JP2011191411A - Device and method for correcting defect - Google Patents

Abstract

A defect of a pattern formed on a surface of a resin substrate is corrected to high quality by laser beam irradiation without damaging the resin substrate.
A defect correcting apparatus 201 is provided on a surface of a film substrate 26 having a surface in which a laser beam 32 having a pulse width in femtosecond units and a laser beam optical axis (Z axis) are orthogonal to each other. A correction unit that corrects a defective portion of the pattern formed on the substrate. The correction part irradiates the defect part with laser light so that the surface of the defect part and the optical axis are orthogonal to each other. At this time, the irradiation position of the laser beam can be varied between a direction in which the Y axis orthogonal to the optical axis extends on the surface and a direction in which the X axis orthogonal to each of the optical axis and the Y axis extends, and Laser light is irradiated along the optical axis from the surface of the defect portion to the surface of the film substrate 26 while being variable in a plurality of times.
[Selection] Figure 1

Description

  The present invention relates to an apparatus and method for correcting a defective portion of a pattern formed on a film substrate.

  A PDP (Plasma Display Panel) has an electromagnetic shielding film attached to the front of the panel in order to prevent leakage of electromagnetic waves generated from the panel body. An electromagnetic wave shielding film for PDP is formed by forming a fine mesh pattern (hereinafter also referred to as an electrode) by applying a metal on a transparent resin film substrate. In order to obtain an electromagnetic wave leakage preventing effect, the electromagnetic wave shielding film pattern is required to be free from defects.

  However, in the manufacturing process of the electromagnetic wave shielding film, various defects occur in the fine pattern formed on the substrate. If all the substrates on which defects have occurred are discarded, the yield decreases. In particular, recently, from the viewpoint of lowering the market price of displays and suppressing the increase in environmental burden due to the disposal of defective products, there is a strong tendency to modify products that can be modified and commercialize them. There is also a strong demand for a correction method and a correction apparatus that can correct defects in films.

  In the manufacturing process of the electromagnetic wave shielding film, the thick defect 101 (see FIG. 13A) in which the line width of the electromagnetic shielding pattern 100 becomes thick or the defective defect 102 in which the pattern 100 is missing (see FIG. 13). 13 (a)) occurs. As a method for correcting the defect, with respect to the thick defect 101, the defect is corrected by irradiating the portion where the line width of the pattern 100 is increased with laser light. In addition, the defect 102 is corrected by applying a metal paste to the chipped portion. As an apparatus for performing such correction, for example, Patent Document 1 discloses an apparatus for correcting an electrode defect of a PDP.

JP 2000-56477 A

  Patent Document 1 describes an apparatus for correcting electrodes of a PDP or LCD (Liquid Crystal Display). In the electrode defect correction of the PDP, a YAG (Yttrium Aluminum Garnet) laser or YLF laser pulse oscillation laser of the second harmonic is mounted in order to cut the electrode short defect. About the pattern formed on the glass substrate like the PDP electrode, since the glass substrate almost transmits the second harmonic and is excellent in heat resistance, the electrode defect portion can be selectively cut with a laser. Is possible.

  However, when a pattern is formed on a resin film substrate, such as an electromagnetic wave shielding film, when laser light is used for defect correction, the film substrate itself is deformed, distorted, or perforated by absorption of laser light. In addition, the occurrence of damage such as deformation, distortion, drilling, and blackening due to heat generation during electrode cutting is inevitable.

  Therefore, it is difficult to remove and correct the wide defect, and it is difficult to remove the excess portion in the shaping process after the paste application correction even in the correction of the chip defect. As a result, the conventional apparatus cannot correct the metal pattern formed on the film substrate.

  An object of the present invention is to provide a defect correcting apparatus and method capable of correcting a defect of a pattern formed on the surface of a resin substrate to a high quality by laser beam irradiation without damaging the resin substrate. is there.

  A defect correcting device according to an aspect of the present invention is a metal material on a surface of a resin substrate having a laser part emitting a laser beam having a pulse width in femtosecond units and a surface in which the optical axes of the laser beam are orthogonal to each other. A correction unit that corrects a defect portion of the formed pattern, and the correction unit irradiates the defect portion with laser light so that the surface of the defect portion and the optical axis are orthogonal to each other, and the laser irradiation unit The irradiation position of the laser beam by the laser beam can be varied between a direction in which the first axis orthogonal to the optical axis extends on the surface and a direction in which the second axis orthogonal to each of the optical axis and the first axis extends. And an irradiation position variable portion that irradiates laser light while making the variable variable in a plurality of times from the surface of the defect portion to the surface of the resin substrate along the optical axis.

  Preferably, the resin substrate is a thin film resin substrate that can be accommodated in a roll shape, and the defect correction device is wound in a roll shape with a mounting table on which the resin substrate is mounted in order to correct the defective portion. And a take-up unit that feeds the resin substrate to the table while unwinding, and a take-up unit that accommodates the resin substrate that has passed through the table while being unwound in a roll shape.

  Preferably, the correction unit includes a correction material application unit that applies the correction material attached to the tip of the needle in contact with the missing defect portion of the metal material formed on the surface of the resin substrate, and the applied correction material. A correction material curing portion to be cured, and removing unnecessary portions of the cured correction material as defective portions by irradiating the laser beam with the laser irradiation unit and the irradiation position variable unit.

  Preferably, an observation unit that captures an image for observing a defect portion, and a mounting unit on which a laser unit, a correction material application unit, a correction material curing unit, and an observation unit are mounted, and the mounting unit is moved along the optical axis An optical axis direction moving part for enabling the optical axis direction moving part, a second axis direction moving part for enabling the optical axis direction moving part to move along the second axis, and a second axis A direction moving part is mounted, and further includes a first axial direction moving part for enabling the second axial direction moving part to move along the first axis.

  Preferably, an observation unit that captures an image for observing the defect portion, a first material moving unit for mounting the correction material application unit, and allowing the correction material application unit to move along the first axis; An optical axis moving unit for mounting the laser unit, the correction material curing unit, the observation unit, and the first axial moving unit, the optical axis moving unit for allowing the mounting unit to move along the optical axis, A direction moving part is mounted, and a second axial direction moving part for allowing the optical axis direction moving part to move along the second axis is further provided.

  Preferably, the correction unit includes a correction material application unit that applies the correction material attached to the tip of the needle in contact with the missing defect portion of the metal material formed on the surface of the resin substrate, and the applied correction material. A correction material curing portion to be cured, and an unnecessary portion of the cured correction material as a defective portion is removed by irradiating the laser beam with the laser irradiation portion and the irradiation position variable portion.

  Preferably, a mounting table on which a resin substrate is placed to correct the defect portion, an observation portion that captures an image for observing the defect portion, a laser portion, a correction material application portion, a correction material curing portion, and It has a mounting part for mounting the observation part, and is equipped with an optical axis direction moving part for enabling the mounting part to move along the optical axis, and an optical axis direction moving part, and the optical axis direction moving part is mounted on the mounting table. A second axial movement unit for enabling movement along the second axis above, and a first axial movement unit for allowing the mounting table to move along the first axis are further provided. .

  Preferably, the number of times that the irradiation position variable portion makes the irradiation position variable along the optical axis is the distance along the optical axis from the diameter of the spot of the laser light and the surface of the defect portion to the surface of the resin substrate. It is determined according to parameters including

  A defect correction method according to another aspect of the present invention includes a step of placing a resin substrate having a surface and having a pattern formed of a metal material on the surface, and forming the resin substrate on the surface on the surface. A correction step of irradiating a laser beam having a pulse width of femtoseconds with a defect width of the patterned pattern, wherein the correction step has the surface of the defect portion orthogonal to the optical axis of the laser beam A laser irradiation step of irradiating the defect portion with laser light, and the irradiation position of the laser light by the laser irradiation step in the direction in which the first axis orthogonal to the optical axis extends on the surface, the optical axis and the first axis While being variable in the direction in which the second axis orthogonal to each extends, and changing the irradiation position in a plurality of times from the surface of the defect portion to the surface of the resin substrate along the direction in which the optical axis extends, Leh It is irradiated with light.

  Preferably, the correction step includes a correction material application step of applying the correction material attached to the tip of the needle in contact with the missing defect portion of the metal material formed on the surface of the resin substrate, and the applied correction material. A correction material curing step for curing the substrate, and removing unnecessary portions of the cured correction material as defective portions by irradiating with laser light in the laser irradiation step.

  Preferably, the number of times of changing the irradiation position along the optical axis in the laser irradiation step includes a spot diameter of the laser light and a distance along the optical axis from the surface of the defect portion to the surface of the resin substrate. Determined according to the parameters.

  According to the present invention, the defect of the pattern formed on the surface of the resin substrate can be corrected to high quality by laser light irradiation without damaging the resin substrate.

1 is a schematic external view of a defect correction apparatus according to Embodiment 1 of the present invention. It is a block diagram of the computer for control of FIG. It is a figure explaining the winding roll mechanism of FIG. It is a process flowchart of the defect correction method which concerns on Embodiment 1 of this invention. It is a process flowchart of the defect correction method which concerns on Embodiment 1 of this invention. It is a process flowchart of the defect correction method which concerns on Embodiment 1 of this invention. It is a figure explaining the paste application | coating mechanism which concerns on Embodiment 1 of this invention. It is a schematic block diagram of the observation optical system which concerns on Embodiment 1 of this invention. In the defect correction apparatus which concerns on Embodiment 1 of this invention, it is a figure which shows the state in which a laser is condensed and irradiated to a film substrate from an objective lens. (A)-(c) is a figure which expands and shows the surface part of the film board | substrate with which a laser beam is irradiated. It is a general | schematic external view of the defect correction apparatus which concerns on Embodiment 2 of this invention. It is a general | schematic external view of the defect correction apparatus which concerns on Embodiment 3 of this invention. It is a figure which illustrates typically the kind and correction of a defect.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. It should be noted that the same components are denoted by the same reference symbols in the respective drawings, and detailed description thereof will not be repeated. Here, it is assumed that the substrate surface irradiated with the laser light corresponds to a two-dimensional coordinate plane defined by the orthogonal X axis and Y axis. An axis extending in the vertical direction of the substrate surface, that is, an axis orthogonal to the X axis and orthogonal to the Y axis is assumed to be the Z axis. The directions in which the X axis, the Y axis, and the Z axis extend are referred to as “X direction”, “Y direction”, and “Z direction”.

(Embodiment 1)
Referring to FIG. 1, a defect correction apparatus 201 according to the first embodiment has a fine pattern formed by applying metal on the main surface of a thin film substrate 26 made of a resin material that is fluidly moved. It is an apparatus for correcting a defective part. Specifically, the defect correction apparatus 201 includes a laser 32 that irradiates a laser beam for cutting a defective portion, and an observation optical system 30 that enables observation of the defective portion. Here, it is assumed that the direction in which the film substrate 26 flows for movement corresponds to the Y direction. The optical axis of the laser 32 corresponds to the Z axis.

  The observation optical system 30 includes an attenuator 50 (not shown) that controls the power of the laser light emitted from the laser 32, a galvano scanner 51 (not shown) for scanning the laser light in the X direction and the Y direction, and a laser on the film substrate 26. A CCD (Charge Coupled Device) camera 31 for observing a defective portion irradiated with light is included. The CCD camera 31 receives reflected light from the defective portion, converts it into an electrical signal corresponding to the amount of received light, and outputs it. The output electrical signal indicates image data obtained by imaging. The CCD camera 31 corresponds to an observation unit that observes a defective portion.

  The galvano scanner 51 is a unit for moving the optical axis in order to process at high speed. A mirror on which the laser beam emitted from the laser 32 is incident and reflected, and a motor for controlling the tilt of the mirror are provided. The operation of the motor is controlled using a control computer 35 described later.

  The defect correcting device 201 further includes a paste applying mechanism 25 for applying a metal paste to the defective portion, and a correction head including a paste baking mechanism 33 for curing the paste applied by the paste applying mechanism 25 by drying or baking. A part. A Z-axis table 27 and a Z-axis table, which are mounted with an observation optical system 30, a laser 32, and a correction head unit, and can freely move in the Z direction with respect to the surface of the film substrate 26 placed on the placement table 40. 27, and an X-axis table 28 that can move in the X direction orthogonal to the flow direction of the film substrate 26, and the X-axis table 28 are mounted, and move in the Y direction, which is the same direction as the flow direction of the film substrate 26. A Y-axis table 29 is provided.

  Further, the defect correcting device 201 accommodates and holds the film substrate 26 in a roll form, and sends the film substrate 26 in the Y direction so as to place the film substrate 26 on the placement table 40 while unwinding the accommodated roll. In order to accommodate the feeding roll mechanism 38, the suction plate 37 that fixes the fed film substrate 26 on the mounting table 40, and the film substrate 26 that is fed through the mounting table 40 in a roll shape while being wound in the Y direction. The take-up roll mechanism 39 shown in FIG. Further, the defect correction apparatus 201 includes a control computer 35 that controls the driving of each unit described above, an operation panel 36 that is operated by an operator to input a command to the control computer 35, and an image processing apparatus (not shown). The image processing apparatus inputs image data output from the CCD camera 31. The image processing apparatus processes the image data and outputs the processing result and the image data to the control computer 35.

  In order to move the film substrate 26 and to move various mechanisms based on the defect position of the film substrate 26, a certain reference is required. Here, however, reference marks are provided on the film substrate 26 at predetermined intervals. Assume that it is formed.

  Referring to FIG. 2, the control computer 35 concentrates the operation of the display computer 610, a keyboard 650, a mouse 660, an operation panel 36, and an operation panel 36, each of which includes a CRT (cathode ray tube) or LCD. A CPU (abbreviation of central processing unit) 622 for controlling and monitoring, a memory 624 including ROM (Read Only Memory) or RAM (abbreviation of Random Access Memory), a fixed disk 626, and an FD (Flexible Disc) 632 Is detachably mounted, an FD drive device 630 that accesses the mounted FD 632, and a CD-ROM (Compact Disc Read Only Memory) 642 is detachably mounted and the CD-ROM that accesses the mounted CD-ROM 642 ROM drive device 640, communication line 300 for communicating with other components, and communication circuit Includes a communication interface 680 for communicating connecting the 300 and 該制 patronage computer 35. These units are connected for communication via a bus.

  The laser to be used is a pulse laser having a pulse time width of 10 femtoseconds to 20 picoseconds. Its configuration is, for example, a laser using an erbium-doped optical fiber or ytterbium-doped optical fiber or an erbium-ytterbium co-doped optical fiber as a resonator and an amplifying medium, for example, reproduction using a sapphire crystal doped with titanium. There are various types of lasers such as lasers using amplification methods, for example, lasers using yttrium-aluminum-garnet disk crystals doped with ytterbium.

The defect correcting apparatus 201 uses a femtosecond laser as the laser 32 for cutting the pattern of the defective portion generated in the electromagnetic wave shield pattern. In this embodiment, the oscillation pulse width is 500 fs (fs stands for femtosecond ^{(10 -15} seconds)) using the following laser 32.

  Thus, according to the femtosecond laser 32 having a very narrow oscillation pulse width, it is possible to remove the object to be processed by ablation before the pattern to be processed is irradiated with the laser and heat is generated by the lattice vibration. . With a YAG laser (pulse width is 10 ns) used for conventional pattern correction, it is difficult to process a pattern that is a metal film on the film substrate 26 without damaging the film substrate 26, The femtosecond laser is excellent in that only the pattern is removed and the film substrate 26 is not damaged.

  In the cut using the femtosecond laser 32, laser light is collected by multiphoton absorption (a phenomenon in which electrons are excited by absorbing two or more photons simultaneously when powerful light is incident on a substance). The reaction with light occurs locally only at the illuminated focal part, and by this, only a part of several μm is removed with respect to the film thickness direction of the pattern (this film thickness direction corresponds to the Z direction). Is possible.

  Further, in order to improve the removal efficiency and reduce the time required for the removal, it is desirable that the oscillation frequency of the laser 32 is 90 kHz or higher according to the experiments by the inventors.

(Outline procedure for defect correction)
A method for correcting defects generated in the pattern of the film substrate 26 by the defect correcting apparatus 201 of FIG. 1 will be described with reference to the flowcharts of FIGS. Programs according to these flowcharts are stored in the memory 624 in advance, and the CPU 622 reads out the program from the memory 624 and executes the program to execute defect correction processing.

  It is assumed that defect data 643 is detected and stored in the memory 624 prior to the defect correction process. It is assumed that the defect data 643 is detected by an inspection device (not shown) and stored in the memory 624 of the control computer 35 by some means such as via CIM (Computer Integrated Manufacturing) in the factory. The defect data 643 includes, for example, position information indicating the position on the film substrate 26 for each of the defect portions detected by pattern recognition of the image, and whether the defect portion is a wide defect or a chip defect. It is assumed that the defect type data to be pointed is included in association with each other. Here, the position information is indicated using the coordinate values (X, Y) on the film substrate 26.

  In operation, first, the CPU 622 reads out the above-described defect data 643 given to the defect correcting device 201 from the memory 624 (step S3).

  Subsequently, the CPU 622 controls the delivery roll mechanism 38 and the take-up roll mechanism 39 to send out the film substrate 26 for placement on the placement table 40. Then, the observation optical system 30 is moved to a position where the defect can be observed (step S7). Specifically, the observation optical system 30 is moved to the position of the reference mark registered in advance, and then the observation optical system 30 is moved to the defect portion.

  A case where the observation optical system 30 is moved to the position of the reference mark will be described. Here, the data of the position (the coordinate in the X direction) where the fiducial mark of the film substrate 26 flows is stored in the memory 624 in advance, and the CPU 622 reads the fiducial mark from the memory 624. It moves according to the position data. As the X-axis table 28 moves, the observation optical system 30 moves and stops at the position of the reference mark. Here, the current coordinate position of the observation optical system 30 is detected by a linear scale (not shown) incorporated in the X-axis table 28. The CPU 622 of the control computer 35 moves the X-axis table 28 according to the comparison result while comparing the current position detected by the observation optical system 30 and the coordinate position of the position data of the reference mark. Thereby, the observation optical system 30 can be moved to the position of the reference mark registered in advance.

  Next, the CPU 622 controls the delivery roll mechanism 38 and the take-up roll mechanism 39 to send the film substrate 26 to a position where the reference mark can be observed by the observation optical system 30. Specifically, follow the procedure below. First, when the film substrate 26 is mounted on the mounting table 40 of the defect correcting device 201, the reference mark is once set at the observation center of the observation optical system 30 (the center of the imaging field of view of the CCD camera 31). The CPU 622 reads the value of the encoder 391 incorporated in the drive roll 392 of the take-up roll mechanism 39 shown in FIG. 3 and stores it in the memory 624. Here, since the reference marks are formed on the film substrate 26 at regular intervals in the Y direction, the CPU 622 determines based on the value of the regular intervals, the outer diameter of the drive roll 392, and the value of the encoder 391. The amount of winding of the film substrate 26 for moving the reference mark to a position that can be observed by the observation optical system 30 can be calculated. Therefore, the CPU 622 controls the feed roll mechanism 38 and the take-up roll mechanism 39 based on the calculated winding amount, and the film substrate 26 is moved so that the next reference mark comes to the observation center position of the observation optical system 30. Can be wound automatically.

  After moving the observation optical system 30 so that the reference mark comes to the observation center position, the observation optical system 30 is moved to a position where the defect can be observed. The CPU 622 moves the observation optical system 30 to the X-axis line position where the defect portion can be observed based on the reference position information read from the memory 624 and the defect position information indicated by the defect data 643. Here, the film substrate 26 is fixed so as not to move by the suction plate 37.

  Next, the observation optical system 30 is moved to a position where the defect can be observed by moving the X-axis table 28.

  After the observation optical system 30 is moved to a position where the defect can be observed, defect correction is performed (step S9). Details of the defect correction will be described later with reference to FIG.

  When the defect correction is completed, the CPU 622 determines whether or not the correction of all the defects indicated by the defect data 643 in the memory 624 is completed (step S11). If it is determined that all the defects have been corrected (YES in step S11), the series of processing ends. If it is determined that the correction has not been completed (NO in step S11), the process returns to step S7, the film substrate 26 is moved as described above based on the defect data 643, and the observation optical system 30 observes the next defect portion. After moving to a possible position, the defect is corrected for the next defective portion.

(Detailed procedure for defect correction)
Defect correction (step S9) will be described with reference to FIG.

  In step S7, the CPU 622 searches the defect data 643 in the memory 624 based on the position information of the defect portion to be observed by the observation optical system 30 and reads the data of the corresponding defect type. Then, it is determined whether the read defect type indicates a 'thick defect' or a 'missing defect' (step S21).

  If it is determined that it points to the 'thick defect', a laser removal process (step S23) described later shown in FIG. 6 is performed. Specifically, the pattern of the defect portion is removed and corrected by irradiating the defect portion with laser light from the laser 32. At this time, the laser light is controlled to an appropriate power by the attenuator 50, the optical path is controlled in the XY direction by the galvano scanner 51, and the irradiation position of the laser light on the surface of the film substrate 26 is controlled in the XY direction. By controlling the optical path of the galvano scanner 51, only a necessary portion is irradiated while being scanned in the X and Y directions. In this state, in order not to damage the film substrate 26, the defective portion is removed while lowering the Z-axis table 27 in a plurality of times in accordance with conditions set in advance. Thereafter, the process returns to the original process.

  Here, the relationship between the scanning amount (driving angle) of the galvano scanner 51 and the scanning amount of the laser light on the film substrate 26 is determined by the relationship with the observation optical system 30 through which the laser light passes. An image according to the image data of the defect acquired by the CCD camera 31 of the observation optical system 30 is displayed on the display 610 of the control computer 35. The operator confirms which position is irradiated with the laser beam while monitoring the image, and then operates the operation panel 36 to designate and input the laser irradiation range on the screen of the display 610. The designated and input position (defective portion position) data is read by the CPU 622, and the CPU 622 converts the read position data into XY coordinate position data on the film substrate 26 according to a predetermined procedure, and the converted XY coordinate position. The galvano scanner 51 is controlled so that the position indicated by the data is irradiated with the laser beam.

  If it is determined that it indicates a “missing defect”, the process proceeds to step S25. In step S <b> 25, a metal paste is applied to the chipped portion of the chipped defect 102 using the paste coating mechanism 25. At the time of applying the paste, the operator confirms where the paste is applied while monitoring the image, and then operates the operation panel 36 to designate and input the application range on the screen of the display 610. The designated and input position (defective portion position) data is read by the CPU 622, and the CPU 622 converts the read position data into XY coordinate position data on the film substrate 26 according to a predetermined procedure, and the converted XY coordinate position. The X-axis table 28 and the Y-axis table 29 are moved according to the data, and the paste application mechanism 25 is moved to the defective portion. This makes it possible to apply the paste at the position of the defect. Details of paste application by the paste application mechanism 25 will be described later.

  Subsequently, the applied paste is heated and baked and cured by a paste baking mechanism 33 (a halogen lamp, a semiconductor laser, a CO2 laser (carbon dioxide laser) or the like is used for the paste baking mechanism 33) (step S27). After confirming the image after firing and determining that the line width of the normal pattern has been corrected (NO in step S29), the process returns to the original process.

  If the image is checked, the paste is applied, and the fired portion becomes thicker than the line width of the normal pattern and the unnecessary portion is removed so that shaping is necessary (YES in step S29), the operator uses the operation panel 36. Enter instructions. The CPU 622 controls the irradiation of the laser beam by the laser 32 and the galvano scanner 51 on the basis of the instruction signal in accordance with the input instruction, and scans the laser beam in the same manner as in the case of the thick defect 101 (step S23) in the portion that needs to be shaped. It corrects by irradiating it (step S31). Thereafter, the process returns to the original process.

(Detailed procedure of laser irradiation)
The step of irradiating with laser light to remove (shape) the patterns in step S31 and step S23 will be described with reference to the flowchart of FIG.

  In order not to damage the film substrate 26 by the laser light irradiation, the Z-axis table 27 is lowered in the direction of the surface of the film substrate 26 in a plurality of times (here, N (≧ 2) times) according to a predetermined condition. While irradiating, laser light is irradiated. The predetermined condition described above varies depending on the type of pattern formed on the film substrate 26. In the memory 624, data of a predetermined condition corresponding to each pattern type is stored in advance.

  In operation, the CPU 622 searches the memory 624 based on the type of pattern input by the operator from the input unit 700, reads the corresponding predetermined condition, and determines the above N times according to the read predetermined condition (step S31). . The detailed procedure for this determination will be described later.

  Subsequently, 0 is set to a temporary variable n for flow control (step S33). Thereafter, while incrementing the value of the variable n by 1 (step S35), it is determined whether or not the condition of (n> N) is satisfied (step S39). While it is determined that the condition is not satisfied (NO in step S39), every time the variable n is incremented by 1, the Z-axis table 27 is lowered by a predetermined distance in the direction of the film substrate 26 (step S41), and the laser 32 is used. Irradiation is performed while scanning in the XY directions (step S37). If it is determined that the condition (n> N) is satisfied (YES in step S39), the laser removal process ends and the process returns to the original process.

  Here, the predetermined conditions for determining N times are the set value of the attenuator 50 for determining the irradiation power of the laser 32 (determination of the laser light output by the control of the attenuator 50), the laser focused diameter on the film substrate 26 ( The diameter of the focused spot 322 described later), the driving speed of the galvano scanner 51 that determines the scanning speed at the time of laser light irradiation, the number of scans at the time of laser light irradiation (the number of scans in the XY directions at the same height position in the Z direction) , Including the amount of movement of the laser 32 in the Z direction. Since the predetermined condition differs depending on the type of pattern formed on the film substrate 26, it is necessary to detect the condition in advance for each type of pattern. The laser 32 is driven and controlled according to the conditions detected for each type of pattern, and each pattern is cut by irradiating the laser beam. The type of pattern is determined by the pattern material and the like. The data of the above-described predetermined condition for determining N times is detected in advance by experiments or the like for each pattern type.

  Here, the Z-axis table 27 is divided N times and lowered toward the surface of the film substrate 26 in the Z direction, but the total distance to be lowered N times is the thickness of the pattern formed on the film substrate 26. It is uniquely determined by the size.

  Specifically, since the defective part may be thicker than the film thickness (pattern thickness) of the normal part, the operator monitors the operation panel 36 while monitoring the image of the defective part on the display 610. In operation, first, the defect portion is confirmed by adjusting the image focus of the observation optical system 30 to the surface position (Z direction position) of the film substrate 26. Thereafter, the observation optical system 30 is moved in the Z direction by operating the operation panel 36 and moving the Z-axis table 27 in the Z direction so as to focus the image focus on the surface of the defective portion while monitoring in the same manner. While moving the observation optical system 30, the defect is monitored and confirmed. The operator stops the movement of the Z-axis table 27 when the in-focus state is confirmed on the surface of the defective portion. Thereby, the movement of the observation optical system 30 is also stopped. The distance in the Z direction from the stop position of the Z-axis table 27 to the surface position of the film substrate 26 is equal to the total distance to be lowered in N times. Therefore, the above-mentioned predetermined distance is a value obtained by dividing the total distance by N.

  In addition, as a method of controlling the movement in the Z direction with higher accuracy, a method of measuring the height of the defective portion with a laser displacement meter and lowering in the Z direction based on the measurement result may be used.

(Detailed procedure for applying paste)
With reference to FIG. 7, the paste application | coating using the paste application | coating mechanism 25 in step S25 is demonstrated.

  The paste application mechanism 25 shown in FIG. 7 is positioned on the defective portion by the movement of the X-axis table 28 and the Y-axis table 29. At the time of applying the paste, the paste is attached to the tip of the application needle 1 in FIG. 7 and the tip of the application needle 1 is brought into contact with the defective portion, whereby the paste is transferred and applied to the defective portion.

  The paste application mechanism 25 has a holding member 4 that holds the application needle 1 on a drive shaft 3 of an application needle drive cylinder 2 that drives the application needle 1 in the vertical direction in accordance with an instruction signal from the CPU 622. Further, a rotary table 10 for supplying paste to the application needle 1 is mounted adjacent to the application needle drive cylinder 2, and paste pots 13 to 16 for storing the paste are installed on the rotary table 10. In addition, the rotary table 10 is provided with a cleaning device 17 and an air purge device 18 for cleaning the paste adhering to the application needle 1. The rotary table 10 has a notch 12 through which the application needle 1 passes. The rotary table 10 is connected to the motor 21 via the rotary shaft 11 and can rotate in conjunction with the rotation of the motor 21 in accordance with an instruction signal from the CPU 622. The rotary shaft 11 is provided with an index plate 22 for detecting the rotational position of the motor 21. The origin return sensor 24 detects the origin position of the motor 21, and the index sensor 23 detects each position of the motor 21. The index status to can be detected. Since the detection result is given to the CPU 622, the CPU 622 outputs an instruction signal based on the input detection result.

  At the time of applying the paste, the rotary table 10 is driven by the motor 21, and the paste pot containing the paste to be applied is positioned immediately below the application needle 1. In this state, the application needle 1 is lowered by the application needle drive cylinder 2, is immersed in the paste in the positioned paste pot, rises again, and the application needle 1 is removed from the paste pot. At this time, the paste is attached to the tip of the application needle 1.

  Next, the rotary table 10 is rotated, and the notch 12 is positioned immediately below the application needle 1. Then, the application needle 1 is lowered by the application needle driving cylinder 2 and passes through the notched part 12 where the tip of the application needle 1 is positioned to come into contact with the defective part. As a result, the paste is applied to the defective part. .

  When different types of paste are applied to the next defective portion after the application, the paste attached to the application needle 1 is washed. In the case of cleaning, the cleaning device 17 is positioned immediately below the application needle 1 and is inserted into the cleaning device 17 in which the application needle 1 is positioned for cleaning. Thereafter, the air purge device 18 is positioned immediately below the application needle 1 and is inserted into the air purge device 18 in which the application needle 1 is positioned, and drying is performed to complete the cleaning of the application needle 1. Thereafter, the application needle 1 is inserted into a paste pot in which the type of paste to be applied next is stored, and the tip of the application needle 1 is immersed in the paste, and the paste is applied to the next defective portion.

  In addition, when applying the same kind of paste continuously, the application needle 1 is inserted into a paste container in which the applied paste is accommodated after the paste application operation is completed, and the tip of the application needle 1 is immersed in the paste. It waits and the paste adhering to the front-end | tip of the application needle | hook 1 is prevented from drying.

(Laser irradiation procedure)
With reference to FIGS. 8 to 10, pattern removal using laser light 321 emitted from the laser 32 will be described.

  FIG. 8 is an optical path diagram of the laser light 321 that is partially omitted. First, the optical path of the laser beam 321 will be described with reference to FIG. The parallel laser beam 321 emitted from the laser 32 is power-controlled by the attenuator 50 and is derived by being scanned in the XY directions by the galvano mirror 56 of the galvano scanner 51. The derived laser light 321 enters the mirror 52, is reflected here, and then enters the dichroic mirror 53. All the laser light 321 incident on the dichroic mirror 53 from the direction of the mirror 52 is reflected and incident on the objective lens 54. The laser beam 321 incident on the objective lens 54 is condensed by the objective lens 54 and irradiated onto the film substrate 26.

  By controlling the galvano scanner 51, the laser beam 321 can be scanned in an XY direction in an arbitrary shape within a range of several hundred μm square at a defective portion on the surface of the film substrate 26. Therefore, unnecessary pattern portions can be removed in accordance with the shape of the wide defect 101.

  Next, the pattern removal by the laser beam 321 condensed on the film substrate 26 via the above optical path will be described.

  FIG. 9 shows a state where the laser beam 321 is focused on the thick defect 101 of the electromagnetic wave shield pattern 100 on the film substrate 26. A portion 200 where the laser beam 321 in FIG. 9 is condensed is shown enlarged in FIGS. 10 (a) to 10 (c).

  As described above, in the removal processing using the laser 32 having an oscillation pulse width of 500 fs or less, the processing target can be removed by ablation before heat generated by lattice vibration is generated in the pattern 100 to be processed. It is possible to process with little temperature rise. Further, in the cutting with the laser 32, the reaction with the light is locally generated only at the focal point where the laser beam 321 is condensed by multiphoton absorption, so that the film thickness direction (Z direction) of the pattern 100 is reduced. It is possible to remove only a few μm.

  Taking advantage of this processing characteristic, as shown in FIGS. 10A to 10C, the surface of the electromagnetic wave shield pattern 100 is irradiated with a laser beam 321 to form a focused spot 322. At the time of laser irradiation, while changing the irradiation position of the condensing spot 322 from the surface of the defect portion to the surface of the film substrate 26 according to the Z direction, the defect portion is changed at each time while changing so as to fall in N times as described above. The focused spot 322 on the surface is changed in the XY directions. Thereby, in each time, the pattern of the defective part is removed by plasma evaporation in each direction of XYZ. At this time, although the laser beam 321 is irradiated, it is possible to reduce the temperature rise of the film substrate 26 and cut and remove only the defective portion without damaging as much as possible (see 13 (b)). ).

  The arrows in FIGS. 10A to 10C indicate the scanning direction of the laser light 321, and the scanning direction is an XY two-dimensional direction controlled by the galvano scanner 51. Note that the observation optical system 30 may be scanned a plurality of times at the same position on the Z axis.

  Here, the timing of ending the n-th irradiation of the laser beam 321 is not particularly limited. For example, it corresponds to the timing when the CPU 622 outputs a movement start instruction signal of the observation optical system 30 according to the Z direction, and (n + 1) The timing at which the second irradiation is started may correspond to the timing at which the CPU 622 detects a movement completion signal of the observation optical system 30 in the Z direction.

(Embodiment 2)
FIG. 11 shows the configuration of a fine pattern defect correction apparatus 202 according to the second embodiment. 11 differs from the defect correction apparatus 201 of FIG. 1 in that the X-axis table 28 is mounted on the Y-axis table 29 in the defect correction apparatus 201 of FIG. 11, the Y-axis table 29 is mounted on the Z-axis table 27, and the paste application mechanism 25 is mounted on the Y-axis table 29. The X-axis table 28 of the defect correction device 202 is equipped with the Z-axis table 27 as in the defect correction device 201. Other configurations of the defect correcting device 202 are the same as the configurations of the defect correcting device 201.

  During paste application using the defect correction device 202, the entire correction head including the paste application mechanism 25 is moved by the X-axis table 28, and the paste application mechanism 25 is moved in conjunction with the movement of the Y-axis table 29. Similar to the defect correction apparatus 201 of FIG. 1, it is possible to apply paste at an arbitrary position of a defect. Accordingly, it is possible to correct the wide defect 101 and the chip defect 102 in the electromagnetic wave shield pattern 100 formed on the film substrate 26 as in the defect correcting device 201 of FIG.

(Embodiment 3)
FIG. 12 shows the configuration of a fine pattern defect correcting apparatus 203 according to the third embodiment. 12 differs from the defect correction apparatus 201 of FIG. 1 in that the film substrate 26 on which the electromagnetic wave shielding pattern 100 to be corrected is formed is not a roll form but a flat sheet form. It is intended to target the film substrate 26 in the state. In the present embodiment, the film substrate 26 is placed on the Y-axis table 29 at the time of defect correction. Therefore, the roll feeding mechanism 38 and the roll winding mechanism 39 are not mounted on the defect correcting device 203 of FIG. Other configurations are the same as those of the defect correction apparatus 201.

  The defect correction apparatus 203 in FIG. 12 includes a laser 32 that emits laser light 321 for cutting a defective portion, and an observation optical system 30 that enables observation of the defective portion. The observation optical system 30 includes an attenuator 50 (not shown) that controls the power of the laser beam 321 emitted from the laser 32, and a galvano scanner 51 (not shown) that scans the laser beam 321 in the XY directions. The defect correction device 203 receives light reflected from the surface of the film substrate 26, converts the received light signal into an electrical signal indicating an image, and outputs the CCD camera 31 corresponding to the observation unit, and paste application that applies paste to the defect portion. A correction head unit including a mechanism 25 and a paste baking mechanism 33 that cures the paste applied by the paste application mechanism 25 by drying or baking. The defect correcting device 203 is further mounted with a Z-axis table 27 and a Z-axis table 27 that are mounted with the correction head unit and the laser 32 and are movable in the Z direction with respect to the surface of the film substrate 26 to be corrected. The X-axis table 28 and the film substrate 26 that are movable in the X direction are mounted, and the Y-axis table 29 and the Y-axis table 29 that are movable in the Y direction orthogonal to the X direction are mounted. A suction plate 37 for fixing to the Y-axis table 29, a control computer 35 for controlling the driving of these units, an operation panel 36 for inputting commands to the control computer 35, and an image processing device (not shown) are provided. Here, the Y-axis table 29 corresponds to the mounting table 40 on which the film substrate 26 is mounted.

  In the defect correction device 203 of FIG. 12, the correction head unit is moved to the defect position by the movement of the X axis table 28 and the Y axis table 29 based on the reference mark formed on the film substrate 26. Similar to the defect correction apparatuses 201 and 202, the wide defect 101 and the chip defect 102 can be corrected.

  According to the fine pattern defect correcting apparatuses 201 to 203 according to the respective embodiments, the position of the condensing spot 322 on the surface of the defect portion due to the irradiation of the laser beam 321 from the femtosecond laser 32 is changed from the position of the defect portion surface to the film substrate. 26, the position can be controlled to be gradually lowered N times by moving the Z-axis table 27 precisely in the vertical direction with respect to the surface. This enables high-quality defect removal without damaging the film substrate 26. Moreover, even when it becomes necessary to apply the paste to the chipped defect portion and form it after firing, it can be removed using the laser 32, and a high-quality correction can be made as compared with the conventional case.

  In each of the embodiments, the defect correction of the pattern formed on the film substrate 26 of the electromagnetic wave shield of the PDP has been described. However, the present invention is not limited to this, and a solar cell or a flat panel display that is expected to become a film substrate in the future. The defect correction apparatuses 201 to 203 and the correction method can be applied to the correction of the electrode pattern.

  The embodiment disclosed this time should be considered as illustrative in all points and not restrictive. The scope of the present invention is defined by the terms of the claims, rather than the description above, and is intended to include any modifications within the scope and meaning equivalent to the terms of the claims.

  25 paste application mechanism, 26 film substrate, 27 X-axis table, 28 Y-axis table, 29 Z-axis table, 30 observation optical system, 31 CCD camera, 32 laser, 33 paste firing mechanism, 35 control computer, 50 attenuator, 100 Pattern, 101 wide defect, 102 chip defect, 201, 202, 203 defect correction device, 321 laser beam.

Claims (10)

A laser unit that emits laser light having a pulse width in femtosecond units;
A correction portion for correcting a defect portion of a pattern formed of a metal material on the surface of the resin substrate having a surface in which the optical axis of the laser beam is orthogonal, and
The correction unit is
A laser irradiation unit that irradiates the defect part with the laser beam so that the surface of the defect part and the optical axis are orthogonal;
The irradiation position of the laser beam by the laser irradiation unit is set so that a first axis perpendicular to the optical axis extends on the surface and a second axis perpendicular to the optical axis and the first axis extends. An irradiation position variable portion that irradiates the laser light while being variable and variable in a plurality of times from the surface of the defect portion to the surface of the resin substrate along the optical axis. Including a defect correcting device. The resin substrate is a thin film resin substrate that can be accommodated in a roll shape,
The defect correcting device is:
A mounting table on which the resin substrate is mounted to correct the defective portion;
A delivery unit that feeds the resin substrate wound in the roll shape to the table while unwinding;
The defect correction apparatus according to claim 1, further comprising: a winding unit that accommodates the resin substrate that has passed through the table while being wound up, while being wound. The correction unit is
A correction material application part for applying the correction material attached to the tip of the needle in contact with the missing defect part of the metal material formed on the surface of the resin substrate; and
A correction material curing portion that cures the applied correction material; and
The defect correction according to claim 1, wherein an unnecessary portion of the cured correction material is removed as the defect portion by irradiating the laser beam with the laser irradiation unit and the irradiation position variable unit. apparatus. An observation unit that captures an image for observing the defective part;
An optical axis direction moving part for enabling movement of the mounting part along the optical axis, including a mounting part on which the laser part, the correction material application part, the correction material curing part and the observation part are mounted;
A second axial direction moving part for mounting the optical axis direction moving part and enabling the optical axis direction moving part to move along the second axis;
The first axial direction moving part for mounting the second axial direction moving part and enabling the second axial direction moving part to move along the first axis. Defect correction device. An observation unit that captures an image for observing the defective part;
A first axial movement unit for mounting the correction material application unit and enabling the correction material application unit to move along the first axis;
Optical axis movement for enabling mounting of the laser unit, the correction material curing unit, the observation unit, and the first axial movement unit so that the mounting unit can be moved along the optical axis. And
The defect correction according to claim 3, further comprising: a second axis direction moving unit that mounts the optical axis direction moving unit and enables the optical axis direction moving unit to move along the second axis. apparatus. A mounting table on which the resin substrate is mounted to correct the defective portion;
An observation unit that captures an image for observing the defective part;
An optical axis direction moving unit for mounting the laser unit, the correction material application unit, the correction material curing unit, and the observation unit, and for allowing the mounting unit to move along the optical axis; ,
A second axial direction moving part for mounting the optical axis direction moving part and enabling the optical axis direction moving part to move along the second axis on the mounting table;
The defect correction apparatus according to claim 3, further comprising: a first axial movement unit configured to allow the placement table to move along the first axis.   The number of times that the irradiation position variable portion makes the irradiation position variable along the optical axis depends on the diameter of the spot of the laser light and the optical axis from the surface of the defect portion to the surface of the resin substrate. The defect correction apparatus according to claim 1, wherein the defect correction apparatus is determined according to a parameter including a distance along the distance. Placing a resin substrate having a surface and a pattern formed of a metal material on the surface;
A correction step of correcting the defective portion of the pattern formed on the surface of the resin substrate placed by irradiating a laser beam having a pulse width in femtosecond units,
The correcting step includes
A laser irradiation step of irradiating the defect portion with the laser light such that the surface of the defect portion and the optical axis of the laser beam are orthogonal to each other;
The irradiation position of the laser beam in the laser irradiation step is set to a direction in which a first axis orthogonal to the optical axis extends in the surface and a direction in which a second axis orthogonal to each of the optical axis and the first axis extends. Defect correction that irradiates the laser beam while making the irradiation position variable in multiple times from the surface of the defect portion to the surface of the resin substrate along the direction in which the optical axis extends. Method. The correcting step includes
A correction material application step of applying the correction material adhered to the tip of the needle in contact with the missing defect portion of the metal material formed on the surface of the resin substrate,
A correction material curing step of curing the applied correction material; and
The defect correction method according to claim 8, wherein an unnecessary portion of the cured correction material is removed as the defect portion by irradiating the laser beam in the laser irradiation step.   The number of times of changing the irradiation position along the optical axis in the laser irradiation step is along the optical axis from the diameter of the spot of the laser light and the surface of the defect portion to the surface of the resin substrate. The defect correction method according to claim 8, wherein the defect correction method is determined according to a parameter including a distance.

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