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JP2011222292A - Apparatus and method for power supply for plasma discharge - Google Patents

Apparatus and method for power supply for plasma discharge Download PDF

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JP2011222292A
JP2011222292A JP2010090104A JP2010090104A JP2011222292A JP 2011222292 A JP2011222292 A JP 2011222292A JP 2010090104 A JP2010090104 A JP 2010090104A JP 2010090104 A JP2010090104 A JP 2010090104A JP 2011222292 A JP2011222292 A JP 2011222292A
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discharge
power supply
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JP5623115B2 (en
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Joji Nagahira
譲二 永平
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Canon Inc
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Abstract

PROBLEM TO BE SOLVED: To provide a power supply for plasma discharge that can, even if there occurs an arc discharge, recover to stable glow-discharging.SOLUTION: The voltage is turned to a pulse voltage by a first switching element before power is supplied to the body of a plasma discharge device from a DC power supply via an inductor. A potential holding circuit in which a resistor, a capacitor and a second switching element are serially connected is operated while the first switching element is OFF, to thereby restrict arc discharge current at arc discharging.

Description

本発明は、直流電力をパルス変調する直流グロー放電を利用した、プラズマ放電用電源装置に関するものである。   The present invention relates to a plasma discharge power supply device using a direct current glow discharge for pulse-modulating direct current power.

従来から、直流グロー放電を用いてイオン窒化、プラズマ侵炭、プラズマCVD、プラズマスパッタ蒸着、マグネトロンスパッタ蒸着などを行うグロー放電処理装置が広く用いられている。グロー放電処理装置においてアーク放電が発生すると、処理対象物に損傷を与えてしまったり、グロー放電処理時間の変動により、安定した反応プロセスを維持できなくなったりする。特にレンズ等に使用する光学膜の場合、要求精度が高く課題が顕在化している。   Conventionally, glow discharge treatment apparatuses that perform ion nitriding, plasma carburization, plasma CVD, plasma sputter deposition, magnetron sputter deposition, etc. using direct current glow discharge have been widely used. When arc discharge occurs in the glow discharge treatment apparatus, the object to be treated is damaged, or a stable reaction process cannot be maintained due to fluctuations in the glow discharge treatment time. In particular, in the case of an optical film used for a lens or the like, a required accuracy is high and a problem has become apparent.

特開平7−62521(特許文献1)には、グロー放電処理装置によるアーク放電に対する処理方法が記載されている。図5は特許文献1におけるグロー放電処理装置の電気的な構成を示す回路図であり、図6はアーク放電前後の各部信号波形を示すグラフである。   Japanese Patent Application Laid-Open No. 7-62521 (Patent Document 1) describes a treatment method for arc discharge by a glow discharge treatment apparatus. FIG. 5 is a circuit diagram showing an electrical configuration of the glow discharge treatment apparatus in Patent Document 1, and FIG. 6 is a graph showing signal waveforms of respective parts before and after arc discharge.

図5において、1は直流電源、8はプラズマ放電処理装置本体(チャンバ)、9はアノード、10はカソード、16はスイッチング素子、17はアーク電流検出回路、18は制御部である。図6において縦軸は電圧、横軸は時間を示している。図6(a)はカソード10の放電電流の波形を示している。図6(b)は直流電源1の電圧波形であり、図6(c)はーク電流検出回路17によるアーク電流検出信号である。図6(d)はスイッチング素子16のON、OFF動作のタイミングを示す波形である。   In FIG. 5, 1 is a DC power source, 8 is a plasma discharge processing apparatus main body (chamber), 9 is an anode, 10 is a cathode, 16 is a switching element, 17 is an arc current detection circuit, and 18 is a control unit. In FIG. 6, the vertical axis represents voltage and the horizontal axis represents time. FIG. 6A shows the waveform of the discharge current of the cathode 10. FIG. 6B shows a voltage waveform of the DC power source 1, and FIG. 6C shows an arc current detection signal by the cake current detection circuit 17. FIG. 6D is a waveform showing the timing of the ON / OFF operation of the switching element 16.

図5、図6において、グロー放電時は、直流電源1に直列に接続されたスイッチング素子16を、図6(d)に示すようにスイッチングすることで、直流電源1からパルス電圧はアノードに供給される。(図6(a)の最初の3パルスに相当)次に、アーク放電が発生すると、図6(a)の4パルス目に示すように、放電電流が急上昇し、放電電流がアーク判定レベルLを超える。アーク判定レベルLを超えると、アーク電流検出回路17によりアーク検出信号Pを検出する。検出信号Pに基づき制御部18は、スイッチング素子16をOFFし、アノード9への給電を遮断する。これにより直流電源1の電圧一気に低下する。その後、所定の遮断期間経過後、直流電源1の電圧を回復させると共に、スイッチング素子17のパルスを制御することにより、放電電流のパルスデューティ値を徐々に上昇させながらグロー放電を徐々に開始し、通常のグロー放電状態に回復させている。   5 and 6, during glow discharge, the switching element 16 connected in series with the DC power source 1 is switched as shown in FIG. 6D, so that the pulse voltage is supplied from the DC power source 1 to the anode. Is done. (Equivalent to the first three pulses in FIG. 6A) Next, when arc discharge occurs, the discharge current rapidly rises as shown in the fourth pulse in FIG. Over. When the arc determination level L is exceeded, the arc current detection circuit 17 detects the arc detection signal P. Based on the detection signal P, the control unit 18 turns off the switching element 16 and cuts off the power supply to the anode 9. As a result, the voltage of the DC power supply 1 is reduced at once. Thereafter, after a predetermined shut-off period has elapsed, the voltage of the DC power supply 1 is restored and the pulse of the switching element 17 is controlled to gradually start glow discharge while gradually increasing the pulse duty value of the discharge current, The normal glow discharge state is restored.

特開平7−62521JP-A-7-62521

前述したように、特開平7−62521では、放電電流値をアーク判定レベルと比較し給電を遮断する方式が採用されている。しかしながら特開平7−62521の場合、アー放電発生後にアーク判定レベルLを検出してから、放電装置への給電を停止するまでの間は、回路に大きなアーク電流が流れることとなる。そのため、グロー放電への回復をするための遮断期間を長くとることが必要であった。また、放電停止後、安定なグロー放電に回復するには、放電電流のパルスデューティ値を徐々に上昇させるソフトスタート機能を持たせる必要があり、必ず回復期間を必要とする。回復期間が不充分だと、要求した精度の成膜等が実現できなくなり、回復期間を十分に取ると、処理時間が長くなり、製品のコストが高くなってしまう。   As described above, Japanese Patent Application Laid-Open No. 7-62521 employs a method in which a discharge current value is compared with an arc determination level and power feeding is interrupted. However, in the case of Japanese Patent Laid-Open No. 7-62521, a large arc current flows through the circuit after the arc determination level L is detected after the occurrence of arc discharge until the power supply to the discharge device is stopped. Therefore, it is necessary to take a long interruption period for recovery to glow discharge. In order to recover to a stable glow discharge after the discharge is stopped, it is necessary to have a soft start function for gradually increasing the pulse duty value of the discharge current, and a recovery period is always required. If the recovery period is insufficient, film formation with the required accuracy cannot be realized, and if the recovery period is sufficient, the processing time becomes long and the cost of the product increases.

そこで本出願発明の目的は、アーク放電によるグロー放電処理対象物への悪影響を、短時間で大幅に抑制抑えることができるプラズマ放電用電源装置を提供することである。   SUMMARY OF THE INVENTION An object of the present invention is to provide a plasma discharge power supply apparatus that can significantly suppress and suppress adverse effects on an glow discharge treatment object due to arc discharge in a short time.

この目的を達成するため本発明では、直流電源にプラズマ放電処理装置本体が接続されており、前記直流電源と前記プラズマ放電処理装置本体の間には、第1のスイッチング素子と、第1の抵抗と、第1のコンデンサ、第2のスイッチング素子を直列に接続した電位保持回路とが並列に接続されており、前記第1のスイッチング素子及び前記電位保持回路よりも前記直流電源側にはインダクタが直列に接続されており、前記第1、第2のスイッチング素子を交互にオン・オフ制御することで、プラズマ放電処理を連続して行うプラズマ放電処理装置を提案している。   In order to achieve this object, in the present invention, a plasma discharge processing apparatus main body is connected to a DC power supply, and a first switching element and a first resistor are provided between the DC power supply and the plasma discharge processing apparatus main body. And a potential holding circuit in which a first capacitor and a second switching element are connected in series, and an inductor is connected to the DC power supply side from the first switching element and the potential holding circuit. Proposed is a plasma discharge processing apparatus that is connected in series and that continuously performs plasma discharge processing by alternately turning on and off the first and second switching elements.

また、直流電源にプラズマ放電処理装置本体が接続されており、前記直流電源と前記プラズマ放電処理装置本体の間には、第1のスイッチング素子と、第1の抵抗と、第1のコンデンサ、第2のスイッチング素子を直列に接続した電位保持回路とが並列に接続されており、前記第1のスイッチング素子及び前記電位保持回路よりも前記直流電源側にはインダクタが直列に接続されており、プラズマ放電を起こす際には前記第1のスイッチング素子をオフ、前記第1のスイッチング素子をオンとし、プラズマ放電を停止する際には前記第1のスイッチング素子をオン、前記第1のスイッチング素子をオフとし、前記第1、第2スイッチング素子を交互にオン・オフ制御することで、プラズマ放電処理を連続して行うプラズマ放電処理方法を提案している。   In addition, a plasma discharge processing apparatus main body is connected to the DC power supply. Between the DC power supply and the plasma discharge processing apparatus main body, a first switching element, a first resistor, a first capacitor, A potential holding circuit in which two switching elements are connected in series is connected in parallel, and an inductor is connected in series on the DC power supply side with respect to the first switching element and the potential holding circuit. When the discharge occurs, the first switching element is turned off and the first switching element is turned on. When the plasma discharge is stopped, the first switching element is turned on and the first switching element is turned off. And a plasma discharge processing method for continuously performing plasma discharge processing by alternately turning on and off the first and second switching elements. To have.

以上説明したように、本出願に係る発明のプラズマ放電用電源装置によれば、アーク放電が発生したとき、アーク電流を小さく制限し、1区間内のアーク放電後、次の区間に安定したグロー放電に回復させることができる。すなわち、アーク放電の電流も小さく、アーク処理期間も短く、アークによる処理物への悪影響を、特に光学膜の場合には光学特性への悪影響を、大幅に抑えることができる。   As described above, according to the plasma discharge power supply device of the invention of the present application, when arc discharge occurs, the arc current is limited to a small value, and after the arc discharge in one section, a stable glow is generated in the next section. It can be recovered to discharge. That is, the arc discharge current is small, the arc treatment period is short, and the adverse effect of the arc on the processed material, particularly in the case of the optical film, can be greatly suppressed.

第1の実施の形態に係るプラズマ放電用電源装置の回路図Circuit diagram of power supply device for plasma discharge according to first embodiment 第1の実施の形態に係る動作説明のためのグラフThe graph for operation | movement description which concerns on 1st Embodiment 第1の実施の形態に係る動作フロー図Operation flow diagram according to the first embodiment 第2の実施の形態に係るプラズマ放電用電源装置の回路図Circuit diagram of power supply device for plasma discharge according to second embodiment 従来例に係るプラズマ放電用電源装置の回路図Circuit diagram of power supply device for plasma discharge according to conventional example 従来例に係る動作説明のためのグラフGraph for explaining operation according to conventional example

(第1の実施の形態)
以下、本発明の第1の実施の形態を図面に基づいて説明する。図1は、第1の実施の形態におけるプラズマ放電用電源装置の電気的な構成を示す回路図であり、図2はアーク放電前後の各部信号波形を示すグラフである。
(First embodiment)
DESCRIPTION OF EXEMPLARY EMBODIMENTS Hereinafter, a first embodiment of the invention will be described with reference to the drawings. FIG. 1 is a circuit diagram showing an electrical configuration of the plasma discharge power supply device according to the first embodiment, and FIG. 2 is a graph showing signal waveforms of respective parts before and after arc discharge.

図1において、1は直流電源、2はインダクタ、3は第1のスイッチング素子、4は電位保持回路、5は第2のスイッチング素子、6は第1のコンデンサ、7は第1の抵抗、8はプラズマ放電処理装置本体、9はアノード、10はカソードである。   In FIG. 1, 1 is a DC power source, 2 is an inductor, 3 is a first switching element, 4 is a potential holding circuit, 5 is a second switching element, 6 is a first capacitor, 7 is a first resistor, 8 Is a plasma discharge treatment device main body, 9 is an anode, and 10 is a cathode.

図2(a)はカソード10の放電電圧の波形を示しており、図2(b)はカソード10の放電電流の波形を示している。図2(c)はコンデンサ6の電圧の波形を示しており、図2(d)は第1のスイッチング素子3のON/OFF動作のタイミングを示す波形である。図2(e)は第2のスイッチング素子5のON/OFF動作のタイミングを示す波形であり、図2(f)はプラズマ放電処理装置本体8内の放電状態を示す。   2A shows the waveform of the discharge voltage of the cathode 10, and FIG. 2B shows the waveform of the discharge current of the cathode 10. FIG. 2C shows the waveform of the voltage of the capacitor 6, and FIG. 2D is a waveform showing the timing of the ON / OFF operation of the first switching element 3. FIG. 2E is a waveform showing the timing of the ON / OFF operation of the second switching element 5, and FIG. 2F shows the discharge state in the plasma discharge processing apparatus main body 8.

次に第1の実施の形態におけるプラズマ放電用電源装置の、アーク放電発生時の回復動作を説明する。図3は、プラズマ放電用電源装置の動作フローである。   Next, the recovery operation when arc discharge occurs in the plasma discharge power supply device according to the first embodiment will be described. FIG. 3 is an operation flow of the plasma discharge power supply device.

まず、図3における「状態S1」である放電停止状態を説明する。(図2(a)の最初のパルス印加前に相当)放電停止状態(状態S1)では、第1のスイッチング素子3(Q1)をON、第2のスイッチング素子5(Q2)をOFFにする。これにより、プラズマ放電処理装置本体8のアノード9とカソード10の間の電圧が0Vとなり、プラズマ放電処理装置本体8への電力供給が止まり、放電停止期間となる。従ってプラズマ放電処理装置本体8内の放電電流はゼロとなり、放電電圧もゼロとなる。また、第2のスイッチング素子5はOFF状態なので、電位保持回路4の動作は停止状態なっており、コンデンサ6は予め放電に必要なグロー放電電圧Vgrowに充電された状態を維持している。   First, the discharge stop state which is “state S1” in FIG. 3 will be described. In the discharge stop state (state S1) (corresponding to before the first pulse application in FIG. 2A), the first switching element 3 (Q1) is turned on and the second switching element 5 (Q2) is turned off. As a result, the voltage between the anode 9 and the cathode 10 of the plasma discharge treatment apparatus main body 8 becomes 0 V, the power supply to the plasma discharge treatment apparatus main body 8 is stopped, and the discharge stop period is entered. Therefore, the discharge current in the plasma discharge treatment apparatus main body 8 becomes zero, and the discharge voltage becomes zero. Further, since the second switching element 5 is in the OFF state, the operation of the potential holding circuit 4 is in a stopped state, and the capacitor 6 is maintained in a state charged in advance to the glow discharge voltage Vgrow necessary for discharging.

次に、図3における「状態S2」であるグロー放電状態を説明する。(図2(a)の最初のパルスに相当)グロー放電状態(状態S2)では、第1のスイッチング素子3(Q1)をOFF、第2のスイッチング素子5(Q2)をONにする。これにより、予め放電に必要な電位を第1のコンデンサ6から、第1の抵抗7を介して、プラズマ放電処理装置本体8のアノード9とカソード10の間に電圧を与え、アノード9とカソード10の間で放電を開始させる。放電が開始されると、直流電源1から、インダクタ2を介して、電力がプラズマ放電処理装置本体8に供給される。アノード9とカソード10の間のカソード近辺にグロー放電の状態が形成される。   Next, the glow discharge state which is “state S2” in FIG. 3 will be described. In the glow discharge state (state S2) (corresponding to the first pulse in FIG. 2A), the first switching element 3 (Q1) is turned off and the second switching element 5 (Q2) is turned on. As a result, a potential necessary for discharge is applied in advance between the anode 9 and the cathode 10 of the plasma discharge processing apparatus body 8 from the first capacitor 6 via the first resistor 7. The discharge is started between. When the discharge is started, power is supplied from the DC power source 1 to the plasma discharge processing apparatus main body 8 via the inductor 2. A glow discharge state is formed near the cathode between the anode 9 and the cathode 10.

コンデンサ6の電圧は、図2(c)で示すようにグロー放電電圧(Vgrow)が充電されており、電位保持回路4からの電流は流れず、カソード10に流れる電流はインダクタ2に流れる電流ILである。インダクタ2に流れる電流ILの変化率は直流電源1の電圧値(Vdc)とグロー放電電圧(Vgrow)の電圧差に依存し、(Vdc−Vgrow)÷(インダクタ2のインダクタンス値)に応じて変化する。インダクタ2のインダクタンス値を例えば10mHと十分大きめにとることにより、インダクタ2に流れる電流ILはほぼ一定のグロー放電電流(Igrow)になる。また、グロー放電状態では、アノード9とカソード10の間の放電電圧をVgrowに維持し、放電電流をIgrowに維持できるよう、直流電圧1の電源電圧を制御している。   As shown in FIG. 2C, the voltage of the capacitor 6 is charged with a glow discharge voltage (Vgrow), the current from the potential holding circuit 4 does not flow, and the current flowing through the cathode 10 is the current IL flowing through the inductor 2. It is. The rate of change of the current IL flowing through the inductor 2 depends on the voltage difference between the voltage value (Vdc) of the DC power supply 1 and the glow discharge voltage (Vgrow), and changes according to (Vdc−Vgrow) ÷ (inductance value of the inductor 2). To do. By making the inductance value of the inductor 2 sufficiently large, for example, 10 mH, the current IL flowing through the inductor 2 becomes a substantially constant glow discharge current (Igrow). In the glow discharge state, the power supply voltage of the DC voltage 1 is controlled so that the discharge voltage between the anode 9 and the cathode 10 is maintained at Vgrow and the discharge current is maintained at Igrow.

次に、グロー放電状態でアーク放電が発生せず、放電停止しない場合は、図3に示すように、放電停止状態「状態S1」(図2(a)の1パルス目の2パルス目の間、2パルス目の3パルス目の間、3パルス目の4パルス目の間に相当)とグロー放電状態「状態S2」(図2(a)の2パルス目、3パルス目に相当)を繰り返す。これにより、プラズマ状態の消滅、発生を繰り返す。また、グロー放電状態でアーク放電が起こると、「状態S3」であるアーク放電状態となる(図2(a)の4パルス目に相当)。   Next, when the arc discharge does not occur in the glow discharge state and the discharge does not stop, as shown in FIG. 3, the discharge stop state “state S1” (between the second pulse of the first pulse in FIG. 2A) (Equivalent between the second pulse and the third pulse) and the glow discharge state “state S2” (corresponding to the second and third pulses in FIG. 2A) are repeated. . Thereby, the extinction and generation of the plasma state are repeated. When arc discharge occurs in the glow discharge state, an arc discharge state “state S3” is obtained (corresponding to the fourth pulse in FIG. 2A).

次に、図3における「状態S3」であるグロー放電状態でアーク放電が起こった状態を説明する。(図2(a)の4パルス目に相当)アーク放電状態(状態S3)では、第1のスイッチング素子3をOFF、第2のスイッチング素子5をONであり、「状態S2」から変化していない。   Next, a state where arc discharge has occurred in the glow discharge state which is “state S3” in FIG. 3 will be described. (Corresponding to the fourth pulse in FIG. 2A) In the arc discharge state (state S3), the first switching element 3 is OFF, the second switching element 5 is ON, and the state has changed from “state S2”. Absent.

アーク放電状態の時、アノード9とカソード10の間の放電電圧はグロー放電時の電圧Vgrowから降下しアーク放電時の電圧Varcになる。それに伴い、カソード10に流れる電流(Iarc)は、急激に増加しようとし、コンデンサ6の電圧が抵抗7を介して放電されていく。ただし電流Iarcはインダクタ2に流れる電流ILと抵抗7に流れる電流Irとの和であるため、電流IL、電流Irを抑制すれば、電流Iarcの増加を低減できる。   In the arc discharge state, the discharge voltage between the anode 9 and the cathode 10 drops from the voltage Vgrow at the time of glow discharge and becomes the voltage Varc at the time of arc discharge. Accordingly, the current (Iarc) flowing through the cathode 10 tends to increase rapidly, and the voltage of the capacitor 6 is discharged through the resistor 7. However, since the current Iarc is the sum of the current IL flowing through the inductor 2 and the current Ir flowing through the resistor 7, an increase in the current Iarc can be reduced by suppressing the current IL and the current Ir.

インダクタ2に流れる電流ILは、直流電源1の電圧値(Vdc)とアノード9とカソード10の間の放電電圧(Varc)との電圧差に依存し、(Vdc−Varc)÷(インダクタ2のインダクタンス値)に応じて変化する。インダクタ2の値を例えば10mHと十分大きめにとることにより、インダクタ2に流れる電流ILをほぼ一定のグロー放電電流Igrowにする。また、第1の抵抗7に流れる電流Irは、グロー放電電圧(Vgrow)とアノード9とカソード10の間の放電電圧(Varc)との電圧差に依存し、(Vgrow−Varc)÷(抵抗7の抵抗値)となり、一定の値Iarcrとなる。従って、アーク放電時に、カソード10に流れる電流(Iarc)は、Igrow +Iarcrとなる。すなわち、例えばIarcrがIgrowの約5分の1になるように抵抗7の抵抗値を決めることにより、アーク放電中でもアーク電流を低く抑えることができる。   The current IL flowing through the inductor 2 depends on the voltage difference between the voltage value (Vdc) of the DC power supply 1 and the discharge voltage (Varc) between the anode 9 and the cathode 10, and (Vdc−Varc) ÷ (inductance of the inductor 2). Value). By making the value of the inductor 2 sufficiently large, for example, 10 mH, the current IL flowing through the inductor 2 is set to a substantially constant glow discharge current Igrow. The current Ir flowing through the first resistor 7 depends on the voltage difference between the glow discharge voltage (Vgrow) and the discharge voltage (Varc) between the anode 9 and the cathode 10, and (Vgrow−Varc) ÷ (resistance 7 Resistance value) and a constant value Iarcr. Therefore, the current (Iarc) flowing through the cathode 10 during arc discharge is Igrow + Iarcr. That is, for example, by determining the resistance value of the resistor 7 so that Iarcr is about one fifth of Igrow, the arc current can be kept low even during arc discharge.

次に、第1のスイッチング素子3(Q1)をON、第2のスイッチング素子5(Q2)をOFFにすることにより、放電停止状態(状態S1)となる(図2(a)の4パルス目と5パルス目の間に相当)。   Next, when the first switching element 3 (Q1) is turned on and the second switching element 5 (Q2) is turned off, the discharge is stopped (state S1) (the fourth pulse in FIG. 2A). And equivalent to the fifth pulse).

次に、第1のスイッチング素子3(Q1)をOFF、第2のスイッチング素子5(Q2)をONにすることにより、グロー放電状態(状態S2)となる(図2(a)の5パルス目に相当)。   Next, the first switching element 3 (Q1) is turned OFF and the second switching element 5 (Q2) is turned ON, so that a glow discharge state (state S2) is obtained (the fifth pulse in FIG. 2A). Equivalent).

このように、アーク放電状態(状態S3)において、電位保持回路4により放電電流は制限することで、アーク電流を低く抑えている。そのため、5パルス目のグロー放電状態への切り替えタイミングを、変更する事無く継続することができる。すなわち、本実施の形態では、図1に示す電位保持回路4を設けることで、通常のグロー放電状態のON/OFFの切り替えをそのまま継続しても、アーク放電の発生したパルス以外のパルスには影響を及ぼす事無く、アーク放電電流の上昇を防ぎ、一回の放電停止期間の後、すぐにグロー放電に回復させることができる。また急上昇するアーク電流を検出し、放電を制御する手段も必要としない。   In this way, in the arc discharge state (state S3), the discharge current is limited by the potential holding circuit 4 so that the arc current is kept low. Therefore, the switching timing to the glow discharge state of the fifth pulse can be continued without being changed. That is, in the present embodiment, by providing the potential holding circuit 4 shown in FIG. 1, even if the normal glow discharge state ON / OFF switching is continued as it is, pulses other than the pulse in which arc discharge has occurred are included. Without any influence, it is possible to prevent an increase in arc discharge current and to recover to glow discharge immediately after a single discharge stop period. Also, no means for detecting the rapidly rising arc current and controlling the discharge is required.

また、第1のコンデンサ6の電圧の放電電圧はコンデンサと抵抗の時定数とアーク放電時間に依存している。第1第2のスイッチング素子3,5を交互オン・オフにする周期よりも、コンデンサと抵抗の時定数を大きくすることにより、コンデンサ6の電圧降下を抑制できる。第1のコンデンサ6の電圧降下を小さくすることにより、次の放電開始時に更に安定したグロー放電に回復させることができる。   The discharge voltage of the voltage of the first capacitor 6 depends on the capacitor and resistance time constant and the arc discharge time. The voltage drop of the capacitor 6 can be suppressed by increasing the time constant of the capacitor and the resistor than the period in which the first and second switching elements 3 and 5 are alternately turned on and off. By reducing the voltage drop of the first capacitor 6, it is possible to recover a more stable glow discharge at the start of the next discharge.

(第2の実施の形態)
以下、本発明の第2の実施の形態を図面に基づいて説明する。図4(a)は、プラズマ放電用電源装置の電気的な構成を示す回路図である。尚、図1に示した第1の実施の形態と同じ部材には同じ符号を付し、その説明は省略する。
(Second Embodiment)
Hereinafter, a second embodiment of the present invention will be described with reference to the drawings. FIG. 4A is a circuit diagram showing an electrical configuration of the plasma discharge power supply device. In addition, the same code | symbol is attached | subjected to the same member as 1st Embodiment shown in FIG. 1, and the description is abbreviate | omitted.

図4(a)のおいて、第1の実施の形態の図1と異なるのは、第1の抵抗7と並列に、直列に接続された第2の抵抗12と第1のダイオード13が設けられている点である。   In FIG. 4A, the difference from FIG. 1 of the first embodiment is that a second resistor 12 and a first diode 13 connected in series are provided in parallel with the first resistor 7. This is the point.

第1の実施の形態と同様に、図3のグロー放電状態(状態S2)において、コンデンサ6にVgrowの電圧が充電されている。アーク放電が起こり、アーク放電状態(状態S3)に移ると、アノード9とカソード10の間の放電電圧はグロー放電時の電圧Vgrowからアーク放電時の電圧Varcになる。第1のコンデンサ6の電圧が第1の抵抗7を介して放電されていく。   Similar to the first embodiment, the capacitor 6 is charged with a voltage of Vgrow in the glow discharge state (state S2) of FIG. When arc discharge occurs and the arc discharge state (state S3) is entered, the discharge voltage between the anode 9 and the cathode 10 changes from the voltage Vgrow during glow discharge to the voltage Varc during arc discharge. The voltage of the first capacitor 6 is discharged through the first resistor 7.

アーク放電状態(状態S3)から放電停止状態(状態S1)を経由し、グロー放電状態になると、第1のスイッチング素子3をオフになる。この時インダクタ2に流れている電流を流れやすくするため、放電開始電圧まで出力電圧が上がる。放電が開始されグロー放電が始まる。グロー放電の電位とコンデンサ6の電位差で抵抗7だけでなく第1のダイオード13が導通し、第2の抵抗12を介して電流が流れ、第1のコンデンサ6が早く充電され、コンデンサの電圧が早く回復し、更に安定したグロー放電に回復することができる。   When the arc discharge state (state S3) is changed to the glow discharge state via the discharge stop state (state S1), the first switching element 3 is turned off. At this time, in order to make the current flowing through the inductor 2 easy to flow, the output voltage rises to the discharge start voltage. Discharge starts and glow discharge begins. The difference between the potential of the glow discharge and the capacitor 6 causes not only the resistor 7 but also the first diode 13 to conduct, current flows through the second resistor 12, the first capacitor 6 is quickly charged, and the voltage of the capacitor is reduced. It recovers quickly and can recover to a more stable glow discharge.

また、状態S1から状態S2への通常の放電開始時においてもインダクタ2によるサージ電圧をコンデンサ6とダイオード13と抵抗12で吸収する効果もある。また、抵抗回路の他の実施例として、図4(b)に示したように、第1の抵抗7と直列に、お互いが並列に接続された第3の抵抗15と第2のダイオ−ド14が接続されている。アーク放電時は図4(a)の第1の抵抗7に流れるのに対し、図4(b)では、第1の抵抗7と第3の抵抗15に流れ同じ効果が得られる。放電停止状態(状態S1)から状態S2になった時、第1の抵抗7,第1のダイオード13、第2の抵抗12に電流が流れるのに対し、主に第2のダイオード14、第3の抵抗15に電流が流れ同じ効果が得られる。すなわち、アーク放電後、次の放電時に、インダクタによるサージ電圧を前記抵抗回路で抑制し、コンデンサの電圧を早く回復させることにより、更に安定したグロー放電に回復させることができる。   In addition, the surge voltage from the inductor 2 is also absorbed by the capacitor 6, the diode 13, and the resistor 12 at the start of normal discharge from the state S1 to the state S2. As another embodiment of the resistor circuit, as shown in FIG. 4B, a third resistor 15 and a second diode connected in parallel with each other in series with the first resistor 7 are provided. 14 is connected. In the arc discharge, the current flows through the first resistor 7 in FIG. 4A, whereas in FIG. 4B, the current flows through the first resistor 7 and the third resistor 15, and the same effect is obtained. When the discharge stop state (state S1) is changed to the state S2, current flows through the first resistor 7, the first diode 13, and the second resistor 12, while the second diode 14 and the third diode are mainly used. A current flows through the resistor 15 and the same effect is obtained. That is, after the arc discharge, during the next discharge, the surge voltage due to the inductor is suppressed by the resistor circuit, and the voltage of the capacitor is recovered quickly, so that a more stable glow discharge can be recovered.

1 直流電源
2 インダクタ
3、5、16 スイッチング素子
4 電位保持回路
6 コンデンサ
7、12、15 抵抗
8 プラズマ放電処理装置本体
9 アノード
10 カソード
11 抵抗回路
13、14 ダイオード
17 アーク電流検出回路
18 制御部
DESCRIPTION OF SYMBOLS 1 DC power supply 2 Inductor 3, 5, 16 Switching element 4 Potential holding circuit 6 Capacitor 7, 12, 15 Resistance 8 Plasma discharge processing apparatus main body 9 Anode 10 Cathode 11 Resistance circuit 13, 14 Diode 17 Arc current detection circuit 18 Control part

Claims (5)

直流電源にプラズマ放電処理装置本体が接続されており、前記直流電源と前記プラズマ放電処理装置本体の間には、第1のスイッチング素子と、第1の抵抗と、第1のコンデンサ、第2のスイッチング素子を直列に接続した電位保持回路とが並列に接続されており、前記第1のスイッチング素子及び前記電位保持回路よりも前記直流電源側にはインダクタが直列に接続されており、前記第1、第2のスイッチング素子を交互にオン・オフ制御することで、プラズマ放電処理を連続して行うことを特徴とするプラズマ放電処理装置。   A plasma discharge processing apparatus main body is connected to the DC power supply, and a first switching element, a first resistor, a first capacitor, a second capacitor are connected between the DC power supply and the plasma discharge processing apparatus main body. A potential holding circuit in which switching elements are connected in series is connected in parallel, and an inductor is connected in series on the DC power supply side with respect to the first switching element and the potential holding circuit, and the first A plasma discharge treatment apparatus that performs plasma discharge treatment continuously by alternately turning on and off the second switching element. 前記電位保持回路の抵抗とコンデンサとの時定数を、前記第1、第2のスイッチング素子を交互オン・オフにする周期以上であることを特徴とする請求項1に記載のプラズマ放電用電源装置。   2. The plasma discharge power supply device according to claim 1, wherein a time constant between a resistor and a capacitor of the potential holding circuit is equal to or longer than a period in which the first and second switching elements are alternately turned on and off. . 前記電位保持回路には、前記第1の抵抗と並列に、直列に接続された第1のダイオードと第2の抵抗が、さらに接続されていることを特徴とする請求項1に記載のプラズマ放電用電源装置。   2. The plasma discharge according to claim 1, wherein a first diode and a second resistor connected in series are further connected to the potential holding circuit in parallel with the first resistor. Power supply. 前記電位保持回路には、前記第1の抵抗と直列に、お互いが並列に接続された第3の抵抗と第2のダイオ−ドが、さらに接続されていることを特徴とする請求項1に記載のプラズマ放電用電源装置。   2. The potential holding circuit further comprises a third resistor and a second diode connected in parallel with each other in series with the first resistor. The power supply device for plasma discharge as described. 直流電源にプラズマ放電処理装置本体が接続されており、前記直流電源と前記プラズマ放電処理装置本体の間には、第1のスイッチング素子と、第1の抵抗と、第1のコンデンサ、第2のスイッチング素子を直列に接続した電位保持回路とが並列に接続されており、前記第1のスイッチング素子及び前記電位保持回路よりも前記直流電源側にはインダクタが直列に接続されており、プラズマ放電を起こす際には前記第1のスイッチング素子をオフ、前記第1のスイッチング素子をオンとし、プラズマ放電を停止する際には前記第1のスイッチング素子をオン、前記第1のスイッチング素子をオフとし、前記第1、第2スイッチング素子を交互にオン・オフ制御することで、プラズマ放電処理を連続して行うことを特徴とするプラズマ放電処理方法。   A plasma discharge processing apparatus main body is connected to the DC power supply, and a first switching element, a first resistor, a first capacitor, a second capacitor are connected between the DC power supply and the plasma discharge processing apparatus main body. A potential holding circuit in which switching elements are connected in series is connected in parallel, and an inductor is connected in series to the DC power supply side from the first switching element and the potential holding circuit, and plasma discharge is performed. When waking up, the first switching element is turned off, the first switching element is turned on, and when the plasma discharge is stopped, the first switching element is turned on, and the first switching element is turned off, The plasma discharge process is performed continuously by alternately turning on and off the first and second switching elements. Law.
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Cited By (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140062495A1 (en) * 2012-08-28 2014-03-06 Advanced Energy Industries, Inc. Systems and methods for monitoring faults, anomalies, and other characteristics of a switched mode ion energy distribution system
US9147555B2 (en) 2010-07-20 2015-09-29 Trumpf Huettinger Gmbh + Co. Kg Arc extinction arrangement and method for extinguishing arcs
JP2019528369A (en) * 2017-05-10 2019-10-10 アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated Pulsed DC power supply
US10607813B2 (en) 2017-11-17 2020-03-31 Advanced Energy Industries, Inc. Synchronized pulsing of plasma processing source and substrate bias
US10707055B2 (en) 2017-11-17 2020-07-07 Advanced Energy Industries, Inc. Spatial and temporal control of ion bias voltage for plasma processing
US10811229B2 (en) 2017-11-17 2020-10-20 Advanced Energy Industries, Inc. Synchronization with a bias supply in a plasma processing system
US11011349B2 (en) 2009-05-01 2021-05-18 Aes Global Holdings, Pte. Ltd. System, method, and apparatus for controlling ion energy distribution in plasma processing systems
US11615941B2 (en) 2009-05-01 2023-03-28 Advanced Energy Industries, Inc. System, method, and apparatus for controlling ion energy distribution in plasma processing systems
JP2023513130A (en) * 2020-02-10 2023-03-30 ラム リサーチ コーポレーション Separation of radio frequency (RF) signals from process chamber input signal conductors
US11670487B1 (en) 2022-01-26 2023-06-06 Advanced Energy Industries, Inc. Bias supply control and data processing
US11942309B2 (en) 2022-01-26 2024-03-26 Advanced Energy Industries, Inc. Bias supply with resonant switching
US11978613B2 (en) 2022-09-01 2024-05-07 Advanced Energy Industries, Inc. Transition control in a bias supply
US12046448B2 (en) 2022-01-26 2024-07-23 Advanced Energy Industries, Inc. Active switch on time control for bias supply
US12159767B2 (en) 2017-11-17 2024-12-03 Advanced Energy Industries, Inc. Spatial control of plasma processing environments
US12230476B2 (en) 2017-11-17 2025-02-18 Advanced Energy Industries, Inc. Integrated control of a plasma processing system
US12283462B2 (en) 2020-06-12 2025-04-22 Lam Research Corporation Control of plasma formation by RF coupling structures
US12394601B2 (en) 2019-12-02 2025-08-19 Lam Research Corporation Impedance transformation in radio-frequency-assisted plasma generation
US12505986B2 (en) 2017-11-17 2025-12-23 Advanced Energy Industries, Inc. Synchronization of plasma processing components

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS545198A (en) * 1977-06-14 1979-01-16 Nissin Electric Co Ltd Arc stabilizing source device
JPS57194111U (en) * 1981-05-30 1982-12-09
JP2000148082A (en) * 1998-11-13 2000-05-26 Mitsubishi Electric Corp Drive circuit for plasma display panel and plasma display device
JP2004006146A (en) * 2002-05-31 2004-01-08 Shibaura Mechatronics Corp Power supply for discharge, power supply for sputtering and sputtering equipment
JP2009283157A (en) * 2008-05-20 2009-12-03 Nagano Japan Radio Co Plasma processing device

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS545198A (en) * 1977-06-14 1979-01-16 Nissin Electric Co Ltd Arc stabilizing source device
JPS57194111U (en) * 1981-05-30 1982-12-09
JP2000148082A (en) * 1998-11-13 2000-05-26 Mitsubishi Electric Corp Drive circuit for plasma display panel and plasma display device
JP2004006146A (en) * 2002-05-31 2004-01-08 Shibaura Mechatronics Corp Power supply for discharge, power supply for sputtering and sputtering equipment
JP2009283157A (en) * 2008-05-20 2009-12-03 Nagano Japan Radio Co Plasma processing device

Cited By (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11011349B2 (en) 2009-05-01 2021-05-18 Aes Global Holdings, Pte. Ltd. System, method, and apparatus for controlling ion energy distribution in plasma processing systems
US11615941B2 (en) 2009-05-01 2023-03-28 Advanced Energy Industries, Inc. System, method, and apparatus for controlling ion energy distribution in plasma processing systems
US9147555B2 (en) 2010-07-20 2015-09-29 Trumpf Huettinger Gmbh + Co. Kg Arc extinction arrangement and method for extinguishing arcs
US9685297B2 (en) * 2012-08-28 2017-06-20 Advanced Energy Industries, Inc. Systems and methods for monitoring faults, anomalies, and other characteristics of a switched mode ion energy distribution system
US12142452B2 (en) 2012-08-28 2024-11-12 Advanced Energy Industries, Inc. Systems and methods for monitoring faults, anomalies, and other characteristics of a switched mode ion energy distribution system
US20140062495A1 (en) * 2012-08-28 2014-03-06 Advanced Energy Industries, Inc. Systems and methods for monitoring faults, anomalies, and other characteristics of a switched mode ion energy distribution system
US11189454B2 (en) 2012-08-28 2021-11-30 Aes Global Holdings, Pte. Ltd. Systems and methods for monitoring faults, anomalies, and other characteristics of a switched mode ion energy distribution system
JP2019528369A (en) * 2017-05-10 2019-10-10 アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated Pulsed DC power supply
US10811229B2 (en) 2017-11-17 2020-10-20 Advanced Energy Industries, Inc. Synchronization with a bias supply in a plasma processing system
US10607813B2 (en) 2017-11-17 2020-03-31 Advanced Energy Industries, Inc. Synchronized pulsing of plasma processing source and substrate bias
US10811228B2 (en) 2017-11-17 2020-10-20 Advanced Energy Industries, Inc. Control of plasma processing systems that include plasma modulating supplies
US10811227B2 (en) 2017-11-17 2020-10-20 Advanced Energy Industries, Inc. Application of modulating supplies in a plasma processing system
US10707055B2 (en) 2017-11-17 2020-07-07 Advanced Energy Industries, Inc. Spatial and temporal control of ion bias voltage for plasma processing
US12505986B2 (en) 2017-11-17 2025-12-23 Advanced Energy Industries, Inc. Synchronization of plasma processing components
US11842884B2 (en) 2017-11-17 2023-12-12 Advanced Energy Industries, Inc. Spatial monitoring and control of plasma processing environments
US12230476B2 (en) 2017-11-17 2025-02-18 Advanced Energy Industries, Inc. Integrated control of a plasma processing system
US10896807B2 (en) 2017-11-17 2021-01-19 Advanced Energy Industries, Inc. Synchronization between an excitation source and a substrate bias supply
US12159767B2 (en) 2017-11-17 2024-12-03 Advanced Energy Industries, Inc. Spatial control of plasma processing environments
US12394601B2 (en) 2019-12-02 2025-08-19 Lam Research Corporation Impedance transformation in radio-frequency-assisted plasma generation
JP7608467B2 (en) 2020-02-10 2025-01-06 ラム リサーチ コーポレーション Isolation of radio frequency (RF) signals from input signal conductors of a process chamber - Patents.com
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US12283462B2 (en) 2020-06-12 2025-04-22 Lam Research Corporation Control of plasma formation by RF coupling structures
US12046448B2 (en) 2022-01-26 2024-07-23 Advanced Energy Industries, Inc. Active switch on time control for bias supply
US11942309B2 (en) 2022-01-26 2024-03-26 Advanced Energy Industries, Inc. Bias supply with resonant switching
US11670487B1 (en) 2022-01-26 2023-06-06 Advanced Energy Industries, Inc. Bias supply control and data processing
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