JP2011119611A - Injection-molded substrate and injection-molded component - Google Patents

Abstract

[PROBLEMS] To provide a printed wiring board having electrical characteristics that can be used for a high-frequency antenna and the like, and excellent in dimensional stability and mass productivity, and a difference in coefficient of linear expansion between the coating material and the board is small, and cracking due to thermal shock Provide electronic parts such as antenna parts that are less likely to generate
An injection-molded substrate obtained by injection-molding a thermoplastic resin composition containing 15 to 65% by volume of a filler on an electrolytic copper foil having a surface roughness (Rz) of 2 to 15 μm, and a circuit pattern An injection-molded part obtained by further coating a thermoplastic resin composition containing 15 to 60% by volume of a filler on the injection-molded substrate on which is formed.
[Selection] Figure 1

Description

  The present invention relates to an injection molded substrate excellent in electrical characteristics, dimensional stability, mass productivity, and the like, and an injection molded component such as an antenna component.

2. Description of the Related Art Conventionally, printed wiring boards that are formed by combining an insulating layer with a thermosetting resin such as epoxy resin or phenol resin and a reinforcing material such as paper or glass cloth have been widely used. A metal layer made of copper foil or the like is provided on the insulating layer. Holes are drilled in the insulating substrate with this metal layer as needed, or a metal pattern on the surface is etched to form a circuit pattern, followed by solder resist processing and plating finish processing. A substrate is used.
For example, Patent Document 1 describes a method in which a metal foil serving as a circuit conductor is placed in a flat cavity formed by a mold, and an epoxy resin is injected into the formed gap and cured.
However, the glass epoxy substrate as described above has a dielectric loss tangent of about 0.02 and has poor electrical characteristics. Further, since a thermosetting resin is used, there is a problem that the curing time is long and the molding cycle is long.
Furthermore, when a glass epoxy board is punched or covered with a router and covered with a thermoplastic resin, an electronic part such as an antenna part is manufactured, and a heat shock test is performed, the linear expansion coefficient between the glass epoxy board and the thermoplastic resin is increased. Due to the difference, there was a problem that the thermoplastic resin was cracked.

As an antenna substrate material having good dielectric characteristics, for example, in Patent Document 2, a fibrous inorganic filler having a fiber diameter of 3 μm or less, a relative dielectric constant of 50 or more, and a dielectric loss tangent of 0.1 or less in a synthetic resin matrix The resin composition for electronic components characterized by containing is disclosed. In Patent Document 2, as a method for manufacturing an electrode, it is described that a metal foil is bonded or pressure-bonded with an appropriate adhesive. However, when an adhesive is interposed between the metal foil and the resin composition, the adhesive affects the dielectric constant or increases the dielectric loss (dielectric loss tangent). Was not appropriate.
For example, Patent Document 3 discloses a thermoplastic electrically insulating substrate formed by forming a composition comprising a polyphenylene sulfide resin and glass fibers. As an electrode forming method, a method of heating and pressurizing a copper foil with an adhesive at 145 ° C. for 30 minutes is described in the examples as to the resin molded product. Similarly, an adhesive is provided between the copper foil and the resin. Due to the interposition, the adhesive changes the dielectric constant or increases the dielectric loss, so that it is not suitable for use in a high-frequency antenna or the like as in Patent Document 2. Moreover, although the circuit formation method by a silver paste is described, since the electroconductivity is low compared with copper foil or soldering etc. cannot be performed, the use was limited.

JP-A-6-21593 JP-A-8-41247 Japanese Patent Laid-Open No. 5-98157

As described above, in the conventional substrate, the dielectric loss of the substrate itself is large, and the adhesive is attached to the copper foil. Therefore, the change in dielectric constant and the dielectric loss are large, and it is not suitable for use in high frequency applications. In addition, when an electronic component is formed by coating a substrate with a resin, cracking occurs due to a difference in coefficient of linear expansion between the substrate and the coating material in a long-term reliability test such as a heat shock test.
The present invention has electrical characteristics that can also be used for high-frequency antennas, etc., and is excellent in dimensional stability and mass productivity, and the difference in coefficient of linear expansion between the coating material and the substrate is small, resulting from thermal shock. The purpose is to provide electronic parts such as antenna parts that are less likely to crack.

  As a result of intensive studies in view of the above problems, the present inventors have used an electrolytic copper foil whose surface roughness has been adjusted, and by injection molding a thermoplastic resin composition containing a specific proportion of filler, It has been found that the adhesive strength between the copper foil and the insulating substrate can be increased without using it, and the present invention has been achieved.

That is, the present invention
(1) An injection-molded substrate obtained by injection-molding a thermoplastic resin composition containing 15 to 65% by volume of a filler on an electrolytic copper foil having a surface roughness (Rz) of 2 to 15 μm,
(2) The injection-molded substrate according to (1), wherein the adhesive strength between the electrolytic copper foil and the thermoplastic resin composition is 3 N / cm or more,
(3) The injection-molded substrate according to (1) or (2), wherein the thermoplastic resin composition has a linear expansion coefficient of 1.0 × 10 ^{−5 to} 3.0 × 10 ⁻⁵ / ° C.
(4) The injection-molded substrate according to any one of (1) to (3), wherein the thermoplastic resin of the thermoplastic resin composition is a polyphenylene sulfide resin or a polyetherimide resin,
(5) The injection-molded substrate according to any one of (1) to (4), wherein the electrolytic copper foil is etched to form a circuit pattern, and (6) according to (5) An injection-molded part is provided in which an injection-molded substrate is further coated with a thermoplastic resin composition containing 15 to 60% by volume of a filler.

  The board | substrate of this invention can reduce a linear expansion coefficient by using the thermoplastic resin composition containing 15-65 volume% of fillers. The substrate of the present invention receives a thermal history in an etching step or the like after the molding, but becomes a substrate having excellent dimensional stability because of a small linear expansion integer. Moreover, since it is molded by injection molding, the molding cycle can be shortened and no adhesive is used, so that it is not necessary to consider the dielectric constant and dielectric loss of the adhesive. Further, the antenna characteristics can be improved by filling the low dielectric loss tangent material. Furthermore, even if the substrate of the present invention is stamped or routered into a specific shape and then coated with another thermoplastic resin, the difference in coefficient of linear expansion between the coating material and the substrate is small, and cracking due to thermal shock occurs. Hard to do. Therefore, the injection molded part of the present invention has high mass productivity and excellent heat resistance.

It is a top view which shows the injection molded part produced in the Example.

  The injection-molded substrate of the present invention has an electrolytic copper foil on one side or both sides of an insulating substrate made of a thermoplastic resin composition. The injection-molded substrate of the present invention is obtained by injection-molding a thermoplastic resin composition on the surface of an electrolytic copper foil fitted in a mold and having a surface roughness (Rz) of 2 to 15 μm. .

The thermoplastic resin composition in the present invention contains at least a thermoplastic resin and a filler.
As the thermoplastic resin, those that can be used for injection molding can be used without particular limitation. Polybutylene terephthalate resin, polyethylene terephthalate resin, polyphenylene sulfide resin, polyetherimide resin, polyetheretherketone resin, polyethersulfur Phon resin, syndiotactic polystyrene resin, liquid crystalline polyester resin, and the like. Polyphenylene sulfide resin and polyetherimide resin are preferable.

The filler is not particularly limited, but silica, talc, mica, glass fiber, alumina, aluminum nitride, silicon nitride, boron nitride, titanium dioxide, barium titanate, calcium titanate, strontium titanate, barium zirconate, Examples thereof include calcium zirconate, barium stannate, and calcium stannate. The filler may be any material as long as it is apparently powdered, such as spherical, crushed, and fibrous.
If necessary, the filler may be surface-treated with a surface treatment agent. Examples of the surface treatment agent include waxes, saturated fatty acids such as stearic acid and palmitic acid, saturated fatty acid salts such as magnesium stearate, titanate coupling agents, and silane coupling agents.
The blending ratio of the filler is preferably 15 to 65% by volume of the thermoplastic resin composition, more preferably 30 to 60% by volume. If the amount is too small, the insulating base material formed from such a composition has a large dimensional change and a large warp, so that the purpose cannot be achieved. Moreover, when too large, mixing with a thermoplastic resin will become difficult, and injection molding will also become difficult.

In the thermoplastic resin composition, an appropriate amount of commonly used additives such as a lubricant, a colorant, an ultraviolet absorber, a flame retardant, and an antistatic agent can be added as necessary.
The linear expansion coefficient of the thermoplastic resin composition is preferably 1.0 × 10 ^{−5 to} 3.0 × 10 ⁻⁵ / ° C., more preferably 1.0 × 10 ^{−5 to} 2.5 ×. 10 ⁻⁵ / ° C. Outside of the above range, the difference in coefficient of linear expansion between the electrolytic copper foil and the thermoplastic resin composition widens, making it difficult to suppress warping of the printed wiring board, and when receiving a thermal history such as an etching process. The dimensions may change and the dimensional stability may be inferior.

In the electrolytic copper foil, the surface roughness of the contact surface with the thermoplastic resin composition is 2 to 15 μm, preferably 5 to 13 μm, as a value Rz defined by JIS B0601. When the Rz value is smaller than 2 μm, the anchor effect between the thermoplastic resin composition in contact with this surface is not sufficiently exhibited, and the bonding strength between the electrolytic copper foil and the thermoplastic resin composition is insufficient. Problems such as pattern circuit peeling during handling and disconnection during etching are likely to occur. On the other hand, if the Rz value exceeds 15 μm, the bonding strength increases, but it takes time to completely remove the protrusions on the roughened surface, and the side walls of the circuit pattern are also etched, so the shape of the circuit pattern is poor. If there is a fine pattern, there is a possibility of disconnection.
The adhesive strength between the electrolytic copper foil and the thermoplastic resin composition is preferably 3 N / cm or more, more preferably 5 N / cm or more. When the adhesive strength is too small, there is a possibility that circuit peeling or disconnection occurs as described above.

The injection-molded substrate of the present invention is molded into a desired shape using an injection molding machine, a compression molding machine, or an injection compression molding machine, which is a thermoplastic resin molding machine that is generally widely used. The molding conditions in the molding method are not particularly limited, but the mold temperature is preferably 160 ° C. or higher. The injection-molded substrate of the present invention is produced by placing an electrolytic copper foil in a mold so that the rough surface is in contact with the thermoplastic resin when the thermoplastic resin is injection-molded. As a method of arranging, for example, a mechanism for sucking the copper foil is provided in the mold, and the copper foil is sucked when the copper foil is put in the mold so that the copper foil does not fall. Thereafter, an injection-molded substrate can be obtained by filling the resin in the mold. Such an injection-molded substrate of the present invention does not require the use of an adhesive and does not require time required for curing of the adhesive, and therefore has high productivity. Further, since no adhesive is used, it is not necessary to consider the dielectric constant and dielectric loss of the adhesive.
Various methods have been proposed for forming the circuit pattern (conductor pattern) of the injection-molded substrate thus obtained, and examples include the additive method and the semi-additive method. Further, the electrolytic copper foil may be previously pressed into a desired circuit shape. The circuit pattern can be formed, for example, by drilling through holes, plating, and etching the injection molded substrate.

The injection-molded part of the present invention is obtained by further coating a thermoplastic resin composition on the injection-molded substrate on which a circuit pattern is formed. At this time, the thermoplastic resin of the thermoplastic resin composition used for coating, the kind of filler, and the like are the same as those used for the injection-molded substrate, but include 15-60% by volume of filler, preferably 30-50. % By volume. By setting the ratio of the filler in such a range, an injection molded part having excellent dimensional stability and moldability can be obtained. The injection-molded part of the present invention is characterized in that the coefficient of linear expansion is small between the coating material and the substrate, and cracking due to thermal shock is unlikely to occur.
The injection molded substrate and the injection molded component of the present invention can be suitably used for electronic devices such as an antenna, a filter, a large current substrate, and a high heat dissipation substrate. Since the adhesive does not affect the electrical characteristics, it can be used for high frequency antennas and the like, and since it is excellent in conductivity and dimensional stability, it can be used for a wide variety of purposes.

Hereinafter, the present invention will be described in more detail based on examples and comparative examples. In addition, this invention is not limited to the Example shown below.
In the table, PEI represents a polyetherimide resin, and PPS represents a polyphenylene sulfide resin.

<Example 1>
The thermoplastic resin composition was obtained by dry blending 34% by volume of glass fiber (manufactured by Nittobo Co., Ltd., trade name: CS3PE-256) with respect to polyphenylene sulfide resin (manufactured by DIC, trade name: LR100G), and an extruder (Nippon Steel). The mixture was melt-mixed using a trade name, TEX30 twin screw extruder, to produce pellets of the composition.
As the copper foil, an electrolytic copper foil having a thickness of 35 μm and a surface roughness (Rz) of 9 μm (manufactured by Furukawa Electric Co., Ltd., trade name: GTS-MP 35 μm) was used.
Injection molding was performed using a 110 ton injection molding machine manufactured by Nippon Steel Works, and an electrolytic copper foil was fitted into the mold to produce a substrate having a length of 150 mm, a width of 150 mm, and a thickness of 2 mm.

<Example 2>
The thermoplastic resin composition was obtained by dry blending 60% by volume of silica (manufactured by Tatsumori Co., Ltd., trade name: Furex RD-8) with respect to polyphenylene sulfide resin (manufactured by DIC, trade name: LR100G), and an extruder (Japan). The mixture was melt-mixed with a steelworks company, trade name: TEX30 twin screw extruder, to produce pellets of the composition.
As the copper foil, an electrolytic copper foil having a thickness of 35 μm and a surface roughness (Rz) of 9 μm (manufactured by Furukawa Electric Co., Ltd., trade name: GTS-MP 35 μm) was used.
Injection molding was performed using a 110 ton injection molding machine manufactured by Nippon Steel Works, and an electrolytic copper foil was fitted into the mold to produce a substrate having a length of 150 mm, a width of 150 mm, and a thickness of 2 mm.

<Example 3>
The thermoplastic resin composition was dry blended with 46% by volume of barium titanate (BT-100M manufactured by Fuji Titanium Industry Co., Ltd., manufactured by DIC Corporation, trade name: LR100G), and then an extruder (manufactured by Nippon Steel Works). , Trade name: TEX30 twin screw extruder) to prepare pellets of the composition.
As the copper foil, an electrolytic copper foil having a thickness of 35 μm and a surface roughness (Rz) of 9 μm (manufactured by Furukawa Electric Co., Ltd., trade name: GTS-MP 35 μm) was used.
Injection molding was performed using a 110 ton injection molding machine manufactured by Nippon Steel Works, and an electrolytic copper foil was fitted into the mold to produce a substrate having a length of 150 mm, a width of 150 mm, and a thickness of 2 mm.

<Example 4>
The thermoplastic resin composition was obtained by dry blending 17% by volume of glass fiber (manufactured by Nittobo Co., Ltd., trade name: CS3PE-256) with respect to polyetherimide resin (SABIC, trade name: ULTEM1010), and an extruder (Japan). The mixture was melt-mixed with a steelworks company, trade name: TEX30 twin screw extruder, to produce pellets of the composition.
As the copper foil, an electrolytic copper foil having a thickness of 35 μm and a surface roughness (Rz) of 9 μm (manufactured by Furukawa Electric Co., Ltd., trade name: GTS-MP 35 μm) was used.
Injection molding was performed using a 110 ton injection molding machine manufactured by Nippon Steel Works, and an electrolytic copper foil was fitted into the mold to produce a substrate having a length of 150 mm, a width of 150 mm, and a thickness of 2 mm.

<Example 5>
The thermoplastic resin composition was obtained by dry blending 46% by volume of barium titanate (Fuji Titanium Industry Co., Ltd., trade name: BT-100M) with respect to polyetherimide resin (SABIC, trade name: ULTEM1010), and an extruder. The mixture was melt-mixed by a product of Nippon Steel Corporation (trade name: TEX30 twin screw extruder) to produce pellets of the composition.
As the copper foil, an electrolytic copper foil having a thickness of 35 μm and a surface roughness (Rz) of 9 μm (manufactured by Furukawa Electric Co., Ltd., trade name: GTS-MP 35 μm) was used.
Injection molding was performed using a 110 ton injection molding machine manufactured by Nippon Steel Works, and an electrolytic copper foil was fitted into the mold to produce a substrate having a length of 150 mm, a width of 150 mm, and a thickness of 2 mm.

<Example 6>
The thermoplastic resin composition was obtained by dry blending 34% by volume of glass fiber (manufactured by Nittobo Co., Ltd., trade name: CS3PE-256) with respect to polyphenylene sulfide resin (manufactured by DIC, trade name: LR100G), and an extruder (Nippon Steel). The mixture was melt-mixed using a trade name, TEX30 twin screw extruder, to produce pellets of the composition.
As the copper foil, an electrolytic copper foil (manufactured by Furukawa Electric Co., Ltd., trade name: GTS-MP 70 μm) having a thickness of 70 μm and a surface roughness (Rz) of 12 μm was used.
Injection molding was performed using a 110 ton injection molding machine manufactured by Nippon Steel Works, and an electrolytic copper foil was fitted into the mold to produce a substrate having a length of 150 mm, a width of 150 mm, and a thickness of 2 mm.

<Example 7>
The thermoplastic resin composition was obtained by dry blending 62% by volume of glass fiber (manufactured by Nittobo Co., Ltd., trade name: CS3PE-256) with respect to polyphenylene sulfide resin (manufactured by DIC, trade name: LR100G), and an extruder (Nihon Steel). The mixture was melt-mixed using a trade name, TEX30 twin screw extruder, to produce pellets of the composition.
As the copper foil, an electrolytic copper foil having a thickness of 35 μm and a surface roughness (Rz) of 9 μm (manufactured by Furukawa Electric Co., Ltd., trade name: GTS-MP 35 μm) was used.
Injection molding was performed using a 110 ton injection molding machine manufactured by Nippon Steel Works, and an electrolytic copper foil was fitted into the mold to produce a substrate having a length of 150 mm, a width of 150 mm, and a thickness of 2 mm.

<Example 8>
The thermoplastic resin composition was obtained by dry blending 37% by volume of silica (manufactured by Tatsumori Co., Ltd., trade name: Furex RD-8) with respect to polyphenylene sulfide resin (manufactured by DIC, trade name: LR100G), and an extruder (Japan). The mixture was melt-mixed with a steelworks company, trade name: TEX30 twin screw extruder, to produce pellets of the composition.
As the copper foil, an electrolytic copper foil having a thickness of 35 μm and a surface roughness (Rz) of 9 μm (manufactured by Furukawa Electric Co., Ltd., trade name: GTS-MP 35 μm) was used.
Injection molding was performed using a 110 ton injection molding machine manufactured by Nippon Steel Works, and an electrolytic copper foil was fitted into the mold to produce a substrate having a length of 150 mm, a width of 150 mm, and a thickness of 2 mm.

<Example 9>
The thermoplastic resin composition was obtained by dry blending 62% by volume of glass fiber (manufactured by Nittobo Co., Ltd., trade name: CS3PE-256) with respect to polyphenylene sulfide resin (manufactured by DIC, trade name: LR100G), and an extruder (Nihon Steel). The mixture was melt-mixed using a trade name, TEX30 twin screw extruder, to produce pellets of the composition.
The copper foil used was an electrolytic copper foil having a thickness of 18 μm and a surface roughness (Rz) of 5 μm (trade name: 3EC-HTE 18 μm, manufactured by Mitsui Kinzoku Mining Co., Ltd.).
Injection molding was performed using a 110 ton injection molding machine manufactured by Nippon Steel Works, and an electrolytic copper foil was fitted into the mold to produce a substrate having a length of 150 mm, a width of 150 mm, and a thickness of 2 mm.

<Comparative Example 1>
The thermoplastic resin composition was obtained by dry blending 34% by volume of glass fiber (manufactured by Nittobo Co., Ltd., trade name: CS3PE-256) with respect to polyphenylene sulfide resin (manufactured by DIC, trade name: LR100G), and an extruder (Nippon Steel). The mixture was melt-mixed using a trade name, TEX30 twin screw extruder, to produce pellets of the composition.
The copper foil used was an electrolytic copper foil (manufactured by Furukawa Electric Co., Ltd., trade name: F0-WS 18 μm) having a thickness of 18 μm and a surface roughness (Rz) of 1.5 μm.
Injection molding was performed using a 110 ton injection molding machine manufactured by Nippon Steel Works, and an electrolytic copper foil was fitted into the mold to produce a substrate having a length of 150 mm, a width of 150 mm, and a thickness of 2 mm.

About the board | substrate produced in the said Examples 1-9 and the comparative example 1, the moldability, the linear expansion coefficient, the copper foil adhesive strength, and the dielectric loss tangent were measured and evaluated as follows. The results are shown in Table 1.
(Formability)
Copper foil was inserted into a 150 mm × 150 mm × 2 mm mold, and the moldability was judged by observing the state when the thermoplastic resin was injection molded. Molding is not possible if the shape cannot be formed and molding is impossible, molding is possible near the limit of molding conditions, and there is no defect such as unfilled molded product, and when molded under normal molding conditions, Those without defects such as unfilling were considered good.
(Linear expansion coefficient)
Measurement was performed in accordance with JIS K7197. The measurement method was a thermomechanical analyzer (TMA apparatus), and the measurement conditions were a temperature rise time of 5 ° C./min. The values below the glass transition temperature are shown in Table 1 for those whose slope changes above the glass transition temperature.
(Copper foil adhesive strength)
Measurement was performed in accordance with JIS C6471. The copper foil width of the sample was 10 mm, and the results of peeling off at an angle of 90 degrees at 50 mm / min are shown in Table 1.
(Dielectric loss tangent)
Measurements were performed according to ASTM D150. The measurement frequency was 1 MHz, and the results at that time are shown in Table 1.

  Although the board | substrate of the comparative example 1 had favorable moldability, its linear expansion coefficient was small and excellent in dimensional stability, since the surface roughness (Rz) was small, the anchor effect was inadequate and copper foil adhesive strength was low. Therefore, there is a possibility that circuit peeling or disconnection occurs. On the other hand, the substrates of Examples 1 to 9 have no problem in formability, have a low coefficient of linear expansion, excellent dimensional stability, and good copper foil adhesion strength, so that occurrence of defective circuit peeling during the etching process is suppressed. Is done. Therefore, it can be seen that the substrates of Examples 1 to 9 are excellent in mass productivity and have characteristics that can be suitably used for antenna parts and the like.

<Example 10>
The thermoplastic resin composition was obtained by dry blending 34% by volume of glass fiber (manufactured by Nittobo Co., Ltd., trade name: CS3PE-256) with respect to polyphenylene sulfide resin (manufactured by DIC, trade name: LR100G), and an extruder (Nippon Steel). The mixture was melt-mixed using a trade name, TEX30 twin screw extruder, to produce pellets of the composition.
As the copper foil, an electrolytic copper foil having a thickness of 35 μm and a surface roughness (Rz) of 9 μm (manufactured by Furukawa Electric Co., Ltd., trade name: GTS-MP 35 μm) was used.
Injection molding was performed using a 110 ton injection molding machine manufactured by Nippon Steel Works, and an electrolytic copper foil was fitted into the mold to produce a substrate having a length of 150 mm, a width of 150 mm, and a thickness of 2 mm.
Next, through holes were formed in the substrate, plated and etched to form a circuit pattern, which was cut into a shape of 15 mm long × 10 mm wide × 2 mm thick by a router.
After dry blending 34% by volume of glass fiber (manufactured by Nittobo Co., Ltd., trade name: CS3PE-256) to polyphenylene sulfide resin (manufactured by DIC, trade name: LR100G), an extruder (manufactured by Nippon Steel Works, trade name) : A TEX30 twin screw extruder) was used to melt and mix the pellets of the thermoplastic resin composition, and the FANUC 50 ton injection molding machine formed the above circuit pattern and cut the substrate with a thickness of 1 mm. Thus, an injection molded part (antenna part) as shown in FIG. 1 was obtained. FIG. 1 is a plan view of an injection-molded component 10, and an injection-molded substrate 20 having a circuit portion 2 formed on a resin portion 1 further has a coating portion 3 coated with a resin composition.

<Comparative Example 2>
A circuit pattern was formed by drilling, plating and etching a 1 mm thick glass epoxy substrate (FR4 substrate) to form a circuit pattern, which was cut into a shape of 15 mm long × 10 mm wide × 2 mm thick by a router.
This component was dry blended with 34% by volume of glass fiber (manufactured by Nittobo Co., Ltd., trade name: CS3PE-256) to polyphenylene sulfide resin (manufactured by DIC, trade name: LR100G), and then an extruder (Nippon Steel Works). The product was made by melting and mixing with a commercial product name: TEX30 twin screw extruder), and coated with a 1 mm thickness by a 50 ton injection molding machine made by FANUC to obtain an antenna component.

The appearance after the heat shock test at 85 to −30 ° C. was repeated 30 times for the antenna parts produced in Example 10 and Comparative Example 2 was evaluated. The results are shown in Table 2.
In the antenna component of Comparative Example 2, cracks occurred in the coating after the heat shock test, while the antenna component of Example 10 had good results with no particular change in appearance.

DESCRIPTION OF SYMBOLS 1 Resin part 2 Circuit part 3 Covering part 10 Injection molded component 20 Injection molding board

Claims (6)

  An injection-molded substrate obtained by injection-molding a thermoplastic resin composition containing 15 to 65% by volume of a filler on an electrolytic copper foil having a surface roughness (Rz) of 2 to 15 μm.   The injection-molded substrate according to claim 1, wherein an adhesive strength between the electrolytic copper foil and the thermoplastic resin composition is 3 N / cm or more. 3. The injection-molded substrate according to claim 1, wherein the thermoplastic resin composition has a linear expansion coefficient of 1.0 × 10 ^{−5 to} 3.0 × 10 ⁻⁵ / ° C. 3.   The injection-molded substrate according to any one of claims 1 to 3, wherein the thermoplastic resin of the thermoplastic resin composition is a polyphenylene sulfide resin or a polyetherimide resin.   The injection molded substrate according to any one of claims 1 to 4, wherein the electrolytic copper foil is etched to form a circuit pattern.   6. An injection-molded part, wherein the injection-molded substrate according to claim 5 is further coated with a thermoplastic resin composition containing 15 to 60% by volume of a filler.

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