JP2011118163A - Optoelectric module, method of manufacturing the same, and photoelectric module substrate - Google Patents

Abstract

Provided is an optoelectric module that can be efficiently manufactured and can be easily used for assembling an optoelectric module substrate.
An optical waveguide is formed on one surface of a support substrate, optical elements are mounted on one side and the other side of the optical waveguide, respectively, and connected to one surface of the support substrate. The pads 12a and 14b for mounting are formed on the other surface of the patterns 12a and 12b in electrical connection with the connection patterns 12a and 12b, and the optical waveguide 24 includes the first cladding layer 18a and the cores 20a and 20b. The second cladding layer 18b is formed by laminating, and the optical elements 32a and 32b are aligned with the cores 20a and 20b on the second cladding layer 18b which is the surface layer of the optical waveguide 24, and the connection pattern 12a, It is mounted in electrical connection with 12b.
[Selection] Figure 9

Description

  The present invention relates to a photoelectric module used for signal transmission between electronic components using light, a method for manufacturing the same, and a photoelectric module substrate using the photoelectric module.

  As a module substrate for transmitting a signal between semiconductor integrated circuits (ICs), a substrate using a method for transmitting a signal using light has been studied. In the signal transmission method using light, the electrical signal output from the first IC is converted into an optical signal, the converted optical signal is transmitted through an optical waveguide, and the transmitted optical signal is converted into an electrical signal. Convert and input to the second IC. In the case of this transmission method, it is necessary to incorporate an optical waveguide into the module substrate. Conventionally, an optical fiber is used as the optical waveguide, or an optical waveguide is disposed inside or on the substrate, and between the ICs via the optical waveguide. A method for transmitting a signal has been proposed.

JP 2007-4043 A JP 2009-229962 A

An optoelectric module substrate with an optical waveguide includes an optoelectric module composed of multiple components such as an optical waveguide, an optical element (light emitting / receiving element), a driver IC, and an amplifier IC, enabling mass production of the optoelectric module substrate. To achieve this, it is necessary to enable mass production of the assembly parts of the photoelectric module substrate and to facilitate handling when mounting the assembly parts.
INDUSTRIAL APPLICABILITY The present invention makes it possible to efficiently manufacture an optoelectric module composed of a plurality of parts, and by making the optoelectric module into parts, the optoelectricity can be easily used for assembling an optoelectric module substrate. It is an object of the present invention to provide a module, a manufacturing method thereof, and an optoelectric module substrate using the optoelectric module.

In order to achieve the above object, the present invention comprises the following arrangement.
That is, for the photoelectric module, an optical waveguide is formed on one surface of the support substrate, and optical elements are mounted on one side and the other side of the optical waveguide, respectively, and a connection pattern is formed on one surface of the support substrate. However, a mounting pad is formed on the other surface in electrical connection with the connection pattern, and the optical waveguide is formed by laminating a first cladding layer, a core, and a second cladding layer, The optical element is mounted on the second cladding layer, which is a surface layer of the optical waveguide, so as to be positioned at a predetermined position with respect to the core and electrically connected to the connection pattern. It is characterized by that.

  In addition, an end surface, which is a light incident surface, is perpendicular to the longitudinal direction of the core (advancing direction of the optical signal), and a surface facing the end surface is inclined toward the optical element. A groove serving as a surface is formed, and the inclined surface is formed as a mirror. The inclined surface becomes a mirror surface when a highly reflective metal such as gold is deposited by sputtering or the like. A mirror surface can be formed by a core base material without depositing a mirror material such as gold.

In addition, as a method for manufacturing an optoelectric module, a large-sized support substrate is formed in which a connection pattern is formed on one surface and a mounting pad is formed on the other surface in electrical connection with the connection pattern. A step of coating the one surface of the support substrate with a first cladding layer, a step of forming a core layer on the first cladding layer, patterning the core layer, and individual unit substrates A step of forming a core for each of the steps, and a step of forming a groove in the end surface, which is a light incident surface of the core, perpendicular to the longitudinal direction of the core, and a surface facing the end surface is an inclined surface. A step of processing the inclined surface as a mirror, a step of burying the grooved core and covering the surface of the substrate with a second cladding layer, the first cladding layer and the first 2 clad layers before Forming a connection wiring electrically connected to the connection pattern, dividing the large substrate on which the second cladding layer is formed into individual unit substrates, and dividing the unit substrate into individual unit substrates And a step of mounting an optical element by being electrically connected to the connection wiring.
In the step of forming the connection wiring, operations in the conventional manufacturing process of the wiring substrate such as via drilling and formation of a conductor layer by plating can be used.

In addition, as a process using the inclined surface as a mirror, it is effective to deposit gold on the inclined surface in that the reflectance of gold is high and that the gold is excellent in environmental resistance.
In the step of forming the connection wiring, a via that is electrically connected to the connection pattern is formed in the first cladding layer and the second cladding layer, and the surface of the second cladding layer is formed with the via. A connection pad connected to the optical element is formed.
Further, as a subsequent step of the step of forming the connection wiring, a step of covering the surface of the second cladding layer with a protective film is provided. When light does not pass through the protective film in the wavelength region used by the optical element, the protective film at the portion where the protective film and light intersect is removed to form an opening.

  Further, as an optoelectric module substrate, an optical waveguide on a mounting substrate, an optoelectric module in which an optical element is mounted on one side and the other side of the optical waveguide, a semiconductor package, the optoelectric module, and the semiconductor package A driver IC or an amplifier IC interposed between the optical module and the photoelectric module, an optical waveguide is formed on one surface of the support substrate, a connection pattern is formed on one surface of the support substrate, and the other A mounting pad is formed on the surface in electrical connection with the connection pattern, the optical waveguide is formed by laminating a first clad layer, a core, and a second clad layer, and the optical element is And mounted on the second cladding layer, which is a surface layer of the optical waveguide, so as to be positioned at a predetermined position with respect to the core and electrically connected to the connection pattern. It is a sign.

  The optoelectric module according to the present invention is provided with an optical waveguide supported on a support substrate and an optical element mounted on the second clad layer that is a surface layer of the optical waveguide, and thus has good handleability, It can be suitably used as a mounting component to be mounted on the photoelectric module substrate. In addition, according to the method for manufacturing an optoelectric module according to the present invention, the optoelectric module can be easily mass-produced using equipment used for manufacturing a conventional wiring board.

It is sectional drawing (a) and the top view (b) of the support substrate of a photoelectric module. It is sectional drawing of the state in which the 1st clad layer was formed. It is sectional drawing of the state in which the core layer was formed. It is sectional drawing (a) and the top view (b) of the state which patterned the core layer and formed the core. It is sectional drawing (a) and the top view (b) of the state which formed the groove | channel for mirror formation in the core. It is sectional drawing (a) and the top view (b) of the state which formed the mirror. It is sectional drawing (a) in the state where the 2nd clad layer was formed, and AA line sectional view (b) of Drawing 7 (a). It is sectional drawing (a) and the top view (b) of the state which formed the connection pad and the via | veer. It is sectional drawing (a) and a top view (b) of a photoelectric module. It is explanatory drawing which shows the method of forming an optoelectric module from a large-sized board | substrate. It is sectional drawing (a) and a top view (b) of a photoelectric module substrate. It is sectional drawing (a) and the top view (b) of the modification of an optoelectric module board | substrate. It is a top view which shows the other example of an optoelectric module board | substrate. It is a top view which shows the other example of an optoelectric module board | substrate.

Hereinafter, first, a method for manufacturing an optoelectric module according to the present invention will be described.
In the method for manufacturing an optoelectric module according to the present invention, an optoelectric module is manufactured by a manufacturing method in which a large-sized substrate is processed and a large number of unit substrates are taken as an optoelectric module, in the same manner as a conventional wiring substrate manufacturing process Manufacturing.
1 to 9 show a manufacturing process of a large-sized photoelectric module. These drawings show the configuration of one unit substrate portion of a large-sized substrate.

(Support substrate manufacturing process)
FIGS. 1A and 1B show a state in which a support substrate 11 serving as a support for the photoelectric module is formed. The support substrate 11 is formed with connection patterns 12a and 12b electrically connected to the optical element on one surface (surface on which the optical element is mounted) of the resin substrate 10, and the mounting pad 14a and the like on the other surface. 14b is formed, and the connection patterns 12a and 12b and the pads 14a and 14b are electrically connected through a conductive portion (through hole) 16 that penetrates the resin substrate 10 in the thickness direction.
As shown in FIG. 1B, the support substrate 11 of the present embodiment is formed by exposing four connection patterns 12a and 12b on one side and the other side across the region where the optical waveguide is formed. Is. The arrangement positions and the number of arrangement of the connection patterns 12a and 12b are set according to the terminal positions and the number of terminals of the optical elements mounted on the photoelectric module.

The support substrate 11 can be manufactured by a general method for manufacturing a wiring substrate in which a wiring pattern is formed on both surfaces of the substrate and a conductive portion that penetrates the substrate in the thickness direction is provided. For example, after forming a through hole by drilling or the like at a position of the resin substrate 10 where the connection patterns 12a and 12b and the pads 14a and 14b are formed, and plating the inner side surface of the through hole to form the conductive portion 16, A conductive layer is formed on both surfaces of the substrate by plating or the like, and if necessary, the through hole is filled with an insulating resin, and the conductive layer is subjected to pattern etching, whereby the connection pattern 12a is electrically connected by the conductive portion 16. , 12b and pads 14a, 14b.
The method of forming the connection patterns 12a and 12b, the pads 14a and 14b, and the conductive portion 16 is not limited to the above example, and a method of using a double-sided copper-clad substrate in which a copper foil is coated on both surfaces of the resin substrate is also possible. The connection patterns 12a and 12b and the pads 14a and 14b can be formed by other manufacturing processes such as a semi-additive method.

  The manufacturing process of the support substrate 11 including the connection patterns 12a and 12b, the pads 14a and 14b, and the conductive portion 16 is exactly the same as the manufacturing process of a general wiring board, and uses a conventional facility for manufacturing a wiring board. Can be manufactured. Moreover, the substrate material conventionally used for a printed circuit board etc. can be used also about the resin board | substrate etc. which are used for manufacture of the support substrate 11. FIG.

(Step of forming the first cladding layer)
Next, the entire surface on which the connection patterns 12a and 12b are formed (one surface of the resin substrate 10) is covered with a first cladding layer 18a, which is a cladding portion of the optical waveguide (FIG. 2).
The first cladding layer 18a is formed by laminating a resin film having light transmittance in the wavelength region used by the optical element so as to cover the entire surface of one surface of the resin substrate 10. Instead of laminating the resin film, the first clad layer 18a can be formed in a paste form as a clad material or by coating the resin material.

(Process of forming the core layer)
Next, the core layer 20 serving as the core of the optical waveguide is formed on the surface of the first cladding layer 18a (FIG. 3). The core layer 20 is formed by laminating a resin film serving as a core so as to cover the entire surface of the first cladding layer 18a. Instead of using a resin film, the core layer 20 can also be formed by coating a paste-like core material. The core layer 20 is patterned by exposure and development operations to form an optical waveguide core 20a. Therefore, a core material having the same photosensitivity as the photosensitive resist is used for the core layer 20.

  The core of the optical waveguide needs to have a higher refractive index in the operating wavelength range than the clad material. For the core material forming the core layer 20, a material having optical transparency in the wavelength region of the optical element and having a higher refractive index in the wavelength region of the optical element than that of the cladding is selected and used. The resin material for clad and core can be appropriately selected from commercially available resin materials.

(Process of patterning the core layer)
FIG. 4 shows a state in which the core layer 20 is patterned to form the cores 20a and 20b. 4A is a cross-sectional view, and FIG. 4B is a plan view. Since the cores 20a and 20b are formed by exposing and patterning the core layer 20, by appropriately setting a pattern for exposing the core layer 20, the core layer 20 is exposed to an arbitrary pattern to have an arbitrary planar arrangement. The cores 20a and 20b can be formed.

In FIG. 4, connecting connection patterns 12a and 12b facing each other of connection patterns 12a and 12b (pad portions of the connection patterns are arranged at the apexes of a square) arranged on one side and the other side across the optical waveguide are connected. A pair of cores 20a and 20b are formed in a linear arrangement. In this example, an optical waveguide including two (two-channel) cores 20a and 20b is formed. However, according to the exposure and development operations, the cores can be formed in an arbitrary number.
The operation of exposing and developing the core layer 20 is an operation of exposing and developing a large substrate (work) in a lump like the exposure and development operations on the wiring board. Can be formed.
In a state where the core layer 20 is patterned and only the cores 20a and 20b are left on the first cladding layer 18a, the cores 20a and 20b have a rectangular cross-sectional shape.

(Process of forming a mirror)
Next, a mirror is built in the cores 20a and 20b. This mirror is for optically connecting the core and the optical element.
FIG. 5 shows a state in which the grooves 21 that are inclined by 45 degrees are formed in the cores 20a and 20b (groove forming step). As shown in FIG. 5A, in the groove 21, the end surfaces of the cores 20a and 20b are perpendicular to the longitudinal direction of the cores 20a and 20b, and the surface facing the end surfaces of the cores 20a and 20b is a 45-degree inclined surface. It becomes. The 45-degree inclined surface is opened upward (on the side opposite to the first cladding layer 18a) and is inclined 45 degrees with respect to the longitudinal direction of the cores 20a and 20b. Note that the cores 20a and 20b illustrated in FIG. 5 are final core portions that actually transmit light, and the cores 20a and 20b illustrated in FIG. 4 are in a state before the final core portions are formed.

The groove 21 is formed by using a cutting blade having a single-edged cutting blade capable of cutting at 0 degree and 45 degrees. When the groove 21 is formed, the tip of the cutting blade enters the first cladding layer 18a, and the groove 21 is formed so that the cores 20a and 20b are separated in the longitudinal direction to become a single core part. To do.
In FIG. 5B, in the region where the cores 20a and 20b are formed, the groove 21 is formed in the entire thickness direction, and in the region where the first cladding layer 18a is exposed, the tip of the cutting blade is It shows that the groove 21a is formed only in the part that has passed.
The operation of processing the grooves 21 in the cores 20a and 20b can also be processed in a lump by positioning and passing the cutting blade with respect to a large-sized substrate.
As a method for forming the groove, instead of using a cutting blade, it is also possible to use a method of physically or chemically etching into a deformed V shape in which one side is a vertical surface. Moreover, a cutting blade and laser processing can also be used together.

FIG. 6 shows a state in which the mirror 22 is formed by sputtering gold on the 45-degree inclined surface of the groove 21 formed by groove processing (step of forming a mirror).
By exposing the region of the groove 21 where the mirror is formed and masking the region other than the region to be mirrored and sputtering gold onto the exposed surface of the groove 21, the 45-degree inclined surface of the groove 21 is made the mirror 22. Can do. In FIG. 6B, the sputtering region is slightly wider than the 45-degree inclined surface so that the gold is surely deposited on the entire 45-degree inclined surface of the cores 20a and 20b even if the mask is slightly displaced. This is an example in which gold is deposited by setting.

The reason why the mirror 22 is formed by sputtering gold on a 45-degree inclined surface is that gold is excellent in light reflection characteristics and environmental resistance. Metals other than gold, such as aluminum, can also be used for the mirror 22.
The method of forming the mirror 22 is not limited to the sputtering method, and an evaporation method, a plating method, or the like can also be used. Even when sputtering, plating, or the like is used, the mirror 22 can be collectively formed on the 45-degree inclined surface of the core formed on the large substrate by sputtering the large substrate. .

(Step of forming the second cladding layer)
After forming the mirror, the entire surface of the large substrate (work) is covered with the second cladding layer 18b (FIG. 7). The second cladding layer 18b is formed using the same material as the first cladding layer 18a described above. The second cladding layer 18b is formed by setting the thickness so that the cores 20a and 20b are completely buried in the thickness direction. The second clad layer 18b can be formed by laminating a clad material formed in the form of a resin film, or can be formed by coating a paste-like clad material.

By covering the cores 20a and 20b with the second clad layer 18b, the cores 20a and 20b are surrounded by the first clad layer 18a and the second clad layer 18b, as shown in FIG. 7B. The state, that is, the optical waveguide 24 centered on the core and covered with the clad by the clad is formed.
The mirror 22 is sealed by the second cladding layer 18b, and the mirror 22 is prevented from being exposed to the external environment, and the environmental resistance of the mirror 22 is improved.

(Process of forming connection wiring)
After forming the second cladding layer 18b, connection pads 27a and 27b for mounting optical elements are formed on the surface of the second cladding layer 18b. The connection pads 27a and 27b are electrically connected to the connection patterns 12a and 12b through the vias 26 (FIG. 8).
In order to form the connection pads 27a and 27b that are electrically connected to the connection patterns 12a and 12b, the first cladding layer 18a and the second cladding layer 18b are penetrated in the thickness direction, and the connection patterns 12a and 12b are formed on the bottom surface. And via pads 26, the connection pads 27a and 27b may be formed by electrical connection to the connection patterns 12a and 12b through the vias 26 by a subtractive method or a semi-additive method.

When forming a via hole, the via hole is formed so as to penetrate the second cladding layer 18b and the first cladding layer 18a from above the second cladding layer 18b using, for example, a CO2 laser.
In order to form the via 26 and the connection pads 27a and 27b by the semi-additive method, a step of forming a plating seed layer on the bottom surface of the via hole, the inner surface and the surface of the second cladding layer 18b by electroless copper plating, plating A step of forming a resist pattern in which the portions for forming the connection pads 27a and 27b are exposed on the surface of the seed layer, electrolytic copper plating using the plating seed layer as a plating power feeding layer, and via holes and exposed portions of the plating seed layer It can be formed by a step of raising plating, a step of removing the resist pattern after plating, and a step of removing the resist pattern by etching to remove the exposed portion of the plating seed layer.

A method of forming via holes in the first clad layer 18a and the second clad layer 18b and forming the connection pads 27a and 27b electrically connected to the lower connection patterns 12a and 12b is the same as that of a general wiring board. In the manufacturing process, this is the same as the method of electrically connecting the wiring patterns between the layers through vias.
After forming the connection pads 27a and 27b, a necessary surface treatment such as nickel plating gold plating can be performed in the same manner as in the manufacturing process of the conventional wiring board. Further, the surface of the second cladding layer 18b may be covered with a protective film such as a solder resist so that the connection pads 27a and 27b are exposed on the outer surface.

(Process for mounting optical elements)
FIG. 9 shows a state where the optical element 32 is mounted by being electrically connected to the connection pads 27a and 27b, and the photoelectric module 30 is completed. In FIG. 9B, the mounting positions of the optical elements 32a and 32b are indicated by broken lines.
The optical elements 32a and 32b are mounted by aligning the mirror 22 and the planar position of the light receiving and emitting elements formed on the optical elements 32a and 32b, and joining the connection pads 27a and 27b with solder 33. Since the optical elements 32 a and 32 b are aligned and mounted at positions on one side and the other side across the optical waveguide 24, the optical module 30 is optically connected to the optical elements 32 a and 32 b via the optical waveguide 24. To be provided.

The optoelectric module 30 is formed as a module component in which an optical waveguide 24 is provided on one surface of the support substrate 11 and optical elements 32 a and 32 b are mounted on a clad layer of the surface layer constituting the optical waveguide 24.
The light projected from the cores 20a and 20b of the optical waveguide 24 and the light incident on the cores 20a and 20b pass through the cladding layer (second cladding layer 18b) on the surface layer side and are incident on the optical elements 32a and 32b. The
The surface of the second clad layer 18b is covered and protected by a solder resist 28, but an opening 28a is provided in the solder resist 28 at a portion where light is transmitted between the optical elements 32a and 32b and the mirror 22. This prevents light transmission from being hindered. If the solder resist 28 is transparent in the wavelength range of the optical elements 32a and 32b, it is not necessary to provide the opening 28a. The lower surface of the support substrate 11 is also covered with a solder resist 29, and solder balls 34 are joined to the pads 14a and 14b as connection terminals for mounting.

  The optoelectric module 30 shown in FIG. 9 shows a state formed as an independent individual module product. In the actual process, as shown in FIG. 10A, the unit substrate 30a is separated into individual pieces from the large substrate 35 in which the unit substrates 30a to be the photoelectric modules 30 are arranged in the vertical and horizontal directions (FIG. 10A). 10 (b), the optical elements 32a and 32b are mounted on each separated unit substrate 30a to form the photoelectric module 30 (FIG. 10C).

  As shown in FIG. 10, a manufacturing method using a large substrate 35 and finishing the substrate in a state in which the optical elements 32a and 32b are mounted to obtain a large number of unit substrates 30a is the same as the conventional wiring substrate manufacturing process. It is based on the same manufacturing process, and an optoelectric module can be manufactured using the manufacturing equipment of a wiring board. According to this manufacturing method, the optoelectric module can be mass-produced, and the manufacturing cost of the optoelectric module can be efficiently reduced.

(Optoelectric module board)
11A and 11B are a cross-sectional view and a plan view of the photoelectric module substrate 40 assembled using the photoelectric module 30, respectively. The optoelectric module substrate 40 has the optoelectric module 30 mounted on the element mounting surface of the mounting substrate 42. The driver IC 44a, the amplifier IC 44b, and the semiconductor packages 46a and 46b are disposed on one side and the other side of the optoelectric module 30. It is mounted and assembled.
The optoelectric module 30 is mounted by bonding solder balls 34 as connection terminals to the electrodes of the mounting substrate 42. The semiconductor packages 46a and 46b are formed by mounting electronic components 461 and 462 such as logic semiconductors and ASICs, and are mounted on the mounting substrate 42 with the electronic components mounted on the package substrate.

The photoelectric module substrate 40 shown in FIG. 11 avoids disturbance to signal transmission from the outside because the signal transmission between the semiconductor packages 46a and 46b is performed via the photoelectric module 30 containing the optical waveguide 24. It is provided as a module substrate capable of high-speed signal transmission.
A characteristic configuration of the photoelectric module substrate 40 shown in FIG. 11 is that the photoelectric module 30 is handled and mounted as a mounting component similar to the semiconductor packages 46a and 46b, the driver IC 44a, and the amplifier IC 44b. . The optoelectric module 30 can be easily handled as a mounting component incorporating the optical waveguide 24, and various types of optoelectric module substrates can be assembled in combination with a semiconductor package.

FIG. 12 is a modification of the photoelectric module substrate 40 shown in FIG. In the photoelectric module board 40 shown in FIG. 11, the conversion ICs 44a and 44b are mounted on the mounting board 42. However, in the photoelectric module board 401 shown in FIG. 12, the driver IC 44a and the driver are added to the semiconductor packages 47a and 47b. IC44b is installed.
The semiconductor package to be mounted on the mounting substrate 42 can be designed to mount a plurality of electronic components on the package substrate, and it is easy to mount the plurality of components to the form of FIG.

(Another example of optoelectric module board)
13 and 14 show another example of the photoelectric module substrate assembled using the photoelectric module 30. FIG.
The photoelectric module substrate 402 shown in FIG. 13 is assembled by arranging four semiconductor packages 48a, 48b, 48c, and 48d in a quadrangular arrangement (arrangement of lattice point positions) and arranging the photoelectric module 30 between adjacent semiconductor packages. This is an example.
The photoelectric module substrate 403 shown in FIG. 14 has four semiconductor packages 49a, 49b, 49c, and 49d arranged in parallel (side by side), and is arranged in series on one side of the arrangement direction of the semiconductor packages 49a to 49d. This is an example in which 30 is arranged and assembled. The optoelectric module 30 is connected to the respective semiconductor packages 49a to 49d via a driver IC / amplifier IC 45 and a bridge IC 50.
As described above, when the photoelectric module 30 according to the present invention is used, the photoelectric module substrate can be assembled in accordance with various arrangements of the semiconductor packages.

DESCRIPTION OF SYMBOLS 10 Resin board | substrate 11 Support substrate 12a, 12b Connection pattern 14a, 14b Pad 16 Conductive part 18a 1st cladding layer 18b 2nd cladding layer 20 Core layer 20a, 20b Core 21 Groove 22 Mirror 24 Optical waveguide 27a, 27b Connection pad 30 Photoelectric module 30a Unit substrate 32a, 32b Optical element 35 Large format substrate 40, 401, 402, 403 Photoelectric module substrate 42 Mounting substrate 44a Driver IC
44b Amplifier IC
46a, 46b, 47a, 47b, 48a, 48b, 48c, 48d, 49a, 49b, 49c, 49d Semiconductor package

Claims (8)

An optical waveguide is formed on one surface of the support substrate, and optical elements are respectively mounted on one side and the other side of the optical waveguide,
A connection pattern is formed on one surface of the support substrate, and a mounting pad is electrically connected to the connection pattern on the other surface,
The optical waveguide is formed by laminating a first cladding layer, a core, and a second cladding layer,
The optical element is mounted on the second cladding layer, which is a surface layer of the optical waveguide, in alignment with the core and electrically connected to the connection pattern. . The core has a groove in which an end surface, which is a light incident surface, becomes a vertical surface with respect to the optical signal traveling direction of the core, and a surface facing the end surface becomes an inclined surface opened toward the optical element. And
The photoelectric module according to claim 1, wherein the inclined surface is formed as a mirror. Forming a large-sized support substrate in which a connection pattern is formed on one surface and a mounting pad is electrically connected to the connection pattern on the other surface;
Covering the one surface of the support substrate with a first cladding layer;
Forming a core layer on the first cladding layer;
Patterning the core layer and forming a core for each unit substrate;
A step of forming a groove on the core, where an end surface that is a light incident surface is a surface perpendicular to the longitudinal direction of the core and a surface that faces the end surface is an inclined surface;
A step of processing the inclined surface as a mirror;
Burying the grooved core and covering the surface of the substrate with a second cladding layer;
Forming a connection wiring electrically connected to the connection pattern on the first cladding layer and the second cladding layer;
Dividing the large substrate on which the second cladding layer is formed into individual unit substrates;
And a step of mounting an optical element on the unit substrate that is electrically connected to the connection wiring.   4. The method of manufacturing an optoelectric module according to claim 3, wherein gold is deposited on the inclined surface as a process using the inclined surface as a mirror. In the step of forming the connection wiring,
Forming a via electrically connected to the connection pattern in the first cladding layer and the second cladding layer, and forming a connection pad connected to the optical element on the surface of the second cladding layer; 5. The method of manufacturing an optoelectric module according to claim 3 or 4.   The photoelectric module according to claim 3, further comprising a step of covering a surface of the second cladding layer with a protective film as a subsequent step of the step of forming the connection wiring. Production method.   The step of mounting the optical element on the unit substrate includes mounting the mirror formed on the core and the planar position of the light emitting / receiving element of the optical element in alignment with each other. The manufacturing method of the photoelectric module as described in any one of Claims. On the mounting board,
An optical waveguide, a photoelectric module in which an optical element is mounted on one side and the other side of the optical waveguide, a semiconductor package, and a driver IC or an amplifier IC interposed between the photoelectric module and the semiconductor package Installed,
The photoelectric module is
An optical waveguide is formed on one side of the support substrate,
A connection pattern is formed on one surface of the support substrate, and a mounting pad is electrically connected to the connection pattern on the other surface,
The optical waveguide is formed by laminating a first cladding layer, a core, and a second cladding layer,
The optical element is mounted on the second cladding layer, which is a surface layer of the optical waveguide, in alignment with the core and electrically connected to the connection pattern. substrate.

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