JP2011243760A - Tool for carrying substrate - Google Patents

Abstract

【Task】
The thin substrate affixed to the reflow carrier board is usually peeled off by extruding the substrate from the bottom of the carrier by peeling off the jig with pins, but this method causes a large bending stress on the mounted components, and solder This may lead to damage to the joints and mounted parts.
[Solution]
The substrate can be peeled without applying stress to the substrate by pulling up the peeling plate after reflowing using a substrate carrying jig made of a carrier board in which a peeling plate is incorporated in advance.
[Selection] Figure 1

Description

The present invention relates to a jig used for transporting a substrate when an electronic component is mounted on a thin substrate or a flexible substrate.

When electronic components are mounted on a sheet-like substrate that is not rigid on its own, such as a thin substrate or a flexible substrate (hereinafter referred to as “substrate”), it is conveyed by a conveyor such as a printing machine, a mounting machine, or a reflow device. Because of the possibility of deformation, dents, and the like, it is not possible to flow alone, so it is necessary to mount a substrate on a transporting jig called a carrier board. As the mounting method, there are a method of fixing a substrate with an adhesive tape, a method of fixing with an adhesive layer (adhesion type), a suction type, or a presser type.
JP 2009-059790 A

Here, the method of fixing the substrate with the adhesive tape is the earliest, but this method is inefficient in work because the adhesive tape needs to be replaced every time the reflow process is performed. On the other hand, the adhesive type is a method in which the substrate is brought into close contact with the adhesive layer provided on the surface of the carrier board, and this adhesive layer can be repeatedly attached and detached, so that the above-mentioned problems do not occur. The suction type is a method in which the substrate is brought into close contact by sucking air from the back surface of the carrier board through air holes provided in the carrier board, and the substrate can be easily peeled off from the carrier board. The presser type is a method of fixing a substrate by placing a presser made of a magnetic material on the substrate and sandwiching it with a magnet installed on the back surface of the carrier board.

Among these, the adhesive type can take various adhesive forces depending on the type of adhesive, and depending on the adhesive, even if a thermal cycle (from room temperature to 260 ° C.) accompanying 500 or more reflows is applied, Since there is an advantage that there is little deterioration, high mounting accuracy and productivity can be realized.

Here, when using an adhesive carrier board, as a method of peeling the substrate and the carrier board, conventionally, a method of peeling the substrate from the carrier board by an operator's manual work, or providing a through hole in advance in the carrier board, A method of peeling by extruding a substrate from a back surface of a carrier board with a jig in which pins are arranged has been used.
JP 2002-185126 A

In the former method, since the substrate is peeled off from the edge of the carrier board, stress is locally concentrated on the substrate and the carrier board, and there is a problem that the substrate and the mounted electronic component are damaged. In the latter case, when the tip of the peeling pin presses the substrate, a local force is applied, so that the substrate or the mounted electronic component may be damaged.
Conventionally, these problems have been addressed by (1) facilitating peeling using an adhesive having a low adhesive strength, and (2) slowing the work speed and push-up speed of the peeling. ) Has the adverse effect that the state of the substrate sticking on the carrier board is not stable, and (2) has caused a significant decrease in work efficiency.

On the other hand, the suction type mounting method does not cause such a problem, but it is difficult to always maintain a vacuum due to the degree of deformation of the substrate, scratches, dust, etc., and the adhesion of the substrate becomes insufficient and non-uniform. There is a problem that the substrate is deformed, the printed solder paste is blotted, or the printing position or the mounting position of the electronic component is distorted.
JP-A-2005-260140

SUMMARY OF THE INVENTION An object of the present invention is to solve the above problems and to provide a carrier board having a built-in peeling plate for easily and safely peeling a substrate from an adhesive carrier board.

The present invention
A carrier board having a non-adhesive groove formed in an adhesive surface;
It consists of a peeling plate in which holes are formed to fit into the grooves of the carrier board,
A substrate carrying jig configured such that the adhesive surface of the carrier board in a state in which both are fitted is the same as or protrudes from the peeling plate, and
A substrate conveying jig characterized in that the protruding length of the surface of the carrier board protruding from the peeling plate is 0 to 0.2 mm, and
A substrate transporting tool, characterized in that the grooves formed on the carrier board are arranged vertically and horizontally at intervals of 5 to 10 mm on each side, and the width of the grooves is 1 to 5 mm.
Substrate transporting jigs in which notches to be peeling levers are alternately provided on a pair of sides of the carrier board and the peeling plate, and
Use of a substrate transporting tool characterized in that the substrate is peeled from the carrier board by pulling up the peeling plate from the carrier board after the carrier board and the peeling plate are fitted and the substrate is placed on the carrier board. Method.
JP 2002-185126 A

According to the present invention, it is possible to avoid locally concentrating peeling stress on the substrate and prevent damage to the substrate and components, so that the substrate can be peeled off from the carrier board safely and quickly.

When the substrate is peeled off from the carrier board by hand, since the jig has a higher rigidity than the substrate, a large area of the substrate is peeled off from the carrier board almost simultaneously, so the problem of local stress concentration on the substrate is unlikely to occur. Therefore, it is possible to perform the peeling operation quickly while preventing damage to the substrate and the mounted electronic components.

Also, even if the carrier board is provided with a through hole and the board is pushed out by a jig with pins arranged from the back side and peeled off, the position of the through hole on the carrier board should be designed so that the tip of the pin contacts the peeling plate. For example, there is no problem that local stress is applied to the substrate when the tip of the pin directly presses the substrate as described above. Similarly, damage to the substrate and mounted electronic components can be prevented, and the peeling operation can be performed quickly. be able to.

Carrier board and peeling plate illustration Carrier board opening shape variation Setup form of carrier board with release plate Setup form for specially shaped substrates Process of peeling with peeling plate and lifting jig Processing when peeling manually Process of peeling manually using a peeling plate The process of peeling manually without using a peeling plate Process of peeling with a push-up jig without using a peeling plate Special release plate and carrier board for mounting specially shaped substrates

The carrier board with a built-in release plate of the present invention and a method of using the same will be described with reference to the accompanying drawings.

In FIG. 1, the material of the peeling plate 11 may be a heat-resistant hard material of the same level or higher than that of the carrier board. Specifically, a stainless material, an aluminum material, a glass epoxy resin, or the like may be used. In order to suppress deformation at the time, SUS304 is preferable.

As a processing method of the hole shape 13 of the peeling plate, there are laser processing, etching processing, plating method, electric discharge processing, mechanical processing, punching processing, etc., but considering processing accuracy and productivity, etching processing, laser processing, or punching Processing is preferred.

The shape, size and arrangement of the holes 13 of the peeling plate can be changed according to the circuit pattern of the substrate. The shape can be not only a simple shape such as a circle and a rectangle, but also a polygon such as a hexagon (21) and an octagon (22) as shown in FIG. 2, and a more complicated shape. Considering this point and workability, it is preferable to regularly arrange holes having the same shape and size as shown in FIG. 1 (13). Further, in consideration of the durability of the peeling plate, the distance between the holes needs to be set more than the extent that the jig is not deformed at the time of peeling in consideration of the adhesive strength of the material and the adhesive of the carrier board. In particular, it is more preferable that squares having sides of 5 mm to 10 mm are arranged in a grid pattern at intervals of 1 mm to 5 mm because they can be used for substrates of any circuit pattern.

The thickness of the release plate needs to be at least as large as it does not deform at the time of peeling in consideration of the adhesive strength of the material and the adhesive on the carrier board. Since it can be used without depending on adhesive strength, it is preferable.

The carrier board (14) may be any heat-resistant hard material, and specifically, stainless steel, aluminum, or glass epoxy resin may be used.

A square groove 17 is formed on the surface of the carrier board (contact surface of the substrate) as shown in FIG. 1, and the peeling plate is incorporated in this square groove. At this time, the adhesive layer 16 is provided in the portion that fits into the hole of the peeling plate, and the inside of the square groove into which the lattice frame of the peeling plate fits has no adhesive layer.

Furthermore, the width of the square groove in the plane of the carrier board is preferably set so that a slight gap is formed when the release plate is installed in order to facilitate the attachment and detachment of the carrier board and the release plate. It is more preferable to set the plate so that it does not shift, but particularly when the thickness is 0.2 mm to 0.5 mm or less, it is particularly preferable because good detachment and stable installation of the peeling plate can be realized. In addition, the depth of the square groove is required to be approximately the same as the thickness of the peeling plate so that when the peeling plate is installed on the carrier board and the substrate is attached thereon, the substrate becomes substantially flat. The protrusion length of the adhesive layer when the release plate is fitted is preferably within 0 to 0.2 mm.

The step of forming the square groove may be performed either before or after forming the adhesive layer on the surface of the carrier board. However, the step after forming the adhesive layer is preferable because the process can be simplified. In addition, as the method of forming the square groove, machining, etching, laser machining, and the like can be considered, but machining is preferable in consideration of accuracy and machining efficiency.

The shape of the square groove can be any shape such as a U-groove shape or a V-groove shape, but is preferably a concave shape in consideration of ease of processing and fitting with a peeling plate.

As the method for forming the adhesive layer, a method of sticking an adhesive sheet on a carrier board and a method of printing an adhesive substance on the surface of the carrier board are mainly used. As long as it is possible, it is not limited to these.

As shown in FIG. 3, the lattice frame of the peeling plate 31 is fitted into the square groove of the carrier board 32, and the carrier board is combined so that the adhesive layer of the carrier board is fitted into the lattice hole of the peeling plate (b). At this time, the adhesive layer of the carrier board is exposed from the hole of the release plate (33). Therefore, a substrate is set on this, and the substrate is adhered to the adhesive layer of the carrier board to perform setup (c) (hereinafter, this configuration is referred to as “setup configuration”).

Here, as in the case where the substrate 41 is L-shaped and the carrier board 42 is square as shown in FIG. 4, both of the shapes are different, screw holes are installed in the surface of the substrate, etc. If the hole 43 is partially opened in the substrate, the adhesive layer of the carrier board is exposed on the surface in a setup form. In such a case, in the setup form, the surface of the carrier board and the peeling plate are partially exposed on the surface. However, when the metal mask printing plate is brought into contact with the substrate during paste printing, the metal mask is the carrier. It may adhere to the board, causing damage to the metal mask and printing failure. Therefore, when a substrate having a special shape as described above is used, it is necessary to previously lose the adhesive strength of the portion where the adhesive layer is exposed in the setup form.

As this method, for example, removal of the adhesive layer by laser irradiation, etching, or machining, and application of a non-adhesive material can be considered, but the method is not limited thereto as long as the adhesive force of the adhesive layer can be eliminated. Even if the surface of the metal mask is textured, it is possible to prevent the metal mask from adhering to the adhesive layer of the carrier board.

Hereinafter, the peeling board built-in carrier board of this invention and the peeling method of the board | substrate using the same are demonstrated concretely.

[Example 1]
FIG. 5 shows an embodiment of the present invention, in which the peeling work is performed using a peeling plate and a push-up jig. 51 and 53 are setup forms, and 52 and 54 are an overhead view and a cross-sectional view of the lifting jig. 55 and 56 show an overhead view and a cross-sectional view of a state in which the peeling plate is lifted by a lifting jig and the substrate is peeled off. The peeling plate was formed by etching a SUS304 material having a square with a side of 250 mm and a thickness of 0.8 mm, and forming square holes with a side of 8.3 mm in a grid pattern at intervals of 1.7 mm.
The carrier board was made of a glass epoxy resin, and square grooves having a width of 2.1 mm and a depth of 0.8 mm were formed on the surface in a grid pattern vertically and horizontally at intervals of 7.9 mm. The substrate is a square with a side of 200 mm and a thickness of 0.2 mm.
First, before the reflow, the peeling plate is fitted to the carrier board, and the substrate is pasted thereon to form the setup form 51. Next, using a metal mask printing plate, a solder paste is printed on a substrate, and an electronic component is mounted on a solder printing portion, and then this is passed through a reflow furnace to melt the solder paste and mount the electronic component (a ).
After the reflow treatment, a push-up jig is attached to the through hole of the carrier board so as to penetrate the pin, and the substrate is pushed down together with the peeling plate (b). The structure in which the peeling plate is pushed up with the pins in this way makes it possible to peel off the substrate with the peeling plate, and it can be peeled off without applying local stress to the substrate. It was possible to peel without damaging the parts and electronic parts.

[Example 2]
6 and 7 show an embodiment of the present invention, which is a peeling method in which peeling is performed manually using a peeling plate. The release plate and the carrier board were produced by the same method as in Example 1, and electronic components were mounted in the same procedure as in Example 1. FIG. 6 shows a process for performing peeling manually. The carrier board and the release plate are processed with notches alternately. FIG. 7 is a diagram of a peeling process. When the notch is pushed up and down like a lever, the peeling plate peels the substrate from the carrier board (a). By using the peeling plate in this way, it is possible to avoid the peeling stress from being concentrated on the substrate, so that the peeling can be performed without damaging the substrate, the solder joint, the electronic component, etc. (b).

[Comparative Example 1]
As a comparative example, FIG. 8 shows a case where peeling is performed manually without using a peeling plate. (A) shows the state before peeling, (b), (c) shows the state during peeling. In (b), the compressive stress is concentrated on the components and solder joints of the substrate 82, so that the components were cracked and the solder joints 81 were damaged (c). Moreover, when the peeling speed was slowed to avoid damage to the substrate and the mounted electronic components, the working efficiency was reduced to less than half.

[Comparative Example 2]
As a comparative example, FIG. 9 shows a case where peeling is performed using a lifting jig without using a peeling plate (a). In this case, since the pressure was directly applied to the substrate from the tip of the pin, the substrate was stressed (b), and the solder joint was damaged (c). Moreover, when the peeling speed was slowed to avoid damage to the substrate and the mounted electronic components, the working efficiency was reduced to less than half.

Example 3
FIG. 10 shows an embodiment in which a specially shaped substrate such as 41 described above is used and a multi-sided attachment is made using a dedicated peeling plate and carrier board.
Corresponding to the mounting pattern of the specially shaped substrate 101, the hole of the special peeling plate 103 and the square groove of the carrier board 103 were formed. These are combined to obtain the setup form 104.

[Comparative Example 3]
In Example 1 and Example 2, the adhesive strength of the adhesive layer is about 0.4 N / mm in the 180 ° peel test, and the substrate can be sufficiently fixed to the carrier board during reflow. On the other hand, if the substrate is peeled off from the carrier board without damaging the solder joints or the like while maintaining the peeling speed without using a peeling plate, the adhesion layer is maintained. Adhesive strength of about 0.1 N / mm had to be used. With this adhesive strength, the substrate could not be fixed firmly enough, and it was easily peeled off by the hot air pressure in the furnace during reflow.

11 12 31 Release plate 13 Adhesive layer hole 14 15 32 57 Carrier board 16 Adhesive layer 17 18 33 Through hole 21 Adhesive layer hole (hexagon)
22 Hole for adhesive layer (octagon)
23 Hole for adhesive layer (square)
34 State where release plate is set on carrier board 41 L-shaped substrate 42 Reflow carrier adhesive layer 43 Hole on substrate 35 82 92 Substrate
51 53 Setup form 61 62 Processing when performing manual peeling 52 54 Push-up jig 55 56 Peeling substrate and peeling plate 81 91 Electronic component 83 Peeling direction 84 94 Breakage of solder joint due to bending stress 93 Pushing direction 101 Atypical Substrate 102 Atypical substrate peeling plate 103 Atypical substrate carrier board

Claims (5)

A carrier board in which a non-adhesive groove is formed in an adhesive surface;
It consists of a peeling plate in which holes are formed to fit into the grooves of the carrier board,
The jig for board | substrate conveyance comprised so that the adhesion surface of the said carrier board in the state which both fitted may be the same surface as the said peeling plate, or protrudes.   2. The substrate carrying jig according to claim 1, wherein a protruding length of the surface of the carrier board protruding from the peeling plate is 0 to 0.2 mm.   3. The substrate transport according to claim 1, wherein the grooves formed in the carrier board are arranged vertically and horizontally at intervals of 5 to 10 mm on a side, and the width of the grooves is 1 to 5 mm. Jig.   4. The substrate transporting jig according to claim 1, 2, or 3, wherein notches serving as peeling levers are alternately provided on sides of the carrier board and the peeling plate. Use of a substrate transporting tool characterized in that the substrate is peeled from the carrier board by pulling up the peeling plate from the carrier board after the carrier board and the peeling plate are fitted and the substrate is placed on the carrier board. Method.