JP2011249578A - Apparatus, method, and jig for manufacturing electrical circuit - Google Patents

Abstract

An electric circuit manufacturing apparatus and manufacturing method and an electric circuit manufacturing jig capable of suppressing generation of voids in a solder layer for soldering an electric component such as a semiconductor element to a base material are provided.
An electrical component (13) is soldered to a substrate (11) by temporarily melting a solder material (121) disposed between the substrate (11) and the electrical component (13). An electric circuit manufacturing apparatus, which is formed so as to extend to the side of the electric component (13) and the solder material (121) when being superimposed on the electric component (13) and the solder material (121) 13) and a positioning part (112) for determining a relative position between the solder material (121) and a protrusion part (113) that protrudes toward the electric part and contacts the surface of the electric part (13). A jig (110); and a heater (120) that heats at least the jig (110) and temporarily melts the solder material (121) by heat conducted from the jig (110).
[Selection] Figure 2

Description

  The present invention relates to an electric circuit manufacturing apparatus and method, and an electric circuit manufacturing jig.

  Various techniques have been proposed for preventing the generation of voids in the solder layer when a semiconductor element is soldered to a substrate. In Patent Document 1, a solder material is disposed near the center of the semiconductor element and heated. By doing so, the solder material starts to melt from the vicinity of the central portion of the semiconductor element and spreads to the surroundings. For this reason, the generation of voids in the solder layer near the center of the semiconductor element can be suppressed.

Japanese Patent No. 4232727

  However, it has been found by the present inventor that voids may remain even with such a method.

  The present invention has been made paying attention to such conventional problems, and the manufacture of an electric circuit capable of suppressing the occurrence of voids in a solder layer for soldering an electric component such as a semiconductor element to a base material. An object is to provide an apparatus, a manufacturing method, and an electric circuit manufacturing jig.

  The present invention solves the above problems by the following means.

  The electrical circuit manufacturing apparatus of the present invention is an apparatus for soldering an electrical component to a base material by temporarily melting a solder material disposed between the base material and the electrical component. And a positioning portion that is formed so as to extend to the side of the electrical component and the solder material when superimposed on the electrical component and the solder material, and that projects relative to the electrical component and the solder material. A jig that is provided and has a protrusion that contacts the surface of the electrical component; and a heater that at least heats the jig and heats the solder material by heat conducted from the jig. Features.

  According to the present invention, when the electric component and the solder material are overlaid, the protruding portion projecting toward the electric component abuts the surface of the electric component, and at least the jig is heated in this state to conduct from the jig. Since the solder material is temporarily melted by the generated heat, voids are less likely to occur in the solder layer.

It is a perspective view which shows an example of the electric circuit manufactured using the electric circuit manufacturing apparatus by this invention. It is a figure explaining 1st Embodiment of the electric circuit manufacturing apparatus by this invention. It is a figure explaining 2nd Embodiment of the electric circuit manufacturing apparatus by this invention. It is a figure explaining 3rd Embodiment of the electric circuit manufacturing apparatus by this invention. It is a figure explaining 4th Embodiment of the electric circuit manufacturing apparatus by this invention. It is a figure explaining 5th Embodiment of the electric circuit manufacturing apparatus by this invention. It is a figure explaining 6th Embodiment of the electric circuit manufacturing apparatus by this invention. It is a figure explaining 7th Embodiment of the electric circuit manufacturing apparatus by this invention.

  Hereinafter, embodiments for carrying out the present invention will be described in more detail with reference to the drawings.

(First embodiment)
FIG. 1 is a perspective view showing an example of an electric circuit manufactured using the electric circuit manufacturing apparatus according to the present invention.

  The electric circuit 10 shown in FIG. 1 is used for an inverter mounted on an electric vehicle such as an electric vehicle or a hybrid vehicle.

  An electrical component 13 such as a semiconductor element is soldered to the base 11 of the electrical circuit 10. The semiconductor element 13 generates heat during driving and becomes high temperature. In order to release the heat, it is desirable that the solder layer 12 does not contain voids. In particular, the semiconductor element 13 has the highest temperature near the center. For this reason, it is particularly desirable that the solder layer 12 does not contain voids in a region near the center of the semiconductor element 13.

  Therefore, the inventors of the present invention have completed the present invention by preventing the voids from being contained in the solder layer to which the electrical component (semiconductor element) is joined by earnest research.

  Specific contents will be described below.

  FIG. 2 is a diagram for explaining a first embodiment of an electric circuit manufacturing apparatus according to the present invention.

  The electric circuit manufacturing apparatus 100 is an apparatus for soldering the semiconductor element 13 to the base material 11 by temporarily melting the solder pellets 121 disposed between the base material 11 and the semiconductor element (electric component) 13. . As shown in FIG. 2C, the electric circuit manufacturing apparatus 100 includes a jig 110, a jig side heater 120, and a base material side heater 130.

  The solder pellet 121 is the same size as the semiconductor element 13 or slightly larger than the semiconductor element 13, and contacts the entire surface of the semiconductor element 13. FIG. 2 shows a case where the solder pellet 121 is slightly larger than the semiconductor element 13.

  As shown in FIG. 2B, the jig 110 is an integrated product including a positioning portion 112 and a protrusion 113. As a material of the jig 110, a material having a low coefficient of linear expansion and good thermal conductivity, such as carbon, stainless steel, tungsten, or the like is preferable.

  The positioning part 112 is a leg extending from the ceiling part 111. In FIG. 2 (B), the positioning portion 112 extends downward from the ceiling portion 111.

  As shown in FIG. 2C, the positioning unit 112 has the solder pellet 121 and the semiconductor element 13 when the jig 110 is stacked on the solder pellet 121 and the semiconductor element 13 placed on the base material 11. It is formed so as to extend to the side. The inner wall surface 112 a of the positioning portion 112 is positioned on the side of the solder pellet 121. As a result, the relative position between the jig 110 and the solder pellet 121 is determined. In particular, if the inner wall surface 112a of the positioning portion 112 contacts the side surface 121a of the solder pellet 121, the relative position is accurately determined. The semiconductor element 13 is the same size as the solder pellet 121 or slightly smaller than the solder pellet 121. Therefore, if the inner wall surface 112a of the positioning part 112 is located on the side of the solder pellet 121, the gap between the positioning part 112 and the semiconductor element 13 is small, so that the relative position between the jig 110 and the semiconductor element 13 is generally determined. It is done.

  If the solder pellet 121 and the semiconductor element 13 have the same size, the positioning unit 112 accurately determines the relative positional relationship between the solder pellet 121 and the semiconductor element 13 and the jig 110.

  The protrusion 113 is a portion protruding from the ceiling 111 toward the semiconductor element 13 (the lower side in FIG. 2). As shown in FIG. 2C, when the jig 110 is overlaid on the solder pellet 121 and the semiconductor element 13 placed on the base material 11, the protrusion 113 comes into contact with the surface of the semiconductor element 13. . As described above, the semiconductor element 13 has the highest temperature near the center. Therefore, it is very preferable that the solder layer 121 does not include voids in the region near the center of the semiconductor element 13. Therefore, in FIG. 2, the protrusion 113 abuts particularly near the center of the surface of the semiconductor element 13.

  The jig side heater 120 is a heater provided on the jig side (above the jig 110 in FIG. 2). The jig side heater 120 is separated from the jig 110. The jig side heater 120 heats the jig 110 by radiant heat. The heat is conducted from the jig 110 to the solder pellet 121 through the semiconductor component 13.

  The substrate side heater 130 is a heater provided on the substrate side (the lower surface of the substrate 11 in FIG. 2). The substrate-side heater 130 heats the substrate 11 with the conducted heat, and the heat is conducted from the substrate 11 to the solder pellet 121.

(Electrical circuit manufacturing method)
Next, a method for manufacturing an electric circuit will be described with reference to FIG.

  First, the solder pellets 121 are stacked on the base material 11, and further the semiconductor element 13 is stacked (component arrangement step # 101; FIG. 2A).

  Next, the jig 110 is stacked from above the semiconductor element 13 (jig application step # 102; FIG. 2B). At this time, since the positioning portion 112 is formed on the jig 110, the inner wall surface 112a of the positioning portion 112 contacts the side surface 121a of the solder pellet 121, and the relative position between the jig 110 and the solder pellet 121 is determined. . The semiconductor element 13 is slightly smaller than the solder pellet 121. Therefore, if the inner wall surface 112a of the positioning part 112 is located on the side of the solder pellet 121, the gap between the positioning part 112 and the semiconductor element 13 is small, so that the relative position between the jig 110 and the semiconductor element 13 is generally determined. It is done.

  Then, it heats with the jig side heater 120 and the base material side heater 130 (heating process # 103; FIG.2 (C)). Then, the radiant heat from the jig side heater 120 is conducted from the jig 110 to the solder pellet 121 through the semiconductor component 13. Further, the heat conducted from the substrate side heater 130 is conducted from the substrate 11 to the solder pellet 121. As a result, the solder pellet 121 is melted.

  Then, the solder layer 12 is formed, and the semiconductor component 13 is soldered to the base material 11 to complete the electric circuit 10 (FIG. 2D).

  According to this embodiment, the jig 110 is provided with the positioning portion 112. Therefore, the relative positions of the jig 110, the solder pellet 121, and the semiconductor element 13 are determined.

  Then, when the jig 110 is overlaid on the solder pellet 121 and the semiconductor element 13 placed on the base material 11, the protrusion 113 comes into contact with the surface of the semiconductor element 13. For this reason, the heat from the heater is efficiently transmitted. In particular, in this embodiment, the protrusion 113 abuts near the center of the surface of the semiconductor element 13. Therefore, heat is conducted through the semiconductor element 13, and the temperature near the center of the solder pellet 121 becomes particularly high, and voids are hardly generated.

  Further, the solder pellet 121 is the same size as the semiconductor element 13 or slightly larger than the semiconductor element 13 and is in contact with the entire surface of the semiconductor element 13. Therefore, voids are less likely to occur under the semiconductor element 13.

(Second Embodiment)
FIG. 3 is a view for explaining a second embodiment of the electric circuit manufacturing apparatus according to the present invention.

  In the following description, parts having the same functions as those described above are denoted by the same reference numerals, and redundant description is omitted as appropriate.

  The jig-side heater of the first embodiment is a heater 120 that is separated from the jig 110 and heats the jig 110 by radiant heat.

  On the other hand, the jig-side heater of the present embodiment is a heater 140 that is in contact with the jig 110 and heats the base material 11 by the conducted heat, as shown in FIG.

  Even when such a jig-side heater 140 is used, the same effect as that of the first embodiment can be obtained.

(Third embodiment)
FIG. 4 is a diagram for explaining a third embodiment of the electric circuit manufacturing apparatus according to the present invention.

  The jig according to the first embodiment is an integrated product including the positioning portion 112 and the protruding portion 113.

  On the other hand, as shown in FIG. 4B, the jig according to the present embodiment includes an electric component contact body 110-1 having a projection 113 and a positioning body 110-2 including a positioning portion 112. Is a two-piece product consisting of As a material of the electrical component contact body 110-1, a material having good thermal conductivity, such as copper and brass, is preferable. As a material of the positioning body 110-2, carbon, stainless steel, tungsten, or the like having a low coefficient of linear expansion and good thermal conductivity is preferable. A hole 114a is formed in the back surface 114 of the positioning body 110-2.

  As shown in FIG. 4 (C), the protrusion 113 of the electrical component contact body 110-1 is inserted into the hole 114a formed in the positioning body 110-2 and contacts the semiconductor component 13. Before the 121 is melted, the electrical component contact body 110-1 is separated from the positioning body 110-2. Therefore, the mass of the electrical component contact body 110-1 is applied to the semiconductor component 13. That is, the electrical component contact body 110-1 functions as a weight body that applies its own weight to the semiconductor component 13. In the present embodiment, the protrusion 113 of the electrical component contact body 110-1 is in contact with the vicinity of the center of the semiconductor element 13 and applies its own weight near the center of the semiconductor element 13.

  Then, when heated by the jig-side heater 120 and the substrate-side heater 130 in the heating step # 103 (FIG. 4C), the solder pellets 121 begin to melt. Then, the electrical component contact body 110-1 contacts the positioning body 110-2. By doing so, the protrusion 113 of the electrical component contact body 110-1 applies its own weight near the center of the semiconductor element 13, so that voids are unlikely to occur particularly in the solder layer 12 near the center of the semiconductor element 13. Become.

(Fourth embodiment)
FIG. 5 is a diagram for explaining a fourth embodiment of the electric circuit manufacturing apparatus according to the present invention.

  The jig-side heater of the third embodiment is a heater 120 that is separated from the jig 110 and heats the jig 110 by radiant heat.

  On the other hand, the jig-side heater of the present embodiment is a heater 140 that is in contact with the jig 110 and heats the base material 11 by the conducted heat, as shown in FIG.

  According to the present embodiment, not only the mass of the electrical component contact body 110-1 is applied to the vicinity of the center of the semiconductor element 13, but also a load can be applied by the jig-side heater 140. The solder layer 12 in the vicinity of the center of the solder is less likely to occur.

(Fifth embodiment)
FIG. 6 is a view for explaining a fifth embodiment of the electric circuit manufacturing apparatus according to the present invention.

  The jig-side heater 140 of the fourth embodiment is separate from the electrical component contact body 110-1.

  On the other hand, as shown in FIG. 6B, the jig-side heater 140 of the present embodiment integrally fixes the electrical component contact body 110-1.

  According to the present embodiment, since the electric component contact body 110-1 is fixed to the jig-side heater 140, the protrusion of the electric component contact body 110-1 can be moved by moving the jig-side heater 140 up and down. The load applied to the semiconductor element 13 by the portion 113 can be adjusted more precisely. Therefore, voids are less likely to occur in the solder layer 12 near the center of the semiconductor element 13.

(Sixth embodiment)
FIG. 7 is a view for explaining a sixth embodiment of the electric circuit manufacturing apparatus according to the present invention.

  As shown in FIG. 7B, the electric component contact body 110-1 of the jig of the present embodiment has legs 115 extending from the ceiling portion 111 outside the positioning body 110-2. In FIG. 7 (B), the legs 115 are extended downward from the ceiling portion 111.

  As shown in FIG. 7C, the protrusion 113 of the electrical component contact body 110-1 is inserted into the hole 114a formed in the positioning body 110-2 and contacts the semiconductor component 13. Before the 121 is melted, the legs 115 of the electrical component abutting body 110-1 are separated from the base material 11. Therefore, the mass of the electrical component contact body 110-1 is applied to the semiconductor component 13. That is, the electrical component contact body 110-1 functions as a weight body that applies its own weight to the semiconductor component 13. In the present embodiment, the protrusion 113 of the electrical component contact body 110-1 is in contact with the vicinity of the center of the semiconductor element 13 and applies its own weight near the center of the semiconductor element 13.

  Then, when heated by the jig-side heater 120 and the substrate-side heater 130 in the heating step # 103 (FIG. 7C), the solder pellets 121 begin to melt.

  Then, the legs 115 of the electrical component contact body 110-1 contact the base material 11 (FIG. 7D). Then, the heat of the substrate side heater 130 is conducted as indicated by an arrow, and is transmitted to the electric component contact body 110-1 through the substrate 11. Therefore, the heat of the substrate-side heater 130 can be used efficiently, and voids are further less likely to occur in the solder layer 12 near the center of the semiconductor element 13.

(Seventh embodiment)
FIG. 8 is a view for explaining a seventh embodiment of the electric circuit manufacturing apparatus according to the present invention.

  As shown in FIG. 8B, the electric component contact body 110-1 of the jig of the present embodiment has a wall surface 117 extending from the ceiling portion 111 outside the positioning body 110-2. An arm 116 is formed outward from 117, and a leg 115 is formed at the tip of the arm 116.

  As shown in FIG. 8C, the protrusion 113 of the electrical component contact body 110-1 is inserted into the hole 114a formed in the positioning body 110-2 and contacts the semiconductor component 13. Before 121 is melted, the legs 115 of the electrical component contact body 110-1 are separated from the substrate-side heater 130. Therefore, the mass of the electrical component contact body 110-1 is applied to the semiconductor component 13. That is, the electrical component contact body 110-1 functions as a weight body that applies its own weight to the semiconductor component 13. In the present embodiment, the protrusion 113 of the electrical component contact body 110-1 is in contact with the vicinity of the center of the semiconductor element 13 and applies its own weight near the center of the semiconductor element 13.

  Then, when heated by the jig side heater 120 and the base material side heater 130 in the heating step # 103 (FIG. 8C), the solder pellets 121 begin to melt.

  Then, the legs 115 of the electrical component contact body 110-1 contact the base material side heater 130 (FIG. 8D). Then, the heat of the substrate side heater 130 is conducted as indicated by an arrow, and is transmitted to the electrical component contact body 110-1. Therefore, the heat of the substrate side heater 130 can be used more efficiently, and voids are further less likely to occur in the solder layer 12 near the center of the semiconductor element 13.

  Without being limited to the embodiments described above, various modifications and changes are possible within the scope of the technical idea, and it is obvious that these are also included in the technical scope of the present invention.

  For example, also in the sixth embodiment and the seventh embodiment, the jig-side heater may be a heater that comes into contact with the jig 110 and heats the base material 11 with heat conducted. Moreover, the electric component contact body 110-1 may be integrally fixed to the heater.

  Moreover, in each embodiment, you may turn upside down.

  Furthermore, in 1st Embodiment and 2nd Embodiment, before the solder pellet 121 melt | dissolves, the positioning part 112 of the jig | tool 110 will leave | separate from the base material 11, and if the solder pellet 121 melt | dissolved, the positioning part 112 will be in the base material 11. You may set the length of the positioning part 112 so that it may contact. By doing so, the self-weight of the jig 110 can be applied to the semiconductor element 13, and generation of voids in the solder layer can be further suppressed.

  In the above description, the protrusion 113 is mainly described in the case of contacting the vicinity of the center of the semiconductor element 13, but there are also semiconductor elements and electrical parts that are particularly hot except for the vicinity of the center. If it is such a part, it is not desired to generate a void in a portion corresponding to the high temperature portion of the solder layer. In such a case, the position of the projection 113 may be determined according to the characteristics of the component.

11 Substrate 12 Solder layer 121 Solder pellet (solder material)
DESCRIPTION OF SYMBOLS 13 Electrical component 110 Jig 110-1 Electrical component contact body 110-2 Positioning body 112 Positioning part 113 Projection part 115 Leg 120 Jig side heater (radiant heat heater)
130 Substrate side heater 140 Jig side heater (heat conduction heater)

Claims (15)

An electrical circuit manufacturing apparatus for soldering an electrical component to a substrate by temporarily melting a solder material disposed between the substrate and the electrical component,
A positioning portion that is formed so as to extend to the side of the electrical component and the solder material when superimposed on the electrical component and the solder material, and that projects relative to the electrical component and the solder material; A jig having a protrusion that is provided and abuts against the surface of the electrical component;
A heater that at least heats the jig and temporarily melts the solder material by heat conducted from the jig;
An electric circuit manufacturing apparatus comprising: In the electric circuit manufacturing apparatus according to claim 1,
The positioning portion of the jig is positioned so that the protrusion comes into contact with the vicinity of the center of the electrical component.
An electrical circuit manufacturing apparatus. In the electric circuit manufacturing apparatus according to claim 1 or 2,
The positioning portion is floating in the air before the jig is overlapped with the electrical component and the solder material and the solder material is melted.
An electrical circuit manufacturing apparatus. In the electric circuit manufacturing apparatus according to any one of claims 1 to 3,
The heater includes a jig side heater provided on the jig side and a base material side heater provided on the base material side,
An electrical circuit manufacturing apparatus. In the electric circuit manufacturing apparatus according to claim 4,
The jig side heater is separated from the jig and heats the jig by radiant heat,
The base material side heater is in contact with the base material and heats the base material by heat conducted,
An electrical circuit manufacturing apparatus. In the electric circuit manufacturing apparatus according to claim 4,
The jig-side heater is in contact with the jig and heats the jig by the conducted heat,
The base material side heater is in contact with the base material and heats the base material by heat conducted,
An electrical circuit manufacturing apparatus. In the electric circuit manufacturing apparatus according to any one of claims 1 to 6,
The jig is an integral part,
An electrical circuit manufacturing apparatus. In the electric circuit manufacturing apparatus according to any one of claims 1 to 6,
The jig is a two-piece product having an electrical component contact body including a protrusion and a positioning body including a positioning portion, and the protrusion of the electrical component contact body is inserted through a hole formed in the positioning body. Abut against the electrical component,
An electrical circuit manufacturing apparatus. In the electric circuit manufacturing apparatus according to claim 8,
The electrical component contact body of the jig is a weight body that applies its own weight to the electrical component before the solder material melts.
An electrical circuit manufacturing apparatus. In the electric circuit manufacturing apparatus according to claim 8 or 9,
The electric component contact body of the jig includes legs that are separated from the base material before the solder material melts and contact the base material after the solder material melts.
An electrical circuit manufacturing apparatus. In the electric circuit manufacturing apparatus according to claim 8 or 9,
The electric component contact body of the jig includes leg portions that are separated from the base material side heater before the solder material is melted and contact the base material side heater after the solder material is melted.
An electrical circuit manufacturing apparatus. The electric circuit manufacturing apparatus according to any one of claims 8 to 11,
The electric component contact body of the jig is fixed to the jig-side heater,
An electrical circuit manufacturing apparatus. In the electric circuit manufacturing apparatus according to any one of claims 1 to 12,
The solder material is in contact with the entire surface of the electrical component;
An electrical circuit manufacturing apparatus. A jig used when an electrical circuit is manufactured by soldering an electrical component to a substrate by heating and temporarily melting a solder material disposed between the substrate and the electrical component,
A protrusion that contacts the electrical component;
A positioning portion for determining the position of the protrusion relative to the electrical component and the solder material;
A jig for manufacturing an electric circuit, comprising: An electrical circuit manufacturing method for soldering an electrical component to a substrate by temporarily melting a solder material disposed between the substrate and the electrical component,
Jig application step of determining the position of the protrusion of the jig with respect to the electric component and the solder material and contacting the electric component;
A heating step of heating the jig and temporarily melting the solder material by heat conducted from the jig;
An electrical circuit manufacturing method comprising:

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