JP2011211218A - Coating and developing device, method of controlling coating and developing device, and storage medium - Google Patents

Abstract

In a coating / developing apparatus in which an inspection station is provided between a cassette station and a processing station, it is possible to reduce the time that a substrate stays wastefully in an inspection module.
The substrate transfer means in the inspection station prioritizes the transfer of the substrate between the cassette station and the processing station, and the substrate is transferred to the inspection module in the remaining time within the cycle time of the substrate transfer means in the processing station. The board is taken out from the inspection module so that the board can be overtaken (the board with the smaller processing order can be carried out than the board with the larger processing order), and the board is loaded into the inspection module. Prohibits board overtaking.
[Selection] Figure 4

Description

  The present invention relates to a coating, developing apparatus, coating and developing method for performing a substrate cleaning process, a resist solution coating process, and a developing process after exposure on a substrate such as a semiconductor wafer or an LCD substrate (glass substrate for liquid crystal display). About.

A series of processes for producing a desired resist pattern on a substrate by applying a resist solution to a substrate such as a semiconductor device or an LCD substrate, exposing the resist film using a photomask, and developing the resist film, This is performed by using a system in which an exposure apparatus is connected to a coating / developing apparatus for applying or developing a resist solution.

  The coating / developing apparatus has a cassette station on which a wafer cassette is mounted and a transfer arm for transferring a semiconductor wafer (hereinafter referred to as a wafer) to / from the wafer cassette, and a resist coating / developing process for the wafer. The processing station for performing the above and the interface station connected to the exposure apparatus are arranged in a line.

  And about the board | substrate with which the resist pattern was formed, predetermined | prescribed inspections, such as the line width of a resist pattern, the overlap condition of a resist pattern and a ground pattern, and an inspection of a development defect, etc., were performed, and only a board judged to pass. It is sent to the next process. Such inspection is often performed by a stand-alone inspection device provided separately from the coating and developing device, but it is more convenient to adopt an inline system in which the inspection device is provided in the coating and developing device. .

  Therefore, Patent Document 1 describes a configuration in which an inspection station including a plurality of inspection devices and a transfer arm is interposed between a cassette station and a processing station. The system described here transports the substrate from the cassette station to the processing station via the inspection station, returns the processed substrate once to the cassette in the cassette station, and then transports the substrate from here to the inspection station The inspection is performed.

  FIG. 9 shows a configuration example when such a system is actually constructed. FIG. 9 is a schematic view of the coating / developing apparatus in a plan view. 11 is a cassette station, 12 is an inspection station, 13 is a processing station, and 14 is an interface station connected to the exposure apparatus. C is a wafer cassette, 15 is a transfer arm in the cassette station 11, and 16 is a transfer arm in the inspection station. TRSa, TRSb, TRSc, and TRSd are delivery modules, and E1, E2, and E3 are inspection modules. These are expanded on a plane for convenience. For example, the delivery module has a four-stage configuration, and the inspection module has a three-stage configuration. It is said.

  In the coating and developing apparatus of FIG. 9, the wafer in the cassette C is transported along the path of the transfer arm 15 → TRSa → transfer arm 16 → processing station 13. The wafer is subjected to various processes necessary for resist application at the processing station 13 in each module, and is sent out from the interface station 14 to the exposure apparatus and returned to the processing module 13 to be variously necessary for development processing. Is performed in the module. Thereafter, the wafer is returned to the transfer arm 16 → TRSb → transfer arm 15 → cassette C.

  In this case, the order of processing is determined for the wafers in the cassette C. For example, in the case of 13 wafers, wafers 1 to 13 are assigned. And it is conveyed to the processing station 13 in order from No. 1, and a predetermined module is moved in order. The transfer arm (main arm) in the processing station 13 performs a cycle transfer in which cyclic movement is sequentially performed between a series of preset modules, whereby the wafers are sequentially moved. The main arm performs an operation of exchanging the wafer in the module with two arms. When the transfer path of the main arm is called a circulation path, the cycle time for the transfer arm to make one round of the circulation path is determined in advance, the operation of returning backward, and a wafer with a large number (later taken out from the cassette C) The operation of jumping and transferring the wafer having the smaller number (the wafer previously taken out from the cassette C) is not performed. The reason why such an operation is prohibited is that the conveyance program becomes very complicated and is not realistic.

  On the other hand, all or selected wafers returned to the cassette C are discharged to the transfer module TRSc by the transfer arm 15 and transferred to the inspection module by the transfer arm 16. Among the wafers, for example, those that inspect only the inspection module E1, those that inspect only the inspection module E2, those that inspect only the inspection module E3, and those that perform the inspection module E3 following the inspection module E2. and so on. In the transfer of wafers in the inspection station 12, the same method as the cycle transfer in the processing station 13 is employed, and is performed in synchronization with the cycle transfer.

  Incidentally, the wafer of the transfer module TRSa needs to be placed on a transfer module (not shown) received by the main arm in the processing station 13 before the main arm comes to receive. Otherwise, the main arm is emptied and advanced, and the transfer of the wafer is delayed by one cycle.

  Therefore, in the transfer arm 16 in the inspection station 12, it is necessary to give the highest priority to wafer transfer between the transfer modules TRSa and TRSb and the processing station 12. In this case, when the transfer arm 16 performs the cycle transfer, the transfer module TRSc, the inspection modules E1, E2, E3, and TRSd are sequentially transferred after the transfer of the wafer to the transfer module TRSa or TRSb is completed. Therefore, for example, when the inspection is completed simultaneously in the inspection modules E1 and E2, one of the wafers waits for one cycle in the inspection module E1 (E2).

  Then, since the throughput of the inspection flow is lowered, the present inventor is considering operating the transfer arm 16 asynchronously with respect to the main arm. In this case, the transfer arm 16 preferentially processes when a ready signal is output from the transfer module TRSa, or when a processed wafer is placed on the transfer module of the processing station 13 and a ready signal is output therefrom. It is considered that it is advantageous to perform delivery / delivery to the station or take-in / convey from the processing station, and to concentrate on delivery to the inspection module E1 (E2, E3) at other times.

  However, even in that case, the following problems occur. Currently, processing of 150 sheets per hour is required in the coating and developing apparatus. On the other hand, one transfer operation of the transfer arm 15 takes, for example, 8 seconds, and one transfer operation of the transfer arm 16 takes 5 seconds. In order to perform processing of 150 sheets per hour, the cycle time in the above-described cycle conveyance must not exceed 3600 seconds / 150 sheets = 24 seconds. Then, the transfer arm 15 can perform only three transfer operations during one cycle (8 seconds × 3 = 24 seconds), and the transfer arm 16 can perform only four transfer operations during one cycle. (5 seconds × 4 = 20 seconds).

  Here, since the wafer transfer to the transfer modules TRSa and TRSb must be performed with the highest priority as described above, the transfer operation that the transfer arm 15 can perform to the transfer modules TRSc and TRSd during one cycle is 1. In addition, the transfer operation that the transfer arm 16 can perform with respect to the inspection module E1 (E2, E3) in one cycle is two times. The inspection modules E1, E2, and E3 perform different inspections, and each inspection time is different. When the inspection times of the inspection modules E1, E2, and E3 are, for example, 30 seconds, 100 seconds, and 140 seconds, respectively, for example, the 11th wafer in the inspection module E1, the 10th wafer in the inspection module E2, and the inspection module E3. Assuming that the ninth wafer is contained, the eleventh wafer cannot be taken out from the inspection module E1 if the ninth wafer is not completed when the eleventh wafer is inspected.

  The reason for this is that if the jumping of the wafer is permitted also in the inspection station, for example, the first wafer of the subsequent lot enters the inspection module E3, and then the last wafer of the previous lot enters. Then, there arises a problem that the recipe of the inspection module E3 has to be changed, and as a result, conveyance is delayed.

  However, if a situation where the wafer cannot be unloaded from the inspection module after the inspection of the wafer is completed, a long time is required for the inspection process as shown in the embodiment as a comparative example.

JP 2005-175052 (paragraph 0042, FIG. 4)

  The present invention has been made under such circumstances, and an object of the present invention is to reduce the time that the substrate stays wastefully in the inspection module, thereby improving the throughput of the coating and developing apparatus. Is to provide.

The present invention is a cassette station provided with a delivery unit for delivering a substrate to and from a cassette on which a cassette containing a plurality of substrates is placed;
Conveying a plurality of processing modules includes a processing module for processing modules and development for and against the substrate taken out from the cassette to form a resist film, to these processing modules, sequentially substrate along the circulation path And a first substrate transfer means having a predetermined cycle time for making one round of the circulation path, and a processing station comprising:
A substrate that has been processed is inspected, a plurality of inspection modules having different inspection times, a substrate transfer between the cassette station and the processing station, and a substrate transfer to the inspection module. An inspection station comprising: a second substrate transfer means;
One transfer module for transferring the substrate before the inspection processed in the processing station to the second substrate transfer means, and the other transfer module for transferring the substrate after the inspection from the second substrate transfer means; ,
A control unit for controlling the second substrate transfer means,
The substrates that have been processed in the processing station include substrates that are inspected in one inspection module and then inspected in another inspection module that performs an inspection different from the inspection,
The control unit is configured for the second substrate transfer unit.
a) Priority is given to the transfer of substrates from the cassette station to the processing station and the reception of substrates from the processing station;
b) Carrying in the inspection module from the board with the smallest processing order assigned to the board based on the transport schedule ,
c) After a test is performed by one inspection module, a substrate that is not inspected by another inspection module that performs an inspection different from the inspection , regardless of the processing order assigned to the substrate, It is characterized by having a function of controlling the board that has been inspected to be carried out from the inspection module to the other delivery module .

As a specific aspect of the present invention, it comprises one delivery module and the other delivery module provided for delivering a substrate between the delivery means in the cassette station and the second substrate transfer means,
The control unit transfers the substrate that has been processed at the processing station to the cassette, takes out the substrate from the cassette, transfers the substrate to the one transfer module, and transfers the substrate that has been inspected from the other transfer module to the cassette. And controlling delivery means in the cassette station.

As a more specific mode, the control unit controls the transfer unit so that the substrate processed at the processing station is taken out from the cassette and transferred to the one transfer module, or the coating and developing device. An example is a mode in which the transfer means in the cassette station is controlled so that the substrate is taken out from the cassette brought in for inspection from the outside and transferred to the one transfer module.
The transfer means in the cassette station can transfer the substrate only once to either the one or the other transfer module within the cycle time, for example.

  In addition, when the delivery destination when the substrate is delivered from the cassette station to the processing station is a processing module, for example, a cooling module, the control unit transports the substrate from the cassette station to the processing station. The second substrate transfer means is controlled so as to deliver the substrate to the inspection module within the remaining time obtained by subtracting the cycle time from the transfer time for receiving and transferring the substrate from the processing station. It is preferable. In this case, if the time when the cycle time elapses from the time when the substrate from the cassette station is carried into the processing module is T0, even if the second transport means can deliver to the inspection module, If it is determined that the time point when the next substrate from the cassette station is carried into the processing module by passing is over T0, the delivery is postponed.

Another invention is a cassette station provided with a transfer means for transferring a substrate to and from a cassette on which a cassette storing a plurality of substrates is placed;
Conveying a plurality of processing modules includes a processing module for processing modules and development for and against the substrate taken out from the cassette to form a resist film, to these processing modules, sequentially substrate along the circulation path And a first substrate transfer means having a predetermined cycle time for making one round of the circulation path, and a processing station comprising:
Inspecting a substrate that has been processed in this processing station, a plurality of inspection modules having different inspection times, delivery of a substrate between the cassette station and the processing station, and an inspection module A second substrate transfer means for delivering the substrate, and an inspection station comprising:
One transfer module for transferring the substrate before the inspection processed in the processing station to the second substrate transfer means, and the other transfer module for transferring the substrate after the inspection from the second substrate transfer means; With
Among the substrates that have been processed at the processing station, a coating that includes a substrate that is inspected by one inspection module and then inspected by another inspection module that performs an inspection different from the inspection. A method of controlling the developing device,
When the ready signal notifying the preparation for transferring the substrate from the cassette station to the processing station is output, or when the ready signal notifying the preparation for transferring the substrate from the processing station to the transfer destination is output, the second substrate transfer is performed. A step in which the means preferentially transports the substrate;
A process of carrying in on the basis of a transfer schedule for one inspection module from a board with a small processing order assigned to the board,
After an inspection is performed by one inspection module, an inspection is performed on a substrate that is not inspected by another inspection module that performs an inspection different from the inspection , regardless of the processing order assigned to the substrate. And a step of unloading the completed substrate from the inspection module to the other delivery module .

  A storage medium according to still another invention stores a computer program for performing the method of the present invention.

In the present invention, since a substrate having a smaller processing order than a substrate having a larger processing order assigned to the substrate can be carried out first from the inspection module, that is, the substrate is unloaded from the inspection module. Therefore, it is possible to reduce a wasteful time that the processed substrate waits in the inspection module and improve throughput (productivity). And, for board loading into the inspection module, overtaking of the board is prohibited, so the recipe change by entering the first board of the later lot into the inspection module and then the last board of the previous lot The problem of outbreak does not occur.

  First, an outline of an embodiment of the coating and developing apparatus according to the present invention will be described with reference to the plan view of FIG. 1 and the perspective view of FIG. In FIG. 1 and FIG. 2, reference numeral 21 denotes a cassette station for carrying in and out a cassette C in which, for example, 13 sheets of 12-inch wafers W are sealed and stored, for example. A placement portion 22 to be placed, an opening / closing portion 23 provided on a wall surface in front of the placement portion 22, and a delivery arm 24 as delivery means for taking out the wafer W from the cassette C via the opening / closing portion 23. And are provided. The delivery arm 24 is configured such that the arm can be moved up and down, moved left and right, back and forth, and rotatable about a vertical axis, and is controlled based on a command from the control unit 200 described later.

On the back side of the cassette station 21, an inspection station 40 and a processing station S1, which are each surrounded by a casing, are connected in this order.
The inspection station 40 includes four transfer modules TRSa to TRSd, inspection modules E1 to E3, and a second substrate that transfers wafers between these modules TRSa to TRSd and E1 to E3 and the transfer modules TRS1 and TRS4. And a transfer arm 4 serving as a transfer means. The delivery modules TRSa to TRSd are stacked one above the other as shown in FIG. 3, and the inspection modules E1 to E3 are also stacked one above the other. A more detailed description of the inspection station 40 will be described later, and the processing station S1 will be described first.

  The processing station S1 has three shelf modules 25 (25A, 25B, 25C) in which heating / cooling modules are arranged in order from the front side, and 2 for transferring wafers W between liquid processing modules described later. Main arms 26A and 26B, which are first substrate transfer means, are alternately arranged. Each of the main arms 26 (26A, 26B) includes two arms, and the arm 27 is configured to be movable up and down, movable left and right, front and rear, and rotatable about a vertical axis, which will be described later. It is controlled based on a command from the control unit 200.

  The shelf modules 25 (25A, 25B, 25C) and the main arms 26A, 26B are arranged in a line in the front-rear direction when viewed from the cassette station 21 side, and an opening for transferring a wafer (not shown) is formed in each connection portion G. Therefore, the wafer W can move freely from the shelf module 25A on one end side to the shelf module 25C on the other end side in the processing station S1. Further, the main arms 26A and 26B have one surface portion on the shelf module 25 (25A, 25B and 25C) side arranged in the front-rear direction as viewed from the cassette station 21, for example, one surface portion on the right liquid processing apparatus side, It is placed in a space surrounded by a partition wall composed of a single back surface.

  At a position where the substrate is transferred by the main arm 26 (26A, 26B), a liquid processing module 28 (28A, 28B) in which a liquid processing apparatus such as a coating apparatus 4A or a developing apparatus 4B is further multi-staged is provided. . For example, as shown in FIG. 2, the liquid processing module 28 (28A, 28B) has a configuration in which processing containers 29 in which the coating apparatus 4A and the like are stored are stacked in a plurality of stages, for example, five stages.

  As for the shelf module 25 (25A, 25B, 25C), as shown in FIG. 3, for example, a delivery module (TRS1 to TRS4) that forms a delivery part for delivering a wafer, after application of a resist solution, and a developing solution Module (LHP1, LHP2) that forms a heating device for performing a heat treatment of a wafer after coating, and a cooling module that performs a cooling device for performing a wafer cooling process before and after applying a resist solution and before developing processing In addition to (CPL1, CPL2, CPL3), for example, heating modules (PEBs) that form a heating device for performing a heat treatment of the wafer after the exposure processing are assigned to, for example, upper and lower 10 stages. Here, TRS1 and TRS4 are used for transferring wafers between the cassette station 21 and the processing station S1, and TRS2 and TRS3 are used for transferring wafers between the two main arms 26A and 26B.

  In this example, the heating modules (LHP1, LHP2), the cooling modules (CPL1, CPL2, CPL3), and the heating module (PEB) correspond to the processing modules.

  An exposure apparatus S4 is connected to the back side of the shelf module 25C in the processing station S1 via the first interface unit S2 and the second interface unit S3. The first interface unit S2 is configured to be movable up and down and rotatable about a vertical axis, and as will be described later, a transfer arm 31 that transfers a wafer to and from the CPL2 and PEB of the shelf module 25C of the processing station S1, and the periphery A shelf module 32A in which an in-buffer cassette for temporarily storing wafers carried into the exposure apparatus and the exposure apparatus S4 and an out-buffer cassette for temporarily storing wafers unloaded from the exposure apparatus S4 are arranged in multiple stages; And a shelf module 32B in which a wafer transfer module and a high-precision temperature control module are arranged in multiple stages.

  The second interface unit S3 is provided with a transfer arm 33, which allows the transfer module and high-precision temperature control module of the first interface unit S1, the in-stage 34 and the out-stage 35 of the exposure apparatus S4. The wafer is delivered.

  Here, the movement of the main arms 26A and 26B in the processing station S1 will be described. As shown in FIG. 4, for example, the two main arms 26A and 26B are TRS1 → CPL1 → coating apparatus (COT) → TRS2 → The wafer is transported from the cassette station 21 to the first interface unit S2 through the route LHP1 → CPL2, and then the first interface unit S2 through the route PEB → CPL3 → developing device (DEV) → LHP2 → TRS3 → TRS4. To move the wafer toward the cassette station 21. The wafer is transferred between the processing station S1 and the first interface unit S2 via the CPL2 and the PEB.

  At this time, in this embodiment, as shown in FIG. 4 with the respective paths of the main arms 26A and 26B indicated by dotted lines, the main arm 26A has, for example, a circulation path of TRS1, CPL1, COT, TRS2, TRS3, TRS4, and TRS1. The main arm 26B transports the wafer in a cycle, and the main arm 26B transports the wafer through a route of TRS2, LHP1, CPL2, PEB, CPL3, DEV, LHP2, TRS3, and TRS2. Therefore, for example, as shown in FIG. 3, an example of the layout of the shelf modules 25A to 25C is a shelf module 25A for TRS1 and TRS4, a shelf module 25B for TRS2 and TRS3, a shelf module 25C for CPL2 and PEB, and a shelf module 25A for CPL1. The shelf modules 25B, LHP1, and LHP2 are arranged in the shelf module 25B or the shelf module 25C, respectively. Each of the main arms 26A and 26B includes two arm bodies. The main arms 26A and 26B each take out the wafer W placed on the processing module to be transferred, and then receive the next wafer W held by the module. hand over. The main arms 26A and 26B transfer the wafers W placed on each module to the next module one by one in accordance with a pre-made transfer schedule (order of modules for transferring the wafers W). In the transfer path, the wafer W with the smaller processing order is not overtaken by the wafer W with the larger order. For example, when the wafers W are transported in the order of the heating module → the cooling module, the wafers W having the larger order do not enter the heating module before the wafers W having the smaller order.

  Subsequently, the flow of the substrate when processing the substrate at the processing station S1 will be described. First, when the cassette C storing the wafer W from the outside is carried into the cassette station 21, the lid of the cassette C is removed together with the opening / closing portion 23, and the wafer W is taken out by the transfer arm 24. Then, the wafer W is transferred from the transfer arm 24 to the transfer module TRSa and transferred from here to the transfer module TRS1 by the transfer arm 4 of the inspection module 40 as shown in FIGS. Next, the main arm 26A receives the wafer W from here, and thereafter it is transferred by the main arms 26A and 26B along the route of TRS1, CPL1, COT, TRS2, LHP1, CPL2, and the resist via the CPL2. The wafer on which the liquid has been applied is sent to the first interface unit S2.

  In the first interface unit S2, it is transported by the transfer arm 31 in the order of in-buffer cassette → peripheral exposure device → high-precision temperature control module, and transported to the second interface unit S3 via the transfer module of the shelf module 32B. Then, the wafer of the second interface unit S3 is transferred to the exposure apparatus S4 by the transfer means 33 via the in-stage 34 of the exposure apparatus S4, and exposure is performed.

  After exposure, the wafer is transferred to the processing station S1 via the second interface S3 → the first interface unit S2 and the PEB of the processing station S1, and as described above, PEB → CPL3 → DEV → LHP2 → TRS3 → TRS4. In this way, a predetermined developing process is performed in the developing device, and a predetermined resist pattern is formed.

  At this time, the main arm 26A transports the n-th wafer Wn of the lot to CPL1 of the next process via TRS1, and then returns to TRS1 after one cycle along the route of COT → TRS2 → TRS3 → TRS4 → TRS1. The next (n + 1) -th wafer Wn + 1 is transferred to CPL1 via TRS1. The main arm 26B transports the wafer of TRS2 to the LHP1 of the next process, and then returns to TRS2 again after one cycle along the path CPL2-> PEB-> CPL3-> DEV-> LHP2-> TRS3-> TRS2, and returns to the TRS2. Transport to LHP1 via TRS2. As described in the section of the background art, when 150 wafers W per hour are to be processed by this apparatus, the time of one cycle is set to 24 seconds.

Next, the inspection station 40 will be described in detail with reference to FIG. The transfer module TRSa is for placing the wafer W taken out from the cassette C and then discharged to the processing station S1, and the transfer module TRSb is a processed wafer W returned from the processing station S1. Is to be placed. In this example, the delivery module TRSc waits until it receives the processed wafer W from the cassette C containing the processed wafer W returned from the processing station S1 and pays it out to the inspection module E1 (E2, E3). The delivery module TRSd is a mounting table on which the wafer W inspected by the inspection module E1 (E2, E3) is loaded. The delivery modules TRSa to TRSd and the inspection modules E1, E2, and E3 are stacked, but in FIG. 4, they are arranged on a plane for convenience. The transfer arm 4 is
a) Control is performed so as to give priority to the transfer of the wafer W between the cassette station 21 and the processing station S1.
Therefore, if the cycle time is 24 seconds and the transfer operation of the transfer arm 4 is 5 seconds, transfer from the transfer module TRSa to TRS1 and transfer from the transfer module TRS4 to TRSb are given priority. Therefore, the transfer between the delivery modules TRSc, TRSd and the inspection module E1 (E2, E3) can be performed only twice in one cycle (within one cycle time). However, the transfer between the delivery modules TRSc, TRSd and the inspection module E1 (E2, E3) may actually be performed twice or more in each cycle. For example, it is assumed that the wafer W on the transfer module TRS1 is taken out by the main arm 26A, and the subsequent wafer W is subsequently transferred from the transfer module TRSa to TRS1 by the transfer arm 4. The main arm 26A takes out the succeeding wafer W from the delivery module TRS1 after the cycle time elapses, and the timing at which the succeeding wafer W is further carried into the delivery module TRS1 that has become empty is the next cycle. It may be the time when the time elapses, that is, the time until the main arm 26A comes to the delivery module TRS1 next time. For this reason, there is a case where the transfer between TRSd and the inspection module E1 (E2, E3) can be performed three times in a certain cycle. As an example of this, there is a case where the transfer of the substrate to the inspection module is started immediately before the end of one cycle time, and the transfer of the substrate from the transfer module TRSa to TRS1 becomes possible immediately after that.

  When the delivery module TRS1 is also used as a processing module, since the residence time of the wafer W in the processing module is determined, such transfer is not allowed, and the transfer is always performed twice in one cycle. This point will be described later.

Furthermore, the transfer arm 4
b) Carrying in the inspection module E1 (E2, E3) from the wafer W with the smallest processing order assigned to the wafer W,
c) Regardless of the order of processing assigned to the wafer W, the wafer W that has been inspected is controlled to be unloaded from the inspection module E1 (E2, E3). Accordingly, for example, the wafers 1 to 13 are transferred in order from the transfer module TRSc to the inspection module E1 (E2, E3). However, for example, the 11th wafer W is processed in a certain cycle time. However, if the 9th wafer W has not been processed, the 9th wafer W is overtaken and the 11th wafer W is unloaded from the inspection module E1 (E2, E3).

  Here, the inspection module will be described. In this example, the inspection module E1 is a macro inspection module for detecting a macro defect on the wafer W, and the inspection module E2 is a thickness or pattern of a film formed on the wafer W. The inspection module E3 is an overlay inspection module for detecting misalignment of exposure, that is, misalignment between the pattern formed this time and the underlying pattern. In this case, the time required for the inspection of the inspection modules E1, E2, and E3 is, for example, 30 seconds, 100 seconds, and 140 seconds, respectively. Since the inspection times in the inspection modules E1, E2, and E3 are different as described above, the inspection of the wafers W with the large (slow) order of loading is completed earlier than the wafers W with the small (early) order of loading. Cases arise.

The delivery arm 24 of the cassette station 21 is
a) Receive the wafer W before processing from the cassette C and deliver it to the delivery module TRSa;
b) Receive the processed wafer W from the delivery module TRSb and return it to the cassette C;
c) Deliver the processed wafer W from the cassette C to the delivery module TRSc,
d) Transfer the inspected wafer W from the transfer module TRSd to the cassette C.
Have a role. In addition, since the transport of a) and b) must be performed within the cycle time, if the cycle time is 24 seconds, if one transport operation takes 8 seconds, for example, Then, only one of c) and d) can be performed.

  The apparatus includes a control unit 200 including a computer, and a series of processes including the transfer operation of the transfer arm 24 and the transfer arm 4 is controlled by a computer program stored in the storage unit of the control unit 200. . For the delivery module, when the wafer W is placed or delivered, a ready signal is output for the module, and for the inspection module, the inspection of the wafer W is completed or delivered. The ready signal for that module is output. More specifically, for example, a signal output when the wafer W is placed on the TRSa becomes a delivery preparation completion signal when viewed from the transfer arm 4 and is output when the wafer W is discharged from the TRSa. When viewed from the delivery arm 24, the signal becomes a delivery preparation completion signal. Therefore, both arms 24 and 4 can determine which module can be transferred from which module now based on these ready signals, and the transfer operation is determined based on the determination and the previous rule. .

  Next, the effect | action regarding the inspection station 40 in this Embodiment is demonstrated. FIG. 5 shows a wafer W placed in each of the delivery modules TRSa and TRSb and the inspection modules E1, E2 and E3 for each cycle, and the numbers are the order assigned to the wafers in the management of processing. That is, the wafers W in the cassette C return from the processing station S1 in this order and are delivered to the inspection station 40 in this order. In other words, the meaning of the arrangement of the uppermost number means that the wafer W corresponding to the number arranged here is located in the cassette C. In other words, when this table is viewed vertically, it is a so-called schedule conveyance table, and the uppermost number can be read as the cycle number.

In the following description, assuming that the uppermost number is handled as a cycle number, in cycle 1, no wafer W is contained in any of the modules TRSc, TRSd, E1, E2, and E3.
In the next cycle 2, wafer “1” is placed on TRSc. This is because the transfer operation related to the inspection that the transfer arm 24 can perform in one cycle is performed once as described above.
In cycle 3, TRSc wafer “1” is transferred to inspection module E 1 by transfer arm 4, and then wafer “2” is placed on TRSc by transfer arm 24.
In cycle 4, TRSc wafer “2” is transferred to inspection module E <b> 2 by transfer arm 4, and then wafer “3” is placed on TRSc by transfer arm 24. At this time, since the inspection of the wafer “1” is not completed in the inspection module E1, it remains as it is.
In cycle 5, the transfer arm 4 transfers the wafer “3” from TRSc to the inspection module E3, and then transfers the wafer “1” that has been inspected by the inspection module E1 to TRSd. The transfer arm 24 transfers the next wafer “4” to TRSc.

  In this way, when the cycle proceeds to cycle 27, the previous wafers “9” and “10” are being inspected by the inspection modules E3 and E2, respectively, but the subsequent wafer “11” has finished the processing in the inspection module E1. ing. Therefore, in this case, without waiting for the completion of the inspection of the previous wafers “9” and “10”, the subsequent wafer “11” is first unloaded from the inspection module E1 and transferred to TRSd. Subsequently, the wafer “12” is transferred from the TRSd to the inspection module E1, and the wafer “13” is placed on the TRSd.

  FIGS. 7A and 7B show the output of the ready signal and the transfer path in this cycle 27, respectively, and the control operation of the transfer arm 4 is clarified. First, when an inspection end signal (a ready signal that is a carry-out preparation completion signal) is output from the inspection module E1, the transfer arm 4 transfers the wafer “11” to TRSd. When a ready signal indicating completion of unloading is output from TRSc during the transfer, and subsequently a ready signal indicating completion of loading is output from TRS1, transfer from cassette station 21 to processing station S1 is preferentially performed. Accordingly, the wafer “n” is preferentially transferred from TRSa to TRS1, and then the wafer “12” is transferred from TRSc to the inspection module E1.

  On the other hand, when the wafer is not overtaken and the loading and unloading into the inspection modules E1, E2, and E3 are performed in the order of the wafer numbers as in the present invention, the transfer schedule is as shown in FIG. For example, paying attention to the cycle 31, the wafer “11” waits in the inspection module E <b> 1 until the cycle 40 even though the inspection is completed, and there is a lot of wasted time. Therefore, the number of cycles required until the wafer “22” is returned to the cassette C is 46 cycles in the present invention, whereas it is 61 cycles when no overtaking is performed.

  According to the above-described embodiment, a wafer having a smaller processing order than a wafer having a larger processing order assigned to the wafer can be unloaded first from the inspection module E1 (E2, E3). With regard to the unloading of the wafer from the inspection module E1 (E2, E3), since the wafer can be overtaken, it is possible to reduce wasted time that the processed wafer waits in the inspection module E1 (E2, E3), Throughput (productivity) can be improved. As for the wafer loading into the inspection module E1 (E2, E3), the overtaking of the wafer is prohibited, so that the first wafer of the later lot enters the inspection module, and the last wafer of the previous lot continues. There is no problem of recipe changes due to entering.

  Also, depending on the wafer transfer route, in addition to a delivery module that only delivers a substrate, a cooling module that cools the substrate and a heating module that heats the substrate, both cooling or heating the substrate and delivering the substrate The module for performing the above may be used for transferring the wafer from the substrate cassette to the processing station. In this case, this processing module also serves as the transfer module TRS1. In this case, as already described in the description of the control of the transfer arm 4, since the processing time of the wafer W, that is, the stay time in TRS1, is determined, the wafer W from the cassette station 21 is transferred to the processing station S1. In the remaining time obtained by subtracting the transfer time and the transfer time for receiving the wafer W from the processing station S1 from the cycle time, it is necessary to deliver the wafer W to the inspection module E1 (E2, E3).

  In other words, even if the wafer W can be delivered to the inspection module E1 (E2, E3), by performing the operation before the operation is performed, the wafer W is transferred from the subsequent delivery module TRSa to the TRS1. It is necessary to determine whether or not the end point of delivery passes the end point of the cycle time. When the end time of the cycle time has passed, it is necessary to control so as not to transfer the wafer W to the inspection module E1 (E2, E3). If the delivery is executed, the stay time (processing time) in the delivery module TRS1 for the next wafer W becomes shorter than the set time.

  FIG. 8 is an explanatory view showing such a state. T0 is the end point of the cycle time in a certain cycle, and when the wafer “11” can be unloaded from the inspection module E1, the control unit 200 performs the transfer operation of the transfer arm 4 from that point to T0. It is determined whether or not it is twice or more of 5 seconds, which is the time, and if it is twice or more, the wafer W is transferred from the inspection module E1 to the transfer module TRSd. Therefore, when the previous wafer is subsequently unloaded from the transfer module (for example, the cooling module) TRS1 by the main arm 26A, the subsequent wafer “n” is immediately transferred from the transfer module TRSa to the TRS1. Thereafter, the transfer arm 4 transfers the wafer “11” from the inspection module E1 and transfers it to the module TRSd.

  In the present invention, all the wafers in the cassette C may be inspected, or selected wafers may be inspected. Further, instead of inspecting the wafer processed in the processing station S1 and returned to the cassette C, a delivery arm for the wafer in the cassette brought into the mounting portion 22 for inspection from the outside of the coating and developing apparatus. In the same manner, the inspection module E1 (E2, E3) may be used for inspection using the transfer arm 24 and the transfer arm 4.

It is a top view which shows one Embodiment of the application | coating and developing apparatus of this invention. It is an external appearance perspective view which shows the said coating and developing apparatus. It is a side view which shows the outline of the layout of the said application | coating and image development apparatus. It is explanatory drawing which shows the flow of the board | substrate of the said coating and developing apparatus. In this invention, it is explanatory drawing which shows the simulation of the conveyance schedule which shows the motion of the board | substrate in an inspection station. In a comparative example, it is explanatory drawing which shows the simulation of the conveyance schedule which shows the motion of the board | substrate in an inspection station. It is explanatory drawing which matched the ready signal of a test | inspection module and the delivery module, and the motion of a board | substrate in one cycle of the said conveyance schedule. It is explanatory drawing which matched the ready signal of a test | inspection module and the delivery module, and the motion of a board | substrate in one cycle of the said conveyance schedule. It is a top view which shows the flow of the board | substrate in the conventional coating and developing apparatus.

W Wafer C Cassette 21 Cassette station 24 Delivery arm 26A, 26B Main arm 40 Inspection station 4 Transfer arm TRSa to TRSd Delivery module
TRS1 to TRS4 Delivery modules E1 to E3 Inspection module 200 Control unit S1 Processing station

Claims (13)

A cassette station having a transfer unit for transferring a substrate to and from a cassette on which a cassette storing a plurality of substrates is placed;
Conveying a plurality of processing modules includes a processing module for processing modules and development for and against the substrate taken out from the cassette to form a resist film, to these processing modules, sequentially substrate along the circulation path And a first substrate transfer means having a predetermined cycle time for making one round of the circulation path, and a processing station comprising:
A substrate that has been processed is inspected, a plurality of inspection modules having different inspection times, a substrate transfer between the cassette station and the processing station, and a substrate transfer to the inspection module. An inspection station comprising: a second substrate transfer means;
One transfer module for transferring the substrate before the inspection processed in the processing station to the second substrate transfer means, and the other transfer module for transferring the substrate after the inspection from the second substrate transfer means; ,
A control unit for controlling the second substrate transfer means,
The substrates that have been processed in the processing station include substrates that are inspected in one inspection module and then inspected in another inspection module that performs an inspection different from the inspection,
The control unit is configured for the second substrate transfer unit.
a) Priority is given to the transfer of substrates from the cassette station to the processing station and the reception of substrates from the processing station;
b) Carrying in the inspection module from the board with the smallest processing order assigned to the board based on the transport schedule ,
c) After a test is performed by one inspection module, a substrate that is not inspected by another inspection module that performs an inspection different from the inspection , regardless of the processing order assigned to the substrate, A coating and developing apparatus comprising a function of controlling a substrate that has been inspected to be carried out from the inspection module to the other delivery module . One transfer module and the other transfer module provided for transferring the substrate between the transfer means and the second substrate transfer means in the cassette station,
The control unit transfers the substrate that has been processed at the processing station to the cassette, takes out the substrate from the cassette, transfers the substrate to the one transfer module, and transfers the substrate that has been inspected from the other transfer module to the cassette. 2. The coating / developing apparatus according to claim 1, wherein the transfer means in the cassette station is controlled.   3. The coating / developing apparatus according to claim 2, wherein the control unit controls the transfer unit so that the substrate processed at the processing station is taken out from the cassette and transferred to the one transfer module.   The said control part controls the delivery means in a cassette station so that a board | substrate is taken out from the cassette brought in for the test | inspection from the application | coating and the developing apparatus, and it may deliver to said one delivery module. Item 3. The coating and developing apparatus according to Item 2.   5. The transfer means in the cassette station can transfer a substrate only once to either the one or the other transfer module within the cycle time. Application and development equipment. The substrate from the cassette station is transferred to the processing module of the processing station by the second substrate transfer means,
In the remaining time obtained by subtracting the transport time for transporting the substrate from the cassette station to the processing station and the transport time for receiving and transporting the substrate from the processing station to the inspection module. 6. The coating and developing apparatus according to claim 1, wherein the second substrate transfer unit is controlled so as to transfer the substrate to the substrate. A cassette station having a transfer unit for transferring a substrate to and from a cassette on which a cassette storing a plurality of substrates is placed;
Conveying a plurality of processing modules includes a processing module for processing modules and development for and against the substrate taken out from the cassette to form a resist film, to these processing modules, sequentially substrate along the circulation path And a first substrate transfer means having a predetermined cycle time for making one round of the circulation path, and a processing station comprising:
Inspecting a substrate that has been processed in this processing station, a plurality of inspection modules having different inspection times, delivery of a substrate between the cassette station and the processing station, and an inspection module A second substrate transfer means for delivering the substrate, and an inspection station comprising:
One transfer module for transferring the substrate before the inspection processed in the processing station to the second substrate transfer means, and the other transfer module for transferring the substrate after the inspection from the second substrate transfer means; With
Among the substrates that have been processed at the processing station, a coating that includes a substrate that is inspected by one inspection module and then inspected by another inspection module that performs an inspection different from the inspection. A method of controlling the developing device,
When the ready signal notifying the preparation for transferring the substrate from the cassette station to the processing station is output, or when the ready signal notifying the preparation for transferring the substrate from the processing station to the transfer destination is output, the second substrate transfer is performed. A step in which the means preferentially transports the substrate;
A process of carrying in on the basis of a transfer schedule for one inspection module from a board with a small processing order assigned to the board,
After an inspection is performed by one inspection module, an inspection is performed on a substrate that is not inspected by another inspection module that performs an inspection different from the inspection , regardless of the processing order assigned to the substrate. And a step of unloading the finished substrate from the inspection module to the other delivery module . One transfer module and the other transfer module are provided for transferring the substrate between the transfer means in the cassette station and the second substrate transfer means,
A process of transferring the substrate that has been processed at the processing station to the cassette by a transfer means;
Removing the substrate from the cassette and delivering it to the one delivery module;
A process of transferring the substrate after the inspection from the other transfer module to the cassette by the transfer means;
The method for controlling a coating and developing apparatus according to claim 7, further comprising:   9. The coating and developing device control according to claim 8, wherein the substrate delivered to the one delivery module is a substrate taken out from a cassette brought in for inspection from the outside of the coating and developing device. Method.   9. The method of controlling a coating and developing apparatus according to claim 8, wherein the substrate delivered to the one delivery module is a substrate processed at a processing station.   11. The transfer means in the cassette station can transfer a substrate only once to either the one or the other transfer module within the cycle time. Control method for coating and developing apparatus. The substrate from the cassette station is transferred to the processing module of the processing station by the second substrate transfer means,
The step of transferring the substrate to the inspection module is a process of transferring the substrate from the cassette station to the processing station and the transfer time for receiving and transferring the substrate from the processing station by subtracting the remaining time from the cycle time. The method for controlling a coating and developing apparatus according to claim 7, wherein the controlling method is performed in the medium. A storage medium in which a computer program used in a developing apparatus, coating of a resist on a substrate, coating on a substrate after the resist is applied and exposed, and development on the substrate,
13. A storage medium characterized in that the computer program is for carrying out the coating and developing apparatus control method according to claim 8.

Images