JP2011246790A - Continuous electrolytic etching method and continuous electrolytic etching device for metallic strip - Google Patents

Abstract

To solve the problems of the conventional indirect energization type continuous electrolytic etching and to stabilize the electrolytic etching, in particular, to stabilize the shape formed by the electrolytic etching, and to improve the groove width. It is possible to suppress variations in the groove depth.
A first electrode and a second electrode are disposed in order in the transport direction of the metal band so as to face an etching surface of a metal band to be electrolytically etched. Subsequently, an electrolytic solution Wr that is a laminar flow is injected from the first electrode 31 and the second electrode 33 onto the etching surface 1 a of the metal strip 1. One of the first electrode 31 and the second electrode 33 is used as an anode, and the other is used as a cathode, and a voltage is applied between them to energize through the sprayed electrolyte Wr and the metal strip 1.
[Selection] Figure 3

Description

  The present invention relates to a metal strip continuous electrolytic etching method and a continuous electrolytic etching apparatus for electrolytically etching the surface of a continuously transported metal strip, and in particular, anti-strain relief that iron loss is unlikely to deteriorate after strain relief annealing. The present invention relates to a continuous electrolytic etching method and a continuous electrolytic etching apparatus suitable for producing an annealed low iron loss directional silicon steel sheet.

  Conventionally, directional silicon steel sheets used as iron cores of electric motors, transformers, and other electrical equipment have been required to improve their iron loss characteristics. Techniques for subdividing magnetic domains by introducing thermal strain or forming grooves such as linear grooves are known. Here, when a grain-oriented silicon steel sheet is used as a wound iron core or the like, the processed product is subjected to strain relief annealing in order to remove the processing strain due to punching processing or the like, but magnetic domain subdivision is performed by introducing local strain. Then, the local strain is removed by the strain relief annealing, and the effect of improving the iron loss characteristic by the magnetic domain subdivision is lost. For this reason, in producing a strain relief annealed low iron loss directional silicon steel sheet in which the iron loss does not easily deteriorate after strain relief annealing, a method of forming grooves on the surface of the steel sheet is preferably used.

  As a technique for forming a groove on the surface of a metal band such as a directional silicon steel plate, an electrically insulating etching mask having an etching pattern formed on the surface of the metal band that is continuously conveyed is coated in advance. In addition, there is known a continuous electrolytic etching method in which a groove corresponding to the etching pattern is formed on the surface of a metal strip by electrolytic etching (see, for example, Patent Document 1 and Patent Document 2).

  In this continuous electrolytic etching method, as shown in Patent Document 3, a direct energization method in which either the anode or the cathode is brought into contact with the metal band, and the metal band is directly energized from any of the electrodes, and Patent Document As shown in FIG. 4, an indirect energization method in which an electrolyte is filled between the anode and the cathode and the metal strip, and the anode to the cathode is energized through the electrolyte and the metal strip has been studied.

  FIG. 11 is a side view schematically showing the configuration of a direct energization type continuous electrolytic etching apparatus 102, taking the invention disclosed in Patent Document 3 as an example. The continuous electrolytic etching apparatus 102 is disposed outside the electrolytic solution 161, an electrolytic bath 161 in which the electrolytic solution W is stored, a cathode 133 made of a plate electrode immersed in the electrolytic solution W in the electrolytic bath 161, and the electrolytic solution W. And a conductor roll 181 which is an anode. In this continuous electrolytic etching apparatus 102, the etching surface 101a of the metal strip 101 to be electrolytically etched is covered with the etching mask 111 on which the etching pattern is formed, and the one surface 101c opposite to the etching surface 101a is exposed over the entire surface. The etching surface 101a of the metal strip 101 is passed downward, and the cathode 133 is disposed upward so as to face the etching surface 101a of the metal strip 101.

  When performing the electrolytic etching by the direct energization type continuous electrolytic etching apparatus 102, a voltage is applied between the conductor roll 181 as the anode and the cathode 133, and the conductor roll 181, the metal strip 101, the electrolyte W When the cathode 133 is energized in this order, the etching surface 101a of the metal strip 101 facing the cathode 133 is electrolytically etched.

  FIG. 12 is a side view schematically showing the configuration of an indirect energization type continuous electrolytic etching apparatus 103, taking the invention disclosed in Patent Document 4 as an example. The continuous electrolytic etching apparatus 103 includes an anode 131 and a cathode 133 that are formed of plate-like electrodes arranged in order in the transport direction of the metal strip 101 in the electrolytic solution W stored in the electrolytic bath 161, and an anode in the electrolytic solution W. An electrically insulating shielding plate 171 is provided between 131 and the cathode 133 for preventing leakage current flowing from the anode 131 to the cathode 133 only through the electrolytic solution W. In this continuous electrolytic etching apparatus 103, an etching mask 111 on which an etching pattern is formed is coated on the etching surface 101a of the metal strip 101 to be electrolytically etched, and the etching surface 101a of the metal strip 101 is passed downward. A cathode 133 is disposed upward facing the etching surface 101a of the metal strip 101.

  In performing the electrolytic etching by the indirect energization type continuous electrolytic etching apparatus 103, a voltage is applied between the anode 131 and the cathode 133, and the anode 131, the anode 131, and the metal strip 101 opposite to the anode 131. The electrolyte W, the metal strip 101, the cathode 133 and the electrolyte W between the metal strip 101 opposite to the cathode 133, and the cathode 133 are energized in this order to thereby etch the etched surface of the metal strip 101 opposite to the cathode 133. 101a is electrolytically etched.

Japanese Unexamined Patent Publication No. 63-042332 Japanese Patent Publication No. 08-006140 Japanese Patent Laid-Open No. 10-204699 JP 2004-131841 A JP 08-269563 A

  However, since the conventional direct energization type continuous electrolytic etching apparatus 102 described above is a method of directly energizing the metal strip 101 from the conductor roll 181, the one surface 101c of the metal strip 101 on the side on which the conductor roll 181 contacts is It is necessary to maintain electrical conductivity without being covered with the electrically insulating etching mask 111. For this reason, in the apparatus 102, the etching mask 111 on which the etching pattern is formed can be covered only on one surface of the metal strip 101, and the electrolytic etching can be performed because the metal strip 101 can be etched once. It had to be only one side. Therefore, in the same apparatus 102, when it is necessary to perform electrolytic etching on both surfaces of the metal strip 101, it is necessary to perform etching processing twice in total for each side of the metal strip 101, which not only increases the processing cost but also increases the production cost. There was a problem that the nature was bad.

  Even when only one surface of the metal strip 101 is electrolytically etched, an electrically insulating film is covered on both surfaces of the metal strip 101 by a pretreatment such as finish annealing before the etching process, and the conductor roll 181 is covered with the conductive roll 181. If it is difficult on the product to remove the coating on one surface 101c of the metal strip 101 on the side to be in contact with the entire product, or if it is an economic burden, the above-described direct energization type continuous electrolytic etching is performed. There was a problem that it could not be applied.

  The above problems may be solved by changing the continuous electrolytic etching from the direct energization method to the indirect energization method. However, indirect energization type continuous electrolytic etching is an unprecedented technology in the industry, and there are many unknown matters such as the stability of the shape of the groove formed in the metal strip 101 by electrolytic etching and the electrolytic etching conditions. I had to say that it was technically incomplete.

  In addition, in both the conventional direct energization method and the indirect energization method, it is necessary to immerse the metal strip in the electrolytic solution, so that current concentration occurs at the end of the metal strip immersed in the electrolytic solution in the plate width direction. The distribution of the etching amount in the plate width direction becomes non-uniform, and the current also flows to the surface opposite to the etching surface to be electrolytically etched. There was a problem that electrolytic etching progressed. In order to solve this, as disclosed in Patent Document 5, an electrically insulating shielding plate is interposed between the metal strip and the electrode in the electrolytic solution, and a current flowing between the metal strip and the electrode. A method has been proposed in which the metal is partially cut off at the end of the metal strip in the plate width direction. However, in this case, since it is necessary to insert a shielding plate, an extra device cost is increased.

  Therefore, the present invention has been devised in view of the above-described problems, and the object of the present invention is to advantageously solve the problems of conventional indirect energization type continuous electrolytic etching, and to perform electrolytic etching. Metal strip continuous electrolytic etching method that makes it possible to stabilize, and in particular, stabilizes the shape of a groove formed by electrolytic etching and suppresses variations in groove width and groove depth. And providing a continuous electrolytic etching apparatus.

  In order to solve the above-mentioned problems, the present inventor has invented the following continuous electrolytic etching method and continuous electrolytic etching apparatus for metal bands after intensive studies.

  A continuous electrolytic etching method for a metal strip according to a first aspect of the present invention is the continuous electrolytic etching method for a metal strip for electrolytically etching the surface of a continuously transported metal strip, opposite to the etching surface of the metal strip to be electrolytically etched. Then, the first electrode and the second electrode are sequentially arranged in the transport direction of the metal strip, and an electrolyte solution that becomes a laminar flow is sprayed from the first electrode and the second electrode to the etching surface of the metal strip, One of the first electrode and the second electrode is an anode, and the other is a cathode, and a voltage is applied between them to conduct electricity through the sprayed electrolyte and the metal strip.

  According to a second aspect of the present invention, there is provided the continuous electrolytic etching method for a metal strip according to the first aspect, wherein in the step of disposing the first electrode and the second electrode, a cathode is disposed on the most exit side in the transport direction of the metal strip. It is characterized by doing.

  The method for continuously electrolytic etching a metal strip according to a third aspect of the present invention is the first or second aspect of the invention, wherein the first electrode and the second electrode are arranged in the step of disposing the first electrode and the second electrode. A plurality of electrode groups comprising a plurality of electrode groups are arranged in the metal band transport direction.

  According to a fourth aspect of the present invention, there is provided the continuous electrolytic etching method for a metal strip according to any one of the first to third aspects of the present invention, wherein the transported metal strip is the etched surface on both sides, and the first electrode. In the step of disposing the second electrode, the first electrode and the second electrode, which are the cathodes, are disposed opposite to the etching surfaces on both surfaces of the metal strip.

  According to a fifth aspect of the present invention, there is provided the continuous electrolytic etching method for a metal strip according to any one of the first to fourth aspects of the present invention, wherein the transported metal strip is coated with an electrically insulating etching mask on the etching surface. The etching mask is formed with a row of point-like grooves or linear grooves spaced apart in the transport direction of the metal strip.

  The continuous electrolytic etching method for a metal strip according to a sixth aspect of the present invention is the method according to the fifth aspect, wherein the transported metal strip is a directional silicon steel plate after finish annealing, and the metal strip that is the directional silicon steel plate is The etching surface is covered with an insulating coating layer having an insulating coating as the etching mask.

  The continuous electrolytic etching method for a metal strip according to a seventh aspect of the present invention is the method according to the sixth aspect, wherein the insulating coating layer comprises a forsterite coating on the ground iron surface of the grain-oriented silicon steel sheet and a tension imparting type on the forsterite coating surface. It has an insulating film.

  According to an eighth aspect of the present invention, there is provided the metal strip continuous electrolytic etching method according to the sixth aspect, wherein the insulating coating layer has a tension-imparting insulating coating on the surface of the ground iron of the directional silicon steel sheet.

  According to a ninth aspect of the present invention, there is provided the metal strip continuous electrolytic etching method according to the fifth aspect, wherein the transported metal strip is a directional silicon steel sheet after being cold-rolled, and is the directional silicon steel sheet. Is characterized in that an etching resist as the etching mask is coated on the etching surface.

  According to a tenth aspect of the present invention, there is provided a continuous electrolytic etching method for a metal strip according to any one of the first to fourth aspects of the invention, wherein the transported metal strip is stainless steel whose etching surface is not coated with an etching mask. It is characterized by comprising pure titanium or a titanium alloy.

  A metal strip continuous electrolytic etching apparatus according to an eleventh aspect of the invention is a metal strip continuous electrolytic etching apparatus for electrolytically etching the surface of a continuously transported metal strip. The first electrode and the second electrode that are arranged opposite to each other in order in the transport direction of the metal strip, and the first electrode and the second electrode, the metal from the first electrode and the second electrode. A laminar nozzle that injects a laminar electrolyte on the etching surface of the strip, and a voltage is applied using either the first electrode or the second electrode as an anode and the other as a cathode, and the laminar nozzle injects the voltage. And a voltage applying means for energizing through the electrolytic solution and the metal strip.

  According to a twelfth aspect of the present invention, there is provided the metal strip continuous electrolytic etching apparatus according to the eleventh aspect of the present invention, wherein the first electrode and the second electrode are arranged on the most outward side in the transport direction of the metal strip. It is characterized by that.

  According to a thirteenth aspect of the present invention, there is provided the continuous electrolytic etching apparatus for a metal strip according to the eleventh or twelfth aspect of the present invention, wherein the first electrode and the second electrode include a plurality of electrode groups in the transport direction of the metal strip. It is characterized by being arranged.

  In the continuous electrolytic etching device for a metal strip according to a fourteenth aspect of the present invention, in the invention according to any one of the eleventh to thirteenth aspects of the invention, both sides of the transported metal strip are the etched surfaces, and the first electrode The second electrode is characterized in that the cathode of the first electrode and the second electrode is disposed opposite to the etching surfaces on both sides of the metal strip.

  According to the first invention to the fourteenth invention, it is possible to perform cleaning while performing electrolytic etching on the etching surface of the metal band by injecting an electrolytic solution that becomes a laminar flow onto the etching surface of the metal band. For this reason, the mass transfer on the etching surface of the metal band can be made smooth, and the electrolytic etching can be stabilized correspondingly. In addition, since the metal strip can be electrolytically etched using an electrolytic solution as a laminar flow, and the metal strip can be etched without being immersed in the electrolytic solution, the metal used for the electrolytic etching It is possible to suppress current concentration at the end of the strip in the plate width direction, and it is possible to stabilize electrolytic etching correspondingly. In addition, since the electrolytic etching can be performed without immersing the metal strip in the electrolytic solution, it is possible to suppress the current from flowing to one side opposite to the etching surface of the metal strip. In addition, since it is possible to perform the electrolytic etching without immersing the metal strip in the electrolytic solution, it is possible to suppress the leakage current flowing only through the electrolytic solution from the anode to the cathode and to accurately control the etching amount. Become. In addition, since it is possible to perform the electrolytic etching without immersing the metal strip in the electrolytic solution, it is not necessary to store a large amount of the electrolytic solution in the electrolytic bath as in the conventional case, and the processing cost is reduced accordingly. It becomes possible. In addition, while exhibiting these effects, it is possible to demonstrate the effect of being able to perform electrolytic etching on both sides of the metal strip for one etching process, which is a merit of the indirect energization type continuous electrolytic etching method. Compared with the continuous electrolytic etching method, the processing cost can be reduced, and the productivity can be further improved.

  According to the second and twelfth aspects of the present invention, even if reaction products or dirt generated by electrolytic etching adhere to the etching surface of the metal strip, It becomes possible to remove by an anodic reaction, and post-treatment for removing reaction products and the like becomes unnecessary.

  According to the third and thirteenth inventions, it is possible to increase the etching ability for the etched surface of the metal band, and it is possible to perform electrolytic etching of the etched surface of the metal band at high speed.

  According to the fifth invention, the mass transfer in the groove formed on the etching surface of the metal band can be made smooth, and the shape of the groove formed by electrolytic etching is stabilized correspondingly, the groove width, It is possible to suppress variations in the groove depth. Such an effect is exhibited as a particularly excellent effect when an anti-strain-free annealed low iron loss directional silicon steel sheet, in which the iron loss hardly deteriorates after the stress relief annealing, is applied.

  According to the tenth aspect of the invention, the mass transfer on the etching surface of the metal strip can be made smooth, and accordingly, the electrolytic etching can be stabilized and the occurrence of peracid washing can be suppressed. In addition, it is not necessary to immerse the metal strip in the electrolytic solution of the electrolytic bath, and the progress of the electrolytic etching reaction can be adjusted by the presence or absence of energization or the supply of the electrolytic solution. It is possible to suppress the occurrence of washing.

It is side surface sectional drawing which shows schematically the structure of the continuous electrolytic etching apparatus which concerns on 1st Embodiment. It is a top view which shows typically the structure of the 1st electrode which concerns on 1st Embodiment. It is side surface sectional drawing which shows typically the operation state of the 1st electrode and 2nd electrode which concern on 1st Embodiment. It is front sectional drawing which shows typically the operation state of the 1st electrode which concerns on 1st Embodiment. It is a figure which shows the example of the voltage applied by the electrolytic power supply device which concerns on 1st Embodiment. It is side surface sectional drawing which shows schematically the structure of the continuous electrolytic etching apparatus which concerns on 2nd Embodiment. It is side surface sectional drawing which shows schematically the structure of the continuous electrolytic etching apparatus which concerns on 3rd Embodiment. It is side surface sectional drawing which shows typically the operation state of the 1st electrode and 2nd electrode which concern on 3rd Embodiment. It is front sectional drawing which shows typically the operation state of the 1st electrode which concerns on 3rd Embodiment. It is sectional drawing which shows typically the geometric shape of a groove | channel observed when a groove | channel is formed in the surface of a metal strip by continuous electrolytic etching. It is side surface sectional drawing which shows schematically the structure of the conventional continuous electroetching apparatus of a direct current system. It is side surface sectional drawing which shows the structure of the conventional continuous electroetching apparatus of the conventional indirect energization method roughly.

  First, preliminary examination contents conducted until the present invention is completed will be described.

  In order to collect basic data on the indirect energization type continuous electrolytic etching method, the surface of the metal strip 101 is electroetched by using the indirect energization type continuous electrolytic etching apparatus 103 as shown in FIG. Preliminary experiments to form grooves were conducted.

  In this preliminary experiment, a directionally-oriented silicon steel plate after finish annealing was used as the metal strip 101. As the direction-oriented silicon steel plate, a forsterite film formed on the surface of the ground iron by finish annealing and its forsterite An insulating coating layer having a tension-imparting insulating coating composed of a phosphate coating obtained by applying and baking a coating solution on the coating was used on both sides. This insulative coating layer of the directional silicon steel sheet was used as an etching mask 111, and an etching pattern composed of linear grooves 113 was formed only on one side of the insulating coating layer by laser processing. In this preliminary experiment, a Pt-based insoluble electrode was used as the anode 131, an electrode made of SUS316 was used as the cathode 133, and an aqueous NaCl solution was used as the electrolyte W. In this preliminary experiment, the geometric shape, groove width, groove depth, etc. of the grooves formed on the surface of the metal strip 101 by electrolytic etching were observed.

  FIG. 10A to FIG. 10D are cross-sectional views schematically showing the geometric shape of the groove 2 observed in this preliminary experiment. In FIG. 10, only the groove width W of the groove 113 of the etching mask 111 is shown.

  FIG. 10A shows a concave (A) -shaped groove 2 having a relatively flat groove bottom surface 2a, and FIG. 10 (B) shows an inclined (B) -shaped groove with irregularities inclined on the groove bottom surface 2a. 10 (c) shows a groove 2 having a wide-width type (C) shape in which the groove width is formed wider than the groove width W of the groove 113 of the etching mask 111, and FIG. ) Shows a locally etched (d) -shaped groove 2 in which a part of the groove bottom surface 2a is locally etched. The groove 2 having the concave shape (A) in FIG. 10A is the most preferable shape among them.

  Most of the shapes of the grooves 2 observed in the preliminary experiment are unstable shapes as shown in FIGS. 10 (b) to 10 (d), and further, the groove width and the groove depth. It has also been found that the fluctuations are greatly variable.

  Therefore, the present inventor changed the steel type of the metal strip 1 or changed the electrolytic etching conditions such as the effective current density with respect to the exposed portion of the metal strip 101 from the etching mask 111, under various conditions. The shape of the groove 2 was investigated, but the shape of the groove 2 could not be stabilized and the variation in groove width and depth could not be significantly reduced.

The present inventor has determined that the current concentration at the end in the plate width direction of the metal strip 101 caused by immersing the metal strip 101 in the electrolytic solution W is the main cause, while conducting further elaborate studies, and electrolytic etching. It is determined that the main cause is that mass transfer in the groove 2 formed in the metal strip 101 by the etching, in particular, reaction products and dirt generated by electrolytic etching remain as stagnation (precipitate) in the groove 2. It was. Note that the reaction product referred to here is an iron compound such as Fe (OH) ₂ or Fe (OH) ₃ or a compound such as Si that is an impurity other than iron when the metal strip 101 is a steel strip. Means.

  And based on such a point of interest, the present inventor effectively reduces the sag in the groove 2 while suppressing current concentration at the end of the metal strip 101 in the plate width direction. The idea that the shape of the groove 2 formed by electrolytic etching can be stabilized and the groove width and depth can be made uniform by smoothing the mass transfer will be described in Example 1 described later. A confirmation experiment was conducted.

  As a result, as a means for reducing stagnation in the groove 2 while suppressing current concentration at the end of the metal band 101 in the plate width direction, the metal band 101 is not immersed in the electrolytic solution W. The inventors have found that it is extremely effective to perform electrolytic etching while injecting a flowing electrolytic solution onto a metal strip, and have completed the present invention.

  The present invention has been devised based on such examination contents. Hereinafter, embodiments for carrying out the present invention will be described in detail with reference to the drawings.

  First, the continuous electrolytic etching method according to the first embodiment of the present invention and the continuous electrolytic etching apparatus for realizing the method will be described.

  FIG. 1 is a side sectional view schematically showing a configuration of a continuous electrolytic etching apparatus 3 according to the first embodiment of the present invention.

  The metal strip 1 to which the continuous electrolytic etching method according to the present invention is applied is continuously transported by a transport roll 81 or the like. One or both surfaces of the metal strip 1 are conveyed as an etching surface 1a to be electrolytically etched, and in the first embodiment, only the upper one surface is conveyed as an etching surface 1a. The etching surface 1a of the metal strip 1 is covered with an electrically insulating etching mask 11 made of an insulating film layer, an etching resist, etc., which will be described later. When the etching surface 1a of the metal band 1 is only one surface, the remaining one surface 1c may be covered with the etching mask 11 or may not be covered.

  On the etching mask 11 covered with the etching surface 1a of the metal band 1, an etching pattern including grooves 13 is formed in advance by a laser, an electron beam or the like. On the etching surface 1 a of the metal band 1, the exposed portion 1 b exposed from the groove 13 of the etching mask 11 is electrolytically etched to form a groove 2 having a shape corresponding to the groove 13 of the etching mask 11. As the shape of the groove 2 to be formed on the etching surface 1a of the metal strip 1 by electrolytic etching, for example, a row of dotted or linear grooves spaced in the transport direction of the metal strip 1 can be cited. As specific dimensional conditions of the groove 2 in the example, for example, the extending direction is in the range of 90 ° to 45 ° with respect to the conveying direction of the metal strip 1, the groove width is 10 to 300 μm, and the groove depth is 5-40 micrometers and the pitch which is the pitch which is the space | interval between groove | channels in the conveyance direction of the metal strip 1 are mentioned. The grooves 13 formed in the etching mask 11 are also formed from row-like dot-like grooves or linear grooves spaced in the transport direction of the metal strip 1 so as to satisfy the shape and size conditions of the grooves 2. .

  The continuous electrolytic etching apparatus 3 includes a first electrode 31 and a second electrode 33 which are disposed in order in the transport direction of the metal band 1 so as to face the etching surface 1a of the metal band 1 to be electrolytically etched.

  One of the first electrode 31 and the second electrode 33 is configured as an anode and the other as a cathode, and is configured from a known electrode material. However, the electrodes 31 and 33 serving as anodes are preferably made of an insoluble material such as Pt so that the electrodes themselves are not subjected to electrolytic etching, and the electrodes 31 and 33 serving as cathodes are made of insoluble materials. There is no particular limitation, and it may be composed of a substance having a low gas generation potential.

  Between the first electrode 31 and the second electrode 33, an electrolytic power supply device 41 is connected as voltage applying means for applying a voltage therebetween. In the first embodiment, the electrolytic power supply device 41 is configured to apply a DC voltage. The electrolysis power supply device 41 is configured, for example, from a six-phase AC power source that rectifies a six-phase half-wave and applies a DC voltage. However, the configuration is not particularly limited as long as a voltage can be applied, and the method thereof There is no particular limitation on the transistor system, the inverter system, and the like.

  In the first embodiment, a switch 43 is connected between the first electrode 31 and the electrolytic power supply device 41, and a resistor 45 is connected between the electrolytic power supply device 41 and the second electrode 33. By closing the switch 43, a voltage is applied between the first electrode 31 and the second electrode 33, and by applying the switch 43, the voltage application between them is interrupted. . Further, by increasing / decreasing the value of the resistor 45, the current value of the electrolysis current passed between the first electrode 31 and the second electrode 33 is adjusted.

  2 is a plan view schematically showing the configuration of the first electrode 31, FIG. 3 is a side sectional view showing the operating state, and FIG. 4 is a front sectional view showing the operating state. In addition, since the structure of the 2nd electrode 33 is the same as this, the structure of the 2nd electrode 33 is also demonstrated collectively based on FIGS. In FIG. 4, the electrolyte solution Wr as a laminar flow ejected from the first electrode 31 is omitted, and only a range in which the electrolyte solution Wr is ejected is schematically illustrated.

  In the first embodiment, the first electrode 31 and the second electrode 33 are opposed to the plate-like electrode plate 35 disposed substantially parallel to the transport direction of the metal strip 1 and the metal strip 1 of the electrode plate 35. On the side, one or more cylindrical headers 37 provided in parallel at intervals in the transport direction of the metal band 1, and provided on the header 37, the first electrode 31 and the second electrode 33 are connected to the metal band 1. A laminar nozzle 39 is provided as an electrolyte injection means for injecting an electrolyte Wr that is a laminar flow onto the etching surface 1a.

  The electrode plate 35 is connected to a power supply wiring 47 that is electrically connected to the electrolytic power supply device 41 in order to apply a voltage.

  In the first embodiment, an electrolyte supply main pipe 51 extending in the transport direction of the metal strip 1 is disposed on both sides of the electrode plate 35 in the plate width direction, and the electrolyte solution branched from the electrolyte supply main pipe 51 is provided. A supply branch pipe 53 is connected to the end of the header 37. In the middle of the piping of the electrolyte supply branch pipe 53, a branch pipe flow rate control valve 55 is connected in order to adjust the injection amount of the electrolyte solution from the laminar nozzle 39 in the first embodiment. By adjusting the opening, the supply amount of the electrolyte supplied from the electrolyte supply main pipe 51 to the header 37 through the electrolyte supply branch pipe 53 is adjusted.

  The laminar nozzle 39 ejects a laminar flow. The laminar flow referred to here is a flow having a thickness and a width with respect to a direction orthogonal to the jetting direction, in which the electrolyte is filled and injected from the laminar nozzle 39. The shape in the range from collision to collision with the metal strip 1 is a flow that is substantially uniform over time. In the first embodiment, the laminar nozzle 39 is an example in which the laminar nozzle 39 includes a slit-like injection port 39a for injecting a film-like laminar flow. You may be comprised from what has the cylindrical injection port which injects a laminar flow.

  In the first embodiment, the first electrode 31 and the second electrode 33 are illustrated in which the electrode plate 35, the header 37, and the laminar nozzle 39 are integrally configured. 37 and laminar nozzle 39 may be separated and connected to each other. The first electrode 31 and the second electrode 33 are not particularly limited as long as the first electrode 31 and the second electrode 33 are configured to be able to energize the electrolyte sprayed from the laminar nozzle 39. For example, only the header 37 is known. The electrode material may be used, or the electrode plate 35 may not be used.

  Moreover, the continuous electrolytic etching apparatus 3 includes an electrolytic tank 61 for storing the electrolytic solution sprayed from the laminar nozzle 39 onto the etching surface 1a of the metal strip 1 in the first embodiment. In the electrolytic bath 61, the electrolytic solution sprayed from the laminar nozzle 39 accumulates at the bottom 61 a and is accumulated as Wa, so that the metal strip 1 is not immersed in the electrolytic solution as the accumulated Wa stored in the electrolytic bath 61. It is conveyed to.

  The electrolytic solution that has accumulated at the bottom 61 a of the electrolytic tank 61 and has become Wa is discharged through a discharge pipe 63 connected to the electrolytic tank 61 and stored in a storage tank 64 connected to the discharge pipe 63. An electrolytic solution supply main pipe 51 is connected to the storage tank 64, and an electrolytic solution supply pump 65 for transferring the electrolytic solution is provided in the middle of the piping of the electrolytic solution supply main pipe 51 to filter the electrolytic solution. The electrolyte filter 66 is connected to a main flow rate adjusting valve 67 for adjusting the amount of electrolyte supplied to the electrolyte supply main pipe 51. The electrolytic solution W stored in the storage tank 64 is transferred to the electrolytic solution supply main pipe 51 through the electrolytic solution filter 66 by driving of the electrolytic solution supply pump 65, and then again through the header 37 and the laminar nozzle 39 to form the metal again. It is injected into the belt 1 and used after circulation.

  As the electrolytic solution W, a known one corresponding to the type and material of the metal strip 1 to be subjected to electrolytic etching is appropriately used. For example, an acidic aqueous solution such as NaCl is used when electrolytically etching a directional silicon steel plate. Hydrochloric acid, nitric acid or the like is used when electrolytically etching stainless steel, which will be described later, is used.

  In the first embodiment, in order to suppress discharge from the first electrode 31 to the second electrode 33, a shield made of an electrically insulating material such as urethane rubber is provided between the first electrode 31 and the second electrode 33. A plate 71 is provided.

  In the first embodiment, a pair of ringer rolls 81 are arranged on the entry side and the exit side of the electrolytic cell 61 with the metal band 1 interposed therebetween as the conveyance roll 81 for continuously conveying the metal band 1. The electrolyte solution W is prevented from flowing out to the outside of the electrolytic cell 61.

  Moreover, the 1st electrode 31, the 2nd electrode 33, and the shielding board 71 are arrange | positioned in the state supported by the electrolytic vessel 61 through the electrically insulating material which is not shown in figure, for example.

  Next, a continuous electrolytic etching method using the continuous electrolytic etching apparatus 3 according to the first embodiment of the present invention will be described.

  First, an electrolytic solution Wr that forms a laminar flow is sprayed from the first electrode 31 and the second electrode 33 to the etching surface 1a of the metal strip 1 that is continuously conveyed by the laminar nozzle 39. At this time, the electrolyte solution Wr as a laminar flow jetted from the laminar nozzle 39 on the upper side of the metal band 1 flows to the both ends in the plate width direction of the metal band 1 after most of the collision with the upper surface of the metal band 1. Drops Wb fall into the electrolytic cell 61 from both ends of the metal strip 1 in the plate width direction.

  Here, the electrolyte solution Wr as a laminar flow sprayed from the laminar nozzle 39 on the upper side of the metal strip 1 has a faster drop speed as it is positioned below the laminar nozzle 39, and its thickness is related to the surface tension. It deforms so that the width becomes smaller. At this time, the laminar flow which is located in the range S in FIG. 4 and does not collide with the metal band 1 and tries to pass through both sides in the plate width direction is not constrained by the metal band 1 and its thickness or Due to the fact that the width is small, the flow is unstable and often partly divided. As a result, the electrolytic solution Wr as a laminar flow which does not collide with the metal band 1 and tries to pass through both sides in the plate width direction hardly generates an electrolysis current flow with respect to the metal band 1. Current concentration at the end in the plate width direction is suppressed.

  Subsequently, a voltage is applied by the electrolysis power supply device 41 as a voltage application unit using either the first electrode 31 or the second electrode 33 as an anode and the other as a cathode. Here, a constant voltage as shown in FIG. 5 is applied using the first electrode 31 as an anode and the second electrode 33 as a cathode. At this time, by adjusting the performance of the electrolytic power supply device 41, the resistance value of the resistor 45, and the like, adjustment is made so that an electrolytic current having a predetermined current value is supplied from the electrolytic power supply device 41.

  Accordingly, the electrolytic power supply 41-the first electrode 31 serving as the anode-the laminar electrolyte Wr sprayed from the first electrode 31-the exposed portion of the etching surface 1a of the metal strip 1 facing the first electrode 31 1b-metal band 1-exposed portion 1b of the etching surface 1a of the metal band 1 opposite to the second electrode 33-laminar flow electrolyte Wr sprayed from the second electrode-second electrode 33 serving as a cathode-electrolysis A closed circuit of the power supply device 41 is formed, and an electrolytic current is passed through them.

At this time, in the exposed portion 1b of the etching surface 1a of the metal band 1 opposite to the second electrode 33 serving as the cathode, the following anode from which the metal cation Me ^{n +} is eluted from the metal Me constituting the metal band 1 by this electrolytic current. Reaction occurs and electrolytic etching proceeds. As a result, a groove 2 having a shape corresponding to the etching pattern of the etching mask 11 is formed on the etching surface 1 a of the metal strip 1.
Me → Me ^{n +} + ne ⁻ (when the metal strip 1 is a steel strip: Fe → Fe ²⁺ + 2e ⁻ )

  At this time, in the first embodiment, since the electrolytic solution is circulated through the electrolytic solution filter 66, the electrolytic solution from which reaction products, dirt, and the like generated by electrolytic etching have been removed is etched into the metal strip 1. It is injected to the surface 1a.

  Here, according to the present invention, while the electrolytic etching of the metal strip 1 is proceeding, the electrolytic solution Wr that is a laminar flow is sprayed onto the etching surface 1a of the metal strip 1, so that it is generated by electrolytic etching. Reaction products, dirt, etc. are washed away from the grooves 2 formed on the etching surface 1a of the metal strip 1 and removed. That is, by injecting the electrolytic solution Wr that is a laminar flow onto the etching surface 1a of the metal band 1, it becomes possible to perform cleaning while performing the electrolytic etching of the etching surface 1a of the metal band 1. For this reason, the mass transfer in the groove 2 formed on the etching surface 1a of the metal band 1 can be made smooth, and the shape of the groove 2 formed by electrolytic etching is stabilized correspondingly, the groove width, It is possible to suppress variations in the groove depth.

  In addition, according to the present invention, the electrolytic etching of the metal strip 1 can be performed using the electrolytic solution Wr as a laminar flow, and the electrolytic etching can be performed without immersing the metallic strip 1 in the electrolytic solution Wa. Therefore, it is possible to suppress current concentration at the end of the metal strip 1 in the plate width direction when electrolytic etching is performed, and to that extent, the shape of the groove 2 formed by electrolytic etching is stabilized, It is possible to suppress variations in the groove depth. In addition, since the electrolytic etching can be performed without immersing the metal strip 1 in the electrolytic solution Wa, it is possible to suppress the current from flowing to one side of the metal strip 1 opposite to the etching surface 1a.

  The effect of stabilizing the shape of the groove 2 formed by such electrolytic etching is the case where a strain relief annealed low iron loss directional silicon steel sheet, in which the iron loss does not easily deteriorate after strain relief annealing, is applied. This is particularly effective. This is because in such a directional silicon steel sheet, the variation in the shape of the groove 2 formed by electrolytic etching becomes a magnetic variation as it is and adversely affects the magnetic properties.

  In addition, according to the present invention, the electrolytic etching can be performed without immersing the metal strip 1 in the electrolytic solution Wa, so that the leakage current flowing only from the anode to the cathode through the electrolytic solution Wa is suppressed, and the etching amount is reduced. Control can be performed accurately. Further, since the electrolytic etching can be performed without immersing the metal strip 1 in the electrolytic solution Wa, it is not necessary to store a large amount of the electrolytic solution in the electrolytic bath 61 as in the prior art, and the processing cost is correspondingly reduced. Reduction can be achieved.

  Further, according to the present invention, while exhibiting these effects, it is possible to perform electrolytic etching on both surfaces of the metal strip 1 per etching process, which is a merit of the indirect energization type continuous electrolytic etching method. Therefore, the processing cost can be reduced and the productivity can be further improved as compared with the direct energization type continuous electrolytic etching method.

  Next, a continuous electrolytic etching method according to a second embodiment of the present invention and a continuous electrolytic etching apparatus for realizing the same will be described. In addition, about the component same as the component mentioned above, the description below is abbreviate | omitted by attaching | subjecting the same code | symbol.

  FIG. 6 is a side sectional view schematically showing the configuration of the continuous electrolytic etching apparatus 3 according to the second embodiment.

  In 1st Embodiment, although the electrode group 30 which consists of a group of the 1st electrode 31 and the 2nd electrode 33 demonstrated one example arrange | positioned in the conveyance direction of the metal strip 1, in 2nd Embodiment, A plurality of electrode groups 30 each including a set of the first electrode 31 and the second electrode 33 are arranged in the transport direction of the metal strip 1. Further, one electrolytic power supply device 41 is connected to each electrode group 30.

  As described above, when a plurality of electrode groups 30 are arranged in the conveying direction of the metal band 1, the etching capability of the metal band 1 with respect to the etching surface 1a can be increased, and the etching surface 1a of the metal band 1 can be formed at high speed. Electrolytic etching can be performed.

  At this time, as illustrated in the second embodiment, it is also effective to sequentially arrange the electrolytic cells 61 in the conveying direction of the metal strip 1. This is due to the following reason. If the electrolytic cell 61 becomes too long in the conveyance direction of the metal band 1, the metal band 1 is deformed into a catenary shape by its own weight, and the distance from the electrodes 31, 33 to the metal band 1 and the variation of the shape of the metal band 1 are changed in the conveyance direction. As a result, the laminar flow becomes unstable. Here, when the electrolytic cell 61 is arranged in order in the conveying direction of the metal strip 1, the length per one electrolytic cell 61 required for electrolytic detching by a predetermined amount can be suppressed. As a result, the metal strip 1 due to its own weight. The catenary deformation can be suppressed. Thereby, the distance from the electrodes 31 and 33 to the metal band 1 and the fluctuation of the shape of the metal band 1 can also be suppressed. As a result, the laminar flow can be stabilized, and thus formed by electrolytic etching. It is possible to suppress variations in the groove width and groove depth of the groove 2.

  Next, a continuous electrolytic etching method and a continuous electrolytic etching apparatus for realizing the same according to a third embodiment of the present invention will be described.

  FIG. 7 is a side sectional view schematically showing a configuration of the continuous electrolytic etching apparatus 3 according to the third embodiment, and FIG. 8 is a front sectional view showing an operation state thereof. In FIG. 8, the electrolyte solution Wr as a laminar flow ejected from the upper and lower first electrodes 31 is omitted, and only the range in which the lower electrolyte solution Wr is ejected is schematically shown.

  The continuous electrolytic etching method according to the third embodiment exemplifies a method applied when electrolytic etching is performed using both surfaces of the metal strip 1 as etching surfaces 1a. In the continuous electrolytic etching apparatus 3 according to the third embodiment, an electrode group 30 composed of a set of a first electrode 31 and a second electrode 33 is disposed opposite to both surfaces of the metal strip 1. Further, one electrolytic power supply device 41 is connected to each electrode group 30.

  As a result, both surfaces of the metal strip 1 can be electrolytically etched using the etching surface 1a.

  When both surfaces of the metal band 1 are the etching surfaces 1a, only the anode reaction needs to proceed on the etching surfaces 1a on both surfaces of the metal band 1, so that only the electrode serving as the cathode is opposed to both surfaces of the metal band 1. If the allowable current density permits, the electrode serving as the anode may be disposed opposite to only one side of the metal strip 1.

  Further, in the continuous electrolytic etching method according to the third embodiment, an electrolytic solution is injected from the laminar nozzle 39 of the first electrode 31 and the second electrode 33 on the lower side of the metal band 1. Most of the electrolytic solution Wr sprayed from the laminar nozzle 39 collides with the lower surface of the metal strip 1 and then drops into the electrolytic bath 61 as droplets Wb from both ends of the metal strip 1 in the plate width direction. .

  Here, the electrolytic solution Wr as a liner flow ejected from the laminar nozzle 39 on the lower side of the metal strip 1 is required to have the minimum energy necessary for colliding with the lower surface of the metal strip 1. The speed at the time of jetting from is adjusted in advance. As a result, the laminar flow located on the lower side of the metal band 1 stably contacts the lower surface of the metal band 1 due to the surface tension between the lower surface of the metal band 1 and the upper part of the laminar flow. The laminar flow which is located in the range S in FIG. 5 and does not collide with the metal band 1 and tries to pass through both sides in the plate width direction does not reach the height of the lower surface of the metal band 1 stably. As a result, the electrolytic solution Wr as a laminar flow which does not collide with the metal band 1 and tries to pass through both sides in the plate width direction hardly generates an electrolysis current flow with respect to the metal band 1. Current concentration at the end in the plate width direction is suppressed.

  At this time, the shape of the electrolyte that is a laminar flow ejected from the laminar nozzle 39 of the first electrode 31 and the second electrode 33 on the upper side of the metal band 1 is more than the shape that is ejected from the lower laminar nozzle 39. In order to stabilize, when performing electrolytic etching only on one side of the metal strip 1, it is preferable to dispose the first electrode 31 and the second electrode on the upper side of the metal strip 1 in order to stabilize the electrolytic etching.

  Moreover, in 1st Embodiment-3rd Embodiment, it arrange | positions among the 1st electrodes 31 and 2nd electrodes 33 which comprise the 1 or several electrode group 30 in the most outgoing side of the conveyance direction of the metal strip 1. These are made up of cathodes. Thereby, even if the reaction product, dirt, etc. produced by the electrolytic etching adhere to the groove 2 formed on the etching surface 1a of the metal strip 1, the cathode and the metal strip 1 arranged on the most outer side are provided. Can be removed by an anodic reaction between them, thereby eliminating the need for post-treatment for removing reaction products and the like adhering to the grooves. Incidentally, the anode disposed on the most outlet side in the transport direction of the metal strip 1 may be used.

  As mentioned above, although the example of embodiment of this invention was demonstrated in detail, all the embodiment mentioned above showed only the example of actualization in implementing this invention, and these are the technical aspects of this invention. The range should not be construed as limiting.

  For example, in the above-described embodiment, the example in which the etching surface 11a on one side or both sides of the metal strip 1 is covered with the electrically insulating etching mask 11 has been described. However, the metal strip 1 is made of stainless steel, pure titanium, or titanium. When it is made of an alloy or the like, the entire surface of the metal strip 1 may be pickled by the continuous electrolytic etching method according to the present invention without covering the etching mask 11.

  Also in this case, while the electrolytic etching of the metal strip 1 is proceeding, the electrolyte Wr that is a laminar flow is sprayed onto the etching surface 1a of the metal strip 1, so that the reaction product generated by the electrolytic etching, Dirt and the like are washed away from the etching surface 1a of the metal strip 1 and removed. For this reason, the mass transfer on the etching surface 1a of the metal strip 1 can be made smooth, and it is possible to stabilize the electrolytic etching and suppress the occurrence of peracid washing.

  Also in this case, since the electrolytic etching can be performed without immersing the metal strip 1 in the electrolytic solution Wa, the current concentration at the end in the plate width direction of the metal strip 1 during the electrolytic etching is suppressed. Further, it is possible to suppress the current from flowing to one side of the metal strip 1 opposite to the etching surface 1a, and to stabilize the electrolytic etching correspondingly, it is possible to suppress the occurrence of peracid washing.

  Further, in this case, it is not necessary to immerse the metal strip 1 in the electrolytic solution Wa in the electrolytic bath 61, and the presence or absence of energization by the opening / closing operation of the switch 43 and the supply of the electrolytic solution by the driving operation of the electrolyte supply pump 65 Since the progress of the electrolytic etching reaction can be adjusted depending on the presence or absence, it is possible to suppress the occurrence of peracid washing in the metal strip 1 when the conveyance line is stopped.

  Moreover, when the metal strip 1 is composed of a grain-oriented silicon steel sheet, the configuration of the etching mask 11 varies depending on at which point in the manufacturing process of the grain-oriented silicon steel sheet the continuous electrolytic etching method according to the present invention is applied. come. That is, in general production of grain-oriented silicon steel sheets, first, hot rolling is performed on the slab, and hot-rolled sheet annealing is performed as necessary, and then cold rolling is performed once or a plurality of times with intermediate annealing. After finishing the cold-rolled sheet with the final thickness, it is subjected to primary recrystallization annealing including decarburization annealing, and after that, after applying an annealing separator as necessary, it consists of secondary recrystallization annealing and purification annealing. A series of steps for performing finish annealing is performed. In this series of steps, the continuous electrolytic etching method according to the present invention may be performed after cold rolling or after finish annealing.

  At this time, after the cold rolling is performed on the steel sheet that becomes the grain-oriented silicon steel sheet, the etching mask 1 made of the etching resist is covered with the etching film 1 because the insulating coating layer as the etching mask 11 is not covered on the etching surface 1a. A process is required. This process is performed by applying and baking a resist ink on the etching surface 1a by offset printing or the like before electrolytic etching.

In addition, after performing finish annealing on the steel sheet that becomes the grain-oriented silicon steel sheet, a forsterite film made of fosterite (Mg ₂ SiO ₄ ) generated by finish annealing is generated according to the conditions of finish annealing, It may not be generated. In any case, after finishing annealing, a coating solution is applied to the surface of the iron or forsterite film and baked to produce a tension-imparting insulating film, forsterite film and tension-imparting type. An insulating coating layer having a coating or an insulating coating layer having a tension-imparting coating layer may be used as the etching mask 11. This tension-imparting insulation coating is produced for the purpose of imparting tension to a steel sheet, thereby reducing magnetostriction in an alternating magnetic field and reducing iron loss. Consists of As described above, the present invention can be applied with or without a forsterite film, and in any case, the excellent effect as a strain-relief-annealed low iron loss directional silicon steel sheet. Is demonstrated.

  Hereinafter, the effects of the present invention will be further described with reference to examples.

  In this embodiment, the continuous electrolytic etching apparatus 3 according to the present invention as shown in FIG. 1 and the conventional indirect energization type continuous electrolytic etching apparatus 103 as shown in FIG. The effect of the present invention is confirmed by grooving the surfaces of the bands 1 and 101 and observing the geometric shape, groove width, and groove depth of the grooves 2 formed on the surfaces of the metal bands 1 and 101. It was decided.

  In this example, grain-oriented silicon steel sheets manufactured in the order as described below were used. First, a cold rolled steel sheet having a final thickness is finished by cold rolling so as to have the dimensional conditions shown in Table 1 below, followed by decarburization annealing, and then an annealing separator made of MgO is applied to the metal strip 1. , 101 were applied and baked on both sides, and then finish annealing was performed. Subsequently, a coating solution was applied and baked on the surfaces of the metal bands 1 and 101 so that a tension-imparting insulating coating composed of a phosphate-based coating was generated. Thus, a grain-oriented silicon steel sheet was obtained in which an insulating coating layer having a forsterite coating on the surface of the ground iron and a tension-imparting insulating coating composed of a phosphate-based coating on the surface was coated on both sides. Subsequently, in order to use this insulating coating layer as the etching masks 11 and 111, an etching pattern composed of linear grooves 13 and 113 extending at an angle of 90 ° with respect to the transport direction of the metal bands 1 and 101 is defined as the groove width. Only the insulating coating layer on one side of the metal bands 1 and 101 was formed by laser so that the pitch was 0.2 mm and the pitch was 0.2 mm.

In this example, the electrolytic solution W having a composition of 500 g-NaCl / 1 and a liquid temperature of 60 ° C. is used, and an electrolytic current of 350 C / dm ² is applied, and the surfaces of the metal bands 1 and 101 are subjected to electrolytic etching. The target value of the groove depth of the groove 2 formed in the above was 0.02 mm.

The geometric shapes of the grooves 2 formed on the surfaces of the metal bands 1 and 101 are the ratios of the grooves as shown in FIGS. 10A to 10D to all the grooves for each example. Was determined as a percentage, and the percentage was evaluated for each example. For each example, the groove depth of the groove 2 is determined by measuring the groove width and groove depth of all the grooves 2, and then obtaining an average value Xave to obtain the average value Xave and each measured value Xi (i = The standard deviation σ is obtained from the following formula based on the natural number of 1 to n, where n is the number of samples), and is evaluated by the variation (%) calculated by the standard deviation σ / average value Xave. In addition, the groove | channel 2 of the metal strips 1 and 101 used as evaluation object evaluated as the sample number n = 12.

  The dimensional conditions and results of the metal bands 1 and 101 for each example are as shown in Table 1 below.

  Those satisfying the requirements of the present invention are No. It is an example of 1-7. Regardless of the plate width, the geometric shapes of the grooves 2 observed on the surfaces of the metal bands 1 and 101 are all concave shapes (a). As a result, the groove width and the groove depth vary. It can be seen that is extremely small compared to the other examples. In addition, although the geometric shape of the groove | channel 2 becomes concave (A), it is a reason for the variation in groove width and groove depth becoming small, but this is because the geometric shape of the groove 2 is concave (A). As a result, it is considered that the amount of dissolution by electrolytic etching with respect to a constant electrolytic current is stabilized as a result of being stable with respect to other shapes.

  Those outside the scope of the present invention are examples Nos. 11-15. As for the geometrical shape of the groove 2 observed on the surfaces of the metal bands 1 and 101, the concave shape (b) is hardly recognized, and the inclined type (b), the widened type (c), and the local etching are observed. It can be seen that the shapes of the molds (d) are mixed and the variation in groove depth is large. It can also be seen that the narrower the plate width, the greater the variation in groove depth.

1: Metal strip 1 a: Etching surface 1 b: Exposed portion 2: Groove 3: Continuous electrolytic etching apparatus 11: Etching mask 13: Groove 30: Electrode group 31: First electrode 33: Second electrode 35: Electrode plate 37: Header 39 : Laminar nozzle 41: Electrolytic power supply device 43: Switch 45: Resistor 47: Power supply wiring 51: Electrolyte supply main pipe 53: Electrolyte supply branch pipe 55: Branch pipe flow control valve 61: Electrolytic tank 63: Discharge pipe 64: Reservoir tank 65: Electrolyte supply pump 66: Electrolyte filter 67: Main flow rate control valve 71: Shield plate 81: Transfer roll W: Electrolyte Wr: Laminar flow Wa: Pool Wb: Droplet

Claims (14)

In the continuous electrolytic etching method of the metal strip for electrolytically etching the surface of the continuously transported metal strip,
The first electrode and the second electrode are arranged in order in the transport direction of the metal band opposite to the etching surface to be electrolytically etched of the metal band,
Injecting an electrolyte solution that becomes a laminar flow from the first electrode and the second electrode to the etching surface of the metal strip,
One of the first electrode and the second electrode is an anode, and the other is a cathode, and a voltage is applied between them to energize through the sprayed electrolyte and the metal strip. A continuous electrolytic etching method for strips. 2. The continuous electrolytic etching method for a metal strip according to claim 1, wherein in the step of disposing the first electrode and the second electrode, a cathode is disposed on the outermost side in the transport direction of the metal strip. The step of disposing the first electrode and the second electrode includes disposing a plurality of electrode groups each composed of a set of the first electrode and the second electrode in a transport direction of the metal strip. 3. A continuous electrolytic etching method for a metal strip according to 1 or 2. Both sides of the metal strip to be conveyed are the etched surfaces,
In the step of disposing the first electrode and the second electrode, disposing the first electrode and the second electrode serving as a cathode opposite to the etching surfaces on both surfaces of the metal strip. The continuous electrolytic etching method for a metal strip according to any one of claims 1 to 3. The metal strip to be conveyed is composed of a directional silicon steel plate in which the etching surface is covered with an electrically insulating etching mask,
The metal according to any one of claims 1 to 4, wherein the etching mask is formed with a row of dotted grooves or linear grooves spaced in the transport direction of the metal strip. A continuous electrolytic etching method for strips. The metal strip to be conveyed is a directional silicon steel plate after finish annealing,
6. The continuous electrolytic etching of a metal strip according to claim 5, wherein the metal strip which is the directional silicon steel sheet is coated with an insulating coating layer having an insulating coating as the etching mask on the etching surface. Method. The metal strip according to claim 6, wherein the insulating coating layer has a forsterite coating on the surface of the ground iron of the grain-oriented silicon steel sheet and a tension-imparting insulating coating on the surface of the forsterite coating. Continuous electrolytic etching method. The method of continuous electrolytic etching of a metal strip according to claim 6, wherein the insulating coating layer has a tension-imparting insulating coating on the surface of the ground iron of the grain-oriented silicon steel sheet. The metal band to be conveyed is a grain-oriented silicon steel sheet after being cold-rolled,
6. The method of continuous electrolytic etching of a metal strip according to claim 5, wherein the metal strip, which is a directional silicon steel plate, is coated with an etching resist as the etching mask on the etching surface. The metal strip according to any one of claims 1 to 4, wherein the transported metal strip is made of stainless steel, pure titanium, or a titanium alloy whose etching surface is not covered with an etching mask. Continuous electrolytic etching method. In a continuous electroetching apparatus for a metal strip for electrolytically etching the surface of a continuously transported metal strip,
A first electrode and a second electrode arranged in order in the transport direction of the metal band opposite to the etching surface of the metal band to be electrolytically etched;
A laminar nozzle that is provided on the first electrode and the second electrode, and injects an electrolyte solution that becomes a laminar flow from the first electrode and the second electrode to the etching surface of the metal strip;
A voltage applying unit configured to apply a voltage by using one of the first electrode and the second electrode as an anode and the other as a cathode, and to energize the electrolyte through the laminar nozzle and the metal strip. Metal strip continuous electrolytic etching equipment. 12. The continuous electrolytic etching apparatus for a metal strip according to claim 11, wherein the first electrode and the second electrode are arranged on the most exit side in the transport direction of the metal strip as a cathode. 13. The continuous electrolytic etching of a metal strip according to claim 11, wherein the first electrode and the second electrode are each provided with a plurality of electrode groups made of these sets in the transport direction of the metal strip. apparatus. Both sides of the metal strip to be conveyed are the etched surfaces,
In the first electrode and the second electrode, the cathodes of the first electrode and the second electrode are arranged opposite to the etching surfaces on both sides of the metal strip. The continuous electrolytic etching apparatus for a metal strip according to any one of claims 11 to 13.

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