[go: up one dir, main page]

JP2011214036A - Cu-Zn ALLOY STRIP FOR TAB MATERIAL FOR CONNECTING CELLS - Google Patents

Cu-Zn ALLOY STRIP FOR TAB MATERIAL FOR CONNECTING CELLS Download PDF

Info

Publication number
JP2011214036A
JP2011214036A JP2010081028A JP2010081028A JP2011214036A JP 2011214036 A JP2011214036 A JP 2011214036A JP 2010081028 A JP2010081028 A JP 2010081028A JP 2010081028 A JP2010081028 A JP 2010081028A JP 2011214036 A JP2011214036 A JP 2011214036A
Authority
JP
Japan
Prior art keywords
alloy
alloy strip
rolling
final
mass
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2010081028A
Other languages
Japanese (ja)
Other versions
JP5490594B2 (en
Inventor
Naofumi Maeda
直文 前田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JX Nippon Mining and Metals Corp
Original Assignee
JX Nippon Mining and Metals Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by JX Nippon Mining and Metals Corp filed Critical JX Nippon Mining and Metals Corp
Priority to JP2010081028A priority Critical patent/JP5490594B2/en
Priority to TW100108503A priority patent/TWI443203B/en
Priority to PCT/JP2011/057438 priority patent/WO2011125555A1/en
Priority to CN2011800169739A priority patent/CN102812137A/en
Priority to KR1020127028279A priority patent/KR101414882B1/en
Publication of JP2011214036A publication Critical patent/JP2011214036A/en
Application granted granted Critical
Publication of JP5490594B2 publication Critical patent/JP5490594B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C9/00Alloys based on copper
    • C22C9/04Alloys based on copper with zinc as the next major constituent
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01MPROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/50Current conducting connections for cells or batteries
    • H01M50/531Electrode connections inside a battery casing
    • H01M50/533Electrode connections inside a battery casing characterised by the shape of the leads or tabs
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22FCHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/02Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working in inert or controlled atmosphere or vacuum
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22FCHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00Electroplating characterised by the article coated
    • C25D7/06Wires; Strips; Foils
    • C25D7/0614Strips or foils
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01MPROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/50Current conducting connections for cells or batteries
    • H01M50/531Electrode connections inside a battery casing
    • H01M50/534Electrode connections inside a battery casing characterised by the material of the leads or tabs
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01MPROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/50Current conducting connections for cells or batteries
    • H01M50/531Electrode connections inside a battery casing
    • H01M50/536Electrode connections inside a battery casing characterised by the method of fixing the leads to the electrodes, e.g. by welding
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10Energy storage using batteries

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Metallurgy (AREA)
  • Materials Engineering (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Conductive Materials (AREA)
  • Connection Of Batteries Or Terminals (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

【課題】 良好な繰返し曲げ性と溶接性を有する電池接続タブ材に好適なCu−Zn系合金。
【解決手段】 2〜12質量%のZnを含有し、残部が銅および不可避不純物から成る銅合金であって、双晶境界頻度が40〜70%である充電用電池タブに用いられるCu−Zn系合金条。この合金条は更に0.1〜0.8質量%のSnを含有してもよく、圧延平行方向および直角方向の結晶粒径のアスペクト比が0.3〜0.7でもよく、更にNi、Mg、Fe、P、AlおよびAgのなかの少なくとも一種以上を合計で0.005〜0.5質量%含有してもよい。上記Cu−Zn系合金に0.3〜2μmのSnめっきを施したCu−Zn系合金Snめっき合金条も提供する。
【選択図】 なし
PROBLEM TO BE SOLVED: To provide a Cu-Zn alloy suitable for a battery connection tab material having good repeated bendability and weldability.
SOLUTION: Cu-Zn used for a charging battery tab containing 2 to 12% by mass of Zn, the balance being copper and inevitable impurities, and having a twin boundary frequency of 40 to 70% Alloy strip. This alloy strip may further contain 0.1 to 0.8% by mass of Sn, the aspect ratio of crystal grain size in the rolling parallel direction and the perpendicular direction may be 0.3 to 0.7, Ni, You may contain 0.005-0.5 mass% of at least 1 type or more in total among Mg, Fe, P, Al, and Ag. A Cu—Zn alloy Sn-plated alloy strip obtained by subjecting the Cu—Zn alloy to 0.3 to 2 μm of Sn plating is also provided.
[Selection figure] None

Description

本発明は、電池接続タブ材に用いられるCu−Zn系合金条に関する。   The present invention relates to a Cu—Zn alloy strip used for a battery connection tab material.

ビデオカメラ等の携帯用電子機器にはニッカド電池やリチウム電池等の充電式電池が用いられる。また、近年の環境負荷低減の動きを受け、電気自動車やハイブリッド自動車の需要も増加し、車載用リチウムイオン二次電池の開発も進んでいる。これら充電式電池は必要な電気容量を確保するため、複数個の単体構造の電池を複数本互いに近接した状態で電気的に接続して使用される。電池の接続に用いられる金属部品は、集電タブまたはタブと呼ばれ、確実に接続するために、電気抵抗による発熱を利用した抵抗溶接により電池の電極と溶着されることが多い。電極にタブが溶接された複数個の電池をコンパクトなケース内に収納するため、タブには厳しい曲げ加工が施される。そのため、タブに使用される材料には電極との良好な溶接性および繰返し曲げ性が要求される。   A rechargeable battery such as a nickel cadmium battery or a lithium battery is used for a portable electronic device such as a video camera. In addition, demand for electric vehicles and hybrid vehicles has increased in response to the recent trend of reducing environmental impact, and the development of in-vehicle lithium-ion secondary batteries is also progressing. These rechargeable batteries are used by electrically connecting a plurality of single-structure batteries in a state of being close to each other in order to ensure a necessary electric capacity. Metal parts used for battery connection are called current collecting tabs or tabs, and are often welded to battery electrodes by resistance welding using heat generated by electrical resistance to ensure connection. In order to accommodate a plurality of batteries having tabs welded to the electrodes in a compact case, the tabs are subjected to severe bending. Therefore, the material used for the tab is required to have good weldability and repeated bendability with the electrode.

シリーズ型の抵抗溶接機を用いてステンレス板や軟鋼板とタブを接続する際、導電率が高すぎると、タブに過大な電流が流れ溶損に至るため、従来のタブには、ニッケルや比較的に導電率が低い銅合金等が使用されていた。しかし、近年のニッケル価格の高騰を受け、コストダウンのため、金属材料を従来のニッケルから銅合金に変更する動きが出ている。タブ材料として適した銅合金としてCu−Ni−Sn系合金が挙げられる。しかし、Cu−Ni−Sn系合金の溶接性および繰返し曲げ性は十分でなく、改善が望まれていた。   When connecting a tab with a stainless steel plate or mild steel plate using a series-type resistance welder, if the conductivity is too high, excessive current flows through the tab and leads to melting. In particular, a copper alloy having a low electrical conductivity has been used. However, in response to the recent rise in nickel prices, there is a movement to change the metal material from conventional nickel to a copper alloy for cost reduction. An example of a copper alloy suitable as a tab material is a Cu—Ni—Sn alloy. However, the weldability and repeated bendability of the Cu—Ni—Sn alloy are not sufficient, and improvement has been desired.

本発明は、良好な繰返し曲げ性と溶接性を有する電池接続タブ材に好適なCu−Zn系合金を目的とする。   The present invention is directed to a Cu—Zn-based alloy suitable for a battery connection tab material having good repeated bendability and weldability.

本発明は、製造工程を調整し、結晶粒径のアスペクト比と双晶境界頻度を調整する事で、良好な繰返し曲げ性と溶接性を満足した電池用タブ材に好適なCu−Zn系合金を提供するものであり、具体的には、下記のとおりである。
(1)2〜12質量%のZnを含有し、残部が銅および不可避不純物から成る銅合金であって、双晶境界頻度が40〜70%である事を特徴とする、充電用電池タブに用いられるCu−Zn系合金条。
(2)更に0.1〜0.8質量%のSnを含有する(1)に記載のCu−Zn系合金条。
(3)圧延平行方向および直角方向の結晶粒径のアスペクト比が0.3〜0.7である(1)又は(2)に記載のCu−Zn系合金条。
(4)更にNi、Mg、Fe、P、AlおよびAgのなかの少なくとも一種以上を合計で0.005〜0.5質量%含有する(1)〜(3)いずれかに記載のCu−Zn系合金条。
(5)上記(1)〜(4)いずれかに記載のCu−Zn系合金に0.3〜2μmのSnめっきを施したCu−Zn系合金Snめっき合金条。
本発明例のCu−Zn系合金は、繰返し曲げ性および溶接性が良好で、電池用タブ材として好適である。
The present invention is a Cu-Zn-based alloy suitable for a battery tab material satisfying good repeated bendability and weldability by adjusting the manufacturing process and adjusting the aspect ratio of crystal grain size and the twin boundary frequency. Specifically, it is as follows.
(1) A charging battery tab characterized in that it contains 2 to 12% by mass of Zn, and the balance is a copper alloy composed of copper and inevitable impurities, and has a twin boundary frequency of 40 to 70%. Cu-Zn alloy strip used.
(2) The Cu—Zn alloy strip according to (1), further containing 0.1 to 0.8% by mass of Sn.
(3) The Cu—Zn alloy strip according to (1) or (2), wherein the aspect ratio of the crystal grain size in the rolling parallel direction and the perpendicular direction is 0.3 to 0.7.
(4) The Cu—Zn according to any one of (1) to (3), further containing 0.005 to 0.5 mass% in total of at least one of Ni, Mg, Fe, P, Al, and Ag. Alloy strip.
(5) A Cu—Zn alloy Sn-plated alloy strip obtained by subjecting the Cu—Zn alloy according to any one of (1) to (4) to Sn plating of 0.3 to 2 μm.
The Cu—Zn-based alloy of the present invention has good repeated bendability and weldability and is suitable as a battery tab material.

結晶粒径のアスペクト比を示す概略図である。It is the schematic which shows the aspect ratio of a crystal grain diameter.

(Cu−Zn系合金条)
(A)Zn濃度
本発明の合金は、2〜12質量%(以下%で表す)、好ましくは3〜10%のZnを含有し、残部が銅および不可避不純物から成る銅合金である。Znが2%未満であるとタブとして必要な強度が不充分になる。また、導電率が高くなりすぎて溶接時にタブが溶損したり、電極側のステンレス板や軟鋼板に電流が流れにくくなるため溶接性が劣化する。Znが12%を超えると表面に形成される酸化膜の成分がZnリッチとなり溶接性が劣化する。
(B)Sn濃度
Snは圧延の際の加工硬化を促進する作用を持ち、強度上昇に寄与する。従って、本発明の合金は、更に0.1〜0.8%、好ましくは0.2〜0.6%のSnを含有してもよい。Snが0.1%未満では、所望の効果が得られず、Snが0.8%を超えると、導電率が低下する。
(C)上記以外の添加元素
本発明の合金には、合金の強度、耐熱性、耐応力緩和性等を改善する目的で、Ni、Mg、Fe、P、AlおよびAgの中の一種以上を合計で0.005〜0.5%添加することができる。総量が0.005%未満では所望の特性が得られず、総量が0.5%を超えると所望の特性は得られるものの、導電性や曲げ加工性が低下する。
(Cu-Zn alloy strip)
(A) Zn Concentration The alloy of the present invention is a copper alloy containing 2 to 12% by mass (hereinafter expressed as%), preferably 3 to 10% Zn, with the balance being copper and inevitable impurities. If the Zn content is less than 2%, the strength required for the tab becomes insufficient. Moreover, since the electrical conductivity becomes too high, the tab is melted at the time of welding, or the current is difficult to flow through the stainless steel plate or the mild steel plate on the electrode side, so that the weldability is deteriorated. If Zn exceeds 12%, the component of the oxide film formed on the surface becomes Zn-rich and the weldability deteriorates.
(B) Sn concentration Sn has an effect of promoting work hardening during rolling and contributes to an increase in strength. Therefore, the alloy of the present invention may further contain 0.1 to 0.8%, preferably 0.2 to 0.6% of Sn. If Sn is less than 0.1%, the desired effect cannot be obtained, and if Sn exceeds 0.8%, the electrical conductivity decreases.
(C) Additive elements other than those described above The alloy of the present invention contains at least one of Ni, Mg, Fe, P, Al and Ag for the purpose of improving the strength, heat resistance, stress relaxation resistance, etc. of the alloy. A total of 0.005 to 0.5% can be added. If the total amount is less than 0.005%, desired properties cannot be obtained. If the total amount exceeds 0.5%, desired properties can be obtained, but conductivity and bending workability are deteriorated.

(D)双晶境界頻度
双晶境界頻度が40%未満の場合、繰返し曲げ性が劣化する。本発明の成分系で双晶境界頻度が70%を超える様に調整する事は工業的に困難なため、上限は70%とした。
双晶境界とは、双晶関係にある2つの結晶の境界を指し、この境界を境に2つの結晶は鏡面対称の関係にある。対応粒界理論によれば双晶境界はΣ3の結晶粒界に相当する。双晶境界は境界間の原子の整合性が良い為、境界近傍において不均一変形が起こりにくく、曲げ変形時、境界近傍を基点とする割れやしわが発生しにくい。
双晶境界頻度とは、結晶粒界と双晶境界を合わせた全境界中の双晶境界の割合を言う。双晶の発生頻度は積層欠陥エネルギーと関係があり、積層欠陥エネルギーが低いほど、双晶境界頻度は高くなる。
本発明の組成は、黄銅(Cu65%、Zn35%)に比べると溶接性及び導電性を満たすためにZn量が少ない。積層欠陥エネルギーはZn量の減少に伴い高くなるため、双晶境界頻度は黄銅に比べ低くなり、通常の工程で40%を超える高い双晶境界頻度を得る事は難しかった。発明者は本発明の合金において、双晶境界頻度を上昇させるため、製造工程と双晶境界頻度の関係について鋭意調査を行なった結果、最終焼鈍の前に実施される冷間圧延の条件が重要であることが判明した。圧延では一対のロール間に材料を繰返し通過(パス)させ、目標の板厚に仕上げてゆく。この一連のパスにおいて、最終パスおよび最終パスより1つ前のパスで、1パス当たりの加工度を上昇させ、圧延速度を高速化した仕上圧延を行ない、その後、適切な条件で最終焼鈍を行なうと、40%を超える高い双晶境界頻度が得られる事を見出した。
(D) Twin boundary frequency When the twin boundary frequency is less than 40%, repeated bendability deteriorates. Since it is industrially difficult to adjust the twin boundary frequency to exceed 70% in the component system of the present invention, the upper limit is set to 70%.
The twin boundary refers to the boundary between two crystals in a twin relationship, and the two crystals are mirror-symmetrical with respect to this boundary. According to the corresponding grain boundary theory, the twin boundary corresponds to the grain boundary of Σ3. Since twin boundaries have good atomic alignment between the boundaries, non-uniform deformation is unlikely to occur near the boundaries, and cracks and wrinkles based on the vicinity of the boundaries are less likely to occur during bending deformation.
The twin boundary frequency refers to the ratio of twin boundaries in all boundaries including the grain boundaries and twin boundaries. The generation frequency of twins is related to the stacking fault energy. The lower the stacking fault energy, the higher the twin boundary frequency.
The composition of the present invention has a small amount of Zn in order to satisfy weldability and conductivity as compared with brass (Cu 65%, Zn 35%). Since the stacking fault energy becomes higher as the Zn content decreases, the twin boundary frequency becomes lower than that of brass, and it is difficult to obtain a high twin boundary frequency exceeding 40% in a normal process. In order to increase the twin boundary frequency in the alloy of the present invention, the inventor conducted an intensive investigation on the relationship between the manufacturing process and the twin boundary frequency, and as a result, the conditions of the cold rolling performed before the final annealing are important. It turned out to be. In rolling, the material is repeatedly passed (passed) between a pair of rolls, and finished to a target plate thickness. In this series of passes, in the last pass and the pass before the last pass, the finishing degree per one pass is increased and the finishing speed is increased, and then the final annealing is performed under appropriate conditions. And found that a high twinning boundary frequency exceeding 40% can be obtained.

ここで、双晶境界頻度を求める方法としては、例えば、FESEM(Field Emission Scanning Electron Microscope)によるEBSP(Electron Backscattering Pattern)法がある。この方法は、試料表面に斜めに電子線を当てたときに生じる後方散乱電子回折パターン(菊地パターン)に基づき、結晶方位を解析する方法である。本方法で結晶方位を解析した後、隣接結晶方位間の方位差を求め、ランダム粒界および各対応粒界の割合(粒界性格分布)を決定することが出来る。双晶境界はΣ3対応粒界に相当するため、双晶境界頻度は(対応粒界Σ3の長さの総和)/(結晶粒界の長さの総和)×100で計算される。なお、結晶粒界とは隣接結晶粒間の方位差が15°以上となる境界を指し、小角粒界や亜粒界を含まない。   Here, as a method for obtaining the twin boundary frequency, for example, there is an EBSP (Electron Backscattering Pattern) method using FESEM (Field Emission Scanning Electron Microscope). This method is a method of analyzing crystal orientation based on a backscattered electron diffraction pattern (Kikuchi pattern) generated when an electron beam is obliquely applied to a sample surface. After analyzing the crystal orientation by this method, the orientation difference between adjacent crystal orientations can be obtained, and the ratio of the random grain boundaries and the corresponding grain boundaries (grain boundary character distribution) can be determined. Since the twin boundary corresponds to a Σ3-corresponding grain boundary, the twin boundary frequency is calculated by (total length of corresponding grain boundary Σ3) / (total length of crystal grain boundary) × 100. The crystal grain boundary means a boundary where the orientation difference between adjacent crystal grains is 15 ° or more, and does not include a small-angle grain boundary or a sub-grain boundary.

(E)結晶粒径のアスペクト比
本発明では、繰返し曲げ性をさらに改善するために、金属組織と繰返し曲げ性について研究を進めた結果、最終焼鈍後の金属組織を均一な等軸粒に制御する事で繰返し曲げ性が改善される事が明らかになった。最終製品には30〜60%の冷間圧延が施されるため、繰返し曲げ性を改善するには、最終製品における圧延平行方向および直角方向の結晶粒径のアスペクト比b/aおよびd/cを0.3〜0.7に制御する事が好ましい。より好ましくはb/aが0.3〜0.5であり、d/cが0.5〜0.7である。図1は試料断面にて観察される結晶粒の模式図である。
圧延平行方向および直角方向の結晶粒径のアスペクト比b/a及び/又はd/cが、0.3未満であるか0.7を超えると繰返し曲げ時にひずみが局部的に集中し、せん断帯が形成され、繰返し曲げ性が劣化する。
本発明の合金条の組成は黄銅に比べZn量が少ないため、再結晶後の金属組織は混粒になりやすい。また、熱間圧延時に途中パスにて再結晶が終了すると、圧延方向に伸長した粗大結晶粒が残留し、金属組織の等軸化を阻害する。従って、最終焼鈍時に均一な等軸粒を得るには、熱間圧延の終了温度を制御し、適切な加工度で圧延する事で動的再結晶により金属組織を等軸化した後、複数回の圧延と焼鈍を繰り返す必要がある。
本発明の平均結晶粒径は、好ましくは12μm以下、更に好ましくは7μm以下である。
(E) Aspect ratio of crystal grain size In the present invention, in order to further improve repeated bendability, as a result of research on the metal structure and repeat bendability, the metal structure after final annealing is controlled to uniform equiaxed grains. It became clear that repeated bendability was improved by doing. Since the final product is cold-rolled by 30 to 60%, the aspect ratio b / a and d / c of the crystal grain size in the rolling parallel direction and the perpendicular direction in the final product can be improved in order to improve the repeated bendability. Is preferably controlled to 0.3 to 0.7. More preferably, b / a is 0.3 to 0.5, and d / c is 0.5 to 0.7. FIG. 1 is a schematic diagram of crystal grains observed in a sample cross section.
When the aspect ratio b / a and / or d / c of the crystal grain size in the direction parallel to and perpendicular to the rolling is less than 0.3 or more than 0.7, the strain is locally concentrated during repeated bending, and the shear band Are formed, and the repeated bendability deteriorates.
Since the composition of the alloy strip of the present invention has a smaller amount of Zn than brass, the metal structure after recrystallization tends to be mixed grains. In addition, when recrystallization is completed in a halfway pass during hot rolling, coarse crystal grains that extend in the rolling direction remain, which hinders equalization of the metal structure. Therefore, in order to obtain uniform equiaxed grains at the time of final annealing, the end temperature of hot rolling is controlled and the metal structure is equiaxed by dynamic recrystallization by rolling at an appropriate working degree, and then multiple times. It is necessary to repeat rolling and annealing.
The average crystal grain size of the present invention is preferably 12 μm or less, more preferably 7 μm or less.

(特性)
本発明の合金条の引張強さ(JISZ2241)は、通常420MPa以上、好ましくは450MPa以上、更に好ましくは500MPa以上であるとタブ材料として好適に使用できる。
本発明の合金条の導電率(JISH0505)は、70%IACS以下、更に好ましくは60%IACS以下であるとタブ材料として適切に使用できる。70%IACSを超えると抵抗溶接時に溶損が起こったり、電極側の金属板に充分な電流が流れず、溶接性が低下する。
本発明の合金条の繰り返し曲げ性は、好ましくは3.0回以上、更に好ましくは3.2回以上であるとタブ材料として好ましい。
(Characteristic)
When the tensile strength (JISZ2241) of the alloy strip of the present invention is usually 420 MPa or more, preferably 450 MPa or more, more preferably 500 MPa or more, it can be suitably used as a tab material.
The electrical conductivity (JISH0505) of the alloy strip of the present invention can be suitably used as a tab material when it is 70% IACS or less, more preferably 60% IACS or less. If it exceeds 70% IACS, melting damage occurs during resistance welding, or a sufficient current does not flow through the metal plate on the electrode side, resulting in poor weldability.
The repeated bendability of the alloy strip of the present invention is preferably 3.0 times or more, and more preferably 3.2 times or more, as a tab material.

本発明の合金条の厚みは特に限定はされないが好ましくは0.03〜1.00mm、より好ましくは0.12〜0.6mmであり、例えば0.15mmであり、この厚さであると充電池接続用タブ材料としての強度、溶接性を満たす。
本発明の合金条には0.3〜2μmのSnめっきを施してCu−Zn系合金Snめっき合金条とすることができる。Snめっき方法は従来法で行うことができ、0.3〜2μm程度のSnめっきを施すことにより溶接性がより良好となる。
The thickness of the alloy strip of the present invention is not particularly limited, but is preferably 0.03 to 1.00 mm, more preferably 0.12 to 0.6 mm, for example, 0.15 mm. Satisfies strength and weldability as battery connection tab material.
The alloy strip of the present invention can be subjected to Sn plating of 0.3 to 2 μm to form a Cu—Zn-based alloy Sn-plated alloy strip. The Sn plating method can be performed by a conventional method, and the weldability is improved by applying Sn plating of about 0.3 to 2 μm.

(製造方法)
本発明のCu−Zn系合金条の製造工程は、基本的には通常の合金条と同様であり、溶解鋳造、均質化焼鈍及び熱間圧延、面削の後、複数回の冷間圧延、焼鈍を繰返し、製造される。
しかし、本発明の合金条を製造するためには、本発明の範囲の双晶境界頻度となるように製造条件を制御する必要がある。
最終焼鈍前の冷間圧延の最終パス、及び最終パスより1つ前のパスの平均加工度としては32〜40%、圧延速度としては220〜350mpmが適切である。前述の範囲より加工度が低い、又は圧延速度が遅い場合、双晶境界頻度が低くなり繰返し曲げ性が劣化する。加工度が高い、又は圧延速度が速い場合、材料縁端部に耳割れ(エッジクラック)が発生し、圧延時に材料が破断する等、著しく製造性が低下する。
最終焼鈍の条件としては、温度660〜760℃、焼鈍時間5〜20sが適切である。前述の範囲より温度が低い、又は時間が短い場合、最終焼鈍が不充分なため、双晶境界頻度が低下し、繰返し曲げ性が劣化する。最終焼鈍温度が高い、又は時間が長い場合、結晶粒の著しい粗大化が起こり、双晶境界頻度が低下し、繰返し曲げ性が劣化する。
以下の製造条件を調整する事で、さらに繰返し曲げ性を改善する事が出来る。
熱間圧延の終了温度は好ましくは600〜750℃であり、最終加工度は好ましくは30〜55%である。これらが範囲外であるとアスペクト比が本発明で好ましい範囲外となり、繰返し曲げ性が劣化する。
中間焼鈍温度は好ましくは680〜780℃で5〜20秒であり、焼鈍条件が前述の範囲外であると、アスペクト比が本発明で好ましい範囲外となり、繰返し曲げ性が劣化する。
(Production method)
The manufacturing process of the Cu-Zn alloy strip of the present invention is basically the same as that of a normal alloy strip, and after multiple casting, homogenization annealing and hot rolling, face cutting, multiple cold rolling, Manufactured by repeated annealing.
However, in order to manufacture the alloy strip of the present invention, it is necessary to control the manufacturing conditions so that the twin boundary frequency is within the range of the present invention.
The average working degree of the final pass of the cold rolling before the final annealing and the pass immediately before the final pass is suitably 32 to 40%, and the rolling speed is suitably 220 to 350 mpm. When the degree of work is lower than the above range or the rolling speed is slow, the twin boundary frequency becomes low and the repeated bendability deteriorates. When the degree of work is high or the rolling speed is high, the edge cracks (edge cracks) occur at the edge of the material, and the productivity is significantly reduced, for example, the material breaks during rolling.
As conditions for the final annealing, a temperature of 660 to 760 ° C. and an annealing time of 5 to 20 s are appropriate. When the temperature is lower than the above-mentioned range or the time is short, the final annealing is insufficient, so the twin boundary frequency is lowered and the repeated bendability is deteriorated. When the final annealing temperature is high or the time is long, the crystal grains are significantly coarsened, the twin boundary frequency is lowered, and the repeated bendability is deteriorated.
Repeatability can be further improved by adjusting the following manufacturing conditions.
The end temperature of hot rolling is preferably 600 to 750 ° C., and the final workability is preferably 30 to 55%. If these are out of the range, the aspect ratio is out of the preferred range in the present invention, and the repeated bendability deteriorates.
The intermediate annealing temperature is preferably 680 to 780 ° C. for 5 to 20 seconds. If the annealing condition is outside the above range, the aspect ratio is outside the preferable range in the present invention, and the repeated bendability deteriorates.

実施例で行った測定の条件は下記の通りである。
[双晶境界頻度] 各銅合金板について、FESEM(Field Emission Scanning Electron Microscope)によるEBSP(Electron Backscattering Pattern)法で測定した。
[アスペクト比] 各銅合金板について、圧延方向に平行な断面および垂直な断面の結晶粒径をJISH0501の切断法に準じ測定し算出した。図1に示す圧延方向と平行な断面では、圧延面に対して平行な方向と、圧延面に対して直角な方向の2方向でそれぞれ結晶粒径を測定し、平行方向の測定値を長径a、直角方向の測定値を短径bとした。圧延方向と垂直な断面では、圧延方向に対して平行な方向と、圧延方向に対して直角な方向のそれぞれ2方向で結晶粒径を測定し、平行方向の測定値を長径c、直角方向の測定値を短径dとした。
[繰返し曲げ性] 長手方向が圧延方向に平行となる様に、厚さ0.15mm、幅10mm×長さ40mmの最終品試験片を4個作製し、試験片の長手方向に直角な方向を曲げ軸として、180°曲げを行なった後、曲げ戻した。これを1回として、試料が破断するまで繰返し曲げを行い、試料4個の平均破断(繰返し曲げ)回数を求めた。
The measurement conditions performed in the examples are as follows.
[Twinning Boundary Frequency] Each copper alloy plate was measured by an EBSP (Electron Backscattering Pattern) method using FESEM (Field Emission Scanning Electron Microscope).
[Aspect Ratio] For each copper alloy plate, the crystal grain size of the cross section parallel to the rolling direction and the cross section perpendicular to the rolling direction was measured and calculated according to the cutting method of JISH0501. In the cross section parallel to the rolling direction shown in FIG. 1, the crystal grain size is measured in two directions, a direction parallel to the rolling surface and a direction perpendicular to the rolling surface. The measured value in the perpendicular direction was taken as the minor axis b. In the cross section perpendicular to the rolling direction, the crystal grain size is measured in two directions, a direction parallel to the rolling direction and a direction perpendicular to the rolling direction, and the measured value in the parallel direction is taken as the major axis c and the direction perpendicular to the rolling direction. The measured value was taken as the minor axis d.
[Repeated bendability] Four final product test pieces having a thickness of 0.15 mm, a width of 10 mm and a length of 40 mm are prepared so that the longitudinal direction is parallel to the rolling direction, and the direction perpendicular to the longitudinal direction of the test piece is set. The bending axis was 180 ° bending and then bending back. This was taken as one time and repeated bending until the sample broke, and the average number of times of breaking (repeating bending) of four samples was determined.

[溶接性]シリーズスポット溶接機にて加圧力30N、溶接電流3.5kA、溶接時間10msecにて0.3mmの軟鋼板と銅合金を2点でスポット溶接した。アイコーエンジニアリング製の精密荷重測定機にて引張試験を行ない、溶接強度を測定した。溶接強度が35N以上なら溶接性が良好○と判断し、溶接強度が35N未満であれば不良×と評価した。
[引張強さ] 各銅合金板について、圧延方向に平行な方向に引張試験を行ない、JISZ2241に準拠して求めた。
[導電率] 各銅合金板について、JISH0505に準拠し、ダブルブリッジ装置を用いた四端子法により求めた体積抵抗率から%IACSを算出した。
[Weldability] A 0.3 mm mild steel plate and a copper alloy were spot welded at two points with a pressurizing force of 30 N, a welding current of 3.5 kA, and a welding time of 10 msec using a series spot welder. A tensile test was carried out with a precision load measuring machine manufactured by Aiko Engineering, and the welding strength was measured. If the weld strength was 35N or more, the weldability was judged as good, and if the weld strength was less than 35N, it was evaluated as poor.
[Tensile strength] Each copper alloy plate was subjected to a tensile test in a direction parallel to the rolling direction, and determined according to JISZ2241.
[Conductivity] For each copper alloy plate,% IACS was calculated from the volume resistivity determined by the four-terminal method using a double bridge device in accordance with JISH0505.

(実施例1)
高周波誘導炉で電気銅を溶解し、溶湯表面を木炭被覆した後、合金元素を添加し所望の組成に溶湯を調整した。鋳込温度1200℃で鋳造を行い、得られたインゴットを850℃で3時間加熱後、熱間圧延の最終パスの加工度が35%になる様に、板厚8mmまで圧延し、熱間圧延終了温度を650℃以上に調整した。表面に生じた酸化スケールを面削にて除去した。その後、冷間圧延で板厚1.5mmまで加工し、700℃にて12秒間の中間焼鈍を行い、さらに0.35mmまでの冷間圧延では、最終パス及び最終パスより1つ前のパスの平均加工度が35%、最終パスおよび最終パスより1つ前のパスの圧延速度がともに250m/minとなる様に調整した。この冷間圧延後、680℃にて10秒間の最終焼鈍を行ない、最終焼鈍後の銅合金板を冷間圧延し、0.15mmの板に仕上げた。中間焼鈍および最終焼鈍はアンモニア分解ガス雰囲気中で、連続ラインにて行なった。表1に試験結果を示す。
Example 1
After electrolytic copper was melted in a high frequency induction furnace and the surface of the molten metal was coated with charcoal, an alloy element was added to adjust the molten metal to a desired composition. Casting is performed at a casting temperature of 1200 ° C, and the obtained ingot is heated at 850 ° C for 3 hours, and then rolled to a plate thickness of 8 mm so that the degree of processing in the final pass of hot rolling is 35%. The end temperature was adjusted to 650 ° C. or higher. The oxidized scale formed on the surface was removed by chamfering. Then, it is processed to a plate thickness of 1.5 mm by cold rolling, subjected to intermediate annealing at 700 ° C. for 12 seconds, and in cold rolling to 0.35 mm, the final pass and the pass before the final pass The average working degree was adjusted to 35%, and the rolling speed of both the final pass and the pass before the final pass was 250 m / min. After this cold rolling, final annealing was performed at 680 ° C. for 10 seconds, and the copper alloy plate after the final annealing was cold-rolled to finish a 0.15 mm plate. Intermediate annealing and final annealing were performed in a continuous line in an ammonia decomposition gas atmosphere. Table 1 shows the test results.

(実施例2)
高周波誘導炉で電気銅を溶解し、溶湯表面を木炭被覆した後、8.0%Zn、0.30%Sn及びCuの組成になるように溶湯内にZn及びSnを添加して成分を調整し、鋳込温度1200℃で鋳造を行なった。得られたインゴットを900℃で3時間加熱後、熱間圧延を行ない、板厚8mmの銅合金板を作製し、表面に生じた酸化スケールを面削にて除去した。その後、冷間圧延で板厚1.5mmまで加工し、中間焼鈍を行なった後、板厚0.25mmまで冷間圧延を実施した。更に最終焼鈍を行ない、最終焼鈍後の銅合金板を冷間圧延し、0.15mmの板に仕上げた。中間焼鈍および最終焼鈍はアンモニア分解ガス雰囲気中で、連続ラインを用いて行なった。表2に熱間圧延及び中間焼鈍の条件、最終焼鈍前の冷間圧延の条件(最終パスおよび最終パスより1つ前のパスの平均加工度と圧延速度)、最終焼鈍条件並びに試験結果を示す。
(Example 2)
After melting electrolytic copper in a high-frequency induction furnace and coating the surface of the molten metal with charcoal, adjust the components by adding Zn and Sn into the molten metal so that the composition is 8.0% Zn, 0.30% Sn and Cu. Then, casting was performed at a casting temperature of 1200 ° C. The obtained ingot was heated at 900 ° C. for 3 hours and then hot-rolled to produce a copper alloy plate having a plate thickness of 8 mm, and the oxide scale generated on the surface was removed by chamfering. Then, after cold-rolling to a plate thickness of 1.5 mm and performing intermediate annealing, cold rolling was performed to a plate thickness of 0.25 mm. Further, final annealing was performed, and the copper alloy plate after the final annealing was cold-rolled to finish a 0.15 mm plate. Intermediate annealing and final annealing were performed using a continuous line in an ammonia decomposition gas atmosphere. Table 2 shows the conditions for hot rolling and intermediate annealing, conditions for cold rolling before final annealing (average working degree and rolling speed of the last pass and pass one before the final pass), final annealing conditions and test results. .

表1中の発明例1〜19は本発明の範囲内であるので、良好な繰返し曲げ性と溶接性を有し、強度も充分な合金条であった。発明例20は、添加されたSn量が比較的少ないため、良好な繰返し曲げ性と溶接性を有するが、発明例1〜19に比べ、強度が低かった。発明例21はSn量が比較的多いため、発明例1〜19に比べ、導電率が低下した。一方、比較例22はZn量が少なく、発明例に比べ、繰返し曲げが劣り、強度も低下した。比較例23はZn量が多く、繰返し曲げ性は良好であったが、表面酸化膜がZnリッチとなったため、溶接性が劣化し、導電率も低下した。   Since Invention Examples 1 to 19 in Table 1 are within the scope of the present invention, they were alloy strips having good repeated bendability and weldability and sufficient strength. Inventive Example 20 has good repeated bendability and weldability because the amount of Sn added was relatively small, but the strength was lower than Inventive Examples 1-19. Inventive example 21 has a relatively large amount of Sn, and thus the conductivity is lower than in inventive examples 1-19. On the other hand, Comparative Example 22 had a small amount of Zn and was inferior in repeated bending and reduced in strength as compared with the inventive examples. In Comparative Example 23, the amount of Zn was large and the repetitive bendability was good, but the surface oxide film became Zn-rich, so that the weldability was deteriorated and the conductivity was also lowered.

表2中の発明例24〜38は本発明の範囲内であるので、良好な繰返し曲げ性と溶接性を有し、強度も充分な合金条であった。
発明例32は熱間圧延の終了温度が低く、発明例33及び34は熱間圧延の最終加工度が低く又は高く、発明例35及び36は中間焼鈍温度が低く又は高く、発明例37及び38は中間焼鈍での再結晶焼鈍時間が短い又は長すぎる。そのため、これら発明例ではアスペクト比が好ましい範囲外となり、繰返し曲げ性が、発明例24〜31に比べ劣った。
比較例39は中間焼鈍後の冷間圧延の最終パスおよび最終パスより1つ前のパスの平均加工度が低く、比較例41は中間焼鈍後の冷間圧延の最終パスおよび最終パスより1つ前のパスの圧延速度が遅いため双晶境界頻度が低い。比較例40は中間焼鈍後の冷間圧延の最終パスおよび最終パスより1つ前のパスの平均加工度が高すぎ、比較例42は中間焼鈍後の冷間圧延の最終パスおよび最終パスより1つ前のパスの圧延速度が速すぎるため材料縁端部に耳割れが発生し、最終圧延時に材料が破断した。比較例43及び44は最終焼鈍温度が低く又は高く、比較例45及び46は最終焼鈍時間が短い又は長いため、双晶境界頻度が低く、アスペクト比も好ましい規定範囲外となった。このため、これら比較例で破断しなかったものは繰り返し曲げ性が発明例に比べ劣った。
Since Invention Examples 24-38 in Table 2 are within the scope of the present invention, they were alloy strips having good repeated bendability and weldability and sufficient strength.
Invention Example 32 has a low hot rolling end temperature, Invention Examples 33 and 34 have a low or high hot rolling final workability, Invention Examples 35 and 36 have a low or high intermediate annealing temperature, and Invention Examples 37 and 38. Is too short or too long for recrystallization annealing in intermediate annealing. Therefore, in these invention examples, the aspect ratio is out of the preferred range, and the repeated bendability is inferior to that of Invention Examples 24-31.
In Comparative Example 39, the average degree of work in the final pass of the cold rolling after the intermediate annealing and the pass before the final pass is low, and in the Comparative Example 41, the average pass is one from the final pass of the cold rolling after the intermediate annealing and the final pass. The twin boundary frequency is low because the rolling speed of the previous pass is slow. In Comparative Example 40, the average degree of work in the final pass of the cold rolling after the intermediate annealing and the pass before the final pass is too high, and in the comparative example 42, the average passability is 1 in the final pass of the cold rolling after the intermediate annealing and the final pass. Since the rolling speed of the previous pass was too high, an edge crack occurred at the edge of the material, and the material broke during the final rolling. In Comparative Examples 43 and 44, the final annealing temperature was low or high. In Comparative Examples 45 and 46, the final annealing time was short or long. Therefore, the twin boundary frequency was low, and the aspect ratio was outside the preferable specified range. For this reason, those that did not break in these comparative examples were inferior in repeatability to the invention examples.

Figure 2011214036
Figure 2011214036

Figure 2011214036
Figure 2011214036

Claims (5)

2〜12質量%のZnを含有し、残部が銅および不可避不純物から成る銅合金であって、双晶境界頻度が40〜70%である事を特徴とする、充電用電池タブに用いられるCu−Zn系合金条。   Cu used in a battery tab for charging, characterized in that it contains 2 to 12% by mass of Zn, and the balance is a copper alloy composed of copper and inevitable impurities, and the twin boundary frequency is 40 to 70% -Zn alloy strip. 更に0.1〜0.8質量%のSnを含有する請求項1に記載のCu−Zn系合金条。   Furthermore, the Cu-Zn type alloy strip of Claim 1 containing 0.1-0.8 mass% Sn. 圧延平行方向および直角方向の結晶粒径のアスペクト比が0.3〜0.7である請求項1又は2に記載のCu−Zn系合金条。   The Cu-Zn alloy strip according to claim 1 or 2, wherein the aspect ratio of the grain size in the rolling parallel direction and the perpendicular direction is 0.3 to 0.7. 更にNi、Mg、Fe、P、AlおよびAgのなかの少なくとも一種以上を合計で0.005〜0.5質量%含有する請求項1〜3いずれか1項に記載のCu−Zn系合金条。   The Cu-Zn alloy strip according to any one of claims 1 to 3, further comprising 0.005 to 0.5 mass% in total of at least one of Ni, Mg, Fe, P, Al, and Ag. . 請求項1〜4いずれか1項に記載のCu−Zn系合金に0.3〜2μmのSnめっきを施したCu−Zn系合金Snめっき合金条。   A Cu-Zn alloy Sn-plated alloy strip obtained by subjecting the Cu-Zn alloy according to any one of claims 1 to 4 to Sn plating of 0.3 to 2 µm.
JP2010081028A 2010-03-31 2010-03-31 Cu-Zn alloy strip for battery connection tab material Active JP5490594B2 (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2010081028A JP5490594B2 (en) 2010-03-31 2010-03-31 Cu-Zn alloy strip for battery connection tab material
TW100108503A TWI443203B (en) 2010-03-31 2011-03-14 Cu-Zn alloy bars for battery connector materials
PCT/JP2011/057438 WO2011125555A1 (en) 2010-03-31 2011-03-25 Cu-zn alloy strip for tab material for connecting cells
CN2011800169739A CN102812137A (en) 2010-03-31 2011-03-25 Cu-Zn alloy strips for battery joint materials
KR1020127028279A KR101414882B1 (en) 2010-03-31 2011-03-25 Cu-zn alloy strip for tab material for connecting cells

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010081028A JP5490594B2 (en) 2010-03-31 2010-03-31 Cu-Zn alloy strip for battery connection tab material

Publications (2)

Publication Number Publication Date
JP2011214036A true JP2011214036A (en) 2011-10-27
JP5490594B2 JP5490594B2 (en) 2014-05-14

Family

ID=44762508

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010081028A Active JP5490594B2 (en) 2010-03-31 2010-03-31 Cu-Zn alloy strip for battery connection tab material

Country Status (5)

Country Link
JP (1) JP5490594B2 (en)
KR (1) KR101414882B1 (en)
CN (1) CN102812137A (en)
TW (1) TWI443203B (en)
WO (1) WO2011125555A1 (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012153728A1 (en) * 2011-05-10 2012-11-15 Jx日鉱日石金属株式会社 Ni-plated metal sheet, welded structure, and method for making battery material
JP5130406B1 (en) * 2012-03-29 2013-01-30 Jx日鉱日石金属株式会社 Cu-Zn-Sn copper alloy strip
JP2014101571A (en) * 2012-10-26 2014-06-05 Mitsubishi Materials Corp Copper alloy for electronic and electrical equipment, copper alloy thin sheet for electronic and electrical equipment, electroconductive part and terminal for electronic and electrical equipment
JP2014118595A (en) * 2012-12-14 2014-06-30 Mitsubishi Materials Corp Copper alloy for electronic and electrical equipment, copper alloy thin sheet for electronic and electrical equipment, and electroconductive component for electronic and electrical equipment and terminal
JP2014145095A (en) * 2013-01-28 2014-08-14 Mitsubishi Materials Corp Copper alloy for electronic and electrical equipment, copper alloy thin sheet for electronic and electrical equipment, electroconductive component for electronic and electrical equipment and terminal
JP2014145096A (en) * 2013-01-28 2014-08-14 Mitsubishi Materials Corp Copper alloy for electronic and electrical equipment, copper alloy thin sheet for electronic and electrical equipment, electroconductive component for electronic and electrical equipment and terminal
WO2014181555A1 (en) * 2013-05-08 2014-11-13 住友電気工業株式会社 Lead conductor and electrical energy storage device

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014115307A1 (en) * 2013-01-25 2014-07-31 三菱伸銅株式会社 Copper-alloy plate for terminal/connector material, and method for producing copper-alloy plate for terminal/connector material
TWI486462B (en) * 2013-01-28 2015-06-01 Mitsubishi Shindo Kk Copper alloys plate that is materials of terminal and connector and method of producing the same
JP6829179B2 (en) * 2017-11-15 2021-02-10 Jx金属株式会社 Corrosion resistant CuZn alloy
CN109439933A (en) * 2018-08-31 2019-03-08 新昌县金声铜业有限公司 A kind of antibacterial copper alloy and preparation method thereof by force
CN109321779A (en) * 2018-10-26 2019-02-12 浙江星康铜业有限公司 A kind of Flexural-resistant and compressive-resistancopper copper plate and preparation method thereof

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06220594A (en) * 1993-01-21 1994-08-09 Mitsui Mining & Smelting Co Ltd Manufacturing method of copper alloy for electric parts with good workability
KR100686657B1 (en) * 2002-03-01 2007-02-27 쇼와 덴코 가부시키가이샤 Method for producing Al-Mg-Si-based alloy plate, Al-Mg-Si-based alloy plate and Al-Mg-Si-based alloy material
JP2006299287A (en) * 2005-04-15 2006-11-02 Nikko Kinzoku Kk Dual phase copper alloy, spring material and foil body, and method for producing dual phase copper alloy
JP4781145B2 (en) * 2006-03-30 2011-09-28 Jx日鉱日石金属株式会社 Terminal, connector or relay using Cu-Zn-Sn alloy and Cu-Zn-Sn alloy strip
JP5156317B2 (en) * 2006-09-27 2013-03-06 Dowaメタルテック株式会社 Copper alloy sheet and manufacturing method thereof
TW200844267A (en) * 2007-03-22 2008-11-16 Nippon Mining Co Sn-plated copper alloy material for printed board terminal
JP5156316B2 (en) * 2007-09-26 2013-03-06 Dowaメタルテック株式会社 Cu-Sn-P copper alloy sheet, method for producing the same, and connector

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012153728A1 (en) * 2011-05-10 2012-11-15 Jx日鉱日石金属株式会社 Ni-plated metal sheet, welded structure, and method for making battery material
CN103534389A (en) * 2011-05-10 2014-01-22 Jx日矿日石金属株式会社 Ni-plated metal sheet, welded structure, and method for making battery material
JP5908895B2 (en) * 2011-05-10 2016-04-26 Jx金属株式会社 Ni-plated metal plate, welded structure, and battery material manufacturing method
JP5130406B1 (en) * 2012-03-29 2013-01-30 Jx日鉱日石金属株式会社 Cu-Zn-Sn copper alloy strip
JP2014101571A (en) * 2012-10-26 2014-06-05 Mitsubishi Materials Corp Copper alloy for electronic and electrical equipment, copper alloy thin sheet for electronic and electrical equipment, electroconductive part and terminal for electronic and electrical equipment
JP2014118595A (en) * 2012-12-14 2014-06-30 Mitsubishi Materials Corp Copper alloy for electronic and electrical equipment, copper alloy thin sheet for electronic and electrical equipment, and electroconductive component for electronic and electrical equipment and terminal
JP2014145095A (en) * 2013-01-28 2014-08-14 Mitsubishi Materials Corp Copper alloy for electronic and electrical equipment, copper alloy thin sheet for electronic and electrical equipment, electroconductive component for electronic and electrical equipment and terminal
JP2014145096A (en) * 2013-01-28 2014-08-14 Mitsubishi Materials Corp Copper alloy for electronic and electrical equipment, copper alloy thin sheet for electronic and electrical equipment, electroconductive component for electronic and electrical equipment and terminal
WO2014181555A1 (en) * 2013-05-08 2014-11-13 住友電気工業株式会社 Lead conductor and electrical energy storage device
JP2014220129A (en) * 2013-05-08 2014-11-20 住友電気工業株式会社 Lead conductor and electric power storage device

Also Published As

Publication number Publication date
TW201142049A (en) 2011-12-01
WO2011125555A1 (en) 2011-10-13
TWI443203B (en) 2014-07-01
KR101414882B1 (en) 2014-07-03
KR20120130343A (en) 2012-11-30
JP5490594B2 (en) 2014-05-14
CN102812137A (en) 2012-12-05

Similar Documents

Publication Publication Date Title
JP5490594B2 (en) Cu-Zn alloy strip for battery connection tab material
US9234263B2 (en) Weldment
EP3040430B1 (en) Copper alloy sheet material and method for producing same, and current-carrying component
KR101518142B1 (en) Hardened aluminum foil for battery collectors
US9809872B2 (en) Dilute copper alloy material, dilute copper alloy wire, dilute copper alloy twisted wire and cable using the same, coaxial cable and composite cable, and method of manufacturing dilute copper alloy material and dilute copper alloy wire
CN108026612B (en) Copper alloy sheet and method for producing the same
EP3128019B1 (en) Copper alloy wire material and manufacturing method thereof
CN111566240B (en) Aluminum alloy materials and conductive members, battery members, fastening parts, spring parts and structural parts using the same
JP5189715B1 (en) Cu-Mg-P based copper alloy sheet having excellent fatigue resistance and method for producing the same
JP5927614B2 (en) Aluminum hard foil for battery current collector
US9805836B2 (en) Dilute copper alloy material and method of manufacturing dilute copper alloy member excellent in characteristics of resistance to hydrogen embrittlement
TWI429764B (en) Cu-Co-Si alloy for electronic materials
US20180211741A1 (en) Copper alloy for electronic/electrical device, plastically-worked copper alloy material for electronic/electrical device, component for electronic/electrical device, terminal, and busbar
JP5534610B2 (en) Cu-Co-Si alloy strip
JP6730784B2 (en) Cu-Ni-Co-Si alloy for electronic parts
JP5140171B2 (en) Copper alloy strip used for battery tab material for charging
JP2001011550A (en) Copper alloy rolled foil
EP2444978A2 (en) Solar cell conductor and method of manufacturing the same
JP4157899B2 (en) High strength copper alloy sheet with excellent bending workability
JP5130406B1 (en) Cu-Zn-Sn copper alloy strip
JP2012211376A (en) Copper alloy strip for battery connection tab
JP6762453B1 (en) Copper alloy plate material and its manufacturing method
JP5565262B2 (en) Clad material with excellent workability and manufacturing method thereof
CN118103534A (en) Copper alloy sheet and method for manufacturing the same

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20120928

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20131112

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20131217

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20140128

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20140226

R150 Certificate of patent or registration of utility model

Ref document number: 5490594

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

S531 Written request for registration of change of domicile

Free format text: JAPANESE INTERMEDIATE CODE: R313531

S533 Written request for registration of change of name

Free format text: JAPANESE INTERMEDIATE CODE: R313533

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

S531 Written request for registration of change of domicile

Free format text: JAPANESE INTERMEDIATE CODE: R313531

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250