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JP2011110693A - Grinding tool - Google Patents

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JP2011110693A
JP2011110693A JP2009284512A JP2009284512A JP2011110693A JP 2011110693 A JP2011110693 A JP 2011110693A JP 2009284512 A JP2009284512 A JP 2009284512A JP 2009284512 A JP2009284512 A JP 2009284512A JP 2011110693 A JP2011110693 A JP 2011110693A
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grindstone
mounting plate
grinding wheel
annular
ring
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Kazumasa Onishi
一正 大西
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  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide a grinding tool of small grinding resistance, hard to cause a partial abrasion of a grinding wheel. <P>SOLUTION: This grinding tool 1 connects two connecting parts 3a and 3b of an annular grinding wheel installing plate, to a support plate 10 vertically fixed to a rotary shaft 8 in a lower end of the rotary shaft 8, with an unillustrated bolt. The grinding wheel installing plate 2 has the ring-shaped connecting parts 3a and 3b connected to a ring-shaped grinding wheel holding part 4 and the support plate 10 for holding the grinding wheel 5, and is also adhered to the upper surface of the grinding wheel installing plate 2 using an epoxy resin by making the average diameter of an annular ultrasonic vibrator 7 coincide with the average diameter of the ring-shaped connecting parts 3a and 3b. The grinding tool 1 is fixed to the lower end of the rotary shaft 8 with, for example, the bolt 9. The grinding wheel installing plate 2 has the ring-shaped grinding wheel holding part 4. A peripheral groove 6 is formed on the lower surface of the grinding wheel holding part 4. The grinding wheel 5 is fitted and fixed to this peripheral groove 6. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

本発明は、研磨対象物の表面を研磨するために用いられ研磨具に関する。  The present invention relates to a polishing tool used for polishing the surface of an object to be polished.

従来より、電子部品の製造のため、サファイア基板、ガラス基板、シリコンカーバイト基板、シリコン基板、あるいはアルミナーチタンカーバイト基板などが用いられている。これらの基板の表面は、環状の砥石を備える研磨具とその駆動装置とから構成される研磨装置を用いて平滑に研磨される。  Conventionally, a sapphire substrate, a glass substrate, a silicon carbide substrate, a silicon substrate, an alumina-titanium carbide substrate, or the like has been used for manufacturing electronic components. The surfaces of these substrates are polished smoothly using a polishing apparatus comprising a polishing tool including an annular grindstone and a driving device thereof.

特許文献1の研磨具は、駆動装置の回転軸の下端部に回転軸に対して垂直に固定される環状の支持板(接続板)、支持板の下方に複数個(合計で6個)の接続部材(接続部)を介して支持されている、下面に環状の砥石が装着された環状砥石装着板(環状弾性体)、および砥石装着板に固定された複数個(合計6個)の超音波振動子から構成されている。  The polishing tool disclosed in Patent Document 1 has an annular support plate (connection plate) fixed to the lower end portion of the rotation shaft of the drive device perpendicularly to the rotation shaft, and a plurality (6 in total) below the support plate. An annular grindstone mounting plate (annular elastic body) supported by a connecting member (connecting portion) and having an annular grindstone mounted on the lower surface, and a plurality (6 in total) of super wheels fixed to the grindstone mounting plate It consists of a sound wave vibrator.

前記の各接続部材の幅(砥石装着板の径方向に沿う長さ)は、砥石装着板の幅と等しくされている。支持板の各ねじ孔と各接続部材のねじ孔と各接続部材のねじ孔とにボルトをねじ込むことにより、支持板と砥石装着板とが複数個の接続部材を介して互いに固定される。  The width of each connecting member (the length along the radial direction of the grindstone mounting plate) is made equal to the width of the grindstone mounting plate. By screwing the bolts into the screw holes of the support plate, the screw holes of the connection members, and the screw holes of the connection members, the support plate and the grindstone mounting plate are fixed to each other via the plurality of connection members.

研磨具を備える研磨装置では、次のようにして研磨対象物の表面の研磨が行われる。先ず、駆動装置の回転軸を研磨具と共に回転させる。次に、各々の超音波振動子に電気エネルギー(例、交流電圧)を付与することにより、各振動子にて超音波振動を発生させる。この超音波振動は砥石装着板を介して砥石に付与されるため、砥石が超音波振動する。そして研磨具の砥石を研磨対象物に接触させることにより、研磨対象物の表面の研磨が行なわれる。  In a polishing apparatus provided with a polishing tool, the surface of an object to be polished is polished as follows. First, the rotating shaft of the driving device is rotated together with the polishing tool. Next, by applying electrical energy (eg, AC voltage) to each ultrasonic transducer, ultrasonic vibration is generated in each transducer. Since this ultrasonic vibration is applied to the grindstone via the grindstone mounting plate, the grindstone vibrates ultrasonically. Then, the surface of the polishing object is polished by bringing the grindstone of the polishing tool into contact with the polishing object.

研磨具の砥石装着板の互いに隣接する接続部材の間の部位は、接続部材に接続されている部位と比較して超音波振動し易い。したがって、各々の超音波振動子にて発生した超音波振動は、接続部材、そして支持板を介して回転軸に伝わり難く、その大部分が砥石装着板を介して砥石に付与される。このため、砥石が大きな振幅にて超音波振動する。これにより砥石と研磨対象物との摩擦抵抗が小さくなり、この摩擦により発熱が抑制され、研磨対象物の熱膨張や変質が抑制されるため、研磨対象物の表面にて研磨されると記載されている。  The part between the connection members adjacent to each other on the grindstone mounting plate of the polishing tool is likely to vibrate ultrasonically as compared with the part connected to the connection member. Therefore, the ultrasonic vibration generated by each ultrasonic vibrator is hardly transmitted to the rotating shaft via the connecting member and the support plate, and most of the vibration is applied to the grindstone via the grindstone mounting plate. For this reason, the grindstone vibrates ultrasonically with a large amplitude. As a result, the frictional resistance between the grindstone and the object to be polished is reduced, heat generation is suppressed by this friction, and thermal expansion and alteration of the object to be polished are suppressed, so that polishing is performed on the surface of the object to be polished. ing.

特許文献2の研磨具では、環状の砥石は、駆動装置の回転軸の下端部に固定された円板部とその周縁から下方に伸びる円筒部の外周面には円環状外側溝が、そして内周面には円環状内側溝が形成されている。溝と溝との深さの合計は、円筒部の厚みよりも大きく設定される。したがって、溝と溝とは、円筒部に互いに上下に間隔をあけて形成される。  In the polishing tool disclosed in Patent Document 2, the annular grindstone has an annular outer groove on the outer peripheral surface of the disk portion fixed to the lower end portion of the rotating shaft of the driving device and the cylindrical portion extending downward from the periphery thereof, and An annular inner groove is formed on the peripheral surface. The sum of the depths of the grooves is set larger than the thickness of the cylindrical portion. Therefore, the groove and the groove are formed in the cylindrical portion with a space therebetween in the vertical direction.

研磨具では、超音波振動子にて発生した超音波振動が、円筒部と溝の内部の空気層との界面から形成される超音波反射面にて反射され、その大部分が円筒部の溝よりも下側の部分を介して砥石に付与される。このため、研磨対象物の表面が高精度にて研磨されると記載されている。  In the polishing tool, the ultrasonic vibration generated by the ultrasonic vibrator is reflected by the ultrasonic reflecting surface formed from the interface between the cylindrical portion and the air layer inside the groove, and most of the ultrasonic vibration is reflected in the groove of the cylindrical portion. It is applied to the grindstone through the lower part. For this reason, it describes that the surface of a grinding | polishing target object is grind | polished with high precision.

国際公開第06/137453号パンフレット  International Publication No. 06/137453 Pamphlet 国際公開第08/108463号パンフレット  International Publication No. 08/108463 Pamphlet

特許文献1の研磨具は、砥石装着板の接続部材に接続された部位が超音波振動が相対的に他の部位に比較して小さいため、接続部材と対応する砥石装着板に装着された砥石の部位の超音波振動も小さい。このため、砥石の偏摩耗(砥石が周方向において不均一に摩耗)して、長時間の使用により研磨の精度が低下する可能性がある。  In the polishing tool disclosed in Patent Document 1, the portion connected to the connecting member of the grindstone mounting plate is relatively smaller in ultrasonic vibration than the other portions, and therefore the grindstone mounted on the grindstone mounting plate corresponding to the connecting member. The ultrasonic vibration of this part is also small. For this reason, uneven wear of the grindstone (the grindstone is worn unevenly in the circumferential direction) may cause a reduction in polishing accuracy due to long-term use.

特許文献2の研磨具では、研磨対象物の表面を高精度で研磨するために研磨対象物の研磨面に平行に超音波振動し易い。しかし、研磨面の垂直方向の超音波振動は研磨面と平行な方向に比較して小さい。研磨抵抗を小さくするためには、平行方向に比較して垂直方向の超音波振動が大きいことが望まれる。  In the polishing tool disclosed in Patent Document 2, ultrasonic vibration is likely to occur in parallel with the polishing surface of the polishing object in order to polish the surface of the polishing object with high accuracy. However, the ultrasonic vibration in the direction perpendicular to the polishing surface is small compared to the direction parallel to the polishing surface. In order to reduce the polishing resistance, it is desired that the ultrasonic vibration in the vertical direction is larger than that in the parallel direction.

本発明の課題は、砥石の偏摩耗が発生し難く、そして研磨抵抗の小さい研磨具を提供することにある。  An object of the present invention is to provide a polishing tool in which uneven wear of a grindstone hardly occurs and the polishing resistance is small.

本発明は、回転軸の下端部に該回転軸に対して垂直に固定される支持板があり、円環状の砥石装着板に同心円状の2個のリング状の接続部があり、そして外周の接続部と内周の接続部のほぼ中央に砥石保持部を持ち、砥石装着板の2個の接続部と該支持板が接続され、砥石装着板の砥石保持部に連続した、または不連続の環状の砥石が装着され、そして該砥石装着板に超音波振動子が固定されている研磨具とするものである。  The present invention has a support plate fixed perpendicularly to the rotating shaft at the lower end of the rotating shaft, two concentric ring-shaped connecting portions on the annular grindstone mounting plate, and There is a grindstone holding part in the center of the connection part and the inner peripheral connection part, and the two connection parts of the grindstone mounting plate and the support plate are connected, and are continuous or discontinuous to the grindstone holding part of the grindstone mounting plate. A polishing tool is provided in which an annular grindstone is mounted and an ultrasonic vibrator is fixed to the grindstone mounting plate.

本発明の研磨具は、研磨対象物と砥石の摩擦力を軽減することができるので、研磨速度を向上させることができる、また研磨対象物と砥石の発熱を低減できるため、高精度である研磨面を得ることができる。  The polishing tool of the present invention can reduce the frictional force between the object to be polished and the grindstone, so that the polishing rate can be improved, and the heat generation of the object to be polished and the grindstone can be reduced. You can get a plane.

本発明の研磨具の構成例を示す断面図である。It is sectional drawing which shows the structural example of the polishing tool of this invention. 図1に記入した切断線A−A線に沿って切断した研磨具の断面図である。It is sectional drawing of the grinding | polishing tool cut | disconnected along the cutting line AA entered in FIG. 砥石装着板の振動モード変換を説明する概略図である。It is the schematic explaining the vibration mode conversion of a grindstone mounting plate.

本発明の研磨具の構成を、添付の図面を用いて説明する。図1は、本発明の研磨具の構成例を示す断面図であり、そして図2は、図1に記入した切断線A−Aに沿って切断した研磨具の断面図である。  The configuration of the polishing tool of the present invention will be described with reference to the accompanying drawings. FIG. 1 is a cross-sectional view showing a configuration example of the polishing tool of the present invention, and FIG. 2 is a cross-sectional view of the polishing tool cut along a cutting line AA written in FIG.

図1及び図2に示す研磨具1は、回転軸8の下端部に回転軸8に対して垂直に固定された支持板10に、円環状の砥石装着板の2個の接続部3a、3bを図示しないボルトにより接続する。砥石装着板2は、砥石5を保持するリング状の砥石保持部4と支持板10と接続するリング状の接続部3a、3bを持っている。また、砥石装着板2の上面に、リング状の接続部3a、3bの平均半径に合わせて円環状の超音波振動子7の平均半径を一致させてエポキシ樹脂を用いて接着する。  The polishing tool 1 shown in FIGS. 1 and 2 has two connection portions 3a and 3b of an annular grindstone mounting plate on a support plate 10 fixed to the lower end portion of the rotation shaft 8 perpendicularly to the rotation shaft 8. Are connected by bolts (not shown). The grindstone mounting plate 2 has a ring-shaped grindstone holding portion 4 that holds the grindstone 5 and ring-shaped connecting portions 3 a and 3 b that are connected to the support plate 10. In addition, the upper surface of the grindstone mounting plate 2 is bonded using an epoxy resin so that the average radius of the annular ultrasonic transducer 7 is matched with the average radius of the ring-shaped connecting portions 3a and 3b.

研磨具1は、回転軸8の下端部に、例えば、ボルト9を用いて固定される。駆動装置としては、例えば、前記特許文献1あるいは特許文献2に記載された研磨装置に備えられている駆動装置を用いることができる。なお、回転軸は、水平方向に配置されてもよい。この場合、本発明の研磨具の「上側」とは支持板の側を、そして「下側」とは砥石の側を意味する。  The polishing tool 1 is fixed to the lower end portion of the rotating shaft 8 using, for example, a bolt 9. As the drive device, for example, the drive device provided in the polishing apparatus described in Patent Document 1 or Patent Document 2 can be used. The rotating shaft may be arranged in the horizontal direction. In this case, the “upper side” of the polishing tool of the present invention means the side of the support plate, and the “lower side” means the side of the grindstone.

支持板10は、例えば、図示しないボルトを用いて砥石装着板の接続部3a、3bを固定する。ここで砥石装着板の接続部3a、3bは、砥石装着板2と分離してもよい。そして、砥石装着板2と接続部3a、3bをボルトで接合するか、または接着剤で接合しても良い。  The support plate 10 fixes the connecting portions 3a and 3b of the grindstone mounting plate using, for example, bolts (not shown). Here, the connecting portions 3 a and 3 b of the grindstone mounting plate may be separated from the grindstone mounting plate 2. And you may join the grindstone mounting plate 2 and the connection parts 3a and 3b with a volt | bolt, or it may join with an adhesive agent.

また砥石装着板2は、リング状の砥石保持部4を持つ。リング状の砥石保持部4は砥石5に近づくに従い、リングが細くなる形状でもよい。これは、砥石5に半径方向の不要な振動を与えないためである。砥石保持部4の下面には、周溝6が形成されている。この周溝6に砥石5が嵌め合わせられて固定されている。砥石保持部4と砥石5とは、例えば、接着剤を用いて固定することもできる。なお、回転軸8と支持板10、支持板10と砥石装着板の接続部3a、3b、砥石装着板の砥石保持部4と砥石5のそれぞれの固定方法に特に制限はない。  The grindstone mounting plate 2 has a ring-shaped grindstone holding portion 4. The ring-shaped grindstone holding part 4 may have a shape in which the ring becomes narrower as the grindstone 5 approaches. This is because the grinding stone 5 is not given unnecessary vibration in the radial direction. A circumferential groove 6 is formed on the lower surface of the grindstone holding portion 4. A grindstone 5 is fitted into the circumferential groove 6 and fixed. The grindstone holding part 4 and the grindstone 5 can also be fixed using an adhesive, for example. In addition, there is no restriction | limiting in particular in each fixing method of the rotating shaft 8 and the support plate 10, the connection parts 3a and 3b of the support plate 10 and a grindstone mounting plate, and the grindstone holding part 4 and the grindstone 5 of a grindstone mounting plate.

砥石装着板2は超音波振動の減衰の小さい材料が適しているため、砥石装着板2の材料は、例えば、アルミニウム、青銅、ステンレススチール、アルミニウム合金、及びチタン合金に代表される金属材料から形成することができる。  Since a material with small attenuation of ultrasonic vibration is suitable for the grindstone mounting plate 2, the material of the grindstone mounting plate 2 is formed from a metal material typified by, for example, aluminum, bronze, stainless steel, aluminum alloy, and titanium alloy. can do.

環状の砥石5としては、例えば、ダイアモンド砥粒に代表される砥粒を、金属ボンドやレジンボンドで結着して連続した環状の形状に設定された砥石(連続した環状の砥石)を用いることができる。通常、砥粒の平均粒径は、0.1〜50μmの範囲内に設定される。  As the annular grindstone 5, for example, a grindstone (continuous annular grindstone) set in a continuous annular shape by binding abrasive grains represented by diamond abrasive grains with metal bonds or resin bonds is used. Can do. Usually, the average particle diameter of the abrasive grains is set within a range of 0.1 to 50 μm.

環状の砥石5としては、環状に並べて配置された複数個(例えば2〜200個)の砥石片の集合体」(不連続の環状の砥石)を用いることができる。不連続の環状の砥石は、上記の連続した環状の砥石と比較して、その作成が(特に環状の砥石の径が大きい場合に)容易である。また、研磨の際に砥石内部に生じる応力を低減するため、砥石の破損の発生が抑制される。  As the annular grindstone 5, an “aggregate of a plurality of (for example, 2 to 200) grindstone pieces arranged in a ring” (discontinuous annular grindstone) can be used. The discontinuous annular grindstone is easy to create (particularly when the diameter of the annular grindstone is large) as compared to the continuous annular grindstone. Further, since the stress generated in the grindstone during polishing is reduced, the occurrence of breakage of the grindstone is suppressed.

研磨具1では、12個の円弧状の超音波振動子7が用いられ、これを組み合わせて円環状としている。超音波振動子7としては、例えば、圧電体の上面及び下面の各々に電極層を付設した構成の圧電振動子が用いられる。  In the polishing tool 1, twelve arc-shaped ultrasonic transducers 7 are used, which are combined to form an annular shape. As the ultrasonic vibrator 7, for example, a piezoelectric vibrator having a configuration in which an electrode layer is provided on each of an upper surface and a lower surface of a piezoelectric body is used.

圧電体の材料の例としては、ジルコン酸チタン酸鉛系の圧電セラミック材料が挙げられる。圧電体は、例えば、その厚み方向(図1の上下方向)に分極処理される。電極層の材料の例としては、銀、金そしてリン青銅などの金属材料が挙げられる。  Examples of the piezoelectric material include lead zirconate titanate-based piezoelectric ceramic materials. For example, the piezoelectric body is polarized in the thickness direction (vertical direction in FIG. 1). Examples of the material for the electrode layer include metal materials such as silver, gold, and phosphor bronze.

超音波振動子7は、例えば、エポキシ樹脂を用いて砥石装着板2に固定される。砥石装着板2の上面に固定することが好ましい。これにより、研磨の際に研磨対象物の表面に供給される研削補助液(代表例、水)を介した超音波振動子7の上下面の電極層の電気的な短絡が防止される。  The ultrasonic vibrator 7 is fixed to the grindstone mounting plate 2 using, for example, an epoxy resin. It is preferable to fix to the upper surface of the grindstone mounting plate 2. Thereby, an electrical short circuit of the electrode layers on the upper and lower surfaces of the ultrasonic vibrator 7 through the grinding auxiliary liquid (typical example, water) supplied to the surface of the object to be polished at the time of polishing is prevented.

超音波振動子7は、その電極層に電源にて発生した電気的エネルギーが付設されると超音波振動を発生する。この超音波振動は砥石装着板2を介して砥石5に付与される。超音波振動子7と電源とは、例えば、ロータリートランスやスリップリングを介して互いに電気的に接続される。超音波振動子7と電源との電気的な接続方法については、前記の特許文献1及び特許文献2の各々に詳しい記載がある。  The ultrasonic vibrator 7 generates ultrasonic vibration when electrical energy generated by a power source is attached to the electrode layer. This ultrasonic vibration is applied to the grindstone 5 via the grindstone mounting plate 2. The ultrasonic transducer 7 and the power source are electrically connected to each other via, for example, a rotary transformer or a slip ring. The electrical connection method between the ultrasonic vibrator 7 and the power source is described in detail in each of Patent Document 1 and Patent Document 2 described above.

本発明者は、図3で示すように円環状の砥石装着板2に外周部の支持部3aと内周部の支持部3bを設け、そして支持部3a、3bの端面を固定することにより、砥石5に研磨対象物の表面にほぼ垂直な振動を励起することを提案した。  As shown in FIG. 3, the present inventor provides an annular grindstone mounting plate 2 with an outer peripheral support portion 3a and an inner peripheral support portion 3b, and by fixing the end faces of the support portions 3a and 3b, It has been proposed to excite the wheel 5 substantially perpendicular to the surface of the object to be polished.

図3の点線に示す振動モードを励起することにより、砥石5に研磨対象物の面に垂直方向の超音波振動を発生させることができる。この超音波振動により砥石5と研磨対象物との摩擦抵抗を小さくできため、砥石5と研磨対象物の摩擦による発熱が抑制され、研磨対象物の熱膨張が抑制され研磨対象物の表面が高精度に研磨できる。また砥石5も同様に発熱が抑制されるため砥石5のライフが伸びる。  By exciting the vibration mode indicated by the dotted line in FIG. 3, ultrasonic vibration in the direction perpendicular to the surface of the object to be polished can be generated in the grindstone 5. This ultrasonic vibration can reduce the frictional resistance between the grindstone 5 and the object to be polished, thereby suppressing heat generation due to friction between the grindstone 5 and the object to be polished, suppressing thermal expansion of the object to be polished, and increasing the surface of the object to be polished. It can be polished accurately. Similarly, since the heat generation of the grindstone 5 is suppressed, the life of the grindstone 5 is extended.

なお、研磨具1の超音波振動子7に付与する交流電圧の周波数は、例えば、次のようにして定めることができる。有限要素法により砥石装着板の接続部3a、3bの端面を固定した条件での、砥石5が装着され、かつ超音波振動子7が固定された砥石装着板2の固有振動モードを計算する。そして所望の振動モードの固有振動数を予め計算する。  The frequency of the AC voltage applied to the ultrasonic vibrator 7 of the polishing tool 1 can be determined as follows, for example. The natural vibration mode of the grindstone mounting plate 2 to which the grindstone 5 is mounted and the ultrasonic transducer 7 is fixed under the condition that the end faces of the connecting portions 3a and 3b of the grindstone mounting plate are fixed by the finite element method is calculated. Then, the natural frequency of the desired vibration mode is calculated in advance.

次に実際の砥石5が装着された砥石装着板2に固定された超音波振動子7の周波数特性を、例えば、インピーダンスアナライザを用いて測定する。そして先に有限要素法を用いて計算した所望の固有振動モードの固有振動数に近い周波数特性のピークの交流電圧の周波数を、砥石装着板2に接合した超音波振動子7に印加する。  Next, the frequency characteristic of the ultrasonic vibrator 7 fixed to the grindstone mounting plate 2 on which the actual grindstone 5 is mounted is measured using, for example, an impedance analyzer. Then, the frequency of the alternating voltage having the peak of the frequency characteristic close to the natural frequency of the desired natural vibration mode calculated using the finite element method is applied to the ultrasonic vibrator 7 bonded to the grindstone mounting plate 2.

そして所望の振動モードであることを確認するため、例えばレーザドプラー振動計により砥石5および砥石装着板2の超音波振動の変位量を測定する。  And in order to confirm that it is a desired vibration mode, the displacement amount of the ultrasonic vibration of the grindstone 5 and the grindstone mounting plate 2 is measured, for example with a laser Doppler vibrometer.

研磨具1の超音波振動子7の位置は、砥石装着板2の外周と内周の接続部のほぼ中央が望ましい。また超音波振動子7の形状は円弧状が望ましい。これを複数個並べて円環状にする。そして、隣り合う円弧状の超音波振動子の間隔は、可能な限り小さくするのがよい。望ましくは、間隔は1mm以下である。これは、全円周方向に均一な振動を付与するためである。  The position of the ultrasonic vibrator 7 of the polishing tool 1 is preferably substantially at the center of the connection portion between the outer periphery and the inner periphery of the grindstone mounting plate 2. In addition, the shape of the ultrasonic transducer 7 is preferably an arc shape. A plurality of these are arranged into an annular shape. The interval between adjacent arc-shaped ultrasonic transducers should be as small as possible. Desirably, the spacing is 1 mm or less. This is to provide uniform vibration in the entire circumferential direction.

1 研磨具
2 砥石装着板
3 接続部
4 砥石保持部
5 砥石
6 周溝
7 超音波振動子
8 回転軸
9 ボルト
10 支持板
DESCRIPTION OF SYMBOLS 1 Polishing tool 2 Whetstone mounting plate 3 Connection part 4 Whetstone holding part 5 Whetstone 6 Circumferential groove 7 Ultrasonic vibrator 8 Rotating shaft 9 Bolt 10 Support plate

Claims (1)

回転軸の下端部に該回転軸に対して垂直に固定される支持板があり、円環状の砥石装着板に同心円状の2個のリング状の接続部があり、そして外周の接続部と内周の接続部のほぼ中央に砥石保持部を持ち、砥石装着板の2個の接続部と該支持板が接続され、砥石装着板の砥石保持部に連続した、または不連続の環状の砥石が装着され、そして該砥石装着板に超音波振動子が固定されていることを特徴とする研磨具。  There is a supporting plate fixed perpendicularly to the rotating shaft at the lower end of the rotating shaft, two concentric ring-shaped connecting portions on the annular grindstone mounting plate, and inner and outer connecting portions A grindstone holding portion is provided at the approximate center of the peripheral connection portion, and two connecting portions of the grindstone mounting plate and the support plate are connected, and a continuous or discontinuous annular grindstone is connected to the grindstone holding portion of the grindstone mounting plate. A polishing tool which is mounted and an ultrasonic transducer is fixed to the grindstone mounting plate.
JP2009284512A 2009-11-25 2009-11-25 Grinding tool Withdrawn JP2011110693A (en)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104475772A (en) * 2014-12-19 2015-04-01 苏州路路顺机电设备有限公司 Cutter rest for lathe with polishing function
CN105150034A (en) * 2015-08-12 2015-12-16 华侨大学 Grinding head capable of achieving end face ultrasound-assisted grinding and polishing
JP2017170541A (en) * 2016-03-22 2017-09-28 株式会社東京精密 Chamfering device and chamfering method

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104475772A (en) * 2014-12-19 2015-04-01 苏州路路顺机电设备有限公司 Cutter rest for lathe with polishing function
CN105150034A (en) * 2015-08-12 2015-12-16 华侨大学 Grinding head capable of achieving end face ultrasound-assisted grinding and polishing
JP2017170541A (en) * 2016-03-22 2017-09-28 株式会社東京精密 Chamfering device and chamfering method

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