JP2011244005A - Build-in component wiring board, and manufacturing method thereof - Google Patents

Abstract

To provide a wiring board with a built-in component and a manufacturing method that reduce manufacturing burden and improve reliability.
An electrical / mechanical component electrically and mechanically connected on the surface of the wiring pattern, and a surface of the wiring pattern on which the electrical / electronic component is connected so as to embed the electrical / electronic component. And an insulating layer having an insulating resin and a reinforcing material contained in the insulating resin, and the insulating layer does not reach the region of the electric / electronic component in the lateral direction. An insulating layer that is present in the insulating resin, the insulating resin reaches the region of the electric / electronic component and is in close contact with the electric / electronic component, and in addition, is a stack of at least two insulating layers, A second wiring pattern sandwiched between at least two insulating layers and a surface of the wiring pattern penetrating the insulating layer in contact with the wiring pattern of at least two insulating layers and the second wiring pattern And the interlayer connector sandwiched between the Comprising.
[Selection] Figure 14

Description

  The present invention relates to a component built-in wiring board having an electric / electronic component embedded in an insulating plate and a method for manufacturing the same, and more particularly to a component built-in wiring board suitable for reducing the manufacturing burden and a method for manufacturing the same.

  As a prior art of a component built-in wiring board, there is one disclosed in Patent Document 1 below. This component built-in wiring board has a structure in which an electronic component is surface-mounted on a pattern of an inner wiring layer in a multilayer wiring layer. Electronic parts are embedded in an insulating plate, and the insulating plate is obtained by molding an insulating resin or a mixture of this and a filler into a sheet shape by a doctor blade method or the like. In the laminating process, an insulating plate is used that does not have a relief portion such as a recess or an opening, or a recess smaller than the size occupied by the electronic component, at a corresponding position of the electronic component.

JP 2003-197849 A

  In the structure and the manufacturing method described above, it is difficult to use a so-called prepreg that uses a glass cloth or an aramid resin fiber as a reinforcing material for a printed wiring board as a material for the insulating resin. That is, it is necessary to prepare a special insulating material, which is disadvantageous in terms of availability and cost. Also, if the prepreg is forcibly used, a glass cloth or the like may collide with the built-in electronic component and stress may be generated, causing the electronic component to be damaged, or the connection reliability between the inner wiring pattern and the electronic component may be impaired. .

  The present invention has been made in consideration of the above-described circumstances. In the component built-in wiring board having an electric / electronic component embedded in an insulating plate and the manufacturing method thereof, the manufacturing burden is reduced and the reliability is improved. An object is to provide a component built-in wiring board and a method for manufacturing the same.

  In order to solve the above-described problems, a component built-in wiring board according to an aspect of the present invention includes a wiring pattern, an electrical / electronic component electrically and mechanically connected on the surface of the wiring pattern, and the electrical / electronic component. An insulating layer having an insulating resin and a reinforcing material contained in the insulating resin, which is laminated on a surface of the wiring pattern to which the electrical / electronic component is connected so as to embed the electronic component; The insulating layer is present in the insulating resin without the reinforcing material of the insulating layer reaching the region of the electrical / electronic component in the lateral direction, and the insulating resin of the insulating layer is An insulating layer that reaches the region of the electric / electronic component and is in close contact with the electric / electronic component, and is additionally a laminate of at least two insulating layers, and is sandwiched between the at least two insulating layers A second wiring pattern and the at least two And further comprising an inter-layer connection body that is interposed between the surface of the wiring pattern and the surface of the second wiring pattern through the insulating layer in contact with the wiring pattern of the edge layer It is characterized by.

  That is, the insulating layer in which the electric / electronic component is embedded has a structure having a reinforcing material in a region other than the region except for the region in which the electric / electronic component is embedded. In other words, the region where the electrical / electronic component is embedded does not have the reinforcing material, and the region other than that has the reinforcing material. Thereby, the collision between the electrical / electronic component and the reinforcing material is avoided, and the reliability is improved. Moreover, it becomes possible to use what hardened a general prepreg with the wiring board as an insulating layer. The interlayer connection body is an example of an interlayer connection body that penetrates the insulating layer that contacts the wiring pattern. For example, the interlayer connection body is derived from a conductive bump formed by screen printing of a conductive composition. is there.

  According to another aspect of the present invention, there is provided a method of manufacturing a component built-in wiring board, wherein an electrical / electronic component is electrically disposed on the first metal wiring pattern of the first insulating layer having the first metal wiring pattern. A step of mechanically connecting; a step of printing and forming conductive bumps on the second metal wiring pattern of the second insulating layer having a second metal wiring pattern and containing a reinforcing material; A step of laminating a layer of a prepreg containing a reinforcing material on the second insulating layer on the side where the conductive bumps are formed; and a layered body having the second insulating layer and the prepreg, A step of penetrating an opening larger than the electric / electronic component so as to correspond to the position of the component, and the lamination in which the opening is formed on the first insulating layer on the side to which the electric / electronic component is connected The first side of the prepreg Disposing the electrical / electronic component so as to face the insulating layer and positioning the electrical / electronic component in the opening, and further disposing a third insulating layer on the second insulating layer, and laminating and integrating; It is characterized by comprising.

  According to this manufacturing method, the insulating layer (laminated body including the second insulating layer) in which the electric / electronic component is embedded has the reinforcing material in a region other than the region except for the region in which the electric / electronic component is embedded. Become a structure. Thereby, the collision between the electric / electronic component and the reinforcing material is avoided, and the reliability is improved. Moreover, a general prepreg can be used for the wiring board as the second insulating layer.

  According to the present invention, in a component built-in wiring board having an electrical / electronic component embedded in an insulating plate and its manufacturing method, the manufacturing burden can be reduced and the reliability can be improved.

Sectional drawing which shows typically the structure of the component built-in wiring board which concerns on a reference example. Process drawing which shows the manufacturing process of the component built-in wiring board shown in FIG. Sectional drawing which shows typically the structure of the component built-in wiring board concerning another reference example. Process drawing which shows the manufacturing process of the component built-in wiring board shown in FIG. Sectional drawing which shows typically the structure of the component built-in wiring board which concerns on another reference example. FIG. 6 is a process diagram schematically showing a partial manufacturing process of the component built-in wiring board shown in FIG. 5. Sectional drawing which shows typically the structure of the component built-in wiring board which concerns on another reference example. FIG. 8 is a process chart schematically showing a partial manufacturing process of the component built-in wiring board shown in FIG. 7. Sectional drawing which shows typically the structure of the component built-in wiring board which concerns on another reference example. FIG. 10 is a process diagram schematically showing a partial manufacturing process of the component built-in wiring board shown in FIG. 9. Sectional drawing which shows typically the structure of the component built-in wiring board which concerns on another reference example. FIG. 12 is a process diagram schematically showing a partial manufacturing process of the component built-in wiring board shown in FIG. 11. Sectional drawing which shows typically the structure of the component built-in wiring board which concerns on one Embodiment of this invention. Sectional drawing which shows typically the structure of the component built-in wiring board which concerns on another embodiment of this invention. FIG. 15 is a process diagram showing a simplified main part in the manufacturing process of the component built-in wiring board shown in FIG. 14.

  In addition, the first description of each figure performed by description of the following embodiment may differ from said description. In this case, the above description has priority. In that case, the description referring to the figure is not the description of the embodiment of the invention but the description of the reference example.

  Based on the above, embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a cross-sectional view schematically showing a configuration of a component built-in wiring board according to an embodiment of the present invention. As shown in FIG. 1, this component built-in wiring board includes an insulating layer 11, wiring patterns 12 and 13, a through hole inner wall conductive layer 14, solder 15, and electrical / electronic components 16. The insulating layer 11 includes an insulating resin 11a and a reinforcing material 11b (for example, glass cloth) that reinforces the insulating resin 11a.

  The electrical / electronic component 16 is embedded in the insulating layer 11 and electrically and mechanically connected to the wiring pattern 12 via the solder 15. The insulating layer 11 is laminated on the same surface as the surface of the wiring pattern 12 to which the electrical / electronic component 16 is connected, and the wiring pattern 13 is provided on the opposite side of the insulating layer 11. The reinforcing material 11b of the insulating layer 11 does not exist in the region where the electric / electronic component 16 is embedded. The wiring patterns 12 and 13 on both surfaces of the insulating layer 11 can be electrically connected by a through hole inner wall conductive layer 14 provided in the insulating layer 11. In the component built-in wiring board having such a configuration, a glass epoxy prepreg can be easily used as the insulating layer 11 in the manufacturing process.

  Hereinafter, the manufacturing process of the component built-in wiring board shown in FIG. 1 will be described with reference to FIG. FIG. 2 is a process diagram schematically showing a manufacturing process of the component built-in wiring board shown in FIG.

  First, as shown in FIG. 2 (a), a metal foil (electrolytic copper foil) 12A having a thickness of, for example, 18 μm to be used as the wiring pattern 12 is prepared, and cream-like solder is formed on the surface thereof at a predetermined position, for example, by screen printing. 15 is attached by printing. Next, as shown in FIG. 2B, the electrical / electronic component 16 (for example, a 0603 size or 0402 size chip resistor) is placed using, for example, a mounter so that both terminals thereof are in contact with the solder 15. Thereafter, the solder 15 is reflowed to electrically and mechanically connect the electrical / electronic component 16 onto the metal foil 12A.

  Next, a glass epoxy prepreg 11A (thickness, for example, 150 μm) to be used as the insulating layer 11 is prepared, and a hole having a diameter of, for example, 0.8 mm corresponding to the position where the built-in electric / electronic component 16 is disposed (electric / When the electronic component 16 is 0603 size), the opening 11o is formed in the prepreg 11A. As shown in FIG. 2 (c), a prepreg 11A having an opening 11o formed opposite to the side of the metal foil 12A to which the electrical / electronic component 16 is connected, and a wiring pattern 13 on the upper side of the prepreg 11A. A metal foil (electrolytic copper foil) 13 </ b> A having a thickness of, for example, 18 μm is aligned and laminated.

  After the stacked arrangement, pressure is applied in the stacking direction while heating to fluidize the prepreg 11A to integrate the whole. At this time, the insulating resin 11a portion of the prepreg 11A fills the space around the electrical / electronic component 16 and comes into close contact therewith. In this state, the prepreg 11 </ b> A is completely cured and becomes the insulating layer 11. In this laminated integration, since the opening 11o is provided in advance in the prepreg 11A in the region where the electric / electronic component 16 is disposed, the electric / electronic component 16 is not excessively pressurized. Therefore, an excessive stress is not generated at the connecting portion (solder 5) between the electric / electronic component 16 and the metal foil 12A, and the electric / electronic component 16 can be prevented from being broken. Thereby, reliability can be improved.

In addition, the heating under the pressurization mentioned above can set a pressure to 20-50 kgf / cm < ² > and a temperature to 125-175 degreeC, for example, when the said prepreg is comprised from the epoxy resin containing glass cloth. The heating can be performed at a single temperature. For example, the heating can be performed at 125 ° C. for 30 minutes and then at 175 ° C. for 1 hour. At this time, it can be performed with vacuum suction.

Further, when the prepreg is made of BT resin, the pressure can be set to 20 to 50 kgf / cm ² and the temperature can be set to 130 to 200 ° C. Also in this case, the heating can be performed at a single temperature. For example, the heating can be performed at 130 ° C. for 30 minutes and then at 200 ° C. for 90 minutes. At this time, it can be performed with vacuum suction.

  By adopting such pressure heating conditions, the prepreg 11A can be sufficiently fluidized.

  After the lamination and integration, a predetermined position drilling and plating processes are performed as is well known to obtain a double-sided shield substrate having a through-hole inner wall conductive layer 14 as shown in FIG. Further, when the metal foils 12A and 13A on both sides are patterned by, for example, well-known photolithography and processed into the wiring patterns 12 and 13, a component built-in wiring board having a configuration as shown in FIG. 1 can be obtained.

  In the above description, the solder 15 is used to connect the electric / electronic component 16 to the metal foil 12A. However, for example, a conductive adhesive can be used instead. Moreover, although the case of the prepreg 11A containing a glass cloth as the reinforcing material 11b has been described, a prepreg containing a reinforcing material such as an aramid cloth, a glass nonwoven fabric, or an aramid nonwoven fabric may be used instead of the reinforcing material.

  The size of the opening 11o can be, for example, a circular shape having a planar shape of 0.45 mm to 1.0 mm in diameter or a rectangular shape having a diameter of 0.41 mm × 0.21 mm to 0.7 mm × 0.5 mm. . In this case, the size of the opening 11 o is suitable for placing and embedding 0402 parts (0.4 mm × 0.2 mm) as the electrical / electronic parts 16.

  Further, the size of the opening 11o may be, for example, a circular shape having a diameter of 0.68 mm to 1.5 mm, or a rectangular shape having a diameter of 0.61 mm × 0.31 mm to 1.2 mm × 0.9 mm. it can. In this case, the size of the opening 11o is suitable for placing and embedding 0603 parts (0.6 mm × 0.3 mm) as the electric / electronic parts 16.

  Further, the size of the opening 11o may be, for example, a circular shape having a diameter of 1.15 mm to 2.5 mm, or a rectangular shape having a diameter of 1.01 mm × 0.51 mm to 1.6 mm × 1.1 mm. it can. In this case, the size of the opening 11 o is suitable for placing and embedding 1005 parts (1.0 mm × 0.5 mm) as the electric / electronic parts 16.

  Note that the opening 11o described above constitutes an embedded region for the electrical / electronic component 16 because the electrical / electronic component 16 is disposed and embedded therein.

  In addition, the above-described electric / electronic component has a height of, for example, about 0.2 mm to 0.5 mm (when a specific component such as the above-mentioned 0402 component is used), and the thickness of the insulating layer is several tens. Since it is μm (for example, nominally 60 μm), the entire thickness of the component built-in wiring board is about several millimeters of commas.

  Next, a component built-in wiring board according to another embodiment of the present invention will be described with reference to FIG. FIG. 3 is a cross-sectional view schematically showing a configuration of a component built-in wiring board according to another embodiment of the present invention. As shown in FIG. 3, this component built-in wiring board has insulating layers 31, 32, 33, wiring patterns 34, 35, 36, 37, through-hole inner wall conductive layers 38, solder 40, and electrical / electronic components 41. The insulating layers 31, 32, and 33 are made of insulating resins 31a, 32a, and 33a and reinforcing materials 31b, 32b, and 33b (for example, glass cloth) that reinforce the insulating resins 31a, 32a, and 33a, respectively. In this embodiment, an electric / electronic component 41 having a thickness larger than that of the wiring board of the embodiment shown in FIG. 1 can be incorporated. The total number of wiring layers is 4 including the two inner layers.

  The electrical / electronic component 41 is embedded in the insulating layers 31 and 32 and is electrically and mechanically connected to the wiring pattern 34 via the solder 40. An insulating layer 31 is laminated on the same surface of the wiring pattern 34 to which the electrical / electronic component 41 is connected. A wiring pattern 35 is interposed between the insulating layer 31 and the laminated insulating layer 32 thereon. Similarly, a wiring pattern 36 is interposed between the insulating layer 35 and the laminated insulating layer 33 thereon. Has been. A wiring pattern 37 is provided on the side of the insulating layer 33 opposite to the side on which the wiring pattern 36 is provided (that is, outside).

  The reinforcing members 31b and 32b of the insulating layers 31 and 32 do not exist in the region where the electric / electronic component 41 is embedded. Each wiring pattern 34, 35, 36, 37 can be electrically connected by a through-hole inner wall conductive layer 38 that penetrates the insulating layers 31, 32, 33. Even in the component built-in wiring board having this configuration, a glass epoxy prepreg can be easily used as the insulating layers 31 and 32 in the manufacturing process.

  Hereinafter, the manufacturing process of the component built-in wiring board shown in FIG. 3 will be described with reference to FIG. FIG. 4 is a process diagram schematically showing the manufacturing process shown in FIG. However, the connection process of the electric / electronic component 41 onto the metal foil (electrolytic copper foil) 34A is substantially the same as the process shown in FIGS. As the electrical / electronic component 41, for example, a 1005 size or 2012 size chip resistor having a thickness of 0.5 mm is used.

  In addition to the metal foil 34A to which the electric / electronic component 41 is connected, as shown in FIG. 4A, the insulating layer 32 and the prepreg 31A (which should be the insulating layer 31) are laminated and the electric / electronic component 41 is A thing (core plate) having an opening 32o corresponding to the position to be arranged and a prepreg 33A (what should be the insulating layer 33) on which a metal foil (electrolytic copper foil) 37A is laminated are prepared. The core plate is prepared in advance by the following process.

  An FR-4 double-sided copper-clad substrate (having an insulating layer 32) having a thickness of 0.5 mm, for example, is prepared, and the copper layers on both sides are patterned by, for example, well-known photolithography. Process. Then, a FR-4 prepreg 31A having a thickness of, for example, 60 μm is laminated on the wiring pattern 35 side of the insulating layer 32 by thermal lamination. Subsequently, for example, drilling with a diameter of 1.2 mm corresponding to a position where the built-in electrical / electronic component 41 is disposed (when the electrical / electronic component 41 is 1005 size) is performed on the stacked product by, for example, drilling. Opening 32o is provided.

  The prepreg 33A (to be the insulating layer 33) on which the metal foil 37A is laminated is a laminate of an electrolytic copper foil having a thickness of, for example, 18 μm and a FR-4 prepreg having a thickness of, for example, 60 μm. As shown in FIG. 4A, the three members prepared above face the side where the electric / electronic component 41 of the metal foil 34A is connected, and the insulating layer 32 and the prepreg 31A in which the opening 32o is formed. On the laminated body (core plate), the prepreg 33A side of the laminated body of the metal foil 37A and the prepreg 33A is positioned and laminated on the insulating layer 32 side.

  After the stacked arrangement, the prepreg 31A and the prepreg 33A are fluidized and integrated by applying pressure in the stacking direction while heating. At this time, the portions of the prepreg 31A and the insulating resins 31a and 33a of the prepreg 33A fill the space around the electric / electronic component 41 and come into close contact with each other. In this state, the prepregs 31 </ b> A and 33 </ b> A are completely cured to become insulating layers 31 and 33. Even in this stacking integration, since the opening 32o is provided in advance in the insulating layer 32 and the prepreg 31A in the region where the electric / electronic component 41 is disposed, the electric / electronic component 41 may be excessively pressurized. Absent. Therefore, an excessive stress is not generated at the connecting portion (solder 40) between the electric / electronic component 41 and the metal foil 32A, and the electric / electronic component 41 can be prevented from being broken. Thereby, reliability can be improved.

  After the lamination and integration, a predetermined position drilling and plating processes are performed as is well known, and a double-sided shield substrate having a through-hole inner wall conductive layer 38 as shown in FIG. 4B is obtained. Furthermore, when the metal foils 34A and 37A on both sides are patterned by, for example, well-known photolithography and processed into the wiring patterns 34 and 37, a component built-in wiring board having a configuration as shown in FIG. 3 can be obtained.

  Also in this embodiment, in addition to using the solder 40 to connect the electric / electronic component 41 to the metal foil 34A, for example, a conductive adhesive can be used. Moreover, although the case of the prepregs 31A and 33A containing glass cloth as the reinforcing materials 31b and 33b has been described, a prepreg containing a reinforcing material such as an aramid cloth, a glass nonwoven fabric, or an aramid nonwoven fabric may be used instead of the reinforcing material. The insulating layer 32 can be made of a CEM-3 material in addition to the FR-4 equivalent.

  Further, at the stage where the copper layers on both sides of the copper-clad substrate (having the insulating layer 32) are processed into the wiring patterns 35 and 36, normal predetermined position drilling and plating processes are performed, and the through-hole inner wall conductivity is formed in the insulating layer 32. A layer may be formed. By forming the through-hole inner wall conductive layer at this stage, it is possible to further refine the wiring board. The through holes are filled with the insulating resins 31a and 33a in the subsequent laminating process.

  The openings 32o can be formed in the insulating layer 32 and the prepreg 31A separately before the insulating layer 32 and the prepreg 31A are stacked. In this case, alignment accuracy is required when stacking.

  Furthermore, pressure and temperature as described in the example relating to FIG. 1 can be adopted as the pressure heating condition, and two-stage heat treatment can be performed.

  In addition, the size of the planar shape of the opening 32o that defines the embedded region of the electric / electronic component 41 depends on the case where the component is 0402 component, 0603 component, or 1005 component, as described in the example relating to 1. The size can be the same as above. Furthermore, the total thickness of the component built-in wiring board can be set to several millimeters of commas.

  Next, still another embodiment of the present invention will be described with reference to FIG. FIG. 5 is a cross-sectional view schematically showing a configuration of a component built-in wiring board according to still another embodiment of the present invention. In FIG. 5, the same or equivalent parts as those already described are denoted by the same reference numerals, and the description thereof is omitted. In the component built-in wiring board of this embodiment, the number of wiring layers is further increased by two to a total of six layers. As a result, the wiring pattern 53 to which the electric / electronic component 41 is connected becomes the inner layer wiring pattern. Further, as described as a modification in the description of FIG. 4, the insulating layer 32 of the core plate has a through hole inner wall conductive layer 42 penetrating therethrough.

  In addition to the above, this embodiment is different from the embodiment shown in FIG. 3 in that the wiring pattern 34 is the double-sided wiring board composed of the insulating layer 51 and the wiring patterns 52 and 53 on both sides thereof, and the wiring pattern 37 is the insulating layer 61 and both sides thereof. These are replaced with double-sided wiring boards composed of wiring patterns 62 and 63, respectively. Here, the wiring patterns 52 and 53 on both surfaces of the insulating layer 51 can be electrically conducted by the interlayer connector 54 interposed between the surfaces, and the wiring patterns 62 and 63 on both surfaces of the insulating layer 61 are It can be electrically connected by an interlayer connector 64 sandwiched between these surfaces. The insulating layers 51 and 61 are made of insulating resins 51a and 61a and reinforcing materials 51b and 61b (for example, glass cloth) that reinforce the insulating resins 51a and 61a, respectively.

  Hereinafter, the manufacturing process of the component built-in wiring board shown in FIG. 5 will be described with reference to FIG. FIG. 6 is a process diagram schematically showing a partial manufacturing process of the component built-in wiring board shown in FIG. 5 and is a double-sided wiring board comprising the insulating layer 51 and the wiring patterns 52 and 53 on both sides thereof as described above. The manufacturing process of this part is shown. This manufacturing process is the same for the double-sided wiring board portion including the insulating layer 61 and the wiring patterns 62 and 63 on both sides thereof.

  First, as shown in FIG. 6A, a paste-like conductive composition to be an interlayer connection 54 is formed on a metal foil (electrolytic copper foil) 53A having a thickness of, for example, 18 μm by, for example, screen printing. Form bumps. This conductive composition is obtained by dispersing fine metal particles such as silver, gold and copper or fine carbon particles in a paste-like resin. For convenience of illustration, printing is performed on the lower surface of the metal foil 53A, but it may be printed on the upper surface (the following figures are also the same). After the interlayer connector 54 is printed, it is dried and cured.

  Next, as shown in FIG. 6B, a prepreg 51A having a nominal thickness of, for example, 60 μm is laminated on the metal foil 53A to penetrate the interlayer connector 54 so that the head is exposed. At the time of exposure or afterwards, the tip thereof may be crushed by plastic deformation (in any case, the shape of the interlayer connector 54 is a shape having an axis that coincides with the stacking direction and the diameter changing in the axial direction). Subsequently, as shown in FIG. 6C, a metal foil (electrolytic copper foil) 52A is laminated on the prepreg 51A, and the whole is integrated by pressing and heating. At this time, the metal foil 52A is in electrical continuity with the interlayer connector 54, and the prepreg 51A is completely cured to become the insulating layer 51.

  Next, as shown in FIG. 6D, patterning is performed on the metal foil 53 A on one side by, for example, well-known photolithography, and the wiring pattern 53 is processed. And what is shown to this figure (d) is used instead of metal foil 34A shown to Fig.4 (a). That is, the cream-like solder 40 is printed and attached onto the wiring pattern 53. In this printing adhesion process, alignment with the wiring pattern 53 is necessary. In addition, the thing of the structure similar to what is shown in FIG.6 (d) is used instead of metal foil 37A shown to Fig.4 (a). In the above state, the same lamination and integration as in FIG. 4 is performed, and finally, the through-hole inner wall conductive layer 38 is formed and the metal foils 52A and 62A on both sides are patterned to obtain the component built-in wiring board shown in FIG. Obtainable.

  In this embodiment, the component built-in wiring board shown in FIG. 1 or FIG. 3 can be used instead of the wiring board member shown in FIG. 6D (however, the wiring pattern on one side is the same as that before patterning). Leave it in the state of a metal foil. According to this, it is possible to incorporate components at a higher density as a component-embedded wiring board.

  Note that pressure and temperature as described in the example relating to FIG. 1 can be adopted as the pressure heating condition, and two-stage heat treatment can be performed.

  Further, the size of the planar shape of the opening that defines the embedded region of the electric / electronic component 41 depends on the case where the component is 0402 component, 0603 component, or 1005 component, as described in the example related to FIG. The size can be the same as above. Furthermore, the total thickness of the component built-in wiring board can be set to several millimeters of commas.

  Next, still another embodiment of the present invention will be described with reference to FIG. FIG. 7 is a cross-sectional view schematically showing a configuration of a component built-in wiring board according to still another embodiment of the present invention. In FIG. 7, the same or equivalent parts as those already described are denoted by the same reference numerals, and the description thereof is omitted. In this embodiment, instead of the interlayer connection bodies 54 and 64 of the component built-in wiring board shown in FIG. 5, the interlayer connection is made of metal and has an axis that coincides with the stacking direction and has a shape whose diameter changes in the axial direction. The bodies 74 and 84 are used.

  Hereinafter, the manufacturing process of the component built-in wiring board shown in FIG. 7 will be described with reference to FIG. FIG. 8 is a process diagram schematically showing a partial manufacturing process of the component built-in wiring board shown in FIG. 7. Of the above description, the manufacturing process of the part composed of the wiring pattern 53 and the interlayer connector 74 is shown. It is shown.

  First, for example, a laminated film in which a layer (etching stopper layer ES) made of, for example, a nickel alloy having a very thin thickness, for example, 2 μm, is prepared on a metal foil (electrolytic copper foil) 53A having a thickness of 18 μm is prepared. A metal plate (copper plate) 74A is laminated and integrated on the side to obtain a clad material having a three-layer structure as shown in FIG. Further, an etching mask 79 is formed at a predetermined position on the metal plate 74A.

  Next, the three-layer clad metal plate 74A on which the etching mask 79 is formed is etched with an etchant that can etch only copper. Thereby, as shown in FIG.8 (b), the interlayer connection body 74 can be obtained. In the following steps, the material shown in FIG. 8B may be replaced with the material shown in FIG. The above description is the same for the portion composed of the wiring pattern 63 and the interlayer connector 84.

  Also in this case, the size of the planar shape of the opening that defines the embedded region of the electric / electronic component 41 is, for example, when the component is 0402 component, 0603 component, or 1005 component as described in the example with reference to FIG. Depending on the size, it can be made the same size as above.

  Next, still another embodiment of the present invention will be described with reference to FIG. FIG. 9 is a cross-sectional view schematically showing a configuration of a component built-in wiring board according to still another embodiment of the present invention. In FIG. 9, parts that are the same as or equivalent to those already described are given the same reference numerals, and descriptions thereof are omitted. In this embodiment, instead of the interlayer connectors 54 and 64 of the component built-in wiring board shown in FIG. 5, a shape made of a conductive composition and having an axis that coincides with the stacking direction and whose diameter does not change in the axial direction. The interlayer connection bodies 94 and 104 are used.

  Hereinafter, the manufacturing process of the component built-in wiring board shown in FIG. 9 will be described with reference to FIG. FIG. 10 is a process diagram schematically showing a partial manufacturing process of the component built-in wiring board shown in FIG. 9. In the above description, the insulating layer 51, the wiring patterns 52 and 53 on both sides thereof, and the insulating layer The manufacturing process of the part of the interlayer connection body 94 which penetrates 51 is shown.

  First, as shown in FIG. 10A, for example, a predetermined position of a prepreg 51 </ b> A having a nominal thickness of 60 μm is formed, and the inside of the hole is filled with a conductive composition to form an interlayer connector 94. Next, as shown in FIG. 10B, metal foils (electrolytic copper foils) 52A and 53A having a thickness of, for example, 18 μm are laminated on both surfaces of the prepreg 51A, and are integrated by pressing and heating. By this lamination and integration, the metal foils 52A and 53A establish an electrical conduction state with the interlayer connection body 94, and the prepreg 51A is completely cured to become the insulating layer 51.

  Next, as shown in FIG. 10C, patterning by, for example, well-known photolithography is performed on the metal foil 53 </ b> A on one side, and this is processed into a wiring pattern 53. Then, the material shown in FIG. 10C is used instead of the material shown in FIG. 6D, and the subsequent steps are the same as those described in FIG.

  Note that pressure and temperature as described in the example relating to FIG. 1 can be adopted as the pressure heating condition, and two-stage heat treatment can be performed.

  Further, the size of the planar shape of the opening that defines the embedded region of the electric / electronic component 41 depends on the case where the component is 0402 component, 0603 component, or 1005 component, as described in the example related to FIG. The size can be the same as above. Furthermore, the total thickness of the component built-in wiring board can be set to several millimeters of commas.

  Next, still another embodiment of the present invention will be described with reference to FIG. FIG. 11 is a cross-sectional view schematically showing a configuration of a component built-in wiring board according to still another embodiment of the present invention. In FIG. 11, the same or equivalent parts as those already described are denoted by the same reference numerals, and the description thereof is omitted. In this embodiment, instead of the interlayer connection bodies 54 and 64 of the component built-in wiring board shown in FIG. 5, the interlayer connection is made of metal and has an axis that coincides with the stacking direction and does not change its diameter in the axial direction. The bodies 114 and 124 are used.

  Hereinafter, the manufacturing process of the component built-in wiring board shown in FIG. 11 will be described with reference to FIG. FIG. 12 is a process diagram schematically showing a partial manufacturing process of the component built-in wiring board shown in FIG. 11. In the above description, the manufacturing process of the part composed of the wiring pattern 53 and the interlayer connector 114 is shown. It is shown.

  First, as shown in FIG. 12A, a plating prevention mask 119 having a mask removal portion 119A at a predetermined position is formed on a metal foil (electrolytic copper foil) 53A having a thickness of 18 μm, for example. The shape of the mask removing unit 119A is, for example, substantially cylindrical. Next, an electrolytic plating process is performed on the plating prevention mask 119 side using the metal foil 53A as an electric supply path, and, for example, a copper plating layer is grown in the mask removing portion 119A as shown in FIG. This grown plating layer becomes the interlayer connector 114. After the plating layer is grown, the plating block mask 119 is removed to obtain a material as shown in FIG. In the following steps, the material shown in FIG. 12C may be replaced with the material shown in FIG. 6A, and the steps shown in FIG. The above description is the same for the portion composed of the wiring pattern 63 and the interlayer connector 124.

  5 to 12, the double-sided wiring board portion including the insulating layer 51 and the wiring patterns 52 and 53 on both sides thereof, and the double-sided wiring board portion including the insulating layer 61 and the wiring patterns 62 and 63 on both sides thereof are illustrated. The examples are shown from the viewpoint of the structure of the interlayer connector. Of course, it is possible to use a double-sided wiring board having an interlayer connection other than those described above. For example, the interlayer connection body may be a well-known through-hole inner wall conductor formed by a drilling and plating process. Furthermore, a double-sided wiring board having various other configurations of the interlayer connector can be used.

  Note that pressure and temperature as described in the example relating to FIG. 1 can be adopted as the pressure heating condition, and two-stage heat treatment can be performed.

  Further, the size of the planar shape of the opening that defines the embedded region of the electric / electronic component 41 depends on the case where the component is 0402 component, 0603 component, or 1005 component, as described in the example related to FIG. The size can be the same as above. Furthermore, the total thickness of the component built-in wiring board can be set to several millimeters of commas.

  Next, still another embodiment of the present invention will be described with reference to FIG. FIG. 13 is a cross-sectional view schematically showing a configuration of a component built-in wiring board according to still another embodiment of the present invention. In FIG. 13, parts that are the same as or equivalent to those already described are given the same reference numerals, and descriptions thereof are omitted. The component built-in wiring board of this embodiment newly has interlayer connection bodies 205 and 201 that pass through the insulating layers 31 and 33 and are sandwiched between the wiring pattern surfaces, as compared with the one shown in FIG. And the insulating layer 32 is a three-layer laminate of insulating layers 3, 2, 1.

  Here, wiring patterns 6 and 5 are interposed between the insulating layers 3 and 2 and between the insulating layers 2 and 1, respectively, and penetrate the insulating layers 3, 2, and 1 and are interposed between the wiring pattern surfaces. Interlayer connectors 204, 203, and 202 exist. By providing the interlayer connectors 205, 201, 204, 203, 202 in addition to the interlayer connectors 54, 64, there is no need for interlayer connection by the through-hole inner wall conductive layer.

  The insulating layers 3, 2, and 1 are made of insulating resins 3a, 2a, and 1a and reinforcing materials 3b, 2b, and 1b (for example, glass cloth) that reinforce the insulating resins 3a, 2a, and 1a, respectively. The wiring patterns 7 and 4 correspond to the wiring patterns 35 and 36 in the embodiment shown in FIG.

  Also in this embodiment, the insulating layers 1, 2, 3, and 31 do not have the reinforcing materials 1b, 2b, 3b, and 31b in the region where the electrical / electronic component 41 is embedded, and the reinforcing material 1b, 2b, 3b, 31b. Therefore, it is possible to improve the reliability by avoiding the collision between the electric / electronic component 41 and the reinforcing members 1b, 2b, 3b, 31b. Moreover, it becomes possible to use what hardened a general prepreg with the wiring board as the insulating layers 1, 2, 3, and 31. FIG.

  The manufacturing method of the component built-in wiring board shown in FIG. 13 is roughly described as follows. First, a double-sided board having wiring patterns and metal foils on both sides and having an interlayer connection having a shape in which the diameter of the interlayer connection changes in the laminating direction is provided on each of the insulating layers 51, 3, 1, 61. Correspondingly, 4 sheets are manufactured. The process is as shown in FIG.

  Next, on the wiring pattern 5 corresponding to the insulating layer 1, conductive bumps to be the interlayer connection 203 are printed and formed, and a prepreg to be the insulating layer 2 is laminated on the surface. Then, the wiring pattern 6 side of the double-sided substrate corresponding to the insulating layer 3 is opposed to the prepreg side to be the insulating layer 2 and laminated and integrated by pressing and heating. As a result, a substrate with four wiring layers is formed. Subsequently, the wiring patterns 7 and 4 are formed by patterning the outer metal foil.

  Next, on the formed wiring pattern 7, conductive bumps to be the interlayer connection body 205 are printed and formed, and a prepreg to be the insulating layer 31 is laminated on the surface. And the opening (for example, 0.8 mm diameter) of the position corresponding to the electrical / electronic component 41 to incorporate is formed in the laminated body obtained by this, for example by drilling.

  On the other hand, on the wiring pattern 63 corresponding to the insulating layer 61, conductive bumps to be the interlayer connector 201 are printed and formed, and a prepreg to be the insulating layer 33 is laminated on the surface. An electrical / electronic component 41 is connected to the wiring pattern 53 of the one corresponding to the insulating layer 51 via the solder 40.

  The three members obtained as described above are stacked and pressed in the stacking direction in the same manner as the layout shown in FIG. At this time, the portions of the prepreg to be the insulating layer 31 and the insulating resins 31a and 33a of the prepreg to be the insulating layer 33 fill the space around the electric / electronic component 41 and come into close contact with each other. In this state, both prepregs are completely cured and become insulating layers 31 and 33. Furthermore, if the metal foil located on both surfaces is patterned by, for example, well-known photolithography and processed into the wiring patterns 52 and 62, a component built-in wiring board having a configuration as shown in FIG. 13 can be obtained.

  The component built-in wiring board shown in FIG. 13 described above has the interlayer connectors 204 and 202 connected to the interlayer connectors 74 and 84 (FIG. 7), 94 and 104 (FIG. 9), and 114 and 124 (FIG. 11). It can be replaced with one formed as described above. Further, the interlayer connectors 205 and 201 can be replaced with those formed as the interlayer connectors 94 and 104 (FIG. 9A). In the latter case, the last lamination process is not a lamination of three materials but a lamination of five materials.

  Note that pressure and temperature as described in the example relating to FIG. 1 can be adopted as the pressure heating condition, and two-stage heat treatment can be performed.

  Further, the size of the planar shape of the opening that defines the embedded region of the electric / electronic component 41 depends on the case where the component is 0402 component, 0603 component, or 1005 component, as described in the example related to FIG. The size can be the same as above. Furthermore, the total thickness of the component built-in wiring board can be set to several millimeters of commas.

  Next, still another embodiment of the present invention will be described with reference to FIG. FIG. 14 is a cross-sectional view schematically showing a configuration of a component built-in wiring board according to still another embodiment of the present invention. In FIG. 14, parts that are the same as or equivalent to those already described are given the same reference numerals, and descriptions thereof are omitted. In this embodiment, instead of connecting each wiring pattern by the through-hole inner wall conductive layer 38 of the component built-in wiring board shown in FIG. 7, it has an axis that coincides with the stacking direction and has a shape whose diameter changes in the axial direction. Each wiring pattern is connected using an interlayer connector.

  Specifically, as shown in FIG. 14, instead of the through hole inner wall conductive layer 38, the wiring patterns 62 and 63 have an axis that coincides with the stacking direction and the diameter changes in the direction of the axis. The interlayer connector 111 is electrically and mechanically connected, and the wiring patterns 63 and 36 are electrically and mechanically connected by the interlayer connector 112 having the same shape. In addition, the wiring patterns 35 and 53 are electrically and mechanically connected by the interlayer connector 113 having the same shape, and the wiring patterns 53 and 52 are electrically and mechanically connected by the interlayer connector 114 having the same shape.

  Further, in the present example, interlayer connectors 115 and 116 having the same shape are formed, and the wiring patterns 63 and 36 and the wiring patterns 35 and 53 are also electrically and mechanically connected by these interlayer connectors. I am doing so.

  FIG. 15 is a simplified diagram showing the main part of the method for manufacturing the component built-in wiring pattern shown in FIG.

  First, according to the steps shown in FIGS. 2A and 2B and FIG. 6, the electrical / electronic component 41 is electrically and mechanically connected to the wiring pattern 53 formed on the insulating layer 51 by the solder 40. Such an assembly 150 is manufactured. In this assembly 150, a metal foil 52 </ b> A that will later become a wiring pattern 52 is formed on the back side of the insulating layer 51, and an interlayer connector 114 is formed in the insulating layer 51.

  Similarly, in accordance with the process as shown in FIG. 6, insulating layers 61 and 33 are laminated, a wiring pattern 63 is narrowed therebetween, and interlayer connectors 63, 112, and 115 are provided in the insulating layers 61 and 33. A formed assembly 151 is formed.

  Next, according to the process as shown in FIG. 4, the wiring patterns 36 and 35 are formed, the insulating layer 32 on which the through-hole inner wall conductor 42 is formed, the insulating layer 32 provided in close contact therewith, and the interlayer connector. Heating is performed in a vertical direction under pressure through a prepreg 31A provided so that 113 penetrates. At this time, the prepreg 31 </ b> A is fluidized and cured in a state where the space around the electrical / electronic component 41 is buried and closely adhered to become an insulating layer.

  Instead of directly forming the interlayer connection body from the metal foil, as described above, the interlayer connection body is composed of a paste-like material in which fine metal particles such as silver, gold, copper, or carbon fine particles are dispersed in the resin by screen printing, for example. You can also

  Note that pressure and temperature as described in the example relating to FIG. 1 can be adopted as the pressure heating condition, and two-stage heat treatment can be performed.

  Further, the size of the planar shape of the opening that defines the embedded region of the electric / electronic component 41 depends on the case where the component is 0402 component, 0603 component, or 1005 component, as described in the example related to FIG. The size can be the same as above. Furthermore, the total thickness of the component built-in wiring board can be set to several millimeters of commas.

  Although the present invention has been described in detail based on specific examples, the present invention is not limited to the above specific examples, and various modifications and changes can be made without departing from the scope of the present invention.

  DESCRIPTION OF SYMBOLS 1 ... Insulating layer, 1a ... Insulating resin, 1b ... Reinforcing material, 2 ... Insulating layer, 2a ... Insulating resin, 2b ... Reinforcing material, 3 ... Insulating layer, 3a ... Insulating resin, 3b ... Reinforcing material, 4, 5, 6 7 ... wiring pattern, 11 ... insulating layer, 11a ... insulating resin, 11b ... reinforcing material, 11A ... prepreg, 11o ... opening, 12, 13 ... wiring pattern, 12A, 13A ... metal foil (copper foil), 14 ... through Hole inner wall conductive layer, 15 ... solder, 16 ... part, 31 ... insulating layer, 31a ... insulating resin, 31b ... reinforcing material, 31A ... prepreg, 32 ... insulating layer, 32a ... insulating resin, 32b ... reinforcing material, 32o ... opening 33 ... Insulating layer, 33a ... Insulating resin, 33b ... Reinforcing material, 33A ... Pre-preg, 34, 35, 36, 37 ... Wiring pattern, 34A, 37A ... Metal foil (copper foil), 38 ... Through wall inner wall conductive layer, 40 ... solder, 41 ... 51 ... Insulating layer, 51a ... Insulating resin, 51b ... Reinforcing material, 52, 53 ... Wiring pattern, 52A, 53A ... Metal foil (copper foil), 54 ... Interlayer connector (Conductive bump by printing conductive composition) ), 61 ... Insulating layer, 61 a ... Insulating resin, 61 b ... Reinforcing material, 62, 63 ... Wiring pattern, 64 ... Interlayer connection body (conductive bump by conductive composition printing), 74, 84 ... Interlayer connection body (metal) Conductor bumps by plate etching), 74A ... metal plate, 79 ... etching mask, 94,104 ... interlayer connector (filled with conductive composition), 114,124 ... interlayer connector (conductor bump by plating), 119 ... prevent plating Mask, 119A ... Mask removal portion, 201, 202, 203, 204, 205 ... Interlayer connector (conductive bump by conductive composition printing), ES ... Etching stopper layer, 11,112,113,114,115,116 ... interlayer connectors.

Claims (2)

A wiring pattern;
Electrical / electronic components electrically and mechanically connected on the surface of the wiring pattern;
An insulating layer having an insulating resin and a reinforcing material contained in the insulating resin, which is laminated on a surface of the wiring pattern on the side where the electric / electronic component is connected so as to embed the electric / electronic component. And comprising
The insulating layer is present in the insulating resin without the reinforcing material of the insulating layer reaching the region of the electric / electronic component in the lateral direction, and the insulating resin of the insulating layer is An insulating layer that reaches the area of the electronic component and is in intimate contact with the electrical / electronic component, in addition, a stack of at least two insulating layers;
A second wiring pattern sandwiched between the at least two insulating layers;
An interlayer connector that is interposed between the surface of the wiring pattern and the surface of the second wiring pattern through the insulating layer in contact with the wiring pattern of the at least two insulating layers; A component built-in wiring board further comprising: Electrically and mechanically connecting an electrical / electronic component on the first metal wiring pattern of the first insulating layer having the first metal wiring pattern;
Printing and forming conductive bumps on the second metal wiring pattern of the second insulating layer having a second metal wiring pattern and containing a reinforcing material;
Laminating a layer of a prepreg containing a reinforcing material on the second insulating layer on the side where the conductive bumps are formed;
A step of penetrating and forming a larger opening than the electric / electronic component to correspond to the position of the electric / electronic component in the laminate including the second insulating layer and the prepreg;
The laminated body having the opening formed on the first insulating layer on the side where the electric / electronic component is connected is arranged so that the prepreg side faces the first insulating layer, and the electric The electronic component is disposed so as to be positioned in the opening, and a third insulating layer is disposed on the second insulating layer, and is laminated and integrated. A method for manufacturing a wiring board.

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