JP2011114050A - Structure for mounting electronic component - Google Patents

Abstract

A component can be mounted on both sides using a relatively inexpensive non-through-hole type double-sided substrate.
A non-through-hole type double-sided printed circuit board 1 having a conductor pattern and a flow soldering land 6 on one side and a conductor pattern and a hand soldering land 3 on the opposite component mounting surface is used. The jumper wire 2 is mounted on the component mounting surface, the lead wire 5 is passed through the component mounting hole 11 penetrating both surfaces, the jumper wire lead wire is soldered to a predetermined flow soldering land, and the flow solder surface The electronic component 4 is mounted from the side, the lead wire of the electronic component is passed through the hole penetrating both surfaces, and the electronic component lead wire is manually soldered to the hand soldering land provided on the component mounting surface side, and the jumper The lines are also hand-soldered to the hand-soldering lands provided on the component mounting surface to electrically connect the patterns on both the front and back surfaces.
[Selection] Figure 1

Description

  The present invention relates to a mounting structure for mounting electronic components on both sides of a printed circuit board.

  Conventionally, this type of mounting technology is printed at a predetermined solder connection position on a double-sided through-hole board where a conductor pattern is formed on both sides and the conductor pattern on the front and back is electrically connected with a conductor such as copper. The surface mount type electronic components are mounted on the cream solder, and the electronic components are mounted on both sides by a method of melting and soldering the cream solder in a reflow furnace. Also, in a single-sided printed circuit board, electronic components to be mounted on the component mounting surface are large in size or high in height. For the convenience of the structure that houses the printed circuit board, flow soldering (on the surface of the molten solder tank) The method of automatic soldering by sliding the surface of the printed circuit board on the soldering surface side) Mounting the component from the surface side, and the lead of the electronic component mounted from the flow soldering surface on the jumper wire mounted on the component mounting surface ( Some have electronic components mounted on both sides by soldering the connection terminals) (see, for example, Patent Document 1).

  FIG. 6 shows a conventional mounting structure described in Patent Document 1. In FIG. As shown in FIG. 6, it is comprised from the printed wiring board 1, the jumper wire 2, the hand solder 3, the flow solder 6, and the electronic component 4 mounted in the flow solder surface side.

JP 2007-5638 A

  However, the conventional configuration requires an expensive double-sided through-hole substrate, and the reflow soldering equipment is expensive, so that the finished product is also expensive, and the large electronic components are kept at the temperature in the reflow furnace. Since it cannot withstand, automatic soldering is performed in a flow solder bath. In addition, when soldering electronic component lead wires inserted from the back side onto a jumper wire mounted on a single-sided printed circuit board, the soldering state is unstable, resulting in poor connection or aging It had the subject of being easy to raise | generate a solder crack.

  SUMMARY OF THE INVENTION The present invention solves the above-described conventional problems, and an object thereof is to provide an electronic component mounting structure capable of realizing stable soldering connection at low cost.

  In order to solve the above-described conventional problems, the electronic component mounting structure of the present invention has a flow solder surface having a conductor pattern on both sides and a soldering land on one side, and an electronic component opposite thereto. Using a non-through-hole type double-sided printed wiring board with conductor patterns and hand-soldering lands on the component mounting surface side as well, electronic components are mounted on the flow solder surface side, and electrons are placed in holes that penetrate both surfaces. The lead wire of the electronic component is soldered to the hand soldering land provided on the component mounting surface side through the component lead wire, and the jumper wire is also soldered to the hand soldering land to electrically connect the patterns on both sides Electronic component mounting structure that enables some electronic components to be mounted on the flow solder surface side by electrically conducting.

In addition, the electronic component mounting structure of the present invention can be obtained by replacing the jumper wire with a resistor and electrically conducting the patterns on both sides by manual soldering of the lead wire of the resistor, and obtaining the same effect. The same effect can be achieved by replacing the jumper line with eyelets.

  As a result, mounting of electronic components from the soldering surface side can be realized while maintaining high soldering quality.

  With the electronic component mounting structure of the present invention, mounting of the electronic component on the flow soldering surface side can be realized inexpensively and easily while using a relatively inexpensive non-through-hole double-sided printed wiring board.

The top view seen from the electronic component mounting surface in Embodiment 1 of this invention Side view of Embodiment 1 of the present invention The top view seen from the electronic component mounting surface in Embodiment 2 of this invention The top view seen from the electronic component mounting surface in Embodiment 3 of this invention Side view of Embodiment 3 of the present invention Sectional view showing a conventional electronic component mounting structure from the soldering surface side

  The first invention has a conductor pattern on both sides, a flow soldering land on one side, and a non-through-hole type both side having a conductor pattern and a hand soldering land on the component mounting surface on the opposite side. Using printed circuit boards, electronic components are mounted on the component mounting surface, the lead wires of the electronic components are passed through holes that penetrate both surfaces, and the lead wires of the electronic components are soldered to the predetermined flow soldering lands. After mounting the wire and soldering the jumper wire on the flow soldering surface in the same way, mount the electronic component from the flow soldering surface side, penetrate the lead wire of the electronic component through the hole penetrating both surfaces, and mount the component side Solder the lead wires of electronic components to the hand soldering lands provided on the board and solder the jumper wires to the hand soldering lands provided on the component mounting surface. By electrically connecting the back side of the pattern, the non-through-hole double-sided printed circuit board can be mounting an electronic component on the flow soldering surface side using.

  In particular, the second invention is similar to the first invention while suppressing the number of components to be mounted by substituting the jumper wire of the first invention with a feedback resistor necessary for an electronic component using a piezoelectric element. An effect can be obtained.

  In particular, the third aspect of the invention can achieve the same effect as the first and second aspects of the invention by replacing at least one of either the jumper wire or the feedback resistor of the first or second aspect or the feedback resistor with an eyelet. Obtainable.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. Note that the present invention is not limited to the embodiments.

(Embodiment 1)
FIG. 1 is a plan view of a mounting structure for an electronic component according to a first embodiment of the present invention, and FIG. 2 is a side view thereof.

In FIG. 1, reference numeral 2 denotes a jumper wire, which is mounted from the component mounting surface side of the non-through-hole type printed circuit board 1 having conductor patterns on the front and back sides, and component mounting penetrating both surfaces provided in the center of the hand soldering land 3 It protrudes through the hole 11 to the center of the flow soldering land 6 on the DIP surface side. Reference numeral 4 denotes an electronic component mounted from the flow solder surface side. The electronic component lead 5 is mounted from the flow solder surface side, and the electronic component lead 5 is provided on the component mounting surface side through the component mounting hole 11. The two hand-soldering lands 3 are connected to each other by a pattern 7 on the component mounting surface side.

  The operation and action of the electronic component mounting structure configured as described above will be described below.

  First, the jumper wire 2 is soldered to a flow soldering land 6 provided on the flow solder surface side in a flow soldering bath, and then the lead wire of the electronic component 4 mounted on the flow solder surface side is mounted on the component. The hand soldering land 3 provided on the surface is manually soldered using a soldering iron 3 and is connected to the hand mounting land 11 of the component mounting hole 11 in which the jumper wire 2 is mounted. 3, the electronic component 4 mounted from the flow solder surface and the jumper wire are electrically connected by the pattern 7 by manual soldering connection, and the jumper wire is connected to the hand soldering land 3 on the component mounting surface. When the flow soldering lands 6 protruding through the component mounting holes 11 are soldered, the front and the back can be electrically connected.

  As described above, in the present embodiment, the jumper wire 2 is soldered on the front and back of the printed circuit board 1 so that the front and back are electrically connected in the same manner as the through-hole board, and the electronic component 4 mounted from the flow solder surface. It is possible to maintain stable soldering quality by manually soldering to the hand soldering land 3 provided on the component mounting surface.

(Embodiment 2)
FIG. 3 is a plan view of the second embodiment of the present invention. In the same configuration as in the first embodiment, the jumper wire 2 is substituted with a feedback resistor necessary for an electronic component using a piezoelectric element. Thus, the same effects as those of the first embodiment can be obtained while suppressing the number of components to be mounted and the number of manual soldering.

  When it is necessary to connect a plurality of front and back sides of the printed circuit board, only a part of the plurality of jumper wires may be substituted with a resistance lead wire.

(Embodiment 3)
4 and 5 are a plan view and a cross-sectional view showing the third embodiment of the present invention. The configuration is the same as that of the first embodiment, and the jumper wire 2 is replaced with the eyelet 10, thereby reducing the number of parts. The effect similar to Embodiment 1 can be acquired, suppressing the number of soldering points.

  Even if the lead wire of the component is inserted in the eyelet, it may be in a state where the lead wire is not inserted and only the solder is filled.

  As described above, on parts such as the operation panel where the height of the mounting part on the part mounting surface side is limited by the height of the operation switch, some parts such as buzzers and electrolytic capacitors are flow soldered It can be implemented from the side.

  As described above, the electronic component mounting structure according to the present invention enables mounting of electronic components on both sides using a non-through-hole type double-sided printed circuit board. Due to restrictions, it can be applied to remote controllers where tall parts cannot be mounted.

DESCRIPTION OF SYMBOLS 1 Non-through-hole type double-sided printed circuit board 2 Jumper wire 3 Hand soldering land 4 Electronic component 5 Lead wire 6 Flow soldering land 7 Pattern 8 Resist 9 Resistance 10 Eyelet 11 Component mounting hole

Claims (3)

Using a non-through-hole type double-sided printed circuit board that has a conductor pattern on both sides, a flow soldering land on one side, and a conductor pattern and hand-soldering land on the opposite component mounting surface Mount the electronic component on the mounting surface, pass the lead wire of the electronic component through the hole penetrating both sides, solder the electronic component lead wire to the predetermined flow soldering land, mount the jumper wire and flow similarly After soldering the jumper wire on the soldering surface, mount the electronic component from the flow soldering side, and manually solder the lead wire of the electronic component through the hole that penetrates both sides and provided on the component mounting surface side. The lead wires of electronic components are soldered to the lands, and the jumper wires are also hand-soldered to the manual soldering lands provided on the component mounting surface. Mounting structure of an electronic component, characterized in that for electrically connecting the down. The electronic component mounting structure according to claim 1, wherein a resistor is used instead of the jumper wire. 3. The electronic component mounting structure according to claim 1, wherein eyelets are used in at least one place instead of one or both of the jumper wire and the resistor.

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