there is no connection between at least two heat dissipation bases 41 formed on the thick sheet 40 and at least two sets of conductive brackets 42, thereby separating the heat dissipation from the electrical connection, A form of thermoelectric separation can be formed.

The thick sheet 40 is made of a metal plate or alloy plate having good electrical conductivity and thermal conductivity, and may be made of, for example, copper, iron, aluminum alloy, or other material having good electrical conductivity and thermal conductivity. In other words, the heat radiation base 41 and the conductive bracket 42 have good electrical conductivity and thermal conductivity. Here, the material of the thick sheet 40 will be described as an example, but the application range of the present invention is not limited. .

At the same time, description will be made with reference to FIGS. FIG. 8 is a plan view of a thermoelectric isolation type light emitting diode bracket according to the present invention.
After manufacturing the thick sheet 40 having at least two heat dissipation bases 41 and at least two sets of conductive brackets 42 separated from each other by the above process method, each of the heat dissipation bases 41 and each set of the conductive brackets 42 The colloidal base 50 is formed so as to be partially embedded in the colloidal base 50 (step 240). In the actual manufacturing process, each colloidal base 50 is formed by an upper mold (not shown) and a lower mold (not shown). As long as the heat dissipating base 41 and each set of conductive brackets 42 are embedded therein and the colloid bottom seat 50 is injection molded, a part of each heat dissipating base 41 and each set of conductive brackets 42 is colloidal. It can be embedded in the bottom seat 50, the upper mold and the lower mold can be released at once, and the process of insert injection molding of the colloid bottom seat 50 can be performed. It can be completed. The material of the colloid bottom 50 may be polyphthalamide (PPA) or a thermoplastic resin often used as the colloid bottom 50 of another light emitting diode structure. Here, although illustrated and demonstrated as a material of the colloid bottom seat 50, the application range of the present invention is not particularly limited.

At the same time as the injection molding of the colloid bottom seat 50, the concave portion 51 is formed in the colloid bottom seat 50, and a part of each heat radiation base 41 and each set of the conductive bracket 42 is exposed to the concave portion 51 of the colloid bottom seat 50 (step 240). In addition, a part of each set of conductive brackets 42 is extended from the colloid bottom seat 50 (step 240).
The portion exposed to the recess 51 of the colloid bottom 50 of each set of conductive brackets 42 and the portion extending from the colloid bottom 50 of each set of conductive brackets 42 are for electrical connection, That is, the portion of the conductive bracket 42 exposed to the concave portion 51 of the colloid bottom seat 50 is a light emitting diode chip (not shown) disposed in each of the heat dissipation bases 41 in the concave portion 51 of the colloid bottom seat 50 later. Are electrically connected to each other, but portions extending from the colloidal bottom seat 50 of each pair of conductive brackets 42 are other electronic devices (not shown) such as a mother board, a circuit board, etc. It is for forming an electrical connection to the outside of the colloid bottom 50 so as to be electrically connected, and is merely illustrative and does not limit the application range of the present invention.

In other words, the light emitting diode chips (not shown) that are respectively disposed in the recesses 51 of the colloid bottom base 50 and on the individual heat dissipation bases 41 later radiate heat from the light emitting diode chips via the individual heat dissipation bases 41. Useful for providing electrical connection of the light-emitting diode chip through the portion exposed to the recess 51 of the colloid bottom 50 of each set of conductive brackets 42, and also for providing the colloid bottom 50 of each set of conductive brackets 42. The LED chip is electrically connected to other electronic devices through a portion extending from the LED chip.
FIG. 8 shows a structure of a thermoelectric isolation type light emitting diode bracket manufactured through the above process.

Referring to FIG. 9A, FIG. 9A is a top view showing a first arrangement form in which the light emitting diode chips are arranged in the thermoelectric separation type light emitting diode bracket according to the present invention.
Here, the first embodiment of the present invention will be described on the assumption that a light emitting diode chip is disposed, and the light emitting diode according to the first embodiment is disposed on which the light emitting diode chip according to the second embodiment of the present invention is disposed. It will be described as if the chip is arranged, and the scope of application of the present invention is not limited by way of example only here.

The cathode of the first light emitting diode chip 61 is fixed to the first heat dissipation base 111 exposed in the concave portion 31 of the colloid bottom 30 by surface mounting technology (Surface Mount Device, SMD). The cathode is fixed to the second heat dissipation base 112 exposed in the recess 31 of the colloid bottom seat 30, and the cathode of the third light emitting diode chip 63 is fixed to the third heat dissipation base 113 exposed in the recess 31 of the colloid bottom seat 30. Secure to.

Then, by wire bonding, the anode of the first light emitting diode chip 61 and the conductive bracket 221 of the anode of the first set of conductive brackets 211 exposed in the recess 31 of the colloid bottom seat 30 are electrically connected. And the first heat dissipating base 111 (that is, the cathode of the first light emitting diode chip 61) and the cathode of the first set of conductive brackets 211 exposed in the recess 31 of the colloid bottom base 30. An electrical connection is formed with the conductive bracket 231.

In addition, an electrical connection is formed between the anode of the second light-emitting diode chip 62 and the conductive bracket 222 of the anode of the second set of conductive brackets 212 exposed in the concave portion 31 of the colloid bottom seat 30. The second heat radiation base 112 (that is, the cathode of the second light emitting diode chip 62) and the conductive bracket 232 of the cathode of the second set of conductive brackets 212 exposed in the recess 31 of the colloid bottom base 30 are electrically connected. To form.

Finally, the anode of the third light-emitting diode chip 63 is electrically connected to the conductive bracket 223 of the anode of the third set of conductive brackets 213 exposed in the recess 31 of the colloid bottom base 30, or the third The heat dissipation base 113 (that is, the cathode of the third light emitting diode chip 63) and the cathode conductive bracket 233 of the third set of conductive brackets 213 exposed in the recess 31 of the colloid bottom seat 30 are electrically connected. Let it form.

The first set of conductive brackets 211 has a different electrical polarity for the first light emitting diode chip 61, the second set of conductive brackets 212 has a different electrical polarity for the second light emitting diode chip 62, and the third set. The conductive brackets 213 can provide different electrical polarities to the third light emitting diode chip 33, respectively.

For the first light-emitting diode chip 61, the second light-emitting diode chip 62, and the third light-emitting diode chip 63, a first set of conductive brackets 211 and a second set of conductive brackets 212 are obtained by wire bonding technology. And electrically connecting to the third set of conductive brackets 213, and further, by flip chip bonding, each of the light emitting diode chips and each set of conductive brackets are connected. The electrical connection is formed, and the wire bonding technique and the flip chip bonding technique may be referred to an existing technique as an electrical connection method, and will not be described in detail here, and only as an example, As described above, the application range of the present invention is not limited.

Referring to FIG. 9B, FIG. 9B is a plan view showing a second arrangement of the light emitting diode chips in the thermoelectric separation type light emitting diode bracket according to the present invention.

In the second arrangement, the anode of the first light-emitting diode chip 61 is connected to the first heat radiation base 111 exposed in the concave portion 31 of the colloid bottom 30, and the anode of the second light-emitting diode chip 62 is connected to the colloid bottom 30. The cathode of the third light emitting diode chip 63 was fixed to the third heat dissipation base 113 exposed to the recess 31 of the colloid bottom seat 30, and the second heat dissipation base 112 exposed to the recess 31.

Then, the electrical connection between the cathode of the first light emitting diode chip 61 and the conductive bracket 231 of the cathode of the first set of conductive brackets 211 exposed in the concave portion 31 of the colloid bottom 30 by wire bonding technology. Conduction of the first heat dissipating base 111 (that is, the anode of the first light emitting diode chip 61) and the anode of the first set of conductive brackets 211 exposed in the recess 31 of the colloid bottom 30 is formed. The electrical connection with the conductive bracket 221 is formed.

In addition, an electrical connection is formed between the cathode of the second light emitting diode chip 62 and the cathode conductive bracket 232 of the second set of conductive brackets 212 exposed in the recess 31 of the colloid bottom base 30, and the second An electrical connection is formed between the heat dissipation base 112 (that is, the anode of the second light emitting diode chip 62) and the anode conductive bracket 222 of the second set of conductive brackets 212 exposed in the recess 31 of the colloid bottom seat 30. To do.

Finally, an electrical connection is formed between the anode of the third light-emitting diode chip 63 and the conductive bracket 223 of the anode of the third set of conductive brackets 213 exposed in the recess 31 of the colloid bottom 30, and Electrical connection between the three heat dissipation bases 113 (that is, the cathode of the third light emitting diode chip 63) and the cathode conductive bracket 233 of the third set of conductive brackets 213 exposed in the recess 31 of the colloid bottom 30 Form.

The first set of conductive brackets 211 has a different electrical polarity for the first light emitting diode chip 61, the second set of conductive brackets 212 has a different electrical polarity for the second light emitting diode chip 62, and the third The set of conductive brackets 213 can provide different electrical polarities to the third light emitting diode chip 33, respectively.

At the same time, description will be made with reference to FIGS. 9A and 9B. By the first set of conductive brackets 211, the second set of conductive brackets 212, and the third set of conductive brackets 213, the first light-emitting diode chip 61, the second light-emitting diode chip 62, and the third set Each of the light emitting diode chips 63 can be controlled, and a light emitting diode chip with a different specification (PNP type or NPN type) can be adopted, thereby further improving the use effect of the light emitting diode chip.

  In FIGS. 9A and 9B, only two types of light emitting diode arrangements and electrical connection methods are provided. However, this is merely an example and does not limit the application range of the present invention.

  Next, a description will be given with reference to FIG. FIG. 10 is a plan view showing a light emitting diode chip package in the structure of the thermoelectric isolation type light emitting diode bracket according to the present invention.

  Here, the first embodiment will be described on the assumption that the light emitting diode chip is disposed, and the light emitting diode chip according to the second embodiment is disposed with the light emitting diode chip according to the first embodiment. It is explained as follows. Here, as an example only, the scope of application of the present invention is not limited.

In addition, by forming the package colloid 70 in the recess 31 of the colloid bottom 30, the package colloid 70 can cover the light emitting diode chip 60 in the recess 31, so that the package colloid 70 is dispensed by a dispensing method. Although formed, this is merely an example, and the application range of the present invention is not limited.
Further, since the phosphor powder may be doped into the package colloid 70, when the light emitted from the light emitting diode chip 60 hits the phosphor powder and excites visible light of another type, the light emitting diode chip 60. The light emitted by is mixed with the light excited by the phosphor powder, resulting in a mixed light effect.

  As described above, one of the specific embodiments of the present invention maintains thermoelectric separation by forming at least two heat dissipating bases and at least two sets of conductive brackets by coupling the heat dissipating plate and the bracket plate. In the other embodiment, the thermoelectric separation is maintained by forming at least two heat dissipating bases and at least two sets of conductive brackets from a thick sheet. In addition, by simultaneously using the light emitting diode chips having different specifications, the light emitting diode chips having different specifications can be arranged on the heat dissipation base, and electrical connection with different conductive bracket sets can be formed. There is a difference from the prior art in that the light-emitting diode chip of the specification can be freely selected to avoid the limitation in use of the light-emitting diode chip.

  With such a technical means, when a plurality of light emitting diode chips are provided on a heat dissipation base according to the conventional technology, it is necessary to use light emitting diode chips with the same specifications, and thus the problem that the use of light emitting diode chips is limited. Can be resolved. Furthermore, the effect of simultaneously using light emitting diode chips having different specifications can be achieved.

  Although the embodiment according to the present invention is as described above, the contents do not limit the claims of the present invention as they are. In the technical field of the present invention, those skilled in the art may make some changes to the embodiments and details without departing from the spirit and scope of the present invention. The application scope of the invention is determined by the appended claims.

Claims (10)

A method of manufacturing a thermoelectric separation type light emitting diode bracket, which includes the following steps.
Forming at least two heat dissipating bases on the heat sink,
Forming at least two sets of conductive brackets on the bracket plate;
The heat radiating plate and the bracket plate are coupled together to provide the at least two heat radiating bases between the at least two sets of conductive brackets, and the at least two heat radiating bases and the at least two sets of conductive brackets are in contact with each other. Without touching
A part of the at least two heat dissipation bases and the at least two sets of conductive brackets are embedded in a colloid bottom seat, and a part of the at least two heat dissipation bases and the at least two sets of conductive brackets are recessed in the colloidal bottom seat. And a part of the at least two sets of conductive brackets is extended outward from the colloid bottom seat.   The method of manufacturing a thermoelectric isolation type light emitting diode bracket according to claim 1, wherein in the step of forming at least two heat dissipation bases on the heat dissipation plate, the at least two heat dissipation bases are formed by a stamping process.   The thermoelectric separation type light emitting diode bracket according to claim 1, wherein in the step of forming at least two sets of conductive brackets on the bracket plate, the at least two sets of conductive brackets are formed by a stamping process. Production method.   A portion of the at least two heat dissipating bases and the at least two sets of conductive brackets are embedded in the colloid bottom seat, and the at least two heat dissipating bases and a portion of the at least two sets of conductive brackets are exposed in the recesses of the colloid bottom seat. And, in the step of extending a part of the at least two sets of conductive brackets to the outside of the colloid base, a part of the at least two heat dissipation bases is exposed to the recess so as to fix the light emitting diode chip respectively. 2. The thermoelectric separation type according to claim 1, wherein each of the light emitting diode chips is electrically connected to any one set of conductive brackets partially exposed in the recess. Manufacturing method of light emitting diode bracket.   A portion of the at least two heat dissipating bases and the at least two sets of conductive brackets are embedded in the colloid bottom seat, and the at least two heat dissipating bases and a portion of the at least two sets of conductive brackets are exposed in the recesses of the colloid bottom seat. The step of extending a part of the at least two sets of conductive brackets to the outside of the colloid bottom seat further includes the step of covering the recess with a package colloid. Manufacturing method of thermoelectric isolation type light emitting diode bracket. A method of manufacturing a thermoelectric separation type light emitting diode bracket, which includes the following steps.
Two kinds of thick sheets with different thickness are manufactured,
Forming at least two heat dissipating bases in the thick portion of the thick sheet;
Forming at least two sets of conductive brackets at a portion having a small thickness in the thick sheet, and not contacting the at least two sets of conductive brackets with the at least two heat dissipation bases;
A portion of the at least two heat dissipating bases and the at least two sets of conductive brackets are embedded in a colloid bottom seat, and the at least two heat dissipating bases and a portion of the at least two sets of conductive brackets are exposed in the recesses of the colloid bottom seat. And a part of the at least two sets of conductive brackets are extended outward from the colloid bottom seat.   The thermoelectric separation type according to claim 6, wherein, in the step of forming the at least two heat dissipation bases in the thick portion of the thick sheet, the at least two heat dissipation bases are formed by a stamping process. Manufacturing method of light emitting diode bracket.   In the step of forming the at least two sets of conductive brackets at locations where the thickness of the thick sheet is small and not contacting the at least two sets of conductive brackets with the at least two heat dissipation bases, The method of manufacturing a thermoelectric isolation type light emitting diode bracket according to claim 6, wherein two sets of conductive brackets are formed.   A portion of the at least two heat dissipation bases and the at least two sets of conductive brackets are embedded in the colloid bottom seat, and the at least two heat dissipation bases and a portion of the at least two sets of conductive brackets are recessed in the colloid bottom seat. In the step of exposing and extending a part of the at least two sets of conductive brackets to the outside of the colloid base, a part of the at least two heat dissipation bases is disposed in the recess so as to fix the light emitting diode chips respectively. The thermoelectric separation according to claim 6, wherein the thermoelectric separation is formed by exposing each of the light emitting diode chips and any one of the conductive brackets partially exposed in the recess. Type light emitting diode bracket manufacturing method.   A portion of the at least two heat dissipation bases and the at least two sets of conductive brackets are embedded in the colloid bottom seat, and the at least two heat dissipation bases and a portion of the at least two sets of conductive brackets are recessed in the colloid bottom seat. 10. The step of exposing and extending a portion of the at least two sets of conductive brackets outwardly of the colloid base further includes the step of covering the colloid with a package colloid. Manufacturing method of thermoelectric isolation type light emitting diode bracket.

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