JP2011119551A - Optical member deformation apparatus, optical system, aligner, method of manufacturing device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an optical member deformation apparatus wherein the optical characteristics of an optical member can be adjusted accurately, and to provide an optical system, an aligner, and a method of manufacturing a device. <P>SOLUTION: A mirror deformation apparatus 53 which deforms the shape of a concave mirror 41 includes a second permanent magnet 72 which is fixed to the concave mirror 41, a first permanent magnet 71 which is arranged to face the second permanent magnet 72, and a displacement mechanism 80 which displaces the first permanent magnet 71 so that the relative distance to the second permanent magnet 72 changes based on the driving force transmitted from an actuator 61. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to an optical member deformation apparatus that deforms the shape of an optical member, an optical system including the optical member deformation apparatus, an exposure apparatus including the optical system, and a device manufacturing method using the exposure apparatus.

  In general, in a lithography process for manufacturing a device such as a semiconductor element or a liquid crystal display element, a predetermined pattern formed on a mask such as a reticle or photomask is coated with a resist or the like via a projection optical system. An exposure apparatus that transfers onto a substrate such as a glass plate is used. In such an exposure apparatus, the optical member may be locally deformed when non-uniform thermal expansion is applied to at least some of the optical elements constituting the projection optical system. When the optical member is deformed in this way, the optical characteristics of the projection optical system are changed, and there is a possibility that a poor projection of the pattern image on the substrate may occur. Therefore, a conventional exposure apparatus is known in which a mechanism for positively deforming the shape of the optical member is provided in order to adjust the optical characteristics of the projection optical system (see, for example, Patent Document 1). .

  That is, the exposure apparatus is provided with an electromagnet unit for deforming the mirror (optical member). The electromagnet unit includes a magnetic member attached to the back side of the mirror, and an electromagnet disposed in a non-contact manner with respect to the magnetic member. In this exposure apparatus, the amount of current applied to the electromagnet is changed, and the amount of magnetic force that the electromagnet acts on the magnetic member is adjusted to control the amount of deformation of the mirror by the electromagnet unit. It has become.

JP 2007-316132 A

  By the way, in the above-described exposure apparatus, in order to increase the deformation amount of the mirror by the electromagnet unit, it is necessary to increase the magnitude of the current that is passed through the electromagnet. And if the magnitude | size of the electric current energized to an electromagnet increases, the emitted-heat amount in an electromagnet will increase. Therefore, the exposure apparatus is provided with a cooling jacket for cooling the electromagnet.

  However, in the above-described exposure apparatus, if the cooling jacket generates vibrations as the refrigerant circulates, the vibrations may be propagated from the cooling jacket to the mirror, thereby affecting the optical characteristics of the mirror.

  The present invention has been made in view of such circumstances, and an object of the present invention is to manufacture an optical member deformation apparatus, an optical system, an exposure apparatus, and a device that can adjust the optical characteristics of the optical member with high accuracy. It is to provide a method.

In order to achieve the above object, the present invention adopts the following configuration corresponding to FIGS. 1 to 10 shown in the embodiment.
The optical member deforming device of the present invention is the optical member deforming device (53) for deforming the shape of the optical member (41), the first member (72) fixed to the optical member (41), and the first member. The first member (72) and the second member based on the second member (71) disposed opposite to the member (72) and the driving force transmitted from the driving source (61) A displacement mechanism (80) for displacing one member of (71) such that the relative distance changes with respect to the other member, and one of the first member and the second member. The gist is that the member is a magnetic body or a magnetic field generating member, and the other member is a magnetic field generating member.

  According to the above configuration, one of the first member and the second member is a magnetic body or a magnetic field generating member, and the other member is a magnetic field generating member. A magnetic field is generated between these members. When the first member or the second member is relatively displaced by the displacement mechanism, the magnitude of the magnetic force acting between the first member and the second member changes. Therefore, when the magnetic force acting between the first member and the second member is changed, the member that is relatively displaced by the displacement mechanism does not generate a large amount of heat. Therefore, it is not necessary to provide a cooling device in the vicinity of the member. Therefore, unlike the case where the cooling device is provided, vibration does not propagate from the cooling device to the optical member, and the optical characteristics of the optical member can be adjusted precisely.

  According to the present invention, the optical characteristics of the optical member can be adjusted with high accuracy.

1 is a schematic sectional view of an exposure apparatus according to a first embodiment. 2A is a cross-sectional view taken along line 2a-2a in FIG. 1, and FIG. 2B is a cross-sectional view of the mirror deformation device of the first embodiment. (A) is sectional drawing of the mirror deformation | transformation apparatus of an initial state, (b) is sectional drawing which shows the state which the actuator contracted rather than FIG. 3 (a), (c) has extended the actuator rather than FIG. 3 (a). Sectional drawing which shows a state. (A) is a schematic diagram showing a state in which the concave mirror is distorted and deformed in the + Y direction side, (b) is a schematic diagram showing a state in which the deformation amount of the concave mirror is almost zero, and (c) is a diagram in which the concave mirror is on the −Y direction side. The schematic diagram which shows the state which has carried out distortion deformation. (A) is sectional drawing of the mirror deformation | transformation apparatus which shows the state which extended the spindle part of the micrometer, (b) is sectional drawing of the mirror deformation | transformation apparatus which shows the state which contracted the spindle part of the micrometer. Sectional drawing of the mirror deformation | transformation apparatus of 2nd Embodiment. (A) is a schematic diagram showing a state where the concave mirror is distorted and deformed in the + Y direction side, and (b) is a state where the concave mirror is further distorted and deformed in the + Y direction side than the state shown in FIG. FIG. Sectional drawing of the mirror deformation | transformation apparatus of another embodiment. The flowchart of the manufacture example of a device. The detailed flowchart regarding the board | substrate process in the case of a semiconductor device.

(First embodiment)
Hereinafter, a first embodiment of the present invention will be described with reference to FIGS. In the present embodiment, in FIG. 1, the Z axis is parallel to the first optical axis AX1 of the catadioptric optical system constituting the projection optical system 15 to be described later, and the plane perpendicular to the first optical axis AX1 is in FIG. The Y axis is set parallel to the paper surface, and the X axis is set perpendicular to the paper surface.

  As shown in FIG. 1, the exposure apparatus 11 of the present embodiment illuminates a transmissive reticle R on which a predetermined circuit pattern is formed with exposure light EL, so that the exposure surface Wa (the surface on the + Z direction side) is illuminated. 1 is an apparatus for forming a circuit pattern on a wafer W as a photosensitive substrate having a photosensitive material such as a resist coated on the upper surface in FIG. The exposure apparatus 11 includes an illumination optical system 13 that guides the exposure light EL emitted from the light source device 12 to the irradiated surface Ra (the surface on the + Z direction side) of the reticle R, and a reticle stage 14 that holds the reticle R. , A projection optical system 15 for guiding the exposure light EL transmitted through the reticle R to the exposure surface Wa of the wafer W, and a wafer stage 16 for holding the wafer W are provided. Note that the light source device 12 of this embodiment has an ArF excimer laser light source that outputs light having a wavelength of 193 nm, and light output from the ArF excimer laser light source is guided into the exposure device 11 as exposure light EL.

  A beam matching unit 17 is connected between the light source device 12 and the illumination optical system 13. The beam matching unit 17 optically connects the light source device 12 and the exposure device 11, and guides the exposure light EL emitted from the light source device 12 into the exposure device 11. Note that the spatial region from the light source device 12 to the optical member closest to the reticle R in the illumination optical system 13 is replaced with an inert gas such as helium gas or nitrogen, which is a gas having a low absorption rate of the exposure light EL.

  A stand 18 is provided below the illumination optical system 13. The gantry 18 includes a lower gantry 20 erected on the surface plate 19 and an upper gantry 21 supported on the lower gantry 20. A reticle stage 14 is placed on the upper surface of the upper frame 21. The reticle stage 14 is arranged so that the holding surface 14a for holding the reticle R is parallel to the XY plane. The reticle stage 14 is movable with a predetermined stroke in the Y-axis direction by driving a reticle stage drive unit (not shown). The reticle stage drive unit is also configured to move the reticle stage 14 by a minute amount in the X-axis direction, the Z-axis direction, and the rotation direction around the Z-axis. Then, the exposure light EL emitted from the illumination optical system 13 passes through the reticle R, and then is projected into the gantry 18 through the transmission port 22 formed in the approximate center of the upper wall portion of the upper gantry 21. It is guided to the optical system 15. When the reticle R is illuminated with the exposure light EL, a substantially rectangular illumination region extending in the X-axis direction is formed on a part of the irradiated surface Ra of the reticle R.

  The projection optical system 15 includes a substantially cylindrical upper barrel 23 centered on the first optical axis AX1 of the projection optical system 15 and a substantially cylindrical centered on the second optical axis AX2 orthogonal to the first optical axis AX1. And a substantially cylindrical lower barrel 25 that is disposed on the wafer W side of the upper barrel 23 and that has the first optical axis AX1 as the center. The lower lens barrel 25 passes through an opening 26 formed in the approximate center of the upper wall portion of the lower mount 20 in the vertical direction. These lens barrels 23, 24, 25 are coupled to each other via a coupling member 27. The coupling member 27 is attached near the mouth edge of the opening 26 in the lower gantry 20.

  A cover glass 31 that closes the opening of the upper barrel 23 is provided at the upper end of the upper barrel 23 (the end on the + Z direction side). The exposure light EL guided to the projection optical system 15 passes through the cover glass 31 and enters the upper barrel 23. Further, the lower end portion (the end portion on the −Z direction side) of the upper barrel 23 is inserted into the coupling member 27.

  A plurality of optical members 32 (only one is shown in FIG. 1) held by the upper barrel 23 constitutes a first imaging optical system 33. The first imaging optical system 33 forms a first intermediate image of the circuit pattern of the reticle R inside the upper barrel 23.

  The horizontal barrel 24 has a bottomed cylindrical shape, and the bottom 35 is inserted into the coupling member 27 through an opening 36 formed on the side surface of the coupling member 27. In addition, an opening 47 having a substantially center on the first optical axis AX1 is formed through the upper side wall of the horizontal barrel 24 (that is, the side wall on the upper barrel 23 side). The exposure light EL is incident through the opening 47 from the upper lens barrel 23 side. In addition, an opening 48 having the first optical axis AX1 substantially in the center is formed in the lower side wall of the horizontal barrel 24 (that is, the side wall on the lower barrel 25 side). The exposure light EL is emitted through the opening 48 to the lower lens barrel 25 side. Such a horizontal barrel 24 holds a right-angle reflecting mirror 38 by a bottom portion 35 inserted into the coupling member 27.

  Further, the horizontal lens barrel 24 holds the negative lens 39 and the concave mirror 41 via a holding member 40 fixed to the inner wall of the horizontal lens barrel 24. A held portion 41a (see FIG. 2B) having a substantially annular shape is formed on the side surface of the concave mirror 41, and the holding member of the horizontal barrel 24 holds the concave mirror 41 via the held portion 41a. is doing. As an example, a plurality of (for example, three) holding members 40 of the horizontal barrel 24 are arranged at equal intervals along the circumferential direction around the second optical axis AX2, and a plurality of concave mirrors 41 are provided by the holding member 40. It is held at a point (for example, 3 points).

  A disc-shaped reaction plate 42 having a diameter substantially the same as the inner diameter of the horizontal barrel 24 is provided on the right end side in the horizontal barrel 24 so as to close the opening of the horizontal barrel 24. . A sealing member 43 having a substantially cylindrical shape with a bottom is provided on the right side of the horizontal barrel 24 so as to cover the reaction plate 42 from the outside of the horizontal barrel 24. A predetermined space S is formed between the reaction plate 42 and the bottom wall of the sealing member 43 (the right wall portion in FIG. 1).

  A first optical path folding mirror 44 and a second optical path folding mirror 45 are formed on the right-angle reflecting mirror 38 held by the horizontal barrel 24. The first optical path folding mirror 44 is disposed in the vicinity of the first intermediate image formed by the first imaging optical system 33 and enters the horizontal lens barrel 24 from the first imaging optical system 33 through the opening 47. The exposure light EL to be reflected is reflected substantially at a right angle and guided to the negative lens 39. Further, the second optical path bending mirror 45 reflects the exposure light EL that has passed through the negative lens 39 and is reflected by the concave mirror 41, and then reflected substantially at a right angle after passing through the negative lens 39 again, and through the opening 48, the wafer. Injection to the W side. That is, in the present embodiment, the second imaging optical system 46 is configured by the right-angle reflecting mirror 38, the negative lens 39, and the concave mirror 41 held by the horizontal lens barrel 24. The second imaging optical system 46 forms a second intermediate image of the circuit pattern of the reticle R in the vicinity of the second optical path folding mirror 45 that is in the vicinity of the formation position of the first intermediate image. The second intermediate image is substantially the same size as the first intermediate image, and is a secondary image of the circuit pattern of the reticle R.

  The upper end side of the lower barrel 25 is inserted into the coupling member 27. A cover glass 50 that closes the opening of the lower barrel 25 is provided on the lower end side of the lower barrel 25. The exposure light EL that has passed through the projection optical system 15 passes through the cover glass 50 and is emitted from the projection optical system 15.

  In the lower lens barrel 25, a plurality of optical members 51 (only three are shown in FIG. 1) are held along the first optical axis AX1, and the third imaging optical system 52 is formed by each optical member 51. It is configured. Then, the third imaging optical system 52 is a reduced image of the circuit pattern of the reticle R (an image of the second intermediate image) based on the light beam from the second intermediate image formed by the second imaging optical system 46. The final image of the circuit pattern is formed on the exposure surface Wa of the wafer W. Further, the inside of the projection optical system 15 is in a state of being hermetically sealed by the cover glass 31, the reaction plate 42, and the cover glass 50, and helium gas, nitrogen, or the like, which is a gas having a low absorption rate of the exposure light EL. Replaced with active gas.

  A wafer stage 16 is provided on a surface plate 19 below the projection optical system 15. The wafer stage 16 is arranged so that the holding surface 16a for holding the wafer W is parallel to the XY plane. The wafer stage 16 can be moved in the Y-axis direction by a wafer stage drive unit (not shown). Further, the wafer stage driving unit is configured to move the wafer stage 16 by a minute amount also in the X-axis direction, the Z-axis direction, and the rotation direction around the Z-axis.

  Then, when the circuit pattern of the reticle R is formed on one shot area of the wafer W using the exposure apparatus 11 of the present embodiment, the reticle stage driving unit with the illumination area formed on the reticle R by the illumination optical system 13. , The reticle R held by the reticle stage 14 is moved in the Y-axis direction (for example, from the + Y direction side to the −Y direction side) for each predetermined stroke. At the same time, the wafer stage driving unit drives the wafer W held on the wafer stage 16 in the Y-axis direction at a speed ratio corresponding to the reduction magnification of the projection optical system 15 with respect to the movement of the reticle R along the Y-axis direction. For example, the movement is performed in synchronization with the + Y direction side from the −Y direction side. When the pattern formation on one shot area is completed, the pattern formation on the other shot areas of the wafer W is continuously performed.

  In the exposure apparatus 11 of this embodiment, the optical characteristics of the projection optical system 15 are adjusted by intentionally deforming the shape of the concave mirror 41 held by the horizontal lens barrel 24. Then, next, the mirror deformation | transformation apparatus 53 for changing the shape of the concave mirror 41 is demonstrated.

  2A and 2B, the reaction plate 42 has a plurality of insertion portions 54 (17 in the present embodiment, only one is shown in FIG. 2B) in the thickness direction of the reaction plate 42. It is formed so as to penetrate in the (Y-axis direction). Each insertion portion 54 is formed so as to be evenly distributed over the entire area of the reaction plate 42. In this embodiment, a plurality (17 in this embodiment) of mirror deforming devices 53 are individually inserted into these insertion portions 54. In addition, since each mirror deformation | transformation apparatus 53 has the respectively same structure, only the mirror deformation | transformation apparatus 53 arrange | positioned in the -Y direction side most among these mirror deformation | transformation apparatuses 53 is easy for the understanding of description. This will be described below, and the description of the other mirror deformation device 53 will be omitted.

  As shown in FIG. 2B, the mirror deforming device 53 includes a support member 55 erected from the reaction plate 42 along the second optical axis AX2 of the projection optical system 15, and the support member 55 is In the predetermined space S, it is disposed in the vicinity of the insertion portion 54. As an example, the support member 55 shown in FIG. 2B is disposed on the radially inner side of the insertion portion 54 corresponding to the support member 55 individually. The base end side (the upper end side in FIG. 2B) of the support member 55 is connected to the reaction plate 42 by a bolt 56. The support member 55 is bent at a right angle from the distal end side (the lower end side in FIG. 2B) and extends toward the insertion portion 54 side (the radially outer side in FIG. 2B). And a second extending portion 55b extending from the substantially central position of the proximal end side and the distal end side toward the insertion portion 54 side (radially outward in FIG. 2B). .

  A first connecting member 57 is connected to the first extending portion 55a of the support member 55 via an elastic hinge 58 made of an elastic material. The first connecting member 57 has a substantially L-shaped cross section, and has a bottom portion 57a extending substantially parallel to the extending direction of the first extending portion 55a of the support member 55, and one end side of the bottom portion 57a (FIG. 2 ( b) includes a side portion 57b which is bent substantially vertically from the left end side) and extends substantially parallel to the standing direction of the support member 55. The other end side (the right end side in FIG. 2B) of the bottom 57a of the first connecting member 57 is located on one side (the upper side in FIG. 2B) of the first extending portion 55a and is elastic. The first extending portion 55a is connected to one end side of the first extending portion 55a through the hinge 58 (in FIG. 2 (b), it is radially outward and to the left end side). The first connecting member 57 is relatively displaced with respect to the first extending portion 55a of the support member 55 as the elastic hinge 58 is elastically deformed. In addition, one surface of the bottom portion 57a of the first connecting member 57 is connected to the coil spring 59 on one end side (in the radial direction and on the right end side in FIG. 2B) from the connecting portion with the elastic hinge 58. The first extending portion 55a of the support member 55 is connected to the first extending portion 55a. The coil spring 59 presses the bottom 57a of the first connecting member 57 in the −Y direction.

  The other surface of the bottom portion 57a of the first connecting member 57 is supported via an actuator (for example, a piezoelectric element) 61 at a position between the elastic hinge 58 and the coil spring 59 in the radial direction on one surface. The member 55 is connected to the second extending portion 55b. The actuator 61 is configured to be extendable and contractable along a direction (Y-axis direction) substantially parallel to the second optical axis AX2. The actuator 61 has a base end connected to the second extending portion 55 b and a tip connected to the bottom 57 a of the first connecting member 57. A force is applied to the bottom portion 57 a of the first connecting member 57 from the actuator 61 as the actuator 61 is extended. As a result, the first connecting member 57 is elastically deformed as the elastic hinge 58 is elastically deformed. The hinge 58 swings around the X axis. Further, one end side (the upper end side in FIG. 2B) of the side portion 57b of the first connecting member 57 is connected to the second connecting member 63 via an elastic hinge 62 made of an elastic material. In other words, the connecting portion of the side portion 57 b connected to the second connecting member 63 in the first connecting member 57 swings from the elastic hinge 58 serving as a swing fulcrum, rather than the connecting portion of the bottom portion 57 a connected to the actuator 61. Are relatively far apart in the Z-axis direction, which is the radial direction.

  The second connecting member 63 is disposed at a position closer to the reaction plate 42 in the Y-axis direction than the first connecting member 57, and is formed so that the length in the radial direction is longer than the length in the Y-axis direction. ing. The elastic hinge 62 is connected to a portion of the second connecting member 63 that is radially outward from the center in the radial direction and that is on the + Y direction side of the center in the Y-axis direction. The second connecting member 63 is configured to be displaced relative to the first connecting member 57 as the elastic hinge 62 is elastically deformed. A displacement member 65 is connected to the second connecting member 63 via an elastic hinge 64 made of an elastic material. The elastic hinge 64 is connected to a portion on the inner side in the radial direction from the center in the radial direction in the second connecting member 63 and to a portion on the −Y direction side from the center in the Y-axis direction.

  Further, between the displacement member 65 and the support member 55, the displacement member 65 and the Y axis direction are substantially at the same position, and in the radial direction centered on the second optical axis AX2 (left and right direction in FIG. 2B). An extending flexible member 66 is interposed. The flexible member 66 has high rigidity in the Z-axis direction different from the Y-axis direction along the second optical axis AX2 and in the X-axis direction orthogonal to the Z-axis direction, while the support member 55 is erected. However, it has low rigidity in the Y-axis direction. Therefore, since the flexible member 66 is easily bent and deformed in the Y-axis direction, the displacement member 65 can be freely displaced in the Y-axis direction along the second optical axis AX2 of the projection optical system 15 by the flexible member 66. Is allowed to. On the other hand, since the flexible member 66 hardly deforms (extends) in the X axis direction and the Z axis direction, the displacement member 65 restricts displacement in the XZ plane orthogonal to the Y axis direction by the flexible member 66. It has come to be.

  Further, a displacement amount of the displacement member 65 (more specifically, the displacement member 65 of the displacement member 65 is located at a position facing the displacement member 65 in the X-axis direction orthogonal to the displacement direction (Y-axis direction) of the displacement member 65. A displacement sensor 67 that measures a displacement amount in the Y-axis direction) is provided. The displacement sensor 67 measures the amount of displacement of the displacement member 65 by detecting position information of a scale (not shown) fixed to the displacement member 65, and transmits the measurement result to the control mechanism 68. The control mechanism 68 drives and controls the extension amount of the actuator 61 based on the measurement result received from the displacement sensor 67.

  A coil spring 69 is connected to the displacement member 65 at the same radial position as the insertion portion 54. The coil spring 69 is configured to be extendable in the direction along the second optical axis AX2 of the projection optical system 15. Further, the coil spring 69 is inserted into the horizontal barrel 24 via an insertion portion 54 formed on the reaction plate 42. The coil spring 69 is connected to an intermediate member 70 housed in the horizontal barrel 24.

  The intermediate member 70 has a substantially cylindrical shape and is configured to extend in the Y-axis direction, which is the displacement direction of the displacement member 65. The intermediate member 70 has one end in the longitudinal direction connected to the coil spring 69 and the other end in the longitudinal direction connected to the first permanent magnet 71. A second permanent magnet 72 having a convex portion is fixed (for example, bonded) to the back surface side of the reflecting surface of the concave mirror 41 at a position facing the first permanent magnet 71 in the Y-axis direction. The second permanent magnet 72 is configured so that its size is larger than that of the first permanent magnet 71. And in this embodiment, the 1st permanent magnet 71 and the 2nd permanent magnet 72 make a repulsive force act mutually on the Y-axis direction according to the magnetic field generated by them. That is, the 1st permanent magnet 71 and the 2nd permanent magnet 72 are each arrange | positioned so that those opposing surfaces may become the same pole (for example, N pole).

  Note that the insertion portion 54 of the reaction plate 42 includes a small-diameter portion located on the outer wall surface side (the outer side of the horizontal lens barrel 24 and the lower side in FIG. 2B) and the inner wall surface side (the horizontal lens tube 24 And a large-diameter portion located on the inner side and on the upper side in FIG. That is, an annular support portion 73 is formed on the outer wall surface side in the insertion portion 54. A plurality of (two in the present embodiment) penetrating portions 74 are formed in the supporting portion 73 so as to penetrate the supporting portion 73 in the Y-axis direction, and these penetrating portions 74 are at different circumferential positions. Each is arranged. A micrometer 75 is inserted into each of the through portions 74. A sealing member 76 that seals the inside of the horizontal barrel 24 in an airtight manner is disposed on the inner wall surface side in the insertion portion 54. The sealing member 76 is formed with an insertion hole through which the intermediate member 70 and each micrometer 75 are inserted. Further, the sealing member 76 is made of a thin plate-like elastic material, and can be easily bent and deformed in the Y-axis direction in conjunction with the displacement of the intermediate member 70, thereby inhibiting the displacement of the intermediate member 70. There is no such thing.

  The micrometer 75 has a spindle part 75a and an operation part 75b for adjusting the amount of protrusion of the spindle part 75a in the Y-axis direction. The operation portion 75b is disposed in a predetermined space S, that is, on the outer wall surface side of the reaction plate 42, and the amount of protrusion of the spindle portion 75a changes when the operation portion 75b is rotated. Yes. The micrometer 75 is fixed to the support portion 73 with bolts (not shown) in a state where the spindle portion 75a is inserted into the horizontal lens barrel 24 via the through portion 74. Further, the tip of the spindle portion 75 a in the micrometer 75 (the upper end in FIG. 2B) is connected to the support plate 77. That is, the support plate 77 is supported by the spindle portion 75 a of each micrometer 75 provided in the insertion portion 54 that individually corresponds to the support plate 77. The support plate 77 is displaced in the Y-axis direction as the amount of protrusion of each spindle portion 75a changes.

  The support plate 77 has a substantially annular shape, and a circular insertion hole 77a having a diameter slightly larger than the outer diameter of the intermediate member 70 is formed at a substantially central portion thereof. An intermediate member 70 is inserted into the insertion hole 77 a of the support plate 77 in a manner that allows relative displacement in the Y-axis direction with respect to the support plate 77. A coil spring 78 is interposed between the second permanent magnet 72 bonded to the back surface of the concave mirror 41 and the support plate 77 so as to be attachable and detachable.

  Next, taking as an example the mirror deformation device 53 arranged on the most −Z direction side among the mirror deformation devices 53 configured as described above, the mirror deformation device 53 moves the displacement member 65 in accordance with the extension drive of the actuator 61. The effect | action at the time of displacing is demonstrated below. FIG. 3A shows an initial state in which the actuator 61 is extended by a predetermined amount in the Y-axis direction.

  In such an initial state, as shown in FIG. 3A, the bottom portion 57a of the first connecting member 57 extends substantially parallel to the extending direction of the first extending portion 55a of the supporting member 55, and the first connecting member 57 The side portion 57b of the member 57 is disposed so as to extend substantially parallel to the standing direction of the support member 55. The elastic hinge 58 that connects the first extending portion 55 a of the support member 55 and the bottom portion 57 a of the first connecting member 57, and the elastic hinge that connects the side portion 57 b of the first connecting member 57 and the second connecting member 63. 62 and the elastic hinge 64 that connects the second connecting member 63 and the displacement member 65 have almost zero deformation. Further, the flexible member 66 interposed between the displacement member 65 and the support member 55 is disposed so as to extend substantially parallel to the Z-axis direction, and the amount of deformation thereof is substantially zero.

  Here, as shown in FIG. 3B, it is assumed that the extension amount of the actuator 61 in the Y-axis direction is decreased from the initial state based on the control command from the control mechanism 68. In this case, since the proximal end of the actuator 61 is fixed to the second extending portion 55b of the support member 55, the distal end thereof is displaced to the −Y direction side. Further, one end side of the bottom portion 57 a of the first connecting member 57 is pressed toward the −Y direction side according to the urging force of the coil spring 59 interposed between the first extending portion 55 a of the support member 55.

  Then, since the first connecting member 57 is fixed by the elastic hinge 58 interposed between the first extending portion 55a of the support member 55, the first connecting member 57 has the elastic hinge 58 as a fulcrum. A pressing force is applied from the coil spring 59 so as to rotate the one connecting member 57 counterclockwise when viewed from the + X direction side. Therefore, the elastic hinge 58 is elastically deformed so as to be on the −Z direction side that is opposite to the coil spring 59 when viewed from the elastic hinge 58.

  In this case, the first connecting member 57 rotates toward the + Y direction side while the connecting portion with respect to the second connecting member 63 draws an arcuate trajectory having the elastic hinge 58 as an axis. As a result, the first connecting member 57 is on the −Z direction side and the + Y direction side via the elastic hinge 62 interposed between the first connecting member 57 and the second connecting member 63 (FIG. 3). In (b), the second connecting member 63 is pulled toward the diagonally lower left. In addition, the second connecting member 63 pulls the displacement member 65 in the −Z direction side and the + Y direction side via the elastic hinge 64 interposed between the second connection member 63 and the displacement member 65. It becomes like this. That is, the displacement member 65 is pulled by the second connecting member 63 in a direction away from the support member 55 and away from the reaction plate 42, that is, diagonally to the left in FIG. 3B.

  The flexible member 66 has a structure that hardly deforms in the Z-axis direction in which the displacement member 65 and the support member 55 face each other. Therefore, even if the displacement member 65 is pulled to the −Z direction side by the second connecting member 63, the flexible member 66 hardly deforms (extends) to the −Z direction side, and the −Z of the displacement member 65. Displacement in the direction is restricted. As a result, the first connecting member 57 is relatively displaced in the −Z direction with respect to the support member 55, while the displacement member 65 is hardly displaced in the Z axis direction with respect to the support member 55. That is, the first connecting member 57 is relatively displaced with respect to the displacement member 65 so as to be separated in the Z-axis direction.

  Then, the elastic hinge 62 interposed between the first connecting member 57 and the second connecting member 63 is elastically deformed so as to be on the + Z direction side. As a result, the second connecting member 63 is displaced relative to the first connecting member 57 in the + Z direction side. At the same time, the elastic hinge 64 interposed between the second connecting member 63 and the displacement member 65 is similarly elastically deformed so as to be on the + Z direction side. Further, the second connecting member 63 rotates in the counterclockwise direction when viewed from the + X direction side so as to interlock with the first connecting member 57 according to the elastic restoring force of both the elastic hinges 62 and 64. Thus, even if the positional relationship between the displacement member 65 and the connection members 57 and 63 in the Z-axis direction changes, the connection state of the connection members 57 and 63 and the displacement member 65 is the elasticity of the elastic hinges 62 and 64. It is maintained by the deformation and the rotation of the second connecting member 63.

  On the other hand, the flexible member 66 interposed between the displacement member 65 and the support member 55 has a structure in which the displacement member 65 and the reaction plate 42 are easily bent and deformed in the direction of the Y axis facing each other. Yes. Therefore, when the displacement member 65 is pulled to the + Y direction side by the second connecting member 63, the flexible member 66 is bent and deformed to be on the + Y direction side, so that the displacement member 65 is displaced to the + Y direction side. Permissible.

  Further, as shown in FIG. 3C, it is assumed that the extension amount of the actuator 61 in the Y-axis direction is increased based on the control command from the control mechanism 68. In this case, since the base end of the actuator 61 is fixed to the second extending portion 55b of the support member 55, the tip end is displaced to the + Y direction side. Then, the actuator 61 comes to press the one end side of the bottom portion 57 a of the first connecting member 57 against the urging force of the coil spring 59 in the + Y direction side.

  Then, since the first connecting member 57 is fixed by the elastic hinge 58 interposed between the first extending portion 55a of the support member 55, the first connecting member 57 has the elastic hinge 58 as a fulcrum. A pressing force is applied from the actuator 61 so as to rotate the one connecting member 57 in the clockwise direction when viewed from the + X direction side. Therefore, the elastic hinge 58 is elastically deformed so as to be on the + Z direction side on the actuator 61 side when viewed from the elastic hinge 58.

  In this case, the first connecting member 57 rotates toward the −Y direction side while the connecting portion with respect to the second connecting member 63 forms an arc-shaped trajectory having the elastic hinge 58 as the axis. As a result, the first connecting member 57 is positioned in the + Z direction side and the −Y direction side (diagonally to the right) via the elastic hinge 58 interposed between the first connecting member 57 and the second connecting member 63. The second connecting member 63 is pressed toward the upper side. Further, the second connecting member 63 presses the displacement member 65 in the + Z direction side and the −Y direction side via the elastic hinge 64 interposed between the second connection member 63 and the displacement member 65. To come. That is, the displacement member 65 is pressed by the second connecting member 63 in a direction approaching the support member 55 and in a direction approaching the reaction plate 42.

  At this time, the first connecting member 57 is relatively displaced in the + Z direction side with respect to the support member 55 as the extension amount of the actuator 61 increases, and is connected to the first connecting member 57 via the elastic hinge 62. The second connecting member 63 is also displaced relative to the support member 55 in the + Z direction side. On the other hand, the displacement member 65 is restricted from being displaced in the + Z direction by the flexible member 66. That is, the relative positional relationship of the connecting members 57 and 63 with respect to the displacement member 65 in the Z-axis direction changes. Even in such a situation, the elastic hinges 62 and 64 are elastically deformed so as to be on the −Z direction side, and the second connecting member 63 rotates in conjunction with the first connecting member 57. The connected state of the members 57 and 63 and the displacement member 65 is maintained.

  On the other hand, when the displacement member 65 is pressed to the −Y direction side from the second connecting member 63, the flexible member 66 is bent and deformed so as to be on the −Y direction side. Displacement in the Y direction is allowed.

  In the first connecting member 57, the connecting portion with respect to the second connecting member 63 is far away from the elastic hinge 58 serving as a fulcrum than the connecting portion with respect to the actuator 61. Therefore, the second connecting member 63 connected to the first connecting member 57 and the displacement member 65 connected to the second connecting member 63 are separated from the actuator 61 on the basis of the principle of the lever having the elastic hinge 58 as a fulcrum. The driving force is increased and transmitted respectively. That is, each displacement amount in the Y-axis direction of the second connecting member 63 and the displacement member 65 is larger than the extension amount of the actuator 61. Therefore, in the present embodiment, the displacement transmitted by the support member 55, the elastic hinges 58, 62, 64, the first connecting member 57, and the second connecting member 63 is expanded and transmitted to the displacement member 65. An enlargement mechanism 79 is configured. In the present embodiment, the first permanent magnet is driven by the extension drive of the actuator 61 by the displacement enlarging mechanism 79, the displacement member 65, the coil spring 69, the intermediate member 70, the micrometer 75, the support plate 77, and the coil spring 78. A displacement mechanism 80 for displacing 71 relative to the second permanent magnet 72 is configured.

  Next, an operation when the shape of the concave mirror 41 is deformed with the extension driving of the actuator 61 will be described below. 4A shows an initial state in which the actuator 61 in the mirror deforming device 53 is extended by a predetermined amount in the Y-axis direction. Moreover, when the mirror deformation | transformation apparatus 53 is an initial state, the coil spring 78 interposed by the 2nd permanent magnet 72 and the support plate 77 shall be extended rather than natural length.

  4A, when the mirror deformation device 53 is in the initial state, the coil spring 78 fixes the second permanent magnet 72 in the second permanent magnet 72 and the concave mirror 41 by the biasing force. The tension in the + Y direction side is applied to the vicinity of the position to be applied. As a result, the vicinity of the position where the second permanent magnet 72 is fixed in the concave mirror 41 is distorted and deformed in the + Y direction side.

  Here, as shown in FIG. 4B, it is assumed that the extension amount of the actuator 61 in the Y-axis direction has increased from the initial state based on the control command from the control mechanism 68. Then, since the increase amount of the extension amount of the actuator 61 is enlarged by the displacement enlargement mechanism 79 and transmitted to the displacement member 65, the displacement amount of the displacement member 65 toward the −Y direction side is the + Y direction side of the tip of the actuator 61. More than the amount of displacement. Further, since the intermediate member 70 is connected to the displacement member 65 via the coil spring 78, the intermediate member 70 is displaced in the −Y direction side in conjunction with the displacement member 65. At this time, the first permanent magnet 71 coupled to the intermediate member 70 is integrated with the intermediate member 70 so as to approach the second permanent magnet 72 bonded to the back surface side of the concave mirror 41 in the −Y direction. Displace to the side. Then, a magnetic force (repulsive force) acting on the concave mirror 41 from the first permanent magnet 71 to the second permanent magnet 72 acts as a pressing force. When the magnetic force acting on the second permanent magnet 72 from the first permanent magnet 71 and the tension acting on the second permanent magnet 72 from the coil spring 78 cancel each other, the concave mirror 41 fixes the second permanent magnet 72. The distortion deformation is eliminated due to the decrease in the force applied from the outside in the vicinity of the position to be applied.

  When the first permanent magnet 71 approaches the second permanent magnet 72 and increases the repulsive force against the second permanent magnet 72, the first permanent magnet 71 generates a reaction force from the second permanent magnet 72 toward the + Y direction. receive. At this time, the coil spring 69 interposed between the first permanent magnet 71 and the displacement member 65 is pressed toward the + Y direction by the first permanent magnet 71 and contracts. As a result, the relative displacement amount of the first permanent magnet 71 connected to the coil spring 69 with respect to the second permanent magnet 72 is attenuated as compared with the case where the first permanent magnet 71 is directly connected to the displacement member 65.

  Further, as shown in FIG. 4C, it is assumed that the actuator 61 is further extended in the Y-axis direction based on a control command from the control mechanism 68. Then, the displacement member 65 is further displaced toward the −Y direction side, and the intermediate member 70 connected to the displacement member 65 via the coil spring 69 is also displaced further toward the −Y direction side. At this time, the first permanent magnet 71 is displaced with the intermediate member 70 so as to be closer to the second permanent magnet 72 bonded to the back surface side of the concave mirror 41. Then, the magnetic force (repulsive force) acting on the second permanent magnet 72 from the first permanent magnet 71 is increased, and in the vicinity of the position where the second permanent magnet 72 is bonded on the concave mirror 41, the first permanent magnet 71 changes to the first permanent magnet 71. The magnetic force acting on the second permanent magnet 72 exceeds the tension acting on the second permanent magnet 72 from the coil spring 69. In this case, since the pressing force from the first permanent magnet 71 to the second permanent magnet 72 in the −Y direction side becomes strong, the concave mirror 41 is located near the position where the second permanent magnet 72 is fixed on the −Y direction side. Distorted and deformed.

  By the way, in this embodiment, the tension that the coil spring 78 acts on the second permanent magnet 72 can be changed by operating the micrometer 75. For example, as shown in FIG. 5A, it is assumed that the operation portion 75b of the micrometer 75 is rotated to increase the protruding amount of the spindle portion 75a. In this case, since the micrometer 75 is fixed to the support portion 73 of the reaction plate 42, the micrometer 75 extends so that the tip of the spindle portion 75 a approaches the concave mirror 41. Then, the support plate 77 connected to the tip of the spindle portion 75a is displaced so as to approach the concave mirror 41 as the spindle portion 75a extends. Therefore, the support plate 77 comes close to the second permanent magnet 72 bonded to the back surface side of the concave mirror 41. As a result, the length of the coil spring 78 in the Y-axis direction is shorter than that before the operation of the micrometer 75, and the tension from the coil spring 78 to the + Y direction acting on the second permanent magnet 72 is reduced. . Therefore, when the actuator 61 is driven so that the first permanent magnet 71 approaches the second permanent magnet 72, the vicinity of the position where the second permanent magnet 72 of the concave mirror 41 is bonded is compared with that before the operation of the micrometer 75. And it becomes easy to displace to the -Y direction side. That is, it is possible to coarsely adjust the optical characteristics of the concave mirror 41 as compared to before the micrometer 75 is operated.

  On the other hand, as shown in FIG. 5B, it is assumed that the operation portion 75b of the micrometer 75 is rotated to reduce the protruding amount of the spindle portion 75a. In this case, the tip of the spindle portion 75 a of the micrometer 75 contracts so as to be separated from the concave mirror 41, and the support plate 77 connected to the tip of the spindle portion 75 a is displaced so as to be separated from the concave mirror 41. Therefore, the support plate 77 is displaced so as to be separated from the second permanent magnet 72 bonded to the back surface side of the concave mirror 41. As a result, the length of the coil spring 78 in the Y-axis direction is longer than before the operation of the micrometer 75, and the tension from the coil spring 78 to the + Y direction acting on the second permanent magnet 72 is increased. . Therefore, when the actuator 61 is driven so that the first permanent magnet 71 approaches the second permanent magnet 72, the vicinity of the position where the second permanent magnet 72 is bonded to the concave mirror 41 is compared with that before the operation of the micrometer 75. And it becomes difficult to displace to the -Y direction side. That is, the optical characteristics of the concave mirror 41 can be finely adjusted as compared to before the micrometer 75 is operated.

  That is, the adjustment accuracy of the concave mirror 41 can be changed by rotating the operation portion 75b of the micrometer 75. Therefore, it is possible to quickly and appropriately adjust the optical characteristic of the concave mirror 41, that is, the optical characteristic of the projection optical system 15, as compared with the case where the adjustment accuracy cannot be changed.

Therefore, in this embodiment, the following effects can be obtained.
(1) The first permanent magnet 71 arranged away from the concave mirror 41 can be moved toward and away from the second permanent magnet 72 bonded to the concave mirror 41 by the operation of the displacement mechanism 80. . When the distance between the first permanent magnet 71 and the second permanent magnet 72 changes, the magnitude of the magnetic force applied from the first permanent magnet 71 to the second permanent magnet 72 changes. Therefore, the displacement mechanism 80 changes the distance between the first permanent magnet 71 and the second permanent magnet 72 to adjust the pressing force to the concave mirror 41 that acts from the first permanent magnet 71 via the second permanent magnet 72. By doing so, the optical characteristics of the concave mirror 41 can be adjusted.

  (2) The coil spring 78 applies tension to the second permanent magnet 72 in a direction that causes the second permanent magnet 72 to approach the first permanent magnet 71. Here, when the first permanent magnet 71 is disposed far away from the second permanent magnet 72, the magnetic force (repulsive force) acting on the second permanent magnet 72 from the first permanent magnet 71 is greater than the coil spring. The tension acting on the second permanent magnet 72 from 78 becomes smaller. Then, in the concave mirror 41, the vicinity of the position where the second permanent magnet 72 is bonded is pulled by the coil spring 78 via the second permanent magnet 72 and is deformed and deformed. On the other hand, when the first permanent magnet 71 is displaced in the direction approaching the second permanent magnet 72, the magnetic force (repulsive force) acting on the second permanent magnet 72 from the first permanent magnet 71 is increased from the coil spring 78. 2 It becomes larger than the tension acting on the permanent magnet 72. The vicinity of the position where the second permanent magnet 72 is bonded in the concave mirror 41 is pressed by the first permanent magnet 71 via the second permanent magnet 72 and is deformed and deformed. That is, the concave mirror 41 can be distorted and deformed in both the tensile direction and the pressing direction by relatively displacing the first permanent magnet 71 in the direction in which the first permanent magnet 71 is moved toward and away from the second permanent magnet 72. Accordingly, it is possible to increase the degree of freedom in changing the optical characteristics of the concave mirror 41.

  (3) The micrometer 75 displaces the support plate 77 in a direction in which the support plate 77 is in contact with or separated from the second permanent magnet 72 when the operation unit 75 b is rotated. Therefore, the extension amount of the coil spring 78 interposed between the support plate 77 and the second permanent magnet 72 is adjusted, and the magnitude of the tension acting on the second permanent magnet 72 from the coil spring 78 can be adjusted. it can. Therefore, by adjusting the position of the support plate 77 in the Y-axis direction, the adjustment accuracy when changing the optical characteristics of the concave mirror 41 can be freely set.

  (4) The displacement sensor 67 measures the displacement amount of the displacement member 65 enlarged by the displacement enlargement mechanism 79, and estimates the displacement amount of the first permanent magnet 71 based on the measured displacement amount of the displacement member 65. The displacement amount of the first permanent magnet 71 can be measured with high accuracy. Since the degree of extension of the actuator 61 is controlled based on the measurement result of the displacement sensor 67, the magnitude of the pressing force acting on the concave mirror 41 from the first permanent magnet 71 through the second permanent magnet 72 is increased. The accuracy can be adjusted. Therefore, the shape of the concave mirror 41 can be adjusted precisely, and consequently the optical characteristics of the projection optical system 15 can be adjusted precisely, so that the accuracy of the circuit pattern formed on the wafer W can be improved.

  (5) A coil spring 69 is interposed between the displacement member 65 and the first permanent magnet 71. Then, the force based on the displacement of the displacement member 65 is transmitted to the first permanent magnet 71 while being attenuated by the coil spring 69. Therefore, even when the displacement amount of the displacement member 65 is increased by the displacement expansion mechanism 79, an excessive strain stress acts on the concave mirror 41 from the first permanent magnet 71 via the second permanent magnet 72. Can be avoided.

  (6) The support member 55 supports the first connecting member 57 so as to be swingable about the elastic hinge 58. Here, the first connecting member 57 is configured such that the connecting portion with respect to the second connecting member 63 is farther away from the elastic hinge 58 than the connecting portion with respect to the actuator 61. Then, when the first connecting member 57 swings about the elastic hinge 58, the extension amount of the actuator 61 is the first connecting member 57 and the second connecting member 63 in a state where the displacement amount is enlarged based on the principle of the lever. Is transmitted to the displacement member 65 via. Therefore, a configuration in which the extension amount of the actuator 61 is transmitted to the displacement member 65 in a state where the extension amount of the actuator 61 is enlarged via the first connection member 57 and the second connection member 63 can be easily realized.

  (7) The flexible member 66 defines the displacement direction of the displacement member 65 in one direction along the optical axis of the concave mirror 41 (Y-axis direction). Therefore, the direction of the strain stress acting on the concave mirror 41 from the first permanent magnet 71 through the second permanent magnet 72 is defined in one direction. Therefore, since the deformation amount of the concave mirror 41 based on the strain stress acting on the concave mirror 41 from the first permanent magnet 71 via the second permanent magnet 72 is adjusted more precisely, the optical characteristics of the concave mirror 41 are adjusted with high accuracy. be able to.

  (8) The reaction force received by the displacement enlarging mechanism 79 from the actuator 61 is received by the reaction plate 42. Therefore, the displacement enlarging mechanism 79 can increase the extension amount of the actuator 61 and transmit it to the displacement member 65 while being stably supported by the reaction plate 42.

  (9) The reaction plate 42 is provided with an insertion portion 54 that allows a part of the mirror deformation device 53 to be inserted into the horizontal barrel 24, and the actuator 61 is provided outside the horizontal barrel 24. Yes. Therefore, the actuator 61 and the concave mirror 41 are arranged to be separated from each other with the reaction plate 42 interposed therebetween, and it is possible to suppress the vibration generated from the actuator 61 due to the extension driving of the actuator 61 from being propagated to the concave mirror 41.

  (10) The insertion portion 54 formed on the reaction plate 42 is provided with a sealing member 76 so as to close the space between the mouth of the insertion portion 54 and the mirror deformation device 53. Therefore, the gas outside the horizontal lens barrel 24 is prevented from entering the inside of the horizontal lens barrel 24 via the insertion portion 54 of the reaction plate 42. Similarly, even when outgas is generated from an actuator 61 provided outside the horizontal barrel 24 or an electric wire (not shown) connected to the actuator 61, the outgas passes through the insertion portion 54 of the reaction plate 42. It is avoided to enter the inside of the horizontal barrel 24 via Therefore, these outgasses do not cause fogging due to photochemical reaction on the reflecting surface of the concave mirror 41, and the optical characteristics of the concave mirror 41 can be adjusted with high reliability.

  (11) The horizontal barrel 24 is provided with a sealing member 43 so as to cover the reaction plate 42 from the outside of the horizontal barrel 24. Therefore, it is possible to more reliably avoid the gas outside the exposure apparatus 11 (that is, the atmosphere) from entering the inside of the horizontal barrel 24 via the insertion portion 54 of the reaction plate 42. If the amount of outgas generated from an electric wire (not shown) connected to the actuator 61 is zero or within an allowable range, the sealing member 43 can be omitted. Further, by using both the sealing member 76 and the sealing member 43 in combination, it is possible to more reliably avoid the gas outside the exposure apparatus 11 from entering the inside of the horizontal barrel 24.

  (12) A coil spring 78 is interposed between the second permanent magnet 72 and the support plate 77 so as to be detachable and replaceable. Therefore, by replacing the coil spring 78 with a new coil spring 78 having a different elastic force, the tension (biasing force) applied to the second permanent magnet 72 by the coil spring 78 can be easily changed.

(Second Embodiment)
Next, a second embodiment of the present invention will be described with reference to FIGS. The second embodiment is different from the first embodiment in that an electromagnet 81 is provided instead of the first permanent magnet 71 and a magnetic field is generated between the electromagnet 81 and the second permanent magnet 72. . Therefore, in the following description, parts different from those of the first embodiment will be mainly described, and the same or corresponding member configurations as those of the first embodiment are denoted by the same reference numerals, and redundant description will be omitted. Shall.

  As shown in FIG. 6, a portion corresponding to the support portion 73 in the first embodiment is not provided in the insertion portion 54 of the reaction plate 42 of the present embodiment. A sealing member 76 is disposed on the outer wall surface side (the lower surface side in FIG. 6) in the insertion portion 54. The sealing member 76 is made of a thin plate-like elastic material, and obstructs the expansion and contraction operation of the coil spring 69 by being easily bent and deformed in the Y-axis direction in conjunction with the expansion and contraction operation of the coil spring 69. There is no such thing. And the mirror deformation | transformation apparatus 53 of this embodiment is provided in each position corresponding to these insertion parts 54, respectively.

  In other words, the mirror deforming device 53 includes an intermediate member 70 having a substantially T-shaped cross section disposed on the −Y direction side of the sealing member 76. The intermediate member 70 has a substantially disc-shaped bottom portion 70a formed so as to extend along the XZ plane, and a shaft portion 70b extending from the approximate center of the bottom portion 70a to the + Y direction side. The intermediate member 70 has a bottom portion 70 a connected to the displacement member 65 via a coil spring 69 and a tip end (upper end in FIG. 6) of the shaft portion 70 b connected to the electromagnet 81.

  The electromagnet 81 is disposed so as to face the second permanent magnet 72 bonded to the back surface side of the reflecting surface of the concave mirror 41 in the Y-axis direction. The electromagnet 81 applies a magnetic force to the second permanent magnet 72 in the Y-axis direction according to the magnetic field generated by the coil 82 by energizing the coil 82 accommodated therein.

  Further, a bottomed substantially cylindrical sealing member 83 that is open on the + Y direction side and closed on the −Y direction side is fixed to the bottom portion 70 a of the intermediate member 70 so as to cover the electromagnet 81. The space area surrounded by the sealing member 83 and the bottom portion 70a of the intermediate member 70 is hermetically sealed. A part of the sealing member 83 is arranged so as to cross between the electromagnet 81 and the second permanent magnet 72. However, since the sealing member 83 has a thin film shape, The magnetic force acting between the two permanent magnets 72 is hardly affected.

  Next, an operation when the shape of the concave mirror 41 is deformed with the extension driving of the actuator 61 will be described below. FIG. 7A shows an initial state in which the actuator 61 is extended by a predetermined amount. In this initial state, the coil 82 in the electromagnet 81 is in an energized state, and an attractive force is applied as a magnetic force to the second permanent magnet 72 bonded to the back side of the concave mirror 41.

  In the initial state, as shown in FIG. 7A, the electromagnet 81 is bonded to the concave mirror 41 fixed by the holding member 40 with the second permanent magnet 72 corresponding to the electromagnet 81. An attractive force is applied in the vicinity of the position. Therefore, the vicinity of the position where the second permanent magnet 72 is bonded in the concave mirror 41 is distorted and deformed in the + Y direction side.

  Here, as shown in FIG. 7B, it is assumed that the extension amount of the actuator 61 in the Y-axis direction has decreased from the initial state based on the control command from the control mechanism 68. Then, the displacement member 65 coupled to the actuator 61 via the displacement magnifying mechanism 79 is greatly displaced in the + Y direction side, and the intermediate member 70 coupled to the displacement member 65 via the coil spring 69 is replaced with the displacement member 65. Interlocks with the + Y direction side. At this time, the electromagnet 81 connected to the intermediate member 70 is integrated with the intermediate member 70 and is displaced to the + Y direction side so as to be separated from the second permanent magnet 72 bonded to the back surface side of the concave mirror 41. . Then, the second permanent magnet 72 is displaced in the + Y direction side integrally with the electromagnet 81 so as to maintain the distance from the electromagnet 81 based on the magnetic force (attraction) acting from the electromagnet 81. As a result, the attractive force that acts on the concave mirror 41 from the electromagnet 81 via the second permanent magnet 72 to the + Y direction side increases, so the vicinity of the position where the second permanent magnet 72 is bonded to the concave mirror 41 is on the + Y direction side. Will be further distorted.

  Note that when the attractive force that the electromagnet 81 acts on the second permanent magnet 72 in the + Y direction side is increased, the electromagnet 81 receives a larger reaction force from the second permanent magnet 72 in the −Y direction side. At this time, the coil spring 69 interposed between the electromagnet 81 and the displacement member 65 is pulled by the electromagnet 81 toward the −Y direction side and extends. As a result, the relative displacement amount of the electromagnet 81 connected to the coil spring 69 with respect to the second permanent magnet 72 is attenuated as compared with the case where the electromagnet 81 is directly connected to the displacement member 65.

Therefore, in this embodiment, in addition to the effects (1), (2), (4) to (11) of the first embodiment, the following effects can be obtained.
(13) When the displacement mechanism 80 displaces the electromagnet 81 relative to the second permanent magnet 72, the magnitude of the magnetic force acting between the electromagnet 81 and the second permanent magnet 72 changes. For this reason, when the magnitude of the magnetic force acting between the electromagnet 81 and the second permanent magnet 72 is changed, the magnitude of the current applied to the coil 82 of the electromagnet 81 is not changed. There is no fever. As a result, it is not necessary to provide a cooling device for cooling the electromagnet 81. Therefore, unlike the case where a cooling device is provided, vibration does not propagate from the cooling device to the concave mirror 41, and the optical characteristics of the concave mirror 41 can be precisely adjusted.

  (14) In the electromagnet 81, even when the coil 82 is molded with resin, the outgas generated from the resin is hermetically sealed by the sealing member 83, so the vicinity of the reflective surface of the concave mirror 41 Is rarely reached. Therefore, it is possible to suppress the occurrence of fogging on the reflecting surface of the concave mirror 41 due to the photochemical reaction of the outgas on the reflecting surface of the concave mirror 41, and the optical characteristics of the concave mirror 41 can be precisely adjusted.

The above embodiment may be changed to another embodiment as described below.
-In the said 2nd Embodiment, you may process so that the curvature of the reflective surface of the concave mirror 41 before a deformation | transformation may become smaller than a desired value previously. According to this configuration, since the concave mirror 41 is hardly deformed by the mirror deforming device 53 in the initial state, the curvature of the reflecting surface of the concave mirror 41 is a value smaller than a desired value. Here, it is assumed that the mirror deforming device 53 displaces the electromagnet 81 in the direction away from the concave mirror 41. Then, the attractive force acting on the concave mirror 41 from the electromagnet 81 via the second permanent magnet 72 increases, and the curvature of the reflecting surface of the concave mirror 41 is adjusted to a desired value. Further, it is assumed that the mirror deforming device 53 displaces the electromagnet 81 in the direction away from the concave mirror 41 by the displacement mechanism 80. Then, the attractive force acting on the concave mirror 41 from the electromagnet 81 via the second permanent magnet 72 is further increased, and the curvature of the reflecting surface of the concave mirror 41 is adjusted to a value larger than a desired value. That is, according to this configuration, the mirror deforming device 53 continuously adjusts the curvature of the reflecting surface of the concave mirror 41 before and after the desired value by the displacement mechanism 80 displacing the electromagnet 81 relative to the concave mirror 41. can do.

  In the second embodiment, the mirror deformation device 53 is configured to change the magnitude of the current that is passed through the coil 82 of the electromagnet 81 after the displacement mechanism 80 relatively displaces the electromagnet 81 with respect to the concave mirror 41. Also good. In this case, since the magnitude of the magnetic force acting between the electromagnet 81 and the second permanent magnet 72 changes in the mirror deforming device 53, the attractive force acting on the concave mirror 41 from the electromagnet 81 via the second permanent magnet 72 is changed. The size can be adjusted.

  Further, according to this configuration, in the mirror deforming device 53, the attractive force that acts on the concave mirror 41 from the electromagnet 81 via the second permanent magnet 72 is larger than when the electromagnet 81 is not displaced relative to the concave mirror 41. When adjusting the thickness, the amount of current to be supplied to the coil 82 of the electromagnet 81 is reduced. Accordingly, since the amount of heat generated in the electromagnet 81 is suppressed, it is not necessary to provide a cooling jacket for cooling the electromagnet 81.

  Furthermore, according to this configuration, the mirror deforming device 53 increases the amount of deformation of the concave mirror 41 by causing the displacement mechanism 80 to relatively displace the electromagnet 81 in the direction away from the concave mirror 41, and at the same time, the coil 82 of the electromagnet 81. The amount of deformation of the concave mirror 41 is increased by increasing the amount of current to be energized. Therefore, the deformation amount of the concave mirror 41 can be increased as compared with the case where the electromagnet 81 is not displaced relative to the concave mirror 41.

In each of the above embodiments, the actuator 61 may be a direct-acting MEMS (Micro Electro Mechanical System) or a direct-acting motor.
In each of the above embodiments, the mirror deformation device 53 can adopt any arrangement mode.

In each of the above embodiments, the sealing member 43 may be fixed to the reaction plate 42 so as to cover the mirror deformation device 53 from the outside of the horizontal barrel 24.
In each of the above embodiments, the sealing member 43 disposed so as to cover the mirror deformation device 53 from the outside of the horizontal barrel 24 may be omitted.

  In each of the above embodiments, as illustrated in FIG. 8, the sealing member 76 is between the electromagnet 81 and the second permanent magnet 72 (or between the first permanent magnet 71 and the second permanent magnet 72). You may fix and provide to the horizontal lens tube 24 so that it may cross.

In each of the above embodiments, the mirror deforming device 53 may be configured to be accommodated inside the horizontal barrel 24.
In each of the above embodiments, the displacement magnifying mechanism 79 may be configured to be fixed to the gantry 18 that houses the projection optical system 15 therein.

  In each of the above embodiments, a parallel link mechanism may be employed as a holding mechanism for holding the concave mirror 41, and the parallel link mechanism may be fixedly disposed on the horizontal barrel 24 or the reaction plate 42.

  In the first embodiment, the single coil spring 78 having a size capable of accommodating the first permanent magnet 71 is arranged with the second permanent magnet 72 and the support plate so as to surround the first permanent magnet 71. 77 may be interposed.

  In the first embodiment, a thin plate shim may be interposed between the coil spring 78 and the support plate 77 to adjust the biasing force of the coil spring 78 against the second permanent magnet 72.

  In the first embodiment, the first permanent magnet 71 and the second permanent magnet 72 may be configured to act on each other according to the magnetic field generated by each. In this case, when the concave mirror 41 is distorted and deformed in both the tensile direction and the pressing direction, the coil spring 78 separates the second permanent magnet 72 bonded to the back side of the concave mirror 41 from the first permanent magnet 71. It is desirable to have a configuration that biases in the direction. According to this configuration, the first permanent magnet 71 causes the second permanent magnet 72 to adhere to the concave mirror 41 by applying an attractive force to the second permanent magnet 72 against the biasing force of the coil spring 78. The vicinity of the position can be distorted and deformed in both the tensile direction and the pressing direction.

  In the second embodiment, the electromagnet 81 is adhered to the back side of the concave mirror 41, the second permanent magnet 72 is disposed at a position facing the electromagnet 81, and the displacement mechanism 80 causes the second permanent magnet 72 to be electromagnet. It is good also as a structure displaced in the direction which contacts / separates with respect to 81. FIG.

  -In the said 1st Embodiment, it is good also as a structure which adhere | attaches the magnetic body (for example, metal plate) which has a paramagnetism on the back surface side of the concave mirror 41. FIG. In addition, a magnetic body (for example, a metal plate) having paramagnetism is disposed at a position facing the second permanent magnet 72 bonded to the back side of the concave mirror 41, and the displacement mechanism 80 attaches the magnetic member to the second permanent magnet 72. It is good also as a structure displaced in the direction approaching / separating with respect to.

  In the second embodiment, an urging member that urges the second permanent magnet 72 bonded to the back surface side of the concave mirror 41 in a direction in which the second permanent magnet 72 is separated from the electromagnet 81 may be provided. According to this configuration, the electromagnet 81 can distort and deform the vicinity of the position where the second permanent magnet 72 is bonded in the concave mirror 41 in both the tensile direction and the pressing direction.

-In the said 2nd Embodiment, it is good also as a structure which adhere | attaches the magnetic body (for example, metal plate) which has a paramagnetism on the back surface side of the concave mirror 41. FIG.
In each of the above embodiments, the holding member 40 for holding the concave mirror 41 may be omitted, and the concave mirror 41 may be held by a plurality of mirror deformation devices 53.

  In each of the above embodiments, the object whose shape is deformed by the mirror deforming device 53 is not limited to the concave mirror 41, and may be another optical member constituting the projection optical system 15. Further, various optical members constituting the illumination optical system 13, and the reticle R and the wafer W may be targeted.

  In each of the above embodiments, a displacement sensor for measuring the displacement amount of the intermediate member 70 may be provided, and the control mechanism 68 may be configured to drive and control the extension amount of the actuator 61 based on the measurement result received from the displacement sensor. .

  In each of the above embodiments, the light source device 12 includes, for example, g-line (436 nm), i-line (365 nm), KrF excimer laser (248 nm), F2 laser (157 nm), Kr2 laser (146 nm), Ar2 laser (126 nm), etc. May be a light source capable of supplying The light source device 12 amplifies the infrared or visible single wavelength laser light oscillated from the DFB semiconductor laser or fiber laser, for example, with a fiber amplifier doped with erbium (or both erbium and ytterbium). Alternatively, a light source capable of supplying harmonics converted into ultraviolet light using a nonlinear optical crystal may be used. The light source device 12 may be a light source capable of supplying extreme ultraviolet light, that is, EUV (Extreme Ultraviolet) light having a wavelength of about 100 nm or less in a soft X-ray region.

  In each of the above embodiments, the exposure apparatus 11 manufactures a reticle or mask used in not only a microdevice such as a semiconductor element but also a light exposure apparatus, an EUV exposure apparatus, an X-ray exposure apparatus, and an electron beam exposure apparatus. Therefore, an exposure apparatus that transfers a circuit pattern from a mother reticle to a glass substrate or a silicon wafer may be used. The exposure apparatus 11 is used for manufacturing a display including a liquid crystal display element (LCD) and the like, and is used for manufacturing an exposure apparatus that transfers a device pattern onto a glass plate, a thin film magnetic head, and the like. It may be an exposure apparatus that transfers to a wafer or the like, and an exposure apparatus that is used to manufacture an image sensor such as a CCD.

  In each of the above embodiments, the exposure apparatus 11 is exposed in a state where an arbitrary liquid (for example, pure water) having a refractive index larger than 1.1 is supplied to a predetermined space between the cover glass 50 and the wafer W. A so-called immersion type exposure apparatus may be used.

In each of the above embodiments, the exposure apparatus 11 may be embodied as a step-and-repeat apparatus.
In each of the above embodiments, the present invention may be embodied in a maskless exposure apparatus using a variable pattern generator (for example, DMD (Digital Mirror Device or Digital Micro-mirror Device)).

  Next, an embodiment of a microdevice manufacturing method using the device manufacturing method by the exposure apparatus 11 of the embodiment of the present invention in the lithography process will be described. FIG. 9 is a flowchart illustrating a manufacturing example of a micro device (a semiconductor chip such as an IC or LSI, a liquid crystal panel, a CCD, a thin film magnetic head, a micromachine, or the like).

  First, in step S101 (design step), function / performance design (for example, circuit design of a semiconductor device) of a micro device is performed, and pattern design for realizing the function is performed. Subsequently, in step S102 (mask manufacturing step), a mask (reticle R or the like) on which the designed circuit pattern is formed is manufactured. On the other hand, in step S103 (substrate manufacturing step), a substrate (a wafer W when a silicon material is used) is manufactured using a material such as silicon, glass, or ceramics.

  Next, in step S104 (substrate processing step), using the mask and substrate prepared in steps S101 to S104, an actual circuit or the like is formed on the substrate by lithography or the like, as will be described later. Next, in step S105 (device assembly step), device assembly is performed using the substrate processed in step S104. Step S105 includes processes such as a dicing process, a bonding process, and a packaging process (chip encapsulation) as necessary. Finally, in step S106 (inspection step), inspections such as an operation confirmation test and a durability test of the microdevice manufactured in step S105 are performed. After these steps, the microdevice is completed and shipped.

FIG. 10 is a diagram illustrating an example of a detailed process of step S104 in the case of a semiconductor device.
In step S111 (oxidation step), the surface of the substrate is oxidized. In step S112 (CVD step), an insulating film is formed on the substrate surface. In step S113 (electrode formation step), an electrode is formed on the substrate by vapor deposition. In step S114 (ion implantation step), ions are implanted into the substrate. Each of the above steps S111 to S114 constitutes a pretreatment process at each stage of the substrate processing, and is selected and executed according to a necessary process at each stage.

  When the above-mentioned pretreatment process is completed in each stage of the substrate process, the posttreatment process is executed as follows. In this post-processing process, first, in step S115 (resist formation step), a photosensitive material is applied to the substrate. Subsequently, in step S116 (exposure step), the circuit pattern of the mask is transferred to the substrate by the lithography system (exposure apparatus 11) described above. Next, in step S117 (development step), the substrate exposed in step S116 is developed to form a mask layer made of a circuit pattern on the surface of the substrate. Subsequently, in step S118 (etching step), the exposed member in a portion other than the portion where the resist remains is removed by etching. In step S119 (resist removal step), the photosensitive material that has become unnecessary after the etching is removed. That is, in step S118 and step S119, the surface of the substrate is processed through the mask layer. By repeatedly performing these pre-processing steps and post-processing steps, multiple circuit patterns are formed on the substrate.

  DESCRIPTION OF SYMBOLS 11 ... Exposure apparatus, 15 ... Projection optical system as an optical system, 24 ... Horizontal lens barrel, 41 ... Concave mirror as an optical member, 42 ... Reaction plate as reaction force receiving member, 53 ... Mirror deformation as an optical member deformation | transformation apparatus Device 54 ... Insertion part 55 ... Support member 57 ... First connection member 58 ... Elastic hinge as support part 61 ... Actuator as drive source 63 ... Second connection member 65 ... Displacement member 67 ... Displacement sensor as measurement member, 69 ... Coil spring as reduction mechanism, 71 ... Second permanent magnet as second member and magnetic field generating member, 72 ... Second permanent magnet as second member and magnetic field generating member, 75... Micrometer as urging force adjusting mechanism, 76... Sealing member, 78... Coil spring as urging member, 79. Member and an electromagnet as a magnetic field generating member, 83 ... sealing member, EL ... exposure light as the radiation beam, W ... wafer as an object to be irradiated.

Claims (20)

In the optical member deformation device for deforming the shape of the optical member,
A first member fixed to the optical member;
A second member disposed opposite the first member;
A displacement mechanism for displacing one member of the first member and the second member so that a relative distance changes with respect to the other member based on a driving force transmitted from a driving source; ,
One of the first member and the second member is a magnetic body or a magnetic field generating member, and the other member is a magnetic field generating member. The optical member deformation apparatus according to claim 1,
The optical member deforming device, wherein the displacement mechanism displaces the second member so that a relative distance with respect to the first member changes. The optical member deformation apparatus according to claim 2,
The apparatus for deforming an optical member, wherein the displacement mechanism further includes an urging member that urges the first member with respect to the second member such that a relative distance changes. In the optical member deformation device according to claim 3,
The biasing member is
When a repulsive force acts between the first member and the second member, the first member is urged in a direction to approach the second member, and
An optical member deformation characterized in that when an attractive force acts between the first member and the second member, the first member is urged in a direction in which the first member is separated from the second member. apparatus. In the optical member deformation device according to claim 3 or 4,
The said displacement mechanism is further equipped with the biasing force adjustment mechanism which adjusts the biasing force with respect to the said 1st member by the said biasing member, The optical member deformation | transformation apparatus characterized by the above-mentioned. In the optical member deformation device according to any one of claims 3 to 5,
The urging member is detachable and replaceable, and is an optical member deformation device. In the optical member deformation device according to any one of claims 2 to 6,
The displacement mechanism is
A displacement member coupled to the second member side and displaced based on a driving force transmitted from the driving source;
An optical member deformation apparatus comprising: a connecting member that is displaced based on a driving force from the driving source; and a displacement enlarging mechanism that enlarges a displacement amount of the connecting member and transmits the displacement to the displacement member. In the optical member deformation device according to claim 7,
The displacement enlarging mechanism is configured to include a support member that supports the connecting member via a support portion,
The connecting member is connected to the driving source via the connecting portion, and swings about the support portion based on a driving force from the driving source. The optical member deformation apparatus according to claim 8,
The support member is configured so that a distance between the connection portion of the connection member with respect to the second member and the support portion is greater than a distance between the connection portion of the connection member with respect to the drive source and the support portion. An optical member deforming device that supports a connecting member. The optical member deformation apparatus according to claim 9,
An optical member deforming apparatus, further comprising a measuring member that measures a displacement amount of the displacing member. In the optical member deformation device according to any one of claims 7 to 10,
The displacement mechanism is
A reduction mechanism provided between the second member and the displacement member, further reducing a displacement amount of the displacement member transmitted from the displacement expansion mechanism and transmitting the reduced amount to the second member. An optical member deformation device. In an optical system including a plurality of optical members for guiding light to an irradiated body,
A lens barrel for holding the optical member;
An optical system comprising: the optical member deformation device according to any one of claims 1 to 11, which is provided in the lens barrel and deforms at least a part of a shape of the optical member. The optical system according to claim 12, wherein
An optical system further comprising a reaction force receiving member coupled to a displacement enlarging mechanism for enlarging a displacement amount of the one member and receiving a reaction force from the drive source transmitted through the displacement enlarging mechanism. system. The optical system according to claim 13.
The reaction force receiving member constitutes at least a part of a wall surface that partitions the inside and outside of the lens barrel,
An optical system, wherein the reaction force receiving member is provided with an insertion portion that allows the displacement mechanism to be inserted inside the lens barrel. The optical system according to claim 14.
The optical system, wherein the drive source is provided outside the lens barrel. The optical system according to claim 14 or 15,
An optical system, further comprising: a sealing member provided between a mouth edge of the insertion portion and the displacement mechanism, which seals the inside of the lens barrel. The optical system according to claim 16, wherein
An optical system characterized in that a part of the sealing member crosses between the first member and the second member. The optical system according to claim 17,
The optical system, wherein the sealing member is fixed to the reaction force receiving member. The optical system according to any one of claims 13 to 18, comprising:
An exposure apparatus that irradiates an irradiated body with a radiation beam through an optical member held by the lens barrel and forms a predetermined pattern on the irradiated body. In a device manufacturing method including a lithography process,
A device manufacturing method using the exposure apparatus according to claim 19 in the lithography process.

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