JP2012041218A - Glass for forming electrode, and electrode-forming material using the same - Google Patents
Glass for forming electrode, and electrode-forming material using the same Download PDFInfo
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/546—Polycrystalline silicon PV cells
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/548—Amorphous silicon PV cells
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
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Abstract
Description
本発明は、電極形成用ガラス及び電極形成材料に関し、特にシリコン太陽電池(単結晶シリコン太陽電池、多結晶シリコン太陽電池、微結晶シリコン太陽電池、アモルファスシリコン太陽電池等を含む)の裏面電極の形成に好適な電極形成用ガラス及び電極形成材料に関する。 The present invention relates to an electrode-forming glass and an electrode-forming material, and in particular, to form a back electrode of a silicon solar cell (including a single crystal silicon solar cell, a polycrystalline silicon solar cell, a microcrystalline silicon solar cell, an amorphous silicon solar cell, etc.). The present invention relates to an electrode forming glass and an electrode forming material suitable for the above.
シリコン太陽電池は、シリコン半導体基板、受光面電極、裏面電極、反射防止膜等を備えており、シリコン半導体基板の受光面側に、グリッド状の受光面電極が形成されると共に、シリコン半導体基板の裏面側に、裏面電極が形成される。また、受光面電極は、Ag電極等が一般的であり、裏面電極は、Al電極等が一般的である。 The silicon solar cell includes a silicon semiconductor substrate, a light receiving surface electrode, a back electrode, an antireflection film, and the like. A grid-shaped light receiving surface electrode is formed on the light receiving surface side of the silicon semiconductor substrate, and the silicon semiconductor substrate A back electrode is formed on the back side. The light receiving surface electrode is generally an Ag electrode and the back surface electrode is generally an Al electrode.
裏面電極は、通常、厚膜法で形成される。厚膜法は、所望の電極パターンになるように、シリコン半導体基板に電極形成材料をスクリーン印刷し、これを最高温度660〜900℃で短時間焼成(具体的には、焼成開始から終了まで2〜3分、最高温度で10〜30秒保持)して、Alをシリコン半導体基板に拡散させることにより、シリコン半導体基板に裏面電極を形成する方法である。 The back electrode is usually formed by a thick film method. In the thick film method, an electrode forming material is screen-printed on a silicon semiconductor substrate so as to obtain a desired electrode pattern, and this is fired for a short time at a maximum temperature of 660 to 900 ° C. This is a method of forming a back electrode on the silicon semiconductor substrate by diffusing Al into the silicon semiconductor substrate for 3 minutes and holding at the maximum temperature for 10 to 30 seconds).
裏面電極の形成に用いる電極形成材料は、Al粉末と、ガラス粉末と、ビークル等を含有する。この電極形成材料を焼成すると、Al粉末がシリコン半導体基板のSiと反応し、裏面電極とシリコン半導体基板の界面にAl−Si合金層が形成されると共に、Al−Si合金層とシリコン半導体基板の界面にAlドープ層(Back Surfase Field層、BSF層とも称される)が形成される。Alドープ層を形成すれば、電子の再結合を防止し、生成キャリアの収集効率を向上させる効果、所謂BSF効果を享受することができる。結果として、Alドープ層を形成すれば、シリコン太陽電池の光電変換効率を高めることができる。 The electrode forming material used for forming the back electrode contains Al powder, glass powder, vehicle and the like. When this electrode forming material is baked, the Al powder reacts with Si of the silicon semiconductor substrate to form an Al-Si alloy layer at the interface between the back electrode and the silicon semiconductor substrate, and between the Al-Si alloy layer and the silicon semiconductor substrate. An Al doped layer (also referred to as a back surface field layer or a BSF layer) is formed at the interface. By forming the Al-doped layer, it is possible to enjoy the effect of preventing recombination of electrons and improving the collection efficiency of generated carriers, the so-called BSF effect. As a result, if an Al-doped layer is formed, the photoelectric conversion efficiency of the silicon solar cell can be increased.
電極形成材料に含まれるガラス粉末は、Al粉末を結合させて、電極を形成する成分であると共に、Al粉末とSiの反応に影響を及ぼすことにより、Al−Si合金層とAlドープ層の形成に関与する成分である(特許文献1、2参照)。 The glass powder contained in the electrode forming material is a component that binds Al powder to form an electrode and affects the reaction between Al powder and Si, thereby forming an Al-Si alloy layer and an Al doped layer. (See Patent Documents 1 and 2).
ところで、従来、電極形成用ガラスとして、鉛ホウ酸系ガラスが使用されてきた。しかし、鉛ホウ酸系ガラスの使用は、環境的観点から、制限される傾向にある。このため、鉛ホウ酸系ガラスを無鉛化する動きが加速している。現時点では、ビスマス系ガラスが、鉛ホウ酸系ガラスの代替材料として有望である。 By the way, lead borate glass has been conventionally used as an electrode forming glass. However, the use of lead borate glass tends to be limited from an environmental point of view. For this reason, the movement to lead-free lead borate glass is accelerating. At present, bismuth glass is promising as an alternative material for lead borate glass.
しかし、従来のビスマス系ガラスは、Al−Si合金層やAlドープ層の厚みを適正化することが困難であるため、シリコン太陽電池の光電変換効率を高め難い性質を有していた。具体的には、シリコン半導体基板に形成されるAlドープ層が浅いと、BSF効果を十分に享受できず、その一方で、Alドープ層がシリコン半導体基板中のp型半導体とn型半導体の界面まで過剰に深く形成されると、空乏層が悪影響を受けて、BSF効果を十分に享受できなくなる。また、従来のビスマス系ガラスを用いると、ブリスターやAlの凝集が発生し易くなり、外観不良が発生し易くなる。 However, the conventional bismuth-based glass has a property that it is difficult to increase the photoelectric conversion efficiency of the silicon solar cell because it is difficult to optimize the thickness of the Al—Si alloy layer or the Al-doped layer. Specifically, if the Al doped layer formed on the silicon semiconductor substrate is shallow, the BSF effect cannot be fully enjoyed. On the other hand, the Al doped layer is an interface between the p-type semiconductor and the n-type semiconductor in the silicon semiconductor substrate. If the depth is excessively deep, the depletion layer is adversely affected and the BSF effect cannot be fully enjoyed. In addition, when conventional bismuth-based glass is used, blisters and Al aggregates are liable to occur, and appearance defects are liable to occur.
そこで、本発明は、ブリスターやAlの凝集を発生させずに、Al−Si合金層とAlドープ層を適正に形成し得るビスマス系ガラスからなる電極形成用ガラスを創案することにより、シリコン太陽電池の外観不良を低減し、且つ光電変換効率を高めることを技術的課題とする。 Accordingly, the present invention provides a silicon solar cell by creating an electrode-forming glass made of bismuth-based glass that can appropriately form an Al-Si alloy layer and an Al-doped layer without causing blistering or aggregation of Al. It is a technical problem to reduce the appearance defect and increase the photoelectric conversion efficiency.
本発明者は、鋭意努力の結果、ビスマス系ガラスのガラス組成と軟化点を所定範囲に規制することにより、上記技術的課題を解決できることを見出し、本発明として、提案するものである。すなわち、本発明の電極形成用ガラスは、ガラス組成として、質量%で、Bi2O3 56〜76.3%、B2O3 2〜18%、ZnO 0〜11%(但し、11%は含まず)、CaO 0〜12%、BaO+CuO+Fe2O3+Sb2O3(BaO、CuO、Fe2O3、及びSb2O3の合量) 0〜25%を含有し、軟化点が462〜520℃であることを特徴とする。ここで、「軟化点」とは、マクロ型示差熱分析(DTA)装置で測定した値を指し、DTAは室温から測定を開始し、昇温速度は10℃/分とする。なお、軟化点は、図1に示すマクロ型DTA装置の測定データにおいて、第四屈曲点の温度(Ts)を指す。 As a result of diligent efforts, the present inventor has found that the above technical problem can be solved by regulating the glass composition and softening point of bismuth-based glass within a predetermined range, and proposes the present invention. That is, the glass for electrode formation according to the present invention has, as a glass composition, mass%, Bi 2 O 3 56 to 76.3%, B 2 O 3 2 to 18%, ZnO 0 to 11% (however, 11% is Not containing), CaO 0-12%, BaO + CuO + Fe 2 O 3 + Sb 2 O 3 (total amount of BaO, CuO, Fe 2 O 3 , and Sb 2 O 3 ) 0-25%, softening point 462- It is characterized by being 520 ° C. Here, the “softening point” refers to a value measured with a macro-type differential thermal analysis (DTA) apparatus, DTA starts measurement from room temperature, and the rate of temperature rise is 10 ° C./min. The softening point indicates the temperature (Ts) at the fourth bending point in the measurement data of the macro DTA apparatus shown in FIG.
ガラス組成中のBi2O3の含有量を56〜76.3%、B2O3の含有量を2〜18%に規制すれば、熱的安定性を維持しつつ、軟化点を適正な範囲に規制し易くなる。また、軟化点を462〜520℃に規制すれば、Al−Si合金層やAlドープ層を適正に形成することが可能になる。なお、軟化点が462℃より低いと、焼成時にガラスがAl粉末とSiの反応を阻害して、Al−Si合金層とAlドープ層が形成され難くなり、結果として、BSF効果を享受し難くなる。一方、軟化点が520℃より高いと、Al粉末とSiの反応が過剰になるため、焼成時にガラスがシリコン半導体基板を侵食し易くなり、シリコン太陽電池の光電変換効率が低下し易くなると共に、ブリスターやAlの凝集が発生し易くなる。また、上記のようにZnO、CaO、BaO+CuO+Fe2O3+Sb2O3の含有量を規制すれば、熱的安定性が向上すると共に、ブリスターやAlの凝集を防止し易くなる。 If the Bi 2 O 3 content in the glass composition is regulated to 56 to 76.3% and the B 2 O 3 content to 2 to 18%, the softening point is kept appropriate while maintaining the thermal stability. It becomes easy to regulate to the range. Further, if the softening point is restricted to 462 to 520 ° C., it is possible to appropriately form an Al—Si alloy layer or an Al doped layer. If the softening point is lower than 462 ° C., the glass inhibits the reaction between Al powder and Si during firing, and it becomes difficult to form an Al—Si alloy layer and an Al doped layer, and as a result, it is difficult to enjoy the BSF effect. Become. On the other hand, if the softening point is higher than 520 ° C., the reaction between the Al powder and Si becomes excessive, so that the glass is likely to erode the silicon semiconductor substrate during firing, and the photoelectric conversion efficiency of the silicon solar cell is likely to be reduced. Aggregation of blisters and Al is likely to occur. Further, ZnO as described above, CaO, when regulating the content of BaO + CuO + Fe 2 O 3 + Sb 2 O 3, the thermal stability is improved, easily preventing the blister or aggregation of Al.
第二に、本発明の電極形成用ガラスは、ZnO+CuO(ZnOとCuOの合量)の含有量が2.6〜15質量%であることを特徴とする。このようにすれば、熱的安定性を高めつつ、ブリスターやAlの凝集を抑制し易くなる。 Second, the electrode-forming glass of the present invention is characterized in that the content of ZnO + CuO (total amount of ZnO and CuO) is 2.6 to 15% by mass. If it does in this way, it will become easy to suppress aggregation of blister and Al, improving thermal stability.
第三に、本発明の電極形成用ガラスは、BaOの含有量が0.1〜15質量%であることを特徴とする。このようにすれば、熱的安定性を高めつつ、ブリスターやAlの凝集を抑制し易くなる。 Third, the electrode-forming glass of the present invention is characterized in that the content of BaO is 0.1 to 15% by mass. If it does in this way, it will become easy to suppress aggregation of blister and Al, improving thermal stability.
第四に、本発明の電極形成用ガラスは、CaOの含有量が0.1〜10質量%であることを特徴とする。このようにすれば、軟化点が不当に上昇する事態を防止しながら、ブリスターやAlの凝集を抑制し易くなる。 Fourth, the electrode forming glass of the present invention is characterized in that the content of CaO is 0.1 to 10% by mass. If it does in this way, it will become easy to suppress aggregation of a blister or Al, preventing the situation where a softening point raises unjustly.
第五に、本発明の電極形成用ガラスは、実質的にPbOを含有しないことを特徴とする。このようにすれば、近年の環境的要請を満たすことができる。ここで、「実質的にPbOを含有しない」は、ガラス組成中のPbOの含有量が1000ppm以下の場合を指す。 Fifth, the electrode-forming glass of the present invention is characterized by containing substantially no PbO. In this way, environmental demands in recent years can be satisfied. Here, “substantially does not contain PbO” refers to a case where the content of PbO in the glass composition is 1000 ppm or less.
第六に、本発明の電極形成用ガラスは、シリコン太陽電池の電極に用いることを特徴とする。 Sixth, the electrode forming glass of the present invention is used for an electrode of a silicon solar cell.
第七に、本発明の電極形成用ガラスは、シリコン太陽電池の裏面電極に用いることを特徴とする。 Seventh, the glass for forming an electrode of the present invention is used for a back electrode of a silicon solar cell.
第八に、本発明の電極形成材料は、上記の電極形成用ガラスからなるガラス粉末と、金属粉末と、ビークルとを含むことを特徴とする。このようにすれば、厚膜法で電極パターンを形成できるため、シリコン太陽電池の生産効率を高めることができる。ここで、「ビークル」は、一般的に、有機溶媒中に樹脂を溶解させたものを指すが、本発明では、樹脂を含有せず、高粘性の有機溶媒(例えば、イソトリデシルアルコール等の高級アルコール)のみで構成される態様を含む。 Eighth, the electrode forming material of the present invention is characterized by including glass powder made of the above-mentioned electrode forming glass, metal powder, and a vehicle. In this way, since the electrode pattern can be formed by the thick film method, the production efficiency of the silicon solar cell can be increased. Here, “vehicle” generally refers to a resin dissolved in an organic solvent. However, in the present invention, the resin does not contain a high-viscosity organic solvent (for example, isotridecyl alcohol or the like). The aspect comprised only with a higher alcohol) is included.
第九に、本発明の電極形成材料は、ガラス粉末の含有量が0.2〜10質量%であることを特徴とする。このようにすれば、電極の機械的強度を確保した上で、Al粉末とSiの反応を適正化し易くなる。 Ninthly, the electrode forming material of the present invention is characterized in that the content of the glass powder is 0.2 to 10% by mass. If it does in this way, it will become easy to optimize reaction of Al powder and Si, while ensuring the mechanical strength of an electrode.
第十一に、本発明の電極形成材料は、平均粒子径D50が3μm未満であることを特徴とする。ここで、「平均粒子径D50」は、レーザー回折法で測定した値を指し、レーザー回折法により測定した際の体積基準の累積粒度分布曲線において、その積算量が粒子の小さい方から累積して50%である粒子径を表す。 Eleventh, the electrode forming material of the present invention is characterized in that the average particle diameter D 50 is less than 3 μm. Here, the “average particle diameter D 50 ” refers to a value measured by the laser diffraction method. In the volume-based cumulative particle size distribution curve measured by the laser diffraction method, the accumulated amount is accumulated from the smaller particle. The particle diameter is 50%.
第十二に、本発明の電極形成材料は、金属粉末がAg、Al、Au、Cu、Pd、Pt及びこれらの合金の一種又は二種以上を含むことを特徴とする。これらの金属粉末は、導電性が良好であると共に、本発明に係るビスマス系ガラスと適合性が良好である。このため、これらの金属粉末を用いると、焼成時にガラス中に発泡が生じ難くなると共に、ガラスが失透し難くなる。 Twelfth, the electrode forming material of the present invention is characterized in that the metal powder contains Ag, Al, Au, Cu, Pd, Pt, or one or more of these alloys. These metal powders have good conductivity and good compatibility with the bismuth glass according to the present invention. For this reason, when these metal powders are used, it is difficult for foaming to occur in the glass during firing, and the glass is difficult to devitrify.
第十三に、本発明の電極形成材料は、金属粉末がAlであることを特徴とする。 Thirteenth, the electrode forming material of the present invention is characterized in that the metal powder is Al.
本発明の電極形成用ガラスにおいて、上記のように各成分の含有範囲を規定した理由を以下に説明する。なお、各成分の含有範囲の説明において、%表示は質量%を指す。 In the electrode forming glass of the present invention, the reason why the range of each component is specified as described above will be described below. In addition, in description of the containing range of each component,% display points out the mass%.
Bi2O3は、軟化点を低下させる成分であり、また耐水性を高める成分であり、その含有量は56〜76.3%、好ましくは60〜76%、より好ましくは65〜75%、更に好ましくは67〜73%である。Bi2O3の含有量が56%より少ないと、軟化点が高くなり過ぎて、焼成時にガラスが溶け難くなるため、Al粉末とSiの反応が過剰になり、結果として、Al−Si合金層とAlドープ層が過剰に形成されて、シリコン太陽電池の光電変換効率が低下し易くなる。また、裏面電極の焼結性が低下するため、裏面電極の機械的強度が低下し易くなる。また、Bi2O3の含有量が56%より少ないと、耐水性が低下し易くなるため、シリコン太陽電池の長期安定性が低下し易くなる。一方、Bi2O3の含有量が76.3%より多いと、軟化点が低下し過ぎて、焼成時にガラスがAl粉末とSiの反応を阻害し、結果として、Al−Si合金層とAlドープ層が形成され難くなる。また、Bi2O3の含有量が76.3%より多いと、熱的安定性が低下して、焼成時にガラスが失透し易くなり、裏面電極の機械的強度が低下し易くなる。また、焼成時にガラスが完全に失透すると、Al粉末とSiの反応を適正化し難くなり、BSF効果を享受し難くなる。 Bi 2 O 3 is a component that lowers the softening point and also increases water resistance, and its content is 56 to 76.3%, preferably 60 to 76%, more preferably 65 to 75%, More preferably, it is 67 to 73%. If the content of Bi 2 O 3 is less than 56%, the softening point becomes too high and the glass becomes difficult to melt at the time of firing, so the reaction between Al powder and Si becomes excessive, and as a result, the Al—Si alloy layer As a result, the Al-doped layer is excessively formed, and the photoelectric conversion efficiency of the silicon solar cell is likely to be lowered. Further, since the sinterability of the back electrode is lowered, the mechanical strength of the back electrode is likely to be lowered. Further, when the content of Bi 2 O 3 is less than 56%, since the water resistance tends to decrease long-term stability of the silicon solar cells tends to decrease. On the other hand, if the content of Bi 2 O 3 is more than 76.3%, the softening point is too low, and the glass inhibits the reaction between the Al powder and Si during firing. As a result, the Al—Si alloy layer and the Al It becomes difficult to form a doped layer. Further, when the content of Bi 2 O 3 is more than 76.3%, thermal stability is lowered, the glass is easily devitrified during firing, the mechanical strength of the back electrode tends to decrease. Further, when the glass is completely devitrified during firing, it is difficult to optimize the reaction between the Al powder and Si, and it is difficult to enjoy the BSF effect.
B2O3は、ガラスの骨格を形成する成分であり、その含有量は2〜18%、好ましくは5〜16%、更に好ましくは8〜15%、特に好ましくは10〜14%である。B2O3の含有量が2%より少ないと、熱的安定性が低下して、焼成時にガラスが失透し易くなるため、裏面電極の機械的強度が低下し易くなる。また、焼成時にガラスが完全に失透すると、Al粉末とSiの反応を適正化し難くなり、BSF効果を享受し難くなる。一方、B2O3の含有量が18%より多いと、耐水性が低下し易くなるため、シリコン太陽電池の長期安定性が低下し易くなると共に、ガラスが分相し易くなるため、Al−Si合金層とAlドープ層を均一に形成し難くなる。 B 2 O 3 is a component that forms a glass skeleton, and its content is 2 to 18%, preferably 5 to 16%, more preferably 8 to 15%, and particularly preferably 10 to 14%. When the content of B 2 O 3 is less than 2%, the thermal stability is lowered, and the glass tends to be devitrified during firing, so that the mechanical strength of the back electrode is easily lowered. Further, when the glass is completely devitrified during firing, it is difficult to optimize the reaction between the Al powder and Si, and it is difficult to enjoy the BSF effect. On the other hand, if the content of B 2 O 3 is more than 18%, the water resistance tends to be lowered, so that the long-term stability of the silicon solar cell is likely to be lowered, and the glass is likely to be phase-separated. It becomes difficult to form the Si alloy layer and the Al doped layer uniformly.
ZnOは、熱的安定性を高める成分であり、また熱膨張係数を上昇させずに、軟化点を低下させる成分であり、その含有量は0〜11%(但し、11%は含まず)、好ましくは0.1〜10%、より好ましくは1〜9%である。ZnOの含有量が11%以上であると、ガラス組成の成分バランスが損なわれて、逆に熱的安定性が低下し易くなると共に、ブリスターやAlの凝集が生じ易くなる。なお、ブリスターやAlの凝集を抑制する観点に立てば、実質的にZnOを含有しないことが好ましい。ここで、「実質的にZnOを含有しない」とは、ガラス組成中のZnOの含有量が1000ppm以下の場合を指す。 ZnO is a component that enhances thermal stability and is a component that lowers the softening point without increasing the thermal expansion coefficient, and its content is 0 to 11% (however, 11% is not included), Preferably it is 0.1 to 10%, More preferably, it is 1 to 9%. When the ZnO content is 11% or more, the component balance of the glass composition is impaired, and conversely, the thermal stability tends to be lowered, and blisters and Al aggregates easily occur. In terms of suppressing the aggregation of blisters and Al, it is preferable that ZnO is not substantially contained. Here, “substantially does not contain ZnO” refers to a case where the content of ZnO in the glass composition is 1000 ppm or less.
CaOは、ブリスターやAlの凝集を抑制する効果が大きい成分であり、その含有量は0〜12%、0〜10%、0.1〜8%、0.5〜5%、特に1〜4%が好ましい。CaOの含有量が12%より多いと、軟化点が高くなり過ぎて、焼成時にガラスが溶け難くなるため、Al粉末とSiの反応が過剰になり、結果として、Al−Si合金層とAlドープ層が過剰に形成されて、シリコン太陽電池の光電変換効率が低下し易くなる。また、裏面電極の焼結性が低下するため、裏面電極の機械的強度が低下し易くなる。 CaO is a component having a great effect of suppressing aggregation of blisters and Al, and its content is 0 to 12%, 0 to 10%, 0.1 to 8%, 0.5 to 5%, particularly 1 to 4%. % Is preferred. If the content of CaO is more than 12%, the softening point becomes too high and the glass becomes difficult to melt during firing, so that the reaction between Al powder and Si becomes excessive, and as a result, the Al-Si alloy layer and Al dope The layer is formed excessively, and the photoelectric conversion efficiency of the silicon solar cell is likely to decrease. Further, since the sinterability of the back electrode is lowered, the mechanical strength of the back electrode is likely to be lowered.
BaO+CuO+Fe2O3+Sb2O3は、熱的安定性を高める成分であり、その含有量は0〜25%、好ましくは1〜20%、より好ましくは4〜15%、更に好ましくは6〜12%である。BaO+CuO+Fe2O3+Sb2O3の含有量が25%より多いと、ガラス組成の成分バランスが損なわれるため、逆に熱的安定性が低下して、焼成時にガラスが失透し易くなり、結果として、裏面電極の機械的強度が低下し易くなる。また、焼成時にガラスが完全に失透すると、Al粉末とSiの反応を適正化し難くなり、BSF効果を享受し難くなる。 BaO + CuO + Fe 2 O 3 + Sb 2 O 3 is a component that enhances thermal stability, and its content is 0 to 25%, preferably 1 to 20%, more preferably 4 to 15%, and still more preferably 6 to 12 %. When the content of BaO + CuO + Fe 2 O 3 + Sb 2 O 3 is more than 25%, the component balance of the glass composition is impaired, and conversely, the thermal stability is lowered, and the glass is easily devitrified during firing. As a result, the mechanical strength of the back electrode tends to decrease. Further, when the glass is completely devitrified during firing, it is difficult to optimize the reaction between the Al powder and Si, and it is difficult to enjoy the BSF effect.
BaOは、ブリスターやAlの凝集を抑制する成分であると共に、熱的安定性を顕著に高める成分であり、その含有量は0〜20%、0.01〜15%、0.1〜10%、1〜9%、特に2〜8%が好ましい。BaOの含有量が20%より多いと、ガラス組成の成分バランスが損なわれて、逆に熱的安定性が低下し易くなる。また、焼成時にガラスが完全に失透すると、Al粉末とSiの反応を適正化し難くなり、BSF効果を享受し難くなる。 BaO is a component that suppresses the aggregation of blisters and Al, and is a component that remarkably increases thermal stability, and its content is 0 to 20%, 0.01 to 15%, 0.1 to 10%. 1-9%, particularly 2-8% is preferred. When there is more content of BaO than 20%, the component balance of a glass composition will be impaired and conversely thermal stability will fall easily. Further, when the glass is completely devitrified during firing, it is difficult to optimize the reaction between the Al powder and Si, and it is difficult to enjoy the BSF effect.
CuOは、熱的安定性を顕著に高める成分であり、また熱膨張係数を上昇させずに、軟化点を低下させる成分であり、その含有量は0〜12%、0.1〜9%、特に1〜7%が好ましい。CuOの含有量が12%より多いと、ガラス組成の成分バランスが損なわれて、逆に熱的安定性が低下し易くなる。また、焼成時にガラスが完全に失透すると、Al粉末とSiの反応を適正化し難くなり、BSF効果を享受し難くなる。 CuO is a component that remarkably increases thermal stability, and is a component that lowers the softening point without increasing the thermal expansion coefficient, and its content is 0 to 12%, 0.1 to 9%, 1 to 7% is particularly preferable. When the content of CuO is more than 12%, the component balance of the glass composition is impaired, and conversely, the thermal stability tends to decrease. Further, when the glass is completely devitrified during firing, it is difficult to optimize the reaction between the Al powder and Si, and it is difficult to enjoy the BSF effect.
ZnO+CuOは、熱的安定性を顕著に高める成分であり、また熱膨張係数を上昇させずに、軟化点を低下させる成分であり、その含有量は0〜20%、2.6〜16%、3〜14%、特に5〜12%が好ましい。ZnO+CuOの含有量が20%より多いと、ガラス組成の成分バランスが損なわれて、逆に熱的安定性が低下し易くなると共に、ブリスターやAlの凝集が生じ易くなる。 ZnO + CuO is a component that remarkably increases thermal stability, and is a component that lowers the softening point without increasing the thermal expansion coefficient, and its content is 0 to 20%, 2.6 to 16%, 3 to 14%, particularly 5 to 12% is preferable. When the content of ZnO + CuO is more than 20%, the component balance of the glass composition is impaired, and conversely, the thermal stability is likely to be lowered, and blisters and Al are easily aggregated.
Fe2O3は、熱的安定性を高める成分であり、その含有量は0〜7%、0.1〜4%、特に0.4〜3%が好ましい。Fe2O3の含有量が7%より多いと、ガラス組成の成分バランスが損なわれて、逆に熱的安定性が低下し易くなる。また、焼成時にガラスが完全に失透すると、Al粉末とSiの反応を適正化し難くなり、BSF効果を享受し難くなる。 Fe 2 O 3 is a component that enhances thermal stability, and its content is preferably 0 to 7%, 0.1 to 4%, particularly preferably 0.4 to 3%. When the content of Fe 2 O 3 is more than 7%, is impaired balance of components glass composition, thermal stability tends to decrease in reverse. Further, if the glass is completely devitrified during firing, it is difficult to optimize the reaction between the Al powder and Si, and it is difficult to enjoy the BSF effect.
Sb2O3は、熱的安定性を顕著に高める成分であり、その含有量は0〜7%、0.1〜4%、特に0.5〜3%が好ましい。Sb2O3の含有量が7%より多いと、ガラス組成の成分バランスが損なわれて、逆に熱的安定性が低下し易くなる。また、焼成時にガラスが完全に失透すると、Al粉末とSiの反応を適正化し難くなり、BSF効果を享受し難くなる。 Sb 2 O 3 is a component that remarkably increases the thermal stability, and its content is preferably 0 to 7%, 0.1 to 4%, particularly preferably 0.5 to 3%. When the content of Sb 2 O 3 is more than 7%, is impaired balance of components glass composition, thermal stability tends to decrease in reverse. Further, when the glass is completely devitrified during firing, it is difficult to optimize the reaction between the Al powder and Si, and it is difficult to enjoy the BSF effect.
上記成分以外にも、例えば、以下の成分を添加してもよい。 In addition to the above components, for example, the following components may be added.
MgOは、ブリスターやAlの凝集を抑制する成分であり、その含有量は0〜5%、0〜3%、特に0〜1%が好ましい。MgOの含有量が5%より多いと、軟化点が高くなり過ぎて、焼成時にガラスが溶け難くなるため、Al粉末とSiの反応が過剰になり、結果として、Al−Si合金層とAlドープ層が過剰に形成されて、シリコン太陽電池の光電変換効率が低下し易くなる。また、裏面電極の焼結性が低下するため、裏面電極の機械的強度が低下し易くなる。 MgO is a component that suppresses aggregation of blisters and Al, and its content is preferably 0 to 5%, 0 to 3%, particularly preferably 0 to 1%. If the content of MgO is more than 5%, the softening point becomes too high, and the glass is difficult to melt during firing, so that the reaction between Al powder and Si becomes excessive, and as a result, the Al-Si alloy layer and the Al dope The layer is formed excessively, and the photoelectric conversion efficiency of the silicon solar cell is likely to decrease. Further, since the sinterability of the back electrode is lowered, the mechanical strength of the back electrode is likely to be lowered.
SrOは、ブリスターやAlの凝集を抑制する成分であると共に、ガラスの熱的安定性を高める成分であり、その含有量は0〜15%、0〜10%、特に0〜5%が好ましい。SrOの含有量が15%より多いと、ガラス組成の成分バランスが損なわれて、逆に熱的安定性が低下し易くなる。 SrO is a component that suppresses the aggregation of blisters and Al and is a component that enhances the thermal stability of the glass, and its content is preferably 0 to 15%, 0 to 10%, particularly preferably 0 to 5%. When the content of SrO is more than 15%, the component balance of the glass composition is impaired, and conversely, the thermal stability tends to be lowered.
SiO2は、耐水性を高める成分であるが、軟化点を大幅に上昇させる作用を有する。このため、SiO2の含有量は20%以下、15%以下、8.5%以下、5%以下、3%以下、特に1%以下が好ましい。SiO2の含有量が20%より多いと、軟化点が高くなり過ぎて、焼成時にガラスが溶け難くなるため、Al粉末とSiの反応が過剰になり、結果として、Al−Si合金層とAlドープ層が過剰に形成されて、シリコン太陽電池の光電変換効率が低下し易くなる。また、裏面電極の焼結性が低下するため、裏面電極の機械的強度が低下し易くなる。 SiO 2 is a component that enhances water resistance, but has the effect of significantly increasing the softening point. For this reason, the content of SiO 2 is preferably 20% or less, 15% or less, 8.5% or less, 5% or less, 3% or less, and particularly preferably 1% or less. If the content of SiO 2 is more than 20%, the softening point becomes too high and the glass becomes difficult to melt during firing, so that the reaction between the Al powder and Si becomes excessive. As a result, the Al—Si alloy layer and the Al Doped layers are formed excessively, and the photoelectric conversion efficiency of the silicon solar cell is likely to be lowered. Further, since the sinterability of the back electrode is lowered, the mechanical strength of the back electrode is likely to be lowered.
Al2O3は、耐水性を高める成分であるが、軟化点を大幅に上昇させる作用を有する。このため、Al2O3の含有量は15%以下、8.5%以下、5%以下、3%以下、特に1%以下が好ましい。Al2O3の含有量が15%より多いと、軟化点が高くなり過ぎて、焼成時にガラスが溶け難くなるため、Al粉末とSiの反応が過剰になり、結果として、Al−Si合金層とAlドープ層が過剰に形成されて、シリコン太陽電池の光電変換効率が低下し易くなる。また、裏面電極の焼結性が低下するため、裏面電極の機械的強度が低下し易くなる。 Al 2 O 3 is a component that enhances water resistance, but has the effect of significantly increasing the softening point. For this reason, the content of Al 2 O 3 is preferably 15% or less, 8.5% or less, 5% or less, 3% or less, and particularly preferably 1% or less. If the content of Al 2 O 3 is more than 15%, the softening point becomes too high and the glass becomes difficult to melt during firing, so that the reaction between Al powder and Si becomes excessive, resulting in an Al—Si alloy layer. As a result, the Al-doped layer is excessively formed, and the photoelectric conversion efficiency of the silicon solar cell is likely to be lowered. Further, since the sinterability of the back electrode is lowered, the mechanical strength of the back electrode is likely to be lowered.
Li2O、Na2O、K2O及びCs2Oは、軟化点を下げる成分であるが、溶融時にガラスの失透を促進する作用を有するため、これらの成分の含有量は各々2%以下が好ましい。 Li 2 O, Na 2 O, K 2 O, and Cs 2 O are components that lower the softening point, but since they have an action of promoting devitrification of the glass when melted, the content of these components is 2% each. The following is preferred.
Nd2O3は、熱的安定性を高める成分であり、その含有量は0〜10%、0〜5%、特に0〜3%が好ましい。ガラス組成中にNd2O3を所定量添加すれば、Bi2O3−B2O3系ガラスのガラスネットワークを安定化させて、焼成時にBi2O3(ビスマイト)、Bi2O3とB2O3で形成される2Bi2O3・B2O3又は12Bi2O3・B2O3等の結晶が析出し難くなる。但し、Nd2O3の含有量が10%より多いと、ガラス組成の成分バランスが損なわれて、逆にガラスに結晶が析出し易くなる。 Nd 2 O 3 is a component that enhances thermal stability, and its content is preferably 0 to 10%, 0 to 5%, particularly preferably 0 to 3%. If a predetermined amount of Nd 2 O 3 is added to the glass composition, the glass network of Bi 2 O 3 —B 2 O 3 glass is stabilized, and Bi 2 O 3 (bismite), Bi 2 O 3 and B 2 O 3, such as 2Bi 2 O 3 · B 2 O 3 or 12Bi 2 O 3 · B 2 O 3 is formed in the crystal is less likely to precipitate. However, if the content of Nd 2 O 3 is more than 10%, the component balance of the glass composition is impaired, and conversely, crystals are likely to precipitate on the glass.
WO3は、熱的安定性を高める成分であり、その含有量は0〜5%、特に0〜2%が好ましい。WO3の含有量が5%より多いと、ガラス組成の成分バランスが損なわれて、逆に熱的安定性が低下し易くなる。 WO 3 is a component that enhances thermal stability, and its content is preferably 0 to 5%, particularly preferably 0 to 2%. When the content of WO 3 is more than 5%, the component balance of the glass composition is impaired, and conversely, the thermal stability tends to be lowered.
In2O3は、熱的安定性を高める成分であり、その含有量は0〜3%、特に0〜1%が好ましい。In2O3の含有量が3%より多いと、バッチコストが高騰する。 In 2 O 3 is a component that enhances thermal stability, and its content is preferably 0 to 3%, particularly preferably 0 to 1%. When the content of In 2 O 3 is more than 3%, the batch cost increases.
Ga2O3は、熱的安定性を高める成分であり、その含有量は0〜3%、特に0〜1%が好ましい。Ga2O3の含有量が3%より多いと、バッチコストが高騰する。 Ga 2 O 3 is a component that enhances thermal stability, and its content is preferably 0 to 3%, particularly preferably 0 to 1%. When the content of Ga 2 O 3 is more than 3%, the batch cost increases.
P2O5は、溶融時の失透を抑制する成分であるが、その含有量が多いと、ガラスが分相し易くなるため、Al−Si合金層とAlドープ層を均一に形成し難くなる。よって、P2O5の含有量は1%以下が好ましい。 P 2 O 5 is a component that suppresses devitrification at the time of melting. However, if the content is large, the glass is likely to be phase-separated, so that it is difficult to form an Al—Si alloy layer and an Al doped layer uniformly. Become. Therefore, the content of P 2 O 5 is preferably 1% or less.
MoO3+La2O3+Y2O3+CeO2(MoO3、La2O3、Y2O3、及びCeO2の合量)は、溶融時の分相を抑制する効果があるが、これらの成分の含有量が多いと、バッチコストが高騰する。よって、MoO3+La2O3+Y2O3+CeO2の含有量は3%以下が好ましい。なお、MoO3、La2O3、Y2O3、CeO2の含有量は、各々0〜2%が好ましい。 MoO 3 + La 2 O 3 + Y 2 O 3 + CeO 2 (total amount of MoO 3 , La 2 O 3 , Y 2 O 3 , and CeO 2 ) has an effect of suppressing phase separation during melting. When the content of the component is large, the batch cost increases. Therefore, the content of MoO 3 + La 2 O 3 + Y 2 O 3 + CeO 2 is preferably 3% or less. Incidentally, MoO 3, La 2 O 3 , Y 2 O 3, the content of CeO 2 are each 0 to 2% is preferred.
本発明の電極形成用ガラスは、PbOの含有を排除するものではないが、環境的観点から実質的にPbOを含有しないことが好ましい。 Although the glass for electrode formation of the present invention does not exclude the inclusion of PbO, it is preferable that the glass does not substantially contain PbO from the environmental viewpoint.
本発明の電極形成用ガラスにおいて、軟化点は462〜520℃であり、好ましくは465〜510℃、より好ましくは470〜500℃である。軟化点が462℃より低いと、焼成時にガラスがAl粉末とSiの反応を阻害して、Al−Si合金層とAlドープ層が形成され難くなり、結果として、BSF効果を享受し難くなる。一方、軟化点が520℃より高いと、焼成時にガラスが溶け難くなるため、Al粉末とSiの反応が過剰になり、Al−Si合金層とAlドープ層が過剰に形成されて、シリコン太陽電池の光電変換効率が低下し易くなると共に、ブリスターやAlの凝集が発生し易くなる。 In the glass for electrode formation of the present invention, the softening point is 462 to 520 ° C, preferably 465 to 510 ° C, more preferably 470 to 500 ° C. When the softening point is lower than 462 ° C., the glass inhibits the reaction between the Al powder and Si during firing, and it becomes difficult to form the Al—Si alloy layer and the Al doped layer, and as a result, it is difficult to enjoy the BSF effect. On the other hand, if the softening point is higher than 520 ° C., the glass becomes difficult to melt at the time of firing, so the reaction between Al powder and Si becomes excessive, and the Al—Si alloy layer and the Al doped layer are excessively formed. The photoelectric conversion efficiency tends to decrease, and blisters and Al agglomeration easily occur.
本発明の電極形成材料は、上記の電極形成用ガラスからなるガラス粉末と、金属粉末と、ビークルとを含む。ガラス粉末は、Al粉末を結合させて、電極を形成する成分であると共に、Al粉末とSiの反応に影響を及ぼすことにより、Al−Si合金層とAlドープ層を適正に形成させる成分である。金属粉末は、電極を形成する主要成分であり、導電性を確保するための成分である。ビークルは、ペースト化するための成分であり、印刷に適した粘度を付与するための成分である。 The electrode forming material of the present invention includes glass powder made of the above electrode forming glass, metal powder, and a vehicle. Glass powder is a component that forms an electrode by bonding Al powder, and that appropriately forms an Al-Si alloy layer and an Al-doped layer by affecting the reaction between Al powder and Si. . The metal powder is a main component for forming the electrode and a component for ensuring conductivity. The vehicle is a component for making a paste, and a component for imparting a viscosity suitable for printing.
本発明の電極形成材料において、ガラス粉末の平均粒子径D50は3μm以下、2μm以下、特に1.5μm以下が好ましい。ガラス粉末の平均粒子径D50が3μmより大きいと、微細な電極パターンを形成し難くなるため、シリコン太陽電池の光電変換効率が低下し易くなる。一方、ガラス粉末の平均粒子径D50の下限は特に限定されないが、ガラス粉末の平均粒子径D50が小さ過ぎると、ガラス粉末のハンドリング性や材料収率が低下し易くなる。このような状況を考慮すれば、ガラス粉末の平均粒子径D50は0.5μm以上が好ましい。なお、(1)ガラスフィルムをボールミルで粉砕した後、得られたガラス粉末を空気分級、或いは(2)ガラスフィルムをボールミル等で粗粉砕した後、ビーズミル等で湿式粉砕すれば、上記平均粒子径D50を有するガラス粉末を作製することができる。 In the electrode forming material of the present invention, the average particle diameter D 50 of the glass powder is 3μm or less, 2 [mu] m or less, especially 1.5μm or less. Since the average particle diameter D 50 of the glass powder is hardly formed and 3μm greater than the fine electrode pattern, the photoelectric conversion efficiency of the silicon solar cells tends to decrease. On the other hand, the lower limit of the average particle diameter D 50 of the glass powder is not particularly limited, the average particle diameter D 50 of the glass powder is too small, the handling property and material yield of the glass powder tends to decrease. In view of such situation, the average particle diameter D 50 of the glass powder is preferably at least 0.5 [mu] m. (1) After the glass film is pulverized with a ball mill, the obtained glass powder is classified by air, or (2) The glass film is coarsely pulverized with a ball mill or the like and then wet pulverized with a bead mill or the like. it can be produced glass powder having a D 50.
本発明の電極形成材料において、ガラス粉末の最大粒子径Dmaxは25μm以下、20μm以下、15μm以下、10μm以下、特に10μm未満が好ましい。ガラス粉末の最大粒子径Dmaxが25μmより大きいと、微細な電極パターンを形成し難くなるため、シリコン太陽電池の光電変換効率が低下し易くなる。ここで、「最大粒子径Dmax」は、レーザー回折法で測定した値を指し、レーザー回折法により測定した際の体積基準の累積粒度分布曲線において、その積算量が粒子の小さい方から累積して99%である粒子径を表す。 In the electrode forming material of the present invention, the maximum particle diameter Dmax of the glass powder is preferably 25 μm or less, 20 μm or less, 15 μm or less, 10 μm or less, particularly preferably less than 10 μm. When the maximum particle diameter Dmax of the glass powder is larger than 25 μm, it becomes difficult to form a fine electrode pattern, and thus the photoelectric conversion efficiency of the silicon solar cell tends to be lowered. Here, the “maximum particle diameter D max ” refers to a value measured by the laser diffraction method. In the volume-based cumulative particle size distribution curve measured by the laser diffraction method, the accumulated amount is accumulated from the smaller particle. The particle diameter is 99%.
本発明の電極形成材料において、ガラス粉末の結晶化温度は550℃以上、580℃以上、特に600℃以上が好ましい。ガラス粉末の結晶化温度が550℃より低いと、ガラスの熱的安定性が低下するため、焼成時にガラスが失透し易くなり、裏面電極の機械的強度が低下し易くなる。また、ガラスが完全に失透すると、Al粉末とSiの反応を適正化し難くなり、BSF効果を享受し難くなる。ここで、「結晶化温度」は、マクロ型DTA装置で測定したピーク温度を指し、DTAは室温から測定を開始し、昇温速度は10℃/分とする。 In the electrode forming material of the present invention, the crystallization temperature of the glass powder is preferably 550 ° C. or higher and 580 ° C. or higher, particularly 600 ° C. or higher. When the crystallization temperature of the glass powder is lower than 550 ° C., the thermal stability of the glass is lowered, so that the glass is easily devitrified at the time of firing, and the mechanical strength of the back electrode is easily lowered. Further, when the glass is completely devitrified, it becomes difficult to optimize the reaction between the Al powder and Si, and it becomes difficult to enjoy the BSF effect. Here, the “crystallization temperature” refers to the peak temperature measured with a macro DTA apparatus, DTA starts measurement from room temperature, and the rate of temperature rise is 10 ° C./min.
本発明の電極形成材料において、ガラス粉末の含有量は0.2〜10質量%、0.5〜6質量%、0.7〜4質量%、特に1〜3質量%が好ましい。ガラス粉末の含有量が0.2質量%より少ないと、ブリスターやAlの凝集が生じ易くなることに加えて、裏面電極の機械的強度が低下し易くなる。一方、ガラス粉末の含有量が10質量%より多いと、焼成後にガラスが偏析し易くなり、裏面電極の導電性が低下して、シリコン太陽電池の光電変換効率が低下するおそれがある。また、ガラス粉末の含有量と金属粉末の含有量は、上記と同様の理由により、質量比で0.3:99.7〜13:87、1.5:98.5〜7:93、特に1.8:98.2〜4:96が好ましい。 In the electrode forming material of the present invention, the glass powder content is preferably 0.2 to 10% by mass, 0.5 to 6% by mass, 0.7 to 4% by mass, and particularly preferably 1 to 3% by mass. When the content of the glass powder is less than 0.2% by mass, in addition to easy aggregation of blisters and Al, the mechanical strength of the back electrode is likely to decrease. On the other hand, if the content of the glass powder is more than 10% by mass, the glass tends to segregate after firing, the conductivity of the back electrode is lowered, and the photoelectric conversion efficiency of the silicon solar cell may be lowered. In addition, the content of the glass powder and the content of the metal powder are 0.3: 99.7 to 13:87, 1.5: 98.5 to 7:93 in mass ratios for the same reason as described above, in particular. 1.8: 98.2 to 4:96 are preferred.
本発明の電極形成材料において、ガラス粉末と金属粉末の含有量は、体積比で1:99〜10:90、2:98〜6:94、特に2.5:97.5〜5:95が好ましい。ガラス粉末の含有量が少なくなると、ブリスターやAlの凝集が生じ易くなることに加えて、裏面電極の機械的強度が低下し易くなる。一方、ガラス粉末の含有量が多くなると、焼成後にガラスが偏析し易くなるため、裏面電極の導電性が低下して、シリコン太陽電池の光電変換効率が低下するおそれがある。 In the electrode forming material of the present invention, the volume ratio of the glass powder and the metal powder is 1:99 to 10:90, 2:98 to 6:94, and particularly 2.5: 97.5 to 5:95 in volume ratio. preferable. When the content of the glass powder is reduced, the mechanical strength of the back electrode is likely to be lowered in addition to the tendency of blisters and agglomeration of Al. On the other hand, when the content of the glass powder increases, the glass tends to segregate after firing, so that the conductivity of the back electrode is lowered and the photoelectric conversion efficiency of the silicon solar cell may be lowered.
本発明の電極形成材料において、金属粉末の含有量は50〜97質量%、65〜95質量%、特に70〜92質量%が好ましい。金属粉末の含有量が50質量%より少ないと、裏面電極の導電性が低下して、シリコン太陽電池の光電変換効率が低下し易くなる。一方、金属粉末の含有量が97質量%より多いと、ガラス粉末の含有量が相対的に低下するため、Al−Si合金層とAlドープ層を適正に形成し難くなる。 In the electrode forming material of the present invention, the content of the metal powder is preferably 50 to 97 mass%, 65 to 95 mass%, particularly preferably 70 to 92 mass%. When the content of the metal powder is less than 50% by mass, the conductivity of the back electrode is lowered, and the photoelectric conversion efficiency of the silicon solar cell is likely to be lowered. On the other hand, when the content of the metal powder is more than 97% by mass, the content of the glass powder is relatively lowered, so that it is difficult to properly form the Al—Si alloy layer and the Al doped layer.
本発明の電極形成材料において、金属粉末はAg、Al、Au、Cu、Pd、Pt及びこれらの合金の一種又は二種以上が好ましく、AlはBSF効果を享受する観点から特に好ましい。これらの金属粉末は、導電性が良好であると共に、本発明に係るビスマス系ガラスと適合性が良好である。このため、これらの金属粉末を用いると、焼成時にガラス中に発泡が生じ難くなると共に、ガラスが失透し難くなる。また、微細な電極パターンを形成する観点から、金属粉末の平均粒子径D50は5μm以下、3μm以下、2μm以下、特に1μm以下が好ましい。 In the electrode forming material of the present invention, the metal powder is preferably one or more of Ag, Al, Au, Cu, Pd, Pt and alloys thereof, and Al is particularly preferable from the viewpoint of enjoying the BSF effect. These metal powders have good conductivity and good compatibility with the bismuth glass according to the present invention. For this reason, when these metal powders are used, it is difficult for foaming to occur in the glass during firing, and the glass is difficult to devitrify. Further, from the viewpoint of forming a fine electrode pattern, the average particle diameter D 50 of the metal powder is preferably 5 μm or less, 3 μm or less, 2 μm or less, and particularly preferably 1 μm or less.
本発明の電極形成材料において、ビークルの含有量は5〜50質量%、特に10〜30質量%が好ましい。ビークルの含有量が5質量%より少ないと、ペースト化が困難になり、厚膜法で電極を形成し難くなる。一方、ビークルの含有量が50質量%より多いと、焼成前後で膜厚や膜幅が変動し易くなるため、所望の電極パターンを形成し難くなる。 In the electrode forming material of the present invention, the content of the vehicle is preferably 5 to 50% by mass, particularly preferably 10 to 30% by mass. When the content of the vehicle is less than 5% by mass, it becomes difficult to form a paste and it is difficult to form an electrode by the thick film method. On the other hand, when the content of the vehicle is more than 50% by mass, the film thickness and the film width are likely to fluctuate before and after firing, so that it is difficult to form a desired electrode pattern.
上記の通り、ビークルは、一般的に、有機溶媒中に樹脂を溶解させたものを指す。樹脂としては、アクリル酸エステル(アクリル樹脂)、エチルセルロース、ポリエチレングリコール誘導体、ニトロセルロース、ポリメチルスチレン、ポリエチレンカーボネート、メタクリル酸エステル等が使用可能である。特に、アクリル酸エステル、ニトロセルロース、エチルセルロースは、熱分解性が良好であるため、好ましい。有機溶媒としては、N、N’−ジメチルホルムアミド(DMF)、α−ターピネオール、高級アルコール、γ−ブチルラクトン(γ−BL)、テトラリン、ブチルカルビトールアセテート、酢酸エチル、酢酸イソアミル、ジエチレングリコールモノエチルエーテル、ジエチレングリコールモノエチルエーテルアセテート、ベンジルアルコール、トルエン、3−メトキシ−3−メチルブタノール、水、トリエチレングリコールモノメチルエーテル、トリエチレングリコールジメチルエーテル、ジプロピレングリコールモノメチルエーテル、ジプロピレングリコールモノブチルエーテル、トリプロピレングリコールモノメチルエーテル、トリプロピレングリコールモノブチルエーテル、プロピレンカーボネート、ジメチルスルホキシド(DMSO)、N−メチル−2−ピロリドン等が使用可能である。特に、α−ターピネオールは、高粘性であり、樹脂等の溶解性も良好であるため、好ましい。 As described above, the vehicle generally refers to a resin in which a resin is dissolved in an organic solvent. As the resin, acrylic acid ester (acrylic resin), ethyl cellulose, polyethylene glycol derivative, nitrocellulose, polymethylstyrene, polyethylene carbonate, methacrylic acid ester and the like can be used. In particular, acrylic acid ester, nitrocellulose, and ethylcellulose are preferable because of their good thermal decomposability. As organic solvents, N, N′-dimethylformamide (DMF), α-terpineol, higher alcohol, γ-butyllactone (γ-BL), tetralin, butyl carbitol acetate, ethyl acetate, isoamyl acetate, diethylene glycol monoethyl ether , Diethylene glycol monoethyl ether acetate, benzyl alcohol, toluene, 3-methoxy-3-methylbutanol, water, triethylene glycol monomethyl ether, triethylene glycol dimethyl ether, dipropylene glycol monomethyl ether, dipropylene glycol monobutyl ether, tripropylene glycol monomethyl Ether, tripropylene glycol monobutyl ether, propylene carbonate, dimethyl sulfoxide (DMSO) N- methyl-2-pyrrolidone and the like can be used. In particular, α-terpineol is preferable because it is highly viscous and has good solubility in resins and the like.
本発明の電極形成材料は、上記成分以外にも、熱膨張係数を調整するためにコーディエライト等のセラミックフィラー粉末、電極の表面抵抗を調整するためにNiO等の酸化物粉末、ペースト特性を調整するために界面活性剤、増粘剤、可塑剤、表面処理剤、色調を調整するために顔料等を含有してもよい。 In addition to the above components, the electrode-forming material of the present invention has ceramic filler powder such as cordierite for adjusting the thermal expansion coefficient, oxide powder such as NiO for adjusting the surface resistance of the electrode, and paste characteristics. In order to adjust, a surfactant, a thickener, a plasticizer, a surface treatment agent, a pigment or the like may be included to adjust the color tone.
本発明の電極形成材料(又は電極形成用ガラス)は、裏面電極の形成に好適であるが、受光面電極の形成に使用しても差し支えない。厚膜法で受光面電極を形成する場合、焼成時に電極形成材料が反射防止膜を貫通する現象が利用され、この現象により受光面電極と半導体層が電気的に接続される。この現象は、一般的にファイアスルーと称されている。ファイアスルーを利用すれば、受光面電極の形成に際し、反射防止膜のエッチングが不要になると共に、反射防止膜のエッチングと電極パターンの位置合わせが不要になり、シリコン太陽電池の生産効率が飛躍的に向上する。電極形成材料が反射防止膜を貫通する度合(以下、ファイアスルー性)は、電極形成材料の組成、焼成条件で変動し、特にガラス粉末のガラス組成の影響が最も大きい。また、シリコン太陽電池の光電変換効率は、電極形成材料のファイアスルー性と相関があり、ファイアスルー性が不十分であると、これらの特性が低下し、シリコン太陽電池の基本性能が低下する。本発明の電極形成材料は、上記のようにガラス粉末のガラス組成範囲を規制しているため、ファイアスルー性が良好であり、受光面電極の形成に使用可能である。本発明の電極形成材料を受光面電極の形成に用いる場合、金属粉末は、Ag粉末が好ましく、Ag粉末の含有量等は、上記の通りである。 The electrode forming material (or electrode forming glass) of the present invention is suitable for forming a back electrode, but may be used for forming a light receiving surface electrode. When the light-receiving surface electrode is formed by the thick film method, a phenomenon in which the electrode forming material penetrates the antireflection film at the time of firing is used, and this phenomenon electrically connects the light-receiving surface electrode and the semiconductor layer. This phenomenon is generally called fire-through. Using fire-through eliminates the need to etch the antireflection film and eliminates the need to etch the antireflection film and align the electrode pattern when forming the light-receiving surface electrode, dramatically improving the production efficiency of silicon solar cells. To improve. The degree to which the electrode-forming material penetrates the antireflection film (hereinafter referred to as fire-through property) varies depending on the composition of the electrode-forming material and the firing conditions, and is particularly affected by the glass composition of the glass powder. Moreover, the photoelectric conversion efficiency of a silicon solar cell correlates with the fire-through property of the electrode forming material. If the fire-through property is insufficient, these characteristics are deteriorated and the basic performance of the silicon solar cell is deteriorated. Since the electrode forming material of the present invention regulates the glass composition range of the glass powder as described above, it has good fire-through properties and can be used to form a light-receiving surface electrode. When the electrode forming material of the present invention is used for forming a light-receiving surface electrode, the metal powder is preferably Ag powder, and the content and the like of Ag powder are as described above.
受光面電極と裏面電極を別々に形成してもよいし、受光面電極と裏面電極を同時に形成してもよい。受光面電極と裏面電極を同時に形成すれば、焼成回数を減らすことができるため、シリコン太陽電池の製造効率が向上する。ここで、本発明の電極形成材料を受光面電極と裏面電極の双方に用いると、受光面電極と裏面電極を同時に形成し易くなる。 The light receiving surface electrode and the back surface electrode may be formed separately, or the light receiving surface electrode and the back surface electrode may be formed simultaneously. If the light-receiving surface electrode and the back electrode are formed at the same time, the number of firings can be reduced, so that the production efficiency of the silicon solar cell is improved. Here, when the electrode forming material of the present invention is used for both the light receiving surface electrode and the back surface electrode, it becomes easy to form the light receiving surface electrode and the back surface electrode simultaneously.
以下、実施例に基づいて、本発明を詳細に説明する。 Hereinafter, based on an Example, this invention is demonstrated in detail.
表1、2は、本発明の実施例(試料No.1〜10)及び比較例(試料No.11〜13)を示している。 Tables 1 and 2 show Examples (Sample Nos. 1 to 10) and Comparative Examples (Sample Nos. 11 to 13) of the present invention.
次のようにして、各試料を調製した。まず、表中に示したガラス組成となるように各種酸化物、炭酸塩等のガラス原料を調合し、ガラスバッチを準備した後、このガラスバッチを白金坩堝に入れ、1000〜1100℃で1〜2時間溶融した。次に、溶融ガラスの一部を押棒式熱膨張係数測定(TMA)用サンプルとしてステンレス製の金型に流し出した。その他の溶融ガラスを水冷ローラーでフィルム状に成形し、得られたガラスフィルムをボールミルで粉砕した後、目開き250メッシュの篩を通過させた上で、分級し、表中に示す平均粒子径D50のガラス粉末を得た。 Each sample was prepared as follows. First, after preparing glass batches such as various oxides and carbonates so as to have the glass composition shown in the table, and preparing a glass batch, the glass batch was put in a platinum crucible and 1 to 1000 to 1100 ° C. Melted for 2 hours. Next, a part of the molten glass was poured out into a stainless steel mold as a sample for measuring the thermal expansion coefficient of the push rod (TMA). Other molten glass was formed into a film shape with a water-cooled roller, and the obtained glass film was pulverized with a ball mill, then passed through a 250 mesh sieve, classified, and the average particle diameter D shown in the table 50 glass powders were obtained.
各試料につき、熱膨張係数α、平均粒子径D50、軟化点、熱的安定性、Alドープ層の状態、外観、電池特性を測定した。その結果を表1、2に示す。 For each sample, thermal expansion coefficient α, average particle diameter D 50 , softening point, thermal stability, state of Al-doped layer, appearance, and battery characteristics were measured. The results are shown in Tables 1 and 2.
熱膨張係数αは、TMA装置により、30〜300℃の温度範囲で測定した値である。 The thermal expansion coefficient α is a value measured in a temperature range of 30 to 300 ° C. with a TMA apparatus.
平均粒子径D50は、レーザー回折法で測定した値であり、レーザー回折法により測定した際の体積基準の累積粒度分布曲線において、その積算量が粒子の小さい方から累積して50%である粒子径である。 The average particle diameter D 50 is a value measured by a laser diffraction method, in the cumulative particle size distribution curve of the volume-based when measured by a laser diffraction method, the accumulated amount is 50% cumulative from the smaller particle The particle size.
軟化点は、マクロ型DTA装置で測定した値である。なお、マクロ型DTAの測定温度域は室温〜650℃とし、昇温速度は10℃/分とした。 The softening point is a value measured with a macro DTA apparatus. The measurement temperature range of the macro type DTA was room temperature to 650 ° C., and the rate of temperature increase was 10 ° C./min.
熱的安定性は、結晶化温度が550℃以上の場合を「○」とし、550℃未満の場合を「×」として評価した。なお、結晶化温度は、マクロ型DTA装置で測定した値であり、マクロ型DTAの測定温度域は室温〜650℃とし、昇温速度は10℃/分とした。 The thermal stability was evaluated as “◯” when the crystallization temperature was 550 ° C. or higher, and “X” when it was lower than 550 ° C. The crystallization temperature was a value measured with a macro DTA apparatus, the measurement temperature range of the macro DTA was from room temperature to 650 ° C., and the rate of temperature increase was 10 ° C./min.
得られたガラス粉末3質量%と、Al粉末(平均粒子径D50=0.5μm)75質量%と、ビークル(α−ターピネオールにアクリル酸エステルを溶解させたもの)23質量%とを三本ローラーで混練し、ペースト状の試料を得た。次に、スクリーン印刷により、シリコン半導体基板(100mm×100mm×200μm厚)の裏面であるn型層側の全面に電極形成材料を塗布し、乾燥した後、最高温度720℃で短時間焼成(焼成開始から終了まで2分、最高温度で20秒保持)し、厚みが50μmの裏面電極を得た。得られた裏面電極につき、裏面電極の表面を目視観察し、ブリスター及びAlの凝集の個数を観察することで外観を評価した。具体的には、ブリスター及びAlの凝集の個数が2個以下の場合を「○」、3〜5個の場合を「△」、6個以上の場合を「×」として、評価した。 Three of 3% by weight of the obtained glass powder, 75% by weight of Al powder (average particle diameter D 50 = 0.5 μm), and 23% by weight of vehicle (a solution of acrylic acid ester dissolved in α-terpineol) A paste-like sample was obtained by kneading with a roller. Next, an electrode forming material is applied to the entire surface of the n-type layer side which is the back surface of the silicon semiconductor substrate (100 mm × 100 mm × 200 μm thick) by screen printing, dried, and then fired at a maximum temperature of 720 ° C. for a short time (baking) 2 minutes from the start to the end and held at the maximum temperature for 20 seconds) to obtain a back electrode having a thickness of 50 μm. About the obtained back electrode, the external appearance was evaluated by visually observing the surface of the back electrode and observing the number of blisters and the aggregation of Al. Specifically, the case where the number of aggregates of blisters and Al was 2 or less was evaluated as “◯”, the case of 3 to 5 as “Δ”, and the case of 6 or more as “X”.
次のようにして、Alドープ層の状態を評価した。外観の評価で作製した裏面電極をSEM(マッピング)で観察し、シリコン半導体基板のpnジャンクションの手前までAlドープ層が形成されているものを「○」、それ以外を「×」として評価した。 The state of the Al doped layer was evaluated as follows. The back electrode produced in the appearance evaluation was observed by SEM (mapping), and the case where the Al doped layer was formed just before the pn junction of the silicon semiconductor substrate was evaluated as “◯”, and the others were evaluated as “×”.
次のようにして、電池特性を評価した。上記のペースト状の試料を用いて、常法に従い、裏面電極を形成した上で、シリコン太陽電池を作製した。次に、常法に従い、得られたシリコン太陽電池の光電変換効率を測定し、光電変換効率が17%以上である場合を「○」、17%未満である場合を「×」として、評価した。 The battery characteristics were evaluated as follows. Using the above paste-like sample, a silicon solar cell was produced after forming a back electrode according to a conventional method. Next, according to a conventional method, the photoelectric conversion efficiency of the obtained silicon solar cell was measured, and the case where the photoelectric conversion efficiency was 17% or more was evaluated as “◯”, and the case where it was less than 17% was evaluated as “X”. .
表1、2から明らかなように、試料No.1〜10は、Alドープ層、外観、電池特性の評価が良好であった。一方、試料No.11は、軟化点が低いため、Alドープ層の評価が不良であった。試料No.12、13は、軟化点が高いため、電池特性の評価が不良であった。 As apparent from Tables 1 and 2, Sample No. In Nos. 1 to 10, the evaluation of the Al-doped layer, appearance, and battery characteristics was good. On the other hand, sample No. No. 11 was poor in evaluation of the Al-doped layer because of its low softening point. Sample No. Since 12 and 13 had a high softening point, the evaluation of battery characteristics was poor.
本発明の電極形成用ガラス組成物及び電極形成材料は、シリコン太陽電池の電極、特にシリコン太陽電池の裏面電極の形成に好適に使用可能である。さらに、本発明の電極形成用ガラス組成物及び電極形成材料は、シリコン太陽電池以外の用途、例えばセラミックコンデンサ等のセラミック電子部品、フォトダイオード等の光学部品にも使用可能である。 The glass composition for electrode formation and the electrode forming material of the present invention can be suitably used for forming an electrode of a silicon solar cell, particularly a back electrode of a silicon solar cell. Furthermore, the electrode-forming glass composition and electrode-forming material of the present invention can be used for applications other than silicon solar cells, for example, ceramic electronic parts such as ceramic capacitors, and optical parts such as photodiodes.
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