JP2011119655A - Printed circuit board and method of manufacturing the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a printed circuit board which allows excellently connecting an electrode terminal of a semiconductor device with a connection pad for the semiconductor device, and a method of manufacturing the same. <P>SOLUTION: A solder resist layer 6 covering on an lower surface side of an insulating substrate 1 fills the inside of a through hole 2 provided in the insulating substrate 1, and the solder resist layer 6 covering on an upper surface of the insulating substrate 1 has an opening for exposing the through hole 2 in a loading section 1a. Alternatively, a thickness in the loading section 1a of the solder resist layer 6 covering on the upper surface of the insulating substrate 1 is thinner than that outside the loading section 1a. Alternatively, a thickness of the solder resist layer 6 covering on the upper surface of the insulating substrate 1 is thinner than that of the solder resist layer 6 covering on the lower surface of the insulating substrate 1. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a wiring board for mounting a semiconductor element and a manufacturing method thereof.

  Conventionally, as shown in FIG. 10, the central portion of the upper surface of an insulating substrate 11 having a large number of through-holes 12 is used as a wiring substrate on which a semiconductor element S having peripherally arranged electrode terminals T is mounted by flip-chip connection. A mounting portion 11 a for mounting the semiconductor element S is provided on the substrate, and a plurality of wiring conductors 13 led out from the upper surface of the insulating substrate 11 to the lower surface through the inside of the through holes 12 are attached. Is disposed as a semiconductor element connection pad 14 for connecting to the electrode terminal T of the semiconductor element S on the outer peripheral portion of the mounting portion 11a, and is disposed as an external connection pad 15 for connecting to an external electric circuit board on the lower surface of the insulating substrate 11. Furthermore, the semiconductor element connection pads 14 and the external connection pads are provided in the upper and lower surfaces of the insulating substrate 11 and the through holes 12. 5 wiring substrate made by depositing a solder resist layer 16 having openings 16a and 16b are exposed has been known.

  In such a wiring board, as shown in FIG. 11, the semiconductor element connection pad 14 provided on the mounting portion 11 a and the electrode terminal T of the semiconductor element S are pressure-contacted to face each other and joined. The semiconductor element S is mounted by filling a sealing resin 17 called underfill between the mounting portion 11a and the mounting portion 11a.

In this conventional wiring board, in order to deposit the solder resist layer 16 on the upper and lower surfaces of the insulating substrate 11 and in the through holes 12, a resin paste having photosensitivity for the solder resist layer is applied by screen printing. 11 is applied to the upper and lower surfaces of the resin 11 and filled into the through-holes 12 at the same time.
A method is employed in which the applied and filled resin paste is exposed and developed so as to have openings 16a and 16b, and is thermally cured and ultraviolet-cured.

  However, in this conventional wiring board, when the solder resist layer 16 is deposited on the upper and lower surfaces of the insulating substrate 11 and in the through hole 12, the resin on the through hole 12 is filled with the resin paste filled in the through hole 12. The paste is pushed outward, and the solder resist layer 16 on the through hole 12 tends to have a convex portion.

  And when the large convex part is formed in the soldering resist layer 16 in the mounting part 11a, when making the electrode terminal T of the semiconductor element S face to face on the semiconductor element connection pad 14 provided in the mounting part 11a, The lower surface of the semiconductor element S and the convex portion of the solder resist layer 16 are in contact with each other. As a result, the electrode terminal T of the semiconductor element S and the semiconductor element connection pad 14 are not firmly pressed together, and the connection between the two is performed satisfactorily. It has the problem that it becomes difficult.

JP 2006-66517 A

  An object of the present invention is to provide a good connection between a semiconductor element electrode terminal and a semiconductor element connection pad in a wiring board on which a semiconductor element having electrode terminals arranged peripherally on the lower surface outer periphery is mounted by flip chip connection. And providing a manufacturing method thereof.

  A first wiring board according to the present invention has a mounting portion on which a semiconductor element is mounted on an upper surface, and an insulating substrate formed with a plurality of through holes from the upper surface including the mounting portion to the lower surface, and the insulating substrate. The insulating substrate has a plurality of semiconductor element connection pads that are attached from the upper surface to the lower surface of the insulating substrate through the inner surface of the through hole, and to which the electrode terminals of the semiconductor element are connected to the outer peripheral portion of the mounting portion. A wiring conductor having an external connection pad to which a wiring conductor of an external electric circuit board is connected to the lower surface of the semiconductor substrate, and exposing the semiconductor element connection pad and the external connection pad in the upper and lower surfaces of the insulating substrate and the through hole. A wiring substrate comprising a solder resist layer deposited so as to fill the inside of the through hole, wherein the through hole Is filled with a solder resist layer deposited on the lower surface side of the insulating substrate, and the solder resist layer deposited on the upper surface of the insulating substrate has an opening that exposes the through hole in the mounting portion. It is characterized by this.

  The second wiring board of the present invention has a mounting portion on which a semiconductor element is mounted on the upper surface, and an insulating substrate in which a plurality of through holes are formed from the upper surface to the lower surface including the mounting portion, and the insulating substrate And a plurality of semiconductor element connection pads to which electrode terminals of the semiconductor element are connected to an outer peripheral portion of the mounting portion. A wiring conductor having an external connection pad to which a wiring conductor of an external electric circuit board is connected to the lower surface of the substrate, and the semiconductor element connection pad and the external connection pad are exposed in the upper and lower surfaces of the insulating substrate and the through hole. And a solder resist layer deposited so as to fill the inside of the through hole, the wiring board comprising: Is filled with a solder resist layer deposited on the lower surface side of the insulating substrate, and the solder resist layer deposited on the upper surface of the insulating substrate has a thickness on the outer side of the mounting portion. It is characterized by being thinner.

  A third wiring board of the present invention has a mounting portion on which a semiconductor element is mounted on the upper surface, and an insulating substrate formed with a plurality of through holes from the upper surface including the mounting portion to the lower surface, and the insulating substrate. The insulating substrate has a plurality of semiconductor element connection pads that are attached from the upper surface to the lower surface of the insulating substrate through the inner surface of the through hole, and to which the electrode terminals of the semiconductor element are connected to the outer peripheral portion of the mounting portion. A wiring conductor having an external connection pad to which a wiring conductor of an external electric circuit board is connected to the lower surface of the semiconductor substrate, and exposing the semiconductor element connection pad and the external connection pad in the upper and lower surfaces of the insulating substrate and the through hole. A wiring substrate comprising a solder resist layer deposited so as to fill the inside of the through hole, wherein the through hole Is filled with a solder resist layer deposited on the lower surface side of the insulating substrate, and the solder resist layer deposited on the upper surface of the insulating substrate is thinner than the solder resist layer deposited on the lower surface. It is characterized by.

  A first method for manufacturing a wiring board according to the present invention has a mounting portion on which a semiconductor element is mounted on an upper surface, and a plurality of through holes are formed from the upper surface to the lower surface including the mounting portion. A step of preparing an insulating substrate having a wiring conductor deposited on the lower surface through the inner surface of the hole; and applying a resin paste for a solder resist layer to the lower surface of the insulating substrate and applying the resin paste from the lower surface side to the through hole Filling in, a step of applying a resin paste for a solder resist layer so as to have an opening exposing the through hole in the mounting portion on the upper surface of the insulating substrate, the upper and lower surfaces of the insulating substrate, and the Wiring attached to the upper surface by curing after exposing and developing the resin paste in the through hole A solder on the upper surface side having an opening for exposing a part of the body to the outer peripheral part of the mounting part as a plurality of semiconductor element connection pads connected to the electrode terminals of the semiconductor element and exposing the through hole in the mounting part Forming a resist layer and a solder resist layer on the lower surface side having an opening that exposes a part of the wiring conductor attached to the lower surface as an external connection pad connected to the wiring conductor of the external electric circuit board; It is characterized by performing in order.

  The second wiring board manufacturing method of the present invention has a mounting portion on which a semiconductor element is mounted on the upper surface, and a plurality of through holes are formed from the upper surface to the lower surface including the mounting portion, and the through-hole is formed from the upper surface. A step of preparing an insulating substrate having a wiring conductor deposited on the lower surface through the inner surface of the hole; and applying a resin paste for a solder resist layer to the lower surface of the insulating substrate and applying the resin paste from the lower surface side to the through hole Filling the inside with a resin paste for the solder resist layer on the upper surface of the insulating substrate, and the mounting portion is thinner than the resin paste applied to the lower surface and the mounting portion is outside the mounting portion. A step of coating so as to be thicker than in the portion, and the upper and lower surfaces of the insulating substrate and the resin in the through hole A portion of the wiring conductor deposited on the upper surface is exposed to the outer peripheral portion of the mounting portion as a plurality of semiconductor element connection pads connected to the electrode terminals of the semiconductor element by curing after the exposure and development of the wafer. A solder resist layer on the upper surface side having an opening to be exposed, and a lower surface side having an opening that exposes a part of the wiring conductor attached to the lower surface as an external connection pad connected to the wiring conductor of the external electric circuit board. And a step of forming a solder resist layer in order.

  According to a third method of manufacturing a wiring board of the present invention, a plurality of through holes are formed from a top surface to a bottom surface including a mounting portion on which a semiconductor element is mounted on the top surface. A step of preparing an insulating substrate having a wiring conductor deposited on the lower surface through the inner surface of the hole; and applying a resin paste for a solder resist layer to the lower surface of the insulating substrate and applying the resin paste from the lower surface side to the through hole Filling the inside, applying a solder resist layer resin paste on the upper surface of the insulating substrate so as to be thinner than the resin paste applied to the lower surface, upper and lower surfaces of the insulating substrate and the One of the wiring conductors deposited on the top surface is cured by exposing and developing the resin paste in the through hole and then curing. A plurality of semiconductor element connection pads connected to the electrode terminals of the semiconductor element, and a solder resist layer on the upper surface side having an opening that is exposed to the outer peripheral portion of the mounting portion, and one of the wiring conductors deposited on the lower surface Forming a solder resist layer on the lower surface side having an opening that exposes the portion as an external connection pad connected to the wiring conductor of the external electric circuit board.

  According to the first wiring board of the present invention, the inside of the through hole is filled with the solder resist layer deposited on the lower surface side of the insulating substrate, and the solder resist layer deposited on the upper surface of the insulating substrate is mounted. Since the through-hole is exposed in the part, the inside of the through-hole is satisfactorily filled with the solder resist, and the solder resist filled in the through-hole protrudes above the through-hole, for example. However, in the mounting portion of the insulating substrate, a large convex portion of the solder resist layer that contacts the lower surface of the semiconductor element to be mounted is not formed. Therefore, when the electrode terminal of the semiconductor element is pressed face-to-face on the semiconductor element connection pad provided in the mounting portion, the lower surface of the semiconductor element and the solder resist layer in the mounting portion do not come into contact with each other. The connection between the terminal and the semiconductor element connection pad can be performed satisfactorily.

  According to the second wiring board of the present invention, the inside of the through hole is filled with the solder resist layer deposited on the lower surface side of the insulating substrate, and the solder resist layer deposited on the upper surface of the insulating substrate is mounted. Because the thickness of the part is thinner than the thickness outside the mounting part, the inside of the through hole is filled with the solder resist well, and even if the solder resist filled in the through hole protrudes over the through hole In the mounting portion of the insulating substrate, a large convex portion of the solder resist layer that contacts the lower surface of the mounted semiconductor element is not formed. Therefore, when the electrode terminal of the semiconductor element is pressed face-to-face on the semiconductor element connection pad provided in the mounting portion, the lower surface of the semiconductor element and the solder resist layer in the mounting portion do not come into contact with each other. The connection between the terminal and the semiconductor element connection pad can be performed satisfactorily.

  According to the third wiring board of the present invention, the inside of the through hole is filled with the solder resist layer deposited on the lower surface side of the insulating substrate, and the solder resist layer deposited on the upper surface of the insulating substrate is the lower surface. The through hole is filled with the solder resist well, and even if the solder resist filled in the through hole protrudes over the through hole, the insulating substrate In the mounting portion, a large convex portion of the solder resist layer that contacts the lower surface of the semiconductor element to be mounted is not formed. Therefore, when the electrode terminal of the semiconductor element is pressed face-to-face on the semiconductor element connection pad provided in the mounting portion, the lower surface of the semiconductor element and the solder resist layer in the mounting portion do not come into contact with each other. The connection between the terminal and the semiconductor element connection pad can be performed satisfactorily.

  According to the first method of manufacturing a wiring board of the present invention, the resin paste for the solder resist layer is applied to the lower surface of the insulating substrate and the resin paste is filled into the through hole from the lower surface side, Since the resin paste for the solder resist layer is applied on the upper surface of the insulating substrate so as to have an opening that exposes the through hole in the mounting portion, the inside of the through hole is satisfactorily filled with the solder resist, and the through hole Even if the solder resist filled inside protrudes through the through-hole, a large convex portion of the solder resist layer is formed in the mounting portion of the insulating substrate so as to be in contact with the lower surface of the mounted semiconductor element. There is no. Therefore, when the electrode terminal of the semiconductor element is pressed face-to-face on the semiconductor element connection pad provided in the mounting portion, the lower surface of the semiconductor element and the solder resist layer in the mounting portion do not come into contact with each other. It is possible to provide a wiring board capable of satisfactorily connecting the terminals and the semiconductor element connection pads.

  According to the second method of manufacturing a wiring board of the present invention, the resin paste for the solder resist layer is applied to the lower surface of the insulating substrate and the resin paste is filled into the through-hole from the lower surface side. A resin paste for the solder resist layer is formed on the upper surface of the insulating substrate so that the mounting portion is thinner than the resin paste applied to the lower surface and is thicker outside the mounting portion than in the mounting portion. Since the inside of the through hole is satisfactorily filled with the solder resist because it is applied, even if the solder resist filled in the through hole protrudes over the through hole, it is mounted on the mounting portion of the insulating substrate. A large convex portion of the solder resist layer that contacts the lower surface of the semiconductor element is not formed. Therefore, when the electrode terminal of the semiconductor element is pressed face-to-face on the semiconductor element connection pad provided in the mounting portion, the lower surface of the semiconductor element and the solder resist layer in the mounting portion do not come into contact with each other. It is possible to provide a wiring board capable of satisfactorily connecting the terminals and the semiconductor element connection pads.

  According to the third method of manufacturing a wiring board of the present invention, a resin paste for a solder resist layer is applied to the lower surface of the insulating substrate, and the resin paste is filled into the through-hole from the lower surface side. Since the resin paste for the solder resist layer is applied to the upper surface of the insulating substrate so as to be thinner than the resin paste applied to the lower surface, the inside of the through hole is satisfactorily filled with the solder resist, and the through hole Even if the solder resist filled inside protrudes through the through-hole, a large convex portion of the solder resist layer is formed in the mounting portion of the insulating substrate so as to be in contact with the lower surface of the mounted semiconductor element. There is no. Therefore, when the electrode terminal of the semiconductor element is pressed face-to-face on the semiconductor element connection pad provided in the mounting portion, the lower surface of the semiconductor element and the solder resist layer in the mounting portion do not come into contact with each other. It is possible to provide a wiring board capable of satisfactorily connecting the terminals and the semiconductor element connection pads.

FIG. 1 is a schematic sectional view showing a first embodiment of a wiring board according to the present invention. FIG. 2 is a schematic cross-sectional view showing a case where a semiconductor element is mounted on the wiring board shown in FIG. FIG. 3 is a schematic cross-sectional view for each step for explaining the method of manufacturing the wiring board shown in FIG. FIG. 4 is a schematic sectional view showing a second embodiment of the wiring board of the present invention. FIG. 5 is a schematic cross-sectional view showing a case where a semiconductor element is mounted on the wiring board shown in FIG. FIG. 6 is a schematic cross-sectional view for each step for explaining the method of manufacturing the wiring board shown in FIG. FIG. 7 is a schematic cross-sectional view showing a third embodiment of the wiring board of the present invention. FIG. 8 is a schematic cross-sectional view showing a case where a semiconductor element is mounted on the wiring board shown in FIG. FIG. 9 is a schematic cross-sectional view for each step for explaining the method of manufacturing the wiring board shown in FIG. FIG. 10 is a schematic cross-sectional view showing a conventional wiring board. 11 is a schematic cross-sectional view showing a case where a semiconductor element is mounted on the wiring board shown in FIG.

  Next, a first embodiment of the wiring board and the manufacturing method thereof according to the present invention will be described with reference to FIGS. As shown in FIG. 1, the wiring substrate of this example is mainly formed of an insulating substrate 1, a wiring conductor 3, and a solder resist layer 6.

  The insulating substrate 1 is made of an electrically insulating material plate that is thermoset by impregnating a glass cloth base material with a thermosetting resin such as an epoxy resin or a bismaleimide triazine resin, and a semiconductor element S is mounted on the center of the upper surface thereof. A plurality of through holes 2 are formed from the upper surface to the lower surface including the mounting portion 1a. Such an insulating substrate 1 is obtained by impregnating a glass cloth base material with an uncured thermosetting resin composition and semi-curing it, and attaching a metal foil to be a part of the wiring conductor 3 on the upper and lower surfaces thereof. It is formed by thermally curing to form an electric insulating material plate, and then drilling the electric insulating material plate together with the upper and lower metal foils and drilling through holes 2.

  A plurality of wiring conductors 3 are attached from the upper surface of the insulating substrate 1 through the inner surface of the through hole 2 to the lower surface. The wiring conductor 3 functions as a conductive path for connecting the electrode terminal T of the semiconductor element S to a wiring conductor of an external electric circuit board (not shown), and the electrode terminal of the semiconductor element S is provided on the outer periphery of the mounting portion 1a on the upper surface of the insulating substrate 1. It has a semiconductor element connection pad 4 to which T is connected, and an external connection pad 5 connected to the wiring conductor of the external electric circuit board on the lower surface of the insulating substrate 1. Such a wiring conductor 3 is made of a good conductive material such as a copper foil or a copper plating layer. For example, a thin copper foil that is a part of the wiring conductor 3 is attached to the upper and lower surfaces of the electrically insulating material plate for the insulating substrate 1. In addition, after forming the through hole 2 together with the copper foil on the electrically insulating material plate, the electroless copper plating is applied to the inner surface of the through hole 2 and the surface of the copper foil, and then the electrolytic copper is deposited on the electroless copper plating. Plating and electrolytic tin plating are applied to a predetermined pattern corresponding to the wiring conductor 3, and then the electroless copper plating and copper foil not selectively covered with tin plating are selectively removed by etching, and finally electrolysis is performed. It is formed by selectively etching away the tin plating on the copper plating.

  A solder resist layer 6 having a thickness of about 20 to 25 μm is deposited on the upper and lower surfaces of the insulating substrate 1 and the inside of the through hole 2 is filled with the solder resist layer 6 deposited on the lower surface side. The semiconductor element connection pads 4 and the external connection pads 5 are exposed from the openings 6 a and 6 b provided in the solder resist layer 6. The solder resist layer 6 is for protecting the wiring conductor 3. For example, electrical insulation in which an inorganic insulating filler such as silicon oxide is dispersed in a photocurable and thermosetting resin substrate such as an acrylic-modified epoxy resin. Made of material. Such a solder resist layer 6 is printed and applied to the upper and lower surfaces of the insulating substrate 1 by printing a resin paste of an electroless material containing, for example, a photosensitive acrylic-modified epoxy resin by a screen printing method. Then, the resin paste is exposed and developed in a predetermined pattern, and then cured by ultraviolet curing and heat curing.

  In the wiring board of this example, the through hole 2 is filled with the solder resist layer 6 deposited on the lower surface side of the insulating substrate 1 and the solder resist layer deposited on the upper surface of the insulating substrate 1. 6 has an opening 6a for exposing the semiconductor element connection pad 4 and exposing the through hole 2 in the mounting portion 1a. Thus, in the wiring substrate of this example, the inside of the through hole 2 is filled with the solder resist layer 6 deposited on the lower surface side of the insulating substrate 1 and the solder resist deposited on the upper surface of the insulating substrate 1. Since the layer 6 has the opening 6a that exposes the semiconductor element connection pad 4 and the through hole 2 in the mounting portion 1a, the solder resist layer 6 on the upper surface side is formed on the through hole 2 in the mounting portion 1a. Even though the through hole 2 is satisfactorily filled with the solder resist layer 6 on the lower surface side, even if the solder resist layer 6 filled in the through hole 6 protrudes over the through hole 2, In the mounting portion 1a of the insulating substrate 1, a large convex portion of the solder resist layer 6 that contacts the lower surface of the semiconductor element S to be mounted. It will not be formed.

  Then, in the wiring board of this example, as shown in FIG. 2, the electrode terminal T of the semiconductor element S is pressed and bonded to the semiconductor element connection pad 4 provided in the mounting portion 1a so as to face each other. The semiconductor element S is mounted by filling a sealing resin 7 called underfill between the element S and the insulating substrate 1. At this time, in the mounting portion 1a of the insulating substrate 1, since the large convex portion of the solder resist layer 6 that contacts the lower surface of the semiconductor element S to be mounted is not formed, according to the wiring substrate of this example, The electrode terminal T of the semiconductor element S and the semiconductor element connection pad 4 can be connected well. At this time, since the sealing resin 7 is filled between the semiconductor element S and the insulating substrate 1, the solder resist layer 6 does not exist on the mounting portion 1a of the insulating substrate 1, but the wiring on the mounting portion 1a. The conductor 3 is well protected by the sealing resin 7.

  Note that the surface of the wiring conductor 3 on the mounting portion 1a except for the semiconductor element connection pads 4 is preferably at least one of a roughened surface and an oxidized surface. The surface of the wiring conductor 3 on the mounting portion 1a excluding the semiconductor element connection pads 4 is set as at least one of a roughened surface and an oxidized surface, whereby the wiring conductor 3 and the sealing resin 7 on the mounting portion 1a are roughened. Or it can adhere | attach very firmly through at least one of an oxidation surface. In this case, a metal having excellent corrosion resistance such as gold is deposited on the surface of the semiconductor element connection pad 4 by plating in order to improve the bonding with the electrode T of the semiconductor element S, or a preflux treatment is performed. It is preferable to give.

  Next, a method for manufacturing the wiring board of the first embodiment described above by the manufacturing method of the present invention will be described with reference to FIG.

  First, as shown in FIG. 3 (a), the semiconductor device has a mounting portion 1a on which a semiconductor element is mounted at the center of the upper surface, and a plurality of through holes 2 are formed from the upper surface to the lower surface including the mounting portion 1a. An insulating substrate 1 having a wiring conductor 3 deposited from the upper surface to the lower surface through the inner surface of the through hole 2 is prepared. At this time, the surface of the wiring conductor 3 is preferably a roughened surface. In order to make the surface of the wiring conductor 3 roughened, for example, a method of roughening the surface of the wiring conductor 3 with an acidic roughening solution containing formic acid is employed.

  Next, as shown in FIG. 3B, a solder paste layer resin paste 6 </ b> P <b> 1 is applied to the lower surface of the insulating substrate 1, and the resin paste 6 </ b> P <b> 1 is filled into the through holes 2. At this time, the resin paste 6 </ b> P <b> 1 filled in the through hole 2 is applied with a thickness that does not protrude significantly from the upper surface side of the insulating substrate 1. A screen printing method is used for application and filling of the resin paste 6P1.

  Next, after drying the lower surface of the insulating substrate 1 and the resin paste 6P1 in the through hole 2, as shown in FIG. 3C, a solder resist layer is formed on the lower surface of the insulating substrate 1 from above the resin paste 6P1. A resin paste 6P2 is applied. By this application, the thickness of the solder resist layer 6 on the lower surface of the insulating substrate 1 can be made sufficiently thick, such as about 20 to 25 μm. If an attempt is made to obtain a solder resist layer 6 having a sufficient thickness on the lower surface of the insulating substrate 1 by applying only the resin paste 6P1 to the lower surface of the insulating substrate 1, the resin paste 6P1 filled in the through hole 2 is insulated. There is a high risk that the substrate 1 protrudes greatly on the upper surface side. Therefore, after applying the resin paste 6P1 to the lower surface of the insulating substrate 1 in such a thin thickness that the resin paste 6P1 filled in the through hole 2 does not protrude greatly to the upper surface side of the insulating substrate 1, and then drying it, It is preferable that the resin paste 6P2 for making the solder resist layer 6 on the lower surface of the insulating substrate 1 have a sufficient thickness is overcoated. The resin paste 6P2 may be the same as the resin paste 6P1. The resin paste 6P2 may be applied by a screen printing method as in the case of the resin paste 6P1, but a screen, a squeegee, or the like used for the screen printing may be different from that in the case of the resin paste 6P1.

  Next, after drying the resin paste 6P2 applied on the resin paste 6P1, as shown in FIG. 3D, an opening 6P3a for exposing the through hole 2 in the mounting portion 1a is formed on the upper surface of the insulating substrate 1. The resin paste 6P3 for the solder resist layer is applied so as to have it. The resin paste 6P3 may be the same as the resin paste 6P1 or 6P2. The resin paste 6P3 may be applied by a screen printing method as in the case of the resin pastes 6P1 and 6P2, but the screen used for the screen printing is a masked portion corresponding to the opening 6P3a.

  Next, after drying the resin paste 6P3 applied to the upper surface of the insulating substrate 1, as shown in FIG. 3E, the resin pastes 6P1, 6P2, and 6P3 are exposed to a predetermined pattern using a photolithography technique. Then, after the development, the semiconductor element connection pad 4 and the solder resist layer 6 on the upper surface side having the opening 6a exposing the through hole 2 in the mounting portion 1a and the external connection pad 5 are exposed by ultraviolet curing and heat curing. By forming the solder resist layer 6 on the lower surface side having the opening 6b to be formed, the wiring board of this example is completed.

  At this time, according to the method of manufacturing the wiring board of this example, the resin pastes 6P1 and 6P2 for the solder resist layer are sequentially applied to the lower surface of the insulating substrate 1 and the resin paste 6P1 is filled into the through holes 2 from the lower surface side. Next, since the resin paste 6P3 for the solder resist layer is applied on the upper surface of the insulating substrate 1 so as to have the opening 6P3a exposing the through hole 2 in the mounting portion 1a, the inside of the through hole 2 is better due to the solder resist 6 Even if the solder resist 6 filled in the through hole 2 protrudes above the through hole 2, the mounting portion 1a of the insulating substrate 1 contacts the lower surface of the semiconductor element S to be mounted. Such a large convex portion of the solder resist layer 6 is not formed. Accordingly, when the electrode terminal T of the semiconductor element S is brought into pressure contact with the semiconductor element connection pad 4 provided in the mounting portion 1a, the lower surface of the semiconductor element S and the solder resist layer 6 in the mounting portion 1a are in contact with each other. Therefore, it is possible to provide a wiring board capable of satisfactorily connecting the electrode terminal T of the semiconductor element S and the semiconductor element connection pad 4.

  The wiring conductor 3 on the mounting portion 1a exposed in the opening 6a preferably has at least one of a roughened surface and an oxidized surface on the surface excluding the semiconductor element connection pads 4. The surface of the wiring conductor 3 on the mounting portion 1a excluding the semiconductor element connection pads 4 is set as at least one of a roughened surface and an oxidized surface, whereby the wiring conductor 3 and the sealing resin 7 on the mounting portion 1a are roughened. Alternatively, it is possible to provide a wiring substrate that can be adhered extremely firmly through at least one of the oxidized surfaces. In order to make the surface of the wiring conductor 3 on the mounting portion 1a exposed in the opening 6a a roughened surface, a method of roughening the surface of the wiring conductor 3 with a roughening solution as described above is employed. Further, in order to make the surface of the wiring conductor 3 on the mounting portion 1a exposed in the opening 6a an oxidized surface, after forming the solder resist layer 6 on the upper and lower surfaces of the insulating substrate 1, the surface of the wiring conductor 3 is oxidized. A method of leaving it in an easy-to-use environment is adopted. In this case, a metal having excellent corrosion resistance such as gold is deposited on the surface of the semiconductor element connection pad 4 by plating in order to improve the bonding with the electrode T of the semiconductor element S, or a preflux treatment is performed. It is preferable to give.

  Next, a second embodiment of the wiring board and the manufacturing method thereof according to the present invention will be described with reference to FIGS. In addition, in this example, the same code | symbol is attached | subjected to the location similar to the above-mentioned 1st embodiment, and the detailed description is abbreviate | omitted in order to avoid complexity.

  As shown in FIG. 4, in the wiring substrate of this example, the inside of the through hole 2 is filled with a solder resist layer 6 deposited on the lower surface side of the insulating substrate 1 and is deposited on the upper surface of the insulating substrate 1. The solder resist layer 6 thus formed has a thickness of about 5 to 11 μm in the mounting portion 1a and is thinner than a thickness of about 20 to 25 μm on the outside thereof. As described above, according to the wiring board of this example, the inside of the through hole 2 is filled with the solder resist layer 6 deposited on the lower surface side of the insulating substrate 1 and is deposited on the upper surface of the insulating substrate 1. Since the thickness of the solder resist layer 6 in the mounting portion 1a is thinner than the thickness on the outside thereof, the inside of the through hole 2 is on the lower surface side even though the solder resist layer 6 in the mounting portion 1a is as thin as 5 to 11 μm. The solder resist layer 6 is satisfactorily filled, and even if the solder resist layer 6 filled in the through hole 6 protrudes over the through hole 2, it is mounted on the mounting portion 1a of the insulating substrate 1. A large convex portion of the solder resist layer 6 that contacts the lower surface of the semiconductor element S is not formed.

  Therefore, according to the wiring board of this example, as shown in FIG. 5, after the electrode terminal T of the semiconductor element S is pressed and bonded to the semiconductor element connection pad 4 provided in the mounting portion 1a facing each other, When the semiconductor element S is mounted by filling the sealing resin 7 between the semiconductor element S and the insulating substrate 1, the mounting portion 1 a of the insulating substrate 1 comes into contact with the lower surface of the mounted semiconductor element S. Since the large convex portion of the solder resist layer 6 is not formed, the electrode terminal T of the semiconductor element S and the semiconductor element connection pad 4 can be connected well. At this time, since the sealing resin 7 is filled between the semiconductor element S and the insulating substrate 1, the solder resist layer 6 on the mounting portion 1a of the insulating substrate 1 is thin, but on the mounting portion 1a. The wiring conductor 3 is well protected by the sealing resin 7.

  Next, a method of manufacturing the wiring board of the second embodiment described above by the manufacturing method of the present invention will be described with reference to FIG.

  First, as shown in FIG. 6 (a), it has a mounting portion 1a on which a semiconductor element is mounted at the center of the upper surface, and a plurality of through holes 2 are formed from the upper surface including the mounting portion 1a to the lower surface, and An insulating substrate 1 having a wiring conductor 3 deposited from the upper surface to the lower surface through the inner surface of the through hole 2 is prepared.

  Next, as shown in FIG. 6B, a solder paste layer resin paste 6 </ b> P <b> 1 is applied to the lower surface of the insulating substrate 1 and the resin paste 6 </ b> P <b> 1 is filled into the through holes 2. At this time, the resin paste 6 </ b> P <b> 1 filled in the through hole 2 is applied with a thickness that does not protrude significantly from the upper surface side of the insulating substrate 1.

  Next, after drying the lower surface of the insulating substrate 1 and the resin paste 6P1 in the through hole 2, as shown in FIG. 6C, a solder resist layer is formed on the lower surface of the insulating substrate 1 from above the resin paste 6P1. A resin paste 6P2 is applied. By this application, the thickness of the solder resist layer 6 on the lower surface of the insulating substrate 1 can be made sufficiently thick, such as about 20 to 25 μm.

  Next, after drying the resin paste 6P2 applied on the resin paste 6P1, the resin paste 6P3 for the solder resist layer is applied to the upper surface of the insulating substrate 1 as shown in FIG. It is applied thinner than the total thickness of the resin pastes 6P1 and 6P2 applied to the lower surface. The thickness of the resin paste 6P3 is preferably about 5 to 11 μm. When the thickness of the resin paste 6P3 is larger than 11 μm, the semiconductor element S and the solder resist layer 6 on the upper surface side of the insulating substrate 1 are formed when the resin paste 6P1 filled in the through hole 2 protrudes from the upper surface of the insulating substrate 1. There is a risk of forming a large convex portion that comes into contact. The inorganic insulating filler contained in the resin paste 6P3 preferably has a particle size of 10 μm or less. If the particle size of the inorganic insulating filler contained in the resin paste 6P3 exceeds 10 μm, the risk of pinholes being formed in the applied resin paste 6P3 increases.

  Next, after drying the resin paste 6P3 applied to the upper surface of the insulating substrate 1, as shown in FIG. 6E, the outer side of the mounting portion 1a on the resin paste 6P3 applied to the upper surface of the insulating substrate 1 is provided. The solder paste layer resin paste 6P4 is applied to the portion. The resin paste 6P4 may be the same as the resin paste 6P1, 6P2, 6P3. The resin paste 6P4 may be applied by screen printing as in the case of the resin pastes 6P1, 6P2, and 6P3. However, the screen used for screen printing uses a masked portion corresponding to the mounting portion 1a. .

  Next, after the resin paste 6P4 applied on the upper surface of the insulating substrate 1 is dried, as shown in FIG. 6F, the resin pastes 6P1, 6P2, 6P3, and 6P4 are applied with a predetermined pattern using a photolithography technique. After the exposure and development, the upper surface side solder resist layer 6 having the opening 6a for exposing the semiconductor element connection pad 4 and the opening 6b for exposing the external connection pad 5 are obtained by ultraviolet curing and thermal curing. The wiring board of this example is completed by forming the solder resist layer 6 on the lower surface side.

  At this time, according to the method of manufacturing the wiring board of this example, the resin pastes 6P1 and 6P2 for the solder resist layer are sequentially applied to the lower surface of the insulating substrate 1 and the resin paste 6P1 is filled into the through holes 2 from the lower surface side. Next, the resin paste 6P3, 6P4 for the solder resist layer is formed on the upper surface of the insulating substrate 1, and the mounting portion 1a is thinner than the total thickness of the resin pastes 6P1 and 6P2 applied to the lower surface of the insulating substrate 1, and the mounting portion. Since the coating is sequentially performed so as to be thicker on the outer side than 1a than on the mounting portion 1a, the inside of the through hole 2 is satisfactorily filled with the solder resist 6, and the solder resist 6 filled in the through hole 2 is formed. Even if it protrudes through the through hole 2, the mounted semiconductor 1 is mounted on the mounting portion 1 a of the insulating substrate 1. Is not a large protrusion of the solder resist layer 6 so as to contact with the lower surface of the element S is formed. Accordingly, when the electrode terminal T of the semiconductor element S is brought into pressure contact with the semiconductor element connection pad 4 provided in the mounting portion 1a, the lower surface of the semiconductor element S and the solder resist layer 6 in the mounting portion 1a are in contact with each other. However, it is possible to provide a wiring board capable of satisfactorily connecting the electrode terminal T of the semiconductor element S and the semiconductor element connection pad 4.

  Next, a third embodiment of the wiring board and the manufacturing method thereof according to the present invention will be described with reference to FIGS. In addition, in this example, the same code | symbol is attached | subjected to the location similar to the above-mentioned 1st and 2nd embodiment example, and in order to avoid complexity, the detailed description is abbreviate | omitted.

  As shown in FIG. 7, in the wiring board of this example, the inside of the through hole 2 is filled with a solder resist layer 6 deposited on the lower surface side of the insulating substrate 1 and is deposited on the upper surface of the insulating substrate 1. The solder resist layer 6 thus formed has a thickness of 5 to 11 μm, and is thinner than the thickness 20 to 25 μm of the solder resist layer 6 deposited on the lower surface of the insulating substrate 1. As described above, according to the wiring board of this example, the inside of the through hole 2 is filled with the solder resist layer 6 deposited on the lower surface side of the insulating substrate 1 and is deposited on the upper surface of the insulating substrate 1. Since the solder resist layer 6 is thinner than the solder resist layer 6 deposited on the lower surface of the insulating substrate 1, the solder resist layer 6 on the upper surface side is as thin as 5 to 11 μm on the through hole 2 in the mounting portion 1a. Nevertheless, the inside of the through hole 2 is satisfactorily filled with the solder resist layer 6 on the lower surface side, and even if the solder resist layer 6 filled in the through hole 6 protrudes over the through hole 2, the insulating substrate In one mounting portion 1a, a large convex portion of the solder resist layer 6 that contacts the lower surface of the semiconductor element S to be mounted is not formed.

  Therefore, according to the wiring board of this example, as shown in FIG. 8, after the electrode terminal T of the semiconductor element S is pressed and bonded to the semiconductor element connection pad 4 provided in the mounting portion 1a facing each other, When the semiconductor element S is mounted by filling a sealing resin 7 called underfill between the semiconductor element S and the insulating substrate 1, the mounting portion 1 a of the insulating substrate 1 has a lower surface of the semiconductor element S to be mounted. Since the large convex portions of the solder resist layer 6 that are in contact with each other are not formed, the electrode terminal T of the semiconductor element S and the semiconductor element connection pad 4 can be well connected. At this time, since the sealing resin 7 is filled between the semiconductor element S and the insulating substrate 1, the solder resist layer 6 on the mounting portion 1a of the insulating substrate 1 is thin, but on the mounting portion 1a. The wiring conductor 3 is well protected by the sealing resin 7.

  Next, a method of manufacturing the wiring board of the third embodiment described above by the manufacturing method of the present invention will be described with reference to FIG.

  First, as shown in FIG. 9 (a), the semiconductor device has a mounting portion 1a on which a semiconductor element is mounted at the center of the upper surface, and a plurality of through holes 2 are formed from the upper surface to the lower surface including the mounting portion 1a. An insulating substrate 1 having a wiring conductor 3 deposited from the upper surface to the lower surface through the inner surface of the through hole 2 is prepared.

  Next, as shown in FIG. 9B, a solder resist layer resin paste 6P1 is applied to the lower surface of the insulating substrate 1, and the resin paste 6P1 is filled into the through holes 2. Next, as shown in FIG. At this time, the resin paste 6 </ b> P <b> 1 filled in the through hole 2 is applied with a thickness that does not protrude significantly from the upper surface side of the insulating substrate 1.

  Next, after drying the lower surface of the insulating substrate 1 and the resin paste 6P1 in the through hole 2, as shown in FIG. 9C, a solder resist layer is formed on the lower surface of the insulating substrate 1 from above the resin paste 6P1. A resin paste 6P2 is applied. By this application, the thickness of the solder resist layer 6 on the lower surface of the insulating substrate 1 can be made sufficiently thick, such as about 20 to 25 μm.

  Next, after drying the resin paste 6P2 applied on the resin paste 6P1, the resin paste 6P3 for the solder resist layer is applied to the upper surface of the insulating substrate 1 as shown in FIG. The resin paste 6P1 and 6P2 applied to the lower surface is applied to a thickness of 5 to 11 μm, which is thinner than the total thickness of 20 to 25 μm. When the thickness of the resin paste 6P3 is larger than 11 μm, the semiconductor element S and the solder resist layer 6 on the upper surface side of the insulating substrate 1 are formed when the resin paste 6P1 filled in the through hole 2 protrudes from the upper surface of the insulating substrate 1. There is a risk of forming a large convex portion that comes into contact. The inorganic insulating filler contained in the resin paste 6P3 preferably has a particle size of 10 μm or less. If the particle size of the inorganic insulating filler contained in the resin paste 6P3 exceeds 10 μm, the risk of pinholes being formed in the applied resin paste 6P3 increases.

  Next, after the resin paste 6P3 applied on the upper surface of the insulating substrate 1 is dried, as shown in FIG. 9E, the resin pastes 6P1, 6P2, 6P3 are exposed to a predetermined pattern using a photolithography technique. Then, after development, the upper surface side solder resist layer 6 having the opening 6a exposing the semiconductor element connection pad 4 and the lower surface side having the opening 6b exposing the external connection pad 5 are exposed by ultraviolet curing and heat curing. The wiring board of this example is completed by forming the solder resist layer 6.

  At this time, according to the method of manufacturing the wiring board of this example, the resin pastes 6P1 and 6P2 for the solder resist layer are sequentially applied to the lower surface of the insulating substrate 1 and the resin paste 6P1 is filled into the through holes 2 from the lower surface side. Next, since the solder paste layer resin paste 6P3 is applied to the upper surface of the insulating substrate 1 so as to be thinner than the total thickness of the resin pastes 6P1 and 6P2 applied to the lower surface of the insulating substrate 1, the through-hole 2 Even if the inside is satisfactorily filled with the solder resist 6 and the solder resist 6 filled in the through hole 2 protrudes over the through hole 2, the semiconductor to be mounted is mounted on the mounting portion 1 a of the insulating substrate 1. A large convex portion of the solder resist layer 6 that contacts the lower surface of the element S is not formed. Accordingly, when the electrode terminal T of the semiconductor element S is brought into pressure contact with the semiconductor element connection pad 4 provided in the mounting portion 1a, the lower surface of the semiconductor element S and the solder resist layer 6 in the mounting portion 1a are in contact with each other. However, it is possible to provide a wiring board capable of satisfactorily connecting the electrode terminal T of the semiconductor element S and the semiconductor element connection pad 4.

DESCRIPTION OF SYMBOLS 1 Insulation board | substrate 1a Mounting part 2 Through-hole 3 Wiring conductor 4 Semiconductor element connection pad 5 External connection pad 6 Solder resist layer 6P1, 6P2, 6P3, 6P4 Resin paste for solder resist layers S Semiconductor element T Semiconductor element electrode terminal

Claims (10)

  An insulating substrate having a mounting portion on which a semiconductor element is mounted on an upper surface, and a plurality of through holes formed from an upper surface including the mounting portion to a lower surface, and the upper surface of the insulating substrate through the inner surface of the through hole A wiring conductor of an external electric circuit board is provided on the lower surface of the insulating substrate and has a plurality of semiconductor element connection pads that are attached to the lower surface of the insulating substrate and are connected to electrode portions of the semiconductor elements on the outer peripheral portion of the mounting portion. A wiring conductor having an external connection pad connected to the semiconductor substrate, an upper and lower surfaces of the insulating substrate, and the through-hole so that the semiconductor element connection pad and the external connection pad are exposed and filled in the through-hole. A wiring board comprising a solder resist layer attached thereto, wherein the through-hole is formed on a lower surface side of the insulating board. Together are filled with been solder resist layer, the wiring board solder resist layer deposited on the upper surface of the insulating substrate is characterized by having an opening that exposes the through hole in the mounting portion.   The wiring board according to claim 1, wherein a surface of the wiring conductor excluding the semiconductor element connection pad in the mounting portion is at least one of a roughened surface and an oxidized surface.   An insulating substrate having a mounting portion on which a semiconductor element is mounted on an upper surface, and a plurality of through holes formed from an upper surface including the mounting portion to a lower surface, and the upper surface of the insulating substrate through the inner surface of the through hole A wiring conductor of an external electric circuit board is provided on the lower surface of the insulating substrate and has a plurality of semiconductor element connection pads that are attached to the lower surface of the insulating substrate and are connected to electrode portions of the semiconductor elements on the outer peripheral portion of the mounting portion. A wiring conductor having an external connection pad connected to the semiconductor substrate, an upper and lower surfaces of the insulating substrate, and the through-hole so that the semiconductor element connection pad and the external connection pad are exposed and filled in the through-hole. A wiring board comprising a solder resist layer attached thereto, wherein the through-hole is formed on a lower surface side of the insulating board. And a solder resist layer deposited on the upper surface of the insulating substrate, wherein the thickness of the mounting portion is thinner than the thickness outside the mounting portion. .   An insulating substrate having a mounting portion on which a semiconductor element is mounted on an upper surface, and a plurality of through holes formed from an upper surface including the mounting portion to a lower surface, and the upper surface of the insulating substrate through the inner surface of the through hole A wiring conductor of an external electric circuit board is provided on the lower surface of the insulating substrate and has a plurality of semiconductor element connection pads that are attached to the lower surface of the insulating substrate and are connected to electrode portions of the semiconductor elements on the outer peripheral portion of the mounting portion. A wiring conductor having an external connection pad connected to the semiconductor substrate, an upper and lower surfaces of the insulating substrate, and the through-hole so that the semiconductor element connection pad and the external connection pad are exposed and filled in the through-hole. A wiring board comprising a solder resist layer attached thereto, wherein the through-hole is formed on a lower surface side of the insulating board. Together they are filled with been solder resist layer, the wiring substrate applied to the solder resist layer on the upper surface of the insulating substrate, characterized in that thinner than the solder resist layer deposited on the lower surface.   A wiring conductor having a mounting portion on which a semiconductor element is mounted on the upper surface, a plurality of through holes formed from the upper surface including the mounting portion to the lower surface, and deposited from the upper surface to the lower surface via the inner surface of the through hole A step of preparing an insulating substrate having the following: applying a resin paste for a solder resist layer to the lower surface of the insulating substrate and filling the resin paste into the through-hole from the lower surface side; and an upper surface of the insulating substrate After applying the resin paste for the solder resist layer so as to have an opening that exposes the through hole in the mounting portion, and after exposing and developing the resin paste in the upper and lower surfaces of the insulating substrate and in the through hole By curing, a part of the wiring conductor deposited on the upper surface becomes an electrode terminal of the semiconductor element. A solder resist layer on the upper surface side having an opening that exposes the through hole in the mounting portion and is exposed to the outer peripheral portion of the mounting portion as a plurality of connected semiconductor element connection pads, and the wiring attached to the lower surface And a step of forming a solder resist layer on the lower surface side having an opening exposing a part of the conductor as an external connection pad connected to the wiring conductor of the external electric circuit board. .   6. The method of manufacturing a wiring board according to claim 5, further comprising a step of making the surface of the wiring conductor excluding the semiconductor element connection pad in the mounting portion at least one of a roughened surface and an oxidized surface.   A wiring conductor having a mounting portion on which a semiconductor element is mounted on the upper surface, a plurality of through holes formed from the upper surface including the mounting portion to the lower surface, and deposited from the upper surface to the lower surface via the inner surface of the through hole A step of preparing an insulating substrate having the following: applying a resin paste for a solder resist layer to the lower surface of the insulating substrate and filling the resin paste into the through-hole from the lower surface side; and an upper surface of the insulating substrate Applying a resin paste for the solder resist layer to be thinner than the resin paste applied to the lower surface in the mounting portion and to be thicker than that in the mounting portion outside the mounting portion; Cured after exposing and developing the resin paste in the upper and lower surfaces of the insulating substrate and in the through hole. Thus, a part of the wiring conductor deposited on the upper surface is exposed on the outer peripheral portion of the mounting portion as a plurality of semiconductor element connection pads connected to the electrode terminals of the semiconductor element. Forming a solder resist layer and a solder resist layer on the lower surface side having an opening that exposes a part of the wiring conductor attached to the lower surface as an external connection pad connected to the wiring conductor of the external electric circuit board; A method of manufacturing a wiring board, wherein the steps are sequentially performed.   In the step of applying the resin paste on the upper surface of the insulating substrate, the mounting portion is applied with the resin paste by a single application, and the outer side of the mounting portion is applied with the resin paste by overcoating. A method for manufacturing a wiring board according to claim 7.   A wiring conductor having a mounting portion on which a semiconductor element is mounted on the upper surface, a plurality of through holes formed from the upper surface including the mounting portion to the lower surface, and deposited from the upper surface to the lower surface via the inner surface of the through hole A step of preparing an insulating substrate having the following: applying a resin paste for a solder resist layer to the lower surface of the insulating substrate and filling the resin paste into the through-hole from the lower surface side; and an upper surface of the insulating substrate After applying the resin paste for the solder resist layer so as to be thinner than the resin paste applied to the lower surface, and exposing and developing the resin paste in the upper and lower surfaces of the insulating substrate and the through hole By curing, a part of the wiring conductor deposited on the upper surface is connected to the electrode terminal of the semiconductor element. A solder resist layer on the upper surface side having an opening exposed to the outer peripheral portion of the mounting portion as a plurality of semiconductor element connection pads, and a part of the wiring conductor deposited on the lower surface is connected to the wiring conductor of the external electric circuit board And a step of forming a solder resist layer on the lower surface side having an opening exposed as an external connection pad, in order.   In the step of applying the resin paste to the lower surface of the insulating substrate and filling the resin paste into the through-hole from the lower surface side, the through-hole is filled with the resin paste by a single coating and the lower surface. The method of manufacturing a wiring board according to claim 5, wherein the resin paste is applied by overcoating.

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