JP2011129691A - Semiconductor module and semiconductor device including the same - Google Patents

Abstract

Unnecessary radiation from a semiconductor module is reduced and the cooling performance of the semiconductor module is improved.
[Solution]
The semiconductor module (10) is provided on a mother board (21) including a ground wiring layer (22), and a connector (25) provided on the surface with a conductor (25) electrically connected to the ground wiring layer (22). 24) is configured to be detachable. The semiconductor module (10) includes a module substrate (11) on which the semiconductor element (12) is mounted, and a heat spreader (14) attached to one surface of the semiconductor element (12) facing away from the module substrate (11). And). When the semiconductor module (10) is attached to the connector (24), the heat spreader (14) is configured to contact the conductor (25) provided on the surface (24a) of the connector (24).
[Selection] Figure 1

Description

  The present invention relates to a semiconductor module configured to be detachable from a connector installed on a mother board and a semiconductor device including the semiconductor module.

  For example, a semiconductor device including a semiconductor element such as a DRAM includes a module board on which one or more semiconductor elements are mounted, and a mother board on which a connector into which an end of the module board is inserted is disposed. (See Patent Document 1 and Patent Document 2).

  Patent Document 1 discloses a semiconductor device including a module substrate on which memory elements as semiconductor elements are arranged, and a mounting substrate (mother substrate) on which the module substrate is mounted (see FIG. 1 of Patent Document 1). 3). A plurality of terminals are arranged on one end of both sides of the module substrate, and the plurality of terminals constitute a plug as a whole. The mounting board is provided with a socket (connector) having a pair of terminals corresponding to a plurality of terminals of the module board. By inserting the module substrate into the socket, the memory element disposed on the module substrate and the mounting substrate are electrically connected.

  Patent Document 2 discloses an electronic device (semiconductor device) in which semiconductor elements are mounted on both sides of a circuit board (module board), and a heat sink is provided in contact with these semiconductor elements. Both ends of the circuit board are attached to a pair of connectors provided on the mother board. Moreover, in the cited document 2, it is described that the heat sink may be electrically connected to the ground layer exposed on the surface of the circuit board.

  Patent Document 3 discloses a connector in which a conductor is provided on the surface of a housing formed of an insulator to prevent leakage of electromagnetic waves, and the conductor is short-circuited to a reference potential of an electric circuit.

JP 2006-324326 A JP 2006-202975 JP-A-9-82420

  For example, a semiconductor device including a memory element emits unnecessary electromagnetic waves (radiated emission) depending on the operating frequency, and may cause electromagnetic interference (EMI) to peripheral electronic components.

  In the semiconductor device described in Patent Literature 1, since the memory element provided on the module substrate is exposed, there is a problem in that the intensity of unnecessary radiation emitted from the memory element cannot be reduced.

  Even if the heat sink is attached in contact with the semiconductor element as described in Patent Document 2, when the heat sink is insulated (floating), the operating frequency according to the size and shape of the heat sink Thus, electromagnetic waves emitted from the semiconductor element may resonate. At this time, there arises a problem that the intensity of unnecessary radiation emitted from the semiconductor element increases. In Patent Document 2, such a problem of unnecessary radiation is not described at all.

  In recent years, for example, as a semiconductor element such as a memory element is operated at high speed, the amount of heat generated by a semiconductor module including the semiconductor element has increased. In order to improve the heat dissipation of the semiconductor module, it is conceivable to increase the thickness or area of the heat sink attached to the semiconductor element. However, the height and thickness of the semiconductor module are limited by standards and the like. Therefore, there exists a problem that the shape of a heat sink cannot be set arbitrarily.

  Further, Patent Document 3 discloses a configuration of a connector for preventing leakage of electromagnetic waves, but does not describe any module attached to the connector. Therefore, the connector described in Patent Document 3 does not solve the above-described problems related to suppression of electromagnetic waves leaking from the semiconductor module and cooling of the semiconductor module.

  The semiconductor module in one embodiment is provided on a mother board including a ground wiring layer, and is configured to be detachable from a connector provided with a conductor electrically connected to the ground wiring layer on the surface. The semiconductor module includes a module substrate on which a semiconductor element is mounted, and a heat spreader attached to one surface of the semiconductor element facing away from the module substrate. When the semiconductor module is attached to the connector, the heat spreader is configured to contact a conductor provided on the surface of the connector.

  Further, a semiconductor device according to an embodiment includes a mother board including a ground wiring layer, a connector installed on the mother board, a conductor electrically connected to the ground wiring layer and provided on the surface of the connector, And a semiconductor module.

  According to the said structure, when a module board | substrate is inserted in a connector, a heat spreader contacts with the conductor of the surface of a connector. In this way, the semiconductor element and the connector are integrally covered with the heat spreader and the conductor maintained at the ground potential.

  ADVANTAGE OF THE INVENTION According to this invention, the unnecessary radiation from a semiconductor module can be reduced and the cooling property of a semiconductor module can be improved.

1 is a schematic plan view of a semiconductor device according to a first embodiment.

  Embodiments of the present invention will be described below with reference to the drawings.

  FIG. 1 is a schematic cross-sectional view showing the semiconductor device according to the first embodiment. The semiconductor device includes a semiconductor module 10 and a mother board 21. FIG. 1 shows a state in which the semiconductor module 10 is attached to the mother board 21, and is along a plane perpendicular to the plate surface of the module board 11 of the semiconductor module 10 and perpendicular to the board surface of the mother board 21. A cross section is shown.

  The mother board 21 is formed by laminating an insulating layer 23, a ground wiring layer 22, a signal wiring layer (not shown), and the like. The mother board 21 may have any configuration, and an arbitrary electronic component (not shown) may be mounted.

  The mother board 21 is provided with an electrical connector 24 to which the semiconductor module 10 can be attached and detached. The connector 24 has an electrode terminal 26 electrically connected to a wiring layer such as the ground wiring layer 22 or the signal wiring layer of the mother board 21.

  In the present embodiment, the connector 24 protrudes from the mother board 21, and the surface 24 a of the connector 24 is covered with the conductor 25. The conductor 25 is electrically connected to the ground wiring layer 22 of the mother board 21, whereby the conductor 25 is grounded.

  The semiconductor module 10 includes a module substrate 11, a semiconductor element 12, and a heat spreader 14. For example, a memory element such as a DRAM can be used as the semiconductor element 12, but is not limited thereto. The module substrate 11 may be mounted with an electronic element 15 such as a capacitor or a logic IC. The semiconductor element 12 is mounted on the module substrate 11.

  As shown in FIG. 1, the semiconductor element 12 may be mounted on the module substrate 11 by the bump electrodes 13 or may be mounted on the module substrate 11 by wire bonding.

  An electrode terminal 16 is provided at one end portion 11 a of the module substrate 11, and the one end portion 11 a of the module substrate is detachable from the connector 24 of the mother substrate 21. When one end portion 11a of the module board is inserted into the connector 24, the electrode terminals 16 of the module board come into contact with the electrode terminals 26 of the connector, and other electronic components (non-conducting parts) mounted on the semiconductor element 12 and the mother board 21 Are electrically connected to each other.

  The heat spreader 14 is attached to one surface of the semiconductor element 12 opposite to the module substrate 11. The heat spreader 14 is preferably made of a conductor (metal) having high thermal conductivity and electrical conductivity. The heat spreader 14 extends from the semiconductor element 12 toward the one end 11a of the module substrate 11 where the electrode terminals are provided. When the one end 11a of the module substrate is inserted into the connector 24, the heat spreader 14 comes into contact with the conductor 25 formed on the surface 24a of the connector. As a specific example, as shown in FIG. 1, the conductor 25 is preferably provided on a side wall surface along the insertion direction of the module substrate 11 with respect to the connector 24.

  As described above, the heat spreader 14 is electrically connected to the ground wiring layer 22 of the mother board 21 through the conductor 25 formed on the surface 24a of the connector. That is, the semiconductor element 12 and the connector 24 are integrally covered with the conductor (heat spreader 14 and conductor 25) maintained at the ground potential. Therefore, the effect of suppressing unnecessary radiation from the semiconductor element 12 and the connector 24 is improved.

  Further, heat generated in the semiconductor module 10 is conducted to the heat spreader 14. Part of this heat is radiated from the heat spreader 14 into the air, and another part of this heat is conducted from the heat spreader 14 to the ground wiring layer 22 of the mother board 21 through the conductor 25 on the surface 24a of the connector. In this way, the heat transmitted to the heat spreader 14 is quickly radiated.

  Further, since the heat spreader 14 extends toward the one end portion 11a of the module substrate 11, there is an advantage that the volume of the heat spreader 14 is increased and the cooling performance of the heat spreader 14 is improved.

  As described above, in the present embodiment, the heat spreader 14 does not need to have a height that greatly exceeds the height of the module substrate 11 (the height from the mother substrate 21), and does not need to increase the thickness. Therefore, the size of the semiconductor device hardly increases, and the semiconductor device can be configured in accordance with the standard.

  The semiconductor element 12 is preferably mounted on both surfaces of the module substrate 11. There may be one or a plurality of semiconductor elements 12 mounted on one side of the module substrate 11. When the semiconductor element 12 is mounted on both surfaces of the module substrate 11, it is preferable that the heat spreader 14 is provided on each semiconductor element. The heat spreaders 14 are preferably configured to contact the conductor 25 provided on the surface 24 a of the connector when the semiconductor module 10 is attached to the connector 24.

  In the above-described embodiment, the semiconductor device having the mother board 24 provided with the connector 24 and the semiconductor module 10 has been described. However, the present invention is a single semiconductor module configured to be detachable from the connector described in the above-described embodiment. Also applies.

  The preferred embodiments of the present invention have been described above, but the present invention is not limited to the above-described embodiments, and various changes and modifications can be made without departing from the spirit of the present invention. It goes without saying that it is included in the range of. That is, the present invention of course includes various variations and modifications that could be made by those skilled in the art based on all the descriptions and technical ideas including the claims.

DESCRIPTION OF SYMBOLS 10 Semiconductor module 11 Module board | substrate 11a One end part 12 of a module board | substrate 13 Semiconductor element 13 Bump electrode 14 Heat spreader 15 Electronic element 16 Electrode terminal 21 of module board | substrate 21 Mother board 22 Ground wiring layer 23 Insulation layer 24 Connector 24a Connector surface 25 Conductor 26 Connector of Electrode terminal

Claims (7)

A semiconductor module provided on a mother board including a ground wiring layer and configured to be detachable to a connector provided on a surface of a conductor electrically connected to the ground wiring layer,
A module substrate on which a semiconductor element is mounted;
A heat spreader attached to one surface of the semiconductor element facing away from the module substrate;
A semiconductor module configured such that when the semiconductor module is attached to the connector, the heat spreader contacts the conductor provided on the surface of the connector. An electrode terminal is formed at one end of the module substrate,
The semiconductor module according to claim 1, wherein the one end portion of the module substrate is inserted into the connector.   The semiconductor module according to claim 2, wherein the conductor is provided on a side wall surface along an insertion direction of the module substrate with respect to the connector. A semiconductor module provided on a mother board including a ground wiring layer and configured to be detachable to a connector provided on a surface of a conductor electrically connected to the ground wiring layer,
A module substrate having a first semiconductor element mounted on one surface and a second semiconductor element mounted on the other surface;
A first heat spreader attached to one surface of the first semiconductor element facing away from the module substrate;
A second heat spreader attached to one surface of the second semiconductor element facing away from the module substrate;
A semiconductor module configured such that when the semiconductor module is attached to the connector, the first heat spreader and the second heat spreader are in contact with the conductor provided on the surface of the connector. A mother board including a ground wiring layer;
A connector installed on the mother board;
A conductor electrically connected to the ground wiring layer and provided on the surface of the connector;
A semiconductor module configured to be detachable from the connector;
The semiconductor module has a module substrate on which a semiconductor element is mounted, and a heat spreader attached to one surface of the semiconductor element facing away from the module substrate,
A semiconductor device configured such that when the semiconductor module is attached to the connector, the heat spreader contacts the conductor provided on the surface of the connector. An electrode terminal is formed at one end of the module substrate,
The semiconductor device according to claim 5, wherein the one end portion of the module substrate is inserted into the connector.   The semiconductor device according to claim 6, wherein the conductor is provided on a side wall surface along an insertion direction of the module substrate with respect to the connector.

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