JP2011233674A - Method for mounting electronic component and electronic component mounter - Google Patents

Abstract

【Task】
The image captured by the component recognition camera of the electronic component mounting device (mounter) usually shows the lead end of the component lead. However, if the inclination of the lead tip is large, the lead tip does not appear in the captured image, and the suction posture calculation is performed. This causes a problem that a component recognition error occurs in the image processing.
[Solution]
A lens or auxiliary light source for illumination is installed only in an area outside the field of view of the imaging system of the component recognition camera. By illuminating the illumination light at an angle that did not reach the component surface with conventional optical systems, the object to be observed The range corresponding to the surface tilt angle (lead tip tilt angle) is expanded. Since a lens and a light source are installed only in a region outside the imaging system field of view, it is possible to improve the performance of the illumination system without affecting the imaging system.
[Selection] Figure 8

Description

  The present invention relates to an electronic component mounting method and apparatus, and more particularly to an electronic component mounting method and apparatus suitable for mounting a component having a large number of lead electrodes on a substrate.

  An electronic component mounting apparatus (mounter) sucks an electronic component supplied from a component supply unit with a suction nozzle of a mounting head unit, and mounts the electronic component on a conveyed circuit board. At that time, the light emitted from the illuminating device is irradiated to the picked-up component and imaged by the component recognition camera, and after calculating the suction posture of the component (shift between the suction center and the component center, shift in the suction angle) by image processing, The suction posture is corrected and mounted at a predetermined position on the circuit board. In this case, when the lead electrode such as QFP (Quad Flat Package) or SOP (Small Outline Package) is provided, the illumination is performed from the vertical direction by coaxial illumination so that the lead portion is illuminated, and BGA (Ball Grid Array). When the bump electrode is provided, illumination is performed obliquely by oblique illumination. An apparatus for mounting an electronic component having such a lead electrode is described in Patent Documents 1 to 4, for example.

JP 2009-135266 A Japanese Patent Laid-Open No. 11-289199 JP 2008-227069 A JP 2009-130034 A

  In an electronic component mounting apparatus that mounts electronic components having a large number of lead electrodes on a substrate, such as QFP (Quad Flat Package) and SOP (Small Outline Package), the electronic components supplied from the component supply unit are connected to the head unit. It is sucked by the suction nozzle and mounted on the circuit board that is being transported. In that case, after picking up the picked-up part with the part recognition camera and calculating the picking posture of the part (deviation between the picking center and the part center, picking angle deviation) by image processing, correct the picking posture and fix the predetermined position on the circuit board. To implement. At this time, a large number of lead electrodes illuminated by illumination are picked up by a component recognition camera to obtain a picked-up image, and the suction posture is calculated from the many lead positions illuminated. Are not necessarily in the same plane, and some lead electrodes may be formed to be inclined with respect to other lead electrodes. When this inclination angle is large, the tip of the lead electrode formed in an inclined shape is not illuminated when picked up by the component recognition camera, and when calculating the posture of the electronic component sucked by the suction nozzle from the picked-up image, A component recognition error may occur.

  In other words, in order for the illumination light reflected on the surface of the lead electrode to reach the component recognition camera, the incident angle of the illumination light on the surface of the lead electrode increases as the tilt angle of the surface of some of the lead electrodes increases. The range also needs to be increased. However, in the configuration described in Patent Document 1, when the inclination angle of the lead electrode tip exceeds an upper limit determined by the device configuration, the illumination light is directed to the surface of the lead electrode for reaching the component recognition camera. In this case, the range of the illumination incident angle does not satisfy the above condition, and a part of the tip of the lead may not be reflected in the captured image. In such a case, an error occurs in the image processing of the suction posture calculation. Therefore, when recognizing the tilt of the component from the image of the lead electrode tip, the ability to cope with the lead electrode tip tilt is improved (that is, the observation target). Expansion of the corresponding range with respect to the surface tilt angle). However, none of the inventions described in Patent Documents 1 to 4 considers this point.

  SUMMARY OF THE INVENTION An object of the present invention is to solve the above-described problems of the prior art and to provide an electronic component mounting method and apparatus for improving the ability to cope with variations in the tilt angle of the lead electrode tip.

  In the present invention, an illumination lens or an auxiliary light source is installed only in a region outside the imaging system field of the component recognition unit, and the component is illuminated at an illumination angle that could not be illuminated by the conventional optical system, thereby The range corresponding to the surface tilt angle (lead tip tilt angle) can be expanded. As a result, since the lens and light source are installed only in the area outside the imaging system field of view, the ability of the illumination system can be improved without affecting the imaging system.

  That is, in order to achieve the above object, in the present invention, a component supply unit that supplies an electronic component, a component holding unit that holds an electronic component supplied from the component supply unit, and an electronic component that is held by the component holding unit An image pickup means for picking up an image, a component posture correction means for correcting the posture of the electronic component obtained by picking up the image with the image pickup means, and an electronic component whose posture is corrected by the component posture correction means In an apparatus for mounting an electronic component having a component mounting unit that is transported to and mounted on a predetermined position on a substrate at a predetermined position on the substrate, the imaging unit is connected to the electronic component held by the component holding unit via a lens. A light irradiating unit that irradiates illumination light, and an imaging unit that captures an image of reflected light from an electronic component irradiated with light by the light irradiating unit via a lens. The center and periphery of the lens And to irradiate the illumination light at different incident angles with respect to the electronic components in the.

  In order to achieve the above object, according to the present invention, a component supply unit that supplies an electronic component, a component holding unit that holds an electronic component supplied from the component supply unit, and an electronic component that is held by the component holding unit An image pickup means for picking up an image, a component posture correction means for correcting the posture of the electronic component obtained by picking up the image with the image pickup means, and an electronic component whose posture is corrected by the component posture correction means In an apparatus for mounting an electronic component having a component mounting unit that is transported to and mounted on a predetermined position on a substrate at a predetermined position on the substrate, the imaging unit is connected to the electronic component held by the component holding unit via a lens. A light irradiating unit that irradiates illumination light, and an imaging unit that captures an image of reflected light from an electronic component irradiated with light by the light irradiating unit through a lens, and the surface of the lens is directed toward the central part. The curvature at the periphery is small Has a diameter, the light irradiation unit was to irradiate the illumination light at different incident angles with respect to the electronic parts and the peripheral portion the central portion of the lens through the lens.

  Furthermore, in order to achieve the above object, in the present invention, the electronic component supplied from the component supply unit is held by the holding unit, the electronic component held by the holding unit is imaged, and the electronic component obtained by imaging In the electronic component mounting method for correcting the posture of the electronic component based on the image and transporting the corrected electronic component to a predetermined position on the substrate and mounting the electronic component on the substrate, the electronic component held by the holding unit In the step of imaging, the illumination light is irradiated to the electronic component at different incident angles at the central portion and the peripheral portion of the lens through the lens, and an image of the reflected light from the electronic component irradiated with the illumination light is It was made to image through.

  According to the present invention, it is possible to realize an electronic component mounting apparatus with improved ability to cope with variations in the inclination angle of the lead electrode tip. In addition, it is possible to expand the range of response to the tilt angle of the electronic component surface, improve the quality of the component recognition image, and contribute to improving the component recognition rate (reducing recognition errors) of the electronic component mounting device during component recognition. You can get the effect of doing.

FIG. 1 is an image captured by a component recognition camera of an electronic component when the inclination of the lead tip is small. FIG. 2 is an image captured by the component recognition camera of the electronic component when the inclination of the lead tip is large. FIG. 3 is a side view of the electronic component. FIG. 4 is a front view of the optical system showing the path of the illumination light when the surface of the electronic component is not inclined. FIG. 5 is a front view of the optical system showing the path of the illumination light when the surface of the electronic component is inclined. 6A is a plan view of the electronic component mounting apparatus, and FIG. 6B is a perspective view of the mounting head portion. FIG. 7 is a block diagram illustrating a schematic configuration of a control unit of the electronic component mounting apparatus. FIG. 8 is a front view showing a schematic configuration of the optical system of the component recognition unit in which the auxiliary lens is installed in front of the object side lens. FIG. 9 is a front view showing a schematic configuration of the optical system of the component recognition unit in which the auxiliary lens is installed behind the object side lens. FIG. 10 is a flowchart showing the procedure of electronic component mounting by the electronic component mounting apparatus. 11A is a plan view of the auxiliary lens, and FIG. 11B is a side view of the auxiliary lens. FIG. 12A is a plan view of a lens configured integrally, FIG. 12B is a side view of the lens configured integrally, and FIG. 12C is a side view of a lens configured integrally without a step. FIG. 13 is a front view showing a schematic configuration of an optical system of a component recognition unit in which an auxiliary illumination light source is installed instead of the auxiliary lens. FIG. 14 is a plan view of an auxiliary illumination light source showing the arrangement of the auxiliary illumination LEDs.

Embodiments of an electronic component mounting apparatus according to the present invention will be described below with reference to the drawings.
FIG. 1 shows an image 101 obtained by imaging an electronic component with a component recognition camera of the electronic component mounting apparatus. The image 101 obtained by imaging the electronic component is usually an image in which the component lead tip 102 is reflected by illumination light, and the above-described suction posture calculation is performed from the position of the lead tip 102 on the image. Can do. However, it is known that there is actually a variation in tilt angle (θ in FIG. 3) at the lead tip, and if this variation in tilt angle is large, all the lead tips in one imaging screen. As a result, it is difficult to capture an image of the regular reflection light from the lead, and as shown in FIG. This will be described with reference to FIGS.

  4 and 5 show paths through which the light beam reflected at the point P reaches the imaging surface when the point P on the component surface has and does not have an inclination angle, respectively. The surface of the component is almost a mirror surface (the incident angle and reflection angle of light at the point P are equal), and the light that reaches the imaging surface by the illumination light reflected at the point P is shown in the figure from the configuration of the imaging system. The route shall be taken.

  In the case of FIG. 4 where the point P on the component surface does not have an inclination angle, it can be seen that the illumination light source 803 is emitted when the light ray 402 reaching the imaging surface 807 is traced back from the imaging surface 807. Therefore, out of the light emitted from the illumination light source 803, partially reflected by the half mirror 802, transmitted through the objective lens 801, and reflected at the point P of the lead electrode 401, it is transmitted again through the object side lens 801. The light transmitted through the half mirror 802 reaches the imaging surface 807 (the image of the P point by the light that is regularly reflected from the P point by the illumination light emitted from the illumination light source 803 is included in the image captured on the imaging surface 807. Can be confirmed.

  On the other hand, in the case of FIG. 5 where the P point on the component surface has an inclination angle, if the light ray 502a (dotted light path) reaching the imaging surface 807 is traced back from the imaging surface 807, it is detached from the object side lens 801 and the illumination light source. 803 is not reached. It can be seen that the light beam 502b (solid line optical path) incident on the extreme end of the objective lens among the light actually emitted from the illumination light source 803 cannot reach the point P because the refraction by the object side lens 801 is not sufficient. This is because there is no light that reaches the imaging surface 807 among the illumination light emitted from the light source 803, reflected by the half mirror 802, transmitted through the object side lens 801, and regularly reflected at the point P (illumination light). (P point is not reflected in the captured image).

FIG. 5B shows an enlarged view of 503 (region surrounded by a dotted line) in FIG. 5A, and the light is reflected in the direction of the angle α with respect to the axis 504 perpendicular to the component suction surface 806. When the light ray 502a reaches the imaging surface 807, the incident angle (angle with respect to the axis 504 perpendicular to the component suction surface) of the light ray 502a to the component surface P point (surface inclination angle θ) is (2θ + α). That is, in order for the illumination light reflected at the point P on the component surface to reach the imaging surface 807, the incident angle of the illumination light 502b on the component surface P point is also increased in proportion to the inclination angle of the point P on the component surface. There is a need. )
For this reason, when the inclination angle of the lead tip is large, the incident angle of the illumination light to the component surface does not satisfy the above condition, and the lead tip is not reflected in the captured image. In such a case, an image processing error in the suction posture calculation results, and the component recognition unit is required to improve the ability to cope with the inclination of the tip of the lead (that is, to expand the correspondence range with respect to the surface inclination angle of the observation target). It will be.

  The present invention relates to the provision of an electronic component device provided with an illumination optical system that improves the ability to cope with the inclination of the lead tip.

Embodiments of the present invention will be described below with reference to the drawings.
FIG. 6A shows a plan view of the electronic component mounting apparatus. The electronic component mounting apparatus 601 includes a component supply unit 602 that supplies various electronic components, a transport unit 603 that transports and positions the printed circuit board 607, a mounting head unit 604 that sucks and mounts the electronic component 608 on the printed circuit board, and mounting A mounting head driving unit 605 that drives the head unit, and a component position recognition unit 606 that recognizes the suction state of the electronic component 608 to the mounting head are provided.

  A plurality of the component supply units 602 are installed on the feeder base 602a and the feeder base 602a attached to the apparatus main body of the electronic component mounting apparatus, and various electronic components 608 are placed one by one in the component take-out unit (component suction position). The component supply unit 602b group to supply.

  The transport unit 603 receives the printed circuit board 607 from the upstream, transports the printed circuit board 607 received from the upstream to a positioning unit (not shown), and after the electronic component 608 is mounted on the printed circuit board positioned by the positioning unit. The substrate is discharged downstream.

  FIG. 6B shows a perspective view of the mounting head unit 604 in the electronic component mounting apparatus. The mounting head portion 604 includes a plurality of suction nozzles 604a that suck electronic components, and includes a vertical axis motor 604b and a plurality of suction nozzles 604a corresponding to the suction nozzles 604a for individually moving the plurality of suction nozzles 604a up and down. A θ-axis motor 604c for rotating around the vertical axis is provided, and each suction nozzle 604a moves in the X-axis direction along the X-axis guide 605c and in the Y-axis direction along the Y-axis guide 605d, Rotation about a vertical axis driven by the shaft motor 604c and vertical movement driven by the vertical shaft motor 604b are possible. Further, the mounting head unit 604 can be moved along the X-axis guide 605c and the Y-axis 605d by the X-axis drive motor 605a and the Y-axis drive motor 605b, and is supplied from the component supply unit 602. After the electronic component 608 is sucked by the suction nozzle 604a, the electronic component 608 is moved onto the printed circuit board 607 positioned by the positioning unit, and the electronic component is mounted on the printed circuit board 607.

  The mounting head drive unit 605 includes an X-axis drive motor (605a), a Y-axis drive motor (605b), an X-axis drive guide (605c), and a Y-axis drive guide (605d). The mounting head unit 604 is driven in the XY plane.

  For example, as shown in FIG. 8, the component position recognizing unit 606 includes an illumination optical system 810 including an illumination light source and a component imaging camera (imaging optical system) 820, and an electronic component 608. Is picked up by the suction nozzle 604a, the electronic component 608 is imaged to recognize how much the electronic component 608 is displaced and held with respect to the center of the suction nozzle 604a.

  FIG. 7 is a block diagram showing the configuration of the control unit of this apparatus. A central control unit 700 includes a CPU 701, a RAM 702, and a ROM 703. The CPU 701 performs overall control of operations related to mounting of this apparatus. The CPU 701 stores the mounting data related to component mounting (position information in the X and Y directions in the printed circuit board as well as the size of the electronic component and the illumination method for component recognition) via the bus line 7001. (Random access memory) 702 and a ROM (Read Only Memory) 703 in which a program is stored are connected. Then, the CPU 701 of the central control unit 700 controls the operation related to the component mounting operation of the electronic component mounting apparatus 601 according to the program stored in the ROM 703 based on the data stored in the RAM 702. That is, the CPU 701 controls the X-axis drive motor 605a driven by the X-axis drive motor drive unit 705a and the Y-axis drive motor 605b driven by the Y-axis drive motor drive unit 705b via the X-axis Y-axis motor control unit 705. To do.

  The CPU 701 also includes a vertical drive motor 604b driven by a vertical drive motor drive unit 704a of a mounting head via a motor / vacuum pump control unit 704, and a θ drive motor driven by a θ drive motor drive unit 704b of the mounting head. The vacuum pump 620 for turning ON / OFF the suction of the electronic component 608 driven by the vacuum pump driving unit 704c is controlled. Furthermore, the CPU 701 controls the illumination light source unit 810 that operates in the illumination control circuit unit 706a and the image sensor 811 that operates in the component imaging camera control circuit unit 706b via the camera / illumination control unit 706. Further, the CPU 701 controls an image processing unit 707 that receives an image signal from the image sensor 811 and performs component recognition processing.

A component mounting operation based on the above configuration will be described with reference to FIG.
First, the printed circuit board 607 is transported from the upstream device to the transport unit 603 and positioned and fixed by a positioning mechanism (not shown) (S1001).

  Next, the CPU 201 reads out mounting data stored in the RAM 702 (consisting of X-direction, Y-direction and angular position information in the printed circuit board and arrangement number information of each component supply unit for each electronic component mounting order). (S1002) The electronic component 608 to be mounted by the suction nozzle 604a is sucked and taken out from the predetermined feeder 602b (S1003). At that time, the vertical axis motor 706 is driven by the drive circuit, and the respective suction nozzles 604a descend to suck and take out the components.

  Next, the vertical axis motor 604b is driven by the drive circuit to raise the suction nozzle 604a, and the mounting head 604 starts to move to the upper position of the printed board by the X-axis drive motor 605a and the Y-axis drive motor 605b (S1004).

In the middle of this movement, the electronic component 608 is imaged at a position above the component position recognition unit 606 (S1005), and the image processing unit 707 performs recognition processing based on the captured image, whereby the electronic component 608 is It is recognized how much the position is shifted with respect to the suction nozzle 604a and held by suction (S1006).
The recognized positional deviation amount is sent to the CPU, and based on this, the XY coordinate position to be mounted and the rotational angle position about the vertical axis stored in the RAM 702 are corrected (S1007). That is, the positional deviation of the parts in the XY directions is corrected by the X-axis motor 605a and the Y-axis motor 605b, and the rotational deviation of the parts is corrected by the θ-axis motor 604c, so that the parts are mounted at the mounting position (S1008).

  The above is sequentially executed for all the components recorded in the mounting data (S1009), and when the mounting of all the components is completed, the printed circuit board 607 is transported to the downstream apparatus by the transport unit 603.

  Next, the optical system of the component position recognizing unit 606 according to the present invention will be described in detail with reference to FIG. 8 (a cross-sectional view of the component position recognizing unit 606 as viewed from the side). The optical system is large and includes an object side lens 801, a half mirror 802, an illumination light source unit 810 (coaxial illumination unit 803, oblique illumination unit 804), and a component recognition camera 820 (aperture 809, camera lens 805, image sensor 807). The reflected light from the surface of the electronic component 608 on the object surface 806 irradiated with illumination light passes through the half mirror 802 and forms an image on the image sensor 807 via the camera lens 805, An image of the electronic component 608 is taken. The illumination light source unit 810 is configured by a combination of a coaxial illumination unit 803 and an oblique illumination unit 804.

  The coaxial illumination unit 803 has a configuration in which a large number of LEDs 803a are arranged in the same plane. After half of the light emitted from the coaxial illumination unit 803 is reflected by the half mirror 802, the object plane 806 passes through the object side lens 801. The electronic component 608 on the top is irradiated.

  Further, the oblique illumination unit 804 has a configuration in which a large number of LEDs 804a are concentrically arranged in a plurality of stages in the space between the object-side lens 801 and the object surface 806, as disclosed in Patent Document 1, for example. Light emitted from the oblique illumination LED 804a is applied to the electronic component from an oblique direction.

  Further, in this embodiment, the auxiliary lens 808 for coaxial illumination is placed in front of the object side lens 801 (the one closer to the object) only in the range outside the imaging system field of view adjacent to the object side lens 801 or the object side lens 801. Installed behind (the one closer to the image sensor). The purpose of installing the auxiliary lens 808 is to guide the coaxial illumination light (illumination light satisfying the condition of the incident angle shown in FIG. 5B) that could not be guided to the point P in FIG. 5 to the point P. The reason for installing the auxiliary lens only in the range outside the field of the imaging system is that the auxiliary lens functions only for the above purpose without affecting the imaging system (distorting the captured image).

  FIG. 8 shows a configuration in which the auxiliary lens 808 is installed in front of the object side lens 801, and FIG. 9 shows a configuration in which the auxiliary lens 808 is installed in the rear of the object side lens 801.

  In the configuration of FIG. 8, a light beam 8101 emitted from one LED 803 a 1 of the many LEDs 803 a of the coaxial illumination unit 803 is reflected by a half mirror 802, and is transmitted through the auxiliary lens 808 as a light beam 8102. The light beam 8103 passes through the object side lens 801 and enters the point P of the electronic component 608 sucked by the suction nozzle 604a at the tilt angle θ on the object surface 806. Reflected light 8104 is generated from point P, passes through the object side lens 801, becomes a light beam 8105, and enters the half mirror 802. In the half mirror 802, half of the light amount of the incident light beam 8105 is transmitted to become a light beam 8106, passes through a diaphragm 809 for blocking stray light, and is imaged on the light receiving surface 807 of the image sensor 811 by the camera lens 805. The object side lens 801 is adjusted so that the light beam 8106 transmitted through the half mirror 802 out of the transmitted light beam 8105 is condensed at the position of the stop 809.

  As described above, the light beam 8102 emitted from the coaxial illumination unit 803 and reflected by the half mirror 802 passes through the two lenses of the auxiliary lens 808 and the object-side lens 801 and becomes the light beam 8103. As shown in FIG. 5B, illumination light having a large incident angle (a dotted line in FIG. 5 (b)) is refracted greatly compared to the light ray 502b1 (solid line optical path) that has passed through only the object-side lens 801 as shown in FIG. It becomes possible to irradiate the surface of the electronic component 608 with illumination light that satisfies the condition of the incident angle indicated by the optical path 502b2. As a result, the reflected light from the point P having the same surface inclination as in FIG. 5 can reach the image pickup surface 807 of the image pickup device (the point P is lit by illumination light).

  Also in the configuration shown in FIG. 9, as in the case of FIG. 8, the light beam 8101 emitted from one LED 803a1 of the many LEDs 803a of the coaxial illumination unit 803 is reflected by the half mirror 802 and half of the light amount is reflected. 8102 passes through the object side lens 801 and then passes through the auxiliary lens 808 to become a light ray 8113 and enters the point P of the electronic component 608 sucked by the suction nozzle 604a at the inclination angle θ on the object surface 806. Reflected light 8114 is generated from the point P and is transmitted through the object side lens 801 to be a light ray 8115, is incident on the half mirror 802, and half of the light quantity is transmitted to become a light ray 8116, passes through the aperture 809, and passes through the camera lens 805. As a result, an image is formed on the light receiving surface 807 of the image sensor 811.

  Next, the shape of the auxiliary lens 808 will be described with reference to FIG. FIG. 10A shows a top view of the auxiliary lens 808 and FIG. 11B shows a side view of the auxiliary lens 808. Since the auxiliary lens 808 is installed only in a range outside the field of view of the imaging system constituted by the object side lens 801 and the camera lens 805 as described above, when the field of view of the imaging system is circular, FIG. As shown in a), the top view of the auxiliary lens 808 is annular. In FIG. 11B, the surfaces 808a and 808b are combinations of radii of curvature so that the coaxial illumination light refracted by the auxiliary lens 808 and the object side lens 801 has an incident angle shown in FIG. 5B. To.

  In addition to the configuration in which the object side lens 801 and the auxiliary lens 808 shown in the examples of FIGS. 8 and 9 are separately disposed, the object side lens 801 and the auxiliary lens 808 are integrated and replaced as a single object side lens. Is also possible. FIG. 12A shows a top view and FIG. 12B shows a side view of the object-side lens 1201 integrated at this time.

  As shown in FIG. 12B, the shape of the integrated object-side lens 1201 is a lens central portion 1201a (region in the imaging system field of view) for the purpose of forming an image of the electronic component 608 on the imaging surface 807. ) And the lens peripheral portion 1201b (region outside the imaging system field of view) for the purpose of guiding illumination light to the imaging surface 807, and the lens peripheral portion 1201b is refracted by the object-side lens 1201. The coaxial illumination light 502b2 has a curvature radius such that the incident angle (2θ + α) shown in FIG. Further, not only the auxiliary lens is integrated with the object side lens as shown in FIG. 12B, but also the level difference between the surface of the lens central portion 1201a and the lens peripheral portion 1201b as shown in FIG. 12C. Alternatively, only the curvature may be changed between the 1201a portion and the 1201b portion in the same manner as the structure shown in FIG.

  In FIG. 13, the auxiliary lens 808 is not provided, and the auxiliary lens 808 is behind the object lens 801 (closer to the image sensor surface 807) and is auxiliary to a range outside the imaging system visual field formed by the object lens 801 and the camera lens 805. A configuration in which the illumination 1301 is installed and the illumination light from the auxiliary illumination 1301 is guided to the component surface P (surface inclination angle θ) is shown. Further, FIG. 13 shows an optical path 1311 of a light beam emitted from the auxiliary illumination 1301. By installing the auxiliary illumination 1301 just behind the object side lens 801 (on the component recognition camera 820 side with respect to the object side lens 801), the optical path 502b (dotted line) of the light emitted from the coaxial illumination unit 803 shown in FIG. The incident angle of the coaxial illumination light 1311 (solid line optical path) incident on the object side lens 801 at the point S (the end portion of the opening of the object side lens 801) can be made smaller than the optical path of the object side lens 801. Only by the refraction by, the electronic component can be irradiated at the incident angle of the illumination light 502b2 shown in FIG. As a result, the reflected light from the point P having the same surface inclination as in FIG. 5B can reach the imaging surface. In the optical system shown in FIG. 13, the configuration of the optical system other than the auxiliary illumination is the same as the configuration shown in FIG.

  As in the case of the auxiliary lens 808, the auxiliary illumination 1301 needs to be installed only in a range outside the field of the imaging system field. Therefore, the LEDs 1401a are arranged concentrically in the annular region 1401 in FIG. Are shown in three rows, but the number of LEDs is not limited to three rows). As described above, by arranging the auxiliary illumination only outside the field of view of the imaging system, like the auxiliary lens 808, it is possible to improve the ability to cope with the component surface tilt angle without affecting the captured image of the camera. It becomes possible.

  DESCRIPTION OF SYMBOLS 101 ... Captured image of electronic component 102 ... Lead tip 601 ... Electronic component mounting device 602 ... Component supply unit 602a ... Feeder base 602b ... Component supply unit 603 ... Conveying unit 604 ..Mounting head portion 604a ... Suction nozzle 604b ... Up / down axis drive motor 604c ... θ drive motor 605 ... Mounting head drive portion 605a ... X-axis drive motor 605b ... Y-axis drive motor 605c ... X-axis guide 605d ... Y-axis guide 606 ... component position recognition unit 607 ... printed circuit board 608 ... electronic component 620 ... vacuum pump 700 ... central control unit 701 ... CPU 702 ... RAM 703 ... ROM 704 ... Data / vacuum pump control unit 705 ... X-axis / Y-axis motor control unit 706 ... Camera / illumination control unit 707 ... Image processing unit 800 ... Optical system 801 ... Object side lens 802 ... Half mirror 803 Coaxial illumination unit 803a LED 804 Oblique illumination unit 804a LED 805 Camera lens 807 Image sensor 808 Auxiliary lens 810 Illumination light source unit 820 ..Part recognition camera 1201 .. Object side lens 1301... Auxiliary illumination 1401 a.

Claims (13)

A component supply unit for supplying electronic components;
Component holding means for holding electronic components supplied from the component supply unit;
Imaging means for imaging the electronic component held by the component holding means;
Component posture correction means for correcting the posture held by the component holding means of the electronic component obtained by imaging with the imaging means;
Component mounting means for transporting and mounting the electronic component whose posture has been corrected by the component posture correcting means to a predetermined position on the substrate;
A device for mounting an electronic component having a predetermined position on a substrate,
The imaging unit is configured to irradiate an electronic component held by the component holding unit with illumination light through a lens, and an image of reflected light from the electronic component irradiated with light by the light irradiation unit. An imaging unit that captures an image through the lens, and the light irradiation unit irradiates the illumination light at different incident angles with respect to the electronic component at a central portion and a peripheral portion of the lens through the lens. An electronic component mounting apparatus characterized by:   The light irradiation unit emits illumination light to the electronic component through the peripheral portion of the lens at an incident angle larger than an incident angle of illumination light applied to the electronic component through the central portion of the lens. 2. The electronic component mounting apparatus according to claim 1, wherein irradiation is performed.   3. The electronic component mounting apparatus according to claim 2, wherein the lens of the light irradiation unit is configured by combining a first convex lens and a second convex lens having a hollow central portion.   4. The electronic component mounting apparatus according to claim 3, wherein a cavity in a central portion of the second convex lens is larger than a field of view of imaging of the imaging unit.   The light irradiation unit includes a first illumination light source that irradiates the electronic component with illumination light through a central portion of the lens, and the first illumination light source with respect to the electronic component through a peripheral portion of the lens. 2. The electronic component mounting apparatus according to claim 1, further comprising: a second illumination light source that irradiates illumination light at a larger incident angle.   The electronic component mounting apparatus according to claim 1, wherein the imaging unit further includes an oblique illumination unit that irradiates the electronic component held by the component holding unit with illumination light from the outside of the lens. A component supply unit for supplying electronic components;
Component holding means for holding electronic components supplied from the component supply unit;
Imaging means for imaging the electronic component held by the component holding means;
Component posture correction means for correcting the posture held by the component holding means of the electronic component obtained by imaging with the imaging means;
Component mounting means for transporting and mounting the electronic component whose posture has been corrected by the component posture correcting means to a predetermined position on the substrate;
A device for mounting an electronic component having a predetermined position on a substrate,
The imaging unit is configured to irradiate an electronic component held by the component holding unit with illumination light through a lens, and an image of reflected light from the electronic component irradiated with light by the light irradiation unit. An imaging unit that captures an image through the lens, and the surface of the lens has a small radius of curvature at a peripheral part with respect to a central part, and the light irradiation unit is in the central part of the lens through the lens. The electronic component mounting apparatus irradiates the illumination light at a different incident angle with respect to the electronic component between the peripheral portion and the peripheral portion.   The light irradiation unit emits illumination light to the electronic component through the peripheral portion of the lens at an incident angle larger than an incident angle of illumination light applied to the electronic component through the central portion of the lens. The electronic component mounting apparatus according to claim 7, wherein irradiation is performed. Hold the electronic component supplied from the component supply unit with the holding means,
Image the electronic component held by the holding means,
Correcting the posture of the electronic component based on the image of the electronic component obtained by imaging,
An electronic component mounting method for transporting the electronic component whose posture has been corrected to a predetermined position on a substrate and mounting the electronic component on the substrate,
In the step of imaging the electronic component held by the holding means, illumination light is irradiated to the electronic component at different incident angles at the central portion and the peripheral portion of the lens through the lens, and the illumination light is irradiated. An electronic component mounting method, wherein an image of reflected light from the electronic component is picked up through the lens.   The illumination light irradiated to the electronic component through the central portion of the lens is irradiated with illumination light at different incident angles to the electronic component at the central portion and the peripheral portion of the lens through the lens. The electronic component mounting method according to claim 9, wherein the electronic component is irradiated with illumination light through a peripheral portion of the lens at an incident angle larger than an incident angle with respect to the electronic component.   Irradiating illumination light to the electronic component at different incident angles at the central part and the peripheral part of the lens through the lens, a first convex lens and a second convex lens having a hollow central part 11. The electronic component mounting method according to claim 10, wherein illumination light is irradiated through a lens configured in combination.   12. The electronic component mounting method according to claim 11, wherein a cavity at a center portion of the second convex lens is larger than a field of view of imaging of the imaging unit.   In the step of imaging the electronic component held by the holding unit, an image of the reflected light from the electronic component is captured through the lens in a state where the electronic component is obliquely illuminated from the outside of the lens. The electronic component mounting method according to claim 9.

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