JP2011194750A - Method for manufacturing lens array and lens array - Google Patents

Abstract

Disclosed is a lens array formed of an energy curable resin to reduce misalignment and pitch variation of a plurality of lens portions.
An energy curable lens array comprising: a plurality of lens units arranged one-dimensionally or two-dimensionally; and a substrate unit that fills a space between the plurality of lens units and connects the lens units to each other. A method of manufacturing a lens array integrally formed with a resin, wherein a curing step is performed in which energy is applied to the resin to cure the resin in a state in which the resin is sandwiched between a pair of mold members. The method for manufacturing a lens array includes the step of curing the uncured resin between the pair of mold members at different timings for each of a plurality of preset regions.
[Selection] Figure 7

Description

  The present invention relates to a lens array manufacturing method and a lens array.

  In recent years, portable terminals of electronic devices such as mobile phones and PDAs (Personal Digital Assistants) are equipped with small and thin imaging units. Such an imaging unit generally includes a solid-state imaging device such as a CCD (Charge Coupled Device) image sensor or a CMOS (Complementary Metal-Oxide Semiconductor) image sensor, and at least one image forming an object image on the solid-state imaging device. And a lens.

  Due to the miniaturization and thinning of portable terminals, there is a demand for further miniaturization and thinning of image pickup units mounted on portable terminals. In addition, productivity at the time of manufacture is also required. In response to such a request, one or more lens arrays in which a plurality of lenses are arrayed are stacked on a sensor array in which a plurality of solid-state image sensors are arrayed, and the obtained stacked body is respectively provided with a solid-state image sensor and a lens. A method of mass-producing an imaging unit by cutting so as to include it is known.

  As a manufacturing method of a lens array used for the above-mentioned application, there is known a method of obtaining a lens array by curing a resin in a state where an ultraviolet curable or thermosetting resin is sandwiched between a pair of mold members. (For example, see Patent Documents 1 and 2). The obtained lens array includes a plurality of lens portions arranged two-dimensionally, and a substantially circular substrate portion that fills the space between the plurality of lens portions and connects the lens portions to each other. The part and the substrate part are integrally formed of resin.

International Publication No. 08/153102 International Publication No. 08/102582

  In general, the resin shrinks in the process of curing, but the curing and shrinkage of the resin in the radial direction of the substrate portion of the lens array is restricted by the mold member, and the cure and shrinkage of the resin in that direction is limited. Therefore, stress remains in the formed lens array. Due to this residual stress, the lens array removed from the mold member may contract, and a plurality of lens portions may be displaced and the pitch may vary.

  And when resin is pinched | interposed between a pair of mold members, excess resin may overflow from between a pair of mold members. When the entire resin including the overflowed resin is cured, the outer shape of the substrate portion of the lens array is not circular due to the overflowed resin, and the shrinkage in the radial direction is not uniform. Thereby, the deviation of the arrangement of the plurality of lens portions and the variation of the pitch become more remarkable.

  The present invention has been made in view of the above-described circumstances, and an object of the present invention is to reduce misalignment of a plurality of lens portions and variation in pitch in a lens array formed of an energy curable resin.

  A lens array comprising a plurality of lens portions arranged one-dimensionally or two-dimensionally and a substrate portion that fills the space between the plurality of lens portions and interconnects these lens portions is integrated with an energy-curable resin. A method of manufacturing a lens array, comprising: a curing step in which energy is applied to the resin to cure the resin in a state where the resin is sandwiched between a pair of mold members and deformed. The process is a method for manufacturing a lens array, in which an uncured resin between the pair of mold members is cured at different timings for each of a plurality of preset regions.

  According to the present invention, the stress remaining in the lens array can be divided for each portion corresponding to the region at the time of curing, and the shrinkage of the lens array due to the residual stress can be suppressed. Thereby, the shift | offset | difference of the arrangement | sequence of a some lens part and the dispersion | variation in a pitch can be reduced.

The figure which shows an example of the imaging unit for demonstrating embodiment of this invention. The figure which shows an example of the lens array for describing embodiment of this invention. The figure which shows the lens array of FIG. 2 in the III-III line cross section. The figure which shows an example of the shaping | molding apparatus used for manufacture of the lens array of FIG. The figure which shows an example of the manufacturing method of the lens array using the shaping | molding apparatus of FIG. The figure which shows the breadth of resin typically. The figure which shows an example of the manufacturing method of the lens array following FIG. The figure which shows the modification of the manufacturing method of the lens array of FIG. The figure which shows the other modification of the manufacturing method of the lens array of FIG. The figure which shows the other example of the shaping | molding apparatus used for manufacture of the lens array of FIG. The figure which shows an example of the manufacturing method of the lens array using the shaping | molding apparatus of FIG. The figure which shows the modification of the manufacturing method of the lens array of FIG. The figure which shows the modification of the shaping | molding apparatus of FIG. The figure which shows an example of the manufacturing method of the lens array using the shaping | molding apparatus of FIG. The figure which shows an example of the manufacturing method of the imaging unit of FIG. The figure which shows the modification of the manufacturing method of the imaging unit of FIG. The figure which shows the other example of the manufacturing method of the imaging unit of FIG.

  FIG. 1 shows an example of an imaging unit.

  An imaging unit 1 shown in FIG. 1 includes a sensor module 2 and a lens module 3.

  The sensor module 2 has a wafer piece 21. The wafer piece 21 is formed of a semiconductor such as silicon, for example, and has a substantially rectangular shape in plan view. A solid-state image sensor 22 is provided at a substantially central portion of the wafer piece 21. The solid-state imaging device 22 is, for example, a CCD image sensor, a CMOS image sensor, or the like, and repeats a well-known film formation process, photolithography process, etching process, impurity addition process, etc. A light receiving region, an electrode, an insulating film, a wiring, and the like are formed.

  The lens module 3 includes a substrate piece 31 and a lens portion 32. The substrate piece 31 surrounds the lens part 32 and spreads outside the lens part 32. The substrate piece 31 is formed in a substantially rectangular shape in plan view that is substantially the same as the wafer piece 21 of the sensor module 2. The optical surfaces 33 formed at both ends of the lens portion 32 in the optical axis direction are convex spherical surfaces in the illustrated example, but depending on the application, convex spherical surfaces, concave spherical surfaces, and aspherical surfaces are used. Or various combinations of planes.

  The lens module 3 is stacked on the sensor module 2 with a spacer 35 interposed between the substrate piece 31 and the wafer piece 21 of the sensor module 2. The lens unit 32 forms a subject image in the light receiving region of the solid-state image sensor 22. In the illustrated example, one lens module 3 is stacked on the sensor module 2, but a plurality of lens modules 3 may be stacked on the sensor module 2.

  The shape of the spacer 35 is not particularly limited as long as the lens module 3 is stabilized on the sensor module 2, but is preferably a frame shape surrounding the solid-state imaging device 22. If the spacer 35 has a frame shape, the space between the sensor module 2 and the lens module 3 can be isolated from the outside. Thereby, the entry of foreign matters such as dust into the space between the sensor module 2 and the lens module 3 can be prevented, and the foreign matter can be prevented from adhering to the solid-state imaging device 22 and the lens portion 32. Further, in this case, if the spacer 35 is light-shielding, it is possible to block light unnecessary for image formation from entering the solid-state imaging device 22 from between the sensor module 2 and the lens module 3.

  The imaging unit 1 configured as described above is typically reflow-mounted on a circuit board of a mobile terminal. That is, paste solder is printed in advance on the circuit board at a position where the imaging unit 1 is mounted, and the imaging unit 1 is placed there. The circuit board including the imaging unit 1 is subjected to a heat treatment such as infrared irradiation or hot air blowing, thereby melting the solder and mounting the imaging unit 1 on the circuit board.

  2 and 3 show an example of a lens array.

  The lens array 5 shown in FIGS. 2 and 3 includes a substrate unit 30 and a plurality of lens units 32.

  The plurality of lens units 32 are arranged in a matrix. The substrate unit 30 fills the space between the plurality of arranged lens units 32 and connects the plurality of lens units 32 to each other. The substrate part 30 and the plurality of lens parts 32 are integrally formed of resin. The outer shape of the substrate portion 30 is a wafer shape (circular shape), and its diameter is typically 6 inches, 8 inches, or 12 inches. Then, typically thousands of lens portions 32 are arranged on the substrate portion 30 having such a size. Note that the arrangement of the plurality of lens units 32 is not limited to a matrix, and may be, for example, a radial shape, a concentric annular shape, another two-dimensional arrangement, or a one-dimensional arrangement.

  As the resin for forming the lens array 5, an energy curable resin composition is used. Examples of the energy curable resin composition include a resin composition that is cured by heat or a resin composition that is cured by ultraviolet rays.

  The resin composition forming the lens array 5 preferably has appropriate fluidity before curing from the viewpoint of moldability, such as mold shape transfer suitability. Specifically, it is liquid at room temperature and has a viscosity of about 1000 to 50000 mPa · s.

  Moreover, it is preferable that the resin composition which forms the lens array 5 has heat resistance to such an extent that it does not thermally deform even after the reflow process after curing. From this viewpoint, the glass transition temperature of the cured product is preferably 200 ° C. or higher, more preferably 250 ° C. or higher, and particularly preferably 300 ° C. or higher. In order to impart such high heat resistance to the resin composition, it is necessary to constrain the mobility at the molecular level, and as effective means, (1) means for increasing the crosslinking density per unit volume, (2) Means utilizing a resin having a rigid ring structure (for example, an alicyclic structure such as cyclohexane, norbornane, tetracyclododecane, an aromatic ring structure such as benzene and naphthalene, a cardo structure such as 9,9′-biphenylfluorene, Resins having a spiro structure such as spirobiindane, specifically, for example, JP-A-9-137043, JP-A-10-67970, JP-A-2003-55316, JP-A-2007-334018, JP-A-2007-238883 (3) means for uniformly dispersing a high Tg substance such as inorganic fine particles (for example, JP-A-5-20 027, JP-described), and the like in the 10-298265 Patent Publication. A plurality of these means may be used in combination, and it is preferable to make adjustments within a range that does not impair other characteristics such as fluidity, shrinkage rate, and refractive index characteristics.

  Further, the resin composition forming the lens array 5 is preferably a resin composition having a small volume shrinkage due to a curing reaction from the viewpoint of shape transfer accuracy. The curing shrinkage rate of the resin composition is preferably 10% or less, more preferably 5% or less, and particularly preferably 3% or less. Examples of the resin composition having a low curing shrinkage rate include (1) resin compositions containing a high molecular weight curing agent (such as a prepolymer) (for example, JP-A Nos. 2001-19740, 2004-302293, and 2007-). The number average molecular weight of the high molecular weight curing agent is preferably in the range of 200 to 100,000, more preferably in the range of 500 to 50,000, and particularly preferably in the range of 1,000 to 20, as described in Japanese Patent No. 211247. The value calculated by the number average molecular weight of the curing agent / the number of curing reactive groups is preferably in the range of 50 to 10,000, and in the range of 100 to 5,000. More preferably, it is particularly preferably in the range of 200 to 3,000.), (2) Resins containing non-reactive substances (organic / inorganic fine particles, non-reactive resins, etc.) Composition (for example, described in JP-A-6-298883, JP-A-2001-247793, JP-A-2006-225434, etc.), (3) a resin composition containing a low shrinkage crosslinking reactive group (for example, ring-opening polymerization) Sex groups (for example, epoxy groups (for example, described in JP-A No. 2004-210932), oxetanyl groups (for example, described in JP-A No. 8-134405), episulfide groups (for example, JP-A No. 2002-105110) Etc.), cyclic carbonate groups (e.g. described in JP-A-7-62065 etc.), etc., ene / thiol curing groups (e.g. described in JP-A 2003-20334 etc.), hydrosilylation curing groups (e.g. (For example, described in JP-A-2005-15666), etc.), (4) rigid skeleton resins (fluorene, adamantane, isophorone, etc.) (5) Resin composition containing an interpenetrating network structure (so-called IPN structure) containing two types of monomers having different polymerizable groups (for example, described in JP-A-9-137043) For example, described in JP-A-2006-131868), (6) Resin composition containing an expansible substance (for example, described in JP-A-2004-2719, JP-A-2008-238417, etc.), etc. Can be suitably used in the present invention. In addition, it is preferable from the viewpoint of optimizing physical properties to use a plurality of curing shrinkage reducing means in combination (for example, a resin composition containing a prepolymer containing a ring-opening polymerizable group and fine particles).

  The resin composition forming the lens array 5 is preferably a mixture of resins having different Abbe numbers of two or more types of high and low. The resin on the high Abbe number side preferably has an Abbe number (νd) of 50 or more, more preferably 55 or more, and particularly preferably 60 or more. The refractive index (nd) is preferably 1.52 or more, more preferably 1.55 or more, and particularly preferably 1.57 or more. Such a resin is preferably an aliphatic resin, particularly a resin having an alicyclic structure (for example, a resin having a cyclic structure such as cyclohexane, norbornane, adamantane, tricyclodecane, tetracyclododecane, specifically, for example, JP-A-10-152551, JP-A-2002-212500, JP-A-2003-20334, JP-A-2004-210932, JP-2006-199790, JP-2007-2144, JP-2007-284650. And the resin described in JP-A-2008-105999. The resin on the low Abbe number side preferably has an Abbe number (νd) of 30 or less, more preferably 25 or less, and particularly preferably 20 or less. The refractive index (nd) is preferably 1.60 or more, more preferably 1.63 or more, and particularly preferably 1.65 or more. Such a resin is preferably a resin having an aromatic structure. For example, a resin having a structure such as 9,9′-diarylfluorene, naphthalene, benzothiazole, benzotriazole (specifically, for example, JP-A-60-38411). Publication No. 10-67977, No. 2002-47335, No. 2003-238848, No. 2004-83855, No. 2005-325331, No. 2007-238883, International Publication No. 2006/095610 pamphlet, Japanese Patent No. 2537540, and the like) are preferable.

  Further, in the resin composition forming the lens array 5, it is preferable to disperse inorganic fine particles in the matrix in order to increase the refractive index or adjust the Abbe number. Examples of the inorganic fine particles include oxide fine particles, sulfide fine particles, selenide fine particles, and telluride fine particles. More specifically, for example, fine particles of zirconium oxide, titanium oxide, zinc oxide, tin oxide, niobium oxide, cerium oxide, aluminum oxide, lanthanum oxide, yttrium oxide, zinc sulfide, and the like can be given. In particular, it is preferable to disperse fine particles such as lanthanum oxide, aluminum oxide, and zirconium oxide for the high Abbe number resin, and titanium oxide, tin oxide, zirconium oxide, and the like for the low Abbe number resin. It is preferable to disperse the fine particles. The inorganic fine particles may be used alone or in combination of two or more. Moreover, the composite by several components may be sufficient. In addition, for various purposes such as reducing photocatalytic activity and water absorption, the inorganic fine particles are doped with different metals, the surface layer is coated with different metal oxides such as silica and alumina, silane coupling agents and titanate cups. The surface may be modified with a ring agent, an organic acid (carboxylic acid, sulfonic acid, phosphoric acid, phosphonic acid, etc.) or a dispersant having an organic acid group. The number average particle size of the inorganic fine particles is usually about 1 nm to 1000 nm, but if it is too small, the properties of the substance may change. If it is too large, the influence of Rayleigh scattering becomes remarkable, so 1 nm to 15 nm is preferable. 2 nm to 10 nm are more preferable, and 3 nm to 7 nm are particularly preferable. Further, it is desirable that the particle size distribution of the inorganic fine particles is narrow. There are various ways of defining such monodisperse particles. For example, a numerical value range as described in JP-A No. 2006-160992 applies to a preferable particle size distribution range. Here, the above-mentioned number average primary particle size can be measured by, for example, an X-ray diffraction (XRD) apparatus or a transmission electron microscope (TEM). The refractive index of the inorganic fine particles is preferably 1.90 to 3.00, more preferably 1.90 to 2.70, and more preferably 2.00 to 2.70 at 22 ° C. and a wavelength of 589 nm. It is particularly preferred that The content of the inorganic fine particles with respect to the resin is preferably 5% by mass or more, more preferably 10 to 70% by mass, and particularly preferably 30 to 60% by mass from the viewpoint of transparency and high refractive index.

  In order to uniformly disperse the fine particles in the resin composition, for example, a dispersant containing a functional group having reactivity with a resin monomer that forms a matrix (for example, described in Examples of JP 2007-238884 A), hydrophobic Block copolymer composed of a functional segment and a hydrophilic segment (for example, described in JP-A-2007-2111164), or having a functional group capable of forming an arbitrary chemical bond with inorganic fine particles at the polymer terminal or side chain It is desirable to disperse the fine particles by appropriately using a resin (for example, described in JP 2007-238929 A, JP 2007-238930 A, etc.).

  In addition, the resin composition forming the lens array 5 is appropriately blended with known release agents such as silicone-based, fluorine-based, and long-chain alkyl group-containing compounds and additives such as antioxidants such as hindered phenols. It may be.

  Moreover, a curing catalyst or an initiator can be mix | blended with the resin composition which forms the lens array 5 as needed. Specifically, for example, a compound that accelerates a curing reaction (radical polymerization or ionic polymerization) by the action of heat or active energy rays described in JP-A-2005-92099 (paragraph numbers [0063] to [0070]) and the like. Can be mentioned. The amount of these curing reaction accelerators to be added varies depending on the type of catalyst and initiator, or the difference in the curing reactive site, and cannot be specified unconditionally, but in general, the total solid content of the curing reactive resin composition About 0.1-15 mass% is preferable with respect to a minute, and about 0.5-5 mass% is more preferable.

  The resin composition forming the lens array 5 can be manufactured by appropriately blending the above components. At this time, if other components can be dissolved in the liquid low molecular weight monomer (reactive diluent), etc., it is not necessary to add a separate solvent, but if this is not the case, use a solvent. A curable resin composition can be produced by dissolving each component. The solvent that can be used in the curable resin composition is not particularly limited as long as the composition is uniformly dissolved or dispersed without precipitation, and specifically, for example, Ketones (eg, acetone, methyl ethyl ketone, methyl isobutyl ketone, etc.), esters (eg, ethyl acetate, butyl acetate, etc.), ethers (eg, tetrahydrofuran, 1,4-dioxane, etc.) Alcohols (eg, methanol, ethanol) Isopropyl alcohol, butanol, ethylene glycol, etc.), aromatic hydrocarbons (eg, toluene, xylene, etc.), water and the like. When the curable composition contains a solvent, it is preferable to perform a mold shape transfer operation after drying the solvent.

  The lens module 3 (see FIG. 1) described above is obtained by cutting the substrate portion 30 and dividing the lens array 5 so as to include the lens portions 32 individually. In other words, the lens array 5 is an assembly of the lens modules 3 described above.

  A method for manufacturing the lens array of FIG. 2 will be described below.

  FIG. 4 shows an example of a molding apparatus used for manufacturing the lens array of FIG.

  A molding apparatus 50 shown in FIG. 4 includes an upper mold member 51, a lower mold member 52, a dispenser 53 that supplies an energy curable resin that forms the lens array 5, and a curing unit 54 that cures the resin. ing.

  The upper mold member 51 and the lower mold member 52 sandwich a resin between them, and mold the resin into the shape of the lens array 5. The upper mold member 51 and the lower mold member 52 are formed in a disc shape having the same diameter as the substrate portion 30 of the lens array 5. On the molding surface 61 of the upper mold member 51 facing the lower mold member 52, a plurality of lens molding portions 61a are provided. The lens molding portion 61 a has a shape obtained by inverting one optical surface 33 of the lens portion 32, and is arranged on the molding surface 61 in the same arrangement as the plurality of lens portions 32 in the lens array 5. The molding surface 62 of the lower mold member 52 facing the upper mold member 51 is provided with a plurality of lens molding portions 62a. The lens molding part 62 a has a shape obtained by inverting the other optical surface 33 of the lens part 32, and is arranged in the same arrangement as the plurality of lens parts 32 in the lens array 5.

  The dispenser 53 enters between the upper mold member 51 and the lower mold member 52, and forms an amount necessary for forming the lens array 5 or the lens array 5 on the molding surface 62 of the lower mold member 52. A larger amount of resin is supplied than necessary. After the resin is supplied, the dispenser 53 is moved by driving means (not shown) and retracts from between the upper mold member 51 and the lower mold member 52.

  The material of the upper mold member 51 and the lower mold member 52 is appropriately selected according to the energy curable resin that forms the lens array 5. That is, when a thermosetting resin is used as the resin, a metal material having excellent thermal conductivity, such as nickel, is used as the mold material. Further, when an ultraviolet curable resin composition is used as the resin composition, a material that transmits ultraviolet rays, such as glass, is used as the mold material. In this example, an ultraviolet curable resin is used as the resin.

  The curing means 54 includes a radiation source 63 that emits ultraviolet rays UV and a mask 64. In the illustrated example, the radiation source 63 is disposed below the lower mold member 52, and emits ultraviolet rays toward the lower mold member 52. Therefore, the lower mold member 52 is formed of a material that transmits ultraviolet rays. The mask 64 is disposed between the radiation source 63 and the lower mold member 52 and exposes a predetermined region between the molding surface 61 of the upper mold member 51 and the molding surface 62 of the lower mold member 52. The ultraviolet rays UV emitted from the radiation source 63 are applied to the resin in the predetermined area exposed from the mask 64.

  FIG. 5 shows an example of a method for manufacturing a lens array using the molding apparatus of FIG.

  FIG. As shown in FIG. 5A, a required amount of resin M is supplied from the dispenser 53 onto the molding surface 62 of the lower mold member 52.

  Then, FIG. As shown in 5B, the upper mold member 51 is lowered. As the upper mold member 51 is lowered, the resin M is pressurized between the molding surface 61 of the upper mold member 51 and the molding surface 62 of the lower mold member 52, and radially between the molding surface 61 and the molding surface 62. While being spread, the molding surface 61 and the molding surface 62 are deformed.

  Then, FIG. As shown in 5C, the space between the molding surface 61 and the molding surface 62 is filled with the resin M in a state where the upper mold member 51 is lowered by a predetermined amount. Excess resin M flows out between the molding surface 61 and the molding surface 62, travels along the outer peripheral surface 66 of the lower mold member 52, and adheres thereto.

  FIG. 6 schematically shows the spread of the resin.

  FIG. 6 shows a state where the resin M adhering to the outer peripheral surface 66 of the lower mold member 52 is developed on the same surface as the resin M on the molding surface 62 of the lower mold member 52. The excess resin M flowing out from between the molding surface 61 and the molding surface 62 is not uniform on the circumference. Therefore, the amount of the resin M adhering to the outer circumferential surface 66 of the lower mold member 52 is on the circumference. It is different everywhere. Therefore, as shown in FIG. 6, the outer shape of the spread of the resin M does not become a circle.

  FIG. 7 shows an example of a manufacturing method of the lens array following FIG.

  In the example shown in FIG. 7, a plurality of concentric circular or annular regions are set between the molding surface 61 of the upper mold member 51 and the molding surface 62 of the lower mold member 52, and the outer region is moved from the inner region to the outer region. The resin M in each region is sequentially cured toward the region. In the illustrated example, between the forming surface 61 and the forming surface 62, a circular region Ca from the center to the radius Ra, an annular region Cb from the radius Ra to the radius Rb (> Ra), and the radius Rb. Three regions of an annular region Cc up to the edge (radius Rc) are set.

  FIG. As shown to 7A, the mask 64a is arrange | positioned between the radiation source 63 and the lower mold | type member 52. FIG. The mask 64a covers a region other than the region Ca between the molding surface 61 and the molding surface 62, and exposes the region Ca. Then, the radiation source 63 is driven to emit ultraviolet rays from the radiation source 63. The ultraviolet rays emitted from the radiation source 63 are applied to the resin M in the area Ca exposed from the mask 64. Thereby, the resin M in the region Ca is cured. At this time, the resin M shrinks as the curing proceeds, but the uncured resin M in the region on the outer peripheral side of the region Ca flows in to compensate for the shrinkage. Thereby, in the area | region Ca, the contact of the molding surface 61 and the molding surface 62, and the resin M is maintained.

  Then, FIG. As shown in 7B, a mask 64b is arranged between the radiation source 63 and the lower mold member 52. The mask 64b covers a region other than the region Cb between the molding surface 61 and the molding surface 62, and exposes the region Cb. Then, the radiation source 63 is driven to irradiate the resin M in the region Cb exposed from the mask 64b with ultraviolet rays. Thereby, the resin M in the region Cb is cured. For the curing shrinkage of the resin M in the region Cb, the uncured resin M in the region on the outer peripheral side of the region Cb flows so as to compensate for the shrinkage. Thereby, the contact between the molding surface 61 and the molding surface 62 and the resin M is maintained in the region Cb. Note that the resin M in the region Ca exposed by the mask 64a has already been cured, and there is no problem in further irradiating the resin M in the region Ca with ultraviolet rays. Therefore, the mask 64b is configured to expose the region from the center to the radius Rb between the molding surface 61 and the molding surface 62, that is, to include the cured region Ca exposed by the mask 64a. May be.

  Then, FIG. As shown in 7C, a mask 64c is disposed between the radiation source 63 and the lower mold member 52. The mask 64c covers a region other than the region Cc between the molding surface 61 and the molding surface 62 and exposes the region Cc. Then, the radiation source 63 is driven to irradiate the resin M in the region Cc exposed from the mask 64c with ultraviolet rays. Thereby, the resin M in the region Cc is cured. With respect to the curing shrinkage of the resin M in the region Cc, it adheres to the uncured resin M in the region on the outer peripheral side of the region Cc, that is, the outer peripheral surface 66 of the lower mold member 52 so as to compensate for the shrinkage. Uncured resin M flows in. Thereby, the contact between the molding surface 61 and the molding surface 62 and the resin M is maintained in the region Cc. The mask 64c exposes a region from the center to the radius Rc between the molding surface 61 and the molding surface 62, that is, a cured region Ca exposed by the mask 64a and a cured region exposed by the mask 64b. It may be configured to be exposed including the region Cb.

  Then, FIG. 7D, the removing member 55 such as a spatula is brought into contact with the outer peripheral surface 66 of the lower mold member 52, and the removing member 55 is slid over the entire periphery of the outer peripheral surface 66. Thereby, the resin M adhering to the outer peripheral surface 66 is removed. Thereby, the outer shape of the obtained lens array 5 is circular. The resin M attached to the outer peripheral surface 66 may be removed after being irradiated with ultraviolet rays and cured.

  In this way, a plurality of concentric circular or annular regions Ca, Cb, Cc are set between the molding surface 61 and the molding surface 62, and each region is directed from the inner region Ca toward the outer region Cc. By sequentially curing the resin M in the substrate, the stress remaining in the lens array 5 is divided into portions corresponding to the regions at the time of curing, thereby suppressing the shrinkage of the lens array 5 due to the residual stress. it can. Thereby, it is possible to reduce misalignment and pitch variation of the plurality of lens portions 32.

  The molding surface 61 and the molding surface 62 can be kept in contact with the resin M, and the molding surface 61 including the lens molding portion 61a and the shape of the molding surface 62 including the lens molding portion 62a can be accurately determined. It can be transferred to the resin M. Thereby, the shape accuracy of the board | substrate part 30 and the lens part 32 can be improved.

  Further, by removing the excess resin M flowing out between the molding surface 61 and the molding surface 62 and making the outer shape of the lens array 5 circular, the shrinkage in the radial direction of the lens array 5 becomes uniform. Thereby, it is possible to further reduce misalignment of the plurality of lens portions 32 and variations in pitch.

  FIG. 8 shows a modification of the manufacturing method of FIG.

  In the example shown in FIG. 8, a plurality of concentric circular or annular regions are set between the molding surface 61 of the upper mold member 51 and the molding surface 62 of the lower mold member 52, and the inner region is changed from the outer region to the inner region. The resin M in each region is sequentially cured toward the region. In the illustrated example, a circular region C0 in the center from the center to the radius R0, an annular region Ca from the radius R0 to the radius Ra (> R0), and the radius between the molding surface 61 and the molding surface 62 are illustrated. Four regions are set, an annular region Cb from Ra to radius Rb (> Ra) and an annular region Cc from radius Rb to the edge (radius Rc). The process of filling the resin M between the molding surface 61 and the molding surface 62 is the same as that shown in FIG.

  A concave portion 67 for storing the resin M is provided in the central portion (region from the center to the radius R0) of the molding surface 62 of the lower mold member 52. In addition, the recessed part which becomes a resin pool may be provided in the center part of the molding surface 61 of the upper mold | type member 51, and the recessed part which becomes a resin pool is provided in both the center part of the molding surface 61 and the center part of the molding surface 62. Also good.

  FIG. As shown to 8A, the mask 64c is arrange | positioned between the radiation source 63 and the lower mold | type member 52. FIG. The mask 64 c exposes a region Cc between the molding surface 61 and the molding surface 62. Then, the radiation source 63 is driven to irradiate the resin M in the region Cc exposed from the mask 64c with ultraviolet rays. Thereby, the resin M in the region Cc is cured. For the curing shrinkage of the resin M in the region Cc, the uncured resin M in the region on the inner peripheral side of the region Cc flows so as to compensate for the shrinkage. Thereby, the contact between the molding surface 61 and the molding surface 62 and the resin M is maintained in the region Cc.

  Then, FIG. As shown to 8B, the mask 64b is arrange | positioned between the radiation source 63 and the lower mold | type member 52. FIG. The mask 64 b exposes a region Cb between the molding surface 61 and the molding surface 62. Then, the radiation source 63 is driven to irradiate the resin M in the region Cb exposed from the mask 64b with ultraviolet rays. Thereby, the resin M in the region Cb is cured. For the curing shrinkage of the resin M in the region Cb, the uncured resin M in the region on the inner peripheral side of the region Cb flows so as to compensate for the shrinkage. Thereby, the contact between the molding surface 61 and the molding surface 62 and the resin M is maintained in the region Cb. The mask 64b may be configured to expose the region from the edge to the radius Ra between the molding surface 61 and the molding surface 62, that is, to include the region Cc exposed by the mask 64c. .

  Then, FIG. As shown to 8C, the mask 64a is arrange | positioned between the radiation source 63 and the lower mold | type member 52. FIG. The mask 64 a exposes a region Ca between the molding surface 61 and the molding surface 62. Then, the radiation source 63 is driven to irradiate the resin M in the region Ca exposed from the mask 64a with ultraviolet rays. Thereby, the resin M in the region Ca is cured. With respect to the curing shrinkage of the resin M in the region Ca, the uncured resin M in the region on the inner peripheral side of the region Ca, that is, the uncured in the concave portion 67 that is a resin reservoir, so as to compensate for the shrinkage. Resin M flows in. Thereby, in the area | region Ca, the contact of the molding surface 61 and the molding surface 62, and the resin M is maintained. The mask 64a includes a region Cc exposed between the molding surface 61 and the molding surface 62 from the edge to the radius R0, that is, a region Cc exposed by the mask 64c and a region Cb exposed by the mask 64b. You may comprise so that it may expose. After the resin M in the region Ca is cured, the mask 64a is retracted from between the radiation source 63 and the lower mold member 52, and the uncured resin M in the recess 67 is irradiated with ultraviolet rays to cure it. .

  Then, FIG. As shown in 8D, the resin M adhering to the outer peripheral surface 66 is removed by the removing member 55, and the outer shape of the lens array 5 is made circular.

  FIG. 9 shows another modification of the manufacturing method of FIG.

  In the example shown in FIG. 9, a region Cd in which a plurality of lens portions 32 of the lens array 5 are formed between the molding surface 61 of the upper mold member 51 and the molding surface 62 of the lower mold member 52, and the substrate of the lens array 5. The region Ce for forming the portion 30 is set, and the resin M in the region Cd is first cured. The process of filling the resin M between the molding surface 61 and the molding surface 62 is the same as that shown in FIG.

  FIG. As shown to 9A, the mask 64d is arrange | positioned between the radiation source 63 and the lower mold | type member 52. FIG. The mask 64d exposes a region Cd between the molding surface 61 and the molding surface 62. Then, the radiation source 63 is driven to irradiate the resin M in the region Cd exposed from the mask 64d with ultraviolet rays. Thereby, the resin M in the region Cd is cured to form a plurality of lens portions 32. The uncured resin M around each lens portion 32 flows so as to compensate for the shrinkage of the resin M forming each lens portion 32. Thereby, the contact between the resin M forming each lens portion 32, the lens molding portion 61a of the molding surface 61, and the lens molding portion 62a of the molding surface 62 is maintained.

  Then, FIG. As shown in 9B, a mask 64e is disposed between the radiation source 63 and the lower mold member 52. The mask 64 e exposes a region Ce between the molding surface 61 and the molding surface 62. Then, the radiation source 63 is driven to irradiate the resin M in the region Ce exposed from the mask 64e with ultraviolet rays. Thereby, the resin M in the region Ce is cured to form the substrate unit 30. For curing shrinkage of the resin M forming the substrate part 30, the uncured resin M in the region on the outer peripheral side of the substrate part 30, that is, the outer peripheral surface 66 of the lower mold member 52 so as to compensate for the shrinkage. Flows into the uncured resin M adhering to. Thereby, the contact between the resin M forming the substrate portion 30, the molding surface 61, and the molding surface 62 is maintained. The mask 64e may be configured to be exposed including the region Cd where the plurality of lens portions 32 are formed.

  Then, FIG. As shown in 9C, the resin M adhering to the outer peripheral surface 66 is removed by the removing member 55, and the outer shape of the lens array 5 is made circular.

  FIG. 10 shows another example of a molding apparatus used for manufacturing the lens array of FIG.

  A molding apparatus 150 shown in FIG. 10 includes an upper mold member 151, a lower mold member 152, a dispenser 153 that supplies an energy curable resin that forms the lens array 5, and a curing unit 154 that cures the resin. ing.

  The upper mold member 151 and the lower mold member 152 sandwich a resin between them, and mold the resin into the shape of the lens array 5. The upper mold member 151 and the lower mold member 152 are formed in a disk shape having the same diameter as the substrate portion 30 of the lens array 5. A plurality of lens molding portions 161 a are provided on the molding surface 161 of the upper mold member 151. In addition, a plurality of lens molding portions 162 a are provided on the molding surface 162 of the lower mold member 152.

  The dispenser 153 enters between the upper mold member 151 and the lower mold member 152, and supplies an amount of resin necessary for forming the lens array 5 on the molding surface 162 of the lower mold member 152. In this example, a thermosetting resin is used as the resin.

  The curing unit 154 includes a plurality of heaters 163a, 163b, and 163c that are heat sources. The heaters 163a, 163b, and 163c are all annular, and the diameter increases in the order of the heaters 163a, 163b, and 163c. The heaters 163a, 163b, and 163c are arranged concentrically and attached to the surface of the lower mold member 152 (the surface opposite to the molding surface 162). Therefore, the lower mold member 152 is formed of a metal material having excellent thermal conductivity. Heat generated by the heaters 163a, 163b, and 163c is transmitted to the resin between the molding surface 161 and the molding surface 162 via the lower mold member 152. The heat generated in the heaters 163a, 163b, and 163c is diffused in the radial direction by the lower mold member 152, but is mainly transmitted to the resin in the region overlapping the heaters.

  FIG. 11 shows an example of a method of manufacturing a lens array using the molding apparatus of FIG.

  In the example shown in FIG. 11, a plurality of concentric circular or annular regions are set between the molding surface 161 of the upper mold member 151 and the molding surface 162 of the lower mold member 152, and the outer region is changed from the inner region to the outer region. The resin M in each region is sequentially cured toward the region. In the illustrated example, a circular region Ca from the center to the radius Ra, an annular region Cb from the radius Ra to the radius Rb (> Ra), and the radius Rb are formed between the molding surface 161 and the molding surface 162. Three regions of an annular region Cc up to the edge (radius Rc) are set. The process of filling the resin M between the molding surface 161 and the molding surface 162 is the same as that shown in FIG.

  Of the heaters 163a, 163b, and 163c of the molding apparatus 150, the radius of the smallest heater 163a is smaller than the radius Ra and overlaps the region Ca between the molding surface 161 and the molding surface 162. The radius of the heater 163b is larger than the radius Ra and smaller than the radius Rb, and overlaps the region Cb between the molding surface 161 and the molding surface 162. Further, the radius of the heater 163b is larger than the radius Rb and smaller than the radius Rc, and overlaps the region Cc between the molding surface 161 and the molding surface 162.

  FIG. As shown to 11A, after filling between the molding surface 161 and the molding surface 162 with the resin M, the heater 163a is operated and the heater 163a is heated. The heat H generated by the heater 163a is transmitted to the resin M in the region Ca between the molding surface 161 and the molding surface 162 that overlap with each other. Thereby, the resin M in the region Ca is cured. At this time, the uncured resin M in the region on the outer peripheral side of the region Ca flows in to compensate for the shrinkage of the resin M in the region Ca. Thereby, in the area | region Ca, the contact of the molding surface 161 and the molding surface 162, and the resin M is maintained.

  Then, FIG. As shown to 11B, the heater 163b is operated and the heater 163b is heated. The heat H generated by the heater 163b is transmitted to the resin M in the region Cb between the molding surface 161 and the molding surface 162 that overlap with each other. Thereby, the resin M in the region Cb is cured. At this time, the uncured resin M in the region on the outer peripheral side of the region Cb flows so as to compensate for the shrinkage of the resin M in the region Cb. Thereby, the contact between the molding surface 161 and the molding surface 162 and the resin M is maintained in the region Cb. Note that the resin M in the region Ca has already been cured, and thus the heater 163a overlapping the region Ca may be kept operating or may be stopped.

  Then, FIG. As shown to 11C, the heater 163c is operated and the heater 163c is heated. The heat H generated by the heater 163c is transmitted to the resin M in the region Cc between the molding surface 161 and the molding surface 162 that overlap with each other. Thereby, the resin M in the region Cc is cured. At this time, to the curing shrinkage of the resin M in the region Cc, the uncured resin M in the region on the outer peripheral side of the region Cc, that is, the outer peripheral surface 166 of the lower mold member 152 is compensated for. Adhered uncured resin M flows in. Thereby, the contact between the molding surface 161 and the molding surface 162 and the resin M is maintained in the region Cc. Note that the resin M in the region Ca and the resin M in the region Cb have already been cured, so that the heater 163a that overlaps the region Ca and the heater 163b that overlaps the region Cb may remain operating. You may stop it.

  Then, FIG. 11D, the removing member 155 is brought into contact with the outer circumferential surface 166 of the lower mold member 152, and the removing member 155 is slid over the entire circumference of the outer circumferential surface 166. Thereby, the resin M adhering to the outer peripheral surface 166 is removed.

  In this way, a plurality of concentric circular or annular regions Ca, Cb, Cc are set between the molding surface 161 and the molding surface 162, and each region is directed from the inner region Ca toward the outer region Cc. By sequentially curing the resin M in the substrate, the stress remaining in the lens array 5 is divided into portions corresponding to the regions at the time of curing, thereby suppressing the shrinkage of the lens array 5 due to the residual stress. it can. Thereby, it is possible to reduce misalignment and pitch variation of the plurality of lens portions 32.

  The molding surface 161 and the molding surface 162 can be kept in contact with the resin M, and the molding surface 161 including the lens molding portion 161a and the shape of the molding surface 162 including the lens molding portion 162a can be accurately determined. It can be transferred to the resin M. Thereby, the shape accuracy of the board | substrate part 30 and the lens part 32 can be improved.

  Further, by removing the excess resin M flowing out between the molding surface 161 and the molding surface 162 and making the outer shape of the lens array 5 circular, the shrinkage in the radial direction of the lens array 5 becomes uniform. Thereby, it is possible to further reduce misalignment of the plurality of lens portions 32 and variations in pitch.

  FIG. 12 shows a modification of the manufacturing method of FIG.

  In the example shown in FIG. 12, a plurality of concentric circular or annular regions are set between the molding surface 161 of the upper mold member 151 and the molding surface 162 of the lower mold member 152, and the inner region is changed to the inner region from the outer region. The resin M in each region is sequentially cured toward the region. In the illustrated example, a circular region C0 in the center from the center to the radius R0, an annular region Ca from the radius R0 to the radius Ra (> R0), the radius between the molding surface 161 and the molding surface 162. Four regions are set, an annular region Cb from Ra to radius Rb (> Ra) and an annular region Cc from radius Rb to the edge (radius Rc). The process of filling the resin M between the molding surface 161 and the molding surface 162 is the same as that shown in FIG.

  A concave portion 167 for storing the resin M is provided in the central portion (region from the center to the radius R0) of the molding surface 162 of the lower mold member 152. In addition, a concave portion that serves as a resin reservoir may be provided at the central portion of the molding surface 161 of the upper mold member 151, or a concave portion that serves as a resin reservoir may be provided at both the central portion of the molding surface 161 and the central portion of the molding surface 162. Also good.

  Among the heaters 163a, 163b, and 163c of the molding apparatus 150, the radius of the smallest heater 163a is larger than the radius R0 and smaller than the radius Ra, and overlaps the region Ca between the molding surface 161 and the molding surface 162. . The radius of the heater 163b is larger than the radius Ra and smaller than the radius Rb, and overlaps the region Cb between the molding surface 161 and the molding surface 162. Further, the radius of the heater 163b is larger than the radius Rb and smaller than the radius Rc, and overlaps the region Cc between the molding surface 161 and the molding surface 162.

  FIG. 12A, after the space between the molding surface 161 and the molding surface 162 is filled with the resin M, the heater 163c is operated to raise the temperature of the heater 163c. The heat H generated by the heater 163c is transmitted to the resin M in the region Cc between the molding surface 161 and the molding surface 162 that overlap with each other. Thereby, the resin M in the region Cc is cured. At this time, the uncured resin M in the region on the inner peripheral side of the region Cc flows so as to compensate for the shrinkage of the resin M in the region Cc. Thereby, the contact between the molding surface 161 and the molding surface 162 and the resin M is maintained in the region Cc.

  Then, FIG. As shown to 12B, the heater 163b is operated and the heater 163b is heated. The heat H generated by the heater 163b is transmitted to the resin M in the region Cb between the molding surface 161 and the molding surface 162 that overlap with each other. Thereby, the resin M in the region Cb is cured. At this time, the uncured resin M in the region on the inner peripheral side of the region Cb flows so as to compensate for the shrinkage of the resin M in the region Cb. Thereby, the contact between the molding surface 161 and the molding surface 162 and the resin M is maintained in the region Cb.

  Then, FIG. As shown to 12C, the heater 163a is operated and the heater 163a is heated. The heat H generated by the heater 163a is transmitted to the resin M in the region Ca between the molding surface 161 and the molding surface 162 that overlap with each other. Thereby, the resin M in the region Ca is cured. At this time, in order to compensate for the shrinkage of the resin M in the region Ca, the uncured resin M in the region on the inner peripheral side of the region Ca, that is, the recess 167 that is a resin reservoir is provided. Uncured resin M flows in. Thereby, in the area | region Ca, the contact of the molding surface 161 and the molding surface 162, and the resin M is maintained. After the resin M in the region Ca is cured, the heater 163a is continuously operated, and the resin M in the recess 167 is cured by the heat diffused in the radial direction in the lower mold member 152.

  Then, FIG. 12D, the resin M attached to the outer peripheral surface 166 of the lower mold member 152 is removed by the removing member 155, and the outer shape of the lens array 5 is made circular.

  FIG. 13 shows a modification of the molding apparatus of FIG.

  In the molding apparatus 250 shown in FIG. 13, a plurality of accommodation holes 165 are provided on the surface 164 opposite to the molding surface of the upper mold member 151. The plurality of accommodation holes 165 are arranged on the surface 164 in the same arrangement as the plurality of lens portions 32 in the lens array 5, and each accommodation hole 165 extends from the surface 164 to the vicinity of the lens molding portion 162 a of the molding surface 162. It extends.

  The curing unit 154 includes one heater 163 that is a heat source and a heat transfer member 170. The heater 163 has a disk shape having a diameter sufficient to cover the surface 164 of the upper mold member 151. The heat transfer member 170 is sandwiched between the heater 163 and the upper mold member 151, and transfers heat generated by the heater 163 to the upper mold member 151. The heat transfer member 170 includes a disk-shaped base 171 having a diameter substantially the same as that of the heater 163, and a plurality of substantially columnar protrusions 172 provided on one surface of the base 171. The protrusions 172 are arranged on the surface of the base 171 in the same arrangement as the plurality of receiving holes 165 in the surface 164 of the upper mold member 151. Each protrusion 172 has a smaller diameter than the accommodation hole 165 and is longer than the depth of the accommodation hole 165.

  The heat transfer member 170 is overlaid on the upper mold member 151 such that the tip surfaces of the plurality of protrusions 172 are in contact with the bottom surface of the accommodation hole 165 of the upper mold member 151. There is a gap between the outer peripheral surface of the protrusion 172 and the inner peripheral surface of the accommodation hole 165, and there is also a gap between the surface of the base 171 provided with the protrusion 172 and the surface 164 of the upper mold member 151. Is placed. Insulation is provided by air intervening in these gaps, and heat transfer from the heat transfer member 170 to the upper mold member 151 is mainly performed by the front end surface of each projection 172 and the accommodation hole 165 of the upper mold member 151 in contact with the tip surface. Is made via the bottom surface. In addition, you may make it fill said clearance gap with a heat insulating material.

  FIG. 14 shows an example of a method of manufacturing a lens array using the molding apparatus of FIG.

  In the example shown in FIG. 14, a region Cd in which a plurality of lens portions 32 of the lens array 5 are formed between the molding surface 161 of the upper mold member 151 and the molding surface 162 of the lower mold member 152, and the substrate of the lens array 5. The region Ce that forms the portion 30 is set, and the resin in the region Cd is first cured. The process of filling the resin M between the molding surface 161 and the molding surface 162 is the same as that shown in FIG.

  FIG. As shown in FIG. 14A, the heater 163 is operated in a state where the heat transfer member 170 is sandwiched between the heater 163 and the upper mold member 151, and the heater 163 is heated. The heat generated by the heater 163 is transmitted through the top surface of the plurality of protrusions 172 of the heat transfer member 170 and the bottom surface of the plurality of receiving holes 165 of the top mold member 151 that is in contact with the top surfaces. 151. The bottom surface of each accommodation hole 165 is located in the vicinity of the lens molding portion 162 a of the molding surface 162, so that most of the heat H transferred to the upper mold member 151 is a region Cd that forms the plurality of lens portions 32. Is transmitted to the resin M. Thereby, the resin M in the region Cd is cured to form a plurality of lens portions 32. The uncured resin M around each lens portion 32 flows so as to compensate for the shrinkage of the resin M forming each lens portion 32. Thereby, the contact between the resin M forming each lens part 32, the lens molding part 161a of the molding surface 161, and the lens molding part 162a of the molding surface 162 is maintained.

  Then, FIG. 14B, the heat transfer member 170 is removed from between the heater 163 and the upper mold member 151, and the heater 163 is directly superimposed on the surface 164 of the upper mold member 151. The heat generated by the heater 163 is uniformly transmitted to the entire upper mold member 151 and is also transmitted to the resin M in the region Ce. Thereby, the resin M in the region Ce is cured to form the substrate unit 30. With respect to the curing shrinkage of the resin M forming the substrate portion 30, the uncured resin M in the region on the outer peripheral side of the substrate portion 30, that is, the outer peripheral surface 166 of the lower mold member 152, so as to compensate for the shrinkage. Flows into the uncured resin M adhering to. Thereby, the contact between the resin M forming the substrate portion 30, the molding surface 161, and the molding surface 162 is maintained.

  Then, FIG. As shown in FIG. 14C, the resin M attached to the outer peripheral surface 166 is removed by the removing member 155, and the outer shape of the lens array 5 is made circular.

  The lens array 5 manufactured as described above is divided into a plurality of lens modules 3 (see FIG. 1) each including the lens portion 32 by cutting the substrate portion 30 with a cutter or the like. As described above, the lens module 3 constitutes the imaging unit 1 in combination with the sensor module 2.

  FIG. 15 shows an example of a method for manufacturing the imaging unit of FIG.

  FIG. As shown to 15A, the board | substrate part 30 is cut | disconnected along the cutting line L extended between the rows of the several lens parts 32 arranged in matrix form, and between columns. Thereby, the lens array 5 is divided into a plurality of lens modules 3 each including a lens portion 32. And FIG. As shown in FIG. 15B, the individual lens modules 3 are stacked on the sensor module 2 via the spacers 35. As described above, the imaging unit 1 (see FIG. 1) is obtained.

  FIG. 16 shows a modification of the method for manufacturing the imaging unit of FIG. In the example shown in FIG. 16, two lens modules 3 are stacked on the sensor module 2.

  FIG. 16A, two lens arrays 5 are stacked via a mutually connected spacer array 9 in which a plurality of spacers 35 are arranged in the same arrangement as the lens portions 32 in the lens array 5, and the lens array stack 6 Configure. Then, along the cutting line L, the substrate portions 30 of the two lens arrays 5 included in the stacked body 6 and the spacer array 9 are collectively cut. Thereby, FIG. As shown to 16B, the lens array laminated body 6 is divided | segmented into the several lens module laminated body 7 by which the two lens modules 3 are each laminated | stacked. And FIG. As illustrated in 16 </ b> C, the individual lens module stacked bodies 7 are stacked on the sensor module 2 via the spacers 35. Thus, the imaging unit 1 is obtained.

  In this way, when the lens module laminate 7 in which a plurality of lens modules 3 are laminated in advance is laminated on the sensor module 2, the imaging unit is compared with the case where the lens modules 3 are sequentially laminated on the sensor module 2. 1 productivity can be improved.

  FIG. 17 shows another example of a method for manufacturing the imaging unit of FIG.

  In the example shown in FIG. 17, the lens array 5 is stacked on the sensor array 4 to form an element array stacked body 8 that is an aggregate of a plurality of imaging units 1, and then the element array stacked body 8 is combined with the plurality of imaging units 1. It is divided into two.

  The sensor array 4 includes a wafer 20 made of a semiconductor material such as silicon, and a plurality of solid-state imaging elements 22 are arranged on the wafer 20 in the same arrangement as the lens portions 32 in the lens array 5. . Typically, the diameter of the wafer 20 is 6 inches, 8 inches, or 12 inches, and thousands of solid-state image sensors 22 are arranged therein.

  The lens array 5 is stacked on the sensor array 4 via the spacer array 9 to form an element array stacked body 8. Then, along the cutting line L, the wafer 20 of the sensor array 4, the substrate portion 30 of the lens array 5, and the spacer array 9 included in the element array stack 8 are collectively cut. As described above, the element array stacked body 8 is divided into a plurality of imaging units 1 each including the lens unit 32 and the solid-state imaging element 22.

  In this way, one or more lens arrays 5 are stacked on the sensor array 4, and then the wafer 20 of the sensor array 4 and the substrate portion 30 of the lens array 5 are collectively cut to form a plurality of imaging units 1. If divided, the productivity of the imaging unit 1 can be further improved as compared with the case where the lens module 3 or the laminate 7 thereof is assembled to the sensor module 2.

  As described above, the manufacturing method of the lens array disclosed in this specification includes a plurality of lens units arranged one-dimensionally or two-dimensionally, and a space between the plurality of lens units. A lens array comprising a substrate portion connected to each other, and a lens array manufacturing method integrally formed of an energy curable resin, wherein the resin is sandwiched and deformed between a pair of mold members, A curing step of curing the resin by applying energy to the resin, and the curing step is configured to remove uncured resin between the pair of mold members at different timings for a plurality of preset regions. Harden.

  Further, in the method of manufacturing a lens array disclosed in the present specification, the plurality of regions are concentric circles or rings, and the curing step uses an uncured resin between the pair of mold members. Then, curing is performed sequentially from the inner region to the outer region.

  Further, in the method of manufacturing a lens array disclosed in the present specification, the plurality of regions are concentric circles or rings, and the curing step uses an uncured resin between the pair of mold members. Then, curing is performed sequentially from the outer region toward the inner region.

  Further, in the lens array manufacturing method disclosed in the present specification, the plurality of regions are a region where the plurality of lens parts are formed and a region where the substrate part is formed, and the curing step includes the pair of steps. The uncured resin between the mold members is cured first in the region where the plurality of lens portions are formed, and then the region where the substrate portion is formed.

  Further, in the method of manufacturing a lens array disclosed in the present specification, the resin is an ultraviolet curable resin, and the curing step is performed by curing the uncured region or the uncured region among the plurality of regions. The finished region is exposed by covering the other region with a mask, and the uncured resin is cured by irradiating with ultraviolet rays in that state.

  Further, in the method of manufacturing a lens array disclosed in the present specification, the resin is a thermosetting resin, and a plurality of heat sources corresponding to each of the plurality of regions are provided. The plurality of heat sources are sequentially heated in accordance with the curing order of the regions.

  Further, in the method for manufacturing a lens array disclosed in the present specification, the resin is a thermosetting resin, and the molding surface is formed on at least one mold member from a surface opposite to the molding surface in contact with the resin. Providing a plurality of holes reaching the vicinity of the part forming each lens part in, and when curing the region forming the plurality of lens parts, the heat generated by the heat source is applied to the bottom surface of the plurality of holes, When hardening the area | region which forms the said board | substrate part, the heat which generate | occur | produced with the said heat source is added to the said surface of the said mold member.

  Further, in the method of manufacturing a lens array disclosed in the present specification, a larger amount of the resin than that required for forming the lens array is supplied in advance between the pair of mold members, When the resin is sandwiched between a pair of mold members and narrowed to a predetermined interval, the resin overflows from between the pair of mold members, and is sandwiched between the overflowed uncured resin and the pair of mold members. The curing step is performed with the resin being connected.

  Further, in the lens array manufacturing method disclosed in the present specification, a concave portion for storing the resin is provided in a central portion of at least one of the pair of mold members, and the lens array is interposed between the pair of mold members. When the resin is supplied in an amount larger than the amount necessary for forming the resin and the resin is supplied or when the resin is sandwiched between the pair of mold members and narrowed to a predetermined interval, the resin is The curing process is performed while the uncured resin that has flowed into the recess is connected to the resin in the inner region.

  The lens array disclosed in this specification is manufactured by any one of the manufacturing methods described above.

  The lens array laminate disclosed in this specification includes a plurality of the lens arrays described above, and these lens arrays are laminated.

  Further, an element array stack disclosed in the present specification includes at least one of the lens arrays described above and a sensor array in which a plurality of solid-state imaging elements are arranged on a wafer, and the lens array is the sensor array. Laminated on top.

  The lens module disclosed in the present specification is divided from the lens array including the one lens.

  The lens module laminate disclosed in this specification is divided from the lens array laminate including lenses arranged in the stacking direction.

  In addition, the imaging unit disclosed in this specification is divided from the element array stack including a solid-state imaging device and a lens arranged in the stacking direction.

DESCRIPTION OF SYMBOLS 1 Imaging unit 2 Sensor module 3 Lens module 4 Sensor array 5 Lens array 6 Lens array laminated body 7 Lens module laminated body 8 Element array laminated body 9 Spacer array 20 Wafer 21 Wafer piece 22 Solid-state image sensor 30 Substrate part 31 Substrate piece 32 Lens Part 33 Optical surface 35 Spacer 50 Molding device 51 Upper mold member 52 Lower mold member 53 Dispenser 54 Curing means 55 Removal member 61 Molding surface 61a Lens molding part 62 Molding surface 62a Lens molding part 63 Radiation source 64 Mask 66 Outer circumferential surface Ca Region Cb Region Cc Region M Resin

Claims (15)

A lens array comprising a plurality of lens portions arranged one-dimensionally or two-dimensionally and a substrate portion that fills the space between the plurality of lens portions and interconnects these lens portions is integrated with an energy-curable resin. A method of manufacturing a lens array formed in
In a state where the resin is sandwiched and deformed between a pair of mold members, the resin is provided with a curing step of applying energy to the resin and curing the resin,
The said hardening process is a manufacturing method of the lens array which hardens uncured resin between said pair of type | mold members at a different timing for every some preset area | region. A method of manufacturing a lens array according to claim 1,
The plurality of regions are concentric circles or rings,
In the curing step, the uncured resin between the pair of mold members is sequentially cured from the inner region toward the outer region. A method of manufacturing a lens array according to claim 1,
The plurality of regions are concentric circles or rings,
In the curing step, the uncured resin between the pair of mold members is sequentially cured from the outer region toward the inner region. A method of manufacturing a lens array according to claim 1,
The plurality of regions are a region for forming the plurality of lens portions and a region for forming the substrate portion,
In the curing step, an uncured resin between the pair of mold members is cured first in a region where the plurality of lens portions are formed, and then is cured in a region where the substrate portion is formed. Production method. It is a manufacturing method of the lens array as described in any one of Claims 1-4, Comprising:
The resin is an ultraviolet curable resin,
The curing step is to expose an uncured region, or an uncured region and a cured region of the plurality of regions by covering the other regions with a mask, and then irradiating with ultraviolet rays in that state. A method of manufacturing a lens array in which a cured resin is cured. It is a manufacturing method of the lens array as described in any one of Claims 1-3,
The resin is a thermosetting resin;
Providing a plurality of heat sources corresponding to each of the plurality of regions;
In the curing step, the plurality of heat sources are sequentially heated in accordance with the curing order of the plurality of regions. A method of manufacturing a lens array according to claim 6,
The resin is a thermosetting resin;
At least one mold member is provided with a plurality of holes reaching from the surface opposite to the molding surface in contact with the resin to the vicinity of the portion forming each lens portion on the molding surface,
When curing the region forming the plurality of lens portions, heat generated by a heat source is applied to the bottom surface of the plurality of holes, and when curing the region forming the substrate portion, the heat source generates A method for manufacturing a lens array, wherein applied heat is applied to the surface of the mold member. It is a manufacturing method of the lens array as described in any one of Claims 1-7,
Between the pair of mold members, the amount of the resin larger than the amount necessary for forming the lens array is supplied in advance,
When the resin is sandwiched between the pair of mold members and narrowed to a predetermined interval, the resin overflows from between the pair of mold members, and between the overflowed uncured resin and the pair of mold members. A method of manufacturing a lens array, in which the curing step is performed in a state where the resin sandwiched is connected. A method of manufacturing a lens array according to claim 3,
In the central part of at least one of the pair of mold members, a recess for storing the resin is provided,
Between the pair of mold members, the amount of the resin larger than the amount necessary for forming the lens array is supplied in advance,
When the resin is supplied or when the resin is sandwiched between the pair of mold members and narrowed to a predetermined interval, the resin is caused to flow into the recess, and the uncured resin that has flowed in and the resin in the inner region The manufacturing method of the lens array which performs the said hardening process with the state which connected.   The lens array manufactured by the manufacturing method as described in any one of Claims 1-9.   A lens array laminate comprising a plurality of the lens arrays according to claim 10, wherein these lens arrays are laminated.   11. An element array laminate comprising at least one lens array according to claim 10 and a sensor array in which a plurality of solid-state imaging elements are arranged on a wafer, wherein the lens array is laminated on the sensor array.   The lens module divided | segmented from the lens array of Claim 10 including the said one lens.   A lens module laminated body that is divided from the lens array laminated body according to claim 11 so as to include lenses arranged in a laminating direction.   An imaging unit divided from the element array stack according to claim 12 including a solid-state imaging device and a lens arranged in a stacking direction.

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